WO2018157579A1 - 一种阵列基板及其制造方法 - Google Patents

一种阵列基板及其制造方法 Download PDF

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Publication number
WO2018157579A1
WO2018157579A1 PCT/CN2017/102042 CN2017102042W WO2018157579A1 WO 2018157579 A1 WO2018157579 A1 WO 2018157579A1 CN 2017102042 W CN2017102042 W CN 2017102042W WO 2018157579 A1 WO2018157579 A1 WO 2018157579A1
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Prior art keywords
hydrophilic
induction
hydrophobic
column
bottom wall
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PCT/CN2017/102042
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English (en)
French (fr)
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赵德江
陈一民
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京东方科技集团股份有限公司
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Priority to US15/775,888 priority Critical patent/US11031578B2/en
Publication of WO2018157579A1 publication Critical patent/WO2018157579A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs

Definitions

  • the present invention relates to the field of display technologies, and more particularly to an array substrate and a method of fabricating the same.
  • the organic light emitting diode (OLED) display technology is a technology that realizes display by using an invertible color generated by an organic functional material driven by a current.
  • OLED organic light emitting diode
  • a common method of manufacturing an organic functional material layer in an OLED display device is to employ an ink jet printing method.
  • the use of inkjet printing methods to fabricate OLED products has the advantages of high production efficiency and low material cost.
  • it is also constrained by the characteristics of printing technology, making it difficult to produce high-definition products.
  • the main factors affecting the production of high-resolution products are the uniformity of the in-pixel thickness.
  • an embodiment of the present invention provides an array substrate and a manufacturing method thereof, which can improve the uniformity of film formation and increase the effective area of the light-emitting region.
  • an embodiment of the present invention provides an array substrate, including: a substrate substrate, a pixel defining layer disposed on the substrate substrate, the pixel defining layer being provided with a bottom wall and a sidewall An open area in which an edge of the bottom wall is provided with a plurality of hydrophilic induction columns whose surfaces are hydrophilic.
  • the positions of the plurality of hydrophilic induction columns satisfy the following relationship:
  • a second position and a third position symmetrical with the first position are provided with a hydrophilic induction column based on the axis of symmetry of the bottom wall.
  • the corner of each of the bottom walls is provided with the Hydrophilic induction column.
  • the hydrophilic induction column has the same height as the open area.
  • the hydrophilicity inducing column is more hydrophilic than the bottom wall.
  • a plurality of hydrophobic induction pillars whose surfaces are hydrophobic are disposed on the upper surface of the pixel defining layer near the sidewall.
  • the positions of the plurality of hydrophobic induction columns satisfy the following relationship:
  • the fifth position and the sixth position symmetrical with the fourth position are provided with a hydrophobic induction column based on the upper surface and the side of the pixel defining layer The axis of symmetry of the area enclosed by the boundary of the wall.
  • the hydrophobic induction column is disposed at a corner of the upper surface of the pixel interface layer near the sidewall.
  • the height of the hydrophobic induction column is greater than the thickness of the pixel defining layer.
  • the hydrophobic induction column has the same height.
  • the embodiment of the invention further provides a method for manufacturing an array substrate, comprising:
  • the edge of the bottom wall is provided with a plurality of hydrophilic induction columns whose surfaces are hydrophilic.
  • the positions of the plurality of hydrophilic induction columns satisfy the following relationship:
  • a second position and a third position symmetrical with the first position are provided with a hydrophilic induction column based on the axis of symmetry of the bottom wall.
  • the hydrophilic induction column is disposed at each corner of the bottom wall in the open area.
  • a plurality of hydrophobic induction pillars whose surfaces are hydrophobic are disposed on the upper surface of the pixel defining layer near the sidewall.
  • a surface is disposed at a corner of the upper surface of the pixel interface layer near the sidewall Hydrophobic induction column.
  • the ink tension is offset, so that the ink surface is flatter, and the uniformity of film formation is increased.
  • the hydrophobic induction column is arranged, the ink capacity can be increased, and the ink requirement of the pixel size is relatively small, thereby achieving inkjet printing of the high-resolution product.
  • FIG. 1 is a cross-sectional view of an array substrate according to an embodiment of the present invention.
  • FIG. 2 is a top view of an array substrate according to an embodiment of the invention.
  • FIG. 3 is a top view of an array substrate according to another embodiment of the present invention.
  • FIG. 4 is a top view of an array substrate according to another embodiment of the present invention.
  • Figure 5 is a cross-sectional view showing the maximum ink amount after ink is injected in the prior art
  • FIG. 6 is a cross-sectional view showing the highest ink amount after ink is injected by using the solution provided by the embodiment of the present invention
  • Figure 7 is a cross-sectional view showing the height of the ink dried to the bank layer after the ink is sprayed in the prior art
  • FIG. 8 is a cross-sectional view showing the ink drying to the height of the bank layer after the ink is sprayed by the solution provided by the embodiment of the present invention.
  • An embodiment of the present invention provides an array substrate, including: a substrate substrate, a pixel defining layer disposed on the substrate substrate, the pixel defining layer being provided with an opening region including a bottom wall and a sidewall, wherein the opening In the region, the edge of the bottom wall is provided with a plurality of hydrophilic induction columns whose surfaces are hydrophilic.
  • the edge of the bottom wall is near the boundary between the bottom wall and the side wall, and the hydrophilic induction column may be close to the boundary between the bottom wall and the side wall, or may be slightly apart from the boundary.
  • the positions of the plurality of hydrophilic induction columns are symmetrical.
  • the positions of the plurality of hydrophilic induction columns satisfy the following relationship: a first position provided with any hydrophilic induction column, and the first A positionally symmetric second and third position is provided with a hydrophilic induction column based on the axis of symmetry of the bottom wall. That is, a hydrophilic induction column is disposed at a symmetrical position of each hydrophilic induction column.
  • the third position is the same as the first position.
  • a plurality of hydrophobic induction pillars having a surface that is hydrophobic are disposed on the upper surface of the pixel defining layer near the sidewall.
  • the fifth position and the sixth position symmetric with the fourth position are provided with a hydrophobic induction column, the symmetry being based on the upper surface of the pixel defining layer An axis of symmetry of the region enclosed by the boundary with the sidewall. That is, the hydrophobic induction column is disposed at a symmetrical position of the position where each of the hydrophobic induction columns is located.
  • FIG. 1 is a cross-sectional view of an array substrate according to an embodiment of the present invention
  • FIG. 2 is a top view of an array substrate according to an embodiment of the present invention.
  • the substrate includes: a substrate substrate 10, a pixel defining layer (PDL layer, or bank layer) 20 disposed on the substrate substrate 10, the pixel defining layer is provided with an opening region 30, and the opening region includes a bottom wall 301 and the side wall 302, each of the corners 3011 of the bottom wall 301 of the open area 30 is provided with a hydrophilic induction column 40 whose surface is hydrophilic.
  • the bottom wall 301 and the side wall 302 form a cavity for containing ink to be sprayed.
  • the opening region 30 exposes an anode layer, that is, the bottom wall 301 of the opening region 30 is an anode layer.
  • the hydrophilic induction column 40 is within the open region 30. Generally, the hydrophilic induction column 40 is perpendicular to the bottom wall.
  • the bottom wall 301 has four corners 3011, and a hydrophilic induction column 40 can be disposed at each corner 3011, thereby providing a total of four hydrophilic induction columns 40.
  • the role of the hydrophilic induction column 40 is to counteract the ink tension.
  • the hydrophilic induction column may be next to the boundary 3012 of the bottom wall 301 or may be slightly spaced from the boundary 3012.
  • the positions of the four hydrophilic induction columns are symmetrical. The symmetry is based on the symmetry axis symmetry of the bottom wall 301, including left-right symmetry and upper and lower symmetry.
  • the hydrophilicity inducing column 40 may be cylindrical as shown in Figs. 1, 2, or may be other shapes such as a square column, a prismatic column or the like.
  • the hydrophilicity inducing column 40 may be an organic hydrophilic material or an inorganic hydrophilic material, and its surface hydrophilicity is greater than the hydrophilicity of the bottom wall, but the difference from the hydrophilicity of the bottom wall is less than a set threshold. Pulling is formed with the bottom wall to counteract the surface tension of the ink.
  • the hydrophilic induction columns 40 are of equal height.
  • the hydrophilic induction column 40 is of the same height as the open area.
  • the hydrophilicity inducing column 40 can also be slightly above the open area.
  • more hydrophilic induction columns may be disposed as needed, as shown in FIG. 3, and disposed between the two corners of the bottom wall 301 near the side wall 302.
  • the hydrophilic induction column 40 is disposed at a symmetrical position of each hydrophilic induction column 40, the symmetry is based on the axis of symmetry of the bottom wall, and the axis of symmetry is as The dotted line in Figure 3 is shown.
  • the position of the bottom wall 301 near the side wall 302 is near the boundary 3012 of the bottom wall 301 and the side wall 302.
  • a hydrophilic induction column 40 is disposed at an intermediate position near the boundary 3012, and a hydrophilic induction column 40 is also disposed at a symmetrical position of the hydrophilic induction column 40. Only the hydrophilic induction column 40 is disposed in the middle of the vicinity of the left and right boundaries in FIG.
  • a hydrophilic induction column may be disposed in the middle of FIG. 3 near the upper boundary of the bottom wall 301 and the side wall, and is disposed in the middle of the lower boundary of the bottom wall 301 and the side wall 302.
  • a plurality of hydrophilic induction columns may be provided on the bottom wall 301 at a position close to the boundary 3012.
  • a hydrophilic induction column 40 is arranged every 25 um.
  • a hydrophilic induction column 402 and a hydrophilic induction column 403 are respectively disposed.
  • a hydrophilic induction column 401 and a hydrophilic induction column 404 are respectively disposed.
  • hydrophilicity inducing columns can be set as needed, for example, according to pixel size and ink characteristics.
  • the embodiment of the invention provides a solution for adding a hydrophilic induction column in the opening region. After the ink is sprayed into the opening region, the ink is gradually dried. When the remaining ink amount and the pixel defining layer are level, the hydrophilic induction column starts to play. The effect is to offset the surface tension of the ink droplets, so that the upper surface of the ink droplets is more flat, which improves the uniformity of film formation.
  • a solution is provided. As shown in FIGS. 1 and 2, a hydrophobic induction pillar 50 having a hydrophobic surface is disposed at a corner 3021 of the upper surface of the pixel defining layer 20 adjacent to the sidewall 302.
  • the hydrophobic induction column 50 may be made of a fluorine-containing material, which is considered to be connected to the pixel defining layer during the fabrication process, and requires some processing on the interface, for example, using UV irradiation, CF4plsma treatment, and the like.
  • the hydrophobic induction column 50 is located on the upper surface of the pixel defining layer 50, generally, a hydrophobic induction column
  • the direction of 50 is defined perpendicular to the pixel layer 20.
  • four hydrophobic induction columns 50 are provided.
  • the positions of the four hydrophobic induction columns 50 are symmetrical. The symmetry is based on the symmetry axis symmetry of the region formed by the boundary 302 of the sidewall 302 and the pixel defining layer 20, including left-right symmetry and up-and-down symmetry.
  • the hydrophobic induction pillars 50 have the same height and are higher than the height of the pixel defining layer 20.
  • An optional range of heights of the hydrophobic induction column 50 is between 2/3-4/3 of the highest height of the ink after the ink is sprayed into the open area.
  • more hydrophobic inducing columns may be disposed as needed, as shown in FIG. 3, at a position on the upper surface of the pixel defining layer 20 near the two corners of the side wall.
  • a hydrophobic induction column 50 is provided, and a symmetrical position of each hydrophobic induction column 50 is provided with the hydrophobic induction column, the symmetry being based on a region enclosed by the boundary 3022 between the upper surface of the pixel defining layer and the sidewall The axis of symmetry is shown by the dashed line in Figure 3.
  • the hydrophobic induction pillar 50 is disposed at a position on the upper surface of the pixel defining layer 20 near the two corners of the sidewall, that is, a hydrophobic induction pillar is disposed at a position close to the boundary 3022 on the pixel defining layer and at a non-rotation angle 3021.
  • a hydrophobic induction column 50 is disposed at an intermediate position near the boundary 3022, and a hydrophobic induction column 50 is also disposed at a symmetrical position of the hydrophobic induction column 50. Only the hydrophobic induction column 50 is disposed in the middle of the vicinity of the left and right boundaries in FIG.
  • the hydrophobic induction column 50 may also be disposed intermediate the upper and lower boundaries.
  • a plurality of hydrophilic induction pillars may be disposed at a position where the upper surface of the pixel defining layer 20 is close to the boundary 3022.
  • a hydrophobic induction is arranged every 20 um around the boundary between the sidewall and the upper surface of the pixel defining layer (ie, the boundary around the opening region and the upper surface of the pixel defining layer).
  • Column 50 The number of hydrophobic induction columns can be set as desired, such as according to pixel size and ink characteristics.
  • the solution for increasing the hydrophobicity inducing column provided by the embodiment of the present invention can accommodate more ink by adding a hydrophobic induction column to the outer layer of the pixel, and meet the requirement of high-resolution pixels for ink amount, and at the same time, because of hydrophobicity induction
  • the column is separated and does not affect the fabrication of the cathode, and the accumulation of material near the hydrophobic induction column acts as an auxiliary electrode.
  • solution in the embodiment of the present invention is not limited to the open area of the shape shown in FIG. 1 and FIG. 2, and the open area of other shapes may also be applied to the solution of the present invention.
  • Fig. 5 is a schematic view showing the maximum amount of ink contained in the prior art.
  • Fig. 6 is a schematic view showing the maximum amount of ink contained in an embodiment of the present invention.
  • the maximum amount of ink accommodated is the amount of ink in the region 60; after the hydrophobic induction column is increased, as shown in FIG. 6, the maximum amount of ink accommodated is the amount of ink indicated by the region 70, It has been found that the amount of ink contained is increased after the addition of the hydrophobic induction column, and for high resolution products, although the pixel area is reduced, the amount of ink required can be accommodated after the solution provided by the present application.
  • FIG. 7 is a schematic view showing the surface of the ink when the ink is dried to the pixel defining layer in the prior art
  • FIG. 8 is a schematic view showing the surface of the ink when the ink is dried to the pixel defining layer by using the embodiment of the present invention.
  • the ink surface is a recessed area as shown by the ink surface 80 in FIG. 7, and the film thickness is inconsistent, resulting in a non-uniform film formation.
  • the hydrophilic induction column when the hydrophilic induction column is added, when the ink is dried to the pixel defining layer 20, the hydrophilic induction column cancels part of the surface tension, and the ink surface is as shown in FIG. Shown, it is flatter than the ink surface 80 of Figure 7, resulting in a more uniform film formation.
  • the number and hydrophilicity of the hydrophilicity-inducing column by changing the number and hydrophilicity of the hydrophilicity-inducing column, the effect of the ink surface being flat can be achieved. Therefore, according to the embodiment of the present invention, the final film thickness is relatively uniform, and the uniformity of film formation is improved.
  • the embodiment of the invention further provides a method for manufacturing the above array substrate, comprising:
  • the edge of the bottom wall is provided with a plurality of hydrophilic induction columns whose surfaces are hydrophilic.
  • the positions of the plurality of hydrophilic induction columns satisfy the following relationship:
  • a second position and a third position symmetrical with the first position are provided with a hydrophilic induction column based on the axis of symmetry of the bottom wall.
  • the hydrophilic induction column is disposed at each corner of the bottom wall in the open area.
  • the hydrophilic induction column is disposed on the bottom wall at a position between two corners and adjacent to the side wall.
  • the hydrophilic induction column is the same height as the open area.
  • a plurality of hydrophobic inducing columns whose surfaces are hydrophobic are disposed on the upper surface of the pixel defining layer near the sidewall.
  • a hydrophobic induction column having a hydrophobic surface is disposed at a corner of the upper surface of the pixel defining layer adjacent to the sidewall.
  • the positions of the plurality of hydrophobic induction columns satisfy the following relationship:
  • the fifth position and the sixth position symmetrical with the fourth position are provided with a hydrophobic induction column based on the upper surface and the side of the pixel defining layer The axis of symmetry of the area enclosed by the boundary of the wall.
  • a hydrophobic induction column is disposed at a position on the upper surface of the pixel defining layer between the two corners adjacent to the sidewall.
  • the height of the hydrophobic induction column is greater than the thickness of the pixel defining layer.

Abstract

一种阵列基板及其制造方法，该阵列基板包括：衬底基板（10），设置于衬底基板（10）上的像素界定层（20），像素界定层（20）设置有包括底壁（301）和侧壁（302）的开口区域（30），在开口区域（30）内，底壁（301）的边缘设置有多个表面为亲水性的亲水诱导柱（40）。通过增加亲水诱导柱（40），抵消墨水表面张力，提高了成膜的均一性。

Description

一种阵列基板及其制造方法 技术领域
本发明涉及显示技术领域，尤指一种阵列基板及其制造方法。
背景技术
有机发光二极管(OLED)显示技术是一种利用有机功能材料在电流的驱动下产生的可逆变色来实现显示的技术。目前，制造OLED显示装置中的有机功能材料层的常见方法是采用喷墨打印(ink jet Printing)方法。使用喷墨打印方法制作OLED产品有生产效率高，材料成本低的优点，但是，也受到打印技术自身特性的约束，很难实现高精细产品制作。影响高分辨产品制作的主要有像素内膜厚的均一性。现有技术中，受墨水表面张力影响，墨水打印到像素中干燥后形成的图案不均匀，周边会出现一圈咖啡环，从而影响发光区域的有效面积。
发明内容
为了解决上述技术问题，本发明实施例提供了一种阵列基板及其制造方法，能够提高成膜的均一性，增加发光区域的有效面积。
为了达到本发明目的，本发明实施例提供了一种阵列基板，包括：衬底基板，设置于所述衬底基板上的像素界定层，所述像素界定层设置有包括底壁和侧壁的开口区域，在所述开口区域内，所述底壁的边缘设置有多个表面为亲水性的亲水诱导柱。
可选的，多个所述亲水诱导柱的位置满足如下关系：
对任一设置有亲水诱导柱的第一位置，与所述第一位置对称的第二位置和第三位置设置有亲水诱导柱，所述对称基于所述底壁的对称轴。
可选的，在所述开口区域内，所述底壁的每个转角处设置有所述 亲水诱导柱。
可选的，所述亲水诱导柱与所述开口区域的高度相同。
可选的，所述亲水诱导柱的亲水性大于所述底壁的亲水性。
可选的，所述像素界定层上表面上靠近所述侧壁处设置有多个表面为疏水性的疏水诱导柱。
可选的，多个所述疏水诱导柱的位置满足如下关系：
对任一设置有疏水诱导柱的第四位置，与所述第四位置对称的第五位置和第六位置设置有疏水诱导柱，所述对称基于所述像素界定层的上表面与所述侧壁的交界所围成的区域的对称轴。
可选的，所述像素界面层上表面靠近所述侧壁的转角处设置有所述疏水诱导柱。
可选的，所述疏水诱导柱的高度大于所述像素界定层的厚度。
可选的，所述疏水诱导柱的高度相同。
本发明实施例还提供一种阵列基板的制造方法，包括：
提供衬底基板；
在所述衬底基板上设置像素界定层；
在所述像素界定层设置包括底壁和侧壁的开口区域；
在所述开口区域内，所述底壁的边缘设置多个表面为亲水性的亲水诱导柱。
可选的，多个所述亲水诱导柱的位置满足如下关系：
对任一设置有亲水诱导柱的第一位置，与所述第一位置对称的第二位置和第三位置设置有亲水诱导柱，所述对称基于所述底壁的对称轴。
可选的，在所述开口区域内，所述底壁的每个转角处设置所述亲水诱导柱。
可选的，在所述像素界定层上表面上靠近所述侧壁处设置多个表面为疏水性的疏水诱导柱。
可选的，在所述像素界面层上表面靠近所述侧壁的转角处设置所 述疏水诱导柱。
与现有技术相比，本发明实施例中，通过设置亲水诱导柱，抵消墨水张力，使得墨水表面更为平整，增加了成膜的均匀性。
进一步地，本发明实施例中，设置疏水诱导柱，可以提高墨水的容纳量，满足像素尺寸比较小时的墨水需求量，从而实现高分辨率产品的喷墨打印制作。
本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本发明技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本发明的技术方案，并不构成对本发明技术方案的限制。
图1为本发明一实施例提供的阵列基板截面图；
图2为本发明一实施例提供的阵列基板俯视图；
图3为本发明另一实施例提供的阵列基板俯视图；
图4为本发明又一实施例提供的阵列基板俯视图；
图5为现有技术中喷入墨水后最高墨水量截面图；
图6为采用本发明实施例提供方案喷入墨水后最高墨水量截面图；
图7为现有技术中喷入墨水后，墨水干燥到bank层高度的截面图；
图8为采用本发明实施例提供的方案喷入墨水后，墨水干燥到bank层高度的截面图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白，下文中将结 合附图对本发明的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
在附图的流程图示出的步骤可以在诸如一组计算机可执行指令的计算机系统中执行。并且，虽然在流程图中示出了逻辑顺序，但是在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤。
应当指出的是，尽管以下实施例以OLED显示装置为例来说明本发明，但是如本领域技术人员将领会到的，本发明可以应用于任何能够采用喷墨打印方法制作功能层的显示装置，而不限于OLED显示装置。
本发明实施例提供一种阵列基板，包括：衬底基板，设置于所述衬底基板上的像素界定层，所述像素界定层设置有包括底壁和侧壁的开口区域，在所述开口区域内，所述底壁的边缘设置有多个表面为亲水性的亲水诱导柱。
其中，所述底壁的边缘为靠近底壁与侧壁的交界的位置，亲水诱导柱可以紧挨底壁与侧壁的边界，也可以离边界略微有点距离。
可选的，该多个亲水诱导柱的位置对称，具体的，多个所述亲水诱导柱的位置满足如下关系：对任一设置有亲水诱导柱的第一位置，与所述第一位置对称的第二位置和第三位置设置有亲水诱导柱，所述对称基于所述底壁的对称轴。即每个亲水诱导柱所在位置的对称位置处设置有亲水诱导柱。特殊情况下，比如，第一位置为底壁的两个转角的正中时，此时，第三位置与第一位置相同。
在本发明的一可选实施例中，所述像素界定层上表面上靠近所述侧壁处设置有多个表面为疏水性的疏水诱导柱。
可选的，对任一设置有疏水诱导柱的第四位置，与所述第四位置对称的第五位置和第六位置设置有疏水诱导柱，所述对称基于所述像素界定层的上表面与所述侧壁的交界所围成的区域的对称轴。即每个所述疏水诱导柱所在位置的对称位置处设置有所述疏水诱导柱。
下面以具体实例进一步说明本发明。
图1为本发明实施例提供的一种阵列基板的截面图，图2为本发明实施例提供的一种阵列基板的俯视图，如图1,2所示，本发明实施例提供的一种阵列基板包括：衬底基板10，设置于所述衬底基板10上的像素界定层(PDL层，或称bank层)20，所述像素界定层设置有开口区域30，所述开口区域包括底壁301和侧壁302，所述开口区域30的底壁301的每个转角3011处设置有表面为亲水性的亲水诱导柱40。所述底壁301和侧壁302形成一个腔体，容纳待喷入的墨水。需要说明的是，该开口区域30暴露一阳极层，即开口区域30的底壁301为一阳极层。该亲水诱导柱40在所述开口区域30内。一般地，该亲水诱导柱40与底壁垂直。
从图2可以看出，底壁301有四个转角3011，可以在每个转角3011处设置一个亲水诱导柱40，从而共设置四个亲水诱导柱40。亲水诱导柱40的作用是抵消墨水张力。亲水诱导柱可以挨着底壁301的边界3012，也可以与边界3012略微有点距离。可选的，这4个亲水诱导柱的位置对称。该对称是基于底壁301的对称轴对称，包括左右对称和上下对称。
亲水诱导柱40可以为图1，2中所示的圆柱形，也可以是其他形状，比如方形柱，或者棱形柱等等。
亲水诱导柱40可以采用有机亲水材料或者无机亲水材料，且其表面亲水性大于所述底壁的亲水性，但与底壁的亲水性的差值小于一设定阈值，与底壁形成拉扯，从而抵消墨水的表面张力。
在发明的一可选实施例中，所述亲水诱导柱40的高度相等。
在本发明的一可选实施例中，所述亲水诱导柱40与所述开口区域的高度相同。当然，亲水诱导柱40也可以略高于所述开口区域。
在本发明的一可选实施例中，可以根据需要设置更多的亲水诱导柱，如图3所示，在所述底壁301上两个转角处之间靠近所述侧壁302处设置有所述亲水诱导柱40，且每个亲水诱导柱40的对称位置处设置有所述亲水诱导柱40，所述对称基于所述底壁的对称轴，对称轴如 图3中的虚线所示。图3中，底壁301靠近侧壁302的位置即靠近底壁301与侧壁302的边界3012的位置。图3中，在靠近边界3012的中间位置设置了一个亲水诱导柱40，在该亲水诱导柱40的对称位置也设置了一个亲水诱导柱40。图3中仅示出了在靠近左边界和右边界的中间位置设置了亲水诱导柱40。在本发明的其他实施例中，可以在图3中靠近底壁301与侧壁的上边界的中间位置设置一个亲水诱导柱，在靠近底壁301与侧壁302的下边界的中间位置设置一个亲水诱导柱。另外，也可以在底壁301上靠近边界3012的位置设置多个亲水诱导柱。比如，如图4所示，在像素大小为50um*150um时，每隔25um布置一个亲水诱导柱40。此时，对亲水诱导柱401，其对称位置有两个，分别设置有亲水诱导柱402和亲水诱导柱403。对另一亲水诱导柱402，其对称位置有两个，分别设置有亲水诱导柱401和亲水诱导柱404。
需要说明的是，亲水诱导柱的个数可根据需要设定，比如根据像素尺寸和墨水特性设定。
本发明实施例提供的在开口区域内增加亲水诱导柱的方案，在开口区域内喷入墨水后，墨水逐步干燥，当剩余的墨水量和像素界定层高度齐平时，亲水诱导柱开始发挥作用，抵消墨滴的表面张力，使得墨滴的上表面更为平整，提高了成膜的均一性。
当要打印高分辨率产品时，像素的尺寸变得很小，所能容纳的墨水量越来越少，而制作显示器件使用的墨水量又比较大，如果单纯依靠增高bank层的高度，虽然可以提高墨水的容纳量，但是会给阴极的蒸镀工作带来很大的困难。本发明实施例中，提供了一种解决方案。如图1，2所示，在像素界定层20上表面上靠近所述侧壁302的转角3021处设置有表面为疏水性的疏水诱导柱50。所述疏水诱导柱50可采用含氟类的材料，在制作过程中考虑到要和像素界定层连接，界面上需要一定的处理，比如，使用UV照射，CF4plsma处理等。所述疏水诱导柱50位于像素界定层50的上表面上，一般地，疏水诱导柱 50的方向为垂直于所述像素界定层20。如图2所示，设置了4个疏水诱导柱50。可选的，这4个疏水诱导柱50的位置对称。该对称是基于侧壁302与像素界定层20的交界3022所形成的区域的对称轴对称，包括左右对称和上下对称。
在本发明的一可选实施例中，所述疏水诱导柱50的高度相同，且高于所述像素界定层20的高度。疏水诱导柱50的高度的一个可选范围为：所述开口区域内喷入墨水后墨水最高高度的2/3-4/3之间。
在本发明的一可选实施例中，可以根据需要设置更多的疏水诱导柱，如图3所示，在像素界定层20上表面上靠近所述侧壁的两个转角处之间的位置设置有疏水诱导柱50，且每个疏水诱导柱50的对称位置设置有所述疏水诱导柱，所述对称基于所述像素界定层的上表面与所述侧壁的交界3022所围成的区域的对称轴，如图3中的虚线所示。其中，在像素界定层20上表面上靠近所述侧壁的两个转角处之间的位置设置疏水诱导柱50，即在像素界定层上靠近边界3022的位置且非转角3021处设置疏水诱导柱。图3中，在靠近边界3022的中间位置设置了一个疏水诱导柱50，在该疏水诱导柱50的对称位置也设置了一个疏水诱导柱50。图3中仅示出了在靠近左边界和右边界的中间位置设置了疏水诱导柱50。在本发明的其他实施例中，也可以在靠近上边界和下边界的中间位置设置疏水诱导柱50。另外，也可以在像素界定层20的上表面靠近边界3022的位置设置多个亲水诱导柱。比如，在像素大小为50um*150um时，围绕所述侧壁与所述像素界定层的上表面的边界(即围绕该开口区域与像素界定层上表面的交界)，每隔20um布置一个疏水诱导柱50。疏水诱导柱的个数可根据需要设定，比如根据像素尺寸和墨水特性设定。
本发明实施例提供的增加疏水性诱导柱的方案，由于在像素外层增加了疏水诱导柱，从而可以容纳更多的墨水，满足高分辨率像素对墨水量的需求，同时，因为疏水性诱导柱是分离的，不会影响阴极的制作，而且在疏水诱导柱附近材料的堆积会起到辅助电极的作用。
需要说明的是，本发明实施例所述方案，不限于图1，2中所示形状的开口区域，其他形状的开口区域也可应用本发明所述方案。
下面说明一下使用本申请提供的方案在喷入墨水后的实现。
图5为现有技术中最高容纳墨水量示意图。图6为本发明实施例最高容纳墨水量示意图。如图5所示，喷入墨水后，容纳的最高墨水量为区域60中的墨水量；增加疏水诱导柱后，如图6所示，容纳的最高墨水量为区域70所示的墨水量，可以发现，增加疏水诱导柱后，容纳的墨水量增加，对于高分辨率产品，尽管像素区域减小，采用本申请提供的方案后，仍然可以容纳所需的墨水量。
图7为现有技术中墨水干燥到像素界定层时墨水表面示意图；图8为采用本发明实施例方案后墨水干燥到像素界定层时墨水表面示意图。如图7所示，墨水干燥到像素界定层20时，墨水表面见图7中的墨水表面80所示，为一凹陷区域，膜厚不一致，导致最终成膜不均一。采用本发明实施例提供的方案，如图8所示，由于增加了亲水诱导柱，墨水干燥到像素界定层20时，亲水诱导柱抵消部分表面张力，墨水表面如图8中墨水表面90所示，与图7中的墨水表面80相比，更为平坦，从而使得最终成膜更为均匀。另外，通过改变亲水诱导柱的数量和亲水性，可以达到墨水表面为平面的效果，因此，采取本发明实施例所述方案，最终成膜厚度比较一致，提高了成膜的均一性。
本发明实施例还提供一种上述阵列基板的制造方法，包括：
提供衬底基板；
在所述衬底基板上设置像素界定层；
在所述像素界定层设置包括底壁和侧壁的开口区域；
在所述开口区域内，所述底壁的边缘设置多个表面为亲水性的亲水诱导柱。
在本发明的一可选实施例中，多个所述亲水诱导柱的位置满足如下关系：
对任一设置有亲水诱导柱的第一位置，与所述第一位置对称的第二位置和第三位置设置有亲水诱导柱，所述对称基于所述底壁的对称轴。
在本发明的一可选实施例中，在所述开口区域内，所述底壁的每个转角处设置所述亲水诱导柱。
在本发明的一可选实施例中，在所述底壁上处于两个转角处之间且靠近所述侧壁的位置设置所述亲水诱导柱。
在本发明的一可选实施例中，所述亲水诱导柱与所述开口区域的高度相同。
在本发明的一可选实施例中，在所述像素界定层上表面上靠近所述侧壁处设置多个表面为疏水性的疏水诱导柱。
在本发明的一可选实施例中，在所述像素界定层上表面上靠近所述侧壁的转角处设置表面为疏水性的疏水诱导柱。
在本发明的一可选实施例中，多个所述疏水诱导柱的位置满足如下关系：
对任一设置有疏水诱导柱的第四位置，与所述第四位置对称的第五位置和第六位置设置有疏水诱导柱，所述对称基于所述像素界定层的上表面与所述侧壁的交界所围成的区域的对称轴。
在本发明的一可选实施例中，在所述像素界定层上表面上靠近所述侧壁的两个转角处之间的位置设置有疏水诱导柱。
在本发明的一可选实施例中，所述疏水诱导柱的高度大于所述像素界定层的厚度。
虽然本发明所揭露的实施方式如上，但所述的内容仅为便于理解本发明而采用的实施方式，并非用以限定本发明。任何本发明所属领域内的技术人员，在不脱离本发明所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本发明的专利保护范围，仍须以所附的权利要求书所界定的范围为准。
本本申请要求于2017年3月3日递交的中国专利申请第 201710124200.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (15)

  1. 一种阵列基板，包括：
    衬底基板；以及
    设置于所述衬底基板上的像素界定层，所述像素界定层设置有包括底壁和侧壁的开口区域，其中，在所述开口区域内，所述底壁的边缘设置有多个表面为亲水性的亲水诱导柱。
  2. 如权利要求1所述的阵列基板，其中，多个所述亲水诱导柱的位置满足如下关系：
    对任一设置有亲水诱导柱的第一位置，与所述第一位置对称的第二位置和第三位置设置有亲水诱导柱，所述对称基于所述底壁的对称轴。
  3. 如权利要求1所述的阵列基板，其中，在所述开口区域内，所述底壁的每个转角处设置有所述亲水诱导柱。
  4. 如权利要求1至3任一所述的阵列基板，其中，所述亲水诱导柱与所述开口区域的高度相同。
  5. 如权利要求1至3任一所述的阵列基板，其中，所述亲水诱导柱的亲水性大于所述底壁的亲水性。
  6. 如权利要求1所述的阵列基板，其中，所述像素界定层上表面上靠近所述侧壁处设置有多个表面为疏水性的疏水诱导柱。
  7. 如权利要求6所述的阵列基板，其中，多个所述疏水诱导柱的位置满足如下关系：
    对任一设置有疏水诱导柱的第四位置，与所述第四位置对称的第五位置和第六位置设置有疏水诱导柱，所述对称基于所述像素界定层的上表面与所述侧壁的交界所围成的区域的对称轴。
  8. 如权利要求6所述的阵列基板，其中，所述像素界面层上表面靠近所述侧壁的转角处设置有所述疏水诱导柱。
  9. 如权利要求6至8任一所述的阵列基板，其中，所述疏水诱 导柱的高度大于所述像素界定层的厚度。
  10. 如权利要求6至8任一所述的阵列基板，其中，所述疏水诱导柱的高度相同。
  11. 一种阵列基板的制造方法，包括：
    提供衬底基板；
    在所述衬底基板上设置像素界定层；
    在所述像素界定层设置包括底壁和侧壁的开口区域；
    在所述开口区域内，所述底壁的边缘设置多个表面为亲水性的亲水诱导柱。
  12. 如权利要求11所述的制造方法，其中，多个所述亲水诱导柱的位置满足如下关系：
    对任一设置有亲水诱导柱的第一位置，与所述第一位置对称的第二位置和第三位置设置有亲水诱导柱，所述对称基于所述底壁的对称轴。
  13. 如权利要求11所述的制造方法，其中，在所述开口区域内，所述底壁的每个转角处设置所述亲水诱导柱。
  14. 如权利要求11-13中任一项所述的制造方法，其中，在所述像素界定层上表面上靠近所述侧壁处设置多个表面为疏水性的疏水诱导柱。
  15. 权利要求14所述的制造方法，其中，在所述像素界面层上表面靠近所述侧壁的转角处设置所述疏水诱导柱。
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