WO2018142740A1 - Interposer and electronic device - Google Patents

Interposer and electronic device Download PDF

Info

Publication number
WO2018142740A1
WO2018142740A1 PCT/JP2017/043004 JP2017043004W WO2018142740A1 WO 2018142740 A1 WO2018142740 A1 WO 2018142740A1 JP 2017043004 W JP2017043004 W JP 2017043004W WO 2018142740 A1 WO2018142740 A1 WO 2018142740A1
Authority
WO
WIPO (PCT)
Prior art keywords
interposer
terminal electrode
connection terminal
element body
circuit board
Prior art date
Application number
PCT/JP2017/043004
Other languages
French (fr)
Japanese (ja)
Inventor
浩和 矢▲崎▼
啓人 米森
貴紀 土屋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN201790001573.3U priority Critical patent/CN210692812U/en
Publication of WO2018142740A1 publication Critical patent/WO2018142740A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present invention relates to an interposer mounted on a circuit board and used by connecting a flat cable or the like, and more particularly to an interposer capable of connecting a plurality of flat cables or the like.
  • the present invention also relates to an electronic device using the interposer of the present invention, and more particularly, to an electronic device having a small area on a circuit board required for connecting a plurality of flat cables and the like.
  • a flat cable may be used to connect a circuit board and a circuit board that are arranged apart from each other.
  • FIG. 14A is a side cross-sectional view of the electronic device 1400.
  • FIG. 14B is a plan cross-sectional view of the electronic device 1400.
  • two circuit boards (mounting circuit boards) 102 and a battery pack 103 are accommodated in a housing (equipment housing) 101. More specifically, one circuit board 102, the battery pack 103, and the other circuit board 102 are accommodated side by side in this order.
  • Electronic components (IC chips, mounting components) 104 are mounted on the two circuit boards 102, respectively.
  • a coaxial connector 105 for connecting a flat cable 106 described later is mounted on each of the two circuit boards 102.
  • the two circuit boards 102 arranged apart from each other are connected by a flat cable 106. More specifically, a coaxial connector 107 is connected to both ends of the flat cable 106, one coaxial connector 107 is connected to the coaxial connector 105 mounted on one circuit board 102, and the other coaxial connector is connected. 107 is connected to a coaxial connector 105 mounted on the other circuit board 102.
  • the flat cable 106 is formed in multiple layers, and has a structure in which a signal conductor and a ground conductor wider than the signal conductor are vertically stacked with an insulating layer interposed therebetween.
  • the signal conductor and the ground conductor are each made of, for example, copper (copper foil).
  • the flat cable 106 has a certain degree of flexibility.
  • the electronic device 1400 has two circuit boards 102 connected by a flat cable 106.
  • some electronic devices may include a large number (three or more) of circuit boards, and the circuit boards may be connected to each other by a flat cable. In such an electronic device, it is necessary to connect a plurality of flat cables to one circuit board.
  • a plurality of flat cables are connected to one circuit board by connecting the coaxial connector 105 mounted on the circuit board 102 and the coaxial connector 107 provided at the end of the flat cable 106 as in the electronic device 1400. When trying to do so, it is necessary to mount a plurality of coaxial connectors 105 on the circuit board 102.
  • the coaxial connectors 105 and 107 are mechanical structures manufactured by mechanically processing a metal plate such as phosphor bronze, and have a large dimension in the plane direction and a dimension in the height direction. Therefore, when trying to mount a plurality of coaxial connectors 105 on the circuit board 102, there is a problem that a large area (region) for mounting is required for the circuit board 102. Further, since the coaxial connector 107 is connected to each of the plurality of mounted coaxial connectors 105, there is a problem that a large space for arranging the coaxial connectors 105 and 107 is required on the circuit board 102. As a result, there is a problem that the circuit board 102 is enlarged and the electronic device itself is also enlarged.
  • the interposer of the present invention includes a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface.
  • a second connection terminal electrode, and a mounting terminal electrode provided on the bottom surface and connected to the circuit board via a conductive bonding material.
  • a wiring member such as a flat cable, a substrate, an electronic component, or the like can be connected to the first connection terminal electrode and the second connection terminal electrode.
  • a wiring member it is not restricted to a flat cable, You may connect a general lead wire etc.
  • the element body can be, for example, a rectangular parallelepiped and has four side surfaces.
  • a second connection terminal electrode may be provided on each of two or more side surfaces.
  • a second flat cable can be connected to each second connection terminal electrode.
  • the element body can be made of ceramic, for example. In this case, an interposer with excellent heat resistance can be produced.
  • the element body is preferably a laminated element body in which insulator layers are laminated.
  • a wiring electrode is constituted by a via-hole conductor formed so as to penetrate between both main surfaces of the insulator layer and a line conductor formed between the layers of the insulator layer, and the first connection is made by the wiring electrode. Necessary connection among the terminal electrode for mounting, the terminal electrode for second connection, and the terminal electrode for mounting can be performed.
  • the second connection terminal electrode can be formed by a divided cross section of the via-hole conductor provided in the insulator layer. In this case, the second connection terminal electrode can be easily formed.
  • a metal shield be formed on the outer surface of the element body.
  • the metal shield can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside.
  • a metal shield is formed on the entire surface or a part of at least one side surface of the element body. It is also preferable that a metal shield is formed on the entire surface or a part of at least one side surface where the second connection terminal electrode is not formed. Moreover, it is also preferable that a metal shield is formed on a portion where the second connection terminal electrode is not formed on at least one side surface where the second connection terminal electrode is formed. Furthermore, it is also preferable that the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body. In these cases, noise emission and penetration can be effectively suppressed.
  • the element body is made of a magnetic material.
  • the interposer can have a function of a so-called magnetic bead inductor (a ferrite bead inductor when the magnetic material is ferrite) that suppresses the passage of noise.
  • the element body may be made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer may be made of a magnetic substance. That is, even if the entire element body is not a magnetic body, the element body is a laminated element body in which a plurality of insulator layers are stacked, and even if a part of the insulator layer is a magnetic body, a magnetic bead inductor ( When the magnetic material is ferrite, the function of a ferrite bead inductor) can be provided.
  • the electronic device of the present invention includes a base body of an insulator having a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface, a first connection terminal electrode provided on the top surface,
  • a surface-mount type interposer including a second connection terminal electrode provided on a side surface and a mounting terminal electrode provided on a bottom surface, a circuit board, a first wiring member, and a second wiring member;
  • the mounting terminal electrode of the interposer is connected to the circuit board via the conductive bonding material, and the first wiring member is connected to the first connection terminal electrode of the interposer via the conductive bonding material,
  • the second wiring member may be connected to the second connection terminal electrode of the interposer via a conductive bonding material.
  • At least one of the first wiring member and the second wiring member is a flat cable. In this case, the connection of the wiring member to the connection terminal is facilitated.
  • a metal shield is formed on the side surface of the interposer, and an electronic component is mounted on the circuit board adjacent to the side surface on which the metal shield of the interposer is formed, and the metal shield is positioned higher than the height of the electronic component from the bottom surface. It is also preferable that the side surface is covered. In this case, it is possible to effectively suppress the noise radiated by the interposer from entering and affecting adjacent electronic components and the noise radiated by the adjacent electronic components from entering and affecting the interposer. can do.
  • a metal shield is formed on the side surface of the interposer and the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body. Also in this case, it is possible to effectively suppress noise emission from the interposer and noise intrusion into the interposer.
  • the interposer of the present invention can connect a wiring member such as a plurality of flat cables, a substrate, an electronic component, and the like. That is, for example, a first wiring member such as a flat cable is connected to the first connection terminal electrode provided on the top surface, and a second wiring such as a flat cable is connected to the second connection terminal electrode provided on the side surface. Members can be connected. Therefore, if the interposer of the present invention is used, a plurality of wiring members and the like can be connected to the circuit board without requiring a large area (region). In addition, when connecting a wiring member, it is not restricted to a flat cable, You may connect a general lead wire.
  • the electronic device of the present invention uses the interposer of the present invention, the area on the circuit board required for connecting wiring members such as a plurality of flat cables, substrates, electronic components, and the like is small. Therefore, in the electronic device of the present invention, the circuit board is not enlarged, and the electronic device itself is not enlarged.
  • FIG. 1 is a perspective view showing an interposer 100 according to Embodiment 1.
  • FIG. It is sectional drawing of the interposer 100, and has shown the dashed-dotted line XX part of FIG.
  • FIGS. 3A and 3B are perspective views of main parts showing the electronic apparatus 200 according to the first embodiment.
  • 4A to 4D are cross-sectional views showing steps performed in an example of a method for manufacturing the interposer 100.
  • FIGS. 5A and 5B are perspective views of main parts showing the electronic apparatus 400 according to the second embodiment.
  • FIGS. 6A and 6B are perspective views illustrating main parts of an electronic apparatus 600 according to the third embodiment.
  • FIG. 7A is a perspective view of an interposer 700 according to the fourth embodiment.
  • FIG. 7B is a plan view of the interposer 700.
  • FIG. 7C is a cross-sectional view of the interposer 700. It is a perspective view of the interposer 800 concerning Embodiment 5. FIG. It is a perspective view of the interposer 900 concerning Embodiment 6. FIG. It is a perspective view of the electronic device 1000 concerning Embodiment 7.
  • FIG. 11A is a perspective view of an interposer 1100 according to the eighth embodiment.
  • FIG. 11B is a cross-sectional view of the interposer 1100.
  • FIG. 12A is a perspective view of an interposer 1200 according to the ninth embodiment.
  • FIG. 12B is a cross-sectional view of the interposer 1200.
  • FIG. 13A is a perspective view of an interposer 1300 according to the tenth embodiment.
  • FIG. 13B is an exploded perspective view of the interposer 1300.
  • FIG. 14A is a side cross-sectional view of the electronic device 1400 disclosed in Patent Document 1.
  • FIG. FIG. 14B is a plan cross
  • each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
  • FIGS. 3A and 3B are perspective views showing main parts of the electronic device 200, respectively.
  • the interposer 100 includes a rectangular parallelepiped element body 1.
  • the element body 1 has a structure in which four insulating layers 1a to 1d are laminated.
  • the element body 1 (insulator layers 1a to 1c) is made of a ceramic such as LTCC (Low Temperature Co-fired Ceramics).
  • the element body 1 includes a top surface T, a bottom surface B, and four side surfaces S1, S2, S3, and S4.
  • Via hole conductors 2 are formed through the insulator layers 1a to 1d.
  • a line conductor 3 is formed between the insulator layers 1a to 1d as necessary.
  • a wiring electrode is formed inside the element body 1 using the via-hole conductor 2 and the line conductor 3.
  • the via-hole conductor 2 and the line conductor 3 are each formed of a metal whose main component is, for example, silver or copper.
  • a mounting terminal electrode 4 is formed on the bottom surface B of the element body 1.
  • the mounting terminal electrode 4 is formed of, for example, a metal whose main component is silver or copper.
  • connection terminal electrode (first connection terminal electrode) 5 connected to a flat cable or the like is formed on the top surface T of the element body 1.
  • the connection terminal electrode 5 is made of, for example, a metal whose main component is silver or copper.
  • connection terminal electrode (second connection terminal electrode) 6 connected to a flat cable or the like is formed on one side surface S1 of the element body 1.
  • the connection terminal electrode 6 is made of, for example, a metal whose main component is silver or copper.
  • the connection terminal electrode 6 is formed by a divided cross section of the via-hole conductor 2 formed in the insulator layers 1b and 1c.
  • the target connected to the connection terminal electrode 5 and the connection terminal electrode 6 is arbitrary. It may be a wiring member such as a flat cable, a substrate, or an electronic component. Further, the wiring member is not limited to the flat cable, and a general lead wire or the like may be connected.
  • the plating layer 4 a is formed on the surface of the mounting terminal electrode 4, the plating layer 5 a is formed on the surface of the connection terminal electrode 5, and the plating layer 6 a is formed on the surface of the connection terminal electrode 6.
  • the first layer is formed of nickel
  • the second layer is formed of one metal selected from gold, copper, and tin.
  • the plating layer may have a single layer structure instead of a multilayer structure.
  • the material of a plating layer is also arbitrary and may be formed with another metal.
  • the mounting terminal electrode 4, the connection terminal electrode 5, and the connection terminal electrode 6 are formed inside the element body 1 using wiring electrodes (via-hole conductor 2 and line conductor 3) as necessary. Are connected by wiring electrodes).
  • mother green sheets 11a to 11d for preparing the element body 1 are prepared.
  • Each of the mother green sheets 11a to 11d is made up of a large number of green sheets arranged in a matrix so that a large number of interposers 100 can be manufactured together.
  • the broken lines shown in FIGS. 3A and 3B are dividing lines that divide a large number of batched interposers 100 into individual interposers 100.
  • a conductive paste 14 for forming the mounting terminal electrode 4 is printed in a predetermined shape in advance. Yes.
  • a hole penetrating between both main surfaces is formed in a predetermined portion of each green sheet of the mother green sheet 11a, and a conductive paste 12 for forming the via-hole conductor 2 is filled in the hole. .
  • a hole penetrating between both main surfaces is formed in a predetermined portion of each green sheet of the mother green sheet 11b that is stacked second from the bottom, and the via-hole conductor 2 and the connection terminal electrode 6 are formed in the hole.
  • the conductive paste 12 for filling is filled.
  • a conductive paste 13 for forming the line conductor 3 is printed in a predetermined shape on the lower main surface of each green sheet of the mother green sheet 11c that is stacked third from the bottom. Further, a conductive paste for forming a via hole conductor 2 and a connection terminal electrode 6 in the hole is formed in a predetermined portion of each green sheet of the mother green sheet 11c through both main surfaces. 12 is filled.
  • a conductive paste for forming a via hole conductor 2 in a predetermined portion of each green sheet of the mother green sheet 11d that is laminated fourth from the bottom and forming a via-hole conductor 2 inside the hole. 12 is filled. Further, a conductive paste 15 for forming the connection terminal electrode 5 is printed in a predetermined shape on the upper main surface of each green sheet of the mother green sheet 11d.
  • the mother green sheets 11a to 11d are stacked, pressed and integrated from above and below, and then fired with a predetermined profile to produce a mother body 1 'shown in FIG.
  • the via-hole conductor 2 and the line conductor 3 are formed inside the mother element body 1 ′, and the via-hole conductor 2 and the line conductor 3 constitute a wiring electrode.
  • a mounting terminal electrode 4 is formed on the lower main surface of the mother element body 1 ′.
  • the connection terminal electrode 5 is formed on the upper main surface of the mother body 1 ′.
  • the dividing lines of the mother element body 1 ′ are divided by, for example, a dicer to obtain individual element bodies 1.
  • the via-hole conductor 2 arranged on the dividing line is divided into two in the vertical direction, and the connection terminal electrode 6 is formed on the side surface S1 of each element body 1.
  • the plating layer 4a is formed on the surface of the mounting terminal electrode 4 by, for example, electrolytic plating, and the plating layer 5a is formed on the surface of the connection terminal electrode 5, so as to be connected.
  • a plating layer 6 a is formed on the surface of the terminal electrode 6 for use, and the interposer 100 is completed.
  • FIGS. 3A and 3B Using the interposer 100, the electronic device 200 according to the first embodiment shown in FIGS. 3A and 3B was manufactured.
  • the electronic device 200 is, for example, a portable electronic device such as a smartphone.
  • FIG. 3A is a perspective view of a main part of the electronic device 200 in which the housing is omitted and the inside of the housing is illustrated.
  • FIG. 3B is a perspective view of a main part of the electronic device 200 without a flat cable.
  • the electronic device 200 includes a housing (not shown).
  • the housing is made of resin, for example.
  • a first circuit board 21, a second circuit board 22, and a third circuit board 23 are accommodated in the housing.
  • Electronic components 24 such as semiconductor devices, capacitors, resistors, and inductors are mounted on the first circuit board 21, the second circuit board 22, and the third circuit board 23, respectively.
  • the electronic component 24 is mounted by bonding the mounting electrodes formed on the main surfaces of the circuit boards 21 to 23 and the terminal electrodes of the electronic component 24 with a conductive bonding material such as solder or a conductive adhesive. It is done by doing.
  • the interposer 30 is mounted on the first circuit board 21.
  • the interposer 30 has two connection terminal electrodes 36 formed on the side surface.
  • the interposer 30 is mounted by connecting a mounting electrode formed on the main surface of the circuit board 21 and a mounting terminal electrode formed on the bottom surface of the interposer 30 with a conductive bonding material such as solder or a conductive adhesive. It is done by joining.
  • the interposer 100 according to the first embodiment described above is mounted on the second circuit board 22.
  • the interposer 100 has four connection terminal electrodes (first connection terminal electrodes) 5 formed on the top surface, and two connection terminal electrodes (second connection terminal electrodes) on one of the four side surfaces. ) 6 is formed.
  • the interposer 100 is mounted by connecting a mounting electrode formed on the main surface of the circuit board 22 and a mounting terminal electrode 4 formed on the bottom surface of the interposer 100 to a conductive bonding material such as solder or a conductive adhesive. It is done by joining by.
  • the interposer 40 is mounted on the third circuit board 23.
  • the interposer 40 has four connection terminal electrodes 45 formed on the top surface.
  • the interposer 40 is mounted by mounting a mounting electrode formed on the main surface of the circuit board 23 and a mounting terminal electrode formed on the bottom surface of the interposer 40 with a conductive bonding material such as solder or a conductive adhesive. It is done by joining.
  • connection terminal electrode 36 formed on the side surface of the interposer 30 mounted on the first circuit board 21 and a connection terminal electrode (second electrode) formed on the side surface of the interposer 100 mounted on the second circuit board 22.
  • a connection terminal electrode 6 is connected to a flat cable (second flat cable) 26. More specifically, a plurality of connection terminals are formed at both ends of the flat cable 26, one connection terminal is connected to the connection terminal electrode 36 of the interposer 30, and the other connection terminal is connected. Each of them is joined to the connection terminal electrode 6 of the interposer 100 by a conductive bonding material such as solder or a conductive adhesive.
  • connection terminal electrode (first connection terminal electrode) 5 formed on the top surface of the interposer 100 mounted on the second circuit board 22 and the top of the interposer 40 mounted on the third circuit board 23.
  • a connection terminal electrode 45 formed on the surface is connected by a flat cable (first flat cable) 25. More specifically, a plurality of connection terminals are formed at both ends of the flat cable 25, one connection terminal is connected to the connection terminal electrode 5 of the interposer 100, and the other connection terminal is connected. Each of them is joined to the connection terminal electrode 45 of the interposer 40 by a conductive bonding material such as solder or a conductive adhesive.
  • the second circuit board 22 Since the electronic device 200 uses the interposer 100 in which the connection terminal electrode 5 is formed on the top surface and the connection terminal electrode 6 is formed on the side surface, the second circuit board 22 has a large area (region). The two flat cables 25 and 26 can be connected to the second circuit board 22 without need.
  • the interposer 100 can connect the flat cable by arbitrarily selecting the top surface and the side surface of the electronic device 200, the flat cable can be connected around the obstacle.
  • a flat cable (first flat cable) 25 that connects the second circuit board 22 and the third circuit board 23 is used as it is as the first circuit. Even if it extends in the direction of the board 21 and tries to connect to the first circuit board 21, the electronic component 24x mounted on the second circuit board 22 cannot be connected due to an obstacle.
  • the interposer 100 can be manufactured to an extremely small size by using a multilayer ceramic technology used for manufacturing a multilayer ceramic electronic component (such as a multilayer ceramic capacitor).
  • Embodiment 2 (interposer 300 / electronic device 400)
  • the interposer 300 according to the second embodiment was manufactured.
  • the electronic device 400 according to the second embodiment was manufactured using the interposer 300.
  • FIG. 5 (A) and 5 (B) show an electronic device 400 provided with an interposer 300, respectively.
  • FIG. 5A is a perspective view of a main part of the electronic device 400 in which the housing is omitted and the inside of the housing is illustrated.
  • FIG. 5B is a perspective view of a main part of the electronic device 400 in which a flat cable is further omitted.
  • the electronic device 400 includes a circuit board 41. Although not shown, electronic components are mounted on the circuit board 41. Further, the interposer 300 according to the second embodiment is mounted on the circuit board 41.
  • the interposer 300 has four connection terminal electrodes (first connection terminal electrodes) 55 formed on the top surface.
  • the interposer 300 has two connection terminal electrodes (second connection terminal electrodes) 56a formed on one of the four side surfaces, and two connection terminal electrodes (second connection) on another side surface. Terminal electrode) 56b is formed.
  • a flat cable (first flat cable) 57 is connected to the connection terminal electrode 55
  • a flat cable (second flat cable) 58a is connected to the connection terminal electrode 56a
  • a connection terminal electrode 56b is connected.
  • a flat cable (second flat cable) 58b is connected.
  • connection terminal electrodes are formed on two side surfaces, but connection terminal electrodes may be formed on three or more side surfaces, respectively.
  • FIG. 6A and 6B show an electronic device 600 provided with an interposer 500, respectively.
  • FIG. 6A is a perspective view of a main part of the electronic device 600, showing the inside of the housing without the housing.
  • FIG. 5B is a perspective view of a main part of the electronic apparatus 600 from which a flat cable is further omitted.
  • the electronic device 600 includes a circuit board 61. Although not shown, electronic components are mounted on the circuit board 61. Further, the interposer 500 according to the third embodiment is mounted on the circuit board 61.
  • the interposer 500 has four connection terminal electrodes (first connection terminal electrodes) 75 formed on the top surface.
  • the interposer 300 has four connection terminal electrodes (second connection terminal electrodes) 76 formed on one of the four side surfaces.
  • a flat cable (first flat cable) 77 is connected to the connection terminal electrode 75, and a flat cable (second flat cable) 78 is connected to the connection terminal electrode 76.
  • the flat cable 77 is wired in a direction parallel to the main surface of the circuit board 61.
  • the flat cable 78 is wired in a direction perpendicular to the main surface of the circuit board 61.
  • the flat cable can be pulled out in a desired direction with a high degree of freedom.
  • FIGS. 7A to 7C show an interposer 700 according to the fourth embodiment.
  • 7A is a perspective view of the interposer 700.
  • FIG. 7B is a plan view of the interposer 700.
  • FIG. 7C is a cross-sectional view of the interposer 700.
  • the interposer 700 has a new configuration added to the interposer 100 according to the first embodiment. Specifically, the metal shield 51 was formed on the three side surfaces S2, S3, and S4 of the element body 1 of the interposer 100.
  • connection terminal electrode (second connection terminal electrode) 6 is formed on the side surface S1 of the element body 1, no metal shield was formed.
  • the metal shield 51 is formed on each of the three side surfaces S2, S3, and S4 of the element body 1.
  • the material and configuration of the metal shield 51 are arbitrary, but can be formed of, for example, Ti, Ni, Cr, SUS, Cu, Al, Ag, or an alloy thereof. Further, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, and a corrosion-resistant layer made of Ti, Ni, Cr, SUS, or an alloy thereof
  • the three-layer structure can be formed.
  • the adhesion layer is preferably made of a material having high affinity with the element body 1 and hardly peeled off
  • the conductive layer is preferably made of a material having high conductivity
  • the corrosion-resistant layer is preferably made of a material resistant to oxidation and corrosion.
  • the metal shield 51 is connected to the mounting terminal electrode 4 via the line conductor 3 and the via-hole conductor 2 as shown in FIG. Therefore, the metal shield 51 can be connected to the ground potential by connecting the mounting terminal electrode 4 to the ground potential.
  • the metal shield 51 can be formed, for example, by sputtering after masking the outer surface of the element body 1 where the metal shield 51 is not formed.
  • the interposer 700 can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside by the metal shield 51. That is, since the interposer 700 is shielded by the metal shield 51, the transmission of the side surfaces S2, S3, and S4 of the element body 1 of the magnetic field component and electric field component constituting the noise is suppressed, and is emitted from the interposer to the outside. Noise and noise entering the interposer from the outside are suppressed.
  • FIG. 8 shows an interposer 800 according to the fifth embodiment. However, FIG. 8 is a perspective view of the interposer 800.
  • the interposer 800 has changed a part of the configuration of the interposer 700 according to the fourth embodiment. Specifically, in the interposer 700, the metal shield 51 is formed on the entire surface of each of the three side surfaces S2, S3, and S4 of the element body 1. In the interposer 800, instead of this, metal shields 66 are partially formed on the lower half of the three side surfaces S2, S3, S4 of the element body 1, respectively.
  • the metal shields 66 may be partially formed on the side surfaces S2, S3, and S4 of the element body 1, respectively.
  • FIG. 9 shows an interposer 900 according to the sixth embodiment. However, FIG. 9 is a perspective view of the interposer 900.
  • the interposer 900 has also changed a part of the configuration of the interposer 700 according to the fourth embodiment.
  • connection terminal electrode (second connection terminal electrode) 76 formed on the side surface S1 of the element body 1 is set to the size of the connection terminal electrode (second connection) of the interposer 700.
  • Terminal electrode) 6 was made smaller than the size.
  • a plating layer 76 a is formed on the surface of the connection terminal electrode 76.
  • metal shields 71a and 71b were formed on the side surface S1 of the element body 1 where the connection terminal electrode 76 was not formed. More specifically, the metal shield 71a was formed along the side in contact with the top surface T of the side surface S1 of the element body 1, and the metal shield 71b was formed along the side in contact with the bottom surface B.
  • the interposer 900 has an improved noise shielding effect.
  • the formation positions of the metal shields on the outer surface of the element body 1 are as follows. It is optional and is not limited to the above-described formation examples. The formation position can be appropriately set as necessary while confirming the noise shielding effect.
  • a metal shield may be partially formed on the top surface T of the element body 1.
  • FIG. 10 shows an electronic apparatus 1000 according to the seventh embodiment. However, FIG. 10 is a front view of the electronic apparatus 1000.
  • the interposer 700 according to the fourth embodiment described above is mounted on the circuit board 52.
  • the electronic component 53 is mounted on the circuit board 52 adjacent to the interposer 700.
  • Electronic device 1000 has a height H S of the metal shield 51 formed on the side surface S4 for facing the electronic parts 53 of the element body 1 is higher than the height H D of the electronic component 53.
  • the height H S of the metal shield 51 is lower than the height H D of the electronic components 53, can not be sufficiently shield the noise of metal shield 51, the radiated noise interposer electronic components 53 effect or apply, interposer there is a possibility that noise radiation or affect the electronic component 53, but in the electronic device 1000, the height H S of the metal shield 51 is greater than the height H D of the electronic component 53 Therefore, the influence of noise between the two is effectively suppressed.
  • FIG. 11A and 11B show an interposer 1100 according to the eighth embodiment.
  • FIG. 11A is a perspective view of the interposer 1100.
  • FIG. 11B is a cross-sectional view of the interposer 1100.
  • the interposer 1100 has changed a part of the configuration of the interposer 100 according to the first embodiment. Specifically, in the interposer 100, the four insulator layers 1a to 1d constituting the element body 1 are made of a nonmagnetic material. However, in the interposer 1100, the four insulator layers 1a to 1d are formed. Insulator layers 1b and 1c laminated in the middle were made of magnetic material Z. More specifically, the insulator layers 1b and 1c were made of a magnetic material Z made of ferrite.
  • the interposer 1100 also has a function of a so-called magnetic bead inductor (ferrite bead inductor), and can suppress passage of noise included in a signal passing through the interposer.
  • magnetic bead inductor ferrite bead inductor
  • FIG. 12A and 12B show an interposer 1200 according to the ninth embodiment.
  • FIG. 12A is a perspective view of the interposer 1200.
  • FIG. 12B is a cross-sectional view of the interposer 1200.
  • the interposer 1200 is a part of the configuration of the interposer 1100 according to the eighth embodiment described above. Specifically, in the interposer 1100, the two insulator layers 1b and 1c laminated in the middle of the element body 1 are made of the magnetic substance Z. In the interposer 1200, the four insulator layers 1a to 1d are formed. All were made of magnetic material Z.
  • the element body 1 may be partially made of a magnetic substance like the interposer 1100, or the entire element element 1 like the interposer 1200. May be made of a magnetic material.
  • Interposer 1200 also has the function of a magnetic bead inductor (ferrite bead inductor).
  • FIGS. 13A and 13B show an interposer 1300 according to the tenth embodiment.
  • FIG. 13A is a perspective view of the interposer 1300.
  • FIG. 13B is an exploded perspective view of the interposer 1300, and shows a state where the metal shields 51, 71a, 71b are removed.
  • the interposer 1300 is a combination of the features of the interposer 900 according to the sixth embodiment and the features of the interposer 1100 according to the eighth embodiment.
  • the interposer 1300 is formed by using the magnetic body Z as the insulator layers 1b and 1c laminated in the middle of the four insulating layers 1a to 1d constituting the element body 1. did.
  • the metal shields 71a and 71b are formed on the side surface S1 of the element body 1, and the metal shield 51 is formed on the side surfaces S2 to S4 of the element body 1.
  • the interposer 1300 Since the interposer 1300 is formed with the metal shields 51, 71a, 71b, noise radiated to the outside from the interposer and noise entering from the outside to the inside of the interposer are suppressed. Further, the interposer 1300 has a function of a so-called magnetic bead inductor (ferrite bead inductor) because the insulator layers 1b and 1c constituting the element body 1 are made of the magnetic body Z.
  • magnetic bead inductor ferrite bead inductor
  • interposers 100, 300, 500, 700, 800, 900, 1100, 1200, 1300, and the electronic devices 200, 400, 600, 1000 according to the embodiments have been described above.
  • the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
  • the element body 1 is a laminated element body in which insulator layers 1a to 1d such as ceramics are laminated.
  • the element body of the interposer is not limited to the laminated element body, and may be a block element body constituted by one block.
  • the material of the element body is also arbitrary, and may be made of resin or the like instead of ceramic.
  • the electronic device 200 is a portable electronic device such as a smartphone
  • the type of the electronic device is arbitrary and may be another type of electronic device.
  • FIGS. 3A, 3B, 5A, 5B, 6A, 6B, and 10 showing the electronic devices 200, 400, 600, and 1000
  • the dimensions of the interposers 100, 300, 500, and 700 are shown to be larger than those of other configurations.
  • the interposers 100, 300, 500, and 700 can be manufactured to extremely small dimensions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Provided is an interposer that is capable of connecting a plurality of wiring members such as flat cables as well as substrates, electronic components, etc. The interposer comprises: an element body (1) of an insulator having a bottom surface (B), a top surface (T), and a plurality of side surfaces (S1 to S4); a first connection terminal electrode (5) provided on the top surface (T), and connected to the outside with an electrically conductive joining member interposed therebetween; a second connection terminal electrode (6) provided on the side surface (S1), and connected to the outside with the electrically conductive joining member interposed therebetween; and a mounting terminal electrode (4) provided on the bottom surface (B), and connected to a circuit board with the electrically conductive bonding material interposed therebetween.

Description

インターポーザおよび電子機器Interposers and electronic devices
　本発明は、回路基板に実装され、フラットケーブルなどを接続して使用するインターポーザに関し、さらに詳しくは、複数のフラットケーブルなどを接続することができるインターポーザに関する。 The present invention relates to an interposer mounted on a circuit board and used by connecting a flat cable or the like, and more particularly to an interposer capable of connecting a plurality of flat cables or the like.
　また、本発明は、本発明のインターポーザを使用した電子機器に関し、さらに詳しくは、複数のフラットケーブルなどを接続するために要する回路基板上の面積が小さい電子機器に関する。 The present invention also relates to an electronic device using the interposer of the present invention, and more particularly, to an electronic device having a small area on a circuit board required for connecting a plurality of flat cables and the like.
　スマートフォン等の電子機器において、離れて配置された回路基板と回路基板とを接続するのに、フラットケーブルを使用する場合がある。 In an electronic device such as a smartphone, a flat cable may be used to connect a circuit board and a circuit board that are arranged apart from each other.
　そのような電子機器が、特許文献１（特許第５８４２８５０号公報）に開示されている。図１４（Ａ）、（Ｂ）に、特許文献１に開示された電子機器（携帯電子機器）１４００を示す。ただし、図１４（Ａ）は、電子機器１４００の側面断面図である。図１４（Ｂ）は、電子機器１４００の平面断面図である。 Such an electronic device is disclosed in Patent Document 1 (Japanese Patent No. 5842850). 14A and 14B show an electronic device (portable electronic device) 1400 disclosed in Patent Document 1. FIG. Note that FIG. 14A is a side cross-sectional view of the electronic device 1400. FIG. 14B is a plan cross-sectional view of the electronic device 1400.
　電子機器１４００は、筐体（機器筐体）１０１の内部に、２つの回路基板（実装回路基板）１０２と、バッテリーパック１０３とが収容されている。より具体的には、一方の回路基板１０２と、バッテリーパック１０３と、他方の回路基板１０２とが、この順番に、並べて収容されている。 In the electronic device 1400, two circuit boards (mounting circuit boards) 102 and a battery pack 103 are accommodated in a housing (equipment housing) 101. More specifically, one circuit board 102, the battery pack 103, and the other circuit board 102 are accommodated side by side in this order.
　２つの回路基板１０２には、それぞれ、電子部品（ＩＣチップ、実装部品）１０４が実装されている。また、２つの回路基板１０２には、それぞれ、後述するフラットケーブル１０６を接続するための同軸コネクタ１０５が実装されている。 Electronic components (IC chips, mounting components) 104 are mounted on the two circuit boards 102, respectively. In addition, a coaxial connector 105 for connecting a flat cable 106 described later is mounted on each of the two circuit boards 102.
　離れて配置された２つの回路基板１０２は、フラットケーブル１０６によって接続されている。より具体的には、フラットケーブル１０６の両端に、それぞれ、同軸コネクタ１０７が接続されており、一方の同軸コネクタ１０７が一方の回路基板１０２に実装された同軸コネクタ１０５に接続され、他方の同軸コネクタ１０７が他方の回路基板１０２に実装された同軸コネクタ１０５に接続されている。 The two circuit boards 102 arranged apart from each other are connected by a flat cable 106. More specifically, a coaxial connector 107 is connected to both ends of the flat cable 106, one coaxial connector 107 is connected to the coaxial connector 105 mounted on one circuit board 102, and the other coaxial connector is connected. 107 is connected to a coaxial connector 105 mounted on the other circuit board 102.
　フラットケーブル１０６は、図示しないが、多層に形成されており、信号導体と、信号導体よりも幅の広いグランド導体とが、絶縁層を間に挟んで上下に重ねて設けられた構造である。信号導体、グランド導体は、それぞれ、たとえば、銅（銅箔）によって作製されている。フラットケーブル１０６は、ある程度の可撓性を備えている。 Although not shown, the flat cable 106 is formed in multiple layers, and has a structure in which a signal conductor and a ground conductor wider than the signal conductor are vertically stacked with an insulating layer interposed therebetween. The signal conductor and the ground conductor are each made of, for example, copper (copper foil). The flat cable 106 has a certain degree of flexibility.
特許第５８４２８５０号公報Japanese Patent No. 5842850
　電子機器１４００は、２つの回路基板１０２を、フラットケーブル１０６によって接続している。しかしながら、電子機器によっては、多数（３つ以上）の回路基板を備え、それらの回路基板同士をフラットケーブルによって接続したい場合がある。このような電子機器においては、１つの回路基板に、複数のフラットケーブルを接続することが必要になる。 The electronic device 1400 has two circuit boards 102 connected by a flat cable 106. However, some electronic devices may include a large number (three or more) of circuit boards, and the circuit boards may be connected to each other by a flat cable. In such an electronic device, it is necessary to connect a plurality of flat cables to one circuit board.
　１つの回路基板への複数のフラットケーブルの接続を、電子機器１４００のように、回路基板１０２に実装された同軸コネクタ１０５と、フラットケーブル１０６の端部に設けられた同軸コネクタ１０７とを接続することによっておこなおうとした場合、回路基板１０２に、複数の同軸コネクタ１０５を実装することが必要になる。 A plurality of flat cables are connected to one circuit board by connecting the coaxial connector 105 mounted on the circuit board 102 and the coaxial connector 107 provided at the end of the flat cable 106 as in the electronic device 1400. When trying to do so, it is necessary to mount a plurality of coaxial connectors 105 on the circuit board 102.
　しかしながら、同軸コネクタ１０５や１０７は、リン青銅などの金属板を機械的に加工して作製した機械的構造物であり、平面方向の寸法、および、高さ方向の寸法が、それぞれ大きい。そのため、回路基板１０２に複数の同軸コネクタ１０５を実装しようとした場合、実装するための大きな面積（領域）が回路基板１０２に必要になるという問題があった。また、実装された複数の同軸コネクタ１０５それぞれに、同軸コネクタ１０７が接続されるため、回路基板１０２上に、同軸コネクタ１０５、１０７を配置するための大きな空間が必要になるという問題があった。その結果、回路基板１０２が大型化し、電子機器自体も大型化してしまうという問題があった。 However, the coaxial connectors 105 and 107 are mechanical structures manufactured by mechanically processing a metal plate such as phosphor bronze, and have a large dimension in the plane direction and a dimension in the height direction. Therefore, when trying to mount a plurality of coaxial connectors 105 on the circuit board 102, there is a problem that a large area (region) for mounting is required for the circuit board 102. Further, since the coaxial connector 107 is connected to each of the plurality of mounted coaxial connectors 105, there is a problem that a large space for arranging the coaxial connectors 105 and 107 is required on the circuit board 102. As a result, there is a problem that the circuit board 102 is enlarged and the electronic device itself is also enlarged.
　本発明は、上述した従来の課題を解決するためになされたものであり、その手段として本発明のインターポーザは、底面と、天面と、前記底面と前記天面とを繋ぐ複数の側面とを有する絶縁体の素体と、天面に設けられ、導電性接合材を介して外部に接続される第１接続用端子電極と、側面に設けられ、導電性接合材を介して外部に接続される第２接続用端子電極と、底面に設けられ、導電性接合材を介して回路基板に接続される実装用端子電極と、を備えたものとした。 The present invention has been made to solve the above-described conventional problems, and as its means, the interposer of the present invention includes a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface. An insulating element body, a first connection terminal electrode provided on the top surface and connected to the outside via the conductive bonding material, and provided on the side surface and connected to the outside via the conductive bonding material. A second connection terminal electrode, and a mounting terminal electrode provided on the bottom surface and connected to the circuit board via a conductive bonding material.
　なお、第１接続用端子電極、第２接続用端子電極には、フラットケーブルなどの配線部材や、基板や、電子部品などを接続することができる。なお、配線部材の場合は、フラットケーブルには限られず、一般的なリード線などを接続しても良い。 Note that a wiring member such as a flat cable, a substrate, an electronic component, or the like can be connected to the first connection terminal electrode and the second connection terminal electrode. In addition, in the case of a wiring member, it is not restricted to a flat cable, You may connect a general lead wire etc.
　素体は、たとえば、直方体で、４つの側面を備えたものとすることができる。 The element body can be, for example, a rectangular parallelepiped and has four side surfaces.
　２以上の側面に、それぞれ、第２接続用端子電極を設けても良い。この場合には、それぞれの第２接続用端子電極に、それぞれ第２フラットケーブルを接続することができる。 A second connection terminal electrode may be provided on each of two or more side surfaces. In this case, a second flat cable can be connected to each second connection terminal electrode.
　素体は、たとえば、セラミックによって作製することができる。この場合には、耐熱性に優れたインターポーザを作製することができる。 The element body can be made of ceramic, for example. In this case, an interposer with excellent heat resistance can be produced.
　素体が、絶縁体層が積層された積層素体であることが好ましい。この場合には、絶縁体層の両主面間を貫通させて形成されたビアホール導体と、絶縁体層の層間に形成された線路導体とで配線電極を構成し、配線電極によって、第１接続用端子電極と、第２接続用端子電極と、実装用端子電極との間の必要な接続をおこなうことができる。 The element body is preferably a laminated element body in which insulator layers are laminated. In this case, a wiring electrode is constituted by a via-hole conductor formed so as to penetrate between both main surfaces of the insulator layer and a line conductor formed between the layers of the insulator layer, and the first connection is made by the wiring electrode. Necessary connection among the terminal electrode for mounting, the terminal electrode for second connection, and the terminal electrode for mounting can be performed.
　第２接続用端子電極を、絶縁体層に設けられたビアホール導体の分割断面によって形成することができる。この場合には、第２接続用端子電極を容易に形成することができる。 The second connection terminal electrode can be formed by a divided cross section of the via-hole conductor provided in the insulator layer. In this case, the second connection terminal electrode can be easily formed.
　素体の外表面に金属シールドが形成されることも好ましい。この場合には、金属シールドによって、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズを抑制することができる。 It is also preferable that a metal shield be formed on the outer surface of the element body. In this case, the metal shield can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside.
　上記の場合において、素体の少なくとも１つの側面の、全面または一部分に、金属シールドが形成されることも好ましい。また、第２接続用端子電極が形成されていない少なくとも１つの側面の、全面または一部分に、金属シールドが形成されることも好ましい。また、第２接続用端子電極が形成された少なくとも１つの側面の、第２接続用端子電極が形成されていない部分に、金属シールドが形成されることも好ましい。さらに、金属シールドが、素体の複数の側面の外周を一回りするように形成されることも好ましい。これらの場合には、ノイズの放射や浸入を効果的に抑制することができる。 In the above case, it is also preferable that a metal shield is formed on the entire surface or a part of at least one side surface of the element body. It is also preferable that a metal shield is formed on the entire surface or a part of at least one side surface where the second connection terminal electrode is not formed. Moreover, it is also preferable that a metal shield is formed on a portion where the second connection terminal electrode is not formed on at least one side surface where the second connection terminal electrode is formed. Furthermore, it is also preferable that the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body. In these cases, noise emission and penetration can be effectively suppressed.
　素体が磁性体からなることも好ましい。この場合には、インターポーザに、ノイズの通過を抑制する、いわゆる磁性ビーズインダクタ（磁性体がフェライトである場合はフェライトビーズインダクタ）の機能をもたせることができる。 It is also preferable that the element body is made of a magnetic material. In this case, the interposer can have a function of a so-called magnetic bead inductor (a ferrite bead inductor when the magnetic material is ferrite) that suppresses the passage of noise.
　素体が、複数の絶縁体層が積層された積層素体からなり、絶縁体層の一部が磁性体からなるようにしても良い。すなわち、素体全体を磁性体にしなくても、素体を複数の絶縁体層が積層された積層素体とし、絶縁体層の一部を磁性体にしても、インターポーザに、磁性ビーズインダクタ（磁性体がフェライトである場合はフェライトビーズインダクタ）の機能をもたせることができる。 The element body may be made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer may be made of a magnetic substance. That is, even if the entire element body is not a magnetic body, the element body is a laminated element body in which a plurality of insulator layers are stacked, and even if a part of the insulator layer is a magnetic body, a magnetic bead inductor ( When the magnetic material is ferrite, the function of a ferrite bead inductor) can be provided.
　また、本発明の電子機器は、底面と、天面と、底面と天面とを繋ぐ複数の側面とを有する絶縁体の素体と、天面に設けられた第１接続用端子電極と、側面に設けられた第２接続用端子電極と、底面に設けられた実装用端子電極と、を備えた、表面実装型のインターポーザと、回路基板と、第１配線部材と、第２配線部材と、を備え、インターポーザの実装用端子電極が、導電性接合材を介して回路基板に接続され、インターポーザの第１接続用端子電極に、導電性接合材を介して第１配線部材が接続され、インターポーザの第２接続用端子電極に、導電性接合材を介して第２配線部材が接続されたものとすることができる。 Moreover, the electronic device of the present invention includes a base body of an insulator having a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface, a first connection terminal electrode provided on the top surface, A surface-mount type interposer including a second connection terminal electrode provided on a side surface and a mounting terminal electrode provided on a bottom surface, a circuit board, a first wiring member, and a second wiring member; The mounting terminal electrode of the interposer is connected to the circuit board via the conductive bonding material, and the first wiring member is connected to the first connection terminal electrode of the interposer via the conductive bonding material, The second wiring member may be connected to the second connection terminal electrode of the interposer via a conductive bonding material.
　第１配線部材および第２配線部材の少なくとも一方が、フラットケーブルであることも好ましい。この場合には、接続端子への配線部材の接続が容易になる。 It is also preferable that at least one of the first wiring member and the second wiring member is a flat cable. In this case, the connection of the wiring member to the connection terminal is facilitated.
　インターポーザの側面に金属シールドが形成され、インターポーザの金属シールドが形成された側面に隣接して、回路基板上に、電子部品が実装され、金属シールドが、底面から、電子部品の高さよりも高い位置まで、側面を覆っていることも好ましい。この場合には、インターポーザが放射させたノイズが隣接する電子部品に浸入して影響を与えること、隣接する電子部品が放射させたノイズがインターポーザに侵入して影響を与えることを、効果的に抑制することができる。 A metal shield is formed on the side surface of the interposer, and an electronic component is mounted on the circuit board adjacent to the side surface on which the metal shield of the interposer is formed, and the metal shield is positioned higher than the height of the electronic component from the bottom surface. It is also preferable that the side surface is covered. In this case, it is possible to effectively suppress the noise radiated by the interposer from entering and affecting adjacent electronic components and the noise radiated by the adjacent electronic components from entering and affecting the interposer. can do.
　インターポーザの側面に金属シールドが形成され、金属シールドが、素体の複数の側面の外周を一回りするように形成されることも好ましい。この場合も、インターポーザからのノイズの放射や、インターポーザへのノイズの浸入を効果的に抑制することができる。 It is also preferable that a metal shield is formed on the side surface of the interposer and the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body. Also in this case, it is possible to effectively suppress noise emission from the interposer and noise intrusion into the interposer.
　本発明のインターポーザは、複数のフラットケーブルなどの配線部材や、基板や、電子部品などを接続することができる。すなわち、たとえば、天面に設けられた第１接続用端子電極に、フラットケーブルなどの第１配線部材を接続し、側面に設けられた第２接続用端子電極に、フラットケーブルなどの第２配線部材を接続することができる。したがって、本発明のインターポーザを使用すれば、回路基板に、大きな面積（領域）を必要とすることなく、複数の配線部材などを接続することができる。なお、配線部材を接続する場合は、フラットケーブルには限られず、一般的なリード線などを接続しても良い。 The interposer of the present invention can connect a wiring member such as a plurality of flat cables, a substrate, an electronic component, and the like. That is, for example, a first wiring member such as a flat cable is connected to the first connection terminal electrode provided on the top surface, and a second wiring such as a flat cable is connected to the second connection terminal electrode provided on the side surface. Members can be connected. Therefore, if the interposer of the present invention is used, a plurality of wiring members and the like can be connected to the circuit board without requiring a large area (region). In addition, when connecting a wiring member, it is not restricted to a flat cable, You may connect a general lead wire.
　また、本発明の電子機器は、本発明のインターポーザを使用しているため、複数のフラットケーブルなどの配線部材や、基板や、電子部品などを接続するために要する回路基板上の面積が小さい。したがって、本発明の電子機器は、回路基板が大型化しておらず、電子機器自体も大型化していない。 Further, since the electronic device of the present invention uses the interposer of the present invention, the area on the circuit board required for connecting wiring members such as a plurality of flat cables, substrates, electronic components, and the like is small. Therefore, in the electronic device of the present invention, the circuit board is not enlarged, and the electronic device itself is not enlarged.
実施形態１にかかるインターポーザ１００を示す斜視図である。1 is a perspective view showing an interposer 100 according to Embodiment 1. FIG. インターポーザ１００の断面図であり、図１の一点鎖線Ｘ-Ｘ部分を示している。It is sectional drawing of the interposer 100, and has shown the dashed-dotted line XX part of FIG. 図３（Ａ）、（Ｂ）は、それぞれ、実施形態１にかかる電子機器２００を示す要部斜視図である。FIGS. 3A and 3B are perspective views of main parts showing the electronic apparatus 200 according to the first embodiment. 図４（Ａ）～（Ｄ）は、それぞれ、インターポーザ１００の製造方法の一例において実施される工程を示す断面図である。4A to 4D are cross-sectional views showing steps performed in an example of a method for manufacturing the interposer 100. 図５（Ａ）、（Ｂ）は、それぞれ、実施形態２にかかる電子機器４００を示す要部斜視図である。FIGS. 5A and 5B are perspective views of main parts showing the electronic apparatus 400 according to the second embodiment. 図６（Ａ）、（Ｂ）は、それぞれ、実施形態３にかかる電子機器６００を示す要部斜視図である。FIGS. 6A and 6B are perspective views illustrating main parts of an electronic apparatus 600 according to the third embodiment. 図７（Ａ）は、実施形態４にかかるインターポーザ７００の斜視図である。図７（Ｂ）は、インターポーザ７００の平面図である。図７（Ｃ）は、インターポーザ７００の断面図である。FIG. 7A is a perspective view of an interposer 700 according to the fourth embodiment. FIG. 7B is a plan view of the interposer 700. FIG. 7C is a cross-sectional view of the interposer 700. 実施形態５にかかるインターポーザ８００の斜視図である。It is a perspective view of the interposer 800 concerning Embodiment 5. FIG. 実施形態６にかかるインターポーザ９００の斜視図である。It is a perspective view of the interposer 900 concerning Embodiment 6. FIG. 実施形態７にかかる電子機器１０００の斜視図である。It is a perspective view of the electronic device 1000 concerning Embodiment 7. FIG. 図１１（Ａ）は、実施形態８にかかるインターポーザ１１００の斜視図である。図１１（Ｂ）は、インターポーザ１１００の断面図である。FIG. 11A is a perspective view of an interposer 1100 according to the eighth embodiment. FIG. 11B is a cross-sectional view of the interposer 1100. 図１２（Ａ）は、実施形態９にかかるインターポーザ１２００の斜視図である。図１２（Ｂ）は、インターポーザ１２００の断面図である。FIG. 12A is a perspective view of an interposer 1200 according to the ninth embodiment. FIG. 12B is a cross-sectional view of the interposer 1200. 図１３（Ａ）は、実施形態１０にかかるインターポーザ１３００の斜視図である。図１３（Ｂ）は、インターポーザ１３００の分解斜視図である。FIG. 13A is a perspective view of an interposer 1300 according to the tenth embodiment. FIG. 13B is an exploded perspective view of the interposer 1300. 図１４（Ａ）は、特許文献１に開示された電子機器１４００の側面断面図である。図１４（Ｂ）は、電子機器１４００の平面断面図である。FIG. 14A is a side cross-sectional view of the electronic device 1400 disclosed in Patent Document 1. FIG. FIG. 14B is a plan cross-sectional view of the electronic device 1400.
　以下、図面とともに、本発明を実施するための形態について説明する。 Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
　なお、各実施形態は、本発明の実施の形態を例示的に示したものであり、本発明が実施形態の内容に限定されることはない。また、異なる実施形態に記載された内容を組合せて実施することも可能であり、その場合の実施内容も本発明に含まれる。また、図面は、実施形態の理解を助けるためのものであり、必ずしも厳密に描画されていない場合がある。たとえば、描画された構成要素ないし構成要素間の寸法の比率が、明細書に記載されたそれらの寸法の比率と一致していない場合がある。また、明細書に記載されている構成要素が、図面において省略されている場合や、個数を省略して描画されている場合などがある。 Each embodiment shows an embodiment of the present invention by way of example, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.
　［実施形態１］
　図１、図２に、実施形態１にかかるインターポーザ１００を示す。また、図３（Ａ）、（Ｂ）に、インターポーザ１００を使用して作製した実施形態１にかかる電子機器２００を示す。ただし、図１は、インターポーザ１００を示す斜視図である。図２は、インターポーザ１００を示す断面図であり、図１の一点鎖線Ｘ－Ｘ部分を示している。また、図３（Ａ）、（Ｂ）は、それぞれ、電子機器２００を示す要部斜視図である。 [Embodiment 1]
1 and 2 show an interposer 100 according to the first embodiment. 3A and 3B show an electronic device 200 according to the first embodiment manufactured using the interposer 100. FIG. However, FIG. 1 is a perspective view showing the interposer 100. FIG. 2 is a cross-sectional view showing the interposer 100, and shows a portion indicated by an alternate long and short dash line XX in FIG. FIGS. 3A and 3B are perspective views showing main parts of the electronic device 200, respectively.
　（インターポーザ１００）
　実施形態１にかかるインターポーザ１００は、直方体の素体１を備える。素体１は、４層の絶縁体層１ａ～１ｄが積層された構造である。素体１（絶縁体層１ａ～１ｃ）は、たとえば、ＬＴＣＣ（Low Temperature Co-fired Ceramics；低温同時焼成セラミック）などのセラミックによって作製されている。 (Interposer 100)
The interposer 100 according to the first embodiment includes a rectangular parallelepiped element body 1. The element body 1 has a structure in which four insulating layers 1a to 1d are laminated. The element body 1 (insulator layers 1a to 1c) is made of a ceramic such as LTCC (Low Temperature Co-fired Ceramics).
　素体１は、天面Ｔと、底面Ｂと、４つの側面Ｓ１、Ｓ２、Ｓ３、Ｓ４とを備えている。 The element body 1 includes a top surface T, a bottom surface B, and four side surfaces S1, S2, S3, and S4.
　絶縁体層１ａ～１ｄを貫通して、ビアホール導体２が形成されている。また、絶縁体層１ａ～１ｄの層間に、必要に応じて、線路導体３が形成されている。そして、ビアホール導体２と線路導体３とを使って、素体１の内部に、配線電極が形成されている。ビアホール導体２、線路導体３は、それぞれ、たとえば、銀や銅などを主成分とする金属によって形成されている。 Via hole conductors 2 are formed through the insulator layers 1a to 1d. A line conductor 3 is formed between the insulator layers 1a to 1d as necessary. A wiring electrode is formed inside the element body 1 using the via-hole conductor 2 and the line conductor 3. The via-hole conductor 2 and the line conductor 3 are each formed of a metal whose main component is, for example, silver or copper.
　素体１の底面Ｂに、実装用端子電極４が形成されている。実装用端子電極４は、たとえば、銀や銅などを主成分とする金属によって形成されている。 A mounting terminal electrode 4 is formed on the bottom surface B of the element body 1. The mounting terminal electrode 4 is formed of, for example, a metal whose main component is silver or copper.
　素体１の天面Ｔに、フラットケーブルなどに接続される接続用端子電極（第１接続用端子電極）５が形成されている。接続用端子電極５は、たとえば、銀や銅などを主成分とする金属によって形成されている。 A connection terminal electrode (first connection terminal electrode) 5 connected to a flat cable or the like is formed on the top surface T of the element body 1. The connection terminal electrode 5 is made of, for example, a metal whose main component is silver or copper.
　素体１の１つの側面Ｓ１に、フラットケーブルなどに接続される接続用端子電極（第２接続用端子電極）６が形成されている。接続用端子電極６は、たとえば、銀や銅などを主成分とする金属によって形成されている。なお、接続用端子電極６は、絶縁体層１ｂ、１ｃに形成されたビアホール導体２の分割断面によって形成されている。 A connection terminal electrode (second connection terminal electrode) 6 connected to a flat cable or the like is formed on one side surface S1 of the element body 1. The connection terminal electrode 6 is made of, for example, a metal whose main component is silver or copper. The connection terminal electrode 6 is formed by a divided cross section of the via-hole conductor 2 formed in the insulator layers 1b and 1c.
　なお、接続用端子電極５、接続用端子電極６に接続される対象は、それぞれ任意である。フラットケーブルなどの配線部材であっても良いし、基板であっても良いし、電子部品などであっても良い。また、配線部材である場合も、フラットケーブルには限られず、一般的なリード線などを接続しても良い。 The target connected to the connection terminal electrode 5 and the connection terminal electrode 6 is arbitrary. It may be a wiring member such as a flat cable, a substrate, or an electronic component. Further, the wiring member is not limited to the flat cable, and a general lead wire or the like may be connected.
　実装用端子電極４の表面にめっき層４ａが形成され、接続用端子電極５の表面にめっき層５ａが形成され、接続用端子電極６の表面にめっき層６ａが形成されている。めっき層４ａ、５ａ、６ａは、たとえば、第１層がニッケルによって形成され、第２層が金、銅、錫から選ばれる１つの金属によって形成されている。ただし、めっき層は、多層構造ではなく、単層構造であっても良い。また、めっき層の材質も任意であり、他の金属によって形成されても良い。 The plating layer 4 a is formed on the surface of the mounting terminal electrode 4, the plating layer 5 a is formed on the surface of the connection terminal electrode 5, and the plating layer 6 a is formed on the surface of the connection terminal electrode 6. In the plating layers 4a, 5a, and 6a, for example, the first layer is formed of nickel, and the second layer is formed of one metal selected from gold, copper, and tin. However, the plating layer may have a single layer structure instead of a multilayer structure. Moreover, the material of a plating layer is also arbitrary and may be formed with another metal.
　実装用端子電極４と、接続用端子電極５と、接続用端子電極６とが、素体１の内部において、必要に応じて、配線電極（ビアホール導体２と線路導体３とを使って形成した配線電極）によって接続されている。 The mounting terminal electrode 4, the connection terminal electrode 5, and the connection terminal electrode 6 are formed inside the element body 1 using wiring electrodes (via-hole conductor 2 and line conductor 3) as necessary. Are connected by wiring electrodes).
　（インターポーザ１００の製造方法）
　図４（Ａ）～（Ｄ）に、インターポーザ１００の製造方法の一例を示す。 (Manufacturing method of interposer 100)
4A to 4D show an example of a method for manufacturing the interposer 100. FIG.
　まず、図４（Ａ）に示すように、素体１を作製するための、マザーグリーンシート１１ａ～１１ｄを用意する。マザーグリーンシート１１ａ～１１ｄは、それぞれ、多数のインターポーザ１００を一括して製造するように、多数個分のグリーンシートが、マトリックス状に配置されたものからなる。なお、図３（Ａ）、（Ｂ）に示す破線は、一括して作製された多数のインターポーザ１００を、個々のインターポーザ１００に区分する分割ラインである。 First, as shown in FIG. 4 (A), mother green sheets 11a to 11d for preparing the element body 1 are prepared. Each of the mother green sheets 11a to 11d is made up of a large number of green sheets arranged in a matrix so that a large number of interposers 100 can be manufactured together. The broken lines shown in FIGS. 3A and 3B are dividing lines that divide a large number of batched interposers 100 into individual interposers 100.
　下から１番目に積層されるマザーグリーンシート１１ａの個々のグリーンシートの下側主面には、実装用端子電極４を形成するための導電性ペースト１４が、予め、所定の形状に印刷されている。また、マザーグリーンシート１１ａの個々のグリーンシートの所定の部分に、両主面間を貫通した孔が形成され、孔の内部にビアホール導体２を形成するための導電性ペースト１２が充填されている。 On the lower main surface of each green sheet of the mother green sheet 11a that is stacked first from the bottom, a conductive paste 14 for forming the mounting terminal electrode 4 is printed in a predetermined shape in advance. Yes. In addition, a hole penetrating between both main surfaces is formed in a predetermined portion of each green sheet of the mother green sheet 11a, and a conductive paste 12 for forming the via-hole conductor 2 is filled in the hole. .
　下から２番目に積層されるマザーグリーンシート１１ｂの個々のグリーンシートの所定の部分に、両主面間を貫通した孔が形成され、孔の内部にビアホール導体２および接続用端子電極６を形成するための導電性ペースト１２が充填されている。 A hole penetrating between both main surfaces is formed in a predetermined portion of each green sheet of the mother green sheet 11b that is stacked second from the bottom, and the via-hole conductor 2 and the connection terminal electrode 6 are formed in the hole. The conductive paste 12 for filling is filled.
　下から３番目に積層されるマザーグリーンシート１１ｃの個々のグリーンシートの下側主面には、線路導体３を形成するための導電性ペースト１３が、予め、所定の形状に印刷されている。また、マザーグリーンシート１１ｃの個々のグリーンシートの所定の部分に、両主面間を貫通した孔が形成され、孔の内部にビアホール導体２および接続用端子電極６を形成するための導電性ペースト１２が充填されている。 A conductive paste 13 for forming the line conductor 3 is printed in a predetermined shape on the lower main surface of each green sheet of the mother green sheet 11c that is stacked third from the bottom. Further, a conductive paste for forming a via hole conductor 2 and a connection terminal electrode 6 in the hole is formed in a predetermined portion of each green sheet of the mother green sheet 11c through both main surfaces. 12 is filled.
　下から４番目に積層されるマザーグリーンシート１１ｄの個々のグリーンシートの所定の部分に、両主面間を貫通した孔が形成され、孔の内部にビアホール導体２を形成するための導電性ペースト１２が充填されている。また、マザーグリーンシート１１ｄの個々のグリーンシートの上側主面には、接続用端子電極５を形成するための導電性ペースト１５が、予め、所定の形状に印刷されている。 A conductive paste for forming a via hole conductor 2 in a predetermined portion of each green sheet of the mother green sheet 11d that is laminated fourth from the bottom and forming a via-hole conductor 2 inside the hole. 12 is filled. Further, a conductive paste 15 for forming the connection terminal electrode 5 is printed in a predetermined shape on the upper main surface of each green sheet of the mother green sheet 11d.
　次に、マザーグリーンシート１１ａ～１１ｄを積層し、上下から押圧して一体化させた後、所定のプロファイルで焼成して、図４（Ｂ）に示すマザー素体１’を作製する。この結果、マザー素体１’の内部に、ビアホール導体２と線路導体３とが形成され、ビアホール導体２と線路導体３とで配線電極が構成される。また、マザー素体１’の下側主面に、実装用端子電極４が形成される。また、マザー素体１’の上側主面に、接続用端子電極５が形成される。 Next, the mother green sheets 11a to 11d are stacked, pressed and integrated from above and below, and then fired with a predetermined profile to produce a mother body 1 'shown in FIG. As a result, the via-hole conductor 2 and the line conductor 3 are formed inside the mother element body 1 ′, and the via-hole conductor 2 and the line conductor 3 constitute a wiring electrode. A mounting terminal electrode 4 is formed on the lower main surface of the mother element body 1 ′. Further, the connection terminal electrode 5 is formed on the upper main surface of the mother body 1 ′.
　次に、図４（Ｃ）に示すように、マザー素体１’の分割ラインを、たとえばダイサーによって分割して、個々の素体１を得る。なお、このとき、分割ライン上に配置されていたビアホール導体２が縦方向に２分割され、各素体１の側面Ｓ１に接続用端子電極６が形成される。 Next, as shown in FIG. 4C, the dividing lines of the mother element body 1 ′ are divided by, for example, a dicer to obtain individual element bodies 1. At this time, the via-hole conductor 2 arranged on the dividing line is divided into two in the vertical direction, and the connection terminal electrode 6 is formed on the side surface S1 of each element body 1.
　次に、図４（Ｄ）に示すように、たとえば、電解めっきにより、実装用端子電極４の表面にめっき層４ａを形成し、接続用端子電極５の表面にめっき層５ａを形成し、接続用端子電極６の表面にめっき層６ａを形成して、インターポーザ１００を完成させる。 Next, as shown in FIG. 4D, the plating layer 4a is formed on the surface of the mounting terminal electrode 4 by, for example, electrolytic plating, and the plating layer 5a is formed on the surface of the connection terminal electrode 5, so as to be connected. A plating layer 6 a is formed on the surface of the terminal electrode 6 for use, and the interposer 100 is completed.
　（電子機器２００）
　インターポーザ１００を使用して、図３（Ａ）、（Ｂ）に示す、実施形態１にかかる電子機器２００を作製した。電子機器２００は、たとえば、スマートフォン等の携帯型の電子機器である。なお、図３（Ａ）は、筐体を省略し、筐体の内部を示した、電子機器２００の要部斜視図である。さらに、図３（Ｂ）は、フラットケーブルも省略した、電子機器２００の要部斜視図である。 (Electronic device 200)
Using the interposer 100, the electronic device 200 according to the first embodiment shown in FIGS. 3A and 3B was manufactured. The electronic device 200 is, for example, a portable electronic device such as a smartphone. Note that FIG. 3A is a perspective view of a main part of the electronic device 200 in which the housing is omitted and the inside of the housing is illustrated. Further, FIG. 3B is a perspective view of a main part of the electronic device 200 without a flat cable.
　電子機器２００は、筐体（図示せず）を備える。筐体は、たとえば、樹脂によって作製されている。 The electronic device 200 includes a housing (not shown). The housing is made of resin, for example.
　筐体の内部に、第１の回路基板２１と、第２の回路基板２２と、第３の回路基板２３とが収容されている。 A first circuit board 21, a second circuit board 22, and a third circuit board 23 are accommodated in the housing.
　第１の回路基板２１、第２の回路基板２２、第３の回路基板２３には、それぞれ、半導体装置、キャパシタ、抵抗、インダクタなどの電子部品２４が実装されている。なお、電子部品２４の実装は、回路基板２１～２３の主面に形成された実装用電極と、電子部品２４の端子電極とを、はんだや、導電性接着剤などの導電性接合材によって接合することによっておこなわれている。 Electronic components 24 such as semiconductor devices, capacitors, resistors, and inductors are mounted on the first circuit board 21, the second circuit board 22, and the third circuit board 23, respectively. The electronic component 24 is mounted by bonding the mounting electrodes formed on the main surfaces of the circuit boards 21 to 23 and the terminal electrodes of the electronic component 24 with a conductive bonding material such as solder or a conductive adhesive. It is done by doing.
　第１の回路基板２１には、インターポーザ３０が実装されている。インターポーザ３０は、側面に２つの接続用端子電極３６が形成されている。インターポーザ３０の実装は、回路基板２１の主面に形成された実装用電極と、インターポーザ３０の底面に形成された実装用端子電極とを、はんだや、導電性接着剤などの導電性接合材によって接合することによっておこなわれている。 The interposer 30 is mounted on the first circuit board 21. The interposer 30 has two connection terminal electrodes 36 formed on the side surface. The interposer 30 is mounted by connecting a mounting electrode formed on the main surface of the circuit board 21 and a mounting terminal electrode formed on the bottom surface of the interposer 30 with a conductive bonding material such as solder or a conductive adhesive. It is done by joining.
　第２の回路基板２２には、上述した実施形態１にかかるインターポーザ１００が実装されている。インターポーザ１００は、天面に４つの接続用端子電極（第１接続用端子電極）５が形成され、４つある側面のうちの１つの側面に２つの接続用端子電極（第２接続用端子電極）６が形成されている。インターポーザ１００の実装は、回路基板２２の主面に形成された実装用電極と、インターポーザ１００の底面に形成された実装用端子電極４とを、はんだや、導電性接着剤などの導電性接合材によって接合することによっておこなわれている。 The interposer 100 according to the first embodiment described above is mounted on the second circuit board 22. The interposer 100 has four connection terminal electrodes (first connection terminal electrodes) 5 formed on the top surface, and two connection terminal electrodes (second connection terminal electrodes) on one of the four side surfaces. ) 6 is formed. The interposer 100 is mounted by connecting a mounting electrode formed on the main surface of the circuit board 22 and a mounting terminal electrode 4 formed on the bottom surface of the interposer 100 to a conductive bonding material such as solder or a conductive adhesive. It is done by joining by.
　第３の回路基板２３には、インターポーザ４０が実装されている。インターポーザ４０は、天面に４つの接続用端子電極４５が形成されている。インターポーザ４０の実装は、回路基板２３の主面に形成された実装用電極と、インターポーザ４０の底面に形成された実装用端子電極とを、はんだや、導電性接着剤などの導電性接合材によって接合することによっておこなわれている。 The interposer 40 is mounted on the third circuit board 23. The interposer 40 has four connection terminal electrodes 45 formed on the top surface. The interposer 40 is mounted by mounting a mounting electrode formed on the main surface of the circuit board 23 and a mounting terminal electrode formed on the bottom surface of the interposer 40 with a conductive bonding material such as solder or a conductive adhesive. It is done by joining.
　第１の回路基板２１に実装されたインターポーザ３０の側面に形成された接続用端子電極３６と、第２の回路基板２２に実装されたインターポーザ１００の側面に形成された接続用端子電極（第２接続用端子電極）６とが、フラットケーブル（第２フラットケーブル）２６によって接続されている。より具体的には、フラットケーブル２６の両端に、それぞれ、複数の接続用端子が形成されており、一方側の接続用端子がインターポーザ３０の接続用端子電極３６に、他方側の接続用端子がインターポーザ１００の接続用端子電極６に、それぞれ、はんだや、導電性接着剤などの導電性接合材によって接合されている。 A connection terminal electrode 36 formed on the side surface of the interposer 30 mounted on the first circuit board 21 and a connection terminal electrode (second electrode) formed on the side surface of the interposer 100 mounted on the second circuit board 22. A connection terminal electrode 6 is connected to a flat cable (second flat cable) 26. More specifically, a plurality of connection terminals are formed at both ends of the flat cable 26, one connection terminal is connected to the connection terminal electrode 36 of the interposer 30, and the other connection terminal is connected. Each of them is joined to the connection terminal electrode 6 of the interposer 100 by a conductive bonding material such as solder or a conductive adhesive.
　また、第２の回路基板２２に実装されたインターポーザ１００の天面に形成された接続用端子電極（第１接続用端子電極）５と、第３の回路基板２３に実装されたインターポーザ４０の天面に形成された接続用端子電極４５とが、フラットケーブル（第１フラットケーブル）２５によって接続されている。より具体的には、フラットケーブル２５の両端に、それぞれ、複数の接続用端子が形成されており、一方側の接続用端子がインターポーザ１００の接続用端子電極５に、他方側の接続用端子がインターポーザ４０の接続用端子電極４５に、それぞれ、はんだや、導電性接着剤などの導電性接合材によって接合されている。 Further, the connection terminal electrode (first connection terminal electrode) 5 formed on the top surface of the interposer 100 mounted on the second circuit board 22 and the top of the interposer 40 mounted on the third circuit board 23. A connection terminal electrode 45 formed on the surface is connected by a flat cable (first flat cable) 25. More specifically, a plurality of connection terminals are formed at both ends of the flat cable 25, one connection terminal is connected to the connection terminal electrode 5 of the interposer 100, and the other connection terminal is connected. Each of them is joined to the connection terminal electrode 45 of the interposer 40 by a conductive bonding material such as solder or a conductive adhesive.
　電子機器２００は、天面に接続用端子電極５が形成され、側面に接続用端子電極６が形成されたインターポーザ１００を使用しているため、第２の回路基板２２に大きな面積（領域）を必要とすることなく、第２の回路基板２２に２つのフラットケーブル２５、２６を接続することができる。 Since the electronic device 200 uses the interposer 100 in which the connection terminal electrode 5 is formed on the top surface and the connection terminal electrode 6 is formed on the side surface, the second circuit board 22 has a large area (region). The two flat cables 25 and 26 can be connected to the second circuit board 22 without need.
　また、電子機器２００は、インターポーザ１００が、天面および側面を任意に選択してフラットケーブルを接続できるものであるため、障害物を迂回してフラットケーブルを接続することができる。たとえば、図３（Ａ）、（Ｂ）に示すように、第２の回路基板２２と第３の回路基板２３とを接続するフラットケーブル（第１のフラットケーブル）２５を、そのまま第１の回路基板２１方向に延長して、第１の回路基板２１と接続しようとしても、第２の回路基板２２に実装された電子部品２４ｘが障害物となって接続することができない。電子機器２００では、第１の回路基板２１に実装されたインターポーザ３０の側面に形成された接続用端子電極３６と、第２の回路基板２２に実装されたインターポーザ１００の側面に形成された接続用端子電極６とを、フラットケーブル（第２のフラットケーブル）２６によって接続することによって、障害物である電子部品２４ｘを迂回して、第１の回路基板２１と第２の回路基板２２とが接続できている。 Further, since the interposer 100 can connect the flat cable by arbitrarily selecting the top surface and the side surface of the electronic device 200, the flat cable can be connected around the obstacle. For example, as shown in FIGS. 3A and 3B, a flat cable (first flat cable) 25 that connects the second circuit board 22 and the third circuit board 23 is used as it is as the first circuit. Even if it extends in the direction of the board 21 and tries to connect to the first circuit board 21, the electronic component 24x mounted on the second circuit board 22 cannot be connected due to an obstacle. In the electronic device 200, the connection terminal electrode 36 formed on the side surface of the interposer 30 mounted on the first circuit board 21 and the connection terminal formed on the side surface of the interposer 100 mounted on the second circuit board 22. By connecting the terminal electrode 6 with a flat cable (second flat cable) 26, the electronic circuit 24x that is an obstacle is bypassed, and the first circuit board 21 and the second circuit board 22 are connected. is made of.
　インターポーザ１００は、積層セラミック電子部品（積層セラミックコンデンサなど）の製造に使用されている積層セラミック技術を用いて、極めて小さな寸法に作製することができる。 The interposer 100 can be manufactured to an extremely small size by using a multilayer ceramic technology used for manufacturing a multilayer ceramic electronic component (such as a multilayer ceramic capacitor).
　［実施形態２（インターポーザ３００・電子機器４００）］
　実施形態２にかかるインターポーザ３００を作製した。また、インターポーザ３００を使用して、実施形態２にかかる電子機器４００を作製した。 [Embodiment 2 (interposer 300 / electronic device 400)]
The interposer 300 according to the second embodiment was manufactured. In addition, the electronic device 400 according to the second embodiment was manufactured using the interposer 300.
　図５（Ａ）、（Ｂ）に、それぞれ、インターポーザ３００を備えた電子機器４００を示す。ただし、図５（Ａ）は、筐体を省略し、筐体の内部を示した、電子機器４００の要部斜視図である。図５（Ｂ）は、さらにフラットケーブルも省略した、電子機器４００の要部斜視図である。 5 (A) and 5 (B) show an electronic device 400 provided with an interposer 300, respectively. Note that FIG. 5A is a perspective view of a main part of the electronic device 400 in which the housing is omitted and the inside of the housing is illustrated. FIG. 5B is a perspective view of a main part of the electronic device 400 in which a flat cable is further omitted.
　電子機器４００は、回路基板４１を備える。回路基板４１には、図示を省略するが、電子部品が実装されている。また、回路基板４１には、実施形態２にかかるインターポーザ３００が実装されている。 The electronic device 400 includes a circuit board 41. Although not shown, electronic components are mounted on the circuit board 41. Further, the interposer 300 according to the second embodiment is mounted on the circuit board 41.
　インターポーザ３００は、天面に４つの接続用端子電極（第１接続用端子電極）５５が形成されている。また、インターポーザ３００は、４つある側面のうちの１つの側面に２つの接続用端子電極（第２接続用端子電極）５６ａが形成され、別の側面に２つの接続用端子電極（第２接続用端子電極）５６ｂが形成されている。 The interposer 300 has four connection terminal electrodes (first connection terminal electrodes) 55 formed on the top surface. The interposer 300 has two connection terminal electrodes (second connection terminal electrodes) 56a formed on one of the four side surfaces, and two connection terminal electrodes (second connection) on another side surface. Terminal electrode) 56b is formed.
　そして、インターポーザ３００は、接続用端子電極５５にフラットケーブル（第１フラットケーブル）５７が接続され、接続用端子電極５６ａにフラットケーブル（第２フラットケーブル）５８ａが接続され、接続用端子電極５６ｂにフラットケーブル（第２フラットケーブル）５８ｂが接続されている。 In the interposer 300, a flat cable (first flat cable) 57 is connected to the connection terminal electrode 55, a flat cable (second flat cable) 58a is connected to the connection terminal electrode 56a, and a connection terminal electrode 56b is connected. A flat cable (second flat cable) 58b is connected.
　このように、インターポーザの複数の側面に、それぞれ、接続用端子電極を形成すれば、より多くのフラットケーブルを接続することが可能になる。なお、インターポーザ３００では、２つの側面に接続用端子電極を形成したが、３つ以上の側面に、それぞれ接続用端子電極を形成するようにしても良い。 In this way, it is possible to connect more flat cables by forming connection terminal electrodes on each of the plurality of side surfaces of the interposer. In the interposer 300, connection terminal electrodes are formed on two side surfaces, but connection terminal electrodes may be formed on three or more side surfaces, respectively.
　［実施形態３（インターポーザ５００・電子機器６００）］
　実施形態３にかかるインターポーザ５００を作製した。また、インターポーザ５００を使用して、実施形態３にかかる電子機器６００を作製した。 [Embodiment 3 (interposer 500 / electronic device 600)]
The interposer 500 according to the third embodiment was manufactured. Moreover, the electronic device 600 according to the third embodiment was manufactured using the interposer 500.
　図６（Ａ）、（Ｂ）に、それぞれ、インターポーザ５００を備えた電子機器６００を示す。ただし、図６（Ａ）は、筐体を省略し、筐体の内部を示した、電子機器６００の要部斜視図である。図５（Ｂ）は、さらにフラットケーブルも省略した、電子機器６００の要部斜視図である。 6A and 6B show an electronic device 600 provided with an interposer 500, respectively. Note that FIG. 6A is a perspective view of a main part of the electronic device 600, showing the inside of the housing without the housing. FIG. 5B is a perspective view of a main part of the electronic apparatus 600 from which a flat cable is further omitted.
　電子機器６００は、回路基板６１を備える。回路基板６１には、図示を省略するが、電子部品が実装されている。また、回路基板６１には、実施形態３にかかるインターポーザ５００が実装されている。 The electronic device 600 includes a circuit board 61. Although not shown, electronic components are mounted on the circuit board 61. Further, the interposer 500 according to the third embodiment is mounted on the circuit board 61.
　インターポーザ５００は、天面に４つの接続用端子電極（第１接続用端子電極）７５が形成されている。また、インターポーザ３００は、４つある側面のうちの１つの側面に４つの接続用端子電極（第２接続用端子電極）７６が形成されている。 The interposer 500 has four connection terminal electrodes (first connection terminal electrodes) 75 formed on the top surface. The interposer 300 has four connection terminal electrodes (second connection terminal electrodes) 76 formed on one of the four side surfaces.
　そして、インターポーザ３００は、接続用端子電極７５にフラットケーブル（第１フラットケーブル）７７が接続され、接続用端子電極７６にフラットケーブル（第２フラットケーブル）７８が接続されている。 In the interposer 300, a flat cable (first flat cable) 77 is connected to the connection terminal electrode 75, and a flat cable (second flat cable) 78 is connected to the connection terminal electrode 76.
　フラットケーブル７７は、回路基板６１の主面と平行な方向に配線されている。これに対し、フラットケーブル７８は、回路基板６１の主面と垂直な方向に配線されている。 The flat cable 77 is wired in a direction parallel to the main surface of the circuit board 61. On the other hand, the flat cable 78 is wired in a direction perpendicular to the main surface of the circuit board 61.
　このように、本発明のインターポーザを使えば、フラットケーブルを、所望の方向に、高い自由度で引き出すことができる。 Thus, by using the interposer of the present invention, the flat cable can be pulled out in a desired direction with a high degree of freedom.
　［実施形態４（インターポーザ７００）］
　図７（Ａ）～（Ｃ）に、それぞれ、実施形態４にかかるインターポーザ７００を示す。ただし、図７（Ａ）は、インターポーザ７００の斜視図である。図７（Ｂ）は、インターポーザ７００の平面図である。図７（Ｃ）は、インターポーザ７００の断面図である。 [Embodiment 4 (interposer 700)]
FIGS. 7A to 7C show an interposer 700 according to the fourth embodiment. 7A is a perspective view of the interposer 700. FIG. FIG. 7B is a plan view of the interposer 700. FIG. 7C is a cross-sectional view of the interposer 700.
　インターポーザ７００は、実施形態１にかかるインターポーザ１００に、新たな構成を追加した。具体的には、インターポーザ１００の素体１の３つの側面Ｓ２、Ｓ３、Ｓ４に、金属シールド５１を形成した。 The interposer 700 has a new configuration added to the interposer 100 according to the first embodiment. Specifically, the metal shield 51 was formed on the three side surfaces S2, S3, and S4 of the element body 1 of the interposer 100.
　なお、素体１の側面Ｓ１には、接続用端子電極（第２接続用端子電極）６が形成されているため、金属シールドは形成しなかった。 In addition, since the connection terminal electrode (second connection terminal electrode) 6 is formed on the side surface S1 of the element body 1, no metal shield was formed.
　金属シールド５１は、素体１の３つの側面Ｓ２、Ｓ３、Ｓ４の、それぞれの全面に形成されている。 The metal shield 51 is formed on each of the three side surfaces S2, S3, and S4 of the element body 1.
　金属シールド５１の材質および構成は任意であるが、たとえば、Ｔｉ、Ｎｉ、Ｃｒ、ＳＵＳ、Ｃｕ、Ａｌ、Ａｇ、またはそれらの合金によって形成することができる。また、Ｔｉ、Ｎｉ、Ｃｒ、ＳＵＳ、またはそれらの合金からなる密着層、Ｃｕ、Ａｌ、Ａｇ、またはそれらの合金からなる導電層、Ｔｉ、Ｎｉ、Ｃｒ、ＳＵＳ、またはそれらの合金からなる耐食層の３層構造に形成することができる。密着層は素体１と親和性が高く剥離しにくい材質であることが望ましく、導電層は導電率が高い材質であることが望ましく、耐食層は酸化や腐食に強い材質であることが望ましい。 The material and configuration of the metal shield 51 are arbitrary, but can be formed of, for example, Ti, Ni, Cr, SUS, Cu, Al, Ag, or an alloy thereof. Further, an adhesion layer made of Ti, Ni, Cr, SUS, or an alloy thereof, a conductive layer made of Cu, Al, Ag, or an alloy thereof, and a corrosion-resistant layer made of Ti, Ni, Cr, SUS, or an alloy thereof The three-layer structure can be formed. The adhesion layer is preferably made of a material having high affinity with the element body 1 and hardly peeled off, the conductive layer is preferably made of a material having high conductivity, and the corrosion-resistant layer is preferably made of a material resistant to oxidation and corrosion.
　金属シールド５１は、図７（Ｃ）に示すように、線路導体３、ビアホール導体２を経由して、実装用端子電極４に接続されている。したがって、当該実装用端子電極４をグランド電位に接続することによって、金属シールド５１をグランド電位に接続することができる。 The metal shield 51 is connected to the mounting terminal electrode 4 via the line conductor 3 and the via-hole conductor 2 as shown in FIG. Therefore, the metal shield 51 can be connected to the ground potential by connecting the mounting terminal electrode 4 to the ground potential.
　金属シールド５１は、たとえば、素体１の金属シールド５１を形成しない外表面にマスクをしたうえで、スパッタリングによって形成することができる。 The metal shield 51 can be formed, for example, by sputtering after masking the outer surface of the element body 1 where the metal shield 51 is not formed.
　インターポーザ７００は、金属シールド５１によって、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズを抑制することができる。すなわち、インターポーザ７００は、金属シールド５１によって遮蔽されているため、ノイズを構成する磁界成分や電界成分の素体１の側面Ｓ２、Ｓ３、Ｓ４の透過が抑制されており、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズが抑制されている。 The interposer 700 can suppress noise radiated from the interposer to the outside and noise entering the interposer from the outside by the metal shield 51. That is, since the interposer 700 is shielded by the metal shield 51, the transmission of the side surfaces S2, S3, and S4 of the element body 1 of the magnetic field component and electric field component constituting the noise is suppressed, and is emitted from the interposer to the outside. Noise and noise entering the interposer from the outside are suppressed.
　［実施形態５（インターポーザ８００）］
　図８に、実施形態５にかかるインターポーザ８００を示す。ただし、図８は、インターポーザ８００の斜視図である。 [Embodiment 5 (Interposer 800)]
FIG. 8 shows an interposer 800 according to the fifth embodiment. However, FIG. 8 is a perspective view of the interposer 800.
　インターポーザ８００は、実施形態４にかかるインターポーザ７００の構成の一部に変更を加えた。具体的には、インターポーザ７００では、素体１の３つの側面Ｓ２、Ｓ３、Ｓ４の、それぞれの全面に金属シールド５１を形成していた。インターポーザ８００では、これに代えて、素体１の３つの側面Ｓ２、Ｓ３、Ｓ４の下側半分に、それぞれ金属シールド６６を部分的に形成した。 The interposer 800 has changed a part of the configuration of the interposer 700 according to the fourth embodiment. Specifically, in the interposer 700, the metal shield 51 is formed on the entire surface of each of the three side surfaces S2, S3, and S4 of the element body 1. In the interposer 800, instead of this, metal shields 66 are partially formed on the lower half of the three side surfaces S2, S3, S4 of the element body 1, respectively.
　このように、素体１の側面Ｓ２、Ｓ３、Ｓ４に、それぞれ、部分的に金属シールド６６を形成しても良い。 Thus, the metal shields 66 may be partially formed on the side surfaces S2, S3, and S4 of the element body 1, respectively.
　［実施形態６（インターポーザ９００）］
　図９に、実施形態６にかかるインターポーザ９００を示す。ただし、図９は、インターポーザ９００の斜視図である。 [Sixth embodiment (interposer 900)]
FIG. 9 shows an interposer 900 according to the sixth embodiment. However, FIG. 9 is a perspective view of the interposer 900.
　インターポーザ９００も、実施形態４にかかるインターポーザ７００の構成の一部に変更を加えた。 The interposer 900 has also changed a part of the configuration of the interposer 700 according to the fourth embodiment.
　具体的には、インターポーザ９００では、まず、素体１の側面Ｓ１に形成された接続用端子電極（第２接続用端子電極）７６の大きさを、インターポーザ７００の接続用端子電極（第２接続用端子電極）６の大きさよりも小さくした。なお、接続用端子電極７６の表面には、めっき層７６ａが形成されている。 Specifically, in the interposer 900, first, the size of the connection terminal electrode (second connection terminal electrode) 76 formed on the side surface S1 of the element body 1 is set to the size of the connection terminal electrode (second connection) of the interposer 700. Terminal electrode) 6 was made smaller than the size. A plating layer 76 a is formed on the surface of the connection terminal electrode 76.
　そして、素体１の側面Ｓ１の接続用端子電極７６が形成されていない部分に、金属シールド７１ａ、７１ｂを形成した。より具体的には、素体１の側面Ｓ１の天面Ｔと接する辺に沿って金属シールド７１ａを形成し、底面Ｂと接する辺に沿って金属シールド７１ｂを形成した。 Then, metal shields 71a and 71b were formed on the side surface S1 of the element body 1 where the connection terminal electrode 76 was not formed. More specifically, the metal shield 71a was formed along the side in contact with the top surface T of the side surface S1 of the element body 1, and the metal shield 71b was formed along the side in contact with the bottom surface B.
　この結果、インターポーザ９００では、素体１の側面Ｓ１～Ｓ４の外周を一回りするように、金属シールド５１、７１ａ、７１ｂが形成されている。インターポーザ９００は、インターポーザ７００に比べて、さらにノイズを遮蔽する効果が向上している。 As a result, in the interposer 900, the metal shields 51, 71a, and 71b are formed so as to go around the outer periphery of the side surfaces S1 to S4 of the element body 1. Compared to the interposer 700, the interposer 900 has an improved noise shielding effect.
　以上のように、実施形態４～６にかかるインターポーザ７００、８００、９００において、金属シールド５１、６６、７１ａ、７１ｂの形成例を説明したが、素体１の外表面における金属シールドの形成位置は任意であり、上記の形成例には限定されない。ノイズの遮蔽効果を確認しながら、必要に応じて、適宜、形成位置を設定することができる。たとえば、素体１の天面Ｔに、部分的に金属シールドを形成しても良い。 As described above, in the interposers 700, 800, and 900 according to the fourth to sixth embodiments, examples of forming the metal shields 51, 66, 71a, and 71b have been described, but the formation positions of the metal shields on the outer surface of the element body 1 are as follows. It is optional and is not limited to the above-described formation examples. The formation position can be appropriately set as necessary while confirming the noise shielding effect. For example, a metal shield may be partially formed on the top surface T of the element body 1.
　［実施形態７（電子機器１０００）］
　図１０に、実施形態７にかかる電子機器１０００を示す。ただし、図１０は、電子機器１０００の正面図である。 [Embodiment 7 (electronic device 1000)]
FIG. 10 shows an electronic apparatus 1000 according to the seventh embodiment. However, FIG. 10 is a front view of the electronic apparatus 1000.
　電子機器１０００は、回路基板５２に、上述した実施形態４にかかるインターポーザ７００が実装されている。また、電子機器１０００は、回路基板５２に、インターポーザ７００に隣接して、電子部品５３が実装されている。 In the electronic device 1000, the interposer 700 according to the fourth embodiment described above is mounted on the circuit board 52. In the electronic device 1000, the electronic component 53 is mounted on the circuit board 52 adjacent to the interposer 700.
　電子機器１０００は、素体１の電子部品５３に対向する側面Ｓ４に形成された金属シールド５１の高さＨＳが、電子部品５３の高さＨＤよりも高くなっている。 Electronic device 1000 has a height H S of the metal shield 51 formed on the side surface S4 for facing the electronic parts 53 of the element body 1 is higher than the height H D of the electronic component 53.
　仮に、金属シールド５１の高さＨＳが、電子部品５３の高さＨＤよりも低いと、金属シールド５１でノイズを十分に遮蔽することができず、電子部品５３の放射したノイズがインターポーザに影響を与えたり、インターポーザが放射したノイズが電子部品５３に影響を与えたりする虞があるが、電子機器１０００では、金属シールド５１の高さＨＳが電子部品５３の高さＨＤよりも高いため、両者間でのノイズの影響が効果的に抑制されている。 If the height H S of the metal shield 51 is lower than the height H D of the electronic components 53, can not be sufficiently shield the noise of metal shield 51, the radiated noise interposer electronic components 53 effect or apply, interposer there is a possibility that noise radiation or affect the electronic component 53, but in the electronic device 1000, the height H S of the metal shield 51 is greater than the height H D of the electronic component 53 Therefore, the influence of noise between the two is effectively suppressed.
　［実施形態８（インターポーザ１１００）］
　図１１（Ａ）、（Ｂ）に、それぞれ、実施形態８にかかるインターポーザ１１００を示す。ただし、図１１（Ａ）は、インターポーザ１１００の斜視図である。図１１（Ｂ）は、インターポーザ１１００の断面図である。 [Eighth embodiment (interposer 1100)]
11A and 11B show an interposer 1100 according to the eighth embodiment. However, FIG. 11A is a perspective view of the interposer 1100. FIG. 11B is a cross-sectional view of the interposer 1100.
　インターポーザ１１００は、実施形態１にかかるインターポーザ１００の構成の一部に変更を加えた。具体的には、インターポーザ１００では、素体１を構成する４層の絶縁体層１ａ～１ｄを非磁性体で作製していたが、インターポーザ１１００では、４層の絶縁体層１ａ～１ｄのうち、中間に積層された絶縁体層１ｂ、１ｃを、磁性体Ｚによって作製した。より具体的には、絶縁体層１ｂ、１ｃを、フェライトからなる磁性体Ｚによって作製した。 The interposer 1100 has changed a part of the configuration of the interposer 100 according to the first embodiment. Specifically, in the interposer 100, the four insulator layers 1a to 1d constituting the element body 1 are made of a nonmagnetic material. However, in the interposer 1100, the four insulator layers 1a to 1d are formed. Insulator layers 1b and 1c laminated in the middle were made of magnetic material Z. More specifically, the insulator layers 1b and 1c were made of a magnetic material Z made of ferrite.
　インターポーザ１１００は、いわゆる磁性ビーズインダクタ（フェライトビーズインダクタ）の機能も兼有しており、インターポーザを通る信号に含まれるノイズの通過を抑制することができる。 The interposer 1100 also has a function of a so-called magnetic bead inductor (ferrite bead inductor), and can suppress passage of noise included in a signal passing through the interposer.
　［実施形態９（インターポーザ１２００）］
　図１２（Ａ）、（Ｂ）に、それぞれ、実施形態９にかかるインターポーザ１２００を示す。ただし、図１２（Ａ）は、インターポーザ１２００の斜視図である。図１２（Ｂ）は、インターポーザ１２００の断面図である。 [Embodiment 9 (interposer 1200)]
12A and 12B show an interposer 1200 according to the ninth embodiment. However, FIG. 12A is a perspective view of the interposer 1200. FIG. 12B is a cross-sectional view of the interposer 1200.
　インターポーザ１２００は、上述した実施形態８にかかるインターポーザ１１００の構成の一部に変更を加えた。具体的には、インターポーザ１１００では、素体１の中間に積層された２層の絶縁体層１ｂ、１ｃを磁性体Ｚによって作製しが、インターポーザ１２００では、４層の絶縁体層１ａ～１ｄの全てを磁性体Ｚによって作製した。 The interposer 1200 is a part of the configuration of the interposer 1100 according to the eighth embodiment described above. Specifically, in the interposer 1100, the two insulator layers 1b and 1c laminated in the middle of the element body 1 are made of the magnetic substance Z. In the interposer 1200, the four insulator layers 1a to 1d are formed. All were made of magnetic material Z.
　インターポーザに磁性ビーズインダクタ（フェライトビーズインダクタ）の機能を兼有させる場合、インターポーザ１１００のように素体１を部分的に磁性体で作製しても良いし、インターポーザ１２００のように素体１の全体を磁性体で作製しても良い。 When the interposer also has the function of a magnetic bead inductor (ferrite bead inductor), the element body 1 may be partially made of a magnetic substance like the interposer 1100, or the entire element element 1 like the interposer 1200. May be made of a magnetic material.
　インターポーザ１２００も、磁性ビーズインダクタ（フェライトビーズインダクタ）の機能を兼有している。 Interposer 1200 also has the function of a magnetic bead inductor (ferrite bead inductor).
　［実施形態１０（インターポーザ１３００）］
　図１３（Ａ）、（Ｂ）に、実施形態１０にかかるインターポーザ１３００を示す。ただし、図１３（Ａ）は、インターポーザ１３００の斜視図である。図１３（Ｂ）は、インターポーザ１３００の分解斜視図であり、金属シールド５１、７１ａ、７１ｂを除去した状態を示している。 [Embodiment 10 (interposer 1300)]
FIGS. 13A and 13B show an interposer 1300 according to the tenth embodiment. Note that FIG. 13A is a perspective view of the interposer 1300. FIG. 13B is an exploded perspective view of the interposer 1300, and shows a state where the metal shields 51, 71a, 71b are removed.
　インターポーザ１３００は、上述した実施形態６にかかるインターポーザ９００の特長と、上述した実施形態８にかかるインターポーザ１１００の特長とを組み合わせた。 The interposer 1300 is a combination of the features of the interposer 900 according to the sixth embodiment and the features of the interposer 1100 according to the eighth embodiment.
　具体的には、インターポーザ１３００は、インターポーザ１１００と同様に、素体１を構成する４層の絶縁体層１ａ～１ｄのうち、中間に積層された絶縁体層１ｂ、１ｃを磁性体Ｚによって作製した。また、インターポーザ１３００は、インターポーザ９００と同様に、素体１の側面Ｓ１に金属シールド７１ａ、７１ｂを形成し、素体１の側面Ｓ２～Ｓ４に金属シールド５１を形成した。 Specifically, in the same manner as the interposer 1100, the interposer 1300 is formed by using the magnetic body Z as the insulator layers 1b and 1c laminated in the middle of the four insulating layers 1a to 1d constituting the element body 1. did. In the interposer 1300, similarly to the interposer 900, the metal shields 71a and 71b are formed on the side surface S1 of the element body 1, and the metal shield 51 is formed on the side surfaces S2 to S4 of the element body 1.
　インターポーザ１３００は、金属シールド５１、７１ａ、７１ｂを形成したことによって、インターポーザから外部に放射されるノイズや、インターポーザの内部に外部から侵入するノイズが抑制されている。また、インターポーザ１３００は、素体１を構成する絶縁体層１ｂ、１ｃを磁性体Ｚによって作製したことによって、いわゆる磁性ビーズインダクタ（フェライトビーズインダクタ）の機能を兼有している。 Since the interposer 1300 is formed with the metal shields 51, 71a, 71b, noise radiated to the outside from the interposer and noise entering from the outside to the inside of the interposer are suppressed. Further, the interposer 1300 has a function of a so-called magnetic bead inductor (ferrite bead inductor) because the insulator layers 1b and 1c constituting the element body 1 are made of the magnetic body Z.
　以上、実施形態にかかるインターポーザ１００、３００、５００、７００、８００、９００、１１００、１２００、１３００、電子機器２００、４００、６００、１０００について説明した。しかしながら、本発明が上述した内容に限定されることはなく、発明の趣旨に沿って、種々の変更をなすことができる。 The interposers 100, 300, 500, 700, 800, 900, 1100, 1200, 1300, and the electronic devices 200, 400, 600, 1000 according to the embodiments have been described above. However, the present invention is not limited to the contents described above, and various modifications can be made in accordance with the spirit of the invention.
　たとえば、インターポーザ１００では、素体１が、セラミックなどの絶縁体層１ａ～１ｄが積層された積層素体であった。しかしながら、インターポーザの素体は、積層素体には限られず、１つのブロックで構成されたブロック素体であっても良い。また、素体の材質も任意であり、セラミックに代えて、樹脂などで作製されても良い。 For example, in the interposer 100, the element body 1 is a laminated element body in which insulator layers 1a to 1d such as ceramics are laminated. However, the element body of the interposer is not limited to the laminated element body, and may be a block element body constituted by one block. The material of the element body is also arbitrary, and may be made of resin or the like instead of ceramic.
　また、電子機器２００は、スマートフォン等の携帯型の電子機器であったが、電子機器の種類は任意であり、他の種類の電子機器であっても良い。 Moreover, although the electronic device 200 is a portable electronic device such as a smartphone, the type of the electronic device is arbitrary and may be another type of electronic device.
　また、電子機器２００、４００、６００、１０００を示す図３（Ａ）、（Ｂ）、図５（Ａ）、（Ｂ）、図６（Ａ）、（Ｂ）、図１０においては、理解をしやすいように、インターポーザ１００、３００、５００、７００の寸法を他の構成に比べて大きく示したが、インターポーザ１００、３００、５００、７００は、極めて小さな寸法に作製することが可能である。 In addition, in FIGS. 3A, 3B, 5A, 5B, 6A, 6B, and 10 showing the electronic devices 200, 400, 600, and 1000, the understanding is made. For the sake of simplicity, the dimensions of the interposers 100, 300, 500, and 700 are shown to be larger than those of other configurations. However, the interposers 100, 300, 500, and 700 can be manufactured to extremely small dimensions.
１・・・素体
１ａ～１ｄ・・・絶縁体層
２・・・ビアホール導体
３・・・線路導体
４・・・実装用端子電極
４ａ・・・めっき層
５、５５、７５・・・接続用端子電極（第１接続用端子電極）
５ａ・・・めっき層
６、５６ａ、５６ｂ、７６・・・接続用端子電極（第２接続用端子電極）
６ａ・・・めっき層
２１、２２、２３、４１、６６・・・回路基板
２４、５３・・・電子部品
２５、５７、７７・・・フラットケーブル（第１フラットケーブル；配線部材）
２６、５８ａ、５８ｂ、７８・・・フラットケーブル（第２フラットケーブル；配線部材）
５１、６６、７１ａ、７１ｂ・・・金属シールド
Ｚ・・・磁性体
１００、３００、５００、７００、８００、９００、１１００、１２００、１３００・・・インターポーザ
２００、４００、６００、１０００・・・電子機器 DESCRIPTION OF SYMBOLS 1 ... Element body 1a-1d ... Insulator layer 2 ... Via-hole conductor 3 ... Line conductor 4 ... Terminal electrode 4a for mounting ... Plating layer 5, 55, 75 ... Connection Terminal electrode (first connection terminal electrode)
5a ... plating layers 6, 56a, 56b, 76 ... connection terminal electrodes (second connection terminal electrodes)
6a ... plating layers 21, 22, 23, 41, 66 ... circuit boards 24, 53 ... electronic components 25, 57, 77 ... flat cable (first flat cable; wiring member)
26, 58a, 58b, 78 ... Flat cable (second flat cable; wiring member)
51, 66, 71a, 71b ... Metal shield Z ... Magnetic body 100, 300, 500, 700, 800, 900, 1100, 1200, 1300 ... Interposer 200, 400, 600, 1000 ... Electron machine

Claims (17)

  1. 　底面と、天面と、前記底面と前記天面とを繋ぐ複数の側面とを有する絶縁体の素体と、
    　前記天面に設けられ、導電性接合材を介して外部に接続される第１接続用端子電極と、
    　前記側面に設けられ、導電性接合材を介して外部に接続される第２接続用端子電極と、
    　前記底面に設けられ、導電性接合材を介して回路基板に接続される実装用端子電極と、を備えた、表面実装型のインターポーザ。     An insulator body having a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface;
    A first connection terminal electrode provided on the top surface and connected to the outside via a conductive bonding material;
    A second connection terminal electrode provided on the side surface and connected to the outside via a conductive bonding material;
    A surface-mount type interposer provided with a mounting terminal electrode provided on the bottom surface and connected to a circuit board via a conductive bonding material.
  2. 　前記素体が直方体であり、４つの前記側面を備えた、請求項１に記載されたインターポーザ。 The interposer according to claim 1, wherein the element body is a rectangular parallelepiped and includes four side surfaces.
  3. 　少なくとも２つの前記側面に、それぞれ、前記第２接続用端子電極が設けられた、請求項１または２に記載されたインターポーザ。 The interposer according to claim 1 or 2, wherein the second connection terminal electrodes are provided on at least two of the side surfaces, respectively.
  4. 　前記素体が、セラミックである、請求項１ないし３のいずれか１項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 3, wherein the element body is ceramic.
  5. 　前記素体が、複数の絶縁体層が積層された積層素体である、請求項１ないし４のいずれか１項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 4, wherein the element body is a laminated element body in which a plurality of insulator layers are laminated.
  6. 　前記第２接続用端子電極が、前記絶縁体層に設けられたビアホール導体の分割断面である、請求項５に記載されたインターポーザ。 The interposer according to claim 5, wherein the second connection terminal electrode is a divided cross section of a via-hole conductor provided in the insulator layer.
  7. 　前記素体の外表面に金属シールドが形成された、請求項１ないし６のいずれか1項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 6, wherein a metal shield is formed on an outer surface of the element body.
  8. 　前記素体の少なくとも１つの前記側面の、全面または一部分に、前記金属シールドが形成された、請求項７に記載されたインターポーザ。 The interposer according to claim 7, wherein the metal shield is formed on an entire surface or a part of at least one of the side surfaces of the element body.
  9. 　前記第２接続用端子電極が形成されていない少なくとも１つの前記側面の、全面または一部分に、前記金属シールドが形成された、請求項８に記載されたインターポーザ。 The interposer according to claim 8, wherein the metal shield is formed on an entire surface or a part of at least one of the side surfaces on which the second connection terminal electrode is not formed.
  10. 　前記第２接続用端子電極が形成された少なくとも１つの前記側面の、前記第２接続用端子電極が形成されていない部分に、前記金属シールドが形成された、請求項８または９に記載されたインターポーザ。 The metal shield is formed on a portion of the at least one side surface on which the second connection terminal electrode is formed, on which the second connection terminal electrode is not formed. Interposer.
  11. 　前記金属シールドが、前記素体の複数の前記側面の外周を一回りするように形成された、請求項１０に記載されたインターポーザ。 The interposer according to claim 10, wherein the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body.
  12. 　前記素体が磁性体からなる、請求項１ないし１１のいずれか1項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 11, wherein the element body is made of a magnetic material.
  13. 　前記素体が、複数の絶縁体層が積層された積層素体からなり、前記絶縁体層の一部が磁性体からなる、請求項１ないし１１のいずれか1項に記載されたインターポーザ。 The interposer according to any one of claims 1 to 11, wherein the element body is made of a laminated element body in which a plurality of insulator layers are laminated, and a part of the insulator layer is made of a magnetic substance.
  14. 　底面と、天面と、前記底面と前記天面とを繋ぐ複数の側面とを有する絶縁体の素体と、前記天面に設けられた第１接続用端子電極と、前記側面に設けられた第２接続用端子電極と、前記底面に設けられた実装用端子電極と、を備えた、表面実装型のインターポーザと、
    　回路基板と、
    　第１配線部材と、
    　第２配線部材と、を備えた電子機器であって、
    　前記インターポーザの前記実装用端子電極が、導電性接合材を介して前記回路基板に接続され、
    　前記インターポーザの前記第１接続用端子電極に、導電性接合材を介して前記第１配線部材が接続され、
    　前記インターポーザの前記第２接続用端子電極に、導電性接合材を介して前記第２配線部材が接続された電子機器。     An insulator body having a bottom surface, a top surface, and a plurality of side surfaces connecting the bottom surface and the top surface, a first connection terminal electrode provided on the top surface, and provided on the side surface A surface-mount type interposer comprising a second connection terminal electrode and a mounting terminal electrode provided on the bottom surface;
    A circuit board;
    A first wiring member;
    A second wiring member; and an electronic device comprising:
    The mounting terminal electrode of the interposer is connected to the circuit board via a conductive bonding material,
    The first wiring member is connected to the first connection terminal electrode of the interposer via a conductive bonding material,
    An electronic apparatus in which the second wiring member is connected to the second connection terminal electrode of the interposer via a conductive bonding material.
  15. 　前記第１配線部材および前記第２配線部材の少なくとも一方が、フラットケーブルである、請求項１４に記載された電子機器。 15. The electronic device according to claim 14, wherein at least one of the first wiring member and the second wiring member is a flat cable.
  16. 　前記インターポーザの前記側面に金属シールドが形成され、
    　前記インターポーザの前記金属シールドが形成された前記側面に隣接して、前記回路基板上に、電子部品が実装され、
    　前記金属シールドが、前記底面から、前記電子部品の高さよりも高い位置まで、前記側面を覆っている、請求項１４または１５に記載された電子機器。     A metal shield is formed on the side surface of the interposer;
    An electronic component is mounted on the circuit board adjacent to the side surface where the metal shield of the interposer is formed,
    The electronic device according to claim 14 or 15, wherein the metal shield covers the side surface from the bottom surface to a position higher than the height of the electronic component.
  17. 　前記インターポーザの前記側面に金属シールドが形成され、
    　前記金属シールドが、前記素体の複数の前記側面の外周を一回りするように形成された、請求項１４または１５に記載された電子機器。
          A metal shield is formed on the side surface of the interposer;
    The electronic device according to claim 14 or 15, wherein the metal shield is formed so as to go around the outer periphery of the plurality of side surfaces of the element body.
PCT/JP2017/043004 2017-02-01 2017-11-30 Interposer and electronic device WO2018142740A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201790001573.3U CN210692812U (en) 2017-02-01 2017-11-30 Interposer and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-017108 2017-02-01
JP2017017108 2017-02-01

Publications (1)

Publication Number Publication Date
WO2018142740A1 true WO2018142740A1 (en) 2018-08-09

Family

ID=63039544

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/043004 WO2018142740A1 (en) 2017-02-01 2017-11-30 Interposer and electronic device

Country Status (2)

Country Link
CN (1) CN210692812U (en)
WO (1) WO2018142740A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289467A (en) * 2001-03-23 2002-10-04 Kyocera Corp Multilayer ceramic capacitor and mounting substrate thereof
JP2005072509A (en) * 2003-08-27 2005-03-17 Kyocera Corp Substrate for mounting electronic component and electronic device using it
JP2005251889A (en) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd Three-dimensional electronic circuit device
JP2010087232A (en) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd Electronic component and substrate for electronic component, and methods of manufacturing them

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002289467A (en) * 2001-03-23 2002-10-04 Kyocera Corp Multilayer ceramic capacitor and mounting substrate thereof
JP2005072509A (en) * 2003-08-27 2005-03-17 Kyocera Corp Substrate for mounting electronic component and electronic device using it
JP2005251889A (en) * 2004-03-03 2005-09-15 Matsushita Electric Ind Co Ltd Three-dimensional electronic circuit device
JP2010087232A (en) * 2008-09-30 2010-04-15 Murata Mfg Co Ltd Electronic component and substrate for electronic component, and methods of manufacturing them

Also Published As

Publication number Publication date
CN210692812U (en) 2020-06-05

Similar Documents

Publication Publication Date Title
JP6806166B2 (en) High frequency module
JP2021061412A (en) High frequency module
CN107452464B (en) Laminated coil component
WO2019098316A1 (en) High-frequency module
JP2013026330A (en) Circuit module
US10418168B2 (en) Inductor and method for manufacturing the same
JPWO2016203842A1 (en) Electronic device and antenna element
KR20180006246A (en) Coil component
KR20150089279A (en) Chip-type coil component
JP2008198923A (en) Coil component
JPWO2017179591A1 (en) Passive element array and printed wiring board
CN108461453A (en) Electronic component mounting substrate, electronic device and electronic module
US10869382B2 (en) Interposer and electronic apparatus
CN105555018A (en) Printed circuit board and electronic terminal
JP2017216288A (en) Multilayer coil component
JPWO2019082714A1 (en) Multilayer boards, interposers and electronics
KR101823189B1 (en) Inductor Assembly
JP2017216290A (en) Multilayer coil component
WO2018142740A1 (en) Interposer and electronic device
JP6323622B2 (en) Component mounting board
WO2018139048A1 (en) Interposer and electronic machine
JP2017216289A (en) Multilayer coil component
WO2018110381A1 (en) Electronic module
JP2013175659A (en) Multiple patterning wiring board
JP7568086B2 (en) Multilayer board, manufacturing method thereof, and electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17895237

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17895237

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP