WO2018058761A1 - 一种77Ghz高精密射频雷达印制线路板的制作方法 - Google Patents

一种77Ghz高精密射频雷达印制线路板的制作方法 Download PDF

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WO2018058761A1
WO2018058761A1 PCT/CN2016/105879 CN2016105879W WO2018058761A1 WO 2018058761 A1 WO2018058761 A1 WO 2018058761A1 CN 2016105879 W CN2016105879 W CN 2016105879W WO 2018058761 A1 WO2018058761 A1 WO 2018058761A1
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Prior art keywords
copper
etching
circuit board
radio frequency
square
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PCT/CN2016/105879
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English (en)
French (fr)
Inventor
林启恒
武守坤
陈春
林映生
卫雄
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惠州市金百泽电路科技有限公司
西安金百泽电路科技有限公司
深圳市金百泽电子科技股份有限公司
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Publication of WO2018058761A1 publication Critical patent/WO2018058761A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the invention relates to the technical field of automobile radio frequency radar board manufacturing, in particular to a method for manufacturing a 77Ghz high precision radio frequency radar printed circuit board.
  • the spatial wave with a frequency of 30-300 Ghz is called millimeter wave, and is mainly used for road recognition of vehicles and high-voltage line identification of helicopters.
  • the operating frequency of the car's millimeter wave radar is 21.65-26.65Ghz and 76-87Ghz.
  • the common operating frequency of the car's millimeter wave radar is at 24Ghz, 77Ghz and 79Ghz.
  • the application of millimeter wave radar ranging in automobiles has the characteristics of stable detection performance and good environmental adaptability, because millimeter waves are not easily affected by the shape and color of the surface of the object, and are not affected by the large airflow, rain and snow fog to millimeter waves. The interference is small.
  • 77Ghz Compared with 24Ghz, 77Ghz has the advantage of detecting farther distance and unique frequency band, and the attenuation of 79Ghz in the atmosphere is weakly suitable for long-distance transmission. Therefore, 77Ghz is now considered to be the mainstream direction in the future.
  • the line pattern etching precision is required, and the rectangular pad is kept at a right angle after etching, and the line flash is ⁇ 10um.
  • the radio frequency radar printed circuit board is made of PTFE+ceramic filler sheet. The sheet is thin (100-150um) and soft. The following problems are easy to occur during the processing: 1. Existing line compensation and etching methods cannot effectively guarantee the pattern welding. The disc and the corner are at right angles.
  • the four right-angle positions of the pad are easily etched due to the exchange of the etching syrup, and become an elliptical shape of the pad; and the corner of the pattern is difficult to be exchanged by the etching syrup, forming an elliptical shape without a copper region.
  • the line has large burrs, which greatly affects the transmission quality of the RF signal, so that the assembly equipment can be debugged NG. 2.
  • the laser engraved copper technology is used to remove the copper layer in the non-line area by laser, which can effectively maintain the pattern precision and ensure the right angle of the pad. The requirement of small flashing of the line is high.
  • the laser engraving equipment has high cost and low efficiency.
  • the plate used for processing of RF radar printed circuit board is thin (100-150um), soft, easy to appear pits and plated during processing, and will be fixed by electroplating frame during plating. plating. However, due to the gap between the electroplated frame and the PCB, it is easy to hide the syrup, which makes it impossible to dry effectively. The leaching of the syrup leads to severe oxidation of the plate surface.
  • the plate is soft and thin and cannot be polished, resulting in the subsequent process being unable to remove oxidation, and the surface treatment is easy. A problem with a different color has occurred, resulting in retirement.
  • the laser engraving equipment has high cost and low efficiency. It takes 2 hours to engrave copper on the copper plate of 450mm ⁇ 600mm size. It can not be used in mass production stage for the time being. It is only suitable for small sample production. 3. The delivery time is long; 3. The plate used for processing the RF radar printed circuit board is thin (100-150um), soft, and the process is prone to pits and plated plates. When plating, it will be fixed with electroplated frame to assist in copper plating. However, due to the gap between the electroplated frame and the PCB, it is easy to hide the syrup, which makes it impossible to dry effectively. The leaching of the syrup leads to severe oxidation of the plate surface. The plate is soft and thin and cannot be polished, resulting in the subsequent process being unable to remove oxidation, and the surface treatment is easy. A problem with a different color has occurred, resulting in retirement.
  • a method for manufacturing a 77Ghz high-precision radio frequency radar printed circuit board comprising: the following steps:
  • the first step is engineering data design, including line multiplier compensation and acid etching mode selection, rectangular pad to maintain right angle design, and copper-free corners to maintain a right angle design;
  • the material is opened, baked, drilled and plasma treated according to a conventional process
  • the third step is to metallize the hole, firstly fabricate the thin plate plating frame, add ventilation holes on the thin plate plating frame, and then clamp the radar plate with the electroplated frame.
  • the overlapping area of the plating frame and the radar plate is fixed by rivets, and then follow the conventional routine.
  • the process performs copper plating on the copper plate to complete the through hole metallization;
  • the fourth step the whole plate electroplating copper treatment, according to customer requirements, after the copper plate is treated, the thickness of the copper and copper surface is not up to the required thickness, and the electroplating is performed again to increase the thickness of the copper and copper.
  • the fifth step the outer layer of the graphic production, including the rectangular pad fabrication and etching mode selection, the pad fabrication according to the engineering data after the multiplication compensation design, and the acid etching after the completion of the fabrication;
  • the post-process is performed according to the conventional circuit board processing flow.
  • the manufacturing method of the 77Ghz high-precision radio frequency radar printed circuit board of the invention adopts the line multiplication compensation in the above steps, the acid etching mode selection, the rectangular pad to maintain the right angle design, the copper-free area corner to maintain the right angle design, and the ventilating hole on the thin plate plating frame.
  • the line multiplication compensation energy and acid etching method selection can be effective Control line width, ensure etching precision, effectively ensure small etching burrs, meet customer requirements, and manufacture high-precision high-speed printed circuit boards; rectangular pads maintain a right-angle design to effectively avoid the shape of the right angle caused by the etching water flow effect into an elliptical shape, effective Ensure that the rectangular pad maintains a right angle; the copper-free corner maintains a right angle design to avoid the formation of a copper-free elliptical shape due to the etching water flow effect, effectively ensuring that the copper-free corner maintains a right angle, effectively ensuring the transmission quality of the RF signal; Maintain a right angle design and maintain a copper-free corner The corner design effectively keeps the rectangular pad and the corner of the copper-free area at a right angle.
  • the electroplated frame is easy to hide and can not be effectively dried, which causes the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the circuit.
  • the surface treatment leads to the problem of scrapping, ensuring the plating quality and effectively improving the product yield by about 15%.
  • the line multiplication compensation and the acid etching mode in the first step are specifically selected as follows: first, the etching mode is selected, the acid etching with dry film protection is selected, and then the line compensation corresponding to the copper thickness is selected, and the line compensation is conventional.
  • the line compensation is doubled, that is, the compensation design is twice the thickness of the finished copper.
  • the specific line double compensation, conventional compensation and finished copper thickness are as follows:
  • the number of etching times is designed to be 2 etchings.
  • the etching is performed for the first time using conventional parameters. After the first etching, the first etching is added to the second etching, and the second etching parameter is set at a speed of 7 m/min. The pressure was 0.6 Pa, and the etching path was performed at 1 to 1.5 m. After the dry film compensation increases, the dry film collapses, and the upper end of the line is protected from being etched, and the lower end of the line is slightly etched by the syrup, effectively reducing the width of the burr.
  • the rectangular shape becomes an elliptical shape.
  • the rectangular pads are maintained at right angles in the following steps:
  • the rectangular pad designed by the customer is doubled and compensated according to the two parts of the conventional line compensation
  • the line corner is prevented from forming an elliptical shape without a copper area due to the etching water flow effect.
  • the copper-free area corner in the first step is maintained at a right angle design in the following steps:
  • Each 5milx5mil square is contracted by 1 mil, so that the inner apex angle of the square is located in the graphic area, and the two outer sides of the square intersect with the graphic area to form 2 intersection points;
  • the line width is ensured to be at least 3 mils to effectively ensure the rigidity of the circuit board.
  • the electrical processing of the copper plate in the third step comprises the following steps:
  • Electroplating frame production according to the size of the radar PCB blanking, increase the thickness of the substrate by 0.7mm to 1.0mm by 10mm, drill the positioning hole on the cut substrate, and then make a plurality of ventilation holes, two adjacent The venting holes are staggered, and the plurality of venting holes are distributed in a continuous "Z" shape.
  • the center distance between two adjacent ventilation holes is 6mm ⁇ 10mm.
  • the groove is milled, and the middle is hollowed out to form a plating frame to assist the copper plate.
  • the edge of the hole of the vent hole is 4 mm to 6 mm away from the edge of the plating frame, and the vent hole on the plating frame is added to facilitate the discharge of the syrup and Drying effectively solves the problem that the conventional electroplating frame is easy to hide and can not be effectively dried, causing the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the circuit, causing the problem of scrapping after surface treatment, effectively ensuring the plating quality and reducing the scrapping rate;
  • the copper plate is plated, and the cut radar plate is clamped by using the electroplated frame.
  • the overlapping area of the plated frame and the radar plate is fixed by rivets, and then a layer of 1um-2um thick metal copper layer is deposited in the through hole by chemical copper deposition method. Then, using a plating method, the copper layer is thickened to 7 um to 10 um.
  • the manufacturing method of the 77Ghz high-precision radio frequency radar printed circuit board of the invention adopts the line multiplication compensation in the above steps, the acid etching mode selection, the rectangular pad to maintain the right angle design, the copper-free area corner to maintain the right angle design, and the ventilating hole on the thin plate plating frame.
  • the addition of the high-precision RF radar printed circuit board combined with the hole metallization treatment, the whole plate electroplating copper treatment, the outer layer pattern production and other conventional process flow has the following beneficial effects:
  • the pattern etching precision is high, the line burr is small, the line multiplication compensation and the acid etching method can effectively control the line width, ensure the etching precision, effectively ensure the etching burr is small, the pattern etching precision is high, meet the customer requirements, and carry out high precision and high speed.
  • Printed circuit board production
  • the rectangular pad maintains a right angle design to effectively avoid the shape of the right angle caused by the etching water flow effect to become an elliptical shape, effectively ensuring that the rectangular pad maintains a right angle, and effectively ensures the transmission quality of the radio frequency signal;
  • the corner of the copper-free area is kept at a right angle to effectively avoid the formation of an elliptical shape of the copper-free area due to the etching water flow effect, effectively ensuring that the corner of the copper-free area maintains a right angle, and effectively ensures the transmission quality of the radio frequency signal;
  • Rectangular pads maintain a right-angle design and a copper-free corner maintains a right-angle design.
  • the rectangular pads and the copper-free corners are kept at right angles. No need to introduce special laser engraving equipment, which saves money.
  • Equipment cost improve processing efficiency, suitable for mass production;
  • the product yield is high, and the addition of ventilation holes on the thin plate plating frame effectively solves the problem that the conventional electroplating frame is easy to hide the syrup and cannot be effectively dried, causing the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the line, resulting in surface treatment.
  • the problem of scrapping ensures the quality of plating and effectively improves the yield of the product by about 15%.
  • 1 is a comparison diagram of an acid etching method and a conventional acid etching method according to the present invention
  • Figure 2 is a two-etched view of the present invention
  • Figure 3 is a diagram showing steps A to F of the rectangular pad maintaining the right angle of the present invention.
  • Figure 4 is a diagram showing steps A to F of the design of the copper-free zone line corners maintaining the right angle of the present invention
  • Figure 5 is a comparison view of the electroplated frame of the present invention and a conventional electroplated frame.
  • a method for manufacturing a 77Ghz high-precision radio frequency radar printed circuit board is characterized in that: the following steps are included:
  • the first step is engineering data design, including line multiplier compensation and acid etching mode selection, rectangular pad to maintain right angle design, and copper-free corners to maintain a right angle design;
  • the material is opened, baked, drilled and plasma treated according to a conventional process
  • the third step is to metallize the hole, first make the thin plate plating frame, and add it on the thin plate plating frame.
  • the ventilating hole is then clamped to the radar plate by using the electroplated frame, and the overlapping area of the electroplated frame and the radar plate is fixed by rivets, and then the copper plate is electrically completed to complete the through hole metallization according to the conventional process;
  • the fourth step the whole plate electroplating copper treatment, according to customer requirements, after the copper plate is treated, the thickness of the copper and copper surface is not up to the required thickness, and the electroplating is performed again to increase the thickness of the copper and copper.
  • the fifth step the outer layer of the graphic production, including the rectangular pad fabrication and etching mode selection, the pad fabrication according to the engineering data after the multiplication compensation design, and the acid etching after the completion of the fabrication;
  • the post-process is performed according to the conventional circuit board processing flow.
  • the manufacturing method of the 77Ghz high-precision radio frequency radar printed circuit board of the invention adopts the line multiplication compensation in the above steps, the acid etching mode selection, the rectangular pad to maintain the right angle design, the copper-free area corner to maintain the right angle design, and the ventilating hole on the thin plate plating frame.
  • the line multiplication compensation energy and acid etching method selection can be effective Control line width, ensure etching precision, effectively ensure small etching burrs, meet customer requirements, and manufacture high-precision high-speed printed circuit boards; rectangular pads maintain a right-angle design to effectively avoid the shape of the right angle caused by the etching water flow effect into an elliptical shape, effective Ensure that the rectangular pad maintains a right angle; the copper-free corner maintains a right angle design to avoid the formation of a copper-free elliptical shape due to the etching water flow effect, effectively ensuring that the copper-free corner maintains a right angle, effectively ensuring the transmission quality of the RF signal; Maintain a right angle design and maintain a copper-free corner The corner design effectively keeps the rectangular pad and the corner of the copper-free area at a right angle.
  • the electroplated frame is easy to hide and can not be effectively dried, which causes the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the circuit.
  • the surface treatment leads to the problem of scrapping, ensuring the plating quality and effectively improving the product yield by about 15%.
  • the selection of the line multiplication compensation and the acid etching method in the first step is as follows: First, in combination with FIG. 1, the etching mode is first selected, the acid etching method with dry film protection is selected, and the line compensation corresponding to the copper thickness is selected.
  • the compensation is doubled according to the conventional line compensation, that is, the compensation design is twice the thickness of the finished copper.
  • the relationship between the specific line double compensation, the conventional compensation and the finished copper thickness is as follows:
  • the etching time is designed to be 2 etchings, and the etching is performed for the first time using conventional parameters.
  • the first etching is added to the second etching, and the second etching parameter setting speed is 7 m/min, a pressure of 0.6 Pa, and an etching path of 1 to 1.5 m for etching.
  • the dry film compensation increases, the dry film collapses, and the upper end of the line is protected from being etched, and the lower end of the line is slightly etched by the syrup, effectively reducing the width of the burr.
  • the rectangular pad designed by the customer is doubled and compensated according to the two parts of the conventional line compensation
  • Steps A to F are designed to meet the high accuracy requirements of the RF radar board. Avoid the corners of the line because the etching water flow effect forms a copper-free area elliptical shape. In the circuit design, follow the steps below. Carry out the copper-free corners in the first step to maintain a right-angle design:
  • Each 5milx5mil square is contracted by 1 mil, so that the inner apex angle of the square is located in the graphic area, and the two outer sides of the square intersect with the graphic area to form 2 intersection points;
  • the above-mentioned copper-free zone corners are maintained at a right angle to cut the copper, and the line width is guaranteed to be at least 3 mils to effectively ensure the rigidity of the circuit board.
  • the electrical processing of the copper plate in the third step includes the following steps:
  • Electroplating frame production according to the size of the radar PCB blanking, increase the thickness of the substrate by 0.7mm to 1.0mm by 10mm, drill the positioning hole on the cut substrate, and then make a plurality of ventilation holes, two adjacent The venting holes are staggered, and the plurality of venting holes are distributed in a continuous "Z" shape.
  • the center distance between two adjacent ventilation holes is 6mm ⁇ 10mm.
  • the groove is milled, and the middle is hollowed out to form a plating frame to assist the copper plate.
  • the edge of the hole of the vent hole is 4 mm to 6 mm away from the edge of the plating frame, and the vent hole on the plating frame is added to facilitate the discharge of the syrup and Drying effectively solves the problem that the conventional electroplating frame is easy to hide and can not be effectively dried, causing the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the circuit, causing the problem of scrapping after surface treatment, effectively ensuring the plating quality and reducing the scrapping rate;
  • B The copper plate is plated, and the cut radar plate is clamped by using the electroplated frame.
  • the overlapping area of the plated frame and the radar plate is fixed by rivets, and then a layer of 1um-2um thick metal copper layer is deposited in the through hole by chemical copper deposition method. Then, using a plating method, the copper layer is thickened to 7 um to 10 um.
  • a method for manufacturing a 77Ghz high-precision radio frequency radar printed circuit board is characterized in that: the following steps are included:
  • the first step is engineering data design, including line multiplier compensation and acid etching mode selection, rectangular pad to maintain right angle design, and copper-free corners to maintain a right angle design;
  • the material is opened, baked, drilled and plasma treated according to a conventional process
  • the third step is to metallize the hole, firstly fabricate the thin plate plating frame, add ventilation holes on the thin plate plating frame, and then clamp the radar plate with the electroplated frame.
  • the overlapping area of the plating frame and the radar plate is fixed by rivets, and then follow the conventional routine.
  • the process performs copper plating on the copper plate to complete the through hole metallization;
  • the fourth step the whole plate electroplating copper treatment, according to customer requirements, after the copper plate is treated, the thickness of the copper and copper surface is not up to the required thickness, and the electroplating is performed again to increase the thickness of the copper and copper.
  • the post-process is performed according to the conventional circuit board processing flow.
  • the manufacturing method of the 77Ghz high-precision radio frequency radar printed circuit board of the invention adopts the line multiplication compensation in the above steps, the acid etching mode selection, the rectangular pad to maintain the right angle design, the copper-free area corner to maintain the right angle design, and the ventilating hole on the thin plate plating frame.
  • the line multiplication compensation energy and acid etching method selection can be effective Control line width, ensure etching precision, effectively ensure small etching burrs, meet customer requirements, and manufacture high-precision high-speed printed circuit boards; rectangular pads maintain a right-angle design to effectively avoid the shape of the right angle caused by the etching water flow effect into an elliptical shape, effective Ensure that the rectangular pad maintains a right angle; the copper-free corner maintains a right angle design to avoid the formation of a copper-free elliptical shape due to the etching water flow effect, effectively ensuring that the copper-free corner maintains a right angle, effectively ensuring the transmission quality of the RF signal; Maintain a right angle design and maintain a copper-free corner The corner design effectively keeps the rectangular pad and the corner of the copper-free area at a right angle.
  • the electroplated frame is easy to hide and can not be effectively dried, which causes the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the circuit.
  • the surface treatment leads to the problem of scrapping, ensuring the plating quality and effectively improving the product yield by about 15%.
  • the selection of the line multiplication compensation and the acid etching method in the first step is as follows: First, in combination with FIG. 1, the etching mode is first selected, the acid etching method with dry film protection is selected, and the line compensation corresponding to the copper thickness is selected.
  • the compensation is doubled according to the conventional line compensation, that is, the compensation design is twice the thickness of the finished copper.
  • the relationship between the specific line double compensation, the conventional compensation and the finished copper thickness is as follows:
  • the etching time is designed to be 2 etchings, and the etching is performed for the first time using conventional parameters.
  • the first etching is added to the second etching, and the second etching parameter setting speed is 7 m/min, a pressure of 0.6 Pa, and an etching path of 1 to 1.5 m for etching.
  • the dry film compensation increases, the dry film collapses, and the upper end of the line is protected from being etched, and the lower end of the line is slightly etched by the syrup, effectively reducing the width of the burr.
  • the rectangular pad designed by the customer is doubled and compensated according to the two parts of the conventional line compensation
  • Steps A to F are designed to meet the high accuracy requirements of the RF radar board. Avoid the corners of the line because the etching water flow effect forms a copper-free area elliptical shape. In the circuit design, follow the steps below. Carry out the copper-free corners in the first step to maintain a right-angle design:
  • Each 5milx5mil square is contracted by 1 mil, so that the inner apex angle of the square is located in the graphic area, and the two outer sides of the square intersect with the graphic area to form 2 intersection points;
  • the above-mentioned copper-free zone corners are maintained at a right angle to cut the copper, and the line width is guaranteed to be at least 3 mils to effectively ensure the rigidity of the circuit board.
  • the electrical processing of the copper plate in the third step includes the following steps:
  • Electroplating frame production according to the size of the radar PCB blanking, increase the thickness of the substrate by 0.7mm to 1.0mm by 10mm, drill the positioning hole on the cut substrate, and then make a plurality of ventilation holes, two adjacent The venting holes are staggered, and the plurality of venting holes are distributed in a continuous "Z" shape.
  • the center distance between two adjacent ventilation holes is 6mm ⁇ 10mm.
  • the groove is milled, and the middle is hollowed out to form a plating frame to assist the copper plate.
  • the edge of the hole of the vent hole is 4 mm to 6 mm away from the edge of the plating frame, and the vent hole on the plating frame is added to facilitate the discharge of the syrup and Drying effectively solves the problem that the conventional electroplating frame is easy to hide and can not be effectively dried, causing the syrup to ooze out to the surface of the board, causing serious oxidation of the copper surface of the circuit, causing the problem of scrapping after surface treatment, effectively ensuring the plating quality and reducing the scrapping rate;
  • B The copper plate is plated, and the cut radar plate is clamped by using the electroplated frame.
  • the overlapping area of the plated frame and the radar plate is fixed by rivets, and then a layer of 1um-2um thick metal copper layer is deposited in the through hole by chemical copper deposition method. Then, using a plating method, the copper layer is thickened to 7 um to 10 um.
  • the invention provides a 77Ghz high-precision radio frequency radar printed circuit board with high pattern etching precision, small line burr, rectangular pad and copper-free corner maintaining a right angle, effective cost saving, high processing efficiency and high yield rate .

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

本发明公开了一种77Ghz高精密射频雷达印制线路板的制作方法，主要包括：线路增倍补偿设计，酸性蚀刻方式选择、矩形焊盘和无铜区拐角保持直角优化设计、薄板电镀边框优化设计，其它采用常规工序制作。本发明77Ghz高精密射频雷达印制线路板的制作方法具有图形蚀刻精度高、线路毛边小、矩形焊盘和无铜区拐角保持直角、有效节约成本、加工效率高以及良品率高等优点。

Description

一种77Ghz高精密射频雷达印制线路板的制作方法 技术领域
本发明涉及汽车射频雷达板制作技术领域，具体为一种77Ghz高精密射频雷达印制线路板的制作方法。
背景技术
频率在30-300Ghz的空间波称为毫米波，主要应用在车辆的道路识别、直升飞机的高压线识别。汽车毫米波雷达工作频段为21.65-26.65Ghz和76-87Ghz，比较常见的汽车毫米波雷达工作频率在24Ghz、77Ghz、79Ghz这三个频率附件。在汽车上应用毫米波雷达测距，具有探测性能稳定、环境适应性能好的特点，因为毫米波不易受对象表面形状和颜色的影响，也不受大气流的影响，雨雪雾对毫米波的干扰小。相比24Ghz，77Ghz具有探测距离更远、独有频段的优点，而79Ghz在大气中的衰减要弱适合长距离传输，因此，77Ghz目前更多的被认为是未来的主流方向。
随着汽车电子雷达产品的变革，对信号传输完整性提出了更高的要求，为保证射频信号传输的完整性，要求线路图形蚀刻精度高，矩形焊盘蚀刻后保持直角，线路毛边≤10um。同时，射频雷达印制线路板选用PTFE+陶瓷填料的板材进行加工制作，板材薄(100-150um)、软，加工过程容易出现以下问题：1.现有线路补偿、蚀刻加工方法无法有效保证图形焊盘、拐角呈直角，由于蚀刻药水水流效应，焊盘四个直角位置因为蚀刻药水交换容易导致蚀刻快，变成焊盘椭圆形；而图形拐角因为蚀刻药水交换难，形成无铜区域椭圆形。同时，线路毛边大，极大影响射频信号的传输品质，使得组装设备调试NG；2.采用激光刻铜技术加工，使用激光去除非线路区域的铜层，能有效保持图形精度，保证焊盘直角、线路毛边小的要求，但是，激光刻铜设备成本高，效率低，450mm×600mm尺寸的覆铜板材刻铜需耗时2h，暂无法运用于大批量生产阶段，仅适合小量样品生产，交期长；3.射频雷达印制线路板加工选用的板材薄(100-150um)、软，加工过程容易出现凹坑、电镀折板，电镀时会使用电镀边框固定，辅助沉铜 电镀。但是，由于电镀边框与PCB之间存在空隙，容易藏药水，导致无法有效烘干，药水渗出导致板面严重氧化，板材软、薄无法打磨，导致后工序无法去除氧化，表面处理后容易出现异色问题，导致报废。
技术问题
1.现有线路补偿、蚀刻加工方法无法有效保证图形焊盘、拐角呈直角，由于蚀刻药水水流效应，焊盘四个直角位置因为蚀刻药水交换容易导致蚀刻快，变成焊盘椭圆形；而图形拐角因为蚀刻药水交换难，形成无铜区域椭圆形。同时，线路毛边大，极大影响射频信号的传输品质，使得组装设备调试NG；2.采用激光刻铜技术加工，使用激光去除非线路区域的铜层，能有效保持图形精度，保证焊盘直角、线路毛边小的要求，但是，激光刻铜设备成本高，效率低，450mm×600mm尺寸的覆铜板材刻铜需耗时2h，暂无法运用于大批量生产阶段，仅适合小量样品生产，交期长；3.射频雷达印制线路板加工选用的板材薄(100-150um)、软，加工过程容易出现凹坑、电镀折板，电镀时会使用电镀边框固定，辅助沉铜电镀。但是，由于电镀边框与PCB之间存在空隙，容易藏药水，导致无法有效烘干，药水渗出导致板面严重氧化，板材软、薄无法打磨，导致后工序无法去除氧化，表面处理后容易出现异色问题，导致报废。
问题的解决方案
技术解决方案
一种77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：包括如下步骤：
第一步，工程资料设计，包括线路增倍补偿及酸性蚀刻方式选择、矩形焊盘保持直角设计和无铜区拐角保持直角设计；
第二步，按常规工艺流程进行板材开料、烘板、钻孔和等离子处理；
第三步，孔金属化处理，先进行薄板电镀边框的制作，在薄板电镀边框上增设通风孔，然后采用电镀边框夹住雷达板，电镀边框与雷达板重合区域采用打铆钉固定，后续按常规流程进行沉铜板电完成通孔金属化；
第四步、整板电镀增铜处理，根据客户要求，将经沉铜板电处理后孔铜和面铜厚度未达要求的整板，再次电镀进行增加孔铜、面铜厚度；
第五步、外层图形制作，包括矩形焊盘制作和蚀刻方式选择，根据增倍补偿设计后的工程资料进行焊盘制作，制作完成后进行酸性蚀刻；
第六步，按常规线路板加工流程进行后工序制作。
本发明77Ghz高精密射频雷达印制线路板的制作方法采用上述步骤中的线路增倍补偿、酸性蚀刻方式选择、矩形焊盘保持直角设计、无铜区拐角保持直角设计以及薄板电镀边框上通风孔的增设，结合孔金属化处理、整板电镀增铜处理、外层图形制作及其它常规工序流程进行高精密射频雷达印制线路板的制作，其线路增倍补偿能及酸性蚀刻方式选择能有效控制线路宽度，确保蚀刻精度，有效保证蚀刻毛边小，满足客户要求，进行高精密高速印制线路板制作；矩形焊盘保持直角设计能有效避免蚀刻水流效应导致的直角形状变成椭圆形状，有效确保矩形焊盘保持直角；无铜区拐角保持直角设计有效避免线路拐角因蚀刻水流效应形成无铜区椭圆形状，有效确保无铜区拐角保持直角，进行有效确保射频信号的传输品质；矩形焊盘保持直角设计和无铜区拐角保持直角设计有效使矩形焊盘和无铜区拐角保持直角，无需引进专用激光刻铜设备，有效节约了设备成本，提升了加工效率，适合批量生产；薄板电镀边框上通风孔的增设有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，保证了电镀品质，有效提升产品良率15％左右。
进一步地，第一步中的线路增倍补偿及酸性蚀刻方式选择具体如下：首先对蚀刻方式进行选择，选择有干膜保护的酸性蚀刻，其次根据铜厚选择对应的线路补偿，线路补偿按常规线路补偿的两倍进行，即是按成品铜厚的两倍进行补偿设计，具体线路增倍补偿、常规补偿和成品铜厚关系如下表：
[Table 1]
成品铜厚 常规补偿 增倍补偿
1oz 整体1mil 整体2mil
2oz 整体2mil 整体4mil
3oz 整体3mil 整体6mil
4oz 整体4mil 整体8mil
设计蚀刻次数为2次蚀刻，第一次采用常规参数进行蚀刻，第一次蚀刻后，增加1次减毛边蚀刻为第二次蚀刻，所述第二次蚀刻参数设定速度为7m/min，压力为0.6pa，蚀刻路径1～1.5m进行蚀刻。由于干膜补偿增大后，干膜塌陷，会对线路上端进行保护，不被蚀刻，线路下端就会被药水轻微蚀刻，有效减少毛边宽度。
进一步地，针对精度要求高的矩形焊盘，为避免蚀刻水流效应导致直角形状变成椭圆形状，在线路设计时，按以下步骤进行矩形焊盘保持直角设计：
A.客户设计的矩形焊盘，按常规线路补偿的两部进行增倍补偿；
B.使用软件设计4个5milx5mil的正方形，放置于矩形焊盘4个直角位置，4个5milx5mil的正方形的直角与矩形焊盘4个直角位置重合；
C.将每个5milx5mil的正方形外扩1mil，正方形的两外边均与矩形焊盘相距1mil，使顶角位于矩形焊盘外部，正方形的两内边与矩形焊盘相交形成2交点；
D.将正方形的顶角与两交点依次连接起来，形成三角形；
E.得到三角形后，去除正方形；
F.将三角形变成铜皮，加入到线路图形中，形成优化设计后的焊盘图形。
进一步地，为满足射频雷达板线路精度高的要求，避免线路拐角因为蚀刻水流效应形成无铜区椭圆形状，在线路设计时，按以下步骤进行第一步中的无铜区拐角保持直角设计：
A.客户设计的图形拐角，按常规线路补偿的两部进行补偿；
B.使用软件设计4个5milx5mil 的正方形，放置于图形拐角4个直角位置，4个5milx5mil的正方形的直角与图形拐角4个直角位置重合；
C.将每个5milx5mil的正方形内缩1mil，使正方形的内顶角位于图形区，正方形的两外边与图形区相交形成2交点；
D.将正方形的顶角与两交点依次连接起来，形成三角形；
E.得到三角形后，去除正方形；
F.最后将三角形削去进行削铜，形成设计后的无铜区直角图形。
进一步地，上述无铜区拐角保持直角设计削铜后，保证线路宽度最小为3mil，以有效确保线路板的刚性。
进一步地，第三步中沉铜板电处理包括如下步骤：
A.电镀边框制作，按雷达PCB下料尺寸单边加大10mm裁切0.7mm～1.0mm厚度的基板，在裁切的基板上进行钻定位孔工作，然后制作多个通风孔，相邻两个通风孔呈交错分布，多个通风孔呈连续“Z”字状分布。相邻两个通风孔孔中心距为6mm～10mm。最后再进行铣槽，将中间镂空，形成电镀边框以辅助沉铜板电，所述通风孔的孔边离电镀边框的边缘间距为4mm～6mm，电镀边框上通风孔的增设，有利于排出药水和烘干，有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，有效保证电镀品质，降低报废率；
B.沉铜板电，使用电镀边框将裁切的雷达板夹住，电镀边框与雷达板重合区域采用打铆钉固定，然后采用化学沉铜方法在通孔沉积一层1um-2um厚的金属铜层，再使用电镀方法加厚铜层达到7um～10um。
发明的有益效果
有益效果
本发明77Ghz高精密射频雷达印制线路板的制作方法采用上述步骤中的线路增倍补偿、酸性蚀刻方式选择、矩形焊盘保持直角设计、无铜区拐角保持直角设计以及薄板电镀边框上通风孔的增设，结合孔金属化处理、整板电镀增铜处理、外层图形制作及其它常规工序流程进行高精密射频雷达印制线路板的制作，具有如下的有益效果：
第一、图形蚀刻精度高、线路毛边小，线路增倍补偿及酸性蚀刻方式选择能有效控制线路宽度，确保蚀刻精度，有效保证蚀刻毛边小，图形蚀刻精度高，满足客户要求，进行高精密高速印制线路板制作；
第二、矩形焊盘保持直角设计能有效避免蚀刻水流效应导致的直角形状变成椭圆形状，有效确保矩形焊盘保持直角，有效确保射频信号的传输品质；
第三、无铜区拐角保持直角设计有效避免线路拐角因蚀刻水流效应形成无铜区椭圆形状，有效确保无铜区拐角保持直角，有效确保射频信号的传输品质；
第四、有效节约设备成本，提高加工效率，矩形焊盘保持直角设计和无铜区拐角保持直角设计有效使矩形焊盘和无铜区拐角保持直角，无需引进专用激光刻铜设备，有效节约了设备成本，提升了加工效率，适合批量生产；
第五、产品良率高，薄板电镀边框上通风孔的增设有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，保证了电镀品质，有效提升产品良率15％左右。
对附图的简要说明
附图说明
附图1为本发明酸性蚀刻方式与常规酸性蚀刻方式对比图；
附图2为本发明两次蚀刻图；
附图3为本发明矩形焊盘保持直角设计步骤A至F图；
附图4为本发明无铜区线路拐角保持直角设计步骤A至F图；
附图5为本发明电镀边框与常规电镀边框对比图。
实施该发明的最佳实施例
本发明的最佳实施方式
如图1至图5所示，一种77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：包括如下步骤：
第一步，工程资料设计，包括线路增倍补偿及酸性蚀刻方式选择、矩形焊盘保持直角设计和无铜区拐角保持直角设计；
第二步，按常规工艺流程进行板材开料、烘板、钻孔和等离子处理；
第三步，孔金属化处理，先进行薄板电镀边框的制作，在薄板电镀边框上增设 通风孔，然后采用电镀边框夹住雷达板，电镀边框与雷达板重合区域采用打铆钉固定，后续按常规流程进行沉铜板电完成通孔金属化；
第四步、整板电镀增铜处理，根据客户要求，将经沉铜板电处理后孔铜和面铜厚度未达要求的整板，再次电镀进行增加孔铜、面铜厚度；
第五步、外层图形制作，包括矩形焊盘制作和蚀刻方式选择，根据增倍补偿设计后的工程资料进行焊盘制作，制作完成后进行酸性蚀刻；
第六步，按常规线路板加工流程进行后工序制作。
本发明77Ghz高精密射频雷达印制线路板的制作方法采用上述步骤中的线路增倍补偿、酸性蚀刻方式选择、矩形焊盘保持直角设计、无铜区拐角保持直角设计以及薄板电镀边框上通风孔的增设，结合孔金属化处理、整板电镀增铜处理、外层图形制作及其它常规工序流程进行高精密射频雷达印制线路板的制作，其线路增倍补偿能及酸性蚀刻方式选择能有效控制线路宽度，确保蚀刻精度，有效保证蚀刻毛边小，满足客户要求，进行高精密高速印制线路板制作；矩形焊盘保持直角设计能有效避免蚀刻水流效应导致的直角形状变成椭圆形状，有效确保矩形焊盘保持直角；无铜区拐角保持直角设计有效避免线路拐角因蚀刻水流效应形成无铜区椭圆形状，有效确保无铜区拐角保持直角，进行有效确保射频信号的传输品质；矩形焊盘保持直角设计和无铜区拐角保持直角设计有效使矩形焊盘和无铜区拐角保持直角，无需引进专用激光刻铜设备，有效节约了设备成本，提升了加工效率，适合批量生产；薄板电镀边框上通风孔的增设有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，保证了电镀品质，有效提升产品良率15％左右。
上述第一步中的线路增倍补偿及酸性蚀刻方式选择具体如下：结合图1，首先对蚀刻方式进行选择，选择有干膜保护的酸性蚀刻方式，其次根据铜厚选择对应的线路补偿，线路补偿按常规线路补偿的两倍进行，即是按成品铜厚的两倍进行补偿设计，具体线路增倍补偿、常规补偿和成品铜厚关系如下表：
[Table 2]
成品铜厚 常规补偿 增倍补偿
1oz 整体1mil 整体2mil
2oz 整体2mil 整体4mil
3oz 整体3mil 整体6mil
4oz 整体4mil 整体8mil
结合图2，设计蚀刻次数为2次蚀刻，第一次采用常规参数进行蚀刻，第一次蚀刻后，增加1次减毛边蚀刻为第二次蚀刻，所述第二次蚀刻参数设定速度为7m/min，压力为0.6pa，蚀刻路径1～1.5m进行蚀刻。由于干膜补偿增大后，干膜塌陷，会对线路上端进行保护，不被蚀刻，线路下端就会被药水轻微蚀刻，有效减少毛边宽度。
结合图3矩形焊盘保持直角设计步骤A至F图，针对精度要求高的矩形焊盘，为避免蚀刻水流效应导致直角形状变成椭圆形状，在线路设计时，按以下步骤进行矩形焊盘保持直角设计：
A.客户设计的矩形焊盘，按常规线路补偿的两部进行增倍补偿；
B.使用软件设计4个5milx5mil的正方形，放置于矩形焊盘4个直角位置，4个5milx5mil的正方形的直角与矩形焊盘4个直角位置重合；
C.将每个5milx5mil的正方形外扩1mil，正方形的两外边均与矩形焊盘相距1mil，使顶角位于矩形焊盘外部，正方形的两内边与矩形焊盘相交形成2交点；
D.将正方形的顶角与两交点依次连接起来，形成三角形；
E.得到三角形后，去除正方形；
F.将三角形变成铜皮，加入到线路图形中，形成优化设计后的焊盘图形。
结合图4无铜区线路拐角保持直角设计步骤A至F图，为满足射频雷达板线路精度高的要求，避免线路拐角因为蚀刻水流效应形成无铜区椭圆形状，在线路设计时，按以下步骤进行第一步中的无铜区拐角保持直角设计：
A.客户设计的图形拐角，按常规线路补偿的两部进行补偿；
B.使用软件设计4个5milx5mil的正方形，放置于图形拐角4个直角位置，4个5milx5mil的正方形的直角与图形拐角4个直角位置重合；
C.将每个5milx5mil的正方形内缩1mil，使正方形的内顶角位于图形区，正方形的两外边与图形区相交形成2交点；
D.将正方形的顶角与两交点依次连接起来，形成三角形；
E.得到三角形后，去除正方形；
F.最后将三角形削去进行削铜，形成设计后的无铜区直角图形。
结合图4中F步骤图，上述无铜区拐角保持直角设计削铜后，保证线路宽度最小为3mil，以有效确保线路板的刚性。
结合图1至图5，第三步中沉铜板电处理包括如下步骤：
A.电镀边框制作，按雷达PCB下料尺寸单边加大10mm裁切0.7mm～1.0mm厚度的基板，在裁切的基板上进行钻定位孔工作，然后制作多个通风孔，相邻两个通风孔呈交错分布，多个通风孔呈连续“Z”字状分布。相邻两个通风孔孔中心距为6mm～10mm。最后再进行铣槽，将中间镂空，形成电镀边框以辅助沉铜板电，所述通风孔的孔边离电镀边框的边缘间距为4mm～6mm，电镀边框上通风孔的增设，有利于排出药水和烘干，有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，有效保证电镀品质，降低报废率；B.沉铜板电，使用电镀边框将裁切的雷达板夹住，电镀边框与雷达板重合区域采用打铆钉固定，然后采用化学沉铜方法在通孔沉积一层1um-2um厚的金属铜层，再使用电镀方法加厚铜层达到7um～10um。
发明实施例
本发明的实施方式
如图1至图5所示，一种77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：包括如下步骤：
第一步，工程资料设计，包括线路增倍补偿及酸性蚀刻方式选择、矩形焊盘保持直角设计和无铜区拐角保持直角设计；
第二步，按常规工艺流程进行板材开料、烘板、钻孔和等离子处理；
第三步，孔金属化处理，先进行薄板电镀边框的制作，在薄板电镀边框上增设通风孔，然后采用电镀边框夹住雷达板，电镀边框与雷达板重合区域采用打铆钉固定，后续按常规流程进行沉铜板电完成通孔金属化；
第四步、整板电镀增铜处理，根据客户要求，将经沉铜板电处理后孔铜和面铜厚度未达要求的整板，再次电镀进行增加孔铜、面铜厚度；
第五步、外层图形制作，包括矩形焊盘制作和蚀刻方式选择，根据增倍补偿设计后的工程资料进行焊盘制作，制作完成后进行酸性蚀刻；
第六步，按常规线路板加工流程进行后工序制作。
本发明77Ghz高精密射频雷达印制线路板的制作方法采用上述步骤中的线路增倍补偿、酸性蚀刻方式选择、矩形焊盘保持直角设计、无铜区拐角保持直角设计以及薄板电镀边框上通风孔的增设，结合孔金属化处理、整板电镀增铜处理、外层图形制作及其它常规工序流程进行高精密射频雷达印制线路板的制作，其线路增倍补偿能及酸性蚀刻方式选择能有效控制线路宽度，确保蚀刻精度，有效保证蚀刻毛边小，满足客户要求，进行高精密高速印制线路板制作；矩形焊盘保持直角设计能有效避免蚀刻水流效应导致的直角形状变成椭圆形状，有效确保矩形焊盘保持直角；无铜区拐角保持直角设计有效避免线路拐角因蚀刻水流效应形成无铜区椭圆形状，有效确保无铜区拐角保持直角，进行有效确保射频信号的传输品质；矩形焊盘保持直角设计和无铜区拐角保持直角设计有效使矩形焊盘和无铜区拐角保持直角，无需引进专用激光刻铜设备，有效节约了设备成本，提升了加工效率，适合批量生产；薄板电镀边框上通风孔的增设有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，保证了电镀品质，有效提升产品良率15％左右。
上述第一步中的线路增倍补偿及酸性蚀刻方式选择具体如下：结合图1，首先对蚀刻方式进行选择，选择有干膜保护的酸性蚀刻方式，其次根据铜厚选择对应的线路补偿，线路补偿按常规线路补偿的两倍进行，即是按成品铜厚的两倍进行补偿设计，具体线路增倍补偿、常规补偿和成品铜厚关系如下表：
[Table 3]
成品铜厚 常规补偿 增倍补偿
1oz 整体1mil 整体2mil
2oz 整体2mil 整体4mil
3oz 整体3mil 整体6mil
4oz 整体4mil 整体8mil
结合图2，设计蚀刻次数为2次蚀刻，第一次采用常规参数进行蚀刻，第一次蚀刻后，增加1次减毛边蚀刻为第二次蚀刻，所述第二次蚀刻参数设定速度为7m/min，压力为0.6pa，蚀刻路径1～1.5m进行蚀刻。由于干膜补偿增大后，干膜塌陷，会对线路上端进行保护，不被蚀刻，线路下端就会被药水轻微蚀刻，有效减少毛边宽度。
结合图3矩形焊盘保持直角设计步骤A至F图，针对精度要求高的矩形焊盘，为避免蚀刻水流效应导致直角形状变成椭圆形状，在线路设计时，按以下步骤进行矩形焊盘保持直角设计：
A.客户设计的矩形焊盘，按常规线路补偿的两部进行增倍补偿；
B.使用软件设计4个5milx5mil的正方形，放置于矩形焊盘4个直角位置，4个5milx5mil的正方形的直角与矩形焊盘4个直角位置重合；
C.将每个5milx5mil的正方形外扩1mil，正方形的两外边均与矩形焊盘相距1mil，使顶角位于矩形焊盘外部，正方形的两内边与矩形焊盘相交形成2交点；
D.将正方形的顶角与两交点依次连接起来，形成三角形；
E.得到三角形后，去除正方形；
F.将三角形变成铜皮，加入到线路图形中，形成优化设计后的焊盘图形。
结合图4无铜区线路拐角保持直角设计步骤A至F图，为满足射频雷达板线路精度高的要求，避免线路拐角因为蚀刻水流效应形成无铜区椭圆形状，在线路设计时，按以下步骤进行第一步中的无铜区拐角保持直角设计：
A.客户设计的图形拐角，按常规线路补偿的两部进行补偿；
B.使用软件设计4个5milx5mil的正方形，放置于图形拐角4个直角位置，4个5milx5mil的正方形的直角与图形拐角4个直角位置重合；
C.将每个5milx5mil的正方形内缩1mil，使正方形的内顶角位于图形区，正方形的两外边与图形区相交形成2交点；
D.将正方形的顶角与两交点依次连接起来，形成三角形；
E.得到三角形后，去除正方形；
F.最后将三角形削去进行削铜，形成设计后的无铜区直角图形。
结合图4中F步骤图，上述无铜区拐角保持直角设计削铜后，保证线路宽度最小为3mil，以有效确保线路板的刚性。
结合图1至图5，第三步中沉铜板电处理包括如下步骤：
A.电镀边框制作，按雷达PCB下料尺寸单边加大10mm裁切0.7mm～1.0mm厚度的基板，在裁切的基板上进行钻定位孔工作，然后制作多个通风孔，相邻两个通风孔呈交错分布，多个通风孔呈连续“Z”字状分布。相邻两个通风孔孔中心距为6mm～10mm。最后再进行铣槽，将中间镂空，形成电镀边框以辅助沉铜板电，所述通风孔的孔边离电镀边框的边缘间距为4mm～6mm，电镀边框上通风孔的增设，有利于排出药水和烘干，有效解决了常规电镀边框容易藏药水，无法有效烘干，导致药水渗出到板面使得线路铜面严重氧化，表面处理后导致报废的问题，有效保证电镀品质，降低报废率；B.沉铜板电，使用电镀边框将裁切的雷达板夹住，电镀边框与雷达板重合区域采用打铆钉固定，然后采用化学沉铜方法在通孔沉积一层1um-2um厚的金属铜层，再使用电镀方法加厚铜层达到7um～10um。
以上所述，仅为本发明的较佳实施例而已，并非对本发明作任何形式上的限制；凡本行业的普通技术人员均可按说明书附图所示和以上所述而顺畅地实施本发明；但是，凡熟悉本专业的技术人员在不脱离本发明技术方案范围内，可利用以上所揭示的技术内容而作出的些许更动、修饰与演变的等同变化，均为本发明的等效实施例；同时，凡依据本发明的实质技术对以上实施例所作的任何等同变化的更动、修饰与演变等，均仍属于本发明的技术方案的保护范围之内 。
工业实用性
本发明提供了一种图形蚀刻精度高、线路毛边小、矩形焊盘和无铜区拐角保持直角、有效节约成本、加工效率高以及良品率高的77Ghz高精密射频雷达印制线路板的制作方法。

Claims (10)

  1. 一种77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：包括如下步骤：
    第一步，工程资料设计，包括线路增倍补偿及酸性蚀刻方式选择、矩形焊盘保持直角设计和无铜区拐角保持直角设计；
    第二步，按常规工艺流程进行板材开料、烘板、钻孔和等离子处理；
    第三步，孔金属化处理，先进行薄板电镀边框的制作，在薄板电镀边框上增设通风孔，然后采用电镀边框夹住雷达板，电镀边框与雷达板重合区域采用打铆钉固定，后续按常规流程进行沉铜板电完成通孔金属化；
    第四步、整板电镀增铜处理，根据客户要求，将经沉铜板电处理后孔铜和面铜厚度未达要求的整板，再次电镀进行增加孔铜、面铜厚度；
    第五步、外层图形制作，包括矩形焊盘制作和蚀刻方式选择，根据增倍补偿设计后的工程资料进行焊盘制作，制作完成后进行酸性蚀刻；
    第六步，按常规线路板加工流程进行后工序制作。
  2. 根据权利要求1所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：第一步中的线路增倍补偿及酸性蚀刻方式选择具体如下：首先对蚀刻方式进行选择，选择有干膜保护的酸性蚀刻，其次根据铜厚选择对应的线路补偿，线路补偿按常规线路补偿的两倍进行，设计蚀刻次数为2次蚀刻，第一次为常规参数进行蚀刻，第一次蚀刻后，增加1次减毛边蚀刻为第二次蚀刻。
  3. 根据权利要求2所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：所述第二次蚀刻速度为7m/min，压力为0.6pa，蚀刻路径1～1.5m。
  4. 根据权利要求1所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：第一步中的矩形焊盘保持直角设计包括如下步骤：
    A．客户设计的矩形焊盘，按常规线路补偿的两部进行补偿；
    B．使用软件设计4个5mil x 5mil 的正方形，放置于矩形焊盘4个直角位置，4个5mil x 5mil 的正方形的直角与矩形焊盘4个直角位置重合；
    C．将每个5mil x 5mil 的正方形外扩1mil，正方形的两外边均与矩形焊盘相距1 mil，使顶角位于矩形焊盘外部，正方形的两内边与矩形焊盘相交形成2交点；
    D．将正方形的顶角与两交点依次连接起来，形成三角形；
    E．得到三角形后，去除正方形；
    F．将三角形变成铜皮，加入到线路图形中，形成优化设计后的焊盘图形。
  5. 根据权利要求1所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：第一步中的无铜区拐角保持直角设计包括如下步骤：
    A．客户设计的图形拐角，按常规线路补偿的两部进行补偿；
    B．使用软件设计4个5mil x 5mil 的正方形，放置于图形拐角4个直角位置，4个5mil x 5mil 的正方形的直角与图形拐角4个直角位置重合；
    C．将每个5mil x 5mil 的正方形内缩1mil，使正方形的内顶角位于图形区，正方形的两外边与图形区相交形成2交点；
    D．将正方形的顶角与两交点依次连接起来，形成三角形；
    E．得到三角形后，去除正方形；
    F．最后将三角形削去进行削铜，形成设计后的无铜区直角图形。
  6. 根据权利要求5所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：第一步中无铜区拐角保持直角设计削铜后，线路宽度最小为3 mil。
  7. 根据权利要求1所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：第三步中沉铜板电处理包括如下步骤：
    A．电镀边框制作，按雷达PCB下料尺寸单边加大10mm裁切0.7mm～1.0mm厚度的基板，在裁切的基板上进行钻定位孔工作，然后制作多个通风孔，最后再进行铣槽，将中间镂空，形成电镀边框以辅助沉铜板电；
    B．沉铜板电，使用电镀边框将裁切的雷达板夹住，电镀边框与雷达板重合区域采用打铆钉固定，然后采用化学沉铜方法在通孔沉积一层1um-2um厚的金属铜层，再使用电镀方法加厚铜层达到7um～10um。
  8. 根据权利要求7所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：相邻两个通风孔呈交错分布，多个通风孔呈连续“Z”字状分布。
  9. 根据权利要求8所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：相邻两个通风孔孔中心距为6mm～10mm。
  10. 根据权利要求9所述的77Ghz高精密射频雷达印制线路板的制作方法，其特征在于：所述通风孔的孔边离电镀边框的边缘间距为4mm～6mm。
PCT/CN2016/105879 2016-09-27 2016-11-15 一种77Ghz高精密射频雷达印制线路板的制作方法 WO2018058761A1 (zh)

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