WO2018018961A1 - Pcb板、pcb板的制造方法及移动终端 - Google Patents

Pcb板、pcb板的制造方法及移动终端 Download PDF

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Publication number
WO2018018961A1
WO2018018961A1 PCT/CN2017/081722 CN2017081722W WO2018018961A1 WO 2018018961 A1 WO2018018961 A1 WO 2018018961A1 CN 2017081722 W CN2017081722 W CN 2017081722W WO 2018018961 A1 WO2018018961 A1 WO 2018018961A1
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Prior art keywords
pcb board
heat
board according
heat dissipation
insulating
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PCT/CN2017/081722
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English (en)
French (fr)
Inventor
凌绪衡
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广东欧珀移动通信有限公司
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Publication of WO2018018961A1 publication Critical patent/WO2018018961A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]

Definitions

  • the present invention relates to the field of mobile terminal technologies, and in particular, to a PCB board, a method of manufacturing a PCB board, and a mobile terminal having the same.
  • the present invention aims to solve at least one of the technical problems in the related art to some extent.
  • the present invention provides a PCB board, which can greatly improve the thermal conductivity of the insulating layer by mixing the heat conductive material in the insulating base, so that the heat generated by the PCB in the work can be quickly transmitted out, the PCB board
  • the heat dissipation performance is better, thereby improving the reliability of operation of electronic components and mobile terminals, and the heat dissipation cost is low, and no additional space for the PCB board is required.
  • the present invention also proposes a method of manufacturing the above PCB board.
  • the present invention further proposes a mobile terminal having the above PCB board.
  • a PCB board includes: a plurality of conductive layers, wherein the plurality of conductive layers are sequentially disposed; an insulating layer, wherein the insulating layer is disposed between two adjacent conductive layers Wherein the insulating layer comprises an insulating substrate and a heat conducting material mixed in the insulating matrix.
  • the thermal conductivity of the insulating layer can be greatly improved, so that the heat generated by the PCB in the work can be quickly transferred out, and the heat dissipation performance of the PCB board is better, thereby improving The reliability of the operation of electronic components and mobile terminals, and the low cost of heat dissipation, does not occupy additional space on the PCB board.
  • PCB board according to the present invention may also have the following additional technical features:
  • the PCB board is provided with a heat dissipation hole, the heat dissipation hole sequentially penetrates the plurality of conductive layers and the insulation layer, and the heat conduction material is filled in the heat dissipation hole.
  • the PCB board is provided with a heat dissipation hole, the heat dissipation hole sequentially penetrates the plurality of conductive layers and the insulation layer, and the heat conduction material is located outside the heat dissipation hole.
  • the plurality of heat dissipation holes are plural and are spaced apart from each other on the PCB board.
  • a plurality of the heat dissipation holes are evenly distributed on the PCB board.
  • the heat conducting material is distributed in the form of particles in the insulating matrix.
  • the heat conductive material is spherical.
  • the heat conductive material is plural.
  • a plurality of the heat conducting materials are spaced apart from each other within the insulating matrix.
  • a plurality of the heat conducting materials are non-uniformly distributed in the insulating matrix.
  • the insulating substrate is a polypropylene matrix.
  • the heat conducting material is polystyrene.
  • the heat conducting material is quartz glass.
  • the heat conducting material is an epoxy resin.
  • the manufacturing method includes the steps of: separately melting the insulating substrate and the heat conductive material, mixing, and pressing into a plate-like structure to constitute the insulation. a layer; a metal layer or a metal line is coated on at least one surface of the insulating layer to constitute the conductive layer; and the insulating layer coated with the conductive layer is sequentially stacked and fixed.
  • the insulating substrate and the heat conductive material are respectively melted, mixed, and pressed into a plate-like structure to form an insulating layer, and the insulating base is integrally formed with the heat conductive material, and the overall structural strength of the insulating layer is better.
  • the manufacturing process is simple, and the thermal conductivity of the insulating layer is better.
  • the PCB board is a PCB board according to an embodiment of the first aspect of the present invention.
  • the mobile terminal of the present invention by providing the PCB board according to the embodiment of the first aspect of the present invention, heat dissipation performance is better and operation reliability is higher.
  • FIG. 1 is a schematic structural view of a PCB board according to an embodiment of the present invention.
  • Figure 2 is an enlarged view of a portion A in Figure 1.
  • Insulating layer 2 Insulating layer 2; insulating substrate 21; heat conducting material 22; heat dissipation hole 201.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected or electrically connected; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or an interaction relationship of two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the insulating layer of the PCB board is usually made of polypropylene or epoxy resin material, and the polypropylene or epoxy resin material has low cost and good insulation, but at the same time, its thermal conductivity is poor.
  • the heat sink In order to speed up the heat dissipation of electronic components, it is usually necessary to provide a heat sink for dissipating heat from the electronic components on the PCB. Additional heat sinks on the PCB will increase the overall size of the PCB, which is not conducive to the concentration of the mobile terminal. Development and miniaturization, and high cost and poor heat dissipation.
  • the present invention proposes a PCB board 100 that has good heat dissipation performance, low heat dissipation cost, and does not require additional space for the PCB board 100.
  • the PCB board 100 includes: a plurality of conductive layers 1 and an insulating layer 2.
  • the plurality of conductive layers 1 are sequentially stacked, and an insulating layer 2 is disposed between the adjacent two conductive layers 1, wherein the insulating layer 2 includes an insulating substrate 21 and a heat conductive material 22 mixed in the insulating substrate 21.
  • the material of the heat conductive material 22 is a heat conductive material having a high thermal conductivity, and is generally a heat conductive material having a thermal conductivity greater than or equal to 10 W/(m ⁇ K).
  • An electronic component is disposed on the upper surface of the PCB board 100.
  • the PCB board 100 is applied to the mobile terminal as an example.
  • the electronic component When the mobile terminal works, the electronic component generates heat, and heat generated in the electronic component is transmitted to the conductive layer 1 at the upper end.
  • the conductive layer 1 absorbs the heat of the electronic component and transfers the heat to the insulating layer 2 located underneath.
  • the insulating substrate 21 of the insulating layer 2 is mixed with the heat conductive material 22, and the heat is quickly transferred to the conductive layer 1 of the next layer through the heat conductive material 22. Thus, the transfer continues downward, and heat is quickly transferred out through the multilayer conductive layer 1 and the insulating layer 2 on the adjacent two conductive layers 1.
  • the electronic components referred to herein generally refer to heat generating devices disposed on the PCB board 100, and may be, for example, processor chips, power management chips, transistors, resistors, capacitors, and light emitting diodes.
  • the thermal conductivity of the insulating layer 2 can be greatly improved, and the heat generated by the electronic component during operation can be quickly transmitted through the conductive layer 1 and the insulating layer 2, whereby, the reliability of the operation of the electronic component and the mobile terminal is improved, and the heat dissipation cost is low, and the space of the PCB board 100 is not required to be occupied.
  • the heat conductive material 22 is distributed in the form of particles in the insulating base 21, and the heat conductive material 22 and the insulating base 21 can be better mixed together, thereby making the insulation Layer 2 has better thermal conductivity.
  • the heat conductive material 22 may be spherical, and the heat conductive material 22 is plural, and the plurality of heat conductive materials 22 are spaced apart from each other and distributed in the insulating base 21.
  • a plurality of heat conducting materials 22 are non-uniformly distributed within the insulating substrate 21.
  • the insulating substrate 21 is a polypropylene matrix with good insulation and low cost.
  • the heat conductive material 22 is polystyrene, has good thermal conductivity, and is electrically insulating.
  • the heat conductive material 22 is more flexible in the insulating substrate 21 and does not cause circuit connection to the PCB 100. interference.
  • the heat conductive material 22 is quartz glass, has good thermal conductivity, and is electrically insulating.
  • the heat conductive material 22 is more flexible in the insulating base 21 and does not interfere with the circuit connection of the PCB 100. .
  • the heat conductive material 22 is an epoxy resin, has good thermal conductivity, and is electrically insulating.
  • the heat conductive material 22 is more flexible in the insulating substrate 21 and does not cause circuit connection to the PCB 100. interference.
  • the PCB board 100 is provided with a heat dissipation hole 201, and the heat dissipation holes 201 are sequentially penetrated.
  • the conductive layer 1 and the insulating layer 2 can be filled with the heat conductive material 22, so that the heat generated in the electronic component can be transmitted through the heat dissipation hole 201, and the heat dissipation path is more, and the heat dissipation efficiency is higher.
  • the plurality of heat dissipation holes 201 are disposed apart from each other on the PCB board 100, and a plurality of heat dissipation holes 201 are disposed on the PCB board 100, and each of the heat dissipation holes 201 is filled with the heat conductive material 22, thereby making the insulation layer 2 Better thermal conductivity.
  • a plurality of heat dissipation holes 201 are evenly distributed on the PCB board 100.
  • the PCB board 100 is provided with a heat dissipation hole 201 .
  • the heat dissipation hole 201 sequentially penetrates the plurality of conductive layers 1 and the insulation layer 2 , and the heat conduction material 22 is located outside the heat dissipation hole 201 .
  • the following describes a method of manufacturing a PCB board 100 according to an embodiment of the second aspect of the present invention.
  • the PCB board 100 is the PCB board 100 of the first aspect embodiment described above, and the manufacturing method includes the following steps: respectively, the insulating base 21 and the heat conductive material 22 are respectively After melting, mixing is performed, and pressed into a plate-like structure to constitute the insulating layer 2; a metal layer or a metal wire is coated on at least one surface of the insulating layer 2 to constitute the conductive layer 1; and the insulating layer 2 to be coated with the conductive layer 1 Stack and fix them one after the other.
  • the insulating substrate 21 and the heat conductive material 22 are separately melted, mixed, and pressed into a plate-like structure to constitute the insulating layer 2.
  • the insulating base 21 and the heat conductive material 22 are integrally formed and insulated.
  • the overall structural strength of the layer 2 is better, the manufacturing process is simple, and the thermal conductivity of the insulating layer 2 is better.
  • a mobile terminal including a PCB board 100, which is a PCB board 100 according to an embodiment of the first aspect of the present invention, is described below.
  • the mobile terminal of the present invention by providing the PCB board 100 according to the embodiment of the first aspect of the present invention, heat dissipation performance is better and operational reliability is better.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种PCB板、PCB板的制造方法及移动终端。PCB板（100）包括：多层导电层（1），多层导电层依次叠置设置；绝缘层（2），相邻两个导电层之间均设有绝缘层，其中绝缘层包括绝缘基体（21）和混合在绝缘基体内的导热材（22）。通过在绝缘基体内混合导热材，可以大大提高绝缘层的导热性能，这样PCB板在工作中产生的热量可以快速的传递出去，PCB板的散热性能更好，从而提高电子元件及移动终端运行的可靠性，并且散热成本低，不会增大PCB板的整体体积。

Description

PCB板、PCB板的制造方法及移动终端 技术领域
本发明涉及移动终端技术领域，尤其是涉及一种PCB板、PCB板的制造方法和具有该PCB板的移动终端。
背景技术
随着人们对移动终端的性能要求越来越高，移动终端内部各种器件的运行速度也越来越快，各种器件的功耗也急剧增加，导致移动终端在工作时，其内部PCB板上的一些电子元件，如处理器芯片、晶体管、电阻器和电容器等，均会产生大量的热量。当热量累积时，会造成电子元件运作异常、PCB板及其上的电子元件被烧坏或者发生短路等。因此，对PCB板上的电子元件进行快速有效的散热至关重要。
发明内容
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。为此，本发明提出一种PCB板，所述PCB板通过在绝缘基体内混合导热材，可以大大提高绝缘层的导热性能，这样PCB板在工作中产生的热量可以快速的传递出去，PCB板的散热性能更好，从而提高电子元件及移动终端运行的可靠性，并且散热成本低，不用额外占用PCB板的空间。
本发明还提出一种上述PCB板的制造方法。
本发明又提出一种具有上述PCB板的移动终端。
根据本发明第一方面实施例的PCB板，包括：多层导电层，所述多层导电层依次叠置设置；绝缘层，相邻两个所述导电层之间均设有所述绝缘层，其中所述绝缘层包括绝缘基体和混合在所述绝缘基体内的导热材。
根据本发明的PCB板，通过在绝缘基体内混合导热材，可以大大提高绝缘层的导热性能，这样PCB板在工作中产生的热量可以快速的传递出去，PCB板的散热性能更好，从而提高电子元件及移动终端运行的可靠性，并且散热成本低，不会额外占用PCB板的空间。
另外，根据本发明的PCB板还可以具有如下附加技术特征：
根据本发明的一个实施例，所述PCB板设有散热孔，所述散热孔依次贯穿所述多层导电层和所述绝缘层，所述导热材填充在所述散热孔中。
根据本发明的一个实施例，所述PCB板设有散热孔，所述散热孔依次贯穿所述多层导电层和所述绝缘层，所述导热材位于所述散热孔外侧。
可选地，所述散热孔为多个且在所述PCB板上彼此间隔开设置。
可选地，多个所述散热孔均匀分布在所述PCB板上。
根据本发明的一个实施例，所述导热材以颗粒状分布在所述绝缘基体内。
可选地，所述导热材为球状。
可选地，所述导热材为多个。
可选地，多个所述导热材彼此间隔开分布在所述绝缘基体内。
可选地，多个所述导热材非均匀分布在所述绝缘基体内。
根据本发明的一个实施例，所述绝缘基体为聚丙烯基体。
根据本发明的一个实施例，所述导热材为聚苯乙烯。
根据本发明的一个实施例，所述导热材为石英玻璃。
根据本发明的一个实施例，所述导热材为环氧树脂。
根据本发明第二方面实施例的PCB板的制造方法，所述制造方法包括如下步骤：将所述绝缘基体和所述导热材料分别熔融之后进行混合，且压制成板状结构以构成所述绝缘层；在所述绝缘层的至少一个表面上涂覆金属层或金属线以构成所述导电层；将涂覆有所述导电层的所述绝缘层依次叠置并进行固定。
根据本发明的PCB板的制造方法，通过将绝缘基体和导热材分别熔融之后进行混合，且压制成板状结构以构成绝缘层，绝缘基体与导热材形成一个整体，绝缘层整体结构强度更好，制造工艺简单，并且绝缘层的导热性能更好。
根据本发明第三方面实施例的移动终端，所述PCB板为根据本发明第一方面实施例的PCB板。
根据本发明的移动终端，通过设置根据本发明第一方面实施例的PCB板，散热性能更好，运行可靠性更高。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本发明实施例的PCB板的结构示意图；
图2为图1中A处放大图。
附图标记：
PCB板100；
导电层1；
绝缘层2；绝缘基体21；导热材22；散热孔201。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
本申请基于发明人对以下事实和问题的发现和认识作出的：
相关技术中，PCB板的绝缘层通常由聚丙烯或环氧树脂材料制造而成，聚丙烯或环氧树脂材料成本低且绝缘性好，但同时其导热性能较差。为了加快电子元件的散热效率，通常需要在PCB板上设置用于对电子元件进行散热的散热装置，在PCB板上额外设置散热装置将会增大PCB板的整体体积，不利于移动终端的集中化和小型化发展，并且成本较高、散热效果差。
为此本发明提出一种PCB板100，该PCB板100散热性能好、散热成本低，并且不用额外占用PCB板100的空间。
下面参考图1-图2描述根据本发明第一方面实施例的PCB板100。根据本发明实施例的PCB板100包括：多层导电层1和绝缘层2。
多层导电层1依次叠置设置，相邻两个导电层1之间均设有绝缘层2，其中绝缘层 2包括绝缘基体21和混合在绝缘基体21内的导热材22。导热材22的材料为导热系数较高的导热材料，一般为导热系数大于或者等于10W/(m·K)的导热材料。
PCB板100的上表面上设有电子元件，以PCB板100应用在移动终端为例进行说明，当移动终端工作时，电子元件发热，电子元件中产生的热量传递给导电层1，位于上端的导电层1吸收电子元件的热量并将热量传递至位于其下层的绝缘层2，绝缘层2的绝缘基体21内混合有导热材22，热量通过导热材22快速传递至下一层的导电层1，如此继续向下传递，热量通过多层导电层1和相邻两个导电层1上的绝缘层2快速传递出去。
需要说明的是，这里所说的电子元件一般指设在PCB板100上的发热器件，例如可以为处理器芯片、电源管理芯片、晶体管、电阻器、电容器和发光二极管等。
根据本发明的PCB板100，通过在绝缘基体21中混合导热材22，可以大大提高绝缘层2的导热性能，电子元件在工作中产生的热量可以快速通过导电层1和绝缘层2传递出去，从而提高电子元件及移动终端运行的可靠性，并且散热成本低，不用额外占用PCB板100的空间。
在本发明的一些实施例中，如图1-图2中所示，导热材22以颗粒状分布在绝缘基体21内，导热材22与绝缘基体21可以更好的混合在一起，从而使得绝缘层2的导热性能更好。
可选地，如图2所示，导热材22可以为球状，且导热材22为多个，多个导热材22彼此间隔开分布在绝缘基体21内。在本发明的一个具体示例中，如图2所示，多个导热材22非均匀分布在绝缘基体21内。
在本发明的一些实施例中，绝缘基体21为聚丙烯基体，绝缘性好、成本低。
在本发明的一些实施例中，导热材22为聚苯乙烯，导热性能好，并且具有电绝缘性，导热材22在绝缘基体21内的设置更加灵活，不会对PCB板100的电路连接造成干扰。
在本发明的一些实施例中，导热材22为石英玻璃，导热性能好，并且具有电绝缘性，导热材22在绝缘基体21内的设置更加灵活，不会对PCB板100的电路连接造成干扰。
在本发明的一些实施例中，导热材22为环氧树脂，导热性能好，并且具有电绝缘性，导热材22在绝缘基体21内的设置更加灵活，不会对PCB板100的电路连接造成干扰。
在本发明的一些实施例中，PCB板100上设有散热孔201，散热孔201依次贯穿多 层导电层1和绝缘层2，散热孔201内可以填充导热材22，从而使得电子元件中产生的热量还可以通过散热孔201传递出去，散热途径更多，散热效率更高。
优选地，散热孔201为多个且在PCB板100上彼此间隔开设置，在PCB板100上设置多个散热孔201，并且每个散热孔201内填充导热材22，从而使得绝缘层2的导热性能更好。可选地，多个散热孔201均匀分布在PCB板100上。
在本发明的另一些实施例中，如图1所示，PCB板100上设有散热孔201，散热孔201依次贯穿多层导电层1和绝缘层2，导热材22位于散热孔201外侧。
下面描述根据本发明第二方面实施例的PCB板100的制造方法，所述PCB板100为上述第一方面实施例的PCB板100，制造方法包括如下步骤：将绝缘基体21和导热材22分别熔融之后进行混合，且压制成板状结构以构成绝缘层2；在绝缘层2的至少一个表面上涂覆金属层或金属线以构成导电层1；将涂覆有导电层1的绝缘层2依次叠置并进行固定。
根据本发明的PCB板100的制造方法，通过将绝缘基体21和导热材22分别熔融之后进行混合，且压制成板状结构以构成绝缘层2，绝缘基体21与导热材22形成一个整体，绝缘层2整体结构强度更好，制造工艺简单，并且绝缘层2的导热性能更好。
下面描述根据本发明第三方面实施例的移动终端，包括PCB板100，所述PCB板100为根据本发明第一方面实施例的PCB板100。
根据本发明的移动终端，通过设置根据本发明第一方面实施例的PCB板100，散热性能更好，运行可靠性更好。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (16)

  1. 一种PCB板，其特征在于，包括：
    多层导电层，所述多层导电层依次叠置设置；
    绝缘层，相邻两个所述导电层之间均设有所述绝缘层，其中所述绝缘层包括绝缘基体和混合在所述绝缘基体内的导热材。
  2. 根据权利要求1所述的PCB板，其特征在于，所述PCB板设有散热孔，所述散热孔依次贯穿所述多层导电层和所述绝缘层，所述导热材填充在所述散热孔中。
  3. 根据权利要求1所述的PCB板，其特征在于，所述PCB板设有散热孔，所述散热孔依次贯穿所述多层导电层和所述绝缘层，所述导热材位于所述散热孔外侧。
  4. 根据权利要求2或3所述的PCB板，其特征在于，所述散热孔为多个且在所述PCB板上彼此间隔开设置。
  5. 根据权利要求4所述的PCB板，其特征在于，多个所述散热孔均匀分布在所述PCB板上。
  6. 根据权利要求1所述的PCB板，其特征在于，所述导热材以颗粒状分布在所述绝缘基体内。
  7. 根据权利要求6所述的PCB板，其特征在于，所述导热材为球状。
  8. 根据权利要求6或7所述的PCB板，其特征在于，所述导热材为多个。
  9. 根据权利要求8所述的PCB板，其特征在于，多个所述导热材彼此间隔开分布在所述绝缘基体内。
  10. 根据权利要求9所述的PCB板，其特征在于，多个所述导热材非均匀分布在所述绝缘基体内。
  11. 根据权利要求1-10中任一项所述的PCB板，其特征在于，所述绝缘基体为聚丙烯基体。
  12. 根据权利要求1-11中任一项所述的PCB板，其特征在于，所述导热材为聚苯乙烯。
  13. 根据权利要求1-11中任一项所述的PCB板，其特征在于，所述导热材为石英玻璃。
  14. 根据权利要求1-11中任一项所述的PCB板，其特征在于，所述导热材为环氧树脂。
  15. 一种根据权利要求1-14中任一项所述的PCB板的制造方法，其特征在于，所 述制造方法包括如下步骤：
    将所述绝缘基体和所述导热材分别熔融之后进行混合，且压制成板状结构以构成所述绝缘层；
    在所述绝缘层的至少一个表面上涂覆金属层或金属线以构成所述导电层；
    将涂覆有所述导电层的所述绝缘层依次叠置并进行固定。
  16. 一种移动终端，其特征在于，包括根据权利要求1-14中任一项所述的PCB板。
PCT/CN2017/081722 2016-07-28 2017-04-24 Pcb板、pcb板的制造方法及移动终端 WO2018018961A1 (zh)

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