WO2018146904A1 - 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置 - Google Patents

蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置 Download PDF

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Publication number
WO2018146904A1
WO2018146904A1 PCT/JP2017/041960 JP2017041960W WO2018146904A1 WO 2018146904 A1 WO2018146904 A1 WO 2018146904A1 JP 2017041960 W JP2017041960 W JP 2017041960W WO 2018146904 A1 WO2018146904 A1 WO 2018146904A1
Authority
WO
WIPO (PCT)
Prior art keywords
mask
frame
vapor deposition
joining member
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/041960
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English (en)
French (fr)
Japanese (ja)
Inventor
元嗣 成谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Priority to CN201780086024.5A priority Critical patent/CN110268090B/zh
Publication of WO2018146904A1 publication Critical patent/WO2018146904A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Definitions

  • the present invention relates to an evaporation mask, an evaporation mask manufacturing method, and an evaporation mask manufacturing apparatus.
  • a technique is generally used in which a film forming material is attached to a predetermined position on a substrate by a vapor deposition method or the like through a mask. Yes.
  • a film forming material is attached to a predetermined position on a substrate by a vapor deposition method or the like through a mask.
  • red, green, and blue organic EL elements are formed on a substrate by mask vapor deposition.
  • an opening corresponding to a pattern to be formed is formed, but the mask may be fixed to a frame during film formation (see, for example, Patent Document 1).
  • the bonding strength between the mask and the frame may be a problem.
  • one of the objects of the present invention is to realize a sufficient bonding strength between the mask and the frame.
  • the vapor deposition mask includes a pattern body in which a pattern opening is formed and a mask body having a frame portion surrounding the pattern portion, and a mask frame that supports the frame portion.
  • the mask body has an end surface intersecting the mask frame, and the mask body is fixed and welded to the mask frame at the end surface.
  • the mask frame includes a mask frame base material and a joining member disposed on a side of the mask frame base material on which the mask body is disposed, and the mask body includes the mask body. Fixed and welded.
  • the thickness of the joining member is 0.2 mm or less.
  • the mask frame holds a plurality of the mask bodies.
  • the mask body is an electroformed mask.
  • a thin portion having a thickness thinner than other portions of the frame portion is formed on an outer edge of the frame portion, and a portion including an end surface of the thin portion is fixed and welded to the mask frame.
  • the joining member may be thinner than the thin portion.
  • the vapor deposition mask includes a mask body having a pattern part in which a pattern opening is formed and a frame part surrounding the pattern part, and a mask frame for fixing the frame part
  • the mask frame includes: A mask frame base material and a mask member that is disposed on a side of the mask frame base material on which the mask main body is disposed, and is in contact with the mask main body, and the rigidity of the joint member is lower than the rigidity of the frame portion
  • the frame portion has a side surface that intersects with the joining member, and the side surface is a first region and a plurality of second regions that are dotted and have a surface rougher than the surface of the first region. And have.
  • a method for manufacturing a vapor deposition mask is provided.
  • a mask body having a pattern part in which a pattern opening is formed and a frame part surrounding the pattern part is disposed on a mask frame that supports the frame part of the mask body, and Welding a portion including the end face of the frame portion to the mask frame in this order.
  • the mask main body is welded to the mask frame by irradiating the end surface of the frame of the mask main body with a laser.
  • the mask frame includes a mask frame base material and a joining member disposed on a side of the mask frame base material on which the mask main body is disposed, and the mask main body is connected to the joining member. Weld to.
  • an evaporation mask manufacturing apparatus is provided.
  • the mask frame is placed in a state in which a mask body having a pattern portion in which a pattern opening is formed and a frame portion surrounding the pattern portion is disposed on a mask frame that supports the frame portion of the mask body.
  • a mask frame holding portion to hold and a welding unit for welding the mask main body to the mask frame, and the welding unit welds a portion including an end surface of the frame portion of the mask main body to the mask frame.
  • the welding unit has a laser irradiation part.
  • the mask frame includes a mask frame base material and a joining member disposed on a side of the mask frame base material on which the mask main body is disposed, and the welding unit includes the joining member.
  • the mask body is welded.
  • FIG. 1 is a schematic plan view of a vapor deposition mask in one embodiment of the present invention
  • FIG. 2 is a partially enlarged sectional view of the vapor deposition mask of FIG. 1
  • FIG. 3 is an example of a method of using the vapor deposition mask of FIG. It is a schematic sectional drawing shown.
  • the vapor deposition mask 1 includes a mask body 10 and a mask frame 20 that supports the mask body 10.
  • the mask frame 20 includes a mask frame base material 21 and a joining member 22 disposed on the side of the mask frame base material 21 on which the mask main body 10 is disposed.
  • the mask frame base 21 and the joining member 22 are joined (for example, partially by welding).
  • the mask frame base material 21 and the joining member 22 are made of, for example, invar (invar alloy).
  • the mask body 10 has a pattern portion 11 in which a pattern opening is formed and a frame portion 12 surrounding the pattern portion 11, and is supported and fixed to the mask frame 20 in the frame portion 12.
  • the shape and pattern opening of the pattern unit 11 correspond to, for example, the panel unit of the display device to be manufactured.
  • the pattern opening of the pattern unit 11 corresponds to the pattern of the light emitting layer of the panel unit of the organic EL display device to be manufactured.
  • the pattern portion 11 can be formed by any appropriate method. Specifically, it may be formed by electroforming or may be formed by etching. In the present embodiment, the pattern portion 11 includes a plated portion (for example, a Ni plated portion having a thickness of about 5 ⁇ m to 20 ⁇ m) formed by electroforming.
  • the frame portion 12 is made of, for example, invar (invar alloy).
  • the mask body 10 is an electroformed mask. According to the electroformed mask, for example, more accurate pattern deposition can be achieved.
  • the frame portion 12 has a mask frame 20, more specifically, a joining member 22, and an end surface 12a (also referred to as a side surface) that intersects.
  • a portion including the end surface 12 a of the frame portion 12 is welded to the mask frame 20.
  • a welded portion 13 in which the frame portion 12 and the mask frame 20 are fused and integrated (a fixed spot, a welding mark, a spot having a rougher surface than the other regions of the end surface 12a). Region) is formed.
  • the welded portion 13 does not reach the mask frame base material 21, and the end of the welded portion 13 is located in the joining member 22.
  • laser welding is typically used.
  • the mask main body 10 is placed at a predetermined position on the mask frame 20, and welding is performed by irradiating the end surface 12 a of the frame portion 12 of the mask main body 10 and the mask frame 20 with laser. Specifically, welding is performed by irradiating a corner portion formed by the end surface 12 a of the frame portion 12 of the mask body 10 and the mask frame 20 with a laser. In this way, by welding at the end surface 12a of the frame portion 12, energy necessary for welding can be directly applied to both the frame portion 12 and the mask frame 20, and welding is prevented and sufficient bonding is achieved. Strength can be obtained. Moreover, the energy amount required for welding can be suppressed, and the bad influence by the swelling of the welding part formed can be suppressed.
  • the welding location (welding location when seen planarly) of the mask main body 10 and the number of welding locations can be determined as appropriate. For example, it can be appropriately determined according to the size of the mask body 10.
  • the thickness of the frame portion 12 is set within a range of 0.5 mm to 1 mm, for example.
  • a thin portion 12b having a thickness smaller than other portions is formed on the outer edge of the frame portion 12, and the mask body 10 is welded to the mask frame 20 at the end surface 12a of the thin portion 12b.
  • the mask frame 20 is formed with two windows 20a corresponding to the shape of the mask main body 10.
  • the existing mask body 10 can be used even in a form in which the size of the substrate to be deposited is larger than that of the mask body 10.
  • the size of the window portion 20 a of the mask frame 20 is designed to be larger than the pattern portion 11 of the mask body 10.
  • the thickness of the mask frame 20 is, for example, 2 mm to 10 mm.
  • two mask bodies 10 are fixed to the mask frame 20, but the number is not limited to two, and three or more mask bodies 10 may be fixed to the mask frame 20.
  • the mask frame 20 includes the mask frame base material 21 and the joining member 22, and the mask body 10 is welded to the joining member 22.
  • the rigidity of the vapor deposition mask 1 can be lowered by using the joining member 22.
  • the adhesion of the deposition mask 1 to the substrate is improved, and the wraparound of the deposition material between the deposition mask 1 and the substrate is suppressed, Highly accurate pattern deposition can be realized.
  • the thickness of the joining member 22 is set to be thinner than the thickness of the mask body 10 (frame portion 12). For example, it is 0.2 mm or less. It is because the rigidity of the vapor deposition mask 1 obtained can be reduced effectively.
  • the thickness of the joining member 22 is desirably thinner than the thickness of the thin portion 12b. Therefore, the rigidity of the joining member 22 is lower than the rigidity of the frame portion 12, more specifically, than the rigidity of the mask body 10.
  • the thickness of the joining member 22 is, for example, 0.05 mm or more. For example, it is for securing the fixing strength with respect to the mask main body 10 and the mask frame base material 21.
  • the thickness of the bonding member 22 is thinner than the mask main body 10 (frame portion 12) (particularly when the thickness of the bonding member 22 is 0.2 mm or less and the thickness difference from the mask main body 10 (frame portion 12) is large). Even if it exists, the energy required for welding can be made to act directly on both the frame part 12 and the mask frame 20 by welding with the end surface 12a of the frame part 12 as mentioned above. As a result, while obtaining sufficient joint strength, the amount of energy required for welding can be suppressed and the welded portion can be prevented from penetrating the joining member 22. In addition, when a welding part penetrates the joining member 22, possibility that malfunctions, such as the mask frame base material 21 splashing and sufficient joining strength not being produced, will arise.
  • the vapor deposition mask 1 held by pins or the like on the transfer frame 2 from the mask frame 20 side is disposed so as to face the film formation surface of the substrate 3 to be formed.
  • a film forming material is attached to the substrate 3 from the vapor deposition mask 1 side by, for example, vapor deposition, sputtering, or the like.
  • substrate 3 is arrange
  • the film may be formed on the substrate 3 having a predetermined layer formed on the surface in advance.
  • the substrate 3 may be supported by a support plate during film formation.
  • FIG. 4 is a schematic diagram showing the overall configuration of the vapor deposition mask manufacturing apparatus 50 according to one embodiment of the present invention. Specifically, FIG. 4 is a view of the vapor deposition mask manufacturing apparatus 50 as viewed from the side.
  • the vapor deposition mask manufacturing apparatus 50 includes a mask frame holding unit 51, a reference glass 53, a camera 54, an alignment stage 56, and a welding unit 58.
  • the mask frame 20 is held by the mask frame holding unit 51 between the reference glass 53 and the alignment stage 56.
  • a reference glass 53 fixed to the upper part of the vapor deposition mask manufacturing apparatus 50 is provided with a reference mark 53 a that serves as a reference for alignment between the mask body 10 and the mask frame 20.
  • the mask body 10 is provided with an alignment mark, and the alignment between the mask body 10 and the mask frame 20 is performed by aligning the alignment mark with the reference mark 53a.
  • the camera 54 is provided above the reference glass 53 and is configured to be movable.
  • the camera 54 measures the relative positional relationship between the reference mark 53a and the alignment mark of the mask body 10 by imaging the reference mark 53a from directly above.
  • one camera 54 sequentially moves directly above the reference mark 53a to capture the reference mark 53a and the alignment mark of the mask body 10, but a plurality of cameras may be provided. Good.
  • the alignment stage 56 provided in the lower part of the vapor deposition mask manufacturing apparatus 50 includes a placement unit 56a on which the mask body 10 is placed, and a surface along the placement surface of the mask body 10 placed on the placement unit 56a. And an alignment mechanism 56b that performs alignment by moving the inside.
  • the mounting portion 56a may be configured by a plurality of lift pins, or may be configured by a single mounting table.
  • the alignment mechanism 56b is composed of, for example, an actuator and a drive motor.
  • the alignment stage 56 moves the mask body 10 placed on the placement portion 56a by the alignment mechanism 56b in accordance with the relative positional relationship between the reference mark 53a measured by the camera 54 and the alignment mark of the mask body 10. Perform alignment.
  • the alignment stage 56 is provided for each mask body 10, but one alignment stage may be shared by a plurality of mask bodies.
  • the welding unit 58 welds the mask body 10 to the mask frame 20 after aligning the mask body 10 and the mask frame 20.
  • the welding unit 58 typically has a laser irradiation unit. As shown in FIG. 2, the welding unit 58 is controlled so as to be welded to the mask frame 20 at the end face 12 a of the mask main body 10.
  • the present invention is not limited to the above embodiment, and various modifications can be made.
  • it can be replaced with a configuration that is substantially the same as the configuration described in the above embodiment, a configuration that exhibits the same effects, or a configuration that can achieve the same purpose.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
PCT/JP2017/041960 2017-02-10 2017-11-22 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置 Ceased WO2018146904A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780086024.5A CN110268090B (zh) 2017-02-10 2017-11-22 蒸镀掩模、蒸镀掩模的制造方法及蒸镀掩模的制造装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-022874 2017-02-10
JP2017022874A JP6904718B2 (ja) 2017-02-10 2017-02-10 蒸着マスク、蒸着マスクの製造方法および蒸着マスクの製造装置

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WO2018146904A1 true WO2018146904A1 (ja) 2018-08-16

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JP (1) JP6904718B2 (enExample)
CN (1) CN110268090B (enExample)
WO (1) WO2018146904A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110872685A (zh) * 2018-09-03 2020-03-10 三星显示有限公司 沉积掩膜及其制造方法
WO2020158236A1 (ja) * 2019-02-01 2020-08-06 株式会社ジャパンディスプレイ 蒸着マスク及び蒸着マスクの製造方法
CN115349032A (zh) * 2020-04-08 2022-11-15 株式会社V技术 蒸镀掩模用框架、带框架蒸镀掩模以及蒸镀方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220068327A (ko) * 2020-11-18 2022-05-26 삼성디스플레이 주식회사 마스크 어셈블리 및 그 마스크 어셈블리의 제조 방법
JP7737833B2 (ja) * 2021-06-30 2025-09-11 株式会社Magnolia White 蒸着マスク

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Publication number Priority date Publication date Assignee Title
JP2006322015A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd メタルマスク用フレーム及びその製造方法
JP2014062327A (ja) * 2009-12-14 2014-04-10 Samsung Display Co Ltd 蒸着用マスク、その製造方法及び製造装置
JP2015010270A (ja) * 2013-07-02 2015-01-19 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法

Family Cites Families (3)

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JP6168944B2 (ja) * 2013-09-20 2017-07-26 株式会社ブイ・テクノロジー 成膜マスク
JP6357312B2 (ja) * 2013-12-20 2018-07-11 株式会社ブイ・テクノロジー 成膜マスクの製造方法及び成膜マスク
CN117821896A (zh) * 2015-07-17 2024-04-05 凸版印刷株式会社 蒸镀用金属掩模以及蒸镀用金属掩模的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006322015A (ja) * 2005-05-17 2006-11-30 Dainippon Printing Co Ltd メタルマスク用フレーム及びその製造方法
JP2014062327A (ja) * 2009-12-14 2014-04-10 Samsung Display Co Ltd 蒸着用マスク、その製造方法及び製造装置
JP2015010270A (ja) * 2013-07-02 2015-01-19 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110872685A (zh) * 2018-09-03 2020-03-10 三星显示有限公司 沉积掩膜及其制造方法
CN110872685B (zh) * 2018-09-03 2024-05-14 三星显示有限公司 沉积掩膜及其制造方法
WO2020158236A1 (ja) * 2019-02-01 2020-08-06 株式会社ジャパンディスプレイ 蒸着マスク及び蒸着マスクの製造方法
CN113330135A (zh) * 2019-02-01 2021-08-31 株式会社日本显示器 蒸镀掩模和蒸镀掩模的制造方法
CN113330135B (zh) * 2019-02-01 2023-12-26 株式会社日本显示器 蒸镀掩模和蒸镀掩模的制造方法
CN115349032A (zh) * 2020-04-08 2022-11-15 株式会社V技术 蒸镀掩模用框架、带框架蒸镀掩模以及蒸镀方法

Also Published As

Publication number Publication date
JP6904718B2 (ja) 2021-07-21
CN110268090A (zh) 2019-09-20
JP2018127704A (ja) 2018-08-16
CN110268090B (zh) 2021-08-20

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