WO2017208866A1

WO2017208866A1 - Crystal oscillator and method for manufacturing same

Info

Publication number: WO2017208866A1
Application number: PCT/JP2017/018910
Authority: WO
Inventors: 利克大櫃
Original assignee: 株式会社村田製作所
Priority date: 2016-05-31
Filing date: 2017-05-19
Publication date: 2017-12-07
Also published as: JPWO2017208866A1

Abstract

The present invention is provided with: a crystal oscillation element (100) including a crystal strip (110) that has principal surfaces facing each other, a first excitation electrode (130) and a second excitation electrode (140) provided on the principal surfaces, a frame body (120) surrounding an outer periphery of the crystal strip, and a joining member (111); a lid member (200); and a base member (300) having outer electrodes. The frame body (120) has a first region provided on the side on which the base member is disposed and a second region that is recessed more deeply than the first region. The crystal oscillation element (100) has a first electrode (133) electrically connected to the first excitation electrode (130) and a second electrode (143) electrically connected to the second excitation electrode (140). The first and second electrodes have respective first pad sections (136, 146) provided on the first region and respective second pad sections (134, 144) provided on the second region. The first and second excitation electrodes are electrically connected to the outer electrodes of the base member via the respective first pad sections of the first and second electrodes.

Description

Quartz crystal resonator and manufacturing method thereof

The present invention relates to a crystal resonator and a manufacturing method thereof.

Quartz vibrators with thickness shear vibration as the main vibration are widely used as signal sources for reference signals used in oscillators and bandpass filters. For example, as one aspect of the crystal resonator, there is a structure including a resonator body made of an AT-cut quartz material and having a pair of excitation electrodes, and a lid and a base bonded to the front and back main surfaces of the resonator body. It is known (see Patent Document 1). The crystal resonator has a connection pad electrically connected to an external electrode provided on the base on the base side of the resonator body, and the adjustment pad used for the inspection of the resonator body It is on the lid side of the main body.

JP2015-192279A

However, according to such a configuration, for each of the connection pad and the adjustment pad, one wiring is required to be routed on the front and back of the crystal resonator element, and at least two wirings in total are required. For this reason, there is a case where a short circuit or disconnection due to the wiring occurs due to the miniaturization of the crystal unit.

The present invention has been made in view of such circumstances, and an object thereof is to suppress defects caused by wiring and to improve the quality of a crystal resonator.

The crystal resonator according to the present invention includes a crystal piece having first and second main surfaces facing each other, a first excitation electrode provided on the first main surface of the crystal piece, and the second piece of the crystal piece. A quartz resonator element including a second excitation electrode provided on the main surface and facing the first excitation electrode; a frame surrounding the outer periphery of the crystal piece; and a connecting member connecting the frame and the crystal piece; The lid member is disposed opposite to the first excitation electrode side of the crystal resonator element, and is joined to the second excitation electrode side of the crystal resonator element, and the lid member joined to the frame so as to excite the crystal piece. A base member having an external electrode that is joined to the frame body so as to excite the crystal piece and that can be electrically connected to the outside, and the frame body is provided on a side where the base member is disposed. A first region that is formed and a second region that is recessed from the first region. The child has a first electrode electrically connected to the first excitation electrode and a second electrode electrically connected to the second excitation electrode, and each of the first and second electrodes includes a first electrode A first pad portion provided on the region and a second pad portion provided on the second region, wherein the first and second excitation electrodes are the first pad portions of the first and second electrodes, respectively. Is electrically connected to the external electrode of the base member.

According to the above configuration, the first electrically connected to the first and second excitation electrodes in the region recessed from the joint surface with the base member to a predetermined extent on the surface of the frame on which the base member is disposed. Each second pad portion of the second electrode is formed. Thereby, for example, the number of wirings routed on the front and back sides of the crystal resonator element can be reduced while forming a measurement pad necessary for electrical inspection of the crystal resonator element. Accordingly, it is possible to suppress defects such as a short circuit and disconnection of the wiring and improve the quality of the crystal resonator.

The method for manufacturing a crystal resonator according to the present invention includes: (a) preparing a first substrate having a plurality of crystal resonator elements, wherein the crystal resonator elements have first and second main surfaces facing each other. A piece, a first excitation electrode provided on the first main surface of the crystal piece, a second excitation electrode provided on the second main surface of the crystal piece and facing the first excitation electrode, Preparing a first substrate comprising a frame body that surrounds the outer periphery of the crystal piece and a connecting member that connects the frame body and the crystal piece; and (b) facing the first excitation electrode side of the crystal resonator element. Providing a second substrate having a plurality of lid members to be disposed; and (c) having an external electrode disposed facing the second excitation electrode side of the crystal resonator element and electrically connectable to the outside. Preparing a third substrate having a plurality of base members, (d) A crystal piece can be excited As described above, the first, second, and third substrates are joined so that the frame of the crystal resonator element is joined to the lid member and the base member, and (e) the joined first, second, and second substrates. Cutting the three substrates to obtain a plurality of individual crystal resonators, and the frame body is provided with a first region provided on a side where the base member is disposed, and a lower portion than the first region. The quartz crystal resonator element includes a first electrode electrically connected to the first excitation electrode and a second electrode electrically connected to the second excitation electrode. , Each of the first and second electrodes has a first pad portion provided on the first region and a second pad portion provided on the second region, and (a) Electrically inspecting the quartz crystal vibrating element through each second pad portion of the second electrode, wherein (d) is the first and second excitation electrodes Involves electrically connected to the external electrode of the base member through the respective first pad portions of the first and second electrodes.

According to the above method, the first electrically connected to the first and second excitation electrodes in a region recessed by a predetermined extent from the joint surface with the base member on the surface of the frame on which the base member is disposed. Each second pad portion of the second electrode can be formed. Thereby, for example, the number of wirings routed on the front and back of the crystal resonator element can be reduced while forming a measurement pad necessary for electrical inspection of the crystal pendulum. Accordingly, it is possible to suppress defects such as a short circuit and disconnection of the wiring and improve the quality of the crystal resonator.

According to the present invention, defects due to wiring can be suppressed and the quality of the crystal unit can be improved.

FIG. 1 is an exploded perspective view of a crystal resonator according to an embodiment of the present invention. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3A is a plan view of the crystal resonator element according to the embodiment of the invention. FIG. 3B is a plan view of the crystal resonator element according to the embodiment of the invention. FIG. 4 is a partially enlarged perspective view of the crystal resonator element according to the embodiment of the invention. FIG. 5 is a flowchart showing a method for manufacturing a crystal resonator according to an embodiment of the present invention. FIG. 6A is a diagram showing a procedure of a method for manufacturing a crystal resonator element according to an embodiment of the present invention. FIG. 6B is a diagram illustrating the procedure of the method for manufacturing the crystal resonator element according to the embodiment of the invention. FIG. 6C is a diagram illustrating a procedure of a method for manufacturing a crystal resonator element according to an embodiment of the present invention. FIG. 6D is a diagram illustrating a procedure of a method for manufacturing a crystal resonator element according to an embodiment of the present invention. FIG. 7 is a cross-sectional view of a crystal resonator according to a modification of one embodiment of the present invention. FIG. 8 is a cross-sectional view of a crystal resonator according to another modification of the embodiment of the present invention.

Embodiments of the present invention will be described below. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are exemplary, the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to the embodiments.

A crystal resonator (Quartz Crystal Resonator Unit) according to an embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is an exploded perspective view of the crystal resonator according to this embodiment, FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1, and FIG. 3A is a plan view of the crystal resonator element viewed from the lid member side. FIG. 3B is a plan view seen from the base member side of the crystal resonator element. FIG. 4 is a partially enlarged perspective view of the crystal resonator element.

As shown in FIG. 1, the crystal resonator 1 according to this embodiment includes a crystal resonator element 100 (Quartz Crystal Resonator), a lid member 200, and a base member 300.

The crystal resonator element 100 is constituted by an AT-cut quartz substrate, for example. The AT-cut quartz substrate has an X-axis, a Y-axis, and a Z-axis which are crystal axes of artificial quartz, and the Y-axis and the Z-axis are 35 degrees 15 minutes in the direction from the Y-axis to the Z-axis around the X-axis. When the axes rotated for 1 minute 30 seconds are the Y ′ axis and the Z ′ axis, respectively, the surfaces parallel to the plane specified by the X axis and the Z ′ axis are cut out. A quartz resonator element using an AT-cut quartz substrate has high frequency stability over a wide temperature range, is excellent in aging characteristics, and can be manufactured at low cost. In addition, the AT-cut crystal resonator element often uses a thickness shear vibration mode as a main vibration. Hereinafter, each configuration of the crystal resonator will be described with reference to the axial direction of the AT cut. Note that the quartz resonator element 100 may be composed of a quartz substrate formed by a cut other than the AT cut.

The lid member 200 and the base member 300 are a part of the configuration of a case or a package for housing a part of the crystal resonator element 100 (crystal piece). The crystal resonator element 100, the lid member 200, and the base member 300 have substantially the same dimensions and outer shapes when viewed in plan (for example, substantially rectangular outer shapes). When a manufacturing method (wafer level CSP: also referred to as Chip Size Package) in which wafers are packaged in a wafer state is used, a wafer corresponding to a lid member, a wafer corresponding to a crystal vibrating element, and a base member In order to manufacture each crystal resonator 1 by dicing a three-layer structure made of wafers to be manufactured at once, the crystal resonator element 100, the lid member 200, and the base member 300 have substantially the same size and shape.

The crystal resonator element 100 includes a substantially rectangular crystal piece 110 (Quartz Crystal Blank), a frame body 120 that surrounds the outer periphery of the crystal piece 110 with a predetermined gap when the main surface of the crystal piece 110 is viewed in plan,

Connection members

111 a and 111 b that are arranged in the gap and connect the crystal piece 110 and the frame body 120 are provided. The crystal piece 110, the frame body 120, and the connecting

members

111a and 111b are all formed from an AT-cut crystal substrate. The quartz crystal resonator element 100 as a whole has a long side parallel to the X axis, a short side parallel to the Z ′ axis, and a thickness parallel to the Y ′ axis. In the example shown in FIG. 1, both of the connecting

members

111 a and 111 b are arranged at one end (X-axis negative direction side) of the crystal piece 110 in the X-axis direction. That is, the crystal piece 110 is provided away from the frame body 120, and both are connected by the connecting

members

111a and 111b. In FIG. 1, two connecting members arranged on one end side in the X-axis direction are shown, but the number of connecting members, their arrangement, and the like are not particularly limited.

The shape of each

corner

102, 104, 106, 108 of the crystal resonator element 100 is not particularly limited, and is a rectangular shape having no notches as shown in FIG. Also good. Alternatively, apart from the example shown in FIG. 1, each corner may be formed with a cut-out side surface formed by cutting a part of the corner into a cylindrical curved surface (or castellation shape). In this case, each corner of the lid member 200 and the base member 300 may be formed with the cut-out side surface. Such a cut-out side surface is often formed in accordance with the adoption of a manufacturing method called wafer level CSP in which a wafer is packaged in a wafer state. In this case, the crystal resonator element 100, the lid member 200, and the base are formed. In the member 300, each cut-out side surface at the corresponding corner is arranged so as to coincide with the Y′-axis direction. In addition, the shape in case a notch side surface is formed may be shapes other than a cylindrical curved surface shape.

First and

second excitation electrodes

130 and 140 are formed on the front and back of the opposing main surface of the crystal piece 110. In the crystal piece 110, a portion where the first and

second excitation electrodes

130 and 140 face each other is an excitation portion (a portion excluding the first and second excitation electrodes 130 and 140). Although the thickness of the crystal piece 110 is not particularly limited, the thickness of the excitation portion of the crystal piece 110 is larger than the thickness of the frame 120 (a portion excluding a concave portion 126 described later) as shown in FIG. It may be thin. Alternatively, unlike the example shown in FIG. 2, the thickness of the excitation portion of the crystal piece 110 may be substantially the same as the thickness of the frame 120. Here, “substantially the same” is not limited to the case where the thickness of the crystal piece 110 and the frame body 120 are strictly the same. For example, a flat crystal substrate having an upper surface and a lower surface facing each other is used. This means that it includes a dimensional difference due to processing variations that may occur when forming by removal processing. The same applies to the following description. Further, in the thickness along the normal direction of the main surface of the crystal piece 110, the thickness of the connecting

members

111a and 111b is substantially the same as the thickness of the crystal portion serving as the excitation portion of the crystal piece 110 as shown in FIG. Or the thickness of the crystal portion may be smaller. By making the thickness of the connecting

members

111a and 111b thinner than the thickness of the crystal portion, the crystal piece 110 can be configured to be similar to the mesa structure. Therefore, it is possible to improve the confinement property of the vibration energy by the connecting

members

111a and 111b while maintaining the mechanical strength of the crystal resonator element 100 by the thickness of the frame body 120.

The first excitation electrode 130 is formed on the first surface 112 (first main surface) that is the surface on the Y′-axis positive direction side of the crystal piece 110, while the second excitation electrode 140 is formed on the Y ′ axis of the crystal piece 110. It is formed on the second surface 114 (second main surface) that is the surface on the negative axis direction side. The first and

second excitation electrodes

130 and 140 are arranged as a pair of electrodes so as to substantially overlap each other in plan view of the XZ ′ plane.

A through hole 150 is formed between the crystal piece 110 and the frame body 120 (for example, a region surrounded by the crystal piece 110, the frame body 120, and the connecting

members

111a and 111b). And the 1st excitation electrode 130 is formed so that the outer edge of the X-axis positive direction side of the opening part of the Y'-axis positive direction side of the said through-hole 150 may be contact | connected (refer FIG. 3A). An extraction electrode 132 is formed on the inner wall of the through-hole 150, and the extraction electrode 132 is electrically connected to the first excitation electrode 130 at the opening (see FIGS. 3A and 4). Thereby, the 1st excitation electrode 130 is electrically connected with the 1st electrode 133 formed in the 2nd surface 124 of the frame 120 via the extraction electrode 132 (refer FIG. 3B and FIG. 4).

As will be described later, in the present embodiment, it is not necessary to form the extraction electrode of the second excitation electrode 140 on the inner wall of the through hole 150. Therefore, a resist forming process for providing an insulating portion on the inner wall is not necessary, and the manufacturing process is reduced, and occurrence of short circuit and disconnection is suppressed. In addition, the extraction electrode 132 extracted from the first excitation electrode 130 to the first electrode 133 is formed on the entire inner wall of the through hole 150 as shown in FIG. 3A. By forming the extraction electrode 132 on the entire surface of the inner wall, the quality inspection of the wiring inside the through hole 150 can be omitted. Therefore, the work process is reduced and the manufacturing time is shortened. The extraction electrode may be formed on a part of the inner wall of the through hole.

The extraction electrode 142 electrically connected to the second excitation electrode 140 passes through the coupling member 111b and is extracted to the frame body 120 side (see FIGS. 3B and 4). On the connecting member 111b, the extraction electrode 142 is provided at a predetermined interval from the outer edge on the Z′-axis positive direction side of the opening on the Y′-axis negative direction side of the through hole 150 (see FIGS. 3B and 4). ). That is, the extraction electrode 142 is formed so as not to be electrically connected to the extraction electrode 132. Thereby, the 2nd excitation electrode 140 is electrically connected with the 2nd electrode 143 formed in the 2nd surface 124 side of the frame 120 (refer FIG. 3B and FIG. 4). In addition, since the 2nd electrode 143 is formed in the extraction electrode 142 on the same surface side (side where the base member 300 is arrange | positioned) as the 2nd excitation electrode 140, it pulls out to the surface on the opposite side through a through-hole. There is no need.

First and

second electrodes

133 and 143 are formed on the second surface 124 side of the frame body 120. The first electrode 133 includes

measurement pads

134 and 134a (second pad portion) and a connection pad 136 (first pad portion), and the second electrode 143 includes

measurement pads

144 and 144a (second pad portion) and connection. Pad 146 (first pad portion). Here, before describing the first and

second electrodes

133 and 143, the recess 126 will be described. In the following description, the

measurement pads

134 and 134a or the

measurement pads

144 and 144a may be referred to as “measurement pad 134” or “measurement pad 144” without distinction.

A recess 126 is formed on the second surface 124 side of the frame 120. The concave portion 126 is a region that is recessed on the Y′-axis positive direction side from the bonding region (first region) with the base member 300 on the second surface 124 side (the side on which the base member 300 is disposed) of the frame body 120. (Second region) (see FIG. 4). In the present embodiment, the joining region is formed in the outer edge portion including the outer edge of the frame body 120, and the recess 126 is formed in the region adjacent to the connecting

members

111a and 111b on the X axis negative direction side of the frame body 120. (See FIGS. 3B and 4). Although the shape of the recessed part 126 is not specifically limited, For example, a substantially rectangular external shape may be sufficient. The depth of the concave portion 126 on the Y′-axis positive direction side is not particularly limited, but in this embodiment, the bottom surface of the concave portion 126 (the surface facing the base member 300) is the same as the second surface 114 of the crystal piece 110. It is deep enough to be located at the height. Specifically, the recess 126, the connecting

members

111a and 111b, and the crystal piece 110 are flush with each other on the side where the base member 300 is disposed. By forming the recess 126 in the frame body 120, the thickness of the connecting

members

111 a and 111 b in the Y′-axis direction (that is, the thickness of the through hole 150) is equal to the thickness of the frame body 120 (part excluding the recess 126). Since the thickness is comparatively smaller, the distance of the extraction electrode 132 provided on the inner wall of the through hole 150 is shortened. Thereby, generation | occurrence | production of the disconnection by the defect | deletion of an electrode can be suppressed.

The

measurement pads

134 and 144 are formed on the bottom surface of the recess 126. Specifically, the measurement pad 134 is formed so that at least a part of the bottom surface of the recess 126 is in contact with the outer edge of the through hole 150 on the Y′-axis negative direction side on the X-axis negative direction side. Yes. Thereby, the measurement pad 134 is electrically connected to the extraction electrode 132 formed on the inner wall of the through hole 150. On the other hand, the measurement pad 144 is electrically connected to the extraction electrode 142 on the bottom surface of the concave portion 126 so as not to contact the outer edge of the opening of the through hole 150 (that is, not electrically connected to the extraction electrode 132). Is formed). The measurement pad 134 is electrically connected to the measurement pad 134a formed on the side surface of the concave portion 126 on the negative side of the Z ′ axis, and the measurement pad 144 is connected to the concave portion 126 on the positive side of the Z ′ axis. It is electrically connected to the measurement pad 144a formed on the side surface (see FIG. 4).

The

measurement pads

134 and 144 are pads used for applying a voltage to the first and

second excitation electrodes

130 and 140 when the crystal resonator element 100 is electrically inspected. The electrical inspection is performed, for example, by bringing a pair of probes or the like into contact with the

measurement pads

134 and 144 and applying a voltage to the first and second excitation electrodes. Details of the electrical inspection method will be described later.

Note that the

measurement pads

134 and 144 are formed so as to be partially extended from the extension lines of the connecting

members

111a and 111b (that is, on the vibration propagation path of the excitation vibration) (see FIG. 4). . Thereby, the influence on the oscillation frequency caused by bringing the probe into contact with the measurement pad is suppressed, and the measurement accuracy is improved. In addition, the area | region remove | deviated from the extension line | wire of the

connection members

111a and 111b may be an outer side in the Z'-axis direction from the said extension line | wire, and may be inside.

The

connection pads

136 and 146 are formed on the second surface 124 of the frame body 120 (joining region with the base member 300). Specifically, the connection pad 136 is at least partially in contact with the outer edge of the concave portion 126 on the Z′-axis negative direction side near the corner 102 of the frame body 120 on the second surface 124 of the frame body 120. The connection pad 146 is formed on the second surface 124 of the frame body 120 so that the outer edge of the concave portion 126 on the Z′-axis positive direction side is at least partially in contact with the corner 104 of the frame body 120. (See FIG. 4). Accordingly, the connection pad 136 is in contact with the measurement pad 134a (electrically connected to the measurement pad 134), and the connection pad 146 is in contact with the measurement pad 144a (electrically connected to the measurement pad 144). Accordingly, the connection pad 136 is electrically connected to the first excitation electrode 130 via the

measurement pads

134a and 134 and the extraction electrode 132, and the connection pad 146 includes the

measurement pads

144a and 144 and the extraction electrode 142. And is electrically connected to the second excitation electrode 140.

The

connection pads

136 and 146 are connected to the first and

second excitation electrodes

130 and 140 and the first surface 302 of the base member (on the side where the crystal resonator element 100 is disposed) when the crystal resonator element 100 and the base member 300 are joined. It is a pad used for electrically connecting an external electrode formed on the surface). The first and

second excitation electrodes

130 and 140 are electrically connected to the

external electrodes

322 and 326 formed on the base member 300 through

connection pads

136 and 146, respectively (see FIG. 1).

In each of the electrodes and pads including the first and

second excitation electrodes

130 and 140, for example, the base is formed of a chromium (Cr) layer, and a gold (Au) layer is formed on the surface of the chromium layer. In addition, each electrode is not limited only to said material.

The lid member 200 is disposed on the first surface 122 side of the frame body 120 so as to face the first excitation electrode 130 formed on the first surface 112 of the crystal piece 110, and the base member 300 is disposed on the first surface 122 of the crystal piece 110. The lid member 200, the crystal resonator element 100, and the base member 300 are arranged in three layers in this stacking order so as to be opposed to the second excitation electrode 140 formed on the second surface 114 and on the second surface 124 side of the frame body 120. It has a structure. The lid member 200 has a first surface 202 and a second surface 204 opposite to the first surface 202 and facing the crystal resonator element 100. The base member 300 has a first surface 302 that faces the crystal resonator element 100 and a second surface 304 that is opposite to the first surface 302. In the present embodiment, the second surface 304 of the base member 300 is a mounting surface that is electrically connected to the outside.

External electrodes

322, 324, 326, and 328 are formed on the second surface 304 of the base member 300 at each corner. Specifically,

external electrodes

322 and 324 are formed at two corners on the X axis negative direction side, and

external electrodes

326 and 328 are formed at two corners on the X axis positive direction side. The

external electrodes

322, 324, 326, and 328 are drawn out to the first surface 302 side by electrodes formed on the end surface of the base member 300. Further, on the first surface 302 of the base member 300, the external electrode 322 is provided to extend to a certain extent at the corner on the negative side in the X-axis negative direction Z′-axis, and the external electrode 326 faces the negative side in the X-axis direction. Are extended to a certain extent at the corner on the X-axis negative direction Z′-axis positive direction side (see FIG. 1).

When the crystal resonator element 100 is mounted on the base member 300, the external electrode 322 is electrically connected to the first excitation electrode 130 via the connection pad 136, the measurement pad 134, and the extraction electrode 132, and the external electrode 326. Is electrically connected to the second excitation electrode 140 via the connection pad 146, the measurement pad 144, and the extraction electrode 142 (see FIG. 1). The remaining

external electrodes

324 and 328 are dummy electrodes (also called floating electrodes) that are not electrically connected to any of the first and

second excitation electrodes

130 and 140. The dummy electrode may be connected to a terminal provided on a substrate (not shown) on which the crystal unit 1 is mounted and not connected to any other electronic element. In the example shown in FIG. 1, the

external electrodes

322 and 326 that are electrically connected to the first and

second excitation electrodes

130 and 140 are arranged at opposite corners of the base member 300, It is not limited and may be arranged at other corners. Further, when notched side surfaces such as castellation shapes are formed at each corner of the base member 300, each external electrode extends from the second surface 304 of the base member 300 to the notched side surface at each corresponding corner. It may have been issued.

External electrodes

322, 324, 326, and 328 are formed of, for example, chromium (Cr) or gold (Au). Specifically, for example, the external electrode is formed by forming a conductive material by a sputtering method and then additionally forming a conductive material by a plating method. Note that the

external electrodes

322, 324, 326, and 328 are not particularly limited to the above materials, and a known conductive material can be used. Moreover, well-known formation methods other than said formation method can be used. In the present embodiment, a four-terminal structure including four external electrodes is shown. However, the number of external electrodes is not particularly limited. For example, a two-terminal structure including two external electrodes may be applied. .

In the present embodiment, the lid member 200 and the base member 300 are flat substrates, but the lid member 200 and the base member 300 may have a concave shape opened in a direction facing the crystal resonator element 100. Moreover, the material of the lid member 200 and the base member 300 is made of glass (for example, silicate glass or a material mainly composed of materials other than silicate and having a glass transition phenomenon due to temperature rise). Alternatively, it may be made of quartz (for example, AT-cut quartz), which is the same material as the quartz resonator element 100, or glass epoxy resin in which glass fiber is impregnated with epoxy resin.

As shown in FIGS. 1 and 2, the lid member 200 is joined to the entire circumference of the first surface 122 of the frame body 120 via the sealing member 170, while the base member 300 is connected to the second surface of the frame body 120. The entire periphery of the surface 124 is joined via a sealing member 172. By providing the sealing

members

170 and 172 on the entire circumference of each surface of the frame body 120, the crystal piece 110 is hermetically sealed in the internal space (cavity). It is preferable that the pressure in the internal space is in a vacuum state lower than the atmospheric pressure because changes with time due to oxidation of the first excitation electrode 130 and the second excitation electrode 140 can be reduced. The material of the sealing

members

170 and 172 is not limited as long as the bonding surfaces of the members can be bonded to each other and the internal space can be hermetically sealed. For example, low-melting glass (for example, lead borate or tin phosphate) Glass adhesive material such as a system) or a resin adhesive may be used. When the frame body 120 is bonded to the lid member 200 and the base member 300 using an adhesive material including a resin material having a smaller mechanical quality factor Qm than the glass adhesive material, the sealing

members

170 and 172 are removed from the frame body 120. Is desirable because vibration propagating through is consumed more in the adhesive material.

Next, the reason why the

measurement pads

134 and 144 are provided inside the recess 126 will be described. If electrical inspection is performed by bringing a probe or the like into contact with the

connection pads

136 and 146, the connection pads 136 and 146 (that is, the joint surface with the base member 300) are damaged or contaminated, and When joining with the base member 300, the reliability of joining between the

connection pads

136 and 146 and the

external electrodes

322 and 326 may be lowered. On the other hand, in the present embodiment, a probe or the like can be brought into contact with the

measurement pads

134 and 144 formed on the inner bottom surface of the recess 126 that is recessed from the second surface 124 to the first surface 122 side of the frame 120. . As a result, even when the measurement pads 134 and 144 (that is, the surface that is not bonded to the base member 300) are damaged or contaminated in the electrical inspection of the crystal resonator element 100, the bonding force is reduced due to the damage or contamination. In addition, the crystal resonator element 100 and the base member 300 can be joined. Therefore, it is possible to suppress a decrease in bonding reliability caused by the electrical inspection of the crystal resonator element 100.

As described above, according to the crystal resonator 1 according to the present embodiment, the connection pad (first pad portion of the first electrode) and the measurement pad (first electrode) electrically connected to the first excitation electrode 130. Second pad portion), a connection pad (first pad portion of the second electrode) and a measurement pad (second pad portion of the second electrode) electrically connected to the second excitation electrode 140, Both are formed on the second surface 124 side of the frame body 120. Thereby, compared to the crystal resonator disclosed in Patent Document 1, a measurement pad required for electrical inspection of the crystal resonator element and a connection required for bonding the first and second excitation electrodes and the external electrode are required. While the pad is formed, it is possible to reduce the total number of wirings routed on the front and back surfaces of the crystal resonator element having a high probability of wiring peeling and cutting. Accordingly, it is possible to improve the quality of the crystal unit while reducing the size of the crystal unit and suppressing defects such as a short circuit and disconnection of wiring. In addition, the wiring manufacturing process can be simplified. Furthermore, since both the measurement pad and the connection pad are formed on the same surface side of the crystal resonator element 100, the inspection of the pad quality (for example, shape, misalignment, etc.) using image capturing or the like is simplified. The

In the present embodiment, the measurement pad is formed not only on the bottom surface of the recess 126 but also on the side surface, so that the area in which the probe can be contacted is expanded and the operation in the inspection becomes easy.

In addition, the area | region in which the recessed part 126 is formed is not specifically limited, What is necessary is just the area | region which is a 2nd surface side of a frame, and is provided with the measurement pad so that it may be electrically connected with an extraction electrode. In addition, by forming the concave portion in a region not including the outer edge of the frame body, the measurement pad can be hermetically sealed together with the crystal piece in the internal space (cavity) of the crystal resonator.

Further, the arrangement of the first and second electrodes 133 and 143 (including the

measurement pads

134 and 144 and the connection pads 136 and 146) electrically connected to the first and

second excitation electrodes

130 and 140 is particularly limited. Is not to be done. As shown in this embodiment, each of the

measurement pads

134 and 144 may be disposed between the connection pad 136 and the connection pad 146, or conversely, the connection pad is connected to each measurement pad. You may arrange | position between. Further, the first and second electrodes may be disposed on the two

corners

106 and 108 side of the frame body 120 on the X axis positive direction side.

Next, a method for manufacturing a crystal resonator according to an embodiment of the present invention will be described with reference to FIGS. 6A to 6D based on the flowchart of FIG. In the present embodiment, as an example, a method for manufacturing the crystal resonator 1 shown in FIGS. 1 to 4 will be described. The manufacturing method of the crystal unit in the present embodiment includes manufacturing by applying a wafer level packaging technique for packaging in a wafer state. In the following, among the constituent elements in the state before being singulated into the crystal unit 1, the same constituent elements as those in the state after being singulated are denoted by the same terms and symbols for convenience of explanation. explain.

First, as shown in FIG. 6A, a first substrate 10 is prepared (S10 in FIG. 5). The first substrate 10 is a substrate for forming a plurality of crystal resonator elements 100. As the material of the first substrate 10, the contents described for the quartz resonator element 100 described above can be applied. For example, a quartz substrate obtained by cutting a quartz material from an artificial quartz or a natural quartz ore into a wafer at a predetermined cut angle is used. Can be used.

For the first substrate 10, the crystal piece 110 of the crystal resonator element 100 described above, the frame body 120 surrounding the outer periphery of the crystal piece 110, and the crystal piece by a process such as photolithography, etching, and film formation for each predetermined region. 110 and 110, the first and

second excitation electrodes

130 and 140, the

extraction electrodes

132 and 142, the

measurement pads

134 and 144, and the

connection pads

136 and 146. The first and

second electrodes

133 and 143 are formed. The

measurement pads

134 and 144 and the

connection pads

136 and 146 are formed, for example, by forming a recess 126 in the frame body 120 of the first substrate 10 by photolithography and etching, and forming a conductive material in the recess 126 by sputtering or the like. It can be formed as a film.

Next, as shown in FIG. 6B, an electrical inspection is performed on each crystal resonator element 100 formed on the first substrate 10 (S20 in FIG. 5). In the electrical inspection, for example, a pair of probes or the like are brought into contact with the

measurement pads

134 and 144 and a voltage is applied to the first and

second excitation electrodes

130 and 140. Thereby, the oscillation frequency and crystal impedance value (CI value) of the crystal resonator element 100 are measured, and the frequency of the crystal resonator element 100 is adjusted. The frequency is adjusted by, for example, removing a part of the first or

second excitation electrodes

130 and 140 by laser light irradiation or attaching a metal to the crystal piece 110 by vapor deposition. This is done by adjusting the mass of the

excitation electrodes

130 and 140.

Next, the second substrate 20 and the third substrate 30 are prepared (S30 in FIG. 5). The second substrate 20 and the third substrate 30 are substrates for forming the lid member 200 and the base member 300, respectively. The second substrate 20 has a region corresponding to the plurality of lid members 200, and the third substrate 30 has a region corresponding to the plurality of base members 300. The materials described for the lid member 200 and the base member 300 can be applied to the materials of the second substrate 20 and the third substrate 30. For example, the second substrate 20 and the third substrate 30 can be made of quartz. it can. In that case, the first substrate 10, the second substrate 20, and the third substrate 30 may be crystal substrates having the same cut angle (for example, AT cut). The first substrate 10, the second substrate 20, and the third substrate 30 have substantially the same outer shape in plan view as viewed in the thickness direction. For the third substrate 30, the external electrodes described above are formed for each predetermined region by processes such as photolithography, etching, and film formation.

Next, as shown in FIG. 6C, the second substrate 20 is bonded to the upper surface of the first substrate 10 (the side where the first excitation electrode 130 is formed on the crystal piece 110), and the lower surface of the first substrate 10 (the crystal The 3rd board | substrate 30 is joined to the piece 110 in which the 2nd excitation electrode 140 was formed, and the laminated member 40 is obtained (S40 of FIG. 5).

The second substrate 20, the first substrate 10, and the third substrate 30 are laminated and joined in this order. At this time, through the sealing members 170 and 172 (not shown) so that each crystal piece 110 of the first substrate 10 can be excited on the entire circumference of each surface of the frame body 120 of the first substrate 10. The second substrate 20 and the third substrate 30 are joined. In this way, by bonding the second substrate 20 and the third substrate 30, the plurality of crystal pieces 110 on the first substrate 10 are hermetically sealed. In addition, when any substrate is a quartz substrate, each substrate may be bonded by an intermolecular force of quartz without using a sealing member.

Next, as shown in FIG. 6D, the laminated member 40 is cut out to obtain a plurality of pieces (S50 in FIG. 5). The laminated member 40 is cut out by a method such as dicing or wire cutting, and is separated into pieces for each crystal resonator.

Thereafter, an external electrode is formed on each crystal resonator (S60 in FIG. 5). An external electrode is formed on the bottom surface of the crystal resonator (the surface of the base member 300 opposite to the crystal resonator element 100) by appropriately combining, for example, a sputtering method, a vacuum evaporation method, or a plating method. By forming the external electrode, the mountability of the crystal resonator is ensured.

In S10 of FIG. 5, the first region is formed in a region including the outer edge of the frame body 120, and the second region (that is, the concave portion 126) is formed in a region adjacent to the connecting members 111a and 111b. 134 and 144 may be formed in a region between the connection pad 136 and the connection pad 146 and out of the extension line of the

coupling members

111a and 111b.

Further, in S10 of FIG. 5, the extraction electrode 132 is connected to the first excitation electrode 130 through the inner wall of the through hole 150 between the crystal piece 110 and the frame body 120. You may form in an inner wall. The extraction electrode 132 may be formed on the entire inner wall of the through hole 150.

Further, steps S10 to S30 shown in FIG. 5 are not limited to this order, and the order may be changed.

The aspect of the crystal resonator element according to the present embodiment can be applied with various modifications. Hereinafter, a modification of the crystal resonator according to the present embodiment will be described with reference to FIGS. In the following description, differences from the contents described in the above embodiment will be described.

FIG. 7 is a cross-sectional view of a crystal resonator 2 according to a modification of the present embodiment. This sectional view shows a sectional view of the crystal unit 2 in the same direction as the sectional view taken along the line II-II of FIG. 1 shown in FIG. The crystal resonator 2 includes a crystal resonator element 103. The crystal vibrating element 103 includes a crystal piece 113 and a connecting member 115b instead of the crystal piece 110 and the connecting member 111b in the crystal vibrating element 100 shown in FIG. Note that the connecting member on the Z′-axis negative direction side is the same as the connecting member 115b, and thus detailed description thereof is omitted.

In the present modification, the second surface 114 of the crystal piece 113 is closer to the first surface 302 of the base member 300 than the bottom surface of the recess 126 formed in the frame body 120 (the surface on the side where the base member 300 is disposed). 2 is different from the configuration shown in FIG. 2 in this respect. In other words, in the thickness along the normal direction of the main surface of the crystal piece 113, the thickness of the frame body 120 (the portion excluding the concave portion 126), the thickness of the region where the concave portion 126 of the frame body 120 is formed, and the crystal piece The thicknesses of the 113 and the connecting member 115b are reduced in this order. Accordingly, a step is formed between the recess 126 of the frame body 120 and the connecting member 115b. The

measurement pads

134 and 144 are on the extension line of the connecting member (that is, on the vibration propagation path of the excitation vibration) and are formed from the connecting member through the step (see FIG. 7).

As a result, even if the

measurement pads

134 and 144 are formed on the vibration propagation path, the vibration propagation is reflected or diffused by the above-described step, so that the influence on the oscillation frequency caused by the contact of the probe is suppressed. Measurement accuracy is improved. In addition, since the measurement pad can be arranged on the extension line of the vibration propagation path, the degree of freedom in design such as the arrangement of the measurement pad and the width of the bonding region is increased. Accordingly, it is easy to improve the bonding force between the crystal resonator element and the base member and to reduce the size of the crystal resonator. Furthermore, since the thickness of the connecting member (that is, the thickness of the through hole) is reduced as compared with the crystal resonator element 100 shown in FIG. 1, the distance between the extraction electrodes provided on the inner wall of the through hole is further shortened. The occurrence of disconnection due to electrode defects can be suppressed.

FIG. 8 is a cross-sectional view of a crystal resonator 3 according to another modification of the present embodiment. This sectional view shows a sectional view of the crystal unit 3 in the same direction as the sectional view taken along the line II-II in FIG. 1 shown in FIG. The crystal resonator 3 includes a crystal resonator element 105. The crystal vibrating element 105 includes a crystal piece 117 and a connecting member 119b instead of the crystal piece 110 and the connecting member 111b in the crystal vibrating element 100 shown in FIG. Note that the connecting member on the Z′-axis negative direction side is the same as the connecting member 119b, and thus detailed description thereof is omitted.

In this modification, the crystal piece 117 has a forward mesa shape in which the outer edge portion is formed thinner than the center portion, and this is different from the configuration shown in FIG. Further, the second surface 114 at the center of the crystal piece 117 is the bottom surface of the recess 126 formed in the frame 120 with respect to the first surface 302 of the base member 300 (the surface on the side where the base member 300 is disposed). And at approximately the same position. In this modification, the crystal piece 117 has a substantially rectangular outer shape in plan view, but the shape of the crystal piece 117 is not limited to this.

Even in such a configuration, similarly to the crystal resonator 2, the propagation of vibration is reflected or diffused by the step formed between the concave portion 126 of the frame body 120 and the connecting member, resulting from the contact of the probe. The influence on the oscillation frequency can be suppressed.

In any of the configurations described in the above modifications, as described above, the first and second electrodes electrically connected to the first and

second excitation electrodes

130 and 140 are both the first and second electrodes of the frame body 120. By being formed on the second surface 124 side, the total number of wirings routed on the front and back of the crystal resonator element can be reduced. Accordingly, it is possible to improve the quality of the crystal unit while reducing the size of the crystal unit and suppressing defects such as a short circuit and disconnection of wiring. In addition, the wiring manufacturing process can be simplified.

The exemplary embodiments of the present invention have been described above. The quartz crystal resonators 1 to 3 include first and

second excitation electrodes

130 and 140 in a region that is depressed to a predetermined extent from the joint surface with the base member 300 on the surface of the frame 120 where the base member 300 is disposed. The second pad portions of the first and

second electrodes

133 and 143 that are electrically connected are formed. Thereby, for example, the number of wirings routed on the front and back of the crystal resonator element 100 can be reduced while forming the

measurement pads

134 and 144 necessary for the electrical inspection of the crystal resonator element. Accordingly, it is possible to suppress defects such as a short circuit and disconnection of the wiring and improve the quality of the crystal resonator.

In the crystal resonators 1 to 3, the second pad portions of the first and

second electrodes

133 and 143 are disposed between the first pad portion of the first electrode 133 and the second pad portion of the second electrode 143. It may be arranged.

Further, in the crystal resonators 1 to 3, a joining region of the frame 120 is formed in a region including the outer edge of the frame 120, and a recess 126 is formed in a region adjacent to the connecting

members

111a and 111b. Thus, the

measurement pads

134 and 144 can be hermetically sealed together with the crystal piece 110 in the internal space (cavity) of the crystal resonator.

Further, in the crystal resonators 1 to 3, the second pad portions of the first and

second electrodes

133 and 143 are arranged at least partially in a region off the extension line of the connecting

members

111a and 111b. As a result, the influence on the oscillation frequency caused by bringing the probe into contact with the

measurement pads

134 and 144 is suppressed, and the measurement accuracy is improved.

In the crystal resonators 1 to 3, the first electrode 133 is electrically connected to the first excitation electrode 130 via the extraction electrode 132 provided on the inner wall of the through hole 150 between the crystal piece 110 and the frame body 120. It is connected to the. Further, it is not necessary to form the extraction electrode of the second excitation electrode 140 on the inner wall of the through hole 150. Therefore, a resist forming process for providing an insulating portion on the inner wall is not necessary, and the manufacturing process is reduced, and occurrence of short circuit and disconnection is suppressed.

Further, in the crystal resonators 1 to 3, the extraction electrode 132 is formed on the entire inner wall of the through hole 150. Thereby, the quality inspection of the wiring inside the through hole 150 can be omitted. Therefore, the work process is reduced and the manufacturing time is shortened.

In the crystal resonators 1 to 3, the first electrode 133 is provided in contact with at least a part of the outer edge of the lead electrode 132 and the through hole 150, and the second electrode 143 is provided apart from the outer edge of the opening. Yes. The configuration of the extraction electrode is not limited to this.

Further, in the crystal unit 1, the surface of the crystal piece 110 on the side where the base member 300 is disposed is positioned at the same height as the surface of the frame body 120 on which the base member 300 is disposed. . The depth of the concave portion 126 in the Y′-axis direction is not limited to this.

Further, in the crystal resonator 2, the surface on the side where the base member 300 of the crystal piece 113 is disposed is located farther from the base member 300 than the surface on the side where the base member 300 of the recess 126 in the frame 120 is disposed. Is formed. Thereby, a level | step difference is formed between the recessed part 126 of the frame 120, and a connection member. Therefore, even if the

measurement pads

134 and 144 are formed on the vibration propagation path, the propagation of vibration is reflected or diffused by the above-described step, and the influence on the oscillation frequency due to the contact of the probe is suppressed, and measurement is performed. Accuracy is improved.

Further, the crystal resonator 3 has a forward mesa shape in which the crystal piece 117 has a substantially rectangular outer shape in plan view and the outer edge portion is formed thinner than the center portion. Even in such a configuration, similarly to the crystal resonator 2, the propagation of vibration is reflected or diffused by the step formed between the concave portion 126 of the frame body 120 and the connecting member, resulting from the contact of the probe. The influence on the oscillation frequency is suppressed and the measurement accuracy is improved.

In addition, in the method for manufacturing the crystal resonator, the first and second excitation electrodes 130, the region of the frame 120 on the side where the base member 300 is disposed are recessed to a predetermined extent from the joint surface with the base member 300. Forming a second pad portion of each of the first and

second electrodes

133, 143 electrically connected to 140. Thereby, for example, the number of wirings routed on the front and back of the crystal resonator element 100 can be reduced while forming the

measurement pads

Further, in the method for manufacturing the crystal resonator, a bonding region of the frame body 120 is formed in a region including the outer edge of the frame member 120, a recess 126 is formed in a region adjacent to the connecting

members

111a and 111b, and the first electrode 133 is formed. Between the first pad portion and the first pad portion of the second electrode 143, at least partially in a region outside the extension line of the connecting

members

111 a and 111 b, the first and

second electrodes

133 and 143 Forming each second pad portion. As a result, the influence on the oscillation frequency caused by bringing the probe into contact with the

measurement pads

134 and 144 is suppressed, and the measurement accuracy is improved.

In addition, the method for manufacturing the crystal resonator is such that the first electrode 133 is electrically connected to the first excitation electrode 130 through the inner wall of the through hole 150 between the crystal piece 110 and the frame body 120. Forming the extraction electrode 132 on the inner wall of the through-hole 150. This eliminates the need for a resist forming step for providing an insulating portion on the inner wall of the through-hole 150, reduces the manufacturing steps, and suppresses the occurrence of short circuits and disconnections.

Further, the method for manufacturing a crystal resonator includes forming the extraction electrode 132 on the entire inner wall of the through hole 150. Thereby, the quality inspection of the wiring inside the through hole 150 can be omitted. Therefore, the work process is reduced and the manufacturing time is shortened.

In the above-described embodiment (including modifications), an aspect having a long side parallel to the X axis and a short side parallel to the Z ′ axis has been described as an example of an AT-cut quartz crystal resonator element. The present invention is not limited to this. For example, the present invention may be applied to an AT-cut quartz crystal resonator element having a long side parallel to the Z ′ axis and a short side parallel to the X axis. Moreover, although the aspect which has two connection members was demonstrated in the above description, the number of connection members is not limited, For example, the crystal piece and the frame may be connected by one connection member. .

Each embodiment described above is for facilitating understanding of the present invention, and is not intended to limit the present invention. The present invention can be changed / improved without departing from the spirit thereof, and the present invention includes equivalents thereof. In other words, those obtained by appropriately modifying the design of each embodiment by those skilled in the art are also included in the scope of the present invention as long as they include the features of the present invention. For example, each element included in each embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those illustrated, and can be changed as appropriate. In addition, each element included in each embodiment can be combined as much as technically possible, and combinations thereof are included in the scope of the present invention as long as they include the features of the present invention.

1-3

Crystal resonators

100, 103, 105

Crystal resonator elements

110, 113, 117

Crystal pieces

111a, 111b, 115b, 119b Connecting member 120 Frame body 130

First excitation electrode

132, 142 Extraction electrode 133

First electrode

134, 134a , 144,

144a Measurement pad

136, 146 Connection pad 140 Second excitation electrode 143 Second electrode 150 Through

hole

170, 172 Sealing member 200 Lid member 300

Base member

322, 324, 326, 328 External electrode

Claims

A crystal piece having first and second main surfaces facing each other, a first excitation electrode provided on the first main surface of the crystal piece, and provided on the second main surface of the crystal piece, the first A quartz resonator element comprising: a second excitation electrode facing the excitation electrode; a frame surrounding the outer periphery of the crystal piece; and a connecting member connecting the frame and the crystal piece;
A lid member that is disposed opposite to the first excitation electrode side of the crystal resonator element and is bonded to the frame so as to excite the crystal piece;
A base having an external electrode that is disposed opposite to the second excitation electrode side of the crystal resonator element, is joined to the frame body so as to excite the crystal piece, and is electrically connectable to the outside. A member,
With
The frame body has a first region provided on the side where the base member is disposed and a second region that is recessed from the first region,
The crystal resonator element includes a first electrode electrically connected to the first excitation electrode, and a second electrode electrically connected to the second excitation electrode,
Each of the first and second electrodes has a first pad portion provided on the first region and a second pad portion provided on the second region,
The first and second excitation electrodes are crystal resonators that are electrically connected to the external electrodes of the base member through the first pad portions of the first and second electrodes.
2. The crystal resonator according to claim 1, wherein each of the second pad portions of the first and second electrodes is a measurement pad for electrical inspection.
The each second pad portion of the first and second electrodes is disposed between the first pad portion of the first electrode and the first pad portion of the second electrode. The crystal unit described in 1.
The first region of the frame is a region including an outer edge of the frame,
The crystal resonator according to any one of claims 1 to 3, wherein the second region of the frame is a region adjacent to the connecting member.
The quartz crystal according to any one of claims 1 to 4, wherein each of the second pad portions of the first and second electrodes is disposed at least partially in a region off the extension line of the connecting member. Vibrator.
The first electrode of claim 1 to 5, wherein the first electrode is electrically connected to the first excitation electrode via an extraction electrode provided on an inner wall of a through hole between the crystal piece and the frame. The crystal unit according to any one of the above.
The crystal resonator according to claim 6, wherein the extraction electrode is formed on the entire inner wall of the through hole.
The first electrode is provided in contact with at least a part of the outer edge of the opening of the through hole, and the second electrode is provided apart from the outer edge of the opening of the through hole. The crystal unit described in 1.
The surface of the crystal piece on the side where the base member is disposed is positioned at the same height as the surface of the second region of the frame on which the base member is disposed. The crystal unit according to claim 1.
2. The surface of the crystal piece on the side where the base member is arranged is a position farther from the base member than the surface of the second region on the side where the base member is arranged. The crystal resonator according to any one of 1 to 8.
The crystal resonator according to any one of claims 1 to 10, wherein the crystal piece has a substantially rectangular outer shape in a plan view and a forward mesa shape in which an outer edge portion is formed thinner than a center portion. .
(A) preparing a first substrate having a plurality of crystal resonator elements, wherein the crystal resonator elements have first and second main surfaces facing each other, and the first main portion of the crystal fragments; A first excitation electrode provided on a surface, a second excitation electrode provided on the second main surface of the crystal piece and facing the first excitation electrode, a frame surrounding the outer periphery of the crystal piece, Providing a first substrate comprising a frame and a connecting member for connecting the crystal piece;
(B) preparing a second substrate having a plurality of lid members arranged to face the first excitation electrode side of the crystal resonator element;
(C) providing a third substrate having a plurality of base members having external electrodes that are arranged opposite to the second excitation electrode side of the crystal resonator element and that can be electrically connected to the outside;
(D) bonding the first, second, and third substrates so that the frame of the crystal resonator element is bonded to the lid member and the base member so that the crystal piece can be excited; as well as,
(E) cutting the bonded first, second and third substrates to obtain a plurality of separated crystal resonators;
Including
The frame body has a first region provided on the side where the base member is disposed and a second region that is recessed from the first region,
The crystal resonator element includes a first electrode electrically connected to the first excitation electrode, and a second electrode electrically connected to the second excitation electrode,
Each of the first and second electrodes has a first pad portion provided on the first region and a second pad portion provided on the second region,
(A) includes electrically inspecting the crystal resonator element through the second pad portions of the first and second electrodes;
(D) includes electrically connecting the first and second excitation electrodes to the external electrode of the base member via the first pad portions of the first and second electrodes, A method for manufacturing a crystal unit.
In (a) above,
Forming the first region in a region including an outer edge of the frame, and forming the second region in a region adjacent to the connecting member;
At least partially between the first pad portion of the first electrode and the first pad portion of the second electrode and in a region outside the extension line of the connecting member, the first and second The method for manufacturing a crystal resonator according to claim 12, wherein each of the second pad portions of two electrodes is formed.
In (a) above,
Forming an extraction electrode on the inner wall of the through hole so that the first electrode is electrically connected to the first excitation electrode via the inner wall of the through hole between the crystal piece and the frame; A method for manufacturing a crystal resonator according to claim 12 or 13.
In (a) above,
The method for manufacturing a crystal resonator according to claim 14, wherein the extraction electrode is formed on the entire inner wall of the through hole.