WO2018211787A1 - 保護材用リング - Google Patents

保護材用リング Download PDF

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Publication number
WO2018211787A1
WO2018211787A1 PCT/JP2018/008869 JP2018008869W WO2018211787A1 WO 2018211787 A1 WO2018211787 A1 WO 2018211787A1 JP 2018008869 W JP2018008869 W JP 2018008869W WO 2018211787 A1 WO2018211787 A1 WO 2018211787A1
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WO
WIPO (PCT)
Prior art keywords
silicon
ring
protective material
members
embedded
Prior art date
Application number
PCT/JP2018/008869
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English (en)
French (fr)
Japanese (ja)
Inventor
敦 碇
藤井　智
Original Assignee
日本新工芯技株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 日本新工芯技株式会社 filed Critical 日本新工芯技株式会社
Priority to KR1020197037295A priority Critical patent/KR102586861B1/ko
Priority to CN201880045111.0A priority patent/CN110892510B/zh
Priority to US16/613,856 priority patent/US11545345B2/en
Publication of WO2018211787A1 publication Critical patent/WO2018211787A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/24—Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
    • H01J37/241—High voltage power supply or regulation circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/3255—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32559—Protection means, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching

Definitions

  • the present invention relates to a ring for protective material.
  • a dry etching apparatus using plasma is used as a substrate processing apparatus in manufacturing semiconductor integrated devices such as LSI.
  • the dry etching apparatus has a cylindrical vacuum chamber.
  • a high frequency voltage is applied between the counter electrode (anode) and the cathode by a high frequency oscillator in a state where the wafer to be etched is placed on the cathode of the planar electrode and the etching gas is introduced into the vacuum chamber, so that the electrode In the meantime, an etching gas plasma is generated.
  • the positive ions which are active gases in the plasma, enter the wafer surface and perform etching.
  • ring-shaped members are used in the vacuum chamber of the dry etching apparatus.
  • Typical ring-shaped members include a doughnut-shaped focus ring surrounding the wafer to be etched, and an annular grounding ring arranged to cover the side surface of the cylindrical susceptor base on which the wafer is placed. is there.
  • protective materials such as an annular shield ring provided at the peripheral edge of the counter electrode and a side wall member covering the inner wall side surface of the vacuum chamber (Patent Document 1).
  • the focus ring, ground ring, and ring-shaped protective material must have a larger diameter than the wafer to be etched.
  • Current silicon parts for 300 mm wafers are expensive because they are made from a silicon crystal ingot having a diameter of 320 mm or more.
  • the ring-shaped side wall member has a diameter of 700 mm or more, and it may be substantially impossible to make it from a silicon crystal ingot.
  • a silicon part can be manufactured by joining a plurality of silicon members instead of a single piece, it can be manufactured from a silicon crystal ingot having a smaller diameter, and various advantages such as reduction in manufacturing costs are expected.
  • An object of the present invention is to provide a ring for protective material in which a plurality of silicon members are joined.
  • the ring for protective material according to the present invention is a ring for protective material installed in a processing chamber in which the substrate of a substrate processing apparatus for performing plasma processing on a substrate is accommodated, and includes three or more silicon members and the silicon member And a bonding portion for bonding them together, wherein the bonding portion contains boron oxide.
  • the ring for protective material according to the present invention is a ring for protective material installed in a processing chamber in which the substrate of a substrate processing apparatus for performing plasma processing on a substrate is accommodated, and includes three or more silicon members and the silicon member A bonding portion for bonding together, the bonding portion contains any of Al, Ga, Ge, and Sn, and is a eutectic alloy with silicon, and the silicon member has two or more arc shapes A silicon member and an embedded silicon member embedded at a position straddling the arc-shaped silicon members, and joining the arc-shaped silicon member and the embedded silicon member between the arc-shaped silicon member and the embedded silicon member The joining portion is provided.
  • the protective material ring can be manufactured by combining a plurality of silicon members cut out from a silicon crystal ingot smaller than the outer diameter of the protective material ring. Therefore, the protective ring does not need to use a silicon crystal ingot larger than the outer diameter of the protective ring, so that the cost can be reduced accordingly.
  • FIG. 7A is the butt
  • FIG. 7B is the butt
  • FIG. 8A is a modification (1)
  • FIG. 8B is a modification (2).
  • FIG. 9A is an upper surface side
  • FIG. 9B is a lower surface side.
  • FIG. 11A is a plan view showing an embedded silicon member
  • FIG. 11A is a modification (1)
  • FIG. 11B is a modification (2).
  • FIG. 12A is a modification (1)
  • FIG. 12B is a modification (2).
  • a dry etching apparatus 10 shown in FIG. 1 includes a vacuum chamber 12 as a processing chamber, an upper electrode plate 14, and a base 16.
  • the vacuum chamber 12 has a substantially cylindrical shape, and has a processing space 31 surrounded by a cylindrical side wall.
  • the inner surface of the side wall of the vacuum chamber 12 is covered with a side wall member 13.
  • the inner surface around the upper electrode plate 14 on the upper wall of the vacuum chamber 12 is covered with an upper wall member 17.
  • the side wall member 13 and the upper wall member 17 are annular members for protecting the inner wall of the vacuum chamber 12 exposed to the plasma, and are formed of silicon.
  • the vacuum chamber 12 is provided with a baffle plate 25 that partitions the inside of the vacuum chamber 12 in the height direction.
  • An exhaust space 26 is formed on the lower side of the vacuum chamber 12 partitioned by the baffle plate 25, and a processing space 31 is formed on the upper side.
  • the baffle plate 25 is a protective member for preventing the backflow of the etching gas and is made of silicon.
  • the baffle plate 25 has an annular main body, and has a flow passage 27 that penetrates the main body in the thickness direction. As shown in the figure, the baffle plate 25 is provided at the approximate center in the height direction in the vacuum chamber 12.
  • the upper electrode plate 14 is a disk-shaped member and is fixed to the upper part in the vacuum chamber 12. The peripheral edge of the upper electrode plate 14 is covered with a protective ring 20. A shield ring 21 made of quartz is provided between the upper electrode plate 14 and the protective ring 20.
  • the protection ring 20 is a member for protecting the inner wall of the vacuum chamber 12 from plasma generated around the upper electrode plate 14 and is made of silicon. The protection ring 20 may be grounded.
  • the protective ring 20 has a surface on the inner side of the vacuum chamber 12 that protrudes more than the shield ring 21 and has the same height as the upper wall member 17.
  • the upper electrode plate 14 has a plurality of through holes 15 penetrating in the thickness direction.
  • the upper electrode plate 14 is electrically connected to a high frequency power source (not shown).
  • a gas supply pipe 24 is connected to the upper electrode plate 14.
  • the etching gas supplied from the gas supply pipe 24 flows into the vacuum chamber 12 from the through hole 15 of the upper electrode plate 14.
  • the etching gas that has flowed into the vacuum chamber 12 flows into the exhaust space 26 through the flow passage 27 and is discharged to the outside through the discharge port 28.
  • the base 16 is installed in a processing space 31 above the baffle plate 25 in the vacuum chamber 12, and the periphery thereof is surrounded by a ground ring 30.
  • the ground ring 30 is made of silicon and is grounded.
  • a focus ring 18 is provided on the base 16.
  • the focus ring 18 is made of silicon, and a recess 19 that supports the periphery of the wafer 22 is formed over the entire inner periphery.
  • a power source for applying a voltage for stabilizing the plasma during the etching process is electrically connected to the focus ring.
  • a cover ring 23 that protects the side surface of the focus ring 18 may be provided around the focus ring 18.
  • the cover ring 23 is made of quartz, and a recess 33 that supports the periphery of the focus ring 18 is formed over the entire inner periphery.
  • the dry etching apparatus 10 generates plasma between the upper electrode plate 14 and the wafer 22 when an etching gas is supplied through the upper electrode plate 14 and a high frequency voltage is applied from a high frequency power source.
  • the surface of the wafer 22 is etched by this plasma.
  • the ring for protective material according to the present embodiment can be applied to the side wall member 13, the upper wall member 17, the protective ring 20, and the baffle plate 25 as silicon parts.
  • the ring for protective material is not limited to the silicon part.
  • the protective material ring can be applied to silicon parts installed in the vacuum chamber 12 of the dry etching apparatus 10 other than the focus ring 18 that is an electrode ring and the ground ring 30 that is an electrode ring.
  • the protective material ring can have an inner diameter of 320 mm or more and an outer diameter of about 800 mm or less.
  • the protective material ring 32 includes a plurality of (three in the present example) first silicon members 34, 36, and 38.
  • the plurality of first silicon members 34, 36, 38 are collectively referred to as silicon members unless otherwise distinguished.
  • the silicon member has an arc shape and is integrated in a ring shape by joining in one direction via a joining portion (not shown in the drawing) at the butting surface 37A which is an end face in the longitudinal direction.
  • the silicon member may be single crystal or polycrystalline, and is not limited in its manufacturing method, purity, crystal orientation, and the like.
  • size of a silicon member is not specifically limited, For example, thickness is 1 mm or more and 100 mm or less, and width can be about 10 mm or more and 100 mm or less.
  • FIG. 3 shows a butting surface 37 ⁇ / b> A between the first silicon members 34 and 36.
  • the direction of the arrow in the figure indicates the radially outward direction of the protective material ring 32.
  • the joint portion 39 is provided in a central portion excluding a range of several mm from the outer edge of the abutting surface 37A, preferably in a central portion excluding a range of 1 mm or more.
  • the joint portion 39 is a eutectic alloy with silicon containing a metal that forms a eutectic alloy with silicon.
  • the metal that forms a eutectic alloy with silicon is any one of Al, Ga, Ge, and Sn (hereinafter also referred to as “alloy-forming metal”).
  • Al, Ga, Ge, and Sn have low diffusion coefficients in silicon crystals, low diffusion in silicon members, difficulty in creating deep levels that cause electrical problems, and no environmental problems Therefore, it is preferable.
  • Al is most preferable because of its low price.
  • the purity of the alloy-forming metal is not particularly limited as long as it can form a eutectic with silicon, and is preferably 98% or more.
  • the silicon bonding portion 40 is provided on the outer edge of the abutting surface 37A and closes the space between the abutting surfaces 37A.
  • the silicon bonding portion 40 is not in contact with the vacuum chamber 12, the upper wall member 17, and the shield ring 21, but is exposed in the vacuum chamber 12 and exposed to plasma during dry etching, that is, the outer edge of the butting surface 37A.
  • the silicon bonding portion 40 is provided on the inner peripheral surface side in addition to the upper surface side of the outer edge of the abutting surface 37A.
  • the silicon bonding portion 40 can prevent the eutectic alloy from being exposed at the bonding portion 39 by closing the space between the butted surfaces 37A irradiated with plasma.
  • the protective material ring 32 (2) Manufacturing Method Next, a method for manufacturing the protective material ring 32 will be described.
  • surface treatment is performed on the silicon member.
  • the surface of the silicon member is processed by grinding and polishing, and preferably has a mirror surface.
  • the surface of the silicon member may be etched with a mixed solution of hydrofluoric acid and nitric acid.
  • the three first silicon members 34, 36, and 38 are arranged in a ring shape.
  • An alloy-formed metal foil is disposed between the butted surfaces 37A of the first silicon members 34, 36, and 38.
  • the thickness of the alloy-forming metal foil is preferably thin in that less energy is required for melting.
  • the alloy-forming metal foil is preferably 0.1 to 100 ⁇ m, more preferably 0.5 to 20 ⁇ m in order to obtain bonding strength. If the alloy-formed metal foil is thinner than the lower limit value, the alloy-formed metal foil is likely to be damaged when the alloy-formed metal foil is disposed on the joint surface. If the alloy-formed metal foil is thicker than the above upper limit value, a portion where the bonding with silicon is not sufficient is likely to occur.
  • heating is performed from the outside of the silicon member to generate a melt containing silicon and an alloy-forming metal.
  • the heating method is not particularly limited, and can be performed by resistance heating, light heating, or the like.
  • Light heating is preferable in that the heating part can be easily moved and the amount of heating can be easily changed according to the power to be supplied. For example, various lamps and lasers are used.
  • the apparatus shown in FIG. 4 can be used.
  • the apparatus shown in the figure includes at least one lamp 42 and an elliptical mirror 44 as a condensing unit that collects light emitted from the lamp 42.
  • As the lamp 42 a xenon lamp or a halogen lamp generally used in an infrared crystal growth apparatus can be used.
  • the output is preferably about 1 to 30 kW.
  • the heating may be from the outside of the abutting surface 37A, and is not limited to the direction perpendicular to the silicon member, but may be from an oblique direction.
  • the alloy-forming metal foil is melted by heating to form a metal melt.
  • the abutting surface 37A of the silicon member in contact with the metal melt is attacked by the metal melt, and a melt containing silicon is generated.
  • the heating is stopped and the temperature is lowered, the melt is solidified while forming an alloy phase containing a eutectic, and it is considered that the joining is completed.
  • the silicon members can be sufficiently bonded to each other by heating up to about 800 ° C.
  • the condensing area is usually about 10 to 30 mm in diameter.
  • the condensing region is expanded to about 30 to 100 mm by shifting the light emission position of the lamp 42 from the focus of the elliptical mirror 44. By expanding the condensing region, the heating range can be expanded. It is preferable that the condensing region is heated by scanning over the entire upper surface of the protective material ring 32 of the butting surface 37A.
  • the joint 39 containing the eutectic alloy is generated by cooling and solidifying the melt containing silicon and the alloy-forming metal.
  • the alloy-forming metal is Al
  • a joint 39 containing an Al—silicon eutectic (12.2 atomic% Al) is generated.
  • the cooling rate varies depending on the alloy-forming metal to be used, but when Al is used as the alloy-forming metal, it is preferably controlled to be 10 to 100 ° C./min.
  • the cooling rate is less than the lower limit, the cooling time becomes long and the efficiency is poor.
  • strain tends to remain in the joint portion 39.
  • the cooling rate is such that, after the melting of the alloy-forming metal foil is completed, the output of the heating means is gradually reduced, and the heating is stopped when it is estimated that the temperature of the joint 39 is lower than the melting temperature of the eutectic.
  • Such control of the heating temperature is performed by, for example, installing a thermocouple having the same shape as that of the silicon member to be actually bonded between the silicon members and measuring the relationship between the power and temperature of the heating means in advance. This can be done based on the results.
  • Generation of the melt by heating and generation of the joint 39 including the eutectic alloy by cooling are performed in a 10 to 200 torr (about 1333 to 26664 Pa) argon atmosphere chamber in order to prevent oxidation of the alloy-forming metal and silicon. It is preferable. Oxidation can be prevented by reducing the pressure without using argon gas. However, if the pressure is reduced, evaporation of silicon occurs and the inside of the chamber may be contaminated. Nitrogen gas can also prevent oxidation, but is not preferable because nitridation of silicon occurs at 1200 ° C. or higher.
  • the silicon bonding portion 40 between the butted surfaces 37A of the first silicon members 34, 36, and 38 is formed by heating and melting silicon in the vicinity of the butted surfaces 37A.
  • the lamp position is adjusted so that the focal position of the elliptical mirror 44 matches the position of the light emitting portion of the lamp 42, and the height of the upper surface of the silicon member is adjusted to be another focal position of the elliptical mirror 44.
  • the expansion of the elliptical mirror 44 at the irradiation position is set to about 3 mm. In this state, the elliptic mirror 44 is aligned with the position of the abutting surface 37A, and the power of the lamp 42 is increased.
  • the upper surface side of the butted surface 37A is melted to generate a silicon melt.
  • the surface starts to melt at 60% of the lamp rating (the surface temperature is estimated to be 1420 ° C.), and the silicon melt flows between the butted surfaces 37A at 90% of the lamp rating, and between the butted surfaces 37A. Block a part of.
  • the space between the abutting surfaces 37A can be filled and closed with molten silicon. It is preferable to heat the elliptical mirror 44 by scanning the upper surface side and the inner peripheral surface side of the protective material ring 32 in the outer edge of the abutting surface 37A.
  • the upper surface of the molten butted surface 37A is cooled, and the silicon melt is crystallized according to the crystal of the silicon member. Specifically, the power of the lamp 42 is lowered in 2 minutes to 55% of the lamp rating at which the silicon melt starts to solidify, and the state is maintained for 5 minutes.
  • the first silicon members 34, 36, and 38 are joined to each other to form the protective material ring 32 by forming the joint portion 39 and the silicon bonding portion 40 in the same manner on all the butting surfaces 37 ⁇ / b> A. be able to.
  • the protective material ring 32 obtained as described above becomes the protective ring 20.
  • the protective ring 20 is attached to the peripheral portion of the upper electrode plate 14 with the upper surface where the silicon bonding portion 40 is provided on the butting surface 37A facing downward and the lower surface contacting the upper wall of the vacuum chamber 12.
  • the protective material ring 32 can be manufactured by combining three or more silicon members cut out from a silicon crystal ingot for a wafer smaller than the outer diameter of the side wall member 13, the upper wall member 17, the protective ring 20, and the baffle plate 25. it can. Therefore, the protective material ring 32 does not need to use a silicon crystal ingot for a wafer larger than the outer diameter of the side wall member 13, the upper wall member 17, the protective ring 20, and the baffle plate 25. it can.
  • the ring for protective material 32 is provided with the silicon bonding portion 40 on the abutting surface 37A, the eutectic alloy at the joint portion 39 can be prevented from being exposed. Therefore, the protective material ring 32 can prevent the inside of the vacuum chamber 12 from being contaminated by the eutectic alloy even when the plasma is irradiated in the vacuum chamber 12.
  • silicone adhesion part 40 demonstrated the case where it provided in the upper surface side in the ring 32 for protective materials and the inner peripheral surface side among the outer edges of 37 A of butt
  • the silicon bonding portion 40 may be provided on the upper surface side and the outer peripheral surface side of the outer edge of the butted surface 37A, or may be provided on the entire circumference of the outer edge of the butted surface 37A.
  • the silicon bonding portion 40 is provided between the butted surfaces 37A of the first silicon members 34, 36, and 38 has been described, but the present invention is not limited thereto. As shown in FIG. 5, it is not necessary to provide a silicon bonding portion between the butting surfaces 37B.
  • the protective material ring 46 shown in FIG. 6 includes a first ring body 32 and a second ring body 47.
  • the first ring body 32 is the same as the protective material ring of the first embodiment.
  • the second ring body 47 includes a plurality of (three in the present case) second silicon members 48, 50, 52.
  • the second silicon members 48, 50, 52 are the same as the first silicon members 34, 36, 38, although the symbols are changed for convenience of explanation.
  • the first ring body 32 and the second ring body 47 are coaxially overlapped on the joint surface 54A in a state where the butted surfaces 37A of the silicon members are shifted in the circumferential direction.
  • a joint portion 39 and a silicon bonding portion 40 are provided between the butted surfaces 37A of the first silicon members 34, 36, and 38.
  • 7A shows a butting surface 37A between the first silicon members 34 and 36
  • FIG. 7B shows a butting surface 37A between the second silicon members 48 and 52.
  • the direction of the arrow in the figure indicates the radially outward direction of the protective material ring 46.
  • the joint portion 39 is provided at a central portion excluding a range of several mm from the outer edge of the abutting surface 37A, preferably at a central portion excluding a range of 1 mm or more.
  • joint portion 55 is also provided on the joint surface 54 ⁇ / b> A of the first ring body 32 and the second ring body 47.
  • joint 39 may also be provided on the abutting surface 37A of the second silicon members 48, 50, 52.
  • the silicon bonding portion 40 is provided on the outer edge of the abutting surface 37 ⁇ / b> A and the outer edge of the bonding surface 54 ⁇ / b> A of the first ring body 32 and the second ring body 47.
  • the silicon bonding portion 40 When applied to the protective ring 20, the silicon bonding portion 40 is not in contact with the vacuum chamber 12, the upper wall member 17, and the shield ring 21, and is exposed in the vacuum chamber 12, that is, the protective material ring 46.
  • the silicon bonding portion 40 includes the outer edge of the butting surface 37 ⁇ / b> A of the first ring body 32 and the outer edge of the butting surface 37 ⁇ / b> A of the second ring body 47.
  • the protective ring 20 is attached to the peripheral portion of the upper electrode plate 14 with the upper surface where the silicon bonding portion 40 is provided on the butting surface 37A facing downward and the lower surface contacting the upper wall of the vacuum chamber 12.
  • the silicon bonding portion 40 is formed between the first silicon members 34, 36, 38 and the butted surfaces 37 A of the second silicon members 48, 50, 52, and between the first ring body 32 and the second ring body 47. Between the joint surfaces 54A.
  • the protective material ring 46 of this embodiment will be described. Note that description of steps similar to those in the first embodiment is omitted as appropriate.
  • the three second silicon members 48, 50, 52 after the surface treatment are arranged in a ring shape.
  • an alloy-formed metal foil is disposed on the upper surface of the second silicon members 48, 50, 52.
  • three first silicon members 34, 36, and 38 are placed on the alloy-formed metal foil.
  • An alloy-formed metal foil is disposed between the three first silicon members 34, 36, and 38.
  • the first silicon members 34, 36, and 38 are arranged so as to be shifted from the previously arranged second silicon members 48, 50, and 52 by half the length in the longitudinal direction.
  • the first silicon members 34, 36, and 38 are stacked on the second silicon members 48, 50, and 52 via the alloy-formed metal foil.
  • the silicon between the butted surfaces 37A of the first ring body 32 and the second ring body 47 and between the bonding surfaces 54A is heated and melted to form the silicon bonding portion 40.
  • the silicon bonding portion 40 is provided between the butting surfaces 37A and between the bonding surfaces 54A, the same effect as in the first embodiment can be obtained. .
  • the silicon bonding portion 40 includes the outer edge of the butting surface 37 ⁇ / b> A in the first ring body 32 and the outer edge of the butting surface 37 ⁇ / b> A in the second ring body 47.
  • the protective member ring 46 is provided on the inner peripheral surface side of the protective material ring 46 and the outer peripheral edge of the joint surface 54A on the inner peripheral surface side 57 of the protective material ring 46 has been described, but the present invention is not limited thereto.
  • the silicon bonding portion 40 may be provided on the upper surface side and the outer peripheral surface side of the outer edge of the butting surface 37A in the first ring body 32, and among the outer edges of the butting surface 37A, the upper surface side, the inner peripheral surface side, and You may provide in an outer peripheral surface side.
  • the silicon bonding portion 40 may be provided on the outer peripheral surface side of the protective material ring 46 in the outer edge of the butting surface 37A of the second ring body 47 and on the outer peripheral surface side of the protective material ring 46 in the outer edge of the bonding surface 54A. Alternatively, it may be provided all around the outer edge of the joining surface 54A.
  • a protective material ring according to a third embodiment will be described.
  • 9A and 9B is embedded in a position straddling the plurality of (three in the present case) first silicon members 58, 60, 62 and the first silicon members 58, 60, 62.
  • a plurality of (three) embedded silicon members 64A is provided on the side opposite to the plasma irradiation side of the protective material ring 56, in the case of this figure, on the lower surface side.
  • the embedded silicon member 64A is preferably formed of the same material as the silicon member.
  • the four corners of the embedded silicon member 64A are preferably R processed.
  • the embedded silicon member 64A can prevent damage such as chipping because the four corners are rounded.
  • R is preferably 3 mm or more.
  • the embedded silicon member 64A is preferably formed so that the bottom surface is substantially the same height as the bottom surface of the silicon member.
  • the thickness of the embedded silicon member 64A is preferably 20 to 80%, more preferably 40 to 60% of the thickness of the silicon member.
  • the embedded silicon member 64A is preferably made of a rectangular plate-like member and has a size that does not protrude from the protective material ring 56 in plan view.
  • the length of the embedded silicon member 64A in the longitudinal direction is preferably 2 to 10% of the outer peripheral length of the protective material ring 56.
  • More specific silicon member sizes can be obtained by dividing a ring having an inner diameter of 330 mm, an outer diameter of 400 mm, and a thickness of 10 mm into three parts.
  • the embedded silicon member 64A can have a length of 62 mm, a width of 25 mm, and a thickness of 5 mm with R processing of 5 mm at four corners.
  • the hole formed in the lower surface of the silicon member has a shape corresponding to the shape of the silicon piece, and the depth is 5 mm.
  • the thickness of the embedded silicon member 64A is 50% of the thickness of the silicon member, and the length of the embedded silicon member 64A in the longitudinal direction is 5% of the outer peripheral length of the protective material ring 56.
  • FIG. 10 shows a butting surface 63 ⁇ / b> A between the first silicon members 58 and 60.
  • the direction of the arrow in the figure indicates the radially outward direction of the protective material ring 56.
  • the embedded silicon member 64A is embedded in the hole.
  • a joint portion 68 is provided between the upper surface of the embedded silicon member 64A and the first silicon member (bottom surface of the hole). It is preferable to provide a silicon bonding portion 70 between the butted surfaces 63A of the first silicon members 58, 60, 62.
  • the silicon bonding portion 70 is preferably provided on the upper surface side and the inner peripheral surface side of the protective material ring 56 in the outer edge of the butting surface 63 ⁇ / b> A.
  • the protective ring 20 is attached to the peripheral portion of the upper electrode plate 14 with the upper surface provided with the silicon bonding portion 70 facing downward and the lower surface in contact with the upper wall of the vacuum chamber 12.
  • the protective material ring 56 according to the present embodiment can form the joint 68 by heating from the upper surface side of the silicon member to generate a melt containing silicon and an alloy-forming metal. Further, the silicon bonding portion 70 on the butting surface 63A can be formed by the same method as in the first embodiment.
  • the ring 56 for protective material of the present embodiment is provided with the embedded silicon member 64A, the bonding area between the silicon members can be increased, so that the mechanical strength can be further increased. Further, the protective material ring 56 can obtain the same effect as that of the first embodiment because the gap between the butted surfaces 63A is closed by the silicon bonding portion 70.
  • the embedded silicon member 64A does not have to be rectangular.
  • the longitudinal ends of the embedded silicon members 64B and 64C may be semicircular as shown in FIG.
  • a joint 72 may be provided between the butted surfaces 63B of the silicon members.
  • silicone adhesion part 70 demonstrated the case where it was provided in the upper surface side and inner peripheral surface side in the ring 56 for protective materials among the outer edges of butt
  • the silicon bonding portion 70 may be provided on the upper surface side and the outer peripheral surface side of the outer edge of the butted surface 63A, or may be provided on the entire circumference of the outer edge of the butted surface 63A.
  • the silicon bonding portion 70 is provided between the butted surfaces 63A of the first silicon members 58, 60, 62 has been described, but the present invention is not limited to this. As shown in FIG. 12B, the silicon bonding portion may not be provided between the butting surfaces 63C.
  • the present invention is not limited to the above-described embodiment, and can be appropriately changed within the scope of the gist of the present invention.
  • the joint portion includes an alloy-forming metal
  • the present invention is not limited thereto, and may include boron oxide.
  • a method for manufacturing a protective material ring in the case where the joint portion contains boron oxide will be described below using the joint surface as an example.
  • the silicon member is heated to a first temperature (180 to 280 ° C.), and a starting material made of particulate boric acid (B (OH) 3 ) is supplied to at least a part of the bonding surface of the silicon member. .
  • the silicon member can be heated by a heating means using a general electric resistance heater. Since the temperature of the bonding surface is 180 to 280 ° C., dehydration reaction of boric acid occurs on this bonding surface. Water is released from boric acid in about 10 to 60 seconds to produce metaboric acid (HBO 2 ). Metaboric acid dissolves in the desorbed water, resulting in a liquid product with high fluidity.
  • the temperature of the silicon member is too low, metaboric acid cannot be obtained by desorbing water from boric acid. On the other hand, if the temperature of the silicon member is too high, water is rapidly desorbed from boric acid. As a result, boric acid supplied to the bonding surface of the silicon member scatters or solidified metaboric acid is immediately generated. If the first temperature is 180 to 280 ° C., metaboric acid can be obtained more reliably.
  • the first temperature is preferably 200 to 240 ° C.
  • a starting material made of particulate boric acid a granular commercial product having a diameter of 0.1 to 2 mm can be used as it is.
  • a layer containing metaboric acid as described later can be formed. Boric acid is preferably supplied in small portions to a part of the upper surface of the silicon member.
  • a layer containing metaboric acid can be obtained by extending a liquid material generated by removing water from boric acid with a spatula.
  • a uniform metaboric acid-containing layer can be formed on the bonding surface by supplying a small amount of boric acid as a starting material to the bonding surface of the silicon member and extending the resulting liquid material each time. it can.
  • a spatula obtained by cutting a wafer it is possible to avoid mixing impurities into the layer containing metaboric acid.
  • the thickness of the layer containing metaboric acid is preferably 1 mm or less, and more preferably 0.1 to 0.5 mm. As the thickness of the layer containing metaboric acid is thinner, generation of bubbles due to a dehydration reaction can be suppressed when heated in a later step.
  • the thickness of the layer containing metaboric acid can be adjusted by controlling the amount of boric acid as a starting material to be supplied.
  • the silicon member in which the layer containing metaboric acid is formed on the bonding surface is heated to raise the temperature to the second temperature (500 to 700 ° C.). As a result, water is further desorbed from metaboric acid, and a melt containing boron oxide (B 2 O 3 ) is obtained. If the second temperature is too high, the silicon member may be cracked due to the difference in thermal expansion coefficient between boron oxide and silicon when cooled in a later step. If the second temperature is 500 to 700 ° C., a melt containing boron oxide can be obtained more reliably.
  • the second temperature is preferably 550 to 600 ° C.
  • the other silicon member subjected to the surface treatment is pressure-bonded with the melt containing boron oxide generated in the bonding region of the silicon member interposed therebetween.
  • the pressure at the time of pressure bonding is not particularly limited, and can be set as appropriate. In the case where the width of the silicon member is about 30 mm, the silicon member and another silicon member can be joined by pressing by hand with a heat insulating material interposed therebetween.
  • the silicon member and another silicon member are joined by the boron oxide layer.
  • the melt is solidified by being left at room temperature, for example.
  • a ring for protective material can be manufactured by producing a joint as described above.
  • the layer containing metaboric acid may be formed in a frame shape along the outer edge of the bonding surface instead of the entire bonding surface of the silicon member.
  • the width of the layer containing frame-shaped metaboric acid can be 5 to 10 mm.
  • An alloy-forming metal foil is disposed in a region inside the layer containing frame-shaped metaboric acid. Before placing the alloy-forming metal foil in the inner region, the layer containing frame-shaped metaboric acid may be cooled to polish the surface and reduce the thickness.
  • a layer containing frame-shaped metaboric acid is formed on the bonding surface of the silicon member, and after the alloy-formed metal foil is disposed, another silicon member is disposed and heated to the eutectic temperature or higher and 700 ° C. or lower.
  • the alloy-forming metal forms a eutectic with silicon by heating, the silicon members can be bonded more firmly.
  • the eutectic alloy formed here is surrounded by a frame-shaped boron oxide layer. Further, by providing a silicon adhesive portion on the outer edge of the joint surface, the same effect as in the first embodiment can be obtained.
  • Dry etching equipment (substrate processing equipment) 12 Vacuum chamber (processing room) 32, 46, 56 Protective material rings 34, 36, 38, 58, 60, 62 First silicon members 37A, 37B Abutting surfaces 39, 55, 68, 72 Joint portions 40, 70 Silicon adhesive portions 48, 50, 52 2 Silicon members 54A, 54B Bonding surfaces 63A, 63B, 63C Butting surfaces 64A, 64B, 64C Embedded silicon members

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JP6270191B1 (ja) 2018-01-31
KR20200026813A (ko) 2020-03-11
TWI753135B (zh) 2022-01-21
JP2018195715A (ja) 2018-12-06
KR102586861B1 (ko) 2023-10-11
TW201907433A (zh) 2019-02-16

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