Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R13/6461—Means for preventing cross-talk
  • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
  • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
  • H01R13/6473—Impedance matching
  • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
  • H01R13/6581—Shield structure
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/66—Structural association with built-in electrical component
  • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
  • H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
  • H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
  • H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
  • H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0277—Bendability or stretchability details
  • H05K1/028—Bending or folding regions of flexible printed circuits
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R2107/00—Four or more poles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/05—Flexible printed circuits [FPCs]
  • H05K2201/056—Folded around rigid support or component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/0929—Conductive planes
  • H05K2201/09336—Signal conductors in same plane as power plane
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10227—Other objects, e.g. metallic pieces
  • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
  • H05K2201/10303—Pin-in-hole mounted pins

Definitions

• the second shielding layer is covered in a conductive material.
• the conductive material is comprised of copper and finished silver.
• Another embodiment of the present invention includes a method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, forming a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via, forming a second set of traces on a side of the substrate opposite the top layer that connect
• the first shielding layer is covered in a conductive material.
• FIG. 1 illustrates a high speed communications jack configured in accordance with one embodiment of the various aspects of the present disclosure that includes an RJ45 jack,
• FIG. 4B illustrates another embodiment of a schematic representation of a top view of the front surface of the printed circuit board of FIG. 1
• FIG. 5 A illustrates a schematic representation of a top view of the back surface of the printed circuit board of FIG. 4,
• FIG. 6B illustrates a cross sectional view of a via in the printed circuit board of FIG.
• FIG. 6C illustrates a cross sectional view of another example of a via in the printed circuit board of FIG. 4.
• FIG. 7 illustrates a schematic representation an RJ45 jack having transmit and receiving cable pairs matched and balanced to one another
• FIG. 8 illustrates a schematic representation of a differentially balanced pair of signal lines
• FIG. 9 illustrates a schematic representation of the process used to differentially balance two traces in FIG. 4 based on a first signal and a second signal
• FIG. 10A illustrates a rear perspective view of the RJ45 jack of FIG. 1 with the shield removed;
• FIG. 10B illustrates a rear perspective view of another embodiment of the RJ45 jack of FIG. 1 with the shield removed;
• FIG. 11 depicts one embodiment of a high speed communication jack including a rigid substrate
• FIG. 12 depicts a schematic representation of the layers in a rigid high speed communication j ack
• FIG. 13 A depicts a side view of the high speed communication jack
• FIG. 13B depicts a top view of the rigid substrate
• FIG. 14A depicts a ground layer of the substrate
• FIG. 14C depicts a bottom layer of the substrate
• FIGS. 15B depicts a graphical representation of near field cross talk for the jack in normal operation
• FIGS. 15C depicts a graphical representation of near field cross talk for the jack in normal operation
• FIG. 15E depicts a graphical representation of far end cross talk for the jack during normal operation.
• FIG. 3 illustrates a bottom and right side view of a jack shield for providing shielding for the RJ45 jack 110 and the flexible PCB 120.
• the jack shield 130 includes a top portion 302, a bottom portion 304, a back portion 306, a front portion 308, a left side portion (not shown but substantially identical to the right side portion) and a right side portion 310.
• the jack shield 130 may include a conductive material such as, but not limited to, steel, copper, or any other conductive material.
• Each trace 422, 424, 426, 428, 430, 432, 434 and 436 extends towards a back end of the PCB 120 until the trace 422, 424, 426, 428, 430, 432, 434 or 436 reaches a shielding trace layer 490 near an edge of the PCB 120 opposite the vias 406, 408, 410, 412, 414, 416, 418 and 420.
• Each trace 422, 424, 426, 428, 430, 432, 434 and 436 includes a first portion 454, 456, 458, 460, 462, 464, 466 and 468 adjacent to a second portion 470, 472, 474, 476, 478, 480, 482 and 484 with each second portion 470, 472, 474, 476, 478, 480, 482 and 484 extending to the shielding trace layer 490 without contacting the shielding trace layer 490.
• Each first portion 454, 456, 458, 460, 462, 464, 466 and 468 tapers from the respective second portion 470, 472, 474, 476, 478, 480, 482 and 484 towards a respective via 406, 408, 410, 412, 414, 416, 418 or 420.
• Each second portion 470, 472, 474, 476, 478, 480, 482 and 484 has a length that varies depending on the trace 422, 424, 426, 428, 430, 432, 434 or 436.
• FIG. 6A illustrates a cross-section view of the multi-layer substrate 402 in the PCB 120 along line BB of FIG. 4.
• a first layer 602 of the multi-layer substrate 402 includes a solder mask portion, made from a material such as PSR9000FST Flexible Solder Mask.
• a second layer 604 is formed under the top layer and includes each of the traces 422, 424, 426, 428, 430, 432, 434 and 436.
• Each trace 422, 424, 426, 428, 430, 432, 434 and 436 has a length (L), a height (H) and a width (W), and is separated from an adjacent trace by a distance (S).
• each trace is the length the trace extends along the surface of the flexible circuit board 120 from the edge of its respective via 406, 408, 410, 412, 414, 416, 418 and 420 to shielding trace layer 490.
• Each trace 422, 424, 426, 428, 430, 432, 434 and 436 extends through the first layer 602 such that each trace 422, 424, 426, 428, 430, 432, 434 and 436 is not covered by the flexible solder mask.
• Shield trace layer 490 is also formed over a portion of the second layer 604 with the shield trace layer 490 extending through the first layer 602.
• each trace 422, 424, 426, 428, 430, 432, 434 and 436 is electrically coupled to an adjacent trace 422, 424, 426, 428, 430, 432, 434 and 436.
• trace 422 may be coupled to trace 424.
• a first signal is transmitted down a first trace and an identical signal having an opposite polarity is transmitted down the matched trace thereby differentially coupling the traces together. Because the traces are differentially coupled together, the impedance of each trace determines how the trace is driven. Accordingly, the impedance of each set of matched trace should be substantially equal.
• each trace 422, 424, 426, 428, 430, 432, 434 or 436 in a matched set of traces includes a common mode filter that is tuned to eliminate any common mode interference in the matched set.
• adjusting the depth of the third layer 606 in relation to the conductive material on the vias 406, 408, 410, 412, 414, 416, 418 and 420 allows for the capacitive effect of each via 406, 408, 410, 412, 414, 416, 418 and 420 to be adjusted.
• the capacitors created by the via 406, 408, 410, 412, 414, 416, 418 and 420 and return portion of the fourth layer 608 are sized between approximately 0.1 picofarads (pf) to approximately 0.5pf.
• the top and bottom surfaces of the substrate 402 may be covered in a plastic insulating layer to further enhance the operation of the circuit.
• the second layer 604 also connects each via 406, 408, 410, 412, 414, 416, 418 and 420 to its respective trace 422, 424, 426, 428, 430, 432, 434 or 436.
• the third layer 606 acts as a dielectric layer as described in FIG. 6A.
• the fourth layer 608 is formed in the third layer 606 and acts as a signal return layer.
• the fifth layer 610 is also made from a conductive material such as copper or gold, and also surrounds the circumference of the via in the same manner as the second layer 602.
• a sealing layer (not shown) may also be formed over the fifth layer 610.
• FIGS. 15A-15F depicts a graphical representation of test results for the high speed communication jack.
• FIG. 15A shows the insertion loss of a differential mode version of the jack during normal operation. As the graph shows, at speeds approaching 2000 MHz, the insertion loss is approximately 1.8 db.
• FIGS. 15B and 15C depict a graphical representation of near field cross talk for the jack in normal operation.
• FIG. 15D depicts the return loss for the jack during normal operation.
• the graph also shows the performance requirements for the IEEE 40GBase-T standard. As the graph indicates, at speeds approaching 2000 MHz, the jack performs better than the requirements of the IEEE 40GBase-T standard.
• FIG. 15A shows the insertion loss of a differential mode version of the jack during normal operation. As the graph shows, at speeds approaching 2000 MHz, the insertion loss is approximately 1.8 db.
• FIGS. 15B and 15C depict a graphical representation of near field cross talk for the jack in normal operation.
• FIG. 15E depicts a graphical representation of far end cross talk for the jack during normal operation.
• the graph also shows the performance requirement for the IEEE 40GBase-T standard. As the graph indicates, at speeds approaching 2000 MHz, the jack performs better than the requirements of the IEEE 40GBase-T standard.
• FIG. 15F depicts another graphical representation of far end cross talk for the jack during normal operation.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Details Of Connecting Devices For Male And Female Coupling (AREA)
• Manufacturing Of Electrical Connectors (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)

Priority Applications (11)

Applications Claiming Priority (2)

Publications (1)

Family

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Family Applications (1)

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Citations (5)

Family Cites Families (10)

• 2017
  • 2017-05-03 TW TW106114632A patent/TWI743118B/zh active
  • 2017-05-04 CN CN201780027344.3A patent/CN109478747B/zh active Active
  • 2017-05-04 MX MX2018013320A patent/MX2018013320A/es unknown
  • 2017-05-04 BR BR112018071868-8A patent/BR112018071868A2/pt not_active Application Discontinuation
  • 2017-05-04 KR KR1020187031440A patent/KR102318866B1/ko active IP Right Grant
  • 2017-05-04 JP JP2018557872A patent/JP7339734B2/ja active Active
  • 2017-05-04 EP EP17793306.6A patent/EP3453081A4/en active Pending
  • 2017-05-04 RU RU2018138613A patent/RU2713644C1/ru active
  • 2017-05-04 WO PCT/US2017/030968 patent/WO2017192800A1/en unknown
  • 2017-05-04 AU AU2017260462A patent/AU2017260462B2/en not_active Ceased
  • 2017-05-04 CA CA3022689A patent/CA3022689A1/en not_active Abandoned
• 2018
  • 2018-10-21 IL IL262491A patent/IL262491B/en unknown
  • 2018-10-26 PH PH12018502285A patent/PH12018502285A1/en unknown

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