JP5730700B2 - Power conditioner device and photovoltaic power generation system - Google Patents

Description

  The present invention relates to a power conditioner device and a photovoltaic power generation system.

  In addition to the solar battery, the solar power generation system uses a power conditioner device that converts DC power generated by the solar battery into AC power (DC / AC conversion). This power conditioner device is assumed to be installed outdoors, but in that case, dust contained in the cooling air sucked into the device to cool the equipment in the device adheres to the substrate, short circuit etc. May cause failure.

  Conventionally, various forms of cooling air flow paths have been disclosed. For example, Patent Document 1 discloses a cooling flow path forming means for controlling the temperature of the electronic unit 4. This flow path forming means includes partition plates 51 and 61 provided in the electronic unit 4 and partition receiving plates 52 and 62 provided in the case 3 and in contact with the partition plates 51 and 61 to form a seal region. It is configured as a thing. In this way, by providing the seal region, it is possible to prevent the cooling air from flowing out of the flow path and the like, and suppress the decrease in the temperature control performance.

JP 2009-200230 A

  However, even when the cooling flow path means described in Patent Document 1 is provided, it is inevitable that dust contained in the cooling air adheres to the substrate, and the problem that causes the failure of the apparatus is not solved. In particular, there is a problem that the risk of short-circuiting between terminals increases due to dust adhering to a surface (hereinafter referred to as “solder surface”) to which a terminal of an electronic component inserted and mounted on a board is soldered. is there.

  Therefore, an object of the present invention is to provide a power conditioner device having a structure in which cooling air does not hit a predetermined region such as a solder surface.

A power conditioner device according to one aspect of the present invention is provided.
A board having a mounting surface on which electronic components are mounted, a solder surface on which terminals of the electronic components are soldered, and an intake plate and an exhaust plate arranged to face each other so as to sandwich both ends of the substrate. The air intake plate has an air inlet provided at a position that allows cooling air to pass over the mounting surface of the substrate and does not pass cooling air to the solder surface of the substrate. It has the exhaust port which exhausts the cooling air which passed on the said mounting surface.

In the power conditioner device,
Further comprising a substrate different from the substrate,
The other substrate may be provided such that both ends thereof are sandwiched between the intake plate and the exhaust plate, and the solder surface thereof faces the solder surface of the substrate.

In the power conditioner device,
The air intake plate has an air inlet provided at a position that allows cooling air to pass over the mounting surface of the another substrate and does not pass cooling air to the solder surface of the other substrate,
The exhaust plate may have an exhaust port for exhausting cooling air that has passed over the mounting surface of the another substrate.

In the power conditioner device,
You may further provide the fan provided in the vicinity of the said exhaust port, and sucking and exhausting the cooling air which passed on the said mounting surface of the said board | substrate.

In the power conditioner device,
The fan may suck and exhaust cooling air that has passed over the mounting surface of the another substrate.

In the power conditioner device,
The intake plate and the exhaust plate may be arranged in parallel.

A power conditioner device according to one aspect of the present invention is provided.
A substrate having a mounting surface on which an electronic component is mounted, a solder surface to which terminals of the electronic component are soldered, and a cooling air flow path provided as a cooling air flow path provided along the mounting surface of the substrate And an intake plate and an exhaust plate arranged to face each other so as to sandwich both end portions of the substrate,
The cooling air flow path section has a plurality of heat sinks including a base and heat radiating fins extending from the base, and is configured as a combination of the heat radiating fins of the plurality of heat sinks facing each other. And an exhaust port provided at a position opposed to the opening at one end of the cooling air flow channel portion, and the exhaust plate has an exhaust port provided at a position opposed to the opening at the other end of the cooling air flow channel portion. It is characterized by having.

In the power conditioner device,
You may further provide the electronic component mounted in the said mounting surface of the said board | substrate, and joined to the outer wall of the said cooling wind flow path part.

In the power conditioner device,
A heat radiating sheet may be interposed between the electronic component joined to the cooling air flow path section and the cooling air flow path section.

In the power conditioner device,
The heat radiating sheet may be made of an insulating material, and may insulate the lead part of the electronic component joined to the outer wall of the cooling air flow path part and the cooling air flow path part.

In the power conditioner device,
Further comprising a substrate different from the substrate,
The other substrate may be provided such that both ends thereof are sandwiched between the intake plate and the exhaust plate, and the solder surface thereof faces the solder surface of the substrate.

In the power conditioner device,
A fan that is provided near the exhaust port and sucks and exhausts the cooling air that has passed through the mounting surface of the substrate and inside the cooling air flow path portion may be further provided.

In the power conditioner device,
The air intake plate further has an air intake port provided at a position where the cooling air is passed over the mounting surface of the substrate and the cooling air is not passed through the solder surface of the substrate,
The exhaust plate may have an exhaust port for exhausting cooling air that has passed over the mounting surface of the substrate.

A photovoltaic power generation system according to one embodiment of the present invention is provided.
A solar cell for supplying DC power to a power conditioner device according to the present invention;
A transformer device that transforms AC power supplied from the power conditioner device;
It is characterized by providing.

  The power conditioner device according to the first aspect of the present invention sandwiches a substrate having a mounting surface on which an electronic component is mounted and a solder surface to which terminals of the electronic component are soldered, and both ends of the substrate. An intake plate and an exhaust plate disposed to face each other. The intake plate passes cooling air over the mounting surface of the substrate, but has a suction port provided at a position where the cooling air does not pass through the solder surface of the substrate, and the exhaust plate is mounted on the mounting surface of the substrate. It has an exhaust port for exhausting the cooling air that has passed through it. With such a configuration, the cooling air flowing from the intake port flows out from the exhaust port through the mounting surface of the substrate and does not hit the solder surface. For this reason, it can prevent that the dust contained in the air suck | inhaled in a power conditioner apparatus adheres to the solder surface of a board | substrate. As a result, it is possible to prevent performance degradation and failure of the power conditioner device.

  A power conditioner device according to a second aspect of the present invention includes a substrate similar to the first aspect, and an intake plate and an exhaust plate disposed to face each other so as to sandwich both end portions of the substrate. And a cooling air flow path portion serving as a cooling air flow path provided along the mounting surface of the substrate. The intake plate has an intake port provided to face the opening at one end of the cooling air flow passage portion, and the exhaust plate has an exhaust port provided to face the opening at the other end of the cooling air flow passage portion. As a result, the cooling air flowing in from the intake port of the intake plate flows into the opening of the cooling air flow channel portion, passes through the flow channel inside the cooling air flow channel portion, and then flows out from the exhaust port of the exhaust plate. The cooling air flow path section includes a plurality of heat sinks each having a base and heat radiating fins extending from the base, and the heat radiating fins of the plurality of heat sinks are combined to face each other. The cooling air passing through the cooling air flow path part absorbs heat from the heat radiation fins, so that the cooling air flow path part absorbs heat from the outer wall and the cooling action for suppressing the heat generation of the electronic component mounted on the substrate is increased.

  As described above, according to the second aspect of the present invention, the electronic components on the substrate can be efficiently cooled, and the cooling air is not applied to the mounting surface as well as the solder surface of the substrate. Parts can be cooled. For this reason, the dust contained in the cooling air is prevented from adhering to the solder surface and the mounting surface of the substrate, and performance deterioration and failure of the power conditioner device can be prevented.

It is a perspective view of the D / D part of the power conditioner device concerning the embodiment of the present invention. It is a perspective view of the D / D part of the power conditioner device concerning the embodiment of the present invention in the state where the air intake plate was removed. It is a side view of the housing | casing of a power conditioner apparatus, and the D / D part and fan which were installed in this housing | casing. (A) is a top view of the board | substrate with which the electronic component and the cooling air flow path part were mounted, (b) is a right view of the said board | substrate, (c) is a lower side view of the said board | substrate. It is a schematic block diagram of a solar power generation system.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated.

(Solar power system)
First, the configuration of a photovoltaic power generation system including a power conditioner device will be described with reference to FIG. As shown in FIG. 5, the photovoltaic power generation system 500 includes a power conditioner device 100 and a solar cell 200 that supplies direct-current power (for example, DC 200 to 500 V) to the power conditioner device 100. The power conditioner apparatus 100 converts the DC voltage supplied from the solar cell 200 into a three-phase AC (for example, 200 V) and outputs the converted voltage. This AC power is transformed to a high voltage (for example, 6600 V) by a transformer 300 connected to the output terminal of the power conditioner device 100 and supplied to the commercial power distribution network.

(Power conditioner device)
Next, a power conditioner device according to an embodiment of the present invention will be described.

  FIG. 1 shows a perspective view of a D / D section 1 of a power conditioner device 100 according to the present embodiment. FIG. 2 shows a perspective view of the D / D portion 1 with the intake plate 40 removed. FIG. 3 shows a side view of the D / D unit 1 and the fan 70 installed in the casing 2 of the power conditioner device 100. 1 to 3, a heat dissipation sheet 17, a power MOSFET 18 and a diode 19 which will be described later are not shown.

  The D / D unit 1 has a function of converting an input DC voltage into an AC voltage using a DC-AC converter, and transforming the converted AC voltage into a predetermined AC voltage. As shown in FIG. 1, the D / D unit 1 includes a substrate 10 including a DC-AC converter, a substrate 20 including a transformer for transforming an AC voltage into a predetermined voltage, and an opening serving as an intake port. And an exhaust plate 50 provided with an opening serving as an exhaust port, and a cooling air passage section 60 serving as a cooling air passage.

  The board 10 and the board 20 are sandwiched between the suction plate 40 and the exhaust plate 50 at both end portions (upper and lower two end portions 10e and 20e), and are arranged back to back so that their solder surfaces face each other. .

  That is, the board | substrate 10 and the board | substrate 20 are provided in parallel with the predetermined space | interval through the spacer (not shown). As shown in FIG. 3, an insulating plate 30 that is an insulating sheet is inserted between the substrate 10 and the substrate 20.

  As shown in FIG. 2, an electronic component 21 such as a capacitor and a transformer 22 for transforming an alternating voltage are mounted on the mounting surface of the substrate 20.

  As shown in FIG. 1, the intake plate 40 and the exhaust plate 50 are arranged in parallel to face each other so as to sandwich both end portions (two end portions 10 e) of the substrate 10.

  The intake plate 40 has intake ports 41 and 42 as shown in FIG. The intake port 41 is provided at a position facing an opening at one end of the cooling air flow channel portion 60 in order to allow cooling air from the outside to flow into the cooling air flow channel portion 60. The air inlet 42 is provided at a position where the cooling air passes through the mounting surface of the substrate 10 and does not pass through the solder surface of the substrate 10. That is, the air inlet 42 is provided on the mounting surface side (lower left side in FIG. 1) of the substrate 10 in a state where the air intake plate 40 is fixed to the substrate 10.

  As shown in FIG. 2, the exhaust plate 50 has exhaust ports 51 and 52. The exhaust port 51 is provided at a position facing the opening at the other end of the cooling air flow channel portion 60 in order to discharge the air that has passed through the cooling air flow channel portion 60 to the outside. The exhaust port 52 exhausts the cooling air passing over the mounting surface of the substrate 10 to the outside.

  By configuring the intake ports 41 and 42 and the exhaust ports 51 and 52 as described above, the cooling air does not hit the solder surface of the substrate 10, and thus dust or the like contained in the cooling air adheres to the solder surface of the substrate 10. It is prevented. In addition, the intake port 41 is provided so that the cooling air hits the radiating fins 61b and 62b, which will be described later, so that heat can be efficiently released from the radiating fins.

  As shown in FIGS. 1 and 2, the intake plate 40 has an intake port 43 provided at a position that allows cooling air to pass over the mounting surface of the substrate 20 and does not allow cooling air to pass through the solder surface of the substrate 20. May be. As shown in FIG. 1, the intake port is provided on the mounting surface side (upper right side in FIG. 1) of the substrate 20 in a state where the intake plate 40 is fixed to the substrate 20. The exhaust plate 50 may have an exhaust port 53 that exhausts the cooling air that has passed over the mounting surface of the substrate 20 to the outside. Thus, the electronic component 21 and the transformer 22 on the mounting surface of the substrate 20 can be cooled without applying cooling air to the solder surface of the substrate 20.

  As can be understood from the above description, the intake ports 41, 42 and 43 of the intake plate 40 are connected to the upper end 10 e of the substrate 10 and the substrate 20 in a state where the intake plate 40 is fixed to the substrates 10 and 20. It is not provided in a region sandwiched between the upper end portion 20e of each of the two. Therefore, no airflow is generated in the region sandwiched between the substrate 10 and the substrate 20. As can be seen from FIGS. 1 and 2, the exhaust ports 51, 52 and 53 are preferably provided at positions facing the intake ports 41, 42 and 43, respectively.

  Here, the cooling air flowing through the power conditioner device 100 will be described with reference to FIG. As shown in FIG. 3, cooling air for cooling the D / D portion 1 enters the housing 2 through the air inlet 3 provided in the housing 2, passes through the air inlet of the air intake plate 40, After the electronic components and the like are cooled by flowing on the mounting surface 20 and in the cooling air flow path portion 60, the air is exhausted from the D / D portion 1 through the exhaust port of the exhaust plate 50.

  As shown in FIG. 3, a fan 70 is provided below the D / D unit 1 for sucking and exhausting cooling air discharged from the D / D unit 1. Thereby, the D / D part 1 can be cooled more effectively. As described above, the fan 70 is provided in the vicinity of the exhaust port 51, and sucks and exhausts the cooling air that has passed through the mounting surface of the substrate 10 and the inside of the cooling air flow path section 60. The fan 70 may be configured to suck and exhaust not only the substrate 10 but also the cooling air that has passed over the mounting surface of the substrate 20.

  Next, the mounting state of the board | substrate 10 is demonstrated in detail using Fig.4 (a)-(c). 4A is a top view of the substrate 10, FIG. 4B is a right side view of the substrate 10, and FIG. 4C is a bottom side view of the substrate 10. In FIG. 4A, the heat dissipation sheet 17 is not shown.

  Mounted on the mounting surface 10A of the substrate 10 are an electronic component 11 such as an insertion mounting type capacitor, a drive substrate 12 mounted perpendicularly to the substrate 10, a cooling air flow path section 60, a power MOSFET 18, and a diode 19. Yes. On the other hand, the terminals of the electronic component 11, the power MOSFET 18, and the diode 19 are soldered on the solder surface 10B of the substrate 10.

  As shown in FIG. 4A, the two cooling air flow path portions 60 are provided in the direction from the upper end portion 10e to the lower end portion 10e along the mounting surface 10A. The cooling air flow passage section 60 is configured as a cooling air duct by combining a heat sink 61 and a heat sink 62, and is provided with a cooling air flow passage that is sucked from the intake port 41 and exhausted from the exhaust port 51. Become.

  The heat sink 61 (62) constituting the cooling air flow path section 60 includes a base portion 61a (62a) and a plurality of radiating fins 61b (62b) extending from the base portion 61a (62a). These heat sinks 61 and 62 are fixed to the substrate 10 with screws 14 via a cylindrical insulating support (insulating bush) 13 as shown in FIG. The screw 14 is inserted from the solder surface 10B side of the substrate 10 and is screwed into a screw hole formed in the heat sink 61 (62) through a hole of the insulating support 13 made of an insulating material.

  As shown in FIGS. 4A and 4C, the cooling air flow path section 60 is configured as a combination of the heat sinks 61b and 62b of the two heat sinks 61 and 62 so as to face each other. As a result, a plurality of wind tunnels S surrounded by the base portions 61 a and 62 a and the heat radiation fins 61 b and 62 b are formed inside the cooling air flow passage portion 60. By flowing cooling air through the wind tunnel S, the cooling air can be efficiently applied to the heat radiation fins 61b and 62b.

  4 (a) and 4 (c), there is a gap between the heat radiation fins 61b and 62b. Preferably, the heat radiation fins 61b and 62b are brought into contact with each other or a tape so that no gap is formed. It is preferable to close the gap with an adhesive or the like. Further, the cooling air flow path section 60 is not limited to two, and may be configured by combining three or more heat sinks.

  Here, cooling of the members (electronic component 11, drive substrate 12, power MOSFET 18, diode 19 and the like) mounted on the mounting surface of the substrate 10 by the cooling air flow path section 60 will be described. The cooling air that has entered the inside of the cooling air flow channel portion 60 from one end of the cooling air flow channel portion 60 through the air inlet 41 flows through the wind tunnel S and absorbs the heat of the radiating fins 61b and 62b, and then the cooling air flow channel portion 60. The other end of the gas is exhausted to the outside through the exhaust port 51. Thereby, the periphery of the cooling air flow path section 60 is cooled, and the members on the mounting surface 10A of the substrate 10 are cooled. As described above, the cooling air flow path section 60 can cool the member without directly applying the cooling air to the member to be cooled.

  Further, an electronic component may be joined to the outer wall of the cooling air flow path section 60 to increase the heat removal efficiency. As shown in FIGS. 4A to 4C, electronic components such as the power MOSFET 18 and the diode 19 are joined to the side walls of the cooling air flow path portion 60 (base portions 61 a and 62 a of the heat sinks 61 and 62). The power MOSFET 18 and the diode 19 are fixed to the cooling air flow path section 60 with screws 15. Thus, by providing the electronic component mounted on the mounting surface 10 </ b> A of the substrate 10 and joined to the outer wall of the cooling air flow path section 60, the electronic component can be effectively cooled.

  4B and 4C, the heat radiation sheet 17 is interposed between the power MOSFET 18 joined to the cooling air flow path portion 60 and the cooling air flow path portion 60. preferable. Thereby, the heat of the electronic component joined to the outer wall of the cooling air flow path section 60 can be further effectively removed.

  The heat dissipation sheet 17 is made of an insulating and heat conductive material such as silicone, for example, and insulates the cooling air flow path portion 60 from the lead portion of the power MOSFET 18 joined to the outer wall of the cooling air flow path portion 60. It is preferable that As a result, it is possible to prevent a short circuit between the lead portion of the power MOSFET 18 and the conductive heat sink 61 (62).

  In the above-described embodiment, both the intake port 41 and the intake port 42 are provided. However, if the cooling air flow path section 60 is sufficient for cooling, the intake port 42 may not be provided. In addition, an embodiment in which the cooling air flow path section 60 is not provided, and the air inlet 42 is provided and the air inlet 41 is not provided can be assumed.

  Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. . You may combine suitably the component covering different embodiment. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

DESCRIPTION OF SYMBOLS 1 D / D part 2 Housing | casing 3 Intake port 10 Board | substrate 10A Mounting surface 10B Solder surface 10e End part 11 Electronic component 12 Drive board 13 Insulation support body 14,15 Screw 17 Heat dissipation sheet 18 Power MOSFET
19 Diode 20 Substrate 20e End 21 Electronic component 22 Transformer 30 Insulating plate 40 Intake plate 41, 42, 43 Intake port 50 Exhaust plate 51, 52, 53 Exhaust port 60 Cooling air flow channel 61, 62 Heat sink 61a, 62a Base 61b, 62b Radiating fin 70 Fan 100 Power conditioner device 200 Solar cell 300 Transformer device 500 Solar power generation system S Wind tunnel

Claims (9)

A first substrate having a mounting surface on which an electronic component is mounted and a solder surface to which terminals of the electronic component are soldered;
A second substrate having a mounting surface on which an electronic component is mounted and a solder surface to which terminals of the electronic component are soldered, and the solder surface facing the solder surface of the first substrate When,
An intake plate and an exhaust plate disposed to face each other so as to sandwich both end portions of the first and second substrates,
The intake plate is
A first intake port where the first substrate mounting surface on through the cooling air, and provided at a position that does not pass through the cooling air to the solder surface of the first substrate,
A second air inlet provided at a position where cooling air is passed over the mounting surface of the second substrate and cooling air is not passed through the solder surface of the second substrate ,
The exhaust plate is
A first exhaust port for exhausting cooling air that has passed over the mounting surface of the first substrate ;
A power conditioner device comprising: a second exhaust port that exhausts cooling air that has passed over the mounting surface of the second substrate . 2. The fan according to claim 1 , further comprising a fan that is provided in the vicinity of the first and second exhaust ports and sucks and exhausts cooling air that has passed over the mounting surfaces of the first and second substrates. Power conditioner equipment. The power conditioner device according to claim 1, wherein the intake plate and the exhaust plate are arranged in parallel. A first substrate having a mounting surface on which an electronic component is mounted and a solder surface to which terminals of the electronic component are soldered;
A cooling air flow path section that is provided along the mounting surface of the first substrate and serves as a cooling air flow path;
A second substrate having a mounting surface on which an electronic component is mounted and a solder surface to which terminals of the electronic component are soldered, and the solder surface facing the solder surface of the first substrate When,
An intake plate and an exhaust plate, which are arranged to face each other so as to sandwich both end portions of the first and second substrates;
With
The cooling air flow path portion is configured as a combination of a plurality of heat sinks including a base portion and heat radiating fins extending from the base portion so that the heat radiating fins of the plurality of heat sinks face each other.
The intake plate is
A first air inlet provided at a position facing an opening at one end of the cooling air flow path section ;
A second air inlet provided at a position where cooling air is passed over the mounting surface of the second substrate and cooling air is not passed through the solder surface of the second substrate ,
The exhaust plate is
A first exhaust port provided at a position facing the opening at the other end of the cooling air flow path section ;
A second exhaust port for exhausting the cooling air that has passed over the mounting surface of the second substrate .
A power conditioner device characterized by that. 5. The power conditioner device according to claim 4 , further comprising an electronic component mounted on a mounting surface of the first substrate and bonded to an outer wall of the cooling air flow path portion. The power conditioner device according to claim 5 , wherein a heat dissipation sheet is interposed between the electronic component joined to the cooling air flow path section and the cooling air flow path section. The heat dissipating sheet is made of an insulating material, and the lead portion of the electronic component joined to the outer wall of the cooling air flow path portion, according to claim 6, characterized in that insulating the said cooling air flow path portion Power conditioner device. And a fan that is provided in the vicinity of the first and second exhaust ports and sucks and exhausts the cooling air that has passed through the mounting surfaces of the first and second substrates and through the cooling air flow path section. The power conditioner device according to any one of claims 4 to 7 . A power conditioner device according to any one of claims 1 to 8 ,
A solar cell for supplying direct current power to the power conditioner device;
A transformer device that transforms AC power supplied from the power conditioner device;
A photovoltaic power generation system comprising:

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