JP2013115244A - Substrate for mounting electronic component, electronic device, and manufacturing method of substrate for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for mounting an electronic component which easily reduces adjacent intervals of connection terminals to which electrodes of the electronic component are connected.SOLUTION: A substrate for mounting an electronic component 9 includes: an insulation substrate 1 having an upper surface including a mounting part 2 of an electronic component; and protruding terminals 3 which are provided at the mounting part 2 protruding from an upper surface of the insulation substrate 1, and a side surface of each protruding terminal 3 inclines outwardly from a lower end part to an upper end part. A part of a conductive connection material 5 connecting with an upper surface of each protruding terminal 3 is prevented from spreading to the upper surface of the insulation substrate 1, and thus adjacent intervals of the protruding terminals 3, serving as connection terminals, are easily reduced.

Description

  The present invention relates to an electronic component mounting substrate for mounting an electronic component including a semiconductor element such as an LSI or an IC, an electronic device in which the electronic component is mounted on the electronic component mounting substrate, and an electronic component mounting substrate. It relates to a manufacturing method.

  In electronic parts including semiconductor elements such as LSI and IC, miniaturization and high density are required. In response to this requirement, a large number of electrodes are arranged on the lower surface of the electronic component, and these electrodes are connected to the connection terminals of the electronic component mounting board via a conductive connecting material such as solder, flip chip mounting Is used.

  What is frequently used as an electronic component mounting substrate on which electronic components are mounted by flip-chip mounting is such that a connection terminal made of a metallized layer is provided on the upper surface of an insulating substrate made of a ceramic sintered body or the like.

  The connection terminal and the electrode of the electronic component face each other and are electrically connected to each other via a conductive connection material such as solder to form an electronic device. The connection terminal is electrically led to the lower surface or the side surface of the insulating substrate through a through conductor that penetrates the insulating substrate in the thickness direction.

  Such a substrate for mounting electronic parts is manufactured, for example, by a ceramic green sheet lamination method. That is, first, a plurality of ceramic green sheets are prepared. Next, through holes are formed in a predetermined one of the plurality of ceramic green sheets, and a metal paste is filled in the through holes. Next, the ceramic green sheets A metal paste serving as a connection terminal is printed on the surface of the substrate, and then a plurality of ceramic green sheets are laminated and fired to produce an electronic component mounting board.

JP-A-5-267393 JP 2005-086161 A JP 2006-005322 A

  However, in the above prior art, since it is difficult to reduce the interval between adjacent connection terminals, there is a problem that it is not easy to reduce the size and increase the density of the electronic component mounting board. This is because a conductive connecting material such as solder has fluidity when connected to the connection terminal, and thus a part thereof may spread on the upper surface of the insulating substrate. There is a possibility that the electrical insulating property is lowered by a part of the conductive connecting material spreading between the adjacent connecting terminals. Therefore, it is difficult to reduce the interval between adjacent connection terminals.

  The present invention has been completed in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide an electronic component mounting board and an electronic device in which it is easy to reduce the interval between adjacent connection terminals to which electrodes of the electronic component are connected. An object of the present invention is to provide an apparatus and a method for manufacturing an electronic component mounting board.

  An electronic component mounting substrate according to one aspect of the present invention includes an insulating substrate having an upper surface including a mounting portion for the electronic component, and a convex terminal provided to protrude from the upper surface of the insulating substrate in the mounting portion. The side surface of the convex terminal is inclined outward from the lower end portion toward the upper end portion.

  An electronic device according to one aspect of the present invention includes an electronic component mounting substrate having the above-described configuration, and an electronic component that includes an electrode and is mounted on the mounting portion. It is connected to the upper surface of the convex terminal for connecting the electronic component via a conductive connecting material.

The method of manufacturing an electronic component connecting board according to one aspect of the present invention includes:
Preparing a plurality of ceramic green sheets and laminating the plurality of ceramic green sheets to produce a green sheet laminate;
Laminating an organic resin layer on the upper surface of the green sheet laminate;
Forming a through-hole penetrating from the resin layer to the green sheet laminate;
Filling the through-hole with a metal paste;
Heating the green sheet laminate, the organic resin layer and the metal paste at the same time, firing the green sheet laminate and the metal paste, and removing the organic resin layer,
In the step of forming the through hole, the through hole is formed so as to gradually open outward from the lower end portion toward the upper end portion in a portion penetrating the resin layer.

  According to the electronic component mounting substrate of one aspect of the present invention, the convex terminal is provided on the electronic component mounting portion, and the side surface of the convex terminal faces from the lower end portion to the upper end portion of the side surface. Therefore, it is easy to reduce the interval between adjacent convex terminals as connection terminals to which the electrodes of the electronic component are connected.

  That is, since the convex terminal functioning as the connection terminal protrudes from the upper surface of the insulating substrate, the upper surface of the convex terminal to which the conductive connecting material is connected and the upper surface of the insulating substrate are separated from each other. In addition, since the side surface of the convex terminal is inclined as described above, the side surface of the convex terminal is in contact with the upper surface at a larger angle than perpendicular, and the upper surface of the convex terminal is rounded by the surface tension. A part of the conductive connecting material is prevented from flowing out to the side surface of the convex terminal. Therefore, a part of the conductive connecting material connected to the upper surface of the convex terminal is prevented from spreading on the upper surface of the insulating substrate.

  According to the electronic device of one aspect of the present invention, the electronic component is mounted on the electronic component mounting board having the above-described configuration, and the electrode of the electronic component is connected to the upper surface of the convex terminal via the conductive connecting material. Therefore, the spread of the conductive connecting material between adjacent convex terminals is suppressed. Therefore, it is possible to provide an electronic device in which it is easy to reduce the adjacent interval between the convex terminals to which the electrodes of the electronic component are connected.

  According to the method for manufacturing an electronic component connecting substrate of one aspect of the present invention, since the above steps are included, the convex terminal functioning as the connecting terminal protrudes from the upper surface of the insulating substrate. A substrate can be manufactured. In the manufactured electronic component mounting substrate, as in the electronic component mounting substrate according to one aspect of the present invention, the spreading of the conductive connecting material connected to the convex terminal is effectively suppressed. Therefore, it is possible to provide a method for manufacturing an electronic component mounting board in which it is easy to reduce the interval between adjacent convex terminals to which the electrodes of the electronic component are connected.

(A) is a top view which shows the electronic component mounting board | substrate and electronic device of embodiment of this invention, (b) is sectional drawing in the AA of (a). It is sectional drawing which expands and shows the principal part of the electronic component mounting board | substrate and electronic device which are shown in FIG. It is sectional drawing which shows the principal part in the modification of the electronic component mounting board | substrate and electronic device which are shown in FIG. (A) And (b) is sectional drawing which shows the principal part in the other modification of the electronic component mounting board | substrate and electronic device which are respectively shown in FIG. (A)-(c) is sectional drawing which shows the manufacturing method of the electronic component mounting board | substrate of embodiment of this invention in order of a process, respectively.

  An electronic component mounting substrate, an electronic device, and a method for manufacturing an electronic component mounting substrate according to the present invention will be described with reference to the accompanying drawings. The distinction between upper and lower in the following description does not define the upper and lower when the electronic component mounting substrate and the electronic device are actually used.

  FIG. 1A is a plan view showing an electronic component mounting board and an electronic device according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA of FIG. FIG. 2 is an enlarged cross-sectional view showing the main parts of the electronic component mounting substrate and the electronic device shown in FIG.

  1 and 2, 1 is an insulating substrate, 2 is a mounting portion included on the upper surface of the insulating substrate 1, and 3 is a convex terminal provided on the mounting portion 2. A convex terminal 3 is provided on the mounting portion 2 on the upper surface of the insulating substrate 1 to basically form an electronic component mounting substrate 9. The electronic component 10 is mounted on the mounting portion 2 of the electronic component mounting board 9, and the electrode 11 of the electronic component 10 is connected to the upper surface of the convex terminal 3 via the conductive connecting material 5, so that the electronic device 20 is basically used. Is formed. In FIG. 1A, the electronic component 10 is omitted for easy viewing.

  The insulating substrate 1 is a base for mounting and holding an electronic component 10 including a semiconductor element. For example, the insulating substrate 1 is formed in a square plate shape having a side length of about 20 to 60 mm. The thickness of the insulating substrate 1 is appropriately set according to conditions such as mechanical strength, electrical function, and low profile required for the electronic component mounting substrate 9.

  The insulating substrate 1 is a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a mullite sintered body. Formed by the body.

  If the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows.

  First, a raw material powder mainly composed of aluminum oxide and silicon oxide is kneaded with an organic solvent and a binder, and formed into a sheet shape by a forming method such as a doctor blade method or a lip coater method to produce a ceramic green sheet. . Next, the ceramic green sheets are cut into a predetermined shape and size, and a plurality of ceramic green sheets are stacked vertically. Then, the insulating substrate 1 can be manufactured by firing the laminate of ceramic green sheets at a firing temperature of about 1300 to 1600 ° C.

  The mounting portion 2 on the upper surface of the insulating substrate 1 is a part such as a quadrangle or an ellipse on which the electronic component 10 including the semiconductor element is mounted. In the example shown in FIGS. The central part is the mounting part 2.

  The convex terminal 3 is a part that is electrically connected to the electrode 11 of the electronic component 10, for example, a part of a conductive path for electrically connecting the electrode 11 to an external electric circuit (not shown). Function as.

The convex terminal 3 has, for example, a circular shape, an elliptical shape, a quadrangular shape, or a quadrangular shape in which corners are formed in an arc shape in a plan view. If the electrode 11 of the semiconductor element 10 is connected by the flip chip method, the convex terminal 3 is formed in a circular shape having a diameter of about 50 to 150 μm, for example. The convex terminal 3 is formed of a metal material such as copper, silver, palladium, platinum, gold, copper-tungsten, molybdenum, manganese, or the like. These metal materials are attached to the insulating substrate 1 by a method such as a metallizing method or a plating method.

  The side surface of the convex terminal 3 is inclined outward from the lower end portion of the side surface toward the upper end portion. For example, in the example shown in FIG. 1, the convex terminal 3 has a trapezoidal shape or a so-called taper shape in a longitudinal sectional view. In other words, in a longitudinal sectional view, an angle (side surface inclination angle) θ between a virtual surface obtained by extending the upper surface of the convex terminal 3 outward and the side surface is larger than 90 ° C. (vertical direction). ing.

  The convex terminal 3 having such a shape is formed by, for example, arranging a layered covering material (not shown) having an opening having the same shape and size as the convex terminal 3 to be formed on the upper surface of the insulating substrate 1. In this case, after the metal material to be the convex terminal 3 is arranged in the opening of the covering material, it can be formed by a method of removing the covering material. As the covering material, an organic resin material, a mixed material of an organic resin material and an inorganic material such as a glass material, a metal material, or the like can be used. In addition, the metal material to be the convex terminals 3 is arranged in the opening by, for example, a method in which the metal material paste is filled in the opening and then the metal material paste is heated and sintered. Can do.

  The through conductor 4 functions as a part of a conductive path for electrically connecting the electrode 11 of the electronic component 10 to an external electric circuit together with the convex terminal 3. The electrode 11 of the electronic component 10 electrically and mechanically connected to the convex terminal 3 through a conductive connecting material 5 such as tin-silver solder is connected to the side surface of the insulating substrate 1 through the through conductor 4. Electrically derived to the outer surface such as the lower surface. This lead-out portion is electrically connected to an external electric circuit, and the electrode 11 of the electronic component 10 and the external electric circuit are electrically connected to each other. The conductive connecting material 5 may be other solder such as tin-silver-copper or tin-silver-bismuth, or may be a conductive adhesive.

  The connection between the convex terminal 3 and the electrode 11 via the conductive connecting material 5 is performed as follows, for example, when solder is used as the conductive connecting material 5. That is, first, a solder paste such as tin-silver solder is applied to the upper surface of the convex terminal 3, and then the electronic component 10 is aligned while being positioned so that the upper surface of the convex terminal 3 and the electrode 11 face each other. Is set on the mounting portion 2, and then the solder paste is heated and melted and then cooled and solidified. Thereby, the upper surface of the convex terminal 3 and the electrode 11 (lower surface) are electrically and mechanically connected via the conductive connecting material 5.

  The conductive connecting material 5 may be attached not on the convex terminals 3 but on the electrodes 11 of the electronic component 10. By applying the solder paste as described above on the electrode 11 and heating it to form a hemispherical shape, it is possible to produce the electronic component 10 in which the solder is attached to the electrode 11 as a bump (not shown). it can. The electronic component 10 with the solder bump is mounted on the mounting portion 2 of the electronic component mounting substrate 9, and the electrode 11, the convex terminal 3, Are electrically connected.

In addition, other conductors 6 such as an internal wiring conductor and an external connection conductor may be formed on the inside and the bottom surface of the insulating substrate 1. The other conductor 6 is, for example, the convex terminal 3 and the through conductor 4.
At the same time, it functions as a part of a conductive path for electrically connecting the electrode 11 of the electronic component 10 to an external electric circuit. Further, the other conductor 6 can also function as a conductive path for electrically connecting the plurality of convex terminals 3 or the through conductors 4 to each other.

  In the example shown in FIG. 1, another conductor 6 is formed from the lower end of the through conductor 4 to the lower surface of the insulating substrate 1. Of these other conductors 6, a portion formed on the lower surface of the insulating substrate 1 serves as an external connection conductor, which is electrically and electrically connected to an external electric circuit via solder, a conductive adhesive or the like (not shown). Mechanically connected.

  According to such an electronic component mounting board 9, the convex terminal 3 is provided on the electronic component mounting portion 2, and the side surface of the convex terminal 3 is outward from the lower end portion toward the upper end portion. Since it is inclined, it is easy to reduce the adjacent interval between the convex terminals 3 as connection terminals to which the electrodes 11 of the electronic component 10 are connected.

  That is, since the convex terminal 3 that functions as the connection terminal protrudes from the upper surface of the insulating substrate 1, the upper surface of the convex terminal 3 to which the conductive connecting material 5 is connected and the upper surface of the insulating substrate 1 are separated from each other. ing. Further, since the side surface of the convex terminal 3 is inclined as described above, the inclination angle θ of the side surface of the convex terminal 3 is larger than the vertical direction, and the surface is rounded by the surface tension on the upper surface of the convex terminal 3. A part of the conductive connecting material 5 such as solder in a state is suppressed from flowing out to the side surface of the convex terminal 3.

  Therefore, a part of the conductive connecting material 5 such as solder connected to the upper surface of the convex terminal 3 is suppressed from spreading on the upper surface of the insulating substrate 1. Therefore, it is possible to provide the electronic component mounting board 9 in which it is easy to reduce the adjacent interval between the convex terminals 3 to which the electrodes 11 of the electronic component 10 are connected.

  Moreover, the convex terminal 3 can be formed without printing a metal paste on the upper surface of the ceramic green sheet used as the insulated substrate 1, for example so that it may mention later. Therefore, a part of the convex terminal 3 is prevented from spreading on the upper surface of the insulating substrate 1.

  The height of the convex terminal 3 (the distance between the upper surface of the insulating substrate 1 and the upper surface of the convex terminal 3) is the distance between the adjacent convex terminals 3 and the material and amount of the conductive connecting material 5 used ( Volume), the heating temperature at the time of joining the convex terminal 3 and the electrode 11, the size (area) of the convex terminal 3 and the electrode 11 in plan view, the productivity, and the like.

For example, when the conductive connecting material 5 is tin-silver solder, the convex terminal 3 has a circular shape with a diameter of about 0.1 mm in a plan view, and the electrode 11 has a circular shape with a diameter of about 0.05 mm in a plan view. For example, the height of the convex terminal 3 may be set to about 0.05 to 0.1 mm.

  In addition, the inclination angle of the side surface of the convex terminal 3 is such that the soldering wettability such as the magnitude of the surface tension when the solder used as the conductive connecting material 5 melts or the contact angle with the upper surface of the convex terminal 3 is increased. And a condition similar to the condition for setting the height of the convex terminal 3 can be set.

  For example, when the convex terminal 3 and the electrode 11 have the same shape and dimensions as described above, if the convex terminal 3 is made of a metallized conductor of tungsten and the conductive connecting material 5 is tin-silver solder, The tilt angle is preferably about 60 degrees or less. In consideration of securing the mechanical strength at the upper end portion including the upper surface of the convex terminal 3, it is more preferable that the angle is in the range of about 30 to 60 degrees.

  The protruding terminals 3 in the electronic component mounting board 9 may be coated with a plating layer (not shown) such as nickel or gold on the exposed surface. If such a plating layer is applied, the oxidative corrosion of the convex terminal 3 is more effectively suppressed.

  As shown in FIG. 3, the plating layer may be attached only to the upper surface of the exposed surface of the convex terminal 3. FIG. 3 is an enlarged cross-sectional view showing a main part in a modification of the electronic component mounting board 9 and the electronic device 20 shown in FIGS. 1 and 2. In FIG. 3, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the example shown in FIG. 3, the plating layer 7 is deposited on the upper surface of the exposed surface of the convex terminal 3, and the plating layer 7 is not deposited on the side surface. The plating layer 7 includes, for example, a nickel plating layer, a copper plating layer, a gold plating layer, and the like, and at least the outermost layer is a gold plating layer. In such a case, it is more effectively suppressed that the conductive connection material 5 such as solder flows on the side surface of the convex terminal 3. Therefore, it is more effectively suppressed that a part of the conductive connecting material 5 spreads on the upper surface of the insulating substrate 1 through the side surface of the convex terminal 3. In the electronic device 20 having the plating layer 7, since the outermost gold plating layer is often diffused in the conductive connecting material 5, the presence or absence of the gold plating layer in the plating layer 7 is detected. Is difficult.

  In order to deposit the plating layer 7 only on the upper surface of the convex terminal 3, for example, the metal material to be the convex terminal 3 is disposed in the opening provided in the layered coating material as described above, and then the coating material is removed. Before plating, the plating layer 7 may be applied to the exposed surface of the metal material (the surface to be the upper surface of the convex terminal 3). The plating layer 7 can be applied by a method such as an electrolytic plating method or an electroless plating method.

  In the electronic component mounting substrate 9 having the above-described configuration, a through conductor 4 penetrating at least part of the thickness direction of the insulating substrate 1 is formed from the upper surface of the insulating substrate 1 toward the inside. When the terminal 3 is formed integrally with each other, the electronic component mounting board 9 and the electronic device 20 with higher reliability can be formed.

  That is, in this case, the thermal stress resulting from the difference in thermal expansion coefficient between the electronic component 10 and the insulating substrate 1 in the convex terminal 3 is the end portion (lower end portion) of the convex terminal 3 on the insulating substrate 1 side. ) Tends to concentrate. On the other hand, if the convex terminal 3 and the through conductor 4 are integrally formed, the thermal stress acting on the lower end portion of the convex terminal 3 is also distributed to the through conductor 4 side. Therefore, mechanical destruction of the convex terminal 3 can be more effectively suppressed. Therefore, the electronic component mounting substrate 9 and the electronic device 20 with higher reliability can be provided.

  In this case, the shape and dimensions of the through conductor 4 in plan view (or the diameter if the through conductor 4 is circular in plan view) are the same as those of the convex terminal 3 formed integrally with the through conductor 4. The shape and size at the lower end may be the same or different. If both shapes and dimensions are the same, the lower end surface of the convex terminal 3 and the upper end surface of the through conductor 4 are connected to each other over the entire surface, and therefore the strength of adhesion between the convex terminal 3 and the through conductor 4 This is advantageous in increasing the height. Further, when either one of the lower end surface of the convex terminal 3 and the upper end surface of the through conductor 4 is larger than the other, when the positional deviation occurs between them, the positional deviation is absorbed, This is advantageous in ensuring electrical connection to each other.

  FIGS. 4A and 4B are cross-sectional views showing enlarged main parts of another modification example of the electronic component mounting board 9 and the electronic device 20 shown in FIGS. 1 and 2, respectively. 4, parts similar to those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the example shown in FIG. 4A, the lower end of the convex terminal 3 is connected to another conductor 6 formed on the upper surface of the insulating substrate 1 and is electrically connected to the through conductor 4 via the other conductor 6. It is connected. In this case, the convex terminal 3 is electrically connected to an external electric circuit through another conductor 6 formed on the upper surface of the insulating substrate 1, or the plurality of convex terminals 3 are electrically connected to each other. Can also be connected.

  In the example shown in FIG. 4B, the lower end of the convex terminal 3 is electrically connected to another conductor 6 formed on the upper surface of the insulating substrate 1, and directly below the convex terminal 3 (in plan view). The through conductor 4 is not formed at the position overlapping the convex terminal 3). Also in this case, the convex terminals 3 can be electrically connected to an external electric circuit via another conductor 6 formed on the upper surface of the insulating substrate 1, or the plurality of convex terminals 3 can be electrically connected to each other. Can also be connected.

  5A to 5C are cross-sectional views showing a method of manufacturing an electronic component connecting board in the embodiment of the present invention in the order of steps. 5, parts similar to those in FIGS. 1 and 2 are denoted by the same reference numerals. In the following description, the description of the same matters as those in the electronic component mounting substrate 9 and the electronic device 20 will be omitted.

  First, as shown in FIG. 5A, a plurality of ceramic green sheets 31 are prepared, and the plurality of ceramic green sheets 31 are laminated to produce a green sheet laminate 32. The ceramic green sheet 31 is fired as described above to become the insulating substrate 1 and can be manufactured by using the same material as that for manufacturing the insulating substrate 1 and using the same method. When the ceramic green sheets 31 are stacked, the adhesiveness between the upper and lower ceramic green sheets 31 may be increased by pressing in the vertical direction.

  Next, the organic resin layer 33 is laminated on the upper surface of the produced green sheet laminate 32. Examples of the organic resin material that becomes the organic resin layer 33 include hydrocarbon-based organic resin materials such as polypropylene resin.

  The organic resin layer 33 is obtained by, for example, applying the fluidity obtained by mixing the organic resin material described above with an organic solvent on the upper surface of the green sheet laminate 32, and then removing the organic solvent, thereby removing the green sheet. The stacked body 32 can be stacked on the upper surface. Further, the above organic resin material formed into a sheet shape can be laminated by affixing on the upper surface of the green sheet laminate 32 and laminating.

  The organic resin layer 33 is for providing a through hole (described later) for filling a metal paste to be the convex terminal 3 on the upper surface of the insulating substrate 1. The height of the convex terminal 3 is approximately the same as the thickness of the organic resin layer 33. Therefore, the thickness of the organic resin layer 33 is set to the same thickness as the height of the convex terminal 3 to be formed.

  Next, as shown in FIG. 5B, a through hole 34 penetrating from the resin layer 33 to the green sheet laminate 32 is formed. The through hole 34 may penetrate a part in the thickness direction of the green sheet laminate 32.

  The through hole 34 can be formed by a method such as laser processing or drilling. A portion of the through hole 34 that penetrates the resin layer 33 is a portion for forming the convex terminal 3. In the next step, the through hole 34 is filled with a metal material to be the convex terminal 3. Therefore, the through-hole 34 formed in this step needs to be formed so as to gradually open outward from the lower end portion toward the upper end portion in the portion penetrating the resin layer 33.

When the through hole 34 is formed so as to penetrate from the resin layer 33 to a part in the thickness direction of the green sheet laminate 32, the convex terminal 3 and the through conductor 4 are integrally formed as described above. The electronic component mounting substrate 9 can be manufactured.

  Next, the metal paste 35 is filled into the through-hole 34 formed in the above form. As the metal material for forming the metal paste 35, the metal material used for the convex terminal 3 and the through conductor 4 described above can be used. In the case of using tungsten as the metal material, the metal paste 35 is prepared by kneading tungsten powder together with an organic solvent and an organic binder and adjusting the viscosity to a predetermined viscosity. The filling of the metal paste 35 into the through hole 34 is performed by, for example, a screen printing method.

  In the case where the through hole 34 is formed also in the green sheet laminate 32 and the metal paste 35 is laminated in the through hole 34, before the organic resin layer 33 is laminated, the through hole 34 in the laminate 32 is formed. Formation and filling of the metal paste 35 may be performed.

  Thereafter, the green sheet laminate 32, the organic resin layer 33, and the metal paste 35 are simultaneously heated to fire the green sheet laminate 32 and the metal paste 35, and the organic resin layer 35 is removed. As a result, an electronic component mounting board 9a as shown in FIG. 5C can be manufactured.

  At this time, if the through-hole 34 penetrates from the organic resin layer 33 to a part in the thickness direction of the green sheet laminate 32 as described above, the portion of the metal paste 35 that becomes the convex terminal 3 and the through-hole 34 penetrate. The portion that becomes the conductor 4 is simultaneously fired to form the integrally formed convex terminal 3 and the through conductor 4.

  According to such a method for manufacturing the electronic component connecting substrate 9a, since the above steps are included, the surface of the ceramic green sheet 31 that is the upper surface of the insulating substrate 1 (particularly, the surface that is the upper surface of the insulating substrate 1). ) To form the convex terminal 3 without printing a metal paste. Further, the metal paste 35 to be the convex terminals 3 is separated by the organic resin layer 33 between the adjacent convex terminals 3. Therefore, it is possible to manufacture the electronic component mounting board 9a while suppressing a part of the convex terminals 3 from spreading on the upper surface of the insulating substrate 1.

  Further, since the organic resin layer 33 can be easily removed, the productivity of the electronic component mounting substrates 9 and 9a having the above-described configuration is high.

  Further, in the manufactured electronic component mounting board 9a, the spread of the conductive connecting material 5 connected to the convex terminals 3 is also effectively suppressed as in the electronic component mounting board 9 of the above embodiment. Therefore, it is possible to provide a method for manufacturing the electronic component mounting board 9a in which the adjacent interval between the convex terminals 3 to which the electrodes 11 of the electronic component 10 are connected can be easily reduced.

  In addition, when forming the other conductor 6 in the inside of the insulated substrate 1, a lower surface, etc., the main surface of the ceramic green sheet 31 used as the insulated substrate 1 or the through-hole (not shown) formed previously. What is necessary is just to apply | coat or fill the metal paste similar to the metal paste 35 used as the said convex terminal 3 inside. If the ceramic green sheet 31 printed or filled with the metal paste to be the other conductor 6 is laminated and then fired, for example, for mounting an electronic component having the other conductor 6 on the inside and the lower surface as shown in FIG. Substrates 9 and 9a can be manufactured.

DESCRIPTION OF SYMBOLS 1 ... Insulating substrate 2 ... Mounting part 3 ... Convex terminal 4 ... Penetration conductor 5 ... Conductive connection material 6 ... Other conductor 7 ...・ Plating layer 9, 9a ・ Electronic component mounting board
10 ... Electronic components
11 ... Electrodes
20 ... Electronic devices
31 ... Ceramic green sheet
32 ... Green sheet laminate
33 ... Organic resin layer
34 ... Through hole
35 ... Metal paste

Claims (4)

An insulating substrate having an upper surface including an electronic component mounting portion;
A convex terminal provided to protrude from the upper surface of the insulating substrate in the mounting portion;
An electronic component mounting board, wherein a side surface of the convex terminal is inclined outward from a lower end portion toward an upper end portion. Further comprising a through conductor penetrating at least part of the thickness direction of the insulating substrate from the upper surface of the insulating substrate toward the inside;
2. The electronic component mounting board according to claim 1, wherein the through conductor and the convex terminal are integrally formed. The electronic component mounting substrate according to claim 1 or 2,
And having an electrode and an electronic component mounted on the mounting portion,
The electronic device, wherein the electrode of the electronic component is connected to an upper surface of the convex terminal for connecting the electronic component via a conductive connecting material. Preparing a plurality of ceramic green sheets and laminating the plurality of ceramic green sheets to produce a green sheet laminate;
Laminating an organic resin layer on the upper surface of the green sheet laminate;
Forming a through hole penetrating at least the resin layer in the thickness direction;
Filling the through-hole with a metal paste;
Heating the green sheet laminate, the organic resin layer and the metal paste at the same time, firing the green sheet laminate and the metal paste, and removing the organic resin layer,
In the step of forming the through hole, an inner surface of a portion of the through hole that penetrates the resin layer is inclined outward from the lower end portion toward the upper end portion. .

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