JP6404534B1 - 電磁波シールドフィルム、シールドプリント配線板及び電子機器 - Google Patents

電磁波シールドフィルム、シールドプリント配線板及び電子機器 Download PDF

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Publication number
JP6404534B1
JP6404534B1 JP2018535440A JP2018535440A JP6404534B1 JP 6404534 B1 JP6404534 B1 JP 6404534B1 JP 2018535440 A JP2018535440 A JP 2018535440A JP 2018535440 A JP2018535440 A JP 2018535440A JP 6404534 B1 JP6404534 B1 JP 6404534B1
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JP
Japan
Prior art keywords
electromagnetic wave
wave shielding
shielding film
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018535440A
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English (en)
Japanese (ja)
Other versions
JPWO2018147301A1 (ja
Inventor
上農　憲治
憲治 上農
志朗 山内
志朗 山内
白髪　潤
潤 白髪
村川　昭
昭 村川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
DIC Corp
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp, Tatsuta Electric Wire and Cable Co Ltd filed Critical DIC Corp
Application granted granted Critical
Publication of JP6404534B1 publication Critical patent/JP6404534B1/ja
Publication of JPWO2018147301A1 publication Critical patent/JPWO2018147301A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/18—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by an internal layer formed of separate pieces of material which are juxtaposed side-by-side
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2018535440A 2017-02-08 2018-02-07 電磁波シールドフィルム、シールドプリント配線板及び電子機器 Active JP6404534B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017021650 2017-02-08
JP2017021650 2017-02-08
PCT/JP2018/004112 WO2018147301A1 (ja) 2017-02-08 2018-02-07 電磁波シールドフィルム、シールドプリント配線板及び電子機器

Publications (2)

Publication Number Publication Date
JP6404534B1 true JP6404534B1 (ja) 2018-10-10
JPWO2018147301A1 JPWO2018147301A1 (ja) 2019-02-14

Family

ID=63107549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018535440A Active JP6404534B1 (ja) 2017-02-08 2018-02-07 電磁波シールドフィルム、シールドプリント配線板及び電子機器

Country Status (5)

Country Link
JP (1) JP6404534B1 (zh)
KR (1) KR102256655B1 (zh)
CN (1) CN110199583B (zh)
TW (1) TWI761446B (zh)
WO (1) WO2018147301A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783014A (zh) * 2018-11-26 2020-02-11 广州方邦电子股份有限公司 导电胶膜、线路板及导电胶膜的制备方法
CN113545180A (zh) * 2019-03-22 2021-10-22 拓自达电线株式会社 电磁波屏蔽膜
WO2021212479A1 (zh) * 2020-04-24 2021-10-28 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196285A (ja) * 1998-12-25 2000-07-14 Sumitomo Rubber Ind Ltd 透光性電磁波シ―ルド部材およびその製造方法
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
WO2014192494A1 (ja) * 2013-05-29 2014-12-04 タツタ電線株式会社 電磁波シールドフィルム、それを用いたプリント配線板、及び圧延銅箔

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4647924B2 (ja) * 2004-03-23 2011-03-09 タツタ電線株式会社 プリント配線板用シールドフィルム及びその製造方法
JP5498032B2 (ja) * 2009-02-17 2014-05-21 富士フイルム株式会社 微細構造体の製造方法および微細構造体
TWI444132B (zh) * 2011-12-08 2014-07-01 Ind Tech Res Inst 電磁波屏蔽複合膜及具有該複合膜之軟性印刷電路板
TWI488280B (zh) * 2012-11-21 2015-06-11 Ind Tech Res Inst 電磁波屏蔽結構及其製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000196285A (ja) * 1998-12-25 2000-07-14 Sumitomo Rubber Ind Ltd 透光性電磁波シ―ルド部材およびその製造方法
JP2004273577A (ja) * 2003-03-06 2004-09-30 Sumitomo Electric Printed Circuit Inc シールドフィルムおよびその製造方法
WO2014192494A1 (ja) * 2013-05-29 2014-12-04 タツタ電線株式会社 電磁波シールドフィルム、それを用いたプリント配線板、及び圧延銅箔

Also Published As

Publication number Publication date
CN110199583A (zh) 2019-09-03
JPWO2018147301A1 (ja) 2019-02-14
WO2018147301A1 (ja) 2018-08-16
KR20190116972A (ko) 2019-10-15
TW201836465A (zh) 2018-10-01
TWI761446B (zh) 2022-04-21
CN110199583B (zh) 2020-12-22
KR102256655B1 (ko) 2021-05-25

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