CN210692812U - 内插器以及电子设备 - Google Patents

内插器以及电子设备 Download PDF

Info

Publication number
CN210692812U
CN210692812U CN201790001573.3U CN201790001573U CN210692812U CN 210692812 U CN210692812 U CN 210692812U CN 201790001573 U CN201790001573 U CN 201790001573U CN 210692812 U CN210692812 U CN 210692812U
Authority
CN
China
Prior art keywords
interposer
terminal electrode
connection terminal
blank
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201790001573.3U
Other languages
English (en)
Chinese (zh)
Inventor
矢崎浩和
米森启人
土屋贵纪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Application granted granted Critical
Publication of CN210692812U publication Critical patent/CN210692812U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
CN201790001573.3U 2017-02-01 2017-11-30 内插器以及电子设备 Active CN210692812U (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-017108 2017-02-01
JP2017017108 2017-02-01
PCT/JP2017/043004 WO2018142740A1 (fr) 2017-02-01 2017-11-30 Interposeur et dispositif électronique

Publications (1)

Publication Number Publication Date
CN210692812U true CN210692812U (zh) 2020-06-05

Family

ID=63039544

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201790001573.3U Active CN210692812U (zh) 2017-02-01 2017-11-30 内插器以及电子设备

Country Status (2)

Country Link
CN (1) CN210692812U (fr)
WO (1) WO2018142740A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289467A (ja) * 2001-03-23 2002-10-04 Kyocera Corp 積層セラミックコンデンサおよび実装基板
JP2005072509A (ja) * 2003-08-27 2005-03-17 Kyocera Corp 電子部品搭載用基板およびそれを用いた電子装置
JP4186843B2 (ja) * 2004-03-03 2008-11-26 松下電器産業株式会社 立体的電子回路装置
JP5287102B2 (ja) * 2008-09-30 2013-09-11 株式会社村田製作所 電子部品および電子部品用基板ならびにそれらの製造方法

Also Published As

Publication number Publication date
WO2018142740A1 (fr) 2018-08-09

Similar Documents

Publication Publication Date Title
WO2018164158A1 (fr) Module à haute fréquence
JP6156610B2 (ja) 電子機器、およびアンテナ素子
US8043892B2 (en) Semiconductor die package and integrated circuit package and fabricating method thereof
WO2019098316A1 (fr) Module haute fréquence
CN109545503B (zh) 电子组件
EP0311418B1 (fr) Elément composé en forme de pastille
US10607769B2 (en) Electronic component including a spacer part
US10418168B2 (en) Inductor and method for manufacturing the same
JP6458904B2 (ja) 受動素子アレイおよびプリント配線板
JPWO2008044483A1 (ja) 複合電気素子
KR20150089279A (ko) 칩형 코일 부품
US11646273B2 (en) Module
CN105555018A (zh) 一种印刷电路板及电子终端
JP4716951B2 (ja) 電気回路装置
KR101823189B1 (ko) 인덕터 어셈블리
US20200187346A1 (en) Interposer and electronic apparatus
CN210692812U (zh) 内插器以及电子设备
CN107623989B (zh) 印刷电路板及移动终端
CN220189619U (zh) 电路模块
US20210021038A1 (en) Communication module, electronic device, and communication module manufacturing method
US11145586B2 (en) Interposer and electronic device
CN204464431U (zh) 高频信号传输线路及电子设备
US10707016B2 (en) Method of manufacturing laminated electronic component
JP3854095B2 (ja) 多層回路基板
WO2018139048A1 (fr) Interposeur et machine électronique

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant