WO2018006571A1 - 风冷冰箱及其除湿方法 - Google Patents

风冷冰箱及其除湿方法 Download PDF

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Publication number
WO2018006571A1
WO2018006571A1 PCT/CN2016/113933 CN2016113933W WO2018006571A1 WO 2018006571 A1 WO2018006571 A1 WO 2018006571A1 CN 2016113933 W CN2016113933 W CN 2016113933W WO 2018006571 A1 WO2018006571 A1 WO 2018006571A1
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WIPO (PCT)
Prior art keywords
temperature
air
evaporator
cooled refrigerator
semiconductor refrigeration
Prior art date
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Ceased
Application number
PCT/CN2016/113933
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English (en)
French (fr)
Inventor
聂圣源
刘建如
姬立胜
戚斐斐
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Qingdao Haier Co Ltd
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Qingdao Haier Co Ltd
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Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Publication of WO2018006571A1 publication Critical patent/WO2018006571A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • F25D17/062—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation in household refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/04—Preventing the formation of frost or condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/003—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with respect to movable containers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects

Definitions

  • the invention relates to the technical field of refrigeration equipment, and in particular to an air-cooled refrigerator and a dehumidification method thereof.
  • the R&D personnel developed a cold refrigerator (ie, an air-cooled refrigerator) that placed the evaporator in a separate small space (ie, evaporation).
  • the cold air cooled by the evaporator is sent to the inner chamber of the tank by the blower to cool the chamber inside the tank. Since the cold air temperature is always lower than the compartment temperature, there is no frosting problem.
  • the surface of the evaporator will be frosted. As the amount of frost on the evaporator increases, the refrigeration efficiency of the intercooled refrigerator will decrease, affecting the stability of the temperature between the intercooled refrigerator compartments, and periodic defrost is required. .
  • the current defrosting method commonly used in cold refrigerators is to periodically melt the frost on the evaporator by means of electric heating. This kind of defrosting method stops the compressor during the defrosting process, and the temperature inside the box rises due to the heating effect of the electric heater, which affects the preservation of the food and causes the energy consumption of the intercooled refrigerator to be high.
  • Another object of the first aspect of the present invention is to provide an air-cooled refrigerator to minimize temperature fluctuations in the storage compartment due to defrosting of the evaporator.
  • an air-cooled refrigerator comprising:
  • a supply air duct configured to supply air cooled via the evaporator to the refrigerating compartment
  • a return air duct configured to deliver air from the refrigerating compartment to the evaporator for cooling
  • a semiconductor refrigeration assembly having a first temperature change end and a second temperature change end, the semiconductor refrigeration unit being configured to control the first temperature change end and the second temperature change end as temperature-reducing refrigeration ends and temperature rise, respectively The heating end, and the air before entering the return air passage first flows through the first temperature changing end, so that the moisture therein is condensed at the first temperature changing end.
  • the air-cooled refrigerator further includes:
  • a blower configured to be controlled to open to blow air cooled by the evaporator to the air supply duct;
  • the semiconductor refrigeration unit is configured to: when the blower is turned on, the first temperature changing end and the second temperature change end are respectively used as a temperature-reducing cooling end and a temperature-increased heating end; and when the blower is When the vehicle is shut down, the first temperature changing end and the second temperature changing end are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, so that the frost condensed at the first temperature changing end is melted.
  • the first temperature changing end is disposed at a return air outlet of the return air duct.
  • the semiconductor refrigeration component comprises:
  • a semiconductor refrigeration sheet having a first temperature change surface and a second temperature change surface
  • a first heat exchanger thermally coupled to the first temperature changing surface of the semiconductor refrigeration sheet
  • a second heat exchanger thermally coupled to the second temperature changing surface of the semiconductor refrigeration sheet
  • first temperature change surface and the first heat exchanger serve as the first temperature change end;
  • second temperature change surface and the second heat exchanger serve as the second temperature change end.
  • a return air outlet of the return air duct is disposed on a rear wall of the refrigerating compartment and adjacent to a side wall of the refrigerating compartment;
  • the semiconductor refrigeration unit is disposed on the one side wall, the first heat exchanger extends directly to the front of the air return port, and a rear end of the first heat exchanger is in contact with the air return port.
  • the air-cooled refrigerator further includes: a water receiving box for collecting defrosting water dripping from the first temperature changing end, and conveying the defrosting water to a drain port of the refrigerating compartment .
  • the second heat exchanger extends to the outside of the casing of the air-cooled refrigerator to dissipate heat of the second temperature-changing surface of the semiconductor refrigerating sheet into the surrounding environment of the air-cooled refrigerator.
  • a dehumidifying method for an air-cooled refrigerator includes: a refrigerating compartment, an evaporator, and directing air of the refrigerating compartment to the evaporator a cooled return air duct, and a semiconductor refrigeration assembly having a first temperature change end and a second temperature change end, wherein the semiconductor refrigeration unit is configured such that air entering the return air passage first flows through the first temperature change end ,
  • the dehumidifying method includes: making a first temperature changing end and a second temperature changing end of the semiconductor refrigeration component as a temperature reducing cooling end and a temperature increasing heating end, respectively, so as to flow through the air in the first temperature changing end The moisture condenses at the first temperature changing end.
  • the air-cooled refrigerator further comprises a blower for blowing air cooled by the evaporator into the refrigerating compartment
  • the dehumidifying method further includes: when the blower is turned on, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with an increased temperature.
  • the dehumidifying method further includes:
  • the first temperature changing end and the second temperature changing end of the semiconductor refrigeration component are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature, so that the first temperature changing end is condensed.
  • the frost melts.
  • the air having a relatively high humidity in the refrigerating compartment flows through the first temperature-changing end of the lower temperature of the semiconductor refrigeration component before entering the return air duct, so that the moisture therein is at the first temperature-changing end. Condensation occurs so that the air is dehumidified before entering the return air passage, and thus substantially no or only a small amount of moisture condenses on the evaporator as it flows through the evaporator, greatly reducing the amount of frost on the evaporator.
  • the air-cooled refrigerator of the present invention greatly reduces the frosting amount of the evaporator by providing the semiconductor refrigeration component, thereby substantially ensuring the refrigeration efficiency of the refrigerator on the one hand, and further prolonging the defrosting heating wire on the other hand.
  • the air-cooled refrigerator of the present invention is configured such that when the blower is turned on, the first temperature-changing end and the second temperature-changing end are respectively used as a temperature-reducing cooling end and a temperature-increased heating end, respectively.
  • the first variable temperature end of the lower temperature is used to remove the moisture in the air; and when the air supply mechanism is stopped, the first variable temperature end and the second variable temperature end are respectively used as the heating end and the temperature at which the temperature rises.
  • the lowered refrigerating end is configured to melt the frost condensed at the first temperature-changing end when the cooling of the refrigerating compartment is stopped.
  • the melted water can be discharged to the outside of the refrigerator (for example, in an evaporating dish) through the drain port of the refrigerating compartment. Since the invention defrosting the first variable temperature end in time, it can ensure that the first variable temperature end can ensure the coagulation ability to moisture during the opening of the blower, and always has a good dehumidification effect.
  • the air-cooled refrigerator of the present invention can ensure that the air in the refrigerating compartment can flow through the semi-conducting before entering the return air duct by setting the first temperature-changing end at the return air outlet of the return air duct.
  • the first temperature-changing end of the body cooling assembly has a lower temperature so that moisture therein condenses on the first temperature-changing end.
  • the temperature at the return air outlet of the return air duct is relatively high, the temperature of the first variable temperature end can be slightly lower than 0 ° C to perform dehumidification, and it is not necessary to deliberately set the temperature of the first variable temperature end too low. , causing energy waste.
  • FIG. 1 is a schematic side view of an air-cooled refrigerator in accordance with one embodiment of the present invention.
  • Figure 2 is a schematic partial front cross-sectional view of the air-cooled refrigerator of Figure 1;
  • Figure 3 is a schematic cross-sectional view taken along line A-A of Figure 1;
  • FIG. 4 is a schematic flow chart of a dehumidification method of an air-cooled refrigerator according to an embodiment of the present invention.
  • the air-cooled refrigerator 100 may generally include a case 1.
  • the case 1 may include a steel plate outer case that is open at the front side, a synthetic resin inner case that is disposed in the inner space of the outer case and has a front side opening, and foaming formed by filling and foaming in a gap between the outer case and the inner liner. Polyurethane insulation material.
  • a storage compartment for storing food or the like is formed in the casing 1. Depending on the storage temperature and use, the interior of the storage compartment is divided into a refrigerating compartment 10 and at least one other compartment. The other storage compartments may be the freezing compartment 20 or the like.
  • the air-cooled refrigerator 100 may further include a door body (not shown) for opening/closing the refrigerating compartment 10 and other storage compartments.
  • the air-cooled refrigerator 100 of the embodiment of the present invention may include a compressor (not shown), an evaporator 40, and a condenser, like the existing air-cooled refrigerator. Not shown) as well as throttling elements (not shown) and the like.
  • the evaporator 40 is connected to a compressor, a condenser, and a throttle element via a refrigerant line (not shown) to constitute a refrigeration cycle, and is cooled at the start of the compressor to cool the air flowing therethrough.
  • the air cooled via the evaporator 40 is supplied to the respective chambers to maintain the temperatures in the respective chambers within the respective set temperature ranges.
  • the air-cooled refrigerator 100 may further include a blower 30, a blower duct 11, and a return air duct 12.
  • Air supply The machine 30 is configured to be controlled to open to blow the air cooled by the evaporator 40 into the air supply duct 11.
  • the air supply duct 11 is for supplying the air cooled by the evaporator 40 to the refrigerating compartment 10, and the air that has entered the air supply duct 11 flows into the refrigerating compartment 10 via the air blowing port 111.
  • the return air duct 12 is for conveying air flowing out of the refrigerating compartment 10 to the evaporator 40 for cooling.
  • the air in the refrigerating compartment 10 enters the return air duct 12 via the return air opening 121.
  • the return air port 121 of the return air duct 12 is generally disposed on the rear wall of the refrigerating compartment 10 and adjacent to a tank side wall 101 of the air-cooled refrigerator 100 (the return air opening 121 is generally adjacent to the left side wall of the air-cooled refrigerator 100) .
  • the air cooled via the evaporator 40 enters the air supply duct 11 by the blower 30, thereby supplying a cooling amount to the refrigerating compartment 10, so that the refrigerating compartment 10 is provided.
  • the temperature inside is maintained between 0 ° C and 10 ° C; while the air in the refrigerating compartment 10 flows into the return air duct 12 to flow to the evaporator 40 for re-cooling.
  • the air-cooled refrigerator 100 may further include a semiconductor refrigeration unit 50 having a first temperature-changing end and a second temperature-changing end.
  • a semiconductor refrigeration unit 50 having a first temperature-changing end and a second temperature-changing end.
  • the semiconductor refrigeration unit 50 When the semiconductor refrigeration unit 50 is energized, the temperature of the first temperature-changing end thereof is lowered, and the temperature of the second temperature-changing end is increased.
  • the semiconductor refrigeration unit 50 When the semiconductor refrigeration unit 50 is in the opposite direction, the temperature of the first temperature changing end is increased, and the temperature of the second temperature changing end is lowered.
  • the semiconductor refrigeration unit 50 is configured to control the first temperature changing end and the second temperature changing end as the cooling end of the temperature decrease and the heating end of the temperature increase, respectively, and the air before entering the return air duct 12 flows through the first a temperature change end, so that the moisture therein is condensed at the first temperature change end. That is, the semiconductor refrigeration unit 50 is disposed such that the air whose first temperature-changing end is in the refrigerating compartment 10 flows back into the flow path of the air duct 12 so that the air before entering the return air duct 12 can flow through the first A temperature change end.
  • the semiconductor refrigeration unit 50 is configured to control the first temperature-changing end as a temperature-reduced cooling end, so that the humidity-rich air in the refrigerating compartment 10 flows through the temperature of the semiconductor refrigeration unit 50 before entering the return air duct 12.
  • a lower first temperature-changing end such that moisture therein condenses at the first temperature-changing end, so that the air has been dehumidified before entering the return air duct 12, and thus there is substantially no or only a small amount when flowing through the evaporator 40.
  • the moisture condenses on the evaporator 40, greatly reducing the amount of frost formed by the evaporator 40.
  • the refrigeration efficiency of the refrigerator can be basically ensured, on the other hand, the opening interval of the defrosting heating wire can be extended more, or the opening time of the defrosting heating wire can be shortened, or the heating power of the defrosting heating wire can be reduced, or even canceled.
  • the defrosting heats the wire, thereby reducing the overall power consumption of the refrigerator.
  • the semiconductor refrigeration assembly 50 can be configured such that its first temperature-changing end acts as a cooling end, with its second temperature-changing end always acting as a heating end.
  • the semiconductor refrigerating sheet is configured to: when the blower 30 is turned on, The first temperature-changing end and the second temperature-changing end are respectively used as a temperature-reducing cooling end and a temperature-increased heating end, so that when the refrigerating compartment 10 is cooled, the moisture in the air is removed by using the first temperature-changing end having a lower temperature. And when the blower 30 is turned off, the first temperature changing end and the second temperature changing end are respectively used as a heating end with a temperature increase and a cooling end with a lowered temperature to make the first temperature change when the cooling of the refrigerating compartment 10 is stopped. The condensation of the end of the frost melts.
  • the first temperature-changing end can be defrosted in time, thereby ensuring that the first temperature-changing end can ensure the coagulation ability to moisture during the opening of the blower 30, and always has a good dehumidification effect.
  • the first temperature varying end is disposed at the return air vent 121 of the return air duct 12 . Since the temperature at the return air port 121 of the return air duct 12 is relatively high, the temperature of the first temperature change end can be slightly lower than 0 ° C to perform dehumidification without deliberately setting the temperature of the first temperature change end too low. , causing energy waste. In some embodiments, the temperature of the first temperature-varying end may be set below 0 ° C, for example, may be set within a temperature range of not lower than -30 ° C and not higher than 0 ° C.
  • the first temperature-changing end The temperature can be set below 0 ° C and close to 0 ° C, for example between -1 ° C and -5 ° C, such as -1 ° C, -2 ° C, -3.5 ° C, -5 ° C, and the like.
  • Figure 2 is a schematic partial front cross-sectional view of the air-cooled refrigerator 100 of Figure 1;
  • Figure 3 is a schematic cross-sectional view taken along line A-A of Figure 1.
  • the semiconductor refrigeration assembly 50 includes a semiconductor refrigeration sheet 51 having a first temperature change surface and a second temperature change surface.
  • the first temperature changing end and the second temperature changing end may be a first temperature changing surface and a second temperature changing surface which may be the semiconductor cooling sheet 51, respectively.
  • the semiconductor refrigeration assembly 50 further includes: a first heat exchanger 54 thermally coupled to the first temperature-changing surface of the semiconductor refrigeration sheet 51; and a second heat thermally coupled to the second temperature-changing surface of the semiconductor refrigeration sheet 51 Switch 55.
  • the first heat exchanger 54 and the first temperature changing surface serve as a first temperature changing end; the second heat exchanger 55 and the second temperature changing surface serve as a second temperature changing end.
  • the first heat exchanger 54 and the second heat exchanger 55 may be disposed directly on the first temperature changing surface and the second temperature changing surface, respectively, or may also pass through the first heat conducting block 52 and the second heat conducting block 53 and the first temperature changing surface, respectively. Connected to the second temperature changing surface.
  • the first heat exchanger 54 and the second heat exchanger 55 are connected to the first temperature changing surface and the second temperature changing surface through the first heat conducting block 52 and the second heat conducting block 53, respectively, the first heat exchanger 54,
  • the first heat conducting block 52 and the first temperature changing surface serve as a first temperature changing end;
  • the second heat exchanger 55, the second heat conducting block 53 and the second temperature changing surface serve as a second temperature changing end.
  • the first heat exchanger 54 and the second heat exchanger 55 may specifically have a structure of heat dissipating fins to increase a heat exchange area.
  • the semiconductor refrigeration unit 50 is disposed in a cabinet adjacent to the return air port 121 of the air-cooled refrigerator 100 On the side wall 101.
  • the semiconductor refrigerating sheet 51 may be disposed inside the casing side wall 101, the first heat exchanger 54 extends to the front of the return air opening 121, and the rear end of the first heat exchanger 54 is in contact with the return air opening 121.
  • the second heat exchanger 55 extends to the outside of the tank side wall 101 of the air-cooled refrigerator 100 to dissipate heat of the second temperature-changing surface of the semiconductor refrigerating sheet 51 to the surrounding environment of the air-cooled refrigerator 100.
  • the air-cooled refrigerator 100 may further include a water receiving box 60 for collecting defrosted water dripping from the first temperature changing end.
  • the water receiving box 60 can communicate with the drain port of the refrigerating compartment 10 through a pipeline to transport the defrosted water to the drain port and flow to the evaporating dish via the drain pipe of the air-cooled refrigerator 100 (Fig. Not shown in the middle).
  • the embodiment of the present invention further provides a dehumidification method of the air-cooled refrigerator 100 in any of the above embodiments.
  • the air-cooled refrigerator 100 may include: a refrigerating compartment 10, an evaporator 40, a return air duct 12 that guides air of the refrigerating compartment 10 to the evaporator 40 for cooling, and a semiconductor having a first temperature changing end and a second temperature changing end
  • the refrigeration assembly 50 wherein the semiconductor refrigeration assembly 50 is configured such that air entering the return air duct 12 first flows through the first temperature change end.
  • the dehumidification method may include: making the first temperature-changing end and the second temperature-changing end of the semiconductor refrigeration component 50 as a temperature-reducing refrigeration end and a temperature-increased heating end, respectively, so that moisture in the air flowing through the first temperature-varying end is The first temperature changing end is condensed.
  • the air-cooled refrigerator 100 further includes a blower 30 for blowing air cooled by the evaporator 40 into the refrigerating compartment 10. As shown in FIG. 4, in some preferred embodiments, the method can include steps S402 through S408.
  • step S402 the blower 30 is turned on. At this time, the compressor is normally turned on, and the temperature of the evaporator 40 is lowered to cool the air flowing therethrough.
  • the air cooled by the evaporator 40 flows to the blower duct 11 by the blower 30, flows into the refrigerating compartment 10 through the air outlet to cool the refrigerating compartment 10, and at the same time, the air in the refrigerating compartment 10 passes through the return duct.
  • 121 flows into the return air duct 12 and then flows to the evaporator 40 for cooling.
  • Step S404 when the blower 30 is turned on, the first temperature changing end and the second temperature changing end are respectively used as a cooling end with a lowered temperature and a heating end with a raised temperature.
  • the air in the refrigerating compartment 10 flows through the first temperature changing end, the moisture therein is condensed, so that the air in the refrigerating compartment 10 is dried, and then flows into the return air duct 12 to flow to the evaporation. Cooling is performed at the unit 40.
  • step S406 the blower 30 is turned off. After the refrigerating compartment 10 is completely cooled, that is, the temperature in the refrigerating compartment 10 reaches a preset temperature, the blower 30 is turned off. At this point, the compressor is normally shut down.
  • Step S408 the first temperature changing end and the second temperature changing end are respectively used as a heating end with a rising temperature and a cooling end with a lowered temperature. At this time, the frost condensed at the first temperature-changing end melts due to an increase in temperature of the first temperature-changing end.
  • the energization of the semiconductor refrigerating sheet 51 may be stopped after the frost at the first temperature changing end is completely melted.
  • the semiconductor cooling fins 51 are stopped from being energized.
  • the semiconductor refrigerating sheet 51 is energized again, so that the first temperature changing end and the second temperature changing end serve as a cooling end with a lowered temperature and a heating end with a raised temperature, respectively.
  • air-cooled refrigerator is not limited to an air-cooled refrigerator having a refrigerating compartment and a freezing compartment and storing food in a general sense, and may also have other refrigeration functions.
  • Devices such as wine coolers, refrigerated cans, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
  • Defrosting Systems (AREA)

Abstract

一种风冷冰箱（100）及其除湿方法。该风冷冰箱（100）包括：箱体（1），其内限定形成有冷藏间室（10）；蒸发器（40），其对流经其的空气进行冷却；送风风道（11），配置成将经由蒸发器（40）冷却的空气向冷藏间室（10）供应；回风风道（12），配置成将来自冷藏间室（10）的空气输送至蒸发器（40）处进行冷却；以及具有第一变温端和第二变温端的半导体制冷组件（50），半导体制冷组件（50）配置成受控地使第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，且使进入回风风道（12）之前的空气先流经第一变温端，以使其中的水分在第一变温端凝结。由于冷藏间室（10）中湿度较大的空气在进入回风风道（12）之前，其中的水分在第一变温端发生凝结，从而使得空气在进入回风风道（12）之前已被除湿，大大减少了蒸发器（40）的结霜量。

Description

风冷冰箱及其除湿方法 技术领域
本发明涉及制冷设备技术领域，特别是涉及一种风冷冰箱及其除湿方法。
背景技术
直冷冰箱在使用一段时间后会出现箱内间室结霜现象，为解决这个问题，研发人员开发出间冷冰箱(即风冷冰箱)，其将蒸发器放置在一独立小空间(即蒸发器室)内，通过送风机向箱内间室输送经蒸发器冷却的冷气以使箱内间室冷却。由于冷气温度始终低于间室温度，所以不存在结霜问题。但是间冷冰箱使用一段时间蒸发器表面会结霜，随着蒸发器上结霜量的增多，会导致间冷冰箱制冷效率下降，影响间冷冰箱间室温度的稳定性，需要定期进行除霜。目前间冷冰箱常用的除霜方法是采用电加热的方式定期融化蒸发器上的结霜。这种除霜方式在除霜过程中压缩机停止工作，而且由于电加热器的加热作用，箱体内温度会上升，既影响食品保存，又导致间冷冰箱的能耗高。
发明内容
本发明第一方面的一个目的是要克服现有技术存在的至少一个缺陷，提供一种可减少蒸发器结霜或基本实现蒸发器无霜运行的风冷冰箱。
本发明第一方面的另一个的目的是要提供一种风冷冰箱，以尽量避免由于蒸发器除霜导致储物间室温度波动。
本发明第二方面的一个目的是要提供一种风冷冰箱的除湿方法，以减少蒸发器结霜或基本实现蒸发器无霜运行。
按照本发明的第一方面，提供了一种风冷冰箱，包括：
箱体，其内限定形成有冷藏间室；
蒸发器，其流经其的空气进行冷却；
送风风道，配置成将经由所述蒸发器冷却的空气向所述冷藏间室供应；
回风风道，配置成将来自所述冷藏间室的空气输送至所述蒸发器处进行冷却；以及
具有第一变温端和第二变温端的半导体制冷组件，所述半导体制冷组件配置成受控地使所述第一变温端和所述第二变温端分别作为温度降低的制冷端和温度升高的制热端，且使进入所述回风风道之前的空气先流经所述第一变温端，以使其中的水分在所述第一变温端凝结。
可选地，所述风冷冰箱，还包括：
送风机，配置成受控地开启，以将经所述蒸发器冷却后的空气向所述送风风道中吹送；
所述半导体制冷组件配置成：当所述送风机开启时，使所述第一变温端和所述第二变温端分别作为温度降低的制冷端和温度升高的制热端；且当所述送风机关停时，使所述第一变温端和所述第二变温端分别作为温度升高的制热端和温度降低的制冷端，以使所述第一变温端凝结的霜融化。
可选地，所述第一变温端设置在所述回风风道的回风口处。
可选地，其中所述半导体制冷组件包括：
具有第一变温表面和第二变温表面的半导体制冷片；
与半导体制冷片的第一变温表面热连接的第一热交换器；以及
与半导体制冷片的第二变温表面热连接的第二热交换器；
其中所述第一变温表面和所述第一热交换器作为所述第一变温端；所述第二变温表面和所述第二热交换器作为所述第二变温端。
可选地，所述回风风道的回风口设置在所述冷藏间室的后壁上，且邻近所述冷藏间室的一个侧壁；
所述半导体制冷组件设置在所述一个侧壁上，所述第一热交换器延伸至所述回风口的正前方，且所述第一热交换器的后端与所述回风口相接。
可选地，所述风冷冰箱还包括：接水盒，用于收集从所述第一变温端滴落的化霜水，且将所述化霜水输送至所述冷藏间室的排水口。
可选地，所述第二热交换器延伸至所述风冷冰箱的箱体外部，以将所述半导体制冷片的第二变温表面的热量散发到所述风冷冰箱的周围环境中。
按照本发明的第二方面，提供了一种风冷冰箱的除湿方法，其中所述风冷冰箱包括：冷藏间室、蒸发器、将所述冷藏间室的空气引至所述蒸发器处进行冷却的回风风道，以及具有第一变温端和第二变温端的半导体制冷组件，其中所述半导体制冷组件配置成使得进入所述回风风道之前的空气先流经所述第一变温端，
所述除湿方法包括：使所述半导体制冷组件的第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，以使流经所述第一变温端的空气中的水分在所述第一变温端凝结。
可选地，其中所述风冷冰箱还包括用于将经所述蒸发器冷却后的空气向所述冷藏间室中吹送的送风机，
所述除湿方法还包括：当所述送风机开启时，使所述第一变温端和所述第二变温端分别作为温度降低的制冷端和温度升高的制热端。
可选地，所述除湿方法，还包括：
当所述送风机关停时，使所述半导体制冷组件的第一变温端和第二变温端分别作为温度升高的制热端和温度降低的制冷端，以使所述第一变温端凝结的霜融化。
本发明的风冷冰箱，由于冷藏间室中湿度较大的空气在进入回风风道之前，先流经半导体制冷组件温度较低的第一变温端，以使其中的水分在第一变温端发生凝结，从而使得空气在进入回风风道之前已被除湿，进而在流经蒸发器时基本没有或仅有少量水分凝结在蒸发器上，大大减少了蒸发器的结霜量。
进一步地，本发明的风冷冰箱，由于设置了半导体制冷组件而大大减少了蒸发器的结霜量，从而一方面可基本保证冰箱的制冷效率，另一方面能够较多地延长化霜加热丝的开启间隔、或缩短化霜加热丝的开启时间、或减少化霜加热丝的加热功率、甚至取消化霜加热丝，从而整体上降低冰箱的耗电量。
进一步地，本发明的风冷冰箱，通过将半导体制冷片配置成在送风机开启时，使第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，以在冷藏间室制冷时，利用温度较低的第一变温端将空气中的水分去除；而当送风机关停时，使第一变温端和第二变温端分别作为温度升高的制热端和温度降低的制冷端，以在停止对冷藏间室制冷时，使第一变温端凝结的霜融化。融化的水可经由冷藏间室的排水口排至冰箱外部(例如蒸发皿中)。由于本发明及时对第一变温端进行化霜，从而可保证第一变温端在送风机开启期间，能够保证对水分的凝结能力，始终具有较好的除湿作用。
进一步地，本发明的风冷冰箱，通过将第一变温端设置在回风风道的回风口处，从而可保证冷藏间室中的空气在进入回风风道之前，可先流经半导 体制冷组件温度较低的第一变温端，以使其中的水分在第一变温端上发生凝结。同时，由于回风风道的回风口处的温度相对较高，也可使第一变温端的温度稍微低于0℃即可起到除湿作用，而不必刻意将第一变温端的温度设置得太低，造成能源浪费。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的风冷冰箱的示意性侧视图；
图2是图1所示风冷冰箱的示意性局部前视剖视图；
图3是沿图1中的剖切线A-A截取的示意性剖视图；
图4是根据本发明一个实施例的风冷冰箱的除湿方法的示意性流程图。
具体实施方式
图1是根据本发明一个实施例的风冷冰箱100的示意性侧视图。风冷冰箱100一般性地可包括箱体1。箱体1可包括前侧开口的钢板制外壳、设置在外壳的内部空间中且前侧开口的合成树脂制内胆、以及在外壳与内胆之间的间隙中进行充填发泡形成的发泡聚氨酯制隔热材料。箱体1内形成用于贮藏食品等的储物间室。根据保存温度及用途，储物间室的内部分隔为冷藏间室10和至少一个其他收纳间室。其他收纳间室可为冷冻间室20等。风冷冰箱100还可包括用于打开/关闭冷藏间室10和其他收纳间室的门体(图中未示出)。
如本领域技术人员可意识到的，本发明实施例的风冷冰箱100与现有的风冷冰箱一样，还可包括压缩机(图中未示出)、蒸发器40、冷凝器(图中未示出)以及节流元件(图中未示出)等。蒸发器40经由制冷剂管路(图中未示出)与压缩机、冷凝器、节流元件连接，构成制冷循环回路，在压缩机启动时降温，以对流经其的空气进行冷却。经由蒸发器40冷却后的空气被供应至各间室中，以使各间室内的温度保持在相应的设定温度范围内。
风冷冰箱100还可包括送风机30、送风风道11以及回风风道12。送风 机30配置成受控地开启，以将经蒸发器40冷却后的空气向送风风道11中吹送。送风风道11用于向冷藏间室10供应经由蒸发器40冷却的空气，进入送风风道11中的空气经由送风口111流入冷藏间室10中。回风风道12用于将从冷藏间室10流出的空气输送至蒸发器40处进行冷却。冷藏间室10中的空气经由回风口121进入回风风道12中。回风风道12的回风口121通常设置在冷藏间室10的后壁上，且邻近风冷冰箱100的一个箱体侧壁101(回风口121通常邻近风冷冰箱100的左侧侧壁)。
在本发明实施例的风冷冰箱100中，在送风机30的作用下，经由蒸发器40冷却的空气进入送风风道11中，从而向冷藏间室10提供冷量，以使冷藏间室10内的温度保持在0℃～10℃之间；同时冷藏间室10中的空气流入回风风道12中，以便流至蒸发器40处进行再次冷却。
特别地，风冷冰箱100还可包括半导体制冷组件50，其具有第一变温端和第二变温端，当半导体制冷组件50通电时，其第一变温端温度降低，且第二变温端温度升高；当半导体制冷组件50通相反方向的电流时，第一变温端温度升高，且第二变温端温度降低。
半导体制冷组件50配置成受控地使第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，且使进入回风风道12之前的空气先流经第一变温端，以使其中的水分在第一变温端凝结。也就是说，半导体制冷组件50设置成使其第一变温端处于冷藏间室10中的空气流回回风风道12的流路中，以使进入回风风道12之前的空气可流经第一变温端。半导体制冷组件50配置成受控地使第一变温端作为温度降低的制冷端，从而使得冷藏间室10中湿度较大的空气在进入回风风道12之前，先流经半导体制冷组件50温度较低的第一变温端，以使其中的水分在第一变温端发生凝结，从而使得空气在进入回风风道12之前已被除湿，进而在流经蒸发器40时基本没有或仅有少量的水分凝结在蒸发器40上，大大减少了蒸发器40的结霜量。这样，一方面可基本保证冰箱的制冷效率，另一方面能够较多地延长化霜加热丝的开启间隔、或缩短化霜加热丝的开启时间、或减少化霜加热丝的加热功率、甚至取消化霜加热丝，从而整体上降低冰箱的耗电量。
在一些可选的实施例中，半导体制冷组件50可配置成使其第一变温端一直作为制冷端，使其第二变温端一直作为制热端。
在本发明的一些实施例中，半导体制冷片配置成：当送风机30开启时， 使第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，以在冷藏间室10制冷时，利用温度较低的第一变温端将空气中的水分去除；且当送风机30关停时，使第一变温端和第二变温端分别作为温度升高的制热端和温度降低的制冷端，以在停止对冷藏间室10制冷时，使第一变温端凝结的霜融化。本发明实施例可及时对第一变温端进行化霜，从而可保证第一变温端在送风机30开启期间，能够保证对水分的凝结能力，始终具有较好的除湿作用。
在一些实施例中，第一变温端设置在回风风道12的回风口121处。由于回风风道12的回风口121处的温度相对较高，也可使第一变温端的温度稍微低于0℃即可起到除湿作用，而不必刻意将第一变温端的温度设置得太低，造成能源浪费。在一些实施例中，第一变温端的温度可设置在0℃以下，例如可设置在不低于-30℃且不高于0℃的温度范围内，在进一步的实施例中，第一变温端的温度可设置成低于0℃且接近0℃，例如设置在-1℃～-5℃之间，如-1℃、-2℃、-3.5℃、-5℃等。
图2是图1所示风冷冰箱100的示意性局部前视剖视图；图3是沿图1中的剖切线A-A截取的示意性剖视图。参见图2和图3，在一些实施例中，半导体制冷组件50包括：具有第一变温表面和第二变温表面的半导体制冷片51。第一变温端和第二变温端可以分别为可以是半导体制冷片51的第一变温表面和第二变温表面。
在一些实施例中，半导体制冷组件50还包括：与半导体制冷片51的第一变温表面热连接的第一热交换器54；以及与半导体制冷片51的第二变温表面热连接的第二热交换器55。其中第一热交换器54和第一变温表面作为第一变温端；第二热交换器55和第二变温表面作为第二变温端。第一热交换器54和第二热交换器55可以分别直接设置在第一变温表面和第二变温表面上，或者也可分别通过第一导热块52和第二导热块53与第一变温表面和第二变温表面连接。在第一热交换器54和第二热交换器55分别通过第一导热块52和第二导热块53与第一变温表面和第二变温表面连接的实施例中，第一热交换器54、第一导热块52和第一变温表面作为第一变温端；第二热交换器55、第二导热块53和第二变温表面作为第二变温端。第一热交换器54和第二热交换器55具体可具有散热翅片的结构，以增大热交换面积。
半导体制冷组件50设置在风冷冰箱100的邻近回风口121的一个箱体 侧壁101上。其中半导体制冷片51可设置在箱体侧壁101内部，第一热交换器54延伸至回风口121的正前方，且第一热交换器54的后端与回风口121相接。第二热交换器55延伸至风冷冰箱100的箱体侧壁101外部，以将半导体制冷片51的第二变温表面的热量散发到风冷冰箱100的周围环境中。
在一些实施例中，风冷冰箱100还可包括接水盒60，用于收集从第一变温端滴落的化霜水。在一些实施例中，该接水盒60可通过管路与冷藏间室10的排水口连通，以将化霜水输送至排水口，并经由风冷冰箱100的排水管流至蒸发皿(图中未示出)中。
特别地，本发明实施例还提供了上述任一实施例中的风冷冰箱100的除湿方法。风冷冰箱100可包括：冷藏间室10、蒸发器40、将冷藏间室10的空气引至蒸发器40处进行冷却的回风风道12，以及具有第一变温端和第二变温端的半导体制冷组件50，其中半导体制冷组件50配置成使得进入回风风道12之前的空气先流经第一变温端。该除湿方法可包括：使半导体制冷组件50的第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，以使流经第一变温端的空气中的水分在第一变温端凝结。
图4是根据本发明一个实施例的风冷冰箱100的除湿方法的示意性流程图。其中风冷冰箱100还包括用于将经蒸发器40冷却后的空气向冷藏间室10中吹送的送风机30。如图4所示，在一些优选的实施例中，该方法可包括步骤S402至步骤S408。
步骤S402，开启送风机30。此时，压缩机通常处于开启状态，蒸发器40的温度降低，以对流经其的空气进行冷却。经由蒸发器40冷却的空气在送风机30作用下流向送风风道11，经由出风口流入冷藏间室10中，以对冷藏间室10进行制冷；同时，冷藏间室10中的空气经由回风口121流入回风风道12中，并进而流至蒸发器40处进行冷却。
步骤S404，当送风机30开启时，使第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端。此时，冷藏间室10中的空气在流经第一变温端时，其中的水分发生凝结，从而使得冷藏间室10中的空气得到干燥，之后再流入回风风道12中进而流至蒸发器40处进行冷却。
步骤S406，关停送风机30。当对冷藏间室10完成制冷后，即冷藏间室10内的温度达到预设温度后，关闭送风机30。此时，压缩机通常处于关停状态。
步骤S408，使第一变温端和第二变温端分别作为温度升高的制热端和温度降低的制冷端。此时，凝结在第一变温端的霜由于第一变温端温度升高而融化。
在一些实施例中，可在第一变温端的霜融化完全后，停止对半导体制冷片51通电。例如在使第一变温端和第二变温端分别作为温度升高的制热端和温度降低的制冷端后的预设时间后，停止对半导体制冷片51通电。而在送风机30再次开启时，再次向半导体制冷片51通电，以使第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端。
本领域技术人员应理解，本发明所称的“风冷冰箱”并不限定为一般意义上的具有冷藏间室和冷冻间室且用于存储食物的风冷冰箱，还可以是其他具有冷藏功能的装置，例如酒柜、冷藏罐等。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种风冷冰箱，包括：
    箱体，其内限定形成有冷藏间室；
    蒸发器，其对流经其的空气进行冷却；
    送风风道，配置成将经由所述蒸发器冷却的空气向所述冷藏间室供应；
    回风风道，配置成将来自所述冷藏间室的空气输送至所述蒸发器处进行冷却；以及
    具有第一变温端和第二变温端的半导体制冷组件，所述半导体制冷组件配置成受控地使所述第一变温端和所述第二变温端分别作为温度降低的制冷端和温度升高的制热端，且使进入所述回风风道之前的空气先流经所述第一变温端，以使其中的水分在所述第一变温端凝结。
  2. 根据权利要求1所述的风冷冰箱，还包括：
    送风机，配置成受控地开启，以将经所述蒸发器冷却后的空气向所述送风风道中吹送；
    所述半导体制冷组件配置成：当所述送风机开启时，使所述第一变温端和所述第二变温端分别作为温度降低的制冷端和温度升高的制热端；且当所述送风机关停时，使所述第一变温端和所述第二变温端分别作为温度升高的制热端和温度降低的制冷端，以使所述第一变温端凝结的霜融化。
  3. 根据权利要求2所述的风冷冰箱，其中
    所述第一变温端设置在所述回风风道的回风口处。
  4. 根据权利要求3所述的风冷冰箱，其中所述半导体制冷组件包括：
    具有第一变温表面和第二变温表面的半导体制冷片；
    与半导体制冷片的第一变温表面热连接的第一热交换器；以及
    与半导体制冷片的第二变温表面热连接的第二热交换器；
    其中所述第一变温表面和所述第一热交换器作为所述第一变温端；所述第二变温表面和所述第二热交换器作为所述第二变温端。
  5. 根据权利要求4所述的风冷冰箱，其中
    所述回风风道的回风口设置在所述冷藏间室的后壁上，且邻近所述冷藏间室的一个侧壁；
    所述半导体制冷组件设置在所述一个侧壁上，所述第一热交换器延伸至所述回风口的正前方，且所述第一热交换器的后端与所述回风口相接。
  6. 根据权利要求5所述的风冷冰箱，还包括：
    接水盒，用于收集从所述第一变温端滴落的化霜水，且将所述化霜水输送至所述冷藏间室的排水口。
  7. 根据权利要求5所述的风冷冰箱，其中
    所述第二热交换器延伸至所述风冷冰箱的箱体外部，以将所述半导体制冷片的第二变温表面的热量散发到所述风冷冰箱的周围环境中。
  8. 一种风冷冰箱的除湿方法，其中所述风冷冰箱包括：冷藏间室、蒸发器、将所述冷藏间室的空气引至所述蒸发器处进行冷却的回风风道，以及具有第一变温端和第二变温端的半导体制冷组件，其中所述半导体制冷组件配置成使得进入所述回风风道之前的空气先流经所述第一变温端，
    所述除湿方法包括：使所述半导体制冷组件的第一变温端和第二变温端分别作为温度降低的制冷端和温度升高的制热端，以使流经所述第一变温端的空气中的水分在所述第一变温端凝结。
  9. 根据权利要求8所述的除湿方法，其中所述风冷冰箱还包括用于将经所述蒸发器冷却后的空气向所述冷藏间室中吹送的送风机，
    所述除湿方法还包括：当所述送风机开启时，使所述第一变温端和所述第二变温端分别作为温度降低的制冷端和温度升高的制热端。
  10. 根据权利要求9所述的除湿方法，还包括：
    当所述送风机关停时，使所述半导体制冷组件的第一变温端和第二变温端分别作为温度升高的制热端和温度降低的制冷端，以使所述第一变温端凝结的霜融化。
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