CA3022689A1 - High speed grounded communication jack - Google Patents
High speed grounded communication jack Download PDFInfo
- Publication number
- CA3022689A1 CA3022689A1 CA3022689A CA3022689A CA3022689A1 CA 3022689 A1 CA3022689 A1 CA 3022689A1 CA 3022689 A CA3022689 A CA 3022689A CA 3022689 A CA3022689 A CA 3022689A CA 3022689 A1 CA3022689 A1 CA 3022689A1
- Authority
- CA
- Canada
- Prior art keywords
- layer
- jack
- substrate
- vias
- traces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004891 communication Methods 0.000 title claims description 39
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 238000002955 isolation Methods 0.000 claims description 22
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 description 168
- ZLGYJAIAVPVCNF-UHFFFAOYSA-N 1,2,4-trichloro-5-(3,5-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC(Cl)=C(Cl)C=2)Cl)=C1 ZLGYJAIAVPVCNF-UHFFFAOYSA-N 0.000 description 36
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 18
- 229910052737 gold Inorganic materials 0.000 description 17
- 239000010931 gold Substances 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- 239000003990 capacitor Substances 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- -1 but not limited to Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- BWWVXHRLMPBDCK-UHFFFAOYSA-N 1,2,4-trichloro-5-(2,6-dichlorophenyl)benzene Chemical compound C1=C(Cl)C(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl BWWVXHRLMPBDCK-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920002457 flexible plastic Polymers 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2107/00—Four or more poles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/056—Folded around rigid support or component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09336—Signal conductors in same plane as power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/146,019 | 2016-05-04 | ||
| US15/146,019 US9627816B2 (en) | 2012-02-13 | 2016-05-04 | High speed grounded communication jack |
| PCT/US2017/030968 WO2017192800A1 (en) | 2016-05-04 | 2017-05-04 | High speed grounded communication jack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA3022689A1 true CA3022689A1 (en) | 2017-11-09 |
Family
ID=60203392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3022689A Abandoned CA3022689A1 (en) | 2016-05-04 | 2017-05-04 | High speed grounded communication jack |
Country Status (13)
| Country | Link |
|---|---|
| EP (1) | EP3453081A4 (zh) |
| JP (1) | JP7339734B2 (zh) |
| KR (1) | KR102318866B1 (zh) |
| CN (1) | CN109478747B (zh) |
| AU (1) | AU2017260462B2 (zh) |
| BR (1) | BR112018071868A2 (zh) |
| CA (1) | CA3022689A1 (zh) |
| IL (1) | IL262491B (zh) |
| MX (1) | MX2018013320A (zh) |
| PH (1) | PH12018502285A1 (zh) |
| RU (1) | RU2713644C1 (zh) |
| TW (1) | TWI743118B (zh) |
| WO (1) | WO2017192800A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023028712A (ja) * | 2021-08-20 | 2023-03-03 | 日本航空電子工業株式会社 | コネクタ組立体 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69421798T2 (de) * | 1994-03-26 | 2004-07-15 | Molex Inc., Lisle | Verbinder vom Typ Modular Jack |
| JP2003224408A (ja) * | 2002-01-30 | 2003-08-08 | Kyocera Corp | 高周波用配線基板 |
| US6769937B1 (en) * | 2003-05-13 | 2004-08-03 | Molex Incorporated | Modular jack assembly for jack plugs with varying numbers of wires |
| US7182649B2 (en) * | 2003-12-22 | 2007-02-27 | Panduit Corp. | Inductive and capacitive coupling balancing electrical connector |
| EP2675022B1 (en) * | 2004-07-13 | 2014-09-03 | Panduit Corporation | Communications connector with flexible printed circuit board |
| US7601034B1 (en) * | 2008-05-07 | 2009-10-13 | Ortronics, Inc. | Modular insert and jack including moveable reactance section |
| WO2009138168A1 (de) | 2008-05-15 | 2009-11-19 | Adc Gmbh | Leiterplatte für elektrischen verbinder und elektrischer verbinder |
| US8167661B2 (en) * | 2008-12-02 | 2012-05-01 | Panduit Corp. | Method and system for improving crosstalk attenuation within a plug/jack connection and between nearby plug/jack combinations |
| US8660424B2 (en) | 2010-08-26 | 2014-02-25 | Cisco Technology, Inc. | Scalable high speed gigabit active bundle link and tester |
| US8637987B2 (en) | 2011-08-09 | 2014-01-28 | Micron Technology, Inc. | Semiconductor assemblies with multi-level substrates and associated methods of manufacturing |
| US8858266B2 (en) * | 2012-02-13 | 2014-10-14 | Sentinel Connector Systems, Inc. | High speed communication jack |
| US9337592B2 (en) | 2012-02-13 | 2016-05-10 | Sentinel Connector Systems, Inc. | High speed communication jack |
| TWM445286U (zh) * | 2012-09-03 | 2013-01-11 | Simula Technology Inc | 訊號連接器 |
| US8915756B2 (en) * | 2013-01-23 | 2014-12-23 | Commscope, Inc. Of North Carolina | Communication connector having a printed circuit board with thin conductive layers |
| CN103390818B (zh) * | 2013-08-09 | 2015-08-12 | 浙江一舟电子科技股份有限公司 | 一种超高速通信用抗串扰接口电路及包含该接口电路的插座 |
-
2017
- 2017-05-03 TW TW106114632A patent/TWI743118B/zh active
- 2017-05-04 CA CA3022689A patent/CA3022689A1/en not_active Abandoned
- 2017-05-04 KR KR1020187031440A patent/KR102318866B1/ko active IP Right Grant
- 2017-05-04 WO PCT/US2017/030968 patent/WO2017192800A1/en unknown
- 2017-05-04 EP EP17793306.6A patent/EP3453081A4/en active Pending
- 2017-05-04 JP JP2018557872A patent/JP7339734B2/ja active Active
- 2017-05-04 AU AU2017260462A patent/AU2017260462B2/en not_active Ceased
- 2017-05-04 MX MX2018013320A patent/MX2018013320A/es unknown
- 2017-05-04 RU RU2018138613A patent/RU2713644C1/ru active
- 2017-05-04 BR BR112018071868-8A patent/BR112018071868A2/pt not_active Application Discontinuation
- 2017-05-04 CN CN201780027344.3A patent/CN109478747B/zh active Active
-
2018
- 2018-10-21 IL IL262491A patent/IL262491B/en unknown
- 2018-10-26 PH PH12018502285A patent/PH12018502285A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN109478747A (zh) | 2019-03-15 |
| AU2017260462A1 (en) | 2018-11-15 |
| IL262491B (en) | 2022-04-01 |
| AU2017260462B2 (en) | 2021-05-20 |
| PH12018502285A1 (en) | 2019-07-15 |
| JP2019519068A (ja) | 2019-07-04 |
| RU2713644C1 (ru) | 2020-02-05 |
| EP3453081A4 (en) | 2020-01-22 |
| CN109478747B (zh) | 2021-03-05 |
| TWI743118B (zh) | 2021-10-21 |
| KR102318866B1 (ko) | 2021-10-28 |
| EP3453081A1 (en) | 2019-03-13 |
| JP7339734B2 (ja) | 2023-09-06 |
| WO2017192800A1 (en) | 2017-11-09 |
| TW201813215A (zh) | 2018-04-01 |
| IL262491A (en) | 2018-12-31 |
| KR20190000888A (ko) | 2019-01-03 |
| BR112018071868A2 (pt) | 2019-02-19 |
| MX2018013320A (es) | 2019-03-01 |
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| US9899776B2 (en) | High speed communication jack | |
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| US9627816B2 (en) | High speed grounded communication jack |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |
Effective date: 20221104 |
|
| FZDE | Discontinued |
Effective date: 20221104 |
|
| FZDE | Discontinued |
Effective date: 20221104 |