JP2012124706A - Method of manufacturing piezoelectric oscillator, and piezoelectric oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric oscillator, along with a piezoelectric oscillator, capable of assuring the space of a cavity by forming an inspection electrode on the upper surface of the piezoelectric oscillator.SOLUTION: The method of manufacturing a piezoelectric oscillator includes: a step (S101) for preparing a piezoelectric wafer in which a plurality of piezoelectric vibration elements having a piezoelectric piece and an outer frame are formed; a step (S103) for preparing a first wafer in which a plurality of first containers having an inspection electrode are formed, and in which a plurality of through holes are formed on the side shared by adjoining first containers while a connection electrode is formed in the through hole; a step (S104) for preparing a second wafer in which a plurality of second containers having an external electrode are formed; a step (S102) for preparing a plurality of integrated circuits; a joining step (S105) for placing an integrated circuit in the first container or the second container, and joining the piezoelectric wafer, the first wafer, and the second wafer; and a measurement step (S107) for measuring at least either a CI value of the piezoelectric piece or a vibration frequency through the inspection electrode.

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator in which a piezoelectric vibrating piece and an integrated circuit are mounted in a package, and a piezoelectric oscillator.

  A piezoelectric oscillator in which a piezoelectric vibrating piece and an integrated circuit are mounted in a box-shaped package is known. In such a piezoelectric oscillator, vibrations such as a crystal impedance value and a vibration frequency of the piezoelectric vibrating piece are caused by stress generated when the piezoelectric vibrating piece and the integrated circuit are placed in the package and when the package is sealed with a lid. The characteristics may change. Therefore, after placing the piezoelectric vibrating piece and integrated circuit in the package and after sealing the package, the crystal impedance value or vibration frequency of the piezoelectric vibrating piece is measured, and it is confirmed that the value is within the proper range. Is done.

  Measurement of vibration characteristics such as crystal impedance value or vibration frequency of the piezoelectric vibrating piece is performed through an inspection electrode formed on the outer side surface of the package. For example, in a temperature compensated crystal oscillator disclosed in Patent Document 1, a crystal inspection terminal electrically connected to a crystal resonator is formed on the side surface of the container body, and the crystal impedance value of the crystal resonator is passed through the crystal inspection terminal. Alternatively, vibration characteristics such as vibration frequency are measured.

JP 2007-142869 A

  However, in the case where test electrodes such as crystal test terminals are formed on the outer side surface of the package of the piezoelectric oscillator, the cavity in the piezoelectric oscillator becomes narrow and the size of the piezoelectric vibrating reed and the integrated circuit to be mounted must be reduced.

  Therefore, the present invention provides a method for manufacturing a piezoelectric oscillator and a piezoelectric oscillator that can ensure the size of a cavity by forming an inspection electrode on the upper surface of the piezoelectric oscillator.

  A method for manufacturing a piezoelectric oscillator according to a first aspect is a method for manufacturing a surface-mount type piezoelectric oscillator, which is formed so as to surround a piezoelectric piece and a piezoelectric piece having a pair of excitation electrodes on both front and back main surfaces, and is drawn from the excitation electrode. A step of preparing a piezoelectric wafer on which a plurality of piezoelectric vibration elements having an outer frame having a pair of extraction electrodes are formed; a first bonding surface made of an insulating material and bonded to one main surface of the piezoelectric vibration element; A plurality of first container bodies having a ceiling surface opposite to the first joint surface and a pair of inspection electrodes formed on the ceiling surface are formed, and the first joint is formed on a common side of the adjacent first container bodies. Preparing a first wafer in which a plurality of through holes penetrating from the surface to the ceiling surface and connection electrodes connected to the inspection electrodes are formed in the through holes, and bonded to the other main surface of the piezoelectric vibration element A second joint surface, a bottom surface opposite to the second joint surface, and a bottom surface A step of preparing a second wafer having a plurality of second container bodies made of an insulating material and having an external electrode on which the piezoelectric oscillator is mounted, and oscillating the piezoelectric piece to provide a piezoelectric terminal and a circuit Preparing a plurality of integrated circuits having terminals, placing the integrated circuit on the first container body or the second container body, bonding the piezoelectric wafer, the first wafer, and the second wafer, and connecting the circuit terminals and external electrodes; And connecting the piezoelectric terminal, the connection electrode and the extraction electrode electrically, and measuring the crystal impedance value or the vibration frequency of the piezoelectric piece via the inspection electrode after the bonding step. Measuring step.

  A method for manufacturing a piezoelectric oscillator according to a second aspect is a method for manufacturing a surface-mount type piezoelectric oscillator, and includes a plurality of excitation electrodes formed on both front and back main surfaces and a pair of extraction electrodes extracted from the excitation electrodes. A step of preparing a piezoelectric piece, a first joining surface made of an insulating material and disposed to face one main surface of the piezoelectric piece, a ceiling surface opposite to the first joining surface, and a ceiling surface A plurality of first container bodies having a pair of inspection electrodes are formed, a plurality of through holes penetrating from the first joint surface to the ceiling surface on a common side of adjacent first container bodies, and the through holes serving as inspection electrodes A step of preparing a first wafer on which a connection electrode to be connected is formed; a second bonding surface disposed to face the other main surface of the piezoelectric piece; and a bottom surface opposite to the second bonding surface; An external electrode formed on the bottom surface for mounting the piezoelectric oscillator, A step of preparing a second wafer on which a plurality of second container bodies made of an edge material are formed; a step of oscillating a piezoelectric piece to prepare a plurality of integrated circuits having piezoelectric terminals and circuit terminals; It is placed on one container body or the second container body, the piezoelectric piece, the first wafer, and the second wafer are joined to electrically connect the circuit terminal and the external electrode, and the piezoelectric terminal, the connection electrode, and the extraction electrode are connected. A joining step of electrical connection and a measuring step of measuring at least one of the crystal impedance value or the vibration frequency of the piezoelectric piece via the pair of inspection electrodes after the joining step.

  According to a third aspect of the piezoelectric oscillator manufacturing method, in the first aspect or the second aspect, the first container body is formed in a flat plate rectangular shape, and at least one side common to the adjacent first container bodies has a through hole. Are formed, and each of the connection electrodes formed in the through hole is connected to only one inspection electrode.

  According to a fourth aspect of the piezoelectric oscillator manufacturing method, in the first or second aspect, the first container body is formed in a flat rectangular shape, and at least one of the common sides of the adjacent first container bodies penetrates the first container body. One hole is formed.

According to a fifth aspect of the method of manufacturing a piezoelectric oscillator, in the first to third aspects, after the measurement step, the step of cutting the connection electrode or the inspection electrode and the wafer bonded in the bonding step pass through the through-hole. A cutting step of cutting.
Thereby, after measuring the vibration characteristics of the piezoelectric vibrating piece, the connection between the inspection electrode and the piezoelectric vibrating piece can be disconnected to suppress the generation of stray capacitance.

  A piezoelectric oscillator according to a sixth aspect is a surface-mount type piezoelectric oscillator, and includes a piezoelectric piece including a pair of excitation electrodes formed on both the front and back main surfaces and a pair of extraction electrodes drawn from the excitation electrodes, and one of the piezoelectric pieces A first container body made of an insulating material, having a first joint surface facing the main surface, a ceiling surface opposite to the first joint surface, and a pair of inspection electrodes connected to the pair of extraction electrodes on the ceiling surface A second container body made of an insulating material, a second joint surface facing the other main surface of the piezoelectric piece, a bottom surface opposite to the second joint surface, and an external electrode to be mounted on the bottom surface; An integrated circuit that oscillates the piezoelectric piece and electrically connects to the extraction electrode and the external electrode, and a pair of castellations is formed on a side surface between the first joint surface and the ceiling surface, and at least one of the pair of castellations Some of the connection electrodes connect the extraction electrode and the inspection electrode It is formed.

  A piezoelectric oscillator according to a seventh aspect is a surface-mount type piezoelectric oscillator, and includes a piezoelectric piece including a pair of excitation electrodes formed on both front and back main surfaces and a pair of extraction electrodes drawn from the excitation electrodes, and one of the piezoelectric pieces A first container body made of an insulating material, having a first joint surface facing the main surface, a ceiling surface opposite to the first joint surface, and a pair of inspection electrodes connected to the pair of extraction electrodes on the ceiling surface A second container body made of an insulating material, a second joint surface facing the other main surface of the piezoelectric piece, a bottom surface opposite to the second joint surface, and an external electrode to be mounted on the bottom surface; An integrated circuit that oscillates the piezoelectric piece and electrically connects to the extraction electrode and the external electrode, and a pair of castellations is formed on a side surface between the first joint surface and the ceiling surface, and at least one of the pair of castellations Some extend from one of the extraction and inspection electrodes to the other. Connection electrodes are cut off are formed.

  A piezoelectric oscillator according to an eighth aspect includes, in the sixth aspect or the seventh aspect, an outer frame that is connected to the piezoelectric piece, is formed so as to surround the piezoelectric piece, and has a pair of lead electrodes, and the outer frame is a first bonding surface. And the second joint surface.

  In the ninth aspect of the piezoelectric oscillator according to the sixth aspect to the eighth aspect, the pair of castellations face each other one by one on the first side surface which is one of the side surfaces and the second side surface on the opposite side. Formed as follows.

  The piezoelectric oscillator of the tenth aspect is the sixth aspect, in which the pair of castellations are formed so as to face each other on the first side surface which is one of the side surfaces and the second side surface on the opposite side. Only one connection electrode is formed on the first side surface and the second side surface.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of a piezoelectric oscillator and a piezoelectric oscillator which can ensure the breadth of a cavity by forming a test | inspection electrode on the upper surface of a piezoelectric oscillator can be provided.

1 is an exploded perspective view of a piezoelectric oscillator 100. FIG. (A) is sectional drawing of the piezoelectric oscillator 100 equivalent to the AA cross section of FIG. (B) is BB sectional drawing of FIG. FIG. 4C is a cross-sectional view of the piezoelectric oscillator 100 with the connection electrode 33 cut. 3 is a flowchart illustrating a method for manufacturing the piezoelectric oscillator 100. It is a top view of piezoelectric wafer W10. It is a top view of the 1st wafer W30. It is a top view of the 2nd wafer W40. 4 is a flowchart for explaining a process of bonding the piezoelectric wafer W10, the first wafer W30, and the second wafer W40 in step S105 of FIG. 2 is an exploded perspective view of a piezoelectric oscillator 200. FIG. 5 is a flowchart illustrating a method for manufacturing the piezoelectric oscillator 200. It is a top view of piezoelectric wafer W110. It is a top view of the 1st wafer W130. It is a top view of the 2nd wafer W140. 2 is an exploded perspective view of a piezoelectric oscillator 300. FIG. (A) is CC sectional drawing of FIG. FIG. 4B is a sectional view of the piezoelectric oscillator 300. FIG. It is a top view of the 1st wafer W230. 2 is an exploded perspective view of a piezoelectric oscillator 400. FIG. It is EE sectional drawing of FIG. 2 is an exploded perspective view of a piezoelectric oscillator 500. FIG. It is a top view of the 1st wafer W430. It is a top view of the 2nd wafer W440.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the scope of the present invention is not limited to these forms unless otherwise specified in the following description.

(First embodiment)
<Configuration of Piezoelectric Oscillator 100>
FIG. 1 is an exploded perspective view of the piezoelectric oscillator 100. The piezoelectric oscillator 100 is a surface mount type piezoelectric oscillator, and is used by being mounted on a printed circuit board or the like. The piezoelectric oscillator 100 is mainly composed of a piezoelectric vibration element 10, an integrated circuit 20, a first container body 30, and a second container body 40. In the piezoelectric oscillator 100, an insulating material that does not conduct electricity, such as crystal and glass, is used for the first container body 30 and the second container body 40. Further, for example, an AT-cut crystal vibrating element is used for the piezoelectric vibrating element 10. In the AT-cut quartz crystal resonator element, the main surface (YZ plane) is inclined 35 degrees 15 minutes from the Z axis in the Y axis direction around the X axis with respect to the Y axis of the crystal axis (XYZ). In the following description, the new axes that are inclined with respect to the axial direction of the AT-cut crystal resonator element are used as the Y ′ axis and the Z ′ axis. That is, in the piezoelectric oscillator 100, the longitudinal direction of the piezoelectric oscillator 100 is defined as the X-axis direction, the height direction of the piezoelectric oscillator 100 is defined as the Y′-axis direction, and the direction perpendicular to the X-axis direction and the Y′-axis direction is defined as the Z′-axis direction. .

  The piezoelectric vibration element 10 includes a piezoelectric piece 11 and an outer frame 12 formed so as to surround the piezoelectric piece 11. A pair of “L” -shaped through grooves 17 penetrating the piezoelectric vibrating element 10 are formed between the piezoelectric piece 11 and the outer frame 12. A portion where the through groove 17 is not formed is a connecting portion 19 between the piezoelectric piece 11 and the outer frame 12. A pair of excitation electrodes 13 is formed on both main surfaces of the piezoelectric piece 11 on the + Y′-axis side and the −Y′-axis side. In addition, an extraction electrode 14 that is extracted from the excitation electrode 13 is formed on the outer frame 12. Further, a pair of piezoelectric castellations 15 for forming the piezoelectric through holes 16 (see FIG. 4) are formed on the side surfaces of the outer frame 12 on the + Z ′ axis side and the −Z ′ axis side. The extraction electrode 14 drawn from the excitation electrode 13 formed on the surface on the −Y′-axis side passes through the piezoelectric castellation 15 on the −Z′-axis side and extends to the surface on the + Y′-axis side of the outer frame 12. An electrode pad 141 is formed. The extraction electrode 14 drawn from the excitation electrode 13 formed on the surface on the + Y′-axis side passes through the piezoelectric castellation 15 on the + Z′-axis side and extends to the surface on the −Y′-axis side of the outer frame 12. Thus, an electrode pad 141 is formed.

  The integrated circuit 20 is electrically connected to the piezoelectric piece 11 to form an oscillation circuit. The integrated circuit 20 has four circuit terminals 21 and two piezoelectric terminals 22 formed on the surface at the −Y′-axis side. The circuit terminals 22 are electrically connected to the external electrodes 44, respectively, and the piezoelectric terminals 22 are electrically connected to the excitation electrodes 12 of the piezoelectric vibration element 10.

  The first container body 30 is disposed on the + Y′-axis side of the piezoelectric vibration element 10, and is bonded to the piezoelectric vibration element 10 at a first bonding surface 38 b that is a surface on the −Y′-axis side of the first container body 30. Is done. A first recess 39 is formed in the first bonding surface 38b, and the first recess 39 forms a part of the cavity 70 (see FIG. 2A) of the piezoelectric oscillator 100. A pair of inspection electrodes 31 are formed on the ceiling surface 38 a on the + Y′-axis side of the first container body 30. A pair of first castellations 32 for forming the first through holes 35 (see FIG. 5) is formed on the side surfaces of the first container body 30 on the + Z ′ axis side and the −Z ′ axis side. A connection electrode 33 is formed on the first castellation 32, and each connection electrode 33 is connected to the inspection electrode 31. In addition, electrode pads 34 respectively connected to the connection electrodes 33 are formed on the first bonding surface 38 b of the first container body 30. The electrode pad 34 is electrically connected to the extraction electrode 14 or the electrode pad 141 formed on the surface at the + Y′-axis side of the piezoelectric vibration element 10.

  The second container body 40 is disposed on the −Y′-axis side of the piezoelectric vibration element 10, and is bonded to the piezoelectric vibration element 10 at the second bonding surface 48 a that is the + Y′-axis side surface of the second container body 40. Is done. In addition, external electrodes 44 are formed at the four corners of the bottom surface 48 b on the −Y′-axis side of the second container body 40. Further, four second castellations 47 for forming the second through holes 45 (see FIG. 6) are formed at the four corners of the side surface of the second container body 40. A second recess 49 is formed in the second joint surface 48 a of the second container body 40. The second recess 49 has four circuit terminal electrodes 61 electrically connected to the circuit terminals 21 of the integrated circuit 20 and a pair of piezoelectric terminal electrodes 62 electrically connected to the piezoelectric terminals 22 of the integrated circuit 20. And are formed. In the integrated circuit 20, the circuit terminal 21 and the piezoelectric terminal 22 are connected to the circuit terminal electrode 61 and the piezoelectric terminal electrode 62 via the metal bumps 51 (see FIG. 2A), whereby the second container body 40 has a structure. It is placed in the second recess 49. A first electrode 71 and a second electrode 72 are formed on the second container body 40. The first electrode 71 is formed from the circuit terminal electrode 61 through the second castellation 47 to the external electrode 44. The second electrode 72 is formed from the piezoelectric terminal electrode 62 to the edge on the + Z′-axis side and the edge on the −Z′-axis side of the second bonding surface 48a.

  FIG. 2A is a cross-sectional view of the piezoelectric oscillator 100 corresponding to the AA cross section of FIG. Two inspection electrodes 31 are formed on the ceiling surface 38 a of the first container body 30. An electrode pad 34 is formed on the first bonding surface 38b. The inspection electrode 31 on the + Z′-axis side is connected to the extraction electrode 14 formed on the outer frame 12 of the piezoelectric vibration element 10 via the connection electrode 33 and the electrode pad 34. The inspection electrode 31 on the −Z′-axis side is connected to the extraction electrode 14 formed on the outer frame 12 of the piezoelectric vibration element 10 via the connection electrode 33, the electrode pad 34, and the electrode pad 141. In other words, the pair of inspection electrodes 31 are electrically connected to the excitation electrodes 13 of the pair of piezoelectric vibration elements 10. The excitation electrode 13 is connected to the second electrode 72 on the surface at the −Y′-axis side of the outer frame 12 through the extraction electrode 14 and the electrode pad 141. That is, the excitation electrode 13 is connected to the piezoelectric terminal 22 of the integrated circuit 20 through the second electrode 72, the piezoelectric terminal electrode 62, and the metal bump 51.

  FIG. 2B is a cross-sectional view taken along the line BB in FIG. In FIG. 2B, the circuit terminal electrode 61 is connected to the first electrode 71, and the first electrode 71 is connected to the external electrode 44 through the second castellation 47 from the second joint surface 48 a. That is, the external electrode 44 is electrically connected to the circuit terminal 21 of the integrated circuit 20 via the circuit terminal electrode 61, and the circuit terminal 21 is connected to the piezoelectric terminal 22 via the internal circuit (not shown) of the integrated circuit 20. It is connected. That is, the external electrode 44 is electrically connected to the excitation electrode 13 of the piezoelectric vibration element 10 (see FIG. 2A). As a result, a DC voltage can be input to one of the external electrodes 44 to cause the piezoelectric piece 11 to vibrate in thickness, and an output signal can be extracted from the other external electrode 44. Although details will be described later, the first container body 30, the piezoelectric vibration element 10, and the second container body 40 are bonded together by the bonding material 52, and the cavity 70 is sealed.

  FIG. 2C is a cross-sectional view of the piezoelectric oscillator 100 corresponding to the AA cross section of FIG. 1 and shows a state where the connection electrode 33 is cut. FIG. 2C shows a state where the region 33a of the connection electrode 33 is cut. FIG. 2A shows that the piezoelectric oscillator 100 measures vibration characteristics such as a crystal impedance (CI) value or a vibration frequency of the piezoelectric piece 11 through two inspection electrodes 31 formed on the ceiling surface 38a. It was. However, the inspection electrode 31 causes stray capacitance generation of the piezoelectric oscillator 100 and may affect vibration characteristics such as a crystal impedance value or a vibration frequency of the piezoelectric piece 11. For this reason, as shown in FIG. 2C, it is preferable to disconnect the connection electrode 33 that connects the inspection electrode 31 and the excitation electrode 13 after measuring the vibration characteristics of the piezoelectric piece 11.

<Method for Manufacturing Piezoelectric Oscillator 100>
FIG. 3 is a flowchart showing a method for manufacturing the piezoelectric oscillator 100.
First, a piezoelectric wafer W10 is prepared in step S101. A plurality of piezoelectric vibration elements 10 are formed on the piezoelectric wafer W10. For example, AT-cut quartz is used for the piezoelectric wafer W10. The piezoelectric wafer W10 will be described with reference to FIG.

  FIG. 4 is a plan view of the piezoelectric wafer W10. A plurality of piezoelectric vibration elements 10 are formed on the piezoelectric wafer W10. In FIG. 4, each piezoelectric vibration element 10 is shown separated by a one-dot chain line. The piezoelectric piece 11 and the outer frame 12 are formed in one piezoelectric vibration element 10, and the piezoelectric piece 11 and the outer frame 12 penetrate through the surface on the −Y′-axis side to the surface on the + Y′-axis side. It is divided by. Excitation electrodes 13 are formed on the surface on the + Y′-axis side and the surface on the −Y′-axis side of the piezoelectric piece 11, and an extraction electrode 14 is formed from the excitation electrode 13 to the outer frame 12. Further, the piezoelectric through-hole 16 that penetrates the piezoelectric wafer W10 from the surface on the −Y′-axis side to the surface on the + Y′-axis side on the + Z′-axis side and the −Z′-axis side of each piezoelectric vibration element 10. Is formed. An electrode (not shown) is formed on the inner wall of the piezoelectric through hole 16, and this electrode constitutes a part of the extraction electrode 14. As shown in FIG. 2A, the extraction electrode 14 is formed from the surface on the + Y′-axis side to the surface on the −Y′-axis side of the outer frame 12. Here, when the piezoelectric through hole 16 is divided in half, a piezoelectric castellation 15 (see FIG. 1) is obtained.

  Returning to FIG. 3, in step S102, a plurality of integrated circuits 20 are prepared. As shown in FIG. 1, the integrated circuit 20 has four circuit terminals 21 and two piezoelectric terminals 22 formed on the surface at the −Y′-axis side. The circuit terminal 21 and the piezoelectric terminal 22 are connected via an internal circuit (not shown).

  In step S103, the first wafer W30 is prepared. A plurality of first container bodies 30 are formed on the first wafer W30. The first wafer W30 is formed of, for example, crystal or glass. The first wafer W30 will be described with reference to FIG.

  FIG. 5 is a plan view of the first wafer W30. A plurality of first container bodies 30 are formed on the first wafer W30, and in FIG. 5, each first container body 30 is shown separated by an alternate long and short dash line. An inspection electrode 31 is formed on the surface at the + Y′-axis side of the first container body 30. Although not shown in FIG. 5, electrode pads 34 (see FIG. 1) are formed on the surface at the −Y′-axis side of the first wafer W30. Further, on the boundary line indicated by the alternate long and short dash line of the adjacent first container bodies 30, the first wafer body 30 is placed on the −Y ′ axis on the + Z ′ axis side and the −Z ′ axis side of each first container body 30. A first through hole 35 penetrating from the surface on the side to the surface on the + Y′-axis side is formed. An electrode (not shown) is formed on the inner wall of each first through-hole 35, and this electrode serves as a connection electrode 33 (see FIG. 1) that connects the inspection electrode 31 and the electrode pad 34. The electrodes formed in the first through holes 35 are connected to the two inspection electrodes 31. The 1st recessed part 39 formed in the 1st joint surface 38b of the 1st container body 30 is shown by the dotted line in FIG. Here, if the 1st through-hole 35 is divided | segmented into half, it will become the 1st castellation 32 (refer FIG. 1).

  Returning to FIG. 3, the second wafer W40 is prepared in step S104. A plurality of second container bodies 40 are formed on the second wafer W40. The second wafer W40 is made of, for example, crystal or glass. The second wafer W40 will be described with reference to FIG.

  FIG. 6 is a plan view of the second wafer W40. A plurality of second container bodies 40 are formed on the second wafer W40, and in FIG. 6, each second container body 40 is shown separated by an alternate long and short dash line. A second recess 49 is formed in the second bonding surface 48a (see FIG. 2B), which is the + Y′-axis side surface of the second container body 40, and the circuit terminal electrode 61 is formed in the second recess 49. And the electrode 62 for piezoelectric terminals is formed. A first electrode 71 and a second electrode 72 are connected to the circuit terminal electrode 61 and the piezoelectric terminal electrode 62. In addition, second through holes 45 are formed in the four corners of each second container body 40 to penetrate the second wafer W40 from the surface on the −Y′-axis side to the surface on the + Y′-axis side. An electrode (not shown) is formed in each second through hole 45, and this electrode becomes a part of the first electrode 71. The first electrode 71 is connected to the external electrode 44 formed on the bottom surface 48b which is the surface on the −Y′-axis side of the second container body 40 (see FIG. 2B). Here, if the 2nd through-hole 45 is divided | segmented into 1/4, it will become the 2nd castellation 47 (refer FIG. 1).

In the flowchart of FIG. 3, the order of step S101 to step S104 may be performed arbitrarily, or may be performed simultaneously.
Next, in step S105, the integrated circuit 20 is mounted on the second wafer W40, and the piezoelectric wafer W10, the first wafer W30, and the second wafer W40 are bonded. In the integrated circuit 20, as shown in FIGS. 2A and 2B, the circuit terminal 21 is connected to the circuit terminal electrode 61 via the metal bump 51, and the piezoelectric terminal 22 is connected to the piezoelectric terminal electrode 62. Are mounted on the second wafer W40 so as to be connected via the metal bumps 51. In FIG. 2A and FIG. 2B, the integrated circuit 20 is fixed to the second wafer W40 by face-down bonding through the metal bumps 51 and connected to the circuit terminal electrode 61 and the piezoelectric terminal electrode 62. However, the integrated circuit 20 may be fixed to the second wafer W40 by die bonding, and may be connected to the circuit terminal electrode 61 and the piezoelectric terminal electrode 62 by wire bonding using wires. A process of bonding the piezoelectric wafer W10, the first wafer W30, and the second wafer W40 to each other will be described with reference to FIG.

  FIG. 7 is a flowchart for explaining the process of bonding the piezoelectric wafer W10, the first wafer W30, and the second wafer W40 in step S105 of FIG. 7A to 7D for explaining each step are shown on the right side of each step in FIG.

  In step S151, the piezoelectric wafer W10 and the second wafer W40 are positioned. Step S151 will be described with reference to FIG. FIG. 7A shows a part of a cross section of the piezoelectric wafer W10 and the second wafer W40 corresponding to the AA cross section of FIG. Hereinafter, the same cross section is shown with respect to FIGS. 7B to 7D. FIG. 7A shows a state before the piezoelectric wafer W10 and the second wafer W40 are bonded. A bonding material 52 is formed on the surface at the + Y′-axis side of the second wafer W40. The bonding material 52 is, for example, low-melting glass, and is formed on the second wafer W40 by a method such as screen printing. A polyimide resin may be used for the bonding material 52.

  In step S152, the piezoelectric wafer W10 is bonded to the second wafer W40 while being pressed. FIG. 7B shows a state after the piezoelectric wafer W10 and the second wafer W40 are bonded. The piezoelectric wafer W10 and the second wafer W40 are bonded so that the extraction electrode 14 and the second electrode 72 are connected to each other.

  In step S153, the piezoelectric wafer W10, the second wafer W40, and the first wafer W30 are positioned. FIG. 7C shows a state before the piezoelectric wafer W10, the second wafer W40, and the first wafer W30 are bonded. A bonding material 52 is formed on the surface at the −Y′-axis side of the first wafer W <b> 40. At this time, the piezoelectric through hole 16 of the piezoelectric wafer W10 and the first through hole 35 of the first wafer W30 overlap with each other in the Y′-axis direction.

  In step S154, the first wafer W30 is bonded to the piezoelectric wafer W10 while being pressed. FIG. 7D shows a state after the piezoelectric wafer W10 and the first wafer W30 are bonded. The piezoelectric wafer W10 and the first wafer W30 are bonded so that the extraction electrode 14 and the electrode pad 34 are connected to each other. Thereby, the cavity 70 is filled with an inert gas or hermetically sealed in a vacuum state.

  Returning to FIG. 3, in step S106, the piezoelectric wafer W10, the second wafer W40, and the first wafer W30 bonded together in step S105 are cut. The cutting is performed along the alternate long and short dash line shown in FIGS. 4 to 6, and the cutting is performed so as to pass over the piezoelectric through hole 16, the first through hole 35, and the second through hole 45 formed on the alternate long and short dash line. Is called.

  In step S107, at least one of the crystal impedance (CI) value or the vibration frequency of the piezoelectric piece 11 is measured. The measurement is performed by bringing a pair of probes (not shown) into contact with the pair of inspection electrodes 31 (see FIG. 1). Since the inspection electrode 31 is electrically connected to the extraction electrode 14 (see FIG. 2A), it is possible to measure at least one of the crystal impedance (CI) value or the vibration frequency of the piezoelectric piece 11 through the inspection electrode 31. it can. As a result of the measurement, if the crystal impedance (CI) value or the vibration frequency value is outside the range of the appropriate value, the crystal impedance (CI) value or the vibration frequency value is set to an appropriate value by adjusting the parameters of the integrated circuit 20. It is adjusted to be within the range.

  In step S108, the connection electrode 33 is cut. The connection electrode 33 is cut by irradiating the connection electrode 33 with laser light in the direction of the white arrow 81 shown in FIG. In FIG. 2C, a region where the connection electrode 33 is cut is shown as a region 33a. In addition, although the connection electrode 33 is cut in FIG. 2C, a thin portion connected to the connection electrode 33 of the inspection electrode 31 may be cut.

  The piezoelectric oscillator 100 can be used as a product without cutting the connection electrode 33 in step S108 (see FIGS. 1 and 2A). However, if the inspection electrode 31 and the excitation electrode 13 remain connected, stray capacitance is generated in the inspection electrode 31, which may affect the crystal impedance (CI) value, vibration frequency, etc. of the piezoelectric piece 11. is there. Therefore, it is desirable that the connection electrode 33 is cut. Further, in the piezoelectric oscillator 100, the inspection electrode 31 is formed on the ceiling surface 38a of the first container body 30, whereby the cavity 70 (see FIG. 2A) of the piezoelectric oscillator 100 can be widened.

(Second Embodiment)
As a second embodiment, a piezoelectric oscillator 200 in which four first castellations are formed on the side surface of a first container body will be described. In the following description, the same components as those of the piezoelectric oscillator 100 are denoted by the same reference numerals as those of the piezoelectric oscillator 100, and the description thereof is omitted.

<Configuration of Piezoelectric Oscillator 200>
FIG. 8 is an exploded perspective view of the piezoelectric oscillator 200. The piezoelectric oscillator 200 is a surface-mount type piezoelectric oscillator, and is used by being mounted on a printed circuit board or the like. The piezoelectric oscillator 200 is mainly composed of the piezoelectric vibration element 110, the integrated circuit 20, the first container body 130, and the second container body 140.

  The piezoelectric vibration element 110 includes a piezoelectric piece 11 and an outer frame 112 formed so as to surround the piezoelectric piece 11. A pair of excitation electrodes 13 is formed on both main surfaces of the piezoelectric piece 11 on the + Y′-axis side and the −Y′-axis side. In addition, an extraction electrode 114 that is extracted from the excitation electrode 13 is formed on the outer frame 112. Further, a piezoelectric castellation 115a is formed on the side of the outer frame 112 on the + Z ′ axis side on the −X axis side and on the side of the −Z ′ axis side on the + X axis side. A piezoelectric castellation 115b is formed on the side of the + X axis side and the −Z ′ axis side on the −X axis side. The extraction electrode 114 drawn from the excitation electrode 13 formed on the surface on the −Y′-axis side passes through the piezoelectric castellation 115 a on the −Z′-axis side and is formed to the surface on the + Y′-axis side of the outer frame 112. ing. Here, the piezoelectric castellations 115a and 115b are formed when the piezoelectric through holes 116 (see FIG. 10) are formed. The extraction electrode 114 drawn from the excitation electrode 13 formed on the surface on the + Y′-axis side passes through the piezoelectric castellation 115a on the + Z′-axis side and is formed on the surface on the −Y′-axis side of the outer frame 112. Has been.

  The first container body 130 is disposed on the + Y′-axis side of the piezoelectric vibration element 110, and is bonded to the piezoelectric vibration element 110 at a first bonding surface 138 b that is a −Y′-axis side surface of the first container body 130. Is done. A first recess 39 is formed in the first joint surface 138b, and the first recess 39 forms a part of a cavity (not shown) of the piezoelectric oscillator 200. In addition, a pair of inspection electrodes 131 is formed on the ceiling surface 138a which is the surface on the + Y′-axis side of the first container body 130 and on the opposite side of the first joint surface 138b. A first castellation 132a is formed on the -X-axis side of the side surface of the first container body 130 on the + Z'-axis side and the + X-axis side of the side surface on the -Z'-axis side, and the + Z'-axis side of the first container body 130 is formed. A first castellation 132b is formed on the + X axis side of the side surface and the −X axis side of the side surface on the −Z ′ axis side. Here, the first castellations 132a and 132b are formed when the first through holes 135 (see FIG. 11) are formed. Connection electrodes 133 are formed on the first castellation 132a, and each connection electrode 133 is connected to the inspection electrode 131. In addition, electrode pads 34 respectively connected to the connection electrodes 133 are formed on the first bonding surface 138 b of the first container body 130. The electrode pad 34 is electrically connected to the extraction electrode 114 formed on the surface at the + Y′-axis side of the piezoelectric vibration element 110.

  The second container body 140 is disposed on the −Y′-axis side of the piezoelectric vibration element 110, and is bonded to the piezoelectric vibration element 110 at a second bonding surface 148 a that is a surface on the + Y′-axis side of the second container body 140. The The second container body 140 is different from the second container body 40 (see FIG. 1) of the piezoelectric oscillator 100 described in the first embodiment in the second electrode. The second electrode 172 of the second container body 140 is formed such that the + Z′-axis side end and the −Z′-axis side end are shifted to the −X-axis side and the + X-axis side, and the lead electrode of the piezoelectric vibration element 110 is formed. 114 is electrically connected.

<Method for Manufacturing Piezoelectric Oscillator 200>
FIG. 9 is a flowchart showing a method for manufacturing the piezoelectric oscillator 200.
First, a piezoelectric wafer W110 is prepared in step S201. A plurality of piezoelectric vibrating elements 110 are formed on the piezoelectric wafer W110, and for example, AT-cut quartz is used for the piezoelectric wafer W110. The piezoelectric wafer W110 will be described with reference to FIG.

  FIG. 10 is a plan view of the piezoelectric wafer W110. A plurality of piezoelectric vibration elements 110 are formed on the piezoelectric wafer W110, and in FIG. 10, each piezoelectric vibration element 110 is shown separated by an alternate long and short dash line. The piezoelectric piece 11 and the outer frame 112 are formed in one piezoelectric vibration element 110, and the piezoelectric piece 11 and the outer frame 112 penetrate through from the −Y′-axis side surface to the + Y′-axis side surface. It is divided by. An excitation electrode 13 is formed on the surface on the + Y′-axis side and the surface on the −Y′-axis side of the piezoelectric piece 11, and an extraction electrode 114 is formed from the excitation electrode 13 to the outer frame 112. Further, the piezoelectric through-hole 116 that penetrates the piezoelectric wafer W110 from the surface on the −Y′-axis side to the surface on the + Y′-axis side on the + Z′-axis side and the −Z′-axis side of each piezoelectric vibration element 110. Is formed. An electrode (not shown) is formed on the inner wall of the piezoelectric through hole 116, and this electrode constitutes a part of the extraction electrode 114. As shown in FIG. 9, the extraction electrode 114 is formed from the surface on the + Y′-axis side to the surface on the −Y′-axis side of the outer frame 112. In addition, one extraction electrode 114 is formed in one piezoelectric through hole 116. Further, when the piezoelectric through hole 116 is divided in half, the piezoelectric castellations 115a and 115b (see FIG. 8) are obtained.

  In step S202, a plurality of integrated circuits 20 are prepared. Step S202 is the same step as step S102 of the flowchart shown in FIG.

  In step S203, the first wafer W130 is prepared. A plurality of first container bodies 130 are formed on the first wafer W130. The first wafer W130 will be described with reference to FIG.

  FIG. 11 is a plan view of the first wafer W130. A plurality of first container bodies 130 are formed on the first wafer W130. In FIG. 11, each first container body 130 is shown separated by a one-dot chain line. An inspection electrode 131 is formed on the surface on the + Y′-axis side of the first container body 130. Although not shown in FIG. 11, an electrode pad 34 (see FIG. 8) is formed on the surface at the −Y′-axis side of the first wafer W130. Further, on the boundary line indicated by the alternate long and short dash line of the adjacent first container bodies 130, the first wafer W 130 is placed on the + Z ′ axis side and the −Z ′ axis side of each first container body 130 with the −Y ′ axis. A first through-hole 135 penetrating from the surface on the side to the surface on the + Y′-axis side is formed. An electrode (not shown) is formed on the inner wall of each first through-hole 135, and this electrode serves as a connection electrode 133 (see FIG. 8) that connects the inspection electrode 131 and the electrode pad 34. In addition, the electrode formed in each first through hole 135 is connected to one inspection electrode 131. The first recess 39 formed in the first joint surface 138b of the first container body 130 is indicated by a dotted line in FIG. Further, when the first through hole 135 is divided in half, the first castellations 132a and 132b (see FIG. 8) are obtained.

  In step S204, a second wafer W140 is prepared. A plurality of second container bodies 140 are formed on the second wafer W140. The second wafer W140 is made of, for example, crystal or glass. The second wafer W140 will be described with reference to FIG.

  FIG. 12 is a plan view of the second wafer W140. A plurality of second container bodies 140 are formed on the second wafer W140, and in FIG. 12, each second container body 140 is shown separated by an alternate long and short dash line. The second wafer W140 differs from the second wafer W40 shown in FIG. 6 in the second electrode. As shown in FIG. 8, the second electrode 172 formed on the second wafer W140 has the + Z′-axis end and the −Z′-axis end of the second electrode 172 at the −X-axis side and + X It is formed shifted to the shaft side.

In the flowchart of FIG. 9, the order from step S201 to step S204 may be performed arbitrarily or may be performed simultaneously.
Next, in step S205, the integrated circuit 20 is mounted on the second wafer W140, and the piezoelectric wafer W110, the first wafer W130, and the second wafer W140 are bonded. The step of joining in step S205 is the same as step S105 of the flowchart shown in FIG. When the piezoelectric wafer W110 and the first wafer W130 are overlaid, the piezoelectric through hole 116 of the piezoelectric wafer W110 and the first through hole 135 of the first wafer W130 overlap in the Y′-axis direction. Further, as described in step S105 of FIG. 3, the integrated circuit 20 may be fixedly connected to the second wafer W140 using face-down bonding, or may be connected to the second wafer W140 using die bonding and wire bonding. It may be fixed and connected.

  In step S206, at least one of the crystal impedance (CI) value or the vibration frequency of the piezoelectric piece 11 is measured. As shown in FIG. 11, the measurement is performed, for example, by bringing a pair of probes 90 into contact with a pair of inspection electrodes 131 formed on the piezoelectric oscillator 200A. Each inspection electrode 131 formed on the first wafer W <b> 130 is connected only to an electrode (not shown) formed in one first through hole 135. Further, as shown in FIG. 10, each extraction electrode 114 formed on the piezoelectric wafer W <b> 110 is connected to only an electrode (not shown) formed in one piezoelectric through hole 116. Further, the piezoelectric through hole 116 and the first through hole 135 are overlapped with each other in the Y′-axis direction in step S205. That is, since one inspection electrode 131 is connected to only one extraction electrode 114, the crystal impedance (CI) value or the vibration frequency of the piezoelectric piece 11 is measured while the piezoelectric oscillator 200 is formed on the wafer. Can do. That is, the first through-hole 135 connected to the inspection electrode 131 of the piezoelectric oscillator 200A is formed away from the first through-hole 135 connected to the inspection electrode 131 of the piezoelectric oscillator 200B on the + Z ′ axis side in the X-axis direction. ing. Similarly, the first through hole 135 connected to the inspection electrode 131 of the piezoelectric oscillator 200A is separated from the first through hole 135 connected to the inspection electrode 131 of the piezoelectric oscillator 200C on the −Z ′ axis side in the X-axis direction. Is formed. Therefore, when measuring the crystal impedance (CI) value or vibration frequency of the piezoelectric oscillator 200A, the piezoelectric oscillators 200B and 200C formed adjacent to both sides are not affected. Similarly to step S107 in FIG. 3, if the measurement result shows that the crystal impedance (CI) value or the vibration frequency value is outside the range of the appropriate value, the parameters of the integrated circuit 20 are adjusted to adjust the crystal impedance (CI). ) The value or the value of the vibration frequency is adjusted to be within the range of the appropriate value.

  In step S207, the inspection electrode 131 is cut in the wafer state. The inspection electrode 131 is cut at a thin portion connected to the connection electrode 133 by irradiating laser light.

  In step S208, the piezoelectric wafer W110, the second wafer W140, and the first wafer W130 bonded to each other in step S205 are cut. The cutting is performed along the alternate long and short dash line shown in FIG. 10 to FIG. 12, and passes through the piezoelectric through hole 116, the first through hole 135, and the second through hole 45 formed on the alternate long and short dash line. Is called.

  The piezoelectric oscillator 200 can measure at least one of the crystal impedance (CI) value or the vibration frequency of the piezoelectric piece 11 in a state where the piezoelectric oscillator 200 is formed on the wafer. Therefore, at least one of the crystal impedance (CI) value or the vibration frequency of the piezoelectric piece 11 can be measured efficiently. In the second embodiment, the inspection electrodes 131 are cut in the wafer state and then cut into individual piezoelectric oscillators 200. However, after cutting into individual piezoelectric oscillators 200, the inspection electrodes 131 or the connection electrodes 133 are cut. Also good.

(Third embodiment)
As a third embodiment, a piezoelectric oscillator 300 in which an integrated circuit is placed on a first container body will be described. In the following description, the same components as those of the piezoelectric oscillator 100 and the piezoelectric oscillator 200 are denoted by the same reference numerals as those of the piezoelectric oscillator 100 and the piezoelectric oscillator 200, and the description thereof is omitted.

<Configuration of Piezoelectric Oscillator 300>
FIG. 13 is an exploded perspective view of the piezoelectric oscillator 300. The piezoelectric oscillator 300 is a surface mount type piezoelectric oscillator, and is used by being mounted on a printed circuit board or the like. The piezoelectric oscillator 300 mainly includes a piezoelectric vibration element 210, an integrated circuit 20, a first container body 230, and a second container body 240.

  The piezoelectric vibration element 210 includes a piezoelectric piece 11 and an outer frame 212 formed so as to surround the piezoelectric piece 11. Excitation electrodes 13 are formed on the surface on the + Y′-axis side and the surface on the −Y′-axis side of the piezoelectric piece 11. In addition, an extraction electrode 214 connected to the excitation electrode 13 is formed on the outer frame 212. Further, piezoelectric castellations 215 a and 215 b are formed on the side surfaces of the outer frame 212 on the + Z′-axis side and the −Z′-axis side. The extraction electrode 214 connected to the excitation electrode 13 formed on the surface at the −Y′-axis side passes through the piezoelectric castellation 215 a and is formed to the surface at the + Y′-axis side of the outer frame 212. Piezoelectric castellations 217 are formed at the four corners of the outer frame 212. From the surface of the outer frame 212 on the + Y′-axis side to the surface of the outer frame 212 on the −Y′-axis side through the piezoelectric castellation 217, the piezoelectric castellations 217 are formed. A first electrode 271 a that is a part of the first electrode 271 formed in the oscillator 300 is formed.

  The first container body 230 is disposed on the + Y′-axis side of the piezoelectric vibration element 210, and is bonded to the piezoelectric vibration element 210 at a first bonding surface 238 b that is a surface on the −Y′-axis side of the first container body 230. Is done. A first recess 39 is formed in the first bonding surface 238b, and the first recess 39 forms a part of the cavity 270 (see FIG. 14A) of the piezoelectric oscillator 300. In the first recess 39, a circuit terminal electrode 261 electrically connected to the circuit terminal 21 of the integrated circuit 20 and a piezoelectric terminal electrode 262 electrically connected to the piezoelectric terminal 22 of the integrated circuit 20 are formed. Has been. In the integrated circuit 20, the circuit terminal 21 and the piezoelectric terminal 22 are connected to the circuit terminal electrode 261 and the piezoelectric terminal electrode 262 via the metal bumps 51 (see FIG. 14A), whereby the first container body 230 has a structure. It is mounted on the first joint surface 238b. A first electrode 271 b and a second electrode 272 that are part of the first electrode 271 formed in the piezoelectric oscillator 300 are formed in the first container body 230. The first electrode 271b is formed from the four circuit terminal electrodes 261 to the four corners of the first joint surface 238b, and the first electrode 271a formed on the piezoelectric vibration element 210 at the corners of the first joint surface 238b. Connected. The second electrode 272 is formed from the piezoelectric terminal electrode 262 to the + Z′-axis side end and the −Z′-axis side end of the first bonding surface 238a, and the + Y′-axis side surface of the piezoelectric vibration element 210. Are connected to the extraction electrode 214 formed on the substrate. A pair of inspection electrodes 231 is formed on the ceiling surface 238a which is the surface on the + Y′-axis side of the first container body 230 and on the opposite side of the first joint surface 238b. A first castellation 232a is formed on the -X-axis side of the side surface on the + Z'-axis side of the first container body 230 and on the + X-axis side of the side surface on the -Z'-axis side, and the + Z'-axis side of the first container body 230 A first castellation 232b is formed on the + X axis side of the side surface and the −X axis side of the side surface on the −Z ′ axis side. Connection electrodes 233 are formed on the first castellation 232a, and each connection electrode 233 is connected to the inspection electrode 231 and the second electrode 272, respectively.

  The second container body 240 is disposed on the −Y′-axis side of the piezoelectric vibration element 210, and is bonded to the piezoelectric vibration element 210 at a second bonding surface 248 a that is a surface on the + Y′-axis side of the second container body 240. The A second recess 49 is formed in the second bonding surface 248a, and the second recess 49 forms a part of the cavity 270 (see FIG. 14A) of the piezoelectric oscillator 300. External electrodes 44 are formed at the four corners of the bottom surface 248 b that is the surface on the −Y′-axis side of the second container body 240. In addition, second castellations 47 are formed at the four corners of the second container body 240. A first electrode 271 c that is a part of the first electrode 271 formed in the piezoelectric oscillator 300 is formed from the second joint surface 248 a through the second castellation 47 to the external electrode 44. The first electrode 271c is connected to the extraction electrode 214 formed on the surface at the −Y′-axis side of the piezoelectric vibration element 210 at the second bonding surface 248a.

  FIG. 14A is a cross-sectional view taken along the line CC in FIG. 14A, the first electrode 271 formed on the piezoelectric oscillator 300 will be described. The first electrode 271b formed on the first container body 230 is formed from the circuit terminal electrode 261 to the + X axis side and −X axis side ends of the first joint surface 238b, and the + X axis side and − The X-axis side end is connected to the first electrode 271a formed on the outer frame 212. The first electrode 271a is connected to the first electrode 271c formed on the second container body 240 on the surface at the −Y′-axis side of the outer frame 212. In this way, the circuit terminal 21 of the integrated circuit 20 and the external electrode 44 are electrically connected.

  FIG. 14B is a cross-sectional view of the piezoelectric oscillator 300. FIG. 14B is also a cross-sectional view of a cross section corresponding to the DD cross section of FIG. In FIG. 14B, the piezoelectric terminal 22 and the inspection electrode 231 of the integrated circuit 20 are electrically connected to each other via the second electrode 272 and the connection electrode 233. In the manufacturing process of the piezoelectric oscillator 300, the connection electrode 233 in FIG. 14B may be cut by a laser beam indicated by a white arrow 82 in a region 233 a surrounded by a dotted line in FIG. The second electrode 272 is electrically connected to the excitation electrode 213 via an extraction electrode 214 formed on the + Y′-axis side of the piezoelectric vibration element 210.

  The manufacturing method of the piezoelectric oscillator 300 is basically the same as the manufacturing method of the piezoelectric oscillator 200 shown in FIG. 9, but in the piezoelectric oscillator 300, in step S205 of FIG. 9, the integrated circuit 20 is the first container body. 230 is placed on the surface at the −Y′-axis side of the first wafer W <b> 230 (see FIG. 15) on which 230 is formed.

  FIG. 15 is a plan view of the first wafer W230. A plurality of first container bodies 230 are formed on the first wafer W230, and in FIG. 15, the first container bodies 230 are shown separated by a one-dot chain line. An inspection electrode 231 is formed on the surface of the first container body 130 on the + Y′-axis side. In addition, a circuit terminal electrode 261, a piezoelectric terminal electrode 262, a first electrode 271b, and a second electrode 272 are formed on the surface of the first container body 130 on the + Y′-axis side. Further, on the boundary line indicated by the alternate long and short dash line of the adjacent first container bodies 230, the first wafer W 230 is placed on the + Y ′ axis side and the −Z ′ axis side of each first container body 230. A first through hole 235 that penetrates from the surface on the side to the surface on the + Y′-axis side is formed. An electrode (not shown) is formed on the inner wall of each first through hole 235, and this electrode serves as a connection electrode 233 (see FIG. 14B) that connects the inspection electrode 231 and the second electrode 272. The electrodes formed in each first through hole 235 are connected to one inspection electrode 231 and one second electrode 272. The first recess 39 formed in the first joint surface 238b of the first container body 230 is indicated by a dotted line in FIG.

(Fourth embodiment)
As a fourth embodiment, a two-layer piezoelectric oscillator 400 in which an outer frame is not formed around a piezoelectric piece and a first container body and a second container body are joined to each other will be described. In the following description, the same components as those of the piezoelectric oscillator 100, the piezoelectric oscillator 200, and the piezoelectric oscillator 300 are denoted by the same reference numerals as the piezoelectric oscillator 100, the piezoelectric oscillator 200, and the piezoelectric oscillator 300, and the description thereof is omitted.

<Configuration of Piezoelectric Oscillator 400>
FIG. 16 is an exploded perspective view of the piezoelectric oscillator 400. The piezoelectric oscillator 400 is a surface-mount type piezoelectric oscillator, and is used by being mounted on a printed circuit board or the like. The piezoelectric oscillator 400 mainly includes a piezoelectric vibration element 310, the integrated circuit 20, a first container body 330, and a second container body 340.

  In the piezoelectric vibration element 310, a pair of excitation electrodes 313 are formed on both main surfaces of the surface on the + Y′-axis side and the surface on the −Y′-axis side of the piezoelectric vibration element 310. The extraction electrode 314 is drawn out from the excitation electrode 313 in the + X axis direction and the −X axis direction. The extraction electrode 314 connected to the excitation electrode 313 formed on the surface on the + Y ′ axis side is formed in the −X-axis direction from the excitation electrode 313, passes through the side surface of the piezoelectric vibration element 310, and − It is formed up to the surface on the Y ′ axis side.

  The first container body 330 is disposed on the + Y′-axis side of the piezoelectric vibration element 310. A first recess 39 is formed in the first joint surface 338 b that is the surface on the −Y′-axis side of the first container body 330. In addition, a pair of inspection electrodes 331 is formed on the ceiling surface 338a which is the surface on the + Y′-axis side of the first container body 330 and on the opposite side of the first joint surface 338b. A first castellation 332 is formed on the side surface on the + X axis side and the side surface on the −X axis side of the first container body 330, and a connection electrode 333 is formed on the first castellation 332. A pair of electrode pads 34 is formed on the first bonding surface 338b, and the connection electrode 333 electrically connects the inspection electrode 331 and the electrode pad 34 to each other.

  The second container body 340 is disposed on the −Y′-axis side of the piezoelectric vibration element 310, and is bonded to the piezoelectric vibration element 310 at a second bonding surface 348 a that is a surface on the + Y′-axis side of the second container body 340. The Further, the second container body 340 is joined at the first joint surface 338a and the second joint surface 348a of the first container body 330. External electrodes 44 are formed at the four corners of the bottom surface 348 b that is the surface on the −Y′-axis side of the second container body 340. A second recess 49 is formed in the second joint surface 348 a of the second container body 340, and a circuit terminal electrode 61 and a piezoelectric terminal electrode 62 are formed in the second recess 49. The first electrode 371 connected to the circuit terminal electrode 61 is connected to the external electrode 44 through the through hole 373 (see FIG. 17) penetrating the second container body 340 from the circuit terminal electrode 61. The second electrode 372 connected to the piezoelectric terminal electrode 62 is formed from the piezoelectric terminal electrode 62 to the + X-axis side end and the −X-axis side end. The second electrode 372 is connected to the extraction electrode 314 of the piezoelectric vibration element 310 and the electrode pad 34 of the first container 330.

  17 is a cross-sectional view taken along line EE in FIG. In FIG. 17, a portion not on the EE cross section is indicated by a dotted line for the sake of explanation. The first electrode 371 is connected to the external electrode 44 through the through hole 373 from the circuit terminal electrode 61. The second electrode 372 is formed from the piezoelectric terminal electrode 62 to the + X axis side and −X axis side ends of the second bonding surface 348 a of the second container body 340. The extraction electrode 314 of the piezoelectric vibration element 310 and the electrode pad 34 of the first container 330 are connected to the second electrode 372, respectively. Therefore, the inspection electrode 331 formed on the first container 330, the excitation electrode 313 formed on the piezoelectric vibration element 310, and the piezoelectric terminal 22 of the integrated circuit 20 are electrically connected to each other.

  The manufacturing method of the piezoelectric oscillator 400 is basically the same as the flowchart shown in FIG. However, in the process of preparing the piezoelectric wafer in step S101 of FIG. 3, the piezoelectric wafer is cut and divided into individual piezoelectric vibration elements 310. Thereafter, each piezoelectric vibration element 310 is placed on the second container body 340 in step S105.

(Fifth embodiment)
In the fifth embodiment, four castellations are formed on the side surface of the first container body, the outer frame is not formed around the piezoelectric piece, and the first container body and the second container body are joined together. The stacked piezoelectric oscillator 500 will be described. In the following description, the same components as those of the piezoelectric oscillator 100, the piezoelectric oscillator 200, the piezoelectric oscillator 300, and the piezoelectric oscillator 400 are denoted by the same reference numerals as the piezoelectric oscillator 100, the piezoelectric oscillator 200, the piezoelectric oscillator 300, and the piezoelectric oscillator 400. Description is omitted.

<Configuration of Piezoelectric Oscillator 500>
FIG. 18 is an exploded perspective view of the piezoelectric oscillator 500. The piezoelectric oscillator 500 is a surface-mount type piezoelectric oscillator, and is used by being mounted on a printed circuit board or the like. The piezoelectric oscillator 500 mainly includes a piezoelectric vibration element 310, an integrated circuit 20, a first container body 430, and a second container body 440.

  The first container body 430 is disposed on the + Y′-axis side of the piezoelectric vibration element 310. A first recess 39 is formed in the first joint surface 438 b that is the surface on the −Y′-axis side of the first container body 430. In addition, a pair of inspection electrodes 431 is formed on the ceiling surface 438a which is the surface on the + Y′-axis side of the first container body 430 and on the opposite side of the first joint surface 438b. A first castellation 432a is formed on the −Z′-axis side of the side surface of the first container body 430 on the + X-axis side and the + Z′-axis side of the side surface on the −X-axis side, and the + Z′-axis side of the first container body 430 is formed. A first castellation 432b is formed on the + X-axis side of the side surface and the −X-axis side of the side surface on the −Z′-axis side. Connection electrodes 433 are formed on the first castellation 432a, and each connection electrode 433 is connected to the inspection electrode 431, respectively. In addition, electrode pads 34 respectively connected to the connection electrodes 433 are formed on the first bonding surface 438 b of the first container body 430.

  The second container body 440 is disposed on the −Y′-axis side of the piezoelectric vibration element 310, and is bonded to the piezoelectric vibration element 310 at a second bonding surface 448 a that is a surface on the + Y′-axis side of the second container body 440. The Further, the second container body 440 is joined at the first joining surface 438a and the second joining surface 448a of the first container body 430. External electrodes 44 are formed at the four corners of the bottom surface 448 b that is the surface on the −Y′-axis side of the second container body 440. A second recess 49 is formed in the second joint surface 448 a of the second container body 440, and a circuit terminal electrode 61 and a piezoelectric terminal electrode 62 are formed in the second recess 49. The first electrode 371 connected to the circuit terminal electrode 61 is connected to the external electrode 44 through the through hole 373 (see FIG. 17) penetrating the second container body 440 from the circuit terminal electrode 61. The second electrode 472 connected to the piezoelectric terminal electrode 62 is formed from the piezoelectric terminal electrode 62 to the + X-axis side end and the −X-axis side end of the second container body 440. The second electrode 472 is connected to the extraction electrode 314 of the piezoelectric vibration element 310 and the electrode pad 34 of the first container body 430 at the second joint surface 448a. Further, the second electrode 472 is not formed on the −Y′-axis side of the first castellation 432 b of the first container body 430.

  The manufacturing method of the piezoelectric oscillator 500 is basically the same as the flowchart shown in FIG. However, in the process of preparing the piezoelectric wafer in step S201 of FIG. 9, the piezoelectric wafer is cut and divided into individual piezoelectric vibration elements 310. Thereafter, in step S <b> 205, each piezoelectric vibration element 310 is placed on the second container body 440. Further, step S203, step S204, and step S206 will be supplemented below with reference to FIGS.

  FIG. 19 is a plan view of the first wafer W430. The first wafer W430 is prepared in step S203 in FIG. A plurality of first container bodies 430 are formed on the first wafer W430, and in FIG. 19, each first container body 430 is shown separated by an alternate long and short dash line. An inspection electrode 431 is formed on the surface at the + Y′-axis side of the first container body 430. Although not shown in FIG. 19, an electrode pad 34 (see FIG. 18) is formed on the surface at the −Y′-axis side of the first wafer W430. Furthermore, on the boundary line indicated by the alternate long and short dash line of the adjacent first container bodies 430, the first wafer W 430 is placed on the −Y′-axis side on the + X axis side and the −X axis side of each first container body 430. A first through hole 435 penetrating from the surface to the surface on the + Y′-axis side is formed. An electrode (not shown) is formed on the inner wall of each first through-hole 435, and this electrode serves as a connection electrode 433 (see FIG. 18) that connects the inspection electrode 431 and the electrode pad 34. In addition, the electrode formed in each first through hole 435 is connected to one inspection electrode 431. The first recess 39 formed in the first joint surface 438b of the first container body 430 is indicated by a dotted line in FIG. Further, when the first through hole 435 is divided in half, the first castellations 432a and 432b (see FIG. 18) are obtained.

  FIG. 20 is a plan view of the second wafer W440. The second wafer W440 is prepared in step S204 in FIG. A plurality of second container bodies 440 are formed on the second wafer W440, and in FIG. 20, each second container body 440 is shown separated by an alternate long and short dash line. In the second wafer W440, as shown in FIG. 20, the second electrodes 472 of the second container bodies 440 adjacent in the X-axis direction are not connected to each other.

  In step S206 of FIG. 9, at least one of the crystal impedance (CI) value and the vibration frequency of the piezoelectric vibration element 310 is measured. As shown in FIG. 19, the measurement is performed, for example, by bringing a pair of probes 90 into contact with a pair of inspection electrodes 431 formed on the piezoelectric oscillator 500A. Each inspection electrode 431 formed on the first wafer W430 is connected only to an electrode (not shown) formed in one first through hole 435. Further, one first through hole 435 is connected to only one second electrode 472. On the other hand, the extraction electrode 314 is connected to only one second electrode 472 (see FIG. 18). Furthermore, as shown in FIG. 20, one second electrode 472 formed on the second wafer W 440 is not connected to the other second electrode 472. That is, since one inspection electrode 431 is connected to only one extraction electrode 314, at least one of the crystal impedance (CI) value or the vibration frequency of the piezoelectric vibration element 310 is measured while the piezoelectric oscillator 500 is formed on the wafer. be able to. That is, the first through hole 435 connected to the inspection electrode 431 of the piezoelectric oscillator 500A is formed away from the first through hole 435 connected to the inspection electrode 431 of the piezoelectric oscillator 500B on the + X axis side in the Z′-axis direction. ing. Similarly, the first through hole 435 connected to the inspection electrode 431 of the piezoelectric oscillator 500A is separated from the first through hole 435 connected to the inspection electrode 431 of the piezoelectric oscillator 500C on the −X axis side in the Z′-axis direction. Is formed. For this reason, when measuring the crystal impedance (CI) value or vibration frequency of the piezoelectric oscillator 500A, the piezoelectric oscillators 500B and 500C formed adjacent to both sides are not affected. Similarly to step S107 in FIG. 3, if the measurement result shows that the crystal impedance (CI) value or the vibration frequency value is outside the range of the appropriate value, the parameters of the integrated circuit 20 are adjusted to adjust the crystal impedance (CI). ) The value or the value of the vibration frequency is adjusted to be within the range of the appropriate value.

  As described above, the optimal embodiment of the present invention has been described in detail. However, as will be apparent to those skilled in the art, the present invention can be implemented with various modifications and variations within the technical scope thereof.

  For example, although the case where the piezoelectric vibration element is an AT-cut quartz-crystal vibration element has been shown, the present invention can be similarly applied to a BT cut that vibrates in the thickness-slip mode. The present invention can also be applied to a tuning fork type crystal vibrating element. Furthermore, the piezoelectric vibration element can be basically applied not only to a crystal material but also to a piezoelectric material including lithium tantalate, lithium niobate, or piezoelectric ceramic.

DESCRIPTION OF SYMBOLS 10, 110, 210 ... Piezoelectric vibration element 11 ... Piezoelectric piece 12, 112, 212 ... Outer frame 13 ... Excitation electrode 14, 114, 214 ... Extraction electrode 15, 115a, 115b, 215a, 215b, 217 ... Piezoelectric castellation 16, 35, 45, 116, 135, 435... Through hole 17... Through groove 19... Connection 20. Integrated circuit 21... Circuit terminal 22 .. Piezoelectric terminal 30, 130, 330, 430 ... First container body 31, 131, 331, 431 ... Inspection electrode 32, 132a, 132b, 232a, 232b, 332 ... First castellation 33, 133 ... Connection electrode 34, 141 ... Electrode pad 38a, 138a, 238a, 348a, 438a ... Ceiling surface 38b, 138b, 238b, 348b, 438b ... 1st joint surface 39, 49 ... Recess 40, 140, 340, 440 ... Second container body 44 ... External electrode 47 ... Second castellation 48a, 148a, 348a, 448a ... Second joint surface 48b, 148b, 348b, 448b ... Bottom 51 ... Metal bump 52 ... Bonding material 61, 261 ... Electrode for circuit terminal 62, 262 ... Electrode for piezoelectric terminal 70, 270 ... Cavity 71, 271, 371 ... First electrode 72, 172, 272, 372, 472 ... Second electrode 100, 200, 300, 400, 500 ... Piezoelectric oscillator 373 ... Through hole W10, W110 ... Piezoelectric wafer W30, W130 ... First wafer W40, W140 ... Second wafer

Claims (10)

In the manufacturing method of the surface mount type piezoelectric oscillator,
Piezoelectric element having a plurality of piezoelectric vibration elements having a piezoelectric piece having a pair of excitation electrodes on both the front and back main surfaces and an outer frame having a pair of extraction electrodes formed so as to surround the piezoelectric piece and drawn from the excitation electrode Preparing a wafer;
A first bonding surface made of an insulating material and bonded to one main surface of the piezoelectric vibration element, a ceiling surface opposite to the first bonding surface, and a pair of inspection electrodes formed on the ceiling surface A plurality of first container bodies are formed, a plurality of through holes penetrating from the first joint surface to the ceiling surface on a common side of the adjacent first container bodies, and connected to the inspection electrode in the through holes Preparing a first wafer on which a connection electrode to be formed is formed;
A second bonding surface bonded to the other main surface of the piezoelectric vibration element; a bottom surface opposite to the second bonding surface; and an external electrode formed on the bottom surface for mounting the piezoelectric oscillator. And preparing a second wafer on which a plurality of second container bodies made of an insulating material are formed;
Oscillating the piezoelectric piece and preparing a plurality of integrated circuits having piezoelectric terminals and circuit terminals;
The integrated circuit is mounted on the first container body or the second container body, the piezoelectric wafer, the first wafer, and the second wafer are joined to electrically connect the circuit terminal and the external electrode. A bonding step of electrically connecting the piezoelectric terminal, the connection electrode, and the extraction electrode;
After the joining step, a measurement step of measuring at least one of a crystal impedance value or a vibration frequency of the piezoelectric piece through the inspection electrode;
A method for manufacturing a piezoelectric oscillator comprising: In the manufacturing method of the surface mount type piezoelectric oscillator,
Preparing a plurality of piezoelectric pieces including a pair of excitation electrodes formed on the front and back main surfaces and a pair of extraction electrodes drawn from the excitation electrodes;
A first joint surface made of an insulating material and disposed to face one main surface of the piezoelectric piece, a ceiling surface opposite to the first joint surface, and a pair of inspection electrodes formed on the ceiling surface A plurality of first container bodies having a plurality of through holes penetrating from the first joint surface to the ceiling surface on a common side of the adjacent first container bodies, and the inspection electrode in the through hole. Preparing a first wafer on which connection electrodes to be connected are formed;
A second bonding surface disposed to face the other main surface of the piezoelectric piece; a bottom surface opposite to the second bonding surface; and an external electrode formed on the bottom surface for mounting the piezoelectric oscillator. And preparing a second wafer on which a plurality of second container bodies made of an insulating material are formed;
Oscillating the piezoelectric piece and preparing a plurality of integrated circuits having piezoelectric terminals and circuit terminals;
The integrated circuit is placed on the first container body or the second container body, the piezoelectric piece, the first wafer, and the second wafer are joined to electrically connect the circuit terminal and the external electrode. A bonding step of electrically connecting the piezoelectric terminal, the connection electrode, and the extraction electrode;
After the bonding step, a measurement step of measuring at least one of the crystal impedance value or the vibration frequency of the piezoelectric piece through the pair of inspection electrodes;
A method for manufacturing a piezoelectric oscillator comprising:   The first container body is formed in a flat rectangular shape, and the two through holes are formed in at least one of the common sides of the adjacent first container bodies, and the connection electrode is formed in the through hole. The method for manufacturing a piezoelectric oscillator according to claim 1, wherein each is connected to only one of the inspection electrodes.   3. The first container body according to claim 1, wherein the first container body is formed in a flat rectangular shape, and one through hole is formed on at least one side of the common sides of the adjacent first container bodies. A method for manufacturing a piezoelectric oscillator. After the measurement step,
Cutting the connection electrode or the inspection electrode;
A cutting step of cutting the wafer bonded in the bonding step so as to pass through the through hole;
The manufacturing method of the piezoelectric oscillator of any one of Claim 1 to 3 containing these. A surface-mounted piezoelectric oscillator,
A piezoelectric piece including a pair of excitation electrodes formed on the front and back main surfaces and a pair of extraction electrodes drawn from the excitation electrodes;
A first joint surface facing one main surface of the piezoelectric piece, a ceiling surface opposite to the first joint surface, and a pair of inspection electrodes connected to the pair of extraction electrodes on the ceiling surface, A first container body made of an insulating material;
A second container body made of an insulating material, having a second joint surface facing the other main surface of the piezoelectric piece, a bottom surface opposite to the second joint surface, and an external electrode to be mounted on the bottom surface; ,
An integrated circuit that oscillates the piezoelectric piece and is electrically connected to the extraction electrode and the external electrode;
A pair of castellations is formed on a side surface between the first joint surface and the ceiling surface, and a connection electrode for connecting the extraction electrode and the inspection electrode is formed on at least a part of the pair of castellations. Piezoelectric oscillator. A surface-mounted piezoelectric oscillator,
A piezoelectric piece including a pair of excitation electrodes formed on the front and back main surfaces and a pair of extraction electrodes drawn from the excitation electrodes;
A first joint surface facing one main surface of the piezoelectric piece, a ceiling surface opposite to the first joint surface, and a pair of inspection electrodes connected to the pair of extraction electrodes on the ceiling surface, A first container body made of an insulating material;
A second container body made of an insulating material, having a second joint surface facing the other main surface of the piezoelectric piece, a bottom surface opposite to the second joint surface, and an external electrode to be mounted on the bottom surface; ,
An integrated circuit that oscillates the piezoelectric piece and is electrically connected to the extraction electrode and the external electrode;
A pair of castellations is formed on a side surface between the first joint surface and the ceiling surface, and at least part of the pair of castellations is cut off while extending from one of the extraction electrode and the inspection electrode to the other. A piezoelectric oscillator in which connection electrodes are formed.   An outer frame connected to the piezoelectric piece and formed to surround the piezoelectric piece and having the pair of lead electrodes is provided, and the outer frame is sandwiched between the first bonding surface and the second bonding surface. The piezoelectric oscillator according to claim 6 or 7.   9. The pair of castellations according to claim 6, wherein the pair of castellations are formed so as to face each other on a first side surface that is one side surface of the side surfaces and a second side surface opposite to the first side surface. The piezoelectric oscillator according to item 1.   The pair of castellations are formed so as to face each other two on the first side surface which is one of the side surfaces and the second side surface on the opposite side, and on the first side surface and the second side surface, The piezoelectric oscillator according to claim 6, wherein only one of the connection electrodes is formed.