WO2018142740A1 - Interposeur et dispositif électronique - Google Patents

Interposeur et dispositif électronique Download PDF

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Publication number
WO2018142740A1
WO2018142740A1 PCT/JP2017/043004 JP2017043004W WO2018142740A1 WO 2018142740 A1 WO2018142740 A1 WO 2018142740A1 JP 2017043004 W JP2017043004 W JP 2017043004W WO 2018142740 A1 WO2018142740 A1 WO 2018142740A1
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WO
WIPO (PCT)
Prior art keywords
interposer
terminal electrode
connection terminal
element body
circuit board
Prior art date
Application number
PCT/JP2017/043004
Other languages
English (en)
Japanese (ja)
Inventor
浩和 矢▲崎▼
啓人 米森
貴紀 土屋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201790001573.3U priority Critical patent/CN210692812U/zh
Publication of WO2018142740A1 publication Critical patent/WO2018142740A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to an interposer mounted on a circuit board and used by connecting a flat cable or the like, and more particularly to an interposer capable of connecting a plurality of flat cables or the like.
  • the present invention also relates to an electronic device using the interposer of the present invention, and more particularly, to an electronic device having a small area on a circuit board required for connecting a plurality of flat cables and the like.
  • a flat cable may be used to connect a circuit board and a circuit board that are arranged apart from each other.
  • FIG. 14A is a side cross-sectional view of the electronic device 1400.
  • FIG. 14B is a plan cross-sectional view of the electronic device 1400.
  • two circuit boards (mounting circuit boards) 102 and a battery pack 103 are accommodated in a housing (equipment housing) 101. More specifically, one circuit board 102, the battery pack 103, and the other circuit board 102 are accommodated side by side in this order.
  • Electronic components (IC chips, mounting components) 104 are mounted on the two circuit boards 102, respectively.
  • a coaxial connector 105 for connecting a flat cable 106 described later is mounted on each of the two circuit boards 102.
  • the two circuit boards 102 arranged apart from each other are connected by a flat cable 106. More specifically, a coaxial connector 107 is connected to both ends of the flat cable 106, one coaxial connector 107 is connected to the coaxial connector 105 mounted on one circuit board 102, and the other coaxial connector is connected. 107 is connected to a coaxial connector 105 mounted on the other circuit board 102.
  • the flat cable 106 is formed in multiple layers, and has a structure in which a signal conductor and a ground conductor wider than the signal conductor are vertically stacked with an insulating layer interposed therebetween.
  • the signal conductor and the ground conductor are each made of, for example, copper (copper foil).
  • the flat cable 106 has a certain degree of flexibility.
  • the electronic device 1400 has two circuit boards 102 connected by a flat cable 106.
  • some electronic devices may include a large number (three or more) of circuit boards, and the circuit boards may be connected to each other by a flat cable. In such an electronic device, it is necessary to connect a plurality of flat cables to one circuit board.
  • a plurality of flat cables are connected to one circuit board by connecting the coaxial connector 105 mounted on the circuit board 102 and the coaxial connector 107 provided at the end of the flat cable 106 as in the electronic device 1400. When trying to do so, it is necessary to mount a plurality of coaxial connectors 105 on the circuit board 102.
  • the coaxial connectors 105 and 107 are mechanical structures manufactured by mechanically processing a metal plate such as phosphor bronze, and have a large dimension in the plane direction and a dimension in the height direction. Therefore, when trying to mount a plurality of coaxial connectors 105 on the circuit board 102, there is a problem that a large area (region) for mounting is required for the circuit board 102. Further, since the coaxial connector 107 is connected to each of the plurality of mounted coaxial connectors 105, there is a problem that a large space for arranging the coaxial connectors 105 and 107 is required on the circuit board 102. As a result, there is a problem that the circuit board 102 is enlarged and the electronic device itself is also enlarged.
  • the interposer of the present invention includes a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface.
  • a second connection terminal electrode, and a mounting terminal electrode provided on the bottom surface and connected to the circuit board via a conductive bonding material.
  • a wiring member such as a flat cable, a substrate, an electronic component, or the like can be connected to the first connection terminal electrode and the second connection terminal electrode.
  • a wiring member it is not restricted to a flat cable, You may connect a general lead wire etc.
  • the element body can be, for example, a rectangular parallelepiped and has four side surfaces.
  • a second connection terminal electrode may be provided on each of two or more side surfaces.
  • a second flat cable can be connected to each second connection terminal electrode.
  • the element body can be made of ceramic, for example. In this case, an interposer with excellent heat resistance can be produced.
  • the element body is preferably a laminated element body in which insulator layers are laminated.
  • a wiring electrode is constituted by a via-hole conductor formed so as to penetrate between both main surfaces of the insulator layer and a line conductor formed between the layers of the insulator layer, and the first connection is made by the wiring electrode. Necessary connection among the terminal electrode for mounting, the terminal electrode for second connection, and the terminal electrode for mounting can be performed.
  • the second connection terminal electrode can be formed by a divided cross section of the via-hole conductor provided in the insulator layer. In this case, the second connection terminal electrode can be easily formed.
  • a metal shield be formed on the outer surface of the element body.
  • the metal shield can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside.
  • a metal shield is formed on the entire surface or a part of at least one side surface of the element body. It is also preferable that a metal shield is formed on the entire surface or a part of at least one side surface where the second connection terminal electrode is not formed. Moreover, it is also preferable that a metal shield is formed on a portion where the second connection terminal electrode is not formed on at least one side surface where the second connection terminal electrode is formed. Furthermore, it is also preferable that the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body. In these cases, noise emission and penetration can be effectively suppressed.
  • the element body is made of a magnetic material.
  • the interposer can have a function of a so-called magnetic bead inductor (a ferrite bead inductor when the magnetic material is ferrite) that suppresses the passage of noise.
  • the element body may be made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer may be made of a magnetic substance. That is, even if the entire element body is not a magnetic body, the element body is a laminated element body in which a plurality of insulator layers are stacked, and even if a part of the insulator layer is a magnetic body, a magnetic bead inductor ( When the magnetic material is ferrite, the function of a ferrite bead inductor) can be provided.
  • the electronic device of the present invention includes a base body of an insulator having a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface, a first connection terminal electrode provided on the top surface,
  • a surface-mount type interposer including a second connection terminal electrode provided on a side surface and a mounting terminal electrode provided on a bottom surface, a circuit board, a first wiring member, and a second wiring member;
  • the mounting terminal electrode of the interposer is connected to the circuit board via the conductive bonding material, and the first wiring member is connected to the first connection terminal electrode of the interposer via the conductive bonding material,
  • the second wiring member may be connected to the second connection terminal electrode of the interposer via a conductive bonding material.
  • At least one of the first wiring member and the second wiring member is a flat cable. In this case, the connection of the wiring member to the connection terminal is facilitated.
  • a metal shield is formed on the side surface of the interposer, and an electronic component is mounted on the circuit board adjacent to the side surface on which the metal shield of the interposer is formed, and the metal shield is positioned higher than the height of the electronic component from the bottom surface. It is also preferable that the side surface is covered. In this case, it is possible to effectively suppress the noise radiated by the interposer from entering and affecting adjacent electronic components and the noise radiated by the adjacent electronic components from entering and affecting the interposer. can do.
  • a metal shield is formed on the side surface of the interposer and the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body. Also in this case, it is possible to effectively suppress noise emission from the interposer and noise intrusion into the interposer.
  • the interposer of the present invention can connect a wiring member such as a plurality of flat cables, a substrate, an electronic component, and the like. That is, for example, a first wiring member such as a flat cable is connected to the first connection terminal electrode provided on the top surface, and a second wiring such as a flat cable is connected to the second connection terminal electrode provided on the side surface. Members can be connected. Therefore, if the interposer of the present invention is used, a plurality of wiring members and the like can be connected to the circuit board without requiring a large area (region). In addition, when connecting a wiring member, it is not restricted to a flat cable, You may connect a general lead wire.
  • the electronic device of the present invention uses the interposer of the present invention, the area on the circuit board required for connecting wiring members such as a plurality of flat cables, substrates, electronic components, and the like is small. Therefore, in the electronic device of the present invention, the circuit board is not enlarged, and the electronic device itself is not enlarged.
  • FIG. 1 is a perspective view showing an interposer 100 according to Embodiment 1.
  • FIG. It is sectional drawing of the interposer 100, and has shown the dashed-dotted line XX part of FIG.
  • FIGS. 3A and 3B are perspective views of main parts showing the electronic apparatus 200 according to the first embodiment.
  • 4A to 4D are cross-sectional views showing steps performed in an example of a method for manufacturing the interposer 100.
  • FIGS. 5A and 5B are perspective views of main parts showing the electronic apparatus 400 according to the second embodiment.
  • FIGS. 6A and 6B are perspective views illustrating main parts of an electronic apparatus 600 according to the third embodiment.
  • FIG. 7A is a perspective view of an interposer 700 according to the fourth embodiment.
  • FIG. 7B is a plan view of the interposer 700.
  • FIG. 7C is a cross-sectional view of the interposer 700. It is a perspective view of the interposer 800 concerning Embodiment 5. FIG. It is a perspective view of the interposer 900 concerning Embodiment 6. FIG. It is a perspective view of the electronic device 1000 concerning Embodiment 7.
  • FIG. 11A is a perspective view of an interposer 1100 according to the eighth embodiment.
  • FIG. 11B is a cross-sectional view of the interposer 1100.
  • FIG. 12A is a perspective view of an interposer 1200 according to the ninth embodiment.
  • FIG. 12B is a cross-sectional view of the interposer 1200.
  • FIG. 13A is a perspective view of an interposer 1300 according to the tenth embodiment.
  • FIG. 13B is an exploded perspective view of the interposer 1300.
  • FIG. 14A is a side cross-sectional view of the electronic device 1400 disclosed in Patent Document 1.
  • FIG. FIG. 14B is a plan cross
  • each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
  • FIGS. 3A and 3B are perspective views showing main parts of the electronic device 200, respectively.
  • the interposer 100 includes a rectangular parallelepiped element body 1.
  • the element body 1 has a structure in which four insulating layers 1a to 1d are laminated.
  • the element body 1 (insulator layers 1a to 1c) is made of a ceramic such as LTCC (Low Temperature Co-fired Ceramics).
  • the element body 1 includes a top surface T, a bottom surface B, and four side surfaces S1, S2, S3, and S4.
  • Via hole conductors 2 are formed through the insulator layers 1a to 1d.
  • a line conductor 3 is formed between the insulator layers 1a to 1d as necessary.
  • a wiring electrode is formed inside the element body 1 using the via-hole conductor 2 and the line conductor 3.
  • the via-hole conductor 2 and the line conductor 3 are each formed of a metal whose main component is, for example, silver or copper.
  • a mounting terminal electrode 4 is formed on the bottom surface B of the element body 1.
  • the mounting terminal electrode 4 is formed of, for example, a metal whose main component is silver or copper.
  • connection terminal electrode (first connection terminal electrode) 5 connected to a flat cable or the like is formed on the top surface T of the element body 1.
  • the connection terminal electrode 5 is made of, for example, a metal whose main component is silver or copper.
  • connection terminal electrode (second connection terminal electrode) 6 connected to a flat cable or the like is formed on one side surface S1 of the element body 1.
  • the connection terminal electrode 6 is made of, for example, a metal whose main component is silver or copper.
  • the connection terminal electrode 6 is formed by a divided cross section of the via-hole conductor 2 formed in the insulator layers 1b and 1c.
  • the target connected to the connection terminal electrode 5 and the connection terminal electrode 6 is arbitrary. It may be a wiring member such as a flat cable, a substrate, or an electronic component. Further, the wiring member is not limited to the flat cable, and a general lead wire or the like may be connected.
  • the plating layer 4 a is formed on the surface of the mounting terminal electrode 4, the plating layer 5 a is formed on the surface of the connection terminal electrode 5, and the plating layer 6 a is formed on the surface of the connection terminal electrode 6.
  • the first layer is formed of nickel
  • the second layer is formed of one metal selected from gold, copper, and tin.
  • the plating layer may have a single layer structure instead of a multilayer structure.
  • the material of a plating layer is also arbitrary and may be formed with another metal.
  • the mounting terminal electrode 4, the connection terminal electrode 5, and the connection terminal electrode 6 are formed inside the element body 1 using wiring electrodes (via-hole conductor 2 and line conductor 3) as necessary. Are connected by wiring electrodes).
  • mother green sheets 11a to 11d for preparing the element body 1 are prepared.
  • Each of the mother green sheets 11a to 11d is made up of a large number of green sheets arranged in a matrix so that a large number of interposers 100 can be manufactured together.
  • the broken lines shown in FIGS. 3A and 3B are dividing lines that divide a large number of batched interposers 100 into individual interposers 100.
  • a conductive paste 14 for forming the mounting terminal electrode 4 is printed in a predetermined shape in advance. Yes.
  • a hole penetrating between both main surfaces is formed in a predetermined portion of each green sheet of the mother green sheet 11a, and a conductive paste 12 for forming the via-hole conductor 2 is filled in the hole. .
  • a hole penetrating between both main surfaces is formed in a predetermined portion of each green sheet of the mother green sheet 11b that is stacked second from the bottom, and the via-hole conductor 2 and the connection terminal electrode 6 are formed in the hole.
  • the conductive paste 12 for filling is filled.
  • a conductive paste 13 for forming the line conductor 3 is printed in a predetermined shape on the lower main surface of each green sheet of the mother green sheet 11c that is stacked third from the bottom. Further, a conductive paste for forming a via hole conductor 2 and a connection terminal electrode 6 in the hole is formed in a predetermined portion of each green sheet of the mother green sheet 11c through both main surfaces. 12 is filled.
  • a conductive paste for forming a via hole conductor 2 in a predetermined portion of each green sheet of the mother green sheet 11d that is laminated fourth from the bottom and forming a via-hole conductor 2 inside the hole. 12 is filled. Further, a conductive paste 15 for forming the connection terminal electrode 5 is printed in a predetermined shape on the upper main surface of each green sheet of the mother green sheet 11d.
  • the mother green sheets 11a to 11d are stacked, pressed and integrated from above and below, and then fired with a predetermined profile to produce a mother body 1 'shown in FIG.
  • the via-hole conductor 2 and the line conductor 3 are formed inside the mother element body 1 ′, and the via-hole conductor 2 and the line conductor 3 constitute a wiring electrode.
  • a mounting terminal electrode 4 is formed on the lower main surface of the mother element body 1 ′.
  • the connection terminal electrode 5 is formed on the upper main surface of the mother body 1 ′.
  • the dividing lines of the mother element body 1 ′ are divided by, for example, a dicer to obtain individual element bodies 1.
  • the via-hole conductor 2 arranged on the dividing line is divided into two in the vertical direction, and the connection terminal electrode 6 is formed on the side surface S1 of each element body 1.
  • the plating layer 4a is formed on the surface of the mounting terminal electrode 4 by, for example, electrolytic plating, and the plating layer 5a is formed on the surface of the connection terminal electrode 5, so as to be connected.
  • a plating layer 6 a is formed on the surface of the terminal electrode 6 for use, and the interposer 100 is completed.
  • FIGS. 3A and 3B Using the interposer 100, the electronic device 200 according to the first embodiment shown in FIGS. 3A and 3B was manufactured.
  • the electronic device 200 is, for example, a portable electronic device such as a smartphone.
  • FIG. 3A is a perspective view of a main part of the electronic device 200 in which the housing is omitted and the inside of the housing is illustrated.
  • FIG. 3B is a perspective view of a main part of the electronic device 200 without a flat cable.
  • the electronic device 200 includes a housing (not shown).
  • the housing is made of resin, for example.
  • a first circuit board 21, a second circuit board 22, and a third circuit board 23 are accommodated in the housing.
  • Electronic components 24 such as semiconductor devices, capacitors, resistors, and inductors are mounted on the first circuit board 21, the second circuit board 22, and the third circuit board 23, respectively.
  • the electronic component 24 is mounted by bonding the mounting electrodes formed on the main surfaces of the circuit boards 21 to 23 and the terminal electrodes of the electronic component 24 with a conductive bonding material such as solder or a conductive adhesive. It is done by doing.
  • the interposer 30 is mounted on the first circuit board 21.
  • the interposer 30 has two connection terminal electrodes 36 formed on the side surface.
  • the interposer 30 is mounted by connecting a mounting electrode formed on the main surface of the circuit board 21 and a mounting terminal electrode formed on the bottom surface of the interposer 30 with a conductive bonding material such as solder or a conductive adhesive. It is done by joining.
  • the interposer 100 according to the first embodiment described above is mounted on the second circuit board 22.
  • the interposer 100 has four connection terminal electrodes (first connection terminal electrodes) 5 formed on the top surface, and two connection terminal electrodes (second connection terminal electrodes) on one of the four side surfaces. ) 6 is formed.
  • the interposer 100 is mounted by connecting a mounting electrode formed on the main surface of the circuit board 22 and a mounting terminal electrode 4 formed on the bottom surface of the interposer 100 to a conductive bonding material such as solder or a conductive adhesive. It is done by joining by.
  • the interposer 40 is mounted on the third circuit board 23.
  • the interposer 40 has four connection terminal electrodes 45 formed on the top surface.
  • the interposer 40 is mounted by mounting a mounting electrode formed on the main surface of the circuit board 23 and a mounting terminal electrode formed on the bottom surface of the interposer 40 with a conductive bonding material such as solder or a conductive adhesive. It is done by joining.
  • connection terminal electrode 36 formed on the side surface of the interposer 30 mounted on the first circuit board 21 and a connection terminal electrode (second electrode) formed on the side surface of the interposer 100 mounted on the second circuit board 22.
  • a connection terminal electrode 6 is connected to a flat cable (second flat cable) 26. More specifically, a plurality of connection terminals are formed at both ends of the flat cable 26, one connection terminal is connected to the connection terminal electrode 36 of the interposer 30, and the other connection terminal is connected. Each of them is joined to the connection terminal electrode 6 of the interposer 100 by a conductive bonding material such as solder or a conductive adhesive.
  • connection terminal electrode (first connection terminal electrode) 5 formed on the top surface of the interposer 100 mounted on the second circuit board 22 and the top of the interposer 40 mounted on the third circuit board 23.
  • a connection terminal electrode 45 formed on the surface is connected by a flat cable (first flat cable) 25. More specifically, a plurality of connection terminals are formed at both ends of the flat cable 25, one connection terminal is connected to the connection terminal electrode 5 of the interposer 100, and the other connection terminal is connected. Each of them is joined to the connection terminal electrode 45 of the interposer 40 by a conductive bonding material such as solder or a conductive adhesive.
  • the second circuit board 22 Since the electronic device 200 uses the interposer 100 in which the connection terminal electrode 5 is formed on the top surface and the connection terminal electrode 6 is formed on the side surface, the second circuit board 22 has a large area (region). The two flat cables 25 and 26 can be connected to the second circuit board 22 without need.
  • the interposer 100 can connect the flat cable by arbitrarily selecting the top surface and the side surface of the electronic device 200, the flat cable can be connected around the obstacle.
  • a flat cable (first flat cable) 25 that connects the second circuit board 22 and the third circuit board 23 is used as it is as the first circuit. Even if it extends in the direction of the board 21 and tries to connect to the first circuit board 21, the electronic component 24x mounted on the second circuit board 22 cannot be connected due to an obstacle.
  • the interposer 100 can be manufactured to an extremely small size by using a multilayer ceramic technology used for manufacturing a multilayer ceramic electronic component (such as a multilayer ceramic capacitor).
  • Embodiment 2 (interposer 300 / electronic device 400)
  • the interposer 300 according to the second embodiment was manufactured.
  • the electronic device 400 according to the second embodiment was manufactured using the interposer 300.
  • FIG. 5 (A) and 5 (B) show an electronic device 400 provided with an interposer 300, respectively.
  • FIG. 5A is a perspective view of a main part of the electronic device 400 in which the housing is omitted and the inside of the housing is illustrated.
  • FIG. 5B is a perspective view of a main part of the electronic device 400 in which a flat cable is further omitted.
  • the electronic device 400 includes a circuit board 41. Although not shown, electronic components are mounted on the circuit board 41. Further, the interposer 300 according to the second embodiment is mounted on the circuit board 41.
  • the interposer 300 has four connection terminal electrodes (first connection terminal electrodes) 55 formed on the top surface.
  • the interposer 300 has two connection terminal electrodes (second connection terminal electrodes) 56a formed on one of the four side surfaces, and two connection terminal electrodes (second connection) on another side surface. Terminal electrode) 56b is formed.
  • a flat cable (first flat cable) 57 is connected to the connection terminal electrode 55
  • a flat cable (second flat cable) 58a is connected to the connection terminal electrode 56a
  • a connection terminal electrode 56b is connected.
  • a flat cable (second flat cable) 58b is connected.
  • connection terminal electrodes are formed on two side surfaces, but connection terminal electrodes may be formed on three or more side surfaces, respectively.
  • FIG. 6A and 6B show an electronic device 600 provided with an interposer 500, respectively.
  • FIG. 6A is a perspective view of a main part of the electronic device 600, showing the inside of the housing without the housing.
  • FIG. 5B is a perspective view of a main part of the electronic apparatus 600 from which a flat cable is further omitted.
  • the electronic device 600 includes a circuit board 61. Although not shown, electronic components are mounted on the circuit board 61. Further, the interposer 500 according to the third embodiment is mounted on the circuit board 61.
  • the interposer 500 has four connection terminal electrodes (first connection terminal electrodes) 75 formed on the top surface.
  • the interposer 300 has four connection terminal electrodes (second connection terminal electrodes) 76 formed on one of the four side surfaces.
  • a flat cable (first flat cable) 77 is connected to the connection terminal electrode 75, and a flat cable (second flat cable) 78 is connected to the connection terminal electrode 76.
  • the flat cable 77 is wired in a direction parallel to the main surface of the circuit board 61.
  • the flat cable 78 is wired in a direction perpendicular to the main surface of the circuit board 61.
  • the flat cable can be pulled out in a desired direction with a high degree of freedom.
  • FIGS. 7A to 7C show an interposer 700 according to the fourth embodiment.
  • 7A is a perspective view of the interposer 700.
  • FIG. 7B is a plan view of the interposer 700.
  • FIG. 7C is a cross-sectional view of the interposer 700.
  • the interposer 700 has a new configuration added to the interposer 100 according to the first embodiment. Specifically, the metal shield 51 was formed on the three side surfaces S2, S3, and S4 of the element body 1 of the interposer 100.
  • connection terminal electrode (second connection terminal electrode) 6 is formed on the side surface S1 of the element body 1, no metal shield was formed.
  • the metal shield 51 is formed on each of the three side surfaces S2, S3, and S4 of the element body 1.
  • the material and configuration of the metal shield 51 are arbitrary, but can be formed of, for example, Ti, Ni, Cr, SUS, Cu, Al, Ag, or an alloy thereof. Further, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, and a corrosion-resistant layer made of Ti, Ni, Cr, SUS, or an alloy thereof
  • the three-layer structure can be formed.
  • the adhesion layer is preferably made of a material having high affinity with the element body 1 and hardly peeled off
  • the conductive layer is preferably made of a material having high conductivity
  • the corrosion-resistant layer is preferably made of a material resistant to oxidation and corrosion.
  • the metal shield 51 is connected to the mounting terminal electrode 4 via the line conductor 3 and the via-hole conductor 2 as shown in FIG. Therefore, the metal shield 51 can be connected to the ground potential by connecting the mounting terminal electrode 4 to the ground potential.
  • the metal shield 51 can be formed, for example, by sputtering after masking the outer surface of the element body 1 where the metal shield 51 is not formed.
  • the interposer 700 can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside by the metal shield 51. That is, since the interposer 700 is shielded by the metal shield 51, the transmission of the side surfaces S2, S3, and S4 of the element body 1 of the magnetic field component and electric field component constituting the noise is suppressed, and is emitted from the interposer to the outside. Noise and noise entering the interposer from the outside are suppressed.
  • FIG. 8 shows an interposer 800 according to the fifth embodiment. However, FIG. 8 is a perspective view of the interposer 800.
  • the interposer 800 has changed a part of the configuration of the interposer 700 according to the fourth embodiment. Specifically, in the interposer 700, the metal shield 51 is formed on the entire surface of each of the three side surfaces S2, S3, and S4 of the element body 1. In the interposer 800, instead of this, metal shields 66 are partially formed on the lower half of the three side surfaces S2, S3, S4 of the element body 1, respectively.
  • the metal shields 66 may be partially formed on the side surfaces S2, S3, and S4 of the element body 1, respectively.
  • FIG. 9 shows an interposer 900 according to the sixth embodiment. However, FIG. 9 is a perspective view of the interposer 900.
  • the interposer 900 has also changed a part of the configuration of the interposer 700 according to the fourth embodiment.
  • connection terminal electrode (second connection terminal electrode) 76 formed on the side surface S1 of the element body 1 is set to the size of the connection terminal electrode (second connection) of the interposer 700.
  • Terminal electrode) 6 was made smaller than the size.
  • a plating layer 76 a is formed on the surface of the connection terminal electrode 76.
  • metal shields 71a and 71b were formed on the side surface S1 of the element body 1 where the connection terminal electrode 76 was not formed. More specifically, the metal shield 71a was formed along the side in contact with the top surface T of the side surface S1 of the element body 1, and the metal shield 71b was formed along the side in contact with the bottom surface B.
  • the interposer 900 has an improved noise shielding effect.
  • the formation positions of the metal shields on the outer surface of the element body 1 are as follows. It is optional and is not limited to the above-described formation examples. The formation position can be appropriately set as necessary while confirming the noise shielding effect.
  • a metal shield may be partially formed on the top surface T of the element body 1.
  • FIG. 10 shows an electronic apparatus 1000 according to the seventh embodiment. However, FIG. 10 is a front view of the electronic apparatus 1000.
  • the interposer 700 according to the fourth embodiment described above is mounted on the circuit board 52.
  • the electronic component 53 is mounted on the circuit board 52 adjacent to the interposer 700.
  • Electronic device 1000 has a height H S of the metal shield 51 formed on the side surface S4 for facing the electronic parts 53 of the element body 1 is higher than the height H D of the electronic component 53.
  • the height H S of the metal shield 51 is lower than the height H D of the electronic components 53, can not be sufficiently shield the noise of metal shield 51, the radiated noise interposer electronic components 53 effect or apply, interposer there is a possibility that noise radiation or affect the electronic component 53, but in the electronic device 1000, the height H S of the metal shield 51 is greater than the height H D of the electronic component 53 Therefore, the influence of noise between the two is effectively suppressed.
  • FIG. 11A and 11B show an interposer 1100 according to the eighth embodiment.
  • FIG. 11A is a perspective view of the interposer 1100.
  • FIG. 11B is a cross-sectional view of the interposer 1100.
  • the interposer 1100 has changed a part of the configuration of the interposer 100 according to the first embodiment. Specifically, in the interposer 100, the four insulator layers 1a to 1d constituting the element body 1 are made of a nonmagnetic material. However, in the interposer 1100, the four insulator layers 1a to 1d are formed. Insulator layers 1b and 1c laminated in the middle were made of magnetic material Z. More specifically, the insulator layers 1b and 1c were made of a magnetic material Z made of ferrite.
  • the interposer 1100 also has a function of a so-called magnetic bead inductor (ferrite bead inductor), and can suppress passage of noise included in a signal passing through the interposer.
  • magnetic bead inductor ferrite bead inductor
  • FIG. 12A and 12B show an interposer 1200 according to the ninth embodiment.
  • FIG. 12A is a perspective view of the interposer 1200.
  • FIG. 12B is a cross-sectional view of the interposer 1200.
  • the interposer 1200 is a part of the configuration of the interposer 1100 according to the eighth embodiment described above. Specifically, in the interposer 1100, the two insulator layers 1b and 1c laminated in the middle of the element body 1 are made of the magnetic substance Z. In the interposer 1200, the four insulator layers 1a to 1d are formed. All were made of magnetic material Z.
  • the element body 1 may be partially made of a magnetic substance like the interposer 1100, or the entire element element 1 like the interposer 1200. May be made of a magnetic material.
  • Interposer 1200 also has the function of a magnetic bead inductor (ferrite bead inductor).
  • FIGS. 13A and 13B show an interposer 1300 according to the tenth embodiment.
  • FIG. 13A is a perspective view of the interposer 1300.
  • FIG. 13B is an exploded perspective view of the interposer 1300, and shows a state where the metal shields 51, 71a, 71b are removed.
  • the interposer 1300 is a combination of the features of the interposer 900 according to the sixth embodiment and the features of the interposer 1100 according to the eighth embodiment.
  • the interposer 1300 is formed by using the magnetic body Z as the insulator layers 1b and 1c laminated in the middle of the four insulating layers 1a to 1d constituting the element body 1. did.
  • the metal shields 71a and 71b are formed on the side surface S1 of the element body 1, and the metal shield 51 is formed on the side surfaces S2 to S4 of the element body 1.
  • the interposer 1300 Since the interposer 1300 is formed with the metal shields 51, 71a, 71b, noise radiated to the outside from the interposer and noise entering from the outside to the inside of the interposer are suppressed. Further, the interposer 1300 has a function of a so-called magnetic bead inductor (ferrite bead inductor) because the insulator layers 1b and 1c constituting the element body 1 are made of the magnetic body Z.
  • magnetic bead inductor ferrite bead inductor
  • interposers 100, 300, 500, 700, 800, 900, 1100, 1200, 1300, and the electronic devices 200, 400, 600, 1000 according to the embodiments have been described above.
  • the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
  • the element body 1 is a laminated element body in which insulator layers 1a to 1d such as ceramics are laminated.
  • the element body of the interposer is not limited to the laminated element body, and may be a block element body constituted by one block.
  • the material of the element body is also arbitrary, and may be made of resin or the like instead of ceramic.
  • the electronic device 200 is a portable electronic device such as a smartphone
  • the type of the electronic device is arbitrary and may be another type of electronic device.
  • FIGS. 3A, 3B, 5A, 5B, 6A, 6B, and 10 showing the electronic devices 200, 400, 600, and 1000
  • the dimensions of the interposers 100, 300, 500, and 700 are shown to be larger than those of other configurations.
  • the interposers 100, 300, 500, and 700 can be manufactured to extremely small dimensions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

L'invention concerne un interposeur permettant de connecter une pluralité d'éléments de câblage tels que des câbles plats ainsi que des substrats, des composants électroniques, etc. L'interposeur comprend : un corps d'élément (1) d'un isolant présentant une surface inférieure (B), une surface supérieure (T) et une pluralité de surfaces latérales (S1 à S4) ; une première électrode de borne de connexion (5) disposée sur la surface supérieure (T) et reliée à l'extérieur au moyen d'un élément de liaison électroconducteur interposé entre ces dernières ; une seconde électrode de borne de connexion (6) disposée sur la surface latérale (S1) et reliée à l'extérieur au moyen de l'élément de liaison électroconducteur interposé entre ces dernières ; et une électrode de borne de montage (4) disposée sur la surface inférieure (B) et connectée à une carte de circuit imprimé au moyen du matériau de liaison électroconducteur interposé entre ces derniers.
PCT/JP2017/043004 2017-02-01 2017-11-30 Interposeur et dispositif électronique WO2018142740A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201790001573.3U CN210692812U (zh) 2017-02-01 2017-11-30 内插器以及电子设备

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JP2017017108 2017-02-01
JP2017-017108 2017-02-01

Publications (1)

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WO2018142740A1 true WO2018142740A1 (fr) 2018-08-09

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289467A (ja) * 2001-03-23 2002-10-04 Kyocera Corp 積層セラミックコンデンサおよび実装基板
JP2005072509A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 電子部品搭載用基板およびそれを用いた電子装置
JP2005251889A (ja) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd 立体的電子回路装置
JP2010087232A (ja) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd 電子部品および電子部品用基板ならびにそれらの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289467A (ja) * 2001-03-23 2002-10-04 Kyocera Corp 積層セラミックコンデンサおよび実装基板
JP2005072509A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 電子部品搭載用基板およびそれを用いた電子装置
JP2005251889A (ja) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd 立体的電子回路装置
JP2010087232A (ja) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd 電子部品および電子部品用基板ならびにそれらの製造方法

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