WO2018173379A1

WO2018173379A1 - Power conversion device

Info

Publication number: WO2018173379A1
Application number: PCT/JP2017/043630
Authority: WO
Inventors: 大輔松元; 中津　欣也; 央上妻
Original assignee: 株式会社日立製作所
Priority date: 2017-03-22
Filing date: 2017-12-05
Publication date: 2018-09-27

Abstract

In order to configure a power conversion device to have a small size and a small weight while inhibiting accumulation of dust, this power conversion device comprises a housing (100) having formed therein a first compartment (SP1) accommodating a first main circuit board (122), a second compartment (SP2) having an airflow passage for allowing cooling airflow to pass therethrough, and a third compartment (SP3) accommodating a second main circuit board (162), wherein: electric terminals (124a) of first capacitors (124) and electric terminals (126a) of first semiconductor elements (126) are accommodated in the first compartment; at least a part of each of the first capacitors (124) and at least a part of each first heat sink (128) are exposed in the second compartment; electric terminals (164a) of second capacitors (164) and electric terminals (166a) of second semiconductor elements (166) are accommodated in the third compartment; and at least a part of each of the second capacitors (164) and at least a part of each second heat sink (168) are exposed in the second compartment.

Description

Power converter

The present invention relates to a power conversion device.

When forced air cooling is performed on a power conversion device such as an inverter, if the cooling air contains dust, dust may accumulate in the electrical terminals of each part, and the insulation performance may be reduced. As a countermeasure, the following Patent Document 1 states that “a plurality of compartments are formed inside the box of the power converter, and at least one of the compartments is configured to allow forced air flow from outside. The partition chamber adjacent to the partition wall through the partition wall cannot be forced to flow cooling air from the outside, and the power conversion device needs to be cooled in the partition chamber capable of forced cooling air flow. The component device is accommodated, and the electrical connection terminal portion of the component device accommodated in the compartment is exposed through the partition wall into the compartment where the cooling air cannot be forced to flow through. The connection terminal portions of the component devices exposed to each other and the connection terminal portions of other component devices are connected by connection conductors in the compartment where the forced air flow is not possible. " Yes (see abstract)

JP 2016-116327 A

However, if a plurality of compartments are simply formed inside the casing of the power conversion device, space efficiency is deteriorated, resulting in a problem that the casing of the power conversion device is enlarged. Further, when the power conversion device includes a plurality of circuits having greatly different potentials, there arises a problem that the casing is further increased in size in order to secure a space between the circuits.
This invention is made in view of the situation mentioned above, and it aims at providing the power converter device which can be comprised small and lightweight, suppressing accumulation of dust.

In order to solve the above problems, in the power conversion device of the present invention, a first semiconductor element, a first heat sink mounted on the first semiconductor element, a first capacitor, and a first semiconductor element A first main circuit board on which the first capacitor is mounted; a second semiconductor element; a second heat sink mounted on the second semiconductor element; a second capacitor; A second main circuit board on which the semiconductor element and the second capacitor are mounted; a first section in which the first main circuit board is accommodated; and a second section having a ventilation path through which the cooling air flows. And a housing that forms a third compartment in which the second main circuit board is accommodated, and an electrical terminal of the first capacitor and an electrical terminal of the first semiconductor element are the first At least a portion of the first capacitor and the first heat shield. At least a portion of the first capacitor is exposed to the second section, and an electric terminal of the second capacitor and an electric terminal of the second semiconductor element are housed in the third section, and at least the second capacitor A part and at least a part of the second heat sink are exposed to the second section.

ADVANTAGE OF THE INVENTION According to this invention, a power converter device can be comprised small and lightweight, suppressing accumulation of dust.

It is a longitudinal cross-sectional view of the power converter device by 1st Embodiment of this invention. It is a cross-sectional view of the principal part of the power converter device of 1st Embodiment. FIG. 2B is a partially enlarged view of FIG. 2A. It is a cross-sectional view of the principal part of the power converter device of 2nd Embodiment. FIG. 3B is a partially enlarged view of FIG. 3A. It is a longitudinal cross-sectional view of the power converter device by 3rd Embodiment. It is a perspective view of the power converter device by 4th Embodiment. It is a circuit diagram of the power converter device by 4th Embodiment. It is a schematic diagram of the power conversion system by 5th Embodiment.

[First Embodiment]
FIG. 1 is a longitudinal sectional view of a power conversion device S1 according to the first embodiment of the present invention.
The power conversion device S1 includes a substantially cuboid frame-shaped casing 100. The outside of the housing 100 is in an atmospheric environment. The casing 100 has three sections divided along the vertical direction, and these sections are arranged in order from the top, SP1 (first section), SP2 (second section), SP3 (third section). ).

The upper surface and side surfaces of the section SP1 are covered with an upper lid 110 (first lid member) having a substantially cross-sectional shape, thereby suppressing the flow of air and outside air in the section SP1. Further, the lower surface of the section SP1 is covered with the partition plate 130 (first partition plate) and the power conversion circuit 120. The power conversion circuit 120 includes a main circuit board 122 (first main circuit board), a capacitor 124 (first capacitor), and a semiconductor element 126 (first semiconductor element). Here, the partition plate 130 is obtained by forming a plurality of through holes 130a (first through holes) in a rectangular plate made of an insulating material or a metal material. The main circuit board 122 is attached to the partition plate 130 so as to cover the through hole 130a.

A plurality of capacitors 124 and a plurality of semiconductor elements 126 are mounted on the main circuit board 122. The main circuit board 122 is obtained by applying a wiring pattern (not shown) made of copper metal or the like to a plate of an insulating material such as an epoxy resin, and the wiring patterns having different potentials are insulated by the insulating material. The capacitor 124 and the semiconductor element 126 are appropriately connected to these wiring patterns.

The configuration of the wiring pattern and the type and quantity of the capacitor 124 and the semiconductor element 126 may be determined according to a desired power conversion method. The capacitor 124 is arranged so that these electric terminals 124a face upward, and the main body portion of the capacitor 124 passes through the partition plate 130 through the through hole 130a and protrudes to the lower section SP2. In addition, the semiconductor element 126 has an electrical terminal 126a protruding in the lateral direction. These

electric terminals

124 a and 126 a are connected to the wiring pattern by soldering or the like on the upper surface side of the main circuit board 122.

On the lower surface of the semiconductor element 126, a heat sink 128 that suppresses a temperature rise during operation is mounted. The semiconductor element 126 and the heat sink 128 are inserted through the through hole 130 a of the partition plate 130. The abutting surface between the semiconductor element 126 and the heat sink 128 is preferably near the vertical center position of the through-hole 130a (vertical center position of the partition plate 130). The heat sink 128 has a plurality of fins (not indicated) serving as a heat radiating portion, and the heat radiating portion protrudes into the lower section SP2 through the through hole 130a.

Further, the lower surface and side surfaces of the section SP3 are covered with a lower lid 150 (second cover member) having a substantially square cross section, thereby suppressing the flow of air and outside air in the section SP3. Here, the vertical width of the lower lid 150 is wider than that of the upper lid 110. Further, the upper surface of the section SP3 is covered with the partition plate 140 (second partition plate) and the power conversion circuit 160. The power conversion circuit 160 includes a main circuit board 162 (second main circuit board), a capacitor 164, and a semiconductor element 166.

The partition plate 140 is formed by forming a plurality of through holes 140a (second through holes) in a rectangular plate made of an insulating material or a metal material, like the partition plate 130. The main circuit board 162 is mounted on the partition plate 140 so as to cover the through hole 140a. Similarly to the main circuit board 122, the main circuit board 162 is obtained by applying a wiring pattern to a plate of an insulating material. The capacitor 164 (second capacitor) and the semiconductor element 166 (second semiconductor element) are These wiring patterns are appropriately connected.

The capacitor 164 is disposed such that these electric terminals 164a face downward, and the main body portion of the capacitor 164 penetrates the partition plate 140 through the through hole 140a and protrudes into the section SP2. Further, the semiconductor element 166 has an electrical terminal 166a protruding in the lateral direction. The

electrical terminals

164a and 166a are connected to the wiring pattern by soldering or the like on the lower surface side of the main circuit board 162.

Further, a heat sink 168 (second heat sink) configured similarly to the heat sink 128 is mounted on the upper surface of the semiconductor element 166. The semiconductor element 166 and the heat sink 168 are inserted through the through hole 140a. The abutting surface between the semiconductor element 166 and the heat sink 168 is preferably in the vicinity of the vertical center position of the through hole 140a. As a result, the plurality of fins (not shown) serving as the heat radiating portion of the heat sink 168 protrudes into the partition SP2 through the through hole 140a.

In the section SP3, a control circuit 170 is disposed below the power conversion circuit 160. The control circuit 170 has a control board 172 and various components (not shown) mounted thereon. The control circuit 170 controls the on / off states of the

semiconductor elements

126 and 166. Although not shown in FIG. 1, the housing 100 has electrical terminals that input and output power to the

power conversion circuits

120 and 160.

As described above, the main body portions of the

capacitors

124 and 164 and the heat dissipation portions of the

heat sinks

128 and 168 protrude into the section SP2. Both ends (front and rear ends in FIG. 1) of the partition SP2 are opened, and the

partition plates

130 and 140 are the upper and lower surfaces. In addition, a pair of side wall plates 134 (in FIG. 1, only one of them is shown because it is a cross-sectional view) serves as the left and right surfaces. Thereby, the section SP2 is formed in a substantially duct shape as a whole. A blower 132 is disposed in front of the section SP2. The cooling air W by the blower 132 flows in from the front of the section SP2 and flows out backward.

In addition, the

partition plates

130 and 140 are separated by a distance that can secure a sufficient space between the

capacitors

124 and 164 and between the

heat sinks

128 and 168. Thereby, the cooling air W cools the main body portions of the

capacitors

124 and 164, cools the

semiconductor elements

126 and 166 through the

heat sinks

128 and 168, and then is discharged backward. At this time, since the

partition plates

130 and 140 are also exposed to the cooling air W, the heat of the main circuit boards 122 and 162 is exhausted after being transmitted to the

partition plates

130 and 140.

Here, the section SP1 and the section SP3 are in an airtight state. Therefore, the

capacitors

124 and 164 and the

electrical terminals

124a, 164a, 126a, and 166a of the

semiconductor elements

126 and 166 are not directly exposed to the cooling air W. Although the cooling air W purifies the atmosphere containing dust and the like with an air filter or the like, it still contains a certain amount of dust. Therefore, dust tends to accumulate in the path of the cooling air W due to long-term use of the power conversion device S1. However, since the

electrical terminals

124a, 164a, 126a, 166a are not exposed in the path of the cooling air W, it is possible to suppress the accumulation of dust between these terminals.

If dust accumulates between the electrical terminals such as the

electrical terminals

124a, 164a, 126a, 166a, etc., the dust becomes a short circuit path and an unexpected short circuit may occur between the electrical terminals. Since such a short circuit leads to a sudden stop or failure of the apparatus, a certain distance is provided between the electrical terminals. The distance is determined by a period in which a short circuit due to dust is desired to be prevented, a dust level, and the like. In general, there is a desire to use the apparatus for a long period of time and in an environment with a high dust level. If this requirement is met, the distance between the electrical terminals becomes longer, which tends to increase the size of the apparatus. On the other hand, according to the present embodiment, since the cooling air W is not directly exposed to the electric terminals, it is not necessary to increase the distance between the electric terminals even when the dust level of the outside air is high. The device S1 can be reduced in size.

The configuration of the main circuit boards 122 and 162 is determined based on the adopted power conversion method or the like, but the potential (for example, ground potential) of the main circuit boards 122 and 162 may be greatly different depending on the power conversion method or the like. In that case, there is a case where a certain distance should be provided between the main circuit boards 122 and 162 in accordance with the potential difference between them. In the present embodiment, as shown in FIG. 1, the main circuit boards 122 and 162 are originally separated by a certain distance (the width in the vertical direction of the side wall plate 134), thereby ensuring a sufficient insulation distance. There are many cases. Therefore, it is not necessary to secure an extra space for securing the insulation distance, and the power conversion device S1 can be configured to be small and light.

FIG. 2A is a cross-sectional view of the power conversion device S1 in the vicinity of the ends of the sections SP1 and SP2. FIG. 2B is an enlarged view of the A1 portion.
In FIG. 2B, the partition plate 130 and the side wall plate 134 are in direct contact with each other. On the other hand, a sealing material 210 (first sealing material) is inserted between the upper lid 110 and the partition plate 130. Here, as the sealing material 210, a sheet of resin or the like, an adhesive, or the like can be applied. As described above, by applying the sealing material 210, it is possible to close a minute gap due to a manufacturing error of the upper lid 110 and the partition plate 130, to improve the airtightness of the section SP1, and to prevent entry of dust and the like. it can. Note that a sealing material 210 (second sealing material) is similarly inserted between the partition plate 140 and the lower lid 150 shown in FIG. 1 (not shown). Thereby, the airtightness of division SP3 can be improved similarly.

[Second Embodiment]
Next, the power conversion device S2 according to the second embodiment of the present invention will be described. In the following description, parts corresponding to those in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof may be omitted.
The configuration of the power conversion device S2 of the present embodiment is substantially the same as that of the power conversion device S1 (see FIG. 1) of the first embodiment, but the configuration of the parts shown in FIGS. 3A and 3B is different.
Here, FIG. 3A is a cross-sectional view of the power conversion device in the vicinity of the ends of the sections SP1 and SP2 in the power conversion device S2 of the present embodiment. FIG. 3B is an enlarged view of the B1 portion.

In FIG. 3A, the upper lid 110 and the partition plate 130 are in direct contact with each other.
On the other hand, in FIG. 3B, a sealing material 220 (third sealing material) is inserted between the partition plate 130 and the side wall plate 134. As the sealing material 220, a sheet of resin or the like, an adhesive, or the like can be applied as in the sealing material 210 (see FIG. 2B) of the first embodiment. As described above, by applying the sealing material 220, it is possible to close a minute gap due to a manufacturing error of the partition plate 130 and the side wall plate 134, and to improve the airtightness in the lateral direction of the section SP2.

Also, a sealing material 220 (fourth sealing material) is similarly inserted between the partition plate 140 and the side wall plate 134 shown in FIG. 1 (not shown). Thereby, leakage of the cooling air W from the lateral direction can be prevented, and the diffusion of dust throughout the entire apparatus can be more reliably suppressed. In the present embodiment, a sealing material 210 may be inserted between the upper lid 110 and the partition plate 130 as in the first embodiment (see FIG. 2B). That is, both the sealing

materials

210 and 220 may be applied.

[Third Embodiment]
Next, the power converter device by 3rd Embodiment of this invention is demonstrated. In the following description, parts corresponding to those in FIGS. 1 to 3B are denoted by the same reference numerals and description thereof may be omitted.
FIG. 4 is a longitudinal sectional view of the power converter S3 according to the present embodiment.
The power conversion device S3 has a substantially rectangular parallelepiped frame-shaped housing 100B. The housing 100B has sections SP1, SP2, and SP3 partitioned along the vertical direction, like the housing 100 (see FIG. 1) of the first embodiment.

In the present embodiment, control circuits 180 (first control circuits) and 190 are provided instead of the control circuit 170 in the first embodiment. Here, the control circuit 180 controls the on / off state of the semiconductor element 126 in the power conversion circuit 120. In addition, the control circuit 190 controls the on / off state of the semiconductor element 166 in the power conversion circuit 160. The control circuit 180 includes a control board 182 (first control board) provided in the section SP1 and a heat sink 184 (third heat sink) attached to a heat generating component (not shown) mounted on the control board 182. And have. The heat sink 184 protrudes into the partition SP2 through the through hole 130a of the partition plate 130.

Similarly, the control circuit 190 (second control circuit) is mounted on a control board 192 (second control board) provided in the section SP3 and a heat generating component (not shown) mounted on the control board 192. Heat sink 194 (fourth heat sink). The heat sink 194 protrudes into the partition SP2 through the through hole 140a of the partition plate 140.
According to the present embodiment, since the control circuits 180 and 190 can be cooled by the cooling air W, the reliability of these control circuits can be improved particularly when the amount of heat generated by the control circuits 180 and 190 is large.

[Fourth Embodiment]
Next, the power converter device by 4th Embodiment of this invention is demonstrated. In the following description, parts corresponding to those in FIGS. 1 to 4 are denoted by the same reference numerals, and the description thereof may be omitted.
FIG. 5 is a perspective view of the power converter S4 according to the present embodiment. The power conversion device S4 includes a housing 100. Inside the housing 100, each component of the power conversion device S1 (first embodiment) shown in FIG. 1, such as the

power conversion circuits

120 and 160, is provided.

Further, a power conversion circuit 410 having a substantially rectangular parallelepiped casing 412 is attached to the right end of the front end portion of the casing 100. A power conversion circuit 430 having a substantially rectangular parallelepiped casing 432 is attached to the left end of the front end portion of the casing 100.

Electrical terminals

414 and 434 protrude from the front surfaces of the housings 412 and 432 toward the front, respectively. Furthermore,

heat sinks

416 and 436 protrude from the left side surface of the housing 412 and the right side surface of the housing 432 so as to face each other.

Also, a transformer circuit 450 having a substantially rectangular parallelepiped casing 452 is attached to the rear end of the casing 100. The housing 452 is open along the front-rear direction (not shown). As a result, the cooling air W flowing in from the front of the housings 412 and 432 is discharged rearward through the housing 100 and the housing 452. The above-described casings 100, 412, 432, and 452 are collectively referred to as a casing 400. The housings 412 and 432 are configured to keep the inside thereof in an airtight state. Accordingly, dust is less likely to accumulate around electrical terminals (not shown) inside the casings 412 and 432.

FIG. 6 is a circuit diagram of the power conversion device S4 according to the present embodiment.
In FIG. 6, the power conversion circuit 410 includes four semiconductor elements 422 that are bridge-connected. In the example shown in the drawing, the semiconductor element 422 is an IGBT (Insulated Gate Bipolar Transistor) and a free-wheeling diode connected to each of them in parallel. The power conversion circuit 410 operates as a synchronous rectification circuit, and converts an AC voltage (for example, commercial frequency) applied to the electrical terminal 414 into a DC voltage. Note that the heat sink 416 shown in FIG. 5 is attached to these semiconductor elements 422.

As shown in FIG. 1, the power conversion circuit 120 includes a plurality of capacitors 124 and a plurality of semiconductor elements 126. However, the plurality of capacitors 124 are illustrated as one capacitor 124G in FIG. The DC voltage output from the power conversion circuit 410 is smoothed by the capacitor 124G. In the present embodiment, the semiconductor element 126 is a MOSFET (Metal-Oxide-SemiconductoremiField-Effect Transistor) and a free-wheeling diode connected in parallel to each of them, and four semiconductor devices 126 are bridge-connected. .

In the present embodiment, the power conversion circuit 120 operates as an inverter, and converts the DC voltage output from the capacitor 124G into a high-frequency voltage of about several tens of kHz. The transformer circuit 450 includes a high-frequency transformer 462, a reactor 468, and a capacitor 464, and supplies power from the power conversion circuit 120 to the power conversion circuit 160 while insulating the power conversion circuit 120 and the power conversion circuit 160.

As shown in FIG. 1, the power conversion circuit 160 includes a plurality of capacitors 164 and a plurality of semiconductor elements 166. However, the plurality of capacitors 164 are illustrated as one capacitor 164G in FIG. In the present embodiment, the semiconductor element 126 is a diode, and four semiconductor elements 126 are bridge-connected to form a full-wave rectifier circuit. The high-frequency voltage output from the transformer circuit 450 is converted into a DC voltage by the semiconductor element 166, and the DC voltage is smoothed by the capacitor 164G.

The power conversion circuit 430 includes four semiconductor elements 442 that are bridge-connected. In the illustrated example, the semiconductor element 442 is an IGBT and a free-wheeling diode connected to each of them in parallel. Note that the heat sink 436 shown in FIG. 5 is attached to these semiconductor elements 442.

The power conversion circuit 430 operates as an inverter, converts the DC voltage supplied from the power conversion circuit 160 into an AC voltage (for example, commercial frequency), and outputs the AC voltage via the electrical terminal 434. The control circuit 170 controls the on / off states of the

semiconductor elements

126, 422, 442 included in the

power conversion circuits

120, 410, 430. According to the present embodiment, the AC voltage applied to the electrical terminal 414 can be converted into another AC voltage having a desired voltage and frequency and output via the electrical terminal 434.

[Fifth Embodiment]
Next, a power conversion system according to a fifth embodiment of the present invention will be described. In the following description, parts corresponding to those in FIGS. 1 to 6 are denoted by the same reference numerals, and the description thereof may be omitted.
FIG. 7 is a schematic diagram of the power conversion system S5 according to the present embodiment. The power conversion system S5 includes a housing 500, and four power conversion devices S4 are arranged in the vertical direction inside the housing 500. The configuration of each power conversion device S4 is the same as that of the fourth embodiment.

The electric terminals 414 (see FIG. 6) in the four power converters S4 are sequentially connected in series, and the electric terminals 434 are also sequentially connected in series. In this way, when a plurality of power conversion devices S4 are connected in series, a higher level AC voltage can be input / output compared to a single power conversion device S4.

In FIG. 7, a duct-shaped exhaust passage 510 is formed behind each power conversion device S <b> 4, and a blower 132 is attached to the upper end portion of the exhaust passage 510. Here, when the blower 132 is operated, the cooling air W is sucked from the front surface of each power converter S4. And after cooling each power converter device S4, the cooling air W is discharged | emitted outside via the exhaust path 510 and the air blower 132. FIG.
Thus, according to this embodiment, it becomes possible to input / output a higher level AC voltage than in the fourth embodiment, and the number of blowers 132 can be made smaller than the number of power conversion devices S4.

[Modification]
The present invention is not limited to the above-described embodiments, and various modifications can be made. The above-described embodiments are illustrated for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. In addition, a part of the configuration of a certain embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of a certain embodiment. Further, it is possible to delete a part of the configuration of each embodiment, or to add or replace another configuration. In addition, the control lines and information lines shown in the figure are those that are considered necessary for the explanation, and not all the control lines and information lines that are necessary on the product are shown. Actually, it may be considered that almost all the components are connected to each other. Examples of possible modifications to the above embodiment are as follows.

(1) In the first embodiment, a plurality of through

holes

130 a and 140 a are formed for the

partition plates

130 and 140. However, the number of through

holes

130a and 140a may be one each. That is, a plurality of semiconductor elements and capacitors may be inserted through one through hole.

(2) In the fourth embodiment (see FIG. 6), a diode is applied as the semiconductor element 166 of the power conversion circuit 160. However, switching elements such as MOSFETs and IGBTs may be applied in place of the diodes. By applying a switching element to the power conversion circuit 160, bidirectional power transmission between the

electrical terminals

414 and 434 becomes possible.

100, 100B Housing 110 Upper lid (first lid member)
122 Main circuit board (first main circuit board)
124,124G capacitor (first capacitor)
124a, 164a, 126a, 166a Electrical terminal 126 Semiconductor element (first semiconductor element)
128 heat sink (first heat sink)
130 Partition plate (first partition plate)
130a Through hole (first through hole)
134 Side wall plate 140 Partition plate (second partition plate)
140a Through hole (second through hole)
150 Lower lid (second lid member)
162 Main circuit board (second main circuit board)
164,164G capacitor (second capacitor)
166 Semiconductor element (second semiconductor element)
168 heat sink (second heat sink)
180 control circuit (first control circuit)
182 Control board (first control board)
184 heat sink (third heat sink)
190 Control circuit (second control circuit)
192 Control board (second control board)
194 Heat sink (fourth heat sink)
210 Sealing material (first sealing material, second sealing material)
220 Sealing material (third sealing material, fourth sealing material)
S1 to S4 power converters SP1, SP2, SP3 partitions (first partition, second partition, third partition)

Claims

A first semiconductor element;
A first heat sink mounted on the first semiconductor element;
A first capacitor;
A first main circuit board on which the first semiconductor element and the first capacitor are mounted;
A second semiconductor element;
A second heat sink mounted on the second semiconductor element;
A second capacitor;
A second main circuit board on which the second semiconductor element and the second capacitor are mounted;
A first section in which the first main circuit board is accommodated, a second section having a ventilation path through which cooling air flows, and a third section in which the second main circuit board is accommodated. A housing to be formed;
With
An electrical terminal of the first capacitor and an electrical terminal of the first semiconductor element are housed in the first compartment;
At least a portion of the first capacitor and at least a portion of the first heat sink are exposed to the second compartment;
An electrical terminal of the second capacitor and an electrical terminal of the second semiconductor element are housed in the third compartment;
At least a part of the second capacitor and at least a part of the second heat sink are exposed to the second section.
The housing is
It has an insulating material or a metal material, and has a first through hole that is inserted through at least a part of the first capacitor and at least a part of the first heat sink to be exposed to the second section. , A first partition plate that divides the first section and the second section;
It has an insulating material or a metal material, and has a second through-hole that passes through at least a part of the second capacitor and at least a part of the second heat sink and is exposed to the second section. , A second partition plate that divides the second section and the third section;
Side wall plates constituting the ventilation path together with the first partition plate and the second partition plate;
Further comprising
The direction in which the first capacitor and the first heat sink pass through the first through hole is opposite to the direction in which the second capacitor and the second heat sink pass through the second through hole. The power converter according to claim 1, wherein the power converter is provided.
The said housing | casing further has a 1st cover member which covers the said 1st division so that the flow of the air in the said 1st division and external air may be suppressed. The Claim 2 characterized by the above-mentioned. Power conversion device.
The said housing | casing further has a 2nd cover member which covers the said 3rd division so that the flow of the air in the said 3rd division and external air may be suppressed. Power conversion device.
The power converter according to claim 4, further comprising: a first sealing material sandwiched between the first lid member and the first partition plate.
The power converter according to claim 5, further comprising: a second seal member sandwiched between the second lid member and the second partition plate.
The power conversion device according to claim 6, further comprising a third sealing material sandwiched between the first partition plate and the side wall plate.
The power converter according to claim 7, further comprising: a fourth sealing material sandwiched between the second partition plate and the side wall plate.
A first control board provided in the first section and having a first control circuit for controlling the first semiconductor element;
A third heat sink mounted on the first control board;
A second control board provided in the third section and having a second control circuit for controlling the second semiconductor element;
A fourth heat sink mounted on the second control board;
Further comprising
The first through hole formed in the first partition plate is inserted through at least a part of the third heat sink and exposed to the second partition,
The said 2nd through-hole formed in the said 2nd partition plate inserts at least one part of a said 4th heat sink, and is exposed to the said 2nd division. The Claim 4 characterized by the above-mentioned. The power converter described.