WO2018101001A1 - Capteur infrarouge - Google Patents

Capteur infrarouge Download PDF

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Publication number
WO2018101001A1
WO2018101001A1 PCT/JP2017/040418 JP2017040418W WO2018101001A1 WO 2018101001 A1 WO2018101001 A1 WO 2018101001A1 JP 2017040418 W JP2017040418 W JP 2017040418W WO 2018101001 A1 WO2018101001 A1 WO 2018101001A1
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WO
WIPO (PCT)
Prior art keywords
light receiving
infrared
receiving element
lenses
lens
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Application number
PCT/JP2017/040418
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English (en)
Japanese (ja)
Inventor
久也 小林
橋本　裕介
Original Assignee
パナソニックＩｐマネジメント株式会社
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Publication of WO2018101001A1 publication Critical patent/WO2018101001A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G01V8/10—Detecting, e.g. by using light barriers
    • G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver

Definitions

  • the present invention relates generally to infrared detection devices, and more particularly, to an infrared detection device including a light receiving system that receives infrared light from a detection area.
  • Patent Document 1 a heat ray type human sensor that detects the presence or absence of a person in a predetermined detection area by detecting heat rays (infrared rays) emitted from a human body is known (Patent Document 1) ).
  • the hot-wire type human sensor described in Patent Document 1 includes a sensor element and a light receiving lens (hereinafter referred to as "multi-lens").
  • the sensor element detects the heat radiation emitted from the human body and generates an output according to the time change of the incident heat dose.
  • the multi-lens consists of an assembly of a large number of lens bodies (hereinafter referred to as "lens”) that cause heat rays in each area in the detection area to converge on the sensor element.
  • the multi-lens is formed in a hemispherical shape surrounding the light receiving surface of the sensor element.
  • the multiple lenses in the multi-lens are arranged in a triple circle, with 4 lenses on the innermost circle, 8 lenses on the next largest circle, and 12 on the outermost circle The lens is formed.
  • the heat dose incident on the sensor element through the lenses arranged on the outermost circle is the heat ray incident on the sensor element through the lenses arranged on the inner circle Less than amount. Therefore, in the above-mentioned hot-wire type human sensor, the sensitivity in the region corresponding to the lenses arranged on the outermost circle may be lowered.
  • An object of the present invention is to provide an infrared detection device capable of suppressing variation in sensitivity in a detection area.
  • the infrared detection device includes a light receiving system that receives infrared light from the detection area.
  • the light receiving system includes a first light receiving unit and a plurality of second light receiving units.
  • the first light receiving unit includes a first light receiving element and a first multi lens.
  • the first multi lens has a plurality of first lenses for condensing infrared light on the first light receiving element.
  • Each of the plurality of second light receiving units includes a second light receiving element and a second multi lens.
  • the second multi lens includes a plurality of second lenses that condense infrared light on the second light receiving element.
  • each of the plurality of small detection areas obtained by dividing the detection area is associated with one of the first light receiving unit and the plurality of second light receiving units.
  • one small detection area of the plurality of small detection areas is associated with each of the plurality of first lenses of the first light receiving unit.
  • one small detection area of the plurality of small detection areas is associated with each of the plurality of second lenses of each of the plurality of second light receiving units.
  • the optical axes of the second light receiving elements of the plurality of second light receiving units are inclined in directions different from each other with respect to the optical axis of the first light receiving element.
  • the number of the first group of small detection areas associated with the first light receiving unit among the plurality of small detection areas is associated with each of the plurality of second light receiving units among the plurality of small detection areas It is more than the number of small detection areas in the second group.
  • FIG. 1 is an exploded perspective view of an infrared detection device according to an embodiment of the present invention.
  • FIG. 2A is a perspective view from above of the infrared ray detection device of the same.
  • FIG. 2B is a perspective view of the lower side of the infrared detection device of the same.
  • FIG. 3A is a bottom view of a light receiving system in the above infrared detecting device.
  • FIG. 3B is a bottom view through the left half of the light receiving system in the above infrared detecting device.
  • FIG. 4 is a cross-sectional view of the above infrared detection device.
  • FIG. 5 is a perspective view of an infrared sensor including a light receiving element in the above infrared detecting device.
  • FIG. 6A is a plan view of a light receiving system in the above infrared detecting device.
  • FIG. 6B is an explanatory diagram of a detection area of the above infrared detection device.
  • FIG. 7 is an explanatory view of a small detection area in the detection area of the above infrared detection device.
  • FIG. 8 is an explanatory view of a first multi lens and a second multi lens in the infrared detection device of the same.
  • FIG. 9 is an explanatory view of a detection area of the above infrared detection device.
  • each drawing described in the following embodiment is a schematic drawing, and the ratio of the size and thickness of each component in the drawing does not necessarily reflect the actual dimensional ratio. .
  • the infrared detection device 100 is used, for example, for human body detection to detect the presence or absence of a person (detection target) in the detection area 11 (see FIGS. 4 and 6B). That is, the infrared detection device 100 is an infrared human-body detection device that detects a human body in the detection area 11.
  • the infrared detection device 100 includes a light receiving system 1 that receives infrared light from the detection area 11.
  • the light receiving system 1 includes a first light receiving unit 2a and a plurality of (four) second light receiving units 2b.
  • the first light receiving unit 2a includes a first infrared sensor 3a having a first light receiving element 30a (see FIGS. 4 and 6A), and a first optical member 6a having a first multi-lens 5a.
  • the first multi lens 5a has a plurality of (30) first lenses 50a (see FIGS. 6A and 8) for condensing infrared light on the first light receiving element 30a.
  • Each of the plurality of second light receiving units 2b includes a second infrared sensor 3b having a second light receiving element 30b (see FIGS. 4 and 6A) and a second optical member 6b having a second multi lens 5b.
  • the second multi lens 5 b has a plurality (15) of second lenses 50 b (see FIGS. 6A and 8) for condensing infrared light on the second light receiving element 30 b.
  • the infrared detection device 100 further includes a circuit board 7.
  • the first infrared sensor 3a and the plurality of second infrared sensors 3b are mounted on the circuit board 7.
  • the first infrared sensor 3a is mounted on the circuit board 7 such that the optical axis 39a (see FIG. 4) of the first light receiving element 30a is substantially parallel to the thickness direction of the circuit board 7.
  • each of the plurality of (four) second infrared sensors 3b is mounted on the circuit board 7 so that the optical axis 39b (see FIG. 4) of the second light receiving element 30b is inclined with respect to the thickness direction of the circuit board 7.
  • the plurality of second infrared sensors 3b are inclined in different directions.
  • the infrared detection device 100 further includes a base 8.
  • the base 8 holds the first light receiving unit 2 a, the plurality of second light receiving units 2 b, and the circuit board 7.
  • the infrared detection device 100 the relative position of the first light receiving element 30a of the first infrared sensor 3a mounted on the circuit board 7 and the first multi-lens 5a is determined.
  • the second multi-lens 5b corresponding to one-to-one of the second light receiving elements 30b of the plurality of second infrared sensors 3b mounted on the circuit board 7 and the plurality of second multi-lenses 5b. The relative position with is determined.
  • the infrared detection device 100 further includes a signal processing unit 9.
  • the signal processing unit 9 determines whether or not a person is present in the detection area 11 based on the output signals of the first light receiving element 30a and the plurality of second light receiving elements 30b.
  • the signal processing unit 9 is configured to output a determination result as to whether or not a person is present in the detection area 11 to an external device (external circuit).
  • the infrared detection device 100 includes the first infrared sensor 3 a, the plurality of second infrared sensors 3 b, the first multi lens 5 a, the plurality of second multi lenses 5 b, the circuit board 7, and the base 8. And the signal processing unit 9.
  • the first light receiving element 30a and the second light receiving element 30b have the same configuration, and therefore, in the following, for convenience of description, when the two are not distinguished from each other, they are simply referred to as the light receiving element 30.
  • the optical axis 39a of the first light receiving element 30a and the optical axis 39b of the second light receiving element 30b are described without distinction, they are simply referred to as the optical axis 39.
  • the first infrared sensor 3a and the second infrared sensor 3b have the same configuration, for convenience of explanation, when the two are not distinguished without being distinguished from each other, they will be referred to simply as the infrared sensor 3.
  • the infrared sensor 3 has a light receiving element 30.
  • the light receiving element 30 is a thermal infrared detection element. More specifically, the light receiving element 30 is a quad type pyroelectric element, and four detection units are arranged in a 2 ⁇ 2 array (matrix) in one pyroelectric substrate. Each of the four detection units includes a first electrode disposed on the first surface of the pyroelectric substrate, a second electrode disposed on the second surface opposite to the first surface, and pyroelectric It is a capacitor including the part between the 1st electrode and the 2nd electrode among body substrates.
  • the first electrode is composed of a conductive film (for example, a NiCr film) that absorbs infrared light.
  • the optical axis 39 of the light receiving element 30 is a normal which is erected at the center of a polygon (for example, a square) including the light receiving surface of each of the four detection portions when the light receiving element 30 is viewed from one direction in the thickness direction. .
  • the light receiving element 30 receives infrared light, and outputs a current signal according to the change in the amount of the received infrared light.
  • the infrared sensor 3 includes an IC (Integrated Circuit) element including a conversion circuit that converts a current signal output from the light receiving element 30 into a voltage signal.
  • the conversion circuit includes, for example, a current-voltage conversion circuit and a voltage amplification circuit.
  • the current-voltage conversion circuit is a circuit that converts a current signal, which is an output signal output from the light receiving element 30, into a voltage signal and outputs the voltage signal.
  • the voltage amplification circuit is a circuit that amplifies and outputs a voltage signal of a predetermined frequency band (for example, 0.1 Hz to 10 Hz) among voltage signals converted by the current-voltage conversion circuit.
  • the voltage amplification circuit has a function as a band pass filter.
  • the function as a band pass filter is a function of passing the component of the predetermined frequency band out of the voltage signal output from the current-voltage conversion circuit and removing an unnecessary frequency component which becomes noise.
  • the infrared sensor 3 includes a mounting substrate on which the light receiving element 30 and the IC element are mounted.
  • the mounting substrate is, for example, a molded substrate.
  • the infrared sensor 3 also includes a package 33 (see FIG. 5) that accommodates a circuit module including the light receiving element 30, the IC element, and the mounting substrate.
  • the package 33 is a so-called can package (Can Package).
  • the can package is also called a metal package (Metal Package).
  • the package 33 as shown in FIG. 5, includes a pedestal 331, a cap 332, a window member 333 and three lead terminals 334.
  • the pedestal 331 has conductivity.
  • the pedestal 331 is made of metal.
  • the pedestal 331 has a disk shape, and supports the mounting substrate on one side in the thickness direction.
  • the cap 332 is conductive.
  • the cap 332 is made of metal.
  • the cap 332 is cylindrical with a bottom, and is fixed to the pedestal 331 so as to cover the circuit module.
  • the window member 333 is an infrared transmitting member that transmits infrared light.
  • the window member 333 preferably has conductivity.
  • the window material 333 includes, for example, a silicon substrate.
  • the window member 333 preferably includes an infrared optical filter stacked on the silicon substrate in addition to the silicon substrate.
  • the infrared optical filter is an optical multilayer film that transmits infrared light in the wavelength region of the detection target of the infrared detection device 100.
  • the window member 333 is arranged to close the window hole 3322 formed in the front wall 3321 of the cap 332.
  • the window member 333 is bonded to the cap 332 by a conductive material, and is electrically connected to the cap 332.
  • the window member 333 is disposed in front of the light receiving surface of the light receiving element 30. In the infrared sensor 3, it is preferable that the light receiving element 30 be disposed such that the optical axis 39 of the light receiving element 30 passes through the center of the window member 333.
  • the three lead terminals 334 are held by the pedestal 331. Each of the three lead terminals 334 is pin-shaped. Each of the three lead terminals 334 penetrates the pedestal 331 in the thickness direction of the pedestal 331.
  • the three lead terminals 334 are a power supply lead terminal, a signal output lead terminal, and a ground lead terminal.
  • the five infrared sensors 3 are mounted on a rectangular plate-shaped circuit board 7.
  • the circuit board 7 is, for example, a printed circuit board.
  • the circuit board 7 has a first surface 71 intersecting in the thickness direction, and a second surface 72 opposite to the first surface 71.
  • the four second light receiving elements 30b are arranged on the first surface 71 side of the circuit board 7 so as to be arranged at substantially equal intervals on one virtual circle, and the first light receiving elements 30a are It is arranged at the center of the above virtual circle.
  • each second light receiving element 30b is disposed one by one at four corners of the virtual square on the first surface 71 side of the circuit board 7, and the first light receiving element 30a Is located at the center of the virtual square.
  • the optical axis 39 a (see FIG. 4) of the first light receiving element 30 a is orthogonal to the first surface 71 of the circuit board 7.
  • the optical axis 39 b (see FIG. 4) in each of the plurality of second light receiving elements 30 b intersects with the first surface 71 of the circuit board 7.
  • the angle between the normal line erected at the center of the virtual circle and the optical axis 39b of the second light receiving element 30b is the same.
  • the plurality of second infrared sensors 3b are mounted on the circuit board 7 such that the optical axes 39b of the second light receiving elements 30b are inclined in different directions with respect to the normal line erected at the center of the virtual circle. .
  • the circuit board 7 is provided with a plurality of sets (five sets) of three pin insertion holes 74 (see FIGS. 1 and 4) for passing the three lead terminals 334 in each of the plurality (five) infrared sensors 3 one by one. ing.
  • the circuit board 7 is disposed on the upper surface of the central portion 801 expanded upward in the disk-like base 8, and is held by the base 8.
  • the plurality of infrared sensors 3 mounted on the circuit board 7 are disposed on the lower surface side of the central portion 801 of the base 8.
  • the base 8 has electrical insulation.
  • the material of the base 8 is, for example, a synthetic resin.
  • the base 8 includes a first spacer portion 81a interposed between the first infrared sensor 3a and the circuit board 7, and a plurality of pedestals interposed between the pedestals 331 of the plurality of second infrared sensors 3b and the circuit board 7. And a second spacer portion 81b.
  • the first spacer portion 81a is formed with a plurality of holes 82a through which each of the three lead terminals 334 of the first infrared sensor 3a passes one by one.
  • the surface 811 a facing the pedestal 331 of the infrared sensor 3 is orthogonal to the optical axis 39 a of the first light receiving element 30 a and parallel to the first surface 71 of the circuit board 7.
  • the surface 811 b facing the pedestal 331 of the infrared sensor 3 is orthogonal to the optical axis 39 b of the second light receiving element 30 b and with respect to the first surface 71 of the circuit board 7 It is inclined.
  • the infrared detection device 100 preferably further includes a plurality of (four) light blocking walls 83 (see FIG. 4).
  • Each of the plurality of light blocking walls 83 is semi-cylindrical.
  • Each of the plurality of light shielding walls 83 surrounds the pedestal 331 of the second infrared sensor 3b corresponding to one to one of the plurality of second infrared sensors 3b and the substantially half circumference of the cap 332, and the second infrared sensor 3b and the first infrared It is arranged between the sensor 3a.
  • the plurality of light shielding walls 83 may be integrally formed with the base 8 or may be separately formed and fixed to the base 8.
  • the base 8 includes four first walls 84 on the lower surface side of the central portion 801, in which the first optical member 6a is disposed.
  • each of the four first walls 84 has an arc shape, and is disposed at substantially equal intervals in the circumferential direction of the first optical member 6a.
  • the first optical member 6a is fixed to two first walls 84 of the four first walls 84 of the base 8 by two first screws (not shown).
  • the base 8 is provided with four second walls 85 on the lower surface side of the peripheral portion 802, in which each of the plurality of second optical members 6b is disposed.
  • Each of the four second walls 85 has a C shape in which the first optical member 6 a side is opened as viewed from the lower surface side of the base 8.
  • each of the plurality of second optical members 6b is fixed to the second wall 85 of the base 8 by two second screws (not shown).
  • the first optical member 6a has a bottomed cylindrical first optical member main body 60a and a first flange 62a projecting outward from the upper end of the first optical member main body 60a all around. And.
  • the first multi lens 5a is formed on the bottom wall 61a of the lower end of the first optical member main body 60a.
  • the first optical member 6 a is disposed such that the first flange 62 a overlaps the lower end surfaces of the four first walls 84 of the base 8.
  • each of the second optical members 6b has a box-shaped second optical member body 60b with a bottom and a second flange 62b protruding outward from the upper end of the second optical member body 60b.
  • the peripheral wall of the second optical member main body 60b has a C shape in which the first optical member 6a side is opened as viewed from the base 8 side.
  • the second multi lens 5b is formed on the bottom wall 61b of the lower end of the second optical member main body 60b.
  • the second optical member 6 b is disposed such that the second flange 62 b overlaps the lower end surface of the second wall 85 of the base 8.
  • a first surface 501a (see FIG. 4) on which infrared light from the outside (detection area 11) is incident is constituted by a group of incident surfaces of the plurality of first lenses 50a.
  • the second surface 502a (see FIG. 4) from which infrared light is emitted in the first multi-lens 5a is formed of a group of emission surfaces of the plurality of first lenses 50a.
  • Each of the plurality of first lenses 50a in the first multi lens 5a is a condensing lens, and is configured by a convex lens.
  • the convex lens which comprises each of the some 1st lens 50a is an aspherical lens from a viewpoint of making an aberration smaller.
  • the plurality of (30) first lenses 50a are divided into a plurality of (3) different rows from the optical axis 39a of the first light receiving element 30a.
  • the plurality of (30) first lenses 50a are on the first virtual circle C1, the second virtual circle C2 and the third virtual circle C3 having different radii. It is divided and arranged. The radiuses of the first virtual circle C1, the second virtual circle C2 and the third virtual circle C3 increase in this order.
  • the four first lenses 50a are arranged on the first virtual circle C1
  • the ten first lenses 50a are arranged on the second virtual circle C2
  • the third lenses are arranged on the third virtual circle C3.
  • Sixteen first lenses 50a are arranged.
  • the first multi lens 5a is preferably designed such that the focal points of the plurality of first lenses 50a on the first light receiving element 30a side are at the same position.
  • the first multi-lens 5a is preferably configured such that the infrared rays transmitted through each of the plurality of first lenses 50a directly enter the window member 333 of the first infrared sensor 3a.
  • the infrared rays to be controlled by each of the plurality of first lenses 50a in the first multi-lens 5a are, for example, infrared rays in a wavelength range of 5 ⁇ m to 25 ⁇ m.
  • a first surface 501b (see FIG. 4) to which infrared light from the outside (detection area 11) is incident is constituted by a group of incident surfaces of the plurality of second lenses 50b.
  • the second surface 502b (see FIG. 4) from which infrared light is emitted in the second multi lens 5b is configured by a group of emission surfaces of the plurality of second lenses 50b.
  • Each of the plurality of second lenses 50b in the second multi lens 5b is a condensing lens, and is configured by a convex lens.
  • the convex lenses that constitute each of the plurality of second lenses 50b are aspheric lenses.
  • Each of the plurality of second lenses 50b is preferably a Fresnel lens from the viewpoint of reducing the thickness.
  • the plurality of (15) second lenses 50b are divided into a plurality of (three) rows in which the distances from the optical axis 39a of the first light receiving element 30a are different from each other.
  • a plurality of (15) second lenses 50b are on the fourth virtual circle C4, the fifth virtual circle C5, and the sixth virtual circle C6 having mutually different radii. It is divided and arranged.
  • the radiuses of the fourth virtual circle C4, the fifth virtual circle C5, and the sixth virtual circle C6 increase in this order.
  • the radius of the fourth virtual circle C4 is larger than the radius of the third virtual circle C3.
  • the centers of the first virtual circle C1 to the sixth virtual circle C6 are the same.
  • five second lenses 50b are arranged on the fourth virtual circle C4, and seven second lenses 50b are arranged on the fifth virtual circle C5, and on the sixth virtual circle C6.
  • Three second lenses 50b are arranged.
  • the first virtual circle C1 to the sixth virtual circle C1 to the sixth virtual circle 50 can be seen from the second to third second lenses 50b arranged in the one radial direction common to the first virtual circle C1 to the sixth virtual circle C6.
  • the lens area is larger as the second lens 50b is farther from the center common to the circle C6.
  • the second multi lens 5 b is designed such that the focal points of the plurality of second lenses 50 b on the second light receiving element 30 b side are at the same position.
  • the second multi lens 5b is preferably configured such that the infrared rays transmitted through each of the plurality of second lenses 50b directly enter the window member 333 of the second infrared sensor 3b.
  • the infrared rays to be controlled by each of the plurality of second lenses 50b in the second multi-lens 5b are, for example, infrared rays in a wavelength range of 5 ⁇ m to 25 ⁇ m.
  • the material of the first multi-lens 5a and the second multi-lens 5b is, for example, polyethylene. More specifically, the material of the first multi-lens 5a is polyethylene to which a white pigment or a black pigment is added. As the white pigment, for example, it is preferable to use an inorganic pigment such as titanium oxide. As the black pigment, for example, fine particles of carbon black or the like are preferably employed.
  • the first multi lens 5a and the second multi lens 5 b can be formed, for example, by a molding method. As a molding method, an injection molding method, a compression molding method, etc. are employable, for example.
  • the infrared detection device 100 is disposed on a ceiling or the like so that the center line 110 (see FIG. 4) of the detection area 11 is directed vertically downward.
  • the infrared detection device 100 is arranged such that the light receiving surface of the first light receiving element 30a is directed vertically downward in one usage pattern.
  • the detection area 11 is a square pyramidal three-dimensional area.
  • the detection area 11 is square in a horizontal plane perpendicular to the center line 110.
  • the solid angle of the detection area 11 of the infrared detection device 100 is defined by the first light receiving unit 2a and the plurality of second light receiving units 2b.
  • each of a plurality of (90) small detection areas 13 obtained by dividing the detection area 11 is a first light receiving unit 2a and a plurality of (four) second light receiving units 2b.
  • Is associated with one of the FIG. 6B is a diagram schematically showing the detection area 11 of the infrared detection device 100 on a virtual plane 120 (for example, a floor surface) orthogonal to the center line 110 of the detection area 11.
  • a virtual plane 120 for example, a floor surface
  • the detection area 11 includes a plurality of (90) small detection areas 13.
  • Each of the plurality of (90) small detection areas 13 includes a plurality of (four) minute detection areas 14 (see FIG. 7) corresponding to the plurality of (four) detection portions of the light receiving element 30 one by one.
  • the plurality of minute detection areas 14 are in different directions as viewed from the light receiving element 30.
  • Each of the plurality of minute detection areas 14 has an oblique square pyramid shape.
  • the solid angle of each of the plurality of minute detection areas 14 is smaller than the solid angle of the small detection area 13.
  • the minute detection area 14 is narrower than the small detection area 13.
  • the minute detection area 14 is a three-dimensional area formed when the infrared ray bundle incident on the detection unit of the first light receiving element 30a through the first lens 50a is extended in the direction opposite to the advancing direction of the infrared rays, or the second lens 50b The three-dimensional region is formed when the infrared ray bundle incident on the detection portion of the second light receiving element 30b is extended in the direction opposite to the advancing direction of the infrared ray.
  • the minute detection area 14 is a three-dimensional area through which an infrared ray bundle used to form an image on the light receiving surface of the detection unit of the light receiving element 30 can pass.
  • the minute detection area 14 can be estimated, for example, by the result of simulation using ray tracing analysis software.
  • Each of the plurality of minute detection areas 14 can be regarded as having a polarity corresponding to the first electrode of the detection unit in a one-to-one manner.
  • the detection area 11, each small detection area 13, and each minute detection area 14 are optically defined three-dimensional areas, not actually visible three-dimensional areas.
  • the small detection area 13 may also depend on the size and shape of the window member 333 of the infrared sensor 3 (see FIG. 5), the opening shape of the window hole 3322 and the like.
  • one small detection area 13 of the plurality of (90) small detection areas 13 is associated with each of the plurality of (30) first lenses 50a of the first light receiving unit 2a. There is. In other words, 30 small detection areas 13 out of 90 small detection areas 13 are associated with the first light receiving unit 2a. Further, in the infrared detection device 100, one of the plurality (90) of the small detection areas 13 is provided for each of the plurality of (15) second lenses 50b of each of the plurality of (four) second light receiving units 2b. The small detection area 13 is associated. In other words, 15 small detection areas 13 out of 90 small detection areas 13 are associated with each of the four second light receiving units 2b. That is, in the infrared detection device 100, the small detection area 13 in which the number (30) of the small detection areas 13 associated with the first light receiving unit 2a is associated with each of the plurality of second light receiving units 2b. More than the number of (15).
  • the infrared detection device 100 determines the signal processing unit 9 which determines whether or not a person is present in the detection area 11 based on the output signal of each of the first light receiving element 30a and the plurality of second light receiving elements 30b.
  • the signal processing unit 9 performs synchronous detection for extracting synchronous components of the output signals of the plurality of light receiving elements 30, and determines whether or not a person is present in the detection area 11 based on the result of the synchronous detection.
  • the signal processing unit 9 can be configured using, for example, a multiplier for performing synchronous detection, a comparator, and the like.
  • the component parts of the signal processing unit 9 are mounted on the circuit board 7.
  • the component parts of the signal processing unit 9 are disposed on the second surface 72 side of the circuit board 7.
  • the signal processing unit 9 may include an IC element in each of the plurality of infrared sensors 3 described above.
  • the detection area 11 is divided into a central area 11a and a peripheral area 11b.
  • the central area 11 a corresponds to the first light receiving unit 2 a, and includes 30 small detection areas 13 out of 90 small detection areas 13.
  • the peripheral area 11 b corresponds to the plurality of second light receiving units 2 b, and includes 60 small detection areas 13 out of 90 small detection areas 13.
  • the central area 11a is a circular area on the virtual plane 120 as shown in FIG. 6B.
  • the peripheral area 11b is, as shown in FIG.
  • the defined direction in the small detection area 13 of the central area 11a As shown in FIG. 4, when the direction along the direction in which the first light receiving element 30a and the second light receiving element 30b are arranged is defined as the defined direction D1, in FIG. 9, the defined direction in the small detection area 13 of the central area 11a.
  • the distance between the small detection areas 13 determined for each combination of two adjacent small detection areas 13 in D1 is a distance L1. Further, in FIG. 9, the distance between the small detection areas 13 determined for each combination of two small detection areas 13 adjacent in the specified direction D1 among the small detection areas 13 of the peripheral area 11b is a distance L2.
  • the average value of the distances L2 of a plurality (the number of combinations of two small detection areas 13 adjacent in the defined direction D1 in the peripheral area 11b) is two (small) adjacent in the defined direction D1 in the central area 11a. It is larger than the average value of the distance L1 of the number of combinations of the detection areas 13).
  • the infrared detection device 100 of the present embodiment described above includes the light receiving system 1 that receives infrared light from the detection area 11.
  • the light receiving system 1 includes a first light receiving unit 2a and a plurality of second light receiving units 2b.
  • the first light receiving unit 2a includes a first light receiving element 30a and a first multi lens 5a.
  • the first multi lens 5a has a plurality of first lenses 50a for condensing infrared light on the first light receiving element 30a.
  • Each of the plurality of second light receiving units 2b includes a second light receiving element 30b and a second multi lens 5b.
  • the second multi lens 5 b has a plurality of second lenses 50 b for condensing infrared light on the second light receiving element 30 b.
  • each of the plurality of small detection areas 13 obtained by dividing the detection area 11 is associated with one of the first light receiving unit 2a and the plurality of second light receiving units 2b.
  • one small detection area 13 of the plurality of small detection areas 13 is associated with each of the plurality of first lenses 50a of the first light receiving unit 2a.
  • one small detection area 13 out of the plurality of small detection areas 13 is associated with each of the plurality of second lenses 50b of each of the plurality of second light receiving units 2b.
  • the optical axes 39b of the second light receiving elements 30b of the plurality of second light receiving units 2b are inclined in directions different from each other with respect to the optical axis 39a of the first light receiving element 30a.
  • the number of small detection areas 13 of the first group corresponding to the first light receiving unit 2a among the plurality of small detection areas 13 corresponds to each of the plurality of second light receiving units 2b among the plurality of small detection areas 13 The number is smaller than the number of small detection areas 13 of the second group attached.
  • the infrared detection device 100 can suppress variations in sensitivity in the detection area 11.
  • the lens area of the second lens 50b corresponding to the small detection area 13 having a large inclination relative to the optical axis 39a of the first light receiving element 30a is This can be larger than the lens area of the first lens 50a having a small inclination relative to the optical axis 39a of the element 30a.
  • the detection area 11 is larger than the case where the detection area is expanded by enlarging the diameter of the hemispherical multi lens and increasing the number of rows in which the lenses are arranged in the heat ray type human sensor described above. It is possible to suppress the decrease in sensitivity on the outermost side of the lens. In other words, the infrared detection device 100 can suppress the decrease in sensitivity on the outermost peripheral side of the detection area 11 while increasing the viewing angle, and the sensitivity in the detection area 11 while increasing the viewing angle. It is possible to suppress the variation.
  • the “viewing angle” means the spread angle of the detection area 11 of the infrared detection device 100.
  • the infrared detection device 100 it is preferable that the plurality of second multi lenses 5b be arranged in the outer peripheral direction of the first multi lens 5a so as to surround the first multi lens 5a.
  • the infrared detection device 100 can make the detection area 11 wider in substantially all directions orthogonal to the optical axis 39a of the first light receiving element 30a.
  • the plurality of second light receiving units 2b are preferably at least three second light receiving units 2b.
  • the detection area 11 is a quadrangular pyramid area, compared to the case where only one first light receiving unit 2a and two second light receiving units 2b are provided, Design of each second light receiving unit 2b is facilitated.
  • the plurality of first lenses 50a are arranged in at least two rows different in distance from the optical axis 39a of the first light receiving element 30a, and the plurality of second lenses 50b are It is preferable that the distance from the optical axis 39 of the one light receiving element 30a be divided into at least two different rows.
  • the infrared detection device 100 can increase the lens area of the second lens 50b by reducing the number of the small detection areas 13 associated with each of the second light receiving units 2b. It is possible to further suppress variations in sensitivity.
  • each of the first light receiving element 30a and the second light receiving element 30b be a pyroelectric element.
  • the movement of an object for example, a human body
  • the first light receiving element 30a and the second light receiving element 30b are a thermopile, a resistance bolometer, or the like.
  • the infrared detection device 100 preferably further includes a signal processing unit 9.
  • the signal processing unit 9 preferably determines whether a person is present in the detection area 11 based on the output signals of the first light receiving element 30a and the plurality of second light receiving elements 30b.
  • the infrared detection device 100 can be used as a human body detection device.
  • the first light receiving element 30a and the second light receiving element 30b described above are not limited to quad type pyroelectric elements, but may be, for example, dual type pyroelectric elements, single type pyroelectric elements, or the like. Further, the shape, the arrangement, and the like of the detection unit in the pyroelectric element are not particularly limited.
  • the pyroelectric element may have a configuration in which four detection units are arranged in a 1 ⁇ 4 array on one pyroelectric substrate. In this case, the plan view shape of each of the four detection units is a rectangle. Further, adjacent detection units are connected in reverse parallel.
  • the pyroelectric element is not limited to the configuration provided with the pyroelectric substrate, and for example, the back electrode, the pyroelectric thin film, and the surface electrode are arranged in this order on the electrical insulating film on the surface of the silicon substrate. It may be a chip on which a detection unit is formed. Such a chip can be formed, for example, using micromachining technology and pyroelectric thin film forming technology.
  • the infrared detection device 100 is not limited to human body detection, and may be used in other applications such as gas detection.
  • the infrared detection device 100 can be used for, for example, a wiring apparatus, an apparatus, and the like.
  • the devices include, for example, lighting fixtures, lighting devices, televisions, personal computers, air conditioners, humidifiers, refrigerators, copy machines, digital signage, digital photo frames, urinals, vending machines, ticket vending machines, automatic teller machines, There are gas sensors, gas analyzers, etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Geophysics And Detection Of Objects (AREA)

Abstract

Le problème de la présente invention est de fournir un capteur infrarouge avec lequel il est possible de supprimer une variation de sensibilité à l'intérieur d'une zone de détection. Une petite zone de détection (13) parmi une pluralité de petites zones de détection (13) est associée à chaque lentille d'une pluralité de premières lentilles (50a) d'une première unité de réception de lumière (2a), et une petite zone de détection (13) parmi la pluralité de petites zones de détection (13) est associée à chaque lentille d'une pluralité de secondes lentilles (50b) de chaque unité de réception de lumière d'une pluralité de secondes unités de réception de lumière (2b). L'axe optique d'un second élément de réception de lumière (30b) de chaque unité de réception de lumière de la pluralité de secondes unités de réception de lumière (2b) est incliné, dans une orientation mutuellement différente, par rapport à l'axe optique d'un premier élément de réception de lumière (30a) de la première unité de réception de lumière (2a). Le nombre d'un premier groupe de petites zones de détection (13) associées à la première unité de réception de lumière (2a) parmi la pluralité de petites zones de détection (13) est supérieur au nombre d'un second groupe de petites zones de détection (13) associées à chaque unité de réception de lumière de la pluralité de secondes unités de réception de lumière (2b) parmi la pluralité de petites zones de détection (13).
PCT/JP2017/040418 2016-11-30 2017-11-09 Capteur infrarouge WO2018101001A1 (fr)

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CN111474614B (zh) * 2020-05-14 2022-07-01 上海优周电子科技有限公司 平面红外探测透镜
CN114910163A (zh) * 2021-02-08 2022-08-16 名硕电脑(苏州)有限公司 红外线性能测试装置

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TWI681173B (zh) 2020-01-01

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