JP2013004866A - Component built-in substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component built-in substrate in which arrangement density of internal components can be further improved.SOLUTION: A component built-in substrate includes: a tabular insulation layer having a first surface and a second surface facing the first surface; a component having a rod-like shape and a structure in which at least both end surfaces of the rod-like shape are respectively electrode surfaces, and arranged inside the tabular insulation layer in the thickness direction so that one end surface of both end surfaces faces the first surface and the other end surface of both end surfaces faces the second surface; a first wiring pattern provided on the first surface of the tabular insulation layer; a first connection member electrically connecting the first wiring pattern and the electrode surface on one end surface side of the component; a second wiring pattern provided on the second surface of the tabular insulation layer; and a second connection member electrically connecting the second wiring pattern and the electrode surface of the other end surface side of the component by penetrating a part of the tabular insulation layer in the thickness direction.

Description

  The present invention relates to a component-embedded substrate in which components are positioned inside a plate thickness, and more particularly to a component-embedded substrate suitable for incorporating a high-density component.

  As one of the basic technologies that advance the miniaturization, high performance, and multi-functionality of portable electronic devices, component-embedded substrates that improve the component density by placing passive element components inside the plate thickness are used. . For example, a surface-mounted passive element component distributed as a single component can be used as the component positioned inside. When such a component is used, it is easy to mount the wiring pattern on the wiring pattern serving as the inner wiring layer, for example, with solder, which is advantageous in terms of productivity and efficiency.

  In such a substrate structure, the internal components are usually embedded in a posture parallel to the spreading direction of the plate, that is, in a posture where both electrode terminals can be connected to a common wiring layer. This is inevitable as a result of the application of surface mounting to the component by solder reflow on the wiring pattern that becomes the inner wiring layer after manufacturing. However, it can be considered that such a component posture is not necessarily in an efficiently arranged state when viewed from the direction of looking down at the board. This is because the posture is large when viewed from the direction of overlooking the substrate.

  A known example of the component-embedded substrate in which the passive element component having such a posture is positioned inside the plate thickness is disclosed in JP-A-2003-197849.

JP 2003-197849 A

  The present invention has been made in consideration of the above circumstances, and provides a component-embedded substrate that can further improve the arrangement density of the components in the component-embedded substrate in which the components are positioned inside the plate thickness. With the goal.

  In order to solve the above problems, a component-embedded substrate that is one embodiment of the present invention has a plate-like insulating layer having a first surface and a second surface opposite to the first surface, and a rod-like shape. And having a structure in which at least both end surfaces of the rod-like shape are electrode surfaces, one end surface of the both end surfaces is opposed to the first surface and the other end surface of the both end surfaces And a first wiring pattern provided on the first surface of the plate-like insulating layer, and a component disposed inside the plate-like insulating layer in the thickness direction so as to face the second surface A first connecting member that electrically connects the first wiring pattern and the electrode surface on the one end surface side of the component, and the second insulating layer on the second surface. The second wiring pattern and a part of the plate-like insulating layer in the thickness direction through the second wiring pattern and the front Characterized by comprising a second connecting member for electrically connecting the electrode surface side of the other end surface of the component.

  In this substrate, the component is provided inside the plate-like insulating layer having the first and second surfaces in the thickness direction. The part has a bar shape (for example, a square bar or a round bar), and at least both end faces of the bar shape are electrode surfaces.

  With respect to the plate-like insulating layer, the component is arranged in the thickness direction of the plate-like insulating layer so that one end face of both end faces faces the first face and the other end face faces the second face. Arranged inside. And the electrode surface of the one end surface side of components is electrically connected to the 1st wiring pattern provided on the 1st surface of the plate-shaped insulating layer by the 1st connection member. In addition, the electrode surface on the other end surface side of the component is electrically connected to the second wiring pattern provided on the second surface of the plate-like insulating layer by the second connecting member.

  That is, in this substrate, the components located inside are in a rod-like standing posture in alignment with the thickness direction of the plate-like insulating layer, and the electrode surfaces at each end in that posture are plate-like. The first and second wiring patterns provided on each surface of the insulating layer are electrically connected to each other through first and second connecting members. As a result, the component is in a state where the connection with each wiring pattern is electrically secured while the area is in the minimum posture as viewed from the direction of looking down the board. Therefore, according to this component built-in substrate, the arrangement density of components provided inside the substrate can be further improved.

  According to the present invention, in the component-embedded substrate in which the components are positioned inside the plate thickness, the arrangement density of the components inside can be further improved.

1 is a cross-sectional view schematically showing a configuration of a component built-in substrate that is an embodiment of the present invention. FIG. 2 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 1. Process drawing which shows the modification of the process shown in FIG. 2 typically. FIG. 4 is a supplementary plan view in the manufacturing process shown in FIGS. 2 and 3. FIG. 6 is a process diagram schematically showing another part of the manufacturing process of the component built-in substrate shown in FIG. 1. FIG. 6 is a continuation diagram of FIG. 5, and a process diagram schematically showing another part of the manufacturing process of the component-embedded substrate shown in FIG. 1. FIG. 9 is a process diagram schematically showing still another part of the manufacturing process of the component built-in substrate shown in FIG. 1. Sectional drawing which shows typically the structure of the component built-in board | substrate which is another embodiment. FIG. 9 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 8. Sectional drawing which shows typically the structure of the component built-in board | substrate which is another embodiment. Process drawing which shows typically a part of manufacturing process of the component built-in board | substrate shown in FIG. FIG. 11 is a process diagram schematically showing another part of the manufacturing process of the component built-in substrate shown in FIG. 10. Sectional drawing which shows typically the structure of the component built-in board | substrate which is another (4th) embodiment. FIG. 14 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 13. FIG. 14 is a process diagram schematically showing another part of the manufacturing process of the component built-in substrate shown in FIG. 13. Furthermore, sectional drawing which shows typically the structure of the component built-in board | substrate which is another (5th) embodiment. FIG. 17 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 16. Sectional drawing which shows typically the structure of the component built-in board which is another (6th) embodiment. Process drawing which shows typically a part of manufacturing process of the component built-in board | substrate shown in FIG. FIG. 19 is a process diagram schematically showing another part of the manufacturing process of the component built-in substrate shown in FIG. 18. Sectional drawing which shows typically the structure of the component built-in board which is another (7th) embodiment. FIG. 22 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 21. Sectional drawing which shows typically the structure of the component built-in board which is another (8th) embodiment. FIG. 24 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 23. Sectional drawing which shows typically the structure of the component built-in board | substrate which is another (9th) embodiment.

  As an embodiment of the present invention, the first connecting member may be a solder containing tin. If solder is used as the first connecting member, applying surface mounting technology in the course of manufacturing provides a great advantage in terms of productivity and efficiency when mounting components. Solder containing tin is common as solder.

  As an embodiment, the second connection member may have a shape having an axis that matches the thickness direction of the plate-like insulating layer. Such a shape is inevitably obtained as a connecting member provided through a part in the thickness direction of the plate-like insulating layer, depending on several manufacturing processes considered in consideration of efficiency. is there.

  As an embodiment, the second connecting member can be a member made of a conductive composition. As the second connection member, a member made of a conductive composition can be considered as the candidate. That is, the conductive composition is a powerful and suitable member that can be used as a member that penetrates a part of the plate-like insulating layer in the thickness direction.

  Further, as an embodiment, the member as the second connecting member may have a shape in which the diameter becomes narrower as it approaches the component in the axial direction. The second connecting member, which is a member made of a conductive composition, has such a shape. For example, a paste-like conductive composition is placed on a metal foil before being processed into a second wiring pattern. It is derived from the fact that it is formed in a substantially conical shape and is plastically deformed to crush this head. That is, the shape depends on one manufacturing process that can be considered in consideration of efficiency.

  As an embodiment, the member as the second connecting member may have a shape whose diameter does not change in the direction of the axis. The reason why the second connecting member, which is a member made of a conductive composition, has such a shape is that, for example, a through-hole is formed in advance in a layer that becomes a part of the plate-like insulating layer, and the conductive composition is formed in the inside. It comes from filling things. That is, the shape depends on another manufacturing process that can be considered in consideration of efficiency.

  As an embodiment, the second connecting member is electrically connected to the second wiring pattern so as to be electrically connected from the second wiring pattern to the electrode surface on the other end face side of the component. It can be said that it is a plating via in a via hole extended in. Such via-plated vias can be considered as candidates for the second connecting member. That is, the via-hole plated via is a powerful and appropriate member that can be used as a member that penetrates a part of the plate-like insulating layer in the thickness direction.

  Further, as an embodiment, the third wiring pattern provided in the middle of the thickness of the plate-like insulating layer, and provided between the surface of the second wiring pattern and the surface of the third wiring pattern. An interlayer connection that electrically connects the second wiring pattern and the third wiring pattern, wherein the interlayer connection is made of the same material as that of the second connection member. And having an axis that coincides with the thickness direction of the plate-like insulating layer and having a diameter that becomes narrower as it approaches the third wiring pattern in the direction of the axis. .

  In this embodiment, a third wiring pattern is used to form a multilayer wiring, and the interlayer connection body related thereto is made of a conductive composition of the same material as the second connection member, and the shape thereof is the same as that of the second connection member. It is comprised so that it may become. According to this, multilayer wiring can be realized, and in addition, the formation of the interlayer connection body and the formation of the second connection member can be performed in the same process, so that efficient manufacturing can be performed.

  Further, as an embodiment, the third wiring pattern provided in the middle of the thickness of the plate-like insulating layer, and provided between the surface of the second wiring pattern and the surface of the third wiring pattern. An interlayer connection that electrically connects the second wiring pattern and the third wiring pattern, wherein the interlayer connection is made of the same material as that of the second connection member. It can be made into a shape which has an axis that coincides with the thickness direction of the plate-like insulating layer and does not change its diameter in the direction of the axis.

  Also in this aspect, the third wiring pattern is used to form a multilayer wiring, and the interlayer connection body related thereto is made of the same material as that of the second connection member, and the shape thereof is the same as that of the second connection member. It is comprised so that it may become. According to this, multilayer wiring can be realized, and in addition, the formation of the interlayer connection body and the formation of the second connection member can be performed in the same process, so that efficient manufacturing can be performed.

  Further, as an embodiment, a third wiring pattern provided in the middle of the thickness of the plate-like insulating layer, an interlayer connection body that electrically connects the second wiring pattern and the third wiring pattern, The interlayer connection body is extended so as to be electrically connected to the second wiring pattern and from the second wiring pattern to the surface of the third wiring pattern. It can be said that it is a via-hole plated via made of the same material as the second connecting member.

  In this aspect, multilayer wiring is achieved by the third wiring pattern, and the interlayer connection body related thereto is the same via-hole plated via as that of the second connection member. According to this, multilayer wiring can be realized, and in addition, the formation of the interlayer connection body and the formation of the second connection member can be performed in the same process, so that efficient manufacturing can be performed.

  Further, as an embodiment, the surface of the first wiring pattern so as to pass through a third wiring pattern provided in the middle of the thickness of the plate-like insulating layer and a part in the thickness direction of the plate-like insulating layer. And an interlayer connector that is provided between the first wiring pattern and the third wiring pattern, and electrically connects the first wiring pattern and the third wiring pattern. The conductive member has an axis that coincides with the thickness direction of the plate-like insulating layer, and the diameter of the conductive composition decreases as it approaches the electrode surface on the one end face side of the component in the axis direction. The interlayer connection body is made of a conductive composition of the same material as the first connection member, and has an axis that coincides with the thickness direction of the plate-like insulating layer; A shape in which the diameter becomes narrower as it approaches the third wiring pattern in the direction of the axis In it, it can be a.

  The side where the first connecting member is provided as viewed from the part can be considered in the same manner as the side where the second connecting member is provided. That is, in this aspect, the third wiring pattern is formed into a multilayer wiring, and the interlayer connection body related thereto is made of a conductive composition of the same material as the first connection member, and the shape thereof is also the same as that of the first connection member. The configuration is the same. According to this, multilayer wiring can be realized, and in addition, the formation of the interlayer connection body and the formation of the first connection member can be performed in the same process, so that efficient manufacturing can be performed.

  Further, as an embodiment, a third wiring pattern provided in the middle of the thickness of the plate-like insulating layer, a part of the plate-like insulating layer in the thickness direction, and the first wiring pattern and the above-mentioned An interlayer connection body that electrically connects the third wiring pattern, and the first connection member is electrically connected to the first wiring pattern from the first wiring pattern. A via-hole plated via extending to be electrically connected to the electrode surface on the one end face side of the component, wherein the interlayer connection is electrically connected to the first wiring pattern and the first wiring; It can be said that it is a via-hole plated via extended from the pattern so as to be electrically connected to the third wiring pattern.

  The side where the first connecting member is provided as viewed from the part can be considered in the same manner as the side where the second connecting member is provided. That is, according to this, multilayer wiring can be realized, and in addition, the formation of the interlayer connection body and the formation of the first connection member can be performed in the same process, so that efficient manufacture can be achieved.

  Further, as an embodiment, the first wiring pattern is an outermost wiring having no multilayer wiring structure on a surface opposite to a surface of the first wiring pattern that is in contact with the plate-like insulating layer. It can be a layer pattern. With such a structure, the thickness of the plate-like insulating layer related to component incorporation is made thinner. That is, a thinner component-embedded substrate can be obtained.

  Further, as an embodiment, the second wiring pattern is an outermost wiring having no multilayer wiring structure on a surface opposite to a surface of the second wiring pattern that is in contact with the plate-like insulating layer. It can be a layer pattern. With such a structure, the thickness of the plate-like insulating layer related to component incorporation is made thinner. That is, a thinner component-embedded substrate can be obtained.

  Based on the above, embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view schematically showing a configuration of a component built-in substrate according to an embodiment. As shown in FIG. 1, this component-embedded substrate is composed of insulating layers (plate-like insulating layers) 11, 12, 13, wiring layers (wiring patterns) 21, 22, 23, 24 (= total of 4 layers) Wiring), interlayer connector 31, 33, through-hole conductor 32, connecting member 33a, surface-mounted passive element component 41, solder (connecting member) 51, and solder resists 61, 62. Reference numeral 41a denotes each terminal electrode of the component 41.

  This component-embedded substrate is provided with a surface-mount type passive element component 41 inside the thickness of the plate-like insulating layers 11, 12, and 13. The structural feature is the posture of the component 41 with respect to the plate-like insulating layers 11, 12, and 13. That is, in this substrate, the component 41 positioned inside is in an upright posture that coincides with the thickness direction of the plate-like insulating layers 11, 12, and 13, and the electrode surface (longitudinal length) of each terminal electrode 41 a in that posture. The end surface of the component 41 as viewed in the direction) is electrically connected via the wiring patterns 21 and 24 provided on each surface of the plate composed of the plate-like insulating layers 11, 12 and 13, and the connection members 51 and 33 a, respectively. It is a structure that is connected.

  As a result, the component 41 is electrically connected to the wiring patterns 21 and 24 while being in a posture in which the area is minimum when viewed from the direction of overlooking the board. Therefore, according to this component built-in substrate, it is possible to further improve the planar arrangement density of the components 41 provided inside the substrate.

  Hereinafter, the configuration of the component-embedded substrate will be described more specifically.

  The component 41 is a surface-mounted passive element component (so-called chip resistor, chip capacitor, or the like), and has a rectangular parallelepiped shape (a bar shape with a square cross section when viewed in the longitudinal direction). When using a chip resistor or chip capacitor, the planar size in a normal surface mounting posture is, for example, 0.6 mm × 0.3 mm (0603 type), 0.4 mm × 0.2 mm (0402 type), etc. Small size can be adopted. The height dimension in a normal surface mounting posture is often equal to the width dimension, and therefore, the end face when viewed in a rod shape is substantially square.

  The component 41 includes an end face on one side in the longitudinal direction of the rectangular parallelepiped and a part of each face connected to the end face as one terminal electrode 41a, an end face on the other side in the longitudinal direction of the rectangular parallelepiped, and the end face A part of each surface connected to is the other terminal electrode 41a. The component 41 may have other rod-like shapes such as a round bar in addition to such a square rod-like shape.

  The terminal electrode 41a of the commercially available component 41 is usually tin-plated on the surface in many cases. However, in order to be connectable with the solder 51, copper plating is formed instead. Things can be used. In this embodiment, as another consideration, the terminal electrode 41a having a copper plating layer is preferable for compatibility with the material of the connection member 33a (= conductive composition described later).

  One end surface (also an electrode surface) of the component 41 is opposed to the embedded component mounting land included in the wiring layer 21. The terminal 41a on the end face of the component 41 and this land are electrically and mechanically connected by a solder 51 containing at least tin. The solder 51 is located on this land of the wiring layer 21 in a shape including a fillet formed around the terminal electrode 41 a so as to extend on each surface connected to the end surface of the component 41. An example of a setting method for such a land for the embedded component 41 of the wiring layer 21 will be supplementarily described later along with the manufacturing process (FIG. 4).

  Further, the other end surface (also an electrode surface) of the component 41 is in contact with the connection member 33 a, and the connection member 33 a is a member sandwiched between the end surface and the wiring pattern 24. The connection member 33a is common to the interlayer connection body 33 in terms of its material (composition) and formation method. These points will be described again in the description of the manufacturing method (FIG. 7). As described above, the terminal electrode 41a in relation to the connection member 33a has a copper plating layer in view of compatibility with an electrical connection with a material (= conductive composition described later) used as the connection member 33a. preferable.

  The wiring layers 21 and 24 are wiring layers on both main surfaces as a substrate, and various components can be mounted thereon. Solder resists 61 and 62 are formed on both main surfaces except for the land portions of the wiring layers 21 and 24 on which the solder is to be mounted in the mounting, so that the solder melted at the time of solder connection is fixed to the land portions and then functions as a protective layer. (The thickness is about 20 μm, for example). A Ni / Au plating layer (not shown) having high corrosion resistance may be formed on the surface layer of the land portion.

  Each of the wiring layers 22 and 23 is an inner wiring layer. In order, the insulating layer 11 is between the wiring layer 21 and the wiring layer 22, and the insulating layer 12 is between the wiring layer 22 and the wiring layer 23. The insulating layer 13 is located between the wiring layer 24 and the wiring layer 24 and separates the wiring layers 21 to 24. Each of the wiring layers 21 to 24 is made of, for example, a metal (copper) foil having a thickness of 18 μm.

  Each insulating layer 11-13 is, for example, 60 μm thick except for the insulating layer 12, and only the insulating layer 12 has a thickness of, for example, 400 μm to 700 μm (depending on the longitudinal dimension of the embedded component 41). It is a material. In particular, the insulating layer 12 has an opening at a position corresponding to the embedded component 41 and provides a space for embedding the component 41. Insulating layers 11 and 13 fill the space inside the through-hole conductor 32 of the insulating layer 12 and the opening of the insulating layer 12 so as to be in close contact with the surface of the component 41, and enter the space to form a space inside. Does not exist.

  The wiring layer 21 and the wiring layer 22 can be conducted by an interlayer connector 31 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 11. The wiring layer 22 and the wiring layer 23 can be conducted by a through-hole conductor 32 provided so as to penetrate the insulating layer 12. The wiring layer 23 and the wiring layer 24 can be conducted by an interlayer connector 33 that is sandwiched between the surfaces of the patterns and penetrates the insulating layer 13.

  Each of the interlayer connectors 31 and 33 is derived from a conductive bump formed by screen printing of a conductive composition, and depends on its manufacturing process in the axial direction (upper and lower laminations in the illustration of FIG. 1). Direction). The diameter is, for example, 100 μm on the thick side. As already described, the interlayer connector 33 and the connecting member 33a are common in terms of materials (composition) and methods for forming them.

  In this embodiment, the wiring patterns 21 and 24 to which the component 41 is electrically connected are formed on the outermost wiring layer having no multilayer wiring structure on the surface facing the surface in contact with the insulating layers 11 and 13, respectively. In this respect, the increase in the number of wiring layers is limited, but it is also advantageous in that a thin component-embedded substrate can be provided by minimizing the thickness of the plate-like insulating layer involved in component incorporation.

  Also, solder is used as the connecting member 51, which is advantageous in terms of productivity and efficiency when mounting the component 41 during the manufacturing process. In particular, since the solder 51 is positioned so as to extend over each surface connected to the end surface of the component 41 and a well-shaped solder fillet is formed, the mounting stability and reliability can be further improved.

  Next, a manufacturing process of the component built-in substrate shown in FIG. 1 will be described with reference to FIGS. 2, 5, 6, and 7 are process diagrams each schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 1. FIG. 3 is a modification of the process shown in FIG. FIG. 4 is a supplementary plan view in the manufacturing process shown in FIGS. In these figures, the same or equivalent components as those shown in FIG.

  It demonstrates from FIG. FIG. 2 shows a manufacturing process of a part centered on the wiring layer 21 and the component 41 in each configuration shown in FIG. First, as shown in FIG. 2A, a cream solder 51A is printed on a region corresponding to a land for the component 41 of a metal foil (electrolytic copper foil) 21A to be the wiring layer 21, for example, by screen printing. . The cream solder 51A is obtained by dispersing fine solder particles in a flux and can be easily printed in a predetermined pattern by using screen printing. A dispenser can be used instead of screen printing.

  After the cream solder 51A is printed, the component 41 in a standing posture is placed on the metal foil 21A via the cream solder 51A, for example, with a mounter, and then the cream solder 51A is reflowed in, for example, a reflow furnace. Thereby, as shown in FIG. 2B, the component 41 is connected and fixed on the metal foil 21 </ b> A in a standing state via the solder 51. The member obtained as described above is referred to as a laminated member 1.

  In addition, to supplement the illustration of FIG. 2B, in this state, the component 41 is only fixed on the metal foil 21A, and no land in the normal sense yet exists in the metal foil 21A. . That is, when the cream solder 51A is reflowed on the metal foil 51A, it is difficult to control the spread of melting, and when the land is formed by patterning of the metal foil 21A, the solder that remains in the land area is formed. Hateful. The improvement of this point will be described later with reference to FIG.

  A modification of the process shown in FIG. 2 will be described with reference to FIG. In the description of FIG. 2, it is assumed that the component 41 can be placed on the metal foil 21 </ b> A via the cream solder 51 </ b> A, for example, with a mounter. It is not assumed that 41 is mounted on the mounting surface. That is, the component 41 is normally supplied in a laid posture, and the upper surface of the component 41 in the laid posture is adsorbed by the mounter head. Therefore, in order to cope with the component 41 in the standing posture being sucked by the mounter, it is necessary to make a special order for the posture at the time of supplying the component.

  However, as shown in FIG. 3, the component 41 in the standing posture can be fixed on the metal foil 21 </ b> A through the solder 51 as a result without placing the component 41 in the standing posture on the metal foil 21 </ b> A. is there.

  First, as shown in FIG. 3A, cream solder 51A is printed on a region corresponding to a land for the component 41 of the metal foil 21A to be the wiring layer 21, for example, by screen printing. After the printing of the cream solder 51A, as shown in FIG. 3B, the component 41 in the laying posture (that is, the posture at the time of normal surface mounting) is mounted on the metal foil 21A with the mounter through the cream solder 51A. To do. At this time, one terminal electrode 41a of the component 41 is placed so as to be positioned on the printed cream solder 51A.

  Subsequently, the cream solder 51A is reflowed in a reflow furnace, for example. As a result of this reflow, the component 41 is erected by itself as shown in FIG. This is because the wettability is exhibited between the solder 51 and the terminal electrode 41a in a state where the solder 51 is melted, and the melted solder 51 has a surface tension to reduce its surface area. Is due to As described above, the component 41 is connected and fixed on the metal foil 21 </ b> A in a standing state via the solder 51.

  Next, with reference to FIG. 4, an example of a method for controlling the wetting and spreading on the metal foil 21A generated by reflowing the cream solder 51A will be described.

  First, as shown in FIG. 4A, a nickel gold plating layer 56 is formed in advance in a region corresponding to a land for the component 41 on the metal foil 21A. More specifically, the nickel plating layer is selectively formed on the metal foil 21A in a thickness of, for example, about 5 μm, and then a gold plating layer is formed on the nickel plating layer with a thickness of, for example, 0.05 μm.

  If such a nickel gold plating layer 56 is provided in advance, when the solder fine particles contained therein are melted by reflow of the cream solder 51A, the molten solder is only on the gold plating layer having relatively high wettability compared to copper. By spreading, the shape of the solder 51 can be controlled. Note that the gold component is taken into the solder 51 and disappears by reflow.

  Alternatively, as shown in FIG. 4B, there is a countermeasure in which a damming resin pattern 57 is formed in advance instead of using the nickel gold plating layer 56. As shown in FIG. 4B, the damming resin pattern 57 is, for example, a frame so as to limit the spread of the solder 51 that should be positioned in the region corresponding to the land with respect to the component 41 on the metal foil 21A. It is formed in a shape. The damming resin pattern 57 can be provided by, for example, the same material as the solder resist and the same patterning formation method. The thickness can be about 20 μm, for example.

  Next, a description will be given with reference to FIGS. FIG. 5 shows a manufacturing process (up to the middle) of a part centering on the insulating layer 12 and 11 among the components shown in FIG. FIG. 6 is a continuation of FIG. First, as shown in FIG. 5A, the thickness of, for example, 400 μm to 700 μm (depending on the longitudinal dimension of the component 41 to be embedded) in which metal foils (electrolytic copper foils) 22A and 23A having a thickness of 18 μm are laminated on both surfaces, for example. An insulating layer 12 of FR-4 is prepared, a through hole 72 for forming a through-hole conductor is formed at a predetermined position, and a part opening 71 is formed in a part corresponding to the part 41 to be embedded.

  Next, electroless plating and electrolytic plating are performed to form the through-hole conductor 32 on the inner wall of the through hole 72 as shown in FIG. At this time, a conductor is also formed on the inner wall of the opening 71. Subsequently, as shown in FIG. 5C, the metal foils 22A and 23A are patterned in a predetermined manner using well-known photolithography to form wiring layers 22 and 23. By patterning the wiring layers 22 and 23, the conductor formed on the inner wall of the opening 71 is also removed.

  Next, as shown in FIG. 6A, conductive bumps (cone shape having a bottom diameter of, for example, 100 μm and a height of, for example, 100 μm) are formed as paste-like conductivity at predetermined positions on the wiring layer 22. It is formed by screen printing of a composition (for example, a silver paste in which silver particles are dispersed in a large amount in a paste-like resin). After printing, it is dried and cured to some extent.

  Subsequently, as shown in FIG. 6B, the FR-4 prepreg 11A (nominal thickness, for example, 60 μm) to be the insulating layer 11 is laminated on the wiring layer 22 side using a press machine. In the prepreg 11A, an opening corresponding to the part 41 to be embedded, which is the same as the insulating layer 12, is provided in advance.

  In this lamination process, the head of the interlayer connector 31 is made to penetrate the prepreg 11A. Note that the broken line at the head of the interlayer connector 31 in FIG. 6B indicates that there are both cases where the head is plastically deformed at this stage and where it is not plastically deformed (the following figures). But it is the same). By this step, the wiring layer 22 is depressed and positioned on the prepreg 11A side. Let the laminated member obtained by the above be the laminated member 2. FIG.

  The steps shown in FIGS. 5 and 6 can be performed as follows. In the stage of FIG. 5A, only the through holes 72 are formed, and the subsequent steps of FIG. 5B, FIG. 5C, and FIG. Next, as a process corresponding to FIG. 6B, prepreg 11A (without opening) is stacked. And it is the procedure of forming simultaneously the opening part for the components embedded in the insulating layer 12 and the prepreg 11A.

  Next, a description will be given with reference to FIG. FIG. 7 is a diagram showing an arrangement relationship in which the laminated members 1 and 2 obtained as described above are laminated. The laminated member 3 in the figure has an interlayer connector 33 (bottom diameter of, for example, 100 μm, height of, for example, 100 μm) on the metal foil (electrolytic copper foil) 24A to be the wiring layer 24 by the same material and method as the interlayer connector 31. A conical shape) and a connecting member 33a (conical shape having a bottom surface diameter of 100 μm and a height of 100 μm, for example), and the prepreg 13A to be the insulating layer 13 is formed using a press in the same material and method as the prepreg 11A. It is a member obtained by stacking.

  The interlayer connector 33 and the connecting member 33a in the laminated member 3 do not necessarily have the same size (bottom diameter and height). In order to make these different sizes, for example, through-holes (pits) for supplying a paste-like conductive composition of a screen plate (metal mask) used when forming by screen printing to adhere to the metal foil 24 (pits) It is easy if the diameters of) are different. The height of the interlayer connector 33 is set so as to penetrate the prepreg 13A and make contact with the wiring pattern 23 with a good area. On the other hand, the height of the connecting member 33a is set so as to allow good contact with the terminal electrode 41a (upper surface in the drawing) of the component 41 through the prepreg 13A.

  The respective laminated members 1, 2, and 3 are laminated in the arrangement as shown in FIG. 7, and are pressed and heated by a press. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated.

  The interlayer connector 33 is electrically connected to the wiring layer 23, the connection member 33a is electrically connected to the terminal electrode 41a (the upper surface in the figure) of the component 41, and the interlayer connector 31 is It is electrically connected to the metal foil 21A. As a result, each of the interlayer connector 33, the connecting member 33a, and the interlayer connector 31 has a shape in which the head is crushed by plastic deformation (that is, the shaft has a shaft as shown in FIG. It is fixed in a thinner shape.

  After the laminating step shown in FIG. 7, the upper and lower metal foils 21A and 24A are patterned in a predetermined manner by using well-known photolithography, and subsequently, a layer of solder resists 61 and 62 is formed, as shown in FIG. Such a component-embedded substrate can be obtained.

  Next, an embodiment different from the above-described embodiment will be described with reference to FIG. FIG. 8 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to another embodiment. Components that are the same as or equivalent to those shown in the already described drawings are denoted by the same reference numerals. is there. The description of the part is omitted unless there is an additional matter.

  This embodiment is provided with interlayer connectors 31L and 33L having shapes different from those shown in FIG. 1 in place of the interlayer connectors 31 and 33, and in addition to the connection member 33a, This is provided with a connecting member 33La having a different shape. Each of the interlayer connectors 31L and 33L and the connection member 33La has a cylindrical shape (that is, a shape that has an axis and does not change its diameter in the direction of the axis). Derived from the forming method.

  FIG. 9 is a process diagram schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 8, and shows a process corresponding to the stacking stage shown in FIG. 7 in the above embodiment. . In FIG. 9, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  As shown in FIG. 9, in this laminating step, the metal foil 24A and the prepreg 13A are made into different laminated members, and the prepreg 11A is also made into a laminated member different from the insulating layer 12 side and laminated. However, in the prepreg 11A, the interlayer connector 31L is formed before this time, and in the prepreg 13A, the interlayer connector 33L and the connecting member 33La are formed before this time.

  The interlayer connection body 33L and the connection member 33La are formed with a through hole, for example, with a drill at a predetermined position of the prepreg 13A (the position for the connection member 33La overlaps with the terminal electrode 41a of the component 41), and paste is formed in the through hole. A conductive composition (for example, the same one used in the interlayer connectors 31 and 33 shown in FIG. 1) is filled and dried. For the interlayer connector 31L, the steps of forming a through hole, filling the conductive composition, and drying the prepreg 11A are the same. The prepreg 11A is provided with an opening 76 corresponding to the part 41 to be embedded, similar to the insulating layer 12, for example, after the formation of the interlayer connector 31L.

  Each laminated member is arranged in a layout as shown in FIG. 9 and is pressed and heated by a press. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated.

  The interlayer connector 33L is electrically connected to the wiring layer 23 and the metal foil 24A, and the connection member 33La is electrically connected to the terminal electrode 41a (upper surface in the drawing) of the component 41 and the metal foil 24A. Further, the interlayer connector 31L is electrically connected to the metal foil 21A and the wiring layer 22. In consideration of the compatibility of the electrical connection between the materials in contact between the connection member 33La and the terminal electrode 41a, the terminal electrode 41a preferably has a copper plating layer.

  After the laminating process shown in FIG. 9, the upper and lower metal foils 21A and 24A are patterned in a predetermined manner by using well-known photolithography, and subsequently, layers of solder resists 61 and 62 are formed, as shown in FIG. Such a component-embedded substrate can be obtained. This component-embedded substrate can still further improve the planar arrangement density of the components 41 provided inside the substrate.

  Next, still another embodiment will be described with reference to FIG. FIG. 10 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to another embodiment. Components that are the same as or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  In this embodiment, changes are made to the interlayer connector 33 and the connecting member 33a in the embodiment shown in FIG. That is, as compared with the one shown in FIG. 1, an interlayer connector 33M, which is a via-hole plated via, which is made of a different material from that of the interlayer connector 33, is provided, and instead of the connecting member 33a, Is provided with a connecting member 33Ma which is a via-hole plated via of different materials.

  The via-hole plating via 33 </ b> M extends so as to be electrically connected to the wiring pattern 24 and from the wiring pattern 24 to the wiring pattern 23. The via hole plating via 33Ma is electrically connected to the wiring pattern 24 and extends from the wiring pattern 24 to the terminal electrode 41a (upper surface in the drawing) of the component 41. Each of the interlayer connection body 33M and the connection member 33Ma has, for example, a truncated cone shape (that is, a shape having an axis and a diameter changing in the direction of the axis as shown in the figure). This shape will be described next. As such, it is derived from their formation method.

  FIGS. 11 and 12 are process diagrams schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 10, each of which corresponds to the stacking process shown in FIG. 7 (FIG. 11). And a part of the process (FIG. 12) performed after the lamination. 11 and 12, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  In the lamination process shown in FIG. 11, the laminated member 3A is used instead of the laminated member 3 (see FIG. 7). The laminated member 3A is a member without the formation of the interlayer connector 33 and the connection member 33a. Each laminated member 1, 2, 3A is laminated and arranged in the arrangement as shown in FIG. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated. This is the same as the description in FIG.

  After this lamination, the process shown in FIG. 12 is performed. That is, via holes 33h and 33ha for forming via-hole plated vias 33M and 33Ma are processed and formed on the material obtained in the stacking process shown in FIG.

  More specifically, as shown in FIG. 12, via holes 33h and 33ha are formed at necessary positions from the exposed surface side of the metal foil 24A, for example, by laser processing. The via hole 33h is provided at a position where an interlayer connection between the metal foil 24A serving as the wiring layer 24 and the wiring layer 23 is necessary so as to communicate with and penetrate the metal foil 24A and the insulating layer 13. The via hole 33ha is provided corresponding to the position of the terminal electrode 41a of the component 41 so as to reach the terminal electrode 41a (upper surface in the drawing) through the metal foil 24A and the insulating layer 13. The via hole 33h and the via hole 33ha can be formed at the same time in the same process and do not hinder the improvement of the production efficiency.

  The formation of the via holes 33h and 33ha is not only a method of drilling so that the metal foil 24A and the insulating layer 13 are continuously lost by laser processing, but first, only the metal foil 24A is penetrated by etching, and then Using the etched metal foil 24A as a mask, the insulating layer 13 can then be removed by laser processing to form a hole. At the stage of etching only the metal foil 24A, a patterned resist mask for etching is formed on the metal foil 24A. The former method is considered to be preferable from the viewpoint of efficiency, and the latter method is considered to be excellent in controllability of the hole shape although it is inefficient.

  The size of the via holes 33h and 33ha can be, for example, about 100 μm on the larger side as a diameter. As shown in the figure, the via holes 33h and 33ha formed by laser processing generally have a shape with a slightly smaller diameter toward the back. This is because the laser spot at the time of laser processing is outputted with a slightly smaller energy density at the edge of the spot.

  As shown in FIG. 12, after the formation of the via holes 33h and 33ha, the electroless plating and electrolytic plating processes are performed to electrically connect with the metal foil 24A, and from this metal foil 24A, the wiring layer 23 and the terminal electrode 41a of the component 41 Via-hole plating vias 33M and 33Ma are formed so as to be electrically connected to the upper surface in the drawing. The plating vias 33M and 33Ma are required to be formed at least on the inner walls of the via holes 33h and 33ha, but may be formed so as to almost fill and fill the via holes 33h and 33ha. In order to control the shape as such a via, the above plating step may be performed after a patterned resist mask is formed on the metal foil 24A. The plating vias 33M and 33Ma can be formed at the same time in the same process and do not hinder the improvement of the production efficiency.

  For example, copper can be used as the material for the plating vias 33M and 33Ma in the via hole. Correspondingly, the surface of the terminal electrode 41a of the component 41 should have a copper plating layer. It is preferable to effectively improve the reliability of contact between the terminal electrode 41a and the via hole inner plating 33Ma.

  After the above steps, the metal foils 21A and 24A on the upper and lower surfaces are patterned using a well-known photolithography, followed by forming layers of solder resists 61 and 62, as shown in FIG. A component-embedded substrate can be obtained. Even with this component built-in substrate, the planar arrangement density of the components 41 provided inside the substrate can be further improved.

  Next, still another embodiment will be described with reference to FIG. FIG. 13 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to still another embodiment. Components that are the same as or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  This embodiment is largely different from that shown in FIG. 1 in that a connection member 31Ra of a conductive composition is used instead of the solder 51 as the connection member. Further, in accordance with the use of the conductive composition connecting member 31Ra, the conductive composition 31R formed at the same time as this is opposite to that shown in FIG. . By forming the connection member 31Ra and the interlayer connection body 31R in the same process, it is possible to contribute to productivity improvement.

  14 and 15 are process diagrams schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 13, each of which corresponds to the mounting of the component 41 shown in FIG. 14) and a subsequent lamination process corresponding to the process shown in FIG. 7 (FIG. 15). 14 and 15, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  First, as shown in FIG. 14A, a metal foil 21A having a thickness of, for example, 18 μm to be used as the wiring layer 21 is prepared, and conductive bumps (bottom diameter, for example, 100 μm, high) serving as an interlayer connector 31R are provided at predetermined positions. By screen printing a conductive bump (for example, conical shape with a bottom diameter of 50 μm and a height of 30 μm, for example) and a conductive bump (for example, a conical shape of 100 μm) and a connection member 31Ra for connecting components, for example Form. After printing, they are dried to cure them to some extent. As for the composition of the conductive composition, those already described can be referred to.

  As the screen plate used for screen printing, one having two types of pits (through holes) having different diameters is used. Thereby, due to the difference in volume in the pit, the interlayer connector 31R and the connecting member 31Ra having different sizes (bottom diameter and height as a conical shape) can be easily formed simultaneously, which can contribute to improvement in productivity. As for the number and position of the connection members 31Ra per one component 41, for example, an arrangement in which the number of the connection members 31Ra is located at each vertex of a square as four can be exemplified. If it does in this way, stability will be good when the components 41 are mounted on the connection member 31Ra with a mounter, for example. In view of stability, three arrangements are also conceivable in which they are positioned at each vertex of the triangle. Furthermore, as one of the slightly larger ones, it may be possible to obtain a stability by slightly plastically deforming this with the component 41.

  Next, as illustrated in FIG. 14B, the component 41 in the standing posture is placed on the metal foil 21 </ b> A so as to be placed on the connection member 31 </ b> Ra using, for example, a mounter. At this time, the printed connection member 31Ra is not sufficiently cured, and if it is slightly pressurized, it is deformed into a truncated cone shape as shown in the figure, and the terminal electrode 41a (the lower surface in the figure) is sufficient. A contact area can be secured. In addition, it is preferable to use a flat stage that can fix the position of the metal foil 21A by vacuum suction when mounting the component by the mounter. Thereby, deformations such as wrinkles on the metal foil 21A can be avoided, and component placement with high positional accuracy becomes possible.

  14 (a) and 14 (b), unlike the description above, the mounter of the component 41 is formed after the formation of the interlayer connector 31R and the connection member 31Ra (before drying and curing to some extent). The interlayer connection body 31R and the connection member 31Ra may be dried and cured after that. Even in that case, if the viscosity of the paste-like conductive composition to be the connection member 31Ra is controlled to be large to some extent, it is difficult to electrically connect the connection member 31Ra and the terminal electrode 41a (lower surface in the figure). Does not occur. Considering the viscosity of the conductive composition that is normally used and the weight of the component 41, there is a possibility that this procedure is rather superior because no weight is required for mounting.

  In addition, in any stage where the interlayer connection body 31R and the connection member 31Ra are dried and cured, the compatibility of the electrical connection between the materials in the contact between the connection member 31Ra and the terminal electrode 41a is considered. The terminal electrode 41a preferably has a copper plating layer.

  Next, as shown in FIG. 14C, a FR-4 prepreg 11A having a nominal thickness, for example, 60 μm, to be the insulating layer 11 is laminated on the metal foil 21A using a press. At this time, a prepreg 11A having an opening at a portion corresponding to the position of the component 41 is used, and a cushion material (not shown) capable of absorbing the thickness of the component 41 is interposed above the prepreg 11A. Pressurize and heat. As a result, the head of the interlayer connector 31 penetrates the prepreg 11A more reliably. Thus, a laminated member 1A as shown in FIG. 14C is obtained.

  Next, using the laminated member 1A shown in FIG. 14C, a lamination process as shown in FIG. 15 is performed. The laminated member 3 and 2A shown in FIG. 15 have the structures already described (the laminated member 3 is explained in FIG. 7 and 2A is explained in FIG. 9). Each of the laminated members 1A, 2A, 3 is arranged in the arrangement as shown in FIG. 15, and is pressed and heated by a press. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated.

  The interlayer connector 33 is electrically connected to the wiring layer 23, the connection member 33a is electrically connected to the terminal electrode 41a (the upper surface in the drawing) of the component 41, and the interlayer connector 31R is It is electrically connected to the wiring layer 22. As a result, each of the interlayer connector 33, the connecting member 33a, and the interlayer connector 31R has a shape in which the head is crushed by plastic deformation (that is, the shaft has a shaft as shown in FIG. It is fixed in a thinner shape.

  After the laminating step shown in FIG. 15, the upper and lower metal foils 21A and 24A are patterned in a predetermined manner by using well-known photolithography, and subsequently, a layer of solder resists 61 and 62 is formed, as shown in FIG. Such a component-embedded substrate can be obtained. Even with this component built-in substrate, the planar arrangement density of the components 41 provided inside the substrate can be further improved.

  Next, still another embodiment will be described with reference to FIG. FIG. 16 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to still another embodiment. Components identical or equivalent to those shown in the already described drawings are given the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  This embodiment is almost the same as that shown in FIG. 13, except that the use of the interlayer connector 31 makes the shape of the interlayer connector 13R shown in FIG. That is.

  FIG. 17 is a process diagram schematically showing a part of the manufacturing process of the component built-in substrate shown in FIG. 16, and shows a stacking process corresponding to the process shown in FIG. In FIG. 17, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  The laminated members 3 and 2 shown in FIG. 17 have the configurations already described (described in FIG. 7). The laminated member 1AA in FIG. 17 can be obtained by omitting the formation of the interlayer connector 13R in the steps shown in FIGS. 14 (a) and 14 (b). Each of the laminated members 1AA, 2, 3 is laminated in the arrangement as shown in FIG. 17, and is pressed and heated by a press. In the following, the component-embedded substrate as shown in FIG. 16 can be obtained in substantially the same manner as described with reference to FIG.

  In this embodiment, it is considered that the formation of the laminated member 1AA can be obtained with fewer steps than the formation of the laminated member 1A shown in FIG. Also, in terms of ensuring the correct posture of the component 41, it is considered to be superior because there are few processes that may affect this. However, the laminated member 2 has more necessary steps than the laminated member 2A (see FIG. 15), and in that respect, yields one step.

  Next, still another embodiment will be described with reference to FIG. FIG. 18 is a cross-sectional view schematically showing a configuration of a component-embedded substrate according to still another embodiment. Components identical or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  In this embodiment, similarly to the embodiment shown in FIG. 10, an interlayer connector 33M that is a via hole plating via is provided in place of the interlayer connector 33, and a connection member that is a via hole plating via is used instead of the connection member 33a. 33Ma is provided, and is additionally deformed as follows. That is, the electrical connection to the wiring pattern 21 side as viewed from the component 41 is also performed by the connection member 31Ma which is a via hole plating via, and the interlayer connection between the wiring layer 21 and the wiring layer 22 is also performed by the via hole plating via 31M. Configured to do.

  The via-hole plating via 31 </ b> M extends so as to be electrically connected to the wiring pattern 21 and from the wiring pattern 21 to the wiring pattern 22. The via-hole plated via 31Ma is electrically connected to the wiring pattern 21 and extended from the wiring pattern 21 to the terminal electrode 41a (lower surface in the drawing) of the component 41. Each of the interlayer connection body 31M and the connection member 31Ma has, for example, a truncated cone shape (that is, a shape having an axis and a diameter changing in the direction of the axis as illustrated). The reason for this is the same as the description related to the shapes of the interlayer connector 33M and the connecting member 33Ma (see FIG. 10).

  FIG. 19 is a process diagram schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 18, and shows a process corresponding to the stacking stage shown in FIG. In FIG. 19, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  In the laminating step shown in FIG. 19, the laminated member 1B is used in addition to the laminated member 3A (explained in FIG. 11) and the laminated member 2A (explained in FIG. 9). As shown in the figure, the laminated member 1B is an easily obtained member in which a prepreg 11A (thickness, for example, 60 μm) is disposed on a metal foil 21A, and the component 41 is placed upright at a predetermined position of the prepreg 11A. It is.

  Each laminated member 1B, 2A, 3A is arranged in a layout as shown in FIG. 19, and is pressed and heated by a press. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated. This is the same as the description in FIG.

  Next, FIG. 20 shows a part of the process performed after the stacking process shown in FIG. 19, and via holes 33h, 33ha for forming via-hole plating vias 33M, 33Ma on the stacked material. , And via holes 31h and 31ha for forming via-hole plated vias 31M and 31Ma are shown.

  The formation of the via holes 31h and 31ha is the same as the description of the formation of the via holes 33h and 33ha in FIG. The via holes 31h and 31ha can be formed at the same time in the same process and are not hindered from improving the production efficiency, and are the same as those described for the via holes 33h and 33ha.

  As shown in FIG. 20, after forming the via holes 31h, 31ha, 33h, and 33ha, an electroless plating process and an electrolytic plating process are performed. Thus, via-hole plated vias 31M and 31Ma are formed so as to be electrically connected to the metal foil 21A and from the metal foil 21A to the wiring layer 22 and the terminal electrode 41a (lower surface in the drawing). . In addition, via-hole plated vias 33M and 33Ma are formed so as to be electrically connected to the metal foil 24A and from the metal foil 24A to the wiring layer 23 and the terminal electrode 41a (upper surface in the drawing). These points can also refer to the description in FIG.

  After the above steps, the metal foils 21A and 24A on both the upper and lower surfaces are patterned by using a well-known photolithography, followed by forming layers of solder resists 61 and 62, as shown in FIG. A component-embedded substrate can be obtained. The component built-in substrate shown in FIG. 18 is the same as the above embodiments in that the planar arrangement density of the components 41 provided inside the substrate can be further improved.

  Next, still another embodiment will be described with reference to FIG. FIG. 21 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to still another embodiment. Components identical or equivalent to those shown in the already described drawings are given the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  In this embodiment, the number of wiring layers is increased as compared with the embodiment shown in FIG. 1. Specifically, a wiring layer (wiring pattern) 25 is provided further outside the wiring layer 24. Accordingly, an insulating layer 14 that separates the wiring layer 24 and the wiring layer 25 from each other and an interlayer connector 34 that penetrates the insulating layer 14 and electrically connects the wiring layer 24 and the wiring layer 25 are newly provided. . Depending on the manufacturing process, the wiring layer 24 is located in the thickness direction of the insulating layer 13 unlike the one shown in FIG.

  FIG. 22 is a process diagram schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 21, and shows a process corresponding to the stacking process shown in FIG. In FIG. 22, the same reference numerals are given to the same or equivalent components as those shown in the already described drawings. The description of the part is omitted unless there is an additional matter.

  In the lamination process shown in FIG. 22, the laminated member 3B is used instead of the laminated member 3 (see FIG. 7). The laminated member 3B uses the insulating layer 14 with the wiring pattern 24 formed on one side instead of the metal foil 24A in the laminated member 3, and then forms the interlayer connector 33 and the connecting member 33a in the same manner as the laminated member 3. This is a member obtained. The insulating layer 14 on which the wiring pattern 24 is formed on one side is prepared as a double-sided copper-clad plate having a metal foil 25A, in which an interlayer connector 34 is formed so as to penetrate the insulating layer 14, and the metal foil on the other side is provided. Obtained by predetermined patterning. The double-sided copper-clad plate can be integrated by laminating a member having the same configuration as the laminated member 3 shown in FIG. 7 and a metal foil.

  Each of the laminated members 1, 2, and 3B is arranged in the arrangement as shown in FIG. 22 and is pressed and heated by a press. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated. This is the same as the description in FIG.

  After the lamination step shown in FIG. 22, the upper and lower metal foils 21A and 25A are patterned in a predetermined manner by using well-known photolithography, and subsequently, layers of solder resists 61 and 62 are formed. Such a component-embedded substrate can be obtained. The component-embedded substrate shown in FIG. 21 is the same as the above embodiments in that the planar arrangement density of the components 41 provided inside the substrate can be further improved.

  As a modification of the embodiment shown in FIG. 21, instead of the interlayer connection body 31 and the solder 51, an interlayer connection body 31R as shown in FIG. 13 (interlayer connection body 31 as shown in FIG. 16), respectively. It is naturally conceivable that the connecting member 31Ra is provided. Further, as another modification, it is naturally conceivable to provide via-hole plated vias 31M and 31Ma as shown in FIG. 18 instead of the interlayer connector 31 and the solder 51.

  Next, still another embodiment will be described with reference to FIG. FIG. 23 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to still another embodiment. Components identical or equivalent to those shown in the already described drawings are given the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  In this embodiment, the number of wiring layers is increased as compared with the embodiment shown in FIG. 10. Specifically, the wiring layer (wiring pattern) 20 is provided further outside the wiring layer 21. Accordingly, an insulating layer 10 that separates the wiring layer 20 from the wiring layer 20 and an interlayer connector 30 that penetrates the insulating layer 10 and electrically connects the wiring layer 20 and the wiring layer 21 are newly provided. . Depending on the manufacturing process, the wiring layer 21 is located in the thickness direction of the insulating layer 11 unlike the one shown in FIG.

  24 is a process diagram schematically showing a part of the manufacturing process of the component-embedded substrate shown in FIG. 23, and shows a process corresponding to the stacking process shown in FIG. In FIG. 24, components that are the same as or equivalent to the components shown in the drawings already described are denoted by the same reference numerals. The description of the part is omitted unless there is an additional matter.

  In the lamination process shown in FIG. 24, the laminated member 1C is used instead of the laminated member 1 (see FIGS. 11 and 7). The laminated member 1 </ b> C uses the insulating layer 10 in which the wiring pattern 21 is formed on one side instead of the metal foil 21 </ b> A in the laminated member 1, and then mounts the component 41 on the wiring pattern 21 with the solder 51. It is the obtained member. The insulating layer 10 on which the wiring pattern 21 is formed on one side is prepared by preparing a double-sided copper-clad plate having a metal foil 20A in which an interlayer connector 30 is formed so as to penetrate the insulating layer 10 and using the metal foil on the other side. Obtained by predetermined patterning. The double-sided copper-clad plate can be integrated by laminating a member having the same configuration as the laminated member 3 shown in FIG. 7 and a metal foil.

  Each laminated member 1C, 2, 3A is laminated and arranged in the arrangement as shown in FIG. Thereby, the prepregs 11A and 13A are completely cured, and the whole is laminated and integrated. At this time, due to the fluidity of the prepregs 11A and 13A obtained by heating, the prepregs 11A and 13A are deformed and enter the space around the component 41 and the space inside the through-hole conductor 32 so that no gap is generated. This is the same as the description in FIG.

  After the stacking process shown in FIG. 24, the same process as the process shown in FIG. 12 and the subsequent plating process are performed. Subsequently, the metal foils 20A and 24A on both the upper and lower surfaces are patterned in a predetermined manner by using well-known photolithography, and subsequently, layers of solder resists 61 and 62 are formed, whereby the component-embedded substrate as shown in FIG. Can be obtained. The component-embedded substrate shown in FIG. 23 is the same as the above embodiments in that the planar arrangement density of the components 41 provided inside the substrate can be further improved.

  As a modification, the form shown in FIG. 23 is configured to provide an interlayer connector 33 and a connecting member 33a made of a conductive composition, as shown in FIG. 1, instead of via-hole plated vias 33M and 33Ma. Of course, this is also possible.

  Next, still another embodiment will be described with reference to FIG. FIG. 25 is a cross-sectional view schematically showing the configuration of a component-embedded substrate according to still another embodiment. Components that are the same as or equivalent to those shown in the already described drawings are denoted by the same reference numerals. It is. The description of the part is omitted unless there is an additional matter.

  In this embodiment, the number of wiring layers is increased as compared with the embodiment shown in FIG. 21. Specifically, the wiring layer (wiring pattern) 20 is provided on the outer side of the wiring layer 21. Accordingly, an insulating layer 10 that separates the wiring layer 20 from the wiring layer 20 and an interlayer connector 30 that penetrates the insulating layer 10 and electrically connects the wiring layer 20 and the wiring layer 21 are newly provided. . Depending on the manufacturing process, the wiring layer 21 is located in the thickness direction of the insulating layer 11 unlike the one shown in FIG.

  In other words, this form is a form in which a part of the members used in the embodiment shown in FIG. 21 and a part of the members used in the embodiment shown in FIG. 23 are combined to further increase the number of wiring layers. is there. Although a specific stacking arrangement in the case of manufacturing is not shown, the stacking members 3B and 2 shown in FIG. 22 are used, and the stacking member 1C shown in FIG. Can be obtained by performing

  In the embodiment described with reference to FIG. 21 and subsequent figures, the substrate with the increased number of wiring layers has been described. However, in order to increase the number of wiring layers, other structures and construction methods can be employed. For example, in the embodiment shown in FIG. 1, a multilayer wiring layer can be formed with a structure in which a wiring layer is newly provided corresponding to the middle thickness of the insulating layer 12. Further, the structure of the component-embedded substrate shown in FIG. 1 (FIGS. 8, 10, 13, 16, and 18) can be used as a core, and multilayer wiring can be made so as to build it up. In order to build up, as a method of forming the conductor in the vertical direction, a method of growing a plating inside a hole formed by a laser (described above), or a conductive bump by conducting a screen printing of a conductive composition, for example. Or the like (described above) can be used.

  1, 1A, 1AA, 1B, 1C ... laminated member, 2, 2A ... laminated member, 3, 3A, 3B ... laminated member, 10, 11, 12, 13, 14 ... insulating layer (plate-like insulating layer), 11A, 13A ... Prepreg, 20, 21, 22, 23, 24, 25 ... Wiring layer (wiring pattern), 20A, 21A, 22A, 23A, 24A, 25A ... Metal foil (copper foil), 30, 31, 33, 34 ... Interlayer connection body (conductive bump by conductive composition printing), 31a ... connection member (conductive bump by conductive composition printing), 31h, 33h ... via hole, 31ha, 33ha ... via hole, 31L, 33L ... interlayer connection body (Conductive bumps filled with conductive composition), 31M, 33M ... interlayer connection (via hole plating via), 31Ma, 33Ma ... connection member (via hole plating via), 31R ... layer Connection body (conductive bump by conductive composition printing), 31Ra ... connection member (conductive bump by conductive composition printing), 32 ... through-hole conductor, 33a ... connection member (conductivity by conductive composition printing) Bumps), 33 La... Connection members (conductive bumps filled with a conductive composition), 41... Surface mount passive element parts, 41 a... Terminal electrodes, 51 .. solder (connection members), 51 A. Plating layer, 57 ... Damping resin pattern, 61, 62 ... Solder resist, 71, 76 ... Opening for parts, 72 ... Through hole.

Claims (14)

A plate-like insulating layer having a first surface and a second surface facing the first surface;
The rod-shaped shape has a structure in which at least both end surfaces of the rod-shaped shape are electrode surfaces, and one end surface of the both end surfaces is opposed to the first surface and of the both end surfaces. A part disposed inside the plate-like insulating layer in the thickness direction so that the other end face of the plate faces the second face;
A first wiring pattern provided on the first surface of the plate-like insulating layer;
A first connecting member for electrically connecting the first wiring pattern and the electrode surface on the one end surface side of the component;
A second wiring pattern provided on the second surface of the plate-like insulating layer;
A second connecting member that penetrates part of the plate-like insulating layer in the thickness direction and electrically connects the second wiring pattern and the electrode surface on the other end face side of the component; A component-embedded board characterized by:   The component built-in board according to claim 1, wherein the first connecting member is a solder containing tin.   3. The component built-in board according to claim 2, wherein the second connection member has a shape having an axis that coincides with a thickness direction of the plate-like insulating layer.   4. The component built-in board according to claim 3, wherein the second connecting member is a member made of a conductive composition.   The component built-in board according to claim 4, wherein the member as the second connection member has a shape in which the diameter becomes narrower as the component is closer to the component in the axis direction.   The component built-in board according to claim 4, wherein the member as the second connection member has a shape whose diameter does not change in the direction of the axis.   A via hole extending so that the second connecting member is electrically connected to the second wiring pattern and is electrically connected to the electrode surface on the other end face side of the component from the second wiring pattern. 4. The component-embedded substrate according to claim 3, wherein the component-embedded substrate is an inner plating via. A third wiring pattern provided in the middle of the thickness of the plate-like insulating layer;
An interlayer connector that is provided between the surface of the second wiring pattern and the surface of the third wiring pattern and electrically connects the second wiring pattern and the third wiring pattern; Further comprising
The interlayer connection body is made of a conductive composition made of the same material as the second connection member, and has an axis that coincides with the thickness direction of the plate-like insulating layer. The component-embedded substrate according to claim 5, wherein the component has a shape with a smaller diameter as it is closer to the wiring pattern. A third wiring pattern provided in the middle of the thickness of the plate-like insulating layer;
An interlayer connector that is provided between the surface of the second wiring pattern and the surface of the third wiring pattern and electrically connects the second wiring pattern and the third wiring pattern; Further comprising
The interlayer connection body is made of a conductive composition of the same material as the second connection member, and has an axis that matches the thickness direction of the plate-like insulating layer, and the diameter changes in the direction of the axis. The component-embedded substrate according to claim 6, wherein the component-embedded substrate has a shape that does not. A third wiring pattern provided in the middle of the thickness of the plate-like insulating layer;
An interlayer connector that electrically connects the second wiring pattern and the third wiring pattern; and
The second connection member, wherein the interlayer connection body is extended so as to be electrically conductive with the second wiring pattern and from the second wiring pattern to the surface of the third wiring pattern. The component built-in substrate according to claim 7, wherein the via is a plated via in the via hole made of the same material. A third wiring pattern provided in the middle of the thickness of the plate-like insulating layer;
Provided between the surface of the first wiring pattern and the surface of the third wiring pattern so as to penetrate a part in the thickness direction of the plate-like insulating layer, and the first wiring pattern and the first wiring pattern An interlayer connection body that electrically connects the wiring patterns of 3;
The first connecting member has an axis that coincides with the thickness direction of the plate-like insulating layer, and has a shape in which the diameter becomes narrower as it approaches the electrode surface on the one end face side of the component in the axis direction. It is a member made of a sex composition,
The interlayer connection body is made of a conductive composition made of the same material as the first connection member, and has an axis that coincides with the thickness direction of the plate-like insulating layer. The component-embedded substrate according to claim 1, wherein the component has a shape with a smaller diameter as it becomes closer to the wiring pattern. A third wiring pattern provided in the middle of the thickness of the plate-like insulating layer;
An interlayer connector that penetrates part of the plate-like insulating layer in the thickness direction and electrically connects the first wiring pattern and the third wiring pattern;
A via hole extending so that the first connecting member is electrically connected to the first wiring pattern and is electrically connected to the electrode surface on the one end face side of the component from the first wiring pattern. Internal plating vias,
The interlayer connection body is a via-hole plated via extending so as to be electrically connected to the first wiring pattern and from the first wiring pattern to the third wiring pattern. The component-embedded substrate according to claim 1.   The first wiring pattern is a pattern of an outermost wiring layer having no multilayer wiring structure on a surface opposite to a surface of the first wiring pattern that is in contact with the plate-like insulating layer. The component-embedded substrate according to claim 1.   The second wiring pattern is a pattern of an outermost wiring layer having no multilayer wiring structure on a surface opposite to a surface of the second wiring pattern that is in contact with the plate-like insulating layer. The component-embedded substrate according to claim 1.

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