WO2018047574A1 - レーザ光源およびそれを用いたレーザ加工装置 - Google Patents

レーザ光源およびそれを用いたレーザ加工装置 Download PDF

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Publication number
WO2018047574A1
WO2018047574A1 PCT/JP2017/029062 JP2017029062W WO2018047574A1 WO 2018047574 A1 WO2018047574 A1 WO 2018047574A1 JP 2017029062 W JP2017029062 W JP 2017029062W WO 2018047574 A1 WO2018047574 A1 WO 2018047574A1
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WO
WIPO (PCT)
Prior art keywords
laser
voltage
signal
light source
trigger signal
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Application number
PCT/JP2017/029062
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English (en)
French (fr)
Japanese (ja)
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原　章文
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住友重機械工業株式会社
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Application filed by 住友重機械工業株式会社 filed Critical 住友重機械工業株式会社
Priority to KR1020197003086A priority Critical patent/KR102311082B1/ko
Priority to CN201780046356.0A priority patent/CN109641316B/zh
Publication of WO2018047574A1 publication Critical patent/WO2018047574A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser

Definitions

  • the present invention relates to a laser driving device for a laser processing apparatus.
  • Laser processing equipment is widely used as an industrial processing tool.
  • the processing accuracy of the laser processing apparatus depends on the characteristics of the laser pulse generated by the laser light source, such as energy, intensity, and time waveform. Therefore, in order to realize highly accurate processing, it is necessary to generate laser pulses with small variations from the laser light source.
  • Patent Document 1 a physical quantity that depends on the energy of a laser pulse is measured by a photodetector, and when the measured physical quantity deviates from an allowable value, the target is not irradiated with the laser pulse, and is released to another path.
  • Technology is disclosed.
  • the present invention has been made in such a situation, and one of the exemplary purposes of an aspect thereof is to provide a laser processing apparatus that suppresses shot defects and a laser light source thereof by using a different approach.
  • the laser processing apparatus includes a laser light source that oscillates in response to a trigger signal and generates a laser pulse, an optical system that irradiates an object with the laser pulse, and a control device that outputs a trigger signal to the laser light source.
  • the laser light source includes a discharge electrode, a direct current power source that generates a direct current voltage, a high frequency power source that receives the direct current voltage and generates a high frequency voltage between the discharge electrodes, and operates the high frequency power source in response to a trigger signal.
  • a drive circuit that generates an irradiation prohibition signal that is asserted when the voltage deviates from the allowable range.
  • the laser processing apparatus is configured not to irradiate the object with a laser pulse when the irradiation inhibition signal is asserted.
  • the drive circuit may not operate the high frequency power supply when the irradiation prohibition signal is asserted. As a result, when the irradiation prohibition signal is asserted, laser oscillation can be prevented, so that shot defects can be suppressed while suppressing wasteful power.
  • the control device may not output a trigger signal when the irradiation prohibition signal is asserted. Thereby, the operation of the high frequency power supply when the irradiation prohibition signal is asserted can be prevented.
  • the allowable range may be narrower than ⁇ 10% of the target value of DC voltage. More preferably, the upper and lower limits of the allowable range may be defined as a range narrower than ⁇ 5% of the target value of the DC voltage, and more preferably narrower than ⁇ 1% of the target value.
  • the laser light source is a laser light source for a laser processing device that emits light in response to a trigger signal from a control device, and receives a DC voltage, a DC voltage, and a high frequency between the discharge electrodes.
  • a high-frequency power source that generates a voltage; and a drive circuit that operates the high-frequency power source in response to a trigger signal and generates a flag signal indicating that light emission is prohibited when the DC voltage deviates from an allowable range.
  • shot defects can be suppressed.
  • FIG. 1 is a block diagram of a laser processing apparatus 10 according to an embodiment.
  • the laser processing apparatus 10 irradiates the object 2 with the laser pulse 4 to process the object 2.
  • the type of the object 2 is not particularly limited, and examples of the type of processing include drilling and cutting, but are not limited thereto.
  • the laser processing apparatus 10 includes a laser light source 12, an optical system 14, a control device 16, and a stage 18.
  • the object 2 is placed on the stage 18 and fixed as necessary.
  • the stage 18 positions the object 2 in accordance with the position control signal S 2 from the control device 16 and relatively scans the irradiation position of the object 2 and the laser pulse 4.
  • the stage 18 can be uniaxial, biaxial (XY), or triaxial (XYZ).
  • the laser light source 12 oscillates in response to the trigger signal S 1 from the control device 16 and generates a laser pulse 6.
  • the optical system 14 irradiates the object 2 with the laser pulse 6.
  • the configuration of the optical system 14 is not particularly limited, and may include a mirror group for guiding the beam to the object 2, a lens and an aperture for beam shaping, and the like.
  • the control device 16 controls the laser processing apparatus 10 in an integrated manner. Specifically, the control device 16 intermittently outputs a trigger signal S 1 to the laser light source 12. The control unit 16 generates a position control signal S 2 for controlling the stage 18 according to the data (recipe) describes the processing.
  • the laser light source 12 generates a radiation prohibition signal S 3.
  • Irradiation prohibition signal S 3 has a visible to the controller 16.
  • the control unit 16 does not output a trigger signal S 1.
  • FIG. 2 is a block diagram of the laser light source 12.
  • the laser light source 12 includes a discharge electrode 30, a DC power supply 40, and a high frequency power supply 50.
  • the discharge electrode 30 is provided in a chamber 32 filled with a mixed gas such as CO2, and is equivalently represented as a series capacitor.
  • the DC power supply 40 generates a DC voltage VDC of several hundreds V (for example, 500V).
  • the configuration of the DC power supply 40 is not particularly limited, but may include a bank capacitor 42, a power supply device 44, a filter 46, and the like.
  • the power supply device 44 may be a converter or a charging circuit that stabilizes the voltage VDC of the bank capacitor 42 to a target value.
  • the high frequency power supply 50 receives the DC voltage V DC from the DC power supply 40 and generates a rectangular wave driving voltage V DRV .
  • the driving voltage V DRV via the inductor 34 is applied between the discharge electrode 30, the inductor 34 and the series resonance of the discharge electrode 30, generating a high frequency voltage V AC of the AC across the discharge electrode 30.
  • the high frequency power supply 50 includes an input capacitor 52, a full bridge (H bridge) type inverter 54, and a step-up transformer 56.
  • the inverter 54 applies an AC voltage having an amplitude of the DC voltage VDC to the primary winding of the step-up transformer 56.
  • Drive circuit 60 in response to the trigger signals S 1 by operating the high frequency power source 50 generates a high frequency voltage V AC.
  • Drive circuit Specifically 60 when the trigger signals S 1 is input, the switching four switches of the inverter 54. All switches of the inverter 54 in the no-input state of the trigger signals S 1 is off.
  • the determination period before light emission provided in the determination section may be asserted irradiation prohibition signal S 3 when the DC voltage V DC deviates from the allowable range.
  • the determination section is preferably provided in a period in which the DC voltage V DC is to be stabilized at the target value V REF after the oscillation operation of the laser light source 12. For example, the determination section may be immediately before the next shot of the laser pulse 6.
  • the DC voltage V DC (or the detected voltage based thereon) can be composed of a voltage comparator which compares the allowable range upper limit, the threshold corresponding to the lower limit.
  • the DC voltage V DC (or a detection voltage based thereon) may be converted into a digital value by an A / D converter, and the digital value may be compared with threshold values corresponding to the upper limit and the lower limit of the allowable range.
  • narrow is more preferably ⁇ 10% of the target value V REF of the DC voltage V DC, and more preferably, ⁇ 5% of the target value V REF, even more preferably smaller than ⁇ 1% of the target value V REF Is preferred.
  • the allowable range may be 500 ⁇ 1V, that is, ⁇ 0.2% of the target value V REF .
  • the laser processing apparatus 10 when the irradiation prohibition signal S 3 is asserted, configured not irradiated with laser pulses 4 into the object 2.
  • the laser light source 12 when the irradiation prohibition signal S 3 is asserted, the laser light source 12 is configured not to emit light.
  • Drive circuit 60 in particular is not operated a high-frequency power source 50 when the irradiation prohibition signal S 3 is asserted.
  • the control device 16 as described above is inputted irradiation prohibition signal S 3, when the irradiation prohibition signal S 3 is asserted and does not output a trigger signal S 1.
  • FIG. 3 is an operation waveform diagram of the laser processing apparatus 10 of FIG.
  • the DC voltage V DC is stabilized at the target voltage V REF .
  • the control unit 16 to assert (high level) the trigger signal S 1 a high frequency power supply 50 is switched, the laser pulse 6 is generated.
  • the high frequency power supply 50 is switched, the electric charges of the bank capacitors 42 and 52 are discharged, so that the DC voltage V DC decreases, and when the laser oscillation stops, it recovers toward the target value V REF .
  • the direct-current voltage V DC is within the allowable range (hatching) 70, and therefore the irradiation inhibition signal S 3 is negated. Therefore, the second to follow them, the trigger signal S 1 is asserted in the third cycle, the laser pulse 6 is outputted.
  • the irradiation inhibition signal S 3 is asserted. Assertion of a result of the irradiation prohibition signal S 3, in the next fourth cycle does not occur the trigger signal S 1, no laser pulse 6 also occurs.
  • the DC voltage V DC during the fourth cycle converged within the allowable range 70, irradiation prohibition signal S 3 in the judgment interval tau 4 is negated, the trigger signal S 1 is asserted in the next fifth cycle, the laser pulses 6 is output.
  • the above is the operation of the laser processing apparatus 10.
  • the amplitude of RF voltage V AC applied to the discharge electrode 30 is defined by the DC voltage V DC, thus, energy of the laser pulse 6, the peak value, time profiles, depending on the DC voltage V DC generated in the capacitor 42 and 52 ing.
  • the laser processing apparatus 10 it is possible to estimate a shot defect before actually oscillating the laser light source 12 by monitoring the DC voltage VDC . In a situation where there is a high possibility of a shot failure, the processing accuracy can be increased by not irradiating the object 2 with a laser.
  • the control device 16 when the irradiation prohibition signal S 3 is asserted, the control device 16 has been decided not to output the trigger signals S 1 not apply it. For example, the control device 16 outputs the trigger signal S 1 regardless of the irradiation prohibition signal S 3, and the drive circuit 60 receives the trigger signal S 1 when the irradiation prohibition signal S 3 is asserted.
  • the high frequency power supply 50 may not be operated.
  • FIG. 4 is an operation waveform diagram of the laser processing apparatus 10 according to the second modification.
  • Irradiation prohibition signal S 3 when the DC voltage V DC is included in the allowable range first level (e.g., high level) to the (ready state), the second level when the deviation (non-ready state) (e.g. low level ) May be a binary signal.
  • the controller 16 on condition that the irradiation prohibition signal S 3 which is the first level, may output the trigger signal S 1.
  • the irradiation prohibition signal S 3 when the irradiation prohibition signal S 3 is asserted, it is assumed that does not generate a laser pulse 6 is not limited thereto.
  • the irradiation prohibition signal S 3 when the irradiation prohibition signal S 3 is asserted, it may be guided laser pulses 6 to routes other than the object 2.
  • a beam damper may be provided in the optical system 14 in a different path from the object 2, and the laser pulse 4 may be guided to the beam damper when the irradiation inhibition signal S 3 is asserted.
  • the present invention can be used for laser processing technology.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2017/029062 2016-09-07 2017-08-10 レーザ光源およびそれを用いたレーザ加工装置 WO2018047574A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020197003086A KR102311082B1 (ko) 2016-09-07 2017-08-10 레이저광원 및 그것을 이용한 레이저가공장치
CN201780046356.0A CN109641316B (zh) 2016-09-07 2017-08-10 激光光源及使用激光光源的激光加工装置

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JP2016-174734 2016-09-07
JP2016174734A JP6732613B2 (ja) 2016-09-07 2016-09-07 レーザ光源およびそれを用いたレーザ加工装置

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KR (1) KR102311082B1 (zh)
CN (1) CN109641316B (zh)
TW (1) TWI644751B (zh)
WO (1) WO2018047574A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI691373B (zh) * 2018-03-29 2020-04-21 日商住友重機械工業股份有限公司 雷射加工裝置

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KR102442710B1 (ko) 2021-01-28 2022-09-08 경북대학교 산학협력단 마이크로 옵틱 마하젠더 간섭계 기반의 레이저 광원장치
JP2023071308A (ja) * 2021-11-11 2023-05-23 パナソニックＩｐマネジメント株式会社 レーザ加工装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122805A (ja) * 1993-10-26 1995-05-12 Amada Co Ltd 高周波レーザ発振器の電源装置の出力電圧制御方法
JP2000135579A (ja) * 1998-10-29 2000-05-16 Miyachi Technos Corp レーザ加工装置
JP3496369B2 (ja) * 1995-11-06 2004-02-09 三菱電機株式会社 レーザ用電源装置
JP2013071175A (ja) * 2011-09-29 2013-04-22 Mitsubishi Electric Corp レーザ加工機
JP2014188560A (ja) * 2013-03-28 2014-10-06 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
JP2015223591A (ja) * 2014-05-26 2015-12-14 住友重機械工業株式会社 レーザ加工装置及びレーザ発振方法
JP2016059932A (ja) * 2014-09-17 2016-04-25 住友重機械工業株式会社 レーザ加工装置及びパルスレーザビームの出力方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000306813A (ja) * 1999-04-22 2000-11-02 Nikon Corp 露光方法及び露光装置
JP2007059690A (ja) * 2005-08-25 2007-03-08 Fanuc Ltd 高周波放電励起ガスレーザ発振器
JP4137972B2 (ja) * 2006-12-14 2008-08-20 ファナック株式会社 ガス組成異常判断方法及び放電励起ガスレーザ発振器
JP5920870B2 (ja) * 2011-11-02 2016-05-18 株式会社アマダミヤチ レーザ電源装置
JP5988903B2 (ja) * 2013-03-19 2016-09-07 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
TWI523357B (zh) * 2013-03-19 2016-02-21 Sumitomo Heavy Industries Laser processing device and laser processing method
JP2015022214A (ja) * 2013-07-22 2015-02-02 ブラザー工業株式会社 画像形成装置
JP6234296B2 (ja) 2014-03-27 2017-11-22 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122805A (ja) * 1993-10-26 1995-05-12 Amada Co Ltd 高周波レーザ発振器の電源装置の出力電圧制御方法
JP3496369B2 (ja) * 1995-11-06 2004-02-09 三菱電機株式会社 レーザ用電源装置
JP2000135579A (ja) * 1998-10-29 2000-05-16 Miyachi Technos Corp レーザ加工装置
JP2013071175A (ja) * 2011-09-29 2013-04-22 Mitsubishi Electric Corp レーザ加工機
JP2014188560A (ja) * 2013-03-28 2014-10-06 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
JP2015223591A (ja) * 2014-05-26 2015-12-14 住友重機械工業株式会社 レーザ加工装置及びレーザ発振方法
JP2016059932A (ja) * 2014-09-17 2016-04-25 住友重機械工業株式会社 レーザ加工装置及びパルスレーザビームの出力方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI691373B (zh) * 2018-03-29 2020-04-21 日商住友重機械工業股份有限公司 雷射加工裝置

Also Published As

Publication number Publication date
KR102311082B1 (ko) 2021-10-07
TWI644751B (zh) 2018-12-21
KR20190045156A (ko) 2019-05-02
JP2018039032A (ja) 2018-03-15
TW201811476A (zh) 2018-04-01
CN109641316B (zh) 2021-03-30
CN109641316A (zh) 2019-04-16
JP6732613B2 (ja) 2020-07-29

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