WO2018198991A1 - Dispositif d'inspection d'image, système de production, procédé d'inspection d'image, programme et support de stockage - Google Patents

Dispositif d'inspection d'image, système de production, procédé d'inspection d'image, programme et support de stockage Download PDF

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Publication number
WO2018198991A1
WO2018198991A1 PCT/JP2018/016374 JP2018016374W WO2018198991A1 WO 2018198991 A1 WO2018198991 A1 WO 2018198991A1 JP 2018016374 W JP2018016374 W JP 2018016374W WO 2018198991 A1 WO2018198991 A1 WO 2018198991A1
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Prior art keywords
image
mesh
inspection
inspection apparatus
sections
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PCT/JP2018/016374
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English (en)
Japanese (ja)
Inventor
盛人 河原
Original Assignee
株式会社ウイングビジョン
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Application filed by 株式会社ウイングビジョン filed Critical 株式会社ウイングビジョン
Priority to CN201880002545.2A priority Critical patent/CN109564173B/zh
Publication of WO2018198991A1 publication Critical patent/WO2018198991A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

Definitions

  • the present invention relates to an image inspection apparatus that inspects the state of components mounted on a circuit board, circuit board wiring patterns, solder balls, scratches, dirt, and the like, a production system including the image inspection apparatus, an image inspection apparatus, a program, and The present invention relates to a storage medium storing the program.
  • 3D image inspection has been widely performed for circuit board mounting inspection.
  • 3D image inspection for example, there are those that use laser light, those that project moire light, and those that take a picture with a camera from a plurality of directions. He spent effort and time.
  • it is often mistakenly judged to be a defective product due to slight changes in the printed state of the printed circuit board or differences in printed circuit board lots, and each time readjustment is required, and this readjustment requires a lot of man-hours. Met.
  • the calculation for the image inspection becomes complicated, and there is a problem that it takes a long inspection time.
  • Patent Literature 1 a captured image of a printed circuit board is divided into a plurality of sections, and compared with reference image data stored in a storage unit independently corresponding to the sections, a printed circuit board image processing is performed. Means for determining pass / fail is disclosed. When the image is divided into sections, the position is set with reference to fiducial marks on the printed circuit board. The quality determination is performed based on whether or not the difference element between the captured image and the reference image data is extracted and the area of the difference element is equal to or less than a preset upper limit difference area.
  • the reference image data initially comprises sample images of one or a plurality of non-defective substrates, but is added as appropriate reflecting the inspection results as the inspection proceeds.
  • Japanese Patent Application Laid-Open No. 2004-228688 objectively detects macro-level abnormalities (for example, in a range that can be observed with the naked eye due to sequential changes in film formation results such as contrast based on differences in conditions in the film formation process).
  • the comparison reference macro image and the inspection target macro image are divided into a plurality of sections in the vertical and horizontal directions to set partial areas, and zero average normalized cross-correlation (ZNCC: Zero-mean Normalized) for the partial areas corresponding to each other in position.
  • ZNCC Zero average normalized cross-correlation
  • Patent Document 2 as a result of this image matching, the minimum value of each partial region is calculated as a similarity that is a quantitative evaluation value.
  • Patent Document 3 as an appearance inspection device for a conductive pattern or the like on a printed circuit board, when comparing an image of a substrate to be inspected divided into a standard pattern image divided in a corresponding manner, there has been disclosed a means capable of performing a comparison inspection even when there is a positioning error by performing comparison while relatively moving pattern images. For comparison between the image of the substrate to be inspected and the standard pattern image, a binarized signal is used for each divided section.
  • the position is set with reference to the fiducial mark on the printed circuit board when the image is divided into each section, but the positioning error is completely eliminated. Is difficult, requires precise and expensive equipment. Further, if there is a shift in the mounting position of the component, it is determined as a defective product, and the direct rate decreases. Furthermore, since determination processing for a color image has not been sufficiently studied, it is difficult to optimize determination accuracy.
  • an object of the present invention is to provide an image inspection apparatus that has high detection accuracy for a color image, has a high direct rate, is fast in calculation for determination processing, is easy to perform initial setting, and is low in cost. There is to do.
  • Another object of the present invention is to provide a production system using the image inspection apparatus.
  • Another object of the present invention is to provide an image inspection method using the image inspection apparatus.
  • Another object of the present invention is to provide a program for the image inspection apparatus.
  • Another object of the present invention is to provide a storage medium storing the above program.
  • the image inspection apparatus includes a photographing unit that photographs a test object as a color image, Mesh means for dividing the color image photographed by the photographing means into a plurality of mesh-shaped sections based on a designated mesh size; Pre-processing means for converting the color image photographed by the photographing means into a predetermined gray scale image based on a set value; Reference image storage means for storing the color image of the inspection object that is a preselected reference imaged by the imaging means as a reference image; About the inspection image and the reference image that are divided into the mesh-like sections by the mesh means and the pre-processing means and that are captured by the imaging means that have been converted to the predetermined gray scale, The similarity is calculated for a plurality of sections based on a predetermined parameter, and the similarity is highest in a predetermined search range in which the reference image and the inspection image are relatively moved for each of the plurality of mesh-shaped sections
  • the image inspection apparatus is the image inspection apparatus according to the first aspect, wherein the color image is divided into a plurality of mesh-shaped sections by the mesh unit, and then the pre-processing unit performs the process. It is characterized by being converted into a predetermined gray scale image.
  • An image inspection apparatus includes an imaging unit that captures an inspection object as a color image; Mesh means for dividing the color image photographed by the photographing means into a plurality of mesh-shaped sections based on a designated mesh size; Pre-processing means for converting the color image photographed by the photographing means into a predetermined gray scale image based on a set value for each of a plurality of mesh-like sections divided by the mesh means; Reference image storage means for storing the color image of the inspection object that is a preselected reference imaged by the imaging means as a reference image; After being divided into a plurality of mesh-like sections by the mesh means, the inspection image and the reference image photographed by the imaging means converted into the predetermined gray scale for each of the plurality of sections by the preprocessing means Determining means including template matching for determining the similarity based on a predetermined parameter for each of the plurality of mesh-shaped sections; Interface means for setting at least one of the mesh size, the set value, and the parameter, and notifying
  • the image inspection apparatus is the image inspection apparatus according to any one of the first to third aspects, wherein the inspection object is a substrate.
  • the image inspection apparatus is the image inspection apparatus according to any one of the first to fourth aspects, wherein the image inspection apparatus further includes illumination means for illuminating the inspection object.
  • the image inspection apparatus is characterized in that the reference image can be edited in the image inspection apparatus according to any one of the first to fifth aspects.
  • An image inspection apparatus is the image inspection apparatus according to any one of the first to sixth aspects, wherein a plurality of the reference images are used.
  • An image inspection apparatus is the image inspection apparatus according to any one of the first to seventh aspects, wherein each of the plurality of sections has an overlapping region overlapping with a surrounding section.
  • An image inspection apparatus is the image inspection apparatus according to any one of the first to eighth aspects, wherein the preprocessing means determines the mixing ratio, tone curve, gradation, and tone of the three primary colors according to the set values. It is characterized in that at least one of the filters can be set.
  • the image inspection apparatus is the image inspection apparatus according to any one of the first to ninth aspects, wherein the determination means determines the search range, the overlapping amount of the sections, and the template matching according to the parameters. It is characterized in that at least one of the methods including the setting can be set.
  • An image inspection apparatus is the image inspection apparatus according to any one of the first to tenth aspects, wherein the method including the template matching in the determination unit is set according to a state of an image in the mesh. It is characterized by that.
  • the image inspection apparatus is the image inspection apparatus according to any one of the first to eleventh aspects, wherein the determination means further determines the similarity based on a difference in average luminance and / or standard deviation value after graying. It is characterized by doing.
  • An image inspection apparatus is the image inspection apparatus according to any one of the first to twelfth aspects, wherein at least one of the mesh size, the set value, and the parameter can be set as a preset value. It is characterized by being.
  • An image inspection apparatus is the image inspection apparatus according to any one of the first to thirteenth aspects, wherein the image inspection apparatus further includes means for setting an inspection range in the inspection object. .
  • the image inspection apparatus is the image inspection apparatus according to the fourteenth aspect, wherein at least a part of the inspection range can be automatically set.
  • the image inspection apparatus is the image inspection apparatus according to the fourteenth or fifteenth aspect, wherein at least a part of the inspection range is set based on CAD data of a substrate.
  • the production system is the image inspection apparatus according to any one of the first to sixteenth aspects, wherein at least a part of the reference image is not an image photographed by the photographing means, but a CAD of a substrate. It is generated based on data.
  • the production system according to the eighteenth aspect of the present invention is characterized by including the image inspection apparatus according to any one of the first to seventeenth aspects.
  • An image inspection method includes a step of photographing a test object as a color image by photographing means; Dividing the color image into a plurality of mesh-shaped sections based on a designated mesh size by mesh means; Converting the color image photographed by the photographing means by a pre-processing means into a predetermined gray scale image based on a set value; Storing the color image of the inspection object, which is a preselected reference, photographed by the photographing means, as a reference image; About the inspection image and the reference image that are divided into the mesh-like sections by the mesh means and the pre-processing means and that are captured by the imaging means that have been converted to the predetermined gray scale, A step of determining similarity by determination means including template matching, searching for a position where the similarity is highest in a predetermined search range in which the reference image and the inspection image are relatively moved for each of a plurality of sections; Setting at least one of the mesh size, the set value, and the parameter, and notifying a determination
  • An image inspection method includes a step of photographing a test object as a color image by photographing means; Dividing the color image into a plurality of mesh-shaped sections based on a designated mesh size by mesh means; For each of a plurality of mesh-like sections divided by the mesh means, converting the color image photographed by the photographing means by a preprocessing means into a predetermined gray scale image based on a set value; Storing the color image of the inspection object, which is a preselected reference, photographed by the photographing means, as a reference image; After being divided into a plurality of mesh-like sections by the mesh means, the inspection image and the reference image photographed by the imaging means converted into the predetermined gray scale for each of the plurality of sections by the preprocessing means Determining a degree of similarity for each of the plurality of mesh-shaped sections by a determination unit including template matching based on a predetermined parameter; Interface means for setting at least one of the mesh size, the set value, and the parameter,
  • a program according to a twenty-first aspect of the present invention is provided on a computer of a control device that controls the image processing apparatus or the production system so that the image inspection method according to the nineteenth or twentieth aspect is executed by the image processing apparatus or the production system. It is characterized by operating in.
  • a program according to a twenty-second aspect of the present invention is the program according to the twenty-first aspect, further comprising an additional add-in program.
  • the program according to the twenty-third aspect of the present invention is characterized in that in the program according to the twenty-first or twenty-second aspect, a modularized inspection function can be further added.
  • a storage medium according to a twenty-fourth aspect of the present invention stores the program according to any one of the twenty-first to twenty-third aspects.
  • the detection accuracy for the color image is high, the direct rate is high, and the determination process is performed by parallel processing. Can be made faster. Further, by using a color image to be inspected as a reference selected in advance as a reference image, initial setting is easy. Furthermore, since the software is improved, an expensive apparatus is not required, so that an image inspection apparatus with a low cost can be provided.
  • the optimum preprocessing can be performed for each section, so that the detection accuracy is higher and the straightness rate can be increased.
  • the image inspection apparatus of the fourth aspect of the present invention it is possible to provide an image inspection apparatus that performs image inspection of a substrate.
  • the image inspection apparatus of the fifth aspect of the present invention it is possible to improve the determination accuracy by appropriately illuminating the inspection object.
  • the reference image can be optimized.
  • the image inspection apparatus of the seventh aspect of the present invention it is possible to prevent the misregistration of a part from being determined as a defective product, and to increase the straightness rate.
  • each of the plurality of sections has an overlapping area overlapping with the surrounding sections, so that the determination accuracy near the boundary of each section can be improved.
  • the determination accuracy can be improved by appropriately setting the mixing ratio, tone curve, gradation and filter of the three primary colors in the preprocessing means.
  • the determination means can improve the determination accuracy by appropriately setting the search range, the overlapping amount of the sections, and the matching method according to the parameters.
  • the determination accuracy can be improved by setting a technique including template matching according to the state of the image in the mesh.
  • the determination accuracy is further improved by further adding a similarity determination using a difference between the average luminance and / or the standard deviation value after graying to the determination means. can do.
  • the initial setting can be further simplified by allowing the mesh size, setting value, and parameter to be set as preset values.
  • the inspection range in the inspection object can be set appropriately.
  • the initial setting can be further simplified.
  • the initial setting of the inspection range can be performed accurately and easily.
  • the initial setting man-hour can be further reduced.
  • the production system of the eighteenth aspect of the present invention it is possible to provide a production system that exhibits the effect of the image inspection apparatus.
  • the detection accuracy for the color image is high, the direct rate is high, and the determination process is performed by parallel processing.
  • the operation for can be made faster.
  • initial setting is easy.
  • the software is improved, an expensive apparatus is not required, so that an image inspection apparatus with a low cost can be provided.
  • optimal preprocessing can be performed for each section, so that the detection accuracy is higher and the direct rate can be increased.
  • the program which has the effect of the said image inspection method can be provided.
  • the storage medium of the twenty-fourth aspect of the present invention it is possible to provide a storage medium that exhibits the effect of the program.
  • FIG. 1 is an external perspective view of an image inspection apparatus according to a first embodiment.
  • FIG. 2 is a transparent perspective view of FIG. 1. It is explanatory drawing of the imaging range of a camera.
  • FIG. 5A is a reference image before being divided into a plurality of mesh-like sections, and FIG. 5B is a reference image after the automatic mesh is applied.
  • 6A is a reference image in which the parameters of each mesh are being edited, and FIG. 6B is a reference image after the parameters of each mesh have been edited. It is a determination result display screen. It is a setting screen of a mesh parameter numerical value.
  • It is a block diagram of a production system. It is an external view of the image inspection apparatus of 2nd Embodiment.
  • FIGS. 1 is an external perspective view of the image inspection apparatus 1 according to the first embodiment of the present invention
  • FIG. 2 is a transparent perspective view of FIG. 1
  • FIG. 3 is an explanatory diagram of an imaging range of the cameras 18a to 18d.
  • FIG. 4 is a block diagram of the image inspection apparatus 1.
  • the image detection apparatus 1 is an apparatus that performs 2D image inspection, and includes an image inspection apparatus main body 10 and a personal computer main body (hereinafter referred to as “PC main body”) 25.
  • the image inspection apparatus main body 10 has a substantially rectangular parallelepiped shape, and a substrate 20 to be inspected is mounted on the lower part of the front, and the take-out position (state in FIG. 2) and the accommodation position (state in FIG. 1) of the substrate 20 are arranged.
  • a slide table 11 is provided that can slide between them.
  • an indicator lamp 13 is provided on the front upper portion of the image inspection apparatus main body 10 so that the determination result of the quality of the substrate can be displayed.
  • two indicator lamps 13 are provided, one of the indicator lights emits green light to indicate that the substrate is non-defective, and the other indicator light emits red light to indicate that the substrate is defective. Is displayed.
  • a handle 12 is provided on the front side of the slide table 11, for the operator to grip the slide table 11 between the take-out position and the storage position.
  • the image inspection apparatus main body 10 is provided with a stopper 23 for fixing the slide table 11 at the storage position.
  • the stopper 23 is an L-shaped member that is provided near the front of the side surface of the slide table housing portion 22, and one side of the L-shape of the stopper is loosened by a screw that can be operated by the operator. Then, it is attached to the side surface of the slide table accommodating part 22 so that it can rotate and can be fixed when the screw is tightened. Thereby, the other side of the L-shape of the stopper can be rotated 180 degrees between the engagement position for engaging the slide table 11 and the release position for releasing the engagement.
  • the stopper 23 is fixed at the engagement position.
  • the stopper 23 is set to the release position.
  • the first reference block 14 and the second reference block 15 are provided at positions corresponding to the four sides of the substrate 20, respectively.
  • the 1st movable block 16 and the 2nd movable block 17 are provided.
  • Notches whose cross sections perpendicular to the longitudinal direction of the blocks 14 to 17 are L-shaped are provided up to the same height above the side of the blocks 14 to 17 on which the substrate 20 abuts.
  • the four sides of the substrate 20 are supported at a predetermined height by the notches.
  • the first reference block 14 and the second reference block 15 are fixed, and a contact surface of the first reference block 14 with the side surface of the substrate 20 and a contact surface of the second reference block 15 with the side surface of the substrate 20 in plan view. Is the origin 21 of the substrate 20.
  • the first reference block 14 and the second reference block 15 are provided at the contact positions, but the present invention is not limited to this.
  • the present invention includes a mode in which the first reference block 14 and the second reference block 15 are separated from the origin 21. In this case, the intersection point between the extension line of the substrate contact surface of the first reference block 14 and the extension line of the substrate contact surface of the second reference block 15 in plan view is set as the origin 21 of the substrate 20.
  • the substrate 20 When the substrate 20 is mounted on the slide table 11, the two sides near the origin 21 among the four sides of the substrate 20 are brought into contact with the first reference block 14 and the second reference block 15 for positioning. In this state, the first movable block 16 and the second movable block 17 are moved until they come into contact with the other two sides of the substrate 20, and the substrate 20 is supported by the notches provided in the blocks 14-17. Since the first movable block 16 and the second movable block 17 are fixed by bolts, the bolts are loosened and the first movable block 16 and the second movable block 17 are moved until they abut against the other two sides of the substrate 20. By tightening the bolts again, the substrate 20 can be fixed in a state of being positioned by the blocks 14-17. For example, a hexagon wrench can be used to tighten the bolt.
  • the cameras 18a to 18d take a color image 40 of the substrate 20.
  • four cameras 18a to 18d are provided.
  • the present invention is not limited to this, and the number of cameras 18a to 18d may be one or plural, for example, Six may be sufficient.
  • the cameras 18a to 18d for example, 14 million pixel USB cameras can be used.
  • the lenses of the cameras 18a to 18d wide-angle lenses having a deep depth of field can be used.
  • the focal point is set with reference to the component with the lowest height, the color image 40 in a state where the focus is achieved with respect to almost all components with the height can be obtained. Accordingly, since the cameras 18a to 18d are fixed and do not require a diaphragm, the camera has no moving parts, is low in cost, has a long life, and can be downsized.
  • the parts mounted on the board 20 have some color variations. Further, due to the mounters of the standard machine 93, the variant machine 94, etc. (see FIG. 9), there may be some variation in the mounting position even when components are mounted on the board 20. In the image inspection, if the optical resolution of the cameras 18a to 18d is increased more than necessary, a very slight variation is judged as defective, and the direct rate may be lowered. Also, for the LED illumination 19 described later, if illumination having a color reproducibility higher than necessary is used, a very slight variation is judged as defective, and the direct rate may be reduced. Therefore, in the image inspection apparatus main body 10 of the first embodiment, as the cameras 18a to 18d and the LED lighting 19, general-purpose USB cameras and general lighting are used instead of the FA dedicated products.
  • an image taken with a wide-angle lens may be curved in a spherical shape, it is desirable to correct image distortion by performing image processing such as Hough transform or affine transform.
  • image processing such as Hough transform or affine transform.
  • the origin 21 of each color image 40 is determined. Calibrate the alignment.
  • the four cameras 18a to 18d are arranged in two vertical rows and two horizontal rows so that, for example, the entire M-sized substrate 20 having a size of 330 mm ⁇ 250 mm can be photographed without omission. As shown in FIG. 3, the imaging ranges of the respective cameras 18a to 18d are set so as to completely include the substrate 20 and include areas that overlap each other.
  • a total of four flat LED illuminations 19 are provided as illumination means, one on each of the four inner walls.
  • the LED illumination 19 is a white planar light source, the front and back LED illuminations 19 are distributed obliquely toward the substrate 20, and the LED illuminations 19 on both sides are distributed in a direction perpendicular to the side surfaces. Yes.
  • the LED lighting 19 provided on both side surfaces is provided at a position (a lower position) closer to the substrate 20 than the LED lighting 19 provided on the front and back surfaces.
  • the PC main body 25 is provided with a display 26, a keyboard 27, and a mouse 28 as interface means 30.
  • the PC main body 25 is supplied with power from a commercial power supply (not shown) via a power cable, and is connected to the image inspection apparatus main body 10 via, for example, a USB cable.
  • An image inspection program 35 is installed in the PC main body 25, and includes functions of a mesh unit 31, a preprocessing unit 32, a reference image storage unit 33, and a determination unit 34. Further, the PC main body 25 sets and controls the cameras 18a to 18d, and processes the photographed color image. Further, the PC main body 25 can shoot color images without shadows or shine by the cameras 18a to 18d by controlling each LED illumination 19.
  • a notebook personal computer is illustrated as the PC main body 25, and in the case of the notebook personal computer, a display 26 and a keyboard 27 are provided integrally with the PC main body 25.
  • the PC main body 25 may be, for example, a tablet terminal. In the case of a tablet terminal, the keyboard 27 and the mouse 28 can be omitted.
  • the PC main body 25 desirably employs a multi-core processor having a plurality of processor cores.
  • each processor core is basically independent, so that each processor core can be operated without being influenced by other processor cores.
  • the image inspection program 35 is programmed to cause a multi-core processor to perform parallel processing. Since the image inspection program 35 performs preprocessing and template matching for each mesh, the effect of improving the calculation speed by parallel processing is high.
  • the present invention is not limited to the multi-core processor, and any PC processor that can perform column processing can be used. For example, a multi-processor can be adopted.
  • the specifications, number and arrangement of the cameras 18a to 18d are different, and the specifications, number and arrangement of the LED lighting 19 are different. Therefore, by performing the initial setting of the image inspection program 35 according to the specifications of the image inspection apparatus body 10, the image inspection program 35 can be shared with the image inspection apparatus body 10 having various specifications. This initial setting is preferably performed before the shipment of the image inspection apparatus 1.
  • the reference image 40R that is the color image 40 of the non-defective substrate 20R is acquired.
  • the photographing start button on the non-defective substrate 20R displayed on the display 26 is clicked, the PC main body 25 and the image inspection apparatus main body 10 are in a communication state, and the PC main body 25 controls the cameras 18a to 18d and the LED illumination 19, and the camera The image data from 18a to 18d can be received.
  • the operator prepares a non-defective substrate 20 ⁇ / b> R that has been confirmed to be non-defective in advance, and mounts the non-defective substrate 20 ⁇ / b> R on the slide table 11.
  • each LED illumination 19 may be controlled so that the illumination corresponding to the imaging range of each camera 18a to 18d on the non-defective substrate 20R is optimized.
  • the display 26 displays that the acquisition of the reference image 40R of the non-defective substrate 20R is finished.
  • the communication stop button displayed on the display 26 is clicked to stop communication between the PC main body 25 and the image inspection apparatus main body 10.
  • the mode in which the four cameras 18a to 18d photograph the non-defective substrate 20R in order has been described.
  • the present invention is not limited to this, and a plurality of cameras in the four cameras 18a to 18d can simultaneously be captured. You may make it image
  • meshes of a predetermined pixel size are mapped over the entire inspection range, and after pre-processing each mesh, template matching between the reference image 40R and the test image 40T is performed in units of meshes.
  • desired parameter from the three parameters preset for each mesh, ie, “Standard [1]”, “Sweet [2]” and “Strict [3]”
  • desired parameter from the three parameters preset for each mesh, ie, “Standard [1]”, “Sweet [2]” and “Strict [3]”
  • “automatic mesh” in which meshes with standard [1] parameters are arranged at necessary locations by automatic system judgment is applied, but in addition to this, “all sets” in which all meshes become standard parameter settings.
  • “Clear” for removing all meshes from the inspection target can be selected, and the parameters of each mesh can be adjusted manually. For example, when all sets are selected, manually remove the unnecessary parts from the inspection target and set to [0] to complete the setting. When clear is selected, the parts that require manual inspection Set three parameters. Since the parameters can be adjusted manually in this way, initially all the inspection target locations are set to standard [1], and partially sweetened [2] or strict depending on the inspection results in actual production. Therefore, it can be changed to “3” for optimum setting.
  • FIG. 5A is a reference image 40R before being divided into a plurality of mesh-like sections
  • FIG. 5B is a reference image 40R after the automatic mesh is applied
  • FIG. 6A is a reference image in which the parameters of each mesh are being edited
  • 6B is a reference image 40R after editing the parameters of each mesh.
  • FIG. 6A shows a state in which the display magnification is increased by operating the mouse 28.
  • the area to be changed is selected by operating the mouse 28 and the area is fixed, a context menu is displayed.
  • the standard [1], sweet [2], strict [3], or [0] parameter to be removed from the inspection target is selected by operating the mouse 28 from this menu, all the items in the selected area are selected.
  • the mesh is changed to the selected parameter.
  • the detailed setting is completed by clicking the OK button displayed on the display 26 (see FIG. 6B).
  • the detailed setting of the mesh unit 31, the preprocessing unit 32, and the determination unit 34 can be changed as described later (see FIG. 8).
  • the four cameras 18a to 18d are photographed in order, that is, starting from the camera 18a, and then a predetermined area of the inspection board 20T is photographed in the order of the camera b, the camera 18c, and the camera 18d. Data is transmitted to the PC main body 25.
  • each LED illumination 19 may be controlled so that the illumination of the portion corresponding to the imaging range of each camera 18a to 18d on the inspection board 20T is optimized.
  • the mode in which the four cameras 18a to 18d photograph the inspection board 20T in order has been described, but the present invention is not limited to this, and a plurality of cameras in the four cameras 18a to 18d can simultaneously be captured. You may make it image
  • the four test images 40T are inspected in order. Each test image 40T is subjected to image processing by the mesh unit 31 and the preprocessing unit 32, and then the determination unit 34 performs template matching with the reference image 40R stored in the reference image storage unit 33, thereby determining pass / fail. Is done.
  • the determination of pass / fail corresponds not only to defective parts but also to solder balls, scratches, dirt, etc., which are required for mounting inspection.
  • the indicator lamp 13 lights in green with a sound of “ping-pong”, and the display 26 indicates that the inspection has been completed. Then, the operator is notified that the inspection board 20T is a non-defective product.
  • the communication stop button displayed on the display 26 is clicked to stop the communication between the PC main body 25 and the image inspection apparatus main body 10, and the inspection is completed.
  • the indicator lamp 13 is lit red together with the sound “Boobu”, and the defective part is displayed on the display 26 ( Thus, the operator is notified that the inspection board 20T may be defective, and the inspection is interrupted.
  • a test image 40T mapped by the mesh 41 is displayed on the display 26, and a red rectangle (see FIG. 7) is displayed in the defect determination portion.
  • the test image 40T can be enlarged to a desired magnification by operating the mouse 28.
  • the enlarged image of the defect determination portion can be displayed in color on the upper left of the screen by arranging the reference image 40R and the test image 40T side by side.
  • the inspection substrate 20T is mounted on the slide table 11 in the reverse direction, the first movable Since there is a possibility that the block 16 or the second movable block 17 is loose and the inspection board 20T is displaced, or the LED illumination 19 is not lit, the operator holds the inspection board 20T on the slide table 11. Re-install.
  • the operator performs a visual inspection of the test image 40T.
  • the screen can be enlarged by operating the mouse 28, and the test image 40T and the reference image 40R can be switched and confirmed.
  • the test image 40T and the reference image 40R of the mesh selected by the mouse 28 are displayed side by side and magnified and displayed as non-defective, it is possible to change the determination of the mesh selected by keyboard operation to non-defective determination. it can.
  • the next failure determination location is automatically selected.
  • the entire test image 40T is changed to the non-defective product determination, and the process automatically shifts to the next test image 40T inspection.
  • the parameter is removed from the inspection target [0] or changed to the sweet [2] parameter.
  • the reference image 40R can be partially replaced.
  • the part to be replaced on the test image 40T is selected with the mouse 28, a context menu is displayed, and by selecting "Replace reference image", the image of the selected part on the test image 40T is associated with the reference image 40R.
  • the part to do is rewritten.
  • the printed part can be mixed with the reverse image in either direction. It can be changed so that the non-defective product is determined.
  • a part to be mixed on the test image 40T is selected with the mouse 28, a context menu is displayed, and by selecting "Mix with reference image", the selected part on the test image 40T is a corresponding part of the reference image 40R. To be mixed. It is also possible to replace the reference image 40R with the test image 40T. In this case, one of the four reference images 40R can be replaced with the corresponding test image 40T, or all of the four reference images 40R can be replaced with the test image 40T.
  • the image inspection apparatus 1 is an inspection apparatus for a substrate 20, and in addition to the inspection of the state of mounted components, the inspection of the printed wiring pattern of the substrate 20, the inspection of the waterproof and insulating coating range, and the like. Can be used. In the case of the inspection of the range of the waterproof and insulating coating, the property that the coating range of the coating agent emits light by irradiating with black light is used.
  • the preset value can be selected from three parameters of standard 50, sweet 51 and strict 52, and corresponding to these parameters, pre-processing 60, matching condition 80, judgment standard 85, etc. Many mesh parameter values are set.
  • FIG. 8 shows each mesh parameter numerical value when the standard 50 is selected as the preset value.
  • the mesh size 53 represents the size of one mesh in units of pixels. If the mesh size 53 is small, the determination becomes strict, and if the mesh size 53 is large, the determination tends to be sweet. In FIG. 8, it is set to 20 pixels.
  • the mesh size 53 is desirably 3 pixels or more.
  • the automatic mesh 54, the entire set 55, and the clear 56 are used when the inspection target range is selected.
  • the automatic mesh 54 is selected in the initial setting state, and a mesh at a necessary portion is set to the standard 50 by automatic determination of the system. All sets 55 set all meshes to standard 50.
  • the clear 56 removes all meshes from the inspection target.
  • the pre-process 60 includes setting items for graying 61, contrast 70, and filter 74.
  • graying 61 one of RGB average 62, RGB blend 63, H67, S68, and V69 can be selected.
  • the RGB average 62 is obtained by averaging the luminances of RGB.
  • the RGB blend 63 is obtained by mixing the luminances of RGB at a numerical value ratio of 64 to 66 of 0 to 1.
  • H67 is used to change the hue value to a luminance value.
  • step S68 the saturation value is used as a luminance field.
  • V69 changes the intensity value to a luminance value.
  • 3 items of contrast 70, linear 71, S-curve 72 and subtractive color 73 are defined by integers from 0 to 10, and 0 items are not used.
  • the linear 71 is linear contrast enhancement
  • the S-curve 72 is contrast enhancement using an S-curve
  • the color reduction 73 is contrast enhancement by a gradation subtraction method.
  • the three items of the filter 74, Gaussian 75, median 76, and noise reduction 77 are defined by integers from 0 to 10, and 0 items are not used.
  • the Gaussian 75 is smoothing by a Gaussian filter, and reduces noise by smoothing edges.
  • the median 76 is smoothed by a median filter and reduces granular noise.
  • the noise reduction 77 is noise removal that maintains the outline, and reduces noise caused by blurring the image while leaving the boundary line.
  • the matching condition 80 is a parameter serving as a determination condition, and includes a search range 81, an overlap amount 82, and a matching method 83.
  • the search range 81 is a maximum allowable amount of deviation for each mesh in units of pixels.
  • the search range 81 is the maximum range for moving the test image 40T.
  • the overlap amount 82 is an overlap amount between meshes in units of pixels.
  • the matching method 83 selects an algorithm to be used for template matching. For example, the matching method 83 is selected from AUTO-1, AUTO-2, ZNCC, NCC, CC, SSD, and SAD.
  • AUTO-1 automatically selects from among a plurality of algorithms to be used for template matching according to the contrast in the mesh, and has a strict setting.
  • AUTO-2 automatically selects from among a plurality of algorithms used for template matching according to the contrast in the mesh, and is a standard setting.
  • ZNCC Zero-mean Normalized Cross-Correlation
  • NCC is a normalized cross-correlation technique in which matching values are normalized to ⁇ 1 to 1.
  • CC Cross-correlation matching method in which the correlation between two images is a similarity
  • SSD Sud ofquarSquared Difference
  • SAD Sum of Absolute Difference
  • ZNCC can absorb average brightness fluctuations.
  • the determination standard 85 as a determination method, three methods of matching rate (%) 86, luminance difference (%) 87, and deviation error (%) 88 are adopted (checked) and not adopted (unchecked). And, when adopting, a set value (%) can be designated.
  • the matching rate (%) 86 is a threshold value of the matching rate of template matching, and 1.0 (100%) is a perfect matching rate.
  • the luminance difference (%) 87 is the maximum allowable amount of the average luminance difference in the mesh.
  • the deviation error (%) 88 is the maximum allowable value of the difference between the luminance standard deviation values in the mesh.
  • an initial value parameter setting button may be provided so that the current setting value can be used as the initial value from the next time.
  • FIG. 9 is a configuration diagram of the production system 90.
  • the substrate 20 is processed in this order in the solder printer 91, the standard machine 93, the modified machine 94, and the reflow furnace 96, so that components are soldered to the board 20.
  • solder printing machine 91 paste solder is printed at the position where the components on the substrate 20 are soldered.
  • standard machine 93 standard parts are mounted at predetermined positions on the substrate 20.
  • variant machine 94 a variant part is mounted at a predetermined position on the substrate 20.
  • the reflow furnace 96 the substrate 20 is passed through a high-temperature furnace and components are soldered to the substrate 20. Examples of the heating method for the reflow furnace 96 include an infrared method, a hot air method, and a vapor phase soldering (VPS; vapor phase soldering) method.
  • VPN vapor phase soldering
  • a plurality of image inspection devices 92, 95, 97, 99 are provided after the processing devices 91, 93, 94, 96. Early feedback to 91, 93, 94, 96 is possible.
  • a solder printing inspection device 92 is provided at the subsequent stage of the solder printer 91, a pre-reflow component mounting inspection device 95 is provided at the subsequent stage of the variant machine 94, and a 3D solder and component mounting inspection device is provided at the subsequent stage of the reflow furnace 96.
  • a visual inspection 98 by an inspector and an off-line component mounting inspection device 99 are provided.
  • the image inspection apparatus 1 is provided as the pre-reflow component mounting inspection device 95 and / or the offline component mounting inspection device 99.
  • the pre-reflow component mounting inspection apparatus 95 since it is possible to determine a defect such as a component mounting failure before reflow soldering, no repair is necessary, and for the printing machine 91, the standard machine 93, and the profile machine 94, Early feedback is possible.
  • the image inspection device 1 of the present invention is simple in setting and low in cost.
  • the detection accuracy is high and the direct rate is high, a high effect can be obtained when it is used as the pre-reflow component mounting inspection device 95.
  • the image inspection apparatus 1 is incorporated in the production system 90 as the pre-reflow component mounting inspection apparatus 95, the substrate 20 is mounted on the slide table 11 in the image inspection apparatus 1 and the substrate 20 is removed from the slide table 11.
  • the production system 10 can be automated by matching the image inspection program 35 with the sequencer of the production system 10 as described later. It is also possible to arrange an operator for operating the image inspection apparatus 1 so that part of the inspection in the production system 10 is performed manually.
  • the image inspection apparatus 1 of the present invention is adopted as the off-line component mounting inspection apparatus 99, the setting is simple and the cost is low, and the detection accuracy is high and the direct rate is high.
  • This production system has a high effect and is also effective as a confirmation inspection after substrate repair. Thereby, the burden of the visual inspection 98 by the inspector can be reduced, and the expensive and time-consuming 3D solder and component mounting inspection device 97 can be omitted.
  • the image inspection apparatus main body 10 does not have a complicated configuration, the cameras 18a to 18d are fixed, and the cameras 18a to 18d do not require a diaphragm.
  • the image inspection apparatus main body 10 can be easily manufactured and the cost can be reduced.
  • a USB camera and general illumination can be used instead of the FA camera and FA illumination.
  • a sequencer is not required for I / O, and an IO board can be substituted.
  • the color image 40 can be obtained by shooting the substrate 20 only once, and the shooting of the substrate 20 can be completed in a short time.
  • the depth of field can be increased, so that it is not affected by the height of the components, and a wide range of the substrate 20 can be appropriately photographed.
  • a chip (0.603 chip) having a size of 0.6 mm ⁇ 0.3 mm can be inspected for an M size (330 mm ⁇ 250 mm) substrate 20, but the number and specifications of cameras are changed. As a result, it is possible to deal with substrates 20 of various sizes.
  • a PC for FA is not necessary, and a general-purpose PC can be used. If a PC equipped with a multi-core processor is employed, it is possible to greatly improve the calculation speed by enabling the image inspection program 35 to perform parallel processing. Since preprocessing and template matching are performed for each mesh, the effect of improving the computation speed by parallel processing is high.
  • the setting of the reference image 40R is simple, it is particularly suitable for a production system that performs high-mix low-volume production.
  • a color image 40 acquired by photographing the non-defective substrate 20R with the cameras 18a to 18d can be used as the reference image 40R.
  • a standard [1] 50 parameter mesh can be arranged at a necessary location by automatic determination of the system.
  • a desired parameter can be selected from three preset parameters, ie, “Standard [1]”, “Sweet [2]” and “Strict [3]”. You can also select the “Remove from [0]” setting.
  • preset three types of parameters detailed setting for each mesh can be easily performed. Further, in addition to the setting using the preset value, it is also possible to change the detailed setting of the mesh parameter values related to the mesh unit 31, the preprocessing unit 32, and the determination unit 34.
  • Pre-processing is performed for each mesh, an appropriate gray scale is acquired by image processing in the pre-processing, and template matching is performed based on the gray scale. Therefore, the detection accuracy is high, the direct rate is high, and the multi-core processor performs parallel processing. By performing the process, the calculation speed for the determination process can be improved. Further, an algorithm for template matching can be appropriately selected from a plurality of types according to the state of each mesh, so that the detection accuracy is higher and the direct rate can be increased. For example, when AUTO-1 or AUTO-2 is selected, an algorithm used for template matching is automatically selected from a plurality according to the contrast in the mesh.
  • the image inspection apparatus 1 it is effective to provide the image inspection apparatus 1 according to the first embodiment as the pre-reflow component mounting inspection device 95 and / or the offline component mounting inspection device 99 in the production system 90.
  • the pre-reflow component mounting inspection apparatus 95 since it is possible to determine a defect such as a component mounting failure before reflow soldering, no repair is necessary, and for the printing machine 91, the standard machine 93, and the profile machine 94, Early feedback is possible.
  • the image inspection apparatus 1 of the present invention is adopted as the off-line component mounting inspection apparatus 99, the setting is simple and the cost is low, and the detection accuracy is high and the direct rate is high.
  • This production system has a high effect and is also effective as a confirmation inspection after substrate repair. Thereby, the burden of the visual inspection 98 by the inspector can be reduced, and the expensive and time-consuming 3D solder and component mounting inspection device 97 can be omitted.
  • FIG. 10 is an external view of the image inspection apparatus 1A of the second embodiment.
  • the image inspection apparatus 1A according to the second embodiment differs from the image inspection apparatus 1 according to the first embodiment in that the PC main body 25 is incorporated into the image inspection apparatus main body 10A to be an all-in-one type.
  • a PC main body 25 is incorporated in the image inspection apparatus main body 10A, and an LCD monitor 26A is attached to the upper part of the image inspection apparatus main body 10A via a monitor arm 57.
  • an indicator lamp 13A is provided on the front upper portion of the image inspection apparatus main body 10 so that the determination result of the quality of the substrate can be displayed.
  • three indicator lamps 13A are provided, indicating that the preparation for inspection is completed by emitting blue light, indicating that the substrate is non-defective by emitting green light, and red The light is emitted to indicate that the substrate is defective.
  • a wireless keyboard 27A and a wireless mouse 28A are provided. Since the configuration of the slide table 11, the stopper 23, the cameras 18a to 18d, the LED lighting, and the like is the same as that of the first embodiment, the description thereof is omitted.
  • the PC main body 25 and the LCD monitor 26A are incorporated in the image inspection apparatus main body 10A, and there is no need to provide a separate PC main body 25.
  • the operator performs various settings and image inspections using the attached wireless keyboard 27A and wireless mouse 28A while viewing the image displayed on the LCD monitor 26A. Since there is no need to provide a separate PC main body 25, there is no need to connect the PC main body 25 and the image inspection apparatus main body 10A with a USB cable, and there is no need to connect a power cable for the PC main body 25 to a commercial power source. Therefore, wiring can be omitted.
  • FIGS. 1 to 10 An image inspection apparatus 1B according to a third embodiment of the present invention will be described.
  • the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof is omitted.
  • the image inspection apparatus 1B according to the third embodiment uses the CAD data of the substrate 20 at the time of the automatic mesh 54 and / or the acquisition of the reference image 40R. Different from device 1.
  • the mesh of the standard [1] parameter is arranged at a necessary location by automatic system determination.
  • the CAD data of the substrate 20 is stored in the PC body 25.
  • the CAD data of the substrate 20 can be used by the system when the system is automatically determined.
  • the CAD data can be read via a communication network, or the CAD data can be stored in a removable memory.
  • the CAD data Since the CAD data is used, it is possible to accurately determine a place where inspection is necessary and a place where inspection is not necessary, so that the mesh of the standard [1] parameter can be arranged more accurately. Furthermore, not only the setting of the standard [1] parameter but also the presence or absence of a specific part, the state of the wiring pattern, etc. are judged using CAD data, and the standard [1], the sweet [2] or the stricter The system may automatically determine each parameter of “3” and set each parameter to each mesh.
  • the mesh can be set manually after selecting the automatic mesh 54
  • the CAD data can also be used when setting the mesh manually. For example, by replacing the reference image 40R and the image of the substrate 20 drawn by CAD data and displaying them, the standard [1], the sweet [2], or the tightening is manually performed while comparing and confirming both screens. Each parameter of “3” can be set more appropriately.
  • the color image 40 obtained by photographing the non-defective substrate 20R with the cameras 18a to 18d is acquired as the reference image 40R.
  • a part or all of the reference image 40R is drawn by CAD data. It is also possible to replace the image of the substrate 20 that has been changed. The part to be replaced on the image of the board 20 drawn by CAD data is selected with the mouse 28, a context menu is displayed, and the selected part on the CAD data image is selected by selecting “Replace reference image”. The corresponding portion of the reference image 40R is rewritten with the image.
  • the reference image 40R can be replaced with an image of CAD data.
  • one of the four reference images 40R can be replaced with the corresponding CAD data image, or all of the four reference images 40R can be replaced with the CAD data image. . Since the reference image 40R can be made closer to an ideal image by using CAD data, it is possible to improve the detection accuracy and increase the orthogonality rate. For example, it is effective to use CAD data as the reference image 40R for the inspection of the wiring pattern of the substrate 20 or the like.
  • An image inspection apparatus 1C according to a fourth embodiment of the present invention will be described.
  • the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof is omitted.
  • An image inspection apparatus 1C according to the fourth embodiment is different from the image inspection apparatus 1 according to the first embodiment in that a plurality of reference images 40R are used.
  • the direct rate may decrease.
  • a part of the reference image 40R is mixed, for example, for a reverse mount of a non-polar part, since the printing direction is different from the reference image 40R, a defect is erroneously determined.
  • the image inspection apparatus 1C includes a plurality of reference image storage means 33, and stores a plurality of reference images 40R, or at least a predetermined part of the reference image 40R. By memorizing it, the direct rate is improved.
  • the inspection is performed based on the first reference image 40R, and the inspection is terminated when it is determined to be a non-defective product, but when it is determined to be defective, the inspection is again performed based on the second reference image 40R. Perform an inspection.
  • the substrate 20 is determined to be a non-defective product, and all the reference images are displayed.
  • the direct rate can be improved.
  • the entire image is first inspected based on the first reference image 40R, and if it is determined to be non-defective, the inspection is terminated. If it is determined to be defective, only a predetermined part of the image is inspected again based on the second reference image 40R.
  • the substrate 20 is non-defective. The straight line rate can be improved by determining that the substrate 20 is defective only when it is determined that the substrate 20 is defective for all the reference images 40R.
  • An image inspection apparatus 1D according to a fifth embodiment of the present invention will be described.
  • the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof is omitted.
  • An image inspection apparatus 1D according to the fifth embodiment is different from the image inspection apparatus 1 according to the first embodiment in terms of the number and arrangement of cameras.
  • a mode in which a plurality of cameras 18 arranged in a row is moved by a single-axis robot will be described.
  • four fixed cameras 18a to 18d are used.
  • a plurality of cameras for example, three cameras arranged in a row at equal intervals are moved by a single-axis robot in a direction orthogonal to the arrangement direction of the cameras 18.
  • 18 shooting ranges can be expanded. That is, after shooting with the camera 18 in the initial position, the camera 18 is moved to a predetermined position by the single-axis robot, and the shooting range by the camera 18 can be expanded by repeating this operation.
  • the single-axis robot has a simple structure, the number of cameras can be reduced while suppressing the increase in size and complexity of the apparatus. The cost can be reduced by reducing.
  • a single-axis robot capable of moving the camera 18 in the X direction has been described, but instead of the single-axis robot, the camera 18 is moved in the X direction (horizontal direction) and the Y direction (vertical direction). It is also possible to use a possible two-axis robot or a three-axis robot that can move the camera 18 in the X direction (lateral direction), the Y direction (vertical direction), and the Z direction (height direction).
  • the number of cameras 18 is not limited to a plurality, and may be one.
  • the camera 18 can be moved in the height direction according to the height of the component, so that an optimum image can be obtained using the fixed focus camera 18. is there.
  • FIGS. 1 to 10 An image inspection apparatus 1E according to a sixth embodiment of the present invention will be described.
  • the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof is omitted.
  • the image inspection program 35 of the image inspection apparatus 1E according to the sixth embodiment is different from the image inspection apparatus 1 according to the first embodiment in that it further includes an additional add-in program.
  • the image inspection program 35 initial settings, mesh processing, preprocessing, template matching, and the like are all incorporated as a completed application. For this reason, the image inspection program 35 can cope with the image inspection apparatus main body 10 having different specifications by adjusting the initial setting values according to the number of cameras, the type of camera, the size of the apparatus, and the like. .
  • the initial setting of the image inspection program 35 is completed at the time of shipment.
  • an add-in program when incorporating the image inspection apparatus 1E into an existing production system, it can be handled by adding an add-in program to the image inspection program 35 which is a completed application.
  • an additional add-in program when matching with the communication form of the hardware of the production system, when matching with I / O of the production system, or when matching with the sequencer of the production system It is possible to cope with this.
  • FIGS. 1 to 10 An image inspection apparatus 1F according to a seventh embodiment of the present invention will be described.
  • the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof is omitted.
  • the image inspection program 35 of the image inspection apparatus 1F according to the seventh embodiment has a modular inspection function, and can select and employ only a necessary inspection function. Different from the inspection apparatus 1.
  • the image inspection program 35 has a function of inspecting the appearance of the substrate 20, and this appearance inspection function is modularized. As other functions of appearance inspection, for example, barcode reading function, resistance color bar inspection function, dimension measurement function, character reading function, LED lighting inspection function, etc. are modularized.
  • the image inspection program 35 can be incorporated. Since each inspection function is modularized, in addition to being able to select only a desired inspection function, it becomes possible to add a function that has become necessary after the introduction of the image inspection apparatus 1F.
  • FIGS. 1 to 10 An image inspection apparatus 1G according to an eighth embodiment of the present invention will be described.
  • the same components as those in FIGS. 1 to 10 are denoted by the same reference numerals, and description thereof is omitted.
  • the image inspection apparatus 1G according to the eighth embodiment is different from the image inspection apparatus 1 according to the first embodiment in that the image inspection apparatus 1G is applied to uses other than the inspection of the substrate 20.
  • the image inspection apparatus 1G is applied to a medical site or a nursing site.
  • the care recipient may be restrained on the bed with a restraint, but the posture of the care recipient is monitored at any time. If notification can be made when the posture becomes inappropriate, an effect of reducing the frequency of restraining the care recipient with the restraint can be expected. Therefore, by applying the image inspection apparatus 1G of the present invention, the camera 18 is provided so that the entire bed can be photographed, the appropriate posture of the care recipient is stored as the reference image 40R, and the care recipient's appropriate posture is stored at predetermined time intervals. The state is photographed by the camera 18 to obtain a test image 40T.
  • the test image 40T by template matching with respect to the reference image 40R for each mesh, it is determined at every predetermined time interval whether the posture of the care recipient is appropriate. If it is defective, the caregiver can be notified. If the camera 18 is an infrared camera, the posture of the care recipient can be determined even when the bed is in a dark environment.
  • the present invention is applied to a security camera, provided with a camera 18 that captures the entire surveillance area, stores an image of no intruder among images captured by the camera 18 as a reference image 40R, and has a predetermined time interval. Then, the monitoring area is photographed by the camera 18 to obtain the test image 40T. Then, by determining the test image 40T with respect to the reference image 40R for each mesh by template matching, it is determined at every predetermined time interval whether there is an intruder in the monitoring area, and there is an intruder in the monitoring area. In this case, it is possible to notify the observer of the presence of the intruder. If the camera 18 is an infrared camera, the presence of an intruder can be appropriately determined even when the monitoring area is in a dark environment.
  • the present invention is applied to a surveillance camera for prevention of beast harm, and a camera 18 for photographing the entire surveillance area is provided, and an image in a state where no harmful beast exists from images taken by the camera 18 is used as a reference image 40R.
  • the test area 40 is acquired by photographing the monitoring area with the camera 18 at predetermined time intervals. Then, by determining by template matching the test image 40T with respect to the reference image 40R for each mesh, it is determined at every predetermined time interval whether or not there is a pest in the monitoring area, and there is a pest in the monitoring area. In this case, it is possible to notify the observer of the presence of a pest. In addition, when it is determined that there is a pest, it is possible to drive away the pest by automatically driving the alarm means. Further, if the camera 18 is an infrared camera, the presence of a pest can be appropriately determined even when the monitoring area is dark.
  • Deviation error (%) DESCRIPTION OF SYMBOLS 90 ... Production system 91 ... Printing machine 92 ... Printing inspection apparatus 93 ... Standard machine 94 ... Atypical machine 95 ... Pre-reflow component mounting inspection apparatus 96 ... Reflow furnace 97 ... Component mounting inspection apparatus 98 ... Visual inspection 99 ... Offline component mounting inspection apparatus

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Abstract

La présente invention concerne un dispositif d'inspection d'image ayant une précision de détection élevée par rapport à une image en couleur ainsi qu'une orthogonalité élevée, et dans lequel le temps de calcul pour le traitement de détermination est court, le réglage initial est aisé et le coût associé est faible. Le dispositif d'inspection d'image 1 selon l'invention est caractérisé en ce qu'il est pourvu d' : un moyen d'imagerie 18 pour capturer une image d'un objet d'inspection sous la forme d'une image en couleur 40; un moyen de maillage 31 pour diviser l'image en couleur 40 en une forme de maillage; un moyen de prétraitement 32 pour convertir l'image en couleur 40 en niveaux de gris prédéterminés; un moyen de stockage d'image de référence; un moyen de détermination 34 comprenant une mise en correspondance de modèle pour déterminer un degré de similarité sur la base d'un paramètre prédéterminé pour chacune d'une pluralité de divisions de la forme de maillage pour une image de référence 40R et une image d'inspection 40T capturée par le moyen d'imagerie 18, l'image d'inspection 40T étant divisée en une pluralité de divisions dans une forme de maillage par le moyen de maillage 31 et le moyen de prétraitement 32 et convertie en niveaux de gris prédéterminés; et un moyen d'interface 30.
PCT/JP2018/016374 2017-04-25 2018-04-20 Dispositif d'inspection d'image, système de production, procédé d'inspection d'image, programme et support de stockage WO2018198991A1 (fr)

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