WO2017174022A2 - 分体式阵列摄像模组及其组装和应用方法 - Google Patents

分体式阵列摄像模组及其组装和应用方法 Download PDF

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Publication number
WO2017174022A2
WO2017174022A2 PCT/CN2017/079690 CN2017079690W WO2017174022A2 WO 2017174022 A2 WO2017174022 A2 WO 2017174022A2 CN 2017079690 W CN2017079690 W CN 2017079690W WO 2017174022 A2 WO2017174022 A2 WO 2017174022A2
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WO
WIPO (PCT)
Prior art keywords
module
calibration
split
camera module
array camera
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PCT/CN2017/079690
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English (en)
French (fr)
Inventor
陈洪
丁亮
赵波杰
方银丽
钟凌
张胜
戚杨迪
蒋恒
Original Assignee
宁波舜宇光电信息有限公司
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Priority claimed from CN201610214905.8A external-priority patent/CN107302670B/zh
Priority claimed from CN201610585367.3A external-priority patent/CN107645624A/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2017174022A2 publication Critical patent/WO2017174022A2/zh

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  • the invention relates to a camera module, in particular to a split array camera module, which is suitable for a mobile terminal, so as to improve production efficiency and yield, and particularly improve resource utilization.
  • smart portable devices can be said to be an indispensable tool for people in modern times.
  • a mobile phone or a tablet computer is a very common situation.
  • the quality of the camera functions in the smart portable device has been continuously improved, so people gradually use the camera in the smart portable device to replace the traditional camera to record the habit of life.
  • mobile phone cameras have replaced most of the camera market, but professional cameras with large lenses can collect more light information than small-lens mobile phone cameras, so professional The quality of the camera is in principle superior to that of a small-lens mobile phone camera.
  • an array camera module can be constructed using a plurality of small lenses to replace the lens of a single cumbersome and expensive professional camera for a smart portable device.
  • optical zoom has always been the exclusive function of SLR cameras.
  • the mobile phone camera industry has been hoping to transplant the optical zoom function into mobile phones, narrowing the gap between SLR cameras and truly replacing its photo position.
  • In the process of development of mobile phone camera technology there have also been cameras with optical zoom function. Most of these cameras use the distance between the lenses to realize the zoom function.
  • the fatal flaw of such cameras is the poor resistance to mechanical stress, which can not be used by the terminal mobile phone manufacturer or Accepted by consumer electronics manufacturers.
  • the zoom function is achieved by the freely switching between different focal length cameras to avoid this biggest problem.
  • the camera lens and lens structure of this type of design is completely different from the ordinary mobile phone camera, so that the function of optical zoom is realized on the mobile phone.
  • the array camera module currently on the market has a problem of low yield during manufacturing, which undoubtedly increases the manufacturing cost of the product, because usually one camera (or lens) in the array camera module is defective. This will result in the scrapping of the entire array camera module, and the technical tolerance and material level of the process completely determine the optical axis angle of multiple cameras. Because the concept of the array camera module is to use multiple lenses to collect image information, and to process a large amount of information, one of the lenses has optical differences, mechanical positioning errors or Problems such as electronic noise will cause the entire array of camera modules to produce complete and clear images, thus causing waste of process time and cost.
  • An object of the present invention is to provide a split-type array camera module and an assembly application method thereof, wherein the single-camera module in the split-type array camera module separately completes the manufacturing, assembly, and testing processes, and does not occupy assembly and testing time. That is to say, the manufacturing, assembly and testing of the single camera module need not be distinguished from the conventional module production form, and no special special process stations are needed to improve production efficiency and make high use of production resources.
  • Another object of the present invention is to provide a split-type array camera module and an assembly application method thereof, wherein the assembly of the split-type array camera module is further improved after the performance verification of the single camera module is completed. The yield of the finished product of the split array camera module.
  • Another object of the present invention is to provide a split-type array camera module and an assembly and application method thereof, wherein the method of automatically adjusting the optical axis can solve the problem that the optical axis is not parallel due to the tilt of the optical axis of the process, and is reduced to some extent.
  • Another object of the present invention is to provide a split array camera module and an assembly application method thereof, wherein the single camera module uses a conventional lens, and the optical zoom design principle of the single zoom lens is undoubtedly simpler than the optical zoom design principle of the single lens lens. Many, no complicated light path design is required.
  • Another object of the present invention is to provide a split-type array camera module and a method for assembling the same, wherein a single camera module with different FOVs is used, so that compared with the manufacturing process of the single-lens lens, a single camera module of different FOVs is used. It is relatively simple to group arrays, so the challenge to the manufacturing capabilities of mobile phone camera manufacturers is minimal. Further, the combination of the individual camera modules of different FOVs is the key to realize optical zoom, and the smooth switching between the individual camera modules of different focal lengths realizes the experience of zooming.
  • Another object of the present invention is to provide a split array camera module and an assembly application method thereof, wherein a plurality of single camera modules are combined by assembling brackets to improve yield and reliability.
  • the assembly bracket is made of high hardness and high strength material to ensure that the positional relationship between the individual camera modules is not affected by external forces.
  • the general dual-camera module is susceptible to changes in parallax caused by external forces during transportation and installation, and most of the optical zoom algorithms developed for dual-camera have strict requirements on the parallax of the dual-camera module. Therefore, the assembly bracket The parallax capability of the split array camera module can be effectively guaranteed.
  • Another object of the present invention is to provide a split array camera module and an assembly application method thereof, wherein the gyroscope can be placed according to the spatial structure of the actual terminal product.
  • the placement position of the gyroscope can be flexibly adjusted.
  • the present invention provides a split array camera module, including:
  • sub-modules a plurality of sub-modules, wherein at least one sub-module is a reference module, and the remaining sub-modules are calibration modules;
  • the reference module is a focus adjustable camera module or a fixed focus camera module.
  • the calibration module is a focus adjustable camera module or a fixed focus camera module.
  • the assembly bracket has at least one reference unit and at least one calibration unit, wherein the reference module and the calibration module are respectively assembled to the reference unit and the assembly of the assembly bracket The calibration unit.
  • the module center distance between the calibration module and the reference module is 1-100 mm.
  • the assembly gap between the reference module and the reference unit is 0.01-1 mm
  • the assembly gap between the calibration module and the calibration unit is 0.03-3 mm.
  • the reference module further includes at least one reference lens, at least one reference driver and at least one reference sensor chip, wherein the reference lens is located in a photosensitive path of the reference sensor chip, the reference A lens is mounted to the reference driver.
  • the calibration module further includes at least one calibration lens and an at least calibration photosensitive chip, wherein the calibration lens is located in a photosensitive path of the calibration photosensitive chip.
  • the reference module further includes at least one reference base and at least one reference substrate, wherein the reference photosensitive chip is electrically connected to the reference substrate, and the reference base is disposed on the reference On the substrate, the reference driver is mounted to the reference base.
  • the calibration module further includes at least one calibration base and at least one calibration substrate, wherein the calibration photosensitive chip is electrically connected to the calibration substrate.
  • the calibration base is disposed on the calibration substrate.
  • the split array camera module includes at least one common base, the reference module further includes at least one reference substrate, and the calibration module further includes at least one calibration substrate, wherein the The reference photosensitive chip is electrically connected to the reference substrate, and the calibration photosensitive chip is electrically connected to the calibration substrate, and the common base is disposed on the reference substrate and/or the calibration substrate.
  • At least one common base and at least one common substrate are included, wherein the reference photosensitive chip and the calibration photosensitive chip are electrically connected to the common substrate, and the common base is disposed on the common On the substrate, the reference driver and the calibration lens are both mounted to the common base.
  • a gyroscope is disposed in the reference substrate of the reference module.
  • a gyroscope is included, which is disposed on the calibration substrate of the calibration module.
  • a gyroscope is included, which is electrically connected to the reference module and disposed on the common substrate.
  • a gyroscope is disposed on the common substrate electrically connected to the calibration module.
  • the reference driver is selected from the group consisting of a motor, a thermal drive or a microactuator.
  • the calibration module may further include a calibration driver, wherein the calibration lens is supported above the calibration driver.
  • the FOV is generally between 60° and 220°
  • the calibration module is implemented as a small angle of view lens
  • the FOV is generally Between 10 ° and 90 °.
  • the present invention provides a split array camera module including:
  • At least one first camera module, at least one prism module, at least one second camera module, and at least one circuit board The first camera module and the prism module are disposed in a plane, the prism module is disposed concentrically with the optical axis of the second camera module, and the circuit board is connected to the second camera module. .
  • the prism module comprises a prism unit and a prism base, and the prism unit is rotatably supported in the prism base.
  • the second camera module includes at least one second lens, at least one second sensor chip, and at least one second substrate, wherein the second lens is located at the second photosensitive device a photosensitive path of the chip, the second photosensitive chip being electrically connected to the second substrate.
  • the second camera module includes at least one second driver, wherein the second lens is mounted to the second driver.
  • the second camera module includes an imaging housing, an anti-shake unit and a support housing, wherein the imaging housing, the second driver, the anti-shake unit, and the The support shells are arranged coaxially to each other.
  • the first camera module includes at least one first lens, at least one first photosensitive chip, and at least one first substrate, wherein the lens is located in a photosensitive path of the photosensitive chip, The photosensitive chip is electrically connected to the substrate.
  • the first camera module includes at least one first driver, wherein the first lens is mounted to the first driver.
  • the prism unit mainly comprises a prism housing, a prism, a prism holder, a support sleeve and a support shaft, and the prism is fixedly disposed in the prism holder, the support A sleeve is fixedly mounted on a lower portion of the prism holder, and the support shaft is rotatably mounted in the support sleeve, and the prism holder is disposed in the prism housing.
  • glue is applied between the prism holder and the prism to bond to each other.
  • the prism housing has a rectangular frame and has a bottom frame and two side frames. One end of each of the two side frames is fixedly connected to the bottom frame, and the other end is outward. An extended free end is provided with a connecting beam between the two free ends.
  • the prism base has a first camera module receiving cavity and a prism module receiving cavity, wherein the first camera module is received in the first camera module receiving cavity.
  • the prism unit is housed in a prism module receiving cavity.
  • the prism base comprises an intermediate reinforcing plate extending through the prism base along a length perpendicular to the prism base and over the entire width thereof.
  • a sidewall of the first camera module housing cavity has a first opening for applying a power/signal line of the first camera module, wherein the prism mode
  • the side wall of the group accommodating chamber has a second opening for applying an opening for controlling the power/control signal line of the prism.
  • one side of the prism module receiving cavity is provided with a connecting wall, and at least one positioning post or positioning hole is disposed on the surface for precise positioning with the second camera module. Connection.
  • the image pickup casing has a casing portion surrounding a hollow rectangular column, a front panel fixedly coupled to one end of the casing portion, and two recesses formed on a side surface of the casing portion Two connections.
  • the camera housing includes an optical axis opening and at least one positioning hole or positioning post.
  • the optical axis opening is disposed at a center of the front panel, and the positioning hole or the positioning post is disposed on the front panel.
  • the positioning post is located in the positioning hole, and the free end and the connecting portion cooperate with each other and are fixedly connected to each other.
  • the first camera module is a wide-angle camera module
  • the second camera module is a zoom camera module
  • the optical axis of the first camera module is opposite to the second
  • the optical axes of the camera modules are perpendicular to each other.
  • the present invention provides a method for assembling a split-type array camera module, which includes the following steps:
  • (S13) module height calibration measuring a height difference between the lens end faces of each of the calibration modules and the reference module, and performing corresponding height position calibration on the calibration module;
  • (S15) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module and each calibration mode Collecting the obtained images, calculating the rotation calibration amount of each calibration module by using software, and performing rotational position calibration on each calibration module;
  • the inner returning step (S13) performs height calibration, offset calibration, and rotational calibration on each of the calibration modules until the horizontal position offset of each of the calibration modules and the reference module is at the tolerance Within the scope;
  • the split-type array camera module includes one or more sub-modules, wherein at least one sub-module is the reference module, and the remaining sub-modules are the calibration module.
  • the sub-modules are independent of each other and assembled to the assembly bracket.
  • the reference module selects a sub-module with the highest pixel in the split-array camera module.
  • the reference module and the calibration module are both single-camera modules that have been manufactured, assembled, and tested for performance.
  • the assembly gap between the reference module and the reference unit is 0.01-1 mm
  • the assembly gap between the calibration module and the calibration unit is 0.01-3 mm.
  • the step of assembling and fixing the reference module further comprises:
  • the glue is a UV thermoset
  • the glue is cured by ultraviolet exposure.
  • the module height calibration specifically includes:
  • the module offset calibration specifically includes:
  • the center of the target is an MTF test target, and the four corners of the target contain four Mark points.
  • step (S15) the rotation calibration of each calibration module is implemented by three spatial dimensions of U, V, W, in order to make each calibration
  • the module is parallel to the optical axis of the reference module.
  • the pre-assembly step of the calibration module specifically includes:
  • the step of fixing the split-type array camera module specifically includes:
  • the pre-assembly step of the calibration module specifically includes:
  • the step of fixing the split-type array camera module in the step (S17) specifically includes:
  • the baking temperature of the split array camera module in the oven is 50 ° C ⁇ 200 ° C, baking time 5min ⁇ 600min.
  • the present invention provides a method for assembling a split-type array camera module, which includes the following steps:
  • (S11A) a reference module of a split-type array camera module is assembled and fixed, that is, the reference module is assembled and fixed in a reference unit of an assembly bracket;
  • (S13A) module height/offset calibration measuring a lens end face height difference and a horizontal position offset of each of the calibration module and the reference module, and performing corresponding height position calibration on the calibration module Corresponding horizontal offset position calibration;
  • (S14A) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module and each calibration mode Collecting the acquired images, calculating a rotation calibration amount of each calibration module by using software, and performing rotational position calibration on each calibration module;
  • the present invention provides a method for assembling a split-type array camera module, which includes the following steps:
  • (S11B) a reference module of a split-type array camera module is assembled and fixed, that is, the reference module is assembled and fixed in a reference unit of an assembly bracket;
  • (S13B) module offset calibration measuring a horizontal position offset of each calibration module and the reference module, and performing corresponding horizontal offset position calibration on the calibration module;
  • (S14B) module height calibration measuring a height difference between the lens end faces of each of the calibration modules and the reference module, and performing corresponding height position calibration on the calibration module;
  • (S15B) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module and each calibration mode Collecting the acquired images, calculating a rotation calibration amount of each calibration module by using software, and performing rotational position calibration on each calibration module;
  • the present invention provides a method for assembling a split-type array camera module, which includes the following steps:
  • (S23) module height calibration measuring a height difference between the lens end faces of each of the calibration modules and the reference module, and performing corresponding height position calibration on the calibration module;
  • (S24) module offset calibration measuring a horizontal position offset of each calibration module and the reference module, The calibration module performs corresponding horizontal offset position calibration
  • (S25) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module and each calibration mode Collecting the obtained images, calculating the rotation calibration amount of each calibration module by using software, and performing rotational position calibration on each calibration module;
  • the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module, and the remaining sub-modules are the calibration module.
  • the sub-modules are independent of each other and assembled to the assembly bracket.
  • the reference module and the calibration module are both single-camera modules that have been manufactured, assembled, and tested for performance.
  • the reference module and the calibration module are respectively a focus adjustable camera module or a fixed focus camera module.
  • the reference module is a focus adjustable camera module
  • the calibration module is a fixed focus camera module
  • the assembly gap between the reference module and the reference unit is 0.01-1 mm
  • the assembly gap between the calibration module and the calibration unit is 0.01-3 mm.
  • the step of assembling and fixing the reference module further comprises:
  • the glue is a UV thermoset
  • the glue is cured by ultraviolet exposure.
  • the module height calibration specifically includes:
  • the module offset calibration specifically includes:
  • the target center is an MTF test target
  • the target contains 2-20 Mark points.
  • the rotation calibration of each calibration module is implemented by the movement of the six-axis platform in three spatial dimensions of U, V, and W, in order to make each calibration mode
  • the group is parallel to the optical axis of the reference module.
  • the pre-assembly step of the calibration module specifically includes:
  • the step of fixing the split array camera module specifically includes:
  • the pre-assembly step of the calibration module specifically includes:
  • the step of fixing the split array camera module specifically includes:
  • the baking array camera module has a baking temperature of 50 ° C to 200 ° C in the oven and a baking time of 5 min to 600 min.
  • FIG. 1 is a top plan view of a split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 2 is a front elevational view of a split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 3 is a front elevational view of a split array camera module in accordance with a first preferred embodiment of the present invention. Further explain the relative relationship of the parts.
  • FIG. 4 is a front elevational view of a first modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 5 is a front elevational view of a second modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 6 is a front elevational view of a third modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 7 is a front elevational view showing a fourth modified embodiment of a split type array camera module according to a first preferred embodiment of the present invention.
  • FIG. 8 is a fifth modified embodiment of a split type array camera module according to a first preferred embodiment of the present invention. A front view.
  • FIG. 9 is a front elevational view of a sixth modified embodiment of a split array camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 10 is a front elevational view showing a seventh modified embodiment of a split type array camera module in accordance with a first preferred embodiment of the present invention.
  • Figure 11 is a front elevational view showing an eighth modified embodiment of a split type array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 12 is a flow chart of a method of assembling a split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 13 is a schematic diagram of a split-type array camera module with a jig assembled during assembly according to a first preferred embodiment of the present invention.
  • FIG. 14 is a schematic diagram of a split-type array camera module with a jig assembled during assembly according to a first preferred embodiment of the present invention.
  • 15 is a schematic diagram of a target board of a split-type array camera module in performing calibration in accordance with a first preferred embodiment of the present invention.
  • 16 is a flow chart of a method of assembling another split array camera module in accordance with a first preferred embodiment of the present invention.
  • FIG. 17 is a perspective view of a split-type array camera module assembled in accordance with a second preferred embodiment of the present invention.
  • Figure 18 is an exploded perspective view of a split array camera module in accordance with a second preferred embodiment of the present invention.
  • FIG. 19 is an exploded perspective view of a prism unit of a split type array camera module according to a second preferred embodiment of the present invention.
  • FIG. 20 is a perspective view of a prism base of a split type array camera module in accordance with a second preferred embodiment of the present invention.
  • 21 is a schematic diagram of a prism unit of a split type array camera module assembled to a prism base according to a second preferred embodiment of the present invention.
  • FIG. 22 is an exploded perspective view of a second camera module of a split array camera module in accordance with a second preferred embodiment of the present invention.
  • FIG. 23 is a schematic diagram showing the state of interconnection between a prism module and a second camera module of a split-type array camera module according to a second preferred embodiment of the present invention.
  • Figure 24 is a logic diagram of a split array camera module in accordance with a second preferred embodiment of the present invention.
  • the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
  • a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module is manufactured after being assembled and assembled independently.
  • the camera module finished assembly is integrated on the same bracket to form a new array camera module.
  • the split array camera module has significant advantages such as high yield, high assembly efficiency, and high resource utilization.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the reference module 1 is implemented as a focus adjustable camera module such as a 13M adjustable focus camera module.
  • the calibration module 2 is implemented as a fixed focus camera module such as a 2M fixed focus camera module.
  • the reference module 1 and the calibration module 2 are respectively a single camera module that has completed manufacturing, assembly, and performance testing. It can be understood that the single camera module can also be a focus adjustable camera module, or both can be fixed focus camera modules, or one is a focus camera module, and the other is a fixed focus camera module.
  • the split array camera module includes a 13M adjustable focus camera module as the reference module 1 and a 2M fixed focus camera module as the calibration module 2, The reference module 1 and the calibration module 2 are independent of the single camera module.
  • the split array camera module further includes an assembly bracket 10 having a reference bracket unit 101 and a calibration bracket unit 102.
  • the reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the reference module 1 is assembled to the reference bracket unit 101 of the assembly bracket 10
  • the calibration module 2 is assembled to the calibration bracket unit 102 of the same assembly bracket 10. That is to say, the reference module 1 and the calibration module 2 are assembled in the same assembly bracket.
  • the assembly bracket 10 is made of high-hardness metal and non-metal materials, wherein the material of the assembly bracket 10 is required to be deformed by temperature and humidity changes for fixing the reference module 1 and the The spatial position between the calibration modules 2 is described.
  • the module center distance between the calibration module 2 and the reference module 1 is 10.5 mm.
  • the assembly gap between the reference module 1 and the reference bracket unit 101 is 0.1 mm, and the assembly gap between the calibration module 2 and the calibration bracket unit 102 is 0.3 mm.
  • the reference module 1 further includes a reference lens 11 , a reference driver 12 , a reference sensor chip 13 , a reference base 14 and a reference substrate 15 .
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive chip 13 to be suitable for photoelectric conversion.
  • Said The reference photosensitive chip 13 is electrically connected to the reference substrate 15.
  • the reference base 14 is disposed on the reference substrate 15 .
  • the reference driver 12 is mounted to the reference chassis 14, and the reference lens 11 is mounted to the reference driver 12 such that the reference lens 11 is supported above the reference substrate 15.
  • the reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • MEMS micro-brake
  • the reference base 14 may be separately disposed on the reference substrate 15 or may be formed on the reference substrate 15 via a molding process, wherein the connection is integrally packaged by a molding process.
  • the molding process may be a process such as injection molding or molding.
  • the reference base 14 surrounds the outside of the reference photosensitive chip 13 and forms a through hole to provide a light path of the reference lens 11 and the reference photosensitive chip 13.
  • the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a forward or reverse mounting manner, which is not a limitation of the present invention.
  • the calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, a calibration base 24 and a calibration substrate 25.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the calibration substrate 25.
  • the calibration base 24 is disposed on the calibration substrate 25.
  • the calibration lens 21 is supported above the calibration base 24.
  • the calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included.
  • the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can further include a calibration driver 22, wherein the calibration driver 22 is mounted on the calibration base 24, the calibration lens 21 is mounted to the calibration base 24 such that the calibration lens 21 is supported above the calibration substrate 25.
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • MEMS micro-brake
  • the resolutions of the reference photosensitive chip 13 and the calibration photosensitive chip 23 are close to each other to ensure image quality.
  • the calibration base 24 may be separately disposed on the calibration substrate 25 or may be formed on the calibration substrate 25 via a molding process, wherein the connection is integrally packaged by a molding process.
  • the molding process may be a process such as injection molding or molding.
  • the calibration base 24 surrounds the outside of the calibration photosensitive chip 23 and forms a through hole to provide a light path of the calibration lens 21 and the calibration photosensitive chip 23.
  • the calibration photosensitive chip 23 may be mounted on the calibration substrate 25 in a forward or reverse orientation, which is not a limitation of the present invention.
  • the reference module 1 and the calibration module 2 adopt different FOV lens designs.
  • the reference module 1 is implemented as a large field of view lens, and its FOV is generally between 75° and 120°.
  • the calibration module 2 is implemented as a small angle of view lens, and its FOV is generally between 20° and 50°. between.
  • the reference module 1 and the calibration module 2 are both implemented as zoom camera modules, and the zooming capability ranges from 2 times to 6 times. That is to say, the image magnification is not reduced by the algorithm synthesis, and the magnification is different from 2 to 6 times according to the matching.
  • an OIS or AF focus motor can be used for the small angle of view lens and the large angle of view lens, respectively, which is not a limitation of the present invention. It can be understood that an OIS or AF focusing function is additionally added to the single camera module to increase the quality of the optical zoom image. In other words, the OIS or AF focus function can be selectively used in the small angle of view lens and the large angle of view lens to enhance the optical zoom photographing effect.
  • the split-type array camera module can be implemented as more than one dual camera module, that is, a combination of multiple cameras can be performed as needed, and the focus is on the respective qualified ones.
  • the single camera module is assembled to the assembly bracket 10.
  • the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module 1 and the remaining sub-modules are the calibration module 2, and the sub-module They are independent of each other and assembled to the assembly bracket 10.
  • FIG. 4 it is a first modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102.
  • the reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the reference module 1 further includes a reference lens 11, a reference driver 12, a reference sensor chip 13, and a reference substrate 15.
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive chip 13 to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the reference substrate 15.
  • the reference lens 11 is mounted to the reference driver 12.
  • the reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • MEMS micro-brake
  • the calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, and a calibration substrate 25.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the calibration substrate 25.
  • the calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module.
  • the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 .
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the common base 20 is disposed on the reference substrate 15 and the calibration substrate 25, such that the reference module 1 is implemented as a focus adjustable camera module, and the calibration module 2 is implemented as a fixed
  • the reference driver 12 and the calibration lens 21 are both mounted to the common base 20.
  • the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.
  • the common base 20 may be separately disposed on the reference substrate 15 and the calibration substrate 25, or may be formed on the reference substrate 15 and the calibration substrate 25 via a molding process. And wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged by a molding process, wherein the molding process may be a process such as injection molding or molding.
  • the common base 20 surrounds the outside of the reference photosensitive chip 13 and the calibration photosensitive chip 23 and respectively form a through hole to provide a light path of the reference photosensitive chip 13 and the calibration photosensitive chip 23.
  • the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a formal or flip-chip manner, the school
  • the quasi-sensing chip 23 can be mounted on the calibration substrate 25 in a forward or reversed manner, which is not a limitation of the present invention.
  • FIG. 5 it is a second modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20 and a common substrate 30.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102.
  • the reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the reference module 1 further includes a reference lens 11, a reference driver 12 and a reference sensor chip 13.
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive chip 13 to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the common substrate 30.
  • the reference lens 11 is mounted to the reference driver 12.
  • the common substrate 30 can be coupled to the electronic device for use with the electronic device.
  • the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the calibration module 2 further includes a calibration lens 21 and a calibration sensor chip 23.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the common substrate 30.
  • the common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module.
  • the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 .
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the common base 20 is disposed on the common substrate 30, such that the reference module 1 is implemented as a focus adjustable camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.
  • the common base 20 may be separately disposed on the common substrate 30 or may be formed on the common substrate 30 via a molding process, wherein the package is integrally packaged by a molding process.
  • the common base 20 surrounds the outside of the reference photosensitive chip 13 and the calibration photosensitive chip 23 and respectively form a through hole to provide a light path of the reference photosensitive chip 13 and the calibration photosensitive chip 23.
  • the reference photosensitive chip 13 may be mounted on the common substrate 30 in a positive or negative manner
  • the calibration photosensitive chip 23 may be mounted on the common substrate 30 in a front or a flip-chip manner, which is not Limitations of the invention.
  • a third modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40 disposed on The reference module 1.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102.
  • the reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the reference module 1 further includes a reference lens 11, a reference driver 12, a reference sensor chip 13, a reference base 14 and a reference substrate 15.
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive chip 13 to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the reference substrate 15.
  • the reference base 14 is disposed on the reference substrate 15 .
  • the reference driver 12 is mounted to the reference chassis 14, and the reference lens 11 is mounted to the reference driver 12 such that the reference lens 11 is supported above the reference substrate 15.
  • the reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the gyroscope 40 is disposed on the reference substrate 15 .
  • the reference driver 12 can be implemented as a motor, a thermal drive or a micro-brake (MEMS) or the like.
  • the reference base 14 may be separately disposed on the reference substrate 15 or may be formed on the reference substrate 15 via a molding process, wherein the connection is integrally packaged by a molding process.
  • the molding process may be a process such as injection molding or molding.
  • the reference base 14 surrounds the outside of the reference photosensitive chip 13 and forms a through hole to provide a light path of the reference lens 11 and the reference photosensitive chip 13.
  • the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a forward or reverse mounting manner, which is not a limitation of the present invention.
  • a fourth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40 disposed on The calibration module 2.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102. The reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, a calibration base 24 and a calibration substrate 25.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the calibration substrate 25.
  • the calibration base 24 is disposed on the calibration substrate 25.
  • the calibration lens 21 is supported above the calibration base 24.
  • the calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included.
  • the calibration module 2 can also be implemented as a zoom camera module, so the calibration module 2 can further include a calibration driver 22, wherein the calibration driver 22 is mounted on the calibration base 24, the calibration lens 21 is mounted to the calibration base 24 such that the calibration lens 21 is supported above the calibration substrate 25. It is worth mentioning that the gyroscope 40 is disposed on the calibration substrate 25.
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the calibration base 24 can be separately disposed on the calibration substrate 25, It may be formed on the calibration substrate 25 via a molding process, wherein the calibration substrate 25 is integrally packaged by a molding process, which may be a process such as injection molding or molding.
  • the calibration base 24 surrounds the outside of the calibration photosensitive chip 23 and forms a through hole to provide a light path of the calibration lens 21 and the calibration photosensitive chip 23.
  • the calibration photosensitive chip 23 may be mounted on the calibration substrate 25 in a forward or reverse orientation, which is not a limitation of the present invention.
  • a fifth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes a gyroscope 40.
  • the split array camera module includes an assembly bracket 10 and a common base 20.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the gyroscope 40 is disposed on the reference module 1 .
  • the reference module 1 further includes a reference lens 11, a reference driver 12, a reference sensor chip 13, and a reference substrate 15.
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive chip 13 to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the reference substrate 15.
  • the reference lens 11 is mounted to the reference driver 12.
  • the reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the gyroscope 40 is disposed on the reference substrate 15 .
  • the reference driver 12 can be implemented as a motor, a thermal drive or a micro-brake (MEMS) or the like.
  • the calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, and a calibration substrate 25.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the calibration substrate 25.
  • the calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module.
  • the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 .
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the common base 20 is disposed on the reference substrate 15 and the calibration substrate 25, such that the reference module 1 is implemented as a focus adjustable camera module, and the calibration module 2 is implemented as a fixed
  • the reference driver 12 and the calibration lens 21 are both mounted to the common base 20.
  • the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.
  • the common base 20 may be separately disposed on the reference substrate 15 and the calibration substrate 25, or may be formed on the reference substrate 15 and the calibration substrate 25 via a molding process. And wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged by a molding process, wherein the molding process may be a process such as injection molding or molding.
  • the common base 20 surrounds the outside of the reference photosensitive chip 13 and the calibration photosensitive chip 23 and respectively form a through hole to provide a light path of the reference photosensitive chip 13 and the calibration photosensitive chip 23.
  • the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a formal or flip-chip manner
  • the calibration photosensitive chip 23 may be mounted on the calibration substrate 25 in a formal or flip-chip manner, which is not Limitations of the invention.
  • the split array camera module further includes a gyroscope 40.
  • the split array camera module includes an assembly bracket 10 and a common base 20.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the gyroscope 40 is disposed on the calibration module 2 .
  • the reference module 1 further includes a reference lens 11, a reference driver 12, a reference sensor chip 13, and a reference substrate 15.
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 It is accepted by the reference photosensitive chip 13 to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the reference substrate 15.
  • the reference lens 11 is mounted to the reference driver 12.
  • the reference substrate 15 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • MEMS micro-brake
  • the calibration module 2 further includes a calibration lens 21, a calibration photosensitive chip 23, and a calibration substrate 25.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the calibration substrate 25.
  • the calibration substrate 25 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module.
  • the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 . It is worth mentioning that the gyroscope 40 is disposed on the calibration substrate 25.
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the common base 20 is disposed on the reference substrate 15 and the calibration substrate 25, such that the reference module 1 is implemented as a focus adjustable camera module, and the calibration module 2 is implemented as a fixed
  • the reference driver 12 and the calibration lens 21 are both mounted to the common base 20.
  • the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.
  • the common base 20 may be separately disposed on the reference substrate 15 and the calibration substrate 25, or may be formed on the reference substrate 15 and the calibration substrate 25 via a molding process. And wherein the reference substrate 15 and the calibration substrate 25 are integrally packaged by a molding process, wherein the molding process may be a process such as injection molding or molding.
  • the common base 20 surrounds the outside of the reference photosensitive chip 13 and the calibration photosensitive chip 23 and respectively form a through hole to provide a light path of the reference photosensitive chip 13 and the calibration photosensitive chip 23.
  • the reference photosensitive chip 13 may be mounted on the reference substrate 15 in a formal or flip-chip manner
  • the calibration photosensitive chip 23 may be mounted on the calibration substrate 25 in a formal or flip-chip manner, which is not Limitations of the invention.
  • FIG. 10 it is a seventh modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20, a common substrate 30 and a gyroscope 40.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102.
  • the reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the gyroscope 40 is disposed on the common substrate 30.
  • the reference module 1 further includes a reference lens 11, a reference driver 12 and a reference sensor chip 13. Said The reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further subjected to the processing by the reference lens 11.
  • the reference photosensitive chip 13 is accepted to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the common substrate 30.
  • the reference lens 11 is mounted to the reference driver 12.
  • the common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the gyroscope 40 is electrically connected to the reference module 1 and disposed on the common substrate 30.
  • the reference driver 12 can be implemented as a motor, a thermal drive or a micro-brake (MEMS) or the like.
  • the calibration module 2 further includes a calibration lens 21 and a calibration sensor chip 23.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the common substrate 30.
  • the common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module.
  • the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 .
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the common base 20 is disposed on the common substrate 30, such that the reference module 1 is implemented as a focus adjustable camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.
  • the common base 20 may be separately disposed on the common substrate 30, or may be formed on the common substrate 30 via a molding process, wherein the package is integrally packaged by a molding process. Connected to the common substrate 30, wherein the molding process may be a process such as injection molding or molding.
  • the common base 20 surrounds the outside of the reference photosensitive chip 13 and the calibration photosensitive chip 23 and respectively form a through hole to provide a light path of the reference photosensitive chip 13 and the calibration photosensitive chip 23.
  • the reference photosensitive chip 13 may be mounted on the common substrate 30 in a positive or negative manner
  • the calibration photosensitive chip 23 may be mounted on the common substrate 30 in a front or a flip-chip manner, which is not Limitations of the invention.
  • FIG. 11 it is an eighth modified embodiment of a split-type array camera module according to a first preferred embodiment of the present invention, wherein the split-type array camera module further includes an assembly bracket 10 and a common base. 20, a common substrate 30 and a gyroscope 40.
  • the split array camera module is implemented as a dual camera module, which includes a reference module 1 and a calibration module 2.
  • the assembly bracket 10 has a reference bracket unit 101 and a calibration bracket unit 102.
  • the reference module 1 and the calibration module 2 are assembled to the reference bracket unit 101 and the calibration bracket unit 102 of the assembly bracket 10 respectively.
  • the gyroscope 40 is electrically connected to the calibration module 2 and disposed on the common substrate 30.
  • the reference module 1 further includes a reference lens 11, a reference driver 12 and a reference sensor chip 13.
  • the reference lens 11 is located in the photosensitive path of the reference photosensitive chip 13, so that when the reference module 1 is used to capture an image of an object, the light reflected by the object can be further processed by the reference lens 11 Sense of reference
  • the optical chip 13 is accepted to be suitable for photoelectric conversion.
  • the reference photosensitive chip 13 is electrically connected to the common substrate 30.
  • the reference lens 11 is mounted to the reference driver 12.
  • the common substrate 30 can be coupled to the electronic device for use with the electronic device.
  • the reference driver 12 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the calibration module 2 further includes a calibration lens 21 and a calibration sensor chip 23.
  • the calibration lens 21 is located in the photosensitive path of the calibration photosensitive chip 23, so that when the calibration module 2 is used to capture an image of an object, the light reflected by the object can be further processed by the calibration lens 21. It is accepted by the calibration photosensitive chip 23 to be suitable for photoelectric conversion.
  • the calibration photosensitive chip 23 is electrically connected to the common substrate 30.
  • the common substrate 30 can be coupled to the electronic device for use with the electronic device. It is worth mentioning that the calibration module 2 is implemented as a 2M fixed focus camera module, so no driver is included. However, the calibration module 2 can also be implemented as a zoom camera module.
  • the calibration module 2 can further include a calibration driver 22 , wherein the calibration lens 21 is supported above the calibration driver 22 .
  • the gyroscope 40 is electrically connected to the calibration module 2 and disposed on the common substrate 30.
  • the calibration driver 22 can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the common base 20 is disposed on the common substrate 30, such that the reference module 1 is implemented as a focus adjustable camera module, and when the calibration module 2 is implemented as a fixed focus camera module, The reference driver 12 and the calibration lens 21 are both mounted to the common base 20. In addition, when both the reference module 1 and the calibration module 2 are implemented as a focus adjustable camera module, the reference driver 12 and the calibration driver 22 are both mounted to the common base 20.
  • the common base 20 may be separately disposed on the common substrate 30 or may be formed on the common substrate 30 via a molding process, wherein the package is integrally packaged by a molding process.
  • the common base 20 surrounds the outside of the reference photosensitive chip 13 and the calibration photosensitive chip 23 and respectively form a through hole to provide a light path of the reference photosensitive chip 13 and the calibration photosensitive chip 23.
  • the reference photosensitive chip 13 may be mounted on the common substrate 30 in a positive or negative manner
  • the calibration photosensitive chip 23 may be mounted on the common substrate 30 in a front or a flip-chip manner, which is not Limitations of the invention.
  • FIG. 12 it is a method for assembling a first split-type array camera module according to a first preferred embodiment of the present invention, which includes the following steps:
  • (S12) at least one calibration module 2 of a split-type array camera module is pre-assembled, that is, the calibration module 2 is pre-assembled into a calibration unit 102 of the assembly bracket 10;
  • (S13) module height calibration measuring a height difference between the lens end faces of each of the calibration modules 2 and the reference module 1, and performing corresponding height position calibration on each of the calibration modules 2;
  • (S15) module rotation calibration setting a light source and a target board, illuminating the split array camera module, capturing and capturing images of the target board, according to the reference module 1 and each calibration
  • the module 2 collects the obtained image, calculates the rotation calibration amount of each calibration module 2 by using software, and performs rotational position calibration on the calibration module 2;
  • the order between the step (S13) and the step (S14) is not fixed and can be interchanged. That is to say, if necessary, the step (S13) may be performed first (S14), or the step (S4) may be performed first (S13), wherein the assembly method of the bulk array camera module is not affected. It is worth mentioning that the step (S13) and the step (S14) can be directly combined into one step, that is, the module is horizontally calibrated, that is, the X, Y, and Z axes are calibrated, and the order is not limited.
  • step (S16) does not have to exist.
  • the verification of the module calibration can be performed at the same time as the calibration in the step (S13), the step (S14), and the step (S15) to simplify the assembly process.
  • the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module 1 and the remaining sub-modules are the calibration module 2, and the sub-modules are mutually They are independent of each other and assembled to the assembly bracket 10.
  • the reference module 1 selects one of the sub-modules with the highest pixel in the split-type array camera module.
  • the reference module 1 and the reference unit 101 of the assembly bracket 10 are limited by a limit fixture 30.
  • Assembly wherein the reference module 1 and the bracket frame of the reference unit 101 are fixed by glue.
  • the glue adopts a UV thermosetting glue, and the glue area is located at an upper edge of the frame of the frame of the reference unit 101, and the UV thermosetting glue is pre-cured by ultraviolet exposure after the glue is finished. It is worth mentioning that the assembly gap between the reference module 1 and the reference unit 101 is 0.1 mm.
  • the step of assembling and fixing the reference module further includes:
  • the reference module 1 and the assembly bracket 10 are mounted and fixed to a fixed fixture 401 of a module calibration platform 403, and the calibration module 2 is Mounted and fixed to a calibration fixture 402, which is disposed on a six-axis platform, and the calibration module 2 is placed in the calibration unit 102 of the assembly bracket 10, thus
  • the calibration module 2 can perform six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform. It is worth mentioning that the assembly gap between the calibration module 2 and the calibration unit 102 is 0.3 mm.
  • the heights of a point on the lens end surface of the reference module 1 and the calibration module 2 are measured by using a laser ranging method, and then the calibration module 2 is respectively calculated.
  • the Z-axis displacement of the calibration module 2 is adjusted by the six-axis platform by a height difference from the lens end face of the reference module 1.
  • the module height calibration specifically includes:
  • the reference lens module 1 and the lens end surface of each of the calibration modules 2 are subjected to CCD imaging, the lens end face image is captured, and the calibration module 2 is calculated by using software.
  • the X-axis displacement of the calibration module 2 is adjusted by the six-axis platform according to the horizontal position offset of the reference module 1.
  • the module offset calibration specifically includes:
  • the rotation angle of the U, V, W rotation axes of the six-axis platform is adjusted according to the rotation calibration amount of the calibration module 2, and the rotation calibration of the calibration module 2 is realized.
  • the tolerance of the X-axis position offset of the calibration module 2 and the reference module 1 is [10.4, 10.6] mm
  • the tolerance of the Y-axis position offset is [-0.1, 0.1 ]mm.
  • step (S17) glue is drawn between the calibration module 2 and the calibration unit 102, the glue is a UV thermosetting glue, and the calibration module 2 and the calibration unit 102 are The UV thermosetting glue is pre-cured in an ultraviolet exposure, and then the split-type array camera module is baked in an oven to achieve curing of all the UV thermosetting glue, and the entire split-type array camera module is fixed. The assembly is finally completed.
  • the limit fixture 30 includes a first recess 301 and a second recess 302 extending inwardly from the surface of the limit fixture 30 to form a recess.
  • the first groove 301 is used to place the reference module 1
  • the second groove 302 is used to place the assembly bracket 10 .
  • the assembling step of the reference module 1 and the limit fixture 30 in the step (S11) further includes:
  • the reference module 1 is placed in the first recess 301 of the limit fixture 30;
  • steps (S11A) and (S11B) have no order of assembly, that is, the order of assembly can be adjusted according to the assembly requirements.
  • the laser height measurement point of the reference module 1 is located above the lens end surface of the reference module 1, and the laser height measurement of the calibration module 2
  • the distance between the point and the laser height measuring point of the reference module 1 is fixed, which is the module center distance between the calibration module 2 and the reference module 1.
  • the distance It is 10.5mm.
  • the height difference of 2 however, the altimetry efficiency of this method is much lower than that of a altimetry.
  • the reference module 1 is a focus adjustment module, the reference module 1 needs to be focused before the target image is collected, and the MTF test pattern M1 is used to the reference module 1 Focusing, adjusting the focus until the MTF test pattern is made The image is most clearly imaged in the reference module 1, and then the rotational calibration amount of the calibration module 2 is calculated.
  • the light of the reference module 1 and the calibration module 2 can be separately calculated.
  • the axis is tilted, whereby the amount of rotational calibration of the calibration module 2 can be calculated.
  • the alignment direction of the reference module 1 and the calibration module 2 is defined as the X axis and the vertical direction is the Y axis
  • the calibration module 2 and the reference module 1 The distance between the center of the module is 10.5mm.
  • the tolerance of the X-axis position offset of the calibration module 2 and the reference module 1 in the step (S16) is [10.4, 10.6] mm
  • the tolerance of the Y-axis position offset is [-0.1, 0.1] mm, as long as any one of the X, Y axis position offsets of the calibration module 2 and the reference module 1 is not within the corresponding tolerance range, it is necessary to perform the step (S13).
  • the height calibration, offset calibration, and rotation calibration of the calibration module 2 are performed in sequence, until the X and Y axis position offsets of the calibration module 2 and the reference module 1 fall within corresponding tolerances.
  • the glue is not drawn between the calibration module 2 and the calibration unit 102 in step (S12) until all calibration processes are completed in step (S17) and then in the calibration module.
  • the glue is drawn between the calibration unit 102, and the present invention can also put the glue drawing process between the calibration module 2 and the calibration unit 102 in the step (S17) to the end of the step (S12). That is, the glue between the calibration module 2 and the calibration unit 102 is first performed, and then the assembly position of the calibration module 2 is calibrated. After the calibration is completed, the step (S17) is performed.
  • the glue is UV-cured and semi-cured, and then the entire module is baked to complete the assembly.
  • the baking temperature of the split-type array camera module in the oven is 80 ° C to 90 ° C, and the baking time is 50 min to 60 min.
  • the simplified assembly process mentioned in the present embodiment integrates or interchanges the steps (S13) and (S14), and simplifies the step (S16).
  • the method for assembling a split-type array camera module of the first simplified alternative mode of the first preferred embodiment of the present invention comprises the following steps:
  • (S11A) a reference module 1 of a split-type array camera module is assembled and fixed, that is, the reference module 1 is assembled and fixed in a reference unit 101 of the assembly bracket 10;
  • (S13A) module height/offset calibration measuring a lens end surface height difference and a horizontal position offset of each of the calibration module 2 and the reference module 1, and correspondingly to each of the calibration modules 2 Height position calibration and corresponding horizontal offset position calibration;
  • (S14A) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module 1 and each calibration
  • the module 2 collects the obtained image, calculates the rotation calibration amount of each calibration module 2 by using software, and performs rotational position calibration on the calibration module 2;
  • the split-type array camera module includes one or more sub-modules, wherein one sub-module is the reference module 1 and the remaining sub-modules are the calibration module 2, The sub-modules are independent of one another and assembled to the assembly bracket 10.
  • the reference module 1 and the calibration module 2 are both single-camera modules that have been manufactured, assembled, and tested for performance.
  • the reference module 1 can be implemented as a 13M adjustable focus camera module.
  • the calibration module 2 can be implemented Implemented as a 2M fixed focus camera module.
  • an assembly gap of the reference module and the reference unit is 0.1 mm
  • an assembly gap of the calibration module and the calibration unit is 0.3 mm.
  • (S13B) module offset calibration measuring a horizontal position offset of each calibration module 2 and the reference module 1, and performing corresponding horizontal offset position calibration on each calibration module 2;
  • (S14B) module height calibration measuring the height difference between the lens end face of each calibration module 2 and the reference module 1, and performing corresponding height position calibration on each calibration module 2;
  • (S15B) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module 1 and each calibration
  • the module 2 collects the obtained image, calculates the rotation calibration amount of each calibration module 2 by using software, and performs rotational position calibration on the calibration module 2;
  • FIG. 16 is a schematic diagram of a method for assembling a second one-piece array camera module according to a first preferred embodiment of the present invention, which is different from the first embodiment in that the calibration is not performed in step (S26).
  • the horizontal position offset of the module 2 and the reference module 1 is set to a tolerance range, regardless of the horizontal position offset of the calibration module 2 and the reference module 1, directly based on the measured two
  • the horizontal position offset is adjusted by the six-axis platform to adjust the X and Y axis displacements of the calibration module, that is, the step (S26) repeats the step (S24).
  • the assembly method of the second embodiment is more efficient than the assembly method of the first embodiment, but the calibration quality is relatively low.
  • the above-mentioned characteristics of the split-type array camera module need to be Choose between two options.
  • a method for assembling a split-type array camera module according to a second preferred embodiment of the present invention includes the following steps:
  • (S23) module height calibration measuring a height difference between the lens end faces of each of the calibration modules 2 and the reference module 1, and performing corresponding height position calibration on each of the calibration modules 2;
  • (S25) module rotation calibration setting a light source and a target plate, illuminating the split array camera module, capturing and capturing images on the target board, according to the reference module 1 and each calibration
  • the module 2 collects the obtained image, calculates the rotation calibration amount of each calibration module 2 by using software, and performs rotational position calibration on the calibration module 2;
  • (S26) module offset calibration measuring a horizontal position offset of each calibration module 2 and the reference module 1, Performing a corresponding horizontal offset position calibration for each of the calibration modules 2;
  • the step of assembling and fixing the reference module further comprises:
  • the glue is a UV thermoset glue which is cured by UV exposure.
  • the module height calibration specifically includes:
  • the module offset calibration specifically includes:
  • the center of the target is an MTF test target, and the four corners of the target include four circular Mark points.
  • each calibration module is implemented by the movement of the six-axis platform in three spatial dimensions of U, V, and W, in order to make each calibration module and the reference module
  • the optical axes of the groups are parallel.
  • the pre-assembly step of the calibration module specifically includes:
  • the calibration module can perform movements of six spatial dimensions of X, Y, Z, U, V, and W along with the six-axis platform;
  • the step of fixing the split-type array camera module specifically includes:
  • the pre-assembly step of the calibration module specifically includes:
  • the calibration fixture 402 is disposed on a six-axis platform, and the calibration module is placed in the calibration unit 102 of the assembly bracket 10.
  • the calibration module can follow
  • the six-axis platform is used for the movement of six spatial dimensions of X, Y, Z, U, V, and W.
  • the step of fixing the split-type array camera module specifically includes:
  • the split-type array camera module has a baking temperature of 80 ° C to 90 ° C in the oven and a baking time of 50 min to 60 min.
  • the invention provides a method for assembling the split-type array camera module, wherein the split-type array camera module refers to an integrated assembly of more than one camera module that is completely independent and inspected by each other through a common assembly bracket.
  • Array camera module In the assembly process of the array module, not only the module height between each sub-module is strictly controlled, but also the optical axis spacing and the optical axis parallelism between each sub-module are strictly controlled.
  • the technical solution of the assembly method of the patented split-type array camera module is as follows: one sub-module of the split-type array camera module is used as the reference module 1, and the other sub-modules are used as the calibration module 2, first described
  • the reference module 1 is assembled and fixed on the assembly bracket 10, and the height (Z-axis) and horizontal offset (X, Y-axis) of the calibration module 2 are sequentially sequentially used with the reference module 1 as a reference standard.
  • rotating (U, V, W axis) a total of six axes of assembly position calibration, after the calibration is completed, the calibration of the calibration module 2 and the assembly bracket 10 is fixed, complete the split array camera module Assembly process.
  • the assembly method of the above-mentioned split-type array camera module not only improves the module production efficiency, yield and module quality, but also realizes high utilization of production resources.
  • a split-type array camera module according to a second preferred embodiment of the present invention, wherein the split-type array camera module is a plurality of assembled and independently assembled and qualified products.
  • the camera module or the prism module is assembled and integrated into a new array camera module.
  • the split array camera module has significant advantages such as high yield, high assembly efficiency, and high resource utilization.
  • the split-type array camera module is implemented as a dual-camera zoom module, which includes a first camera module 1, a prism module 2, a second camera module 3, and A circuit board 4.
  • the first camera module 1 is detachably coupled to the prism module 2, and the second camera module 3 is disposed on the prism module 2 and the circuit board 4. between.
  • the first camera module 1 is disposed at the leftmost side of the entire zoom lens module, and the prism module 2 is disposed behind.
  • the second camera module 3 is fixedly connected to each other. .
  • the two are required to be strictly positioned and aligned with each other, so as to ensure that the light refracted in the prism module 2 is concentric or identical to the optical axis of the camera lens in the second camera module 3. axis.
  • the structure of this positioning will be described in further detail later in connection with the related drawings.
  • the prism module 2 and the second camera module 3 to which the first camera module 1 is fixed are positioned to each other, and then the two are fixedly connected to each other by laser welding or bonding.
  • the circuit board 4 can be pre-assembled on the second camera module 3, and then the prism module 2 and the second camera module 3 of the first camera module 1 are fixedly connected to each other.
  • the prism module 2 and the second camera module 3 of the first camera module 1 may be fixedly connected to each other, and then the electricity is further
  • the road board 4 is fixedly connected to the second camera module 3. So far, the dual-camera zoom module according to the present invention has been assembled to form a complete dual-camera zoom module as shown in FIG.
  • the first camera module 1 includes a first lens 100A, a first driver 300A, a first sensor chip 200A, and a first substrate 400A.
  • the first lens 100A is located in the photosensitive path of the first photosensitive chip 200A, so that when the first camera module 1 is used to collect an image of an object, the light reflected by the object can be used by the first lens
  • the processing of 100A is further accepted by the first photosensitive chip 200A to be suitable for photoelectric conversion.
  • the first photosensitive chip 200A is electrically connected to the first substrate 400A.
  • the first lens 100A is mounted to the first of the drivers 300A.
  • the first substrate 400A may be first coupled to the electronic device for use with the electronic device.
  • the first driver 300A can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • the prism module 2 includes a prism unit 201 and a prism base 202.
  • the prism base 202 has a rectangular shape and is provided with two positions, one of which is for accommodating the prism unit 201 and the other is for accommodating the first camera module 1.
  • the arrangement is such that the first camera module 1 and the prism unit 201 are mounted on a bottom plate or a plane, or the first camera module 1 and the prism unit 201 are coplanar. This eliminates the positional error between the first camera module 1 and the prism unit 201 disposed on different pedestals. This arrangement ensures the parallelism of the light entering the first camera module 1 and the prism unit 201 with a simple structure, that is, the image quality is ensured.
  • Figure 19 shows, in an exploded schematic view, the prism unit 201 in the prism module 2 of the dual zoom module according to the present invention.
  • the prism unit 201 mainly includes a prism housing 2011, a prism 2012, a prism holder 2013, a support sleeve 2014, a support shaft 2015, and a support card holder 2016.
  • the prism housing 2011 is a rectangular frame surrounded by three side walls or a frame.
  • the three side walls or the frame are respectively a bottom frame 2011a and two side frames 2011b.
  • Two of the side frames 2011b have the same structure and shape and are arranged opposite to each other.
  • the bottom frame 2011a is provided at one end of the two side frames 2011b. This forms an approximately U-shaped frame.
  • This frame is a rectangular frame that is open or open on one side.
  • the side openings of the U-shaped frame are disposed on opposite sides of the bottom frame 2011a.
  • the two side frames 2011b are respectively fixedly connected to the bottom frame 2011a at one end, and the other end is an outwardly extending free end 2011c, that is, the side opening is formed at the free end 2011c.
  • the two free ends 2011c are used to interconnect with the second camera module 3 that is sequentially disposed.
  • a connecting beam 2011d is further disposed between the two free ends 2011c.
  • the connecting beam 2011d is used to fix the distance between the two free ends 2011c, so that the second camera module 3 can be more accurately connected to the rear and fixedly connected to each other;
  • the connecting beam 2011d also serves to block light that may leak into the space between the prism 2012 and the second camera module 3 at the connection gap. This helps to improve the image quality.
  • the connecting beam 2011d increases the overall rigidity of the prism housing 2011 and effectively prevents unwanted light from entering the dual zoom module according to the present invention.
  • the connecting beam 2011d can be implemented as a long strip or a rectangular frame. It can be understood that the connecting beam 2011d is disposed on the two side frames 2011b if the strip is the strip, and is between the two free ends 2011c. If the connecting beam 2011d is the rectangular frame, it is located at the upper part of the bottom frame 2011a and the two side frames 2011b, and one side of the rectangular frame is located between the two free ends 2011c.
  • the prism unit 201 further includes the prism 2012, the prism holder 2013, the support bushing 2014, and the support shaft 2015.
  • the prism 2012 is fixedly disposed in the prism holder 2013, and it can be clearly seen from the figure that the upper surface of the prism 2012 protrudes from the prism holder 2013 in an assembled state.
  • the support bushing 2014 is fixedly mounted on the lower portion of the prism holder 2013, that is, the other side of the prism holder 2013 opposite to the position at which the prism 2012 is mounted.
  • the support shaft 2015 is rotatably mounted in the support bushing 2014.
  • the cross section of the prism 2012 is substantially a right triangle, and the prism 2012 shown in the figure is in a state of being horizontal. As shown, the plane of a right-angled side of a right-angled triangle is set upwards. Thus, the plane of the oblique side of the right triangle of the mirror 2012 faces the prism holder 2013 and is supported therein.
  • the support bushing 2014 and the support shaft 2015 cooperate with each other to support the entire prism holder 2013 and the prism 2012 so that it can be Rotating around the support shaft 2015.
  • a glue for bonding is first applied to the prism holder 2013, and then the prism 2012 is placed in the prism holder 2013 and the glue is cured. Thereby, the prism 2012 and the prism holder 2013 are bonded to each other firmly.
  • the support bushing 2014 is placed in the through hole 2013a on the prism holder 2013 and fixed.
  • the prism holder 2013 on which the prism 2012 has been assembled is rotatably supported by the prism base 202 via the support shaft 2015, and the prism housing 2011 is mounted on the prism holder 2013.
  • a magnet for driving the movement of the prism holder 2013 is further provided on the prism holder 2013, and the prism base 202 is provided with a movement for driving the prism holder 2013 as described above.
  • the magnets cooperate with the coils and the circuit.
  • a drive device that drives the movement of the prism 2012 is formed. Under the driving of the driving device, the prism 2012 rotates or moves relative to the support shaft 2015, thereby realizing the adjustment movement of the prisms 2012 in different degrees of freedom.
  • Figure 20 shows the specific shape and configuration of the prism base 202 in a perspective view.
  • the prism base 202 has a rectangular shape with a bottom plate 2025 as a rectangular flat plate.
  • a positioning frame wall 2026 extending along the side length thereof is provided.
  • the locating frame wall 2026 does not extend continuously around the entire side length of the bottom plate 2025, but rather extends discontinuously.
  • a first opening 2028 is formed therein.
  • the prism base 202 shown in FIG. 20 is divided into two different chambers by a middle partition wall 2027, and one of the prism units 201 for accommodating or arranging the prism unit 201 is a prism module accommodating chamber 2022. Another one for accommodating the first camera module 1 is a first camera module housing cavity 2021. It is worth mentioning that the first opening 2028 is formed on a sidewall of the first camera module accommodating cavity 2021. In addition, a second opening 2029 is formed in the sidewall of the prism module receiving cavity 2022. As shown in the figure, the first opening 2028 is used to apply the power/signal line of the first camera module 1. Similarly, the second opening 2029 is also an opening for applying a power/control signal line for controlling the prism 2012.
  • a connecting wall 2023 is disposed on a side of the prism module accommodating cavity 2022, and the connecting wall 2023 is connected to the second camera module 3, and also plays on the second camera module 3 When connected to each other, the two are precisely positioned to each other. Further, the connecting wall 2023 is disposed on the opposite side of the middle partition wall 2027.
  • a support seat for supporting the support shaft 2015 is further provided in the prism module accommodating chamber 2022. The support shaft 2015 is fixedly supported on the support base so that the prism 2012 can be moved by the drive mechanism.
  • the first camera module 1 and the prism module 2 are respectively disposed on the prism base 202.
  • One of the purposes of such an arrangement is to align the effective optical regions formed by the prism unit 201 and the lens in the first camera module 1 with each other. This is very important for image quality.
  • the prism base 202 is caused to bear two parts having a certain weight.
  • the intermediate portion of the prism base 202 becomes a relatively weak portion of the entire base.
  • the prism base 202 may break at an intermediate portion.
  • an intermediate reinforcing plate 2024 is provided at its intermediate portion in accordance with the present invention.
  • the intermediate reinforcing plate 2024 extends through the prism base 202 across its entire width along a length direction perpendicular to the prism base 202.
  • the intermediate reinforcing plate 2024 has a certain thickness to enhance the strength of the intermediate portion of the prism base 202.
  • the intermediate reinforcing plate 2024 is effectively prevented from being broken or damaged.
  • the intermediate reinforcing plate 2024 improves the overall rigidity of the prism base 202, so that the installation foundation of the first camera module 1 and the prism unit 201 is more secure, and the positional relationship between the two is ensured. .
  • At least one positioning protrusion 2030 is disposed on the other surface of the connecting wall 2023 at the end of the prism base 202.
  • four of said positioning projections 2030 are provided.
  • the four positioning projections 2030 are distributed at the four corners of the surface of the connecting wall 2023.
  • the positioning protrusions 2030 are configured to cooperate with the positioning holes 301c on the imaging housing 301 on the second camera module 3 to determine the prism base 202 and the second
  • the connection position between the camera modules 3 ensures that the optical axis of the prism 2012 and the optical axis of the lens in the second camera module 3 are coaxial with each other.
  • a through hole for passing light is further disposed at a central portion of the connecting wall 2023. The light refracted by the prism 2012 will pass through the through hole and enter the second camera module 3, and the lens passing therethrough reaches the photosensitive chip.
  • the free end 2011c of the prism housing 2011 is also clearly shown in FIG. According to this embodiment of the invention, the two free ends 2011c are used for fixed connection with the second camera module 3 behind. This will be described in further detail later.
  • the second camera module 3 includes a second lens 102A, a second driver 302A, a second sensor chip 202A, and a second substrate 402A.
  • the second lens 102A is located in the photosensitive path of the second photosensitive chip 202A, so that when the first two camera module 3 is used to collect an image of an object, the light reflected by the object can be by the second The processing of lens 102A is then further accepted by the second sensor chip 202A to be suitable for photoelectric conversion.
  • the second photosensitive chip 202A is electrically connected to the second substrate 402A.
  • the second lens 102A is mounted to the second of the drivers 302A.
  • the second substrate 402A may be first coupled to the electronic device for use with the electronic device.
  • the second driver 302A can be implemented as a motor, a thermal driver or a micro-brake (MEMS) or the like.
  • FIG. 22 shows a partial structure of the second camera module 3 according to the present invention.
  • the second camera module 3 includes an imaging housing 301A.
  • the image pickup casing 301A has a hollow rectangular column shape, has a casing portion 301a surrounding a hollow rectangular column, and a front plate 301e fixedly coupled to one end of the casing portion 301a.
  • the length of the front panel 301e is smaller than the width of the image pickup casing 301A, because two connection portions 301b are respectively provided at both ends in the width direction of the image pickup casing 301A.
  • the two connecting portions 301b are two recesses on the side of the imaging housing 301A.
  • At least one positioning hole 301c is provided in the front panel 301e.
  • four of the positioning holes 301c are provided at the four corners of the front panel 301e.
  • a second driver 302A also shown in Fig. 22 is a second driver 302A, an anti-shake unit 303 and a support housing 304 in this embodiment in accordance with the present invention. These components are disposed coaxially with each other, and the second driver 302A is mounted in the anti-vibration unit 303, and is movable in the anti-vibration unit 303 by the driving mechanism to cancel the deviation caused by the shake.
  • the anti-shake unit 303 is integrally mounted in the support shell 304 and movable in the support shell 304 to drive the lens in the camera module to focus.
  • FIG. 23 is a view schematically showing an interconnection state of the prism module 2 and the second camera module 3 in an embodiment according to the present invention.
  • the four positioning protrusions 2030 on the prism base 202 and the four positioning holes 301c on the imaging housing 301 of the second camera module 3 are aligned with each other, and then inserted into the Positioning hole 301c. In this way, it can be ensured that the second camera module 3 and the prism unit 201 are strictly aligned with each other.
  • the free end 2011c of the prism housing 2011 is fitted at the two recessed connecting portions 301b on both sides of the end portion of the image pickup housing 301.
  • the free end 2011c is laser welded to the connecting portion 301b or bonded by applying glue, and the two are fixedly connected.
  • a combination as shown in FIG. 23 is obtained, but the first camera module 1 and the corresponding circuit board 4 located at the rightmost side are omitted in FIG.
  • the circuit board 4 can be connected to the rear of the second camera module 3 by bonding or the like.
  • the circuit board 4 can also be connected to the rear of the second camera module 3 by a matching structure, such as a screw or a hook. This is not a limitation of the invention.

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Description

分体式阵列摄像模组及其组装和应用方法 技术领域
本发明涉及一摄像模组，尤其涉及一分体式阵列摄像模组，其适用于移动终端，以提高生产效率和良率，特别还提高资源利用率。
背景技术
随着科技的发展，智慧型携带装置可以说已经是人们现代不可或缺的器具，其中像是手机或平板电脑人手一台已是非常普遍常见的情况。特别地，由于科技进步，使装置在智慧型携带装置中的相机功能品质不断提升，因此人们逐渐的使用智慧型携带装置中的相机去取代传统相机去记录生活的习惯。特别地，在各种硬体规格不断的进化下，手机的相机已经取代了大部份的相机市场，但是拥有大镜头的专业相机可以比小镜头的手机相机收集更多的光资讯，因此专业相机所拍摄出的画质原则上是优于小镜头的手机相机，但是，也因为专业相机的镜头尺寸、重量和价格对于要将专业相机的镜头应用于随身携带的手机是非常不易的。特别地在2014年，随着宇龙发布携带双摄的智能手机，摄像模组进入了双摄时代。因此，将可利用多颗的小镜头架构出阵列式摄像模组，以代替单一笨重和昂贵的专业相机的镜头应用于智慧型携带装置。
随着双摄像头及多摄像头的应用技术开发，其优势越来越被手机终端商或消费电子厂商看重，特别是运用于手机、数位相机这样可随身携带的电子式产品，而且在重量和价格上也极具竞争性。值得一提的，光学变焦一直是单反相机的专属功能，手机摄像头业届里一直期望能够把光学变焦的功能移植到手机中，缩小和单反相机的差距，真正取代其拍照地位。在手机摄像头技术发展的过程中也出现过光学变焦功能的摄像头，这些摄像头大多是通过镜片间距离改变实现变焦功能，此类摄像头的致命缺陷在于抗机械应力能力差，从而无法被终端手机厂商或消费电子厂商所接受。然而通过不同焦距摄像头间自由切换的方式实现变焦功能则避免了这个最大的问题，此类设计的摄像头镜头和镜片结构完全和寻常手机摄像头无异，使得光学变焦的功能在手机上实现。
但是，目前市场上的阵列摄像模组在产生制造时有良率低下的问题，这样无疑是增加了产品的生产制造成本，因为通常在阵列摄像模组中的一个摄像头(或镜头)出现不良，即会导致整个阵列摄像模组的报废，而且制程的技术公差能力和物料水准完全决定了多个摄像的光轴角度。因为，所谓阵列摄像模组在设计的概念是利用多个镜头去收集影像资讯，并将大量的资讯进行处理后所组构出的影像，当其中一个镜头出现光学差异、机械定位的误差或是电子的杂讯等问题，即会造成整组的阵列摄像模组无法产生完整清晰的影像，因此造成制程时间和成本的浪费。
另外，现今亦有将棱镜应用于摄像模组的相关产品问市，像在中国专利CN201480051999.0公开了反射镜倾斜致动，其中设有多个镜头组和反射镜及支承反射镜的基座。根据该专利，采用不同的枢轴支承反射镜，并利用磁铁、FP线圈、霍尔传感器以及 弹簧等元件控制反射镜，避免其在使用过程出现的抖动。但是这种反射镜倾斜致动结果复杂，零件数量众多，制造维修复杂。
发明内容
本发明的一个目的在于提供一分体式阵列摄像模组及其组装应用方法，其中所述分体式阵列摄像模组中的单体摄像模组单独完成制造、组装和测试过程，互不占用组装和测试时间。也就是说，所述单体摄像模组的制造、组装和测试无需区别于常规模组生产形式，无需私立特殊工序站，以提高生产效率和使生产资源高度利用。
本发明的另一目的在于提供一分体式阵列摄像模组及其组装应用方法，其中对所述单体摄像模组完成性能测试合格后再进行所述分体式阵列摄像模组的组装，大大提升了所述分体式阵列摄像模组成品的良率。
本发明的另一目的在于提供一分体式阵列摄像模组及其组装应用方法，其中自动调整光轴的方式，能够解决因制程光轴倾斜带来的光轴不平行问题，一定程度上降低了在双摄、多摄模组深度标定中的不良比例，并提升了共基板共镜座双摄像头和多摄像头模组的实际应用效果。
本发明的另一目的在于提供一分体式阵列摄像模组及其组装应用方法，其中单体摄像模组使用常规的镜头，相比单反镜头的光学变焦设计原理，无疑光学变焦的双摄像头显得简单很多，无需复杂的光路设计。
本发明的另一目的在于提供一分体式阵列摄像模组及其组装应用方法，其中采用不同FOV的单体摄像模组，这样相比单反镜头的制造工艺而言，不同FOV的单体摄像模组进行阵列组合相对简单很多，因此对手机摄像头制造商的制造能力挑战也最小。进一步地说，不同FOV的单体摄像模组的组合是实现光学变焦的关键，在不同焦距单体摄像模组间的平滑切换实现变焦的体验效果。
本发明的另一目的在于提供一分体式阵列摄像模组及其组装应用方法，其中通过组装支架组合多个单体摄像模组，以提高良率和可靠度。另外，所述组装支架为高硬度和高强度材质所制，以保证单体摄像模组间的位置关系不受外力影响变化。换言之，一般的双摄模组在运输和装机过程中容易受外力影响发生视差的变化，而大多针对双摄开发的光学变焦算法对双摄模组的视差有严格要求，因此，所述组装支架能有效保证所述分体式阵列摄像模组的视差能力。
本发明的另一目的在于提供一分体式阵列摄像模组及其组装应用方法，其中可根据实际终端产品的空间结构放置陀螺仪。换言之，根据手机装机结构空间差异性可以把陀螺仪的摆放位置进行灵活性调整。
为达到以上至少一个目的，本发明提供一分体式阵列摄像模组，包括：
多颗子模组，其中至少一颗子模组为参考模组，其余子模组为校准模组；以及
一组装支架，其中所述参考模组和所述每个校准模组分别组装于所述组装支架，其中所述参考模组和每个校准模组则分别为独立且合格的单体摄像模组。
根据本发明的一实施例，其中所述参考模组为一可调焦摄像模组或一定焦摄像模组。
根据本发明的一实施例，其中所述校准模组为一可调焦摄像模组或一定焦摄像模组。
根据本发明的一实施例，其中所述组装支架具有至少一参考单元和至少一校准单元，其中所述参考模组与所述校准模组分别组装于所述组装支架的所述参考单元与所述校准单元。
根据本发明的一实施例，其中所述校准模组与所述参考模组之间的模组中心距离是1-100mm。
根据本发明的一实施例，其中所述参考模组与所述参考单元的四周组装间隙为0.01-1mm，所述校准模组与所述校准单元的四周组装间隙为0.03-3mm。
根据本发明的一实施例，其中所述参考模组还包括至少一参考镜头，至少一参考驱动器以及至少一参考感光芯片，其中所述参考镜头位于所述参考感光芯片的感光路径，所述参考镜头被安装于所述参考驱动器。
根据本发明的一实施例，其中所述校准模组还包括至少一校准镜头和一至少校准感光芯片，其中所述校准镜头位于所述校准感光芯片的感光路径。
根据本发明的一实施例，其中所述参考模组还包括至少一参考底座和至少一参考基板，其中所述参考感光芯片电连接于所述参考基板上，所述参考底座设置于所述参考基板上，所述参考驱动器被安装于所述参考底座。
根据本发明的一实施例，其中所述校准模组还包括至少一校准底座和至少一校准基板，其中所述校准感光芯片电连接于所述校准基板上。所述校准底座设置于所述校准基板上。
根据本发明的一实施例，其中所述分体式阵列摄像模组包括至少一共同底座，所述参考模组还包括至少一参考基板，所述校准模组还包括至少一校准基板，其中所述参考感光芯片电连接于所述参考基板上，所述校准感光芯片电连接于所述校准基板上，所述共同底座设置于所述参考基板和/或所述校准基板上。
根据本发明的一实施例，其中包括至少一共同底座和至少一共同基板，其中所述参考感光芯片和所述校准感光芯片电连接于所述共同基板上，所述共同底座设置于所述共同基板上，所述参考驱动器和所述校准镜头都被安装于所述共同底座。
根据本发明的一实施例，其中包括一陀螺仪，其设置于所述参考模组的所述参考基板。
根据本发明的一实施例，其中包括一陀螺仪，其设置于所述校准模组的所述校准基板。
根据本发明的一实施例，其中包括一陀螺仪，其电连接于所述参考模组并设置于所述共同基板上。
根据本发明的一实施例，其中包括一陀螺仪，其电连接所述校准模组地设置于所述共同基板上。
根据本发明的一实施例，其中所述参考驱动器系选自由马达、热驱动器或微致动器所构成的群组。
根据本发明的一实施例，其中所述校准模组还可包括一校准驱动器，其中所述校准镜头被支撑于所述校准驱动器上方。
根据本发明的一实施例，其中所述参考模组实施为大视场角镜头，其FOV一般在60°～220°之间，所述校准模组实施为小视场角镜头，其FOV一般在10°～90°之间。
为达到以上至少一个目的，本发明提供一分体式阵列摄像模组，其包括：
至少一第一摄像模组，至少一棱镜模组，至少一第二摄像模组，以及至少一电路板， 其中所述第一摄像模组与所述棱镜模组共平面设置，所述棱镜模组与所述第二摄像模组光轴同心设置，所述电路板连接在所述第二摄像模组上。
根据本发明的一实施例，其中所述棱镜模组包括一棱镜单元和一棱镜基座，所述棱镜单元可转动地支承在所述棱镜基座中。
根据本发明的一实施例，其中所述第二摄像模组包括至少一第二镜头，至少一第二感光芯片，和至少一第二基板，其中其中所述第二镜头位于所述第二感光芯片的感光路径，所述第二感光芯片电连接于所述第二基板上。
根据本发明的一实施例，其中所述第二摄像模组包括至少一第二驱动器，其中所述第二镜头被安装于所述第二驱动器。
根据本发明的一实施例，其中所述第二摄像模组包括一摄像外壳，一防抖单元和一支承壳，其中所述摄像外壳、所述第二驱动器、所述防抖单元和所述支承壳相互同轴设置。
根据本发明的一实施例，其中所述第一摄像模组包括至少一第一镜头，至少一第一感光芯片，和至少一第一基板，其中所述镜头位于所述感光芯片的感光路径，所述感光芯片电连接于所述基板上。
根据本发明的一实施例，其中所述第一摄像模组包括至少一第一驱动器，其中所述第一镜头被安装于所述第一驱动器。
根据本发明的一实施例，其中所述棱镜单元主要包括一棱镜外壳，一棱镜，一棱镜座，一支承轴套和一支承轴，所述棱镜固定设置在所述棱镜座中，所述支承轴套固定安装在所述棱镜座的下部，所述支承轴可转动地安装在所述支承轴套中，所述棱镜座设置在所述棱镜外壳中。
根据本发明的一实施例，其中所述棱镜座和所述棱镜之间涂覆胶水以相互粘接。
根据本发明的一实施例，其中所述棱镜外壳呈矩形框，具有一底边框和两个侧边框，两个所述侧边框分别各自一端与所述底边框固定连接，其另一端为向外延伸的自由端，两个所述自由端之间设有一连接横梁。
根据本发明的一实施例，其中所述棱镜基座具有一第一摄像模组容纳腔和一棱镜模组容纳腔，其中所述第一摄像模组被容纳于第一摄像模组容纳腔，所述棱镜单元被容纳于棱镜模组容纳腔。
根据本发明的一实施例，其中所述棱镜基座包括一中间加强板，其沿着垂直于所述棱镜基座长度方向并在其整个宽度上贯穿棱镜基座延伸。
根据本发明的一实施例，其中所述第一摄像模组容纳腔的侧壁具有一第一开口，其用于施布所述第一摄像模组的电源/信号线，其中所述棱镜模组容纳腔的侧壁具有一第二开口，其用于施布用于控制所述棱镜的电源/控制信号线的开口。
根据本发明的一实施例，其中所述棱镜模组容纳腔的一侧设有一连接壁，其表面上设有至少一个定位柱或定位孔，以用于与所述第二摄像模组精准定位的连接。
根据本发明的一实施例，其中所述摄像外壳具有围绕形成中空矩形柱的一外壳部，固定连接在所述外壳部一端的一前面板，以及在所述外壳部侧面上形成两个凹陷的两个连接部。
根据本发明的一实施例，其中所述摄像外壳包括一光轴开孔和至少一定位孔或定位柱， 其中所述光轴开孔设置于所述前面板中央，所述定位孔或定位柱设置于所述前面板上。
根据本发明的一实施例，其中所述定位柱位于所述定位孔中，所述自由端与所述连接部相互配合并相互固定连接。
根据本发明的一实施例，其中所述第一摄像模组为广角摄像模组，所述第二摄像模组为变焦摄像模组，所述第一摄像模组的光轴与所述第二摄像模组的光轴相互垂直。
为达到以上至少一个目的，本发明提供一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S11)一分体式阵列摄像模组的至少一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
(S12)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
(S13)模组高度校准，测量所述每个校准模组与所述参考模组的镜头端面高度差，对所述校准模组作相应的高度位置校准；
(S14)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；
(S15)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；
(S16)模组偏移检验/校准，判断所述每个校准模组与所述参考模组的水平位置偏移量是否在公差允许范围内，若在公差范围内不作校准，若不在公差范围内返回步骤(S13)重新对所述每个校准模组做高度校准、偏移校准和旋转校准，直到所述每个校准模组与所述参考模组的水平位置偏移量在所述公差范围内；以及
(S17)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
根据本发明的一实施例，其中所述分体式阵列摄像模组包含一至多颗子模组，其中至少一颗子模组是所述参考模组，其余子模组为所述校准模组，所述子模组彼此之间相互独立并组装于所述组装支架。
根据本发明的一实施例，其中所述参考模组选择所述分体式阵列摄像模组中像素最高的一颗子模组。
根据本发明的一实施例，其中所述参考模组与所述校准模组都是完成了制造、组装并且性能测试合格的单体摄像模组。
根据本发明的一实施例，其中所述参考模组与所述参考单元的四周组装间隙为0.01-1mm，所述校准模组与所述校准单元的四周组装间隙为0.01-3mm。
根据本发明的一实施例，其中步骤(S11)中，所述参考模组组装固定的步骤还包括：
1)用一限位治具对所述参考模组与所述参考单元进行限位组装；以及
2)在所述参考模组与所述参考单元之间画胶水，固化所述胶水。
根据本发明的一实施例，其中所述胶水是一UV热固胶，通过紫外曝光将所述胶水固化。
根据本发明的一实施例，其中步骤(S13)中,所述模组高度校准具体包括：
1)测量所述参考模组和所述每个校准模组的镜头端面上的一个点的高度，分别计算出 所述每个校准模组与所述参考模组的镜头端面高度差值；以及
2)调整所述每个校准模组的Z轴位移。
根据本发明的一实施例，其中步骤(S14)中，所述模组偏移校准具体包括：
1)对所述参考模组与所述每个校准模组的镜头端面进行拍摄，抓取镜头端面图像，用软件分别计算出所述每个校准模组与所述参考模组的水平位置偏移量；以及
2)调整所述每个校准模组的X、Y轴位移。
根据本发明的一实施例，其中步骤(S15)中，所述标板中心为MTF测试标板，所述标板四角含有四个Mark点。
根据本发明的一实施例，其中步骤(S15)中，所述每个校准模组的旋转校准通过在U、V、W三个空间维度的运动来实现，目的是为了使所述每个校准模组与所述参考模组的光轴平行。
根据本发明的一实施例，其中步骤(S12)中，所述校准模组的预组装步骤具体包括：
1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的一固定治具上，所述参考模组放置于所述组装支架的参考单元内；
2)将所述校准模组安装并固定到一校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动；以及
3)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶。
根据本发明的一实施例，其中步骤(S17)中，所述分体式阵列摄像模组固定步骤具体包括：
1)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
2)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
根据本发明的一实施例，其中步骤(S12)中，所述校准模组的预组装步骤具体包括：
1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的固定治具上，所述参考模组放置于所述组装支架的参考单元内；以及
2)将所述校准模组安装并固定到校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动。
根据本发明的一实施例，其中步骤(S17)中，中所述分体式阵列摄像模组固定步骤具体包括：
1)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶；
2)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
3)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
根据本发明的一实施例，其中所述分体式阵列摄像模组在烤箱中的烘烤温度为50℃～ 200℃，烘烤时间5min～600min。
为达到以上至少一个目的，本发明提供一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S11A)一分体式阵列摄像模组的一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
(S12A)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
(S13A)模组高度/偏移校准，测量所述每个校准模组与所述参考模组的镜头端面高度差和水平位置偏移量，对所述校准模组作相应的高度位置校准和相应的水平偏移位置校准；
(S14A)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；以及
(S15A)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
为达到以上至少一个目的，本发明提供一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S11B)一分体式阵列摄像模组的一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
(S12B)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
(S13B)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；
(S14B)模组高度校准，测量所述每个校准模组与所述参考模组的镜头端面高度差，对所述校准模组作相应的高度位置校准；
(S15B)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；以及
(S16B)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
为达到以上至少一个目的，本发明提供一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S21)一分体式阵列摄像模组的一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
(S22)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
(S23)模组高度校准，测量所述每个校准模组与所述参考模组的镜头端面高度差，对所述校准模组作相应的高度位置校准；
(S24)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述 校准模组作相应的水平偏移位置校准；
(S25)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；
(S26)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；以及
(S27)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
根据本发明的一实施例，其中所述分体式阵列摄像模组包含一至多颗子模组，其中一颗子模组是所述参考模组，其余子模组为所述校准模组，所述子模组彼此之间相互独立并组装于所述组装支架。
根据本发明的一实施例，其中所述参考模组与所述校准模组都是完成了制造、组装并且性能测试合格的单体摄像模组。
根据本发明的一实施例，其中所述参考模组和所述校准模组分别为一可调焦摄像模组或一定焦摄像模组。
根据本发明的一实施例，其中所述参考模组为一可调焦摄像模组，所述校准模组为一定焦摄像模组。
根据本发明的一实施例，其中所述参考模组与所述参考单元的四周组装间隙为0.01-1mm，所述校准模组与所述校准单元的四周组装间隙为0.01-3mm。
根据本发明的一实施例，其中所述参考模组组装固定的步骤还包括：
1)用一限位治具对所述参考模组与所述参考单元进行限位组装；以及
2)在所述参考模组与所述参考单元之间画胶水，固化所述胶水。
根据本发明的一实施例，其中所述胶水是一UV热固胶，通过紫外曝光将所述胶水固化。
根据本发明的一实施例，其中所述模组高度校准具体包括：
1)用一激光测距方法各测量所述参考模组和所述每个校准模组的镜头端面上的一个点的高度，分别计算出所述每个校准模组与所述参考模组的镜头端面高度差值；以及
2)通过所述六轴平台调整所述每个校准模组的Z轴位移。
根据本发明的一实施例，其中所述模组偏移校准具体包括：
1)对所述参考模组与所述每个校准模组的镜头端面进行CCD拍摄，抓取镜头端面图像，用软件分别计算出所述每个校准模组与所述参考模组的水平位置偏移量；以及
2)通过所述六轴平台调整所述每个校准模组的X、Y轴位移。
根据本发明的一实施例，其中所述标板中心为MTF测试标板，所述标板含有2-20个Mark点。
根据本发明的一实施例，其中所述每个校准模组的旋转校准通过所述六轴平台在U、V、W三个空间维度的运动来实现，目的是为了使所述每个校准模组与所述参考模组的光轴平行。
根据本发明的一实施例，其中所述校准模组的预组装步骤具体包括：
1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的一固定治具上，所述参考模组放置于所述组装支架的参考单元内；
2)将所述校准模组安装并固定到一校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动；以及
3)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶。
根据本发明的一实施例，其中所述分体式阵列摄像模组固定步骤具体包括：
1)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
2)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
根据本发明的一实施例，其中所述校准模组的预组装步骤具体包括：
1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的一固定治具上，所述参考模组放置于所述组装支架的参考单元内；以及
2)将所述校准模组安装并固定到一校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动。
根据本发明的一实施例，其中所述分体式阵列摄像模组固定步骤具体包括：
1)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶；
2)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
3)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
根据本发明的一实施例，其中所述分体式阵列摄像模组在烤箱中的烘烤温度为50℃～200℃，烘烤时间5min～600min。
附图说明
图1是根据本发明的第一个优选实施例的一分体式阵列摄像模组的一俯视示意图。
图2是根据本发明的第一个优选实施例的一分体式阵列摄像模组的一前视示意图。
图3是根据本发明的第一个优选实施例的一分体式阵列摄像模组的一前视示意图。进一步说明零件相对关系。
图4是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第一变形实施例的一前视示意图。
图5是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第二变形实施例的一前视示意图。
图6是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第三变形实施例的一前视示意图。
图7是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第四变形实施例的一前视示意图。
图8是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第五变形实施例的 一前视示意图。
图9是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第六变形实施例的一前视示意图。
图10是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第七变形实施例的一前视示意图。
图11是根据本发明的第一个优选实施例的一分体式阵列摄像模组的第八变形实施例的一前视示意图。
图12是根据本发明的第一个优选实施例的一分体式阵列摄像模组的组装方法的一流程图。
图13是根据本发明的第一个优选实施例的一分体式阵列摄像模组在组装时搭配治具的示意图。
图14是根据本发明的第一个优选实施例的一分体式阵列摄像模组在组装时搭配治具的示意图。说明一参考模组与一限位治具的相对应关系。
图15是根据本发明的第一个优选实施例的一分体式阵列摄像模组在进行校准时的一标板的图形示意图。
图16是根据本发明的第一个优选实施例的另一分体式阵列摄像模组的组装方法的一流程图。
图17是根据本发明的第二个优选实施例的一分体式阵列摄像模组在组装后立体示意图。
图18是根据本发明的第二个优选实施例的一分体式阵列摄像模组的分解示意图。
图19是根据本发明的第二个优选实施例的一分体式阵列摄像模组的棱镜单元分解示意图。
图20是根据本发明的第二个优选实施例的一分体式阵列摄像模组的棱镜基座的立体示意图。
图21是根据本发明的第二个优选实施例的一分体式阵列摄像模组的棱镜单元组装到棱镜基座上的示意图。
图22是根据本发明的第二个优选实施例的一分体式阵列摄像模组的第二摄像模组的分解示意图。
图23是根据本发明的第二个优选实施例的一分体式阵列摄像模组的棱镜模组与第二摄像模组的相互连接的状态示意图。
图24是根据本发明的第二个优选实施例的一分体式阵列摄像模组逻辑示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、 “下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
如图1至3所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组，其中所述分体式阵列摄像模组是将多个已经完成独立制造组装后且质量合格的摄像模组成品组装集成在同一个支架上，以构成一个全新的阵列式摄像模组。这样所述分体式阵列摄像模组具有高良率、高组装效率、高资源利用率等显着优点。
根据本发明的这个优选实施例，所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述参考模组1实施为一可调焦摄像模组如13M可调焦摄像模组。所述校准模组2实施为一定焦摄像模组如2M定焦摄像模组。所述参考模组1与所述校准模组2分别是已经完成了制造、组装并且性能测试合格的单体摄像模组。可以理解的是，单体摄像模组也可以都是可调焦摄像模组，或者可以都是定焦摄像模组，或者一个是调焦摄像模组，另一个是定焦摄像模组。在这个作为举例的实施例中，所述分体式阵列摄像模组包括一个13M可调焦摄像模组作为所述参考模组1，以及一个2M定焦摄像模组作为所述校准模组2，其中所述参考模组1和所述校准模组2分别为独立的所述单体摄像模组。
如图1、图2所示，所述分体式阵列摄像模组进一步包括一组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。换言之，所述参考模组1组装于所述组装支架10的所述参考支架单元101，而所述校准模组2组装于同一个所述组装支架10的所述校准支架单元102。也就是说，所述参考模组1与所述校准模组2是组装于同一个所述组装支架。另外，为了保证所述双摄像头模组的成像质量，需要严格保证所述参考模组1与所述校准模组2的高度、光轴间距和光轴平行度，因此对所述参考模组1与所述校准模组2在所述组装支架10的所述参考支架单元101与所述校准支架单元102中的组装位置有严格的要求。另外，所述组装支架10由高硬度的金属和非金属材料所制，其中所述组装支架10的材料要求为受温度和湿度变化影响形变小，以用于固定所述参考模组1和所述校准模组2之间的空间位置。
在本实施例中，所述校准模组2与所述参考模组1之间的模组中心距离是10.5mm。所述参考模组1与所述参考支架单元101的四周组装间隙为0.1mm，所述校准模组2与所述校准支架单元102的四周组装间隙为0.3mm。
如图3所示，所述参考模组1还包括一参考镜头11，一参考驱动器12，一参考感光芯片13，一参考底座14和一参考基板15。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述 参考感光芯片13电连接于所述参考基板15上。所述参考底座14设置于所述参考基板15上。所述参考驱动器12被安装于所述参考底座14，所述参考镜头11被安装于所述参考驱动器12，以使得所述参考镜头11被支撑于所述参考基板15上方。所述参考基板15可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
另外，值得一提的是，所述参考底座14可以分离式地设置于所述参考基板15上，亦可经由模塑工艺形成于所述参考基板15上，其中通过模塑工艺一体地封装连接于所述参考基板15，其中模塑工艺可以是注塑或模压等工艺。另外，所述参考底座14围绕于所述参考感光芯片13外侧并形成一通孔，以提供所述参考镜头11和所述参考感光芯片13的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述参考基板15，其不为本发明的限制。
所述校准模组2还包括一校准镜头21，一校准感光芯片23，一校准底座24和一校准基板25。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述校准基板25上。所述校准底座24设置于所述校准基板25上。所述校准镜头21被支撑于所述校准底座24上方。所述校准基板25可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准驱动器22被安装于所述校准底座24，所述校准镜头21被安装于所述校准底座24，以使得所述校准镜头21被支撑于所述校准基板25上方。值得一提的是，所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。另外，所述参考感光芯片13和所述校准感光芯片23的分辨率接近，以保证图像成像质量。
另外，值得一提的是，所述校准底座24可以分离式地设置于所述校准基板25上，亦可经由模塑工艺形成于所述校准基板25上，其中通过模塑工艺一体地封装连接于所述校准基板25，其中模塑工艺可以是注塑或模压等工艺。另外，所述校准底座24围绕于所述校准感光芯片23外侧并形成一通孔，以提供所述校准镜头21和所述校准感光芯片23的光线通路。另外，所述校准感光芯片23可采用正装或倒装的方式安装于所述校准基板25，其不为本发明的限制。
另外，所述参考模组1和所述校准模组2采用不同的FOV镜头设计。换言之，所述参考模组1实施为大视场角镜头，其FOV一般在75°～120°之间，所述校准模组2实施为小视场角镜头，其FOV一般在20°～50°之间。特别地，所述参考模组1和所述校准模组2若都实施为变焦摄像模组，其变焦能力从2倍到6倍不等。也就是说，通过算法合成实现画质不损下的图像倍率放大，根据搭配不同倍率在2到6倍不等。另外，根据实际需求，可分别对小视场角镜头和大视场角镜头使用OIS或者AF对焦马达，其不为本发明的限制。可以理解的，在单体摄像模组中辅加OIS或者AF对焦功能，以增加光学变焦图像拍照质量。换言之，可选择性地在小视场角镜头和大视场角镜头使用OIS或者AF对焦功能，以提升光学变焦拍照效果。
另外，本领域的技术人员应理解，所述分体式阵列摄像模组可实施为不只一个双摄像头模组，也就是说可根据需要进行多个摄像头的搭配组合，其重点为将各别合格的所述单体摄像模组组装至所述组装支架10。换言之，所述分体式阵列摄像模组包含一至多颗子模组，其中一颗子模组是所述参考模组1，其余的子模组为所述校准模组2，所述子模组彼此之间相互独立并组装于所述组装支架10。
如图4所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第一变形实施例，其中所述分体式阵列摄像模组进一步包括一组装支架10和一共同底座20。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。
所述组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。
所述参考模组1还包括一参考镜头11，一参考驱动器12，一参考感光芯片13，和一参考基板15。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述参考基板15上。所述参考镜头11被安装于所述参考驱动器12。所述参考基板15可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
所述校准模组2还包括一校准镜头21，一校准感光芯片23，和一校准基板25。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述校准基板25上。所述校准基板25可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准镜头21被支撑于所述校准驱动器22上方。值得一提的是，所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
值得一提的，所述共同底座20设置于所述参考基板15和所述校准基板25上，这样所述参考模组1实施为可调焦摄像模组，所述校准模组2实施为定焦摄像模组时，所述参考驱动器12和所述校准镜头21都被安装于所述共同底座20。另外，当所述参考模组1和所述校准模组2都实施为可调焦摄像模组时，所述参考驱动器12和所述校准驱动器22都被安装于所述共同底座20。
另外，值得一提的是，所述共同底座20可以分离式地设置于所述参考基板15和所述校准基板25，亦可经由模塑工艺形成于所述参考基板15和所述校准基板25上，其中通过模塑工艺一体地封装连接于所述参考基板15和所述校准基板25，其中模塑工艺可以是注塑或模压等工艺。另外，所述共同底座20围绕于所述参考感光芯片13和所述校准感光芯片23外侧并分别形成一通孔，以提供所述参考感光芯片13和所述校准感光芯片23的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述参考基板15，所述校 准感光芯片23可采用正装或倒装的方式安装于所述校准基板25，其不为本发明的限制。
如图5所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第二变形实施例，其中所述分体式阵列摄像模组进一步包括一组装支架10，一共同底座20和一共同基板30。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。
所述组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。
所述参考模组1还包括一参考镜头11，一参考驱动器12和一参考感光芯片13。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述共同基板30上。所述参考镜头11被安装于所述参考驱动器12。所述共同基板30可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
所述校准模组2还包括一校准镜头21和一校准感光芯片23。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述共同基板30上。所述共同基板30可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准镜头21被支撑于所述校准驱动器22上方。值得一提的是，所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
值得一提的，所述共同底座20设置于所述共同基板30上，这样所述参考模组1实施为可调焦摄像模组，所述校准模组2实施为定焦摄像模组时，所述参考驱动器12和所述校准镜头21都被安装于所述共同底座20。另外，当所述参考模组1和所述校准模组2都实施为可调焦摄像模组时，所述参考驱动器12和所述校准驱动器22都被安装于所述共同底座20。
另外，值得一提的是，所述共同底座20可以分离式地设置于所述共同基板30，亦可经由模塑工艺形成于所述共同基板30上，其中通过模塑工艺一体地封装连接于所述共同基板30，其中模塑工艺可以是注塑或模压等工艺。另外，所述共同底座20围绕于所述参考感光芯片13和所述校准感光芯片23外侧并分别形成一通孔，以提供所述参考感光芯片13和所述校准感光芯片23的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述共同基板30，所述校准感光芯片23可采用正装或倒装的方式安装于所述共同基板30，其不为本发明的限制。
如图6所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第三变形实施例，其中所述分体式阵列摄像模组进一步包括一陀螺仪40，其设置于所述参考模组1。 所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。
所述参考模组1还包括一参考镜头11，一参考驱动器12，一参考感光芯片13，一参考底座14和一参考基板15。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述参考基板15上。所述参考底座14设置于所述参考基板15上。所述参考驱动器12被安装于所述参考底座14，所述参考镜头11被安装于所述参考驱动器12，以使得所述参考镜头11被支撑于所述参考基板15上方。所述参考基板15可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述陀螺仪40设置于所述参考基板15。所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
另外，值得一提的是，所述参考底座14可以分离式地设置于所述参考基板15上，亦可经由模塑工艺形成于所述参考基板15上，其中通过模塑工艺一体地封装连接于所述参考基板15，其中模塑工艺可以是注塑或模压等工艺。另外，所述参考底座14围绕于所述参考感光芯片13外侧并形成一通孔，以提供所述参考镜头11和所述参考感光芯片13的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述参考基板15，其不为本发明的限制。
如图7所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第四变形实施例，其中所述分体式阵列摄像模组进一步包括一陀螺仪40，其设置于所述校准模组2。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。
所述校准模组2还包括一校准镜头21，一校准感光芯片23，一校准底座24和一校准基板25。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述校准基板25上。所述校准底座24设置于所述校准基板25上。所述校准镜头21被支撑于所述校准底座24上方。所述校准基板25可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准驱动器22被安装于所述校准底座24，所述校准镜头21被安装于所述校准底座24，以使得所述校准镜头21被支撑于所述校准基板25上方。值得一提的是，所述陀螺仪40设置于所述校准基板25。所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
另外，值得一提的是，所述校准底座24可以分离式地设置于所述校准基板25上，亦 可经由模塑工艺形成于所述校准基板25上，其中通过模塑工艺一体地封装连接于所述校准基板25，其中模塑工艺可以是注塑或模压等工艺。另外，所述校准底座24围绕于所述校准感光芯片23外侧并形成一通孔，以提供所述校准镜头21和所述校准感光芯片23的光线通路。另外，所述校准感光芯片23可采用正装或倒装的方式安装于所述校准基板25，其不为本发明的限制。
如图8所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第五变形实施例，其中所述分体式阵列摄像模组进一步包括一陀螺仪40。所述分体式阵列摄像模组包括一组装支架10，一共同底座20。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述陀螺仪40设置于所述参考模组1。
所述参考模组1还包括一参考镜头11，一参考驱动器12，一参考感光芯片13，和一参考基板15。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述参考基板15上。所述参考镜头11被安装于所述参考驱动器12。所述参考基板15可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述陀螺仪40设置于所述参考基板15。所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
所述校准模组2还包括一校准镜头21，一校准感光芯片23，和一校准基板25。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述校准基板25上。所述校准基板25可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准镜头21被支撑于所述校准驱动器22上方。值得一提的是，所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
值得一提的，所述共同底座20设置于所述参考基板15和所述校准基板25上，这样所述参考模组1实施为可调焦摄像模组，所述校准模组2实施为定焦摄像模组时，所述参考驱动器12和所述校准镜头21都被安装于所述共同底座20。另外，当所述参考模组1和所述校准模组2都实施为可调焦摄像模组时，所述参考驱动器12和所述校准驱动器22都被安装于所述共同底座20。
另外，值得一提的是，所述共同底座20可以分离式地设置于所述参考基板15和所述校准基板25，亦可经由模塑工艺形成于所述参考基板15和所述校准基板25上，其中通过模塑工艺一体地封装连接于所述参考基板15和所述校准基板25，其中模塑工艺可以是注塑或模压等工艺。另外，所述共同底座20围绕于所述参考感光芯片13和所述校准感光芯片23外侧并分别形成一通孔，以提供所述参考感光芯片13和所述校准感光芯片23的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述参考基板15，所述校准感光芯片23可采用正装或倒装的方式安装于所述校准基板25，其不为本发明的限制。
如图9所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第六变形实 施例，其中所述分体式阵列摄像模组进一步包括一陀螺仪40。所述分体式阵列摄像模组包括一组装支架10，一共同底座20。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述陀螺仪40设置于所述校准模组2。
所述参考模组1还包括一参考镜头11，一参考驱动器12，一参考感光芯片13，和一参考基板15。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述参考基板15上。所述参考镜头11被安装于所述参考驱动器12。所述参考基板15可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
所述校准模组2还包括一校准镜头21，一校准感光芯片23，和一校准基板25。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述校准基板25上。所述校准基板25可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准镜头21被支撑于所述校准驱动器22上方。值得一提的是，所述陀螺仪40设置于所述校准基板25。所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
值得一提的，所述共同底座20设置于所述参考基板15和所述校准基板25上，这样所述参考模组1实施为可调焦摄像模组，所述校准模组2实施为定焦摄像模组时，所述参考驱动器12和所述校准镜头21都被安装于所述共同底座20。另外，当所述参考模组1和所述校准模组2都实施为可调焦摄像模组时，所述参考驱动器12和所述校准驱动器22都被安装于所述共同底座20。
另外，值得一提的是，所述共同底座20可以分离式地设置于所述参考基板15和所述校准基板25，亦可经由模塑工艺形成于所述参考基板15和所述校准基板25上，其中通过模塑工艺一体地封装连接于所述参考基板15和所述校准基板25，其中模塑工艺可以是注塑或模压等工艺。另外，所述共同底座20围绕于所述参考感光芯片13和所述校准感光芯片23外侧并分别形成一通孔，以提供所述参考感光芯片13和所述校准感光芯片23的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述参考基板15，所述校准感光芯片23可采用正装或倒装的方式安装于所述校准基板25，其不为本发明的限制。
如图10所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第七变形实施例，其中所述分体式阵列摄像模组进一步包括一组装支架10，一共同底座20，一共同基板30和一陀螺仪40。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。所述陀螺仪40设置于所述共同基板30上。
所述参考模组1还包括一参考镜头11，一参考驱动器12和一参考感光芯片13。所述 参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述共同基板30上。所述参考镜头11被安装于所述参考驱动器12。所述共同基板30可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述陀螺仪40电连接于所述参考模组1并设置于所述共同基板30上。所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
所述校准模组2还包括一校准镜头21和一校准感光芯片23。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述共同基板30上。所述共同基板30可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准镜头21被支撑于所述校准驱动器22上方。值得一提的是，所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
值得一提的，所述共同底座20设置于所述共同基板30上，这样所述参考模组1实施为可调焦摄像模组，所述校准模组2实施为定焦摄像模组时，所述参考驱动器12和所述校准镜头21都被安装于所述共同底座20。另外，当所述参考模组1和所述校准模组2都实施为可调焦摄像模组时，所述参考驱动器12和所述校准驱动器22都被安装于所述共同底座20。
另外，值得一提的是，所述共同底座20可以分离式地设置于所述共同基板30，亦可经由模塑工艺形成于所述所述共同基板30上，其中通过模塑工艺一体地封装连接于所述共同基板30，其中模塑工艺可以是注塑或模压等工艺。另外，所述共同底座20围绕于所述参考感光芯片13和所述校准感光芯片23外侧并分别形成一通孔，以提供所述参考感光芯片13和所述校准感光芯片23的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述共同基板30，所述校准感光芯片23可采用正装或倒装的方式安装于所述共同基板30，其不为本发明的限制。
如图11所示，是根据本发明的第一优选实施例的一分体式阵列摄像模组的第八变形实施例，其中所述分体式阵列摄像模组进一步包括一组装支架10，一共同底座20，一共同基板30和一陀螺仪40。所述分体式阵列摄像模组实施为一个双摄像头模组，其包含一参考模组1和一校准模组2。所述组装支架10，其具有一参考支架单元101和一校准支架单元102。这样所述参考模组1与所述校准模组2分别组装于所述组装支架10的所述参考支架单元101与所述校准支架单元102。所述陀螺仪40电连接所述校准模组2地设置于所述共同基板30上。
所述参考模组1还包括一参考镜头11，一参考驱动器12和一参考感光芯片13。所述参考镜头11位于所述参考感光芯片13的感光路径，从而在所述参考模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述参考镜头11的处理之后进一步被所述参考感 光芯片13接受以适于进行光电转化。所述参考感光芯片13电连接于所述共同基板30上。所述参考镜头11被安装于所述参考驱动器12。所述共同基板30可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述参考驱动器12可实施为马达、热驱动器或微制动器(MEMS)等。
所述校准模组2还包括一校准镜头21和一校准感光芯片23。所述校准镜头21位于所述校准感光芯片23的感光路径，从而在所述校准模组2用于采集物体的影像时，被物体反射的光线能够在藉由所述校准镜头21的处理之后进一步被所述校准感光芯片23接受以适于进行光电转化。所述校准感光芯片23电连接于所述共同基板30上。所述共同基板30可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述校准模组2实施为一个2M定焦摄像模组，故无包括驱动器。但是所述校准模组2亦可实施为变焦摄像模组，故所述校准模组2还可包括一校准驱动器22，其中所述校准镜头21被支撑于所述校准驱动器22上方。值得一提的是，所述陀螺仪40电连接所述校准模组2地设置于所述共同基板30上。所述校准驱动器22可实施为马达、热驱动器或微制动器(MEMS)等。
值得一提的，所述共同底座20设置于所述共同基板30上，这样所述参考模组1实施为可调焦摄像模组，所述校准模组2实施为定焦摄像模组时，所述参考驱动器12和所述校准镜头21都被安装于所述共同底座20。另外，当所述参考模组1和所述校准模组2都实施为可调焦摄像模组时，所述参考驱动器12和所述校准驱动器22都被安装于所述共同底座20。
另外，值得一提的是，所述共同底座20可以分离式地设置于所述共同基板30，亦可经由模塑工艺形成于所述共同基板30上，其中通过模塑工艺一体地封装连接于所述共同基板30，其中模塑工艺可以是注塑或模压等工艺。另外，所述共同底座20围绕于所述参考感光芯片13和所述校准感光芯片23外侧并分别形成一通孔，以提供所述参考感光芯片13和所述校准感光芯片23的光线通路。另外，所述参考感光芯片13可采用正装或倒装的方式安装于所述共同基板30，所述校准感光芯片23可采用正装或倒装的方式安装于所述共同基板30，其不为本发明的限制。
本发明的这个优选实施例中，如图12所示，是本发明第一优选实施例的第一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S11)一分体式阵列摄像模组的一参考模组1组装固定，即将所述参考模组1组装并固定在一组装支架10的一参考单元101内；
(S12)一分体式阵列摄像模组的至少一个校准模组2预组装，即将所述校准模组2预组装到所述组装支架10的一校准单元102内；
(S13)模组高度校准，测量所述每个校准模组2与所述参考模组1的镜头端面高度差，对所述每个校准模组2作相应的高度位置校准；
(S14)模组偏移校准，测量所述每个校准模组2与所述参考模组1的水平位置偏移量，对所述每个校准模组2作相应的水平偏移位置校准；
(S15)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组1和所述每个校准模组2采集得到的图像，利用软件计算出所述每个校准模组2的旋转校准量，并对所述校准模组2进行旋转位置校准；
(S16)模组偏移检验/校准，判断所述每个校准模组2与所述参考模组1的水平位置偏移量是否在公差允许范围内，若在公差范围内不作校准，若不在公差范围内返回步骤(S13)重新对所述每个校准模组2做高度校准、偏移校准和旋转校准，直到所述每个校准模组2与所述参考模组1的水平位置偏移量在所述公差范围内；以及
(S17)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
值得一提的是，步骤(S13)和步骤(S14)之间的顺序并无固定，即可互换。也就是说，根据需要可以先进行步骤(S13)再进行步骤(S14)，或者是先进行步骤(S4)再进行步骤(S13)，其中并不影所述体式阵列摄像模组的组装方法。值得一提的是，更可以直接把步骤(S13)和步骤(S14)合并为一个步骤，即为：模组水平校准，也就是对X、Y、Z轴进行校准，不限制先后顺序。
另外，步骤(S16)不一定要存在。换言之，模组校准的检验可在步骤(S13)、步骤(S14)和步骤(S15)进行校准时，同时检验完成，以简化组装工序。
另外，所述分体式阵列摄像模组包含一至多颗子模组，其中一颗子模组是所述参考模组1，其余子模组为所述校准模组2，所述子模组彼此之间相互独立并组装于所述组装支架10。特别地，所述参考模组1选择所述分体式阵列摄像模组中像素最高的一颗子模组。
本发明的这个优选实施例中，根据步骤(S11)，如图14所示，利用一限位治具30对所述参考模组1与所述组装支架10的所述参考单元101进行限位组装，其中用胶水将所述参考模组1与所述参考单元101的支架边框进行固定。优选地，所述胶水采用UV热固胶，画胶区域位于所述参考单元101的所述支架边框的上边缘，画胶完成后通过紫外曝光将所述UV热固胶预固化。值得一提的是，所述参考模组1与所述参考单元101的四周组装间隙为0.1mm。
换言之，其中步骤(S11)中，所述参考模组组装固定的步骤还包括：
1)用所述限位治具30对所述参考模组1与所述参考单元101进行限位组装；以及
2)在所述参考模组1与所述参考单元101之间画胶水，固化所述胶水。
根据步骤(S12)，如图13所示，将所述参考模组1与所述组装支架10安装并固定到一模组校准平台403的一固定治具401上，将所述校准模组2安装并固定到一校准治具402上，所述校准治具402设置在一六轴平台上，同时，所述校准模组2放置于所述组装支架10的所述校准单元102内，因此所述校准模组2可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动。值得一提的是，所述校准模组2与所述校准单元102的四周组装间隙为0.3mm。
根据步骤(S13)，透用一激光测距方法各测量所述参考模组1和所述校准模组2的所述镜头端面上的一个点的高度，接着分别计算出所述校准模组2与所述参考模组1的镜头端面高度差值，通过所述六轴平台调整所述校准模组2的Z轴位移。
换言之，其中步骤(S13)中，所述模组高度校准具体包括：
1)用所述激光测距方法各测量所述参考模组1和所述每个校准模组2的镜头端面上的一个点的高度，分别计算出所述每个校准模组2与所述参考模组1的镜头端面高度差值；以及
2)通过所述六轴平台调整所述每个校准模组2的Z轴位移。
根据步骤(S14)，对所述参考模组1与所述每个校准模组2的所述镜头端面进行CCD拍摄，抓取所述镜头端面图像，并利用软件计算出所述校准模组2与所述参考模组1的水平位置偏移量，根据所述的水平位置偏移量，通过所述六轴平台调整所述校准模组2的X、Y轴位移。
换言之，其中步骤(S14)中，所述模组偏移校准具体包括：
1)对所述参考模组1与所述每个校准模组2的镜头端面进行CCD拍摄，抓取镜头端面图像，用软件分别计算出所述每个校准模组1与所述参考模组1的水平位置偏移量；以及
2)通过所述六轴平台调整所述每个校准模组2的X、Y轴位移。
根据步骤(S15)，根据所述校准模组2的所述旋转校准量调整所述六轴平台的U、V、W旋转轴的旋转角，实现所述校准模组2的旋转校准。
根据步骤(S16)，所述校准模组2与所述参考模组1的X轴位置偏移量的公差为[10.4,10.6]mm，Y轴位置偏移量的公差为[-0.1,0.1]mm。
根据步骤(S17)，在所述校准模组2与所述校准单元102之间画胶水，所述胶水为一种UV热固胶，将所述校准模组2与所述校准单元102之间的所述UV热固胶在紫外曝光预固化，再将所述分体式阵列摄像模组拿到烤箱中烘烤，实现所有UV热固胶的固化，固定整个所述分体式阵列摄像模组并最终完成组装。
在本发明一个实施例中，所述限位治具30包括一第一凹槽301和一第二凹槽302，其分别从所述限位治具30的表面向内延伸以形成凹槽。所述第一凹槽301用来放置所述参考模组1，所述第二凹槽302用来放置所述组装支架10。
另外，如图14所示，其中步骤(S11)中所述参考模组1与所述限位治具30的组装步骤进一步地包括：
1)将所述参考模组1放置到所述限位治具30的所述第一凹槽301；
2)将所述组装支架10放置到所述限位治具30的所述第二凹槽302；
3)通过所述限位治具30的所述第一凹槽301和所述第二凹槽302的组装限位来控制所述参考模组1与所述组装支架10的组装位置误差。
值得一提的是，其中步骤(S11A)和(S11B)并无先后组装顺序，也就是说，可根据组装需求进而调整组装的先后顺序。
在本发明一个实施例中，步骤(S13)中，所述参考模组1的激光测高点位于所述参考模组1的所述镜头端面的上方，所述校准模组2的激光测高点与所述参考模组1的激光测高点之间的距离固定，其为所述校准模组2与所述参考模组1之间的模组中心距离，在本实施例中，此距离是10.5mm。可选地，对所述参考模组1与所述校准模组2的激光测高点各有三个，且分别取得平均值，从而得到更加精确的所述参考模组1与所述校准模组2的高度差，然而这种方法的测高效率相比一个测高点的方案要低很多。
在本发明一个实施例中，步骤(S15)中所述标板的图形示意图，如图15所示，所述标板中心是由多组横竖条纹组成的一MTF测试图形M1，用来对所述参考模组1进行调焦，所述标板的四角是四个圆形的Mark点M2，用来计算所述校准模组2的旋转校准量。进一步地，由于所述参考模组1是可调焦模组，在采集标板图像前需要对所述参考模组1进行调焦，所述MTF测试图形M1用来对所述参考模组1进行调焦，调整焦距直到使所述MTF测试图形 在所述参考模组1中成像最清晰，再去计算所述校准模组2的旋转校准量。进一步地，根据所述参考模组1和所述校准模组2拍摄得到的四个所述Mark点M2的位置坐标，可以分别计算出所述参考模组1和所述校准模组2的光轴倾斜，由此就可以计算出所述校准模组2的旋转校准量。
另外，若定义所述参考模组1和所述校准模组2的排列方向为X轴，其垂直方向为Y轴，在本实施例中，所述校准模组2与所述参考模组1之间的模组中心距离是10.5mm。值得一提的是，步骤(S16)中所述校准模组2与所述参考模组1的X轴位置偏移量的公差为[10.4,10.6]mm，Y轴位置偏移量的公差为[-0.1,0.1]mm，只要所述校准模组2与所述参考模组1的X、Y轴位置偏移量的其中任何一个值不在相应的公差范围内，就需要从步骤(S13)开始重新依次对所述校准模组2进行高度校准、偏移校准和旋转校准，直到所述校准模组2与所述参考模组1的X、Y轴位置偏移量都落在相应的公差范围内。
在本实施例中，步骤(S12)中并没有在所述校准模组2与所述校准单元102之间画胶，直到步骤(S17)中完成了所有校准工序后再在所述校准模组2与所述校准单元102之间画胶，本发明也可以将步骤(S17)中的所述校准模组2与所述校准单元102之间画胶工序放到步骤(S12)的最后，也就是说，先进行所述校准模组2与所述校准单元102之间的画胶，再对所述校准模组2的组装位置进行校准，校准完成后，步骤(S17)中，将所述胶水紫外曝光半固化，再对整个模组烘烤，完成组装。
优选地，步骤(S17)中，所述分体式阵列摄像模组在烤箱中的烘烤温度为80℃～90℃，烘烤时间50min～60min。
另外，在本实施例中所提及的简化组装工序，是将步骤(S13)和步骤(S14)整合或互换，以及将步骤(S16)简化。换言之，本发明第一优选实施例第一简化替代模式的一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S11A)一分体式阵列摄像模组的一参考模组1组装固定，即将所述参考模组1组装并固定在一组装支架10的一参考单元101内；
(S12A)一分体式阵列摄像模组的至少一个校准模组2预组装，即将所述校准模组2预组装到所述组装支架10的一校准单元102内；
(S13A)模组高度/偏移校准，测量所述每个校准模组2与所述参考模组1的镜头端面高度差和水平位置偏移量，对所述每个校准模组2作相应的高度位置校准和相应的水平偏移位置校准；
(S14A)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组1和所述每个校准模组2采集得到的图像，利用软件计算出所述每个校准模组2的旋转校准量，并对所述校准模组2进行旋转位置校准；以及
(S15A)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
在本实施例中，所述分体式阵列摄像模组包含一至多颗子模组，其中一颗子模组是所述参考模组1，其余子模组为所述校准模组2，所述子模组彼此之间相互独立并组装于所述组装支架10。所述参考模组1与所述校准模组2都是完成了制造、组装并且性能测试合格的单体摄像模组。所述参考模组1可实施为一13M可调焦摄像模组。所述校准模组2可实 施为一2M定焦摄像模组。另外，所述参考模组与所述参考单元的四周组装间隙为0.1mm，所述校准模组与所述校准单元的四周组装间隙为0.3mm。
本发明第一优选实施例第二简化替代模式的一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S11B)一分体式阵列摄像模组的一参考模组1组装固定，即将所述参考模组1组装并固定在一组装支架10的一参考单元101内；
(S12B)一分体式阵列摄像模组的至少一个校准模组2预组装，即将所述校准模组2预组装到所述组装支架10的一校准单元102内；
(S13B)模组偏移校准，测量所述每个校准模组2与所述参考模组1的水平位置偏移量，对所述每个校准模组2作相应的水平偏移位置校准；
(S14B)模组高度校准，测量所述每个校准模组2与所述参考模组1的镜头端面高度差，对所述每个校准模组2作相应的高度位置校准；
(S15B)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组1和所述每个校准模组2采集得到的图像，利用软件计算出所述每个校准模组2的旋转校准量，并对所述校准模组2进行旋转位置校准；以及
(S16B)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
如图16所示，是本发明第一优选实施例的第二一分体式阵列摄像模组的组装方法的示意图，与第一实施例的不同之处在于，步骤(S26)中不对所述校准模组2与所述参考模组1的水平位置偏移量设置公差范围，不管所述校准模组2与所述参考模组1的水平位置偏移量是多少，直接根据测量得到的两者的水平位置偏移量，通过六轴平台来调整校准模组的X、Y轴位移，即步骤(S26)重复步骤(S24)。第二个实施例的组装方式相比第一个实施例的组装方式校准效率更高，但是校准质量会相对较低，在具体实施时需要根据所述分体式阵列摄像模组的特点来对上述两种方案进行选择。
换言之，本发明第二优选地实施例的一分体式阵列摄像模组的组装方法，其包括如下步骤：
(S21)一分体式阵列摄像模组的一参考模组1组装固定，即将所述参考模组1组装并固定在一组装支架10的一参考单元101内；
(S22)一分体式阵列摄像模组的至少一个校准模组2预组装，即将所述校准模组2预组装到所述组装支架10的一校准单元102内；
(S23)模组高度校准，测量所述每个校准模组2与所述参考模组1的镜头端面高度差，对所述每个校准模组2作相应的高度位置校准；
(S24)模组偏移校准，测量所述每个校准模组2与所述参考模组1的水平位置偏移量，对所述每个校准模组2作相应的水平偏移位置校准；
(S25)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组1和所述每个校准模组2采集得到的图像，利用软件计算出所述每个校准模组2的旋转校准量，并对所述校准模组2进行旋转位置校准；
(S26)模组偏移校准，测量所述每个校准模组2与所述参考模组1的水平位置偏移量， 对所述每个校准模组2作相应的水平偏移位置校准；以及
(S27)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
在本发明第一优选实施例第一简化替代模式和第二简化替代模式以及第二优选地实施例中，共同包含下面内容：
优选地，所述参考模组组装固定的步骤还包括：
1)用一限位治具30对所述参考模组1与所述参考单元101进行限位组装；以及
2)在所述参考模组1与所述参考单元101之间画胶水，固化所述胶水。
特别地，所述胶水是一UV热固胶，通过紫外曝光将所述胶水固化。
优选地，所述模组高度校准具体包括：
1)用一激光测距方法各测量所述参考模组1和所述每个校准模组2的镜头端面上的一个点的高度，分别计算出所述每个校准模组2与所述参考模组1的镜头端面高度差值；以及
2)通过所述六轴平台调整所述每个校准模组2的Z轴位移。
优选地，所述模组偏移校准具体包括：
1)对所述参考模组1与所述每个校准模组2的镜头端面进行CCD拍摄，抓取镜头端面图像，用软件分别计算出所述每个校准模组2与所述参考模组1的水平位置偏移量；以及
2)通过所述六轴平台调整所述每个校准模组的X、Y轴位移。
在本实施例中，所述标板中心为MTF测试标板，所述标板四角含有四个圆形Mark点。
优选地，所述每个校准模组的旋转校准通过所述六轴平台在U、V、W三个空间维度的运动来实现，目的是为了使所述每个校准模组与所述参考模组的光轴平行。
优选地，所述校准模组的预组装步骤具体包括：
1)将所述参考模组与所述组装支架安装并固定到一模组校准平台403的一固定治具401上，所述参考模组放置于所述组装支架的参考单元内；
2)将所述校准模组安装并固定到一校准治具402上，所述校准治具402设置在六轴平台上，所述校准模组2放置于所述组装支架10的校准单元102内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动；以及
3)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶。
配合上述的所述校准模组的预组装步骤，其中所述分体式阵列摄像模组固定步骤具体包括：
1)对所述校准模组2与所述校准单元102之间的所述胶水进行紫外曝光，所述胶水半固化；以及
2)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
优选地，所述校准模组的预组装步骤具体包括：
1)将所述参考模组1与所述组装支架10安装并固定到所述模组校准平台403的所述固定治具401上，所述参考模组1放置于所述组装支架的参考单元101内；以及
2)将所述校准模组安装并固定到一校准治具402上，所述校准治具402设置在六轴平台上，所述校准模组放置于所述组装支架10的校准单元102内，所述校准模组可以随着所 述六轴平台作X、Y、Z、U、V、W六个空间维度的运动。
配合上述的所述校准模组的预组装步骤，其中所述分体式阵列摄像模组固定步骤具体包括：
1)在所述校准模组2与所述校准单元102之间画胶水，所述胶水为一种UV热固胶；
2)对所述校准模组2与所述校准单元102之间的所述胶水进行紫外曝光，所述胶水半固化；以及
3)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
特别地，所述分体式阵列摄像模组在烤箱中的烘烤温度为80℃～90℃，烘烤时间50min～60min。
本发明提出所述分体式阵列摄像模组的组装方法，所述分体式阵列摄像模组指由一个以上彼此之间完全独立的并且检验合格的摄像模组成品通过一个共同的组装支架集成组装而成的阵列式摄像模组。在所述阵列模组的组装过程中不仅要严格控制每个子模组之间的模组高度，而且要严格控制每个子模组之间光轴间距和光轴平行度，为了解决上述技术问题，本专利分体式阵列摄像模组的组装方法采取的技术方案为：将所述分体式阵列摄像模组中的一个子模组作为参考模组1，其它子模组作为校准模组2，先所述将参考模组1组装固定在所述组装支架10上，再以所述参考模组1作为参考标准依次对所述校准模组2的高度(Z轴)、水平偏移(X、Y轴)、旋转(U、V、W轴)共六个轴的组装位置进行校准，校准完成后将校准完成的所述校准模组2与所述组装支架10固定，完成所述分体式阵列摄像模组的组装工序。上述分体式阵列摄像模组的组装方法不仅提升了模组生产效率、良率和模组质量，而且能实现生产资源的高度利用。
如图17-24所示，是根据本发明的第二优选实施例的一分体式阵列摄像模组，其中所述分体式阵列摄像模组是将多个已经完成独立制造组装后且质量合格的摄像模组或棱镜模组成品组装集成为一个全新的阵列式摄像模组。这样所述分体式阵列摄像模组具有高良率、高组装效率、高资源利用率等显着优点。
根据本发明的这个优选实施例，所述分体式阵列摄像模组实施为一个双摄变焦模组，其包含一第一摄像模组1，一棱镜模组2，一第二摄像模组3和一电路板4。如图所示，所述第一摄像模组1可拆解的耦合连接所述棱镜模组2，并且所述第二摄像模组3装置于所述棱镜模组2和所述电路板4之间。进一步地说，所述第一摄像模组1设置在整个双摄变焦模组的最左侧，其后设置着所述棱镜模组2。并且如图17和18所示，根据本发明的一种实施方式，将所述第一摄像模组1和所述棱镜模组2相互组装后，与所述第二摄像模组3相互固定连接。在实现这种连接的时候，要求两者相互严格定位并对齐，这样才能保证所述棱镜模组2中折射出的光线与所述第二摄像模组3中的摄像镜头的光轴同心或同轴。这种定位的结构将在后面结合相关附图做进一步详细描述。在本实施方式中，固定有所述第一摄像模组1的所述棱镜模组2与所述第二摄像模组3相互定位后，利用激光焊接或粘接将两者相互固定连接。所述电路板4可以预先组装在所述第二摄像模组3上，然后再将所述第一摄像模组1的所述棱镜模组2与所述第二摄像模组3相互固定连接。也可以先将所述第一摄像模组1的所述棱镜模组2与所述第二摄像模组3相互固定连接，然后再将所述电 路板4固定连接在所述第二摄像模组3上。至此，根据本发明的双摄变焦模组组装完成，形成如图17所示的完整的双摄变焦模组。
根据本实施例，图24所示，所述第一摄像模组1包括一第一镜头100A，一第一驱动器300A，一第一感光芯片200A，和一第一基板400A。所述第一镜头100A位于所述第一感光芯片200A的感光路径，从而在所述第一摄像模组1用于采集物体的影像时，被物体反射的光线能够在藉由所述第一镜头100A的处理之后进一步被所述第一感光芯片200A接受以适于进行光电转化。所述第一感光芯片200A电连接于所述第一基板400A上。所述第一镜头100A被安装于第一所述驱动器300A。所述第一基板400A第一可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述第一驱动器300A可实施为马达、热驱动器或微制动器(MEMS)等。
根据本实施例，所述棱镜模组2包括一棱镜单元201和一棱镜基座202。所述棱镜基座202呈长方形形状并设有两个位置，其中一个位置用于容纳所述棱镜单元201，另一个用于容纳所述第一摄像模组1。这样设置使得所述第一摄像模组1和所述棱镜单元201相互安装在一个底板或平面上，或者说所述第一摄像模组1和所述棱镜单元201是共平面设置的。这样就消除了将所述第一摄像模组1和所述棱镜单元201设置在不同基座上所产生的相互之间的位置误差。这种布置方式以简单的结构保证了进入所述第一摄像模组1和所述棱镜单元201的光线平行度，也就是保证了成像质量。
图19以分解示意图的方式表示了根据本发明的双摄变焦模组中所述棱镜模组2中的所述棱镜单元201。
如图19所示，所述棱镜单元201主要包括一棱镜外壳2011、一棱镜2012、一棱镜座2013、一支承轴套2014、一支承轴2015和一支承卡座2016。所述棱镜外壳2011是一个由三个侧壁或边框围成的矩形框，三个侧壁或边框分别是一底边框2011a和两个侧边框2011b。其中的两个所述侧边框2011b的结构和形状相同，并且相互相对布置。在两个所述侧边框2011b的一端设有所述底边框2011a。由此形成一个大约呈U字形的框架。这个框架是一侧开口或敞开的矩形框架。可以理解的，U字形的所述框架的侧开口即设置于所述底边框2011a的相对侧。两个所述侧边框2011b分别以各自一端与所述底边框2011a固定连接，其另一端则为向外延伸的自由端2011c，即在所述自由端2011c处形成所述侧开口。在本实施方式中，这两个所述自由端2011c用于与顺序设置于其后的所述第二摄像模组3相互连接。在两个所述自由端2011c之间还设有一连接横梁2011d。所述连接横梁2011d一方面用于固定两个所述自由端2011c之间的距离，使其能够更加精准地与后面的所述第二摄像模组3衔接定位后相互固定连接；另一方面，所述连接横梁2011d还起到遮挡有可能在连接缝隙处泄漏到所述棱镜2012与所述第二摄像模组3之间的空间中的光线。这有利于提高成像质量。所述连接横梁2011d提高了所述棱镜外壳2011的整体刚度，并有效地防止不需要的光线进入根据本发明的双摄变焦模组中。值得一提的，所述连接横梁2011d可实施为一长条或一矩形框。可以理解的，所述连接横梁2011d若为所述长条即设置于两个所述侧边框2011b上，且于两个所述自由端2011c之间。所述连接横梁2011d若为所述矩形框即位于所述底边框2011a和两个所述侧边框2011b上部，并使所述矩形框的其中一边位于两个所述自由端2011c之间。
如图19所示，所述种棱镜单元201还包括所述棱镜2012、所述棱镜座2013、所述支承轴套2014和所述支承轴2015。所述棱镜2012固定设置在所述棱镜座2013中，从图中可以清晰地看出，在组装状态下，所述棱镜2012的上表面突出于所述棱镜座2013。所述支承轴套2014固定安装在所述棱镜座2013的下部，即所述棱镜座2013上的与安装所述棱镜2012的位置相对的另一侧。所述支承轴2015可转动地安装在所述支承轴套2014中。
如图19所示，所述棱镜2012的横截面基本呈直角三角形，图中所示的所述棱镜2012处于横置的状态。如图所示，直角三角形的一条直角边所在的平面朝上设置。这样，棱所述镜2012上直角三角形的斜边所在平面面对所述棱镜座2013，并支承于其中。
如图19所示，在根据本发明的一种实施方式中，所述支承轴套2014与所述支承轴2015相互配合地用于支承整个所述棱镜座2013和所述棱镜2012，使之可以围绕所述支承轴2015转动。
在如图19所示的根据本发明的一种实施方式中，首先在所述棱镜座2013中涂覆粘接用的胶水，然后将所述棱镜2012放入棱镜座2013中并使胶水固化，从而将所述棱镜2012与所述棱镜座2013相互粘接牢固。将所述支承轴套2014放入所述棱镜座2013上的所述通孔2013a中，并将其固定。通过所述支承轴2015将已经组装了所述棱镜2012的所述棱镜座2013可转动地支承在所述棱镜基座202上，再将所述棱镜外壳2011安装在所述棱镜座2013之上。
在根据本发明的实施方式中，在所述棱镜座2013上还设有用于驱动所述棱镜座2013运动的磁铁，在所述棱镜基座202上设有用于与上述驱动所述棱镜座2013运动的磁铁相互配合的线圈以及电路。由此形成驱动所述棱镜2012运动的驱动装置。在该驱动装置的驱动下，所述棱镜2012相对所述支承轴2015转动或移动，从而实现所述棱镜2012在不同自由度上的调整运动。
图20以立体图的形式示出了所述棱镜基座202的具体形状和结构。如图所示，所述棱镜基座202呈长方形，其具有一底板2025为一个长方形的平板。在所述底板2025的一个表面上，设有沿其边长延伸的一定位框壁2026。如图所示，在根据本发明的这种实施方案中，所述定位框壁2026并不是连续地围绕所述底板2025的整个边长延伸，而是间断延伸的。特别地，所述定位框壁2026围绕于所述底板2025时，在当中形成一第一开口2028。
图20所示的所述棱镜基座202由一中间隔壁2027分割成两个不同腔室，其中一个用于容纳或布置所述棱镜单元201的是一棱镜模组容纳腔2022。另一个用于容纳所述第一摄像模组1的是一第一摄像模组容纳腔2021。值得一提的，所述第一开口2028形成在所述第一摄像模组容纳腔2021的侧壁。另外，亦有一第二开口2029形成于棱镜模组容纳腔2022的侧壁。如图中所示，所述第一开口2028用于施布所述第一摄像模组1的电源/信号线。同理，所述第二开口2029也是用于施布用于控制所述棱镜2012的电源/控制信号线的开口。
在所述棱镜模组容纳腔2022的一侧设有一连接壁2023，所述连接壁2023用于与所述第二摄像模组3连接，同时还起着在与所述第二摄像模组3相互连接的时候使两者相互精准定位的作用。进一步地说，所述连接壁2023设置于所述中间隔壁2027的相对侧。在所述棱镜模组容纳腔2022中，还设有用于支承所述支承轴2015的支承座。所述支承轴2015固定支承在所述支承座上，从而使所述棱镜2012能够在驱动机构的驱动下运动。
根据本发明，在所述棱镜基座202上分别设置所述第一摄像模组1和所述棱镜模组2。这种设置的目的之一在于使所述棱镜单元201与所述第一摄像模组1中的镜头所构成的有效光学区域相互对准。这对于成像质量非常重要。但是，当将两个部件或单元同时设置在所述棱镜基座202上时，导致所述棱镜基座202承担着两个具有一定重量的零件。这样，所述棱镜基座202的中间部位成为整个基座上相对脆弱的部位。当根据本发明的双摄变焦模组在使用过程中受到比较强烈的冲击或振动时，所述棱镜基座202会在中间部位断裂。
为了避免所述棱镜基座202的中间部位断裂，根据本发明在其中间部位设置了一中间加强板2024。从图20可以看出，所述中间加强板2024沿着垂直于所述棱镜基座202长度方向、在其整个宽度上贯穿棱镜基座202延伸。中间加强板2024具有一定的厚度，从而增强了所述棱镜基座202中间部位的强度。有效地避免所述中间加强板2024断裂或损坏。此外，所述中间加强板2024提高了所述棱镜基座202的整体刚性，使得所述第一摄像模组1和所述棱镜单元201的安装基础更加牢固，两者之间的位置关系得以保证。
参见图21可以看出，所述棱镜基座202端部的所述连接壁2023的另一个表面上设有至少一定位凸起2030。在根据本发明的这种实施方式中，设置了四个所述定位凸起2030。这四个所述定位凸起2030分布在所述连接壁2023表面的四个角上。这些所述定位凸起2030用于与后面的所述第二摄像模组3上的所述摄像壳体301上的所述定位孔301c相互配合，确定所述棱镜基座202与所述第二摄像模组3之间的连接位置，保证所述棱镜2012的光学轴线与所述第二摄像模组3中的镜头的光学轴线相互同轴。与此同时，在所述连接壁2023的中心部位还开设有用于使光线通过的一通孔。由所述棱镜2012折射的光线将通过这个通孔，进入所述第二摄像模组3中，穿过其中的镜头到达感光芯片。
图21中还清楚地示出所述棱镜外壳2011的所述自由端2011c。根据本发明的这种实施方式中，这两个所述自由端2011c用于与后面的所述第二摄像模组3固定连接。后面将对此做进一步详细描述。
根据本实施例，图24所示，所述第二摄像模组3包括一第二镜头102A，一第二驱动器302A，一第二感光芯片202A，和一第二基板402A。所述第二镜头102A位于所述第二感光芯片202A的感光路径，从而在所述第一二摄像模组3用于采集物体的影像时，被物体反射的光线能够在藉由所述第二镜头102A的处理之后进一步被所述第二感光芯片202A接受以适于进行光电转化。所述第二感光芯片202A电连接于所述第二基板402A上。所述第二镜头102A被安装于第二所述驱动器302A。所述第二基板402A第一可以被耦接至所述电子设备，从而与所述电子设备配合使用。值得一提的是，所述第二驱动器302A可实施为马达、热驱动器或微制动器(MEMS)等。
另外，图22示出了根据本发明的所述第二摄像模组3的部分结构。
在根据本发明的一种实施方式中，所述第二摄像模组3包括一摄像外壳301A。如图22所示，所述摄像外壳301A呈中空矩形柱状，具有围绕形成中空矩形柱的一外壳部301a，以及固定连接在所述外壳部301a一端的一前面板301e。如图22所示，所述前面板301e的长度小于所述摄像外壳301A的宽度，因为在所述摄像外壳301A沿宽度方向的两端分别设有两个连接部301b。这两个所述连接部301b是在所述摄像外壳301A侧面上的两个凹陷。结合图5所示的所述棱镜外壳2011可以看出，在装配状态下，所述棱镜外壳2011的所述自 由端2011c贴嵌在所述摄像外壳301A端部两侧的这两个凹陷的所述连接部301b处，然后通过激光焊接或粘接将两者固定连接在一起。
如图22所示，在所述前面板301e设置有至少一个定位孔301c。在根据本发明的这种实施方式中，在所述前面板301e的四个角上设置有四个所述定位孔301c。在将所述第二摄像模组3与安装有所述棱镜单元201和所述第一摄像模组1的所述棱镜基座202相互组合固定时，这些所述定位孔301c起定位作用，并且做所述棱镜2012的光学轴线与所述第一摄像模组1中的镜头的光学轴线和所述第二摄像模组3中的镜头的光学轴线相互同轴。
图22中还示意性的表示了根据本发明的这种实施方式中的一第二驱动器302A，一防抖单元303和一支承壳304。这些部件相互同轴设置，所述第二驱动器302A安装在所述防抖单元303中，并可在驱动机构的驱动下在所述防抖单元303中移动以抵消抖动造成的偏差。所述防抖单元303整体地安装在所述支承壳304中，并可在所述支承壳304中移动，以带动摄像模组中的镜头进行调焦。
图22中仅仅示意性表示了根据本发明的所述第二摄像模组3的组成部分，并未具体详细表示例如驱动磁铁、相应的霍尔传感器等。
图23示意性表示了在根据本发明的一种实施方式中所述棱镜模组2与所述第二摄像模组3的相互连接状态。
在将所述棱镜单元201整体地安装到所述棱镜基座202上以后，便得到如图21所示的所述棱镜单元201与所述棱镜基座202的组合。然后在所述棱镜基座202面对所述第二摄像模组3的端面上涂覆粘接胶水，并在所述第二摄像模组3的相应端面的所述摄像外壳301的所述前面板301e上也附涂粘接胶水。
然后，将所述棱镜基座202上的四个所述定位凸起2030与所述第二摄像模组3的所述摄像外壳301上的四个所述定位孔301c相互对齐，然后插入所述定位孔301c中。这样，便可保证所述第二摄像模组3和所述棱镜单元201相互严格对齐。
在实现上述对齐之后，所述棱镜外壳2011的所述自由端2011c贴嵌在所述摄像外壳301端部两侧的这两个凹陷的所述连接部301b处。对所述自由端2011c与所述连接部301b施以激光焊接或也是通过涂覆胶水实施粘接，将两者固定连接。连接后得到如图23所示的组合，但图23中省略了所述第一摄像模组1以及相应的位于最右侧的所述电路板4。所述电路板4可以通过粘接等方式连接于所述第二摄像模组3的后面。另外，所述电路板4亦可通过结构的配合，像螺纹或卡勾配合，连接于所述第二摄像模组3的后面。这不为本发明的限制。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (74)

  1. 一分体式阵列摄像模组，其特征在于，包括：
    多颗子模组，其中至少一颗子模组为参考模组，其余子模组为校准模组；以及
    一组装支架，其中所述参考模组和所述每个校准模组分别组装于所述组装支架，其中所述参考模组和每个校准模组则分别为独立且合格的单体摄像模组。
  2. 根据权利要求1所述的分体式阵列摄像模组，其中所述参考模组为一可调焦摄像模组或一定焦摄像模组。
  3. 根据权利要求2所述的分体式阵列摄像模组，其中所述校准模组为一可调焦摄像模组或一定焦摄像模组。
  4. 根据权利要求3所述的分体式阵列摄像模组，其中所述组装支架具有至少一参考单元和至少一校准单元，其中所述参考模组与所述校准模组分别组装于所述组装支架的所述参考单元与所述校准单元。
  5. 根据权利要求4所述的分体式阵列摄像模组，其中所述校准模组与所述参考模组之间的模组中心距离是1-100mm。
  6. 根据权利要求5所述的分体式阵列摄像模组，其中所述参考模组与所述参考单元的四周组装间隙为0.01-1mm，所述校准模组与所述校准单元的四周组装间隙为0.03-3mm。
  7. 根据权利要求1所述的分体式阵列摄像模组，其中所述参考模组还包括至少一参考镜头，至少一参考驱动器以及至少一参考感光芯片，其中所述参考镜头位于所述参考感光芯片的感光路径，所述参考镜头被安装于所述参考驱动器。
  8. 根据权利要求7所述的分体式阵列摄像模组，其中所述校准模组还包括至少一校准镜头和一至少校准感光芯片，其中所述校准镜头位于所述校准感光芯片的感光路径。
  9. 根据权利要求8所述的分体式阵列摄像模组，其中所述参考模组还包括至少一参考底座和至少一参考基板，其中所述参考感光芯片电连接于所述参考基板上，所述参考底座设置于所述参考基板上，所述参考驱动器被安装于所述参考底座。
  10. 根据权利要求9所述的分体式阵列摄像模组，其中所述校准模组还包括至少一校准底座和至少一校准基板，其中所述校准感光芯片电连接于所述校准基板上。所述校准底座设置于所述校准基板上。
  11. 根据权利要求8所述的分体式阵列摄像模组，其中所述分体式阵列摄像模组包括至少一共同底座，所述参考模组还包括至少一参考基板，所述校准模组还包括至少一校准基板，其中所述参考感光芯片电连接于所述参考基板上，所述校准感光芯片电连接于所述校准基板上，所述共同底座设置于所述参考基板和/或所述校准基板上。
  12. 根据权利要求8所述的分体式阵列摄像模组，其中包括至少一共同底座和至少一共同基板，其中所述参考感光芯片和所述校准感光芯片电连接于所述共同基板上，所述共同底座设置于所述共同基板上，所述参考驱动器和所述校准镜头都被安装于所述共同底座。
  13. 根据权利要求9所述的分体式阵列摄像模组，其中包括一陀螺仪，其设置于所述参考模组的所述参考基板。
  14. 根据权利要求10所述的分体式阵列摄像模组，其中包括一陀螺仪，其设置于所述校准模组的所述校准基板。
  15. 根据权利要求11所述的分体式阵列摄像模组，其中包括一陀螺仪，其设置于所述所述参考模组的所述参考基板。
  16. 根据权利要求11所述的分体式阵列摄像模组，其中包括一陀螺仪，其设置于所述校准模组的所述校准基板。
  17. 根据权利要求12所述的分体式阵列摄像模组，其中包括一陀螺仪，其电连接于所述参考模组并设置于所述共同基板上。
  18. 根据权利要求12所述的分体式阵列摄像模组，其中包括一陀螺仪，其电连接所述校准模组地设置于所述共同基板上。
  19. 根据权利要求7所述的分体式阵列摄像模组，其中所述参考驱动器系选自由马达、热驱动器或微致动器所构成的群组。
  20. 根据权利要求8所述的分体式阵列摄像模组，其中所述校准模组还可包括一校准驱动器，其中所述校准镜头被支撑于所述校准驱动器上方。
  21. 根据权利要求1所述的分体式阵列摄像模组，其中所述参考模组实施为大视场角镜头，其FOV一般在60°～220°之间，所述校准模组实施为小视场角镜头，其FOV一般在10°～90°之间。
  22. 一分体式阵列摄像模组，其特征在于，包括：
    至少一第一摄像模组，至少一棱镜模组，至少一第二摄像模组，以及至少一电路板，其中所述第一摄像模组与所述棱镜模组共平面设置，所述棱镜模组与所述第二摄像模组光轴同心设置，所述电路板连接在所述第二摄像模组上。
  23. 根据权利要求22所述的分体式阵列摄像模组，其中所述棱镜模组包括一棱镜单元和一棱镜基座，所述棱镜单元可转动地支承在所述棱镜基座中。
  24. 根据权利要求23所述的分体式阵列摄像模组，其中所述第二摄像模组包括至少一第二镜头，至少一第二感光芯片，和至少一第二基板，其中其中所述第二镜头位于所述第二感光芯片的感光路径，所述第二感光芯片电连接于所述第二基板上。
  25. 根据权利要求24所述的分体式阵列摄像模组，其中所述第二摄像模组包括至少一第二驱动器，其中所述第二镜头被安装于所述第二驱动器。
  26. 根据权利要求25所述的分体式阵列摄像模组，其中所述第二摄像模组包括一摄像外壳，一防抖单元和一支承壳，其中所述摄像外壳、所述第二驱动器、所述防抖单元和所述支承壳相互同轴设置。
  27. 根据权利要求23-26中任一所述的分体式阵列摄像模组，其中所述第一摄像模组包括至少一第一镜头，至少一第一感光芯片，和至少一第一基板，其中所述镜头位于所述感光芯片的感光路径，所述感光芯片电连接于所述基板上。
  28. 根据权利要求27所述的分体式阵列摄像模组，其中所述第一摄像模组包括至少一第一驱动器，其中所述第一镜头被安装于所述第一驱动器。
  29. 根据权利要求28所述的分体式阵列摄像模组，其中所述棱镜单元主要包括一棱镜外壳，一棱镜，一棱镜座，一支承轴套和一支承轴，所述棱镜固定设置在所述棱镜座中， 所述支承轴套固定安装在所述棱镜座的下部，所述支承轴可转动地安装在所述支承轴套中，所述棱镜座设置在所述棱镜外壳中。
  30. 根据权利要求29所述的分体式阵列摄像模组，其中所述棱镜座和所述棱镜之间涂覆胶水以相互粘接。
  31. 根据权利要求29所述的分体式阵列摄像模组，其中所述棱镜外壳呈矩形框，具有一底边框和两个侧边框，两个所述侧边框分别各自一端与所述底边框固定连接，其另一端为向外延伸的自由端，两个所述自由端之间设有一连接横梁。
  32. 根据权利要求31所述的分体式阵列摄像模组，其中所述棱镜基座具有一第一摄像模组容纳腔和一棱镜模组容纳腔，其中所述第一摄像模组被容纳于第一摄像模组容纳腔，所述棱镜单元被容纳于棱镜模组容纳腔。
  33. 根据权利要求32所述的分体式阵列摄像模组，其中所述棱镜基座包括一中间加强板，其沿着垂直于所述棱镜基座长度方向并在其整个宽度上贯穿棱镜基座延伸。
  34. 根据权利要32所述的分体式阵列摄像模组，其中所述第一摄像模组容纳腔的侧壁具有一第一开口，其用于施布所述第一摄像模组的电源/信号线，其中所述棱镜模组容纳腔的侧壁具有一第二开口，其用于施布用于控制所述棱镜的电源/控制信号线的开口。
  35. 根据权利要求34所述的分体式阵列摄像模组，其中所述棱镜模组容纳腔的一侧设有一连接壁，其表面上设有至少一个定位柱或定位孔，以用于与所述第二摄像模组精准定位的连接。
  36. 根据权利要求35所述的分体式阵列摄像模组，其中所述摄像外壳具有围绕形成中空矩形柱的一外壳部，固定连接在所述外壳部一端的一前面板，以及在所述外壳部侧面上形成两个凹陷的两个连接部。
  37. 根据权利要求36所述的分体式阵列摄像模组，其中所述摄像外壳包括一光轴开孔和至少一定位孔或定位柱，其中所述光轴开孔设置于所述前面板中央，所述定位孔或定位柱设置于所述前面板上。
  38. 根据权利要求37所述的分体式阵列摄像模组，其中所述定位柱位于所述定位孔中，所述自由端与所述连接部相互配合并相互固定连接。
  39. 根据权利要求22所述的分体式阵列摄像模组，其中所述第一摄像模组为广角摄像模组，所述第二摄像模组为变焦摄像模组，所述第一摄像模组的光轴与所述第二摄像模组的光轴相互垂直。
  40. 一分体式阵列摄像模组的组装方法，其特征在于，包括如下步骤：
    (S11)一分体式阵列摄像模组的至少一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
    (S12)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
    (S13)模组高度校准，测量所述每个校准模组与所述参考模组的镜头端面高度差，对所述校准模组作相应的高度位置校准；
    (S14)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；
    (S15)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；
    (S16)模组偏移检验/校准，判断所述每个校准模组与所述参考模组的水平位置偏移量是否在公差允许范围内，若在公差范围内不作校准，若不在公差范围内返回步骤(S13)重新对所述每个校准模组做高度校准、偏移校准和旋转校准，直到所述每个校准模组与所述参考模组的水平位置偏移量在所述公差范围内；以及
    (S17)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
  41. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中所述分体式阵列摄像模组包含一至多颗子模组，其中至少一颗子模组是所述参考模组，其余子模组为所述校准模组，所述子模组彼此之间相互独立并组装于所述组装支架。
  42. 根据权利要求41所述分体式阵列摄像模组的组装方法，其中所述参考模组选择所述分体式阵列摄像模组中像素最高的一颗子模组。
  43. 根据权利要求40-42中任一所述分体式阵列摄像模组的组装方法，其中所述参考模组与所述校准模组都是完成了制造、组装并且性能测试合格的单体摄像模组。
  44. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中所述参考模组与所述参考单元的四周组装间隙为0.01-1mm，所述校准模组与所述校准单元的四周组装间隙为0.01-3mm。
  45. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S11)中，所述参考模组组装固定的步骤还包括：
    1)用一限位治具对所述参考模组与所述参考单元进行限位组装；以及
    2)在所述参考模组与所述参考单元之间画胶水，固化所述胶水。
  46. 根据权利要求45所述分体式阵列摄像模组的组装方法，其中所述胶水是一UV热固胶，通过紫外曝光将所述胶水固化。
  47. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S13)中,所述模组高度校准具体包括：
    1)测量所述参考模组和所述每个校准模组的镜头端面上的一个点的高度，分别计算出所述每个校准模组与所述参考模组的镜头端面高度差值；以及
    2)调整所述每个校准模组的Z轴位移。
  48. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S14)中，所述模组偏移校准具体包括：
    1)对所述参考模组与所述每个校准模组的镜头端面进行拍摄，抓取镜头端面图像，用软件分别计算出所述每个校准模组与所述参考模组的水平位置偏移量；以及
    2)调整所述每个校准模组的X、Y轴位移。
  49. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S15)中，所述标板中心为MTF测试标板，所述标板四角含有四个Mark点。
  50. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S15)中，所述每个校准模组的旋转校准通过在U、V、W三个空间维度的运动来实现，目的是为了使所 述每个校准模组与所述参考模组的光轴平行。
  51. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S12)中，所述校准模组的预组装步骤具体包括：
    1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的一固定治具上，所述参考模组放置于所述组装支架的参考单元内；
    2)将所述校准模组安装并固定到一校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动；以及
    3)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶。
  52. 根据权利要求51所述分体式阵列摄像模组的组装方法，其中步骤(S17)中，所述分体式阵列摄像模组固定步骤具体包括：
    1)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
    2)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
  53. 根据权利要求40所述分体式阵列摄像模组的组装方法，其中步骤(S12)中，所述校准模组的预组装步骤具体包括：
    1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的固定治具上，所述参考模组放置于所述组装支架的参考单元内；以及
    2)将所述校准模组安装并固定到校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动。
  54. 根据权利要求53所述分体式阵列摄像模组的组装方法，其中步骤(S17)中，中所述分体式阵列摄像模组固定步骤具体包括：
    1)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶；
    2)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
    3)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
  55. 根据权利要求52或55所述分体式阵列摄像模组的组装方法，其中所述分体式阵列摄像模组在烤箱中的烘烤温度为50℃～200℃，烘烤时间5min～600min。
  56. 一分体式阵列摄像模组的组装方法，其特征在于，包括如下步骤：
    (S11A)一分体式阵列摄像模组的一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
    (S12A)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
    (S13A)模组高度/偏移校准，测量所述每个校准模组与所述参考模组的镜头端面高度差和水平位置偏移量，对所述校准模组作相应的高度位置校准和相应的水平偏移位置校准；
    (S14A)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；以及
    (S15A)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
  57. 一分体式阵列摄像模组的组装方法，其特征在于，包括如下步骤：
    (S11B)一分体式阵列摄像模组的一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
    (S12B)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
    (S13B)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；
    (S14B)模组高度校准，测量所述每个校准模组与所述参考模组的镜头端面高度差，对所述校准模组作相应的高度位置校准；
    (S15B)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；以及
    (S16B)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
  58. 一分体式阵列摄像模组的组装方法，其特征在于，包括如下步骤：
    (S21)一分体式阵列摄像模组的一参考模组组装固定，即将所述参考模组组装并固定在一组装支架的一参考单元内；
    (S22)一分体式阵列摄像模组的至少一个校准模组预组装，即将所述校准模组预组装到所述组装支架的一校准单元内；
    (S23)模组高度校准，测量所述每个校准模组与所述参考模组的镜头端面高度差，对所述校准模组作相应的高度位置校准；
    (S24)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；
    (S25)模组旋转校准，设置一光源和一标板，点亮所述分体式阵列摄像模组，对所述标板进行拍摄采集图像，根据所述参考模组和所述每个校准模组采集得到的图像，利用软件计算出所述每个校准模组的旋转校准量，并对所述每个校准模组进行旋转位置校准；
    (S26)模组偏移校准，测量每个校准模组与所述参考模组的水平位置偏移量，对所述校准模组作相应的水平偏移位置校准；以及
    (S27)固定模组，固定整个所述分体式阵列摄像模组，完成组装。
  59. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述分体式阵列摄像模组包含一至多颗子模组，其中一颗子模组是所述参考模组，其余子模组为所述校准模组，所述子模组彼此之间相互独立并组装于所述组装支架。
  60. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述参考 模组与所述校准模组都是完成了制造、组装并且性能测试合格的单体摄像模组。
  61. 根据权利要求56-58中任一所述的分体式阵列摄像模组，其中所述参考模组和所述校准模组分别为一可调焦摄像模组或一定焦摄像模组。
  62. 根据权利要求56-58中任一所述的分体式阵列摄像模组，其中所述参考模组为一可调焦摄像模组，所述校准模组为一定焦摄像模组。
  63. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述参考模组与所述参考单元的四周组装间隙为0.01-1mm，所述校准模组与所述校准单元的四周组装间隙为0.01-3mm。
  64. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述参考模组组装固定的步骤还包括：
    1)用一限位治具对所述参考模组与所述参考单元进行限位组装；以及
    2)在所述参考模组与所述参考单元之间画胶水，固化所述胶水。
  65. 根据权利要求64所述分体式阵列摄像模组的组装方法，其中所述胶水是一UV热固胶，通过紫外曝光将所述胶水固化。
  66. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述模组高度校准具体包括：
    1)用一激光测距方法各测量所述参考模组和所述每个校准模组的镜头端面上的一个点的高度，分别计算出所述每个校准模组与所述参考模组的镜头端面高度差值；以及
    2)通过所述六轴平台调整所述每个校准模组的Z轴位移。
  67. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述模组偏移校准具体包括：
    1)对所述参考模组与所述每个校准模组的镜头端面进行CCD拍摄，抓取镜头端面图像，用软件分别计算出所述每个校准模组与所述参考模组的水平位置偏移量；以及
    2)通过所述六轴平台调整所述每个校准模组的X、Y轴位移。
  68. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述标板中心为MTF测试标板，所述标板含有2-20个Mark点。
  69. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述每个校准模组的旋转校准通过所述六轴平台在U、V、W三个空间维度的运动来实现，目的是为了使所述每个校准模组与所述参考模组的光轴平行。
  70. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述校准模组的预组装步骤具体包括：
    1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的一固定治具上，所述参考模组放置于所述组装支架的参考单元内；
    2)将所述校准模组安装并固定到一校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动；以及
    3)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶。
  71. 根据权利要求70所述分体式阵列摄像模组的组装方法，其中所述分体式阵列摄像 模组固定步骤具体包括：
    1)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
    2)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
  72. 根据权利要求56-58中任一所述分体式阵列摄像模组的组装方法，其中所述校准模组的预组装步骤具体包括：
    1)将所述参考模组与所述组装支架安装并固定到一模组校准平台的一固定治具上，所述参考模组放置于所述组装支架的参考单元内；以及
    2)将所述校准模组安装并固定到一校准治具上，所述校准治具设置在六轴平台上，所述校准模组放置于所述组装支架的校准单元内，所述校准模组可以随着所述六轴平台作X、Y、Z、U、V、W六个空间维度的运动。
  73. 根据权利要求72所述分体式阵列摄像模组的组装方法，其中所述分体式阵列摄像模组固定步骤具体包括：
    1)在所述校准模组与所述校准单元之间画胶水，所述胶水为一种UV热固胶；
    2)对所述校准模组与所述校准单元之间的所述胶水进行紫外曝光，所述胶水半固化；以及
    3)烘烤所述分体式阵列摄像模组，所述胶水完全固化，固定整个所述分体式阵列摄像模组。
  74. 根据权利要求70或73所述分体式阵列摄像模组的组装方法，其中所述分体式阵列摄像模组在烤箱中的烘烤温度为50℃～200℃，烘烤时间5min～600min。
PCT/CN2017/079690 2016-04-07 2017-04-07 分体式阵列摄像模组及其组装和应用方法 WO2017174022A2 (zh)

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EP3771194A4 (en) * 2018-03-20 2021-05-19 Vivo Mobile Communication Co., Ltd. CAMERA MODULE AND MOBILE TERMINAL
CN113286019A (zh) * 2021-05-07 2021-08-20 南昌欧菲光电技术有限公司 光学模组、摄像头和电子设备
CN113766094A (zh) * 2020-06-02 2021-12-07 Oppo（重庆）智能科技有限公司 前置组件的安装方法、电子设备、具有存储功能的装置

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CN207665056U (zh) * 2017-10-18 2018-07-27 宁波舜宇光电信息有限公司 用于摄像模组阵列的感光组件阵列及相应的摄像模组阵列
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CN107990108A (zh) * 2017-12-26 2018-05-04 上海摩软通讯技术有限公司 用于双摄的支架、分体支架式双摄及组装方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
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JP5584818B2 (ja) * 2011-07-26 2014-09-03 パナソニック株式会社 撮像装置
US20140240469A1 (en) * 2013-02-28 2014-08-28 Motorola Mobility Llc Electronic Device with Multiview Image Capture and Depth Sensing
CN105187697B (zh) * 2015-08-04 2019-12-31 宁波舜宇光电信息有限公司 多镜头摄像模组连体支架和多镜头摄像模组及其应用
CN105338230B (zh) * 2015-11-25 2019-12-27 三赢科技（深圳）有限公司 成像装置及其组装方法

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US11272088B2 (en) 2018-03-20 2022-03-08 Vivo Mobile Communication Co., Ltd. Camera module and mobile terminal
CN108391061A (zh) * 2018-03-26 2018-08-10 深圳市泰品科技有限公司 一种摄像头模组的组装方法和设备
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