WO2017199835A1 - Solution de placage électrolytique de nickel (d'alliage) - Google Patents

Solution de placage électrolytique de nickel (d'alliage) Download PDF

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Publication number
WO2017199835A1
WO2017199835A1 PCT/JP2017/017832 JP2017017832W WO2017199835A1 WO 2017199835 A1 WO2017199835 A1 WO 2017199835A1 JP 2017017832 W JP2017017832 W JP 2017017832W WO 2017199835 A1 WO2017199835 A1 WO 2017199835A1
Authority
WO
WIPO (PCT)
Prior art keywords
nickel
plating solution
electrolytic
electrolytic nickel
plating
Prior art date
Application number
PCT/JP2017/017832
Other languages
English (en)
Japanese (ja)
Inventor
和也 柴田
祐樹 大平原
Original Assignee
日本高純度化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本高純度化学株式会社 filed Critical 日本高純度化学株式会社
Priority to KR1020187032988A priority Critical patent/KR102354192B1/ko
Priority to JP2018518251A priority patent/JP6860933B2/ja
Priority to CN201780030115.7A priority patent/CN109154093B/zh
Publication of WO2017199835A1 publication Critical patent/WO2017199835A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Abstract

La présente invention traite le problème consistant à fournir : une solution de placage électrolytique de nickel (d'alliage) qui est capable de remplir des micro-trous ou des micro-cavités (14) à l'intérieur d'un composant de circuit électronique avec du nickel ou un alliage de nickel (18) sans la génération de défauts tels que des vides et des bavures; un procédé de placage/remplissage de nickel ou d'alliage de nickel qui utilise cette solution de placage électrolytique de nickel (d'alliage) ; et un procédé pour produire une microstructure tridimensionnelle. Le problème décrit ci-dessus a été résolu en remplissant les micro-trous ou les micro-cavités (14) à l'aide d'une solution de placage électrolytique de nickel (d'alliage) qui contient un composé de carbonyl pyridinium N-substitué spécifique.
PCT/JP2017/017832 2016-05-18 2017-05-11 Solution de placage électrolytique de nickel (d'alliage) WO2017199835A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020187032988A KR102354192B1 (ko) 2016-05-18 2017-05-11 전해 니켈 (합금) 도금액
JP2018518251A JP6860933B2 (ja) 2016-05-18 2017-05-11 電解ニッケル（合金）めっき液
CN201780030115.7A CN109154093B (zh) 2016-05-18 2017-05-11 电解镍(合金)镀覆液

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-099184 2016-05-18
JP2016099184 2016-05-18

Publications (1)

Publication Number Publication Date
WO2017199835A1 true WO2017199835A1 (fr) 2017-11-23

Family

ID=60325868

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/017832 WO2017199835A1 (fr) 2016-05-18 2017-05-11 Solution de placage électrolytique de nickel (d'alliage)

Country Status (5)

Country Link
JP (1) JP6860933B2 (fr)
KR (1) KR102354192B1 (fr)
CN (1) CN109154093B (fr)
TW (1) TWI726101B (fr)
WO (1) WO2017199835A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015101751A (ja) * 2013-11-25 2015-06-04 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜
JP2016027211A (ja) * 2013-05-08 2016-02-18 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 半光沢ニッケルまたはニッケル合金を堆積するためのニッケルまたはニッケル合金の直流電気めっき浴、電気めっきのための方法、およびそのための浴および化合物の使用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383073A (en) * 1981-08-20 1983-05-10 The Dow Chemical Company Cationic resin curable with acid catalyzed cross-linkers
US5547832A (en) * 1992-07-07 1996-08-20 Eastman Kodak Company Method for hardening photographic materials
EP2103717B1 (fr) * 2008-02-29 2010-04-21 ATOTECH Deutschland GmbH Bain à base de pyrophosphate destiné à la déposition de couches d'alliage d'étain
CN105308723B (zh) * 2013-06-17 2019-01-01 应用材料公司 利用湿式晶片背面接触进行铜镀硅穿孔的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016027211A (ja) * 2013-05-08 2016-02-18 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 半光沢ニッケルまたはニッケル合金を堆積するためのニッケルまたはニッケル合金の直流電気めっき浴、電気めっきのための方法、およびそのための浴および化合物の使用
JP2015101751A (ja) * 2013-11-25 2015-06-04 日本高純度化学株式会社 電解金めっき液及びそれを用いて得られた金皮膜

Also Published As

Publication number Publication date
JP6860933B2 (ja) 2021-04-21
CN109154093B (zh) 2020-11-27
TW201807261A (zh) 2018-03-01
KR102354192B1 (ko) 2022-01-20
TWI726101B (zh) 2021-05-01
KR20190008232A (ko) 2019-01-23
JPWO2017199835A1 (ja) 2019-03-14
CN109154093A (zh) 2019-01-04

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