200810892 ^ ，. : ⑴ 九、發明說明 【發明所屬之技術領域】 本發明是關於移載玻璃基板等的基板的基板移載機器 人。 4 ^ 【先前技術】 一般在製造薄型顯示板所使用的薄板狀玻璃基板所代 φ 表的基板的收納於複數枚基板收納盒。又，在該處理時一 枚一枚地從基板收納盒取出被搬運到基板處理裝置，經處 理後，從基板處理裝置被搬進到基板收納盒。此種設備的 情形，爲了將玻璃基板搬出入到基板收納盒或基板處理裝 置使用著基板移載機器人。 例如作爲此種基板移載機器人，在專利文獻1揭示著 在機器手上浮游玻璃基板，俾將玻璃基板的定位進行在機 器手上者。又，在專利文獻2或3，揭示著機器人上支撐 • 玻璃基板時，將玻璃基板設置於機器人上的銷或是樹脂製 突起上者。又，在專利文獻4揭示著在機器人上進行玻璃 基板的定位’又，於機器人設置驅動滾子，而藉由驅動滾 * 子的旋轉來進行玻璃基板的交接。 專利文獻1:日本特開2001-253536號公報 專利文獻2:日本特開平7_10314號公報 專利文獻3 :日本特開2000-6073號公報 專利文獻4:日本特開2005-317854號公報 (2) (2)200810892 【發明內容】 如記載於專利文獻1或4的基板移載機器人地，在機 器人上進行玻璃基板的定位，爲在定位狀態下可搬運玻璃 基板之處有益。但是，玻璃基板的定位之際，玻璃基板滑 動機人上而在玻璃基板產生傷痕之虞。在專利文獻1的基 板移載機器人，爲了在機器人上浮游玻璃基板來進行其定 位，而防止在玻璃基板上產生傷痕。但是，大型玻璃基板 的情形，因在玻璃基板產生彎曲，因此很難將玻璃基板均 勻地浮游。又，爲了防止在玻璃基板有傷痕，如專利文獻 2或3所述地，藉由銷或突起作成點支撐玻璃基板，在減 低機器人與玻璃基板的接觸面積之處者效果。但是，即使 此種構成，在玻璃基板的定位之際，在玻璃基板也有傷痕 的情形，尤其是在大型的玻璃基板的情形，玻璃基板的定 位時的變位量也變大，而在玻璃基板容易有傷痕。在專利 文獻4所述者，驅動滾子是爲了交接玻璃基板而有功能者 ，並不是在定位玻璃基板之際能減低驅動滾子與玻璃基板 之摩擦者。所以定位玻璃基板之際，會在驅動滾子與玻璃 基板之間產生摩擦而在玻璃基板有傷痕的情形。 如此，在本發明，提供在定位基板之際，可減低產生 於基板的傷痕的基板移載機器人。 本發明的基板移載機器人，屬於具備：載置有基板的 柄單元，及進行被載置於上述柄單元上的上述基板的定位 的定位手段的基板移載機器人，其特徵爲：上述柄單元是 具備：柄本體部，及從上述柄本體部朝上方突出，載置有 -5- (3) 200810892 上述基板的複數載置構件；各該上述載置構件是具有：在 其上端，旋轉自如地支撐而自由旋轉的旋轉體。 依照該構成，藉由具有旋轉自如地支撐上述載置構件 的上端而進行上述旋轉體，定位之際從動於上述基板的移 動而令上述旋轉體進行上述旋轉體之故，因而減低上述基 ^ 板與上述載置構件之間的摩擦。因此，定位基板之際，可 減低在基板產生傷痕的情形。 φ 在本發明中，上述旋轉體是可採用朝利用上述定位手 段的上述基板的定位方向進行自由旋轉。依照該構成，可 減低藉由利用上述定位手段的定位動作朝上述定位方向移 動的上述基板與上述載置構件之間的摩擦。 在本發明中，上述旋轉體爲球體也可以。依照該構成 ，上述旋轉體朝任意方向可旋轉之故，因而定位上述基板 之際，不管上述基板的移動方向能減低上述基板與上述載 置構件之間的摩擦。 # 又，在本發明中，上述旋轉體是旋轉在與利用上述定 位手段的上述基板的定位方向正交的旋轉軸周圍的構成也 可以。依照該構成，上述基板朝其定位方向移動之際，可 ^ 減低上述基板與上述載置構件之間的摩擦。該情形，作爲 上述旋轉體可採用滾子。滾子是較低成本之故，因而可得 到減低成本。又，該情形，上述滾子是可採用在其旋轉軸 方向的中央部相對地呈大直徑，而在其旋轉軸方向的兩端 部相對地呈小直徑的構成。依照該構成，減小上述滾子與 上述基板的接觸面積，而可更減低摩擦。 - t s -6 - (4) (4)200810892 如上所述地，依照本發明，可提供在定位基板之際 可減低產生於基板的傷痕的基板移載機器人。 【實施方式】 〈第1實施形態〉 第1圖是表示使用本發明的第1實施形態的基板移載 機器人1 〇 〇的基板處理系統的槪略圖。在該基板處理系統 中，基板移載機器人100是將被收納於基板收納裝置200 的基板以搬運到基板處理裝置3 00，又，在基板處理裝置 3 0 0被處理的基板W被運到基板收納裝置2 0 0。基板W是 例如玻璃基板，惟在其他種類上，本發明的基板移載機器 人是可適用。 基板移載機器人100是具備：行走單元1，及昇降單 元10，及迴旋單元20，及移載單元30。行走單元1是舖 設有配設有基板處理系統的地板上，沿著朝Y方向延設的 軌道R而朝Y方向往復移動基板移載機器人100的單元。 昇降單元10是設於行走單元1上，而朝Z方向昇降的迴 旋單元20及移載單元30的單元，例如由氣缸等所構成。 迴旋單元20是在X-Y平面進行旋轉移載單元30的單 元，例如由電動機與減速機構等所構成。移載單元3〇是 具備：被支撐於迴旋單元20的底座單元40，及移動底座 單元40上的滑動單元50，及移動滑動單元50上的柄單元 60 ° 底座單元40，是於其Y方向的兩側部具備定位單元 (5) 200810892 41。各該定位單元41是具備：分別抵接於被載置於柄單 元60上的基板W的Y方向互相地面對面的端緣的抵接構 件41a，及朝Y方向往復移動抵接構件41a的推進機41b 。推進機41b是例如氣缸。定位單元41是將抵接構件41a 抵接於被載置於柄單元60上的基板W的端緣，就可在柄 ~ 單元60上進行基板W的Y方向定位。 滑動單元50是於其X方向一端部具備一對定位單元 φ 51。定位單元51是與定位塊體52來進行被載置於柄單元 60上的基板W的X方向的定位。詳細是如後述。 柄單元60是具備：載置有基板W的複數柄本體部6 1 ，及懸臂支撐柄本體部6 1的支撐部62。柄單元60是對於 滑動單元50成爲朝Y方向可往復移動。又，滑動單元50 是對於底座單元40成爲朝Y方向可移動。將有關於此些 往復移動的構成參照第2圖加以說明。第2圖是表示沿著 第1圖的線A-A的斷面圖。 • 在支撐部62的下面，設於滑動單元5 0的上面，固定 有通過朝Y方向延伸的開縫50a而朝滑動單元50內延伸 的一對支撐構件62a。在一對支撐構件62a，有滑動構件 62b分別固定在滑動單元50內部。在滑動單元50的內部 側面固定有朝Y方向延伸的軌道構件5 Ob，滑動構件62b 是成爲可滑動軌道構件50b。 在一對支撐構件62 a的其中一方，固定有螺合於藉由 電動機53被旋轉驅動的朝Y方向延伸的球形螺桿54的球 形螺帽62c。藉由電動機53的旋轉驅動，柄單元60是被 < .S 3 -8 - (6) 200810892 引導至軌道50b而對於滑動單元50朝Y方向往復移動。 在滑動單元50的下面，設於底座單元40的上面，固 定有通過朝Υ方向延伸的開縫40a而朝底座單元40內延 伸的一對支撐構件50c，在一對支撐構件50c，有滑動構 件5 0d分別固定在底座單元40內部。在底座單元40的內 ~ 部側面固定有朝Y方向延伸的軌道構件40b，滑動構件 5 〇d是成爲可滑動軌道構件40b。 # 在一對支撐構件50c的其中一方，固定有螺合於藉由 電動機43被旋轉驅動的朝Y方向延伸的球形螺桿44的球 形螺帽50e。藉由電動機43的旋轉驅動，滑動單元50是 被引導至軌道40b而對於底座單元40朝Y方向往復移動 〇 又，在本實施形態中，例示如此地滑動柄單元60而 施以形式的基板移載機器人1 00，惟本發明是也可適用於 多關節形式的基板移載機器人。 ® 以下，針對於柄單元60的構成加以說明。第3 ( a ) 圖是表示柄單元60的俯視圖，第3 ( b )圖是表示沿著第 3 ( a )圖的線B -B的線面圖，第4圖是表示沿著第3 ( b )圖的線C - C的斷面圖。 柄本體部61是從上板61a、下板61b、一*對側板61e 及端板61d被中空棒狀地所構成，朝與柄單元60的移動 方向平行的方向延伸。在柄本體部6 1內部配設有複數載 置構件63與複數吸附墊70。 如第4圖所示地，載置構件63是在其上端具備藉由 ~ 9 - 200810892 • (7) 支撐部63b被旋轉自如地支撐而施以自由旋轉的旋轉體的 球體6 3 a。球體6 3 a的一部分是經被形成於上板6 1 a的開 口而從柄本體部61上面朝上方突出。支撐部63b是呈球 殻狀，於其內部形成有複數小球63b’被封入的滾球軸承狀 ‘ 的支撐構造。複數小球62b’是設成包圍著球體63a的下半 _ 部，而球體63a是被支撐於支撐部63b而構成可朝任意方 向旋轉。 φ 載置構件63是其下端被螺裝於柄本體部61的下板 61b而被固定在柄本體部61，又，在其下部形成有配管71 的通過空間6 3 d。 吸附墊70是於其上面具有開口部70 a而形成中空狀 ，又，其上面從形成於上板6 1 a的開口露出於柄本體部6 1 上面所設置。吸附墊7〇是由具有橡膠等可撓性的材料所 構成，在吸附墊7 〇被連接於設在柄本體部6 1內部的配管 71。配管71是被連接於壓縮機等的未圖示的空氣吸引裝 φ 置，而利用空氣吸引裝置的動作，吸附墊70是從開口部 7 0 a來吸引外氣。藉由此，吸附墊7 0是功能作爲將被載置 * 於柄本體部6 1上的基板W吸附在柄本體部6 1的吸附手 - 段。 如第3 ( a )圖所示地，柄單元60是具備位於Y方向 的同一直線狀的一對感測器64a、64b。本實施形態的情形 ，各感測器64是被安裝於柄本體部6 1的側面。一對感測 器64是檢測出被載置於柄本體部6 1上的基板W的感測 器，例如光感測器。 -10- 200810892 " (8) 以下，針對於利用該構成所成的基板移載機器人！ 〇〇 的基板W的移載動作加以說明。第5 ( a )圖至第5 ( e } 圖，第6(a)圖及第6(b)圖以及第7(a)圖至第7(d )圖是基板移載機器人100的動作說明圖。同圖是例汗:％ k 基板收納裝置200取出基板W時的動作。基板移載機器 ·' 人1 00是被未圖示的控制裝置所控制而實行以下的動作。 首先，藉由行走單元1的動作，基板移載機器人1 0 0 Φ 是朝基板收納裝置200的正面移動。之後藉由昇降單元1〇 的動作進行昇降移載單元3 0，對準欲取出的基板W與柄 單元60的Z方向位置。之後，如第5(a)圖所示地朝 方向前進滑動單元50。又，如第5(b)圖所示地，將柄 單元60以一定速度朝+X方向前進，令柄本體部61位於 欲取出的基板W下面。 在此，基板W是並不被限定於在基板收納裝置200內 必須朝一定方向，而有朝斜方向被收納的情形。基板W φ 朝斜方向被收納時，若直接取出基板W，則有基板W與 基板收納裝置200的框架互相接觸的情形。 ^ 所以，進行將柄本體部61的長度方向，亦即將柄單 - 元6〇及滑動單元50的移動方向對準於基板W的方向的 控制。參照第6 ( a )圖及第6(13)圖來說明該控制動作 。第6 ( a )圖是表示柄本體部6 i前進到朝斜方向被收納 的基板W下面的途中的圖式。 基板W朝斜方向的情形，則在藉由一對感測器64a、 64b檢測到基板W的端緣的時機上會產生相差。第6 ( a ) -11 200810892 ^ Ο) 圖時在感測器64a檢測到基板w ’惟在感測器64b尙未檢 測到基板W。200810892 ^ ,. : (1) EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to a substrate transfer robot for transferring a substrate such as a glass substrate. 4 ^ [Prior Art] Generally, a thin plate-shaped glass substrate used for manufacturing a thin display panel is housed in a plurality of substrate storage cases. Further, at the time of the processing, the substrate storage cassette is taken out from the substrate storage cassette and transported to the substrate processing apparatus, and after being processed, the substrate processing apparatus is carried into the substrate storage cassette. In the case of such a device, a substrate transfer robot is used to carry the glass substrate into and out of the substrate storage case or the substrate processing apparatus. For example, as such a substrate transfer robot, Patent Document 1 discloses that a glass substrate is floated on a machine hand, and the positioning of the glass substrate is performed on the machine hand. Further, in Patent Document 2 or 3, when the glass substrate is supported on the robot, the glass substrate is placed on a pin on the robot or a resin protrusion. Further, Patent Document 4 discloses that the glass substrate is positioned on the robot. Further, the robot is provided with a driving roller, and the glass substrate is transferred by driving the rotation of the roller. [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. Hei. No. Hei. No. Hei. No. Hei. 2) 200810892 SUMMARY OF THE INVENTION As described in the substrate transfer robot of Patent Document 1 or 4, positioning of the glass substrate on the robot is advantageous in that the glass substrate can be transported in the positioned state. However, when the glass substrate is positioned, the glass substrate is slippery on the glass substrate and scratches are generated on the glass substrate. In the substrate transfer robot of Patent Document 1, in order to position the glass substrate on the robot, the glass substrate is prevented from being scratched on the glass substrate. However, in the case of a large glass substrate, since the glass substrate is bent, it is difficult to uniformly float the glass substrate. Further, in order to prevent scratches on the glass substrate, as described in Patent Document 2 or 3, the glass substrate is supported by a pin or a projection, and the effect of reducing the contact area between the robot and the glass substrate is obtained. However, even in such a configuration, when the glass substrate is positioned, there is a flaw in the glass substrate, and particularly in the case of a large-sized glass substrate, the amount of displacement of the glass substrate during positioning is also increased, and the glass substrate is enlarged. It is easy to have scratches. In the patent document 4, the roller is driven to transfer the glass substrate, and the friction between the driving roller and the glass substrate can be reduced when the glass substrate is positioned. Therefore, when the glass substrate is positioned, friction occurs between the driving roller and the glass substrate, and the glass substrate is scratched. As described above, according to the present invention, there is provided a substrate transfer robot capable of reducing a flaw generated on a substrate when positioning a substrate. A substrate transfer robot according to the present invention is a substrate transfer robot including a handle unit on which a substrate is placed, and a positioning means for positioning the substrate placed on the handle unit, wherein the handle unit is The shank main body portion and the plurality of mounting members that protrude from the shank main body portion and are placed on the substrate of -5-(3) 200810892; each of the mounting members has a rotation at the upper end thereof A rotating body that is supported by the ground and freely rotated. According to this configuration, the rotating body is rotatably supported by the upper end of the mounting member, and the rotating body is caused to move by the movement of the substrate during positioning, thereby reducing the base. Friction between the plate and the above-described mounting member. Therefore, when the substrate is positioned, the occurrence of scratches on the substrate can be reduced. φ In the present invention, the rotating body is freely rotatable in a positioning direction of the substrate by the positioning means. According to this configuration, the friction between the substrate and the placing member that is moved in the positioning direction by the positioning operation by the positioning means can be reduced. In the present invention, the rotating body may be a sphere. According to this configuration, since the rotating body is rotatable in an arbitrary direction, the friction between the substrate and the mounting member can be reduced regardless of the moving direction of the substrate when the substrate is positioned. In the present invention, the rotating body may be configured to rotate around a rotation axis orthogonal to a positioning direction of the substrate by the positioning means. According to this configuration, when the substrate moves in the positioning direction, the friction between the substrate and the mounting member can be reduced. In this case, a roller can be employed as the rotating body. Rollers are less costly and can therefore achieve lower costs. Further, in this case, the roller may have a large diameter at a central portion in the direction of the rotation axis and a relatively small diameter at both end portions in the direction of the rotation axis. According to this configuration, the contact area between the roller and the substrate is reduced, and the friction can be further reduced. - t s -6 - (4) (4) 200810892 As described above, according to the present invention, it is possible to provide a substrate transfer robot which can reduce scratches generated on a substrate when positioning a substrate. [Embodiment] FIG. 1 is a schematic view showing a substrate processing system using a substrate transfer robot 1 according to a first embodiment of the present invention. In the substrate processing system, the substrate transfer robot 100 transports the substrate stored in the substrate storage device 200 to the substrate processing apparatus 300, and the substrate W processed by the substrate processing apparatus 300 is transported to the substrate. Storage device 2000. The substrate W is, for example, a glass substrate, but the substrate transfer robot of the present invention is applicable to other types. The substrate transfer robot 100 includes a traveling unit 1, a lifting unit 10, a turning unit 20, and a transfer unit 30. The traveling unit 1 is a unit on which a substrate transfer robot 100 is reciprocated in the Y direction along a floor on which a substrate processing system is disposed and which is extended in the Y direction. The elevating unit 10 is a unit provided on the traveling unit 1, and the revolving unit 20 and the transfer unit 30 that are moved up and down in the Z direction are constituted by, for example, an air cylinder. The gyro unit 20 is a unit that performs the rotation transfer unit 30 on the X-Y plane, and is constituted by, for example, a motor and a speed reduction mechanism. The transfer unit 3A includes: a base unit 40 supported by the swing unit 20, and a slide unit 50 on the moving base unit 40, and a handle unit 60° on the slide unit 50. The base unit 40 is in the Y direction. Positioning unit (5) 200810892 41 is provided on both sides. Each of the positioning units 41 is provided with an abutting member 41a that abuts against an end edge of the substrate W placed on the handle unit 60 in the Y direction, and a reciprocating movement of the abutting member 41a in the Y direction. Machine 41b. The pusher 41b is, for example, a cylinder. In the positioning unit 41, the abutting member 41a is brought into contact with the end edge of the substrate W placed on the handle unit 60, and the substrate W can be positioned in the Y direction on the handle unit 60. The slide unit 50 has a pair of positioning units φ 51 at one end portion in the X direction. The positioning unit 51 is positioned in the X direction of the substrate W placed on the handle unit 60 with the positioning block 52. The details are as described later. The handle unit 60 is provided with a plurality of handle body portions 6 1 on which the substrate W is placed, and a support portion 62 that supports the handle body portion 61 of the cantilever. The handle unit 60 is reciprocally movable in the Y direction with respect to the slide unit 50. Further, the slide unit 50 is movable in the Y direction with respect to the base unit 40. The configuration relating to such reciprocating movement will be described with reference to Fig. 2 . Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1. • On the lower surface of the support portion 62, on the upper surface of the slide unit 50, a pair of support members 62a extending inward in the slide unit 50 by slits 50a extending in the Y direction are fixed. In the pair of support members 62a, the slide members 62b are respectively fixed inside the slide unit 50. A rail member 5 Ob extending in the Y direction is fixed to the inner side surface of the slide unit 50, and the slide member 62b is a slidable rail member 50b. A ball nut 62c that is screwed to a ball screw 54 that is rotationally driven by the motor 53 and that extends in the Y direction is fixed to one of the pair of support members 62a. By the rotational driving of the motor 53, the handle unit 60 is guided to the rail 50b by <.S 3 -8 - (6) 200810892 and reciprocates in the Y direction with respect to the sliding unit 50. On the lower surface of the sliding unit 50, on the upper surface of the base unit 40, a pair of supporting members 50c extending toward the inside of the base unit 40 by a slit 40a extending in the weir direction are fixed, and a sliding member is provided in the pair of supporting members 50c. The 50d is fixed inside the base unit 40, respectively. A rail member 40b extending in the Y direction is fixed to the inner side portion of the base unit 40, and the sliding member 5?d is a slidable rail member 40b. # A spherical nut 50e screwed to the ball screw 44 extending in the Y direction by the motor 43 is fixed to one of the pair of support members 50c. By the rotation of the motor 43, the slide unit 50 is guided to the rail 40b and reciprocated in the Y direction with respect to the base unit 40. In the present embodiment, the substrate shift in the form of the handle unit 60 is exemplified as described above. The robot 100 is loaded, but the present invention is also applicable to a substrate transfer robot in a multi-joint form. ® Hereinafter, the configuration of the handle unit 60 will be described. Fig. 3(a) is a plan view showing the handle unit 60, Fig. 3(b) is a line view showing a line B-B along the 3rd (a)th, and Fig. 4 is a view along the 3rd (Fig. 4) b) A cross-sectional view of the line C-C of the figure. The shank main body portion 61 is formed of a hollow rod shape from the upper plate 61a, the lower plate 61b, the pair of side plates 61e, and the end plate 61d, and extends in a direction parallel to the moving direction of the shank unit 60. A plurality of mounting members 63 and a plurality of adsorption pads 70 are disposed inside the handle body portion 61. As shown in Fig. 4, the mounting member 63 is provided with a spherical body 630 having a rotating body that is rotatably supported by the support portion 63b at its upper end. A part of the spherical body 630a protrudes upward from the upper surface of the shank main body portion 61 via an opening formed in the upper plate 61a. The support portion 63b has a spherical shell shape, and a support structure of a ball bearing shape in which a plurality of small balls 63b' are sealed is formed in the inside. The plurality of small balls 62b' are arranged to surround the lower half of the spherical body 63a, and the spherical body 63a is supported by the support portion 63b so as to be rotatable in any direction. The φ mounting member 63 is a passage space 633 that is fixed to the shank main body portion 61 by screwing the lower end thereof to the lower plate 61b of the shank main body portion 61, and a pipe 71 is formed at a lower portion thereof. The adsorption pad 70 has a hollow portion formed on the upper surface thereof with an opening portion 70a, and its upper surface is provided on the upper surface of the handle body portion 6 1 from an opening formed in the upper plate 61a. The adsorption pad 7A is made of a material having flexibility such as rubber, and is connected to a pipe 71 provided inside the handle body portion 61 in the adsorption pad 7''. The pipe 71 is connected to an air suction device φ (not shown) such as a compressor, and the suction pad 70 sucks the outside air from the opening portion 70 a by the operation of the air suction device. Thereby, the adsorption pad 70 functions as an adsorption hand-segment in which the substrate W to be placed on the handle body portion 61 is adsorbed to the handle body portion 61. As shown in Fig. 3(a), the handle unit 60 is provided with a pair of sensors 64a and 64b having the same linear shape in the Y direction. In the case of this embodiment, each of the sensors 64 is attached to the side surface of the shank main body portion 61. A pair of sensors 64 are sensors that detect the substrate W placed on the handle body portion 61, such as a photo sensor. -10- 200810892 " (8) The following is a transfer robot for the substrate using this configuration! The transfer operation of the substrate W will be described. 5(a) to 5(e), 6(a) and 6(b), and 7(a) to 7(d) are descriptions of the operation of the substrate transfer robot 100 In the same figure, the following is an example of the operation when the substrate storage device 200 takes out the substrate W. The substrate transfer device is controlled by a control device (not shown) to perform the following operations. The movement of the traveling unit 1 causes the substrate transfer robot 100 Φ to move toward the front surface of the substrate storage device 200. Thereafter, the elevation transfer unit 30 is moved by the operation of the elevation unit 1〇, and the substrate W and the handle to be taken out are aligned. The position of the unit 60 in the Z direction. Thereafter, the slide unit 50 is advanced in the direction as shown in Fig. 5(a). Further, as shown in Fig. 5(b), the handle unit 60 is oriented at a constant speed toward the +X direction. In the meantime, the handle main body portion 61 is located below the substrate W to be taken out. Here, the substrate W is not limited to being placed in the substrate storage device 200 in a certain direction, and is accommodated in an oblique direction. The substrate W φ When the substrate W is directly taken out in the oblique direction, the substrate W and the frame of the substrate storage device 200 are in contact with each other. ^ Therefore, the longitudinal direction of the shank main body portion 61, that is, the control of the shank-unit 6 〇 and the moving direction of the sliding unit 50 in the direction of the substrate W is performed. Referring to Figures 6 (a) and 6 ( 13) The figure shows the control operation. Fig. 6(a) is a view showing the middle of the handle main body portion 6i advancing to the lower surface of the substrate W accommodated in the oblique direction. When the substrate W is inclined, it is borrowed. A phase difference occurs when the edge of the substrate W is detected by the pair of sensors 64a, 64b. 6 (a) -11 200810892 ^ Ο) When the sensor 64a detects the substrate w', only sensing The substrate W is not detected by the device 64b.
計測從第6 ( a )圖的狀態，一直到雙方的感測器64& 、6 4b檢測到基板W爲止，朝+X方向以一定速度前進柄 A 單元，同時藉由感測器64a及64b的其中一方，從基板W - 的端緣被檢測一直到藉由另一方檢測到基板W的端緣爲 止的時間差。之後，依據所計測的時間差，來演算柄本體 φ 部61的長度方向與基板W的方向之角度（9。 角度0是將柄單元60的移動速度作爲V，將感測器 64a、64b之間的距離作爲L，將感測器64a、64b檢測到 基板W的端緣的時間差作爲T ’則由Measure the state from the sixth (a) diagram until the sensors 64 & 64 4b of both sides detect the substrate W, and advance the shank A unit at a constant speed in the +X direction while passing the sensors 64a and 64b One of the ones is detected from the end edge of the substrate W- until the end of the substrate W is detected by the other side. Thereafter, the angle between the longitudinal direction of the handle body φ portion 61 and the direction of the substrate W is calculated based on the measured time difference (9. The angle 0 is the moving speed of the handle unit 60 as V, and between the sensors 64a, 64b The distance is L, and the time difference between the end edges of the substrate W detected by the sensors 64a, 64b is taken as T '
tan Θ =V · T/L 之式可加以演算。 如此，藉由迴旋單元20迴旋移載單元3 0僅經演算的 角度0分量，俾進彳了基板W與柄本體部61的方向對位。 藉由此種動作，可將柄本體部6 1的長度方向對位於 基板W的方向。第6 ( b )圖是表示該控制動作後的基板 W與柄單元60之位置關係的圖式。 之後，如第5 ( c )圖所示地，藉由昇降單元20的動 作稍上昇移載單元3 0，而將基板W載置於柄本體部6 1上 。基板W是成爲點支撐在載置構件63的球體63a上。又 ，從吸附墊70來吸引空氣，而以柄本體部6 1來保持基板 -12- < S j 200810892 (10) W。 之後，如第5 ( d )圖及第5 ( e )圖所示地，朝-X方 向後退柄單元60，又’朝-X方向後退滑動單元50。藉由 此’終了來自基板收納裝置200的基板W的取出。又， 參照第6(b)圖所述地，迴旋移載單元30時，取出基板 W之後，朝原來方向恢復移載單元30的方向。 然後，進行在柄單元60上所取出的基板W的定位。 如第7 ( a )圖所示地，在從基板收納裝置200取出基板w 之狀態下，基板W是朝X、Y方向偏離規定位置而有被載 置於柄單元60上的情形。如此，解除吸附墊70所致的空 氣吸引，而一旦解除基板W的保持，如第7 ( b )圖所示 地，將定位單元41予以動作而進行基板W的Y方向定位 〇 之後，將定位單元51予以動作來進行基板W的X方 向的定位。定位單元51是由：被配設於滑動單元50內的 伸縮主動器5 1 a，及被支撐於伸縮主動器5 1 a的桿的旋轉 主動器5 1 b，及藉由旋轉主動器5 1 b被轉動的抵接構件 5 1 c所構成。 伸縮主動器5 1 a與旋轉主動器5 1 b是例如由複合型氣 缸所構成。抵接構件5 1 c是在一般時，在第7 ( c )圖中， 如以虛線所示地，從滑動單元5 0不會朝上下溢出的位置 ，在定位時，藉由旋轉主動器51b的動作，在第7(c)圖 中、如以實線所示地轉動9 〇度，使得其一部分從柄本體 部61上面朝上方突出。 -13- 200810892 (11) 於是，首先如第7 ( b )圖所示地，定位單元5 1是令 伸縮主動器5 1 a伸長。之後，如第7 ( c )圖所示地，藉由 旋轉主動器5 1 b的動作，令抵接構件5 1 c從虛線位置轉動 到實線位置。之後如第7 ( d )圖所示地，令伸縮主動器 5 1 a收縮。藉由此，令抵接構件5 1 c抵接於柄本體部6 1上 ' 的基板W的端緣而來押壓該端緣，朝-X方向移動基板w 。基板w是移動至抵接於定位塊體52之位置，而完成其 φ X方向的定位。 此些定位之際，基板W是對於柄本體部6 1成爲相對 性地變位，而在載置構件63與基板W之間容易產生摩擦 。但是，在本實施形態中，基板W是藉由旋轉自如的球 體63 a施以點支撐之故，因而從動於基板W的相對性移動 而旋轉球體63a，會減低基板W與載置構件63之間的摩 擦。The formula tan Θ =V · T/L can be calculated. Thus, by the swirling unit 20, the transfer unit 30 is rotated by the calculated angle 0 component, and the orientation of the substrate W and the handle body portion 61 is reversed. By such an operation, the longitudinal direction of the shank main body portion 61 can be aligned in the direction of the substrate W. Fig. 6(b) is a view showing the positional relationship between the substrate W and the handle unit 60 after the control operation. Thereafter, as shown in Fig. 5(c), the transfer unit 30 is slightly raised by the movement of the elevating unit 20, and the substrate W is placed on the handle body portion 61. The substrate W is supported on the spherical body 63a of the mounting member 63 at a point. Further, air is sucked from the adsorption pad 70, and the substrate -12- < S j 200810892 (10) W is held by the shank main body portion 61. Thereafter, as shown in Figs. 5(d) and 5(e), the handle unit 60 is retracted toward the -X direction, and the slide unit 50 is retracted toward the -X direction. By this, the removal of the substrate W from the substrate housing apparatus 200 is completed. Further, referring to Fig. 6(b), when the transfer unit 30 is rotated, the substrate W is taken out, and the direction of the transfer unit 30 is restored in the original direction. Then, the positioning of the substrate W taken out on the handle unit 60 is performed. As shown in Fig. 7(a), in a state where the substrate w is taken out from the substrate housing apparatus 200, the substrate W is displaced from the predetermined position in the X and Y directions, and is placed on the handle unit 60. In this way, the air suction by the suction pad 70 is released, and once the holding of the substrate W is released, as shown in Fig. 7(b), the positioning unit 41 is operated to position the substrate W in the Y direction, and then the positioning is performed. The unit 51 operates to position the substrate W in the X direction. The positioning unit 51 is composed of: a telescopic actuator 5 1 a disposed in the sliding unit 50, and a rotation actuator 5 1 b supported by the rod of the expansion and contraction actuator 5 1 a, and a rotary actuator 5 1 b is constituted by the abutting member 5 1 c that is rotated. The telescopic actuator 5 1 a and the rotary actuator 5 1 b are constituted, for example, by a composite cylinder. The abutting member 5 1 c is in a general position, in the seventh (c) diagram, as shown by a broken line, the position from the sliding unit 50 does not overflow upward and downward, in the positioning, by the rotation of the active device 51b The action is rotated by 9 degrees as shown by the solid line in Fig. 7(c) such that a part thereof protrudes upward from the upper surface of the shank main body portion 61. -13- 200810892 (11) Thus, first, as shown in Fig. 7(b), the positioning unit 51 is configured to elongate the telescopic actuator 51a. Thereafter, as shown in Fig. 7(c), the abutment member 5 1 c is rotated from the broken line position to the solid line position by the action of the rotary actuator 5 1 b. Thereafter, as shown in Fig. 7 (d), the telescopic actuator 5 1 a is contracted. Thereby, the abutting member 5 1 c is pressed against the end edge of the substrate W on the handle body portion 6 1 to press the end edge, and the substrate w is moved in the -X direction. The substrate w is moved to abut against the positioning block 52 to complete its positioning in the φ X direction. At the time of such positioning, the substrate W is relatively displaced with respect to the shank main body portion 61, and friction is likely to occur between the mounting member 63 and the substrate W. However, in the present embodiment, since the substrate W is supported by the spheroidal ball 63a, the spherical body 63a is rotated by the relative movement of the substrate W, and the substrate W and the placing member 63 are reduced. The friction between.
因此，在定位基板W之際，可減低在基板上產生傷痕 φ 的情形。球體63a是可朝包含定位單元41的定位方向（Y 方向）及定位單元51的定位方向（X方向）的任意方向 ' 旋轉，而在定位基板W之際，不管基板W的變位方向’ • 可減低基板W與載置構件63之間的摩擦。 之後，再開始吸附墊7 0所致的空氣吸引，俾將基板 W保持在柄本體部6 1。又，解除定位單元41及5 1所致 的定位動作。藉由吸附墊7 〇，基板W是在被定位之狀態 下被保持，吸附墊70是功能作爲將被定位在柄單元60上 的基板W保持在被定位之狀態的保持手段。然後’將行 -14 - 200810892 、 (12) 走單元1予以動作而成爲將基板W搬運到基板處理裝置 3 00。基板移載機器人100的移動中，基板W是藉由吸附 墊70所保持之故，因而不會損及基板W的定位狀態。 ^ 〈第2實施形態〉 • 在上述第1實施形態中，作成將載置構件63配設於 柄本體部6 1內部的構成，惟也可作成配設於外部的構成 φ 。又，在上述第1實施形態中，將載置構件63上端的旋 轉體作爲球體63a，也可採用球體63a以外的旋轉體。 第8 ( a )圖是表示本發明的第2實施形態的柄單元 160的俯視圖，第8(b)圖是表示柄單元160的前視圖。 在同圖中，針對於與上述第1實施形態的柄單元60相同 構成附與相同符號，而省略說明。 在本實施形態中，在柄本體部61的上板61a5僅形成 有露出吸附墊70的開口，而載置構件163是被安裝於柄 φ 本體部61的側板61c’。載置構件163是在其上端，旋轉 自如地被支撐作爲旋轉體的滾子1 63 a，而可自由旋轉地所 ’ 構成。滾子163a的一部分是從柄本體部61上面朝上方突 - 出。第7圖是表示載置構件163的立體圖。 滾子1 63 a是將與定位單元4 1所致的定位方向之Y方 向正交的X方向作爲旋轉軸被支撐成旋轉自如的狀態，而 可自由旋轉地構成於定位單元41的定位方向的Y方向。 又，滾子1 63a是在X方向相對地呈大直徑，而作成愈到 其兩端部愈呈小直徑的推拔形狀。藉由此，可減低與基板Therefore, when the substrate W is positioned, the occurrence of the flaw φ on the substrate can be reduced. The sphere 63a is rotatable in any direction including the positioning direction (Y direction) of the positioning unit 41 and the positioning direction (X direction) of the positioning unit 51, and the orientation direction of the substrate W is positioned when the substrate W is positioned. The friction between the substrate W and the mounting member 63 can be reduced. Thereafter, the air suction by the adsorption pad 70 is resumed, and the substrate W is held by the handle body portion 61. Further, the positioning operation by the positioning units 41 and 51 is released. By the adsorption pad 7 〇, the substrate W is held while being positioned, and the adsorption pad 70 functions as a holding means for holding the substrate W positioned on the handle unit 60 in a state of being positioned. Then, the row-14 - 200810892 and (12) walking unit 1 are operated to transport the substrate W to the substrate processing apparatus 300. During the movement of the substrate transfer robot 100, the substrate W is held by the adsorption pad 70, so that the positioning state of the substrate W is not impaired. <Second Embodiment> In the first embodiment, the mounting member 63 is disposed inside the shank main body portion 61, but the configuration φ may be provided outside. Further, in the above-described first embodiment, the rotating body at the upper end of the placing member 63 may be a spherical body 63a, and a rotating body other than the spherical body 63a may be used. Fig. 8(a) is a plan view showing the handle unit 160 according to the second embodiment of the present invention, and Fig. 8(b) is a front view showing the handle unit 160. In the same figure, the same components as those of the handle unit 60 of the above-described first embodiment are denoted by the same reference numerals and will not be described. In the present embodiment, only the opening that exposes the adsorption pad 70 is formed in the upper plate 61a5 of the shank main body portion 61, and the mounting member 163 is attached to the side plate 61c' of the shank main body portion 61. The placing member 163 is rotatably supported by a roller 163 a that is rotatably supported at its upper end as a rotating body. A part of the roller 163a protrudes upward from the upper surface of the shank main body portion 61. Fig. 7 is a perspective view showing the placing member 163. The roller 1 63 a is a state in which the X direction orthogonal to the Y direction of the positioning direction by the positioning unit 41 is rotatably supported as a rotation axis, and is rotatably formed in the positioning direction of the positioning unit 41. Y direction. Further, the roller 1 63a has a large diameter relatively in the X direction, and is formed into a push-out shape in which both end portions are smaller in diameter. Thereby, the substrate can be reduced
-15- 200810892 (13) w的接觸面積。滾子1 6 3 a是其周面由平滑樹脂材料所構 成較佳。 回到第8 ( a )圖及第8 ( b )圖’在本實施形態未設 置第1實施形態的定位塊體52，又’在本實施形態的滑動 、 單元5 0，未設置上述第1實施形態的定位單元5 1。亦即 ’ ，在本實施形態中，在柄單元6 0上的基板W的定位，是 僅進行定位單元4 1所致的Y方向的定位。 ^ 代替這些，在柄單元1 6 0設有感測器6 5，感測器6 5 是與感測器64同樣地來檢測被載置於本體部6 1上的基板 W的光感測器等的感測器，惟感測器64爲被使用用以檢 測基板W是否朝斜方向被收納，對於此，感測器65是被 使用用以檢測柄本體部6 1上的基板W的X方向位置。 以下，針對於使用該構成所成的柄單元1 60的基板移 載機器人1 〇〇所致的基板W的移載動作加以說明。本實 施形態的基板移載機器人1 00的移載動作是基本上與上述 φ 第1實施形態的基板移載機器人1 00的移載動作相同，而 進行表示於第5(a)圖至第5(e)圖及第6(a)圖及第 ^ 6 ( b )圖的動作。 - 但是，在感測器65檢測出基板W的端緣的時機終了 柄單元1 60對於基板收納裝置200的前進動作之處不相同 。第10(a)圖及第10(b)圖是表示其說明圖。 弟10(a)圖是表不柄單元160前進至基板收納裝置 200之途中的態樣的圖式。柄單元是藉由感測器65檢 測出基板W的端緣爲止仍前進，當端緣被檢測出，則如 -16- 200810892 (14) 第10(b)圖所示地停止。藉由該動作，成爲實施基板W 對於柄本體部6 1的定位。之後’進行表示於上述之第5 ( b )圖至第5 ( e )圖的動作，成爲從基板收納裝置200取 出基板W的情形。 、 之後，進行以柄單元160上所取出的基板W之Y方 _ 向定位。第11 (Ο圖及第11 ( b )圖是表示其動作說明 圖。如第1 1 ( a )圖所示地，在從基板收納裝置200取出 φ 基板W的狀態下，基板W是有朝Y方向偏離規定位置而 被載置在柄單元1 60上的情形。所以，首先，解除吸附墊 70所致的空氣吸引而一旦解除基板W之保持，如第1 1 ( b )圖所示地，將定位單元4 1予以動作而進行基板W的Y 方向定位。 進行基板W之定位之際，滾子163a的旋轉方向（Y 方向）爲定位方向（Y方向），而從動於隨著定位動作的 基板W的Y方向移動，令滾子163a旋轉。因此可減低基 φ 板W與載置構件1 63之間的摩擦。 當完成基板w的Y方向定位，則再開始吸附墊70所 ” 致的空氣吸引，俾將基板W保持在柄本體部61。又，解-15- 200810892 (13) Contact area of w. The roller 1 6 3 a is preferably formed of a smooth resin material on its circumferential surface. Returning to Fig. 8(a) and Fig. 8(b)', in the present embodiment, the positioning block body 52 of the first embodiment is not provided, and the sliding portion and the unit 50 of the present embodiment are not provided. Positioning unit 51 of the embodiment. That is, in the present embodiment, the positioning of the substrate W on the handle unit 60 is only the positioning in the Y direction by the positioning unit 41. In place of this, the sensor unit 65 is provided in the handle unit 160, and the sensor 65 is a photo sensor that detects the substrate W placed on the body portion 61 as the sensor 64. The sensor 64 is used to detect whether the substrate W is stored in an oblique direction. For this, the sensor 65 is used to detect the substrate W on the handle body portion 61. Direction position. Hereinafter, the transfer operation of the substrate W by the substrate transfer robot 1 柄 of the handle unit 1 60 formed by this configuration will be described. The transfer operation of the substrate transfer robot 100 of the present embodiment is basically the same as the transfer operation of the substrate transfer robot 100 of the first embodiment, and is shown in the fifth (a) to fifth. (e) Figure and the actions of Figure 6(a) and Figure 6(b). - However, at the timing when the sensor 65 detects the edge of the substrate W, the handle unit 1 60 is different from the advancement operation of the substrate housing apparatus 200. Fig. 10(a) and Fig. 10(b) are diagrams showing the same. The figure 10(a) is a view showing a state in which the handle unit 160 is advanced to the substrate housing apparatus 200. The handle unit is advanced by detecting the edge of the substrate W by the sensor 65, and when the edge is detected, it is stopped as shown in Fig. 10(b) of -16-200810892 (14). By this operation, the positioning of the substrate W to the shank main body portion 61 is performed. Then, the operations shown in the fifth (b) to fifth (e) diagrams described above are performed, and the substrate W is taken out from the substrate housing apparatus 200. Then, the Y direction of the substrate W taken out from the handle unit 160 is positioned. 11(b) and 11(b) are diagrams showing the operation. As shown in Fig. 1 (a), in the state where the φ substrate W is taken out from the substrate housing device 200, the substrate W has a direction The Y direction is displaced from the predetermined position and placed on the handle unit 1 60. Therefore, first, the air suction by the adsorption pad 70 is released, and once the substrate W is released, as shown in Fig. 1 (b) The positioning unit 41 is operated to position the substrate W in the Y direction. When the substrate W is positioned, the rotation direction (Y direction) of the roller 163a is the positioning direction (Y direction), and the follow-up is followed by positioning. The moving substrate W moves in the Y direction to rotate the roller 163a. Therefore, the friction between the base φ plate W and the placing member 163 can be reduced. When the positioning of the substrate w in the Y direction is completed, the adsorption pad 70 is restarted. The air is attracted, and the substrate W is held in the handle body portion 61.
- 除定位單元41所致的定位動作。藉由吸附墊70，基板W 是被保持在定位狀態。基板移載機器人1〇〇的移動中，基 板W是藉由吸附墊70所保持之故，因而不會損及基板W 的定位狀態。 在本實施形態中，作成基板W被載置於滾子163a的 構成，惟與使用上述第1實施形態的球體63a的構成相比 -17· (15) (15)200810892 較，因使用滾子1 6 3 a的構造是較低成本，因此可謀求減 低成本。 又，在本實施形態中，作成將載置構件1 63配設於柄 本體部6 1外部之構成之故，因而可提昇裝配性、維修性 。又，對於未具有載置構件1 63的既有基板移載機器人， 也具有藉由些微的加工就可後續附設載置構件1 63的優點 。又，當然針對於上述第1實施形態的載置構件63，也可 作成配設於柄本體部6 1之外部的構成。 在上述第1及第2實施形態中，爲了保持基板W而使 用吸附墊7 0，惟也可作成例如藉由夾持基板W的夾子式 機構來保持基板W的構成。 【圖式簡單說明】 第1圖是表示使用本發明的第1實施形態的基板移載 機器人1 00的基板處理系統的槪略圖。 第2圖是表示沿著第丨圖的線α·Α的斷面圖。 第3(a)圖是表示柄單元60的俯視圖。 第3 ( b )圖是表示沿著第3 ( a )圖的線B - B的斷面 圖。 第4圖是表示沿著第3 (b)圖的線C-C的斷面圖。 第5(a)圖至第5(e)圖是表示基板移載機器人ι〇〇 的動作說明圖。 第6(a)圖及第6(b)圖是表示基板移載機器人1〇〇 的動作說明圖。 -18- 200810892 (16) 第7(a)圖及第7(d)圖瘴表示基板移載機器人100 的動作說明圖。 第8 ( a )圖是表示本發明的第2實施形態的柄單兀 160的俯視圖。 弟8 ( b )圖是表示柄單元1 6 0的則視圖。 • 第9圖是表示載置構件163的立體圖。 第10(a)圖及第i〇(b)圖是表示本發明的第2實 φ 施形態的基板移載機器人1 0 0的動作說明圖。 第11(a)圖及第n(b)圖是表示本發明的第2實 施形態的基板移載機器人1〇0的動作說明圖。 【主要元件符號說明】 W :基板 4 1、5 1 :定位單元 6 0、1 6 0 :柄單元 φ 6 1 :柄本體部 7 0 :吸附墊 • 63、163 :載置構件 - 6 3 a :球體 100:基板移載機器人 1 6 3 :滾子 -19-- A positioning action other than the positioning unit 41. The substrate W is held in a positioned state by the adsorption pad 70. During the movement of the substrate transfer robot 1 基, the substrate W is held by the adsorption pad 70, so that the positioning state of the substrate W is not impaired. In the present embodiment, the substrate W is placed on the roller 163a, but the roller is used in comparison with the configuration of the spherical body 63a of the first embodiment. -17 (15) (15) 200810892 The construction of 1 6 3 a is lower in cost, so it is possible to reduce costs. Further, in the present embodiment, the mounting member 163 is disposed outside the shank main body portion 161, so that the assemblability and the maintainability can be improved. Further, the conventional substrate transfer robot that does not have the mounting member 163 has the advantage that the mounting member 163 can be attached later by a slight processing. Further, of course, the mounting member 63 of the first embodiment described above may be disposed outside the shank main body portion 61. In the first and second embodiments, the adsorption pad 70 is used to hold the substrate W, but the substrate W may be held by, for example, a clip mechanism that sandwiches the substrate W. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic diagram showing a substrate processing system using a substrate transfer robot 100 according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing a line α·Α along the first diagram. Fig. 3(a) is a plan view showing the handle unit 60. Fig. 3(b) is a cross-sectional view taken along line B-B of Fig. 3(a). Fig. 4 is a cross-sectional view taken along line C-C of Fig. 3(b). 5(a) to 5(e) are explanatory views showing the operation of the substrate transfer robot ι. 6(a) and 6(b) are explanatory views showing the operation of the substrate transfer robot 1A. -18- 200810892 (16) FIGS. 7(a) and 7(d) are diagrams showing the operation of the substrate transfer robot 100. Fig. 8(a) is a plan view showing the shank unit 160 according to the second embodiment of the present invention. The figure 8 (b) is a view showing the handle unit 160. • Fig. 9 is a perspective view showing the placing member 163. Fig. 10(a) and Fig. 2(b) are diagrams showing the operation of the substrate transfer robot 100 in the second embodiment of the present invention. Fig. 11(a) and Fig. 7(b) are diagrams showing the operation of the substrate transfer robot 1〇0 according to the second embodiment of the present invention. [Description of main component symbols] W: Substrate 4 1 , 5 1 : Positioning unit 6 0, 1 6 0 : Handle unit φ 6 1 : Handle body part 7 0 : Adsorption pad • 63, 163 : Mounting member - 6 3 a : Sphere 100: Substrate Transfer Robot 1 6 3 : Roller-19-