WO2017219637A1 - 硅胶振膜及其制备方法、发声部件 - Google Patents

硅胶振膜及其制备方法、发声部件 Download PDF

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Publication number
WO2017219637A1
WO2017219637A1 PCT/CN2016/112964 CN2016112964W WO2017219637A1 WO 2017219637 A1 WO2017219637 A1 WO 2017219637A1 CN 2016112964 W CN2016112964 W CN 2016112964W WO 2017219637 A1 WO2017219637 A1 WO 2017219637A1
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Prior art keywords
silica gel
diaphragm
gel diaphragm
thickness
cavity
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PCT/CN2016/112964
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English (en)
French (fr)
Inventor
许彩霞
陈春元
孙金永
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深圳市摩码克来沃化学科技有限公司
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Publication of WO2017219637A1 publication Critical patent/WO2017219637A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

Definitions

  • the invention relates to the technical field of loudspeakers, in particular to a silica gel diaphragm, a preparation method of the silica gel diaphragm and a sound emitting component using the silica gel diaphragm.
  • a speaker is an important component of a portable electronic device for converting an acoustic electric signal into a sound signal, and is a signal conversion device.
  • the diaphragm is one of the key components of whether the speaker can have good quality.
  • the so-called diaphragm is actually a component that is sensitive to changes in the magnetic field.
  • the electrical signal passes through the coil, the magnetic field changes, causing the diaphragm to be deformed by force.
  • the electrical signal changes rapidly, causing the diaphragm to vibrate at high speed, and then transmits the vibration to the air through the vibration of the diaphragm, thereby generating sound waves.
  • the quality of the diaphragm determines the overall quality of the speaker.
  • the diaphragm of the existing speaker is made of polyetheretherketone and silica gel.
  • the polyetheretherketone diaphragm has poor rigidity, and the weak rigidity causes high-speed micro-motion (when working in high frequency range), the kinetic energy emitted by the voice coil cannot be completely and consistently transmitted to the entire diaphragm, although it has good damping. Sex, but after all, it is impossible to make a perfect piston movement, so the distortion rate is relatively improved. There will be obvious problem of poor resolution and lack of dynamics in the sense of hearing. The intermediate frequency to the intermediate frequency is also prone to sluggishness and poor connection.
  • the diaphragm has poor heat resistance and poor high frequency stability.
  • the silicone diaphragm speaker has good sound effect, is not easy to be distorted, and is stable and durable.
  • the existing silica gel parts are usually obtained by injection molding, that is, liquid silicone gel is injected into the mold, the silica gel is subjected to a curing reaction, and the solidified silica gel is cooled and formed.
  • the preparation method has the disadvantages of complicated process, high cost, low efficiency, unstable process, and difficulty in large-scale preparation.
  • the thickness of the existing diaphragm is uniform, resulting in poor fidelity of the diaphragm at a large volume, and it is difficult to satisfy the consumer's requirement for sound quality.
  • the present invention provides a silica gel diaphragm which is simple in forming and excellent in fidelity effect.
  • the invention provides a silica gel diaphragm having a thickness of 8 to 350 ⁇ m and a thickness of the silica gel diaphragm being non-uniform.
  • the silica gel diaphragm is further formed with a protrusion having a thickness of 8 to 350 ⁇ m.
  • the invention also provides a preparation method of a silica gel diaphragm, the preparation method comprising:
  • the silica gel film is continuously introduced into the cavity of the molding machine, and the thickness of the cavity is not uniform;
  • the silica gel diaphragm is taken out, and the thickness of the silica gel diaphragm is not uniform.
  • the molding machine comprises an upper and lower mold or a left and right mold, and the temperature of the upper and lower molds or the left and right molds is 70 ° C to 200 ° C.
  • the temperature of the upper and lower or left and right molds is from 150 ° C to 180 ° C.
  • the temperature of the upper and lower or left and right molds is 155 ° C to 170 ° C.
  • the molding pressure is 0.01 MPa or more, and the pressure holding time is less than 20 minutes.
  • the molding pressure is 20 to 21 MPa, and the pressure holding time is 1 to 2 minutes.
  • the invention also provides a sound producing component comprising the silica gel diaphragm.
  • the sound emitting component comprises a cavity in which the silicone diaphragm is located.
  • the beneficial effects of the present invention are: a silica gel diaphragm having a non-uniform thickness by using a secondary molding method, which has a good effect of expressing different audio.
  • the sounding component using the silicone diaphragm of which the thickness is not uniform has a better fidelity effect on different audios.
  • FIG. 1 is a schematic view showing a method of processing a silica gel diaphragm of the present invention.
  • Figure 2 is a cross-sectional view showing a silicone diaphragm of the present invention.
  • Figure 3 is a schematic view showing the structure of the sound emitting member of the present invention.
  • first, second, and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the technical solutions between the various embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the combination of the technical solutions is contradictory or impossible to implement, it should be considered that the combination of the technical solutions does not exist. It is also within the scope of protection required by the present invention.
  • the present invention provides a method of preparing a silica gel diaphragm.
  • Step 1 The preparation method of the silica gel membrane comprises the following steps:
  • Step 2 providing a silicone film 4
  • Step 3 The silica gel film 4 is continuously introduced into the cavity 31 of the molding machine 3, and the thickness of the cavity 31 is not uniform;
  • Step 4 Close the mold and control the mold temperature
  • Step 5 adjusting the molding pressure and holding the pressure for a period of time, thereby realizing the secondary molding of the silicone film 4;
  • Step 6 After the molding, the silica gel membrane 1 is taken out, and the thickness of the silica gel membrane 1 is not uniform.
  • the silica gel film used in the embodiment of the present invention is a substrate-free silica gel film.
  • the method for preparing the silica gel diaphragm used in the embodiment of the present invention is to perform secondary molding by using a substrate-free silicone film which has been initially formed. Methods.
  • the molding machine 3 includes upper and lower molds or left and right molds (not shown). During the molding process, when the molding machine 3 is closed, the temperature of the upper and lower molds or the left and right molds is 70 ° C to 200 ° C.
  • the temperature of the upper and lower or left and right molds is from 150 ° C to 180 ° C.
  • the temperature of the upper and lower or left and right molds is 155 ° C to 170 ° C.
  • the silica gel film 4 is introduced into the cavity 31 of the molding press 3 in a continuous manner to keep the silicone film 4 flat in the cavity 31.
  • the molding machine 3 includes a plurality of cavities 31.
  • the silicone molds 4 are introduced into the plurality of cavities 31 of the molding machine 3 in a continuous manner, the silicone molds 4 are arranged side by side. The cavity 31 is covered, and the silicone film 4 is kept flat in the plurality of cavities 31.
  • the molding pressure is 0.01 MPa or more. Preferably, the molding pressure is 20 to 21 MPa.
  • the dwell time is less than 20 minutes. Preferably, the dwell time is 1 to 2 minutes.
  • a plurality of silica gel diaphragms 1 can be produced in one molding process, thereby improving the production efficiency of the silica gel diaphragm 1.
  • the silica gel diaphragm 1 of the present invention has a simple manufacturing method, convenient molding, and large-scale preparation, thereby saving production time and cost. Further, the thickness of the obtained silica gel membrane 1 is not uniform, and the thickness of the silica gel membrane 1 is 8 to 350 ⁇ m.
  • the silica gel diaphragm 1 may be a continuous film having a non-uniform thickness, and the thickness of different regions of the silica gel diaphragm 1 may be inconsistent. Compared with a general sounding component, the sounding component using the silicone diaphragm of which the thickness is not uniform has a better fidelity effect on different audios.
  • a continuous silicone diaphragm 1 having a non-uniform thickness can be obtained by providing the internal structure of the cavity 31. It can be understood that, by providing the internal structure of the cavity 31, a protrusion 11 (refer to FIG. 3) is further formed on the surface of the silica gel diaphragm 1, and the protrusion 11 is integrally formed with the silica gel membrane 1. .
  • the thickness of the protrusion 11 is 8 to 350 ⁇ m. It is to be understood that the surface of the silica gel diaphragm 1 may not form the protrusions 11.
  • the thickness of the silicone diaphragm 1 and the projection 11 is adjusted by adjusting the internal structure of the cavity 31.
  • This embodiment provides a method for preparing a silica gel diaphragm, which comprises the following steps in sequence:
  • Step 1 providing a formed silicone film 4
  • Step 2 introducing the formed silicone film 4 into the cavity 31 of the molding machine 3 in a continuous manner, so that the silicone film 4 is kept flat in the cavity 31;
  • Step 3 clamping the mold up and down or left and right, controlling the temperature of the upper and lower molds or the left and right molds is 155 ° C;
  • Step 4 adjusting the molding pressure to 20 MPa
  • Step 5 Hold pressure for 1 minute
  • Step 6 Molding and taking out, a silica gel diaphragm 11 was prepared.
  • the silicone film 1 after the overmolding can be fixed to the sounding member 2 of the electronic speaker. Further, the processed silicone diaphragm 1 can be fixed in the cavity of the sounding part 2 of the electronic speaker.
  • This embodiment provides a method for preparing a silica gel diaphragm, which comprises the following steps in sequence:
  • Step 1 providing a formed silicone film 4
  • Step 2 introducing the formed silicone film 4 into the cavity 31 of the molding machine 3 in a continuous manner, so that the silicone film 4 is kept flat in the cavity 31;
  • Step 3 clamping the mold up and down or left and right, controlling the temperature of the upper and lower molds or the left and right molds is 160 ° C;
  • Step 4 adjusting the molding pressure to 21 MPa
  • Step 5 Hold pressure for 1 minute
  • Step 6 Molding and taking out, a silica gel membrane 1 was prepared.
  • the silicone film 1 after the overmolding can be fixed to the sounding member 2 of the electronic speaker. Further, the processed silicone diaphragm 1 can be fixed in the cavity of the sounding part 2 of the electronic speaker.
  • This embodiment provides a method for preparing a silica gel diaphragm, which comprises the following steps in sequence:
  • Step 1 providing a formed silicone film 4
  • Step 2 introducing the formed silicone film 4 into the cavity 31 of the molding machine 3 in a continuous manner, so that the silicone film 4 is kept flat in the cavity 31;
  • Step 3 clamping the mold up and down or left and right, controlling the temperature of the upper and lower molds or the left and right molds is 165 ° C;
  • Step 4 adjusting the molding pressure to 20 MPa
  • Step 5 Hold pressure for 2 minutes
  • Step 6 Molding and taking out, a silica gel membrane 1 was prepared.
  • the silicone film 1 after the overmolding can be fixed to the sounding member 2 of the electronic speaker. Further, the processed silicone diaphragm 1 can be fixed in the cavity of the sounding part 2 of the electronic speaker.
  • Step 1 providing a formed silicone film 4
  • Step 2 introducing the formed silicone film 4 into the cavity 31 of the molding machine 3 in a continuous manner, so that the silicone film 4 is kept flat in the cavity 31;
  • Step 3 clamping the mold up and down or left and right, controlling the temperature of the upper and lower molds or the left and right molds is 167 ° C;
  • Step 4 adjusting the molding pressure to 20 MPa
  • Step 5 Hold pressure for 2 minutes
  • Step 6 Molding and taking out, a silica gel membrane 1 was prepared.
  • the silicone film 1 after the overmolding can be fixed to the sounding member 2 of the electronic speaker. Further, the processed silicone diaphragm 1 can be fixed in the cavity of the sounding part 2 of the electronic speaker.
  • Step 1 providing a formed silicone film 4
  • Step 2 introducing the formed silicone film 4 into the cavity 31 of the molding machine 3 in a continuous manner, so that the silicone film 4 is kept flat in the cavity 31;
  • Step 3 clamping the mold up and down or left and right, controlling the temperature of the upper and lower molds or the left and right molds is 180 ° C;
  • Step 4 adjusting the molding pressure to 20 MPa
  • Step 5 Hold pressure for 1 minute
  • Step 6 Molding and taking out, a silica gel membrane 1 was prepared.
  • the silicone film 1 after the overmolding can be fixed to the sounding member 2 of the electronic speaker. Further, the processed silicone diaphragm 1 can be fixed in the cavity of the sounding part 2 of the electronic speaker.
  • the present invention also provides a silica gel diaphragm 1 which is obtained by the above preparation method.
  • the thickness of the silica gel membrane 1 is not uniform.
  • the silica gel membrane 1 can be a continuous diaphragm.
  • the thickness of the silica gel membrane 1 is 8 to 350 ⁇ m.
  • the thickness of each region of the silica gel diaphragm 1 does not match.
  • the surface of the silica gel diaphragm 1 is further formed with a protrusion 11 (see FIG. 3), and the protrusion 11 is integrally formed with the silica gel diaphragm 1.
  • the thickness of the protrusion 11 is 8 to 350 ⁇ m. It is to be understood that the surface of the silica gel diaphragm 1 may not form the protrusions 11.
  • the present invention also provides a sound producing member 2 to which the silicone diaphragm 1 is applied, which can be fixed to the sound emitting member 2 of the electronic speaker. Further, the silicone diaphragm 1 can be fixed in the cavity of the sounding part 2 of the electronic speaker.
  • the surface of the silica gel diaphragm 1 is further formed with a protrusion 11 (see FIG. 3), and the protrusion 11 is integrally formed with the silica gel diaphragm 1.
  • the thickness of the protrusion 11 is 8 to 350 ⁇ m. It is to be understood that the surface of the silica gel diaphragm 1 may not form the protrusions 11.
  • the protruding portion 11 on the surface of the silicone diaphragm 1 of the present embodiment can make the sound-emitting member 2 using the silicone diaphragm 1 having the protruding portion 11 more excellent in the fidelity effect on different audio.
  • the silica gel diaphragm 1 having a non-uniform thickness according to the embodiment of the present invention is obtained by subjecting the silica gel membrane 4 to secondary molding, and the specific temperature, pressure and pressure holding time of the above molding are all specific methods adopted to implement the technical scheme of the present invention.
  • the invention is not intended to limit the invention, and any modifications, equivalents and improvements made within the spirit and scope of the invention are intended to be included within the scope of the invention.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

本发明提供一种硅胶振膜。所述硅胶振膜的厚度不均一，且所述硅胶振膜的厚度为8~350微米。本发明的硅胶振膜具有成型简单、保真效果佳的优点。

Description

硅胶振膜及其制备方法、发声部件
技术领域
本发明涉及扬声器技术领域，尤其涉及一种硅胶振膜、该硅胶振膜的制备方法及应用该硅胶振膜的发声部件。
背景技术
扬声器是便携式电子设备的重要组件，其用于将声波电信号转换成声音信号传出，是一种信号转换器件。振膜则是扬声器能否拥有好素质的关键部件之一.所谓振膜其实是一个对于磁场变化很敏感的元件,当电信号通过线圈的时候,磁场产生变化,导致振膜受力变形.由于电信号变化很快,导致振膜高速振动,再通过振膜的振动传递给空气,从而产生了声波.在这个过程中,振膜的素质决定了扬声器的整体素质。
现有扬声器的振膜的材质有聚醚醚酮和硅胶。聚醚醚酮振膜的刚性比较差,较弱的刚性造成了高速微动作时(高频段工作时),音圈发出的动能无法完全且一致的传达到整个振膜,虽然其有良好的阻尼性,但毕竟已无法作完美的活塞运动,因此失真率相对提高.在听感上会有明显的解析力不好和动态不足的问题,中频到中频也容易出现迟缓、衔接不畅的现象.
现有技术中振膜耐热性差，高频稳定性差。硅胶振膜的扬声器，声音效果好，不易失真，稳定耐用。
现有的硅胶制件通常采用注塑成型制得，即，向模具注射液态硅胶，硅胶经过固化反应，固化后的硅胶冷却成型。该制备方法具有工艺复杂、成本高、效率低、工艺不稳定、难以大规模制备等缺点。
进一步地，现有的振膜的厚度均一，导致振膜在大音量时保真效果差，难以满足消费者对音质的要求。
发明内容
鉴于上述问题，本发明提供了一种成型简单、保真效果佳的硅胶振膜。
为解决上述技术问题，发明提供一种硅胶振膜，所述硅胶振膜的厚度为8~350微米，且所述硅胶振膜的厚度不均一。
优选地，所述硅胶振膜还形成有一凸出部，所述凸出部的厚度为8~350微米。
本发明还提供一种硅胶振膜的制备方法，该制备方法包括：
提供硅胶膜；
将所述硅胶膜以连续引入到模压机的模腔内，模腔的厚度不均一；
合模，控制模温；
调节模压压力，保压处理；
成型后取出硅胶振膜，所述硅胶振膜的厚度不均一。
优选地，所述模压机包括上下模或左右模，所述上下模或左右模的温度为70℃~200℃。
优选地，所述上下或左右模的温度为150℃~180℃。
优选地，所述上下或左右模的温度为155℃~170℃。
优选地，所述模压压力为0.01MPa以上，所述保压时间小于20分钟。
优选地，所述模压压力为20~21MPa，所述保压时间为1~2分钟。
发明还提供一种发声部件，所述发声部件包括所述的硅胶振膜。
优选地，所述发声部件包括腔体，所述硅胶振膜位于所述腔体内。
本发明的有益效果是：通过将硅胶膜采用二次成型的方式制成厚度不均一的硅胶振膜，其具有表现不同音频的良好效果。相比于一般的发声部件，应用该厚度不均一的硅胶振膜的发声部件对不同音频的保真效果更佳。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明的硅胶振膜加工方法示意图。
图2为本发明的硅胶振膜剖视图。
图3为本发明的发声部件结构示意图。
附图标号说明：
标号 名称 标号 名称
1 硅胶振膜 3 模压机
11 凸出部 31 模腔
2 发声部件 4 硅胶膜
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示（诸如上、下、左、右、前、后……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本发明中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
参照图1，本发明提出一种硅胶振膜的制备方法。
步骤1：所述硅胶振膜的制备方法包括以下步骤：
步骤2：提供硅胶膜4；
步骤3：将所述硅胶膜4以连续引入到模压机3的模腔31内，模腔31的厚度不均一；
步骤4：合模，控制模温；
步骤5：调节模压压力，保压一段时间，从而实现硅胶膜4的二次成型；
步骤6：成型后取出硅胶振膜1，所述硅胶振膜1的厚度不均一。
可以理解的，本发明实施例使用的硅胶膜是一种无基材硅胶膜，本发明实施例所使用的制备硅胶振膜的方法是用已初步制造成型的无基材硅胶膜进行二次成型的方法。
所述模压机3包括上下模或左右模（未标示），在成型的过程中，模压机3在合模时，所述上下模或左右模的温度为70℃~200℃。
优选地，所述上下或左右模的温度为150℃~180℃。
更加优选地，所述上下或左右模的温度为155℃~170℃。
所述硅胶膜4以连续方式被引入到模压机3的模腔31内，使硅胶膜4在模腔31内保持平整。本实施例中，所述模压机3中包括若干模腔31，当所述硅胶模4以连续方式被引入到模压机3的若干模腔31内时，所述硅胶模4将并列排列的若干模腔31覆盖，且硅胶膜4在若干模腔31内保持平整。
所述模压压力为0.01MPa以上。优选地，所述模压压力为20~21MPa。
所述保压时间小于20分钟。优选地，所述保压时间为1~2分钟。
本发明的模压机3内若有若干模腔31，使得在一次成型过程中，可以制得若干硅胶振膜1，从而提高了硅胶振膜1的制作效率。本发明的硅胶振膜1的制作方法简单，成型便捷、能够实现大规模制备，从而节约了制作时间与成本。进一步地，制得的硅胶振膜1的厚度不均一，所述硅胶振膜1的厚度为8~350微米。所述硅胶振膜1可为一连续的厚度不均一的膜，所述硅胶振膜1的不同区域的厚度可不一致。相比于一般的发声部件，应用该厚度不均一的硅胶振膜的发声部件对不同音频的保真效果更佳。
进一步地，可通过设置模腔31的内部结构，来获得连续的厚度不均一的硅胶振膜1。可以理解的，还可通过设置模腔31的内部结构，从而于所述硅胶振膜1的表面进一步形成突出部11（参图3），所述突出部11与所述硅胶振膜1一体成型。突出部11的厚度为8~350微米。可以理解的，所述硅胶振膜1的表面也可不形成所述突出部11。
可以理解的，通过调节模腔31的内部结构，来调节硅胶振膜1与突出部11的厚度。
实施例1：
本实施例提供了一种硅胶振膜的制备方法，依次包括如下步骤：
步骤1：提供已成型的硅胶膜4；
步骤2：将已成型的硅胶膜4以连续方式引入到模压机3的模腔31内，使硅胶膜4在模腔31内保持平整；
步骤3：上下或左右合模，控制上下模或左右模的温度为155℃；
步骤4：调节模压压力为20MPa；
步骤5：保压1分钟；
步骤6：成型取出，制备出硅胶振膜11。
如图3所示，二次成型后的硅胶振膜1可被固定在电子扬声器的发声部件2上。进一步地，加工成型的硅胶振膜1可被固定在电子扬声器的发声部件2的腔体内。
实施例2：
本实施例提供一种硅胶振膜的制备方法，依次包括如下步骤：
步骤1：提供已成型的硅胶膜4；
步骤2：将已成型的硅胶膜4以连续方式引入到模压机3的模腔31内，使硅胶膜4在模腔31内保持平整；
步骤3：上下或左右合模，控制上下模或左右模的温度为160℃；
步骤4：调节模压压力为21MPa；
步骤5：保压1分钟；
步骤6：成型取出，制备出硅胶振膜1。
如图3所示，二次成型后的硅胶振膜1可被固定在电子扬声器的发声部件2上。进一步地，加工成型的硅胶振膜1可被固定在电子扬声器的发声部件2的腔体内。
实施例3：
本实施例提供一种硅胶振膜的制备方法，依次包括如下步骤：
步骤1：提供已成型的硅胶膜4；
步骤2：将已成型的硅胶膜4以连续方式引入到模压机3的模腔31内，使硅胶膜4在模腔31内保持平整；
步骤3：上下或左右合模，控制上下模或左右模的温度为165℃；
步骤4：调节模压压力为20MPa；
步骤5：保压2分钟；
步骤6：成型取出，制备出硅胶振膜1。
如图3所示，二次成型后的硅胶振膜1可被固定在电子扬声器的发声部件2上。进一步地，加工成型的硅胶振膜1可被固定在电子扬声器的发声部件2的腔体内。
实施例4：
步骤1：提供已成型的硅胶膜4；
步骤2：将已成型的硅胶膜4以连续方式引入到模压机3的模腔31内，使硅胶膜4在模腔31内保持平整；
步骤3：上下或左右合模，控制上下模或左右模的温度为167℃；
步骤4：调节模压压力为20MPa；
步骤5：保压2分钟；
步骤6：成型取出，制备出硅胶振膜1。
如图3所示，二次成型后的硅胶振膜1可被固定在电子扬声器的发声部件2上。进一步地，加工成型的硅胶振膜1可被固定在电子扬声器的发声部件2的腔体内。
实施例5：
步骤1：提供已成型的硅胶膜4；
步骤2：将已成型的硅胶膜4以连续方式引入到模压机3的模腔31内，使硅胶膜4在模腔31内保持平整；
步骤3：上下或左右合模，控制上下模或左右模的温度为180℃；
步骤4：调节模压压力为20MPa；
步骤5：保压1分钟
步骤6：成型取出，制备出硅胶振膜1。
如图3所示，二次成型后的硅胶振膜1可被固定在电子扬声器的发声部件2上。进一步地，加工成型的硅胶振膜1可被固定在电子扬声器的发声部件2的腔体内。
请参阅图2，本发明还提供一种硅胶振膜1，所述硅胶振膜1由上述制备方法制得。
所述硅胶振膜1的厚度不均一。所述硅胶振膜1可为一连续的振膜。所述硅胶振膜1的厚度为8~350微米。
具体地，所述硅胶振膜1的各区域的厚度不一致。
优选地，所述硅胶振膜1的表面还有进一步形成有一突出部11（参图3），所述突出部11与所述硅胶振膜1一体成型。突出部11的厚度为8~350微米。可以理解的，所述硅胶振膜1的表面也可不形成所述突出部11。
请参阅图3，本发明还提供一种应用所述硅胶振膜1的发声部件2，所述硅胶振膜1可被固定在电子扬声器的发声部件2上。进一步地，所述硅胶振膜1可被固定在电子扬声器的发声部件2的腔体内。
优选地，所述硅胶振膜1的表面还有进一步形成有一突出部11（参图3），所述突出部11与所述硅胶振膜1一体成型。突出部11的厚度为8~350微米。可以理解的，所述硅胶振膜1的表面也可不形成所述突出部11。
本实施例的硅胶振膜1表面的突出部11可使应用该具有突出部11的硅胶振膜1的发声部件2对不同音频的保真效果更佳。
本发明实施例的厚度不均一的硅胶振膜1通过将硅胶膜4进行二次成型制得，上述成型的具体温度、压力及保压时间都是为了实现本发明技术方案而采取的具体方式，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种硅胶振膜，其特征在于，所述硅胶振膜的厚度为8~350微米，且硅胶振膜的厚度不均一。
  2. 如权利要求1所述的硅胶振膜，其特征在于，所述硅胶振膜还形成有一凸出部，所述凸出部的厚度为8~350微米。
  3. 一种硅胶振膜的制备方法，其特征在于，该制备方法包括：
    提供硅胶膜；
    将所述硅胶膜连续引入到模压机的模腔内，模腔的厚度不均一；
    合模，控制模温；
    调节模压压力，保压处理；
    成型后取出硅胶振膜，所述硅胶振膜的厚度不均一。
  4. 如权利要求3所述的硅胶振膜的制备方法，其特征在于，所述模压机包括上下模或左右模，所述上下模或左右模的温度为70℃~200℃。
  5. 如权利要求3所述的硅胶振膜的制备方法，其特征在于，所述上下模或左右模的温度为150℃~180℃。
  6. 如权利要求4所述的硅胶振膜的制备方法，其特征在于，所述上下模或左右模的温度为155℃~170℃。
  7. 如权利要求3所述的硅胶振膜的制备方法，其特征在于，所述模压压力为0.01MPa以上，所述保压时间小于20分钟。
  8. 如权利要求7所述的硅胶振膜的制备方法，其特征在于，所述模压压力为20~21MPa，所述保压时间为1~2分钟。
  9. 一种发声部件，其特征在于，所述发声部件具有如权利要求1或2所述的硅胶振膜。
  10. 如权利要求9所述的发声部件，其特征在于，所述发声部件包括腔体，所述硅胶振膜位于所述腔体内。
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