WO2018120299A1 - 一种摄像头基板组件、摄像头模组及终端设备 - Google Patents

一种摄像头基板组件、摄像头模组及终端设备 Download PDF

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Publication number
WO2018120299A1
WO2018120299A1 PCT/CN2017/071024 CN2017071024W WO2018120299A1 WO 2018120299 A1 WO2018120299 A1 WO 2018120299A1 CN 2017071024 W CN2017071024 W CN 2017071024W WO 2018120299 A1 WO2018120299 A1 WO 2018120299A1
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WO
WIPO (PCT)
Prior art keywords
camera
circuit board
support plate
printed circuit
mounting
Prior art date
Application number
PCT/CN2017/071024
Other languages
English (en)
French (fr)
Inventor
王光海
李存英
罗振东
田清山
王建文
李生
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP17889193.3A priority Critical patent/EP3432569B1/en
Priority to US16/331,869 priority patent/US11102384B2/en
Priority to CN201780018303.8A priority patent/CN108886566B/zh
Publication of WO2018120299A1 publication Critical patent/WO2018120299A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images

Definitions

  • the present invention relates to the field of imaging equipment, and in particular, to a camera substrate assembly, a camera module, and a terminal device.
  • the common substrate type dual camera module is that the two camera substrate circuits are designed on the same printed circuit board board, and then other components are packaged layer by layer based on the common substrate to complete the manufacture of the dual camera module.
  • the dual camera module is required to be assembled in the whole machine: the top surface of the two modules (the plane on the motor or the plane on the outer protection bracket) has the same contour.
  • the other structural components of the left and right modules must be substantially equal, such as the same height motor, the same thickness of the sensor, and the same field of view. Lens, protective bracket of the same thickness, etc.
  • the dual camera module brings new visual experiences to consumers, such as large wide-angle and high depth of field applications, resulting in sharper picture quality, sharper edges, blurred background, and stereoscopic experience. Similarly, the market has to satisfy these The requirements for the dual camera module are put forward, for example: 1. The change of different angles of view of the left and right lenses (one wide angle, one high depth of field); 2. The case where the thickness of the chip is different (the thickness of different manufacturers is different) . As such, the limitations of existing common-substrate dual-camera modules are not suitable for these changes, and innovation is needed to change this.
  • the conventional common substrate type dual-photographing substrate is mostly thermocompression bonded using a printed circuit board and an FPC (Flexible Printed Circuit).
  • FPC Flexible Printed Circuit
  • the flatness of the hard printed circuit board and the flexible circuit board body is not high (>30 ⁇ m); the hard printed circuit board is prone to warpage (warpage>50 ⁇ m) during the thermocompression bonding process.
  • the poor flatness of the substrate will result in poor flatness of the chip and the substrate (tilt>20 ⁇ m).
  • the module will not be efficient due to the tilt caused by AA (active alignment) during subsequent assembly and testing.
  • AA active alignment
  • the theoretically optimal imaging surface is on the sensor surface. Because the flatness changes, it will cause the search for the best imaging surface for a long time. When the flatness exceeds a certain upper limit (this upper limit is set in the product test specification), it cannot be found. The best imaging surface, AA fails) and SFR (Spatial frequency response) performance is poor.
  • the application provides a camera substrate assembly.
  • the camera substrate assembly provided by the present application comprises a laminated rigid support plate and a printed circuit board, wherein the printed circuit board is provided with at least two mounting holes for mounting the camera chip, the rigid support plate having a mounting hole facing each And a mounting surface for supporting the camera chip, wherein the rigid support plate has a strength greater than the printed circuit board, and a flatness of the mounting surface is less than a set threshold.
  • the camera chip is supported by using a mounting hole on the printed circuit board and a mounting surface on the rigid supporting plate, thereby preventing the camera from being warped when the printed circuit board and the flexible circuit board are pressed together.
  • the effect of the installation improves the flatness of the camera chip after installation, thereby improving the camera effect of the camera module.
  • the height difference between the mounting faces facing the different mounting holes enables the substrate assembly to be applied to different scenes, and the angle of view of different lenses can be changed by adjusting the height of the mounting surface; It can also meet the variation of the thickness of different camera chips.
  • the rigid support plate is provided with at least one groove, and the bottom surface of each groove is one of the mounting faces.
  • the height of the mounting surface can be set by forming a groove on the rigid support plate.
  • the number of the grooves can be one-to-one corresponding to the number of the mounting holes, or less than the installation.
  • the number of holes For example, when two mounting holes are used, two grooves can be used, and the setting manners of different height mounting faces can be realized by setting grooves of different depths. In the specific setting, the grooves can be cut by cutting or other common preparations. The method is opened on a rigid support board.
  • the number of the grooves is one, and the groove is in communication with one of the at least two mounting holes; the rigid support plate faces the at least two A mounting surface of the other of the mounting holes is flush with a side of the rigid support plate toward the printed circuit board. That is to say, the height of the mounting surface is formed by adopting a groove setting manner, so as to cope with the change of the viewing angle of different lenses, and also can satisfy the variation of the thickness of different camera chips.
  • the rigid support plate is provided with at least one boss, and a top surface of each of the bosses is one of the mounting faces. That is, the installation of different height mounting surfaces is realized by providing a boss on the rigid support plate.
  • the number of the bosses may be the same as or different from the number of the mounting holes, and the specific one may be set according to actual conditions.
  • the number of the bosses is one and inserted into one of the at least two mounting holes; the rigid support A mounting surface of the board toward the other of the at least two mounting holes is flush with a side of the rigid support plate toward the printed circuit board. That is, in the mounting surface used, one is the top surface of the boss and the other is the surface of the rigid support plate to realize the mounting surface setting of different heights.
  • the boss is integral with the rigid support plate.
  • a boss structure is formed on the rigid support plate by cutting or grinding.
  • the rigid support plate is a metal support plate.
  • the metal support plate has better support strength, and the thermal conductivity of the metal material is superior to that of the printed circuit board material, and the metal material is directly bonded to the camera chip, and the heat dissipation effect is better than the bonding between the camera chip and the printed circuit board;
  • the flatness of the material machined by the grinding machine is far superior to the flatness of the printed circuit board.
  • the metal support plate is a steel plate or an alloy plate.
  • the method further includes: a flexible circuit board connected to the printed circuit board signal, and the flexible circuit board signal is connected with a connector, the flexible circuit board being clamped on the printed circuit board Between two plates. At this time, the mounting hole passes through the flexible circuit board.
  • the set threshold is 5 to 10 [mu]m.
  • the flatness of the metal material can be 5 to 10 ⁇ m, which is far superior to the flatness of the printed circuit board of 30 ⁇ m.
  • the present application further provides a camera module, comprising the camera substrate assembly according to any of the above, further comprising a camera chip disposed on a mounting surface in each mounting hole, and each camera chip and the camera chip
  • the printed circuit board signal connection further comprising:
  • a lens mount fixedly connected to the printed circuit board, wherein the lens mount is provided with a filter
  • a lens and a drive motor that drives the lens to expand and contract, and an optical axis of the lens is coaxial with an axis of the filter.
  • the camera is supported by using a mounting hole on the printed circuit board and a mounting surface on the rigid supporting plate, thereby preventing the warpage from being applied to the camera when the printed circuit board and the flexible circuit board are pressed together.
  • the effect is improved, and the flatness of the camera after installation is improved, thereby improving the camera effect of the camera module.
  • each of the camera chips is signally coupled to the printed circuit board by a metal line.
  • the camera chip is directly bonded and packaged on the structure of the metal support plate.
  • the plane of the camera chip is below the plane of the printed circuit board or is flat.
  • the metal wire connection from the camera chip to the printed circuit board can lower the metal wire arc and reduce the subsequent packaging process. The risk of the lens mount touching the gold wire.
  • the application also provides a terminal device, which includes the camera module described above.
  • the camera is supported by using a mounting hole on the printed circuit board and a mounting surface on the rigid supporting plate, thereby preventing the warpage from being applied to the camera when the printed circuit board and the flexible circuit board are pressed together.
  • the effect is improved, and the flatness of the camera after installation is improved, thereby improving the camera effect of the camera module.
  • FIG. 1 is a top plan view of a camera substrate assembly provided by the present application.
  • Figure 2 is a cross-sectional view taken along line A-A of Figure 1;
  • Figure 3 is a cross-sectional view taken along line B-B of Figure 1;
  • FIG. 4 is a cross-sectional view of a camera substrate assembly provided by the present application.
  • Figure 5 is a cross-sectional view of the camera substrate assembly provided by the present application.
  • Figure 6 is a cross-sectional view of the camera substrate assembly provided by the present application.
  • Figure 7 is a cross-sectional view of the camera substrate assembly provided by the present application.
  • FIG. 8 is a schematic structural diagram of a camera module provided by the present application.
  • Figure 9 is a cross-sectional view taken along line C-C of Figure 8.
  • FIG. 1 is a top view of a camera substrate assembly according to an embodiment of the present application.
  • FIG. 2 and FIG. 3 are cross-sectional views showing different angles of the camera substrate assembly according to the embodiment of the present application.
  • the camera substrate assembly provided by the embodiment of the present application includes a printed circuit board 10 and a rigid support board 20, wherein the printed circuit board 10 and the flexible circuit board 30 are stacked, and at least two of the printed circuit board 10 are provided for accommodating the camera chip.
  • a mounting hole for mounting a camera chip of the camera In the camera substrate assembly shown in FIG. 1 , the number of mounting holes is two, respectively, a first mounting hole 11 and a second mounting hole 12, and The first mounting hole 11 and the second mounting hole 12 are disposed along the longitudinal direction of the printed circuit board 10 (that is, the direction in which the camera substrate assembly is placed in FIG. 1 is the reference direction, and the horizontal direction is the length direction of the printed circuit board 10).
  • the rigid support plate 20 is laminated with the printed circuit board 10, and therefore, one end of the mounting hole on the printed circuit board 10 is blocked by the rigid support plate 20, and the rigid support plate 20 is formed on each side.
  • the set threshold may be 5 to 10 ⁇ m, such as 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m, 10 ⁇ m, etc., any value between 5 and 10 ⁇ m.
  • the flatness is far superior to the flatness of the printed circuit board 10 of 30 ⁇ m.
  • the set threshold value enables the mounting surface of the camera chip to have a good flatness, thereby improving the flatness of the camera chip during installation, and effectively improving the imaging effect.
  • the strength of the rigid support plate 20 is greater than that of the printed circuit board 10, so that the entire substrate assembly can be provided with better strength support.
  • the camera substrate assembly disclosed in the present application further includes a flexible circuit board 30 , which is signally connected to the printed circuit board 10 , and the flexible circuit board 30 is away from the printed circuit.
  • One end of the board 10 is connected to a connector 40 for connecting to the main board of the terminal device.
  • the flexible circuit board 30 is interposed between the two boards of the printed circuit board 10. At this time, the mounting holes on the printed circuit board 10 penetrate the flexible circuit board 30, that is, the mounting holes.
  • the side walls are composed of two sheets of printed circuit board 10 and a flexible circuit board 30.
  • the substrate assembly provided in this embodiment includes: a printed circuit board 10 , a flexible circuit board 30 , a connector 40 , and a rigid support board 20 , wherein the flexible circuit board 30 and the printed circuit board 10
  • the rigid support plate 20 is disposed in a stacked manner.
  • the flexible circuit board 30 is sandwiched between two boards of the printed circuit board 10.
  • the rigid support board 20 is disposed on one side of the printed circuit board 10 and is disposed on the printed circuit board.
  • the number of mounting holes is two, which are respectively the first mounting hole 11 and the second mounting hole 12, and the number of mounting faces on the corresponding rigid supporting plate 20 is also Two are the first mounting surface 21 and the second mounting surface 22, respectively.
  • the rigid support plate 20 is provided with at least one groove, and the bottom surface of each groove is one of the mounting faces.
  • the number of the grooves may be different numbers, and one groove may be used, or one groove may be used for each mounting hole.
  • the specific situation can be determined according to the number and height of the mounting surfaces that are actually needed. That is, the setting of different heights of the mounting surface is achieved by forming grooves on the rigid support plate 20.
  • the first mounting hole 11 corresponds to a groove
  • the bottom surface of the groove is a first mounting surface 21 for supporting the camera chip.
  • the groove can be formed by etching or cutting.
  • the manner is formed on the rigid support plate 20.
  • the second mounting hole 12 corresponds to the surface of the rigid support plate 20, that is, the corresponding mounting surface of the second mounting hole 12 is flush with the surface of the rigid support plate 20 toward the second mounting hole 12.
  • the first mounting hole 11 and the second mounting hole 12 respectively correspond to one groove (the first groove 23 and the second groove 24, respectively), and the first groove 23 and the second groove
  • the depths of 24 are different, that is, the heights of the first mounting surface 21 and the second mounting surface 22 are different, and the adjustment of the mounting plane is achieved by adjusting the depth of the groove. It can realize the change of the angle of view of different lenses 60; it can also meet the variation of the thickness of different camera chips.
  • the number of mounting holes is plural, such as three, four or five, etc.
  • the number of grooves on the corresponding rigid support plate 20 may also be Correspondingly, the surface is adjusted, that is, when the height difference of the mounting surface needs to be adjusted, the corresponding groove setting can be performed on the rigid support plate 20 according to actual needs.
  • the rigid support plate 20 is a metal support plate, such as a common metal plate such as a steel plate, an alloy plate, an aluminum plate or an iron plate.
  • Metal support plate has Good support strength, and the thermal conductivity of the metal material is better than that of the printed circuit board 10, and the metal material is directly bonded to the camera chip, and the heat dissipation effect is better than that of the camera chip and the printed circuit board 10;
  • the flatness of the processing is far superior to the flatness of the printed circuit board 10.
  • the flatness of the metal material can be 5 to 10 ⁇ m, which is far superior to the flatness of the printed circuit board 10 of 30 ⁇ m.
  • FIG. 5 is a cross-sectional view of the camera substrate assembly provided by the embodiment.
  • the structure of the printed circuit board 10, the flexible circuit board 30, and the connector 40 of the camera substrate assembly is The same as in Embodiment 1, and the material of the rigid support plate 20 is also the same as that of Embodiment 1, and will not be described in detail herein.
  • the only change is the change in the structure of the rigid support plate 20.
  • the variation of the rigid support plate 20 of the present application is that at least one of the formation structures of the mounting faces is formed by a boss provided on the rigid support plate 20. That is, at least one boss is disposed on the rigid support plate 20, and the top surface of each of the bosses is one of the mounting faces. That is, the mounting of the mounting surfaces of different heights can be realized by providing the bosses on the rigid supporting plate 20.
  • the number of the bosses can be the same as or different from the number of the mounting holes, and the specific one can be set according to actual conditions. This will be exemplified below.
  • FIG. 5 is a cross-sectional view of a camera substrate assembly having two mounting holes provided by an embodiment of the present application.
  • a first boss 25 inserted into the first mounting hole 11 is disposed in the rigid supporting plate 20, and the top surface of the first boss 25 is the first mounting surface 21
  • a second boss 26 is inserted into the rigid support plate 20, and the top surface of the second boss 26 is the second mounting surface 22.
  • the height difference between the first mounting surface 21 and the second mounting surface 22 is determined by the heights of the first boss 25 and the second boss 26.
  • the first boss can be adjusted according to requirements. 25 and the height of the second boss 26 to realize the first mounting surface 21 and the second mounting surface 22 with different height differences.
  • FIG. 6 is a cross-sectional view of a camera substrate assembly having two mounting holes provided by an embodiment of the present application.
  • a third boss 28 is inserted into the first mounting hole 11 in the rigid support plate 20.
  • the top surface of the third boss 28 is the first mounting surface 21
  • a third groove 27 corresponding to the second mounting hole 12 is further disposed on the rigid support plate 20, and the bottom surface of the third groove 27 is a second mounting surface 22, which can be set according to actual needs.
  • the height of the third boss 28 and the depth of the third groove 27 are adjusted to achieve a height difference between the first mounting surface 21 and the second mounting surface 22.
  • FIG. 7 is a cross-sectional view showing a camera substrate assembly having two mounting holes provided by an embodiment of the present application.
  • a fourth boss 29 is inserted into the rigid support plate 20 and inserted into the first mounting hole 11, and the top surface of the fourth boss 29 is the first mounting surface 21.
  • the second mounting surface 22 faces the surface of the second mounting hole 12 with the rigid supporting plate 20 , that is, the second mounting surface 22 is flush with the surface of the rigid supporting plate 20 facing the second mounting hole 12 .
  • the number of mounting holes changes, such as three, four, or five
  • the number of corresponding bosses may also follow, that is, through the set bosses.
  • the groove is used to adjust the mounting surface to meet the change of the angle of view of the different lenses 60 and the thickness of the camera chip.
  • the boss and the rigid support plate 20 are of unitary construction.
  • the strength of the entire structure is facilitated, and in a specific arrangement, a boss structure is formed on the rigid support plate 20 by cutting or grinding.
  • the mounting surface of the camera substrate assembly provided by the embodiment has a height difference between the mounting surfaces facing the different mounting holes, so that the substrate assembly can be applied to different scenarios.
  • the height of the mounting surface it is possible to cope with the change of the viewing angle of different lenses 60; at the same time, it can also satisfy the variation of the thickness of different camera chips.
  • the camera substrate assembly provided by the embodiment of the present application supports the camera by using a mounting hole on the printed circuit board 10 and a mounting surface on the rigid support board 20, thereby avoiding the printed circuit board 10 and the flexible circuit board 30.
  • the effect of warpage on the camera installation during press-fitting improves the flatness of the camera after installation, and thus improves the camera effect of the camera module.
  • FIG. 8 is a schematic structural view of a camera module according to an embodiment of the present disclosure
  • FIG. 9 is a cross-sectional view of the camera module provided by the embodiment of the present application.
  • the present application further includes a camera module including the camera substrate assembly of any of the above, further comprising a camera chip 80 disposed on a mounting surface in each mounting hole, and each of the camera chip 80 and the printed circuit board 10 signal connections; also includes:
  • the lens mount 50 provided by the present application covers one side of the printed circuit board assembly on which the camera chip 80 is disposed, and the lens mount 50 is provided with a filter 90 on which the lens 60 and the drive are disposed.
  • the lens 60 is a telescopic drive motor 70.
  • the filter 90 and the lens 60 are coaxially disposed, and the axis passes through the sensing device of the camera chip 80 so that the light passing through the lens 60 can be transmitted to the camera chip 80.
  • the mounting head is provided on the printed circuit board 10, and the mounting surface is provided on the rigid supporting board 20 to support the camera, thereby avoiding the warpage when the printed circuit board 10 and the flexible circuit board 30 are pressed together.
  • the effect of the song on the camera installation improves the flatness of the camera after installation, and thus improves the camera effect of the camera module.
  • the camera chip 80 is directly packaged on the mounting surface of the rigid support plate 20, which effectively increases the distance from the bottom of the lens 60 to the surface of the camera chip 80 (back focus distance, BLF), which is advantageous for reducing the imaging probability and yield of small dust.
  • each camera chip 80 is signally coupled to the printed circuit board 10 by a metal wire.
  • the camera chip 80 is adhesively packaged on the structure of the metal support plate.
  • the plane of the camera chip 80 is flat or flat below the plane of the printed circuit board 10.
  • the metal wire connection from the camera chip 80 to the printed circuit board 10 can make the metal wire arc low. Reduce the risk of the lens mount 50 touching the gold wire during the subsequent packaging process.
  • the application also provides a terminal device, which includes the above-mentioned camera module.
  • the terminal device is a common terminal device such as a mobile phone or a flat computer, and in the terminal device, the camera is supported by installing a mounting hole on the printed circuit board 10 and mounting a mounting surface on the rigid supporting plate 20, thereby avoiding When the printed circuit board 10 and the flexible circuit board 30 are pressed together, the influence of the warpage on the camera installation improves the flatness of the camera after installation, thereby improving the imaging effect of the camera module.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

一种摄像头基板组件、摄像头模组及终端设备，包括层叠的硬性支撑板(20)及印刷电路板(10)，其中，印刷电路板(10)上设置有用于安放摄像头芯片(80)的至少两个安装孔(11,12)，硬性支撑板(20)具有朝向每个安装孔(11,12)且用于支撑摄像头芯片(80)的安装面(21,22)，其中，硬性支撑板(20)的强度大于印刷电路板(10)，且安装面(21,22)的平面度小于设定阈值。通过采用在印刷电路板(10)上开设安装孔(11,12)，并在硬性支撑板(20)上设置安装面(21,22)来支撑摄像头，从而避免了在印刷电路板(10)与柔性电路板(30)在压合时翘曲对摄像头安装造成的影响，提高了摄像头在安装后的平整度，进而提高了摄像头模组的摄像效果。

Description

一种摄像头基板组件、摄像头模组及终端设备
本申请要求在2016年12月27日提交中国专利局、申请号为201611225458.2、发明名称为“一种摄像头组件及终端”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及摄像设备技术领域，尤其涉及到一种摄像头基板组件、摄像头模组及终端设备。
背景技术
由于智能手机的快速普及，摄像头的应用也从单摄向双摄、多摄开展了。单就双摄模组的制造，目前主流生产的有2种形态,一是共基板式双摄像头模组，另一种是共支架式双摄像头模组。
共基板式双摄像头模组就是2颗摄像头基板电路设计在同一块印刷电路板板上，然后其它组件以此共同基板为基础来逐层封装，完成双摄像头模组的制造。
双摄像头模组在整机装配要求：两颗模组的顶面(马达上平面或者外保护支架上平面)外形等高。现有同一平面的印刷电路板基板要满足这个装配要求时，左右2颗模组的其它结构件就必须大致等高，比如同高度的马达、同厚度的芯片(sensor)、相同视场角的镜头、同厚度的保护支架等。
双摄像头模组给消费者带来了新的视觉体验，比如大广角、高景深的应用，使得画质更锐丽、边缘更清晰、背景虚化、立体体验等；同样，市场因要满足这些需求对双摄像头模组提出了相应的要求，比如：1.左右镜头不同视场角的变化(一颗广角、一颗高景深)；2.芯片厚度不一样的情况(不同厂家厚度不一样)。如此，现有的共基板双摄模组的局限性不能适合这些变化，需要创新来改变这一现状。
现有的共基板式双摄基板大多采用印刷电路板和FPC(Flexible Printed Circuit，柔性电路板)热压贴合。但是该方法存在如下问题：
1.硬板印刷电路板和柔性电路板本体的平整度(warpage)都不高(>30μm)；在热压贴合的过程中硬板印刷电路板容易产生翘曲(warpage>50μm)。
2.基板平整度差会导致芯片与基板的贴合平整度也很差(tilt>20μm),模组在后续组装测试过程中会由于此倾斜引起AA(active alignment，主动对准)效率不高(注：理论上最佳成像面在sensor表面，因为平整度变化，会造成搜寻最佳成像面时间久，当平整度超过一定上限(此上限在产品测试规格中设置)时，就找不到最佳成像面了，AA就失败了)和SFR(Spatial frequency response，空间频率响应)性能不良。
发明内容
本申请提供了一种摄像头基板组件。
本申请提供的摄像头基板组件包括层叠的硬性支撑板及印刷电路板，其中，所述印刷电路板上设置有用于安放摄像头芯片的至少两个安装孔，所述硬性支撑板具有朝向每个安装孔且用于支撑所述摄像头芯片的安装面，其中，所述硬性支撑板的强度大于所述印刷电路板，且所述安装面的平面度小于设定阈值。
在上述实施例中，通过采用在印刷电路板上开设安装孔，并在硬性支撑板上设置安装面来支撑摄像头芯片，从而避免了在印刷电路板与柔性电路板在压合时翘曲对摄像头安装造成的影响，提高了摄像头芯片在安装后的平整度，进而提高了摄像头模组的摄像效果。
在一个具体的实施方式中，朝向不同安装孔的安装面之间具有高度差，使得基板组件可以应用到不同的场景中，通过调节安装面的高度，实现应对不同镜头的视场角变化；同时也可以满足不同摄像头芯片厚度的变化。
所述硬性支撑板设置有至少一个凹槽，且每个凹槽的底面为所述安装面中的一个。通过在硬性支撑板上形成凹槽来实现安装面不同高度的设置，在一个可选的方案中，该凹槽的个数可以为与安装孔的个数一一对应，也可以采用少于安装孔的个数。如在采用两个安装孔时，可以采用两个凹槽，通过设置不同深度的凹槽实现不同高度安装面的设置方式，在具体设置时，该凹槽可以通过切削的方式或者其他的常见制备方式在硬性支撑板上开设。
在一个具体的实施方案中，所述凹槽的个数为一个，且所述凹槽与所述至少两个安装孔中的一个安装孔连通；所述硬性支撑板上朝向所述至少两个安装孔中的另一个安装孔的安装面与所述硬性支撑板朝向所述印刷电路板的一面齐平。即安装面的高度不同通过采用设置凹槽的方式形成，实现应对不同镜头的视场角变化；同时也可以满足不同摄像头芯片厚度的变化。
在一个具体的实施方式中，所述硬性支撑板上设置有至少一个凸台，且每个凸台的顶面为所述安装面中的一个。即通过在硬性支撑板上设置凸台的方式实现不同高度安装面的设置，该凸台的个数可以与安装孔的个数相同，也可以不同，具体的可以根据实际情况设定。通过设置不同高度的凸台，实现应对不同镜头的视场角变化；同时也可以满足不同摄像头芯片厚度的变化。
在一个具体的实施方式中，在所述硬性支撑板上仅设置有凸台结构时，所述凸台的个数为一个且插入到所述至少两个安装孔中的一个；所述硬性支撑板上朝向所述至少两个安装孔中的另一个安装孔的安装面与所述硬性支撑板朝向所述印刷电路板的一面齐平。即在采用的安装面中，一个为凸台的顶面，另一个为硬性支撑板的表面，以实现不同高度的安装面设置。
在一个具体的实施方案中，所述凸台与所述硬性支撑板为一体结构。通过采用一体结构，方便了整个结构的强度，在具体设置时，通过切削或研磨的方式在硬性支撑板上形成凸台结构。
在一个具体的实施方案中，所述硬性支撑板为金属支撑板。金属支撑板具有较好的支撑强度，并且金属材料的热传导性能优于印刷电路板材料，金属材料与摄像头芯片直接粘接，散热效果会优于摄像头芯片与印刷电路板的粘接；此外，金属材料用磨床加工出的平整度远远优于印刷电路板的平整度。
在一个具体的实施方案中，所述金属支撑板为钢板或合金板。
在一个具体的实施方案中，还包括，与所述印刷电路板信号连接的柔性电路板，且所述柔性电路板信号连接有连接器，所述柔性电路板夹设在所述印刷电路板的两个板材之间。此时，安装孔穿过该柔性电路板。
在一个具体的实施方案中，所述设定阈值为5～10μm。金属材料用磨床加工出的平整度可以做到5～10μm，也远远优于印刷电路板的平整度30μm。
本申请还提供了一种摄像头模组，该摄像头模组包括上述任一项所述的摄像头基板组件，还包括设置在每个安装孔内的安装面的摄像头芯片，且每个摄像头芯片与所述印刷电路板信号连接；还包括：
与所述印刷电路板固定连接的镜头座，所述镜头座上设置有滤光片；
镜头以及驱动所述镜头伸缩的驱动马达，且所述镜头的光轴与所述滤光片的轴线共轴线。
在上述实施例中，通过采用在印刷电路板上开设安装孔，并在硬性支撑板上设置安装面来支撑摄像头，从而避免了在印刷电路板与柔性电路板在压合时翘曲对摄像头安装造成的影响，提高了摄像头在安装后的平整度，进而提高了摄像头模组的摄像效果。
在一个具体的实施方案中，所述每个摄像头芯片通过金属线与所述印刷电路板信号连接。摄像头芯片直接粘接封装在金属支撑板的结构上，摄像头芯片平面在印刷电路板平面以下或持平，从摄像头芯片往印刷电路板上打金属线连接可以把金属线弧做低，降低后面封装过程中镜头座接触金线的风险。
本申请还提供了一种终端设备，该终端设备包括上述所述的摄像头模组。
在上述实施例中，通过采用在印刷电路板上开设安装孔，并在硬性支撑板上设置安装面来支撑摄像头，从而避免了在印刷电路板与柔性电路板在压合时翘曲对摄像头安装造成的影响，提高了摄像头在安装后的平整度，进而提高了摄像头模组的摄像效果。
附图说明
图1为本申请提供的摄像头基板组件的俯视图；
图2为图1的A-A剖视图；
图3为图1的B-B剖视图；
图4为本申请提供的摄像头基板组件的剖视图；
图5为本申请提供的摄像头基板组件的剖视图；
图6为本申请提供的摄像头基板组件的剖视图；
图7为本申请提供的摄像头基板组件的剖视图；
图8为本申请提供的摄像头模组的结构示意图；
图9为图8中C-C处的剖视图。
具体实施方式
下面将结合附图对本申请作进一步描述本申请。
如图1所示及图2，图1示出了本申请实施例提供的摄像头基板组件俯视图，图2及图3示出了本申请实施例提供的摄像头基板组件不同角度的剖视图。
本申请实施例提供的摄像头基板组件包括印刷电路板10及硬性支撑板20，其中，印刷电路板10与柔性电路板30层叠设置，印刷电路板10上设置了用于容纳摄像头芯片的至少两个安装孔，所述安装孔用来安装摄像头的摄像头芯片，在图1所示的摄像头基板组件中，安装孔的个数为两个，分别为第一安装孔11及第二安装孔12，且第一安装孔11及第二安装孔12沿印刷电路板10的长度方向设置(即以图1所示的摄像头基板组件放置方向为参考方向，水平方向即为印刷电路板10的长度方向)。
在本申请实施例中，硬性支撑板20与印刷电路板10层叠设置，因此，印刷电路板10上的安装孔的一端被硬性支撑板20封堵住，并且硬性支撑板20上形成了朝向每个安装孔 且用于支撑摄像头芯片的安装面，即每个安装孔对应在硬性支撑板20上具有一个安装面，该安装面可以为不同结构的表面。在具体设置时，可以根据实际的需要在硬性支撑板20上形成不同的结构以形成不同高度要求的安装面。在安装面具体设置时，安装面的平面度小于设定阈值，具体的，设定阈值可以为5～10μm，如5μm、6μm、7μm、8μm、9μm、10μm等任意介于5～10μm的数值，且该平整度远远优于印刷电路板10的平整度30μm。该设定阈值使得摄像头芯片的安装面具有良好的平面度，进而改善摄像头芯片在设置时的平面度，有效的改善摄像的效果。并且硬性支撑板20的强度大于印刷电路板10，从而可以给整个基板组件提供较好的强度支撑。
此外，继续参考图1、图2及图3，本申请公开的摄像头基板组件还包括一个柔性电路板30，该柔性电路板30与印刷电路板10信号连接，且该柔性电路板30远离印刷电路板10的一端连接有一个连接器40，该连接器40用于与终端设备的主板连接。在一个具体的实施方式中，柔性电路板30夹设在印刷电路板10的两个板材之间，此时，印刷电路板10上的安装孔穿透该柔性电路板30，即该安装孔的侧壁由印刷电路板10的两个板材以及柔性电路板30组成。
为了方便理解本实施例提供的摄像头基板组件的结构以及原理，下面结合具体的附图对其进行详细的描述。
实施例1
继续参考图1、图2及图3，本实施例提供的基板组件包括：印刷电路板10、柔性电路板30、连接器40以及硬性支撑板20，其中，柔性电路板30、印刷电路板10及硬性支撑板20采用层叠的设置方式，柔性电路板30夹设在印刷电路板10的两个板材之间，硬性支撑板20设置在印刷电路板10的一侧并封堵设置在印刷电路板10上的安装孔，在本实施例中，安装孔的个数为两个，分别为第一安装孔11、第二安装孔12，对应的硬性支撑板20上的安装面的个数也为两个，分别为第一安装面21及第二安装面22。
在本申请实施例中，硬性支撑板20设置有至少一个凹槽，且每个凹槽的底面为安装面中的一个。具体的，该凹槽的个数可以为不同的个数，既可以采用一个凹槽，也可以采用每个安装孔对应一个凹槽。具体的情况可以根据实际需要的安装面的个数以及高度来确定。即通过在硬性支撑板20上形成凹槽来实现安装面不同高度的设置。
如在本实施例中，第一安装孔11对应一个凹槽，该凹槽的底面为第一安装面21，用于支撑摄像头芯片，该凹槽在形成时，可以采用通过刻蚀、切削的方式在硬性支撑板20上形成。第二安装孔12对应硬性支撑板20的表面，即第二安装孔12对应的安装面与硬性支撑板20朝向第二安装孔12的表面齐平。
或者如图4所示，第一安装孔11及第二安装孔12分别对应一个凹槽(分别为第一凹槽23及第二凹槽24)，且第一凹槽23及第二凹槽24的深度不同，即第一安装面21及第二安装面22的高度不同，通过调整该凹槽的深度，实现对安装平面的调整。实现应对不同镜头60的视场角变化；同时也可以满足不同摄像头芯片厚度的变化。
应当理解的是，在本申请的实施例中，当安装孔的个数为多个时，如三个、四个或者五个等，对应的硬性支撑板20上的凹槽的个数也可以相应的进行表面，即当需要调整安装面的高度差时，可以根据实际的需要在硬性支撑板20上进行对应的凹槽设置。
此外，为了保证硬性支撑板20的结构强度，在一个具体的实施方案中，硬性支撑板20为金属支撑板，如为钢板、合金板、铝板或铁板等常见的金属板材。金属支撑板具有较 好的支撑强度，并且金属材料的热传导性能优于印刷电路板10材料，金属材料与摄像头芯片直接粘接，散热效果会优于摄像头芯片与印刷电路板10的粘接；此外，金属材料用磨床加工出的平整度远远优于印刷电路板10的平整度，如金属材料用磨床加工出的平整度可以做到5～10μm，也远远优于印刷电路板10的平整度30μm。
实施例2
如图5所示，图5示出了本实施例提供的摄像头基板组件的剖视图，在本申请的实施例中，摄像头基板组件的印刷电路板10、柔性电路板30、连接器40的结构与实施例1中的相同，并且硬性支撑板20的材料也与实施例1中的材料相同，在此不再进行详细的描述。在本实施例中，唯一的变化在于硬性支撑板20的结构的变化。
在本申请的硬性支撑板20的变化在于安装面的形成结构中至少一个由设置在硬性支撑板20上的凸台形成。即在硬性支撑板20上设置至少一个凸台，且每个凸台的顶面为安装面中的一个。即通过在硬性支撑板20上设置凸台的方式实现不同高度安装面的设置，该凸台的个数可以与安装孔的个数相同，也可以不同，具体的可以根据实际情况设定。下面对其进行举例说明。
如图5所示，图5示出了本申请实施例提供的具有两个安装孔的摄像头基板组件的剖视图。在本申请中，如图5所示，硬性支撑板20中设置了一个插入到第一安装孔11内的第一凸台25，该第一凸台25的顶面即为第一安装面21，硬性支撑板20上还设置了一个插入到第二安装孔12内的第二凸台26，该第二凸台26的顶面即为第二安装面22。由图5可以看出，第一安装面21及第二安装面22的高度差由第一凸台25及第二凸台26的高度决定，在实际设置中，可以根据需求调整第一凸台25及第二凸台26的高度，以实现设置不同高度差的第一安装面21及第二安装面22。
如图6所示，图6示出了本申请实施例提供的具有两个安装孔的摄像头基板组件的剖视图。在本申请中，如图6所示，硬性支撑板20中设置了一个插入到第一安装孔11内的第三凸台28，该第三凸台28的顶面即为第一安装面21，硬性支撑板20上还设置了一个与第二安装孔12对应连通的第三凹槽27，该第三凹槽27的底面为第二安装面22，在具体设置时，可以根据实际的需要调整第三凸台28的高度及第三凹槽27的深度以实现第一安装面21及第二安装面22之间高度差的要求。
或者采用如图7所示的结构，图7示出了本申请实施例提供的具有两个安装孔的摄像头基板组件的剖视图。在图7中，硬性支撑板20中设置了一个插入到第一安装孔11内的第四凸台29，该第四凸台29的顶面即为第一安装面21。对于第二安装面22，该第二安装面22采用硬性支撑板20朝向第二安装孔12的表面，即第二安装面22与硬性支撑板20朝向第二安装孔12的面齐平。
通过上述描述可以看出，在本实施例中，通过设置不同高度的凸台、凹槽，实现应对不同镜头60的视场角变化；同时也可以满足不同摄像头芯片厚度的变化。
应当理解的是，在本申请实施例中，当安装孔的个数变化时，如三个、四个、五个时，对应的凸台的个数也可以跟随变化，即通过设置的凸台、凹槽来实现对安装面的调整，以满足不同镜头60的视场角变化及摄像头芯片厚度的变化。
在一个具体的实施方案中，凸台与硬性支撑板20为一体结构。通过采用一体结构，方便了整个结构的强度，在具体设置时，通过切削或研磨的方式在硬性支撑板20上形成凸台结构。
通过上述实施例1及实施例2的描述可以看出，本实施例提供的摄像头基板组件的安装面中，朝向不同安装孔的安装面之间具有高度差，使得基板组件可以应用到不同的场景中，通过调节安装面的高度，实现应对不同镜头60的视场角变化；同时也可以满足不同摄像头芯片厚度的变化。
并且，本申请实施例提供的摄像头基板组件通过采用在印刷电路板10上开设安装孔，并在硬性支撑板20上设置安装面来支撑摄像头，从而避免了在印刷电路板10与柔性电路板30在压合时翘曲对摄像头安装造成的影响，提高了摄像头在安装后的平整度，进而提高了摄像头模组的摄像效果。
如图8及图9所示，图8示出了本申请实施例提供的摄像头模组的结构示意图，图9示出了本申请实施例提供的摄像头模组的剖视图。
本申请还一种摄像头模组，该摄像头模组包括上述任一项的摄像头基板组件，还包括设置在每个安装孔内的安装面的摄像头芯片80，且每个摄像头芯片80与印刷电路板10信号连接；还包括：
与印刷电路板10固定连接的镜头座50，镜头座50上设置有滤光片90；镜头60以及驱动镜头60伸缩的驱动马达70，且镜头60的光轴与滤光片90的轴线共轴线。
继续参考图9，本申请提供的镜头座50覆盖在印刷电路基板组件上设置摄像头芯片80的一侧，并且镜头座50上设置了滤光片90，在镜头座50上设置了镜头60以及驱动该镜头60伸缩的驱动马达70。并且在具体设置时，滤光片90及镜头60之间同轴设置，且该轴线穿过摄像头芯片80的感应器件，以使穿过镜头60的光线能够传递到摄像头芯片80上。
在上述实施例中，通过采用在印刷电路板10上开设安装孔，并在硬性支撑板20上设置安装面来支撑摄像头，从而避免了在印刷电路板10与柔性电路板30在压合时翘曲对摄像头安装造成的影响，提高了摄像头在安装后的平整度，进而提高了摄像头模组的摄像效果。并且，摄像头芯片80直接封装在硬性支撑板20的安装面上，有效增大了镜头60底部到摄像头芯片80表面的距离(后焦距离，BLF)，利于减少小灰尘的成像几率和良率提高。
在一个具体的实施方案中，每个摄像头芯片80通过金属线与印刷电路板10信号连接。摄像头芯片80粘接封装在金属支撑板的结构上，摄像头芯片80平面在印刷电路板10平面以下或持平，从摄像头芯片80往印刷电路板10上打金属线连接可以把金属线弧做低，降低后面封装过程中镜头座50接触金线的风险。
本申请还提供了一种终端设备，该终端设备包括上述的摄像头模组。
该终端设备为手机、平面电脑等常见的终端设备，并且在该终端设备中，通过采用在印刷电路板10上开设安装孔，并在硬性支撑板20上设置安装面来支撑摄像头，从而避免了在印刷电路板10与柔性电路板30在压合时翘曲对摄像头安装造成的影响，提高了摄像头在安装后的平整度，进而提高了摄像头模组的摄像效果。
尽管已描述了本发明的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例做出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本发明范围的所有变更和修改。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (14)

  1. 一种摄像头基板组件，其特征在于，包括层叠设置的硬性支撑板及印刷电路板，其中，所述印刷电路板上设置有用于安放摄像头芯片的至少两个安装孔，所述硬性支撑板具有朝向每个安装孔且用于支撑所述摄像头芯片的安装面，其中，所述硬性支撑板的强度大于所述印刷电路板，且所述安装面的平面度小于设定阈值。
  2. 如权利要求1所述的摄像头基板组件，其特征在于，朝向不同安装孔的安装面之间具有高度差。
  3. 如权利要求2所述的摄像头基板组件，其特征在于，所述硬性支撑板设置有至少一个凹槽，且每个凹槽的底面为所述安装面中的一个。
  4. 如权利要求3所述的摄像头基板组件，其特征在于，所述凹槽的个数为一个，且所述凹槽与所述至少两个安装孔中的一个安装孔连通；所述硬性支撑板上朝向所述至少两个安装孔中的另一个安装孔的安装面与所述硬性支撑板朝向所述印刷电路板的一面齐平。
  5. 如权利要求2或3所述的摄像头基板组件，其特征在于，所述硬性支撑板上设置有至少一个凸台，且每个凸台的顶面为所述安装面中的一个。
  6. 如权利要求5所述的摄像头基板组件，其特征在于，在所述硬性支撑板上仅设置有凸台结构时，所述凸台的个数为一个且插入到所述至少两个安装孔中的一个；所述硬性支撑板上朝向所述至少两个安装孔中的另一个安装孔的安装面与所述硬性支撑板朝向所述印刷电路板的一面齐平。
  7. 如权利要求4或5所述的摄像头基板组件，其特征在于，所述凸台与所述硬性支撑板为一体结构。
  8. 如权利要求1～7任一项所述的摄像头基板组件，其特征在于，所述硬性支撑板为金属支撑板。
  9. 如权利要求8所述的摄像头基板组件，其特征在于，所述金属支撑板为钢板或合金板。
  10. 如权利要求1～9任一项所述的摄像头基板组件，其特征在于，还包括，与所述印刷电路板信号连接的柔性电路板，且所述柔性电路板信号连接的连接器所述柔性电路板夹设在所述印刷电路板的两个板材之间。
  11. 如权利要求1～10任一项所述的摄像头基板组件，其特征在于，所述设定阈值为5～10μm。
  12. 一种摄像头模组，其特征在于，包括如权利要求1～11任一项所述的摄像头基板组件，还包括设置在每个安装孔内的安装面的摄像头芯片，且每个摄像头芯片与所述印刷电路板信号连接；还包括：
    与所述印刷电路板固定连接的镜头座，所述镜头座上设置有滤光片；
    镜头以及驱动所述镜头伸缩的驱动马达，且所述镜头的光轴与所述滤光片的轴线共轴线。
  13. 如权利要求12所述的摄像头模组，其特征在于，所述每个摄像头芯片通过金属线与所述印刷电路板信号连接。
  14. 一种终端设备，其特征在于，包括如权利要求12或13所述的摄像头模组。
PCT/CN2017/071024 2016-12-27 2017-01-13 一种摄像头基板组件、摄像头模组及终端设备 WO2018120299A1 (zh)

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