JP2017216289A - Multilayer coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer coil component arranged so that the degradation of an electric property of the multilayer coil component is suppressed in case that an elemental body is cracked.SOLUTION: A multilayer coil component comprises: an elemental body 2; an inductor 15 arranged in the elemental body 2; and an external electrode disposed on a surface of the elemental body 2, and electrically connected with the inductor 15. The elemental body 2 has principal faces 2c, 2d, each making a mount face, and end faces 2a, 2b located so as to be adjacent to the principal faces 2c, 2d, and extending in a direction crossing the principal faces 2c, 2d. The external electrode has a first electrode layer 21 formed on the principal faces 2c, 2d and the end face 2a, 2b, and a second electrode layer formed so as to cover the first electrode layer 21. Each end of the first electrode layer 21, located on the principal face 2c, 2d, is located outside the inductor 15 when viewed from a direction orthogonal to the principal face 2c, 2d.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a laminated coil component.

  An electronic component including an element body and an external electrode disposed on the surface of the element body is known (see, for example, Patent Document 1). In the electronic component described in Patent Document 1, the external electrode has a base metal layer formed on the surface of the element body and a conductive resin layer formed so as to cover the base metal layer. ing.

Japanese Patent No. 5172818

  An object of one aspect of the present invention is to provide a laminated coil component in which deterioration of electrical characteristics of the laminated coil component is suppressed even if a crack occurs in the element body.

  A laminated coil component according to one aspect of the present invention includes an element body, a coil disposed in the element body, an external electrode disposed on the surface of the element body and electrically connected to the coil, The element body has a main surface that is a mounting surface, and an end surface that is positioned adjacent to the main surface and extends in a direction intersecting the main surface, and the external electrode is a main surface A base metal layer formed on the surface and the end surface, and a conductive resin layer formed so as to cover the base metal layer, and the end located on the main surface of the base metal layer has a main portion It is located outside the coil when viewed from the direction orthogonal to the surface.

  As a result of our research, the following matters were found. For example, when a laminated coil component is mounted on an electronic device (for example, a circuit board or an electronic component), an external force that acts on the laminated coil component from the electronic device may act as a stress on the element body through the external electrode. . At this time, the stress tends to concentrate on the end portion of the base metal layer located on the main surface, which is the mounting surface, and the above-mentioned end portion of the base metal layer is the starting point, and cracks are generated in the element body. There is a fear.

  In the laminated coil component according to one aspect of the present invention, even when a crack occurs in the element body starting from the end of the base metal layer, the end of the base metal layer is orthogonal to the main surface. Since it is located outside the coil when viewed from the direction, the generated crack is difficult to reach the coil. Therefore, even when a crack occurs in the element body, the crack hardly affects the coil, and deterioration of the electrical characteristics of the laminated coil component is suppressed.

  The thickness of the conductive resin layer at the end portion of the base metal layer may be 50% or more of the maximum thickness at the portion located on the main surface of the conductive resin layer.

  As a result of our research, the following matters were found. Since the conductive resin layer generally contains a metal powder and a resin (for example, a thermosetting resin), the conductive resin layer has a higher resistance than a base metal layer made of metal. For this reason, when the external electrode has a conductive resin layer, the DC resistance of the laminated coil component may increase. In order to suppress an increase in DC resistance of the laminated coil component, it is conceivable to reduce the thickness of the conductive resin layer and reduce the resistance of the conductive resin layer. However, in this case, the stress relaxation effect by the conductive resin layer may be reduced.

  In this embodiment, the thickness of the conductive resin layer at the end portion of the base metal layer is set to 50% or more of the maximum thickness at the portion located on the main surface of the conductive resin layer. For this reason, even when an external force is applied to the laminated coil component, stress hardly concentrates on the end portion of the base metal layer, and the end portion is unlikely to become a starting point of a crack. Therefore, even when the thickness of the conductive resin layer is reduced, the stress relaxation effect due to the conductive resin layer is suppressed from decreasing.

  The reference in the direction perpendicular to the end surface with respect to the length from the reference surface in the direction orthogonal to the end surface to the position of the maximum thickness in the portion located on the main surface of the conductive resin layer, with the surface including the end surface as the reference surface The ratio of the length from the surface to the end of the base metal layer may be 0.6 to 1.0. In this case, it is further suppressed that the stress relaxation effect by the conductive resin layer is lowered.

  The conductor further includes a conductor having one end connected to the coil and the other end exposed to the end face and connected to the base metal layer, and from a direction orthogonal to the end face As seen, the position where the other end of the conductor on the end face is exposed may be different from the position of the maximum thickness in the portion located on the main surface of the conductive resin layer.

  As a result of our research, the following matters were found. The base metal layer is generally composed of a sintered metal layer. Since the sintered metal layer is a layer formed by sintering the metal component (metal powder) contained in the conductive paste, the sintered metal layer is unlikely to be a uniform metal layer. Is difficult to control. The sintered metal layer may exhibit a shape (such as a mesh shape) in which a plurality of openings (through holes) are formed, for example.

  The conductive resin layer is a layer in which metal powder is dispersed in a cured resin. In the conductive resin layer, a current path is formed when the metal powders are in contact with each other. It is difficult to control the dispersion state of the metal powder in the resin, and the position of the current path in the conductive resin layer is difficult to control.

  For these reasons, the current paths in the conductive resin layer and the base metal layer are different for each product. Depending on the product, for example, a row of metal powder is formed at the position of the maximum thickness in a portion located on the end face of the conductive resin layer, and the metal powder and the mesh-shaped base metal layer are in contact with each other. In this product, the position at which the other end of the conductor on the end face is exposed and the position of the maximum thickness on the main surface of the conductive resin layer coincide with each other when viewed from the direction orthogonal to the end face. In this case, since the current flows into the other end of the conductor through the current path formed at the position of the maximum thickness in the portion located on the main surface of the conductive resin layer, the direct current resistance is high. In order to obtain a product with low DC resistance, even when a current path is formed at the position of the maximum thickness in the portion located on the main surface of the conductive resin layer, the probability that current flows through the current path is low. It is necessary to adopt.

  In this embodiment, the position at which the other end of the conductor on the end surface is exposed is different from the position of the maximum thickness in the portion located on the main surface of the conductive resin layer as viewed from the direction orthogonal to the end surface. Therefore, there is a high possibility that the current path flows to the end portion of the conductor through the current path formed in a portion other than the position of the maximum thickness in the portion located on the main surface of the conductive resin layer. Therefore, according to this embodiment, it is difficult to obtain a laminated coil component having a high DC resistance.

  The said edge part of a base metal layer may be located in the end surface side rather than the position of the maximum thickness in the part located on the main surface of a conductive resin layer seeing from the direction orthogonal to a main surface. In the present embodiment, for example, the base metal layer is compared with a configuration in which the end portion of the base metal layer is located farther from the end surface than the position of the maximum thickness in the portion located on the main surface of the conductive resin layer. The end of the layer leaves the coil. Therefore, even when a crack occurs in the element body starting from the end portion of the base metal layer, the generated crack hardly reaches the coil. Therefore, even when a crack occurs in the element body, the crack hardly affects the coil, and deterioration of the electrical characteristics of the laminated coil component is suppressed.

  According to the one aspect of the present invention, it is possible to provide a laminated coil component in which deterioration of the electrical characteristics of the laminated coil component is suppressed even if a crack occurs in the element body.

It is a perspective view which shows the laminated coil component which concerns on one Embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer coil component which concerns on this embodiment. It is a perspective view which shows the structure of a coil conductor. It is a figure for demonstrating the cross-sectional structure of an external electrode. It is a figure for demonstrating the cross-sectional structure of an external electrode. It is a top view of the element body in which the 1st electrode layer was formed. It is a top view of the 2nd electrode layer which the electrode part located in an end surface contains. It is a top view of the 2nd electrode layer which the electrode part located in an end surface contains.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-3, the structure of the laminated coil component 1 which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view showing a laminated coil component according to this embodiment. FIG. 2 is a view for explaining a cross-sectional configuration along the line II-II in FIG. FIG. 3 is a perspective view showing the configuration of the coil conductor.

  As shown in FIG. 1, the laminated coil component 1 includes an element body 2 having a rectangular parallelepiped shape and a pair of external electrodes 4 and 5. The pair of external electrodes 4 and 5 are disposed at both ends of the element body 2 and are separated from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded. The multilayer coil component 1 can be applied to, for example, a bead inductor or a power inductor.

  The element body 2 has a rectangular parallelepiped shape. The element body 2 has, as its surface, a pair of end faces 2a and 2b that face each other, a pair of main faces 2c and 2d that face each other, and a pair of side faces 2e and 2f that face each other. ing. The end surfaces 2a and 2b are located adjacent to the pair of main surfaces 2c and 2d. The end faces 2a and 2b are positioned so as to be adjacent to the pair of side faces 2e and 2f. The main surface 2c or the main surface 2d is, for example, a surface (mounting surface) that faces another electronic device when the multilayer coil component 1 is mounted on another electronic device (not shown) (for example, a circuit board or an electronic component). ).

  In the present embodiment, the direction (first direction D1) in which the pair of end faces 2a and 2b face each other is the length direction of the element body 2. The direction (second direction D2) in which the pair of main surfaces 2c and 2d face each other is the height direction of the element body 2. The direction (third direction D3) in which the pair of side surfaces 2e and 2f face each other is the width direction of the element body 2. The first direction D1, the second direction D2, and the third direction D3 are orthogonal to each other.

  The length of the element body 2 in the first direction D1 is larger than the length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3. The length of the element body 2 in the second direction D2 is equal to the length of the element body 2 in the third direction D3. In other words, in the present embodiment, the pair of end surfaces 2a and 2b have a square shape, and the pair of main surfaces 2c and 2d and the pair of side surfaces 2e and 2f have a rectangular shape. The length of the element body 2 in the first direction D1 may be equal to the length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3. The length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3 may be different.

  “Equivalent” may be equivalent to a value including a slight difference or a manufacturing error in a preset range in addition to being equal. For example, if a plurality of values are included in a range of ± 5% of the average value of the plurality of values, the plurality of values are defined to be equivalent.

  Each end surface 2a, 2b extends in the second direction D2 so as to connect the pair of main surfaces 2c, 2d. That is, each end surface 2a, 2b extends in a direction intersecting with the main surfaces 2c, 2d. Each end surface 2a, 2b also extends in the third direction D3. The pair of main surfaces 2c, 2d extends in the first direction D1 so as to connect the pair of end surfaces 2a, 2b. The pair of main surfaces 2c and 2d also extends in the third direction D3. The pair of side surfaces 2e and 2f extends in the second direction D2 so as to connect the pair of main surfaces 2c and 2d. The pair of side surfaces 2e and 2f also extend in the first direction D1.

  The element body 2 is configured by laminating a plurality of insulator layers 6 (see FIG. 3). Each insulator layer 6 is laminated in a direction in which the main surface 2c and the main surface 2d face each other. That is, the stacking direction of each insulator layer 6 coincides with the direction in which the main surface 2c and the main surface 2d face each other. Hereinafter, the direction in which the main surface 2c and the main surface 2d face each other is also referred to as a “stacking direction”. Each insulator layer 6 has a substantially rectangular shape. In the actual element body 2, each insulator layer 6 is integrated to such an extent that the boundary between the layers cannot be visually recognized.

  Each insulator layer 6 is a sintered body of a ceramic green sheet containing a ferrite material (for example, a Ni—Cu—Zn based ferrite material, a Ni—Cu—Zn—Mg based ferrite material, or a Ni—Cu based ferrite material). Consists of That is, the element body 2 is made of a ferrite sintered body.

  The laminated coil component 1 includes a coil 15 disposed in the element body 2. As shown in FIG. 3, the coil 15 includes a plurality of coil conductors (a plurality of internal conductors) 16a, 16b, 16c, 16d, 16e, and 16f. The plurality of coil conductors 16a to 16f include a conductive material (for example, Ag or Pd). The plurality of coil conductors 16a to 16f are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder).

  The coil conductor 16 a includes a connection conductor 17. The connection conductor 17 is disposed on the end surface 2b side of the element body 2 and has an end portion exposed at the end surface 2b. The end portion of the connection conductor 17 is exposed at a position closer to the main surface 2c than the central region of the end surface 2b when viewed from the direction orthogonal to the end surface 2b. The coil conductor 16a is connected to the external electrode 5 at the end of the connection conductor 17 exposed at the end face 2b. That is, the coil conductor 16 a is electrically connected to the external electrode 5 through the connection conductor 17. In the present embodiment, the conductor pattern of the coil conductor 16a and the conductor pattern of the connection conductor 17 are integrally formed continuously.

  The coil conductor 16 f includes a connection conductor 18. The connection conductor 18 is disposed on the end surface 2a side of the element body 2 and has an end portion exposed to the end surface 2a. The end of the connection conductor 18 is exposed at a position closer to the main surface 2d than the central region of the end surface 2a when viewed from the direction orthogonal to the end surface 2a. The coil conductor 16f is connected to the external electrode 4 at the end of the connection conductor 18 exposed at the end face 2a. That is, the coil conductor 16 f is electrically connected to the external electrode 4 through the connection conductor 18. In the present embodiment, the conductor pattern of the coil conductor 16f and the conductor pattern of the connection conductor 18 are integrally formed continuously.

  The plurality of coil conductors 16 a to 16 f are juxtaposed in the stacking direction of the insulator layer 6 in the element body 2. The plurality of coil conductors 16a to 16f are arranged in the order of the coil conductor 16a, the coil conductor 16b, the coil conductor 16c, the coil conductor 16d, the coil conductor 16e, and the coil conductor 16f from the side closest to the outermost layer. In the present embodiment, the coil 15 includes a portion other than the connection conductor 17 in the coil conductor 16a, a plurality of coil conductors 16b to 16d, and a portion other than the connection conductor 18 in the coil conductor 16f.

  The ends of the coil conductors 16a to 16f are connected by through-hole conductors 19a to 19e. The coil conductors 16a to 16f are electrically connected to each other through the through-hole conductors 19a to 19e. The coil 15 is configured by electrically connecting a plurality of coil conductors 16a to 16f. Each through-hole conductor 19a-19e contains a conductive material (for example, Ag or Pd). Each of the through-hole conductors 19a to 19e is configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder) similarly to the plurality of coil conductors 16a to 16f.

  The external electrode 4 is located at the end of the element body 2 on the end face 2a side when viewed in the first direction D1. The external electrode 4 has an electrode portion 4a located on the end surface 2a, an electrode portion 4b located on the pair of main surfaces 2c and 2d, and an electrode portion 4c located on the pair of side surfaces 2e and 2f. ing. That is, the external electrode 4 is formed on the five surfaces 2a, 2c, 2d, 2e, and 2f.

  Adjacent electrode portions 4a, 4b, 4c are connected at the ridge line portion of the element body 2 and are electrically connected. The electrode portion 4a and the electrode portion 4b are connected at a ridge line portion between the end surface 2a and the main surfaces 2c and 2d. The electrode portion 4a and the electrode portion 4c are connected at a ridge line portion between the end surface 2a and the side surfaces 2e and 2f.

  The electrode portion 4 a is disposed so as to cover all the end portions exposed to the end surface 2 a of the connection conductor 18, and the connection conductor 18 is directly connected to the external electrode 4. That is, the connection conductor 18 connects the coil conductor 16a (one end of the coil 15) and the electrode portion 4a. Thereby, the coil 15 is electrically connected to the external electrode 4.

  The external electrode 5 is located at the end of the element body 2 on the end face 2b side when viewed in the first direction D1. The external electrode 5 includes an electrode portion 5a located on the end surface 2b, an electrode portion 5b located on the pair of main surfaces 2c and 2d, and an electrode portion 5c located on the pair of side surfaces 2e and 2f. ing. That is, the external electrode 5 is formed on the five surfaces 2b, 2c, 2d, 2e, and 2f.

  The adjacent electrode portions 5a, 5b, 5c are connected at the ridge line portion of the element body 2 and are electrically connected. The electrode portion 5a and the electrode portion 5b are connected at a ridge line portion between the end surface 2b and the main surfaces 2c and 2d. The electrode portion 5a and the electrode portion 5c are connected at a ridge line portion between the end surface 2b and the side surfaces 2e and 2f.

  The electrode portion 5 a is arranged so as to cover all the end portions exposed to the end surface 2 b of the connection conductor 17, and the connection conductor 17 is directly connected to the external electrode 5. That is, the connection conductor 17 connects the coil conductor 16f (the other end of the coil 15) and the electrode portion 5a. Thereby, the coil 15 is electrically connected to the external electrode 5.

  As shown in FIGS. 4 and 5, the external electrodes 4 and 5 include a first electrode layer 21, a second electrode layer 23, a third electrode layer 25, and a fourth electrode layer 27, respectively. That is, the electrode portions 4a, 4b, and 4c and the electrode portions 5a, 5b, and 5c include the first electrode layer 21, the second electrode layer 23, the third electrode layer 25, and the fourth electrode layer 27, respectively. The fourth electrode layer 27 constitutes the outermost layer of the external electrodes 4 and 5. 4 and 5 are diagrams for explaining a cross-sectional configuration of the external electrode.

  The first electrode layer 21 is formed by applying and baking a conductive paste on the surface of the element body 2. The first electrode layer 21 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer 21 is a sintered metal layer formed on the element body 2. In the present embodiment, the first electrode layer 21 is a sintered metal layer made of Ag. The first electrode layer 21 may be a sintered metal layer made of Pd. Thus, the 1st electrode layer 21 contains Ag or Pd. As the conductive paste, a powder made of Ag or Pd mixed with a glass component, an organic binder, and an organic solvent is used.

  The second electrode layer 23 is formed by curing the conductive resin applied on the first electrode layer 21. The second electrode layer 23 is formed so as to cover the entire first electrode layer 21. The first electrode layer 21 is a base metal layer for forming the second electrode layer 23. The second electrode layer 23 is a conductive resin layer formed on the first electrode layer 21. As the conductive resin, a thermosetting resin mixed with a metal powder and an organic solvent is used. As the metal powder, for example, Ag powder is used. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin is used.

  The third electrode layer 25 is formed on the second electrode layer 23 by a plating method. In the present embodiment, the third electrode layer 25 is a Ni plating layer formed on the second electrode layer 23 by Ni plating. The third electrode layer 25 may be a Sn plating layer, a Cu plating layer, or an Au plating layer. As described above, the third electrode layer 25 includes Ni, Sn, Cu, or Au.

  The fourth electrode layer 27 is formed on the third electrode layer 25 by a plating method. In the present embodiment, the fourth electrode layer 27 is a Sn plating layer formed on the third electrode layer 25 by Sn plating. The fourth electrode layer 27 may be a Cu plating layer or an Au plating layer. As described above, the fourth electrode layer 27 contains Sn, Cu, or Au. The third electrode layer 25 and the fourth electrode layer 27 constitute a plating layer formed on the second electrode layer 23. That is, in this embodiment, the plating layer formed on the second electrode layer 23 has a two-layer structure.

  The average thickness (average thickness of the first electrode layer 21 included in the electrode portions 4a and 5a) of the portion located on the end surfaces 2a and 2b of the first electrode layer 21 is, for example, 10 to 30 μm. The average thickness (average thickness of the second electrode layer 23 included in the electrode portions 4a and 5a) of the portion located on the end surfaces 2a and 2b of the second electrode layer 23 is, for example, 30 to 50 μm. The average thickness (average thickness of the third electrode layer 25 included in the electrode portions 4a and 5a) of the portion located on the end faces 2a and 2b of the third electrode layer 25 is, for example, 1 to 3 μm. The average thickness (average thickness of the fourth electrode layer 27 included in the electrode portions 4a and 5a) of the portion located on the end faces 2a and 2b of the fourth electrode layer 27 is, for example, 2 to 7 μm. The average thickness (average thickness of the plating layer included in the electrode portions 4a and 5a) of the portions located on the end faces 2a and 2b of the plating layers (third and fourth electrode layers 25 and 27) is, for example, 3 to 10 μm. .

  The average thickness (average thickness of the first electrode layer 21 included in the electrode portions 4b and 5b) of the portion located on the main surfaces 2c and 2d of the first electrode layer 21 is, for example, 1 to 2 μm. The average thickness (the average thickness of the second electrode layer 23 included in the electrode portions 4b and 5b) of the portion located on the main surfaces 2c and 2d of the second electrode layer 23 is, for example, 10 to 30 μm. The average thickness (the average thickness of the third electrode layer 25 included in the electrode portions 4b and 5b) of the portion located on the main surfaces 2c and 2d of the third electrode layer 25 is, for example, 1 to 3 μm. The average thickness (the average thickness of the fourth electrode layer 27 included in the electrode portions 4b and 5b) of the portion located on the main surfaces 2c and 2d of the fourth electrode layer 27 is, for example, 2 to 7 μm. The average thickness (average thickness of the plating layer included in the electrode portions 4b and 5b) of the plating layer (third and fourth electrode layers 25 and 27) located on the main surfaces 2c and 2d is, for example, 3 to 10 μm. is there. The average thickness of the second electrode layer 23 included in the electrode portions 4b and 5b is not more than 15 times the average thickness of the first electrode layer 21 included in the electrode portions 4b and 5b. The average thickness of the second electrode layer 23 included in the electrode portions 4b and 5b is not more than five times the average thickness of the plating layer included in the electrode portions 4b and 5b.

  The average thickness can be determined as follows, for example.

  Sectional drawing including each part located on end surface 2a, 2b of the 1st electrode layer 21, the 2nd electrode layer 23, the 3rd electrode layer 25, and the 4th electrode layer 27 is acquired. The cross-sectional view is, for example, the first when cut along a plane parallel to a pair of surfaces facing each other (for example, the pair of side surfaces 2e and 2f) and equidistant from the pair of surfaces. 4 is a cross-sectional view of one electrode layer 21, a second electrode layer 23, a third electrode layer 25, and a fourth electrode layer 27. FIG. Each area of the part located on the end surfaces 2a and 2b of the first electrode layer 21, the second electrode layer 23, the third electrode layer 25, and the fourth electrode layer 27 on the acquired sectional view is calculated.

  The area of the part located on the end faces 2a, 2b of the first electrode layer 21 is divided by the length of the part located on the end faces 2a, 2b on the acquired sectional view, and the obtained quotient is the first electrode. The average thickness of the portions located on the end faces 2a and 2b of the layer 21 is used. The area of the portion located on the end faces 2a, 2b of the second electrode layer 23 is divided by the length of the portion located on the end faces 2a, 2b on the acquired sectional view, and the obtained quotient is the second electrode. The average thickness of the portions located on the end faces 2a and 2b of the layer 23 is taken. The area of the part located on the end faces 2a, 2b of the third electrode layer 25 is divided by the length of the part located on the end faces 2a, 2b on the acquired sectional view, and the obtained quotient is the third electrode. It is set as the average thickness of the part located on the end surfaces 2a and 2b of the layer 25. The area of the portion located on the end surfaces 2a, 2b of the fourth electrode layer 27 is divided by the length of the portion located on the end surfaces 2a, 2b on the acquired sectional view, and the obtained quotient is the fourth electrode. It is set as the average thickness of the part located on the end surfaces 2a and 2b of the layer 27.

  Sectional drawing including each part located on the main surfaces 2c and 2d of the 1st electrode layer 21, the 2nd electrode layer 23, the 3rd electrode layer 25, and the 4th electrode layer 27 is acquired. The cross-sectional view is, for example, the first when cut along a plane parallel to a pair of surfaces facing each other (for example, the pair of side surfaces 2e and 2f) and equidistant from the pair of surfaces. 4 is a cross-sectional view of one electrode layer 21, a second electrode layer 23, a third electrode layer 25, and a fourth electrode layer 27. FIG. The respective areas of the portions of the first electrode layer 21, the second electrode layer 23, the third electrode layer 25, and the fourth electrode layer 27 that are located on the main surfaces 2c and 2d on the acquired cross-sectional view are calculated.

  The area of the part located on the main surfaces 2c and 2d of the first electrode layer 21 is divided by the length of the part located on the main surfaces 2c and 2d on the acquired sectional view, and the obtained quotient It is set as the average thickness of the part located on the main surfaces 2c and 2d of the one electrode layer 21. The area of the portion of the second electrode layer 23 located on the principal surfaces 2c and 2d is divided by the length of the portion located on the principal surfaces 2c and 2d on the acquired cross-sectional view, and the obtained quotient It is set as the average thickness of the part located on the main surfaces 2c and 2d of the two-electrode layer 23. The area of the portion of the third electrode layer 25 located on the principal surfaces 2c and 2d is divided by the length of the portion located on the principal surfaces 2c and 2d on the acquired cross-sectional view, and the obtained quotient It is set as the average thickness of the part located on the main surfaces 2c and 2d of the three-electrode layer 25. The area of the portion of the fourth electrode layer 27 located on the principal surfaces 2c, 2d is divided by the length of the portion located on the principal surfaces 2c, 2d on the acquired cross-sectional view, and the obtained quotient It is set as the average thickness of the part located on the main surfaces 2c and 2d of the four-electrode layer 27.

  In any case, a plurality of cross-sectional views may be acquired, and the above quotients may be acquired for each cross-sectional view. In this case, an average value of a plurality of acquired quotients may be used as the average thickness.

  Next, with reference to FIG.4 and FIG.5, the relationship between the 1st electrode layer 21 and the 2nd electrode layer 23 of the external electrodes 4 and 5 on the main surfaces 2c and 2d is demonstrated.

The thickness T _RS1 of the second electrode layer 23 at the end located on the main surfaces 2c, 2d of the first electrode layer 21 is the maximum thickness T _{RSmax at the} portion located on the main surfaces 2c, 2d of the second electrode layer 23. Of 50% or more. That is, the thickness T _RS1 of the second electrode layer 23 located on the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b is _{equal to} the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portions 4b and 5b. 50% or more. The maximum thickness T _RSmax is, for example, 11 to ₄₀ μm. The thickness T _RS1 is, for example, 6 to 40 μm. In the present embodiment, the maximum thickness T _RSmax is 30 μm, and the thickness T _RS1 is 20 μm. That is, the thickness T _RS1 is about 67% of the maximum thickness T _RSmax .

In the electrode portion 4b, the end portions of the first electrode layer 21 located on the main surfaces 2c and 2d are the main portions of the second electrode layer 23 when viewed from the direction orthogonal to the main surfaces 2c and 2d (second direction D2). It is located closer to the end face 2a than the position of the maximum thickness _TRSmax in the portions located on the faces 2c and 2d. That is, the end of the first electrode layer 21 included in the electrode portion 4b is located closer to the end surface 2a than the position of the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portion 4b when viewed from the second direction D2. ing. The plane including the end surface 2a as a reference plane DP _1, the length _{L SE1} to the end of the first electrode layer 21 from the reference plane DP ₁ comprising the electrode portion 4b in the first direction D1 is in the first direction D1 It is smaller than the length L _RS1 from the reference plane DP ₁ to the position of the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portion 4b.

In the electrode portion 5b, the end portions located on the major surfaces 2c and 2d of the first electrode layer 21 are the largest in the portion located on the major surfaces 2c and 2d of the second electrode layer 23 when viewed from the second direction D2. It is located closer to the end face 2b than the position of the thickness T _RSmax . That is, the end portion of the first electrode layer 21 included in the electrode portion 5b is located closer to the end face 2b side than the position of the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portion 5b when viewed from the second direction D2. ing. A plane including the end face 2b as a reference plane DP _2, the length _{L SE2} to the end of the first electrode layer 21 from the reference plane DP ₂ comprising the electrode portion 5b in the first direction D1 is in the first direction D1 from the reference plane DP ₂ to the position of the maximum thickness _{T RSmax} of the second electrode layer 23 including the electrode portion 5b smaller than the length _{L RS2.}

The length L _SE1 is, for example, 80 μm. The length L _RS1 is, for example, 120 μm. The length L _SE2 is, for example, 80 μm. The length L _RS2 is, for example, 120 μm. In the present embodiment, the length L _SE1 and the length L _SE2 are equivalent, but the length L _SE1 and the length L _SE2 may be different. In the present embodiment, the length L _RS1 and the length L _RS2 are equivalent, but the length L _RS1 and the length L _RS2 may be different.

  Next, although illustration is omitted, the relationship between the first electrode layer 21 and the second electrode layer 23 of the external electrodes 4 and 5 on the side surfaces 2e and 2f will be described.

The thickness of the second electrode layer 23 at the end portion located on the side surfaces 2e and 2f of the first electrode layer 21 is 50% or more of the maximum thickness at the portion located on the side surfaces 2e and 2f of the second electrode layer 23. . That is, the thickness of the second electrode layer 23 located on the end portion of the first electrode layer 21 included in the electrode portions 4c and 5c is 50% or more of the maximum thickness of the second electrode layer 23 included in the electrode portions 4c and 5c. is there. The thickness of the second electrode layer 23 located on the end portion of the first electrode layer 21 included in the electrode portions 4c and 5c is equal to the thickness _TRS1 . The maximum thickness of the second electrode layer 23 included in the electrode portions 4c and 5c is equal to the maximum thickness T _RSmax .

  In the electrode portion 4c, the end portions located on the side surfaces 2e and 2f of the first electrode layer 21 are viewed from the direction orthogonal to the side surfaces 2e and 2f (the third direction D3), and the side surfaces 2e and 2e of the second electrode layer 23, respectively. It is located on the end face 2a side of the position of the maximum thickness in the portion located on 2f. That is, the end portion of the first electrode layer 21 included in the electrode portion 4c is located on the end surface 2a side from the position of the maximum thickness of the second electrode layer 23 included in the electrode portion 4c when viewed from the third direction D3. .

Length from the reference plane DP ₁ in the first direction D1 to the end of the first electrode layer 21 including the electrode portion 4c is equal to the length L _SE1. Length from the reference plane DP ₁ in the first direction D1 to the position of the maximum thickness of the second electrode layer 23 including the electrode portion 4c is equal to the length L _RS1. Accordingly, the second length from the reference plane DP ₁ in the first direction D1 to the end of the first electrode layer 21 including the electrode portion 4c is included in the electrode portion 4c from the reference plane DP ₁ in the first direction D1 It is smaller than the length of the electrode layer 23 up to the position of the maximum thickness.

  In the electrode portion 5c, the end portions located on the side surfaces 2e and 2f of the first electrode layer 21 have the maximum thickness in the portion located on the side surfaces 2e and 2f of the second electrode layer 23 when viewed from the third direction D3. It is located on the end face 2b side from the position. That is, the end portion of the first electrode layer 21 included in the electrode portion 5c is located closer to the end surface 2b than the position of the maximum thickness of the second electrode layer 23 included in the electrode portion 5c when viewed from the third direction D3. .

Length from the reference plane DP ₂ in the first direction D1 to the end of the first electrode layer 21 including the electrode portions 5c are equivalent to the length L _SE2. Length from the reference plane DP ₂ in the first direction D1 to the position of the maximum thickness of the second electrode layer 23 including the electrode portion 5c is equal to the length L _RS2. Accordingly, the second length from the reference plane DP ₂ in the first direction D1 to the end of the first electrode layer 21 including the electrode portion 5c is included in the electrode portion 5c from the reference plane DP ₂ in the first direction D1 It is smaller than the length of the electrode layer 23 up to the position of the maximum thickness.

  Next, the relationship between the coil 15 and the first electrode layer 21 will be described with reference to FIG. FIG. 6 is a plan view of the element body on which the first electrode layer is formed.

As shown in FIG. 6, end portions (end portions of the first electrode layer 21 included in the electrode portions 4 b and 5 b) located on the main surfaces 2 c and 2 d of the first electrode layer 21 are formed on the main surfaces 2 c and 2 d. It is located outside the coil 15 when viewed from the orthogonal direction (second direction D2). That is, the first electrode layer 21 included in the electrode portions 4b and 5b does not overlap the coil 15 when viewed from the direction orthogonal to the main surfaces 2c and 2d. The length _{L SE1} is smaller than the length from the reference plane DP ₁ in the first direction D1 to the coil 15. The length _{L SE2} is smaller than the length from the reference plane DP ₂ in the first direction D1 to the coil 15. Part of the first electrode layer 21 included in the electrode portions 4b and 5b overlaps the connection conductors 17 and 18 when viewed from the second direction D2.

  Although illustration is omitted, the end portions (end portions of the first electrode layer 21 included in the electrode portions 4c and 5c) located on the side surfaces 2e and 2f of the first electrode layer 21 are also in the third direction D3 (side surfaces 2e and 2f). As viewed from the direction orthogonal to the coil 15). That is, the first electrode layer 21 included in the electrode portions 4c and 5c does not overlap the coil 15 when viewed from the third direction D3. Part of the first electrode layer 21 included in the electrode portions 4c and 5c overlaps with the connection conductors 17 and 18 when viewed from the third direction D3.

  Next, with reference to FIG.7 and FIG.8, the relationship between the coil 15 and the 1st electrode layer 21 is demonstrated. FIG.7 and FIG.8 is a top view of the 2nd electrode layer which the electrode part located in an end surface contains.

  As shown in FIGS. 4 and 5, the connection conductor 17 has one end connected to the coil 15 and the other end exposed to the end surface 2 b and connected to the first electrode layer 21. ing. The connection conductor 18 has one end connected to the coil 15 and the other end exposed to the end surface 2 a and connected to the first electrode layer 21.

  When forming the 2nd electrode layer 23, provision of electroconductive resin is generally implement | achieved by the immersion method. In this case, as for the thickness of the second electrode layer 23 included in the electrode portions 4a and 5a, the position corresponding to the central region of the end faces 2a and 2b is the largest when viewed from the direction orthogonal to the end faces 2a and 2b, and is away from the position. It becomes small according to.

  As shown in FIG. 7, the other end of the connection conductor 17 is exposed at a position closer to the main surface 2c than the central region of the end surface 2b when viewed from the direction orthogonal to the end surface 2b. That is, when viewed from the direction orthogonal to the end surface 2b, the position where the other end of the connection conductor 17 on the end surface 2b is exposed is different from the position of the maximum thickness of the second electrode layer 23 included in the electrode portion 5a. .

  As shown in FIG. 8, the other end of the connection conductor 18 is exposed at a position closer to the main surface 2d than the central region of the end surface 2a when viewed from the direction orthogonal to the end surface 2a. That is, when viewed from the direction orthogonal to the end surface 2a, the position at which the other end of the connection conductor 17 on the end surface 2a is exposed differs from the position of the maximum thickness of the second electrode layer 23 included in the electrode portion 4a. .

  When the laminated coil component 1 is mounted on an electronic device, an external force that acts on the laminated coil component 1 from the electronic device may act as a stress on the element body 2 through the external electrodes 4 and 5. At this time, the stress tends to concentrate on the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b.

In the laminated coil component 1, the thickness T _RS1 of the second electrode layer 23 located on the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b is the maximum of the second electrode layer 23 included in the electrode portions 4b and 5b. It is 50% or more of the thickness T _RSmax . For this reason, even when an external force acts on the laminated coil component 1, stress hardly concentrates on the end portion of the first electrode layer 21 included in the electrode portions 4 b and 5 b, and the first electrode layer 21 included in the electrode portions 4 b and 5 b The edge is unlikely to become a starting point for cracks. Therefore, even when the thickness of the second electrode layer 23 is reduced, the stress relaxation effect due to the second electrode layer 23 is suppressed from decreasing.

Here, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax and the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 that can suppress the reduction of the stress relaxation effect will be described in detail.

In order to clarify the ratio of the thickness T _RS1 to the maximum thickness T _RSmax that can suppress the reduction of the stress relaxation effect, the present inventors performed the following test. First, a plurality of laminated coil components (samples S1 to S5) having different ratios of the thickness T _RS1 to the maximum thickness T _RSmax are prepared, and a bending strength test is performed for each of the samples S1 to S5. After the bending strength test, the laminated coil component is cut together with a substrate to be described later, and it is visually confirmed whether or not a crack has occurred in the element body of the laminated coil component.

  In the flexural strength test, first, the laminated coil component is solder-mounted on the central portion of the substrate (glass epoxy substrate). The size of the substrate is 100 mm × 40 mm, and the thickness of the substrate is 1.6 mm. Next, the substrate is placed on two bars arranged in parallel with an interval of 90 mm. The substrate is placed so that the surface on which the laminated coil component is mounted faces downward. Thereafter, a bending stress is applied to the central portion of the substrate from the back surface of the surface on which the laminated coil component is mounted so that the amount of bending of the substrate becomes a desired value.

The ratio of the thickness T _RS1 to the maximum thickness T _RSmax can be changed by making the lengths L _SE1 and L _SE2 different. For example, when the first electrode layer 21 is formed such that the lengths L _SE1 and L _SE2 match the lengths L _RS1 and L _RS2 , the thickness T _RS1 matches the maximum thickness T _RSmax . In this case, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is 100%.

The samples S1 to S5 have the same configuration except that the ratio of the thickness T _RS1 to the maximum thickness T _RSmax (the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 ) is different. In each of the samples S1 to S5, the length of the element body 2 in the first direction D1 is set to 1.46 mm, the length of the element body 2 in the second direction D2 is set to 0.75 mm, The length in the three directions D3 is set to 0.75 mm.

In the sample S1, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is set to “40%”. At this time, the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 is “0.2”. The maximum thickness T _RSmax is 30 μm, and the thickness T _RS1 is 12 μm. The lengths L _RS1 and L _RS2 are 120 μm, and the lengths L _SE1 and L _SE2 are 24 μm.

In the sample S2, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is set to “50%”. At this time, the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 is “0.6”. The maximum thickness T _RSmax is 30 μm, and the thickness T _RS1 is 15 μm. The lengths L _RS1 and L _RS2 are 120 μm, and the lengths L _SE1 and L _SE2 are 72 μm.

In the sample S3, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is set to “100%”. At this time, the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 is “1.0”. The maximum thickness T _RSmax is 30 μm, and the thickness T _RS1 is 30 μm. The lengths L _RS1 and L _RS2 are 120 μm, and the lengths L _SE1 and L _SE2 are 120 μm.

In the sample S4, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is set to “50%”. At this time, the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 is “1.6”. The maximum thickness T _RSmax is 30 μm, and the thickness T _RS1 is 15 μm. The lengths L _RS1 and L _RS2 are 120 μm, and the lengths L _SE1 and L _SE2 are 192 μm.

In the sample S5, the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is set to “40%”. At this time, the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 is “1.8”. The maximum thickness T _RSmax is 30 μm, and the thickness T _RS1 is 12 μm. The lengths L _RS1 and L _RS2 are 120 μm, and the lengths L _SE1 and L _SE2 are 216 μm.

  When a bending stress was applied to the substrate so that the amount of bending of the substrate was “5.0 mm”, in Samples S1 and S5, occurrence of cracks in the element body was confirmed. On the other hand, in sample S2, sample S3, and sample S4, the generation of cracks in the element body was not confirmed.

  When bending stress was applied to the substrate so that the amount of bending of the substrate was “7.0 mm”, generation of cracks was confirmed in the sample bodies S1, S4, and S5. On the other hand, in sample S2 and sample S3, the generation of cracks in the element body was not confirmed.

From the above, when the ratio of the thickness T _RS1 to the maximum thickness T _RSmax is 50% or more, a decrease in the stress relaxation effect is suppressed. Furthermore, when the ratio of the lengths L _SE1 and L _SE2 to the lengths L _RS1 and L _RS2 is in the range of 0.6 to 1.0, it is further suppressed that the stress relaxation effect is lowered.

  The edge part of the 1st electrode layer 21 which the electrode parts 4b and 5b contain is located in the outer side of the coil 15 seeing from the 2nd direction D2. As a result, the stress concentrates on the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b, and even if a crack occurs in the element body starting from the end portion, the generated crack is generated in the coil 15. Difficult to reach. Therefore, even when a crack occurs in the element body 2, the crack hardly affects the coil 15, and the deterioration of the electrical characteristics of the multilayer coil component 1 is suppressed.

  Stress is less likely to concentrate at the end of the second electrode layer 23 included in the electrode portions 4b and 5b than at the end of the first electrode layer 21 included in the electrode portions 4b and 5b. Therefore, the end portion of the second electrode layer 23 included in the electrode portions 4b and 5b may overlap the coil 15 when viewed from the second direction D2.

  The first electrode layer 21 is composed of a sintered metal layer. Since the sintered metal layer is a layer formed by sintering the metal component (metal powder) contained in the conductive paste, the sintered metal layer is unlikely to be a uniform metal layer. Is difficult to control. The sintered metal layer may exhibit a shape (such as a mesh shape) in which a plurality of openings (through holes) are formed, for example.

  The second electrode layer 23 is a layer in which metal powder is dispersed in a cured resin. In the second electrode layer 23, a current path is formed when the metal powders are in contact with each other. It is difficult to control the dispersion state of the metal powder in the resin, and the position of the current path in the second electrode layer 23 is difficult to control.

  For these reasons, the current paths in the second electrode layer 23 and the first electrode layer 21 are different for each product. Depending on the product, for example, a row of metal powder is formed at the position of the maximum thickness of the second electrode layer 23 included in the electrode portions 4a and 5a, and the metal powder and the mesh-shaped first electrode layer 21 are in contact with each other. . In this product, when viewed from the first direction D1, the position where the other ends of the connection conductors 17 and 18 are exposed on the end surfaces 2b and 2a and the position of the maximum thickness of the second electrode layer 23 included in the electrode portions 5a and 4a. Since the current flows into the other end of the connection conductors 17 and 18 through the current path formed at the position of the maximum thickness of the second electrode layer 23 included in the electrode portions 4a and 5a, the direct current resistance Is expensive. In order to obtain a product with low DC resistance, even when a current path is formed at the position of the maximum thickness of the second electrode layer 23 included in the electrode portions 5a and 4a, the probability that current flows through the current path is low. It is necessary to adopt.

  In the laminated coil component 1 according to the present embodiment, when viewed from the first direction D1, the positions where the other ends of the connection conductors 17 and 18 are exposed on the end faces 2b and 2a and the second electrodes included in the electrode portions 4a and 5a. Since the position of the maximum thickness of the layer 23 is different, the connecting conductors 17 and 18 pass through the current path formed at a position other than the position of the maximum thickness of the second electrode layer 23 included in the electrode portions 4a and 5a. There is a high possibility that electricity will flow to the other end of the. Therefore, according to this embodiment, it is difficult to obtain the laminated coil component 1 having a high DC resistance.

The edge part of the 1st electrode layer 21 which the electrode part 4b contains is located in the end surface 2a side rather than the position of the maximum thickness _TRSmax of the 2nd electrode layer 23 which the electrode part 4b contains when seeing from the 2nd direction D2. . In this case, the end portion of the first electrode layer 21 included in the electrode portion 4b is compared to the configuration in which the end portion 2a is positioned farther from the position of the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portion 4b. Thus, the end portion of the first electrode layer 21 included in the electrode portion 4 b is separated from the coil 15.

The edge part of the 1st electrode layer 21 which the electrode part 5b contains is located in the end surface 2b side rather than the position of maximum thickness _TRSmax of the 2nd electrode layer 23 which the electrode part 5b contains seeing from the 2nd direction D2. . In this case, the end portion of the first electrode layer 21 included in the electrode portion 5b is compared to the configuration in which the end portion 2b is positioned farther from the position of the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portion 5b. Thus, the end portion of the first electrode layer 21 included in the electrode portion 5 b is separated from the coil 15.

  As described above, since the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b is separated from the coil 15, the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b is used as a starting point. Even if a crack is generated in the coil, the generated crack is difficult to reach the coil 15. Therefore, even when a crack occurs in the element body 2, the crack hardly affects the coil 15, and the deterioration of the electrical characteristics of the multilayer coil component 1 is suppressed.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  In the above embodiment, the external electrodes 4 and 5 have been described as an example in which the external electrodes 4 and 5 include the electrode portions 4a and 5a, the electrode portions 4b and 5b, and the electrode portions 4c and 5c. However, the shape of the external electrode is not limited to this. For example, the external electrode 4 may be formed only on the end surface 2a and the one main surface 2c, and the external electrode 5 may be formed only on the end surface 2b and the one main surface 2c. In this case, the main surface 2c is a mounting surface.

The thickness T _RS1 of the second electrode layer 23 located on the end portion of the first electrode layer 21 included in the electrode portions 4b and 5b is 50% of the maximum thickness T _RSmax of the second electrode layer 23 included in the electrode portions 4b and 5b. if more than, the length _{L SE1, L SE2} may be of length _{L RS1, L RS2} above. From the viewpoint of suppressing deterioration of the electrical characteristics of the laminated coil component 1 described above, the lengths L _SE1 and L _SE2 are preferably smaller than the lengths L _RS1 and L _RS2 .

The thickness T _RS1 may be less than 50% of the maximum thickness T _RSmax . From the viewpoint of suppressing the decrease in the stress relaxation effect of the laminated coil component 1 described above, the thickness T _RS1 is preferably 50% or more of the maximum thickness T _RSmax .

  When viewed from the first direction D1, the positions at which the other ends of the connection conductors 17 and 18 on the end faces 2b and 2a are exposed overlap the position of the maximum thickness of the second electrode layer 23 included in the electrode portions 4a and 5a. May be. In order to make it difficult to obtain the laminated coil component 1 having a high direct current resistance, as described above, the positions where the other ends of the connection conductors 17 and 18 on the end faces 2b and 2a are exposed and the electrode portions 4a and 5a include The position of the maximum thickness of the two electrode layer 23 is preferably different.

  DESCRIPTION OF SYMBOLS 1 ... Laminated coil component, 2 ... Element body, 2a, 2b ... End face, 2c, 2d ... Main surface, 4, 5 ... External electrode, 15 ... Coil, 16a-16f ... Coil conductor, 17, 18 ... Connection conductor, 21 ... 1st electrode layer, 23 ... 2nd electrode layer.

Claims (5)

With the body,
A coil disposed in the element;
An external electrode disposed on the surface of the element body and electrically connected to the coil;
The prime field is
The main surface that is the mounting surface,
An end face located adjacent to the main surface and extending in a direction intersecting with the main surface;
The external electrode is
A base metal layer formed on the main surface and the end surface;
A conductive resin layer formed so as to cover the base metal layer,
The laminated coil component, wherein an end portion of the base metal layer located on the main surface is located outside the coil when viewed from a direction orthogonal to the main surface.   2. The laminated coil according to claim 1, wherein a thickness of the conductive resin layer at the end of the base metal layer is 50% or more of a maximum thickness of a portion located on the main surface of the conductive resin layer. parts.   The end surface with respect to the length from the reference surface in a direction orthogonal to the end surface to the position of the maximum thickness in the portion located on the main surface of the conductive resin layer, with the surface including the end surface as a reference surface The multilayer coil component according to claim 2, wherein a ratio of a length from the reference surface to the end portion of the base metal layer in a direction orthogonal to the base metal layer is 0.6 to 1.0. Further comprising a conductor disposed in the element body and having one end connected to the coil and the other end exposed to the end face and connected to the base metal layer;
The position where the other end of the conductor on the end face is exposed and the position of the maximum thickness in the portion located on the end face of the conductive resin layer are different from each other when viewed from the direction orthogonal to the end face. The laminated coil component according to any one of claims 1 to 3.   The end portion of the base metal layer is located on the end face side with respect to the position of the maximum thickness in the portion located on the main face of the conductive resin layer as seen from the direction orthogonal to the main face. The laminated coil component according to any one of claims 1 to 4.

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