JP2010087232A - Electronic component and substrate for electronic component, and methods of manufacturing them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate for an electronic component in which a mounting position of a surface-mounted component after reflow can be controlled by directing movement of the surface-mounted component during the reflow, and to provided the electronic component using the substrate, and methods of manufacturing the substrate and the electronic component. <P>SOLUTION: The electronic component 1 has the substrate 11 for the electronic component which has a base material layer 2 and a plurality of external conductors 6 formed on at least one principal surface of the base material layer 2, and surface-mounted components 10a to 10c electrically connected to external conductors 6 through solders 8. Some of the external conductors 6 are inclined external conductors 16 each having a surface inclined to the principal surface 3 of the base material layer 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component on which a surface mount component is mounted, an electronic component substrate used therefor, and a method for manufacturing the same, and more particularly to a technique for mounting a surface mount component on an electronic component substrate.

  As a method of mounting surface-mounted components on a substrate such as a ceramic multilayer substrate, solder paste is applied to the external conductor provided on the substrate, and terminal electrodes of surface-mounted components are mounted on the solder paste and reflowed. There is a method in which the solder paste is melted to join the external conductor and the terminal electrode of the surface mount component.

  Incidentally, in recent years, there has been a demand for downsizing and higher functionality of electronic components, and a large number of wirings are provided not only inside the substrate but also on the substrate surface. And when mounting a surface mounting component on the external conductor provided on the substrate, it is necessary to prevent the molten solder from flowing in the direction of the adjacent wiring which is not intended. Therefore, it has been difficult to narrow the interval between the external conductor for mounting the surface mount component and other wiring.

On the other hand, when the reflow is performed with the surface mounted component mounted on the external conductor, the surface mounted component moves more or less from the mounting position due to the self-alignment effect of the solder. In consideration of the movement of the surface-mounted component due to this self-alignment effect, Patent Document 1 (Japanese Patent Laid-Open No. 2008-72035) discloses a technique for mounting the surface-mounted component in accordance with the position of the solder, not the position of the external conductor. ing. According to the method of Patent Document 1, since the solder melted at the time of reflowing is appropriately wetted and spreads between the outer conductor and the surface-mounted component, the surface-mounted component can be moved toward the center portion of the outer conductor by a self-alignment effect. it can.
JP 2008-72035 A

  However, depending on the method disclosed in Patent Document 1, although the surface-mounted component moves toward the center of the outer conductor due to the self-alignment effect, the self-alignment effect causes the self-alignment effect to affect the self-alignment effect. The moving direction and moving distance of the surface mount component due to the alignment effect vary variously. Therefore, it is difficult to control the movement of the surface mount component so that the surface mount component is mounted at a desired position.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component that controls the mounting position after reflow by directing the movement of the surface-mounted component during reflow, a substrate for electronic component used therefor, and a method for manufacturing the same.

  In order to solve the above problems, an electronic component of the present invention includes a base material layer, a substrate for electronic components having a plurality of external conductors formed on at least one main surface of the base material layer, and an external conductor. In an electronic component comprising a solder formed on a surface and a surface-mounted component electrically connected to the outer conductor via the solder, at least a part of the outer conductor has its surface on the main surface of the base material layer. It is characterized by the fact that it is an inclined outer conductor inclined with respect to it.

  In the electronic component of the present invention, the inclined outer conductor is preferably inclined toward the adjacent outer conductor.

  In the electronic component of the present invention, it is preferable that the center position of the terminal electrode of the surface mount component is closer to the lower end side than the center position of the inclined outer conductor.

  In the electronic component of the present invention, the interlayer connection conductor formed through the base material layer is electrically connected to the inclined outer conductor at a position different from the central position of the inclined outer conductor, and the interlayer It is preferable that the inclined outer conductor is inclined by forming the convex portion or the concave portion on the main surface of the base material layer.

  The present invention is also directed to an electronic component substrate used for such an electronic component.

  The electronic component substrate of the present invention is a substrate for electronic component having a base material layer and a plurality of external conductors formed on at least one main surface of the base material layer. It is an inclined outer conductor inclined with respect to the main surface of the base material layer.

  In the electronic component substrate of the present invention, the inclined outer conductor is preferably inclined toward the adjacent outer conductor.

  In the electronic component substrate of the present invention, the interlayer connection conductor formed through the base material layer is electrically connected to the inclined outer conductor at a position different from the center position of the inclined outer conductor, and In addition, it is preferable that the inclined outer conductor is inclined because the interlayer connecting conductor forms a convex portion or a concave portion on the main surface of the base material layer.

  The present invention is also directed to a method of manufacturing an electronic component.

  The method of manufacturing an electronic component of the present invention includes a step of preparing a base material layer, a step of forming a plurality of external conductors on at least one main surface of the base material layer, a step of firing the base material layer and the external conductor, In a method for manufacturing an electronic component, comprising: a step of creating a substrate for an electronic component through a step; a step of applying solder to the external conductor; and a step of mounting a surface mount component via the solder. The surface of the substrate is inclined with respect to the main surface of the base material layer to form the inclined outer conductor, and in the step of mounting the surface-mounted component, the surface-mounted component is moved to the lower end side of the inclined outer conductor. It is characterized by that.

  In the present invention, the base material layer includes not only an unfired layer but also a fired layer. That is, in the step of creating the electronic component substrate in the present invention, the outer conductor may be formed on the unfired base material layer, and the base material layer and the outer conductor may be fired at once or once fired. An external conductor may be formed on the base material layer, and the base material layer and the external conductor may be fired again.

  In the method of manufacturing an electronic component according to the present invention, it is preferable that the inclined outer conductor is inclined toward the adjacent outer conductor in the step of forming the inclined outer conductor.

  In the method of manufacturing an electronic component according to the present invention, in the step of applying solder, the solder is applied to the high end portion side of the inclined outer conductor, and the surface mount component is mounted in the step of mounting the surface mount component. It is preferable to move the surface mount component to the end side.

  In the electronic component manufacturing method of the present invention, the step of forming the inclined outer conductor is different from the step of forming the interlayer connection conductor penetrating the base material layer, and the position of the interlayer connection conductor different from the center position of the outer conductor. The step of forming the outer conductor on at least one main surface of the base material layer so as to be electrically connected to the inclined outer conductor, and the interlayer connection conductor is caused by a difference in shrinkage between the base material layer and the interlayer connection conductor in the firing step. It is preferable to have a step of inclining the outer conductor by forming a convex portion or a concave portion on the main surface of the base material layer.

  In the method of manufacturing an electronic component according to the present invention, the step of forming the inclined outer conductor includes the step of forming the protruding electrode on the base material layer, and the protruding electrode is formed on the inclined outer conductor at a position different from the center position of the outer conductor. It is preferable to include a step of inclining the external conductor by forming the external conductor on at least one main surface of the base material layer so as to be electrically connected.

  The present invention is also directed to a method of manufacturing an electronic component substrate.

  The electronic component substrate manufacturing method of the present invention includes a step of preparing a base material layer, a step of forming a plurality of external conductors on at least one main surface of the base material layer, and a step of firing the base material layer and the external conductor. And a step of forming an inclined outer conductor by inclining the surface of at least a part of the outer conductor with respect to the main surface of the base material layer.

  In the method for manufacturing an electronic component substrate of the present invention, it is preferable that the inclined outer conductor is inclined toward the adjacent outer conductor in the step of forming the inclined outer conductor.

  In the method for manufacturing a substrate for electronic components of the present invention, the step of forming the inclined outer conductor is different from the step of forming the interlayer connection conductor penetrating the base material layer, and the interlayer connection conductor is different from the center position of the outer conductor. Interlayer connection based on the difference in shrinkage between the base material layer and the interlayer connection conductor in the firing process and the step of forming the external conductor on at least one main surface of the base material layer so that it is electrically connected to the inclined external conductor at the position It is preferable that the conductor has a step of inclining the outer conductor by forming a convex portion or a concave portion on the main surface of the base material layer.

  In the method for manufacturing an electronic component substrate according to the present invention, the step of forming the inclined outer conductor includes the step of forming the protruding electrode on the base material layer, and the protruding electrode at a position different from the center position of the outer conductor. It is preferable to include a step of inclining the outer conductor by forming the outer conductor on at least one main surface of the base material layer so as to be electrically connected to the conductor.

  According to the present invention, at least some of the external conductors formed on the substrate are inclined external conductors whose surfaces are inclined with respect to the main surface of the base material layer. The mounting position after reflow can be controlled by directing the movement of the mounting component.

  Hereinafter, the present invention will be described with reference to FIGS.

  FIG. 1 is a schematic cross-sectional view showing an electronic component substrate 11 and an electronic component 1 using the same according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a partially enlarged state in which the surface mount components 10a and 10b are mounted on the electronic component substrate 11. As shown in FIG. FIG. 3 is a top view showing the electronic component 1 shown in FIG. 1 as viewed from above.

  As shown in FIG. 1, the electronic component substrate 11 includes a plurality of base material layers 2 stacked. A plurality of external conductors 6 are formed on at least one main surface 3 of the base material layer 2. In the electronic component substrate 11 according to the first embodiment, the outer conductor 6 is also formed on the main surface 13 opposite to the base material layer 2. The external conductor 6 formed on the main surface 13 is used to electrically connect the electronic component board 11 to a mother board such as a printed board (not shown). A surface-mounted component may be connected to the outer conductor 6 formed on the main surface 13. In this case, the main surface 13 is sealed with resin and then connected to the mother board. Each layer of the base material layer 2 is provided with an interlayer connection conductor 4 and an in-plane conductor 5 formed through the base material layer 2 as necessary.

  As shown in FIG. 2, some of the external conductors 6 are inclined external conductors 16 in which the surface 7 of the external conductor 6 is inclined with respect to the main surface 3 of the base material layer 2. The inclined outer conductor 16 has the interlayer connecting conductor 4 connected to the inclined outer conductor 16 at a position different from the center position B of the inclined outer conductor 16, and the interlayer connecting conductor 4 is the main surface of the base material layer 2. 3, the outer conductor 6 is inclined by forming the convex portion 14. 1 and 2, the inclined outer conductor 16 is inclined toward the adjacent outer conductor 6.

  As shown in FIG. 1, the electronic component 1 is obtained by mounting a plurality of surface mount components 10 a to 10 c on an electronic component substrate 11. Specifically, as shown in FIG. 2, the surface-mounted component 10 b is electrically connected to the external conductor 6 via the solder 8 provided on the surface 7 of the external conductor 6 formed on the base material layer 2. ing.

  Further, as shown in FIG. 2, in this embodiment, since there is the inclined outer conductor 16, the center position A of the terminal electrode 15 of the surface mount component 10 a mounted on the inclined outer conductor 16 is the same as that of the inclined outer conductor 16. It is closer to the lower end portion 16a side than the center position B. This is because when the surface mount component 10a is mounted on the electronic component substrate 11, the solder 8 is melted by the heat during reflow and the surface mount component 10a moves. Here, the center position A of the terminal electrode 15 and the center position B of the inclined outer conductor 16 of the surface-mounted component 10a are midpoints from both ends in the planar direction.

  As a result, as shown in FIG. 3, the distance between the surface-mounted component 10a and the adjacent surface-mounted component 10b can be reduced, so that more surface-mounted components can be mounted. Further, as shown in FIG. 3, by narrowing the distance between the surface mount component 10a and the surface mount component 10b, the distance between the surface mount component 10a and the end portion 23 of the electronic component substrate 11 can be increased. . Thereby, even if the surface mount component 10a is mounted, it is possible to secure a portion to which the shield case that covers the main surface of the electronic component substrate 11 is attached. This distance from the edge 23 of the substrate is also necessary for preventing interference when the substrate is divided.

  In Example 1, as shown in FIG. 3, the surface mount component 10a is moved in the direction perpendicular to the direction in which the terminal electrodes are arranged, that is, in the direction of the adjacent surface mount component 10b. The terminal electrodes 10a may be moved in a direction parallel to the direction in which the terminal electrodes are arranged.

  Moreover, as shown in FIG. 4, when providing the some inclination outer conductor 16, it is not necessary to incline in the same direction. The inclination direction can be adjusted as appropriate in consideration of a portion where the interval is desired to be wide before reflow and a portion where the interval between the surface-mounted components is desired to be narrow after reflow. In the first embodiment, the inclination direction of the inclined outer conductor 16 can be easily adjusted depending on the formation position of the interlayer connection conductor 4.

  In addition, the inclined outer conductor 16 is not limited to the case where the distance between the surface-mounted components is narrowed or the distance from the end of the board is secured, but solder is applied so as to extend over the inclined outer conductor 16 and the adjacent outer conductor. In this case, the solder can be used to reliably move the solder toward the inclined outer conductor.

Next, with reference to FIG. 5 to FIG. 9, a method for manufacturing the electronic component substrate 11 and the electronic component 1 using the same will be described.
(1) Manufacturing Method of Electronic Component Substrate FIG. 5 is a schematic process diagram showing a manufacturing method of the electronic component substrate 11 according to the first embodiment. FIG. 5A is a view showing a state in which an external conductor is formed on a ceramic green sheet for a base layer, and FIG. 5B is a view showing an electronic component substrate after firing. The electronic component substrate 11 is produced by laminating ceramic green sheets 2a on which a predetermined conductor pattern is formed, and firing the laminate.
1. Step of Preparing Substrate Layer In Example 1, as shown in FIG. 5A, a ceramic green sheet 2a for substrate layer is prepared. In producing the ceramic green sheet 2a for the base material layer, first, an appropriate amount of each of a binder, a dispersant, a plasticizer, an organic solvent, and the like is added to the ceramic powder, and a ceramic slurry is produced by mixing them. In Example 1, alumina powder was used as the ceramic powder.

Next, this ceramic slurry is formed into a sheet shape by a method such as a doctor blade method to produce a ceramic green sheet 2a for a base material layer.
2. Step of forming outer conductor Next, a predetermined conductor pattern is formed on the ceramic green sheet 2a for base material layer. As shown in FIG. 5A, in Example 1, an unfired interlayer connection conductor 4a, an unfired in-plane conductor 5a, and an unfired external conductor 6a are formed on the ceramic green sheet 2a for the base layer. . The unfired interlayer connection conductor 4a is provided with a hole for an interlayer connection conductor penetrating through the ceramic green sheet 2a for the base material layer by a method such as laser irradiation, and the hole for the interlayer connection conductor is filled with a conductive paste. To form. The unsintered in-plane conductor 5a and the unsintered outer conductor 6a are formed by screen-printing a conductive paste on the ceramic green sheet 2a for the base layer. The unfired interlayer connection conductor 4a, the unfired in-plane conductor 5a, and the unfired outer conductor 6a may be formed by an electrophotographic method or an inkjet method.

  Here, the conductive paste is formed by mixing a resin having a low melting point and a low specific resistance, such as Ag, Ag—Pt alloy, Ag—Pd alloy, Cu, Au, and the like.

  In particular, if the amount of the resin contained in the conductive paste for the interlayer connection conductor is small, the shrinkage rate of the interlayer connection conductor 4 in the firing step is lower than the shrinkage rate of the base material layer 2. The convex portion 14 can be formed on the surface 3. On the other hand, when forming a recess in the main surface 3 of the base material layer 2, the amount of resin contained in the conductive paste for the interlayer connection conductor is increased so that the shrinkage rate of the interlayer connection conductor 4 is determined. What is necessary is just to make it higher than the shrinkage rate of the material layer 2. FIG.

  The unfired outer conductor 6a is generally formed such that the center position of the unfired interlayer connection conductor 4a is the center position of the unfired outer conductor 6a. However, some of the unfired outer conductors 6a are formed such that the center position of the unfired interlayer connection conductor 4a is electrically connected at a position different from the center position of the unfired outer conductor 6a. As a result, as shown in FIG. 5B, when the interlayer connection conductor forms the convex portion 14 or the concave portion with respect to the main surface of the base material layer in the firing step described later, the outer conductor 6 is inclined and inclined. The outer conductor 16 is formed. Specifically, as shown in FIG. 5A, when the unfired interlayer connection conductor 4a is formed so as to form a convex portion with respect to the main surface of the base material layer, the unfired interlayer connection is formed. The conductor 4a is formed at a position farther from the unfired outer conductor 6a adjacent to the center position of the unfired outer conductor 6a. On the other hand, as shown in FIG. 6, when the interlayer connection conductor 4 is formed so as to form a recess with respect to the main surface of the base material layer, the interlayer connection conductor 4 is positioned from the center position of the inclined outer conductor 16. Is also formed at a position close to the adjacent outer conductor 6.

  Next, the ceramic green sheet 2a for base material layers is laminated | stacked and crimped | bonded as needed.

In addition, you may laminate | stack the ceramic green sheet for constrained layers which does not sinter substantially at the sintering temperature of the ceramic green sheet for base material layers 2a between each ceramic green sheet for base material layers 2a, or the outermost layer. A ceramic green sheet for a constraining layer that is not substantially sintered does not substantially shrink in the firing step. Therefore, shrinkage of the base material layer in the planar direction in the firing step can be suppressed, and the dimensional accuracy of the electronic component substrate 11 can be increased.
3. Step of firing Next, the base layer ceramic green sheet 2a, the unfired interlayer connection conductor 4a, the unfired in-plane conductor 5a, and the unfired external conductor 6a are combined with the base layer ceramic green sheet 2a. Is fired at a temperature at which sintering takes place. When the low-temperature sintered ceramic material is used as the material, the sintering temperature of the ceramic green sheet 2a for the base material layer is 1050 ° C. or less, and particularly preferably 800 to 1050 ° C. At this time, the base material layer may be fired while applying a certain pressure from the top and bottom directions, or may be fired in an unpressurized state without applying pressure. However, when the unfired interlayer connection conductor 4a is formed so as to form a convex portion with respect to the main surface of the base material layer 2, pressureless firing is preferable. This is because in the case of pressure firing, the unfired interlayer connection conductor 4a cannot be raised by firing.

  By firing, the ceramic green sheet 2a for base material layer shrinks at least in the thickness direction. When the above-mentioned ceramic green sheet for constraining layers is provided, shrinkage in the plane direction of the base material layer can be substantially suppressed, but shrinks in the thickness direction.

  Here, as described above, by adjusting the resin content in the conductive paste, the shrinkage rate of the base layer ceramic green sheet 2a and the unfired interlayer connection conductor 4a can be made different. As shown in FIG. 5B, if the contraction rate of the interlayer connection conductor 4 is smaller than the contraction rate of the base material layer 2, the interlayer connection conductor 4 protrudes and protrudes from the main surface 3 of the base material layer 2. Forming part. In this way, when the interlayer connection conductor 4 is raised, the unfired outer conductor is inclined, and the inclined outer conductor 16 is formed. Here, the shrinkage rate includes not only shrinkage in the thickness direction but also shrinkage in the plane direction. However, when the above-described constraining layer ceramic green sheet is provided, the shrinkage in the plane direction is substantially suppressed, so the difference in shrinkage between the base material layer and the interlayer connection conductor is exclusively in the thickness direction. This is due to the difference in shrinkage rate.

  In addition, when the ceramic green sheet for constrained layers is laminated on the outermost layer and fired, the fired constrained layer is removed. As a removing method, wet blasting, sand blasting, ultrasonic cleaning, or the like can be used.

Through the above steps, the electronic component substrate 11 having the inclined outer conductor 16 is manufactured.
(2) Manufacturing Method of Electronic Component The electronic component 1 is manufactured by mounting the surface mounting component 10 on the outer conductor 6 of the electronic component substrate 11 via the solder 8. As the surface-mounted component 10, an active element such as a transistor or an IC, or a passive element such as a chip capacitor or a chip resistor is mounted.

  FIG. 7 is a schematic cross section showing a state in which solder pastes 8a to 8c are applied to the outer conductor 6 of the electronic component substrate 11 and the surface mount components 10a to 10c are mounted on the solders 8a and 8b, that is, a state before reflow. FIG.

  As shown in FIGS. 2 and 7, solder pastes 8 a to 8 c are applied to the surface 7 of the outer conductor 6 and the inclined outer conductor 16. As a coating method, a method such as printing or dipping can be used.

  When applying the solder paste 8a to the inclined outer conductor 16, the solder paste 8a is applied to the high end portion 16b side of the inclined outer conductor 16, as shown in FIGS. By applying the solder paste 8a to the high end portion 16b side, it is possible to widen the interval between the adjacent solder pastes 8b as compared with the case where the solder paste is applied to the center portion. Therefore, when the surface mount component 10a is mounted on the solder paste 8a, it is possible to ensure an interval between the surface mount components for avoiding contact with the adjacent surface mount component 10b.

  Next, the surface mount components 10a to 10c are mounted on the solder pastes 8a to 8c. Thereafter, the solder pastes 8a to 8c are melted by reflowing at a predetermined temperature, and the external conductor 6 and the inclined external conductor 16 are joined to the terminal electrodes of the surface mount components 10a to 10c.

  Here, the solder 8 moderately wets and spreads on the external conductor 6 and the terminal electrode of the surface mount component 10 during reflow. As a result, the surface-mounted component 10 moves due to a so-called self-alignment effect. At this time, the surface-mounted component 10a mounted on the high end portion 16b side of the inclined outer conductor 16 moves to the low end portion 16a side along the inclination. That is, it is possible to direct the flow of the solder 8 and the movement of the surface mount component in the tilt direction of the tilted outer conductor 16. Therefore, even if the wiring close to the inclined outer conductor 16 is provided, it is possible to prevent the solder 8 from moving toward the adjacent wiring by increasing the inclination on the wiring side.

  Further, after the reflow, if the center position of the terminal electrode of the surface mount component 10a is moved closer to the lower end portion 16a side than the center position of the inclined outer conductor 16, the distance from the adjacent surface mount component 10b is increased. Can be narrowed. In this case, when mounting the surface mount component, that is, before reflowing, the distance between the surface mount component and the adjacent surface mount component can be widened, and after mounting the surface mount component, that is, after reflowing, the surface The distance between the actual equipment and the end of the electronic component substrate can be increased. Therefore, according to the present invention, according to the present invention, the surface mount component is also applied to a portion where the surface mount component cannot be mounted in order to avoid contact between the surface mount components at the time of mounting or contact with the shield case after mounting. Can be implemented. In addition to mounting surface mount components on the edge of the board, according to the present invention, the distance between the surface mount components can be reduced, so that more surface mount components can be mounted than before. Is possible. In addition, as shown in FIGS. 1-4, the surface mount component 10a joined to the inclination outer conductor 16 may incline along an inclination.

  Through the steps described above, it is possible to produce a high-density wiring electronic component that directs the movement of the surface-mounted component during reflow and controls the mounting position of the surface-mounted component after reflow.

  FIG. 8 is a schematic process diagram showing another embodiment of the method for manufacturing the electronic component substrate 11 of the present invention. FIG. 8A is a view showing a state in which a ceramic green sheet for base layer and a ceramic green sheet for forming protruding electrodes are laminated, and FIG. 8B is a diagram in which the ceramic green sheet for forming protruding electrodes is removed after firing. The figure which shows a state, The figure which shows the state which formed the external conductor in FIG.8 (c) base material layer. In addition, since it is the same as that of Example 1 except the manufacturing method of the inclination outer conductor 16, it abbreviate | omits. Further, the process of manufacturing the electronic component 1 using the electronic component substrate 11 is the same as that of the first embodiment, and thus the description thereof is omitted.

  In Example 1, the inclined outer conductor 16 was produced by inclining the unfired outer conductor 6a by the firing step, but in Example 2, the unfired outer conductor 6a is formed on the main surface of the base material layer 2. In the process, an unfired inclined outer conductor 16a is produced. Specifically, as shown in FIG. 8, the step of preparing the base material layer 2 on which the protruding electrodes 24 are formed, and the unfired outer conductor 6 a and the unfired inclined outer conductor 16 a are formed on the base material layer 2. The electronic component substrate 11 provided with the inclined outer conductor 16 is manufactured through the steps of performing and firing these. Hereinafter, each process will be described in detail.

  FIGS. 8A and 8B are views showing a process of forming the protruding electrode 24 on the base material layer 2. First, the protruding electrode forming ceramic green sheet 12a in which the unfired protruding electrode forming interlayer connection conductor 24a is formed on the base layer ceramic green sheet 2a in which the predetermined unfired in-plane conductor 5a and interlayer connecting conductor 4a are formed. Are stacked. The protruding electrode forming ceramic green sheet 12a is not sintered at the sintering temperature of the base layer ceramic green sheet 2a. Therefore, the protruding electrode forming ceramic green sheet 12a can be removed after firing. In this way, the base material layer 2 on which the protruding electrodes 24 are formed as shown in FIG. 8B can be produced.

  Next, as shown in FIG. 8C, an unfired outer conductor 6a is formed on the main surface of the base material layer 2 on which the protruding electrodes 24 are formed. At this time, if the unfired external conductor 6a is formed by screen printing or the like so that the protruding electrode 24 is electrically connected to the external conductor 6 at a position different from the center position of the external conductor 6, the unfired external conductor Since 6a rises at the protruding electrode 24, an unfired inclined outer conductor 16a can be formed. That is, the protruding electrode 24 is provided at a position close to the high end side of the unfired inclined outer conductor 16a.

  Next, the electronic component substrate including the outer conductor 6 and the inclined outer conductor 16 on the main surface of the substrate layer 2 by firing the base layer 2, the unfired outer conductor 6a, and the unfired inclined outer conductor 16a. 11 is produced.

  FIG. 9 is a schematic sectional view showing another embodiment of the method for manufacturing the electronic component substrate 11 of the present invention. In addition, since it is the same as that of Example 1 except the manufacturing method of the unbaking inclination outer conductor 26a, it abbreviate | omits. In addition, the process of manufacturing the electronic component 1 using the electronic component substrate 11 is the same as that in the first embodiment, and thus the description thereof is omitted.

  As shown in FIG. 9, when forming the unfired outer conductor on the main surface 3 of the base material layer 2, the unfired inclined outer conductor is formed by changing the coating amount of the conductive paste. The inclined outer conductor 26 is produced by firing. In the inclined outer conductor in Example 3, only the surface 7 is inclined with respect to the main surface 3 of the base material layer 2. The third embodiment is preferable in that it is not necessary to consider the position of the unfired interlayer connection conductor as in the first and second embodiments when printing the unfired outer conductor.

  In addition, it is possible to produce a substrate for an electronic component including an inclined outer conductor by various methods, such as inclining by pressing an unfired outer conductor.

  Further, the inclined outer conductor does not necessarily need to be used in order to narrow the interval between adjacent surface mount components. By directing the solder flow by tilting the sloped outer conductor, the sloped outer conductor can be used to prevent the solder from flowing in an unintended direction and mounting the surface mount component on an outer conductor different from the desired outer conductor. It is also possible to use it.

It is a schematic sectional drawing which shows the board | substrate for electronic components concerning Example 1 of this invention, and an electronic component using the same. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which expands partially and shows the state which mounted the surface mounting component on the board | substrate for electronic components concerning Example 1 of this invention. It is a top view which shows the state which looked at the electronic component shown in FIG. 1 from the top. It is a schematic sectional drawing which shows the board | substrate for other electronic components concerning Example 1 of this invention, and an electronic component using the same. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic process figure which shows the manufacturing method of the board | substrate for electronic components concerning Example 1 of this invention, (a) is a figure which shows the state which formed the external conductor in the ceramic green sheet for base materials layers, (b) is baking It is a figure which shows the board | substrate for subsequent electronic components. It is a schematic sectional drawing which shows the other manufacturing method of the board | substrate for electronic components concerning Example 1 of this invention. It is a schematic sectional drawing which shows the manufacturing method of the electronic component concerning Example 1 of this invention. It is a schematic process drawing which shows the other manufacturing method of the board | substrate for electronic components concerning Example 1 of this invention, (a) is the state which laminated | stacked the ceramic green sheet for base material layers, and the ceramic green sheet for bump electrode formation The figure shown, (b) is a figure which shows the state which removed the ceramic green sheet for bump electrode formation after baking, (c) The figure which shows the state which formed the external conductor in the base material layer. It is a schematic sectional drawing which shows the other manufacturing method of the board | substrate for electronic components concerning Example 1 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Base material layer 3,13 Main surface of base material layer 4 Interlayer connection conductor 6 External conductor 7 Surface of external conductor 8 Solder 10a, 10b, 10c Surface mount component 11 Substrate for electronic component 12a Green sheet for protruding electrode formation DESCRIPTION OF SYMBOLS 14 Convex part 15 Terminal electrode of surface mount components 16, 26 Inclined outer conductor 16a Low end part of inclined outer conductor 16b High end part of inclined outer conductor 23 End part of substrate for electronic components 24 Projection electrode

Claims (16)

A substrate for electronic components having a base material layer and a plurality of external conductors formed on at least one main surface of the base material layer;
Solder formed on the surface of the outer conductor;
A surface-mount component electrically connected to the outer conductor via the solder;
In an electronic component comprising:
At least a part of the outer conductor is an inclined outer conductor whose surface is inclined with respect to the main surface of the base material layer.   The electronic component according to claim 1, wherein the inclined outer conductor is inclined toward the adjacent outer conductor.   The electronic component according to claim 1, wherein a center position of the terminal electrode of the surface mount component is closer to a lower end side than a center position of the inclined outer conductor.   The interlayer connection conductor formed through the base material layer is electrically connected to the inclined outer conductor at a position different from the center position of the inclined outer conductor, and the interlayer connection conductor is connected to the base 4. The electronic component according to claim 1, wherein the inclined outer conductor is inclined by forming a convex portion or a concave portion on a main surface of the material layer. In an electronic component substrate having a base material layer and a plurality of outer conductors formed on at least one main surface of the base material layer,
At least a part of the outer conductor is an inclined outer conductor whose surface is inclined with respect to the main surface of the base material layer.   The electronic component substrate according to claim 5, wherein the inclined outer conductor is inclined toward the adjacent outer conductor.   The interlayer connection conductor formed through the base material layer is electrically connected to the inclined outer conductor at a position different from the center position of the inclined outer conductor, and the interlayer connection conductor is connected to the base 7. The electronic component substrate according to claim 5, wherein the inclined outer conductor is inclined by forming a convex portion or a concave portion on a main surface of the material layer. A substrate for an electronic component through a step of preparing a base material layer, a step of forming a plurality of external conductors on at least one main surface of the base material layer, and a step of firing the base material layer and the external conductor Creating a process;
Applying solder to the outer conductor;
Mounting a surface mount component via the solder;
In a method for manufacturing an electronic component comprising:
Having a step of inclining at least a part of the surface of the outer conductor with respect to a main surface of the base material layer to form an inclined outer conductor;
In the step of mounting the surface-mounted component, the surface-mounted component is moved to the low end portion side of the inclined outer conductor.   9. The method of manufacturing an electronic component according to claim 8, wherein, in the step of forming the inclined outer conductor, the inclined outer conductor is inclined toward the adjacent outer conductor. In the step of applying the solder, the solder is applied to the high end side of the inclined outer conductor,
The method for manufacturing an electronic component according to claim 8 or 9, wherein, in the step of mounting the surface-mounted component, the surface-mounted component is moved from a high end portion side to a low end portion side of the inclined outer conductor. . The step of forming the inclined outer conductor includes
Forming an interlayer connection conductor penetrating the base material layer;
Forming the outer conductor on at least one main surface of the base layer so that the interlayer connection conductor is electrically connected to the inclined outer conductor at a position different from the center position of the outer conductor;
The step of inclining the external conductor by forming a convex portion or a concave portion on the main surface of the base material layer by the interlayer connection conductor due to a difference in shrinkage between the base material layer and the interlayer connection conductor in the firing step. The method of manufacturing an electronic component according to claim 8, wherein: The step of forming the inclined outer conductor includes
Forming protruding electrodes on the base material layer;
Forming the outer conductor on at least one main surface of the base material layer so that the protruding electrode is electrically connected to the inclined outer conductor at a position different from a center position of the outer conductor; 11. The method of manufacturing an electronic component according to claim 8, further comprising a step of inclining the surface. Preparing a base material layer;
Forming a plurality of outer conductors on at least one main surface of the base material layer;
Firing the base material layer and the outer conductor;
In the manufacturing method of the substrate for electronic components comprising:
The manufacturing method of the board | substrate for electronic components characterized by including the process of inclining the surface of at least one part of the said external conductor with respect to the main surface of the said base material layer, and forming an inclined external conductor.   14. The method of manufacturing a substrate for an electronic component according to claim 13, wherein in the step of forming the inclined outer conductor, the inclined outer conductor is inclined toward the adjacent outer conductor. The step of forming the inclined outer conductor includes
Forming an interlayer connection conductor penetrating the base material layer;
Forming the outer conductor on at least one main surface of the base layer so that the interlayer connection conductor is electrically connected to the inclined outer conductor at a position different from the center position of the outer conductor;
The step of inclining the external conductor by forming a convex portion or a concave portion on the main surface of the base material layer by the interlayer connection conductor due to a difference in shrinkage between the base material layer and the interlayer connection conductor in the firing step. The method for manufacturing a substrate for electronic parts according to claim 13 or 14, characterized by comprising: The step of forming the inclined outer conductor includes
Forming protruding electrodes on the base material layer;
Forming the outer conductor on at least one main surface of the base material layer so that the protruding electrode is electrically connected to the inclined outer conductor at a position different from a center position of the outer conductor; The method for manufacturing a substrate for electronic parts according to claim 13 or 14, further comprising the step of inclining.

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