WO2018019088A1 - 背光模组及其制造方法、显示装置 - Google Patents

背光模组及其制造方法、显示装置 Download PDF

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Publication number
WO2018019088A1
WO2018019088A1 PCT/CN2017/091449 CN2017091449W WO2018019088A1 WO 2018019088 A1 WO2018019088 A1 WO 2018019088A1 CN 2017091449 W CN2017091449 W CN 2017091449W WO 2018019088 A1 WO2018019088 A1 WO 2018019088A1
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WO
WIPO (PCT)
Prior art keywords
light source
backlight module
source assembly
silicone rubber
rubber layer
Prior art date
Application number
PCT/CN2017/091449
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English (en)
French (fr)
Inventor
程鸿飞
张玉欣
Original Assignee
京东方科技集团股份有限公司
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Priority to US15/748,281 priority Critical patent/US10747052B2/en
Publication of WO2018019088A1 publication Critical patent/WO2018019088A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0051—Diffusing sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/0102—Constructional details, not otherwise provided for in this subclass
    • G02F1/0107—Gaskets, spacers or sealing of cells; Filling and closing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133504—Diffusing, scattering, diffracting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133611—Direct backlight including means for improving the brightness uniformity
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/503—Arrangements improving the resistance to shock
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/03—Function characteristic scattering

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a backlight module, a method of manufacturing the same, and a display device.
  • a backlight is a light-emitting structure fixed on the back of a liquid crystal display (LCD). Generally, it is composed of a light source component, a diffusion plate (or a light guide plate), and an optical film.
  • the backlight module can be divided into a side-in backlight module and a direct-lit backlight module according to different orientations of the light source components.
  • the light source component in the side-lit backlight module is disposed on a side of the light guide plate, and the light source component in the direct-lit backlight module is disposed behind the diffusion plate.
  • the embodiment of the invention provides a backlight module, a manufacturing method thereof, and a display device.
  • One aspect of the present invention provides a backlight module including a diffusion plate and a light source assembly, wherein: the diffusion plate is for diffusing light emitted from the light source assembly; and the diffusion plate includes a light incident surface, The light incident surface is in contact with the light emitting surface of the light source assembly.
  • the diffuser plate is integrally formed with the light source assembly.
  • the diffuser plate includes a silicone rubber layer with scattering particles disposed therein.
  • the silicone rubber layer is formed by a mixture of a silicone potting compound, a curing agent, and scattering particles.
  • the silicone potting compound has a weight percentage of 70% to 89%, and the curing agent has a weight percentage of 1% to 10%, the scattering particles.
  • the weight percentage is 10% to 20%.
  • the scattering particles comprise to none of the organic particles and the inorganic particles In less case, the scattering particles have a diameter of from 0.01 micrometer to 50 micrometers.
  • the light source component is a light emitting diode LED or a cold cathode fluorescent tube CCFL.
  • Another aspect of the present invention provides a method of fabricating a backlight module for manufacturing the backlight module as described above, the method comprising:
  • the light incident surface of the diffusing plate is brought into contact with the light emitting surface of the light source assembly
  • the prefabricated diffusion plate mold comprises a bottom plate and a baffle disposed around the bottom plate, and the bottom plate is a substrate provided with the light source assembly.
  • the substrate provided with the light source assembly is integrally formed with the diffuser plate.
  • the forming the diffusion plate using a prefabricated diffusion plate mold comprises:
  • a silicone rubber layer is formed using a prefabricated diffusion plate mold in which scattering particles are disposed.
  • the forming a silicone rubber layer using a prefabricated diffusion plate mold comprises:
  • the silicone potting compound, the curing agent and the scattering particles are mixed according to a preset ratio and then poured into the prefabricated diffusion plate mold;
  • the silicone potting compound is cured to form the silicone rubber layer.
  • the method further comprises:
  • the respective surfaces of the silicone rubber layer are planarized.
  • the silicone potting compound has a weight percentage of 70% to 89%, and the curing agent has a weight percentage of 1% to 10%, the scattering particles.
  • the weight percentage is 10% to 20%.
  • the scattering particles comprise at least one of organic particles and inorganic particles; and the scattering particles have a diameter of from 0.01 micrometers to 50 micrometers.
  • Another aspect of the present invention provides a display device including the backlight module as described above.
  • the light incident surface of the diffusing plate is adhered to the light emitting surface of the light source assembly, thereby effectively reducing the gap between the light source assembly and the diffusing plate, thereby ensuring that the light emitted by the light source assembly can be effectively incident to In the diffusing plate, the light entering efficiency of the diffusing plate is improved.
  • FIG. 1 is a schematic structural view of a diffusion plate according to an embodiment
  • FIG. 2 shows a schematic structural view of another diffusion plate according to an embodiment
  • FIG. 3 shows a flow chart of a method of fabricating a diffuser panel in accordance with one embodiment
  • FIG. 4 shows a flow chart of another method of fabricating a diffuser panel in accordance with one embodiment
  • Figure 5 shows a schematic view of a light source assembly disposed on a substrate, in accordance with one embodiment
  • Figure 6 shows a schematic structural view of a baffle according to an embodiment
  • Figure 7 shows a schematic structural view of another baffle according to one embodiment
  • FIG. 8 is a schematic structural diagram of a backlight module according to an embodiment
  • FIG. 9 shows a schematic structural view of a display device according to an embodiment.
  • FIG. 1 shows a schematic structural view of a diffuser plate for diffusing light emitted from a light source assembly 11 as shown in FIG.
  • the diffusing plate 10 may include a light incident surface 10a that is in contact with a light emitting surface of the light source assembly 11.
  • the light incident surface of the diffusing plate is adhered to the light emitting surface of the light source assembly, thereby effectively reducing the gap between the light source assembly and the diffusing plate, thereby ensuring that the light emitted by the light source assembly can be effectively incident into the diffusing plate, thereby improving the The light entering efficiency of the diffuser.
  • the diffusing plate 10 and the light source assembly 11 can be integrally formed. That is, referring to FIG. 2, the light source assembly 11 may be disposed on the substrate 12, and the diffusion plate 10 may be formed. On the substrate 12 on which the light source unit 11 is disposed, it is ensured that the light incident surface 10a of the diffusing plate 10 and the light emitting surface of the light source unit 11 can be effectively adhered.
  • the diffuser panel 10 may include a transparent silicone rubber layer 101, and the silicone rubber layer 101 may also be provided with scattering particles 102.
  • the diffusing plate can provide a uniform surface light source for the display device.
  • the silicone rubber can maintain elasticity for a long period of time at -60 ° C to 200 ° C, and has excellent electrical properties and chemical stability, the reliability of the diffusion plate can be ensured. Moreover, the silicone rubber is not easily broken, and has a certain viscosity, and can protect the light source component. Further, since the viscosity of the silicone rubber layer is not too strong, if the light source component on the substrate fails or is damaged, the silicone rubber layer can be directly uncovered to replace the light source component, thereby improving the flexibility of the diffusion plate. Sex.
  • the silicone rubber layer 101 may be formed from a mixture of a silicone potting compound, a curing agent, and scattering particles.
  • the weight percentage of the silicone potting compound may be 70% to 89%
  • the weight percentage of the curing agent may be 1% to 10%
  • the weight percentage of the scattering particles may be 10% to 20%. %.
  • the weight percentage of the silicone potting compound, the curing agent, and the scattering particles may be 75:5:20.
  • the silicone encapsulant used in the manufacture of the silicone rubber layer may be a one-component silicone encapsulant or a two-component silicone encapsulant; or, the silicone encapsulant may be Room temperature vulcanized silicone rubber or high temperature vulcanized silicone rubber.
  • Room temperature vulcanized silicone rubbers can be classified into three types: one-component room temperature vulcanized silicone rubber, two-component condensation type room temperature vulcanized silicone rubber, and two-component addition type room temperature vulcanized silicone rubber.
  • the embodiment of the present invention does not limit the type of silicone potting glue used in the diffusion plate.
  • the scattering particles 102 disposed in the silicone rubber layer 101 may include at least one of organic particles and inorganic particles.
  • the scattering particles may be polystyrene particles, polycarbonate particles, polypropylene particles, silica particles, polymethyl methacrylate particles, glass beads, titanium dioxide, cerium oxide, barium sulfate, zinc sulfate, and oxidation. At least one of zinc calcium carbonate.
  • the diameter of the scattering particles 102 may be selected from 0.01 micrometers to 50 micrometers depending on the actual application product.
  • the light source assembly 11 can be a light emitting diode (LED) or a cold cathode fluorescent tube (CCFL); the substrate 12 for providing the light source assembly 11 can be a circuit board.
  • LED light emitting diode
  • CCFL cold cathode fluorescent tube
  • the embodiment of the present invention provides a backlight module including a diffusion plate and a light source assembly, wherein a light incident surface of the diffusion plate is bonded to a light emitting surface of the light source assembly, and the diffusion plate can be formed with the light source assembly.
  • a backlight module including a diffusion plate and a light source assembly, wherein a light incident surface of the diffusion plate is bonded to a light emitting surface of the light source assembly, and the diffusion plate can be formed with the light source assembly.
  • FIG. 3 illustrates a flow chart of a method of fabricating a backlight module in accordance with an embodiment.
  • the method may include:
  • Step 301 forming a diffusing plate by using a prefabricated diffusing plate mold, and disposing a light source assembly on the substrate such that a light incident surface of the diffusing plate is adhered to a light emitting surface of the light source assembly.
  • the prefabricated diffusion plate mold may include a bottom plate and a baffle disposed around the bottom plate, the bottom plate being a substrate provided with the light source assembly.
  • the embodiment of the present invention provides a method for manufacturing a backlight module.
  • the bottom plate in the diffusion plate mold used in the method is a substrate provided with a light source assembly.
  • the light incident surface of the diffusing plate in the backlight module manufactured by the method can be matched with the light emitting surface of the light source component, thereby effectively reducing the gap between the light source component and the diffusing plate, thereby ensuring that the light emitted by the light source component can be effectively effective.
  • Incident into the diffusing plate improves the light-in efficiency of the diffusing plate.
  • FIG. 4 shows a flow chart of a method of fabricating another backlight module in accordance with one embodiment. As shown in FIG. 4, the method may include:
  • Step 401 A light source assembly is disposed on the substrate.
  • a plurality of light source assemblies 11 may be arranged in an array on a substrate (eg, a circuit board) 12 in accordance with design requirements of the display device.
  • the light source unit 11 disposed at the edge region of the substrate 12 may be denser, and the light source unit 11 disposed at the intermediate portion of the substrate 12 may be sparse.
  • the substrate 12 can be a circuit board
  • the light source assembly 11 can be an LED or a CCFL.
  • the light source assembly 11 can be soldered to the circuit board 12 by soldering.
  • Step 402 Providing a baffle around the substrate provided with the light source assembly to form a prefabricated diffusion plate mold.
  • a top open baffle 121 may be disposed around the substrate 12.
  • a top-covered baffle 122 may be disposed around the substrate 12,
  • the cover plate on the top of the baffle 122 may be provided with a small hole 2a for infusing the silicone potting compound.
  • the substrate provided with the light source assembly and the baffle disposed around the substrate may form a mold for manufacturing the diffusion plate.
  • Step 403 mixing the silicone potting compound, the curing agent and the scattering particles according to a preset ratio, and then pouring them into a prefabricated diffusion plate mold.
  • the silicone potting compound when the diffusion plate is formed by the prefabricated diffusion plate mold, may have a weight percentage of 70% to 89%, and the curing agent may have a weight percentage of 1% to 10%, and the scattering particles.
  • the weight percentage can be from 10% to 20%.
  • the silicone potting compound can be a one-component silicone potting compound or a two-component silicone potting compound; or, the silicone potting compound can also be a room temperature vulcanized silicone rubber or a high temperature vulcanized silicone rubber.
  • the scattering particles may include at least one of organic particles and inorganic particles, and the diameter of the scattering particles may be selected from 0.01 micrometers to 50 micrometers.
  • the silicone potting compound, the curing agent and the scattering particles can be thoroughly mixed in a weight ratio of 75:5:20, and the mixture is gently agitated to reduce the air mixed in the mixture. .
  • the mixture can be placed for 5 minutes prior to infusion to remove air from the mixture. If bubbles are still present in the mixture, the mixture can be subjected to a vacuum defoaming treatment, and the bubbles in the mixture are completely removed and then poured into a diffusion plate mold.
  • Step 404 Curing the silicone potting compound to form a silicone rubber layer.
  • the silicone potting compound can be cured at room temperature (eg, 25 ° C) due to the mixing of the curing agent in the mixture.
  • the mixture can be heated to speed up the curing of the silicone potting compound.
  • the silicone potting compound is completely converted into a solid elastomer, the curing reaction is completed.
  • the silicone rubber layer formed of the silicone potting compound, the curing agent and the scattering particles is a diffusion plate.
  • Step 405 Peel off the baffle around the prefabricated diffusion plate mold.
  • the baffle 121 or 122 around the substrate 12 can be peeled off.
  • the diffusion plate after peeling off the baffle plate can be as shown in FIG. 2, and at this time, the diffusion plate 10 and the light source assembly 11 are integrally molded.
  • Step 406 Flattening the respective surfaces of the silicone rubber layer.
  • the embodiment of the present invention provides a method for manufacturing a backlight module.
  • the bottom plate in the diffusion plate mold used in the method is a substrate provided with a light source assembly, and thus the light incident surface of the diffusion plate manufactured by the method is adopted.
  • the light emitting surface of the light source assembly may be attached, and the diffusion plate may be integrally formed with the light source assembly. Therefore, the gap between the light source assembly and the diffusion plate is effectively reduced, thereby ensuring that the light emitted by the light source assembly can be effectively incident into the diffusion plate, thereby improving the light-in efficiency of the diffusion plate.
  • FIG. 8 shows a schematic structural view of a backlight module according to an embodiment.
  • the backlight module may include a diffusion plate 10 and a light source assembly 11.
  • the backlight module may further include a back plate 20 and an optical film 21.
  • the diffusion plate 10 is disposed in the back plate 20, and the optical film 21 is disposed on the light exit surface of the diffusion plate 10.
  • the light incident surface of the diffusing plate 10 is bonded to the light emitting surface of the light source unit 11.
  • the light source assembly 11 can be disposed on a substrate 12, which can be a circuit board.
  • FIG. 9 shows a schematic structural view of a display device according to an embodiment.
  • the display device can include a backlight module 200 and a display panel 300.
  • the backlight module 200 can be a backlight module as shown in FIG.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
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Abstract

一种背光模组（200），背光模组（200）的制造方法以及包括背光模组（200）的显示装置，背光模组（200）包括扩散板（10）和光源组件（11）。扩散板（10）用于扩散光源组件（11）射出的光，并且扩散板（10）包括入光面（10a），入光面（10a）与光源组件（11）的出光面贴合。

Description

背光模组及其制造方法、显示装置 技术领域
本发明涉及显示技术领域，特别涉及一种背光模组及其制造方法、显示装置。
背景技术
背光模组(Back Light)是固定于液晶显示器(Liquid Crystal Display；LCD)背后的一种发光结构，一般由光源组件、扩散板(或导光板)和光学膜片等组件组成。
相关技术中，根据光源组件的设置方位的不同，背光模组可以分为侧入式背光模组和直下式背光模组。侧入式背光模组中的光源组件设置于导光板的侧面，直下式背光模组中的光源组件设置于扩散板的后方。
但是，相关技术中，在直下式背光模组中，扩散板与光源组件之间存在间隙，这会对扩散板的入光效率造成一定的影响。
发明内容
为了解决相关技术中扩散板入光效率较低的问题，本发明实施例提供了一种背光模组及其制造方法、显示装置。
本发明的一个方面提供了一种背光模组，所述背光模组包括扩散板和光源组件，其中：所述扩散板用于扩散光源组件射出的光；并且所述扩散板包括入光面，所述入光面与所述光源组件的出光面贴合。
在一个实施例中，所述扩散板与所述光源组件成型为一体。
在一个实施例中，所述扩散板包括硅橡胶层，所述硅橡胶层内设置有散射粒子。
在一个实施例中，所述硅橡胶层由有机硅灌封胶、固化剂和散射粒子混合形成。
在一个实施例中，在所述硅橡胶层中，所述有机硅灌封胶的重量百分比为70％至89％，所述固化剂的重量百分比为1％至10％，所述散射粒子的重量百分比为10％至20％。
在一个实施例中，所述散射粒子包括有机颗粒和无机颗粒中的至 少一种，所述散射粒子的直径为0.01微米至50微米。
在一个实施例中，所述光源组件为发光二极管LED或者冷阴极荧光灯管CCFL。
本发明的另一个方面提供一种背光模组的制造方法，用于制造如上所述的背光模组，所述方法包括：
采用预制的扩散板模具形成扩散板；
在基板上设置光源组件；
使得所述扩散板的入光面与光源组件的出光面贴合；
其中，所述预制的扩散板模具包括底板以及设置在所述底板四周的挡板，所述底板为设置有所述光源组件的基板。
在一个实施例中，使设置有所述光源组件的基板与所述扩散板成型为一体。
在一个实施例中，所述采用预制的扩散板模具形成所述扩散板，包括：
采用预制的扩散板模具形成硅橡胶层，所述硅橡胶层中设置有散射粒子。
在一个实施例中，所述采用预制的扩散板模具形成硅橡胶层，包括：
将有机硅灌封胶、固化剂以及散射粒子按照预设比例混合后倒入所述预制的扩散板模具中；
使所述有机硅灌封胶固化以形成所述硅橡胶层。
在一个实施例中，在所述使所述有机硅灌封胶固化以形成所述硅橡胶层之后，所述方法还包括：
剥离所述预制的扩散板模具四周的挡板；以及
对所述硅橡胶层的各个表面进行平整化处理。
在一个实施例中，在所述硅橡胶层中，所述有机硅灌封胶的重量百分比为70％至89％，所述固化剂的重量百分比为1％至10％，所述散射粒子的重量百分比为10％至20％。
在一个实施例中，所述散射粒子包括有机颗粒和无机颗粒中的至少一种；并且所述散射粒子的直径为0.01微米至50微米。
本发明的另一个方面提供了一种显示装置，所述显示装置包括如上所述的背光模组。
在本发明的各个实施例中，扩散板的入光面与光源组件的出光面贴合，有效减小了光源组件与扩散板之间的间隙，从而保证了光源组件发出的光能够有效入射至扩散板中，提高了该扩散板的入光效率。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本发明的一些实施例。对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1示出了根据一个实施例的一种扩散板的结构示意图；
图2示出了根据一个实施例的另一种扩散板的结构示意图；
图3示出了根据一个实施例的一种扩散板的制造方法的流程图；
图4示出了根据一个实施例的另一种扩散板的制造方法的流程图；
图5示出了根据一个实施例的在基板上设置光源组件的示意图；
图6示出了根据一个实施例的一种挡板的结构示意图；
图7示出了根据一个实施例的另一种挡板的结构示意图；
图8示出了根据一个实施例的一种背光模组的结构示意图；
图9示出了根据一个实施例的一种显示装置的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明实施方式作进一步地详细描述。
图1示出了根据一个实施例的一种扩散板的结构示意图，如图1所示，该扩散板10用于扩散光源组件11射出的光。
参考图1，该扩散板10可以包括入光面10a，该入光面10a与光源组件11的出光面贴合。
该扩散板的入光面与光源组件的出光面贴合，有效地减小了光源组件与扩散板之间的间隙，从而保证了光源组件发出的光能够有效入射至扩散板中，提高了该扩散板的入光效率。
图2示出了根据一个实施例的另一种扩散板的结构示意图，如图2所示，该扩散板10与该光源组件11可以成型为一体。也就是说，参考图2，该光源组件11可以设置在基板12上，该扩散板10可以形成 在设置有光源组件11的基板12上，从而可以保证该扩散板10的入光面10a与该光源组件11的出光面能够有效贴合。
参考图2，该扩散板10可以包括透明的硅橡胶层101，该硅橡胶层101内还可以设置有散射粒子102。
由于该硅橡胶层中的有机硅灌封胶和散射粒子的折射率不同，因此光在经过该扩散板时会不断地在两个折射率相异的介质中穿过。由此产生折射、反射与散射的现象，实现了光学扩散的效果，从而保证该扩散板能够为显示装置提供均匀的面光源。
此外，由于硅橡胶可以在-60℃至200℃的条件下长期保持弹性，并具有优良的电性能和化学稳定性，因此可以保证该扩散板的可靠性。而且，硅橡胶不易破损，且具有一定的粘性，能够对光源组件起到保护作用。进一步地，由于硅橡胶层的粘性并不太强，因此如果基板上的光源组件出现故障或损坏时，还可以直接揭开该硅橡胶层，以便更换光源组件，提高了该扩散板的使用灵活性。
在一个实施例中，硅橡胶层101可以由有机硅灌封胶、固化剂和散射粒子混合形成。具体地，在该硅橡胶层中，有机硅灌封胶的重量百分比可以为70％至89％，固化剂的重量百分比可以为1％至10％，散射粒子的重量百分比可以为10％至20％。作为一个示例，在该硅橡胶层中，有机硅灌封胶、固化剂和散射粒子的重量百分比可以为75∶5∶20。
在实际应用中，在制造硅橡胶层时所采用的有机硅灌封胶可以为单组分有机硅灌封胶或双组分有机硅灌封胶；或者，采用的有机硅灌封胶可以为室温硫化硅橡胶或高温硫化硅橡胶。室温硫化硅橡胶可分为三种类型：单组分室温硫化硅橡胶、双组分缩合型室温硫化硅橡胶和双组分加成型室温硫化硅橡胶。本发明实施例对扩散板中所采用的有机硅灌封胶的类型不做限定。
在一个实施例中，设置在硅橡胶层101中的散射粒子102可以包括有机颗粒和无机颗粒中的至少一种。具体地，散射粒子可以为聚苯乙烯颗粒、聚碳酸酯颗粒、聚丙烯颗粒、二氧化硅颗粒、聚甲基丙烯酸甲酯颗粒、玻璃微珠、二氧化钛、氧化锑、硫酸钡、硫酸锌和氧化锌碳酸钙中的至少一种。而且，根据实际应用产品的不同，散射粒子102的直径的可选范围可以为0.01微米至50微米。
在一个实施例中，光源组件11可以为发光二极管(LED)或者冷阴极荧光灯管(CCFL)；用于设置光源组件11的基板12可以为电路板。
综上所述，本发明实施例提供了一种背光模组，包括扩散板和光源组件，其中，扩散板的入光面与光源组件的出光面贴合，并且扩散板可以与光源组件成型为一体。这样，有效减小了光源组件与扩散板之间的间隙，从而保证了光源组件发出的光能够有效入射至扩散板中，提高了扩散板的入光效率。
图3示出了根据一个实施例的一种背光模组的制造方法的流程图。参考图3，该方法可以包括：
步骤301：采用预制的扩散板模具形成扩散板，在基板上设置光源组件，使得该扩散板的入光面与光源组件的出光面贴合。
具体地，该预制的扩散板模具可以包括底板以及设置在该底板四周的挡板，该底板为设置有光源组件的基板。
综上所述，本发明实施例提供了一种背光模组的制造方法，该方法中采用的扩散板模具中的底板为设置有光源组件的基板。通过该方法制造的背光模组中的扩散板的入光面可以与光源组件的出光面贴合，有效减小了光源组件与扩散板之间的间隙，从而保证了光源组件发出的光能够有效入射至扩散板中，提高了该扩散板的入光效率。
图4示出了根据一个实施例的另一种背光模组的制造方法的流程图。如图4所示，该方法可以包括：
步骤401：在基板上设置光源组件。
在一个实施例中，参考图5，可以根据显示装置的设计需求，在基板(例如电路板)12上以阵列方式设置多个光源组件11。可替换地，也可以使得在基板12的边缘区域设置的光源组件11较为密集，而在基板12的中间区域设置的光源组件11较为稀疏。
在实际应用中，基板12可以为电路板，光源组件11可以为LED或者CCFL。光源组件11可以通过焊锡的方式焊接在电路板12上。
步骤402：在设置有光源组件的基板周围设置挡板，形成预制的扩散板模具。
如图6所示，可以在基板12四周设置顶部开口的挡板121。可替换地，如图7所示，也可以在基板12四周设置顶部加盖的挡板122， 该挡板122顶部的盖板上可以设置有用于灌注有机硅灌封胶的小孔2a。该设置有光源组件的基板以及设置在基板周围的挡板可以形成用于制造扩散板的模具。
步骤403：将有机硅灌封胶、固化剂以及散射粒子按照预设比例混合后倒入预制的扩散板模具中。
在一个实施例中，在通过该预制的扩散板模具形成扩散板时，有机硅灌封胶的重量百分比可以为70％至89％，固化剂的重量百分比可以为1％至10％，散射粒子的重量百分比可以为10％至20％。将这三种材质按照预设比例混合后，可以直接倒入图6所示的预制的扩散板模具中；可替换地，如图7所示，可以将混合物通过小孔2a注入预制的扩散板模具中。
有机硅灌封胶可以为单组分有机硅灌封胶或双组分有机硅灌封胶；或者，有机硅灌封胶还可以为室温硫化硅橡胶或高温硫化硅橡胶。散射粒子可以包括有机颗粒和无机颗粒中的至少一种，并且散射粒子的直径的可选范围可以为0.01微米至50微米。
在实际应用中，在形成扩散板之前，可以将有机硅灌封胶、固化剂与散射粒子按照75∶5∶20的重量比进行充分混合，轻轻搅动混合物以减少该混合物中所混入的空气。灌注前可以将混合物放置5分钟，以便去除混合物中混入的空气。如果混合物中还存在气泡，则可以对该混合物进行真空脱泡处理，在将该混合物中的气泡完全消除后再倒入扩散板模具中。
步骤404：使有机硅灌封胶固化以形成硅橡胶层。
在一个实施例中，由于混合物中混合有固化剂，因此有机硅灌封胶可以在室温(例如25℃)条件下进行固化。此外，也可以通过对该混合物进行加热，以加快有机硅灌封胶固化的速度。当有机硅灌封胶完全转变为固体弹性体时，固化反应完成。由有机硅灌封胶、固化剂和散射粒子形成的硅橡胶层即为扩散板。
步骤405：剥离预制的扩散板模具四周的挡板。
示例性地，当有机硅灌封胶固化完成后，即可剥离该基板12周围的挡板121或者122。剥离挡板后的扩散板可以如图2所示，此时，扩散板10与光源组件11成型为一体。
步骤406：对硅橡胶层的各个表面进行平整化处理。
在挡板被剥离后，还需要对硅橡胶层的各个表面进行平整化处理，使得该硅橡胶层的各个表面保持平整。
综上所述，本发明实施例提供了一种背光模组的制造方法，该方法采用的扩散板模具中的底板为设置有光源组件的基板，因此通过该方法制造的扩散板的入光面可以与光源组件的出光面贴合，并且该扩散板可以与该光源组件成型为一体。因此，有效减小了光源组件与扩散板之间的间隙，从而保证了光源组件发出的光能够有效入射至扩散板中，提高了扩散板的入光效率。
图8示出了根据一个实施例的一种背光模组的结构示意图。如图8所示，背光模组可以包括扩散板10和光源组件11。该背光模组还可以包括背板20和光学膜片21。扩散板10设置在背板20中，光学膜片21设置在扩散板10的出光面。扩散板10的入光面与光源组件11的出光面贴合。光源组件11可以设置在基板12上，该基板12可以为电路板。
图9示出了根据一个实施例的一种显示装置的结构示意图。该显示装置可以包括背光模组200和显示面板300，其中，该背光模组200可以为如图8所示的背光模组。
以上所述仅为本发明的各个实施例，并不用以限制本发明。在本发明的精神和原则之内所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (15)

  1. 一种背光模组，包括扩散板和光源组件，其中，
    所述扩散板用于扩散光源组件射出的光；并且
    所述扩散板包括入光面，所述入光面与所述光源组件的出光面贴合。
  2. 根据权利要求1所述的背光模组，其中，
    所述扩散板与所述光源组件成型为一体。
  3. 根据权利要求1所述的背光模组，其中，
    所述扩散板包括硅橡胶层；
    所述硅橡胶层内设置有散射粒子。
  4. 根据权利要求3所述的背光模组，其中，
    所述硅橡胶层由有机硅灌封胶、固化剂和散射粒子混合形成。
  5. 根据权利要求4所述的背光模组，其中，
    在所述硅橡胶层中，所述有机硅灌封胶的重量百分比为70％至89％，所述固化剂的重量百分比为1％至10％，所述散射粒子的重量百分比为10％至20％。
  6. 根据权利要求3至5任一所述的背光模组，其中，
    所述散射粒子包括有机颗粒和无机颗粒中的至少一种；
    所述散射粒子的直径为0.01微米至50微米。
  7. 根据权利要求1至5任一所述的背光模组，其中，
    所述光源组件为发光二极管LED或者冷阴极荧光灯管CCFL。
  8. 一种背光模组的制造方法，包括：
    采用预制的扩散板模具形成扩散板；
    在基板上设置光源组件；
    使得所述扩散板的入光面与所述光源组件的出光面贴合；
    其中，所述预制的扩散板模具包括底板以及设置在所述底板四周的挡板，所述底板为设置有所述光源组件的基板。
  9. 根据权利要求8所述的方法，其中，
    使所述设置有所述光源组件的基板与所述扩散板成型为一体。
  10. 根据权利要求8所述的方法，其中，所述采用预制的扩散板模具形成扩散板，包括：
    采用预制的扩散板模具形成硅橡胶层，所述硅橡胶层中设置有散射粒子。
  11. 根据权利要求10所述的方法，其中，所述采用预制的扩散板模具形成硅橡胶层，包括：
    将有机硅灌封胶、固化剂以及散射粒子按照预设比例混合后倒入所述预制的扩散板模具中；
    使所述有机硅灌封胶固化以形成所述硅橡胶层。
  12. 根据权利要求11所述的方法，其中，在使所述有机硅灌封胶固化以形成所述硅橡胶层之后，所述方法还包括：
    剥离所述预制的扩散板模具四周的挡板；以及
    对所述硅橡胶层的各个表面进行平整化处理。
  13. 根据权利要求11所述的方法，其中，
    在所述硅橡胶层中，所述有机硅灌封胶的重量百分比为70％至89％，所述固化剂的重量百分比为1％至10％，所述散射粒子的重量百分比为10％至20％。
  14. 根据权利要求10至13任一所述的方法，其中，
    所述散射粒子包括有机颗粒和无机颗粒中的至少一种；
    所述散射粒子的直径为0.01微米至50微米。
  15. 一种显示装置，包括如权利要求1至7任一所述的背光模组。
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