WO2018147301A1 - 電磁波シールドフィルム、シールドプリント配線板及び電子機器 - Google Patents

電磁波シールドフィルム、シールドプリント配線板及び電子機器 Download PDF

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Publication number
WO2018147301A1
WO2018147301A1 PCT/JP2018/004112 JP2018004112W WO2018147301A1 WO 2018147301 A1 WO2018147301 A1 WO 2018147301A1 JP 2018004112 W JP2018004112 W JP 2018004112W WO 2018147301 A1 WO2018147301 A1 WO 2018147301A1
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WIPO (PCT)
Prior art keywords
electromagnetic wave
wave shielding
shielding film
layer
wiring board
Prior art date
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PCT/JP2018/004112
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English (en)
French (fr)
Japanese (ja)
Inventor
上農　憲治
志朗 山内
白髪　潤
村川　昭
Original Assignee
タツタ電線株式会社
Dic株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツタ電線株式会社, Dic株式会社 filed Critical タツタ電線株式会社
Priority to KR1020197015506A priority Critical patent/KR102256655B1/ko
Priority to CN201880009007.6A priority patent/CN110199583B/zh
Priority to JP2018535440A priority patent/JP6404534B1/ja
Publication of WO2018147301A1 publication Critical patent/WO2018147301A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Definitions

  • the present invention relates to an electromagnetic wave shielding film, a shield printed wiring board, and an electronic device.
  • an electromagnetic wave shielding film is attached to a printed wiring board such as a flexible printed wiring board (FPC) to shield electromagnetic waves from the outside.
  • a printed wiring board such as a flexible printed wiring board (FPC)
  • An electromagnetic wave shielding film usually has a configuration in which a conductive adhesive layer, a shielding layer made of a metal thin film, and an insulating layer are sequentially laminated.
  • the electromagnetic wave shielding film is adhered to the printed wiring board by the adhesive layer, thereby producing a shield printed wiring board. After this bonding, components are mounted on the printed wiring board by solder reflow.
  • the printed wiring board has a configuration in which a printed pattern on a base film is covered with an insulating film.
  • the shield printed wiring board When a shield printed wiring board is manufactured, if the shield printed wiring board is heated by a heating press or solder reflow, gas is generated from the conductive adhesive layer of the electromagnetic shielding film, the insulating film of the printed wiring board, or the like. Further, when the base film of the printed wiring board is formed of a highly hygroscopic resin such as polyimide, water vapor may be generated from the base film by heating. Since these volatile components generated from the conductive adhesive layer, the insulating film, and the base film cannot pass through the shield layer, they accumulate between the shield layer and the conductive adhesive layer. Therefore, if rapid heating is performed in the solder reflow process, the adhesion between the shield layer and the conductive adhesive layer is destroyed by the volatile component accumulated between the shield layer and the conductive adhesive layer, and the shield characteristics are improved. It may decrease.
  • a heating press or solder reflow gas is generated from the conductive adhesive layer of the electromagnetic shielding film, the insulating film of the printed wiring board, or the
  • Patent Document 1 describes an electromagnetic wave shielding film in which a plurality of openings are provided in a shield layer (metal thin film) to improve air permeability.
  • a shield layer metal thin film
  • the volatile components can pass through the shield layer through the openings. Therefore, it is possible to prevent volatile components from accumulating between the shield layer and the conductive adhesive layer, and it is possible to prevent a decrease in shield characteristics due to destruction of interlayer adhesion.
  • the electromagnetic wave shielding film described in Patent Document 1 since the electromagnetic wave shielding film described in Patent Document 1 has an opening in the shield layer, the strength of the shield layer is weak. Therefore, when the electromagnetic wave shielding film described in Patent Document 1 is used for a flexible printed wiring board, the following problems occur. That is, the flexible printed wiring board is repeatedly bent during use. The electromagnetic wave shielding film used for such a flexible printed wiring board and the shielding layer constituting the electromagnetic wave shielding film are also repeatedly bent. As described above, since the shield layer of the electromagnetic wave shielding film described in Patent Document 1 has low strength, there is a problem that the shield layer is easily broken when it is repeatedly bent. Moreover, the electromagnetic wave shielding film described in Patent Document 1 cannot be said to have sufficiently high shielding properties.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide an electromagnetic wave shielding film having sufficient bending resistance and sufficiently high electromagnetic wave shielding characteristics.
  • the electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film comprising a conductive adhesive layer, a shield layer laminated on the conductive adhesive layer, and an insulating layer laminated on the shield layer.
  • the shield layer a plurality of openings are formed.
  • the number of bendings is 600 and no disconnection occurs.
  • the electromagnetic wave shielding characteristic of the electromagnetic wave shielding film at 200 MHz is 85 dB or more.
  • the shield layer has a plurality of openings. Therefore, even when a volatile component is generated between the shield layer and the conductive adhesive layer in the heating press process or the solder reflow process when the shield printed wiring board is manufactured using the electromagnetic wave shielding film of the present invention, Volatile components can pass through the opening of the shield layer. Therefore, it is difficult for volatile components to accumulate between the shield layer and the conductive adhesive layer. As a result, it is possible to prevent the interlayer adhesion from being broken. Therefore, the electromagnetic wave shielding characteristics at 200 MHz measured by the KEC method described later are enhanced.
  • the electromagnetic wave shielding film of the present invention does not break when the number of bendings is 600 in the MIT bending fatigue test specified in JIS P8115: 2001.
  • the electromagnetic wave shielding film of the present invention has such high bending resistance, even if the electromagnetic wave shielding film of the present invention is used for a flexible printed wiring board or the like, disconnection hardly occurs.
  • the electromagnetic wave shielding film of the present invention has an electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method of 85 dB or more. That is, it has a sufficiently high shield characteristic.
  • FIG. 1 is a schematic diagram schematically showing the configuration of a system used in the KEC method.
  • the system used in the KEC method includes an electromagnetic wave shielding effect measuring device 80, a spectrum analyzer 91, an attenuator 92 that attenuates 10 dB, an attenuator 93 that attenuates 3 dB, and a preamplifier 94.
  • the electromagnetic wave shielding effect measuring device 80 is provided with two measuring jigs 83 facing each other.
  • An electromagnetic wave shielding film (indicated by reference numeral 110 in FIG. 1) is sandwiched between the measuring jigs 83.
  • the measurement jig 83 has a structure in which a TEM cell (Transverse Electro Magnetic Cell) size distribution is incorporated and is divided symmetrically in a plane perpendicular to the transmission axis direction.
  • the flat plate-shaped center conductor 84 is disposed with a gap between each measurement jig 83.
  • a signal output from the spectrum analyzer 91 is input to the transmission side measurement jig 83 via the attenuator 92. Then, the signal is received by the measuring jig 83 on the receiving side and the signal via the attenuator 93 is amplified by the preamplifier 94, and then the signal level is measured by the spectrum analyzer 91.
  • the spectrum analyzer 91 outputs the attenuation when the electromagnetic wave shielding film 110 is installed in the electromagnetic wave shielding effect measuring device 80 with reference to the state where the electromagnetic wave shielding film 110 is not installed in the electromagnetic wave shielding effect measuring device 80. .
  • the electromagnetic wave shielding film of the present invention has an electromagnetic wave shielding characteristic at 200 MHz measured using such an apparatus of 85 dB or more.
  • the electromagnetic wave shielding film of the present invention it is desirable that no swelling occurs in the following delamination evaluation.
  • Evaluation of delamination An electromagnetic wave shielding film was attached to a printed wiring board by hot pressing, and the obtained shield printed wiring board was heated to 265 ° C. and then cooled to room temperature, and this heating and cooling were performed a total of 5 times. Thereafter, it is visually observed whether or not the electromagnetic wave shielding film is swollen.
  • the electromagnetic wave shielding film of the present invention has such characteristics, the interlayer adhesion between the shield layer and the conductive adhesive layer is not easily broken.
  • the opening area of the opening and the opening pitch satisfy the relationship of the following formula (1).
  • y represents the square root of the opening area ( ⁇ m 2 ), and x represents the opening pitch ( ⁇ m).
  • the opening area of the opening is preferably 70 to 71000 ⁇ m 2 and the opening ratio of the opening is preferably 0.05 to 3.6%. If the opening area and the opening ratio of the opening formed in the shield layer are within this range, the bending resistance is sufficient, and the accumulation of volatile components between the shield layer and the conductive adhesive layer is prevented. can do.
  • the opening area of the opening is less than 70 ⁇ m 2 , the opening is too narrow and the volatile component is difficult to pass through the shield layer. As a result, volatile components tend to accumulate between the shield layer and the conductive adhesive layer. Therefore, when manufacturing a shield printed wiring board using the electromagnetic wave shielding film, interlayer adhesion between the shield layer and the conductive adhesive layer is easily broken.
  • the shield characteristics are degraded. If the opening area of the opening exceeds 71000 ⁇ m 2 , the opening is too wide, the shield layer becomes weak, and the bending resistance decreases. When the opening ratio of the opening is less than 0.05%, the ratio of the opening is too small, and the volatile component is difficult to pass through the shield layer. As a result, volatile components tend to accumulate between the shield layer and the conductive adhesive layer. When the opening ratio of the opening exceeds 3.6%, the ratio of the opening is too large, the shield layer becomes weak, and the bending resistance is lowered.
  • aperture ratio means the total opening area of a plurality of openings with respect to the area of the entire main surface of the shield layer.
  • the opening pitch of the openings is preferably 10 to 10,000 ⁇ m.
  • the opening pitch of the openings is less than 10 ⁇ m, the ratio of the openings increases in the entire shield layer. As a result, the shield layer becomes weak and the bending resistance is lowered.
  • the opening pitch of the openings exceeds 10,000 ⁇ m, the ratio of the openings is reduced in the entire shield layer. As a result, it becomes difficult for the volatile component to pass through the shield layer, and the volatile component tends to accumulate between the shield layer and the conductive adhesive layer.
  • the “opening pitch of openings” refers to the distance between the centers of gravity of the adjacent openings.
  • the thickness of the shield layer is preferably 0.5 ⁇ m or more.
  • the thickness of the shield layer is less than 0.5 ⁇ m, the shield layer is too thin, and the shield characteristics are lowered.
  • the shielding layer preferably includes a copper layer. Copper is a suitable material for the shield layer from the viewpoint of conductivity and economy.
  • the shield layer further includes a silver layer, the silver layer is disposed on the insulating layer side, and the copper layer is disposed on the conductive adhesive layer side. It is desirable that The electromagnetic wave shielding film having such a configuration can be easily produced by applying a silver paste to the insulating layer so that an opening is formed to form a silver layer and plating the silver layer with copper.
  • the electromagnetic wave shielding film of the present invention is preferably for a flexible printed wiring board.
  • the electromagnetic wave shielding film of the present invention hardly accumulates volatile components between the shield layer and the conductive adhesive layer when producing a shield printed wiring board.
  • the electromagnetic wave shielding film of the present invention has sufficient bending resistance. Therefore, even if the electromagnetic wave shielding film of this invention is used for a flexible printed wiring board and it is repeatedly bent, it is hard to be damaged. Therefore, the electromagnetic wave shielding film of the present invention can be suitably used as an electromagnetic wave shielding film for flexible printed wiring boards.
  • the shield printed wiring board of the present invention is provided on a base member on which a printed circuit is formed, a printed wiring board having an insulating film provided on the base member so as to cover the printed circuit, and the printed wiring board.
  • the electromagnetic wave shielding film is the electromagnetic wave shielding film of the present invention.
  • the printed wiring board is a flexible printed wiring board.
  • the shield printed wiring board of the present invention has the electromagnetic wave shielding film of the present invention having sufficient bending resistance. Therefore, the shield printed wiring board of the present invention also has sufficient bending resistance.
  • the electronic device of the present invention is characterized in that the shield printed wiring board of the present invention is incorporated in a folded state.
  • the shield printed wiring board of the present invention has sufficient bending resistance. Therefore, even if it is incorporated in an electronic device in a bent state, it is not easily damaged. Therefore, the electronic device of the present invention can narrow the space for arranging the shield printed wiring board. Therefore, the electronic device of the present invention can be thinned.
  • the shield film of the present invention In the electromagnetic wave shielding film of the present invention, a plurality of openings are formed in the shield layer, and in the MIT folding fatigue test specified in JIS P8115: 2001, the number of bendings is 600 and no breakage occurs.
  • the electromagnetic wave shielding characteristic of the electromagnetic wave shielding film measured at 200 MHz is 85 dB or more. Therefore, the shield film of the present invention has high bending resistance and shielding properties.
  • FIG. 1 is a schematic diagram schematically showing the configuration of a system used in the KEC method.
  • FIG. 2 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • 3A and 3B are schematic views schematically showing a case where a shield printed wiring board is manufactured using an electromagnetic wave shielding film in which no opening is formed in the shield layer.
  • 4 (a) to 4 (c) are plan views schematically showing an example of an arrangement pattern of openings in the shield layer constituting the electromagnetic wave shielding film of the present invention.
  • FIG. 5 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention in which the shield layer is composed of a copper layer and a silver layer.
  • FIGS. 6 (a) to 6 (c) are process diagrams schematically showing an example of the method for producing an electromagnetic wave shielding film of the present invention in order.
  • FIG. 7 is a process diagram schematically showing an example of an insulating layer preparation process in the method for producing an electromagnetic wave shielding film of the present invention.
  • FIG. 8 is a process diagram schematically showing an example of a silver paste printing process in the method for producing an electromagnetic wave shielding film of the present invention.
  • FIG. 9 is a process diagram schematically showing an example of a silver paste printing process in the method for producing an electromagnetic wave shielding film of the present invention.
  • FIG. 10 is a process diagram schematically showing an example of a silver paste printing process in the method for producing an electromagnetic wave shielding film of the present invention.
  • FIG. 11A and 11B are process diagrams schematically showing an example of a copper plating process in the method for producing an electromagnetic wave shielding film of the present invention.
  • 12 (a) and 12 (b) are process diagrams schematically showing an example of a conductive adhesive layer forming step in the method for producing an electromagnetic wave shielding film of the present invention.
  • FIG. 13 is a scatter diagram of the electromagnetic wave shielding film with the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch, and shows the evaluation of the bending resistance of the electromagnetic wave shielding film.
  • FIG. 13 is a scatter diagram of the electromagnetic wave shielding film with the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch, and shows the evaluation of the bending resistance of the electromagnetic wave shielding film.
  • FIG. 14 is a scatter diagram of the electromagnetic shielding film in which the vertical axis represents the square root of the opening area and the horizontal axis represents the opening pitch, and shows the evaluation of the electromagnetic shielding characteristics of the electromagnetic shielding film.
  • FIG. 15 is a scatter diagram of the electromagnetic wave shielding film with the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch, showing the overall evaluation of the evaluation of the bending resistance and the electromagnetic wave shielding characteristics of the electromagnetic wave shielding film. It is a figure.
  • FIG. 16 is a scatter diagram of the electromagnetic wave shielding film in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, and is a diagram showing the delamination evaluation of the electromagnetic wave shielding film.
  • FIG. 17 is a scatter diagram of an electromagnetic wave shielding film having the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch. Evaluation of the bending resistance of the electromagnetic wave shielding film, evaluation of the electromagnetic wave shielding characteristics, and delamination evaluation It is a figure which shows comprehensive evaluation of.
  • FIG. 2 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • the electromagnetic wave shielding film 10 includes a conductive adhesive layer 20, a shield layer 30 laminated on the conductive adhesive layer 20, and an insulating layer 40 laminated on the shield layer 30. It consists of. A plurality of openings 50 are formed in the shield layer 30.
  • the conductive adhesive layer 20 may be made of any material as long as it has conductivity and can function as an adhesive.
  • the conductive adhesive layer 20 may be composed of conductive particles and an adhesive resin composition.
  • a metal microparticle, a carbon nanotube, carbon fiber, a metal fiber, etc. may be sufficient.
  • the metal fine particles are not particularly limited, but silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by silver plating on copper powder, polymer fine particles Or fine particles in which glass beads or the like are coated with a metal. In these, it is desirable that it is the copper powder or silver coat copper powder which can be obtained cheaply from an economical viewpoint.
  • the average particle size of the conductive particles is not particularly limited, but is desirably 0.5 to 15.0 ⁇ m. When the average particle diameter of the conductive particles is 0.5 ⁇ m or more, the conductivity of the conductive adhesive layer is improved. When the average particle size of the conductive particles is 15.0 ⁇ m or less, the conductive adhesive layer can be thinned.
  • the shape of the conductive particles is not particularly limited, but can be appropriately selected from spherical, flat, flakes, dendrites, rods, fibers, and the like.
  • the material of the adhesive resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, and an imide resin composition. Products, amide resin compositions, acrylic resin compositions, etc., phenol resin compositions, epoxy resin compositions, urethane resin compositions, melamine resin compositions, alkyd resin compositions A thermosetting resin composition such as a product can be used.
  • the material of the adhesive resin composition may be one of these alone or a combination of two or more.
  • a curing accelerator for the conductive adhesive layer 20, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, if necessary. Further, a viscosity modifier or the like may be contained.
  • the blending amount of the conductive particles in the conductive adhesive layer 20 is not particularly limited, but is preferably 15 to 80% by mass, and more preferably 15 to 60% by mass.
  • the adhesiveness to the printed wiring board of a conductive adhesive layer improves that it is the said range.
  • the thickness of the conductive adhesive layer 20 is not particularly limited and can be appropriately set as necessary, but is desirably 0.5 to 20.0 ⁇ m. When the thickness of the conductive adhesive layer is less than 0.5 ⁇ m, it is difficult to obtain good conductivity. If the thickness of the conductive adhesive layer exceeds 20.0 ⁇ m, the thickness of the entire electromagnetic wave shielding film becomes thick and difficult to handle.
  • the conductive adhesive layer 20 has anisotropic conductivity.
  • the transmission characteristics of the high-frequency signal transmitted by the signal circuit of the printed wiring board are improved as compared with the case where the conductive adhesive layer 20 has isotropic conductivity.
  • the insulating layer 40 has sufficient insulating properties, and is not particularly limited as long as the conductive adhesive layer 20 and the shield layer 30 can be protected.
  • a thermoplastic resin composition for example, a thermoplastic resin composition, a thermosetting resin composition, and the like. It is desirable that the composition is composed of an active energy ray-curable composition or the like.
  • the thermoplastic resin composition is not particularly limited, but a styrene resin composition, a vinyl acetate resin composition, a polyester resin composition, a polyethylene resin composition, a polypropylene resin composition, and an imide resin composition. And acrylic resin compositions.
  • thermosetting resin composition A phenol-type resin composition, an epoxy-type resin composition, a urethane-type resin composition, a melamine-type resin composition, an alkyd-type resin composition etc. are mentioned.
  • the active energy ray curable composition for example, the polymeric compound etc. which have at least 2 (meth) acryloyloxy group in a molecule
  • the insulating layer 40 may be composed of a single material, or may be composed of two or more materials.
  • a curing accelerator for the insulating layer 40, a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, an antifoaming agent, a leveling agent, a filler, a flame retardant, and a viscosity adjuster, if necessary.
  • An agent, an antiblocking agent and the like may be contained.
  • the thickness of the insulating layer 40 is not particularly limited and can be appropriately set as necessary, but is preferably 1 to 15 ⁇ m, and more preferably 3 to 10 ⁇ m. If the thickness of the insulating layer 40 is less than 1 ⁇ m, the conductive adhesive layer 20 and the shield layer 30 are not easily protected sufficiently because they are too thin. When the thickness of the insulating layer 40 exceeds 15 ⁇ m, the electromagnetic wave shielding film 10 is difficult to bend because it is too thick, and the insulating layer 40 itself is easily damaged. Therefore, it becomes difficult to apply to members that require bending resistance.
  • 3A and 3B are schematic views schematically showing a case where a shield printed wiring board is manufactured using an electromagnetic wave shielding film in which no opening is formed in the shield layer.
  • the shield printed wiring board on which the electromagnetic wave shielding film 510 is arranged is heated by a heating press or solder reflow.
  • a volatile component 560 is generated from the conductive adhesive layer 520 of the electromagnetic wave shielding film 510, the insulating film of the printed wiring board, the base film, and the like.
  • the shield layer 530 and the conductive layer 560 are made conductive by the volatile component 560 accumulated between the shield layer 530 and the conductive adhesive layer 520. Interlayer adhesion with the adhesive layer 520 may be destroyed.
  • the electromagnetic wave shielding film 10 shown in FIG. 2 a plurality of openings 50 are formed in the shield layer 30. Therefore, even when a volatile component is generated between the shield layer 30 and the conductive adhesive layer 20 due to heating when a shield printed wiring board is manufactured using the electromagnetic wave shield film 10, the volatile component is It can pass through the opening 50. Therefore, it is difficult for volatile components to accumulate between the shield layer 30 and the conductive adhesive layer 20. As a result, it is possible to prevent the interlayer adhesion from being broken.
  • the electromagnetic wave shielding film 10 does not swell in the above delamination evaluation, and the electromagnetic wave shielding characteristics at 200 MHz measured by the KEC method can be 85 dB or more.
  • the electromagnetic wave shielding film of the present invention has a bending frequency of 600 times and no breakage in the MIT folding fatigue test specified in JIS P8115: 2001, and the bending frequency is 2000 times. It is desirable that no disconnection occurs.
  • the electromagnetic wave shielding film of the present invention has such high bending resistance, even if the electromagnetic wave shielding film of the present invention is used for a flexible printed wiring board or the like, disconnection hardly occurs.
  • the opening area of the opening 50 is desirably 70 to 71000 ⁇ m 2 , and the opening ratio of the opening 50 is desirably 0.05 to 3.6%. Area of the opening 50 is more preferably to be 70 ⁇ 32000 ⁇ m 2, more desirably 70 ⁇ 10000 2, more desirably more is 80 ⁇ 8000 ⁇ m 2. Further, the opening ratio of the opening 50 is more preferably 0.1 to 3.6%. If the opening area and the opening ratio of the opening 50 formed in the shield layer 30 are within this range, the bending resistance is sufficient, and a volatile component is present between the shield layer 30 and the conductive adhesive layer 20. Accumulation can be prevented. Moreover, the electromagnetic wave shielding characteristics of the electromagnetic wave shielding film at 200 MHz measured by the KEC method are improved.
  • the opening area of the opening of the shield layer is less than 70 ⁇ m 2 , the opening is too narrow and volatile components are difficult to pass through the shield layer. As a result, volatile components tend to accumulate between the shield layer and the conductive adhesive layer. If the opening area of the opening of the shield layer exceeds 71000 ⁇ m 2 , the opening is too wide, the shield layer becomes weak, and the bending resistance decreases.
  • the opening ratio of the opening of the shield layer is less than 0.05%, the ratio of the opening is too small, and the volatile component hardly passes through the shield layer. As a result, volatile components tend to accumulate between the shield layer and the conductive adhesive layer.
  • the aperture ratio of the opening part of a shield layer exceeds 3.6%, there are too many ratios of an opening part, a shield layer will become weak and bending resistance will fall.
  • the shape of the opening 50 is not particularly limited, and may be a circle, an ellipse, a racetrack, a triangle, a quadrangle, a pentagon, a hexagon, an octagon, a star, or the like. Among these, a circular shape is desirable for ease of formation of the opening 50. Moreover, the shape of the plurality of openings 50 may be one type alone, or a plurality of types may be combined.
  • the opening pitch of the openings 50 is desirably 10 to 10,000 ⁇ m, more desirably 25 to 2000 ⁇ m, and further desirably 250 to 2000 ⁇ m.
  • the opening pitch of the openings is less than 10 ⁇ m, the ratio of the openings increases in the entire shield layer. As a result, the shield layer becomes weak and the bending resistance is lowered.
  • the opening pitch of the openings exceeds 10,000 ⁇ m, the ratio of the openings is reduced in the entire shield layer. As a result, it becomes difficult for the volatile component to pass through the shield layer, and the volatile component tends to accumulate between the shield layer and the conductive adhesive layer. As a result, the interlayer adhesion between the shield layer and the conductive adhesive layer is likely to be broken, and the shield characteristics are also easily deteriorated.
  • the opening area of the opening 50 and the opening pitch satisfy the relationship of the following formula (1).
  • y represents the square root of the opening area ( ⁇ m 2 ), and x represents the opening pitch ( ⁇ m).
  • the measurement was performed by the evaluation in the MIT folding fatigue test specified in JIS P8115: 2001 and the KEC method.
  • the electromagnetic wave shielding characteristics of the electromagnetic wave shielding film at 200 MHz are improved.
  • the arrangement pattern of the openings 50 is not particularly limited.
  • the arrangement pattern shown below may be used.
  • 4 (a) to 4 (c) are plan views schematically showing an example of an arrangement pattern of openings in the shield layer constituting the electromagnetic wave shielding film of the present invention.
  • the arrangement pattern of the openings 50 is an arrangement pattern in which the center of each opening 50 is located at the apex of the equilateral triangle on a plane in which equilateral triangles are continuously arranged vertically and horizontally. There may be.
  • the array pattern of the openings 50 is an array pattern in which the center of the openings 50 is located at the apex of the square in a plane in which squares are continuously arranged vertically and horizontally. May be.
  • the arrangement pattern of the openings 50 is an arrangement pattern in which the center of the openings 50 is positioned at the apex of the regular hexagons on a plane in which regular hexagons are continuously arranged vertically and horizontally. It may be.
  • the thickness of the shielding layer 30 is desirably 0.5 ⁇ m or more, and more desirably 1.0 ⁇ m or more.
  • the thickness of the shield layer 30 is desirably 10 ⁇ m or less. When the thickness of the shield layer is less than 0.5 ⁇ m, the shield layer is too thin, and the shield characteristics are lowered.
  • the thickness of the shield layer 30 is 1.0 ⁇ m or more, the transmission characteristics are good in a signal transmission system that transmits a high-frequency signal having a frequency of 0.01 to 10 GHz.
  • the opening is not formed in the shield layer, when the shield layer becomes thick, when the shield printed wiring board is manufactured, the interlayer adhesion between the shield layer and the conductive adhesive layer is easily broken. .
  • the thickness of the shield layer 30 exceeds 1.0 ⁇ m, the interlaminar adhesion is significantly broken.
  • the opening 50 since the opening 50 is formed in the shield layer 30, it is possible to prevent the interlayer adhesion between the shield layer 30 and the conductive adhesive layer 20 from being broken. .
  • the electromagnetic wave shielding film of the present invention is preferably used in a signal transmission system that transmits a signal having a frequency of 0.01 to 10 GHz.
  • the shielding layer may be made of any material as long as it has electromagnetic wave shielding properties, for example, a metallic layer.
  • the shield layer may include a layer made of a material such as gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, or zinc, and preferably includes a copper layer. Copper is a suitable material for the shield layer from the viewpoint of conductivity and economy.
  • the shield layer may include a layer made of the metal alloy.
  • the shield layer may be formed by laminating a plurality of metal layers.
  • the shield layer preferably includes a copper layer and a silver layer.
  • FIG. 5 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention in which the shield layer is composed of a copper layer and a silver layer.
  • An electromagnetic wave shielding film 110 shown in FIG. 5 includes a conductive adhesive layer 120, a shield layer 130 laminated on the conductive adhesive layer 120, and an insulating layer 140 laminated on the shield layer 130.
  • the shield layer 130 includes a copper layer 132 and a silver layer 131.
  • the silver layer 131 is disposed on the insulating layer 140 side, and the copper layer 132 is disposed on the conductive adhesive layer 120 side.
  • the electromagnetic wave shielding film 110 having such a configuration can be easily manufactured by applying a silver paste to the insulating layer 140 so that the opening 150 is formed, forming a silver layer, and plating the silver layer with copper.
  • an anchor coat layer may be formed between the insulating layer and the shield layer.
  • Anchor coat layer materials include urethane resin, acrylic resin, core-shell type composite resin with urethane resin as shell and acrylic resin as core, epoxy resin, imide resin, amide resin, melamine resin, phenol resin, urea formaldehyde resin And blocked isocyanates obtained by reacting a polyisocyanate with a blocking agent such as phenol, polyvinyl alcohol, polyvinylpyrrolidone and the like.
  • a support film may be provided on the insulating layer side, and a peelable film may be provided on the conductive adhesive layer side.
  • a support film or a peelable film in the operation of transporting the electromagnetic wave shielding film of the present invention or manufacturing a shield printed wiring board using the electromagnetic wave shielding film of the present invention.
  • the electromagnetic wave shielding film of the present invention is easy to handle. Moreover, when arrange
  • the electromagnetic wave shielding film of the present invention may be used for any application as long as it aims to block electromagnetic waves.
  • the electromagnetic wave shielding film of the present invention is desirably used for a printed wiring board, particularly a flexible printed wiring board.
  • the electromagnetic wave shielding film of the present invention hardly accumulates volatile components between the shield layer and the conductive adhesive layer when producing a shield printed wiring board.
  • the electromagnetic wave shielding film of the present invention has sufficient bending resistance. Therefore, even if the electromagnetic wave shielding film of this invention is used for a flexible printed wiring board and it is repeatedly bent, it is hard to be damaged. Therefore, the electromagnetic wave shielding film of the present invention can be suitably used as an electromagnetic wave shielding film for flexible printed wiring boards.
  • the shield printed wiring board having the electromagnetic wave shielding film of the present invention is the shield printed wiring board of the present invention. That is, the shield printed wiring board of the present invention includes a base member on which a printed circuit is formed, a printed wiring board having an insulating film provided on the base member so as to cover the printed circuit, and the printed wiring board. A shield printed wiring board having an electromagnetic wave shielding film provided on the electromagnetic wave shielding film, wherein the electromagnetic wave shielding film is the electromagnetic wave shielding film of the present invention.
  • the printed wiring board is preferably a flexible printed wiring board.
  • the shield printed wiring board of the present invention has the electromagnetic wave shielding film of the present invention having sufficient bending resistance. Therefore, the shield printed wiring board of the present invention also has sufficient bending resistance.
  • the shield printed wiring board of the present invention is used by being incorporated in an electronic device.
  • the electronic device in which the shield printed wiring board of the present invention is incorporated in a folded state is the electronic device of the present invention.
  • the shield printed wiring board of the present invention has sufficient bending resistance. Therefore, even if it is incorporated in an electronic device in a bent state, it is not easily damaged. Therefore, the electronic device of the present invention can narrow the space for arranging the shield printed wiring board. Therefore, the electronic device of the present invention can be thinned.
  • the method for producing the electromagnetic wave shielding film 10 includes (1) a shield layer forming step, (2) an insulating layer forming step, and (3) a conductive adhesive layer forming step.
  • 6 (a) to 6 (c) are process diagrams schematically showing an example of the method for producing an electromagnetic wave shielding film of the present invention in order.
  • the opening 50 can be formed by punching, laser irradiation, or the like.
  • a resist having a pattern that forms the opening 50 may be disposed on the surface of the sheet 35 and the opening 50 may be formed by etching.
  • a conductive paste or a paste that functions as a plating catalyst may be printed on the surface of the sheet 35.
  • the opening 50 may be formed by printing with a predetermined pattern.
  • a fluid containing a metal composed of nickel, copper, chromium, zinc, gold, silver, aluminum, tin, cobalt, palladium, lead, platinum, cadmium, rhodium, or the like is used. it can.
  • the insulating layer 40 is formed by coating and curing the insulating layer resin composition 45 on one surface of the shield layer 30.
  • a method for coating the resin composition for the insulating layer conventionally known coating methods such as gravure coating method, kiss coating method, die coating method, lip coating method, comma coating method, blade coating method, roll coating method, knife coating method , Spray coating method, bar coating method, spin coating method, dip coating method and the like.
  • a method for curing the resin composition for an insulating layer various conventionally known methods can be employed depending on the type of the resin composition for the insulating layer.
  • the conductive adhesive layer composition 25 is formed on the surface of the shield layer 30 opposite to the surface on which the insulating layer 40 is formed.
  • the conductive adhesive layer 20 is formed by coating.
  • a conventionally known coating method such as a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a blade coating method, a roll coating method, Examples include knife coating, spray coating, bar coating, spin coating, and dip coating.
  • the electromagnetic wave shielding film 10 which is an example of the electromagnetic wave shielding film of this invention can be manufactured through the above process.
  • the method of manufacturing the electromagnetic wave shielding film 110 includes (1) an insulating layer preparation step, (2) a silver paste printing step, (3) a copper plating step, and (4) a conductive adhesive layer forming step.
  • FIG. 7 is process drawing which shows typically an example of the insulating layer preparatory process in the manufacturing method of the electromagnetic wave shield film of this invention.
  • an insulating layer 140 is prepared.
  • the insulating layer 140 can be prepared by a conventional method.
  • the silver paste can be printed by intaglio printing such as gravure printing, by relief printing such as flexographic printing, by screen printing, by offset printing by transferring a pattern formed on the intaglio, relief printing, or screen. Examples thereof include a method and a method by ink jet printing which does not require a plate. A method for printing a silver paste by gravure printing will be described below.
  • FIG. 8 to 10 are process diagrams schematically showing an example of a silver paste printing process in the method for producing an electromagnetic wave shielding film of the present invention.
  • a roll-shaped plate cylinder 70 having a plurality of columnar protrusions 72 formed on the surface is prepared.
  • the surface of the plate cylinder on which the protrusions 72 are not formed is a protrusion non-formation region 71.
  • the silver paste 133 is taken into the protrusion non-formation region 71. At this time, the silver paste 133 is prevented from being applied to the upper surface 73 of the protrusion 72.
  • the silver paste 133 is printed on one main surface of the insulating layer 140 by passing the insulating layer 140 between the impression cylinder 75 and the plate cylinder 70 into which the silver paste 133 is taken. .
  • the silver paste 133 is not printed on the portion of the insulating layer 140 where the protrusion 72 hits, and the opening 150 can be formed.
  • the silver paste 133 printed on the insulating layer 140 becomes the silver layer 131.
  • the silver paste 133 may contain various additives such as a dispersant, a thickener, a leveling agent, and an antifoaming agent.
  • the shape of the silver particles is not particularly limited, and a material having an arbitrary shape such as a spherical shape, a flake shape, a dendritic shape, a needle shape, or a fibrous shape can be used.
  • nano-sized particles are desirable. Specifically, silver particles having an average particle diameter in the range of 1 to 100 nm are desirable, and silver particles in the range of 1 to 50 nm are more desirable.
  • the “average particle diameter” means a volume average value obtained by diluting silver particles with a dispersion solvent and measuring by a dynamic light scattering method.
  • “Nanotrack UPA-150” manufactured by Microtrack Co. can be used.
  • the thickness of the silver layer formed by the silver paste to be printed is preferably 5 to 200 nm.
  • FIGS. 11A and 11B are process diagrams schematically showing an example of a copper plating process in the method for producing an electromagnetic wave shielding film of the present invention.
  • a copper layer 132 is formed on the silver layer 131 by plating copper on the silver layer 131.
  • the copper plating method is not particularly limited, and conventional electroless plating and electrolytic plating can be used.
  • a plating solution containing copper sulfate, a reducing agent, and a solvent such as an aqueous medium or an organic solvent When copper is plated by the electrolytic plating method, a plating solution containing copper sulfate, sulfuric acid, and an aqueous medium is used, and the plating processing time, current density, and plating are adjusted so that the desired copper thickness is obtained. It is desirable to adjust by controlling the amount of additives used.
  • the thickness of the copper to be plated is preferably 0.1 to 10 ⁇ m.
  • the shield layer 130 composed of the silver layer 131 and the copper layer 132 can be formed.
  • FIGS. 12A and 12B are process diagrams schematically showing an example of the conductive adhesive layer forming process in the method for producing an electromagnetic wave shielding film of the present invention.
  • FIGS. 12A and 12B FIG. 11B is turned upside down and the subsequent steps are illustrated.
  • a conductive adhesive layer 120 is formed by coating a conductive adhesive layer composition 125 on the copper layer 132.
  • a conventionally known coating method such as gravure coating method, kiss coating method, die coating method, lip coating method, comma coating method, blade coating method, roll coating method, Examples include knife coating, spray coating, bar coating, spin coating, and dip coating.
  • the electromagnetic wave shielding film 110 which is an example of the electromagnetic wave shielding film of this invention can be manufactured through the above process.
  • the area of the opening of the shield layer (square root of the area of the opening) is 79 ⁇ m 2 (8.89 ⁇ m), 1963 ⁇ m 2 (44.30 ⁇ m), 4418 ⁇ m 2 (66.47 ⁇ m), 7854 ⁇ m 2 (88.62 ⁇ m), 12272 ⁇ m.
  • the opening pitch is 10 ⁇ m, 50 ⁇ m, 100 ⁇ m
  • a total of 126 kinds of electromagnetic wave shielding films of 200 ⁇ m, 500 ⁇ m, 750 ⁇ m, 1000 ⁇ m, 1500 ⁇ m, 2000 ⁇ m, 3000 ⁇ m, 4000 ⁇ m, 5000 ⁇ m, 7500 ⁇ m, or 10,000 ⁇ m were produced by the following method.
  • the shape of the opening part of a shield layer is circular.
  • Insulating layer preparation step An insulating layer made of an epoxy resin having a thickness of 5 ⁇ m was prepared.
  • the thickness of the silver layer was 50 nm.
  • the silver paste obtained in Preparation Example 1 was used.
  • the shape of the openings is circular, and the arrangement pattern of the openings is an arrangement pattern in which the center of each opening is positioned at the apex of the equilateral triangle on a plane in which equilateral triangles are continuously arranged vertically and horizontally. .
  • the electroplating solution a solution of copper sulfate 70 g / liter, sulfuric acid 200 g / liter, chloride ion 50 mg / liter, Top Lucina SF (brightener manufactured by Okuno Pharmaceutical Co., Ltd.) 5 g / liter was used.
  • Conductive adhesive layer forming step On the copper layer, a conductive adhesive layer obtained by adding 20% by mass of Ag-coated Cu powder to a phosphorus-containing epoxy resin so as to have a thickness of 15 ⁇ m is coated, An electromagnetic shielding film was produced. As a coating method, a lip coat method was used.
  • MIT Folding Fatigue Tester manufactured by Yasuda Seiki Seisakusho Co., Ltd.
  • No. 307 MIT type folding resistance tester No. 307 MIT type folding resistance tester
  • the test conditions are as follows. Bending clamp tip R: 0.38mm Bending angle: ⁇ 135 ° Bending speed: 175 cpm
  • Load 500gf Detection method: Detects disconnection of shield film with built-in Dentsu device
  • FIG. 13 is a scatter diagram of the electromagnetic wave shielding film with the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch, and shows the evaluation of the bending resistance of the electromagnetic wave shielding film.
  • the symbol “ ⁇ ” indicates an electromagnetic wave shielding film in which no breakage occurs when the number of bendings is 600 in the evaluation of bending resistance.
  • “x” indicates an electromagnetic wave shielding film in which disconnection occurs when the number of bendings is less than 600 in the evaluation of bending resistance.
  • the bending resistance of the electromagnetic wave shielding film is improved when the relationship between y and x satisfies the following formula (1).
  • each electromagnetic wave shielding film was measured under the conditions of a temperature of 25 ° C. and a relative humidity of 30 to 50% using an electromagnetic wave shielding effect measuring device developed at the KEC Kansai Electronics Industry Promotion Center. It cut
  • FIG. FIG. 14 is a scatter diagram of the electromagnetic shielding film in which the vertical axis represents the square root of the opening area and the horizontal axis represents the opening pitch, and shows the evaluation of the electromagnetic shielding characteristics of the electromagnetic shielding film.
  • FIG. 14 is a scatter diagram of the electromagnetic shielding film in which the vertical axis represents the square root of the opening area and the horizontal axis represents the opening pitch, and shows the evaluation of the electromagnetic shielding characteristics of the electromagnetic shielding film.
  • the symbol “ ⁇ ” indicates an electromagnetic wave shielding film having an electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method of 85 dB or more.
  • “X” indicates an electromagnetic wave shielding film having an electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method of less than 85 dB.
  • the electromagnetic shielding characteristics of the electromagnetic shielding film are evaluated by the KEC method. Will be better. y ⁇ 0.38x (2)
  • FIG. 15 is a scatter diagram of an electromagnetic wave shielding film with the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch, and shows the evaluation of the bending resistance of the electromagnetic wave shielding film and the overall evaluation of the electromagnetic wave shielding characteristics. It is.
  • a symbol “ ⁇ ” indicates an electromagnetic wave shielding film in which the bending resistance is 600 times, no disconnection occurs, and the electromagnetic wave shielding property at 200 MHz measured by the KEC method is 85 dB or more.
  • “X” indicates an electromagnetic wave shielding film in which disconnection occurs when the number of bendings is less than 600 in the evaluation of bending resistance.
  • the electromagnetic wave shielding film indicated by a symbol “ ⁇ ” is an electromagnetic wave shielding film according to an example of the present invention
  • the electromagnetic wave shielding film indicated by a symbol “x” is an electromagnetic wave shielding film according to a comparative example of the present invention. It is.
  • an electromagnetic wave shielding film in which the relationship between y and x satisfies the relationship of the following formula (1) is an example of the present invention. This is an electromagnetic wave shielding film.
  • the delamination evaluation of the electromagnetic wave shielding film was performed by the following method. First, each electromagnetic wave shielding film was affixed on the printed wiring board by hot press. Next, this shield printed wiring board was left in a clean room at 23 ° C. and 63% RH for 7 days, and then exposed to the temperature conditions during reflow for 30 seconds to evaluate the presence or absence of delamination. As the temperature condition at the time of reflow, a temperature profile of 265 ° C. at maximum was set assuming lead-free solder. Further, the presence or absence of delamination was observed by visually observing the presence or absence of swelling by passing the shield printed wiring board through atmospheric reflow five times. The results are shown in FIG. FIG.
  • FIG. 16 is a scatter diagram of the electromagnetic wave shielding film in which the vertical axis is the square root of the opening area and the horizontal axis is the opening pitch, and is a diagram showing the delamination evaluation of the electromagnetic wave shielding film.
  • ⁇ indicates an electromagnetic wave shielding film that is not swollen in the delamination evaluation.
  • X indicates an electromagnetic wave shielding film in which swelling occurs in the delamination evaluation.
  • FIG. 17 is a scatter diagram of an electromagnetic wave shielding film having the vertical axis as the square root of the opening area and the horizontal axis as the opening pitch. Evaluation of the bending resistance of the electromagnetic wave shielding film, evaluation of the electromagnetic wave shielding characteristics, and delamination evaluation It is a figure which shows comprehensive evaluation of.
  • the symbol “ ⁇ ” indicates that no breakage occurs when the number of bendings is 600 in the evaluation of bending resistance, the electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method is 85 dB or more, and the swelling is delaminated in the delamination evaluation. The electromagnetic wave shielding film which has not occurred is shown.
  • the symbol “ ⁇ ” indicates that no breakage occurs when the number of bendings is 600 in the evaluation of bending resistance
  • the electromagnetic wave shielding characteristic at 200 MHz measured by the KEC method is 85 dB or more
  • the swelling is delaminated in the delamination evaluation.
  • the electromagnetic wave shielding film which produced is shown.
  • “X” indicates an electromagnetic wave shielding film in which disconnection occurs when the number of bendings is less than 600 in the evaluation of bending resistance.
  • Electromagnetic wave shielding film 10, 110 Electromagnetic wave shielding film 20, 120 Conductive adhesive layer 25, 125 Conductive adhesive layer composition 30, 130 Shield layer 40, 140 Insulating layer 45 Insulating layer resin composition 50, 150 Opening 70 Plate cylinder 71 Protruding part non-formation region 72 Protruding part 73 Upper surface 75 of the projecting part Pressure drum 80 Electromagnetic wave shielding effect measuring device 83 Measuring jig 84 Center conductor 91 Spectrum analyzer 92, 93 Attenuator 94 Preamplifier 131 Silver layer 132 Copper layer 133 Silver paste

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
PCT/JP2018/004112 2017-02-08 2018-02-07 電磁波シールドフィルム、シールドプリント配線板及び電子機器 WO2018147301A1 (ja)

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CN201880009007.6A CN110199583B (zh) 2017-02-08 2018-02-07 电磁波屏蔽膜、屏蔽印制线路板及电子设备
JP2018535440A JP6404534B1 (ja) 2017-02-08 2018-02-07 電磁波シールドフィルム、シールドプリント配線板及び電子機器

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CN113545180A (zh) * 2019-03-22 2021-10-22 拓自达电线株式会社 电磁波屏蔽膜
WO2021212479A1 (zh) * 2020-04-24 2021-10-28 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法

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TW201836465A (zh) 2018-10-01
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CN110199583B (zh) 2020-12-22
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