WO2018021562A1 - 微細気泡洗浄装置及び微細気泡洗浄方法 - Google Patents

微細気泡洗浄装置及び微細気泡洗浄方法 Download PDF

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Publication number
WO2018021562A1
WO2018021562A1 PCT/JP2017/027551 JP2017027551W WO2018021562A1 WO 2018021562 A1 WO2018021562 A1 WO 2018021562A1 JP 2017027551 W JP2017027551 W JP 2017027551W WO 2018021562 A1 WO2018021562 A1 WO 2018021562A1
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Prior art keywords
bubble
cleaning
cleaning liquid
fine
short
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PCT/JP2017/027551
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English (en)
French (fr)
Japanese (ja)
Inventor
日高　義晴
山本　寛
Original Assignee
パナソニックＩｐマネジメント株式会社
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Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Priority to JP2017550944A priority Critical patent/JP6252926B1/ja
Priority to CN201780046445.5A priority patent/CN109564861B/zh
Publication of WO2018021562A1 publication Critical patent/WO2018021562A1/ja

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a cleaning apparatus and a cleaning method using fine bubbles.
  • An object of the present invention is to effectively utilize the crushing action of the FB and to uniformly disperse the crushing energy over the entire workpiece.
  • the present invention has been conceived in view of the above problems, and provides a fine bubble cleaning apparatus and a cleaning method capable of exerting the crushing energy of fine bubbles on the entire object to be cleaned.
  • the fine bubble cleaning device is: A fine bubble generating device that generates fine bubbles in the cleaning liquid and generates the bubble cleaning liquid; A bubble spontaneous crushing device that shortens the lifetime of the fine bubbles in the bubble cleaning liquid and generates a short-life bubble cleaning liquid; It has a washing tank which makes the above-mentioned short-life bubble washing liquid and a thing to be washed contact, and the above-mentioned bubble spontaneous crushing device is arranged on the outside of the washing tank.
  • the fine bubble cleaning method Generating fine bubbles in the cleaning liquid to generate a bubble cleaning liquid; Shortening the lifetime of the fine bubbles in the bubble cleaning liquid, and generating a short-life bubble cleaning liquid; It has the process of making the said short-lived bubble cleaning liquid and a to-be-cleaned object contact.
  • the fine bubble cleaning apparatus usually applies a life shock to fine bubbles having a life of several months to shorten the life, and supplies it to an object to be cleaned. Therefore, spontaneous crushing proceeds on the surface of the object to be cleaned, and a high cleaning effect can be obtained without giving an impact such as ultrasonic waves or superheated steam to the object to be cleaned. In addition, since spontaneous crushing occurs continuously, the object to be cleaned receives the crushing energy throughout. That is, the cleaning power is not unevenly distributed on a part of the object to be cleaned.
  • the fine bubble cleaning device can control the collapse of the fine bubbles in time, it is possible to send out cleaning liquids having different crushing times.
  • Such a cleaning liquid can be suitably used when supplying an object to be cleaned and also cleaning an inner wall of a long pipe.
  • the fine bubble cleaning apparatus according to the present invention is mainly used in a chemical treatment process and a cleaning process for semiconductors and electronic parts formed by photolithography. It is an apparatus for performing cleaning by removing or replacing deposits and chemical components adhering to these surfaces. Further, for example, it can be used for cleaning an inner wall in a liquid feeding pipe.
  • FIG. 1 shows a configuration of a fine bubble cleaning apparatus according to the present invention.
  • the fine bubble cleaning device 1 according to the present invention includes a fine bubble generating device 10, a bubble spontaneous crushing device 12, and a cleaning tank 14. Further, the storage tank 16 may be provided.
  • the fine bubble generating device 10 is a device that generates fine bubbles B in the cleaning liquid W to generate the bubble cleaning liquid WB.
  • the fine bubbles B are bubbles including so-called nano bubbles and micro bubbles having a size of 1 nm to 100 ⁇ m. More preferably, bubbles of 1 nm to 10 ⁇ m are good.
  • the wiring interval of electronic devices is often formed with a size of several ⁇ m to several tens of ⁇ m.
  • the fine holes on the surface of the electronic device often have a hole diameter of several ⁇ m to several tens of ⁇ m. Therefore, when an electronic device is to be cleaned, a fine bubble B having a size equal to or smaller than that size is required.
  • the cleaning liquid W pure water, ion-exchanged water, or the like can be suitably used. However, other polar solvents and nonpolar solvents may be used.
  • the cleaning liquid W is supplied from a cleaning water supply source (not shown).
  • the fine bubbles B may be air, but N 2 (nitrogen), O 2 (oxygen), H 2 (hydrogen), Ar (argon), Xe (xenon), and O 3 (ozone) are used alone or in combination. It may be used as a mixed gas.
  • the effect of redox can be obtained by using N 2 (nitrogen), O 2 (oxygen), H 2 (hydrogen), or O 3 (ozone).
  • a gas generated by the fine bubbles B in the cleaning liquid W is referred to as “bubble cleaning liquid WB”.
  • the gas supply source Gas may be provided.
  • the bubble spontaneous crushing device 12 generates short-lived bubble cleaning liquid WBs in which the lifetime of the fine bubbles B in the bubble cleaning liquid WB is shortened. It is said that microbubbles (including nanobubbles) with a normal size of 100 ⁇ m or less exist stably for several months once they are generated. Here, being stably present means that the density of the fine bubbles B in the liquid does not substantially change.
  • the generated fine bubbles B disappear in a shorter time when the temperature or pressure of the liquid is changed.
  • the life of the fine bubbles B is also affected by the size of the droplets when spraying or ejecting the liquid containing the fine bubbles B as droplets.
  • the trigger for shortening the life of the fine bubbles B is referred to as “life impact”. Further, in contrast to a phenomenon in which the microbubbles B naturally disappear (natural crushing), the fact that the microbubbles B disappear in a short lifetime by artificially giving a lifetime impact is called “spontaneous collapse”.
  • the bubble spontaneous crushing device 12 gives a lifetime impact to the bubble cleaning liquid WB. More specifically, it is a device for adjusting the temperature and pressure of the bubble cleaning liquid WB and the size of the bubble cleaning liquid WB when it is formed into droplets. A specific configuration of the bubble spontaneous crusher 12 will be described later.
  • the microbubbles B given the life impact are crushed with an impact smaller than the life impact, and this effectively utilizes the crushing action of the microbubbles B and is uniform over the entire object to be cleaned. It becomes the point which can disperse the energy of crushing.
  • the cleaning tank 14 is a container for bringing the short-lived bubble cleaning liquid WBs into contact with the object to be cleaned Pro.
  • the contacting is performed by spraying the short-lived bubble cleaning liquid WBs on the object to be cleaned Pro (discharge: including a shower) or immersing the target object Pro in the short-lived bubble cleaning liquid WBs (dip).
  • the cleaning tank 14 may include a chemical processing apparatus that performs chemical processing on the object to be cleaned Pro that has been exposed in the manufacturing process by photolithography. This is because the cleaning process is continuously performed after the chemical process.
  • the chemical treatment refers to a treatment for removing the resist from the object to be cleaned Pro that has been developed.
  • the semiconductor substrate or electronic device that has been exposed is an object to be cleaned, but a semiconductor substrate such as Si on which an element of an electronic device in which wiring is formed by a photolithography method and an etching method is formed, An insulating substrate such as glass is also effective as a cleaning target.
  • the manufacturing process by photolithography will be described as an example, but the target of the process is also a cleaning process based on rinsing cleaning after chemical processing or pure water for removing foreign substances without using chemicals such as etching. Applicable.
  • the fine bubble cleaning device 1 functions with the fine bubble generation device 10, the bubble spontaneous collapse device 12, and the cleaning tank 14 described above.
  • the storage tank 16 the 1st bubble monitor 20, the 2nd bubble monitor 22, and the control apparatus 30 can be further provided.
  • the storage tank 16 is a container for storing the bubble cleaning liquid WB generated by the fine bubble generator 10.
  • the volume of the storage tank 16 can be appropriately determined depending on the scale of the fine bubble cleaning device 1.
  • the first bubble monitor 20 and the second bubble monitor 22 are devices that measure the density of the fine bubbles B in the short-life bubble cleaning liquid WBs.
  • This is an apparatus for measuring the number of fine bubbles B in a unit volume using a laser, that is, the density of the fine bubbles B.
  • this is a device that measures heat and energy such as temperature at a certain distance between the pipe r2 and the return pipe r3. From the difference between the measured values, the number of fine bubbles B in the unit volume, that is, the fine bubbles B Can be measured.
  • control device 30 a computer composed of an MPU (Micro Processor Unit) and a memory can be suitably used.
  • the control device 30 is connected to the first bubble monitor 20 and the second bubble monitor 22. Further, it may be connected to the bubble spontaneous crushing device 12 and a pump for determining the flow rate. It may be connected to the fine bubble generator 10.
  • the bubble spontaneous crushing device 12 and each pump are configured so that their movements can be controlled by signals from the control device 30.
  • the storage tank 16 is provided with a circulation pipe r1.
  • a fine bubble generator 10 is disposed in the circulation pipe r1.
  • the gas supply source Gas may be connected to the fine bubble generating device 10.
  • the circulation pipe r1 is provided with a pump P1 that determines the circulation amount of the bubble cleaning liquid WB.
  • a pipe r2 through which the stored bubble cleaning liquid WB passes is disposed between the storage tank 16 and the cleaning tank 14.
  • the bubble spontaneous crushing device 12 is provided in the middle of the pipe r2. Therefore, in the pipe r2, the part from the storage tank 16 to the bubble spontaneous crushing device 12 may be the pipe r21, and the part from the bubble spontaneous crushing apparatus 12 to the cleaning tank 14 may be the pipe r22.
  • the bubble cleaning liquid WB flows through the pipe r21, and the short-life bubble cleaning liquid WBs flows through the pipe r22.
  • the pipe r21 is provided with a pump P2 that determines the supply amount of the short-life bubble cleaning liquid WBs.
  • a first bubble monitor 20 is provided in the pipe r22. When the pipe r22 is present, the first bubble monitor 20 is desirably provided in the pipe r22. This is because the density of the fine bubbles B whose lifetime has been shortened can be directly measured.
  • the bubble spontaneous crushing apparatus is provided outside the cleaning tank 14. This is because, unlike a conventional cleaning device using the fine bubbles B, it is not necessary to give an impact to the fine bubbles B in the vicinity of the object to be cleaned Pro.
  • the cleaning tank 14 is provided with a drain pipe rx. Further, the cleaning tank 14 may be provided with a return pipe r3 through which the short-lived bubble cleaning liquid WBs flows between the storage tank 16 and the cleaning tank 14 and can be used when the cleaning liquid is circulated.
  • the return pipe r3 is provided with a pump P3 that determines the return amount.
  • a second bubble monitor 22 is also provided in the return pipe r3.
  • control device 30 is connected to the first bubble monitor 20 and the second bubble monitor 22 and receives signals S1 and S2 from these measurement devices.
  • instruction signals CP1, CP2, and Cp3 to the pump P1, the pump P2, and the pump P3, respectively, the flow rates V1, V2, and V3 of the respective pumps are controlled.
  • an instruction signal CB1 is transmitted to the bubble spontaneous crushing device 12 to control the life of the fine bubbles B in the bubble cleaning liquid WB.
  • the operation of the fine bubble cleaning apparatus 1 having the above configuration will be described.
  • the cleaning liquid W in the storage tank 16 flows through the circulation pipe r1, passes through the fine bubble generator 10 in a circulating manner, and the fine bubbles B are mixed into the bubble cleaning liquid WB.
  • the fine bubbles B in the bubble cleaning liquid WB have a long life of about several months as they are.
  • the bubble cleaning liquid WB in the storage tank 16 flows through the pipe r2 toward the cleaning tank 14 by the pump P2.
  • FIG. 2 is a graph showing the concept.
  • the horizontal axis represents time (t), and the vertical axis represents bubble density D (pieces / cm 3).
  • D a ⁇ exp ( ⁇ bt): a, b are real numbers, D is bubble density, and t is the elapsed time from time T0”.
  • a and b vary depending on the type of cleaning liquid W, the type and degree of impact, and the application method.
  • the lifetime TL of the fine bubbles B may be, for example, a time during which the density of the bubbles before receiving the lifetime impact is halved after receiving the lifetime impact.
  • the lifetime TL of the fine bubbles B in the bubble cleaning liquid WB is set to such a time that the short-life bubble cleaning liquid WBs is associated with the object to be cleaned Pro in the cleaning tank 14. To do.
  • the method for setting the bubble life TL differs depending on the configuration of the bubble spontaneous collapse device 12.
  • life TL of the control device 30 can do.
  • the short-lived bubble cleaning liquid WBs in which the lifetime of the fine bubbles B is shortened is sent to the cleaning tank 14 and is associated with the object to be cleaned Pro.
  • the density of the fine bubbles B whose lifetime is shortened hardly decreases until they are associated with the object to be cleaned Pro.
  • the short-lived bubble cleaning liquid WBs associates with the object to be cleaned Pro, it spreads to every corner of the surface of the object to be cleaned Pro.
  • the fine bubbles B in the short-life bubble cleaning liquid WBs are spontaneously crushed by a slight impact such as contact or collision with the object to be cleaned Pro. This is because it is fragile due to the impact of its lifetime. And a foreign material can be removed with the energy which generate
  • the spontaneous collapse of the microbubbles B is not caused by ultrasonic waves or local heat or pressure applied from the outside, so that the surface of the object to be cleaned Pro is not damaged.
  • the fine bubbles B in the short-life bubble cleaning liquid WBs continuously crush spontaneously, the fine bubbles B of the short-life bubble cleaning liquid WBs spontaneously crush at any location on the surface of the object to be cleaned Pro. continuing.
  • the object to be cleaned Pro can be cleaned uniformly. That is, it can be cleaned well near the supply port of the short-life bubble cleaning liquid WBs in the cleaning tank 14, and the cleaning power does not decrease at a distant portion.
  • the short-lived bubble cleaning liquid WBs that has cleaned the object to be cleaned Pro in the cleaning tank 14 is returned to the storage tank 16 through the return pipe r3.
  • a filter (not shown) for removing impurities in the short-life bubble cleaning liquid WBs is provided in the middle of the return pipe r3.
  • the installation location is preferably between the cleaning tank 14 and the second bubble monitor 22. This is because the influence of impurities on the second bubble monitor 22 and the pump P3 can be suppressed. A part may be discarded through the drain pipe rx.
  • the control device 30 measures the bubble density D1 of the fine bubbles B in the short-life bubble cleaning liquid WBs including the fine bubbles B whose lifetime is shortened by the first bubble monitor 20 arranged in the pipe r2.
  • the “fine bubbles B with a shortened life” may be referred to as “fine bubbles B subjected to a life impact”.
  • the bubble density D2 of the fine bubbles B in the discharged short-lived bubble cleaning liquid WBs is measured by the second bubble monitor 22 disposed in the return pipe r3 discharged from the cleaning tank 14. These measured values are notified to the control device 30 by signals S1 and S2.
  • the step of measuring the bubble density D1 of the fine bubbles B with the first bubble monitor 20 may be referred to as a first monitoring step.
  • the step of measuring the bubble density D2 of the fine bubbles B in the short-life bubble cleaning liquid WBs by the second bubble monitor 22 may be called a second monitoring step.
  • the bubble density D1 in the short-life bubble cleaning liquid WBs supplied to the cleaning tank 14 and the bubble density D2 in the short-life bubble cleaning liquid WBs discharged from the cleaning tank 14 are not appropriate values, the bubbles spontaneously
  • the life TL is adjusted by the instruction signal CB1 to the crushing device 12. Moreover, you may further adjust the supply flow volume to the washing tank 14 with the pump P2. Further, when the fine bubble generating device 10 is intermittently operated, it may be switched to continuous operation.
  • the fine bubble generator 10 is controlled by an instruction signal CB0 from the controller 30.
  • the difference Ds between D1 and D2 is less than a predetermined value, the number of fine bubbles B that spontaneously collapse in the cleaning tank 14 is small. This leads to low detergency. Therefore, the instruction signal CB1 is transmitted to the bubble spontaneous collapse device 12 so as to shorten the life TL of the fine bubbles B.
  • the instruction signal CP2 may be transmitted to the pump P2 so as to increase the supply speed of the short-life bubble cleaning liquid WBs to the cleaning tank 14.
  • the instruction signal CB1 is transmitted to the bubble spontaneous crushing device 12 so as to extend the life TL of the fine bubbles B.
  • the instruction signal CP2 may be transmitted to the pump P2 so as to increase the supply speed supplied to the cleaning tank 14.
  • FIG. 3 shows a configuration of the fine bubble cleaning device 2 in which the arrangement of the bubble spontaneous crushing device is different from that in FIG.
  • the bubble spontaneous crushing device 13 is arranged in a circulation pipe r ⁇ b> 4 arranged so as to circulate with respect to the storage tank 16.
  • the circulation pipe r4 is provided with a pump P4.
  • the fine bubble cleaning apparatus 1 shown in FIG. 1 generates the bubble cleaning liquid WB, and shortens the lifetime of the fine bubbles B immediately before being introduced into the cleaning tank 14. Therefore, the life TL of the short-life bubble cleaning liquid WBs can be controlled in a relatively short time.
  • FIG. 4 shows a fine bubble cleaning device 3 provided with two bubble spontaneous collapse devices 12 and a bubble spontaneous collapse device 13. Since two bubble spontaneous crushing devices are arranged, two types of bubbles having different lifetimes TL can be included in the short-life bubble cleaning liquid WBs. By mixing bubbles with different lifespans, there is a mixture of difficult-to-clean deposits that decompose and remove organic substances and deposits that can be easily removed simply by adhering to the surface, such as falling foreign matter. This is effective in the case of an object to be cleaned Pro.
  • FIG. 5 shows a specific example of the bubble spontaneous crushing device 12.
  • FIG. 5A shows the configuration of the bubble spontaneous collapse device 12a when pressure is used as a life impact.
  • the tank 40 Connected to the tank 40 are a pipe rin into which the bubble cleaning liquid WB is introduced and a pipe rout through which the short-life bubble cleaning liquid WBs in the tank 40 is discharged.
  • the pipe rin is the pipe r21
  • the pipe rout is the pipe r22.
  • the pipe rin and the pipe rout are both circulation pipes r4.
  • the tank 40 is also connected with a pressure adjusting device 42.
  • the pressure adjusting device 42 can bring the tank 40 into a pressurized state or a reduced pressure state.
  • the bubble cleaning liquid WB is supplied into the tank 40 by the pipe rin.
  • the tank 40 is filled with a predetermined amount of the bubble cleaning liquid WB, the supply of the bubble cleaning liquid WB is stopped once. Then, the tank 40 is sealed, and the pressure in the tank 40 is increased or reduced by the pressure adjusting device 42.
  • the life of the microbubbles B is shortened regardless of whether they are pressurized or depressurized. However, it is desirable to confirm how much the pressure change causes the life TL to be reached with the actually used cleaning liquid W and the fine bubble cleaning apparatus 1.
  • the bubble spontaneous crushing device 12a shortens the life for each fixed bubble cleaning liquid WB. Therefore, since it becomes a batch process, the short-lived bubble cleaning liquid WBs cannot be sent out continuously. In order to send continuously, two bubble crushing devices 12a may be provided and switched every time the process is completed.
  • FIG. 5 (b) shows a bubble spontaneous collapse device 12b of a type that uses temperature as a lifetime impact.
  • the bubble spontaneous crushing device 12b also has a pipe rin for injecting the bubble cleaning liquid WB into the tank 50 and a pipe rout for sending the short-life bubble cleaning liquid WBs subjected to the short life processing. Note that the short life treatment is to give a life impact.
  • a heat exchanging unit 54 connected to the temperature adjusting device 52 is disposed. Therefore, the temperature of the liquid in the tank 50 can be heated or cooled to a predetermined temperature.
  • the bubble spontaneous crushing device 12b also first fills the tank 50 with the bubble cleaning liquid WB, and then changes the temperature of the bubble cleaning liquid WB. It is desirable to make the temperature of the bubble cleaning liquid WB in the tank 50 as uniform as possible and change in a short time. This is to make the life TL of the fine bubbles B of the bubble cleaning liquid WB in the tank 50 uniform.
  • the bubble spontaneous crushing device 12b is also a batch process. Therefore, it is desirable to switch between the two apparatuses so that the short-lived bubble cleaning liquid WBs can be continuously delivered.
  • FIG. 5 (c) shows a bubble spontaneous crushing device 12c of a type in which the bubble cleaning liquid WB is divided into droplets as a life impact.
  • the bubble self-crushing device 12c introduces the bubble cleaning liquid WB into the tank 60, the bubble cleaning liquid WB is divided into droplets of a predetermined size by the mist nozzle 62.
  • the mist nozzle 62 has a mechanism capable of automatic replacement. More specifically, a plurality of mist nozzles 62 can be rotated, and the mist nozzles 62 connected to the piping rin are switched by an instruction signal CB1 from the control device 30. In FIG. 5, the description of the point that the mist nozzle 62 has a replaceable configuration is omitted.
  • the bubble spontaneous crushing device 12c can continuously generate the short-lived bubble cleaning liquid WBs instead of batch processing.
  • the bubble spontaneous crushing device 12 can be a device having several different configurations in order to impart a lifetime impact such as pressure, temperature, and droplet division to the bubble cleaning liquid WB. These devices may be used in combination. Specifically, the bubble spontaneous collapse device 12a and the bubble spontaneous collapse device 12c may be combined in succession.
  • bubble spontaneous collapse devices 12a to 12c can be used as the bubble spontaneous collapse device 12 and the bubble spontaneous collapse device 13, respectively.
  • FIG. 6 specifically illustrates the contents of the cleaning tank 14.
  • the cleaning tank 14 in which the single-wafer
  • the object to be cleaned Pro is a semiconductor substrate or an electronic device manufactured by photolithography, and has been exposed.
  • the chemical liquid device 70 includes a disk 71 on which the object to be cleaned Pro is sucked and fixed, a chemical liquid nozzle 72 that discharges the chemical liquid to the object to be cleaned Pro, a chemical liquid tank 73 that supplies the chemical liquid to the chemical liquid nozzle 72, a pump 74, and a filter 75. Formed with.
  • the object to be cleaned Pro is sucked on the disk 71 or fixed by a guide mechanism around the object to be cleaned Pro. Then, the chemical solution is supplied onto the object to be cleaned Pro from the chemical solution nozzle 72 while being rotated at high speed. Then, the chemical removes the resist remaining after the etching.
  • the disk 71 is surrounded by a liquid collection frame 79. Therefore, the chemical solution from which the resist has been removed is collected in the chemical solution tank 73 via the valve 73b. And after passing the filter 75 and removing a foreign material, it is discharged again to the to-be-cleaned object Pro.
  • the short-lived bubble cleaning liquid WBs is then discharged from the cleaning nozzle 14a to the object to be cleaned Pro. Since the spontaneous crushing of the fine bubbles B in the short-life bubble cleaning liquid WBs has already started, the fine bubbles B are easily broken. Therefore, regardless of the timing of contact with the object to be cleaned Pro, the object to be cleaned Pro receives a cleaning action of spontaneous collapse of the fine bubbles B in the short-life bubble cleaning liquid WBs.
  • the short-lived bubble cleaning liquid WBs that has been cleaned flows from the valve 73b to the return piping r3 and returns to the storage tank 16. A part of the short-lived bubble cleaning liquid WBs may be discarded from the drain pipe rx through the valve 14eb.
  • a bath type chemical device 80 is included in the cleaning tank 14.
  • an object to be cleaned Pro that has been developed is immersed in a chemical solution bath 81 in which the chemical solution is circulating.
  • the resist on the surface of the object to be cleaned Pro is peeled and decomposed by the chemical solution.
  • the chemical liquid is circulated in the chemical liquid bath 81 through the filter 83 by the pump 82.
  • the object to be cleaned Pro from which the resist is peeled is immersed in the cleaning bath 14b.
  • the short-lived bubble cleaning liquid WBs is supplied. Since the fine bubbles B in the short-life bubble cleaning liquid WBs continue to be spontaneously crushed, they are very easily crushed.
  • the object to be cleaned Pro receives a cleaning effect due to spontaneous crushing of the fine bubbles B while being immersed.
  • the fine bubble cleaning apparatus according to the present invention can be suitably used for cleaning the object to be cleaned Pro.
  • Embodiment 2 In this embodiment mode, an example in which an object to be cleaned is a pipe is shown.
  • the fine bubble cleaning apparatus according to the present invention can produce short-life bubble cleaning liquid WBs containing fine bubbles B with a controlled lifetime TL. Therefore, it is possible to generate the fine bubbles B having different times for spontaneous crushing. Therefore, by flowing the short-life bubble cleaning liquid WBs having different lifetimes TL through the long piping, different portions of the piping can be sequentially cleaned.
  • a long pipe rL is connected to the fine bubble cleaning device 4 as an object to be cleaned.
  • the position of the bubble spontaneous collapse device 12 is the same as that of the fine bubble cleaning device 1.
  • a long pipe rL is connected to the pipe r22 at the rear stage of the bubble spontaneous crushing device 12. The end of the pipe rL may be returned to the storage tank 16.
  • the bubble spontaneous crushing device 12 flows a predetermined amount of the short-life bubble cleaning liquid WBsL having a long lifetime TL.
  • a predetermined amount of short-life bubble cleaning liquid WBsS having a short life TL is passed. This operation may be repeated a plurality of times.
  • the life TL of the short-life bubble cleaning liquid WBsL is set to the middle point of the rear half of the pipe, and the life TL of the short-life bubble cleaning liquid WBsS is set to the mid-point of the front half of the pipe rL.
  • the life TL is divided into two parts and alternately flows through the pipe rL, which is the object to be cleaned, but can also be divided into three or more life TLs.
  • the fine bubble cleaning apparatus according to the present invention can be suitably used for a semiconductor or electronic device cleaning process. Moreover, it can utilize suitably also for washing

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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PCT/JP2017/027551 2016-07-29 2017-07-28 微細気泡洗浄装置及び微細気泡洗浄方法 WO2018021562A1 (ja)

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JP2017550944A JP6252926B1 (ja) 2016-07-29 2017-07-28 微細気泡洗浄装置及び微細気泡洗浄方法
CN201780046445.5A CN109564861B (zh) 2016-07-29 2017-07-28 微气泡清洗装置和微气泡清洗方法

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JP2016-150770 2016-07-29

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Cited By (3)

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