WO2017183688A1 - 多数個取り配線基板、配線基板および多数個取り配線基板の製造方法 - Google Patents
多数個取り配線基板、配線基板および多数個取り配線基板の製造方法 Download PDFInfo
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- WO2017183688A1 WO2017183688A1 PCT/JP2017/015867 JP2017015867W WO2017183688A1 WO 2017183688 A1 WO2017183688 A1 WO 2017183688A1 JP 2017015867 W JP2017015867 W JP 2017015867W WO 2017183688 A1 WO2017183688 A1 WO 2017183688A1
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- Prior art keywords
- wiring board
- main surface
- groove
- divided
- dividing
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02897—Means for compensation or elimination of undesirable effects of strain or mechanical damage, e.g. strain due to bending influence
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
- H03B5/326—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator the resonator being an acoustic wave device, e.g. SAW or BAW device
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Definitions
- the present invention relates to a multi-piece wiring board in which a plurality of wiring board regions having electronic component mounting portions are arranged vertically and horizontally on a mother board, a wiring board, and a manufacturing method of the multi-piece wiring board.
- a multi-piece wiring board in which a plurality of wiring board regions are arranged vertically and horizontally on a mother board is known.
- a dividing groove is formed in the main surface such as the upper surface of the mother board along the boundary of the wiring board region.
- a bending stress is applied to the mother board across the dividing groove, and the mother board is broken, thereby being divided into individual wiring boards.
- the dividing grooves are formed, for example, by making a cut at a predetermined depth on the upper and lower surfaces of the unfired mother board along the outer periphery of the wiring board region using a cutter blade or the like.
- the mother board when a plurality of through holes are formed across the outer periphery of the wiring board region, the mother board is relatively easily divided into individual wiring boards by the action of the through holes and the dividing grooves described above. .
- it can be set as the structure which electrically connects the wiring conductors of an adjacent wiring board area
- this multi-piece wiring board there may be a case where a through hole is not formed on the outer periphery of the wiring board region.
- a through hole is not formed on the outer periphery of the wiring board region.
- the width of the dividing groove is smaller in the processing of the dividing groove by laser compared to the dividing groove that is mechanically formed by a conventional mold or the like.
- the mother board in which the wiring board area in which the through holes are formed on the outer periphery is arranged is arranged in the case where the misalignment of the divided grooves occurs. There is a problem that it is difficult to divide the corner of the wiring board region.
- a multi-cavity wiring board includes a mother board having a first main surface and a second main surface opposite to the first main surface and in which a plurality of wiring board regions are arranged.
- the mother board includes a dividing groove provided in the first main surface and the second main surface along a boundary of the wiring board region, and the dividing groove is one side of the wiring board region.
- a wiring board has a first main surface and a second main surface opposite to the first main surface, and has a rectangular substrate in plan view.
- a first side surface provided on the first main surface side of one opposite side of the set, a second side surface provided on the first main surface side of the other opposite side, and a set A third side surface provided on the second main surface side of the opposite one side, a fourth side surface provided on the second main surface side of the other set of opposite sides, and the first side surface;
- the length of one side surface and the length of the third side surface are provided larger than the length of the second side surface and the length of the fourth side surface, toward the corner of the substrate.
- Has a first track portion the length of the second side face are gradually larger provided, and a second curving section length of the fourth side surface is gradually larger provided.
- a method for manufacturing a multi-piece wiring board includes a single-layer or multiple-layer ceramic insulating layer, and includes a first main surface and a second main surface opposite to the first main surface. And forming a plurality of wiring board regions arranged on the mother board and laser processing to form the mother board on one side of the wiring board area along one side of the wiring board area.
- the first divided groove is formed on the surface side, the depth is smaller than the first divided groove on the first main surface side along the other side of the wiring board region, and the corner of the wiring board region is formed. Forming the first divided portion by forming the third dividing groove having a gradually increasing depth, and laser processing, the second substrate along the one side of the wiring board region by laser processing.
- the second curved portion is formed by forming the fourth divided groove on the second main surface side that is smaller in depth than the second divided groove and gradually increases in depth toward the corner of the wiring board region. And a step of performing.
- the multi-cavity wiring board includes a mother board having a first main surface and a second main surface opposite to the first main surface and in which a plurality of wiring board regions are arranged.
- the mother board includes dividing grooves provided in the first main surface and the second main surface along the boundary of the wiring board region, and the dividing groove is a first main surface on one side of the wiring board region.
- the dividing groove is formed by a laser. Even if formed, it can be made difficult to be affected by the positional deviation of the dividing grooves.
- the first curved part and the second curved part are provided at the intersection where both the vertical and horizontal dividing grooves intersect, It is possible to realize a multi-piece wiring board that can suppress a burr and a chip at a corner portion of the wiring board, can be easily divided, and can manufacture a wiring board with high dimensional accuracy.
- the wiring board has the first main surface and the second main surface opposite to the first main surface, and has a rectangular substrate in plan view.
- a first side surface provided on the first main surface side of one pair of opposite sides and a second side surface provided on the first main surface side of the other pair of opposite sides, a set of opposite sides.
- a third side surface provided on the second main surface side of one side, a fourth side surface provided on the second main surface side of the other pair of opposite sides, a first side surface and a third side surface
- a first curved portion having a length that is greater than the length of the second side surface and the length of the fourth side surface, the length of the second side surface being gradually increased toward the corner of the substrate; Dimensional accuracy with reduced burr and chipping at the corners of the wiring board without having a notch around the wiring board because it has the second curved part with the length of the four side surfaces gradually increasing. Can realize a high wiring board.
- the first main surface and the second main surface opposite to the first main surface include a single-layer or multiple-layer ceramic insulating layer; And forming a plurality of wiring substrate regions arranged on the mother substrate, and laser processing to form the mother substrate on the first main surface side along one side of the wiring substrate region.
- a first dividing groove is formed, the depth is smaller than the first dividing groove on the first main surface side along the other side of the wiring board region, and the depth gradually increases toward the corner of the wiring board region.
- the first divided portion by forming a three-divided groove and laser processing, forming a second divided groove on the second principal surface side along one side of the wiring board region on the mother board by wiring A depth smaller than the second dividing groove on the second main surface side along the other side of the substrate region, Forming the second curved portion by forming a fourth dividing groove having a gradually increasing depth toward the portion, so that a laser is applied to the multi-piece wiring substrate without providing a through hole on the outer periphery of the wiring substrate.
- the first and second curved portions can be formed at the intersections where both the vertical and horizontal dividing grooves intersect, suppressing burrs and chips at the corners of the wiring board region.
- the multi-cavity wiring board, the wiring board, and the manufacturing method of the multi-cavity wiring board of the present invention will be described with reference to the accompanying drawings.
- 101 is a mother board, 102 is a wiring board, 103 is a first main surface, 104 is a second main surface, 105 is one side, 106 is the other side, 107 is a first dividing groove, 108 is the second divided groove, 109 is the third divided groove, 110 is the fourth divided groove, 111 is the first curved portion, 112 is the second curved portion, 113 is the first side surface, 114 is the second side surface, and 115 is the first 1 curved surface, 116 is the third side surface, 117 is the fourth side surface, 118 is the second curved surface, 119 is the first bottom, 120 is the second bottom, 121 is the first intersection, 122 is the second intersection, and 123 is the first 1 virtual circle, 124 is a second virtual circle, 125 is a wiring conductor for connection, 126 is a laser, and 127 is a frame-like metallized layer.
- a wiring board 102 serving as an electronic component storage package arranged on the mother board 101 has a first main surface 103 including a concave mounting portion, and an electronic component (not shown) is accommodated in the mounting portion.
- the wiring board 102 has a base portion and a frame portion stacked on the base portion.
- a frame-like metallized layer 127 is provided on the frame portion of the first main surface 103, and a metal frame (not shown) and a metal lid (not shown) are joined to the frame-like metallized layer 127 by a brazing material. .
- the metal lid is further joined to the metal frame.
- the wiring board 102 includes a wiring conductor, a connecting wiring conductor, an external connecting conductor, and the like.
- an electronic device is formed by bonding an electronic component to a wiring conductor provided on the mounting portion of the wiring substrate 102 with a bonding material or the like.
- Such a wiring board 102 is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards 102 are obtained collectively from a single large-area mother board 101.
- a plurality of wiring board regions are arranged vertically and horizontally on a mother board 101 made of, for example, an aluminum oxide sintered body.
- the mother board 101 is formed by arranging wiring board areas (areas to be the wiring board 102) in which through holes are not provided on the outer periphery.
- connection wiring conductor 125 is provided in the inner layer where no groove is formed.
- FIG. 1 shows a structure provided in the vicinity of the center of the thickness on the long side of each wiring board region. Note that the connection wiring conductor 125 may be formed on the short side of each wiring board region.
- the mother substrate 101 is a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. It is formed by the body.
- a ceramic sintered body such as an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a mullite sintered body. It is formed by the body.
- the mother board 101 is manufactured by laminating a plurality of ceramic insulating layers and integrally firing the laminated body. That is, if the mother substrate 101 is made of an aluminum oxide sintered body, it is manufactured as follows. First, a plurality of ceramic green sheets are produced by adding a suitable organic solvent and a binder to a raw material powder containing a glass component such as aluminum oxide and silicon oxide and forming into a sheet shape. Next, a punching process is performed on a part of the sheet to form a sheet having a plurality of frame parts, and then a plurality of frame parts are formed on a flat ceramic green sheet that has not been punched. Laminated ceramic green sheets.
- a mother substrate 101 in which wiring substrate regions in which a plurality of ceramic insulating layers are laminated is formed in a vertical and horizontal manner can be produced.
- the ceramic green sheet that has been punched becomes the frame, and the ceramic green sheet that has not been punched becomes the base.
- the wiring board 102 serving as an electronic component storage package has an electronic component mounting portion (concave portion) at the center of the upper surface thereof.
- the base part and the frame part act as a container for protecting the electronic component housed in the mounting part.
- Examples of electronic components housed in the mounting unit include various electronic devices such as piezoelectric vibrators such as crystal vibrators, surface acoustic wave elements, semiconductor elements such as semiconductor integrated circuit elements (ICs), capacitive elements, inductor elements, resistors, and the like. List the parts.
- Such an electronic component storage package is, for example, when the electronic component is a crystal resonator and when the electronic device is a crystal device, a communication device such as a mobile phone or a smart phone, a computer, an IC card, etc.
- a communication device such as a mobile phone or a smart phone, a computer, an IC card, etc.
- an electronic device such as an information device, it is used as a package for an oscillator serving as a reference for frequency and time. In this case, the electronic device is used as an oscillator.
- the electronic component accommodated in the mounting portion is electrically connected to the wiring conductor by a bonding material such as a conductive adhesive.
- the wiring board 102 is a product manufactured in a so-called multi-cavity form and divided into individual pieces. For example, a plurality of wiring board regions having mounting portions are arranged vertically and horizontally on a mother board 101 in which a plurality of ceramic insulating layers are laminated. A dividing groove is formed by a laser along the boundary of the wiring board region on the upper surface of the mother board 101, so that, for example, a multi-piece wiring board as shown in FIG. 1 is basically configured.
- Such a mother board 101 is divided along the boundary of the wiring board region, and for example, a wiring board 102 to be an electronic component storage package as shown in FIG. 2 is manufactured.
- dividing grooves are formed in the first main surface 103 and the second main surface 104 of the mother substrate 101 along the boundary of the wiring substrate region.
- a first dividing groove 107 and a third dividing groove 109 are formed on the first main surface 103, and a second dividing groove 108 and a fourth dividing groove 110 are formed on the second main surface 104.
- the mother board 101 is divided into individual wiring boards 102 by applying stress to the mother board 101 at the portion where the groove is formed (border of the wiring board region) and bending the mother board 101 in the thickness direction. It will be.
- a wiring conductor (not shown) is formed inside and on the surface of the wiring board 102 from the bottom surface of the mounting portion to the lower surface of the wiring board 102.
- a portion formed on the second main surface of the wiring board 102 is, for example, an external connection conductor.
- those formed inside the wiring substrate 102 are a through conductor (so-called via conductor or the like) and a connecting wiring conductor 125 or the like.
- the wiring conductor is made of a metal material such as copper, silver, palladium, gold, platinum, tungsten, molybdenum, manganese, or an alloy containing them.
- a metal paste (not shown) prepared by adding an organic solvent and a binder to molybdenum powder is applied to a ceramic green sheet serving as the wiring substrate 102. It can be applied by a predetermined pattern and formed by simultaneous firing.
- a metallized conductor layer to be a frame-like metallized layer 127 of the divided wiring board 102 is formed on the outer periphery of the upper surface of each wiring board region.
- the outer periphery of the frame-shaped metallized layer 127 is in contact with the first divided groove 107 and the third divided groove 109.
- the frame-like metallized layer 127 is made of a metal such as tungsten or molybdenum.
- the frame-like metallized layer 127 is made of a molybdenum metallized conductor layer, a ceramic paste that is made by adding an organic solvent, a binder, etc.
- the ceramic insulating layer (frame part). It can be formed by printing in a predetermined pattern on the upper surface of the sheet.
- the metal paste is formed by, for example, a screen printing method or the like so that the thickness of the frame-like metallized layer 127 after firing becomes about 8 to 20 ⁇ m.
- a metal frame (not shown) may be further joined to the upper surface of the frame-like metallized layer 127 with a brazing material.
- the joining of the metal frames may be performed in the state of a multi-piece wiring board, or may be performed in the state of an individual electronic component storage package (wiring board 102). When productivity is taken into consideration, the joining is performed in a multi-piece state.
- a metal cover body is joined to this metal frame, and an electronic component is sealed by the mounting part.
- a plating layer (not shown) such as a nickel plating layer and a gold plating layer is sequentially deposited on the exposed surface of the frame-like metallized layer 127 and the metal frame.
- the nickel plating layer is formed with a thickness of about 1.0 to 20 ⁇ m
- the gold plating layer is formed with a thickness of about 0.1 to 1.0 ⁇ m. Since the exposed surface of each exposed metal layer is covered with these plating layers, the corrosion of the metal layer and the wettability of solder, brazing material, etc. are improved.
- the multi-cavity wiring substrate has a first main surface 103 and a second main surface 104 opposite to the first main surface 103, and a mother substrate 101 in which a plurality of wiring substrate regions (regions to be the wiring substrate 102) are arranged.
- the mother board 101 includes dividing grooves provided in the first main surface 103 and the second main surface 104 along the boundary of the wiring board region, and the dividing groove is one of the wiring board regions.
- a first dividing groove 107 provided on the first main surface 103 of the side 105; a second dividing groove 108 provided on the second main surface 104 so as to face the first dividing groove 107; and the other of the wiring board region A third divided groove 109 provided on the first main surface 103 of the side 106 and a fourth divided groove 110 provided on the second main surface 104 so as to face the third divided groove 109.
- the depth of the first dividing groove 107 and the depth of the second dividing groove 108 are larger than the depth of the third dividing groove 109 and the depth of the fourth dividing groove 110, and are directed toward the corners of the wiring board region.
- a third have a first curving portion 111 which depth is gradually increased provided the dividing groove 109, second curving portion 112 the depth of the fourth dividing groove 110 is gradually larger provided.
- the first curved part 111 and the second curved part 112 are provided at the intersection where both the vertical and horizontal dividing grooves intersect. As a result, it is possible to realize a multi-piece wiring board that can suppress the burrs and chips at the corners of the wiring board, can be easily divided, and can manufacture the wiring board 102 with high dimensional accuracy.
- the first divided groove 107 provided on the first main surface 103 of one side 105 and the second divided groove 108 provided on the second main surface 104 are opposed to each other. Since it is formed relatively deeply, it is easy to divide the mother substrate 101 along one side 105.
- the third divided groove 109 provided on the first main surface 103 on the other side 106 and the fourth divided groove 110 provided on the second main surface 104 are relatively shallow so as to face each other. Since it is formed, easiness of division in the direction along the other side 106 of the mother substrate 101 is suppressed, but the first curved portion 111 and the second curved portion 112 are thus provided. As a result, the easiness of division at the corners of each wiring board 102 can be improved.
- the through holes are formed with respect to the positional deviation of the dividing grooves on the upper and lower surfaces.
- the dividing groove is compared with the dividing groove mechanically formed by a conventional mold or the like.
- the width is small, there is a possibility that division at the corners of the wiring board region may be difficult when the division grooves are misaligned. In this way, the first curved portion 111 and the second curved portion 112 may be difficult. Is provided, the area where the other side 106 is substantially broken is reduced. Further, in the wiring board region, the third dividing groove 109 and the fourth dividing groove 110 that are formed relatively shallow at corners where burrs and chips are likely to occur are divided in the vicinity of the corners of the wiring board region. The depth is large. Therefore, for example, even when a large number of stresses during handling are applied to the wiring board, it is possible to prevent the wiring board from being divided erroneously, and to improve the easiness of dividing at the corners of each wiring board 102.
- connection wiring conductor 125 is provided in the inner layer of the other side 106 of the wiring board region as shown in FIG. 1, even if the wiring board 102 is downsized and its thickness is very thin,
- the third divided groove 109 provided on the first main surface 103 of the other side 106 and the fourth divided groove 110 provided on the second main surface 104 are formed relatively shallow, and the connection wiring is formed by forming the divided groove.
- the possibility that the conductor 125 is disconnected is reduced. Therefore, there is an effect that it is possible to suppress disconnection of the connection wiring conductor 125 serving as a conduction path between adjacent wiring board regions and to prevent the mother board 101 from being erroneously divided due to stress during handling.
- the mother board 101 is strip-shaped along one side 105 where the first dividing groove 107 and the second dividing groove 108 are formed, that is, the wiring board region is one row.
- the strip-shaped assembly is further divided into individual wiring boards 102 along the other side 106 where the third divided grooves 109 and the fourth divided grooves 110 are formed. do it.
- the depth of the dividing groove is relatively deep, so that the entire mother substrate 101 can have a large fracture area, and the other side 106 has
- the depth of the dividing groove is relatively shallow and the width of the assembly to be divided can be reduced, so that the fracture area can be reduced and the mother substrate 101 can be easily divided.
- the specific manufacturing method of each division groove is mentioned later.
- the multi-cavity wiring board is arranged between the first side surface 113 exposed on one side 105 of the wiring board region and the second side surface 114 exposed on the other side 106 on the first main surface 103 side.
- One curved surface 115 is provided, and on the second main surface 104 side, a first curved surface 115 is provided between the third side surface 116 exposed at one side 105 of the wiring board region and the fourth side surface 117 exposed at the other side 106.
- Two curved surfaces 118 are provided, and the widths of the first curved surface 115 and the second curved surface 118 are gradually narrowed toward the central portion in the thickness direction of the wiring board region.
- the first curved surface 115 is provided on the first main surface 103 side of each corner of the separated wiring substrate 102, and the second curved surface 118 is further provided on the second main surface 104 side. Therefore, it is possible to realize a multi-cavity wiring board that can suppress the burrs and chips at the corners, can be easily divided, and can manufacture the wiring board 102 with high dimensional accuracy.
- the storage property when stored in a tray (transport container provided with a plurality of recesses) for transporting the wiring substrate 102 is improved.
- the material of the tray is a resin such as PE (polyethylene) or PP (polypropylene), and is made of a soft material as compared with the ceramic material constituting the wiring board 102.
- the dividing grooves are formed by the laser 126 along the boundary of the wiring board region, By providing the first curved surface 115 and the second curved surface 118 at the four corners of the separated wiring board 102, burrs and chips at the corners are suppressed, and the storage property when stored in a tray or the like is improved. .
- the first division into one side 105 on the first main surface 103 side by the laser 126 is performed.
- a groove 107 may be provided, and the third divided groove 109 may be provided so that the first divided groove 107 and the third divided groove 109 intersect at a corner portion of each wiring board region.
- the third dividing groove 109 is provided, the first curved surface 115 is chamfered by irradiating the corners of each wiring board region with the laser 126 at the corners of each wiring board region as shown in FIG. Is provided.
- a second divided groove 108 is provided on one side 105 on the second main surface 104 side by a laser 126, and further, the second divided groove 108 and the fourth divided groove 110 are positioned at the corners of each wiring board region. What is necessary is just to provide the 4th division
- the fourth dividing groove 110 is provided, as shown in FIG. 2, the second curved surface 118 is chamfered by irradiating the corners of each wiring board region with the laser 126 at the corners of each wiring board region. Is provided.
- the laser 126 is applied to the mother substrate 101 in the vertical direction from the upper side to the lower side, and is applied so that the focal point thereof is in the vicinity of the lowest point of the dividing groove. That is, the vertical cross-sectional shape of each dividing groove is V-shaped or U-shaped. Therefore, as shown in FIG. 2, the first curved surface 115 is wider as it is closer to the first main surface 103 of the wiring board region, and the second curved surface 118 is wider as it is closer to the second main surface 104 of the wiring board region. Is provided.
- the second main surface is also provided on the first main surface 103 side (upper surface) of the wiring board 102 when it is stored in a tray or the like for transport.
- the corners near the main surface of the wiring board 102 are chamfered by the laser 126, and the curvature of each corner of the wiring board 102 is difficult to be sharpened.
- the tray is made of a soft material, each corner of the wiring board 102 is less likely to be hooked on the inner surface of the tray, etc., and the storage capacity when storing the wiring board 102 in a tray or the like is more effective. It becomes good. Furthermore, it is possible to suppress the generation of dust due to the corners of the wiring substrate 102 coming into contact with the inner side surface of the tray during conveyance, and part of the tray being scraped.
- the multi-piece wiring board is provided with a first bottom portion 119 in a region where the first divided groove 107 and the third divided groove 109 intersect, and the second divided groove 108 and the fourth divided groove are seen in a plan view.
- a first hypothesis centered on the first intersecting portion 121 where 110 intersects, and the length of the first intersecting portion 121 and one end of the second curved portion 112 having the smallest depth of the fourth dividing groove 110 as a radius.
- a first bottom portion 119 is located in the circle 123, and a second bottom portion 120 is provided in a region where the second dividing groove 108 and the fourth dividing groove 110 intersect with each other.
- the second bottom 120 is located in the second virtual circle 124.
- one side 105 extends from the first divided groove 107 provided on the first main surface 103 side to the second divided groove 108 provided on the second main surface 104 side so as to face the first divided groove 107.
- the fracture is provided on one side 105 from the bottom of the first divided groove 107 toward the bottom of the second divided groove 108.
- the first bottom 119 is deeper than the bottom of the first dividing groove 107 and goes to the second bottom 120 where the depth is deeper than the bottom of the second dividing groove 108.
- a fracture portion is provided at this time.
- the surfaces of the first bottom portion 119 and the second bottom portion 120 have curved surfaces along the first curved surface 111 and the second curved surface 112, even if the dividing grooves are displaced from each other on the upper and lower surfaces. This curved surface has the effect of relaxing the positional deviation of the dividing grooves.
- FIG. 3 is a top perspective view showing the main part of the multi-cavity wiring board according to the embodiment of the present invention.
- FIG. 4 shows the second main surface with respect to the first bottom 119 provided on the first main surface 103.
- 6 is a top perspective view showing the positional relationship between the second divided groove 108 and the fourth divided groove 110 provided in 104.
- the 2nd division groove 108 and the 4th division groove 110 in the example shown in FIG. 3, FIG. 4 have each shown the bottom part.
- D1 indicates the distance between the center of the first intersecting portion 121 and the point at which the second curved portion 112 begins to bend.
- FIG. 3 shows a state in which the second dividing groove 108 provided on the second main surface 104 side in a plan view is displaced downward and the fourth dividing groove 110 is displaced to the right side with respect to the first bottom portion 119. Shown in In this example, since the second curved portion 112 is provided in the vicinity of the first bottom portion 119 along the fourth dividing groove 110 in plan view, the first dividing groove 107 provided on the first main surface 103 side.
- the fracture portion When the fracture portion is provided in the second dividing groove 108 provided on the second main surface 104 side, the fracture portion is provided from the first bottom portion 119 to the curved surface along the second curved surface 112 in the vicinity of the second bottom portion 120. For this reason, it is difficult to provide a break portion at a portion away from the second bottom 120 at each corner of the wiring board 102. Therefore, burrs and chips at each corner of the wiring board are effectively suppressed.
- FIG. 5 is a bottom perspective view showing the main part of the multi-piece wiring board according to the embodiment of the present invention.
- FIG. 6 shows the first main part with respect to the second bottom part 120 provided on the second main surface 104.
- FIG. FIG. 5 is a bottom perspective view showing the positional relationship between a first divided groove 107 and a third divided groove 109 provided on a surface 103.
- the 1st division groove 107 and the 3rd division groove 109 in the example shown in FIG. 5, FIG. 6 have each shown the bottom part.
- D2 indicates the distance between the center of the second intersecting portion 122 and the point at which the first music portion 111 starts to bend.
- FIG. 5 shows a state in which the first dividing groove 107 provided on the first main surface 103 side in a plan view is displaced to the upper side and the third dividing groove 109 is displaced to the left side with respect to the second bottom 120. .
- the first curved portion 111 is provided in the vicinity of the second bottom portion 120 along the second divided groove 108 in a plan view, the second divided groove 108 provided on the second main surface 104 side.
- the fracture portion When the fracture portion is provided in the first dividing groove 107 provided on the first main surface 103 side, the fracture portion is provided from the second bottom portion 120 to the curved surface along the first curved surface 115 in the vicinity of the first bottom portion 119. Therefore, it is difficult to provide a rupture portion at a portion away from the first bottom portion 119 at each corner of the wiring board. Therefore, burrs and chips at each corner of the wiring board are effectively suppressed.
- the wiring board 102 has a first main surface 103 and a second main surface 104 opposite to the first main surface 103, and has a rectangular substrate in plan view.
- a first side surface 113 provided on the first main surface 103 side of the pair of opposite sides 105 and a second side surface 114 provided on the first main surface 103 side of the pair of opposite sides 106;
- the third side surface 116 provided on the second main surface 104 side of the one set of opposite sides 105 and the fourth side surface provided on the second main surface 104 side of the set of the other side 106 opposite to each other.
- Second side 114 Has a first track portion 111 length is gradually larger provided, the length of the fourth side surface 117 has a second curving portion 112 which is gradually larger provided.
- the wiring substrate 102 Because of such a structure, it is possible to realize the wiring substrate 102 with high dimensional accuracy in which burrs and chips at the corners of the wiring substrate are suppressed without having a notch around the wiring substrate 102. That is, a structure in which the first curved portion 111 and the second curved portion 112 are formed at each corner and the four corners of the wiring substrate 102 are chamfered without providing a notch at each corner of the wiring substrate 102. It has become. Therefore, it is possible to realize the wiring board 102 with high dimensional accuracy in which chipping of the wiring board 102 during transportation is suppressed.
- FIG. 2 shows an enlarged view of the main part of such a wiring board 102.
- the figure is a perspective view of a corner portion of the wiring board 102 as viewed obliquely from above.
- a first divided groove 107 provided on the first main surface 103 and a second divided groove provided on the second main surface 104 so as to face the first divided groove 107.
- the first side surface 113 and the third side surface 116 are provided by 108, and further, a first fracture portion 131 that connects the first side surface 113 and the third side surface 116 is provided.
- a third divided groove 109 provided on the first main surface 103 and a fourth provided on the second main surface 104 so as to face the third divided groove 109 are provided.
- a second side surface 114 and a fourth side surface 117 are provided by the dividing groove 110, and a second fracture portion 132 that connects the second side surface 114 and the fourth side surface 117 is further provided.
- the first breakage portion 131 and the second breakage portion 132 are regions located on the outermost periphery when the wiring board 102 is viewed in plan view, and are formed as vertical surfaces, so that electronic components are stored in the wiring board 102. It can be effectively used as a reference plane for positioning.
- the second breakage portion 132 is formed wider than the first breakage portion 131 in the thickness direction of the wiring board, and is a more effective structure as a reference plane for positioning the wiring board 102.
- each corner portion of the wiring board 102 has a first curved portion 111 in which the length of the second side surface 114 is gradually increased toward the corner portion, and the length of the fourth side surface 117 is longer. It has the 2nd music part 112 provided gradually gradually.
- a first curved surface 115 is provided on the first main surface 103 side at each corner of the wiring substrate 102, and a second curved surface 118 is provided on the second main surface 104 side.
- the four corners of the wiring board 102 are chamfered except between the first bottom portion 119 on the first main surface 103 side and the second bottom portion 120 on the second main surface 104 side. It has a structure.
- the first curved portion 111 and the second curved portion 112 are bent toward the second fracture surface 132 toward the corner portion, and the first bottom portion 119 and the second bottom portion 120 are bent. In the vicinity, the shape is bent so as to be convex toward the second fracture surface 132 side.
- first bottom 119 and the second bottom 120 have curved portions on their main surfaces, strictly speaking, a small curved portion (from the bottom of the first dividing groove 107 toward the first bottom 119 at the corner ( (Not shown), and a small curved portion (not shown) is provided from the bottom of the second dividing groove 108 toward the second bottom 120 of the corner.
- the first curved surface 115 and the first curved face 115 are formed at each corner of the wiring board 102. Since the two curved surfaces 118 are located on the inner side of the first fracture portion 131 and the second fracture portion 132 when the wiring substrate 102 is viewed in plan view, the wiring substrate 102 can be positioned more favorably. Become. Therefore, it is possible to provide the wiring board 102 having high dimensional accuracy in which chipping of the wiring board 102 is suppressed and excellent in positioning accuracy.
- the method for manufacturing a multi-piece wiring board according to an embodiment of the present invention includes a single-layer or multiple-layer ceramic insulating layer (not shown), and a first main surface 103 and a first main surface 103 facing the first main surface 103.
- the mother substrate 101 having the two main surfaces 104 is manufactured, and a plurality of wiring substrate regions arranged on the mother substrate 101 are formed, and laser processing is performed on the mother substrate 101 to one side 105 of the wiring substrate region.
- the first division groove 107 is formed on the first main surface 103 side along the first main surface 103, and the depth is smaller than the first division groove 107 on the first main surface 103 side along the other side 106 of the wiring board region.
- the step of forming the first curved portion 111 by forming the third dividing groove 109 having a gradually increasing depth toward the corner portion of the substrate region and the laser processing are performed on the mother substrate 101 on one side 105 of the wiring substrate region.
- a second dividing groove 108 is formed on the second main surface 104 side along the second main surface 104 side, and on the second main surface 104 side along the other side 106 of the wiring board region. 2 smaller depth than the dividing groove 108, and a step of forming a second curving portion 112 to form a fourth dividing grooves 110 gradually larger depth toward the corner portion of the wiring substrate region.
- both the vertical and horizontal dividing grooves intersect when forming the dividing grooves by laser processing on the multi-piece wiring board without providing the through holes on the outer periphery of the wiring board 102.
- a manufacturing method of a multi-piece wiring board capable of manufacturing 102 can be adopted.
- first bent portion 111 and the second bent portion 112 can be formed at the corners of the wiring board 102.
- the ease of storing is reduced, and chipping during transport is reduced.
- each corner of the manufactured wiring board 102 has a first curved surface 115 on the first main surface 103 side and a first curved surface as shown in FIG. 2 after each dividing groove is formed (the mother board 101 before dividing).
- a second curved surface 118 is formed on the second principal surface 104 side.
- FIG. 7 is an enlarged view of a main part showing a method for manufacturing a multi-piece wiring board according to an embodiment of the present invention.
- This figure shows a state in which the first divided grooves 107 are formed by the laser 126 along one side 105 on the first main surface 103 side of the mother substrate 101.
- a first dividing groove 107 is provided along one side 105 on the first main surface 103 side, and as shown in FIG.
- the first dividing groove 107 and the third dividing groove 107 are arranged at the corners of each wiring board region. What is necessary is just to provide the 3rd division groove 109 smaller in depth than the 1st division groove 107 so that the division grooves 109 may cross
- the first curved portion 111 is formed by irradiating the corner of each wiring board region with the laser 126 at a position that becomes the corner of each wiring board region.
- the portion is chamfered by the laser 126 to form the first curved surface 115.
- the first divided groove 107 and the third divided groove 109 are deeper than the first divided groove 107, thereby forming the first divided groove 107 and the mother substrate 101 made of a ceramic material at the corners of each wiring board region.
- a boundary with the atmosphere is formed at both ends of the first dividing groove 107, so that when the laser 126 for forming the third dividing groove 109 passes in the vicinity of the boundary, the laser 126 irradiates the boundary.
- the first curved portion 111 and the first curved surface 115 are formed.
- the first curved surface 115 is formed by chamfering with the laser 126 at the corners of each wiring board region.
- the first main surface 103 is not shown.
- a second divided groove 108 is provided along one side 105 on the second main surface 104 side by a laser 126, and the second divided groove 108 is positioned at a corner portion of each wiring board region.
- What is necessary is just to provide the 4th division groove 110 smaller in depth than the 2nd division groove 108 so that the 4th division groove 110 may cross
- the second curved portion 112 and the second curved surface 118 can be formed at the four corners on the second main surface 104 side of each wiring board region.
- the laser 126 is irradiated in a substantially vertical direction from the upper side to the lower side with respect to the mother board 101, and the focal point is the lowest point of the dividing groove. Irradiated to fit in the vicinity. That is, the sectional shape of each divided groove is V-shaped or U-shaped. Therefore, as shown in FIG. 2, the first curved surface 115 is wider as it is closer to the first main surface 103 of the wiring board region, and the second curved surface 118 is wider as it is closer to the second main surface 104 of the wiring board region. Formed.
- the second main surface is also provided on the first main surface 103 side (upper surface) of the wiring board 102 when the mother board 101 is stored in a tray or the like for transportation.
- the corners near the main surface of the wiring board 102 are chamfered by the laser 126, and the curvature of each corner of the wiring board 102 is difficult to be sharpened.
- the tray is made of a soft material, each corner of the wiring board 102 is less likely to be hooked on the inner surface of the tray, etc., and the storage capacity when storing the wiring board 102 in a tray or the like is more effective. Improved.
- the first bottom portion 119 formed in the region where the first divided groove 107 and the third divided groove 109 intersect each other in the plan view is second. Centering around the first intersecting portion 121 where the dividing groove 108 and the fourth dividing groove 110 intersect, the length of the first intersecting portion 121 and one end of the second curved portion 112 where the depth of the fourth dividing groove 110 is the smallest.
- the second bottom 120 formed in a region where the second divided groove 108 and the fourth divided groove 110 intersect with each other is located in the first virtual circle 123 having a radius as a radius.
- the second intersection 122 is centered on the second intersection 122 where the third dividing groove 109 intersects, and the length of the second intersection 122 and the first curved portion 111 where the depth of the third dividing groove 109 is the smallest is the second.
- the wiring board 102 when the wiring board 102 is manufactured by dividing the mother board 101 into individual pieces, it occurs at each corner of the wiring board 102 due to the positional deviation of the dividing grooves on the upper and lower surfaces. It is possible to provide a multi-piece wiring board in which easy burrs and chips are effectively suppressed. Specifically, from the first divided groove 107 provided on the first main surface 103 side to the second divided groove 108 provided on the second main surface 104 side so as to face the first divided groove 107, one side When the mother board 101 is divided by bending the mother board 101 along the side 105, a broken portion is formed on the one side 105 from the bottom of the first dividing groove 107 toward the bottom of the second dividing groove 108. Provided.
- the first bottom 119 is deeper than the bottom of the first dividing groove 107 and goes to the second bottom 120 where the depth is deeper than the bottom of the second dividing groove 108.
- a fracture portion is provided.
- the surfaces of the first bottom portion 119 and the second bottom portion 120 have curved surfaces along the first curved portion 111 and the second curved portion 112, the dividing grooves are displaced on the upper and lower surfaces.
- this curved surface has a function to alleviate misalignment of the dividing grooves, and many burrs and chips that are likely to occur at each corner of the wiring board 102 due to misalignment of the dividing grooves on the upper and lower surfaces are effectively suppressed.
- a method for manufacturing a single-piece wiring board can be provided.
- the second divided groove 108 provided on the second main surface 104 side so as to face the first divided groove 107 from the first divided groove 107 provided on the first main surface 103 side.
- the method of dividing the mother substrate 101 by bending the mother substrate 101 along one side 105 is shown, but conversely, from the second divided groove 108 provided on the second main surface 104 side.
- the mother substrate 101 may be divided by bending the mother substrate 101 along one side 105 in the first dividing groove 107 provided on the first main surface 103 side.
- one side 105 extends from the third divided groove 109 provided on the first main surface 103 side to the fourth divided groove 110 provided on the second main surface 104 side so as to face the third divided groove 109.
- the mother substrate 101 may be divided by bending the substrate substrate 101, and conversely, the fourth divided groove 110 provided on the second main surface 104 side may be divided into the first main surface 103 side.
- the mother substrate 101 may be divided by bending the mother substrate 101 along the one side 105 into the provided third dividing groove 109.
- the dividing method may be appropriately changed according to the shapes of the mother board 101 and the wiring board 102 and the depth of each dividing groove.
- connection wiring conductor 125 when the connection wiring conductor 125 is formed in the inner layer of the other side 106 of the wiring board region as shown in FIG. 1, the wiring board 102 is downsized and its thickness becomes very thin.
- the third dividing groove 109 provided on the first main surface 103 of the other side 106 and the fourth dividing groove 110 provided on the second main surface 104 are formed relatively shallow so that the connection by forming the dividing groove is achieved.
- the disconnection of the wiring conductor 125 can be suppressed. Therefore, a multi-cavity wiring board in which disconnection of the connection wiring conductor 125 that becomes a conduction path between adjacent wiring board regions is suppressed, and that the mother board 101 is prevented from being erroneously divided due to stress during handling, etc.
- the mother board 101 is strip-shaped along one side 105 where the first dividing groove 107 and the second dividing groove 108 are formed, that is, the wiring board region is one row.
- the strip-shaped assembly is further divided into individual wiring boards 102 along the other side 106 where the third divided grooves 109 and the fourth divided grooves 110 are formed. do it.
- the mother substrate 101 is divided along the one side 105, although the depth of the dividing groove is relatively deep, the fracture area of the entire mother substrate 101 becomes large.
- the depth of the dividing groove is relatively shallow, but the width of the aggregate to be divided can be reduced, so that the fracture area can be reduced. Therefore, while making the mother substrate 101 easy to divide, it is possible to suppress erroneous division due to, for example, stress during handling, and to suppress disconnection of the connection wiring conductor 125.
- a UV laser, a green laser, IR laser etc. as a kind of laser used for the manufacturing method of the multi-cavity wiring board of embodiment of this invention, for example.
- the output per unit area of the laser during laser processing (the unit area of the surface of the workpiece at the site irradiated with the laser) is relatively small, and the amount of melt generated is small accordingly. In this case, it is easier to remove the melted material by laser processing in the ceramic green sheet laminate, which is the mother substrate 101 containing an organic material such as a binder before firing, compared to the sintered mother substrate 101.
- the first curved portion 111, the second curved portion 112, the first curved surface 115, and the second curved surface 118 having a good shape even with a laser having relatively small energy as described above.
- these curved portions and curved surfaces have a function of reducing the displacement of the dividing grooves, and burrs and chips due to the displacement of the dividing grooves on the upper and lower surfaces are prevented. It is possible to provide a method for manufacturing a multi-piece wiring board capable of manufacturing the wiring board 102 effectively suppressed.
- a dummy area may be provided so as to surround a plurality of wiring board areas arranged vertically and horizontally, and a dividing groove similar to the above-described wiring board area may be provided.
- the dividing region and the dividing groove at the boundary between the dummy region and the wiring substrate region are formed together with the above-described dividing groove step of the wiring substrate region.
- the multi-cavity wiring board, the wiring board, and the manufacturing method of the wiring board according to the embodiment of the present invention are not limited to the examples of the above-described embodiment, and various methods are possible without departing from the gist of the present invention. You can make any changes.
- the wiring board 102 is rectangular, but the wiring board 102 may be a mother board 101 in which wiring board regions that become the square wiring board 102 are arranged.
- the wiring board 102 has a shape in which a concave mounting portion in which an electronic component is stored is formed, but a mother board in which flat wiring board regions having a mounting portion in which a concave mounting portion is not formed is arranged.
- the substrate 101 may be used.
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Abstract
Description
Claims (6)
- 第1主面および該第1主面に相対する第2主面を有し、複数の配線基板領域が配列された母基板を備えており、
該母基板は、前記配線基板領域の境界に沿って前記第1主面および前記第2主面に設けられた分割溝を含んでおり、
該分割溝は、前記配線基板領域の一方の辺の前記第1主面に設けられた第1分割溝と、該第1分割溝に相対するように前記第2主面に設けられた第2分割溝と、前記配線基板領域の他方の辺の前記第1主面に設けられた第3分割溝と、該第3分割溝に相対するように前記第2主面に設けられた第4分割溝とを有しており、
前記第1分割溝の深さおよび前記第2分割溝の深さが、前記第3分割溝の深さおよび前記第4分割溝の深さよりも大きく設けられ、
前記配線基板領域の角部に向かって、前記第3分割溝の深さが漸次大きく設けられる第1曲部を有し、前記第4分割溝の深さが漸次大きく設けられる第2曲部を有することを特徴とする多数個取り配線基板。 - 前記第1主面側において、前記配線基板領域の前記一方の辺に露出した第1側面と、前記他方の辺に露出した第2側面との間に第1曲面が設けられており、
前記第2主面側において、前記配線基板領域の前記一方の辺に露出した第3側面と、前記他方の辺に露出した第4側面との間に第2曲面が設けられており、
前記第1曲面および前記第2曲面は、前記配線基板領域の厚み方向の中央部に向かって幅が漸次狭くなっていることを特徴とする請求項1に記載の多数個取り配線基板。 - 前記第1分割溝と前記第3分割溝とが交差する領域に第1底部が設けられており、
平面透視において、前記第2分割溝と前記第4分割溝が交差する第1交差部を中心とし、該第1交差部と、前記第4分割溝の深さが最も小さい前記第2曲部の一端部との長さを半径とした第1仮想円内に前記第1底部が位置しており、
前記第2分割溝と前記第4分割溝が交差する領域に第2底部が設けられており、
平面透視において、前記第1分割溝と前記第3分割溝が交差する第2交差部を中心とし、該第2交差部と、前記第3分割溝の深さが最も小さい前記第1曲部の一端部との長さを半径とした第2仮想円内に前記第2底部が位置していることを特徴とする請求項1または請求項2に記載の多数個取り配線基板。 - 第1主面および該第1主面に相対する第2主面を有し、平面視で矩形状の基板を有しており、
該基板は、一組の相対する一方の辺の前記第1主面側に設けられた第1側面と、一組の相対する他方の辺の前記第1主面側に設けられた第2側面と、一組の相対する一方の辺の前記第2主面側に設けられた第3側面と、一組の相対する他方の辺の前記第2主面側に設けられた第4側面と、前記第1側面と前記第3側面とを接続する第1破断部と、前記第2側面と前記第4側面とを接続する第2破断部とを有しており、
前記基板の厚み方向における長さにおいて、前記第1側面の長さおよび前記第3側面の長さが、前記第2側面の長さおよび前記第4側面の長さよりも大きく設けられ、
前記基板の角部に向かって、前記第2側面の長さが漸次大きく設けられる第1曲部を有し、前記第4側面の長さが漸次大きく設けられる第2曲部を有していることを特徴とする配線基板。 - 単層または複数層のセラミック絶縁層を含んでおり、第1主面と該第1主面に相対する第2主面とを有する母基板を作製するとともに、該母基板に配列された複数の配線基板領域を形成する工程と、
レーザー加工により、前記母基板に、前記配線基板領域の一方の辺に沿って前記第1主面側に第1分割溝を形成し、前記配線基板領域の他方の辺に沿って前記第1主面側に前記第1分割溝よりも深さが小さく、前記配線基板領域の角部に向かって漸次深さが大きい前記第3分割溝を形成して前記第1曲部を形成する工程と、
レーザー加工により、前記母基板に、前記配線基板領域の一方の辺に沿って前記第2主面側に前記第2分割溝を形成し、前記配線基板領域の他方の辺に沿って前記第2主面側に該第2分割溝よりも深さが小さく、前記配線基板領域の角部に向かって漸次深さが大きい前記第4分割溝を形成して前記第2曲部を形成する工程とを備えることを特徴とする多数個取り配線基板の製造方法。 - 前記第1分割溝と前記第3分割溝とが交差する領域に形成される第1底部が、平面透視において、前記第2分割溝と前記第4分割溝が交差する第1交差部を中心とし、該第1交差部と、前記第4分割溝の深さが最も小さい前記第2曲部の一端部との長さを半径とした第1仮想円内に位置し、
前記第2分割溝と前記第4分割溝が交差する領域に形成される第2底部が、平面透視において、前記第1分割溝と前記第3分割溝が交差する第2交差部を中心とし、該第2交差部と、前記第3分割溝の深さが最も小さい前記第1曲部との長さを半径とした第2仮想円内に位置するように前記第1底部および前記第2底部を形成する工程を有することを特徴とする請求項5に記載の多数個取り配線基板の製造方法。
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EP17786025.1A EP3448133B1 (en) | 2016-04-22 | 2017-04-20 | Multipiece wiring board, wiring board, and method for manufacturing multipiece wiring board |
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US15/570,997 US10499510B2 (en) | 2016-04-22 | 2017-04-20 | Multi-piece wiring substrate, wiring substrate, and method for manufacturing multi-piece wiring substrate |
CN201780017194.8A CN108781502B (zh) | 2016-04-22 | 2017-04-20 | 多连片布线基板、布线基板 |
US16/700,791 US10945338B2 (en) | 2016-04-22 | 2019-12-02 | Wiring substrate |
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US16/700,791 Division US10945338B2 (en) | 2016-04-22 | 2019-12-02 | Wiring substrate |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2020195491A1 (ja) * | 2019-03-27 | 2020-10-01 | パナソニックIpマネジメント株式会社 | 電解コンデンサおよびその製造方法 |
WO2021106655A1 (ja) * | 2019-11-26 | 2021-06-03 | 京セラ株式会社 | 電子部品収納用パッケージ、電子装置および電子モジュール |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163478A (ja) * | 1997-11-28 | 1999-06-18 | Kyocera Corp | 分割溝を有するセラミック基板 |
JP2007318034A (ja) | 2006-05-29 | 2007-12-06 | Kyocera Corp | 複数個取り配線基板、電子部品収納用パッケージおよび電子装置 |
JP2010272713A (ja) * | 2009-05-22 | 2010-12-02 | Panasonic Corp | 薄膜チップ抵抗器の製造方法 |
JP2012081647A (ja) | 2010-10-12 | 2012-04-26 | Ngk Spark Plug Co Ltd | グリーンシートの溝加工装置および多数個取り配線基板の製造方法 |
JP2012160622A (ja) * | 2011-02-01 | 2012-08-23 | Ngk Spark Plug Co Ltd | 電子部品の製造方法 |
JP2013125855A (ja) * | 2011-12-14 | 2013-06-24 | Seiko Epson Corp | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5108496B2 (ja) * | 2007-12-26 | 2012-12-26 | 三洋電機株式会社 | 回路基板およびその製造方法、回路装置およびその製造方法 |
JP5297139B2 (ja) * | 2008-10-09 | 2013-09-25 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
JP5355246B2 (ja) * | 2009-06-25 | 2013-11-27 | 京セラ株式会社 | 多数個取り配線基板および配線基板ならびに電子装置 |
WO2011049234A1 (ja) * | 2009-10-21 | 2011-04-28 | 三洋電機株式会社 | 基板およびそれを用いた回路装置の製造方法 |
JP2012009767A (ja) * | 2009-11-27 | 2012-01-12 | Kyocera Corp | 多数個取り配線基板およびその製造方法、ならびに配線基板およびその製造方法 |
CN102484943B (zh) * | 2009-12-24 | 2016-03-16 | 京瓷株式会社 | 批量生产布线基板、布线基板以及电子装置 |
US9049793B2 (en) * | 2010-10-08 | 2015-06-02 | Ngk Spark Plug Co., Ltd. | Multi-piece-array and method of manufacturing the same |
JP2012227306A (ja) * | 2011-04-19 | 2012-11-15 | Ngk Insulators Ltd | セラミック基板の製造方法 |
JP6006474B2 (ja) * | 2011-04-25 | 2016-10-12 | 日本特殊陶業株式会社 | 配線基板、多数個取り配線基板、およびその製造方法 |
US9215802B2 (en) * | 2011-12-27 | 2015-12-15 | Ngk Spark Plug Co., Ltd. | Wiring substrate and multi-piece wiring substrate |
CN103152990B (zh) * | 2013-03-25 | 2016-03-23 | 乐健科技(珠海)有限公司 | 用于led安装的陶瓷基印刷电路板的制备方法 |
-
2017
- 2017-04-20 WO PCT/JP2017/015867 patent/WO2017183688A1/ja active Application Filing
- 2017-04-20 CN CN201780017194.8A patent/CN108781502B/zh active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11163478A (ja) * | 1997-11-28 | 1999-06-18 | Kyocera Corp | 分割溝を有するセラミック基板 |
JP2007318034A (ja) | 2006-05-29 | 2007-12-06 | Kyocera Corp | 複数個取り配線基板、電子部品収納用パッケージおよび電子装置 |
JP2010272713A (ja) * | 2009-05-22 | 2010-12-02 | Panasonic Corp | 薄膜チップ抵抗器の製造方法 |
JP2012081647A (ja) | 2010-10-12 | 2012-04-26 | Ngk Spark Plug Co Ltd | グリーンシートの溝加工装置および多数個取り配線基板の製造方法 |
JP2012160622A (ja) * | 2011-02-01 | 2012-08-23 | Ngk Spark Plug Co Ltd | 電子部品の製造方法 |
JP2013125855A (ja) * | 2011-12-14 | 2013-06-24 | Seiko Epson Corp | セラミック基板、電子デバイス及び電子機器と、電子デバイスの製造方法及びセラミック基板の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020195491A1 (ja) * | 2019-03-27 | 2020-10-01 | パナソニックIpマネジメント株式会社 | 電解コンデンサおよびその製造方法 |
US11823845B2 (en) | 2019-03-27 | 2023-11-21 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor and method for manufacturing same |
WO2021106655A1 (ja) * | 2019-11-26 | 2021-06-03 | 京セラ株式会社 | 電子部品収納用パッケージ、電子装置および電子モジュール |
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