WO2018019225A1 - 基板的对接装置及对接方法 - Google Patents

基板的对接装置及对接方法 Download PDF

Info

Publication number
WO2018019225A1
WO2018019225A1 PCT/CN2017/094271 CN2017094271W WO2018019225A1 WO 2018019225 A1 WO2018019225 A1 WO 2018019225A1 CN 2017094271 W CN2017094271 W CN 2017094271W WO 2018019225 A1 WO2018019225 A1 WO 2018019225A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
docking device
adsorption
docking
rotating mechanism
Prior art date
Application number
PCT/CN2017/094271
Other languages
English (en)
French (fr)
Inventor
王东
刘凯
王刚
阮冬
宋海军
Original Assignee
上海微电子装备（集团）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海微电子装备（集团）股份有限公司 filed Critical 上海微电子装备（集团）股份有限公司
Publication of WO2018019225A1 publication Critical patent/WO2018019225A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to the field of semiconductor technology, and in particular, to a docking device and a docking method for a substrate.
  • the substrate In the manufacturing process of the semiconductor, the substrate needs to be grabbed from the magazine through the plate fork and uploaded into the mechanical device, thereby performing corresponding processing on the substrate.
  • the storage direction of the substrate in the magazine is generally the same.
  • the board forks the substrate the board forks the substrate in a certain direction and places the substrate in the same direction in the mechanical device.
  • the substrate needs to be placed in the mechanical device at an angular position. In this case, the substrate is rotated by an angle before the substrate is loaded, and then the substrate rotated to a specific direction is placed on the machine. In the device.
  • the substrate is a rectangular glass
  • the plate fork generally grabs the substrate along the long side direction of the substrate, and when the substrate needs to enter the lithographic exposure apparatus in the short side direction,
  • the substrate is rotated by 90° before the substrate is uploaded to the lithographic exposure apparatus or before the substrate is pre-aligned, and then the rotated substrate is loaded into the lithographic exposure apparatus using a plate fork.
  • the present invention provides a docking device for a substrate, which realizes the docking between the substrate and the substrate production line device, wherein the docking device includes a rotation for driving the substrate to rotate. a mechanism and at least one substrate adsorption mechanism fixed to the rotating mechanism, the substrate adsorption mechanism is for supporting and fixing a substrate, and the rotating mechanism drives the substrate adsorption mechanism to rotate.
  • the substrate adsorption mechanism includes an adsorption kit and a suction tray, and the adsorption mechanism of the substrate adsorption mechanism is fixed on the rotation mechanism, and the adsorption tray extends outward from the interior of the adsorption kit to form a A contact surface for contacting the substrate, wherein the adsorption disk is provided with a vacuum passage communicating with the contact surface.
  • the substrate adsorption mechanism further includes a support member located in the adsorption kit and located below the contact surface to support the contact surface.
  • the material of the adsorption tray is a polymer resin material.
  • the material of the support member is a rubber material.
  • the docking device of the substrate further comprises a plate fork detecting device, wherein the plate fork detecting device has a sensor for determining whether there is a plate fork in the sensing area.
  • the docking device of the substrate further comprises a substrate detecting device, wherein the substrate detecting device has a sensor for determining whether a substrate is present in the sensing area.
  • the docking device of the substrate further includes a plurality of auxiliary support mechanisms distributed around the rotating mechanism for assisting in supporting the substrate.
  • the auxiliary supporting mechanism is a columnar structure, and an end surface of the columnar structure contacting the substrate is a circular arc shape.
  • the auxiliary support mechanism is coupled to the rotating mechanism by a first bracket set, and the rotating mechanism drives the auxiliary support mechanism to rotate.
  • the docking device of the substrate further includes a plurality of substrate clamping mechanisms for clamping the edge of the substrate, the substrate clamping mechanism includes a clamping portion parallel to the edge of the substrate and driving the clip A driving device that moves the holding portion in a direction perpendicular to the edge of the substrate.
  • the substrate clamping mechanism is connected to the rotating mechanism by a second bracket set.
  • the rotating mechanism drives the substrate clamping mechanism to rotate.
  • the docking device of the substrate further comprises a station detecting device, the station detecting device comprises a sensor kit and a mechanical limit kit, wherein the sensor kit is configured to detect a rotation angle of the rotating mechanism, the mechanical limit The kit is used to define an extreme position at which the rotating mechanism is rotatable.
  • a further object of the present invention is to provide a method for docking a substrate, comprising:
  • the rotating mechanism drives the substrate adsorption mechanism to rotate to rotate the substrate to an angular position
  • the pre-aligned substrate is taken out and placed in the substrate production line apparatus or the magazine.
  • the present invention provides a docking device for a substrate.
  • the substrate can be rotated by the docking device to achieve a specific angular position, thereby realizing the substrate pick-and-place. process.
  • the substrate is fixed by a substrate adsorption mechanism, and the substrate adsorption mechanism is driven by a rotation mechanism to rotate, thereby further adsorbing the substrate on the substrate adsorption mechanism.
  • a rotation has occurred. That is, in the docking device of the substrate provided by the present invention, the centripetal force that drives the rotation of the substrate is provided by the frictional force between the substrate surface and the substrate adsorption mechanism, instead of applying a force to the edge of the substrate, and thus at the edge of the substrate Local stress is not generated, which ensures the integrity of the substrate.
  • FIG. 1 is a schematic structural view of a docking device of a substrate according to an embodiment of the present invention
  • FIG. 2a is a partial enlarged view of a substrate adsorption mechanism of a docking device of a substrate according to an embodiment of the invention
  • 2b is a cross-sectional view showing a substrate adsorption mechanism of a docking device of a substrate according to an embodiment of the present invention
  • 3 is a schematic structural view of the substrate before and after rotation taken by two plate forks;
  • FIG. 4 is a partial enlarged view of a substrate clamping mechanism of a docking device of a substrate according to an embodiment of the present invention
  • FIG. 5 is a schematic flow chart of a method for docking a substrate according to an embodiment of the invention.
  • the present invention provides a docking device for a substrate to achieve docking between the substrate and the substrate production line device, wherein the docking device includes a rotating mechanism for rotating the substrate and at least one fixed The substrate adsorption mechanism on the rotating mechanism is configured to support and fix the substrate, and the rotating mechanism drives the substrate adsorption mechanism to rotate.
  • the substrate is fixed by a substrate suction mechanism, and the substrate suction mechanism is rotated by the rotation mechanism to rotate the substrate adsorbed on the substrate adsorption mechanism.
  • FIG. 1 is a schematic structural view of a docking device of a substrate according to an embodiment of the present invention, as shown in FIG. 1
  • the docking device of the substrate includes a rotating mechanism 110 for driving the substrate to rotate, and at least one substrate adsorbing mechanism 120 fixed on the rotating mechanism 110, the substrate adsorbing mechanism 120 is for supporting and fixing the substrate, the rotation
  • the mechanism 110 drives the substrate adsorption mechanism 120 to rotate.
  • the substrate adsorption mechanism 120 When the substrate is rotated by the docking device of the substrate provided by the present invention, the substrate adsorption mechanism 120 is in contact with the lower surface of the substrate and adsorbs the substrate to fix the substrate.
  • the rotating mechanism 110 drives the substrate adsorption mechanism 120 to rotate, the substrate fixed to the substrate adsorption mechanism 120 is correspondingly driven.
  • the centripetal force that drives the rotation of the substrate is the friction between the substrate surface and the substrate adsorption mechanism 120, instead of applying a force to the edge of the substrate, so that local stress is not generated at the edge position of the substrate, thereby ensuring the substrate. Integrity.
  • FIG. 2a is a partial enlarged view of a substrate adsorption mechanism of a docking device of a substrate according to an embodiment of the present invention
  • FIG. 2b is a cross-sectional view of a substrate adsorption mechanism of a docking device of a substrate according to an embodiment of the present invention, which is combined with FIGS. 2a and 2b.
  • the substrate adsorption mechanism 120 includes an adsorption package 121 and a suction pad 122.
  • the substrate adsorption mechanism 120 is coupled to a vacuuming device (not shown), and the substrate can be fixed by vacuuming.
  • the substrate adsorption mechanism 120 has a vacuum channel 125. After the substrate is placed on the substrate adsorption mechanism 120, the vacuuming device extracts air between the substrate and the substrate adsorption mechanism 120 through the vacuum channel 125. Thereby, the substrate is adsorbed on the substrate adsorption mechanism 120.
  • the fixing of the substrate adsorption mechanism can be achieved by the adsorption assembly 121.
  • the adsorption assembly 121 can be fixed to the rotating mechanism 110 by using the screw fastener 124, thereby implementing the entire substrate adsorption mechanism 120. Fixed.
  • the adsorption disk 122 extends outward from the interior of the adsorption package 121 to form a contact surface 122a that is in contact with the substrate, wherein the vacuum channel 125 can be disposed on the adsorption surface.
  • the disk 122 is in communication with the contact surface 122a.
  • the adsorption kit 121 after the adsorption kit 121 is fixed on the rotating mechanism, it forms a hollow structure and is on the same
  • the square also has an opening, and the outer shape of the adsorption disk 122 is matched with the shape of the inner wall of the adsorption set 121, while the adsorption disk 122 is along the inner wall of the adsorption set 121 and passes through the opening of the adsorption set to the outside of the adsorption kit. Extending to form a contact surface 122a.
  • the shape of the contact surface 122a may be any shape, such as a circle, an ellipse or a rectangle.
  • the adsorption tray 122 can be made of a polymer resin material, so that the adsorption tray 122 has a certain pressure bearing property and elasticity. Since the adsorption disk 122 is in contact with the substrate when supporting and fixing the substrate, the adsorption disk 122 made of a polymer resin material has a certain elasticity, which can better protect the substrate on the one hand and avoid scratching the substrate. On the other hand, when the substrate is rotated, a frictional force is easily generated between the adsorption disk and the substrate to facilitate the rotation of the substrate; in addition, when the substrate is warped, the polymer resin is used. The contact surface 122a made of the material has plasticity, so that it can still be well adhered to the surface of the substrate, thereby ensuring the adsorption effect of the substrate adsorption mechanism 120 on the substrate.
  • the substrate adsorption mechanism 120 further includes a support member 123 located in the adsorption package 121 and located below the contact surface 122a to support the contact surface 122a.
  • a support member 123 located in the adsorption package 121 and located below the contact surface 122a to support the contact surface 122a.
  • the support member 123 When a support member 123 for supporting the contact surface 122 is disposed under the contact surface 122a, the support member 123 can support the contact surface 122a well to avoid contact surface after being pressed by the substrate.
  • the support member 123 may be made of a rubber material.
  • the rubber material has a certain elasticity, so that the substrate has a buffering force when it is adhered to the contact surface 122a to reduce the instantaneous impact force generated on the substrate; on the other hand, the rubber material has It has a certain elasticity and can function as a support contact surface.
  • the docking device of the substrate further includes a station detecting device 180.
  • the station detecting device 180 includes a sensor kit and a mechanical limit kit, which is used to detect the rotation angle of the rotating mechanism 110.
  • the limit limit kit can limit the rotation angle of the rotating mechanism 110 according to the set limit position.
  • the substrate is taken into the docking device of the substrate by the plate fork 130.
  • the plate fork 130 has two plate fingers.
  • the two plate fingers of the plate fork 130 move below the substrate and support the substrate, and then Move the plate fork in the opposite direction to achieve the pick-and-place function of the substrate.
  • the corresponding plate fork or a plurality of plate forks may be selected according to the specific substrate and the angle of rotation of the substrate. For example, referring to FIG. 3, when the substrate 200 is rectangular and needs to be rotated by 90°, first, the first plate fork 130a is used to place the substrate 200 on the substrate along the first side of the rotating mechanism 110.
  • the two plate fingers of the first plate fork 130a support the substrate 200 along the short side direction of the substrate 200; then, the docking device of the substrate rotates the substrate 200 by 90°; then, the second board is required
  • the fork 130b grasps the substrate 200 along a second side perpendicular to the first side, and at this time, the finger of the second plate 130b holds the substrate along the longitudinal direction of the substrate 200.
  • the distance between the second plate fork 130b and the two plate fingers in the first plate fork 130a, and the length of the finger are all set according to the length and width of the substrate.
  • the docking device of the substrate further comprises a plate fork detecting device 140 for detecting whether there is a plate fork in the corresponding region.
  • the plate fork detecting device 140 has a sensor through which the presence of the plate fork is sensed, wherein the sensor may be a photosensitive sensor, that is, by detecting an optical signal to determine the presence of the plate fork.
  • the board fork detecting device 140 is located in the moving direction of the board fork 130 and is disposed under the finger of the board fork 130, so that when the finger 130 enters the docking device of the board, The plate fork detecting device 140 can immediately sense the presence of the finger.
  • the plate fork detecting device 140 can be sensed by the plate-fork detecting device 140. Whether there is a plate fork in the docking device of the substrate, and restricting the plurality of plate forks from entering the docking device of the substrate at the same time, thereby realizing interlocking between the plurality of plate forks to avoid mutual interference.
  • the docking device of the substrate further includes a substrate detecting device 150.
  • the substrate detecting device 150 can adopt the same detecting device as the plate detecting device 140. Specifically, the substrate detecting device 150 has a The sensor senses whether a substrate exists in the corresponding area by the sensor. Further, the substrate detecting device 150 is disposed under the substrate. On the one hand, the substrate detecting device 150 can be used to detect whether a substrate is placed in the docking device of the substrate, and the plurality of substrates are repeatedly placed on the docking device of the substrate to cause damage of the substrate; on the other hand, a plurality of substrate detecting devices can be disposed. 150, and is disposed at a position corresponding to the substrate when rotating at different angles, and thus can also be used to determine the angular position of the substrate in the docking device 100.
  • the docking device of the substrate further includes a plurality of auxiliary support mechanisms 160 for assisting in supporting the substrate and adjusting the horizontal position of the substrate.
  • the auxiliary support mechanism 160 is disposed at a peripheral area of the rotating mechanism 110.
  • the auxiliary supporting mechanism 160 is a columnar structure, and the end surface of the columnar structure contacting the substrate has a circular arc shape, thereby reducing the contact area with the substrate and alleviating the friction between the auxiliary supporting mechanism 160 and the substrate.
  • the auxiliary support mechanism 160 is further connected to the rotating mechanism 110 through the first bracket assembly 190. That is, when the rotating mechanism 110 rotates the substrate suction mechanism 120, the auxiliary supporting mechanism 160 also rotates. The auxiliary support mechanism is prevented from scratching the surface of the substrate.
  • the docking device of the substrate further comprises a plurality of substrate clamping mechanisms 170 for clamping the edge of the substrate, the substrate clamping mechanism 170 can be used to adjust the position of the substrate and further fix the base The plate, in this way, ensures the positional accuracy of the substrate before and after rotation.
  • 4 is a partially enlarged view of a substrate clamping mechanism of a docking device of a substrate according to an embodiment of the present invention. Referring specifically to FIG. 4 and in conjunction with FIG. 1, the substrate clamping mechanism 170 includes a clip parallel to the edge of the substrate.
  • the clamping portion is provided with at least one roller 171 for contacting the edge of the substrate, wherein the driving device 172 can be a cylinder.
  • the driving device 172 drives the roller 171 to move in a direction perpendicular to the edge of the substrate, thereby pushing the substrate to a predetermined position.
  • the edge of the substrate contacts and moves with the roller, so that the roller is used to facilitate the movement of the substrate and reduce the friction against the edge of the substrate.
  • the substrate docking device has four substrate clamping mechanisms 170 , wherein each substrate clamping mechanism 170 is provided with two rollers, and the rectangular substrate is clamped.
  • the four substrate holding mechanisms 170 respectively sandwich the four edges of the rectangular substrate, and the two rollers 171 of each of the substrate holding mechanisms 170 respectively press each side of the substrate.
  • the substrate holding mechanism 170 selects whether or not the rotation is driven by the rotation mechanism 110 in accordance with an actual application. That is, in the docking device of the substrate provided by the present invention, the substrate clamping mechanism 170 may be fixedly disposed, or may be coupled to the rotating mechanism 110 so as to be rotatable by the rotating mechanism 110. In this embodiment, the substrate clamping structure 170 is connected to the first bracket assembly 190 through the second bracket assembly 191 so as to be rotatable by the rotating mechanism 110 and simultaneously with the substrate adsorption mechanism 120.
  • FIG. 5 is a schematic flow chart of a method for docking a substrate according to an embodiment of the present invention. Referring specifically to FIG. 5 and FIG. 1 , the method for docking the substrate includes:
  • the rotating mechanism 110 drives the substrate adsorption mechanism 120 to rotate to rotate the substrate to an angular position
  • the pre-aligned substrate is taken out and placed in the substrate production line device/the magazine.
  • the substrate is first adsorbed and fixed by the substrate adsorption mechanism 120, and the substrate adsorption mechanism is rotated by the rotation mechanism 110 to pass between the substrate adsorption mechanism 110 and the substrate surface.
  • the frictional force forms a centripetal force that rotates the substrate, thereby effecting rotation of the substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

提供了一种基板的对接装置及对接方法，其中，基板的对接装置包括带动基板旋转的旋转机构（110）以及至少一个基板吸附机构（120），所述基板吸附机构（120）用于支撑并固定基板，所述旋转机构（110）带动所述基板吸附机构（120）旋转。通过提供的基板的对接装置，以实现当基板需从不同角度位置进入基板产线设备或版库时，可优先对基板进行旋转以达到所需的角度位置，进而实现基板的旋转对接的过程。

Description

基板的对接装置及对接方法 技术领域
本发明涉及半导体技术领域，特别涉及一种基板的对接装置及对接方法。
背景技术
在半导体的制造过程中，基板需通过板叉由版库中抓取并上载至机械设备中，从而对基板进行相应的工艺加工。其中，基板于版库中的存放方向通常是一致的，板叉在抓取基板时，所述板叉以一定的方向抓取基板，并以相同的方向将所述基板放置于机械设备中。然而，在某些工艺过程中，基板需以一定的角度位置放置于机械设备中，此时，就需在上载基板之前，先将基板旋转一角度，再将旋转至特定方向的基板放置于机械设备中。例如，在TFT的光刻工艺中，所述基板为长方形的玻璃，板叉通常沿着基板的长边方向抓取基板，而当基板需以短边方向进入到光刻曝光设备中时，此时在将所述基板上载至光刻曝光设备之前或在对基板进行预对准之前需将基板旋转90°，然后再采用板叉将旋转后的基板上载至光刻曝光设备中。在这个过程中，亟需一种对接装置能实现旋转对接过程。
发明内容
本发明的目的在于提供一种基板的对接装置，以实现基板从不同的角度位置进入设备或版库时，可优先对基板进行旋转以达到所需的角度位置的目的。
为此，本发明提供一种基板的对接装置，实现所述基板在版库和基板产线设备之间的对接，其中，所述对接装置包括用于带动基板旋转的旋转 机构和至少一个固定在所述旋转机构上的基板吸附机构，所述基板吸附机构用于支撑并固定基板，所述旋转机构带动所述基板吸附机构旋转。
可选的，所述基板吸附机构包括一吸附套件以及一吸附盘，通过所述吸附套件实现基板吸附机构在旋转机构上的固定，所述吸附盘由所述吸附套件的内部向外延伸形成一用于与基板接触的接触面，所述吸附盘内设有与所述接触面连通的真空通道。
可选的，所述基板吸附机构还包括一支撑件，所述支撑件位于所述吸附套件内，且位于所述接触面下方以支撑所述接触面。
可选的，所述吸附盘的材质为高分子树脂材料。
可选的，所述支撑件的材料为橡胶材料。
可选的，所述基板的对接装置还包括板叉检测装置，所述板叉检测装置具有一传感器，所述传感器用于判断其感应区域内是否存在板叉。
可选的，所述基板的对接装置还包括基板检测装置，所述基板检测装置具有一传感器，所述传感器用于判断其感应区域内是否存在基板。
可选的，所述基板的对接装置还包括若干辅助支撑机构，所述若干辅助支撑机构分布在所述旋转机构周围，用于辅助支撑所述基板。
可选的，所述辅助支撑机构为柱状结构，所述柱状结构与所述基板接触的端面为圆弧形。
可选的，所述辅助支撑机构通过第一支架套件与所述旋转机构连接，所述旋转机构带动所述辅助支撑机构旋转。
可选的，所述基板的对接装置还包括多个用于夹持所述基板边缘的基板夹持机构，所述基板夹持机构包括与所述基板边缘平行的夹持部和驱动所述夹持部沿垂直所述基板边缘方向移动的驱动装置。
可选的，所述基板夹持机构通过第二支架套件与所述旋转机构连接， 所述旋转机构带动所述基板夹持机构旋转。
可选的，所述基板的对接装置还包括工位检测装置，所述工位检测装置包括传感器套件以及机械限位套件，所述传感器套件用于检测旋转机构的旋转角度，所述机械限位套件用于限定所述旋转机构可旋转的极限位置。
本发明的又一目的在于，提供一种基板的对接方法，其特征在于，包括：
提供一如上所述的基板的对接装置，从所述版库/基板产线设备上取出一基板放置在所述基板吸附机构上，所述基板吸附机构支撑并固定所述基板；
所述旋转机构驱动所述基板吸附机构旋转，使所述基板旋转至一角度位置；
对所述基板实现机械预对准；
将预对准后的所述基板取出放在所述基板产线设备或所述版库。
本发明提供了一种基板的对接装置，当需改变基板的角度位置以进入设备或版库时，则可通过所述对接装置对基板进行旋转以达到特定的角度位置，从而实现基板的取放过程。
并且，在本发明提供的基板的对接装置中，通过一基板吸附机构对基板进行固定，并且所述基板吸附机构由一旋转机构驱动而进行旋转，进而使吸附于所述基板吸附机构上的基板发生旋转。即，在本发明提供的基板的对接装置中，带动基板旋转的向心力是由基板表面和所述基板吸附机构之间的摩擦力提供，而不是对基板的边缘施加作用力，因此在基板边缘位置不会产生局部应力，进而可确保基板的完整性。
附图说明
图1是本发明一实施例中的基板的对接装置的结构示意图；
图2a为本发明一实施例中基板的对接装置的基板吸附机构的局部放大图；
图2b为本发明一实施例中基板的对接装置的基板吸附机构的剖面图；
图3为采用两个板叉分别对旋转前后的基板进行取放的结构示意图；
图4为本发明一实施例中基板的对接装置的基板夹持机构的局部放大图；
图5为本发明一实施例中基板的对接方法的流程示意图。
具体实施方式
如背景技术所述，为使基板能够优先旋转一定角度以在设备和版库之间进行传送，亟需提供一种对接装置以实现旋转对接的过程。
为此，本发明提供一种基板的对接装置，以实现所述基板在版库和基板产线设备之间的对接，其中，所述对接装置包括带动基板旋转的旋转机构和至少一个固定在所述旋转机构上的基板吸附机构，所述基板吸附机构用于支撑并固定基板，所述旋转机构带动所述基板吸附机构旋转。
在本发明提供的基板的对接装置中，通过一基板吸附机构对基板进行固定，并且所述基板吸附机构由旋转机构驱动而进行旋转，进而使吸附于所述基板吸附机构上的基板发生旋转。
以下结合附图和具体实施例对本发明提出的基板的对接装置作进一步详细说明。根据下面说明和权利要求书，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
图1为本发明一实施例中的基板的对接装置的结构示意图，如图1所 示，所述基板的对接装置，包括带动基板旋转的旋转机构110以及至少一个固定在所述旋转机构110上的基板吸附机构120，所述基板吸附机构120用于支撑并固定基板，所述旋转机构110驱动所述基板吸附机构120旋转。
当采用本发明提供的基板的对接装置对基板进行旋转时，所述基板吸附机构120与基板的下表面接触并吸附所述基板，以对基板进行固定。当所述旋转机构110驱动所述基板吸附机构120旋转时，则相应的即带动固定于基板吸附机构120上的基板。其中，带动基板旋转的向心力为基板表面和所述基板吸附机构120之间的摩擦力，而不是对基板的边缘施加作用力，因此在基板的边缘位置不会产生局部应力，进而可确保基板的完整性。
图2a为本发明一实施例中基板的对接装置的基板吸附机构的局部放大图，图2b为本发明一实施例中基板的对接装置的基板吸附机构的剖面图，结合图2a和2b所示，所述基板吸附机构120包括：一吸附套件121以及一吸附盘122。优选的，所述基板吸附机构120与一抽真空装置(图中未示出)连接，进而可采用抽真空的方式固定所述基板。具体的，于所述基板吸附机构120中具有一个真空通道125，当基板放置于基板吸附机构120上之后，抽真空装置通过所述真空通道125抽取位于基板与基板吸附机构120之间的空气，从而使基板吸附于所述基板吸附机构120上。
其中，通过所述吸附套件121可实现基板吸附机构的固定，即本实施例中，可采用螺旋紧固件124将所述吸附套件121固定于旋转机构110上，从而实现对整个基板吸附机构120的固定。
继续参考图2a和图2b所示，所述吸附盘122由所述吸附套件121的内部向外延伸形成一与基板接触的接触面122a，其中，所述真空通道125即可设置于所述吸附盘122内并与所述接触面122a连通。例如本实施中，所述吸附套件121固定于旋转机构上之后，其形成一中空结构并且于其上 方还具有一开口，所述吸附盘122的外围形状与所述吸附套件121的内壁形状相契合，同时所述吸附盘122沿着吸附套件121的内壁并通过吸附套件的开口向吸附套件的外侧延伸形成一接触面122a。具体的，所述接触面122a的形状可以为任意形状，例如圆形、椭圆形或矩形等。进一步的，所述吸附盘122可采用高分子树脂材料制成，从而使所述吸附盘122具有一定的承压性和弹性。由于在支撑及固定基板时，所述吸附盘122与基板接触，因此采用高分子树脂材料制成的吸附盘122具有一定的弹性，其一方面可更好的保护基板，避免对基板造成刮伤；另一方面，当基板进行旋转时，所述吸附盘与所述基板之间易产生摩擦力，以利于实现基板的旋转；除此之外，当基板发生翘曲现象时，由高分子树脂材料制成的接触面122a具有可塑性，因此其仍可以和基板的表面很好的贴合，进而保证基板吸附机构120对基板的吸附效果。
进一步的，所述基板吸附机构120还包括一支撑件123，所述支撑件123位于所述吸附套件121内，并位于所述接触面122a的下方以支撑所述接触面122a。在所述基板吸附机构120支撑基板时，所述基板的表面与所述吸附盘122的接触面122a贴合，此时，基板对所述吸附盘122具有一个向下的作用力，因此，为保证吸附盘122在受到基板的作用力时仍可以支撑基板，尤其的，当采用具有一定弹性的吸附盘时，在所述吸附盘122的接触面122a受到基板的挤压，更易发生变形，因此，当于所述接触面122a的下方设置一个用于支撑所述接触面122的支撑件123时，所述支撑件123可很好的支撑接触面122a，避免在被基板挤压之后，接触面122a发生变形而无法支撑基板的问题。进一步的，所述支撑件123可采用橡胶材料制成。一方面所述橡胶材料具有一定的弹性，使基板在与接触面122a贴合时具有一缓冲力，以减小对基板产生的瞬间冲击力；另一方面，所述橡胶材料具 有一定的弹性，能够起到支撑接触面的功能。
优选的，所述基板的对接装置还包括工位检测装置180，具体的，所述工位检测装置180包括传感器套件以及机械限位套件，所述传感器套件即用于检测旋转机构110的旋转角度，所述极限限位套件即可根据设定的极限位置限制旋转机构110的旋转角度。
继续参考图1所示，所述基板通过板叉130取放于基板的对接装置中。具体的，所述板叉130具有两个板指，当所述板叉130抓取基板时，所述板叉130的两个所述板指移动至基板的下方并托住基板，接着再以相反方向移动板叉以实现对基板的取放功能。此外，在实际应用过程中，可根据具体的基板以及基板旋转的角度而选取相应的板叉或选用多个板叉。例如，参考图3所示，当基板200为长方形，并且需对其旋转90°时，首先，需采用第一板叉130a沿所述旋转机构110的第一侧将基板200放置于基板的对接装置中，此时，第一板叉130a的两个板指沿基板200的短边方向托住基板200；然后，所述基板的对接装置使基板200旋转90°；接着，需采用第二板叉130b沿与所述第一侧垂直的第二侧抓取基板200，此时，所述第二板叉130b的扳指沿基板200的长边方向托住基板。其中，所述第二板叉130b与第一板叉130a中两个板指之间的距离，以及扳指的长度均需根据基板的长度和宽度设定。
优选的，所述基板的对接装置还包括板叉检测装置140，所述板叉检测装置140用于检测其对应区域内是否存在板叉。具体的，所述板叉检测装置140具有一传感器，通过所述传感器感应板叉的存在，其中，所述传感器可以是一光敏传感器，即，通过检测光信号以判断板叉的存在。本实施例中，所述板叉检测装置140位于所述板叉130的移动方向上，并且设置于板叉130的扳指的下方，从而当扳指130进入到基板的对接装置时，所 述板叉检测装置140可立即感应到扳指的存在。此外，在需采用多个板叉130实现基板于对接装置100中的取放功能时，为避免多个板叉在基板的对接装置中发生碰撞，则可通过所述板叉检测装置140感应在基板的对接装置中是否存在有板叉，并限制多个板叉同时进入到基板的对接装置中，实现多个板叉之间的互锁，避免相互干扰。
继续参考图1所示，所述基板的对接装置还包括基板检测装置150，所述基板检测装置150可采用与板叉检测装置140相同的检测装置，具体的，所述基板检测装置150具有一传感器，通过所述传感器感应对应区域内是否存在基板。进一步的，所述基板检测装置150设置于基板的下方。所述基板检测装置150一方面可用于检测基板的对接装置中是否放置有基板，避免多个基板重复放置于基板的对接装置，造成基板的破损；另一方面，还可设置多个基板检测装置150，并且设置于基板在旋转不同角度时所对应的位置上，从而还可用于判断基板于对接装装置100中的角度位置。
继续参考图1所示，所述基板的对接装置还包括若干辅助支撑机构160，所述辅助支撑机构160用于辅助支撑基板，并调整所述基板的水平位置。具体的，所述辅助支撑机构160布置于所述旋转机构110的外围区域。所述辅助支撑机构160为一柱状结构，所述柱状结构与所述基板接触的端面为圆弧形，进而可减少与基板的接触面积，缓解辅助支撑机构160与基板之间的摩擦。本实施例中，所述辅助支撑机构160还通过第一支架套件190与旋转机构110连接，即，旋转机构110在带动基板吸附机构120旋转时，其同时也带动所述辅助支撑机构160旋转，避免所述辅助支撑机构刮伤基板的表面。
优选的，所述基板的对接装置还包括多个用于夹持基板边缘的基板夹持机构170，所述基板夹持机构170可用于调整基板的位置并进一步固定基 板，如此，可确保基板在旋转前和旋转后的位置精度。图4为本发明一实施例中基板的对接装置的基板夹持机构的局部放大图，具体参考图4并结合图1所示，所述基板夹持机构170包括与所述基板边缘平行的夹持部和驱动所述夹持部沿垂直所述基板边缘方向移动的驱动装置172，所述夹持部上设有至少一个用于与所述基板边缘接触的滚轮171，其中，所述驱动装置172可以为气缸。当在对基板进行位置调整时，多个滚轮171分别布置于基板的外围区域，此时驱动装置172驱动所述滚轮171沿垂直于基板的边缘方向移动，进而推动基板移动至预定位置。在此过程中，所述基板的边缘与滚轮接触并移动，因此采用滚轮有助于基板的移动，减小对基板边缘的摩擦。并且，当位于基板外围的多个滚轮171压紧基板的边缘时，即同时实现了对基板的固定。如图1所示，本实施例中，所述基板的对接装置中具有4个基板夹持机构170，其中每个基板夹持机构170上设置有2个滚轮，若对长方形的基板进行夹持固定时，则4个基板夹持机构170分别夹持所述长方形基板的四个边缘，每个基板夹持机构170中的两个滚轮171分别压紧基板的每一条侧边。
此外，基板夹持机构170根据实际应用，选择是否由旋转机构110带动旋转。即，本发明提供的基板的对接装置中，所述基板夹持机构170可固定设置，也可与所述旋转机构110连接使其可以由旋转机构110带动旋转。本实施例中，所述基板夹持架构170通过第二支架套件191与所述第一支架套件190连接，从而可由所述旋转机构110带动并与基板吸附机构120同时旋转。
基于本发明提供的基板的对接装置，本发明另一目的在于，提供一种基板的对接方法，即，采用如上所述的基板的对接装置实现基板的对接。 图5为本发明一实施例中基板的对接方法的流程示意图，具体参考图5并结合图1所示，所述基板的对接方法包括：
S10，提供一如上所述的基板的对接装置，从版库/基板产线设备上取出一基板放置在所述基板吸附机构120上，所述基板吸附机构120支撑并固定所述基板；
S20，所述旋转机构110驱动所述基板吸附机构120旋转，使所述基板旋转至一角度位置；
S30，对所述基板实现机械预对准；
S40，将预对准后的所述基板取出放在所述基板产线设备/所述版库。
本发明提供的基板的对接方法中，首先采用基板吸附机构120吸附固定所述基板，进而在所述旋转机构110的驱动下，使基板吸附机构旋转，从而通过基板吸附机构110与基板表面之间的摩擦力形成一使基板旋转的向心力，进而实现基板的旋转。
上述描述仅是对本发明较佳实施例的描述，并非对本发明范围的任何限定，本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰，均属于权利要求书的保护范围。

Claims (14)

  1. 一种基板的对接装置，实现所述基板在版库和基板产线设备之间的对接，其特征在于，所述对接装置包括用于带动基板旋转的旋转机构和至少一个固定在所述旋转机构上的基板吸附机构，所述基板吸附机构用于支撑并固定基板，所述旋转机构带动所述基板吸附机构旋转。
  2. 如权利要求1所述的基板的对接装置，其特征在于，所述基板吸附机构包括一吸附套件以及一吸附盘，通过所述吸附套件实现基板吸附机构在旋转机构上的固定，所述吸附盘由所述吸附套件的内部向外延伸形成一用于与基板接触的接触面，所述吸附盘内设有与所述接触面连通的真空通道。
  3. 如权利要求2所述的基板的对接装置，其特征在于，所述基板吸附机构还包括一支撑件，所述支撑件位于所述吸附套件内，且位于所述接触面下方以支撑所述接触面。
  4. 如权利要求2或3所述的基板的对接装置，其特征在于，所述吸附盘的材质为高分子树脂材料。
  5. 如权利要求3所述的基板的对接装置，其特征在于，所述支撑件的材料为橡胶材料。
  6. 如权利要求1所述的基板的对接装置，其特征在于，所述基板的对接装置还包括一板叉检测装置，所述板叉检测装置具有一传感器，所述传感器用于判断其感应区域内是否存在板叉。
  7. 如权利要求1所述的基板的对接装置，其特征在于，所述基板的对接装置还包括一基板检测装置，所述基板检测装置具有一传感器，所述传感器用于判断其感应区域内是否存在基板。
  8. 如权利要求1所述的基板的对接装置，其特征在于，所述基板的对接装置还包括若干辅助支撑机构，所述若干辅助支撑机构分布在所述旋转机构周围，用于辅助支撑所述基板。
  9. 如权利要求8所述的基板的对接装置，其特征在于，所述辅助支撑机构为柱状结构，所述柱状结构与所述基板接触的端面为圆弧形。
  10. 如权利要求8所述的基板的对接装置，其特征在于，所述辅助支撑机构通过第一支架套件与所述旋转机构连接，所述旋转机构带动所述辅助支撑机构旋转。
  11. 如权利要求1所述的基板的对接装置，其特征在于，所述基板的对接装置还包括多个用于夹持所述基板边缘的基板夹持机构，所述基板夹持机构包括与所述基板边缘平行的夹持部和驱动所述夹持部沿垂直所述基板边缘方向移动的驱动装置。
  12. 如权利要求11所述的基板的对接装置，其特征在于，所述基板夹持机构通过第二支架套件与所述旋转机构连接，所述旋转机构带动所述基板夹持机构旋转。
  13. 如权利要求1所述的基板的对接装置，其特征在于，所述基板的对接装置还包括工位检测装置，所述工位检测装置包括传感器套件以及机械限位套件，所述传感器套件用于检测旋转机构的旋转角度，所述机械限位套件用于限定所述旋转机构可旋转的极限位置。
  14. 一种基板的对接方法，其特征在于，包括：
    提供一如权利要求1-13中任意一项所述的基板的对接装置，从所述版库或基板产线设备上取出一基板放置在所述基板吸附机构上，所述基板吸附机构支撑并固定所述基板；
    所述旋转机构驱动所述基板吸附机构旋转，使所述基板旋转至一角度 位置；
    对所述基板实现机械预对准；
    将预对准后的所述基板取出放在所述基板产线设备或所述版库。
PCT/CN2017/094271 2016-07-29 2017-07-25 基板的对接装置及对接方法 WO2018019225A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610612918.0A CN107665850B (zh) 2016-07-29 2016-07-29 基板的对接装置及对接方法
CN201610612918.0 2016-07-29

Publications (1)

Publication Number Publication Date
WO2018019225A1 true WO2018019225A1 (zh) 2018-02-01

Family

ID=61016351

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/094271 WO2018019225A1 (zh) 2016-07-29 2017-07-25 基板的对接装置及对接方法

Country Status (3)

Country Link
CN (1) CN107665850B (zh)
TW (1) TWI633621B (zh)
WO (1) WO2018019225A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1922725A (zh) * 2004-03-30 2007-02-28 东京毅力科创株式会社 半导体处理装置和方法
CN203103273U (zh) * 2013-03-06 2013-07-31 北京自动化技术研究院 一种硅片传送装置
WO2014082196A1 (en) * 2012-11-27 2014-06-05 Acm Research (Shanghai) Inc. Substrate supporting apparatus
CN104485302A (zh) * 2014-12-29 2015-04-01 颀中科技（苏州）有限公司 晶圆转移分并批设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM370748U (en) * 2009-06-25 2009-12-11 Quick Test Corp Rotary substrate testing mechanism
TWI529850B (zh) * 2009-08-04 2016-04-11 友達光電股份有限公司 基板吸附裝置防塵設計
KR20140025513A (ko) * 2011-06-02 2014-03-04 다즈모 가부시키가이샤 얼라인먼트 장치 및 얼라인먼트 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1922725A (zh) * 2004-03-30 2007-02-28 东京毅力科创株式会社 半导体处理装置和方法
WO2014082196A1 (en) * 2012-11-27 2014-06-05 Acm Research (Shanghai) Inc. Substrate supporting apparatus
CN203103273U (zh) * 2013-03-06 2013-07-31 北京自动化技术研究院 一种硅片传送装置
CN104485302A (zh) * 2014-12-29 2015-04-01 颀中科技（苏州）有限公司 晶圆转移分并批设备

Also Published As

Publication number Publication date
CN107665850A (zh) 2018-02-06
CN107665850B (zh) 2019-09-17
TW201804561A (zh) 2018-02-01
TWI633621B (zh) 2018-08-21

Similar Documents

Publication Publication Date Title
JP5324231B2 (ja) 半導体ウエハのアライメント装置
TWI627699B (zh) 晶圓對準裝置以及晶圓轉移裝置
JP5384220B2 (ja) アライメント装置およびアライメント方法
JP6179012B2 (ja) ウエハ位置決め装置
JP5372156B2 (ja) 液晶表示装置の製造装置及び液晶表示装置の製造方法
TWI402161B (zh) 貼合程序以及薄膜結構
WO2018119645A1 (zh) 曲面贴合装置及贴合方法
TWI678575B (zh) 保持裝置、定位裝置以及貼合裝置
JP2011258924A5 (zh)
JPWO2007088927A1 (ja) 基板交換装置及び基板処理装置並びに基板検査装置
CN105051882A (zh) 基板位置对准器
KR101594529B1 (ko) 박판 이송 장치 및 박판 청소 시스템
TWI517291B (zh) Sheet attachment and attachment method
JP2008227224A (ja) シート貼付装置及び貼付方法
WO2018019225A1 (zh) 基板的对接装置及对接方法
JP2010165706A (ja) ウェハのアライメント装置
KR20190121556A (ko) 디스플레이 패널 상에 필름을 부착하기 위한 장치
TW200810892A (en) Substrate transfer robot
JP6617416B2 (ja) メタルマスクシートハンドリング治具およびメタルマスクシートの搬送装置
TWI427426B (zh) Drawing device
TWM561323U (zh) 薄片吸附裝置
JP6612670B2 (ja) 基板処理装置、及び、基板処理方法
TWI479588B (zh) 校準裝置
TW201838085A (zh) 夾持機構及具有該夾持機構的承載裝置
TW201306165A (zh) 校準裝置及校準方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17833528

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17833528

Country of ref document: EP

Kind code of ref document: A1