WO2018096721A1 - Dispositif d'assemblage par ultrasons - Google Patents

Dispositif d'assemblage par ultrasons Download PDF

Info

Publication number
WO2018096721A1
WO2018096721A1 PCT/JP2017/023300 JP2017023300W WO2018096721A1 WO 2018096721 A1 WO2018096721 A1 WO 2018096721A1 JP 2017023300 W JP2017023300 W JP 2017023300W WO 2018096721 A1 WO2018096721 A1 WO 2018096721A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
horn
slide member
ultrasonic bonding
aluminum alloy
Prior art date
Application number
PCT/JP2017/023300
Other languages
English (en)
Japanese (ja)
Inventor
稔正 山根
一成 上原
Original Assignee
株式会社キーレックス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社キーレックス filed Critical 株式会社キーレックス
Publication of WO2018096721A1 publication Critical patent/WO2018096721A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding

Definitions

  • the present invention relates to an ultrasonic bonding apparatus for bonding two superposed bonded objects by ultrasonic vibration.
  • a general ultrasonic bonding apparatus includes a horn having a bonding chip attached to the lower side, and two panel-like objects to be joined that are provided below the horn and made of metal.
  • the horn is lowered, the both objects to be bonded are sandwiched between the amble and the chip, and the horn is vibrated in the horizontal direction to perform ultrasonic bonding.
  • an air flow passage capable of circulating air inside the horn and the tip is formed.
  • the air flow path is open to the lower surface of the chip. Even if the bonded object is fixed to the chip, the bonded object is inserted into the chip by the discharge force of the air discharged from the opening portion of the air flow path. It can be separated from.
  • the present invention has been made in view of such a point, and an object of the present invention is to provide an ultrasonic bonding apparatus capable of reliably separating an object to be bonded from a chip after bonding even when the bonding operation is repeatedly performed. It is to provide.
  • the present invention is characterized in that a slide member that can slide up and down is provided inside or outside the chip.
  • a horn having a bonding tip positioned on the lower side, a vibrating means for vibrating the horn in a horizontal direction, an elevating means for moving the horn up and down, and two ridges provided below the horn.
  • the following solution was taken for an ultrasonic bonding apparatus configured to perform ultrasonic bonding.
  • a slide member that is provided inside or outside of the chip and is slidable in the vertical direction, and is slid downward by pressing the slide member, and its lower end portion is the lower end portion of the chip. And pressing means for jumping out from the head.
  • the chip is formed with an accommodation recess that opens on a lower surface and accommodates the slide member and the pressing means, and the lower end portion of the slide member is the slide. When the member slides downward, it is configured to jump out from the opening portion of the housing recess.
  • the pressing means is a coil spring that constantly urges the slide member downward.
  • the slide member that is pressed by the pressing means and slides downward. Since the lower end portion of the substrate is pressed downward by an amount that protrudes from the lower end portion of the chip, the object to be bonded can be separated from the chip. Further, since there is no need to provide an air flow path in the chip as in Patent Document 1, even if the ultrasonic bonding operation is repeated, a part of the joined body enters the air flow path and the air flow path becomes narrower. Alternatively, it can be avoided that the object to be bonded cannot be pressed downward due to clogging, and the object to be bonded can be reliably separated from the chip.
  • the slide member and the pressing means are surrounded by the chip, it is possible to reduce the failure of the apparatus due to dust and dirt adhering to the slide member and the pressing means.
  • both the bonded bodies are ultrasonically vibrated in a state where the portions corresponding to the slide members of the both bonded bodies are pressed against the slide member by the biasing force of the coil spring. Become. Therefore, even if a mechanism for separating the object to be bonded from the chip is provided inside the chip, it is possible to press both objects to be bonded evenly with the amble in the entire region of the chip that contacts the object to be bonded. And a good joint can be formed between the objects to be joined.
  • FIG. 1 is a perspective view of an ultrasonic bonding apparatus according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line II-II in FIG.
  • FIG. 3 is a view taken in the direction of arrow III in FIG. 2. It is a figure which shows the state just before performing ultrasonic joining after FIG. It is a figure which shows the state in the middle of performing ultrasonic joining after FIG.
  • FIG. 6 is a diagram showing a state immediately after the ultrasonic bonding is finished after FIG. 5.
  • FIG. 1 shows an ultrasonic bonding apparatus 1 according to an embodiment of the present invention.
  • the ultrasonic bonding apparatus 1 is an apparatus in which two stacked aluminum alloy plates W1 (to-be-bonded bodies) are integrated by ultrasonic bonding, and an apparatus main body 2 installed on a floor, and the apparatus main body 2 side. And an amble 3 that can be placed in a state where the two aluminum alloy plates W1 are overlapped with each other, and an anti-slip portion 3a having an uneven shape is formed on the upper surface of the amble 3 (see FIG. 2).
  • the apparatus main body 2 includes a processing unit 4 extending in a horizontal direction toward a position above the amble 3 and an elevator 5 (elevating means) for moving the processing unit 4 up and down.
  • the amble 3 includes the processing unit 4. 4 is located below the extended end side.
  • the processing unit 4 includes an elongated substantially rectangular parallelepiped housing case 6 having a housing space 6a therein, and the housing space 6a accommodates a substantially cylindrical vibration unit 7 (vibration means) and a rotary motor 8. Has been.
  • the cylinder unit line C1 of the vibration unit 7 is in a posture along the longitudinal direction of the processing unit 4, and one end side of the vibration unit 7 faces the outside of the housing case 6.
  • the rotary motor 8 is disposed on the other end side of the vibration unit 7, and the rotation shaft 8 a is located on the cylinder center line C ⁇ b> 1 of the vibration unit and protrudes inward of the vibration unit 7. .
  • a horn 9 having a center line C2 that coincides with the cylinder center line C1 of the vibration unit 7 is provided.
  • the horn 9 includes a horn main body 9a having an elongated round bar shape, and a square plate-shaped processing head 9b having a thickness attached to one end of the horn main body 9a.
  • the vibration unit 7 is inserted inward.
  • the other end of the horn body 9a is connected to the rotation shaft 8a of the rotary motor 8, and the horn 9 can be rotated around the center line C2 by the rotation operation of the rotation shaft 8a in the rotation motor 8. ing.
  • the other end side of the horn body 9a is connected to a vibration mechanism (not shown) provided inward of the vibration unit 7, and the horn 9 is connected to the center line C2 by the vibration unit 7. It can vibrate in the orthogonal horizontal direction (arrow X1 direction in FIG. 5).
  • the processing head 9b is provided with four joining chips 10 each having a rectangular plate shape at equal intervals around the center line C2.
  • the bonding head 10 is formed below the horn 9.
  • the positioned chips 10 are switched in order.
  • a pair of concave and convex surface portions 10a are formed on the lower surface of the chip 10 so as to be separated on both sides in the vibration direction.
  • An accommodation recess 10b that opens to the lower surface of the chip 10 is formed in the center portion of the chip 10, and the opening of the accommodation recess 10b is located between the two uneven surface portions 10a.
  • An annular projecting portion 10c is formed on the opening-side inner peripheral surface of the housing recess 10b so as to be smaller in diameter than the inner peripheral surface of the rear end side of the housing recess 10b. It is substantially T-shaped in view.
  • a slide member 11 whose center axis is directed in the vertical direction is accommodated so as to be slidable in the vertical direction.
  • the slide member 11 is formed to be continuous with the disc-shaped head portion 11a located on the back end side of the housing recess 10b and the head portion 11a, and inside the annular projecting portion 10c of the housing recess 10b. It consists of the shaft part 11b located in this.
  • the head portion 11a comes into contact with the annular projecting portion 10c so as not to slide further downward.
  • the head portion 11a is brought into contact with the annular projecting portion 10c.
  • the lower end portion of the shaft portion 11b protrudes downward from the lower end portion of the chip 10 in a contact state.
  • a coil spring 12 (pressing means) that constantly urges the slide member 11 downward is housed on the back end side of the housing recess 10b, and the coil spring 12 presses the slide member 11 downward to move the slide member 11 downward. 11 is protruded from the lower end portion of the chip 10.
  • the ultrasonic bonding apparatus 1 lowers the horn 9 by the elevator 5 and puts the two aluminum alloy plates W1 superimposed on the amble 3 into the amble 3 and the chip 10.
  • the horn 9 is vibrated by the vibration unit 7 to perform ultrasonic bonding, and a solid-phase bonding portion J1 is formed between the two aluminum alloy plates W1. Yes.
  • an industrial robot places two aluminum alloy plates W1 before joining on the amble 3 as shown in FIG.
  • the ultrasonic bonding apparatus 1 When the work of placing both aluminum alloy plates W1 on the amble 3 by the industrial robot is completed, the ultrasonic bonding apparatus 1 is activated. Then, the horn 9 starts to descend by the elevator 5.
  • both the concavo-convex surface portions 10 a of the chip 10 come into contact with the upper surfaces of the two aluminum alloy plates W ⁇ b> 1 placed on the amble 3, and the both aluminum alloy plates W ⁇ b> 1 are in contact with the amble 3. And pressurize.
  • both the rugged surface portions 10a bite into the upper aluminum alloy plate W1 and the anti-slip portion 3a bites into the lower aluminum alloy plate W1.
  • a solid-phase joint J1 is formed between the aluminum alloy plates W1 so that both the aluminum alloy plates W1 are integrated.
  • the slide member 11 presses both the aluminum alloy plates W1 downward by the urging force of the coil spring 12, thereby sandwiching and pressing the both aluminum alloy plates W1 with the amble 3.
  • the horn 9 is raised by the elevator 5. At this time, as shown in FIG. 6, the lower end portion of the slide member 11 that slides downward by the biasing force of the coil spring 12 jumps out from the lower end portion of the chip 10, so that the slide member 11 presses both the aluminum alloy plates W ⁇ b> 1 downward. Then, it is separated from the chip 10.
  • the horn 9 that is raised by the elevator 5 stops when it rises by a predetermined distance.
  • the horn 9 is rotated around the center line C2 by the rotation operation of the rotating shaft 8a in the rotary motor 8, and the chip 10 located below the horn 9 is switched to the chip 10 adjacent to the center line C2.
  • the two aluminum alloy plates W1 before joining are placed on the amble 3 by the industrial robot and again super It will be in the state which can perform sonic bonding.
  • both the aluminum alloy plates W1 can be separated from the chip 10. .
  • the slide member 11 and the coil spring 12 are housed in the housing recess 10 b of the chip 10 and are surrounded by the chip 10, the slide member 11 and the coil spring 12 are superfluous when dust, dust or the like adheres to the slide member 11 and the coil spring 12. The failure of the sonic bonding apparatus 1 can be reduced.
  • both the aluminum alloy plates W1 are ultrasonically vibrated in a state where the portions corresponding to the slide members 11 of the both aluminum alloy plates W1 are pressed against the slide member 11 by the biasing force of the coil spring 12. become. Therefore, even if a mechanism for separating both the aluminum alloy plates W1 from the chip 10 is provided inside the chip 10, the both aluminum alloy plates W1 are connected to the amble 3 in the entire region in contact with both the aluminum alloy plates W1 of the chip 10. Between the two aluminum alloy plates W1 can be formed, and a good solid phase joint J1 can be formed.
  • the housing recess 10b is formed at the center of the chip 10, but the present invention is not limited thereto, and may be provided on both sides in the vibration direction, for example.
  • the slide member 11 is positioned inside the chip 10, but may be provided along the outer peripheral surface of the chip 10.
  • the slide member 11 is slid downward by the coil spring 12, but may be pressed downward by a cylinder or the like, for example.
  • chips 10 are provided at equal intervals around the center line C2 in the horn 9, but two or three chips 10 are equally spaced around the center line C2 in the horn 9. It may be possible to provide five or more.
  • the ultrasonic bonding apparatus 1 of the present invention bonds both the aluminum alloy plates W1 by ultrasonic bonding
  • other materials can also be bonded by ultrasonic bonding.
  • the present invention is suitable for an ultrasonic bonding apparatus for bonding two stacked objects to be bonded by ultrasonic vibration.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

L'invention concerne un dispositif d'assemblage par ultrasons (1) réalisant un assemblage par ultrasons au moyen de l'abaissement d'une bigorne (9) par un élévateur (5), prenant en sandwich deux plaques d'alliage d'aluminium (W1) entre une enclume (3) et une pointe (10), et faisant vibrer la bigorne (9) à l'aide d'une unité de vibration (7). Un élément coulissant (11) pouvant coulisser dans la direction verticale est disposé sur l'intérieur de la pointe (10). Un ressort hélicoïdal (12) applique une pression descendante sur l'élément coulissant (11) pour amener l'élément coulissant à coulisser vers le bas de telle sorte que la partie inférieure de celui-ci fait saillie de la partie inférieure de la pointe (10).
PCT/JP2017/023300 2016-11-22 2017-06-23 Dispositif d'assemblage par ultrasons WO2018096721A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-226711 2016-11-22
JP2016226711A JP6882757B2 (ja) 2016-11-22 2016-11-22 超音波接合装置

Publications (1)

Publication Number Publication Date
WO2018096721A1 true WO2018096721A1 (fr) 2018-05-31

Family

ID=62195805

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/023300 WO2018096721A1 (fr) 2016-11-22 2017-06-23 Dispositif d'assemblage par ultrasons

Country Status (2)

Country Link
JP (1) JP6882757B2 (fr)
WO (1) WO2018096721A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110948884A (zh) * 2019-12-17 2020-04-03 江西渥泰环保科技有限公司 一种净水器滤芯用的焊接设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109317812A (zh) * 2018-12-05 2019-02-12 上海骄成机电设备有限公司 一种超声波焊接辅助机构
TWI792612B (zh) * 2021-10-15 2023-02-11 黃雅筠 塑料薄片之超音波熔接結構

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778720A (en) * 1980-10-31 1982-05-17 Matsushita Electric Works Ltd Method of welding contact with supersonic wave
JPH0857959A (ja) * 1994-08-19 1996-03-05 Fujitsu Ten Ltd 超音波溶接装置
JP2012223780A (ja) * 2011-04-18 2012-11-15 Mitsubishi Electric Corp 超音波金属接合方法及び超音波金属接合装置
JP2017060963A (ja) * 2015-09-24 2017-03-30 株式会社Ｇｓユアサ 超音波接合装置、及び蓄電素子の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272612A (ja) * 1987-04-30 1988-11-10 Kureha Chem Ind Co Ltd 包装体およびその製造方法と製造装置
JP3455344B2 (ja) * 1995-10-20 2003-10-14 株式会社オートネットワーク技術研究所 超音波溶接装置
JP2010274296A (ja) * 2009-05-27 2010-12-09 Nissan Motor Co Ltd 超音波接合装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5778720A (en) * 1980-10-31 1982-05-17 Matsushita Electric Works Ltd Method of welding contact with supersonic wave
JPH0857959A (ja) * 1994-08-19 1996-03-05 Fujitsu Ten Ltd 超音波溶接装置
JP2012223780A (ja) * 2011-04-18 2012-11-15 Mitsubishi Electric Corp 超音波金属接合方法及び超音波金属接合装置
JP2017060963A (ja) * 2015-09-24 2017-03-30 株式会社Ｇｓユアサ 超音波接合装置、及び蓄電素子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110948884A (zh) * 2019-12-17 2020-04-03 江西渥泰环保科技有限公司 一种净水器滤芯用的焊接设备

Also Published As

Publication number Publication date
JP6882757B2 (ja) 2021-06-02
JP2018083209A (ja) 2018-05-31

Similar Documents

Publication Publication Date Title
WO2018096721A1 (fr) Dispositif d'assemblage par ultrasons
JP4792945B2 (ja) 超音波接合装置および接合構造体
KR20130024724A (ko) 파워 모듈 및 그 제조 방법
US10744591B2 (en) Ultrasonic bonding jig, bonding structure, and bonding method
US20180369953A1 (en) Ultrasonic bonding method, ultrasonic bonding jig, and bonding structure
JP6112113B2 (ja) 電子デバイスの製造方法
JP2018173343A5 (fr)
WO2001024963A1 (fr) Technique et dispositif de raccordement far frottement et outil de maintien utilise avec le dispositifs de raccordement par friction
US10232464B2 (en) Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
TWI733164B (zh) 半導體製造裝置、頂出治具及半導體裝置之製造方法
JP6625243B2 (ja) 超音波接合用工具および超音波接合方法
JP5871418B2 (ja) マガジンアタッチメント及び固定システム
JP5926439B1 (ja) 超音波接合装置
US20190047079A1 (en) Ultrasonic bonding jig, ultrasonic bonding method, and bonding structure
JP2009194153A (ja) 半導体装置の製造方法及び超音波接合装置
JP7255900B2 (ja) 超音波接合方法
JP6451180B2 (ja) 半導体装置の製造装置及び半導体装置
JP4609169B2 (ja) 超音波接合方法
JP6893018B2 (ja) 超音波接合装置
JP6634262B2 (ja) ホーン、アンビル、超音波接合ツール、及び蓄電素子の製造方法。
JP6641097B2 (ja) 超音波接合方法
JP6677920B2 (ja) アンビル、ホーン、超音波接合ツール、及び蓄電素子の製造方法
JP2006015354A (ja) 超音波溶接装置、超音波溶接用矯正部材及び超音波溶接方法
JP2020161529A (ja) 超音波接合装置、超音波接合構造、超音波接合方法および半導体装置の製造方法
JP4293003B2 (ja) 超音波溶接装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17874110

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17874110

Country of ref document: EP

Kind code of ref document: A1