WO2017208866A1 - Oscillateur à cristaux et son procédé de fabrication - Google Patents

Oscillateur à cristaux et son procédé de fabrication Download PDF

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Publication number
WO2017208866A1
WO2017208866A1 PCT/JP2017/018910 JP2017018910W WO2017208866A1 WO 2017208866 A1 WO2017208866 A1 WO 2017208866A1 JP 2017018910 W JP2017018910 W JP 2017018910W WO 2017208866 A1 WO2017208866 A1 WO 2017208866A1
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Prior art keywords
crystal
electrode
region
crystal resonator
electrodes
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PCT/JP2017/018910
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English (en)
Japanese (ja)
Inventor
利克 大櫃
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株式会社村田製作所
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Priority to JP2018520802A priority Critical patent/JPWO2017208866A1/ja
Publication of WO2017208866A1 publication Critical patent/WO2017208866A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz

Definitions

  • the present invention relates to a crystal resonator and a manufacturing method thereof.
  • Quartz vibrators with thickness shear vibration as the main vibration are widely used as signal sources for reference signals used in oscillators and bandpass filters.
  • the crystal resonator there is a structure including a resonator body made of an AT-cut quartz material and having a pair of excitation electrodes, and a lid and a base bonded to the front and back main surfaces of the resonator body. It is known (see Patent Document 1).
  • the crystal resonator has a connection pad electrically connected to an external electrode provided on the base on the base side of the resonator body, and the adjustment pad used for the inspection of the resonator body It is on the lid side of the main body.
  • connection pad and the adjustment pad for each of the connection pad and the adjustment pad, one wiring is required to be routed on the front and back of the crystal resonator element, and at least two wirings in total are required. For this reason, there is a case where a short circuit or disconnection due to the wiring occurs due to the miniaturization of the crystal unit.
  • the present invention has been made in view of such circumstances, and an object thereof is to suppress defects caused by wiring and to improve the quality of a crystal resonator.
  • the crystal resonator according to the present invention includes a crystal piece having first and second main surfaces facing each other, a first excitation electrode provided on the first main surface of the crystal piece, and the second piece of the crystal piece.
  • a quartz resonator element including a second excitation electrode provided on the main surface and facing the first excitation electrode; a frame surrounding the outer periphery of the crystal piece; and a connecting member connecting the frame and the crystal piece;
  • the lid member is disposed opposite to the first excitation electrode side of the crystal resonator element, and is joined to the second excitation electrode side of the crystal resonator element, and the lid member joined to the frame so as to excite the crystal piece.
  • the child has a first electrode electrically connected to the first excitation electrode and a second electrode electrically connected to the second excitation electrode, and each of the first and second electrodes includes a first electrode A first pad portion provided on the region and a second pad portion provided on the second region, wherein the first and second excitation electrodes are the first pad portions of the first and second electrodes, respectively. Is electrically connected to the external electrode of the base member.
  • Each second pad portion of the second electrode is formed.
  • the method for manufacturing a crystal resonator according to the present invention includes: (a) preparing a first substrate having a plurality of crystal resonator elements, wherein the crystal resonator elements have first and second main surfaces facing each other. A piece, a first excitation electrode provided on the first main surface of the crystal piece, a second excitation electrode provided on the second main surface of the crystal piece and facing the first excitation electrode, Preparing a first substrate comprising a frame body that surrounds the outer periphery of the crystal piece and a connecting member that connects the frame body and the crystal piece; and (b) facing the first excitation electrode side of the crystal resonator element.
  • Preparing a third substrate having a plurality of base members (d) A crystal piece can be excited
  • the first, second, and third substrates are joined so that the frame of the crystal resonator element is joined to the lid member and the base member, and (e) the joined first, second, and second substrates.
  • the quartz crystal resonator element includes a first electrode electrically connected to the first excitation electrode and a second electrode electrically connected to the second excitation electrode.
  • Each of the first and second electrodes has a first pad portion provided on the first region and a second pad portion provided on the second region, and (a) Electrically inspecting the quartz crystal vibrating element through each second pad portion of the second electrode, wherein (d) is the first and second excitation electrodes Involves electrically connected to the external electrode of the base member through the respective first pad portions of the first and second electrodes.
  • Each second pad portion of the second electrode can be formed.
  • defects due to wiring can be suppressed and the quality of the crystal unit can be improved.
  • FIG. 1 is an exploded perspective view of a crystal resonator according to an embodiment of the present invention.
  • 2 is a cross-sectional view taken along line II-II in FIG.
  • FIG. 3A is a plan view of the crystal resonator element according to the embodiment of the invention.
  • FIG. 3B is a plan view of the crystal resonator element according to the embodiment of the invention.
  • FIG. 4 is a partially enlarged perspective view of the crystal resonator element according to the embodiment of the invention.
  • FIG. 5 is a flowchart showing a method for manufacturing a crystal resonator according to an embodiment of the present invention.
  • FIG. 6A is a diagram showing a procedure of a method for manufacturing a crystal resonator element according to an embodiment of the present invention.
  • FIG. 6B is a diagram illustrating the procedure of the method for manufacturing the crystal resonator element according to the embodiment of the invention.
  • FIG. 6C is a diagram illustrating a procedure of a method for manufacturing a crystal resonator element according to an embodiment of the present invention.
  • FIG. 6D is a diagram illustrating a procedure of a method for manufacturing a crystal resonator element according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view of a crystal resonator according to a modification of one embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of a crystal resonator according to another modification of the embodiment of the present invention.
  • FIG. 1 is an exploded perspective view of the crystal resonator according to this embodiment
  • FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1
  • FIG. 3A is a plan view of the crystal resonator element viewed from the lid member side.
  • FIG. 3B is a plan view seen from the base member side of the crystal resonator element.
  • FIG. 4 is a partially enlarged perspective view of the crystal resonator element.
  • the crystal resonator 1 includes a crystal resonator element 100 (Quartz Crystal Resonator), a lid member 200, and a base member 300.
  • the crystal resonator element 100 is constituted by an AT-cut quartz substrate, for example.
  • the AT-cut quartz substrate has an X-axis, a Y-axis, and a Z-axis which are crystal axes of artificial quartz, and the Y-axis and the Z-axis are 35 degrees 15 minutes in the direction from the Y-axis to the Z-axis around the X-axis.
  • the axes rotated for 1 minute 30 seconds are the Y ′ axis and the Z ′ axis, respectively, the surfaces parallel to the plane specified by the X axis and the Z ′ axis are cut out.
  • a quartz resonator element using an AT-cut quartz substrate has high frequency stability over a wide temperature range, is excellent in aging characteristics, and can be manufactured at low cost.
  • the AT-cut crystal resonator element often uses a thickness shear vibration mode as a main vibration.
  • each configuration of the crystal resonator will be described with reference to the axial direction of the AT cut.
  • the quartz resonator element 100 may be composed of a quartz substrate formed by a cut other than the AT cut.
  • the lid member 200 and the base member 300 are a part of the configuration of a case or a package for housing a part of the crystal resonator element 100 (crystal piece).
  • the crystal resonator element 100, the lid member 200, and the base member 300 have substantially the same dimensions and outer shapes when viewed in plan (for example, substantially rectangular outer shapes).
  • wafer level CSP also referred to as Chip Size Package
  • a wafer corresponding to a lid member a wafer corresponding to a crystal vibrating element
  • a base member a base member
  • the crystal resonator element 100, the lid member 200, and the base member 300 have substantially the same size and shape.
  • the crystal resonator element 100 includes a substantially rectangular crystal piece 110 (Quartz Crystal Blank), a frame body 120 that surrounds the outer periphery of the crystal piece 110 with a predetermined gap when the main surface of the crystal piece 110 is viewed in plan, Connection members 111 a and 111 b that are arranged in the gap and connect the crystal piece 110 and the frame body 120 are provided.
  • the crystal piece 110, the frame body 120, and the connecting members 111a and 111b are all formed from an AT-cut crystal substrate.
  • the quartz crystal resonator element 100 as a whole has a long side parallel to the X axis, a short side parallel to the Z ′ axis, and a thickness parallel to the Y ′ axis. In the example shown in FIG.
  • both of the connecting members 111 a and 111 b are arranged at one end (X-axis negative direction side) of the crystal piece 110 in the X-axis direction. That is, the crystal piece 110 is provided away from the frame body 120, and both are connected by the connecting members 111a and 111b.
  • FIG. 1 two connecting members arranged on one end side in the X-axis direction are shown, but the number of connecting members, their arrangement, and the like are not particularly limited.
  • each corner 102, 104, 106, 108 of the crystal resonator element 100 is not particularly limited, and is a rectangular shape having no notches as shown in FIG. Also good.
  • each corner may be formed with a cut-out side surface formed by cutting a part of the corner into a cylindrical curved surface (or castellation shape).
  • each corner of the lid member 200 and the base member 300 may be formed with the cut-out side surface.
  • Such a cut-out side surface is often formed in accordance with the adoption of a manufacturing method called wafer level CSP in which a wafer is packaged in a wafer state.
  • the crystal resonator element 100, the lid member 200, and the base are formed.
  • each cut-out side surface at the corresponding corner is arranged so as to coincide with the Y′-axis direction.
  • the shape in case a notch side surface is formed may be shapes other than a cylindrical curved surface shape.
  • First and second excitation electrodes 130 and 140 are formed on the front and back of the opposing main surface of the crystal piece 110.
  • a portion where the first and second excitation electrodes 130 and 140 face each other is an excitation portion (a portion excluding the first and second excitation electrodes 130 and 140).
  • the thickness of the crystal piece 110 is not particularly limited, the thickness of the excitation portion of the crystal piece 110 is larger than the thickness of the frame 120 (a portion excluding a concave portion 126 described later) as shown in FIG. It may be thin. Alternatively, unlike the example shown in FIG. 2, the thickness of the excitation portion of the crystal piece 110 may be substantially the same as the thickness of the frame 120.
  • substantially the same is not limited to the case where the thickness of the crystal piece 110 and the frame body 120 are strictly the same.
  • a flat crystal substrate having an upper surface and a lower surface facing each other is used. This means that it includes a dimensional difference due to processing variations that may occur when forming by removal processing. The same applies to the following description.
  • the thickness of the connecting members 111a and 111b is substantially the same as the thickness of the crystal portion serving as the excitation portion of the crystal piece 110 as shown in FIG. Or the thickness of the crystal portion may be smaller.
  • the crystal piece 110 can be configured to be similar to the mesa structure. Therefore, it is possible to improve the confinement property of the vibration energy by the connecting members 111a and 111b while maintaining the mechanical strength of the crystal resonator element 100 by the thickness of the frame body 120.
  • the first excitation electrode 130 is formed on the first surface 112 (first main surface) that is the surface on the Y′-axis positive direction side of the crystal piece 110, while the second excitation electrode 140 is formed on the Y ′ axis of the crystal piece 110. It is formed on the second surface 114 (second main surface) that is the surface on the negative axis direction side.
  • the first and second excitation electrodes 130 and 140 are arranged as a pair of electrodes so as to substantially overlap each other in plan view of the XZ ′ plane.
  • a through hole 150 is formed between the crystal piece 110 and the frame body 120 (for example, a region surrounded by the crystal piece 110, the frame body 120, and the connecting members 111a and 111b).
  • the 1st excitation electrode 130 is formed so that the outer edge of the X-axis positive direction side of the opening part of the Y'-axis positive direction side of the said through-hole 150 may be contact
  • An extraction electrode 132 is formed on the inner wall of the through-hole 150, and the extraction electrode 132 is electrically connected to the first excitation electrode 130 at the opening (see FIGS. 3A and 4). Thereby, the 1st excitation electrode 130 is electrically connected with the 1st electrode 133 formed in the 2nd surface 124 of the frame 120 via the extraction electrode 132 (refer FIG. 3B and FIG. 4).
  • the extraction electrode of the second excitation electrode 140 it is not necessary to form the extraction electrode of the second excitation electrode 140 on the inner wall of the through hole 150. Therefore, a resist forming process for providing an insulating portion on the inner wall is not necessary, and the manufacturing process is reduced, and occurrence of short circuit and disconnection is suppressed.
  • the extraction electrode 132 extracted from the first excitation electrode 130 to the first electrode 133 is formed on the entire inner wall of the through hole 150 as shown in FIG. 3A. By forming the extraction electrode 132 on the entire surface of the inner wall, the quality inspection of the wiring inside the through hole 150 can be omitted. Therefore, the work process is reduced and the manufacturing time is shortened.
  • the extraction electrode may be formed on a part of the inner wall of the through hole.
  • the extraction electrode 142 electrically connected to the second excitation electrode 140 passes through the coupling member 111b and is extracted to the frame body 120 side (see FIGS. 3B and 4).
  • the extraction electrode 142 is provided at a predetermined interval from the outer edge on the Z′-axis positive direction side of the opening on the Y′-axis negative direction side of the through hole 150 (see FIGS. 3B and 4). ). That is, the extraction electrode 142 is formed so as not to be electrically connected to the extraction electrode 132.
  • the 2nd excitation electrode 140 is electrically connected with the 2nd electrode 143 formed in the 2nd surface 124 side of the frame 120 (refer FIG. 3B and FIG. 4).
  • the 2nd electrode 143 is formed in the extraction electrode 142 on the same surface side (side where the base member 300 is arrange
  • First and second electrodes 133 and 143 are formed on the second surface 124 side of the frame body 120.
  • the first electrode 133 includes measurement pads 134 and 134a (second pad portion) and a connection pad 136 (first pad portion), and the second electrode 143 includes measurement pads 144 and 144a (second pad portion) and connection.
  • Pad 146 (first pad portion).
  • the measurement pads 134 and 134a or the measurement pads 144 and 144a may be referred to as “measurement pad 134” or “measurement pad 144” without distinction.
  • a recess 126 is formed on the second surface 124 side of the frame 120.
  • the concave portion 126 is a region that is recessed on the Y′-axis positive direction side from the bonding region (first region) with the base member 300 on the second surface 124 side (the side on which the base member 300 is disposed) of the frame body 120. (Second region) (see FIG. 4).
  • the joining region is formed in the outer edge portion including the outer edge of the frame body 120, and the recess 126 is formed in the region adjacent to the connecting members 111a and 111b on the X axis negative direction side of the frame body 120. (See FIGS. 3B and 4).
  • the shape of the recessed part 126 is not specifically limited, For example, a substantially rectangular external shape may be sufficient.
  • the depth of the concave portion 126 on the Y′-axis positive direction side is not particularly limited, but in this embodiment, the bottom surface of the concave portion 126 (the surface facing the base member 300) is the same as the second surface 114 of the crystal piece 110. It is deep enough to be located at the height. Specifically, the recess 126, the connecting members 111a and 111b, and the crystal piece 110 are flush with each other on the side where the base member 300 is disposed.
  • the thickness of the connecting members 111 a and 111 b in the Y′-axis direction is equal to the thickness of the frame body 120 (part excluding the recess 126). Since the thickness is comparatively smaller, the distance of the extraction electrode 132 provided on the inner wall of the through hole 150 is shortened. Thereby, generation
  • the measurement pads 134 and 144 are formed on the bottom surface of the recess 126. Specifically, the measurement pad 134 is formed so that at least a part of the bottom surface of the recess 126 is in contact with the outer edge of the through hole 150 on the Y′-axis negative direction side on the X-axis negative direction side. Yes. Thereby, the measurement pad 134 is electrically connected to the extraction electrode 132 formed on the inner wall of the through hole 150. On the other hand, the measurement pad 144 is electrically connected to the extraction electrode 142 on the bottom surface of the concave portion 126 so as not to contact the outer edge of the opening of the through hole 150 (that is, not electrically connected to the extraction electrode 132). Is formed).
  • the measurement pad 134 is electrically connected to the measurement pad 134a formed on the side surface of the concave portion 126 on the negative side of the Z ′ axis, and the measurement pad 144 is connected to the concave portion 126 on the positive side of the Z ′ axis. It is electrically connected to the measurement pad 144a formed on the side surface (see FIG. 4).
  • the measurement pads 134 and 144 are pads used for applying a voltage to the first and second excitation electrodes 130 and 140 when the crystal resonator element 100 is electrically inspected.
  • the electrical inspection is performed, for example, by bringing a pair of probes or the like into contact with the measurement pads 134 and 144 and applying a voltage to the first and second excitation electrodes. Details of the electrical inspection method will be described later.
  • the measurement pads 134 and 144 are formed so as to be partially extended from the extension lines of the connecting members 111a and 111b (that is, on the vibration propagation path of the excitation vibration) (see FIG. 4). . Thereby, the influence on the oscillation frequency caused by bringing the probe into contact with the measurement pad is suppressed, and the measurement accuracy is improved.
  • wire of the connection members 111a and 111b may be an outer side in the Z'-axis direction from the said extension line
  • connection pads 136 and 146 are formed on the second surface 124 of the frame body 120 (joining region with the base member 300). Specifically, the connection pad 136 is at least partially in contact with the outer edge of the concave portion 126 on the Z′-axis negative direction side near the corner 102 of the frame body 120 on the second surface 124 of the frame body 120. The connection pad 146 is formed on the second surface 124 of the frame body 120 so that the outer edge of the concave portion 126 on the Z′-axis positive direction side is at least partially in contact with the corner 104 of the frame body 120. (See FIG. 4).
  • connection pad 136 is in contact with the measurement pad 134a (electrically connected to the measurement pad 134), and the connection pad 146 is in contact with the measurement pad 144a (electrically connected to the measurement pad 144). Accordingly, the connection pad 136 is electrically connected to the first excitation electrode 130 via the measurement pads 134a and 134 and the extraction electrode 132, and the connection pad 146 includes the measurement pads 144a and 144 and the extraction electrode 142. And is electrically connected to the second excitation electrode 140.
  • connection pads 136 and 146 are connected to the first and second excitation electrodes 130 and 140 and the first surface 302 of the base member (on the side where the crystal resonator element 100 is disposed) when the crystal resonator element 100 and the base member 300 are joined. It is a pad used for electrically connecting an external electrode formed on the surface).
  • the first and second excitation electrodes 130 and 140 are electrically connected to the external electrodes 322 and 326 formed on the base member 300 through connection pads 136 and 146, respectively (see FIG. 1).
  • the base is formed of a chromium (Cr) layer, and a gold (Au) layer is formed on the surface of the chromium layer.
  • each electrode is not limited only to said material.
  • the lid member 200 is disposed on the first surface 122 side of the frame body 120 so as to face the first excitation electrode 130 formed on the first surface 112 of the crystal piece 110, and the base member 300 is disposed on the first surface 122 of the crystal piece 110.
  • the lid member 200, the crystal resonator element 100, and the base member 300 are arranged in three layers in this stacking order so as to be opposed to the second excitation electrode 140 formed on the second surface 114 and on the second surface 124 side of the frame body 120. It has a structure.
  • the lid member 200 has a first surface 202 and a second surface 204 opposite to the first surface 202 and facing the crystal resonator element 100.
  • the base member 300 has a first surface 302 that faces the crystal resonator element 100 and a second surface 304 that is opposite to the first surface 302.
  • the second surface 304 of the base member 300 is a mounting surface that is electrically connected to the outside.
  • External electrodes 322, 324, 326, and 328 are formed on the second surface 304 of the base member 300 at each corner. Specifically, external electrodes 322 and 324 are formed at two corners on the X axis negative direction side, and external electrodes 326 and 328 are formed at two corners on the X axis positive direction side. The external electrodes 322, 324, 326, and 328 are drawn out to the first surface 302 side by electrodes formed on the end surface of the base member 300. Further, on the first surface 302 of the base member 300, the external electrode 322 is provided to extend to a certain extent at the corner on the negative side in the X-axis negative direction Z′-axis, and the external electrode 326 faces the negative side in the X-axis direction. Are extended to a certain extent at the corner on the X-axis negative direction Z′-axis positive direction side (see FIG. 1).
  • the external electrode 322 is electrically connected to the first excitation electrode 130 via the connection pad 136, the measurement pad 134, and the extraction electrode 132, and the external electrode 326. Is electrically connected to the second excitation electrode 140 via the connection pad 146, the measurement pad 144, and the extraction electrode 142 (see FIG. 1).
  • the remaining external electrodes 324 and 328 are dummy electrodes (also called floating electrodes) that are not electrically connected to any of the first and second excitation electrodes 130 and 140.
  • the dummy electrode may be connected to a terminal provided on a substrate (not shown) on which the crystal unit 1 is mounted and not connected to any other electronic element. In the example shown in FIG.
  • the external electrodes 322 and 326 that are electrically connected to the first and second excitation electrodes 130 and 140 are arranged at opposite corners of the base member 300, It is not limited and may be arranged at other corners. Further, when notched side surfaces such as castellation shapes are formed at each corner of the base member 300, each external electrode extends from the second surface 304 of the base member 300 to the notched side surface at each corresponding corner. It may have been issued.
  • External electrodes 322, 324, 326, and 328 are formed of, for example, chromium (Cr) or gold (Au). Specifically, for example, the external electrode is formed by forming a conductive material by a sputtering method and then additionally forming a conductive material by a plating method. Note that the external electrodes 322, 324, 326, and 328 are not particularly limited to the above materials, and a known conductive material can be used. Moreover, well-known formation methods other than said formation method can be used. In the present embodiment, a four-terminal structure including four external electrodes is shown. However, the number of external electrodes is not particularly limited. For example, a two-terminal structure including two external electrodes may be applied. .
  • the lid member 200 and the base member 300 are flat substrates, but the lid member 200 and the base member 300 may have a concave shape opened in a direction facing the crystal resonator element 100.
  • the material of the lid member 200 and the base member 300 is made of glass (for example, silicate glass or a material mainly composed of materials other than silicate and having a glass transition phenomenon due to temperature rise).
  • it may be made of quartz (for example, AT-cut quartz), which is the same material as the quartz resonator element 100, or glass epoxy resin in which glass fiber is impregnated with epoxy resin.
  • the lid member 200 is joined to the entire circumference of the first surface 122 of the frame body 120 via the sealing member 170, while the base member 300 is connected to the second surface of the frame body 120.
  • the entire periphery of the surface 124 is joined via a sealing member 172.
  • the crystal piece 110 is hermetically sealed in the internal space (cavity). It is preferable that the pressure in the internal space is in a vacuum state lower than the atmospheric pressure because changes with time due to oxidation of the first excitation electrode 130 and the second excitation electrode 140 can be reduced.
  • the material of the sealing members 170 and 172 is not limited as long as the bonding surfaces of the members can be bonded to each other and the internal space can be hermetically sealed.
  • low-melting glass for example, lead borate or tin phosphate
  • Glass adhesive material such as a system
  • a resin adhesive may be used.
  • connection pads 136 and 146 that is, the joint surface with the base member 300
  • the reliability of joining between the connection pads 136 and 146 and the external electrodes 322 and 326 may be lowered.
  • a probe or the like can be brought into contact with the measurement pads 134 and 144 formed on the inner bottom surface of the recess 126 that is recessed from the second surface 124 to the first surface 122 side of the frame 120. .
  • the measurement pads 134 and 144 that is, the surface that is not bonded to the base member 300
  • the bonding force is reduced due to the damage or contamination.
  • the crystal resonator element 100 and the base member 300 can be joined. Therefore, it is possible to suppress a decrease in bonding reliability caused by the electrical inspection of the crystal resonator element 100.
  • connection pad first pad portion of the first electrode
  • the measurement pad first electrode
  • second pad portion a connection pad (first pad portion of the second electrode) and a measurement pad (second pad portion of the second electrode) electrically connected to the second excitation electrode 140, Both are formed on the second surface 124 side of the frame body 120.
  • the pad While the pad is formed, it is possible to reduce the total number of wirings routed on the front and back surfaces of the crystal resonator element having a high probability of wiring peeling and cutting. Accordingly, it is possible to improve the quality of the crystal unit while reducing the size of the crystal unit and suppressing defects such as a short circuit and disconnection of wiring.
  • the wiring manufacturing process can be simplified. Furthermore, since both the measurement pad and the connection pad are formed on the same surface side of the crystal resonator element 100, the inspection of the pad quality (for example, shape, misalignment, etc.) using image capturing or the like is simplified.
  • the measurement pad is formed not only on the bottom surface of the recess 126 but also on the side surface, so that the area in which the probe can be contacted is expanded and the operation in the inspection becomes easy.
  • region in which the recessed part 126 is formed is not specifically limited, What is necessary is just the area
  • the measurement pad can be hermetically sealed together with the crystal piece in the internal space (cavity) of the crystal resonator.
  • first and second electrodes 133 and 143 including the measurement pads 134 and 144 and the connection pads 136 and 146) electrically connected to the first and second excitation electrodes 130 and 140 is particularly limited. Is not to be done. As shown in this embodiment, each of the measurement pads 134 and 144 may be disposed between the connection pad 136 and the connection pad 146, or conversely, the connection pad is connected to each measurement pad. You may arrange
  • the manufacturing method of the crystal unit in the present embodiment includes manufacturing by applying a wafer level packaging technique for packaging in a wafer state.
  • the same constituent elements as those in the state after being singulated are denoted by the same terms and symbols for convenience of explanation. explain.
  • a first substrate 10 is prepared (S10 in FIG. 5).
  • the first substrate 10 is a substrate for forming a plurality of crystal resonator elements 100.
  • the contents described for the quartz resonator element 100 described above can be applied.
  • a quartz substrate obtained by cutting a quartz material from an artificial quartz or a natural quartz ore into a wafer at a predetermined cut angle is used. Can be used.
  • the first and second electrodes 133 and 143 are formed.
  • the measurement pads 134 and 144 and the connection pads 136 and 146 are formed, for example, by forming a recess 126 in the frame body 120 of the first substrate 10 by photolithography and etching, and forming a conductive material in the recess 126 by sputtering or the like. It can be formed as a film.
  • each crystal resonator element 100 formed on the first substrate 10 (S20 in FIG. 5).
  • a pair of probes or the like are brought into contact with the measurement pads 134 and 144 and a voltage is applied to the first and second excitation electrodes 130 and 140.
  • the oscillation frequency and crystal impedance value (CI value) of the crystal resonator element 100 are measured, and the frequency of the crystal resonator element 100 is adjusted.
  • the frequency is adjusted by, for example, removing a part of the first or second excitation electrodes 130 and 140 by laser light irradiation or attaching a metal to the crystal piece 110 by vapor deposition. This is done by adjusting the mass of the excitation electrodes 130 and 140.
  • the second substrate 20 and the third substrate 30 are substrates for forming the lid member 200 and the base member 300, respectively.
  • the second substrate 20 has a region corresponding to the plurality of lid members 200
  • the third substrate 30 has a region corresponding to the plurality of base members 300.
  • the materials described for the lid member 200 and the base member 300 can be applied to the materials of the second substrate 20 and the third substrate 30.
  • the second substrate 20 and the third substrate 30 can be made of quartz. it can.
  • the first substrate 10, the second substrate 20, and the third substrate 30 may be crystal substrates having the same cut angle (for example, AT cut).
  • the first substrate 10, the second substrate 20, and the third substrate 30 have substantially the same outer shape in plan view as viewed in the thickness direction.
  • the external electrodes described above are formed for each predetermined region by processes such as photolithography, etching, and film formation.
  • the second substrate 20 is bonded to the upper surface of the first substrate 10 (the side where the first excitation electrode 130 is formed on the crystal piece 110), and the lower surface of the first substrate 10 (the crystal The 3rd board
  • substrate 30 is joined to the piece 110 in which the 2nd excitation electrode 140 was formed, and the laminated member 40 is obtained (S40 of FIG. 5).
  • the second substrate 20, the first substrate 10, and the third substrate 30 are laminated and joined in this order.
  • the sealing members 170 and 172 (not shown) so that each crystal piece 110 of the first substrate 10 can be excited on the entire circumference of each surface of the frame body 120 of the first substrate 10.
  • the second substrate 20 and the third substrate 30 are joined.
  • the plurality of crystal pieces 110 on the first substrate 10 are hermetically sealed.
  • each substrate may be bonded by an intermolecular force of quartz without using a sealing member.
  • the laminated member 40 is cut out to obtain a plurality of pieces (S50 in FIG. 5).
  • the laminated member 40 is cut out by a method such as dicing or wire cutting, and is separated into pieces for each crystal resonator.
  • an external electrode is formed on each crystal resonator (S60 in FIG. 5).
  • An external electrode is formed on the bottom surface of the crystal resonator (the surface of the base member 300 opposite to the crystal resonator element 100) by appropriately combining, for example, a sputtering method, a vacuum evaporation method, or a plating method. By forming the external electrode, the mountability of the crystal resonator is ensured.
  • the first region is formed in a region including the outer edge of the frame body 120, and the second region (that is, the concave portion 126) is formed in a region adjacent to the connecting members 111a and 111b.
  • 134 and 144 may be formed in a region between the connection pad 136 and the connection pad 146 and out of the extension line of the coupling members 111a and 111b.
  • the extraction electrode 132 is connected to the first excitation electrode 130 through the inner wall of the through hole 150 between the crystal piece 110 and the frame body 120. You may form in an inner wall.
  • the extraction electrode 132 may be formed on the entire inner wall of the through hole 150.
  • steps S10 to S30 shown in FIG. 5 are not limited to this order, and the order may be changed.
  • FIG. 7 is a cross-sectional view of a crystal resonator 2 according to a modification of the present embodiment.
  • This sectional view shows a sectional view of the crystal unit 2 in the same direction as the sectional view taken along the line II-II of FIG. 1 shown in FIG.
  • the crystal resonator 2 includes a crystal resonator element 103.
  • the crystal vibrating element 103 includes a crystal piece 113 and a connecting member 115b instead of the crystal piece 110 and the connecting member 111b in the crystal vibrating element 100 shown in FIG. Note that the connecting member on the Z′-axis negative direction side is the same as the connecting member 115b, and thus detailed description thereof is omitted.
  • the second surface 114 of the crystal piece 113 is closer to the first surface 302 of the base member 300 than the bottom surface of the recess 126 formed in the frame body 120 (the surface on the side where the base member 300 is disposed). 2 is different from the configuration shown in FIG. 2 in this respect.
  • the thickness of the frame body 120 the portion excluding the concave portion 126
  • the thickness of the region where the concave portion 126 of the frame body 120 is formed and the crystal piece
  • the thicknesses of the 113 and the connecting member 115b are reduced in this order. Accordingly, a step is formed between the recess 126 of the frame body 120 and the connecting member 115b.
  • the measurement pads 134 and 144 are on the extension line of the connecting member (that is, on the vibration propagation path of the excitation vibration) and are formed from the connecting member through the step (see FIG. 7).
  • the vibration propagation is reflected or diffused by the above-described step, so that the influence on the oscillation frequency caused by the contact of the probe is suppressed. Measurement accuracy is improved.
  • the measurement pad can be arranged on the extension line of the vibration propagation path, the degree of freedom in design such as the arrangement of the measurement pad and the width of the bonding region is increased. Accordingly, it is easy to improve the bonding force between the crystal resonator element and the base member and to reduce the size of the crystal resonator.
  • the thickness of the connecting member that is, the thickness of the through hole
  • the distance between the extraction electrodes provided on the inner wall of the through hole is further shortened. The occurrence of disconnection due to electrode defects can be suppressed.
  • FIG. 8 is a cross-sectional view of a crystal resonator 3 according to another modification of the present embodiment.
  • This sectional view shows a sectional view of the crystal unit 3 in the same direction as the sectional view taken along the line II-II in FIG. 1 shown in FIG.
  • the crystal resonator 3 includes a crystal resonator element 105.
  • the crystal vibrating element 105 includes a crystal piece 117 and a connecting member 119b instead of the crystal piece 110 and the connecting member 111b in the crystal vibrating element 100 shown in FIG. Note that the connecting member on the Z′-axis negative direction side is the same as the connecting member 119b, and thus detailed description thereof is omitted.
  • the crystal piece 117 has a forward mesa shape in which the outer edge portion is formed thinner than the center portion, and this is different from the configuration shown in FIG. Further, the second surface 114 at the center of the crystal piece 117 is the bottom surface of the recess 126 formed in the frame 120 with respect to the first surface 302 of the base member 300 (the surface on the side where the base member 300 is disposed). And at approximately the same position.
  • the crystal piece 117 has a substantially rectangular outer shape in plan view, but the shape of the crystal piece 117 is not limited to this.
  • the first and second electrodes electrically connected to the first and second excitation electrodes 130 and 140 are both the first and second electrodes of the frame body 120.
  • the total number of wirings routed on the front and back of the crystal resonator element can be reduced. Accordingly, it is possible to improve the quality of the crystal unit while reducing the size of the crystal unit and suppressing defects such as a short circuit and disconnection of wiring.
  • the wiring manufacturing process can be simplified.
  • the quartz crystal resonators 1 to 3 include first and second excitation electrodes 130 and 140 in a region that is depressed to a predetermined extent from the joint surface with the base member 300 on the surface of the frame 120 where the base member 300 is disposed.
  • the second pad portions of the first and second electrodes 133 and 143 that are electrically connected are formed.
  • the second pad portions of the first and second electrodes 133 and 143 are disposed between the first pad portion of the first electrode 133 and the second pad portion of the second electrode 143. It may be arranged.
  • a joining region of the frame 120 is formed in a region including the outer edge of the frame 120, and a recess 126 is formed in a region adjacent to the connecting members 111a and 111b.
  • the measurement pads 134 and 144 can be hermetically sealed together with the crystal piece 110 in the internal space (cavity) of the crystal resonator.
  • the second pad portions of the first and second electrodes 133 and 143 are arranged at least partially in a region off the extension line of the connecting members 111a and 111b.
  • the first electrode 133 is electrically connected to the first excitation electrode 130 via the extraction electrode 132 provided on the inner wall of the through hole 150 between the crystal piece 110 and the frame body 120. It is connected to the. Further, it is not necessary to form the extraction electrode of the second excitation electrode 140 on the inner wall of the through hole 150. Therefore, a resist forming process for providing an insulating portion on the inner wall is not necessary, and the manufacturing process is reduced, and occurrence of short circuit and disconnection is suppressed.
  • the extraction electrode 132 is formed on the entire inner wall of the through hole 150. Therefore, the quality inspection of the wiring inside the through hole 150 can be omitted. Therefore, the work process is reduced and the manufacturing time is shortened.
  • the first electrode 133 is provided in contact with at least a part of the outer edge of the lead electrode 132 and the through hole 150, and the second electrode 143 is provided apart from the outer edge of the opening. Yes.
  • the configuration of the extraction electrode is not limited to this.
  • the surface of the crystal piece 110 on the side where the base member 300 is disposed is positioned at the same height as the surface of the frame body 120 on which the base member 300 is disposed.
  • the depth of the concave portion 126 in the Y′-axis direction is not limited to this.
  • the surface on the side where the base member 300 of the crystal piece 113 is disposed is located farther from the base member 300 than the surface on the side where the base member 300 of the recess 126 in the frame 120 is disposed. Is formed. Thereby, a level
  • the crystal resonator 3 has a forward mesa shape in which the crystal piece 117 has a substantially rectangular outer shape in plan view and the outer edge portion is formed thinner than the center portion. Even in such a configuration, similarly to the crystal resonator 2, the propagation of vibration is reflected or diffused by the step formed between the concave portion 126 of the frame body 120 and the connecting member, resulting from the contact of the probe. The influence on the oscillation frequency is suppressed and the measurement accuracy is improved.
  • the first and second excitation electrodes 130, the region of the frame 120 on the side where the base member 300 is disposed are recessed to a predetermined extent from the joint surface with the base member 300.
  • a bonding region of the frame body 120 is formed in a region including the outer edge of the frame member 120, a recess 126 is formed in a region adjacent to the connecting members 111a and 111b, and the first electrode 133 is formed.
  • the first and second electrodes 133 and 143 Forming each second pad portion.
  • the method for manufacturing the crystal resonator is such that the first electrode 133 is electrically connected to the first excitation electrode 130 through the inner wall of the through hole 150 between the crystal piece 110 and the frame body 120. Forming the extraction electrode 132 on the inner wall of the through-hole 150. This eliminates the need for a resist forming step for providing an insulating portion on the inner wall of the through-hole 150, reduces the manufacturing steps, and suppresses the occurrence of short circuits and disconnections.
  • the method for manufacturing a crystal resonator includes forming the extraction electrode 132 on the entire inner wall of the through hole 150. Thereby, the quality inspection of the wiring inside the through hole 150 can be omitted. Therefore, the work process is reduced and the manufacturing time is shortened.
  • an aspect having a long side parallel to the X axis and a short side parallel to the Z ′ axis has been described as an example of an AT-cut quartz crystal resonator element.
  • the present invention is not limited to this.
  • the present invention may be applied to an AT-cut quartz crystal resonator element having a long side parallel to the Z ′ axis and a short side parallel to the X axis.
  • the aspect which has two connection members was demonstrated in the above description, the number of connection members is not limited, For example, the crystal piece and the frame may be connected by one connection member. .
  • each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention.
  • the present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof.
  • those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention.
  • each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate.
  • each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.
  • Crystal resonators 100, 103, 105 Crystal resonator elements 110, 113, 117 Crystal pieces 111a, 111b, 115b, 119b Connecting member 120 Frame body 130 First excitation electrode 132, 142 Extraction electrode 133 First electrode 134, 134a , 144, 144a Measurement pad 136, 146 Connection pad 140 Second excitation electrode 143 Second electrode 150 Through hole 170, 172 Sealing member 200 Lid member 300 Base member 322, 324, 326, 328 External electrode

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

Le dispositif selon la présente invention est pourvue : d'un élément d'oscillation à cristaux (100) qui comprend une bande de cristaux (110) dont les surfaces principales se font face, une première électrode d'excitation (130) et une seconde électrode d'excitation (140) disposées sur les surfaces principales, un corps de cadre (120), entourant une périphérie extérieure de la bande de cristaux, et un élément de jonction (111) ; d'un élément de couvercle (200) ; d'un élément de base (300) ayant des électrodes externes. Le corps de cadre (120) possède une première région, située du côté sur lequel l'élément de base est disposé, et une seconde région qui est creusée plus profondément que la première région. L'élément d'oscillation à cristaux (100) possède une première électrode (133), connectée électriquement à la première électrode d'excitation (130), et une seconde électrode (143), connectée électriquement à la seconde électrode d'excitation (140). Les première et seconde électrodes présentent des premières parties respectives de plot de connexion (136, 146), situées sur la première région, et des secondes parties respectives de plot de connexion (134, 144), situées sur la seconde région. Les première et seconde électrodes d'excitation sont connectées électriquement aux électrodes extérieures de l'élément de base par l'intermédiaire des premières parties respectives de plot de connexion des première et seconde électrodes.
PCT/JP2017/018910 2016-05-31 2017-05-19 Oscillateur à cristaux et son procédé de fabrication WO2017208866A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020027121A1 (ja) * 2018-08-02 2021-08-02 株式会社村田製作所 Ｍｅｍｓデバイス
WO2022014494A1 (fr) * 2020-07-15 2022-01-20 株式会社村田製作所 Dispositif à ondes élastiques

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119264A (ja) * 1999-10-15 2001-04-27 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2007013729A (ja) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp 水晶振動子の電極構造
JP2007243378A (ja) * 2006-03-07 2007-09-20 Epson Toyocom Corp 圧電振動子及びその製造方法
JP2010109528A (ja) * 2008-10-29 2010-05-13 Epson Toyocom Corp 圧電振動片、および圧電デバイス
JP2013098813A (ja) * 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP2015192279A (ja) * 2014-03-28 2015-11-02 京セラクリスタルデバイス株式会社 圧電振動子、圧電デバイス及び圧電振動子の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5129005B2 (ja) * 2008-04-17 2013-01-23 日本電波工業株式会社 圧電振動子及び圧電素子の製造方法並びに圧電振動子の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001119264A (ja) * 1999-10-15 2001-04-27 Nippon Dempa Kogyo Co Ltd 水晶振動子
JP2007013729A (ja) * 2005-06-30 2007-01-18 Kyocera Kinseki Corp 水晶振動子の電極構造
JP2007243378A (ja) * 2006-03-07 2007-09-20 Epson Toyocom Corp 圧電振動子及びその製造方法
JP2010109528A (ja) * 2008-10-29 2010-05-13 Epson Toyocom Corp 圧電振動片、および圧電デバイス
JP2013098813A (ja) * 2011-11-02 2013-05-20 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP2015192279A (ja) * 2014-03-28 2015-11-02 京セラクリスタルデバイス株式会社 圧電振動子、圧電デバイス及び圧電振動子の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2020027121A1 (ja) * 2018-08-02 2021-08-02 株式会社村田製作所 Ｍｅｍｓデバイス
JP7015484B2 (ja) 2018-08-02 2022-02-03 株式会社村田製作所 Ｍｅｍｓデバイス
US11909379B2 (en) 2018-08-02 2024-02-20 Murata Manufacturing Co., Ltd. MEMS device having a connection portion formed of a eutectic alloy
WO2022014494A1 (fr) * 2020-07-15 2022-01-20 株式会社村田製作所 Dispositif à ondes élastiques

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