WO2018082865A1 - Étiquette rfid pour la caractérisation d'une pièce de linge - Google Patents

Étiquette rfid pour la caractérisation d'une pièce de linge Download PDF

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Publication number
WO2018082865A1
WO2018082865A1 PCT/EP2017/075558 EP2017075558W WO2018082865A1 WO 2018082865 A1 WO2018082865 A1 WO 2018082865A1 EP 2017075558 W EP2017075558 W EP 2017075558W WO 2018082865 A1 WO2018082865 A1 WO 2018082865A1
Authority
WO
WIPO (PCT)
Prior art keywords
protective layer
rfid tag
transponder chip
rfid
tag according
Prior art date
Application number
PCT/EP2017/075558
Other languages
German (de)
English (en)
Inventor
Bernhard Schmidt
Hartmut Wiederrecht
Original Assignee
Schreiner Group Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schreiner Group Gmbh & Co. Kg filed Critical Schreiner Group Gmbh & Co. Kg
Publication of WO2018082865A1 publication Critical patent/WO2018082865A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier

Definitions

  • the invention relates to an RFID label for identifying a laundry item so that the laundry item can be assigned to its owner.
  • a label with an RFID transponder can be used to identify the items of laundry.
  • such an RFID label For use in laundry items that are washed in large laundry, such an RFID label must meet certain requirements.
  • the RFID tag must be able to withstand the high temperatures that occur when washing laundry.
  • pressures of up to 60 bar act on a single item of laundry.
  • the RFID label must not be damaged.
  • ironing or ironing the RFID label should withstand at least up to three times for 4 to 5 seconds steam at a temperature of 180 to 200 ° C.
  • An RFID label in a piece of laundry should always survive undamaged to around 200 applications. Furthermore, the wearer of the garment should not be able to feel the RFID tag. It is an object of the present invention to provide an RFID tag for identifying a garment which in particular withstands the washing, drying and ironing requirements of a laundry.
  • An embodiment of an RFID tag for identifying a laundry item is specified in claim 1.
  • the RFID tag comprises an RFID transponder chip, an antenna structure which is connected to the RFID transponder chip, as well as a carrier substrate and a protective layer.
  • the RFID transponder chip and the antenna structure are arranged on the carrier substrate.
  • the protective layer has the shape of a pas-partout and is arranged around the RFID transponder chip.
  • the protective layer has, in the form of the passes-partout, a recessed area in which the RFID transponder chip is arranged.
  • the recessed area may be in the center of the protective layer, for example.
  • the RFID transponder chip itself can in turn be arranged in the center of the recessed area of the protective layer on the carrier substrate.
  • the thickness of the protective layer is preferably greater than the height of the RFID transponder chip, so that the RFID transponder chip does not destroy upon pressure on the flat side of the protective layer, as occurs, for example, when squeezing a piece of laundry to which the RFID label is attached becomes.
  • the protective layer has predetermined bending points.
  • the predetermined bending points can be realized by punching lines within the protective layer.
  • the punched lines can be formed such that they completely penetrate the protective layer, but the underlying layers, for example the carrier substrate, are not damaged by the punched lines or at least not completely cut through.
  • the number and position of the punching lines that form the predetermined bending points results from the possible spatial directions from which a force can act on the RFID tag affixed to a laundry item and in particular on the RFID transponder chip.
  • the punched lines are preferably not in line with the RFID transponder chip.
  • the RFID transponder chip can dien formed predetermined bending points in the protective layer and align flat to the printing direction. The RFID label thus bends along the punching lines that form the predetermined kinks, and not at the position of the RFID transponder chip.
  • antenna structures In order to avoid antenna breaks in the event of high mechanical stresses, as occur, for example, when a laundry item is pressed out, small-area antenna structures at the connection to the transponder chip are to be avoided.
  • the antenna structures are instead formed over a large area, wherein etched or punched antenna structures can have advantages over printed antenna structures with regard to the mechanical stability. In principle, however, both printed, punched and etched antenna structures can be used.
  • the protective layer in the form of the pass-partout has rounded / curved side edges on at least those outer sides at which the antenna structure protrudes below the protective layer.
  • a side edge, which lies between two other side edges, is not straight between these two other side edges, but has a curved course. In particular, this is the side edge at which the antenna structure exits under the protective layer.
  • the sides of the protective layer at which the antenna structure protrudes under the protective layer can have, for example, a convex as well as a concave profile.
  • FIG. 1 shows a plan view of an RFID label for identifying a laundry item
  • FIGS. 1 and 2 shows a cross section through an RFID label for identifying a piece of laundry.
  • the RFID tag 1 shown in FIGS. 1 and 2 for identifying a piece of laundry comprises an RFID transponder chip 100, which is electrically connected to an antenna structure 200.
  • the transponder chip 100 and the antenna structure 200 are arranged on a carrier substrate 300.
  • the RFID tag has a protective layer 400, which is arranged on the carrier substrate 300 in the form of a pass-partout around the RFID transponder chip 100.
  • the carrier substrate 300 may be formed as a PET film.
  • the protective layer 400 may be formed as a PET or PE film or as a printed layer.
  • the protective layer 400 has an inner side 1400 that delimits a recessed area 410 of the protective layer 400.
  • the RFID transponder chip 100 is arranged in the recessed area 410 of the protective layer 400.
  • the RFID transponder chip 100 may, for example, be arranged centrally within the recessed area 410.
  • other geometric shapes for example rectangular or oval shapes, are also possible.
  • the thickness of the protective layer 400 is greater than the height of the RFID transponder chip 100.
  • the thickness of the protective layer 400 may be, for example, greater than 150 ⁇ m.
  • the chip 100 is protected by the frame-like arranged around the chip around protective layer 400 from a direct force.
  • the protective layer 400 may be formed, for example, as a film or a printed layer disposed on the carrier substrate 300.
  • the protective layer 400 With a pressure on the flat side of the protective layer 400, the protective layer 400 can only be compressed to the extent that the RFID transponder chip 100 does not protrude beyond the protective layer when pressure is applied from above to the protective layer 400. As a result, the transponder chip lies completely within the recess 410 even with a force acting perpendicular to the protective layer 400. In particular, the transponder chip does not protrude from the recessed area when the protective layer 400 is compressed. This ensures that the transponder chip 100 is protected from chip breakage by the protective layer 400 arranged around its frame.
  • the protective layer 400 has at least one stamped line 420. As shown in FIG. 1, the at least one stamped line 420 in the protective layer 400 may be rectilinear.
  • the RFID label in the protective layer 400 has a multiplicity of punched lines 420.
  • the punched lines 420 penetrate the protective layer 400 completely or at least partially, but the underlying layers, in particular the carrier substrate 300, are not damaged or at least not completely severed.
  • the punched lines form predetermined kinks where the RFID tag is at a
  • the RFID transponder chip can dodge because of the existing predetermined bending points and align itself flat to the printing direction.
  • the RFID tag thus bends along a predetermined buckling / punching line and not at the position of the chip 100.
  • the punching lines 420 are arranged in the protective layer 400 such that the protective layer 400 comprises individual regions 400a, 400b, ..., 400n which are separated by the punching lines 420 and are still connected only at the edge of the protective layer 400.
  • the individual regions 400a, 400b,..., 400n of the protective layer 400 continue to form a closed bond despite the punching or weakening lines 420 present in the protective layer.
  • the number and position of the punching lines / predetermined bending points 420 results from the possible spatial directions from which a force can act on the RFID tag or on the RFID transponder chip.
  • at least one punching line / predetermined bending point 420 is perpendicular to the direction of a force.
  • the punching lines 420 are arranged in the protective layer 400 in particular such that the RFID label 1 kinks along the punching line 420 when a force is applied to a part of the RFID label which lies on the left or right side of a punching line 420.
  • the punching lines 420 run within the protective layer 400 in one direction, so that the associated direction vector of a respective punching line does not intersect the RFID transponder chip 100.
  • the predetermined bending points formed by the punched lines 420 are thus not on a line with the RFID transponder chip 100.
  • the protective layer 400 has at least one outer side A400a, A400b, on which the antenna structure 200 arranged on the carrier substrate 300 protrudes below the protective layer 400.
  • the at least one outer side A400a, A400b of the protective layer 400 has a curved, that is not rectilinear, course between the adjacent outer sides A400c and A400d.
  • the curved course extends between the outsides A400c and A400d.
  • the protective layer 400 may have rounded / bent edges, for example, on the outer sides A400a, A400b, where the antenna structure 200 protrudes under the protective layer 400.
  • the at least one outer side A400a, A400b, on which the antenna structure 200 protrudes under the protective layer 400 may have a concave or convex curved course.
  • the outer side A400a is, for example, concave and the outer side A400b, for example, convexly curved.
  • the antenna structures in the contacting region are preferably formed over a large area on the transponder chip.
  • the width of the antenna track of the antenna structure 200 is, for example, greater than the width of the transponder chip 100.
  • the antenna has an annular structure, wherein the RFID transponder chip 100 is connected to the antenna structure 200 on one side of the annular antenna track .
  • the RFID tag 1 may comprise a cover layer 500, by which the RFID transponder chip 100 and the antenna structure 200 are covered for protection.
  • the protective layer 400 is disposed on the cover layer 500.
  • the protective layer 400 may be adhesively bonded to the cover layer 500 by means of an adhesive layer 401.
  • the cover layer 500 may be adhesively bonded to the carrier substrate 300, the antenna structure 200 and the RFID transponder chip 100 by means of an adhesive layer 501.
  • the adhesive layer 401 or 501 may contain a polyacrylate adhesive.
  • the cover layer 500 may be formed as a PET film.
  • the RFID transponder chip 100 and the antenna structure 200 can therefore withstand high temperatures that act on the antenna structure and the transponder chip when washing kitchen linen. Furthermore, the embedding of the transponder chip 100 and the antenna structure 200 between the carrier substrate 300 and the cover layer 500 provides protection against exposure to chemicals present in the wash water.
  • the label may have an adhesive layer 301 on the underside of the carrier substrate 300.
  • the adhesive layer 301 may include, for example, a heat activatable adhesive.
  • the label can then be fixed by ironing on a piece of laundry, for example.
  • Another possibility is to sew the RFID tag on or onto a piece of laundry, especially if the edge is large enough. It is also possible to sew the RFID label into a piece of laundry. In this case, a kind of pocket is formed with the fabric of the textile product by stitching, in which the RFID label is loosely inserted. This is then sewn on the still open place
  • the RFID tag 1, in particular the RFID transponder chip 100 as well as the antenna structure 200 are, designed by the described embodiments, high Temperatures, for example, temperatures of 95 ° C, which occur during cooking of laundry, to withstand.
  • the protective layer 400 is designed so that it is compressed at a pressure of up to 60 bar, but still has a thickness that is greater than the height of the RFID transponder chip. As a result, the RFID transponder chip is protected against direct action of force on its housing.
  • RFID label withstands a steam exposure of 4 to 5 seconds at a steam temperature between 180 ° C to 200 ° C.
  • the RFID tag 1 can be manufactured on a roll and is thus easy to process.
  • the RFID tag has no hard contours, such as a plastic capsule, and is therefore almost unnoticeable when sewing into a garment for a user.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)

Abstract

L'invention concerne une étiquette RFID (1) destinée à caractériser une pièce de linge, comprenant une puce de transpondeur RFID (100) et une structure d'antenne (200) qui est reliée à la puce de transpondeur RFID (100). En outre, l'étiquette RFID (1) comprend un substrat support (300) sur lequel sont disposées la puce de transpondeur RFID (100) et la structure d'antenne (200). Une couche protectrice (400) est prévue pour protéger la puce de transpondeur RFID (100) et la structure d'antenne (200), ladite couche étant disposée sur le substrat support (300) sous la forme d'un passe-partout, autour de la puce de transpondeur RFID (100).
PCT/EP2017/075558 2016-11-07 2017-10-06 Étiquette rfid pour la caractérisation d'une pièce de linge WO2018082865A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016121225.3 2016-11-07
DE102016121225.3A DE102016121225A1 (de) 2016-11-07 2016-11-07 RFID-Etikett zum Kennzeichnen eines Wäschestücks

Publications (1)

Publication Number Publication Date
WO2018082865A1 true WO2018082865A1 (fr) 2018-05-11

Family

ID=60022122

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/075558 WO2018082865A1 (fr) 2016-11-07 2017-10-06 Étiquette rfid pour la caractérisation d'une pièce de linge

Country Status (2)

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DE (1) DE102016121225A1 (fr)
WO (1) WO2018082865A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1887496A1 (fr) * 2006-08-09 2008-02-13 Fujitsu Ltd. Étiquette RFID
EP3001356A1 (fr) * 2014-09-10 2016-03-30 Fujitsu Limited Étiquette rfid

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0370114B1 (fr) * 1988-04-20 1995-08-02 Matsushita Electric Industrial Co., Ltd. Carte a circuits integres et son procede de production
DE10311185A1 (de) * 2003-03-12 2004-09-30 Siemens Ag Funkabfragbares Etikett, Herstellungsverfahren sowie Verwendung eines derartigen funkabfragbaren Etiketts zur Identifizierung von Textilien und/oder in Wäschereinigungsbetrieben
EP1887497B1 (fr) * 2006-08-10 2015-05-27 Fujitsu Limited Étiquette RFID
JP5895681B2 (ja) * 2012-04-18 2016-03-30 Nok株式会社 Ｉｃタグ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1887496A1 (fr) * 2006-08-09 2008-02-13 Fujitsu Ltd. Étiquette RFID
EP3001356A1 (fr) * 2014-09-10 2016-03-30 Fujitsu Limited Étiquette rfid

Also Published As

Publication number Publication date
DE102016121225A1 (de) 2018-05-09

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