WO2018173379A1 - Dispositif de conversion de courant - Google Patents

Dispositif de conversion de courant Download PDF

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Publication number
WO2018173379A1
WO2018173379A1 PCT/JP2017/043630 JP2017043630W WO2018173379A1 WO 2018173379 A1 WO2018173379 A1 WO 2018173379A1 JP 2017043630 W JP2017043630 W JP 2017043630W WO 2018173379 A1 WO2018173379 A1 WO 2018173379A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
capacitor
section
semiconductor element
power conversion
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Application number
PCT/JP2017/043630
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English (en)
Japanese (ja)
Inventor
大輔 松元
中津　欣也
央 上妻
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株式会社日立製作所
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Filing date
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Publication of WO2018173379A1 publication Critical patent/WO2018173379A1/fr

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  • the present invention relates to a power conversion device.
  • Patent Document 1 states that “a plurality of compartments are formed inside the box of the power converter, and at least one of the compartments is configured to allow forced air flow from outside.
  • the partition chamber adjacent to the partition wall through the partition wall cannot be forced to flow cooling air from the outside, and the power conversion device needs to be cooled in the partition chamber capable of forced cooling air flow.
  • the component device is accommodated, and the electrical connection terminal portion of the component device accommodated in the compartment is exposed through the partition wall into the compartment where the cooling air cannot be forced to flow through.
  • the connection terminal portions of the component devices exposed to each other and the connection terminal portions of other component devices are connected by connection conductors in the compartment where the forced air flow is not possible.
  • a first semiconductor element, a first heat sink mounted on the first semiconductor element, a first capacitor, and a first semiconductor element A first main circuit board on which the first capacitor is mounted; a second semiconductor element; a second heat sink mounted on the second semiconductor element; a second capacitor; A second main circuit board on which the semiconductor element and the second capacitor are mounted; a first section in which the first main circuit board is accommodated; and a second section having a ventilation path through which the cooling air flows.
  • a housing that forms a third compartment in which the second main circuit board is accommodated, and an electrical terminal of the first capacitor and an electrical terminal of the first semiconductor element are the first At least a portion of the first capacitor and the first heat shield.
  • At least a portion of the first capacitor is exposed to the second section, and an electric terminal of the second capacitor and an electric terminal of the second semiconductor element are housed in the third section, and at least the second capacitor A part and at least a part of the second heat sink are exposed to the second section.
  • a power converter device can be comprised small and lightweight, suppressing accumulation of dust.
  • FIG. 2B is a partially enlarged view of FIG. 2A. It is a cross-sectional view of the principal part of the power converter device of 2nd Embodiment.
  • FIG. 3B is a partially enlarged view of FIG. 3A.
  • FIG. 1 is a longitudinal sectional view of a power conversion device S1 according to the first embodiment of the present invention.
  • the power conversion device S1 includes a substantially cuboid frame-shaped casing 100.
  • the outside of the housing 100 is in an atmospheric environment.
  • the casing 100 has three sections divided along the vertical direction, and these sections are arranged in order from the top, SP1 (first section), SP2 (second section), SP3 (third section). ).
  • the upper surface and side surfaces of the section SP1 are covered with an upper lid 110 (first lid member) having a substantially cross-sectional shape, thereby suppressing the flow of air and outside air in the section SP1.
  • the lower surface of the section SP1 is covered with the partition plate 130 (first partition plate) and the power conversion circuit 120.
  • the power conversion circuit 120 includes a main circuit board 122 (first main circuit board), a capacitor 124 (first capacitor), and a semiconductor element 126 (first semiconductor element).
  • the partition plate 130 is obtained by forming a plurality of through holes 130a (first through holes) in a rectangular plate made of an insulating material or a metal material.
  • the main circuit board 122 is attached to the partition plate 130 so as to cover the through hole 130a.
  • a plurality of capacitors 124 and a plurality of semiconductor elements 126 are mounted on the main circuit board 122.
  • the main circuit board 122 is obtained by applying a wiring pattern (not shown) made of copper metal or the like to a plate of an insulating material such as an epoxy resin, and the wiring patterns having different potentials are insulated by the insulating material.
  • the capacitor 124 and the semiconductor element 126 are appropriately connected to these wiring patterns.
  • the configuration of the wiring pattern and the type and quantity of the capacitor 124 and the semiconductor element 126 may be determined according to a desired power conversion method.
  • the capacitor 124 is arranged so that these electric terminals 124a face upward, and the main body portion of the capacitor 124 passes through the partition plate 130 through the through hole 130a and protrudes to the lower section SP2.
  • the semiconductor element 126 has an electrical terminal 126a protruding in the lateral direction. These electric terminals 124 a and 126 a are connected to the wiring pattern by soldering or the like on the upper surface side of the main circuit board 122.
  • a heat sink 128 that suppresses a temperature rise during operation is mounted on the lower surface of the semiconductor element 126.
  • the semiconductor element 126 and the heat sink 128 are inserted through the through hole 130 a of the partition plate 130.
  • the abutting surface between the semiconductor element 126 and the heat sink 128 is preferably near the vertical center position of the through-hole 130a (vertical center position of the partition plate 130).
  • the heat sink 128 has a plurality of fins (not indicated) serving as a heat radiating portion, and the heat radiating portion protrudes into the lower section SP2 through the through hole 130a.
  • the lower surface and side surfaces of the section SP3 are covered with a lower lid 150 (second cover member) having a substantially square cross section, thereby suppressing the flow of air and outside air in the section SP3.
  • the vertical width of the lower lid 150 is wider than that of the upper lid 110.
  • the upper surface of the section SP3 is covered with the partition plate 140 (second partition plate) and the power conversion circuit 160.
  • the power conversion circuit 160 includes a main circuit board 162 (second main circuit board), a capacitor 164, and a semiconductor element 166.
  • the partition plate 140 is formed by forming a plurality of through holes 140a (second through holes) in a rectangular plate made of an insulating material or a metal material, like the partition plate 130.
  • the main circuit board 162 is mounted on the partition plate 140 so as to cover the through hole 140a.
  • the main circuit board 162 is obtained by applying a wiring pattern to a plate of an insulating material.
  • the capacitor 164 (second capacitor) and the semiconductor element 166 (second semiconductor element) are These wiring patterns are appropriately connected.
  • the capacitor 164 is disposed such that these electric terminals 164a face downward, and the main body portion of the capacitor 164 penetrates the partition plate 140 through the through hole 140a and protrudes into the section SP2. Further, the semiconductor element 166 has an electrical terminal 166a protruding in the lateral direction. The electrical terminals 164a and 166a are connected to the wiring pattern by soldering or the like on the lower surface side of the main circuit board 162.
  • a heat sink 168 (second heat sink) configured similarly to the heat sink 128 is mounted on the upper surface of the semiconductor element 166.
  • the semiconductor element 166 and the heat sink 168 are inserted through the through hole 140a.
  • the abutting surface between the semiconductor element 166 and the heat sink 168 is preferably in the vicinity of the vertical center position of the through hole 140a.
  • a control circuit 170 is disposed below the power conversion circuit 160.
  • the control circuit 170 has a control board 172 and various components (not shown) mounted thereon.
  • the control circuit 170 controls the on / off states of the semiconductor elements 126 and 166.
  • the housing 100 has electrical terminals that input and output power to the power conversion circuits 120 and 160.
  • the main body portions of the capacitors 124 and 164 and the heat dissipation portions of the heat sinks 128 and 168 protrude into the section SP2.
  • Both ends (front and rear ends in FIG. 1) of the partition SP2 are opened, and the partition plates 130 and 140 are the upper and lower surfaces.
  • a pair of side wall plates 134 (in FIG. 1, only one of them is shown because it is a cross-sectional view) serves as the left and right surfaces.
  • the section SP2 is formed in a substantially duct shape as a whole.
  • a blower 132 is disposed in front of the section SP2. The cooling air W by the blower 132 flows in from the front of the section SP2 and flows out backward.
  • the partition plates 130 and 140 are separated by a distance that can secure a sufficient space between the capacitors 124 and 164 and between the heat sinks 128 and 168.
  • the cooling air W cools the main body portions of the capacitors 124 and 164, cools the semiconductor elements 126 and 166 through the heat sinks 128 and 168, and then is discharged backward.
  • the partition plates 130 and 140 are also exposed to the cooling air W, the heat of the main circuit boards 122 and 162 is exhausted after being transmitted to the partition plates 130 and 140.
  • the section SP1 and the section SP3 are in an airtight state. Therefore, the capacitors 124 and 164 and the electrical terminals 124a, 164a, 126a, and 166a of the semiconductor elements 126 and 166 are not directly exposed to the cooling air W.
  • the cooling air W purifies the atmosphere containing dust and the like with an air filter or the like, it still contains a certain amount of dust. Therefore, dust tends to accumulate in the path of the cooling air W due to long-term use of the power conversion device S1.
  • the electrical terminals 124a, 164a, 126a, 166a are not exposed in the path of the cooling air W, it is possible to suppress the accumulation of dust between these terminals.
  • the dust becomes a short circuit path and an unexpected short circuit may occur between the electrical terminals. Since such a short circuit leads to a sudden stop or failure of the apparatus, a certain distance is provided between the electrical terminals. The distance is determined by a period in which a short circuit due to dust is desired to be prevented, a dust level, and the like. In general, there is a desire to use the apparatus for a long period of time and in an environment with a high dust level. If this requirement is met, the distance between the electrical terminals becomes longer, which tends to increase the size of the apparatus. On the other hand, according to the present embodiment, since the cooling air W is not directly exposed to the electric terminals, it is not necessary to increase the distance between the electric terminals even when the dust level of the outside air is high.
  • the device S1 can be reduced in size.
  • the configuration of the main circuit boards 122 and 162 is determined based on the adopted power conversion method or the like, but the potential (for example, ground potential) of the main circuit boards 122 and 162 may be greatly different depending on the power conversion method or the like. In that case, there is a case where a certain distance should be provided between the main circuit boards 122 and 162 in accordance with the potential difference between them.
  • the main circuit boards 122 and 162 are originally separated by a certain distance (the width in the vertical direction of the side wall plate 134), thereby ensuring a sufficient insulation distance. There are many cases. Therefore, it is not necessary to secure an extra space for securing the insulation distance, and the power conversion device S1 can be configured to be small and light.
  • FIG. 2A is a cross-sectional view of the power conversion device S1 in the vicinity of the ends of the sections SP1 and SP2.
  • FIG. 2B is an enlarged view of the A1 portion.
  • the partition plate 130 and the side wall plate 134 are in direct contact with each other.
  • a sealing material 210 (first sealing material) is inserted between the upper lid 110 and the partition plate 130.
  • the sealing material 210 a sheet of resin or the like, an adhesive, or the like can be applied.
  • a sealing material 210 (second sealing material) is similarly inserted between the partition plate 140 and the lower lid 150 shown in FIG. 1 (not shown). Thereby, the airtightness of division SP3 can be improved similarly.
  • FIGS. 3A and 3B are cross-sectional views of the power conversion device in the vicinity of the ends of the sections SP1 and SP2 in the power conversion device S2 of the present embodiment.
  • FIG. 3B is an enlarged view of the B1 portion.
  • FIG. 3A the upper lid 110 and the partition plate 130 are in direct contact with each other.
  • a sealing material 220 (third sealing material) is inserted between the partition plate 130 and the side wall plate 134.
  • the sealing material 220 a sheet of resin or the like, an adhesive, or the like can be applied as in the sealing material 210 (see FIG. 2B) of the first embodiment.
  • the sealing material 220 it is possible to close a minute gap due to a manufacturing error of the partition plate 130 and the side wall plate 134, and to improve the airtightness in the lateral direction of the section SP2.
  • a sealing material 220 (fourth sealing material) is similarly inserted between the partition plate 140 and the side wall plate 134 shown in FIG. 1 (not shown). Thereby, leakage of the cooling air W from the lateral direction can be prevented, and the diffusion of dust throughout the entire apparatus can be more reliably suppressed.
  • a sealing material 210 may be inserted between the upper lid 110 and the partition plate 130 as in the first embodiment (see FIG. 2B). That is, both the sealing materials 210 and 220 may be applied.
  • FIG. 4 is a longitudinal sectional view of the power converter S3 according to the present embodiment.
  • the power conversion device S3 has a substantially rectangular parallelepiped frame-shaped housing 100B.
  • the housing 100B has sections SP1, SP2, and SP3 partitioned along the vertical direction, like the housing 100 (see FIG. 1) of the first embodiment.
  • control circuits 180 (first control circuits) and 190 are provided instead of the control circuit 170 in the first embodiment.
  • the control circuit 180 controls the on / off state of the semiconductor element 126 in the power conversion circuit 120.
  • the control circuit 190 controls the on / off state of the semiconductor element 166 in the power conversion circuit 160.
  • the control circuit 180 includes a control board 182 (first control board) provided in the section SP1 and a heat sink 184 (third heat sink) attached to a heat generating component (not shown) mounted on the control board 182. And have.
  • the heat sink 184 protrudes into the partition SP2 through the through hole 130a of the partition plate 130.
  • control circuit 190 (second control circuit) is mounted on a control board 192 (second control board) provided in the section SP3 and a heat generating component (not shown) mounted on the control board 192.
  • Heat sink 194 (fourth heat sink). The heat sink 194 protrudes into the partition SP2 through the through hole 140a of the partition plate 140.
  • the control circuits 180 and 190 can be cooled by the cooling air W, the reliability of these control circuits can be improved particularly when the amount of heat generated by the control circuits 180 and 190 is large.
  • FIG. 5 is a perspective view of the power converter S4 according to the present embodiment.
  • the power conversion device S4 includes a housing 100. Inside the housing 100, each component of the power conversion device S1 (first embodiment) shown in FIG. 1, such as the power conversion circuits 120 and 160, is provided.
  • a power conversion circuit 410 having a substantially rectangular parallelepiped casing 412 is attached to the right end of the front end portion of the casing 100.
  • a power conversion circuit 430 having a substantially rectangular parallelepiped casing 432 is attached to the left end of the front end portion of the casing 100.
  • Electrical terminals 414 and 434 protrude from the front surfaces of the housings 412 and 432 toward the front, respectively.
  • heat sinks 416 and 436 protrude from the left side surface of the housing 412 and the right side surface of the housing 432 so as to face each other.
  • a transformer circuit 450 having a substantially rectangular parallelepiped casing 452 is attached to the rear end of the casing 100.
  • the housing 452 is open along the front-rear direction (not shown).
  • the cooling air W flowing in from the front of the housings 412 and 432 is discharged rearward through the housing 100 and the housing 452.
  • the above-described casings 100, 412, 432, and 452 are collectively referred to as a casing 400.
  • the housings 412 and 432 are configured to keep the inside thereof in an airtight state. Accordingly, dust is less likely to accumulate around electrical terminals (not shown) inside the casings 412 and 432.
  • FIG. 6 is a circuit diagram of the power conversion device S4 according to the present embodiment.
  • the power conversion circuit 410 includes four semiconductor elements 422 that are bridge-connected.
  • the semiconductor element 422 is an IGBT (Insulated Gate Bipolar Transistor) and a free-wheeling diode connected to each of them in parallel.
  • the power conversion circuit 410 operates as a synchronous rectification circuit, and converts an AC voltage (for example, commercial frequency) applied to the electrical terminal 414 into a DC voltage.
  • the heat sink 416 shown in FIG. 5 is attached to these semiconductor elements 422.
  • the power conversion circuit 120 includes a plurality of capacitors 124 and a plurality of semiconductor elements 126.
  • the plurality of capacitors 124 are illustrated as one capacitor 124G in FIG.
  • the DC voltage output from the power conversion circuit 410 is smoothed by the capacitor 124G.
  • the semiconductor element 126 is a MOSFET (Metal-Oxide-SemiconductoremiField-Effect Transistor) and a free-wheeling diode connected in parallel to each of them, and four semiconductor devices 126 are bridge-connected. .
  • MOSFET Metal-Oxide-SemiconductoremiField-Effect Transistor
  • the power conversion circuit 120 operates as an inverter, and converts the DC voltage output from the capacitor 124G into a high-frequency voltage of about several tens of kHz.
  • the transformer circuit 450 includes a high-frequency transformer 462, a reactor 468, and a capacitor 464, and supplies power from the power conversion circuit 120 to the power conversion circuit 160 while insulating the power conversion circuit 120 and the power conversion circuit 160.
  • the power conversion circuit 160 includes a plurality of capacitors 164 and a plurality of semiconductor elements 166.
  • the plurality of capacitors 164 are illustrated as one capacitor 164G in FIG.
  • the semiconductor element 126 is a diode, and four semiconductor elements 126 are bridge-connected to form a full-wave rectifier circuit.
  • the high-frequency voltage output from the transformer circuit 450 is converted into a DC voltage by the semiconductor element 166, and the DC voltage is smoothed by the capacitor 164G.
  • the power conversion circuit 430 includes four semiconductor elements 442 that are bridge-connected.
  • the semiconductor element 442 is an IGBT and a free-wheeling diode connected to each of them in parallel. Note that the heat sink 436 shown in FIG. 5 is attached to these semiconductor elements 442.
  • the power conversion circuit 430 operates as an inverter, converts the DC voltage supplied from the power conversion circuit 160 into an AC voltage (for example, commercial frequency), and outputs the AC voltage via the electrical terminal 434.
  • the control circuit 170 controls the on / off states of the semiconductor elements 126, 422, 442 included in the power conversion circuits 120, 410, 430.
  • the AC voltage applied to the electrical terminal 414 can be converted into another AC voltage having a desired voltage and frequency and output via the electrical terminal 434.
  • FIG. 7 is a schematic diagram of the power conversion system S5 according to the present embodiment.
  • the power conversion system S5 includes a housing 500, and four power conversion devices S4 are arranged in the vertical direction inside the housing 500.
  • the configuration of each power conversion device S4 is the same as that of the fourth embodiment.
  • the electric terminals 414 (see FIG. 6) in the four power converters S4 are sequentially connected in series, and the electric terminals 434 are also sequentially connected in series. In this way, when a plurality of power conversion devices S4 are connected in series, a higher level AC voltage can be input / output compared to a single power conversion device S4.
  • a duct-shaped exhaust passage 510 is formed behind each power conversion device S ⁇ b> 4, and a blower 132 is attached to the upper end portion of the exhaust passage 510.
  • the cooling air W is sucked from the front surface of each power converter S4.
  • the cooling air W is discharged
  • FIG. thus, according to this embodiment, it becomes possible to input / output a higher level AC voltage than in the fourth embodiment, and the number of blowers 132 can be made smaller than the number of power conversion devices S4.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made.
  • the above-described embodiments are illustrated for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.
  • a part of the configuration of a certain embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of a certain embodiment.
  • the control lines and information lines shown in the figure are those that are considered necessary for the explanation, and not all the control lines and information lines that are necessary on the product are shown. Actually, it may be considered that almost all the components are connected to each other. Examples of possible modifications to the above embodiment are as follows.
  • a plurality of through holes 130 a and 140 a are formed for the partition plates 130 and 140.
  • the number of through holes 130a and 140a may be one each. That is, a plurality of semiconductor elements and capacitors may be inserted through one through hole.
  • a diode is applied as the semiconductor element 166 of the power conversion circuit 160.
  • switching elements such as MOSFETs and IGBTs may be applied in place of the diodes.

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Abstract

La présente invention concerne un dispositif de conversion de courant, lequel, afin de configurer un dispositif de conversion de courant de manière à ce qu'il ait une petite taille et un faible poids tout en évitant l'accumulation de poussière, comprend un boîtier (100) dans lequel est formé un premier compartiment (SP1) recevant une première carte de circuit imprimé principale (122), un deuxième compartiment (SP2) ayant un passage de flux d'air destiné à permettre au flux d'air de refroidissement de le traverser, et un troisième compartiment (SP3) recevant une seconde carte de circuit imprimé principale (162). Des bornes électriques (124a) de premiers condensateurs (124) et des bornes électriques (126a) de premiers éléments semi-conducteurs (126) sont installées dans le premier compartiment; au moins une partie de chaque premier condensateur (124) et au moins une partie de chaque premier dissipateur thermique (128) sont mises à nu dans le deuxième compartiment; des bornes électriques (164a) de seconds condensateurs (164) et des bornes électriques (166a) de seconds éléments semi-conducteurs (166) sont reçues dans le troisième compartiment; et au moins une partie de chaque second condensateur (164) et au moins une partie de chaque second dissipateur thermique (168) sont mises à nu dans le deuxième compartiment.
PCT/JP2017/043630 2017-03-22 2017-12-05 Dispositif de conversion de courant WO2018173379A1 (fr)

Applications Claiming Priority (2)

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JP2017056708 2017-03-22
JP2017-056708 2017-03-22

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WO2018173379A1 true WO2018173379A1 (fr) 2018-09-27

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021002952A (ja) * 2019-06-24 2021-01-07 富士電機株式会社 電力変換装置
JP2021072701A (ja) * 2019-10-30 2021-05-06 日立ジョンソンコントロールズ空調株式会社 電力変換装置
WO2021215281A1 (fr) * 2020-04-22 2021-10-28 株式会社日立製作所 Unité de conversion de puissance et dispositif de conversion de puissance

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004357348A (ja) * 2003-05-27 2004-12-16 Mitsubishi Electric Corp 電力変換装置
WO2015097833A1 (fr) * 2013-12-26 2015-07-02 三菱電機株式会社 Dispositif de conversion de puissance
WO2016152320A1 (fr) * 2015-03-20 2016-09-29 三菱重工オートモーティブサーマルシステムズ株式会社 Compresseur électrique, dispositif de commande, et procédé de surveillance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004357348A (ja) * 2003-05-27 2004-12-16 Mitsubishi Electric Corp 電力変換装置
WO2015097833A1 (fr) * 2013-12-26 2015-07-02 三菱電機株式会社 Dispositif de conversion de puissance
WO2016152320A1 (fr) * 2015-03-20 2016-09-29 三菱重工オートモーティブサーマルシステムズ株式会社 Compresseur électrique, dispositif de commande, et procédé de surveillance

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021002952A (ja) * 2019-06-24 2021-01-07 富士電機株式会社 電力変換装置
JP2021072701A (ja) * 2019-10-30 2021-05-06 日立ジョンソンコントロールズ空調株式会社 電力変換装置
JP7316193B2 (ja) 2019-10-30 2023-07-27 日立ジョンソンコントロールズ空調株式会社 電力変換装置
WO2021215281A1 (fr) * 2020-04-22 2021-10-28 株式会社日立製作所 Unité de conversion de puissance et dispositif de conversion de puissance

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