WO2018117636A1 - Stratifié métallique et procédé de fabrication de celui-ci - Google Patents

Stratifié métallique et procédé de fabrication de celui-ci Download PDF

Info

Publication number
WO2018117636A1
WO2018117636A1 PCT/KR2017/015122 KR2017015122W WO2018117636A1 WO 2018117636 A1 WO2018117636 A1 WO 2018117636A1 KR 2017015122 W KR2017015122 W KR 2017015122W WO 2018117636 A1 WO2018117636 A1 WO 2018117636A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
fluorine
based film
laminate
core layer
Prior art date
Application number
PCT/KR2017/015122
Other languages
English (en)
Korean (ko)
Inventor
신주호
김진웅
김용욱
Original Assignee
주식회사 두산
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 두산 filed Critical 주식회사 두산
Publication of WO2018117636A1 publication Critical patent/WO2018117636A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat

Definitions

  • the present invention relates to a metal laminated plate and a method for manufacturing the same, and provides a metal laminated plate for a printed circuit board and a method for manufacturing the same that can be stably operated in a high frequency band.
  • Metal laminates manufactured using epoxy resins of a metal laminate for manufacturing a printed circuit board may be impregnated with an epoxy resin in a glass fabric, drying the impregnated fibers to remove other organic solvents, and curing the resin.
  • the fluorine-based resin is a thermoplastic resin and has a non-adhesive property that does not adhere well to other materials due to physically very low surface energy, so that the fluorine resin and the conductive metal foil are usually directly attached. Since it was difficult, the method of directly laminating the conductive metal foil on the resin as described above could not be used.
  • thermosetting resin having a low melting point on various heat-resistant polymer insulating fluorine resins such as polytetrafluoroethylene (PTFE) resin and resin impregnated with polytetrafluoroethylene in glass fiber tissues for adhesion of fluorine resin with other materials.
  • PTFE polytetrafluoroethylene
  • An adhesive film or an adhesive is placed and the conductive metal foil is compressed and cured under heating / pressurization as a medium to be laminated.
  • the present invention is to develop a metal laminated plate for a printed circuit board that can reduce the manufacturing cost according to the simplification of the manufacturing process as well as excellent overall physical properties including low loss coefficient, low dielectric constant, heat resistance suitable for high frequency band.
  • an object of the present invention is to provide a metal laminated plate having excellent low dielectric constant and heat resistance and a method of manufacturing the same. It is done.
  • the present invention is to produce a laminate by impregnating a material having a high heat resistance on the fiber substrate and then ply-up the fluorine-based film, by laminating a conductive metal foil on the laminate and then integrated by high temperature compression in a short time. It is an object of the present invention to provide a metal laminate and a method of manufacturing the same, which exhibit high adhesion between metal foil and film and low dielectric properties.
  • the present invention provides a metal laminated plate to which a low dielectric constant material is applied, and a manufacturing method thereof.
  • the present invention provides a high heat resistant core layer comprising a fibrous substrate; Fluorine-based film laminated on both sides of the core layer; And a metal foil laminated on the fluorine-based film, wherein the fluorine-based film provides a metal laminate, characterized in that it comprises a filler (filler).
  • the fluorine-based film is a fluoropolymer film selected from the group consisting of polytetrafluoroethylene (PTFE), fluoro and ethylene-propylene copolymers and fluorocarbon backbones with perfluoroalkoxy side chains. And, preferably, a perfluoro alkoxy (PFA) film.
  • PTFE polytetrafluoroethylene
  • PFA perfluoro alkoxy
  • the filler in the fluorine-based film may be included in an amount of 10 to 70% by weight.
  • the filler is one of silica (silica), titanium dioxide (TiO 2 ), alumina (Al 2 O 3 ), potassium titanate (K 2 O 6 TiO 2 ), barium oxide (BaO) Can be.
  • the core layer may include a resin layer cured by impregnating the fiber substrate in a high heat resistant resin composition.
  • the high heat resistant resin composition is bisphenol A (bisphenol A) epoxy, aromatic naphthalene epoxy, biphenyl aralkyl type epoxy, isocyanurate epoxy, cresol noblec (cresol) novlac) type epoxy resin, and high heat resistant epoxy resin.
  • the fiber substrate may be spread glass fibers (Spread G / F).
  • the spread glass fibers are glass fibers; And an inorganic binder.
  • the metal foil is preferably copper foil having a roughness Rz in the range of 0.5 to 5.0 ⁇ m.
  • the coefficient of thermal expansion (CTE) of the metal laminate is preferably 5 to 40 ppm.
  • the peel strength (P / S) of the metal foil to the fluorine-based film in the metal laminate is preferably in the range of 0.8 to 1.5 kgf / cm.
  • the present invention comprises the steps of (a) impregnating a fiber substrate in the high heat-resistant resin composition and then semi-curing to prepare a core layer, and (b) sequentially stacking a fluorine-based film and a metal foil on the upper and lower surfaces of the core layer, respectively. Then, it provides a method for producing a metal laminate comprising the step of integrating into a high temperature compression process.
  • the present invention comprises the steps of (a) laminating a fluorine-based film on the upper and lower surfaces of the core layer, respectively, and (b) laminating metal foils on the upper and lower surfaces of the laminate, respectively, and then integrated into a high temperature compression process. It provides a method for producing a metal laminate comprising the step of.
  • the core layer may include glass fiber.
  • the high temperature compression process is preferably carried out for 10 minutes to 3 hours at a temperature of 270 to 400 °C.
  • the metal laminate according to the present invention satisfies a low loss factor, low dielectric properties, heat resistance, and adhesion stability at the same time, the printed circuit board using the same may exhibit excellent high frequency characteristics, good heat resistance, and adhesive stability.
  • the manufacturing method of the metal laminated plate according to the present invention is inexpensive processing cost by integrating by high temperature compression in a short time, and because the unique intrinsic properties can be used as it is by minimizing the change in electrical and mechanical properties of low dielectric constant material, high frequency band It is possible to produce a metal laminated plate having a low loss coefficient, which has excellent electrical characteristics, which can operate very stably.
  • the metal laminate of the present invention is a component of a printed circuit board used in a mobile communication device that handles high-frequency signals of 1 GHz or more, network-based electronic devices such as base station devices, servers, routers, and various electrical and electronic devices such as large computers. It can be usefully used as.
  • FIG. 1 is a cross-sectional view of a metal laminate according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of a metal laminate according to another embodiment of the present invention.
  • the present invention is to provide a metal laminated plate that can be usefully used in printed circuit boards, especially printed circuit boards for ultra-high frequency applications.
  • a core layer including a fiber substrate, a fluorine-based film laminated on both sides of the core layer, and a metal foil laminated on the fluorine-based film, the fluorine-based film on the core layer
  • a metal laminated plate bonded by high temperature compression.
  • the core layer means a prepreg including a fiber base, and preferably means a high heat resistant prepreg formed by impregnating a fiber base in the high heat resistant resin composition.
  • the metal laminate according to the present invention is a high heat-resistant prepreg; A fluorine-based film having a low dielectric constant; And a structure in which a metal foil having low roughness is laminated, and by securing adhesion stability of each layer, the effects of low loss coefficient, low dielectric property, heat resistance, and adhesion stability can be simultaneously given to the printed circuit board using the metal laminate. Can be.
  • FIG. 1 schematically shows a cross section of a metal laminate 100 according to an embodiment of the present invention.
  • the metal laminate 100 includes a prepreg 110 including a fiber base, a fluorine-based film 130 laminated on both surfaces of the prepreg, and a metal foil laminated on the fluorine-based film ( 170).
  • the prepreg 110 of the present invention includes a fiber substrate and a resin layer cured by impregnating the fiber substrate with the high heat resistant resin composition.
  • the high heat resistant resin composition may be a resin varnish dissolved or dispersed in a solvent.
  • the fibrous substrate may be arbitrarily bent, and may be used in the art of a conventional inorganic fiber substrate, organic fiber substrate, or a mixed form thereof. What is necessary is just to select the above-mentioned fiber base material based on the use or performance to be used.
  • Examples of the substrate used in the present invention include inorganic fibers such as E-glass, D-glass, S-glass, NE-glass, T-glass, and Q-glass, and organic fibers such as polyimide, polyamide, polyester, and the like. Mixtures, etc. are selected based on the intended use or performance.
  • Non-limiting examples of fiber substrates that can be used include glass fibers (inorganic fibers) such as E-glass, D-glass, S-glass, NE-glass, T-glass, Q-glass, and the like; Organic fibers such as glass paper, glass fiber nonwoven fabric, glass cloth, aramid fiber, aramid paper, polyimide, polyamide, polyester, aromatic polyester, fluororesin, and the like; Carbon fibers, paper, inorganic fibers, or a mixture of one or more thereof.
  • the fiber base may be formed of a woven or nonwoven fabric made of the aforementioned fibers, roving, chopped strand mat, surfacing mat, metal fiber, carbon fiber, mineral fiber, or the like. Woven fabrics, nonwoven fabrics, mats, etc. may be mentioned.
  • this base materials can be used individually or in mixture of 2 or more types.
  • the stiffness and dimensional stability of the prepreg can be improved.
  • the thickness of this fibrous substrate is not particularly limited and may be, for example, in the range of about 0.01 mm to 0.3 mm.
  • the high heat resistant resin composition is used to form the prepreg 110, and the prepreg 110 may include a resin layer cured by impregnating the fiber base in the high heat resistant resin composition.
  • the high heat resistant resin composition used in the present invention is not particularly limited as long as it is a composition excellent in heat resistance known in the art, but is not particularly limited in terms of its chemical composition.
  • bisphenol A epoxy, aromatic naphthalene epoxy, and biphenyl are used. It is preferable to include at least one of an alkyl (biphenyl aralkyl) type epoxy, an isocyanurate epoxy, a cresol novlac type epoxy resin, and a high heat resistant epoxy resin.
  • the prepreg refers to a sheet-like material obtained by coating a fibrous substrate with a resin composition or by impregnating the fibrous substrate with a resin composition and curing it to B-stage (semicured state) by heating.
  • the prepreg 110 of the present invention may be prepared by known solvent methods known in the art.
  • the solvent method is a method of drying after impregnating a fibrous substrate with a resin composition varnish formed by dissolving the resin composition for prepreg formation in an organic solvent.
  • a resin varnish is generally used.
  • the method of impregnating a fiber base material in the said resin composition the method of immersing a base material in a resin varnish, the method of apply
  • the fiber base material is immersed in a resin varnish, since the impregnation property of the resin composition with respect to a fiber base material can be improved, it is preferable.
  • the prepreg 110 of this invention can be manufactured by impregnating the said heat resistant resin composition with the sheet-like fiber base material or glass base material which consists of a fiber, and semi-hardening by heating.
  • the heat resistant resin composition may be prepared by a resin varnish.
  • ketones such as acetone, methyl ethyl ketone, cyclohexanone, an acetic acid, such as ethyl acetate, butyl acetate, a cellosolve acetate, a propylene glycol monomethyl ether acetate, and a carbitol acetate
  • Carbitols such as esters, cellosolves and butyl carbitol
  • aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, tetrahydrofuran and the like.
  • You may use an organic solvent 1 type or in combination of 2 or more types.
  • the prepreg 110 of the present invention may be formed through an additional drying process after impregnating the substrate in the resin varnish, wherein the drying may be performed at 20 to 200 °C.
  • the prepreg 110 of the present invention is impregnated with the substrate in the high heat-resistant resin varnish and heat-dried for 1 to 10 minutes at a temperature in the range of 70 to 170 °C, the prepreg of the semi-cured state (B-Stage) Legs can be prepared.
  • the metal laminate 100 includes a fluorine-based film 130 laminated on both surfaces of the prepreg 110 as a material having a low dielectric constant.
  • low dielectric constant materials usable in the present invention include fluoropolymers selected from the group consisting of polytetrafluoroethylene (PTFE), fluoro and ethylene-propylene copolymers, and fluorocarbon backbones with perfluoroalkoxy side chains.
  • PTFE polytetrafluoroethylene
  • fluoro and ethylene-propylene copolymers fluorocarbon backbones with perfluoroalkoxy side chains.
  • fluoropolymers selected from the group consisting of polytetrafluoroethylene (PTFE), fluoro and ethylene-propylene copolymers, and fluorocarbon backbones with perfluoroalkoxy side chains.
  • PTFE polytetrafluoroethylene
  • PFA perfluoro alkoxy
  • Prior art has been prepared by impregnating polytetrafluoroethylene (PTFE) resin into glass fiber 5-6 times, high temperature / high pressure press process, but the present invention impregnates glass fiber with high heat-resistant resin, high temperature / Manufacturing through high pressure compression process has the advantage of reducing the productivity, manufacturing process cost.
  • PTFE polytetrafluoroethylene
  • CTE coefficient of thermal expansion
  • a material having a low dielectric constant such as perfluoro alkoxy (PFA), such as a fluororesin
  • PFA perfluoro alkoxy
  • the fluoro-based film 130 is preferably a perfluoro alkoxy (PFA) film, the fluorine-based film 130 may include a filler.
  • PFA perfluoro alkoxy
  • the filler is included in the fluorine-based film, it may have an effect of improving the properties such as G / F impregnation, productivity, thermal expansion coefficient (CTE) of the fluorine-based film.
  • Non-limiting examples of the filler at least one of silica (silica), titanium dioxide (TiO 2 ), alumina (Al 2 O 3 ), potassium titanate (K 2 O 6 TiO 2 ), barium oxide (BaO) Among these, silica is preferable.
  • the filler may be included in an amount of 10 to 70% by weight in the fluorine-based film, for example, it is preferably included in an amount of 40% by weight.
  • the content of the filler in the fluorine-based film is less than 40% by weight can not exhibit a CTE (Z-axis) improvement effect, when included in an amount exceeding 70% by weight is a problem that the film is not formed.
  • the thickness of the fluorine-based film 130 is not particularly limited, but may be in the range of 25 to 125 ⁇ m, preferably 50 ⁇ m.
  • the metal laminate 100 includes a metal foil 170 laminated on the laminate 150 of the prepreg 110 and the fluorine-based film 130.
  • the metal foil 170 may be made of a conventional metal or alloy known in the art without limitation. At this time, when the metal foil is a copper foil, the metal laminated plate 100 according to the present invention can be used as a copper foil laminate. Preferably, the metal foil 170 is copper foil.
  • the said copper foil includes all the copper foils manufactured by the rolling method and the electrolytic method.
  • the copper foil may be subjected to rust prevention treatment in order to prevent the surface from being oxidized and corroded.
  • the metal foil 170 may have a predetermined surface roughness Rz formed on one surface in contact with the fluorine-based film 130.
  • the surface roughness (Rz) is preferably in the range of 0.5 to 5.0 ⁇ m. If the surface roughness is less than 0.5 ⁇ m, the adhesion between the metal foil 170 and the fluorine-based film 130 is insufficient.
  • the thickness of the metal foil 170 is not particularly limited, but may be used less than 7 ⁇ m in consideration of the thickness and mechanical properties of the final product, preferably may be in the range of 3 to 7 ⁇ m. Examples of copper foil that can be used include CFL (TZA_B, HFZ_B), Mitsui (HSVSP, MLS-G), Nikko (RTCHP), Furukawa, ILSIN and the like.
  • a prepreg 110 impregnated by impregnation with a high heat resistant varnish as described above; Fluorine-based film 130; And the metal laminated plate 100 formed by integrally stacked at a high temperature and high pressure after the metal foil 170 is sequentially stacked may have a coefficient of thermal expansion (CTE) of 5 to 40 range.
  • CTE coefficient of thermal expansion
  • the peel strength (P / S) of the metal foil 170 to the fluorine-based film 130 in the metal laminate 100 may be in the range of 0.8 to 1.5 kgf / cm.
  • An embodiment of the present invention includes a method of manufacturing a metal laminate plate formed by laminating the prepreg and the fluorine-based film described above to form a laminate, and then laminating the metal foil on the laminate and molding the same by a high temperature compression process. .
  • the method of manufacturing a metal laminate 100 comprises the steps of (a) manufacturing a prepreg 110 by impregnating a glass fiber in the high heat-resistant resin composition and then semi-curing; (b) sequentially stacking the fluorine-based film 130 and the metal foil 170 on both surfaces of the prepreg 110, and then performing a high temperature compression process to integrate them.
  • the high temperature compression process of step (b) is preferably carried out for 10 minutes to 3 hours at a temperature of 270 to 400 °C.
  • one embodiment of the present invention includes a multilayer printed circuit board, preferably a multilayer printed circuit board, including at least one selected from the group consisting of the core layer, the fluorine-based film, and the metal foil described above.
  • the printed circuit board refers to a printed circuit board laminated by one or more layers by a plating through hole method, a buildup method, or the like, and may be manufactured by a conventional method known in the art. As a preferable example thereof, it can be manufactured by opening a hole in the metal laminated plate 100 according to the present invention to perform through hole plating, and then forming a circuit by etching a metal foil including a plating film.
  • the metal laminate 200 according to another embodiment of the present invention is the same except that the structure of the core layer and the lamination method of the fluorine-based film are different from those of the metal laminate plate 100 described above with reference to FIG. 1. Therefore, the description of the same configuration is omitted for the sake of brevity of the specification.
  • a metal laminate comprising a core layer including a fiber substrate, a fluorine-based film laminated on both sides of the core layer, and a metal foil laminated on the fluorine-based film.
  • the core layer means a fiber base, preferably glass fiber (Spread G / F).
  • FIG. 2 is a schematic cross-sectional view of the metal laminate 200 according to another embodiment of the present invention.
  • the metal laminate 200 may include a fiber base 210, a fluorine-based film 230 laminated on both sides of the fiber base, and a metal foil 270 stacked on the fluorine-based film. Can be.
  • the fiber substrate 210 may be arbitrarily bent, may be used in the art of conventional flexible inorganic fiber substrates, organic fiber substrates, or a mixture thereof. What is necessary is just to select the above-mentioned fiber base material based on the use or performance to be used.
  • the fiber substrate 210 it is preferable to use spread G / F as the fiber substrate 210.
  • the spread glass fibers are glass fibers; And an inorganic binder.
  • Spread glass fibers can be prepared by a conventional method, for example, after stirring the glass fiber and the inorganic binder solution to form a mixed solution, to remove the water from the mixed solution to obtain an extract and then to compress and dry the extract It can be prepared by the method.
  • the inorganic binder is not particularly limited, but may be an aluminum compound produced by neutralizing an acidic solution (eg, aluminum sulfate) and a basic solution (eg, sodium hydroxide) containing aluminum.
  • an acidic solution eg, aluminum sulfate
  • a basic solution eg, sodium hydroxide
  • the metal laminate 200 includes a fluorine-based film 230 laminated on both surfaces of the fiber substrate 210 as a low dielectric constant material.
  • the fluorine-based film 230 in the form of a film so as not to impair the excellent electrical properties and high heat resistance of the material having a low dielectric constant
  • an example of the fluorine-based film used is perfluoro alkoxy ( PFA) films are preferred.
  • the prepreg 110 and the fluorine-based film 130 may be formed by laminating the fluorine-based film 130 on the prepreg 110 in a semi-cured state in which the high heat-resistant resin composition is impregnated with the fiber substrate.
  • the laminate 150 is formed.
  • the laminate 250 of the fiber base 210 and the fluorine film 230 is laminated by stacking the fluorine-based film 230 on both sides of the fiber base 210 by a press process. To form.
  • the metal laminate 200 includes a metal foil 270 laminated on the laminate 250 of the fiber base 210 and the fluorine-based film 230. At this time, the metal foil 270 is laminated on the laminate 250 and then integrated by a high temperature compression process to form the metal laminate 200.
  • Another embodiment of the present invention includes a method of manufacturing a metal laminated plate that is formed by sequentially laminating the above-described fiber substrate and the fluorine-based film to form a laminate, and then laminating metal foils and molding them by a high temperature compression process.
  • the manufacturing method of the metal laminate 200 (a) to prepare a laminate 250 by laminating the fluorine-based film 230 on the upper and lower surfaces of the fiber base 210, respectively. Making; And (b) stacking the metal foils 270 on the upper and lower surfaces of the laminate, and then integrating the same into a high temperature compression process.
  • the high temperature compression process of step (b) is preferably carried out for 10 minutes to 3 hours at a temperature of 270 to 400 °C.
  • another embodiment of the present invention includes a laminated printed circuit board, preferably a multilayer printed circuit board, including at least one selected from the group consisting of the fiber substrate, the fluorine-based film, and the metal foil.
  • the metal laminate may be prepared from the core layer, the fluorine-based film, and the metal foil according to the present invention.
  • These metal laminates not only had low dielectric constant and dielectric loss, but also had a low coefficient of thermal expansion (CTE) and good adhesion stability (see Table 1 below). Therefore, the metal laminate of the present invention is a network printed circuit board used in mobile communication devices that handle high frequency signals of 1 GHz or more, network-based electronic devices such as base station devices, servers, routers, and various electrical and electronic devices such as large computers. It can be usefully used as a component.
  • a high heat resistant resin composition was prepared with a high heat resistant epoxy resin composition and a resin varnish was prepared.
  • the prepared resin varnish was impregnated with a glass fiber having a thickness of 1 to 2 ⁇ m, and then dried at 165 ° C. for 1 to 10 minutes to prepare a prepreg in a semi-cured state.
  • a 50 ⁇ m (0.05T) thick perfluoro alkoxy (PFA) film (40 wt% silica) was laminated on both sides of the prepreg to obtain a laminate.
  • a copper foil laminated plate was obtained in the same manner as in Example 1 except that a polytetrafluoro film (50 wt%) was used.
  • PFA perfluoro alkoxy
  • the copper foil of 18 micrometers thickness was laminated
  • the prepared 25 ⁇ m-thick glass fibers were impregnated with a polytetrafluoroemulsion three times or more, and then dried at 165 ° C. for 3 to 10 minutes to prepare a polytetrafluoro prepreg.
  • Modulus of elasticity (Young Modulus, MPa): Measured using a UTM equipment in accordance with the test standard of IPC TM-650 2.4.4 / ASTM D3039.
  • Elongation (Elong,%): Measured using UTM equipment according to the test standard of IPC TM-650 2.4.4 / ASTM D3039.
  • TGA Ash% (Air) TGA (Thermogravimetric) was measured according to the test standard of IPC TM-650.2.4.24.6.
  • Dielectric constant (Dk) Measured using a material analyzer in accordance with the test standard of IPC TM-650.2.5.5.1.
  • Dielectric loss (Df) measured using a material analyzer in accordance with the test standard of IPC TM-650.2.5.5.1.
  • Example 2 Example 3 Filler Type - SC-2500SQ SC-2500SQ SC-2500SQ Film appearance Good Good bow Good Molding appearance Good Good bow Good Tensile strength (MPa) 40 85 74 86 Modulus of elasticity (MPa) 2017 2792 2902 2654 Elongation (%) 10 6 5 6 CTE (x / y, ppm) 27 18 12 17 CTE (z, ppm) 200 35 27 34 P / S (Hoz) 1.3 ⁇ 3.4 1.2 1.05 1.25 TGA Ash% (Air) - 39 48 39 S / F @ 288 > 10 minutes > 10 minutes > 10 minutes > 10 minutes > 10 minutes 10 minutes 10 Ghz Dk 2.2 2.76 2.85 2.78 Df 0.001 0.0012 0.0014 0.0012

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne un stratifié métallique et un procédé de fabrication de celui-ci. Le stratifié métallique comprend : une couche centrale comprenant un matériau fibreux ; et un film à base de fluor stratifié des deux côtés de la couche centrale ; une feuille métallique stratifiée sur le film à base de fluor, le film à base de fluor comprenant une charge. La présente invention peut réaliser un stratifié métallique pour ultra-hautes fréquences, qui présente simultanément d'excellentes caractéristiques de faible perte diélectrique, une bonne résistance à la chaleur, une excellente stabilité d'adhérence, etc.
PCT/KR2017/015122 2016-12-23 2017-12-20 Stratifié métallique et procédé de fabrication de celui-ci WO2018117636A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160177841A KR101939449B1 (ko) 2016-12-23 2016-12-23 금속적층판 및 이의 제조방법
KR10-2016-0177841 2016-12-23

Publications (1)

Publication Number Publication Date
WO2018117636A1 true WO2018117636A1 (fr) 2018-06-28

Family

ID=62626687

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/015122 WO2018117636A1 (fr) 2016-12-23 2017-12-20 Stratifié métallique et procédé de fabrication de celui-ci

Country Status (2)

Country Link
KR (1) KR101939449B1 (fr)
WO (1) WO2018117636A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3904449A4 (fr) * 2018-12-27 2022-08-17 Doosan Corporation Composition de résine, stratifié métallique et carte de circuit imprimé l'utilisant, et procédé de fabrication de stratifié métallique
CN115198564A (zh) * 2022-07-05 2022-10-18 广东生益科技股份有限公司 一种低介电损耗无纺布及其制备方法和应用
CN115322500A (zh) * 2022-08-30 2022-11-11 哈尔滨工业大学（深圳） 聚四氟乙烯半固化片及其制备方法、覆铜板
CN115341404A (zh) * 2022-08-15 2022-11-15 黄河三角洲京博化工研究院有限公司 一种对位芳纶纳米纤维增强的覆铜板及其制备方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230124159A (ko) * 2022-02-17 2023-08-25 주식회사 두산 롤 타입의 연성 금속 적층판, 이를 제조하는 방법 및 상기 연성 금속 적층판을 포함하는 인쇄회로기판

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120021243A (ko) * 2010-08-30 2012-03-08 스미토모 베이클리트 컴퍼니 리미티드 금속 부착 적층판 및 그 제조 방법
KR20130066527A (ko) * 2011-12-12 2013-06-20 주식회사 엘지화학 연성 금속박 적층판
US20130295388A1 (en) * 2010-09-08 2013-11-07 Guangdong Shengyi Sci. Tech Co., Ltd. Epoxy resin composition and copper clad laminate manufactured by using same
KR20150082730A (ko) * 2014-01-06 2015-07-16 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
WO2016104297A1 (fr) * 2014-12-26 2016-06-30 旭硝子株式会社 Procédé de fabrication de stratifié et procédé de fabrication de carte de circuit imprimé flexible

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2219174B1 (es) * 2003-03-27 2006-02-01 Chemplate Materials, S.L. "procedimiento para la fabricacion de placas para circuitos impresos y maquina para el mismo".
JP4957079B2 (ja) * 2006-05-29 2012-06-20 旭硝子株式会社 プリント回路基板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120021243A (ko) * 2010-08-30 2012-03-08 스미토모 베이클리트 컴퍼니 리미티드 금속 부착 적층판 및 그 제조 방법
US20130295388A1 (en) * 2010-09-08 2013-11-07 Guangdong Shengyi Sci. Tech Co., Ltd. Epoxy resin composition and copper clad laminate manufactured by using same
KR20130066527A (ko) * 2011-12-12 2013-06-20 주식회사 엘지화학 연성 금속박 적층판
KR20150082730A (ko) * 2014-01-06 2015-07-16 주식회사 두산 수지 이중층 부착 동박, 이를 포함하는 다층 인쇄 회로 기판 및 그 제조 방법
WO2016104297A1 (fr) * 2014-12-26 2016-06-30 旭硝子株式会社 Procédé de fabrication de stratifié et procédé de fabrication de carte de circuit imprimé flexible

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3904449A4 (fr) * 2018-12-27 2022-08-17 Doosan Corporation Composition de résine, stratifié métallique et carte de circuit imprimé l'utilisant, et procédé de fabrication de stratifié métallique
US11820885B2 (en) 2018-12-27 2023-11-21 Doosan Corporation Resin composition, metal laminate and printed circuit board using same, and method for manufacturing metal laminate
CN115198564A (zh) * 2022-07-05 2022-10-18 广东生益科技股份有限公司 一种低介电损耗无纺布及其制备方法和应用
CN115198564B (zh) * 2022-07-05 2023-12-22 广东生益科技股份有限公司 一种低介电损耗无纺布及其制备方法和应用
CN115341404A (zh) * 2022-08-15 2022-11-15 黄河三角洲京博化工研究院有限公司 一种对位芳纶纳米纤维增强的覆铜板及其制备方法
CN115341404B (zh) * 2022-08-15 2023-10-13 黄河三角洲京博化工研究院有限公司 一种对位芳纶纳米纤维增强的覆铜板及其制备方法
CN115322500A (zh) * 2022-08-30 2022-11-11 哈尔滨工业大学（深圳） 聚四氟乙烯半固化片及其制备方法、覆铜板

Also Published As

Publication number Publication date
KR101939449B1 (ko) 2019-04-10
KR20180074110A (ko) 2018-07-03

Similar Documents

Publication Publication Date Title
WO2018117636A1 (fr) Stratifié métallique et procédé de fabrication de celui-ci
JP6572983B2 (ja) エポキシ樹脂組成物
KR101140626B1 (ko) 폴리이미드 수지용 조성물 및 그 폴리이미드 수지용 조성물로 이루어지는 폴리이미드 수지
WO2015080445A1 (fr) Composition de résine thermodurcissable ayant des caractéristiques de résistance à la chaleur et de basse perte diélectrique, pré-imprégné l'utilisant, et stratifié revêtu de cuivre
KR101865286B1 (ko) 적층판, 금속박 적층판, 인쇄 배선판, 다층 인쇄 배선판
KR102396894B1 (ko) 지지 기판, 지지 기판이 부착된 적층체 및 반도체 소자 탑재용 패키지 기판의 제조 방법
US8935851B2 (en) Method for manufacturing a circuit board
WO2016105131A1 (fr) Procédé de fabrication d'un film de blindage contre les ondes électromagnétiques pour carte de circuits imprimés souple
TW201909712A (zh) 多層印刷配線板之製造方法
TW201828793A (zh) 內置厚導體之印刷配線板及其製造方法
WO2015105340A1 (fr) Film de blindage contre les ondes électromagnétiques pour carte de circuit imprimé souple et son procédé de fabrication
WO2015088245A1 (fr) Composition de résine thermodurcissable pour haute fréquence ayant une faible perte diélectrique, préimprégné l'utilisant, et stratifié plaqué cuivre
US20220051958A1 (en) Method for producing package substrate for mounting semiconductor device
WO2015102461A1 (fr) Feuille de cuivre à laquelle est fixée une double couche de résine, carte de circuits imprimés multicouche la comprenant, et leur procédé de fabrication
WO2020121652A1 (fr) Procédé de fabrication de substrat de boîtier pour installation d'élément semi-conducteur
WO2014098495A1 (fr) Laminé à revêtement en métal flexible multicouche et procédé de fabrication correspondant
KR101423401B1 (ko) 다층 인쇄 회로 기판 및 그 제조 방법
KR101641210B1 (ko) 저열팽창 프리프레그의 제조방법 및 금속박 적층판의 제조방법
WO2023158259A1 (fr) Stratifié métallique souple de type rouleau, son procédé de fabrication, et carte de circuit imprimé comprenant un stratifié métallique souple
JPH08157621A (ja) プリプレグ並びにこれを用いたプリント基板及びカバーレイフィルム
WO2018012775A1 (fr) Composition de résine thermodurcissable, pré-imprégné utilisant ladite composition de résine thermodurcissable, feuille stratifiée et carte de circuit imprimé
WO2018004190A1 (fr) Revêtement de cuivre - couche primaire et stratifié revêtu de cuivre
WO2016105051A1 (fr) Composition de résine thermodurcissable destinée à être utilisée à des fréquences élevées, et pré-imprégné, feuille stratifiée et carte de circuit imprimé l'utilisant
WO2015102135A1 (fr) Vis à fonction isolante
JP2762544B2 (ja) 低誘電率プリント配線板材料

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17884722

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205 DATED 06/08/2019)

122 Ep: pct application non-entry in european phase

Ref document number: 17884722

Country of ref document: EP

Kind code of ref document: A1