WO2018123732A1 - Carte d'interconnexion, procédé de production et dispositif extensible - Google Patents

Carte d'interconnexion, procédé de production et dispositif extensible Download PDF

Info

Publication number
WO2018123732A1
WO2018123732A1 PCT/JP2017/045535 JP2017045535W WO2018123732A1 WO 2018123732 A1 WO2018123732 A1 WO 2018123732A1 JP 2017045535 W JP2017045535 W JP 2017045535W WO 2018123732 A1 WO2018123732 A1 WO 2018123732A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin layer
rubber
wiring board
meth
acrylate
Prior art date
Application number
PCT/JP2017/045535
Other languages
English (en)
Japanese (ja)
Inventor
剛史 正木
崇司 川守
薫平 山田
タンイー シム
禎宏 小川
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to JP2018559089A priority Critical patent/JP7124711B2/ja
Publication of WO2018123732A1 publication Critical patent/WO2018123732A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the present disclosure relates to a wiring board, a manufacturing method thereof, and a stretchable device.
  • Patent Document 1 As described in Patent Document 1, by providing the sealing material with elasticity, it became possible to realize a member having elasticity that was difficult with a conventional sealing material. On the other hand, since the base substrate does not have stretchability, it has been difficult to provide higher stretchability. Therefore, a wiring board having higher stretchability is required. Further, there is a demand for a wiring board that has higher stretchability and can be interlayer-connected at the time of lamination.
  • an object of the present disclosure is to provide a wiring board having high stretchability and capable of interlayer connection during lamination, a manufacturing method thereof, and a stretchable device.
  • the inventors of the present invention provide high stretchability by using a stretchable resin layer for the base substrate, and combines the stretchable resin layer and the conductive foil, It has been found that the above problem can be solved by providing a via hole in the stretchable resin layer.
  • a wiring board having a stretchable resin layer, a conductor foil provided on the stretchable resin layer and forming a wiring pattern, and a via hole provided in the stretchable resin layer.
  • the stretchable resin layer contains (A) a rubber component, and the rubber component is acrylic rubber, isoprene rubber, butyl rubber, styrene butadiene rubber, butadiene rubber, acrylonitrile butadiene rubber, silicone rubber, urethane rubber, chloroprene.
  • the stretchable resin layer includes (A) a cured product of a resin composition containing a rubber component.
  • the rubber component (A) includes a rubber having a crosslinking group.
  • the crosslinking group is at least one of an acid anhydride group or a carboxyl group.
  • the resin composition further contains (B) a crosslinking component, and the crosslinking component is a (meth) acryl group, vinyl group, epoxy group, styryl group, amino group, isocyanurate group, ureido group, cyanate.
  • a stretchable device comprising the wiring board according to any one of [1] to [13] and an electronic element mounted on the wiring board.
  • the present disclosure it is possible to provide a wiring board that has high stretchability and enables interlayer connection at the time of lamination, a manufacturing method thereof, and a stretchable device. Further, by using the wiring board provided by the present disclosure, it is possible to form a multilayer wiring board having elasticity and high density.
  • FIG. 6 is a stress-strain curve showing an example of measurement of recovery rate. It is a top view which shows one Embodiment of a wiring board. It is a graph which shows the temperature profile of a heat resistance test.
  • (meth) acrylate means at least one of acrylate and methacrylate corresponding thereto.
  • the materials exemplified below may be used alone or in combination of two or more unless otherwise specified.
  • the numerical range indicated by using “to” indicates a range including the numerical values described before and after “to” as the minimum value and the maximum value, respectively. “A or B” only needs to include either A or B, and may include both.
  • the upper limit value or lower limit value of a numerical range of a certain step may be replaced with the upper limit value or lower limit value of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples (reference examples).
  • a wiring board includes a stretchable resin layer, a conductor foil provided on the stretchable resin layer and forming a wiring pattern, and a via hole provided in the stretchable resin layer.
  • FIG. 1 is a cross-sectional view showing an embodiment of a wiring board.
  • a wiring board 100 shown in FIG. 1 is formed on a stretchable resin layer 10 as a base material, a conductive foil 20 provided on the stretchable resin layer 10 and forming a wiring pattern, and the stretchable resin layer 10.
  • the wiring board according to the present embodiment uses a base material formed from the stretchable resin layer 10, and thus has excellent stretchability compared to the case where a conventional substrate is used, and does not form the via hole 30.
  • the electroless copper plating layer 40 By forming the electroless copper plating layer 40 by performing electrolytic copper plating, interlayer connection is possible, and a wiring design equivalent to a conventional wiring board is possible. Thereby, it is possible to manufacture a multilayer wiring board having excellent stretchability and capable of high-density wiring.
  • the diameter (hole diameter) D of the opening before forming the electroless copper plating layer 40 of the via hole 30 is preferably 10 ⁇ m or more, and more preferably 40 ⁇ m or more from the viewpoint of the depositability of the electroless copper plating. From the relationship between via processability and wiring density, it is preferably 500 ⁇ m or less, and more preferably 250 ⁇ m or less.
  • the thickness of the electroless copper plating layer 40 is not particularly limited, but is preferably 0.1 to 1.5 ⁇ m, and preferably 0.3 to 1.0 ⁇ m from the viewpoint of adhesion with the stretchable resin layer 10. It is more preferable.
  • electrolytic copper plating may be further performed on the electroless copper plating layer 40 to form an electrolytic copper plating layer.
  • the thickness of the electrolytic copper plating layer is not particularly limited, but is preferably 1 to 100 ⁇ m, more preferably 10 to 50 ⁇ m from the viewpoint of via hole connection reliability.
  • the width W from the end face of the via hole 30 of the land part 50 is preferably 10 ⁇ m or more, and more preferably 100 ⁇ m or more in order to maintain the interlayer connection by the electroless copper plating layer 40 when the substrate is stretched.
  • the land portion 50 is a conductor layer provided around the via hole 30 and is preferably formed concentrically with the via hole 30 on the surface of the stretchable resin layer 10.
  • the land portion 50 may be made of the same material as that of the conductor foil 20 described later.
  • the diameter of the land portion 50 on the surface of the stretchable resin layer 10 is adjusted so that the width W of the land portion 50 falls within the above range.
  • the conductor foil 20 may form a corrugated wiring pattern that meanders along the direction from the near side to the far side in FIG.
  • the elastic modulus of the conductor foil 20 may be 40 to 300 GPa.
  • the elastic modulus of the conductor foil may be 50 GPa or more or 280 GPa or more, or 60 GPa or less, or 250 GPa or less.
  • the elastic modulus of the conductor foil here can be a value measured by a resonance method.
  • the conductor foil can be a metal foil.
  • metal foil copper foil, titanium foil, stainless steel foil, nickel foil, permalloy foil, 42 alloy foil, kovar foil, nichrome foil, beryllium copper foil, phosphor bronze foil, brass foil, white foil, aluminum foil, tin foil, Lead foil, zinc foil, solder foil, iron foil, tantalum foil, niobium foil, molybdenum foil, zirconium foil, gold foil, silver foil, palladium foil, monel foil, inconel foil, hastelloy foil and the like.
  • the conductor foil is preferably selected from copper foil, gold foil, nickel foil, and iron foil. From the viewpoint of wiring formability, it is preferable to use a copper foil.
  • electrolytic copper foil there is no restriction
  • the electrolytic copper foil and rolled copper foil generally used for a copper clad laminated board, a flexible wiring board, etc. can be used.
  • Commercially available electrolytic copper foils include, for example, F0-WS-18 (trade name, manufactured by Furukawa Electric Co., Ltd.), NC-WS-20 (trade name, manufactured by Furukawa Electric Co., Ltd.), YGP-12 (Japan Electrolytic ( (Trade name), GTS-18 (trade name, manufactured by Furukawa Electric Co., Ltd.), and F2-WS-12 (trade name, manufactured by Furukawa Electric Co., Ltd.).
  • Examples of rolled copper foil include TPC foil (manufactured by JX Metals Co., Ltd., trade name), HA foil (manufactured by JX Metals Co., Ltd., trade name), and HA-V2 foil (manufactured by JX Metals Co., Ltd., trade name). , And C1100R (trade name, manufactured by Sumitomo Mitsui Metal Mining Co., Ltd.). From the viewpoint of further improving the adhesiveness with the stretchable resin layer, it is preferable to use a copper foil that has been subjected to a roughening treatment. Moreover, it is preferable to use a rolled copper foil from the viewpoint of folding resistance and stretchability.
  • the stretchable resin layer 10 can have stretchability such that the recovery rate after tensile deformation to 20% strain is 80% or more.
  • This recovery rate is calculated
  • the recovery rate can be measured with X as 20%.
  • FIG. 2 is a stress-strain curve showing an example of measuring the recovery rate. If the recovery rate is 80% or more, it can withstand repeated use, so the recovery rate is more preferably 85% or more, and still more preferably 90% or more.
  • the elastic modulus of the stretchable resin layer is preferably from 0.1 MPa to 1000 MPa.
  • the elastic modulus is 0.1 MPa or more and 1000 MPa or less, the handleability and flexibility as a substrate tend to be particularly excellent.
  • the elastic modulus is more preferably 0.3 MPa or more and 100 MPa or less, and further preferably 0.5 MPa or more and 50 MPa or less.
  • the elongation at break of the stretchable resin layer is preferably 100% or more. When the elongation at break is 100% or more, sufficient stretchability tends to be obtained. In this respect, the elongation at break is more preferably 150% or more, further preferably 200% or more, particularly preferably 300% or more, and extremely preferably 500% or more.
  • the upper limit of the elongation at break is not particularly limited, but is usually about 1000% or less.
  • the stretchable resin layer can contain (A) a rubber component.
  • the rubber component easily imparts stretchability to the stretchable resin layer.
  • the rubber component content may be 30 to 100% by mass with respect to 100% by mass of the stretchable resin layer.
  • Rubber components include, for example, acrylic rubber, isoprene rubber, butyl rubber, styrene butadiene rubber, butadiene rubber, acrylonitrile butadiene rubber, silicone rubber, urethane rubber, chloroprene rubber, ethylene propylene rubber, fluorine rubber, sulfurized rubber, epichlorohydrin rubber, and chlorinated rubber. At least one of butyl rubber can be included. From the viewpoint of protecting the wiring from damage due to moisture absorption or the like, it is preferable that the gas permeability of the rubber component is low. From this viewpoint, the rubber component may be at least one selected from styrene butadiene rubber, butadiene rubber, and butyl rubber.
  • acrylic rubber examples include “Nipol AR Series” manufactured by Nippon Zeon Co., Ltd. and “Clarity Series” manufactured by Kuraray Co., Ltd.
  • Examples of commercially available isoprene rubber include “Nipol IR series” manufactured by Nippon Zeon Co., Ltd.
  • butyl rubber examples include “BUTYL Series” manufactured by JSR Corporation.
  • Examples of commercially available styrene butadiene rubber include “Dynalon SEBS Series”, “Dynalon HSBR Series” manufactured by JSR Corporation, “Clayton D Polymer Series” manufactured by Kraton Polymer Japan Co., Ltd., and Aron Kasei Co., Ltd. "AR series”.
  • Examples of commercially available butadiene rubber include “Nipol BR series” manufactured by Nippon Zeon Co., Ltd.
  • Examples of commercially available acrylonitrile butadiene rubber include “JSR NBR series” manufactured by JSR Corporation.
  • silicone rubber examples include “KMP series” manufactured by Shin-Etsu Silicone Co., Ltd.
  • Examples of commercially available ethylene propylene rubber include “JSR EP Series” manufactured by JSR Corporation.
  • fluoro rubber products examples include “DAIEL Series” manufactured by Daikin Corporation.
  • the rubber component can also be produced by synthesis.
  • acrylic rubber can be obtained by reacting (meth) acrylic acid, (meth) acrylic acid ester, aromatic vinyl compound, vinyl cyanide compound and the like.
  • the rubber component may contain a rubber having a crosslinking group.
  • the cross-linking group may be a reactive group capable of causing a reaction to cross-link the molecular chain of the rubber component. Examples thereof include a reactive group, an acid anhydride group, an amino group, a hydroxyl group, an epoxy group, and a carboxyl group that the (B) crosslinking component described later has.
  • the rubber component may contain a rubber having at least one crosslinking group out of an acid anhydride group or a carboxyl group.
  • rubbers having acid anhydride groups include rubbers that are partially modified with maleic anhydride.
  • Rubber partially modified with maleic anhydride is a polymer containing structural units derived from maleic anhydride.
  • As a commercial product of rubber partially modified with maleic anhydride for example, there is a styrene elastomer “Tufprene 912” manufactured by Asahi Kasei Corporation.
  • the rubber partially modified with maleic anhydride may be a hydrogenated styrene elastomer partially modified with maleic anhydride.
  • the hydrogenated styrene-based elastomer can be expected to have an effect of improving weather resistance.
  • the hydrogenated styrene-based elastomer is an elastomer obtained by adding hydrogen to an unsaturated double bond of a styrene-based elastomer having a soft segment including an unsaturated double bond.
  • Examples of commercially available hydrogenated styrene elastomers partially modified with maleic anhydride include “FG1901” and “FG1924” manufactured by Kraton Polymer Japan Co., Ltd., and “Tuftec M1911” manufactured by Asahi Kasei Corporation. , “Tuff Tech M1913” and “Tuff Tech M1943”.
  • the weight average molecular weight of the rubber component may be 20,000 to 200,000, 30,000 to 150,000, or 50,000 to 125,000 from the viewpoint of coating properties.
  • the weight average molecular weight (Mw) here means a standard polystyrene conversion value determined by gel permeation chromatography (GPC).
  • the stretchable resin layer may be a cured product of a resin composition containing (A) a rubber component.
  • a curable resin composition is used as the resin composition for forming the stretchable resin layer.
  • This curable resin composition may further contain, for example, (B) a crosslinking component. That is, the stretchable resin layer may further contain (B) a crosslinked polymer of a crosslinking component.
  • the crosslinking component is, for example, selected from the group consisting of (meth) acrylic group, vinyl group, epoxy group, styryl group, amino group, isocyanurate group, ureido group, cyanate group, isocyanate group, mercapto group, hydroxyl group, and carboxyl group.
  • the crosslinking component may be a compound having a reactive group selected from an epoxy group, an amino group, a hydroxyl group, and a carboxyl group. These compounds can be used alone or in combination of two or more.
  • (A) (meth) acrylate compound is mentioned as a compound which has a (meth) acryl group.
  • the (meth) acrylate compound may be monofunctional, bifunctional or polyfunctional, and is not particularly limited, but bifunctional or polyfunctional (meth) acrylate is preferred in order to obtain sufficient curability.
  • Examples of the monofunctional (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, butoxyethyl (meth) acrylate, Isoamyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octylheptyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate , Lauryl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate,
  • (Meth) acrylate cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, cyclopentyl (meth) acrylate, dicyclopentanyl (me ) Acrylate, dicyclopentenyl (meth) acrylate, isobornyl (meth) acrylate, mono (2- (meth) acryloyloxyethyl) tetrahydrophthalate, mono (2- (meth) acryloyloxyethyl) hexahydrophthalate, etc.
  • bifunctional (meth) acrylate examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate.
  • modified caprolactones such as neopentyl glycol type epoxy (meth) acrylate; cyclohexanedimethanol type epoxy (meth) acrylate, hydrogenated bisphenol A type epoxy (meth) acrylate, hydrogenated bisphenol Cycloaliphatic epoxy (meth) acrylates such as F type epoxy (meth) acrylate; and resorcinol type epoxy (meth) acrylate, bisphenol A type epoxy (meth) acrylate, bisphenol F type e Carboxymethyl (meth) acrylate, bisphenol AF type epoxy (meth) acrylates, and aromatic epoxy (meth) acrylates such as fluorene epoxy (meth) acrylate.
  • the aliphatic (meth) acrylate and the aromatic (meth) acrylate are preferable from the viewpoint of compatibility with the styrene-based elastomer, transparency, and heat resistance.
  • Examples of the trifunctional or higher polyfunctional (meth) acrylate include trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, and ethoxylated propoxylated tri Methylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, ethoxylated pentaerythritol tri (meth) acrylate, propoxylated pentaerythritol tri (meth) acrylate, ethoxylated propoxylated pentaerythritol tri (meth) acrylate, pentaerythritol Tetra (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, propoxylated pentaerythri
  • the compound containing an epoxy group is not particularly limited as long as it has an epoxy group in the molecule, and can be, for example, a general epoxy resin.
  • the epoxy resin may be monofunctional, bifunctional, or polyfunctional, and is not particularly limited, but a bifunctional or polyfunctional epoxy resin is preferable in order to obtain sufficient curability.
  • Examples of the epoxy resin include bisphenol A type, bisphenol F type, phenol novolac type, naphthalene type, dicyclopentadiene type, and cresol novolac type.
  • An epoxy resin modified with a fatty chain is preferred because flexibility can be imparted.
  • Examples of commercially available fatty chain-modified epoxy resins include EXA-4816 manufactured by DIC Corporation. From the viewpoints of curability, low tack, and heat resistance, a phenol novolac type, a cresol novolac type, a naphthalene type, and a dicyclopentadiene type may be selected. These epoxy resins can be used alone or in combination of two or more.
  • the content of the crosslinked polymer formed from the crosslinking component is preferably 10 to 50% by mass based on the mass of the stretchable resin layer. If the content of the cross-linked polymer formed from the cross-linking component is in the above range, the adhesion with the conductor foil tends to be improved while maintaining the properties of the stretchable resin layer. From the above viewpoint, the content of the crosslinked polymer formed from the crosslinking component is more preferably 15 to 40% by mass. The content of the crosslinking component in the resin composition for forming the stretchable resin layer may be within these ranges.
  • the stretchable resin layer or the resin composition used to form it can further contain an additive as the component (C).
  • the additive may be at least one of a curing agent or a curing accelerator.
  • the curing agent is a compound that itself participates in the curing reaction
  • the curing accelerator is a compound that functions as a catalyst for the curing reaction.
  • a compound having both functions of a curing agent and a curing accelerator can also be used.
  • the curing agent may be a polymerization initiator. These can be appropriately selected according to other components contained in the resin composition. For example, if it is a resin composition containing a (meth) acrylate compound, a polymerization initiator may be added.
  • the polymerization initiator is not particularly limited as long as it initiates polymerization by heating or irradiation with ultraviolet rays or the like.
  • a thermal radical polymerization initiator or a photo radical polymerization initiator can be used. If it is a thermal radical initiator, it is preferable at the point that reaction of a resin composition advances uniformly. If it is a photo radical initiator, since normal temperature hardening is possible, it is preferable at the point which prevents the deterioration by the heat
  • thermal radical polymerization initiator examples include ketone peroxides such as methyl ethyl ketone peroxide, cyclohexanone peroxide, and methylcyclohexanone peroxide; 1,1-bis (t-butylperoxy) cyclohexane, 1,1-bis (t-Butylperoxy) -2-methylcyclohexane, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylperoxy) cyclohexane, 1,1- Peroxyketals such as bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane; hydroperoxides such as p-menthane hydroperoxide; ⁇ , ⁇ ′-bis (t-butylperoxy) diisopropylbenzene , Dicumyl peroxide, t-butyl cumyl peroxy Dial
  • radical photopolymerization initiators include benzoin ketals such as 2,2-dimethoxy-1,2-diphenylethane-1-one; 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropane- ⁇ -hydroxy ketones such as 1-one, 1- [4- (2-hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one; 2-benzyl-2-dimethylamino-1 ⁇ -amino ketones such as-(4-morpholinophenyl) -butan-1-one, 1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one; Oxime esters such as 4- (phenylthio) phenyl] -1,2-octadion-2- (benzoyl) oxime; bis (2,4,6-tri Phosphine oxides such as methylbenzoyl) phenylphosphine oxide
  • the substituents of the aryl groups at the two triarylimidazole sites may give the same and symmetrical compounds, or differently give asymmetrical compounds.
  • a thioxanthone compound and a tertiary amine may be combined.
  • thermal and photo radical polymerization initiators can be used alone or in combination of two or more. Furthermore, it can also be used in combination with a suitable sensitizer.
  • the curable resin composition for forming the stretchable resin layer contains (A) a rubber component, (B) a crosslinking component, and a curing agent as the (C) component, it contains a curing agent (or a polymerization initiator).
  • the amount is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the rubber component and the crosslinking component.
  • the content of the curing agent (or polymerization initiator) is 0.1 parts by mass or more, sufficient curing tends to be easily obtained.
  • the content of the curing agent (or polymerization initiator) is 10 parts by mass or less, sufficient light transmittance tends to be easily obtained.
  • the content of the curing agent (or polymerization initiator) is more preferably 0.3 to 7 parts by mass, and further preferably 0.5 to 5 parts by mass.
  • the curing agent may contain at least one selected from the group consisting of aliphatic polyamines, polyaminoamides, polymercaptans, aromatic polyamines, acid anhydrides, carboxylic acids, phenol novolac resins, ester resins, and dicyandiamide. These curing agents can be used in combination with, for example, a compound having an epoxy group (epoxy resin).
  • a curing accelerator selected from tertiary amine, imidazole, acid anhydride, and phosphine may be added as a component (C) to the resin composition containing an epoxy resin. From the viewpoint of storage stability and curability of the varnish, it is preferable to use imidazole.
  • the rubber component includes a rubber partially modified with maleic anhydride, an imidazole compatible with the rubber may be selected.
  • the content of imidazole is 100 parts by mass with respect to the total amount of the rubber component and the crosslinking component. It may be 0.1 to 10 parts by mass. When the content of imidazole is 0.1 parts by mass or more, sufficient curing tends to be easily obtained. When the content of imidazole is 10 parts by mass or less, sufficient heat resistance tends to be obtained. From the above viewpoint, the imidazole content may be 0.3 to 7 parts by mass, or 0.5 to 5 parts by mass.
  • the content of the rubber component is (A) the rubber component, (B It may be 30-98% by weight, 50-97% by weight, or 60-95% by weight, based on the total amount of)) crosslinking component and (C) additive.
  • the content of the rubber component is 30% by mass or more, sufficient stretchability is easily obtained.
  • the stretchable resin layer tends to have particularly excellent characteristics in terms of adhesion, insulation reliability, and heat resistance.
  • the stretchable resin layer or the resin composition for forming the resin layer may contain an antioxidant, a yellowing inhibitor, an ultraviolet absorber, a visible light absorber, a colorant, a plasticizer, if necessary.
  • An agent, a stabilizer, a filler, a flame retardant, a leveling agent, and the like may be further included as long as the effects of the present disclosure are not significantly impaired.
  • the stretchable resin layer is obtained by, for example, dissolving or dispersing a coupling agent, a rubber component and, if necessary, other components in an organic solvent to obtain a resin varnish, and the resin varnish on a conductor foil or carrier film by a method described later. It can manufacture by the method including forming into a film.
  • the organic solvent used here is not particularly limited, and examples thereof include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; acetone, methyl ethyl ketone, Ketones such as methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, ⁇ -butyrolactone; ethylene carbonate, propylene carbonate, etc.
  • aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene and p-cymene
  • cyclic ethers such as tetrahydrofuran and 1,4-dioxane
  • organic solvents can be used alone or in combination of two or more. From the viewpoint of solubility and boiling point, toluene or N, N-dimethylacetamide may be used.
  • concentration of solids (components other than organic solvents) in the resin varnish is usually preferably 20 to 80% by mass.
  • the material of the carrier film is not particularly limited, but for example, polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate; polyolefins such as polyethylene and polypropylene; polycarbonates, polyamides, polyimides, polyamideimides, polyetherimides , Polyether sulfide, polyether sulfone, polyether ketone, polyphenylene ether, polyphenylene sulfide, polyarylate, polysulfone and liquid crystal polymer.
  • polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate
  • polyolefins such as polyethylene and polypropylene
  • polycarbonates polyamides, polyimides, polyamideimides, polyetherimides , Polyether sulfide, polyether sulfone, polyether ketone, polyphenylene ether, polyphenylene sulfide
  • a polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polypropylene, polycarbonate, polyamide, polyimide, polyamideimide, polyphenylene ether, polyphenylene sulfide, polyarylate, or polysulfone film is a carrier. It may be used as a film.
  • the thickness of the carrier film is not particularly limited, but is preferably 3 to 250 ⁇ m. When it is 3 ⁇ m or more, the film strength is sufficient, and when it is 250 ⁇ m or less, sufficient flexibility is obtained. From the above viewpoint, the thickness is more preferably 5 to 200 ⁇ m, and further preferably 7 to 150 ⁇ m. From the viewpoint of improving releasability from the stretchable resin layer, a film obtained by subjecting the base film to a release treatment with a silicone compound, a fluorine-containing compound, or the like may be used as necessary.
  • a protective film may be attached on the stretchable resin layer to form a laminated film having a three-layer structure including a conductor foil or a carrier film, a stretchable resin layer, and a protective film.
  • the material of the protective film is not particularly limited, and examples thereof include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefins such as polyethylene and polypropylene.
  • polyesters such as polyethylene terephthalate; and polyolefins such as polyethylene and polypropylene are preferable.
  • a release treatment may be performed with a silicone compound, a fluorine-containing compound, or the like.
  • the thickness of the protective film may be appropriately changed depending on the intended flexibility, but is preferably 10 to 250 ⁇ m. When the thickness is 10 ⁇ m or more, the film strength tends to be sufficient, and when it is 250 ⁇ m or less, sufficient flexibility tends to be obtained. From the above viewpoint, the thickness is more preferably 15 to 200 ⁇ m, and further preferably 20 to 150 ⁇ m.
  • the wiring board according to one embodiment includes, for example, a step of preparing a laminate having a stretchable resin layer and a conductive foil laminated on the stretchable resin layer, a step of forming a via hole in the stretchable resin layer, A step of forming a plating layer such as a copper plating layer on the inner wall surface of the via hole; a step of forming an etching resist on the conductive foil; and exposing the etching resist; developing the etched resist after the exposure; It can be manufactured by a method including a step of forming a resist pattern covering a part, a step of removing a portion of the conductor film not covered with the resist pattern, and a step of removing the resist pattern.
  • any method may be used. For example, a varnish of a resin composition for forming a stretchable resin layer is applied to a conductor foil. And a method of laminating a conductive foil on a stretchable resin layer formed on a carrier film by a vacuum press or a laminator.
  • the resin composition for forming the stretchable resin layer contains a crosslinking component
  • the stretchable resin layer is formed by advancing a crosslinking reaction (curing reaction) of the crosslinking component by heating or light irradiation.
  • Any method may be used for laminating the stretchable resin layer on the carrier film on the conductor foil.
  • a roll laminator, a vacuum laminator, a vacuum press, or the like is used. From the viewpoint of production efficiency, it is preferable to laminate using a roll laminator or a vacuum laminator.
  • the thickness of the stretchable resin layer after drying is not particularly limited, but is usually 5 to 1000 ⁇ m. Within the above range, sufficient strength of the stretchable base material can be easily obtained, and since the drying can be sufficiently performed, the amount of residual solvent in the resin film can be reduced.
  • a laminate having conductor foils formed on both sides of the stretchable resin layer may be produced by further laminating a conductor foil on the surface of the stretchable resin layer opposite to the conductor foil.
  • the via hole can be easily formed by drilling or laser processing.
  • drilling a through-hole shape can be formed.
  • laser processing a blind via shape can be formed in addition to a through-through hole shape, and the tolerance of wiring design can be further increased.
  • drilling or laser processing it is preferable to select drilling or laser processing depending on the shape and diameter of the via hole. It is preferable to use drilling when forming through vias and laser processing when forming non-penetrating blind via shapes.
  • a plating layer such as a copper plating layer can be formed by a known method. For example, after applying a plating catalyst for depositing palladium on the inner wall surface of a via hole, the electroless plating layer (conductor) having a thickness of 0.3 to 1.5 ⁇ m is immersed on the entire inner wall surface of the via hole by immersion in an electroless plating solution. Layer). If necessary, electrolytic plating (electroplating) can be further performed to adjust to a required thickness.
  • an electroless plating solution used for electroless plating a known electroless plating solution can be used, and there is no particular limitation.
  • a well-known method can be used also about electrolytic plating, and there is no restriction
  • a technique for forming a wiring pattern on a conductive foil of a laminated board wiring board forming laminated board
  • a technique using etching or the like is generally used.
  • a mixed solution of concentrated sulfuric acid and hydrogen peroxide, a ferric chloride solution, or the like can be used as the etching solution.
  • a land portion around the via hole can be formed together with the wiring pattern.
  • Etching resists used for etching include, for example, Fotec H-7005 (trade name, manufactured by Hitachi Chemical Co., Ltd.), Fotech H-7030 (trade name, manufactured by Hitachi Chemical Co., Ltd.), and X-87 (Taiyo Holdings Co., Ltd.). ), Product name).
  • the etching resist is usually removed after the wiring pattern is formed.
  • a stretchable device can be obtained by mounting various electronic elements on a wiring board.
  • Resin varnish B As component (A), hydrogenated styrene-butadiene rubber (manufactured by JSR Corporation, Dynalon 2324P, trade name) 20 g, as component (B), butanediol acrylate (manufactured by Hitachi Chemical Co., Ltd., FANCL FA-124AS, trade name) ) 5 g, and 0.4 g of bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (manufactured by BASF Corp., Irgacure 819, trade name) as component (C) and 15 g of toluene as a solvent while stirring.
  • the resin varnish B was obtained by mixing.
  • Resin varnish C (A) Acrylic polymer (manufactured by Kuraray Co., Ltd., Clarity LA2140, trade name) 20 g as component (A), aliphatic chain modified epoxy resin (DIC Corporation, EXA4816, trade name) 5 g as component (B), and (C) Resin varnish C was obtained by mixing 0.5 g of 2-phenylimidazole (manufactured by Shikoku Kasei Co., Ltd., 2PZ, trade name) as a component and 15 g of methyl ethyl ketone as a solvent while stirring.
  • 2-phenylimidazole manufactured by Shikoku Kasei Co., Ltd., 2PZ, trade name
  • the laminated film A was obtained by pasting as a protective film in such a direction that the release treatment surface was on the stretchable resin layer side.
  • the protective film of the laminated film A was peeled off, and the stretchable resin layer of the laminated film A was laminated on the roughened surface side of a copper foil (manufactured by Nippon Electrolytic Co., Ltd., YGP-12, trade name).
  • V130 manufactured by Nichigo-Morton Co., Ltd.
  • pressure-bonding was performed under the conditions of a pressure of 0.5 MPa, a temperature of 90 ° C., and a pressurization time of 60 seconds to produce a laminate with a conductor layer.
  • Reference Example 1-2 Except for changing resin varnish A to resin varnish B and copper foil to another copper foil (BHY-82F-HA-V2-12 ⁇ m, trade name, manufactured by JX Metals Co., Ltd.), the same as Reference Example 1-1 Thus, a laminate having a copper foil and an uncured resin layer was obtained. Thereafter, the resin layer was cured by irradiating 2000 mJ / cm 2 of ultraviolet rays (wavelength 365 nm) with an ultraviolet exposure machine (“ML-320FSAT” manufactured by Mikasa Co., Ltd.) to obtain a laminate with a conductor layer.
  • ML-320FSAT ultraviolet exposure machine manufactured by Mikasa Co., Ltd.
  • Reference Example 1-3 A laminate having a copper foil and an uncured resin layer was obtained in the same manner as in Reference Example 1-1 except that the resin varnish A was changed to the resin varnish C. Then, the resin layer was hardened on 180 degreeC 1 hour conditions using the dryer, and the laminated board with a conductor layer was obtained.
  • Comparative Reference Example 1-1 A laminate having a copper foil and an uncured resin layer was obtained in the same manner as in Reference Example 1-1 except that the resin varnish A was changed to the resin varnish D. Then, the resin layer was hardened on 180 degreeC 1 hour conditions using the dryer, and the laminated board with a conductor layer was obtained.
  • a test wiring board 1 having a stretchable resin layer 3 and a conductive foil 5 having a corrugated pattern formed on the stretchable resin layer 3 as a conductor layer was produced.
  • an etching resist manufactured by Hitachi Chemical Co., Ltd., Photoc RY-5325, product name
  • a photo tool having a corrugated pattern formed thereon is provided. Adhered.
  • the etching resist was exposed with an energy amount of 50 mJ / cm 2 using an EXM-1201 type exposure machine manufactured by Oak Manufacturing Co., Ltd.
  • Table 1 shows the evaluation results of Reference Examples 1-1 to 1-3 and Comparative Reference Example 1-1.
  • the stretchable resin layer does not break even when stretched by 10%, and the corrugated wiring pattern It turned out that there was no problem with the appearance.
  • Comparative Reference Example 1-1 since the resin layer did not have elasticity, it was found that the resin layer was broken before stretching by 10%, and the wiring was also broken at the same time.
  • a release-treated polyethylene terephthalate (PET) film (“Purex A31” manufactured by Teijin DuPont Films Ltd., thickness 25 ⁇ m) was prepared as a carrier film.
  • the resin varnish was applied onto the release-treated surface of this PET film using a knife coater ("SNC-350” manufactured by Yasui Seiki Co., Ltd.)
  • the coating film was dried ("MSO-80TPS” manufactured by Futaba Kagaku Co., Ltd.). )) was dried by heating at 100 ° C. for 20 minutes to form a resin layer having a thickness of 100 ⁇ m.
  • the same release treatment PET film as that of the carrier film was formed.
  • a laminated film was obtained by pasting as a protective film in the direction toward the resin layer side.
  • An electrolytic copper foil having a roughened surface with a surface roughness Ra of 1.5 ⁇ m on the exposed resin layer after peeling off the protective film of the laminated film (F2-WS-12, trade name, manufactured by Furukawa Electric Co., Ltd.) Were stacked in such a direction that the roughened surface was on the resin layer side.
  • an electrolytic copper foil is laminated to the resin layer under the conditions of a pressure of 0.5 MPa, a temperature of 90 ° C. and a pressurization time of 60 seconds using a vacuum pressure laminator (“V130” manufactured by Nikko Materials Co., Ltd.). did.
  • a conductive substrate having a stretchable resin layer, which is a cured product of the resin layer, and an electrolytic copper foil is heated by heating at 180 ° C. for 60 minutes in a dryer (“MSO-80TPS” manufactured by Futaba Kagaku Co., Ltd.). Obtained.
  • Reference Example 2-2 Maleic anhydride-modified styrene ethylene butadiene rubber (manufactured by KRATON Co., Ltd., FG1924GT, trade name) 10 g, (B) component as dicyclopentadiene type epoxy resin (DIC Corporation, EPICLON HP7200H, trade name) 2.5 g, 1-benzyl-2-methylimidazole (manufactured by Shikoku Kasei Co., Ltd., 1B2MZ, trade name) 0.38 g as component (C) (curing accelerator), phenolic antioxidant (ADEKA Corporation) Made of AO-60, trade name) 0.1 g, and phosphite antioxidant (produced by ADEKA, 2112, trade name) 0.1 g and toluene 50 g were mixed with stirring to obtain a resin varnish. Obtained. Using the obtained resin varnish, a laminated film having a resin layer and a conductor substrate were produced in the same manner as in Reference Example 2-1.
  • thermo resistance test The laminated film was heated at 180 ° C. for 60 minutes to cure the resin layer, thereby forming a stretchable resin layer. After removing the carrier film and the protective film, the temperature of FIG. 4 conforming to IPC / JEDEC J-STD-020 is applied to the stretchable resin layer using a nitrogen reflow system (Tamura Seisakusho Co., Ltd., TNV-EN). A heat resistance test in which heat treatment was performed with a profile was performed. The elongation and tensile modulus of the stretchable resin layer before and after the heat resistance test were measured. The conductor substrate was also subjected to the same heat resistance test, and the 90 degree peel strength before and after the heat resistance test was measured.
  • the laminated film was heated at 180 ° C. for 60 minutes to cure the resin layer and form a stretchable resin layer.
  • the carrier film and the protective film were removed from the laminated film after curing, and a test piece of a laminated film having a length of 70 mm and a width of 20 mm was prepared.
  • the tack of the surface of the exposed resin layer was measured using a tacking tester (“TACII” manufactured by Resuka Co., Ltd.). The measurement conditions were set to a constant load mode, an immersion speed of 120 mm / min, a test speed of 600 mm / min, a load of 100 gf, a load holding time of 1 s, and a temperature of 30 ° C.
  • the stretchable resin layers of Reference Example 2-1 and Reference Example 2-2 maintained excellent stretchability and high adhesion to the copper foil even after the heat resistance test. Further, the tackiness of the resin layer was moderately low, and the handleability of the resin layer was excellent.
  • it has high stretchability and can be connected between layers at the time of lamination, and excellent stretchability even after a heat resistance test. And excellent adhesion between the copper foil and the stretchable resin layer can be maintained, and a wiring board having a reasonably low tack of the stretchable resin layer can be obtained.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

L'invention concerne une carte d'interconnexion 100 comprenant une couche de résine 10 extensible, une feuille conductrice 20 qui est disposée sur la couche de résine 10 extensible et qui forme un motif d'interconnexion ; et un trou d'interconnexion 30 ménagé dans la couche de résine 10 extensible.
PCT/JP2017/045535 2016-12-26 2017-12-19 Carte d'interconnexion, procédé de production et dispositif extensible WO2018123732A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018559089A JP7124711B2 (ja) 2016-12-26 2017-12-19 配線基板及びその製造方法、並びにストレッチャブルデバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016251400 2016-12-26
JP2016-251400 2016-12-26

Publications (1)

Publication Number Publication Date
WO2018123732A1 true WO2018123732A1 (fr) 2018-07-05

Family

ID=62707403

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/045535 WO2018123732A1 (fr) 2016-12-26 2017-12-19 Carte d'interconnexion, procédé de production et dispositif extensible

Country Status (3)

Country Link
JP (1) JP7124711B2 (fr)
TW (1) TWI753071B (fr)
WO (1) WO2018123732A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023042491A1 (fr) * 2021-09-16 2023-03-23 パナソニックＩｐマネジメント株式会社 Procédé de fabrication de carte de circuit étirable, feuille stratifiée plaquée de métal, feuille métallique avec résine, carte de circuit imprimé étirable et article monté sur circuit étirable
JP7426592B2 (ja) 2019-03-27 2024-02-02 パナソニックＩｐマネジメント株式会社 伸縮性回路基板

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112771110B (zh) * 2018-10-02 2022-11-04 纳美仕有限公司 树脂组合物、膜、层压板及半导体装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173371A (ja) * 2005-12-20 2007-07-05 Shinko Electric Ind Co Ltd フレキシブル配線基板の製造方法及び電子部品実装構造体の製造方法
JP2013187380A (ja) * 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465124B2 (ja) * 2010-07-30 2014-04-09 東海ゴム工業株式会社 柔軟配線体
CN106663638B (zh) 2014-11-18 2020-04-07 日立化成株式会社 半导体装置及其制造方法和挠性树脂层形成用树脂组合物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173371A (ja) * 2005-12-20 2007-07-05 Shinko Electric Ind Co Ltd フレキシブル配線基板の製造方法及び電子部品実装構造体の製造方法
JP2013187380A (ja) * 2012-03-08 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板およびその製造方法
JP2016178121A (ja) * 2015-03-18 2016-10-06 タツタ電線株式会社 ストレッチャブルケーブルおよびストレッチャブル回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7426592B2 (ja) 2019-03-27 2024-02-02 パナソニックＩｐマネジメント株式会社 伸縮性回路基板
WO2023042491A1 (fr) * 2021-09-16 2023-03-23 パナソニックＩｐマネジメント株式会社 Procédé de fabrication de carte de circuit étirable, feuille stratifiée plaquée de métal, feuille métallique avec résine, carte de circuit imprimé étirable et article monté sur circuit étirable

Also Published As

Publication number Publication date
JP7124711B2 (ja) 2022-08-24
JPWO2018123732A1 (ja) 2019-10-31
TW201828374A (zh) 2018-08-01
TWI753071B (zh) 2022-01-21

Similar Documents

Publication Publication Date Title
JP6624065B2 (ja) 半導体装置及びその製造方法、並びに可撓性樹脂層形成用樹脂組成物
KR102646349B1 (ko) 도체 기판, 배선 기판 및 배선 기판의 제조 방법
WO2018123732A1 (fr) Carte d'interconnexion, procédé de production et dispositif extensible
JP2018116959A (ja) 回路基板装置
JP7306381B2 (ja) 導体基板、伸縮性配線基板、及び配線基板用伸縮性樹脂フィルム
TWI751251B (zh) 帶金屬箔的伸縮性構件
JP2021027099A (ja) 導体基板、伸縮性配線基板、及び伸縮性樹脂フィルム
JP2017186433A (ja) 硬化性樹脂シート、可撓性電気回路体及び半導体装置
WO2018092328A1 (fr) Carte de circuit imprimé et son procédé de fabrication
JP7410633B2 (ja) 配線基板、ストレッチャブルデバイス、配線基板形成用積層板、及び配線基板を製造する方法
JP2019050333A (ja) ストレッチャブルデバイス及びその製造方法
JP2019197867A (ja) 導体基板の製造方法、導体基板、伸縮性配線基板及びストレッチャブルデバイス
JP7110711B2 (ja) 導体基板、配線基板、ストレッチャブルデバイス及び配線基板の製造方法
JP7439815B2 (ja) 配線基板及びその製造方法
WO2018092329A1 (fr) Carte de circuit imprimé et son procédé de fabrication
JP2018103524A (ja) 可撓性樹脂フィルム及び可撓性複合シート
JP2019160965A (ja) 導体基板、配線基板及びそれらの製造方法
JP2018116958A (ja) 回路基板装置の製造方法
JP2018111745A (ja) 可撓性樹脂形成用硬化性樹脂組成物、樹脂フィルム、電気回路体及び半導体装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17887626

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2018559089

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17887626

Country of ref document: EP

Kind code of ref document: A1