WO2017169092A1 - Unité d'affichage et dispositif d'affichage - Google Patents

Unité d'affichage et dispositif d'affichage Download PDF

Info

Publication number
WO2017169092A1
WO2017169092A1 PCT/JP2017/003805 JP2017003805W WO2017169092A1 WO 2017169092 A1 WO2017169092 A1 WO 2017169092A1 JP 2017003805 W JP2017003805 W JP 2017003805W WO 2017169092 A1 WO2017169092 A1 WO 2017169092A1
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
circuit board
display unit
region
emitting device
Prior art date
Application number
PCT/JP2017/003805
Other languages
English (en)
Japanese (ja)
Inventor
尚司 大塚
聡 切通
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Publication of WO2017169092A1 publication Critical patent/WO2017169092A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to a display unit and a display device.
  • a display device configured by combining a plurality of display units.
  • Each display unit includes a circuit board and a light emitting device mounted on the circuit board.
  • Each light-emitting device includes, for example, a light-emitting diode (LED: Light Emitting Diode) described in Patent Document 1 in which a light-emitting element is mounted on a white package.
  • the light emitting device is electrically connected to the wiring formed on the circuit board.
  • Patent Document 2 discloses a display device in which a light-emitting device and a mounting surface of a circuit board on which the light-emitting device is mounted are sealed by a protection unit. In order to emit light emitted from the light-emitting device with high efficiency, a resin having a high transmittance with respect to visible light is used for the protective portion.
  • JP 2011-211032 A Japanese Patent Laid-Open No. 2016-12070
  • the transmittance of the protective part with respect to visible light is high, ambient light that enters the display unit from the periphery of the display unit including sunlight and illumination also passes through the protective part and enters the light emitting device and the circuit board. Since the light emitting device package is white, it reflects ambient light with high reflectivity. Moreover, since the wiring is exposed on the circuit board, ambient light is reflected with high reflectance.
  • Ambient light reflected by the package of the light emitting device and the wiring of the circuit board is again transmitted through the protection unit and emitted from the display unit, thereby reducing the contrast of the image displayed by the display unit.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a display unit and a display device in which reflection of ambient light and emission of reflected ambient light are suppressed.
  • the display unit includes a circuit board, a plurality of light emitting devices mounted on the mounting surface of the circuit board, and a protection unit that covers the mounting surface of the circuit board and the plurality of light emitting devices.
  • the protective part absorbs visible light.
  • the protective part absorbs visible light, reflection of ambient light in the display unit and emission of ambient light reflected by the display unit can be suppressed, and the contrast of an image displayed on the display unit is improved. it can.
  • FIG. 1 Schematic diagram of a display unit according to Embodiment 1 of the present invention.
  • 1 is a cross-sectional view of the display unit of FIG. 1 taken along line AA.
  • 1 is a top view of a light emitting device according to Embodiment 1 of the present invention.
  • Embodiment 1 FIG.
  • the display unit 1 in Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 5B.
  • the display surface that is the front of the display unit 1 is installed perpendicular to the ground, the front direction is the Z-axis direction, the left-right direction is the X-axis direction, and the vertical direction is the Y-axis direction. Will be described. The same applies to other embodiments.
  • the display unit 1 includes a square circuit board 4, a plurality of light emitting devices 2 mounted on a mounting surface 11 of the circuit board 4, and mounting surfaces of the light emitting device 2 and the circuit board 4. 11 is provided.
  • the light emitting device 2 is mounted on the mounting surface 11 of the circuit board 4 in a 4 ⁇ 4 square lattice pattern.
  • the light emitting device 2 is mounted on the mounting surface 11 with the upper surface of a base member 28 described later disposed on the front side of the display unit 1.
  • the interval D between the light emitting devices 2 is, for example, 8 mm. Details of the light emitting device 2 will be described later.
  • the circuit board 4 is made of an insulating resin material.
  • the circuit board 4 has a wiring portion 5 that is electrically connected to the light emitting device 2 on the mounting surface 11.
  • the wiring part 5 is a metal wiring.
  • a driving IC (IC: Integrated Circuit) (not shown) connected to the wiring unit 5 is provided on the circuit board 4.
  • the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4 to prevent water and dust from entering. Moreover, the protection part 3 absorbs visible light. Details of the protection unit 3 will be described later.
  • the driving IC supplies power to the light emitting device 2, and the light emitting device 2 emits visible light of an arbitrary color with an arbitrary intensity. As a result, an image is displayed on the display unit 1.
  • the light emitting device 2 is a 3 in 1 type light emitting device.
  • the light emitting device 2 includes light emitting elements 23r, 23g, and 23b that emit red light, green light, and blue light, a base member 28 on which the light emitting elements 23r, 23g, and 23b are mounted, and light emitting elements 23r, 23g, and 23b, respectively. And a sealing portion 27 that seals the inside of the base member 28.
  • the light emitting device 2 further includes leads 25r, 25g, 25b and leads 26r, 26g, 26b that electrically connect the light emitting elements 23r, 23g, 23b and the wiring part 5 of the circuit board 4.
  • the base member 28 is a cubic housing made of an insulating white resin. In the present embodiment, the base member 28 functions as a package.
  • the base member 28 includes a recess 29 that opens on the upper surface.
  • the upper surface of the base member 28 is disposed on the front side of the display unit 1.
  • the side surface 28 a of the base member 28 is perpendicular to the mounting surface 11 of the circuit board 4.
  • a side surface 28 a of the base member 28 is an outer surface of the base member 28. Further, the side surface 28 a of the base member 28 is a contact surface with the outside of the light emitting device 2 and is also an outer surface of the light emitting device 2.
  • the light emitting elements 23r, 23g, and 23b are surface mount type light emitting elements.
  • the light emitting elements 23r, 23g, and 23b are, for example, LED elements and laser diode (LD) elements.
  • the light emitting elements 23r, 23g, and 23b are arranged in a line in the Y-axis direction at equal intervals on the bottom surface of the recess 29 of the base member 28.
  • the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b supply power to the light emitting elements 23r, 23g, and 23b.
  • One end of each of the leads 25r, 25g, 25b and the leads 26r, 26g, 26b is disposed on the bottom surface of the recess 29 of the base member 28.
  • the leads 25r, 25g, 25b and the leads 26r, 26g, 26b extend from the bottom surface of the recess 29 to the bottom surface of the base member 28 through the side surface 28a of the base member 28.
  • the other ends of the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b are disposed on the bottom surface of the base member 28.
  • the light emitting elements 23r, 23g, and 23b are stacked on one end portions of the leads 25r, 25g, and 25b, respectively. Thereby, the light emitting elements 23r, 23g, and 23b and the leads 25r, 25g, and 25b are electrically connected. Further, one end portions of the light emitting elements 23r, 23g, and 23b and the leads 26r, 26g, and 26b are electrically connected by wires 24, respectively.
  • the other ends of the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b are electrically connected to the connection portion 6 provided on the wiring portion 5 of the circuit board 4.
  • the other ends of the leads 25r, 25g, and 25b, the leads 26r, 26g, and 26b and the connecting portion 6 are electrically connected, for example, by reflow soldering.
  • the sealing portion 27 is a silicon resin that transmits light emitted from the light emitting elements 23r, 23g, and 23b.
  • the sealing portion 27 fills the internal space of the concave portion 29 formed by the inner peripheral surface 28b, and seals the light emitting elements 23r, 23g, and 23b. Thereby, the sealing part 27 protects the light emitting elements 23r, 23g, 23b, the leads 25r, 25g, 25b and the leads 26r, 26g, 26b from water and dust.
  • the contact surface of the sealing portion 27 with the outside of the light emitting device 2 is a light emitting surface 21 through which the light emitted from the light emitting elements 23r, 23g, and 23b is emitted to the outside of the light emitting device 2.
  • the light emitting surface 21 is formed on a plane parallel to the XY plane. Further, the light emitting surface 21 and the upper surface of the base member 28 are flush with each other.
  • the light emitting device 2 power is independently supplied from the driving IC to the light emitting elements 23r, 23g, and 23b through the wiring portion 5, the leads 25r, 25g, and 25b, and the leads 26r, 26g, and 26b. Thereby, the light emission intensity of the light emitting elements 23r, 23g, and 23b is individually adjusted, and the light emitting device 2 can emit visible light of any color from the light emitting surface 21 with any intensity.
  • the protection unit 3 will be described with reference to FIGS. 2, 5A, and 5B.
  • the protection unit 3 connects the light emitting device 2 and the mounting surface 11 of the circuit board 4 along the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 of the light emitting device 2. cover. Thereby, the protection part 3 seals the light emitting device 2 and the mounting surface 11 of the circuit board 4.
  • the protection unit 3 has an adhesive layer on the surface facing the circuit board 4.
  • the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 through the adhesive layer.
  • the protection unit 3 is a flexible film made of a dark resin having waterproofness.
  • the dark resin is a silicon resin to which a black colorant is added.
  • the black colorant is carbon black.
  • the visible light absorptance of the protection part 3 is adjusted by the addition amount of the colorant or the thickness T1 of the protection part 3. Note that the thickness T1 of the protection part 3 is the thickness in the Z-axis direction.
  • the dark color in the protection unit 3 may be an achromatic color or a chromatic color.
  • the absorptivity of the protective part 3 with respect to visible light is preferably 50% or more, and more preferably 70% or more.
  • the visible light transmittance in the protection part 3 is preferably 50% or less, and more preferably 30% or less.
  • the thickness T1 of the protection part 3 is, for example, 100 ⁇ m to 400 ⁇ m.
  • the thickness T1 of the protective part 3 is preferably 150 ⁇ m to 300 ⁇ m, and particularly preferably 190 ⁇ m to 210 ⁇ m, from the viewpoint of flexibility and durability.
  • FIG. 5A shows the reflection of ambient light in the display unit 1.
  • the protection unit 3 absorbs visible light
  • the ambient light that reaches the display unit 1 is absorbed by the protection unit 3, and the wiring unit 5, the connection unit 6, and the base of the circuit board 4.
  • the display unit 1 Before reaching the side surface 28a of the member 28, it decays. Therefore, the display unit 1 can suppress the reflection of ambient light.
  • ambient light reflected by the wiring part 5 and the connection part 6 of the circuit board 4 and ambient light reflected by the side face 28a of the base member 28 are also absorbed by the protection part 3 and attenuated.
  • the display unit 1 can also suppress the ambient light reflected by the wiring portion 5 and the connection portion 6 of the circuit board 4 and the ambient light reflected by the side surface 28 a of the base member 28 from being emitted from the display unit 1. .
  • the emitted light from the light emitting device 2 is only absorbed by the protection unit 3 when passing through the protection unit 3, so that the decrease in the brightness of the image displayed on the display unit 1 is small.
  • the protection part 3 does not absorb visible light
  • the ambient light is not attenuated
  • the wiring part 5, the connection part 6, and the base member 28 of the circuit board 4 are not attenuated.
  • the side surface 28a Incident to the side surface 28a.
  • the ambient light reflected by the wiring portion 5 and the connection portion 6 of the circuit board 4 and the ambient light reflected by the side surface 28a of the base member 28 are emitted from the display unit 1 without being attenuated.
  • the contrast of the displayed image is lowered by the ambient light emitted from the display unit 1.
  • the protection unit 3 absorbs visible light
  • the display unit 1 suppresses the reflection of the ambient light in the display unit 1 and the emission of the ambient light reflected by the display unit 1.
  • the contrast of the displayed image can be improved.
  • FIG. 1 the protection part 3 has a uniform thickness T1.
  • the protection part 3 has a thin part 32.
  • the configurations of the light emitting device 2 and the circuit board 4 are the same as those in the first embodiment.
  • the protection part 3 and the display unit 1 in this Embodiment are demonstrated with reference to FIG. 6, FIG.
  • the protection unit 3 includes a thin portion 32 that is the bottom of the recess 31.
  • the thickness Th1 of the thin portion 32 is smaller than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 of the protection unit 3 described later.
  • the content per unit volume of carbon black in the thin portion 32 of the protection part 3 is the same as the content per unit volume of carbon black in the second area A2 and the third area A3 of the protection part 3.
  • the recess 31 opens on the surface of the protection unit 3 that faces the circuit board 4 when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4.
  • the recess 31 is formed at a position corresponding to the light emitting device 2 mounted on the circuit board 4 by press working.
  • the protection unit 3 is mounted on the light emitting device 2 and the circuit board 4 along the light emitting surface 21, the circuit board 4 mounting surface 11, and the side surface 28 a of the base member 28. 11 and cover.
  • the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 through the adhesive layer.
  • the thin part 32 of the protection part 3 is in close contact with the upper surface of the light emitting device 2 including the light emitting surface 21.
  • the top surface of the light emitting device 2 is a surface located on the front side of the display unit 1 when the light emitting device 2 is mounted on the circuit board 4.
  • the thickness of the protection part 3, and the emitted light and ambient light from the light-emitting device 2 are demonstrated. Note that, in the protection unit 3, the region that is in close contact with the light emitting surface 21 of the light emitting device 2 is in close contact with the first region A 1, the region that is in close contact with the mounting surface 11 of the circuit board 4 is in close contact with the side region 28 a of the base member 28.
  • the area to be performed is referred to as a third area A3.
  • the thin portion 32 of the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2. Therefore, the thickness of the first region A1 of the protection unit 3 is Th1, which is smaller than the thickness Th2 of the second region A2 of the protection unit 3 and the thickness Th3 of the third region A3 of the protection unit 3. Note that the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 may be the same or different.
  • the thickness Th1 of the first region A1 is thinner than the thicknesses Th2 and Th3 of the second region A2 and the third region A3, absorption of the emitted light from the light emitting device 2 by the protection unit 3 is suppressed.
  • the absorption rate R of the resin with respect to visible light decreases exponentially as the resin thickness L decreases. Therefore, the protection unit 3 can remarkably suppress the attenuation of the emitted light from the light emitting device 2.
  • the protection unit 3 suppresses the reflection of the ambient light in the display unit 1 and the emission of the ambient light reflected by the display unit 1 as in the first embodiment. it can.
  • the thickness Th1 of the first region A1 is preferably 10 ⁇ m to 100 ⁇ m, and more preferably 40 ⁇ m to 60 ⁇ m.
  • the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 are preferably 100 ⁇ m to 400 ⁇ m, and more preferably 150 ⁇ m to 250 ⁇ m.
  • the visible light absorptance of the first region A1 is preferably 30% or less, and more preferably 20% or less, from the viewpoint of suppressing the attenuation of the emitted light from the light emitting device 2.
  • the visible light transmittance of the first region A1 is preferably 70% or more, and more preferably 80% or more.
  • the visible light absorptance of the second region A2 and the third region A3 is preferably 50% or more and 70% or more from the viewpoint of suppressing reflection of ambient light and emission of reflected ambient light. It is more preferable.
  • the visible light transmittance of the second region A2 and the third region A3 is preferably 50% or less, and more preferably 30% or less.
  • the circuit board 4 on which the wiring part 5 is formed and the light emitting device 2 are prepared.
  • the light emitting device 2 is mounted on the circuit board 4 by soldering the leads 25r, 25g, and 25b of the light emitting device 2 and the leads 26r, 26g, and 26b to the wiring portion 5 of the circuit board 4.
  • the protection unit 3 is arranged so that the surface on which the concave portion 31 is formed is opposed to the circuit board 4 and the positions of the thin portion 32 and the light emitting surface 21 of the light emitting device 2 are aligned. It arranges in.
  • the circuit board 4 provided with the protection unit 3 is installed in a vacuum heating apparatus. Then, the inside of a vacuum heating apparatus is heated and pressure-reduced. Due to the reduced pressure, the thin part 32 of the protection part 3 is stuck to the light emitting surface 21 of the light emitting device 2. Further, the portion excluding the thin portion 32 of the protection portion 3 extends by heating and is adhered to the mounting surface 11 of the circuit board 4 and the side surface 28a of the base member 28. Finally, the vacuum heating device is returned to room temperature and normal pressure, and the display unit 1 is taken out from the vacuum heating device. The protection part 3 is pressed by atmospheric pressure, and the light emitting surface 21 of the light emitting device 2 and the thin part 32 of the protection part 3 are in close contact with each other. Further, the portion excluding the thin portion 32 of the protection portion 3 is in close contact with the mounting surface 11 of the circuit board 4 or the side surface 28 a of the base member 28. Thus, the display unit 1 can be manufactured.
  • the display unit 1 in the present embodiment can remarkably suppress the attenuation of the emitted light from the light emitting device 2. Therefore, it is not necessary to increase the amount of power supplied to the light emitting device 2 and increase the amount of light emitted from the light emitting device 2. Further, the display unit 1 can suppress the reflection of the ambient light on the display unit 1 and the emission of the ambient light reflected by the display unit 1, and can improve the contrast of the image displayed on the display unit 1.
  • Embodiment 3 FIG.
  • the recess 31 is formed on the surface of the protection unit 3 that faces the circuit board 4.
  • the recess 31 is formed on the surface of the protection unit 3 opposite to the surface facing the circuit board 4.
  • the configurations of the light emitting device 2 and the circuit board 4 are the same as those in the first embodiment.
  • the protection unit 3 and the display unit 1 in the present embodiment will be described with reference to FIGS.
  • the protection unit 3 includes a thin portion 32 that is the bottom of the recess 31.
  • the thickness Th1 of the thin portion 32 is thinner than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 of the protection unit 3 as in the second embodiment.
  • the recess 31 opens on a surface opposite to the surface facing the circuit board 4 when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4.
  • the recess 31 is formed at a position corresponding to the light emitting device 2 mounted on the circuit board 4 by press working.
  • the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4, the protection unit 3 surrounds the light emitting surface 21 of the light emitting device 2 and includes a protrusion 33 protruding in the Z-axis direction.
  • the convex portion 33 of the protection portion 3 functions as a ridge that prevents ambient light from entering the light emitting surface 21 of the light emitting device 2.
  • the ambient light incident on the light emitting surface 21 of the light emitting device 2 is reduced, so that the ambient light reflected from the light emitting surface 21 and the bottom surface of the recess 29 of the light emitting device 2 and emitted from the display unit 1 is reduced. Therefore, the display unit 1 can further improve the contrast of the image displayed on the display unit 1.
  • the protection unit 3 is mounted on the light emitting device 2 and the circuit board 4 along the light emitting surface 21, the circuit board 4 mounting surface 11, and the side surface 28 a of the base member 28. 11 and cover.
  • the thin part 32 of the protection part 3 is in close contact with the upper surface of the light emitting device 2 including the light emitting surface 21.
  • the thickness Th1 of the first region A1 of the protection unit 3 is the same as that of the second region A2 of the protection unit 3 as in the second embodiment. It becomes thinner than the thicknesses Th2 and Th3 of the region A3. Therefore, the display unit 1 in the present embodiment can remarkably suppress the absorption of the emitted light from the light emitting device 2 by the protection unit 3 as in the second embodiment. Further, in the second region A2 and the third region A3, the protection unit 3 reflects the ambient light on the display unit 1 and emits the ambient light reflected on the display unit 1 as in the first and second embodiments. Can be suppressed.
  • the light-emitting device 2 is configured such that the protective portion 3 has a surface on which the concave portion 31 is not formed opposed to the circuit board 4 and the positions of the thin-walled portion 32 and the light-emitting surface 21 of the light-emitting device 2 are aligned. It is disposed on the mounted circuit board 4.
  • the circuit board 4 provided with the protection unit 3 is installed in a vacuum heating apparatus. Then, the inside of a vacuum heating apparatus is heated and pressure-reduced. Due to the reduced pressure, the thin part 32 of the protection part 3 is stuck to the light emitting surface 21 of the light emitting device 2. Further, the portion excluding the thin portion 32 of the protection portion 3 is extended by heating and is adhered to the side surface 28 a of the light emitting device 2 and the mounting surface 11 of the circuit board 4. In this case, the outer edge portion 31 a that forms the outer edge of the concave portion 31 of the protection portion 3 protrudes from the upper surface of the light emitting device 2 in the Z-axis direction to form a convex portion 33 surrounding the light emitting surface 21 of the light emitting device 2. Thus, the display unit 1 can be manufactured.
  • the display unit 1 in the present embodiment is an image displayed on the display unit 1.
  • the contrast can be further improved.
  • the display unit 1 can remarkably suppress the attenuation of the emitted light from the light emitting device 2 as in the second embodiment.
  • the display unit 1 can suppress reflection of ambient light on the display unit 1 and emission of ambient light reflected by the display unit 1.
  • Embodiment 4 FIG.
  • the display device 41 includes a plurality of display units 1 in the third embodiment. As illustrated in FIG. 10, the display device 41 includes 16 display units 1 combined in a tile shape.
  • the display device 41 is installed outdoors such as a stadium or a building wall. By changing the number of display units 1 included in the display device 41, display devices 41 of various sizes can be manufactured.
  • the display device 41 is composed of the display unit 1, the contrast of the image displayed on the display device 41 can be improved as with the display unit 1.
  • the base member 28 is not limited to a cubic shape having the recesses 29 but may be a flat plate shape.
  • the protection unit 3 is in close contact with the light emitting surface 21 and the side surface of the flat plate.
  • the base member 28 may be a substrate on which a wiring pattern is printed.
  • the sealing part 27 is not limited to silicon resin, but is optional.
  • the sealing part 27 may be an epoxy resin.
  • the sealing part 27 may include a dispersant and a phosphor.
  • the shape of the light emitting surface 21 may be a convex shape with a central portion protruding in the Z-axis direction or a concave shape with a central portion recessed in the Z-axis direction.
  • the light emitting device 2 is not limited to the 3 in 1 type.
  • the light emitting device 2 may be a light emitting device that emits monochromatic light in which one light emitting element is mounted on one base member 28.
  • the light emitting device 2 may include four or more light emitting elements.
  • the number of the light emitting devices 2 mounted on the circuit board 4 is not limited to 4 rows ⁇ 4 columns and is arbitrary.
  • the light emitting device 2 may be mounted on the circuit board 4 in 128 rows ⁇ 128 columns or 256 rows ⁇ 256 columns.
  • the arrangement of the light emitting devices 2 is not limited to a square lattice, and is arbitrary.
  • the light emitting devices 2 may be arranged in an orthorhombic lattice, a hexagonal lattice, a rectangular lattice, a staggered lattice, or the like.
  • the circuit board 4 may be provided with a blank space where the light emitting device 2 is not disposed.
  • the distance D between the light emitting devices 2 is not limited to 8 mm, and is arbitrary.
  • the protection unit 3 may be made of a waterproof resin such as a polyester resin, a polycarbonate resin, or an acrylic resin. Further, the colorant added to the resin is not limited to carbon black, and is arbitrary. The colorant added to the resin may be a dye composition.
  • the protection part 3 is not limited to a plastic film, and may be a molded resin member.
  • the thickness Th1 of the first region A1 is not limited to the case where the thickness Th1 of the first region A1 is smaller than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3. Even when the thickness Th2 of the second region A2 or the thickness Th3 of the third region A3 is thinner, the display unit 1 can remarkably suppress the attenuation of the emitted light from the light emitting device 2.
  • the content of carbon black per unit volume in the first region A1 of the protection part 3 is made smaller than the content of carbon black per unit volume in the second region A2 and the third region A3 of the protection unit 3. Also good. Thereby, the absorptance with respect to visible light in the first area A1 becomes smaller than the absorptance with respect to visible light in the second area A2 and the third area A3, and the display unit 1 emits light as in the second and third embodiments. Attenuation of light emitted from the device 2 can be remarkably suppressed.
  • An air layer may be provided between the protection unit 3, the mounting surface 11 of the circuit board 4, the light emitting surface 21 of the light emitting device 2, and the side surface 28 a of the base member 28.
  • the display unit 1 and the display device 41 may include a louver on the mounting surface 11 of the circuit board 4 to prevent ambient light from entering the light emitting device 2 and the circuit board 4.
  • the display device 41 may be installed indoors, such as in a gymnasium or indoor pool.
  • the display device 41 may be configured by combining a plurality of the display units 1 in the first embodiment or the display units 1 in the second embodiment.
  • the display device 41 may be configured, for example, by combining a plurality of the display units 1 in the second embodiment and the display units 1 in the third embodiment.
  • the number of display units 1 provided in the display device 41 is arbitrary.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

Unité d'affichage (1) qui comporte : une carte de circuit imprimé (4); une pluralité de dispositifs électroluminescents (2) montés sur une surface de montage (11) de la carte de circuit imprimé (4); et une partie de protection (3) recouvrant les dispositifs électroluminescents (2) et la surface de montage (11) de la carte de circuit imprimé (4). La partie de protection (3) absorbe la lumière visible.
PCT/JP2017/003805 2016-03-31 2017-02-02 Unité d'affichage et dispositif d'affichage WO2017169092A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-069894 2016-03-31
JP2016069894A JP2019090842A (ja) 2016-03-31 2016-03-31 表示ユニット装置及び表示装置

Publications (1)

Publication Number Publication Date
WO2017169092A1 true WO2017169092A1 (fr) 2017-10-05

Family

ID=59963852

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/003805 WO2017169092A1 (fr) 2016-03-31 2017-02-02 Unité d'affichage et dispositif d'affichage

Country Status (2)

Country Link
JP (1) JP2019090842A (fr)
WO (1) WO2017169092A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511714A (ja) * 1991-06-28 1993-01-22 Takiron Co Ltd ドツトマトリクス発光表示体及びその製造方法
JPH08129343A (ja) * 1994-11-01 1996-05-21 Hitachi Media Electron:Kk マトリクス表示装置
JP2003086846A (ja) * 2000-07-21 2003-03-20 Nichia Chem Ind Ltd 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法
JP2009258455A (ja) * 2008-04-18 2009-11-05 Nichia Corp ディスプレイユニット及びその製造方法
WO2012036281A1 (fr) * 2010-09-17 2012-03-22 ローム株式会社 Dispositif d'émission de lumière à semi-conducteurs, procédé pour sa production et dispositif d'affichage
US20120235187A1 (en) * 2011-03-14 2012-09-20 Avago Technologies Ecbu Ip (Singapore)Pte. Ltd. Light Source with Inner and Outer Bodies
JP2016012070A (ja) * 2014-06-30 2016-01-21 三菱電機株式会社 表示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0511714A (ja) * 1991-06-28 1993-01-22 Takiron Co Ltd ドツトマトリクス発光表示体及びその製造方法
JPH08129343A (ja) * 1994-11-01 1996-05-21 Hitachi Media Electron:Kk マトリクス表示装置
JP2003086846A (ja) * 2000-07-21 2003-03-20 Nichia Chem Ind Ltd 発光素子、および発光素子を配置した表示装置ならびに表示装置の製造方法
JP2009258455A (ja) * 2008-04-18 2009-11-05 Nichia Corp ディスプレイユニット及びその製造方法
WO2012036281A1 (fr) * 2010-09-17 2012-03-22 ローム株式会社 Dispositif d'émission de lumière à semi-conducteurs, procédé pour sa production et dispositif d'affichage
US20120235187A1 (en) * 2011-03-14 2012-09-20 Avago Technologies Ecbu Ip (Singapore)Pte. Ltd. Light Source with Inner and Outer Bodies
JP2016012070A (ja) * 2014-06-30 2016-01-21 三菱電機株式会社 表示装置

Also Published As

Publication number Publication date
JP2019090842A (ja) 2019-06-13

Similar Documents

Publication Publication Date Title
JP5092866B2 (ja) ディスプレイユニット及びその製造方法
JP6548733B2 (ja) 表示ユニット及び表示ユニットの製造方法
JP6418812B2 (ja) 表示装置
WO2018003027A1 (fr) Dispositif d'affichage et procédé de fabrication de dispositif d'affichage
JP6312586B2 (ja) 表示ユニット、映像表示装置及び表示ユニットの製造方法
US20110149571A1 (en) Light transmissible display apparatus
US10402145B2 (en) Optoelectronic lighting device, video wall module and signal transmitter for a light signaling installation
TWI578579B (zh) 發光裝置、顯示單元及影像顯示裝置
TWI552391B (zh) 全周光式發光二極體元件以及照明模組
JP4661765B2 (ja) バックライトユニット
JP6846877B2 (ja) 表示ユニット装置及び表示装置
WO2017169092A1 (fr) Unité d'affichage et dispositif d'affichage
JP6710327B2 (ja) 表示ユニット、表示装置及び表示ユニットの製造方法
JP6599128B2 (ja) 表示装置
JP2016213364A (ja) 発光装置及び表示装置
KR102198695B1 (ko) 광원 모듈 및 이를 포함하는 백라이트 유닛
CN107527936A (zh) 有机发光二极管显示器及其制造方法
JP6896038B2 (ja) 表示装置
JP2021071615A (ja) 表示装置
WO2012077274A1 (fr) Dispositif d'éclairage
CN212061699U (zh) 一种防蓝光led显示屏模组
JP2020016899A (ja) 表示装置
WO2020262552A1 (fr) Dispositif électroluminescent linéaire
JP2022081314A (ja) バックライト
JP2018194866A (ja) 表示装置

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17773641

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17773641

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP