WO2017169092A1 - Display unit and display device - Google Patents

Display unit and display device Download PDF

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Publication number
WO2017169092A1
WO2017169092A1 PCT/JP2017/003805 JP2017003805W WO2017169092A1 WO 2017169092 A1 WO2017169092 A1 WO 2017169092A1 JP 2017003805 W JP2017003805 W JP 2017003805W WO 2017169092 A1 WO2017169092 A1 WO 2017169092A1
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WO
WIPO (PCT)
Prior art keywords
light emitting
circuit board
display unit
region
emitting device
Prior art date
Application number
PCT/JP2017/003805
Other languages
French (fr)
Japanese (ja)
Inventor
尚司 大塚
聡 切通
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Publication of WO2017169092A1 publication Critical patent/WO2017169092A1/en

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof

Definitions

  • the present invention relates to a display unit and a display device.
  • a display device configured by combining a plurality of display units.
  • Each display unit includes a circuit board and a light emitting device mounted on the circuit board.
  • Each light-emitting device includes, for example, a light-emitting diode (LED: Light Emitting Diode) described in Patent Document 1 in which a light-emitting element is mounted on a white package.
  • the light emitting device is electrically connected to the wiring formed on the circuit board.
  • Patent Document 2 discloses a display device in which a light-emitting device and a mounting surface of a circuit board on which the light-emitting device is mounted are sealed by a protection unit. In order to emit light emitted from the light-emitting device with high efficiency, a resin having a high transmittance with respect to visible light is used for the protective portion.
  • JP 2011-211032 A Japanese Patent Laid-Open No. 2016-12070
  • the transmittance of the protective part with respect to visible light is high, ambient light that enters the display unit from the periphery of the display unit including sunlight and illumination also passes through the protective part and enters the light emitting device and the circuit board. Since the light emitting device package is white, it reflects ambient light with high reflectivity. Moreover, since the wiring is exposed on the circuit board, ambient light is reflected with high reflectance.
  • Ambient light reflected by the package of the light emitting device and the wiring of the circuit board is again transmitted through the protection unit and emitted from the display unit, thereby reducing the contrast of the image displayed by the display unit.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a display unit and a display device in which reflection of ambient light and emission of reflected ambient light are suppressed.
  • the display unit includes a circuit board, a plurality of light emitting devices mounted on the mounting surface of the circuit board, and a protection unit that covers the mounting surface of the circuit board and the plurality of light emitting devices.
  • the protective part absorbs visible light.
  • the protective part absorbs visible light, reflection of ambient light in the display unit and emission of ambient light reflected by the display unit can be suppressed, and the contrast of an image displayed on the display unit is improved. it can.
  • FIG. 1 Schematic diagram of a display unit according to Embodiment 1 of the present invention.
  • 1 is a cross-sectional view of the display unit of FIG. 1 taken along line AA.
  • 1 is a top view of a light emitting device according to Embodiment 1 of the present invention.
  • Embodiment 1 FIG.
  • the display unit 1 in Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 5B.
  • the display surface that is the front of the display unit 1 is installed perpendicular to the ground, the front direction is the Z-axis direction, the left-right direction is the X-axis direction, and the vertical direction is the Y-axis direction. Will be described. The same applies to other embodiments.
  • the display unit 1 includes a square circuit board 4, a plurality of light emitting devices 2 mounted on a mounting surface 11 of the circuit board 4, and mounting surfaces of the light emitting device 2 and the circuit board 4. 11 is provided.
  • the light emitting device 2 is mounted on the mounting surface 11 of the circuit board 4 in a 4 ⁇ 4 square lattice pattern.
  • the light emitting device 2 is mounted on the mounting surface 11 with the upper surface of a base member 28 described later disposed on the front side of the display unit 1.
  • the interval D between the light emitting devices 2 is, for example, 8 mm. Details of the light emitting device 2 will be described later.
  • the circuit board 4 is made of an insulating resin material.
  • the circuit board 4 has a wiring portion 5 that is electrically connected to the light emitting device 2 on the mounting surface 11.
  • the wiring part 5 is a metal wiring.
  • a driving IC (IC: Integrated Circuit) (not shown) connected to the wiring unit 5 is provided on the circuit board 4.
  • the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4 to prevent water and dust from entering. Moreover, the protection part 3 absorbs visible light. Details of the protection unit 3 will be described later.
  • the driving IC supplies power to the light emitting device 2, and the light emitting device 2 emits visible light of an arbitrary color with an arbitrary intensity. As a result, an image is displayed on the display unit 1.
  • the light emitting device 2 is a 3 in 1 type light emitting device.
  • the light emitting device 2 includes light emitting elements 23r, 23g, and 23b that emit red light, green light, and blue light, a base member 28 on which the light emitting elements 23r, 23g, and 23b are mounted, and light emitting elements 23r, 23g, and 23b, respectively. And a sealing portion 27 that seals the inside of the base member 28.
  • the light emitting device 2 further includes leads 25r, 25g, 25b and leads 26r, 26g, 26b that electrically connect the light emitting elements 23r, 23g, 23b and the wiring part 5 of the circuit board 4.
  • the base member 28 is a cubic housing made of an insulating white resin. In the present embodiment, the base member 28 functions as a package.
  • the base member 28 includes a recess 29 that opens on the upper surface.
  • the upper surface of the base member 28 is disposed on the front side of the display unit 1.
  • the side surface 28 a of the base member 28 is perpendicular to the mounting surface 11 of the circuit board 4.
  • a side surface 28 a of the base member 28 is an outer surface of the base member 28. Further, the side surface 28 a of the base member 28 is a contact surface with the outside of the light emitting device 2 and is also an outer surface of the light emitting device 2.
  • the light emitting elements 23r, 23g, and 23b are surface mount type light emitting elements.
  • the light emitting elements 23r, 23g, and 23b are, for example, LED elements and laser diode (LD) elements.
  • the light emitting elements 23r, 23g, and 23b are arranged in a line in the Y-axis direction at equal intervals on the bottom surface of the recess 29 of the base member 28.
  • the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b supply power to the light emitting elements 23r, 23g, and 23b.
  • One end of each of the leads 25r, 25g, 25b and the leads 26r, 26g, 26b is disposed on the bottom surface of the recess 29 of the base member 28.
  • the leads 25r, 25g, 25b and the leads 26r, 26g, 26b extend from the bottom surface of the recess 29 to the bottom surface of the base member 28 through the side surface 28a of the base member 28.
  • the other ends of the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b are disposed on the bottom surface of the base member 28.
  • the light emitting elements 23r, 23g, and 23b are stacked on one end portions of the leads 25r, 25g, and 25b, respectively. Thereby, the light emitting elements 23r, 23g, and 23b and the leads 25r, 25g, and 25b are electrically connected. Further, one end portions of the light emitting elements 23r, 23g, and 23b and the leads 26r, 26g, and 26b are electrically connected by wires 24, respectively.
  • the other ends of the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b are electrically connected to the connection portion 6 provided on the wiring portion 5 of the circuit board 4.
  • the other ends of the leads 25r, 25g, and 25b, the leads 26r, 26g, and 26b and the connecting portion 6 are electrically connected, for example, by reflow soldering.
  • the sealing portion 27 is a silicon resin that transmits light emitted from the light emitting elements 23r, 23g, and 23b.
  • the sealing portion 27 fills the internal space of the concave portion 29 formed by the inner peripheral surface 28b, and seals the light emitting elements 23r, 23g, and 23b. Thereby, the sealing part 27 protects the light emitting elements 23r, 23g, 23b, the leads 25r, 25g, 25b and the leads 26r, 26g, 26b from water and dust.
  • the contact surface of the sealing portion 27 with the outside of the light emitting device 2 is a light emitting surface 21 through which the light emitted from the light emitting elements 23r, 23g, and 23b is emitted to the outside of the light emitting device 2.
  • the light emitting surface 21 is formed on a plane parallel to the XY plane. Further, the light emitting surface 21 and the upper surface of the base member 28 are flush with each other.
  • the light emitting device 2 power is independently supplied from the driving IC to the light emitting elements 23r, 23g, and 23b through the wiring portion 5, the leads 25r, 25g, and 25b, and the leads 26r, 26g, and 26b. Thereby, the light emission intensity of the light emitting elements 23r, 23g, and 23b is individually adjusted, and the light emitting device 2 can emit visible light of any color from the light emitting surface 21 with any intensity.
  • the protection unit 3 will be described with reference to FIGS. 2, 5A, and 5B.
  • the protection unit 3 connects the light emitting device 2 and the mounting surface 11 of the circuit board 4 along the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 of the light emitting device 2. cover. Thereby, the protection part 3 seals the light emitting device 2 and the mounting surface 11 of the circuit board 4.
  • the protection unit 3 has an adhesive layer on the surface facing the circuit board 4.
  • the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 through the adhesive layer.
  • the protection unit 3 is a flexible film made of a dark resin having waterproofness.
  • the dark resin is a silicon resin to which a black colorant is added.
  • the black colorant is carbon black.
  • the visible light absorptance of the protection part 3 is adjusted by the addition amount of the colorant or the thickness T1 of the protection part 3. Note that the thickness T1 of the protection part 3 is the thickness in the Z-axis direction.
  • the dark color in the protection unit 3 may be an achromatic color or a chromatic color.
  • the absorptivity of the protective part 3 with respect to visible light is preferably 50% or more, and more preferably 70% or more.
  • the visible light transmittance in the protection part 3 is preferably 50% or less, and more preferably 30% or less.
  • the thickness T1 of the protection part 3 is, for example, 100 ⁇ m to 400 ⁇ m.
  • the thickness T1 of the protective part 3 is preferably 150 ⁇ m to 300 ⁇ m, and particularly preferably 190 ⁇ m to 210 ⁇ m, from the viewpoint of flexibility and durability.
  • FIG. 5A shows the reflection of ambient light in the display unit 1.
  • the protection unit 3 absorbs visible light
  • the ambient light that reaches the display unit 1 is absorbed by the protection unit 3, and the wiring unit 5, the connection unit 6, and the base of the circuit board 4.
  • the display unit 1 Before reaching the side surface 28a of the member 28, it decays. Therefore, the display unit 1 can suppress the reflection of ambient light.
  • ambient light reflected by the wiring part 5 and the connection part 6 of the circuit board 4 and ambient light reflected by the side face 28a of the base member 28 are also absorbed by the protection part 3 and attenuated.
  • the display unit 1 can also suppress the ambient light reflected by the wiring portion 5 and the connection portion 6 of the circuit board 4 and the ambient light reflected by the side surface 28 a of the base member 28 from being emitted from the display unit 1. .
  • the emitted light from the light emitting device 2 is only absorbed by the protection unit 3 when passing through the protection unit 3, so that the decrease in the brightness of the image displayed on the display unit 1 is small.
  • the protection part 3 does not absorb visible light
  • the ambient light is not attenuated
  • the wiring part 5, the connection part 6, and the base member 28 of the circuit board 4 are not attenuated.
  • the side surface 28a Incident to the side surface 28a.
  • the ambient light reflected by the wiring portion 5 and the connection portion 6 of the circuit board 4 and the ambient light reflected by the side surface 28a of the base member 28 are emitted from the display unit 1 without being attenuated.
  • the contrast of the displayed image is lowered by the ambient light emitted from the display unit 1.
  • the protection unit 3 absorbs visible light
  • the display unit 1 suppresses the reflection of the ambient light in the display unit 1 and the emission of the ambient light reflected by the display unit 1.
  • the contrast of the displayed image can be improved.
  • FIG. 1 the protection part 3 has a uniform thickness T1.
  • the protection part 3 has a thin part 32.
  • the configurations of the light emitting device 2 and the circuit board 4 are the same as those in the first embodiment.
  • the protection part 3 and the display unit 1 in this Embodiment are demonstrated with reference to FIG. 6, FIG.
  • the protection unit 3 includes a thin portion 32 that is the bottom of the recess 31.
  • the thickness Th1 of the thin portion 32 is smaller than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 of the protection unit 3 described later.
  • the content per unit volume of carbon black in the thin portion 32 of the protection part 3 is the same as the content per unit volume of carbon black in the second area A2 and the third area A3 of the protection part 3.
  • the recess 31 opens on the surface of the protection unit 3 that faces the circuit board 4 when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4.
  • the recess 31 is formed at a position corresponding to the light emitting device 2 mounted on the circuit board 4 by press working.
  • the protection unit 3 is mounted on the light emitting device 2 and the circuit board 4 along the light emitting surface 21, the circuit board 4 mounting surface 11, and the side surface 28 a of the base member 28. 11 and cover.
  • the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 through the adhesive layer.
  • the thin part 32 of the protection part 3 is in close contact with the upper surface of the light emitting device 2 including the light emitting surface 21.
  • the top surface of the light emitting device 2 is a surface located on the front side of the display unit 1 when the light emitting device 2 is mounted on the circuit board 4.
  • the thickness of the protection part 3, and the emitted light and ambient light from the light-emitting device 2 are demonstrated. Note that, in the protection unit 3, the region that is in close contact with the light emitting surface 21 of the light emitting device 2 is in close contact with the first region A 1, the region that is in close contact with the mounting surface 11 of the circuit board 4 is in close contact with the side region 28 a of the base member 28.
  • the area to be performed is referred to as a third area A3.
  • the thin portion 32 of the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2. Therefore, the thickness of the first region A1 of the protection unit 3 is Th1, which is smaller than the thickness Th2 of the second region A2 of the protection unit 3 and the thickness Th3 of the third region A3 of the protection unit 3. Note that the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 may be the same or different.
  • the thickness Th1 of the first region A1 is thinner than the thicknesses Th2 and Th3 of the second region A2 and the third region A3, absorption of the emitted light from the light emitting device 2 by the protection unit 3 is suppressed.
  • the absorption rate R of the resin with respect to visible light decreases exponentially as the resin thickness L decreases. Therefore, the protection unit 3 can remarkably suppress the attenuation of the emitted light from the light emitting device 2.
  • the protection unit 3 suppresses the reflection of the ambient light in the display unit 1 and the emission of the ambient light reflected by the display unit 1 as in the first embodiment. it can.
  • the thickness Th1 of the first region A1 is preferably 10 ⁇ m to 100 ⁇ m, and more preferably 40 ⁇ m to 60 ⁇ m.
  • the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 are preferably 100 ⁇ m to 400 ⁇ m, and more preferably 150 ⁇ m to 250 ⁇ m.
  • the visible light absorptance of the first region A1 is preferably 30% or less, and more preferably 20% or less, from the viewpoint of suppressing the attenuation of the emitted light from the light emitting device 2.
  • the visible light transmittance of the first region A1 is preferably 70% or more, and more preferably 80% or more.
  • the visible light absorptance of the second region A2 and the third region A3 is preferably 50% or more and 70% or more from the viewpoint of suppressing reflection of ambient light and emission of reflected ambient light. It is more preferable.
  • the visible light transmittance of the second region A2 and the third region A3 is preferably 50% or less, and more preferably 30% or less.
  • the circuit board 4 on which the wiring part 5 is formed and the light emitting device 2 are prepared.
  • the light emitting device 2 is mounted on the circuit board 4 by soldering the leads 25r, 25g, and 25b of the light emitting device 2 and the leads 26r, 26g, and 26b to the wiring portion 5 of the circuit board 4.
  • the protection unit 3 is arranged so that the surface on which the concave portion 31 is formed is opposed to the circuit board 4 and the positions of the thin portion 32 and the light emitting surface 21 of the light emitting device 2 are aligned. It arranges in.
  • the circuit board 4 provided with the protection unit 3 is installed in a vacuum heating apparatus. Then, the inside of a vacuum heating apparatus is heated and pressure-reduced. Due to the reduced pressure, the thin part 32 of the protection part 3 is stuck to the light emitting surface 21 of the light emitting device 2. Further, the portion excluding the thin portion 32 of the protection portion 3 extends by heating and is adhered to the mounting surface 11 of the circuit board 4 and the side surface 28a of the base member 28. Finally, the vacuum heating device is returned to room temperature and normal pressure, and the display unit 1 is taken out from the vacuum heating device. The protection part 3 is pressed by atmospheric pressure, and the light emitting surface 21 of the light emitting device 2 and the thin part 32 of the protection part 3 are in close contact with each other. Further, the portion excluding the thin portion 32 of the protection portion 3 is in close contact with the mounting surface 11 of the circuit board 4 or the side surface 28 a of the base member 28. Thus, the display unit 1 can be manufactured.
  • the display unit 1 in the present embodiment can remarkably suppress the attenuation of the emitted light from the light emitting device 2. Therefore, it is not necessary to increase the amount of power supplied to the light emitting device 2 and increase the amount of light emitted from the light emitting device 2. Further, the display unit 1 can suppress the reflection of the ambient light on the display unit 1 and the emission of the ambient light reflected by the display unit 1, and can improve the contrast of the image displayed on the display unit 1.
  • Embodiment 3 FIG.
  • the recess 31 is formed on the surface of the protection unit 3 that faces the circuit board 4.
  • the recess 31 is formed on the surface of the protection unit 3 opposite to the surface facing the circuit board 4.
  • the configurations of the light emitting device 2 and the circuit board 4 are the same as those in the first embodiment.
  • the protection unit 3 and the display unit 1 in the present embodiment will be described with reference to FIGS.
  • the protection unit 3 includes a thin portion 32 that is the bottom of the recess 31.
  • the thickness Th1 of the thin portion 32 is thinner than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 of the protection unit 3 as in the second embodiment.
  • the recess 31 opens on a surface opposite to the surface facing the circuit board 4 when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4.
  • the recess 31 is formed at a position corresponding to the light emitting device 2 mounted on the circuit board 4 by press working.
  • the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4, the protection unit 3 surrounds the light emitting surface 21 of the light emitting device 2 and includes a protrusion 33 protruding in the Z-axis direction.
  • the convex portion 33 of the protection portion 3 functions as a ridge that prevents ambient light from entering the light emitting surface 21 of the light emitting device 2.
  • the ambient light incident on the light emitting surface 21 of the light emitting device 2 is reduced, so that the ambient light reflected from the light emitting surface 21 and the bottom surface of the recess 29 of the light emitting device 2 and emitted from the display unit 1 is reduced. Therefore, the display unit 1 can further improve the contrast of the image displayed on the display unit 1.
  • the protection unit 3 is mounted on the light emitting device 2 and the circuit board 4 along the light emitting surface 21, the circuit board 4 mounting surface 11, and the side surface 28 a of the base member 28. 11 and cover.
  • the thin part 32 of the protection part 3 is in close contact with the upper surface of the light emitting device 2 including the light emitting surface 21.
  • the thickness Th1 of the first region A1 of the protection unit 3 is the same as that of the second region A2 of the protection unit 3 as in the second embodiment. It becomes thinner than the thicknesses Th2 and Th3 of the region A3. Therefore, the display unit 1 in the present embodiment can remarkably suppress the absorption of the emitted light from the light emitting device 2 by the protection unit 3 as in the second embodiment. Further, in the second region A2 and the third region A3, the protection unit 3 reflects the ambient light on the display unit 1 and emits the ambient light reflected on the display unit 1 as in the first and second embodiments. Can be suppressed.
  • the light-emitting device 2 is configured such that the protective portion 3 has a surface on which the concave portion 31 is not formed opposed to the circuit board 4 and the positions of the thin-walled portion 32 and the light-emitting surface 21 of the light-emitting device 2 are aligned. It is disposed on the mounted circuit board 4.
  • the circuit board 4 provided with the protection unit 3 is installed in a vacuum heating apparatus. Then, the inside of a vacuum heating apparatus is heated and pressure-reduced. Due to the reduced pressure, the thin part 32 of the protection part 3 is stuck to the light emitting surface 21 of the light emitting device 2. Further, the portion excluding the thin portion 32 of the protection portion 3 is extended by heating and is adhered to the side surface 28 a of the light emitting device 2 and the mounting surface 11 of the circuit board 4. In this case, the outer edge portion 31 a that forms the outer edge of the concave portion 31 of the protection portion 3 protrudes from the upper surface of the light emitting device 2 in the Z-axis direction to form a convex portion 33 surrounding the light emitting surface 21 of the light emitting device 2. Thus, the display unit 1 can be manufactured.
  • the display unit 1 in the present embodiment is an image displayed on the display unit 1.
  • the contrast can be further improved.
  • the display unit 1 can remarkably suppress the attenuation of the emitted light from the light emitting device 2 as in the second embodiment.
  • the display unit 1 can suppress reflection of ambient light on the display unit 1 and emission of ambient light reflected by the display unit 1.
  • Embodiment 4 FIG.
  • the display device 41 includes a plurality of display units 1 in the third embodiment. As illustrated in FIG. 10, the display device 41 includes 16 display units 1 combined in a tile shape.
  • the display device 41 is installed outdoors such as a stadium or a building wall. By changing the number of display units 1 included in the display device 41, display devices 41 of various sizes can be manufactured.
  • the display device 41 is composed of the display unit 1, the contrast of the image displayed on the display device 41 can be improved as with the display unit 1.
  • the base member 28 is not limited to a cubic shape having the recesses 29 but may be a flat plate shape.
  • the protection unit 3 is in close contact with the light emitting surface 21 and the side surface of the flat plate.
  • the base member 28 may be a substrate on which a wiring pattern is printed.
  • the sealing part 27 is not limited to silicon resin, but is optional.
  • the sealing part 27 may be an epoxy resin.
  • the sealing part 27 may include a dispersant and a phosphor.
  • the shape of the light emitting surface 21 may be a convex shape with a central portion protruding in the Z-axis direction or a concave shape with a central portion recessed in the Z-axis direction.
  • the light emitting device 2 is not limited to the 3 in 1 type.
  • the light emitting device 2 may be a light emitting device that emits monochromatic light in which one light emitting element is mounted on one base member 28.
  • the light emitting device 2 may include four or more light emitting elements.
  • the number of the light emitting devices 2 mounted on the circuit board 4 is not limited to 4 rows ⁇ 4 columns and is arbitrary.
  • the light emitting device 2 may be mounted on the circuit board 4 in 128 rows ⁇ 128 columns or 256 rows ⁇ 256 columns.
  • the arrangement of the light emitting devices 2 is not limited to a square lattice, and is arbitrary.
  • the light emitting devices 2 may be arranged in an orthorhombic lattice, a hexagonal lattice, a rectangular lattice, a staggered lattice, or the like.
  • the circuit board 4 may be provided with a blank space where the light emitting device 2 is not disposed.
  • the distance D between the light emitting devices 2 is not limited to 8 mm, and is arbitrary.
  • the protection unit 3 may be made of a waterproof resin such as a polyester resin, a polycarbonate resin, or an acrylic resin. Further, the colorant added to the resin is not limited to carbon black, and is arbitrary. The colorant added to the resin may be a dye composition.
  • the protection part 3 is not limited to a plastic film, and may be a molded resin member.
  • the thickness Th1 of the first region A1 is not limited to the case where the thickness Th1 of the first region A1 is smaller than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3. Even when the thickness Th2 of the second region A2 or the thickness Th3 of the third region A3 is thinner, the display unit 1 can remarkably suppress the attenuation of the emitted light from the light emitting device 2.
  • the content of carbon black per unit volume in the first region A1 of the protection part 3 is made smaller than the content of carbon black per unit volume in the second region A2 and the third region A3 of the protection unit 3. Also good. Thereby, the absorptance with respect to visible light in the first area A1 becomes smaller than the absorptance with respect to visible light in the second area A2 and the third area A3, and the display unit 1 emits light as in the second and third embodiments. Attenuation of light emitted from the device 2 can be remarkably suppressed.
  • An air layer may be provided between the protection unit 3, the mounting surface 11 of the circuit board 4, the light emitting surface 21 of the light emitting device 2, and the side surface 28 a of the base member 28.
  • the display unit 1 and the display device 41 may include a louver on the mounting surface 11 of the circuit board 4 to prevent ambient light from entering the light emitting device 2 and the circuit board 4.
  • the display device 41 may be installed indoors, such as in a gymnasium or indoor pool.
  • the display device 41 may be configured by combining a plurality of the display units 1 in the first embodiment or the display units 1 in the second embodiment.
  • the display device 41 may be configured, for example, by combining a plurality of the display units 1 in the second embodiment and the display units 1 in the third embodiment.
  • the number of display units 1 provided in the display device 41 is arbitrary.

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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Abstract

A display unit (1) is provided with: a circuit board (4); a plurality of light emitting devices (2) mounted on a mounting surface (11) of the circuit board (4); and a protection section (3) covering the light emitting devices (2) and the mounting surface (11) of the circuit board (4). The protection section (3) absorbs visible light.

Description

表示ユニット及び表示装置Display unit and display device
　本発明は、表示ユニット及び表示装置に関する。 The present invention relates to a display unit and a display device.
　複数の表示ユニットが組み合わされて構成された表示装置が、知られている。各表示ユニットは、回路基板と、回路基板に実装された発光装置とを備える。各発光装置は、例えば、特許文献１に記載されている、白色のパッケージに発光素子を実装した発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）から構成される。発光装置は、回路基板に形成された配線に電気的に接続される。 A display device configured by combining a plurality of display units is known. Each display unit includes a circuit board and a light emitting device mounted on the circuit board. Each light-emitting device includes, for example, a light-emitting diode (LED: Light Emitting Diode) described in Patent Document 1 in which a light-emitting element is mounted on a white package. The light emitting device is electrically connected to the wiring formed on the circuit board.
　また、表示ユニットには、発光装置と回路基板の配線とを保護するために、水と塵埃の浸入を防ぐ保護部が設けられる。特許文献２は、保護部によって、発光装置と発光装置が実装された回路基板の実装面とを密封された、表示装置を開示している。発光装置からの出射光を高効率で出射させるために、可視光に対して透過率が高い樹脂が、保護部に用いられる。 In addition, the display unit is provided with a protection unit that prevents water and dust from entering in order to protect the light emitting device and the wiring of the circuit board. Patent Document 2 discloses a display device in which a light-emitting device and a mounting surface of a circuit board on which the light-emitting device is mounted are sealed by a protection unit. In order to emit light emitted from the light-emitting device with high efficiency, a resin having a high transmittance with respect to visible light is used for the protective portion.
特開２０１１－２１１０３２号公報JP 2011-211032 A 特開２０１６－１２０７０号公報Japanese Patent Laid-Open No. 2016-12070
　保護部の可視光に対する透過率が高い場合、太陽光と照明とを含む表示ユニットの周囲から表示ユニットに入射する周囲光も、保護部を透過して、発光装置と回路基板に入射する。発光装置のパッケージは、白色であるので、周囲光を高い反射率で反射する。また、配線は、回路基板上に露出しているので、周囲光を高い反射率で反射する。 When the transmittance of the protective part with respect to visible light is high, ambient light that enters the display unit from the periphery of the display unit including sunlight and illumination also passes through the protective part and enters the light emitting device and the circuit board. Since the light emitting device package is white, it reflects ambient light with high reflectivity. Moreover, since the wiring is exposed on the circuit board, ambient light is reflected with high reflectance.
　発光装置のパッケージと回路基板の配線とによって反射された周囲光は、保護部を再び透過して表示ユニットから出射し、表示ユニットが表示する画像のコントラストを低下させる。 Ambient light reflected by the package of the light emitting device and the wiring of the circuit board is again transmitted through the protection unit and emitted from the display unit, thereby reducing the contrast of the image displayed by the display unit.
　本発明は、上記実情に鑑みてなされたものであり、周囲光の反射と反射された周囲光の出射が抑制された表示ユニット及び表示装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a display unit and a display device in which reflection of ambient light and emission of reflected ambient light are suppressed.
　本発明に係る表示ユニットは、回路基板と、回路基板の実装面に実装された複数の発光装置と、回路基板の実装面と複数の発光装置とを覆う保護部とを備える。保護部は可視光を吸収する。 The display unit according to the present invention includes a circuit board, a plurality of light emitting devices mounted on the mounting surface of the circuit board, and a protection unit that covers the mounting surface of the circuit board and the plurality of light emitting devices. The protective part absorbs visible light.
　本発明によれば、保護部が可視光を吸収するので、表示ユニットにおける周囲光の反射と表示ユニットに反射された周囲光の出射とを抑制でき、表示ユニットに表示される画像のコントラストを向上できる。 According to the present invention, since the protective part absorbs visible light, reflection of ambient light in the display unit and emission of ambient light reflected by the display unit can be suppressed, and the contrast of an image displayed on the display unit is improved. it can.
本発明の実施の形態１に係る表示ユニットの模式図Schematic diagram of a display unit according to Embodiment 1 of the present invention. 図１の表示ユニットをＡ－Ａ線で矢視した断面図1 is a cross-sectional view of the display unit of FIG. 1 taken along line AA. 本発明の実施の形態１に係る発光装置の上面図1 is a top view of a light emitting device according to Embodiment 1 of the present invention. 本発明の実施の形態１に係る発光装置の側面図Side view of light-emitting device according to Embodiment 1 of the present invention. 図１の表示ユニットをＢ－Ｂ線で矢視した断面における周囲光の反射を示す模式図Schematic diagram showing the reflection of ambient light at the cross section of the display unit of FIG. 比較例に係る表示ユニットにおける周囲光の反射を示す模式図Schematic diagram showing reflection of ambient light in a display unit according to a comparative example 本発明の実施の形態２に係る保護部の拡大断面図The expanded sectional view of the protection part which concerns on Embodiment 2 of this invention 本発明の実施の形態２に係る表示ユニットの断面図Sectional drawing of the display unit which concerns on Embodiment 2 of this invention 本発明の実施の形態３に係る保護部の拡大断面図The expanded sectional view of the protection part which concerns on Embodiment 3 of this invention 本発明の実施の形態３に係る表示ユニット断面図Cross-sectional view of a display unit according to Embodiment 3 of the present invention 本発明の実施の形態４に係る表示装置の斜視図The perspective view of the display apparatus which concerns on Embodiment 4 of this invention.
　本発明を実施するための形態について、図面を参照して説明する。なお、図面において、同一又は相当する部分には同一の符号を付している。同一又は相当する部分の説明は、適宜、省略する。また、図面において、図面に示す部分の大きさ、形状等が誇張されている場合がある。 Embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals. Description of the same or corresponding parts will be omitted as appropriate. In the drawings, the size, shape, and the like of parts shown in the drawings may be exaggerated.
　実施の形態１．
　図１～図５Ｂを参照して、本発明の実施の形態１における表示ユニット１について説明する。理解を容易にするために、表示ユニット１の正面である表示面が地面に対して垂直に設置されたと仮定し、正面方向をＺ軸方向、左右方向をＸ軸方向、上下方向をＹ軸方向として説明する。他の実施の形態においても同様である。 Embodiment 1 FIG.
The display unit 1 in Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 5B. For easy understanding, it is assumed that the display surface that is the front of the display unit 1 is installed perpendicular to the ground, the front direction is the Z-axis direction, the left-right direction is the X-axis direction, and the vertical direction is the Y-axis direction. Will be described. The same applies to other embodiments.
　図１、図２に示すように、表示ユニット１は、正方形の回路基板４と、回路基板４の実装面１１に実装された複数の発光装置２と、発光装置２と回路基板４の実装面１１とを覆う保護部３とを備える。 As shown in FIGS. 1 and 2, the display unit 1 includes a square circuit board 4, a plurality of light emitting devices 2 mounted on a mounting surface 11 of the circuit board 4, and mounting surfaces of the light emitting device 2 and the circuit board 4. 11 is provided.
　発光装置２は、４行×４列の正方格子状に、回路基板４の実装面１１に実装される。発光装置２は、後述するベース部材２８の上面を表示ユニット１の正面側に配置して、実装面１１に実装される。発光装置２間の間隔Ｄは、例えば、８ｍｍである。発光装置２の詳細については、後述する。 The light emitting device 2 is mounted on the mounting surface 11 of the circuit board 4 in a 4 × 4 square lattice pattern. The light emitting device 2 is mounted on the mounting surface 11 with the upper surface of a base member 28 described later disposed on the front side of the display unit 1. The interval D between the light emitting devices 2 is, for example, 8 mm. Details of the light emitting device 2 will be described later.
　回路基板４は、絶縁性の樹脂材料から構成される。回路基板４は、実装面１１に発光装置２と電気的に接続する配線部５を有する。配線部５は、金属製の配線である。また、配線部５に接続された、図示しない駆動ＩＣ（ＩＣ：Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ）が、回路基板４に設けられる。 The circuit board 4 is made of an insulating resin material. The circuit board 4 has a wiring portion 5 that is electrically connected to the light emitting device 2 on the mounting surface 11. The wiring part 5 is a metal wiring. Further, a driving IC (IC: Integrated Circuit) (not shown) connected to the wiring unit 5 is provided on the circuit board 4.
　保護部３は、発光装置２と回路基板４の実装面１１とを覆い、水と塵埃の浸入を防ぐ。また、保護部３は可視光を吸収する。保護部３の詳細については、後述する。 The protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4 to prevent water and dust from entering. Moreover, the protection part 3 absorbs visible light. Details of the protection unit 3 will be described later.
　表示ユニット１では、駆動ＩＣが発光装置２に電力を供給し、発光装置２は任意の色の可視光を任意の強度で出射する。その結果、表示ユニット１に画像が表示される。 In the display unit 1, the driving IC supplies power to the light emitting device 2, and the light emitting device 2 emits visible light of an arbitrary color with an arbitrary intensity. As a result, an image is displayed on the display unit 1.
　次に、図２～図４を参照して、発光装置２について説明する。発光装置２は、３ｉｎ１型の発光装置である。発光装置２は、それぞれが赤色光、緑色光、青色光を発光する発光素子２３ｒ、２３ｇ、２３ｂと、発光素子２３ｒ、２３ｇ、２３ｂが実装されるベース部材２８と、発光素子２３ｒ、２３ｇ、２３ｂをベース部材２８内に封止する封止部２７とを備える。発光装置２は、さらに、発光素子２３ｒ、２３ｇ、２３ｂと回路基板４の配線部５とを電気的に接続する、リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂとを備える。 Next, the light emitting device 2 will be described with reference to FIGS. The light emitting device 2 is a 3 in 1 type light emitting device. The light emitting device 2 includes light emitting elements 23r, 23g, and 23b that emit red light, green light, and blue light, a base member 28 on which the light emitting elements 23r, 23g, and 23b are mounted, and light emitting elements 23r, 23g, and 23b, respectively. And a sealing portion 27 that seals the inside of the base member 28. The light emitting device 2 further includes leads 25r, 25g, 25b and leads 26r, 26g, 26b that electrically connect the light emitting elements 23r, 23g, 23b and the wiring part 5 of the circuit board 4.
　ベース部材２８は、絶縁性の白色樹脂から構成された立方体形状の筐体である。本実施の形態では、ベース部材２８は、パッケージとして機能する。ベース部材２８は、上面に開口する凹部２９を備える。発光装置２が回路基板４の実装面１１に実装された場合に、ベース部材２８の上面が表示ユニット１の正面側に配置される。ベース部材２８の側面２８ａは、回路基板４の実装面１１に対して垂直となる。ベース部材２８の側面２８ａは、ベース部材２８の外表面である。また、ベース部材２８の側面２８ａは、発光装置２の外部との接触面であり、発光装置２の外表面でもある。 The base member 28 is a cubic housing made of an insulating white resin. In the present embodiment, the base member 28 functions as a package. The base member 28 includes a recess 29 that opens on the upper surface. When the light emitting device 2 is mounted on the mounting surface 11 of the circuit board 4, the upper surface of the base member 28 is disposed on the front side of the display unit 1. The side surface 28 a of the base member 28 is perpendicular to the mounting surface 11 of the circuit board 4. A side surface 28 a of the base member 28 is an outer surface of the base member 28. Further, the side surface 28 a of the base member 28 is a contact surface with the outside of the light emitting device 2 and is also an outer surface of the light emitting device 2.
　発光素子２３ｒ、２３ｇ、２３ｂは、表面実装型の発光素子である。発光素子２３ｒ、２３ｇ、２３ｂは、例えば、ＬＥＤ素子、レーザダイオード（ＬＤ：Ｌａｓｅｒ　Ｄｉｏｄｅ）素子である。発光素子２３ｒ、２３ｇ、２３ｂは、ベース部材２８の凹部２９の底面において、等間隔で、Ｙ軸方向に一列に配列される。 The light emitting elements 23r, 23g, and 23b are surface mount type light emitting elements. The light emitting elements 23r, 23g, and 23b are, for example, LED elements and laser diode (LD) elements. The light emitting elements 23r, 23g, and 23b are arranged in a line in the Y-axis direction at equal intervals on the bottom surface of the recess 29 of the base member 28.
　リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂは、発光素子２３ｒ、２３ｇ、２３ｂに電力を供給する。リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂの一方の端部は、ベース部材２８の凹部２９の底面に配置される。リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂは、凹部２９の底面からベース部材２８の側面２８ａを経て、ベース部材２８の底面まで延びる。リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂの他方の端部は、ベース部材２８の底面に配置される。発光素子２３ｒ、２３ｇ、２３ｂは、それぞれ、リード２５ｒ、２５ｇ、２５ｂの一方の端部のそれぞれに積層される。これにより、発光素子２３ｒ、２３ｇ、２３ｂとリード２５ｒ、２５ｇ、２５ｂは、電気的に接続される。また、発光素子２３ｒ、２３ｇ、２３ｂとリード２６ｒ、２６ｇ、２６ｂの一方の端部は、それぞれ、ワイヤ２４により電気的に接続される。 The leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b supply power to the light emitting elements 23r, 23g, and 23b. One end of each of the leads 25r, 25g, 25b and the leads 26r, 26g, 26b is disposed on the bottom surface of the recess 29 of the base member 28. The leads 25r, 25g, 25b and the leads 26r, 26g, 26b extend from the bottom surface of the recess 29 to the bottom surface of the base member 28 through the side surface 28a of the base member 28. The other ends of the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b are disposed on the bottom surface of the base member 28. The light emitting elements 23r, 23g, and 23b are stacked on one end portions of the leads 25r, 25g, and 25b, respectively. Thereby, the light emitting elements 23r, 23g, and 23b and the leads 25r, 25g, and 25b are electrically connected. Further, one end portions of the light emitting elements 23r, 23g, and 23b and the leads 26r, 26g, and 26b are electrically connected by wires 24, respectively.
　リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂの他方の端部と、回路基板４の配線部５に設けられた接続部６が、電気的に接続する。リード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂの他方の端部と、接続部６とは、例えば、リフロー方式のハンダ付けによって、電気的に接続される。 The other ends of the leads 25r, 25g, and 25b and the leads 26r, 26g, and 26b are electrically connected to the connection portion 6 provided on the wiring portion 5 of the circuit board 4. The other ends of the leads 25r, 25g, and 25b, the leads 26r, 26g, and 26b and the connecting portion 6 are electrically connected, for example, by reflow soldering.
　封止部２７は、発光素子２３ｒ、２３ｇ、２３ｂの発光光に対して透光性を有するシリコン樹脂である。封止部２７は、内周面２８ｂにより形成された凹部２９の内部空間に充填されて、発光素子２３ｒ、２３ｇ、２３ｂを封止する。これにより、封止部２７は、水と塵埃とから、発光素子２３ｒ、２３ｇ、２３ｂとリード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂとを保護する。 The sealing portion 27 is a silicon resin that transmits light emitted from the light emitting elements 23r, 23g, and 23b. The sealing portion 27 fills the internal space of the concave portion 29 formed by the inner peripheral surface 28b, and seals the light emitting elements 23r, 23g, and 23b. Thereby, the sealing part 27 protects the light emitting elements 23r, 23g, 23b, the leads 25r, 25g, 25b and the leads 26r, 26g, 26b from water and dust.
　封止部２７における発光装置２の外部との接触面は、発光素子２３ｒ、２３ｇ、２３ｂの発光光が発光装置２の外部に出射する光出射面２１となる。本実施の形態では、光出射面２１は、ＸＹ平面に平行な平面に形成される。また、光出射面２１とベース部材２８の上面は面一となる。 The contact surface of the sealing portion 27 with the outside of the light emitting device 2 is a light emitting surface 21 through which the light emitted from the light emitting elements 23r, 23g, and 23b is emitted to the outside of the light emitting device 2. In the present embodiment, the light emitting surface 21 is formed on a plane parallel to the XY plane. Further, the light emitting surface 21 and the upper surface of the base member 28 are flush with each other.
　発光装置２では、電力は、駆動ＩＣから配線部５とリード２５ｒ、２５ｇ、２５ｂ、リード２６ｒ、２６ｇ、２６ｂとを介して、発光素子２３ｒ、２３ｇ、２３ｂのそれぞれに独立に供給される。これにより、発光素子２３ｒ、２３ｇ、２３ｂの発光強度が個別に調整され、発光装置２は、光出射面２１から、任意の色の可視光を任意の強度で出射できる。 In the light emitting device 2, power is independently supplied from the driving IC to the light emitting elements 23r, 23g, and 23b through the wiring portion 5, the leads 25r, 25g, and 25b, and the leads 26r, 26g, and 26b. Thereby, the light emission intensity of the light emitting elements 23r, 23g, and 23b is individually adjusted, and the light emitting device 2 can emit visible light of any color from the light emitting surface 21 with any intensity.
　図２、図５Ａ、図５Ｂを参照して、保護部３について説明する。
　保護部３は、発光装置２の光出射面２１と回路基板４の実装面１１と発光装置２のベース部材２８の側面２８ａとに沿って、発光装置２と回路基板４の実装面１１とを覆う。これにより、保護部３は、発光装置２と回路基板４の実装面１１とを密封する。 The protection unit 3 will be described with reference to FIGS. 2, 5A, and 5B.
The protection unit 3 connects the light emitting device 2 and the mounting surface 11 of the circuit board 4 along the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 of the light emitting device 2. cover. Thereby, the protection part 3 seals the light emitting device 2 and the mounting surface 11 of the circuit board 4.
　また、保護部３は、回路基板４に対向する面に粘着層を有する。保護部３は、粘着層を介して、発光装置２の光出射面２１と回路基板４の実装面１１とベース部材２８の側面２８ａとに密着する。 Further, the protection unit 3 has an adhesive layer on the surface facing the circuit board 4. The protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 through the adhesive layer.
　保護部３は暗色であり、可視光を吸収する。保護部３は、防水性を有する暗色の樹脂から構成された可撓性フィルムである。暗色の樹脂は、黒色の着色剤が添加されたシリコン樹脂である。黒色の着色剤は、カーボンブラックである。保護部３の可視光に対する吸収率は、着色剤の添加量又は保護部３の厚さＴ１によって、調整される。なお、保護部３の厚さＴ１は、Ｚ軸方向の厚さである。 Protective part 3 is dark and absorbs visible light. The protection unit 3 is a flexible film made of a dark resin having waterproofness. The dark resin is a silicon resin to which a black colorant is added. The black colorant is carbon black. The visible light absorptance of the protection part 3 is adjusted by the addition amount of the colorant or the thickness T1 of the protection part 3. Note that the thickness T1 of the protection part 3 is the thickness in the Z-axis direction.
　保護部３における暗色は、無彩色であっても有彩色であってもよい。視認テストの結果から、保護部３の可視光に対する吸収率は、５０％以上であることが好ましく、７０％以上であることがより好ましい。換言すると、保護部３における可視光の透過率は、５０％以下であることが好ましく、３０％以下であることがより好ましい。
　また、保護部３の厚さＴ１は、例えば、１００μｍ～４００μｍである。保護部３の厚さＴ１は、柔軟性と耐久性の観点から、１５０μｍ～３００μｍであることが好ましく、特に１９０μｍ～２１０μｍであることが好ましい。 The dark color in the protection unit 3 may be an achromatic color or a chromatic color. From the result of the visual test, the absorptivity of the protective part 3 with respect to visible light is preferably 50% or more, and more preferably 70% or more. In other words, the visible light transmittance in the protection part 3 is preferably 50% or less, and more preferably 30% or less.
Further, the thickness T1 of the protection part 3 is, for example, 100 μm to 400 μm. The thickness T1 of the protective part 3 is preferably 150 μm to 300 μm, and particularly preferably 190 μm to 210 μm, from the viewpoint of flexibility and durability.
　図５Ａは、表示ユニット１における周囲光の反射を示す。本実施の形態においては、保護部３が可視光を吸収するので、表示ユニット１に達した周囲光は、保護部３に吸収されて、回路基板４の配線部５と接続部６と、ベース部材２８の側面２８ａとに達する前に減衰する。したがって、表示ユニット１は、周囲光の反射を抑制できる。さらに、回路基板４の配線部５と接続部６に反射された周囲光と、ベース部材２８の側面２８ａに反射された周囲光も、保護部３に吸収されて、減衰する。したがって、表示ユニット１は、回路基板４の配線部５と接続部６に反射された周囲光と、ベース部材２８の側面２８ａに反射された周囲光が、表示ユニット１から出射することも抑制できる。一方、発光装置２からの出射光は、保護部３を透過する場合に保護部３に吸収されるに過ぎないので、表示ユニット１に表示される画像の明るさの低下は小さい。 FIG. 5A shows the reflection of ambient light in the display unit 1. In the present embodiment, since the protection unit 3 absorbs visible light, the ambient light that reaches the display unit 1 is absorbed by the protection unit 3, and the wiring unit 5, the connection unit 6, and the base of the circuit board 4. Before reaching the side surface 28a of the member 28, it decays. Therefore, the display unit 1 can suppress the reflection of ambient light. Furthermore, ambient light reflected by the wiring part 5 and the connection part 6 of the circuit board 4 and ambient light reflected by the side face 28a of the base member 28 are also absorbed by the protection part 3 and attenuated. Therefore, the display unit 1 can also suppress the ambient light reflected by the wiring portion 5 and the connection portion 6 of the circuit board 4 and the ambient light reflected by the side surface 28 a of the base member 28 from being emitted from the display unit 1. . On the other hand, the emitted light from the light emitting device 2 is only absorbed by the protection unit 3 when passing through the protection unit 3, so that the decrease in the brightness of the image displayed on the display unit 1 is small.
　比較例として、保護部３が可視光を吸収しないと仮定すると、図５Ｂに示すように、周囲光は、減衰せずに、回路基板４の配線部５と接続部６と、ベース部材２８の側面２８ａとに入射する。また、回路基板４の配線部５と接続部６に反射された周囲光と、ベース部材２８の側面２８ａに反射された周囲光も、減衰せずに、表示ユニット１から出射する。比較例においては、表示ユニット１から出射した周囲光により、表示される画像のコントラストは低下する。 As a comparative example, assuming that the protection part 3 does not absorb visible light, as shown in FIG. 5B, the ambient light is not attenuated, and the wiring part 5, the connection part 6, and the base member 28 of the circuit board 4 are not attenuated. Incident to the side surface 28a. Further, the ambient light reflected by the wiring portion 5 and the connection portion 6 of the circuit board 4 and the ambient light reflected by the side surface 28a of the base member 28 are emitted from the display unit 1 without being attenuated. In the comparative example, the contrast of the displayed image is lowered by the ambient light emitted from the display unit 1.
　以上のように、保護部３が可視光を吸収するので、表示ユニット１は、表示ユニット１における周囲光の反射と表示ユニット１に反射された周囲光の出射とを抑制し、表示ユニット１に表示される画像のコントラストを向上できる。 As described above, since the protection unit 3 absorbs visible light, the display unit 1 suppresses the reflection of the ambient light in the display unit 1 and the emission of the ambient light reflected by the display unit 1. The contrast of the displayed image can be improved.
　実施の形態２．
　実施の形態１では、保護部３は、均一な厚さＴ１を有する。本実施の形態２では、保護部３は、薄肉部３２を有する。発光装置２と回路基板４の構成は、実施の形態１と同様である。 Embodiment 2. FIG.
In the first embodiment, the protection part 3 has a uniform thickness T1. In the second embodiment, the protection part 3 has a thin part 32. The configurations of the light emitting device 2 and the circuit board 4 are the same as those in the first embodiment.
　本実施の形態における保護部３と表示ユニット１について、図６、図７を参照して説明する。保護部３は、凹部３１の底部である薄肉部３２を備える。薄肉部３２の厚さＴｈ１は、後述する保護部３の第２領域Ａ２の厚さＴｈ２と第３領域Ａ３の厚さＴｈ３よりも薄い。保護部３の薄肉部３２におけるカーボンブラックの単位体積当たりの含有量と、保護部３の第２領域Ａ２と第３領域Ａ３におけるカーボンブラックの単位体積当たりの含有量は同じである。
　凹部３１は、保護部３が発光装置２と回路基板４の実装面１１とを覆った場合に、保護部３の回路基板４と対向する面に開口する。凹部３１は、プレス加工により、回路基板４に実装された発光装置２に対応する位置に形成される。 The protection part 3 and the display unit 1 in this Embodiment are demonstrated with reference to FIG. 6, FIG. The protection unit 3 includes a thin portion 32 that is the bottom of the recess 31. The thickness Th1 of the thin portion 32 is smaller than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 of the protection unit 3 described later. The content per unit volume of carbon black in the thin portion 32 of the protection part 3 is the same as the content per unit volume of carbon black in the second area A2 and the third area A3 of the protection part 3.
The recess 31 opens on the surface of the protection unit 3 that faces the circuit board 4 when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4. The recess 31 is formed at a position corresponding to the light emitting device 2 mounted on the circuit board 4 by press working.
　保護部３は、図７に示すように、発光装置２の光出射面２１と回路基板４の実装面１１とベース部材２８の側面２８ａとに沿って、発光装置２と回路基板４の実装面１１とを覆う。保護部３は、粘着層を介して、発光装置２の光出射面２１と回路基板４の実装面１１とベース部材２８の側面２８ａとに密着する。保護部３の薄肉部３２は、光出射面２１を含む発光装置２の上面に密着する。なお、発光装置２の上面は、発光装置２が回路基板４に実装された場合に、表示ユニット１の正面側に位置する面である。 As shown in FIG. 7, the protection unit 3 is mounted on the light emitting device 2 and the circuit board 4 along the light emitting surface 21, the circuit board 4 mounting surface 11, and the side surface 28 a of the base member 28. 11 and cover. The protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2, the mounting surface 11 of the circuit board 4, and the side surface 28 a of the base member 28 through the adhesive layer. The thin part 32 of the protection part 3 is in close contact with the upper surface of the light emitting device 2 including the light emitting surface 21. The top surface of the light emitting device 2 is a surface located on the front side of the display unit 1 when the light emitting device 2 is mounted on the circuit board 4.
　図７を参照して、保護部３の厚さと、発光装置２からの出射光と周囲光とについて説明する。なお、保護部３において、発光装置２の光出射面２１に密着する領域を第１領域Ａ１、回路基板４の実装面１１に密着する領域を第２領域Ａ２、ベース部材２８の側面２８ａに密着する領域を第３領域Ａ３とする。 With reference to FIG. 7, the thickness of the protection part 3, and the emitted light and ambient light from the light-emitting device 2 are demonstrated. Note that, in the protection unit 3, the region that is in close contact with the light emitting surface 21 of the light emitting device 2 is in close contact with the first region A 1, the region that is in close contact with the mounting surface 11 of the circuit board 4 is in close contact with the side region 28 a of the base member 28. The area to be performed is referred to as a third area A3.
　本実施の形態において、保護部３の薄肉部３２は発光装置２の光出射面２１に密着する。したがって、保護部３の第１領域Ａ１の厚さは、Ｔｈ１となり、保護部３の第２領域Ａ２の厚さＴｈ２と保護部３の第３領域Ａ３の厚さＴｈ３よりも薄い。なお、第２領域Ａ２の厚さＴｈ２と第３領域Ａ３の厚さＴｈ３は、同じであっても異なっていてもよい。 In the present embodiment, the thin portion 32 of the protection unit 3 is in close contact with the light emitting surface 21 of the light emitting device 2. Therefore, the thickness of the first region A1 of the protection unit 3 is Th1, which is smaller than the thickness Th2 of the second region A2 of the protection unit 3 and the thickness Th3 of the third region A3 of the protection unit 3. Note that the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 may be the same or different.
　第１領域Ａ１の厚さＴｈ１が、第２領域Ａ２と第３領域Ａ３の厚さＴｈ２、Ｔｈ３に比べて薄いので、保護部３による発光装置２からの出射光の吸収は抑制される。 Since the thickness Th1 of the first region A1 is thinner than the thicknesses Th2 and Th3 of the second region A2 and the third region A3, absorption of the emitted light from the light emitting device 2 by the protection unit 3 is suppressed.
　例えば、樹脂の可視光に対する吸収率Ｒは、樹脂の吸光係数をα、樹脂の厚さをＬとすると、Ｒ＝１－ｅｘｐ（－αＬ）で表される。樹脂の可視光に対する吸収率Ｒは、樹脂の厚さＬが薄くなると共に、指数関数的に減少する。したがって、保護部３は、発光装置２からの出射光の減衰を著しく抑制できる。一方、第２領域Ａ２と第３領域Ａ３においては、保護部３は、実施の形態１と同様に、表示ユニット１における周囲光の反射と表示ユニット１に反射された周囲光の出射とを抑制できる。 For example, the absorption ratio R of visible light to the resin is expressed by R = 1−exp (−αL) where α is the extinction coefficient of the resin and L is the thickness of the resin. The absorption rate R of the resin with respect to visible light decreases exponentially as the resin thickness L decreases. Therefore, the protection unit 3 can remarkably suppress the attenuation of the emitted light from the light emitting device 2. On the other hand, in the second region A2 and the third region A3, the protection unit 3 suppresses the reflection of the ambient light in the display unit 1 and the emission of the ambient light reflected by the display unit 1 as in the first embodiment. it can.
　具体的には、第１領域Ａ１の厚さＴｈ１は、１０μｍ～１００μｍが好ましく、４０μｍ～６０μｍがより好ましい。第２領域Ａ２の厚さＴｈ２と第３領域Ａ３の厚さＴｈ３は、１００μｍ～４００μｍが好ましく、１５０μｍ～２５０μｍがより好ましい。 Specifically, the thickness Th1 of the first region A1 is preferably 10 μm to 100 μm, and more preferably 40 μm to 60 μm. The thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 are preferably 100 μm to 400 μm, and more preferably 150 μm to 250 μm.
　また、第１領域Ａ１の可視光に対する吸収率は、発光装置２からの出射光の減衰を抑制する観点から、３０％以下であることが好ましく、２０％以下であることがより好ましい。換言すると、第１領域Ａ１の可視光に対する透過率は、７０％以上であることが好ましく、８０％以上であることがより好ましい。第２領域Ａ２と第３領域Ａ３の可視光に対する吸収率は、周囲光の反射と反射された周囲光の出射とを抑制する観点から、５０％以上であることが好ましく、７０％以上であることがより好ましい。換言すると、第２領域Ａ２と第３領域Ａ３の可視光に対する透過率は、５０％以下であることが好ましく、３０％以下であることがより好ましい。 Further, the visible light absorptance of the first region A1 is preferably 30% or less, and more preferably 20% or less, from the viewpoint of suppressing the attenuation of the emitted light from the light emitting device 2. In other words, the visible light transmittance of the first region A1 is preferably 70% or more, and more preferably 80% or more. The visible light absorptance of the second region A2 and the third region A3 is preferably 50% or more and 70% or more from the viewpoint of suppressing reflection of ambient light and emission of reflected ambient light. It is more preferable. In other words, the visible light transmittance of the second region A2 and the third region A3 is preferably 50% or less, and more preferably 30% or less.
　ここで、本実施の形態における表示ユニット１の作製方法について説明する。
　まず、配線部５が形成された回路基板４と、発光装置２とを準備する。
　次に、発光装置２のリード２５ｒ、２５ｇ、２５ｂとリード２６ｒ、２６ｇ、２６ｂとを、回路基板４の配線部５に半田付することによって、発光装置２を回路基板４に実装する。
　保護部３を、凹部３１が形成された面を回路基板４に対向させ、薄肉部３２と発光装置２の光出射面２１との位置を合わせて、発光装置２が実装された回路基板４上に配設する。 Here, a method for manufacturing the display unit 1 in the present embodiment will be described.
First, the circuit board 4 on which the wiring part 5 is formed and the light emitting device 2 are prepared.
Next, the light emitting device 2 is mounted on the circuit board 4 by soldering the leads 25r, 25g, and 25b of the light emitting device 2 and the leads 26r, 26g, and 26b to the wiring portion 5 of the circuit board 4.
On the circuit board 4 on which the light emitting device 2 is mounted, the protection unit 3 is arranged so that the surface on which the concave portion 31 is formed is opposed to the circuit board 4 and the positions of the thin portion 32 and the light emitting surface 21 of the light emitting device 2 are aligned. It arranges in.
　次に、保護部３が配設された回路基板４を真空加熱装置内に設置する。その後、真空加熱装置内を加熱し、減圧する。減圧により、保護部３の薄肉部３２は発光装置２の光出射面２１に貼りつく。また、保護部３の薄肉部３２を除く部分は、加熱により伸長して、回路基板４の実装面１１とベース部材２８の側面２８ａとに貼りつく。
　最後に、真空加熱装置を常温常圧に戻し、真空加熱装置から表示ユニット１を取り出す。保護部３は、大気圧によって押圧され、発光装置２の光出射面２１と保護部３の薄肉部３２とが密着する。また、保護部３の薄肉部３２を除く部分は、回路基板４の実装面１１又はベース部材２８の側面２８ａに密着する。
　以上によって、表示ユニット１を作製できる。 Next, the circuit board 4 provided with the protection unit 3 is installed in a vacuum heating apparatus. Then, the inside of a vacuum heating apparatus is heated and pressure-reduced. Due to the reduced pressure, the thin part 32 of the protection part 3 is stuck to the light emitting surface 21 of the light emitting device 2. Further, the portion excluding the thin portion 32 of the protection portion 3 extends by heating and is adhered to the mounting surface 11 of the circuit board 4 and the side surface 28a of the base member 28.
Finally, the vacuum heating device is returned to room temperature and normal pressure, and the display unit 1 is taken out from the vacuum heating device. The protection part 3 is pressed by atmospheric pressure, and the light emitting surface 21 of the light emitting device 2 and the thin part 32 of the protection part 3 are in close contact with each other. Further, the portion excluding the thin portion 32 of the protection portion 3 is in close contact with the mounting surface 11 of the circuit board 4 or the side surface 28 a of the base member 28.
Thus, the display unit 1 can be manufactured.
　以上のように、本実施の形態における表示ユニット１は、発光装置２からの出射光の減衰を著しく抑制できる。したがって、発光装置２に供給する電力を増やして、発光装置２からの出射光の光量を増やさなくともよい。また、表示ユニット１は、表示ユニット１における周囲光の反射と表示ユニット１に反射された周囲光の出射とを抑制し、表示ユニット１に表示される画像のコントラストを向上できる。 As described above, the display unit 1 in the present embodiment can remarkably suppress the attenuation of the emitted light from the light emitting device 2. Therefore, it is not necessary to increase the amount of power supplied to the light emitting device 2 and increase the amount of light emitted from the light emitting device 2. Further, the display unit 1 can suppress the reflection of the ambient light on the display unit 1 and the emission of the ambient light reflected by the display unit 1, and can improve the contrast of the image displayed on the display unit 1.
　実施の形態３．
　実施の形態２では、保護部３の回路基板４と対向する面に凹部３１を形成した。本実施の形態３では、保護部３の回路基板４と対向する面と反対側の面に凹部３１を形成する。なお、発光装置２と回路基板４の構成は、実施の形態１と同様である。 Embodiment 3 FIG.
In the second embodiment, the recess 31 is formed on the surface of the protection unit 3 that faces the circuit board 4. In the third embodiment, the recess 31 is formed on the surface of the protection unit 3 opposite to the surface facing the circuit board 4. The configurations of the light emitting device 2 and the circuit board 4 are the same as those in the first embodiment.
　本実施の形態における保護部３と表示ユニット１について、図８、図９を参照して説明する。保護部３は、凹部３１の底部である薄肉部３２を備える。薄肉部３２の厚さＴｈ１は、実施の形態２と同様に、保護部３の第２領域Ａ２の厚さＴｈ２と第３領域Ａ３の厚さＴｈ３よりも薄い。凹部３１は、保護部３が発光装置２と回路基板４の実装面１１とを覆った場合に、回路基板４と対向する面と反対側の面に開口する。凹部３１は、プレス加工により、回路基板４に実装された発光装置２に対応する位置に形成される。 The protection unit 3 and the display unit 1 in the present embodiment will be described with reference to FIGS. The protection unit 3 includes a thin portion 32 that is the bottom of the recess 31. The thickness Th1 of the thin portion 32 is thinner than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3 of the protection unit 3 as in the second embodiment. The recess 31 opens on a surface opposite to the surface facing the circuit board 4 when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4. The recess 31 is formed at a position corresponding to the light emitting device 2 mounted on the circuit board 4 by press working.
　さらに、保護部３は、保護部３が発光装置２と回路基板４の実装面１１とを覆った場合に、発光装置２の光出射面２１を囲み、Ｚ軸方向に突出する凸部３３を有する。保護部３の凸部３３は、発光装置２の光出射面２１への周囲光の入射を防ぐ庇として機能する。これにより、発光装置２の光出射面２１に入射する周囲光が減少するので、光出射面２１と発光装置２の凹部２９の底面に反射され表示ユニット１から出射する周囲光が、減少する。したがって、表示ユニット１は、表示ユニット１に表示される画像のコントラストを、さらに向上できる。 Further, when the protection unit 3 covers the light emitting device 2 and the mounting surface 11 of the circuit board 4, the protection unit 3 surrounds the light emitting surface 21 of the light emitting device 2 and includes a protrusion 33 protruding in the Z-axis direction. Have. The convex portion 33 of the protection portion 3 functions as a ridge that prevents ambient light from entering the light emitting surface 21 of the light emitting device 2. As a result, the ambient light incident on the light emitting surface 21 of the light emitting device 2 is reduced, so that the ambient light reflected from the light emitting surface 21 and the bottom surface of the recess 29 of the light emitting device 2 and emitted from the display unit 1 is reduced. Therefore, the display unit 1 can further improve the contrast of the image displayed on the display unit 1.
　保護部３は、図９に示すように、発光装置２の光出射面２１と回路基板４の実装面１１とベース部材２８の側面２８ａとに沿って、発光装置２と回路基板４の実装面１１とを覆う。保護部３の薄肉部３２は、光出射面２１を含む発光装置２の上面に密着する。 As shown in FIG. 9, the protection unit 3 is mounted on the light emitting device 2 and the circuit board 4 along the light emitting surface 21, the circuit board 4 mounting surface 11, and the side surface 28 a of the base member 28. 11 and cover. The thin part 32 of the protection part 3 is in close contact with the upper surface of the light emitting device 2 including the light emitting surface 21.
　保護部３の薄肉部３２が光出射面２１に密着するので、実施の形態２と同様に、保護部３の第１領域Ａ１の厚さＴｈ１は、保護部３の第２領域Ａ２と第３領域Ａ３の厚さＴｈ２、Ｔｈ３に比べて薄くなる。したがって、本実施の形態における表示ユニット１は、実施の形態２と同様に、保護部３による発光装置２からの出射光の吸収を著しく抑制できる。また、第２領域Ａ２と第３領域Ａ３において、保護部３は、実施の形態１、２と同様に、表示ユニット１における周囲光の反射と表示ユニット１に反射された周囲光の出射とを抑制できる。 Since the thin portion 32 of the protection unit 3 is in close contact with the light emitting surface 21, the thickness Th1 of the first region A1 of the protection unit 3 is the same as that of the second region A2 of the protection unit 3 as in the second embodiment. It becomes thinner than the thicknesses Th2 and Th3 of the region A3. Therefore, the display unit 1 in the present embodiment can remarkably suppress the absorption of the emitted light from the light emitting device 2 by the protection unit 3 as in the second embodiment. Further, in the second region A2 and the third region A3, the protection unit 3 reflects the ambient light on the display unit 1 and emits the ambient light reflected on the display unit 1 as in the first and second embodiments. Can be suppressed.
　ここで、本実施の形態における表示ユニット１の作製方法について、実施の形態２と異なる部分を説明する。実施の形態２と重複する部分については説明を省略する。
　本実施の形態では、保護部３を、凹部３１が形成されていない面を回路基板４に対向させ、薄肉部３２と発光装置２の光出射面２１との位置を合わせて、発光装置２が実装された回路基板４上に配設する。 Here, a part of the manufacturing method of the display unit 1 in the present embodiment that is different from that in the second embodiment will be described. Description of the same parts as those in Embodiment 2 is omitted.
In the present embodiment, the light-emitting device 2 is configured such that the protective portion 3 has a surface on which the concave portion 31 is not formed opposed to the circuit board 4 and the positions of the thin-walled portion 32 and the light-emitting surface 21 of the light-emitting device 2 are aligned. It is disposed on the mounted circuit board 4.
　次に、保護部３が配設された回路基板４を真空加熱装置内に設置する。その後、真空加熱装置内を加熱し、減圧する。減圧により、保護部３の薄肉部３２は発光装置２の光出射面２１に貼りつく。また、保護部３の薄肉部３２を除く部分は、加熱により伸長して、発光装置２の側面２８ａと回路基板４の実装面１１に貼りつく。この場合、保護部３の凹部３１の外縁を形成する外縁部３１ａが、発光装置２の上面からＺ軸方向に突出して、発光装置２の光出射面２１を囲む凸部３３を形成する。
　以上によって、表示ユニット１を作製できる。 Next, the circuit board 4 provided with the protection unit 3 is installed in a vacuum heating apparatus. Then, the inside of a vacuum heating apparatus is heated and pressure-reduced. Due to the reduced pressure, the thin part 32 of the protection part 3 is stuck to the light emitting surface 21 of the light emitting device 2. Further, the portion excluding the thin portion 32 of the protection portion 3 is extended by heating and is adhered to the side surface 28 a of the light emitting device 2 and the mounting surface 11 of the circuit board 4. In this case, the outer edge portion 31 a that forms the outer edge of the concave portion 31 of the protection portion 3 protrudes from the upper surface of the light emitting device 2 in the Z-axis direction to form a convex portion 33 surrounding the light emitting surface 21 of the light emitting device 2.
Thus, the display unit 1 can be manufactured.
　以上のように、保護部３の凸部３３が、発光装置２の光出射面２１に入射する周囲光を減少させるので、本実施の形態における表示ユニット１は、表示ユニット１に表示される画像のコントラストを、さらに向上できる。また、表示ユニット１は、実施の形態２と同様に、発光装置２からの出射光の減衰を著しく抑制できる。さらに、表示ユニット１は、表示ユニット１における周囲光の反射と表示ユニット１に反射された周囲光の出射とを抑制できる。 As described above, since the convex portion 33 of the protection unit 3 reduces the ambient light incident on the light emitting surface 21 of the light emitting device 2, the display unit 1 in the present embodiment is an image displayed on the display unit 1. The contrast can be further improved. Further, the display unit 1 can remarkably suppress the attenuation of the emitted light from the light emitting device 2 as in the second embodiment. Furthermore, the display unit 1 can suppress reflection of ambient light on the display unit 1 and emission of ambient light reflected by the display unit 1.
　実施の形態４．
　表示装置４１は、複数の、実施の形態３における表示ユニット１を備える。表示装置４１は、図１０に示すように、タイル状に組み合わされた１６個の表示ユニット１を備える。 Embodiment 4 FIG.
The display device 41 includes a plurality of display units 1 in the third embodiment. As illustrated in FIG. 10, the display device 41 includes 16 display units 1 combined in a tile shape.
　表示装置４１は、競技場、ビルの壁面等の屋外に設置される。表示装置４１が備える表示ユニット１の数を変えることによって、種々の大きさの表示装置４１を作製できる。 The display device 41 is installed outdoors such as a stadium or a building wall. By changing the number of display units 1 included in the display device 41, display devices 41 of various sizes can be manufactured.
　表示装置４１は表示ユニット１から構成されるので、表示ユニット１と同様に、表示装置４１に表示される画像のコントラストを向上できる。 Since the display device 41 is composed of the display unit 1, the contrast of the image displayed on the display device 41 can be improved as with the display unit 1.
　以上、本発明の複数の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲で種々の変更が可能である。 Although a plurality of embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.
　例えば、ベース部材２８は、凹部２９を有する立方体形状に限られず、平板形状であってもよい。この場合、保護部３は、光出射面２１と平板の側面とに密着する。さらに、ベース部材２８は、配線パターンがプリントされた基板であってもよい。 For example, the base member 28 is not limited to a cubic shape having the recesses 29 but may be a flat plate shape. In this case, the protection unit 3 is in close contact with the light emitting surface 21 and the side surface of the flat plate. Further, the base member 28 may be a substrate on which a wiring pattern is printed.
　封止部２７は、シリコン樹脂に限られず任意である。例えば、封止部２７はエポキシ樹脂であってもよい。封止部２７は分散剤や蛍光体を含んでもよい。また、光出射面２１の形状は、中心部分がＺ軸方向に突出した凸形状や中心部分がＺ軸方向に凹んだ凹形状であってもよい。 The sealing part 27 is not limited to silicon resin, but is optional. For example, the sealing part 27 may be an epoxy resin. The sealing part 27 may include a dispersant and a phosphor. Further, the shape of the light emitting surface 21 may be a convex shape with a central portion protruding in the Z-axis direction or a concave shape with a central portion recessed in the Z-axis direction.
　発光装置２は、３ｉｎ１型に限られない。発光装置２は、１つのベース部材２８に１つの発光素子が実装された単色光を出射する発光装置であってもよい。また、発光装置２は、４つ以上の発光素子を備えてもよい。 The light emitting device 2 is not limited to the 3 in 1 type. The light emitting device 2 may be a light emitting device that emits monochromatic light in which one light emitting element is mounted on one base member 28. The light emitting device 2 may include four or more light emitting elements.
　回路基板４に実装される発光装置２の数は、４行×４列に限られず任意である。例えば、発光装置２は、１２８行×１２８列又は２５６行×２５６列で回路基板４に実装されてもよい。発光装置２の配列は、正方格子に限られず、任意である。発光装置２は、斜方格子、六角格子、矩形格子、千鳥格子等に配列されてもよい。また、回路基板４には、発光装置２が配置されないブランクスペースが、設けられてもよい。さらに、発光装置２間の間隔Ｄは８ｍｍに限られず、任意である。 The number of the light emitting devices 2 mounted on the circuit board 4 is not limited to 4 rows × 4 columns and is arbitrary. For example, the light emitting device 2 may be mounted on the circuit board 4 in 128 rows × 128 columns or 256 rows × 256 columns. The arrangement of the light emitting devices 2 is not limited to a square lattice, and is arbitrary. The light emitting devices 2 may be arranged in an orthorhombic lattice, a hexagonal lattice, a rectangular lattice, a staggered lattice, or the like. The circuit board 4 may be provided with a blank space where the light emitting device 2 is not disposed. Furthermore, the distance D between the light emitting devices 2 is not limited to 8 mm, and is arbitrary.
　保護部３は、ポリエステル樹脂、ポリカーボネート樹脂、アクリル樹脂等の防水性を備える樹脂から構成されてもよい。また、樹脂に添加される着色剤は、カーボンブラックに限られず、任意である。樹脂に添加される着色剤は、染料組成物であってもよい。保護部３は、可塑性フィルムに限らず、成形された樹脂部材であってもよい。実施の形態２、３において、第１領域Ａ１の厚さＴｈ１が第２領域Ａ２の厚さＴｈ２と第３領域Ａ３の厚さＴｈ３より薄い場合に限られず、第１領域Ａ１の厚さＴｈ１が第２領域Ａ２の厚さＴｈ２又は第３領域Ａ３の厚さＴｈ３より薄い場合にも、表示ユニット１は発光装置２からの出射光の減衰を著しく抑制できる。 The protection unit 3 may be made of a waterproof resin such as a polyester resin, a polycarbonate resin, or an acrylic resin. Further, the colorant added to the resin is not limited to carbon black, and is arbitrary. The colorant added to the resin may be a dye composition. The protection part 3 is not limited to a plastic film, and may be a molded resin member. In the second and third embodiments, the thickness Th1 of the first region A1 is not limited to the case where the thickness Th1 of the first region A1 is smaller than the thickness Th2 of the second region A2 and the thickness Th3 of the third region A3. Even when the thickness Th2 of the second region A2 or the thickness Th3 of the third region A3 is thinner, the display unit 1 can remarkably suppress the attenuation of the emitted light from the light emitting device 2.
　さらに、保護部３の第１領域Ａ１における単位体積当たりのカーボンブラックの含有量を、保護部３の第２領域Ａ２と第３領域Ａ３における単位体積当たりのカーボンブラックの含有量よりも少なくしてもよい。これにより、第１領域Ａ１における可視光に対する吸収率が、第２領域Ａ２と第３領域Ａ３における可視光に対する吸収率よりも小さくなり、実施の形態２、３と同様に、表示ユニット１は発光装置２からの出射光の減衰を著しく抑制できる。 Further, the content of carbon black per unit volume in the first region A1 of the protection part 3 is made smaller than the content of carbon black per unit volume in the second region A2 and the third region A3 of the protection unit 3. Also good. Thereby, the absorptance with respect to visible light in the first area A1 becomes smaller than the absorptance with respect to visible light in the second area A2 and the third area A3, and the display unit 1 emits light as in the second and third embodiments. Attenuation of light emitted from the device 2 can be remarkably suppressed.
　保護部３と、回路基板４の実装面１１、発光装置２の光出射面２１、ベース部材２８の側面２８ａとの間には、空気層が設けられていてもよい。 An air layer may be provided between the protection unit 3, the mounting surface 11 of the circuit board 4, the light emitting surface 21 of the light emitting device 2, and the side surface 28 a of the base member 28.
　表示ユニット１と表示装置４１は、回路基板４の実装面１１に、発光装置２と回路基板４への周囲光の入射を防ぐルーバーを備えてもよい。また、表示装置４１は、体育館の館内、屋内プール等の屋内に設置されてもよい。表示装置４１は、実施の形態１における表示ユニット１又は実施の形態２における表示ユニット１が、複数組み合わされて構成されてもよい。さらに、表示装置４１は、例えば、実施の形態２における表示ユニット１と実施の形態３における表示ユニット１が、複数組み合わされて構成されてもよい。表示装置４１が備える表示ユニット１の数は、任意である。 The display unit 1 and the display device 41 may include a louver on the mounting surface 11 of the circuit board 4 to prevent ambient light from entering the light emitting device 2 and the circuit board 4. The display device 41 may be installed indoors, such as in a gymnasium or indoor pool. The display device 41 may be configured by combining a plurality of the display units 1 in the first embodiment or the display units 1 in the second embodiment. Furthermore, the display device 41 may be configured, for example, by combining a plurality of the display units 1 in the second embodiment and the display units 1 in the third embodiment. The number of display units 1 provided in the display device 41 is arbitrary.
　本発明は、本発明の広義の精神と範囲を逸脱することなく、様々な実施の形態及び変形が可能とされるものである。また、上述した実施の形態は、本発明を説明するためのものであり、本発明の範囲を限定するものではない。すなわち、本発明の範囲は、実施の形態ではなく、請求の範囲によって示される。そして、請求の範囲内及びそれと同等の発明の意義の範囲内で施される様々な変形が、本発明の範囲内とみなされる。 The present invention is capable of various embodiments and modifications without departing from the broad spirit and scope of the present invention. The above-described embodiments are for explaining the present invention and do not limit the scope of the present invention. In other words, the scope of the present invention is shown not by the embodiments but by the claims. Various modifications within the scope of the claims and within the scope of the equivalent invention are considered to be within the scope of the present invention.
　本出願は、２０１６年３月３１日に出願された、日本国特許出願特願２０１６－０６９８９４号に基づく。本明細書中に日本国特許出願特願２０１６－０６９８９４号の明細書、特許請求の範囲、図面全体を参照として取り込むものとする。 This application is based on Japanese Patent Application No. 2016-066984 filed on Mar. 31, 2016. The specification, claims, and entire drawings of Japanese Patent Application No. 2016-069894 are incorporated herein by reference.
　１　表示ユニット、２　発光装置、３　保護部、４　回路基板、５　配線部、６　接続部、１１　実装面、２１　光出射面、２３ｒ，２３ｇ，２３ｂ　発光素子、２４　ワイヤ、２５ｒ，２５ｇ，２５ｂ　リード、２６ｒ，２６ｇ，２６ｂ　リード、２７　封止部、２８　ベース部材、２８ａ　側面、２８ｂ　内周面、２９　凹部、３１　凹部、３１ａ　外縁部、３２　薄肉部、３３　凸部、４１　表示装置、Ａ１　第１領域、Ａ２　第２領域、Ａ３　第３領域 1 display unit, 2 light emitting device, 3 protection unit, 4 circuit board, 5 wiring unit, 6 connection unit, 11 mounting surface, 21 light emitting surface, 23r, 23g, 23b light emitting element, 24 wire, 25r, 25g, 25b lead 26r, 26g, 26b lead, 27 sealing part, 28 base member, 28a side surface, 28b inner peripheral surface, 29 concave part, 31 concave part, 31a outer edge part, 32 thin part, 33 convex part, 41 display device, A1 first Area, A2 2nd area, A3 3rd area

Claims (8)

  1. 　回路基板と、
    　前記回路基板の実装面に実装された複数の発光装置と、
    　前記回路基板の実装面と前記複数の発光装置とを覆う保護部とを備え、
    　前記保護部は可視光を吸収する、
    　表示ユニット。     A circuit board;
    A plurality of light emitting devices mounted on a mounting surface of the circuit board;
    A protective part that covers the mounting surface of the circuit board and the plurality of light emitting devices;
    The protective part absorbs visible light;
    Display unit.
  2. 　前記発光装置は、ベース部材と、前記ベース部材に実装された発光素子と、前記発光素子を封止する封止部とを有し、
    　前記保護部は、前記封止部の前記発光素子からの発光光を出射する光出射面に沿う第１領域と、前記回路基板の実装面を覆う第２領域と、前記ベース部材の外表面に沿う第３領域とを備え、
    　前記保護部の前記第１領域における可視光に対する吸収率は、前記保護部の前記第２領域における可視光に対する吸収率と前記保護部の前記第３領域における可視光に対する吸収率の少なくとも一方よりも小さい、
    　請求項１に記載の表示ユニット。     The light emitting device includes a base member, a light emitting element mounted on the base member, and a sealing portion that seals the light emitting element,
    The protective portion includes a first region along a light emitting surface that emits light emitted from the light emitting element of the sealing portion, a second region that covers the mounting surface of the circuit board, and an outer surface of the base member. A third region along the
    The visible light absorptance of the protection part in the first region is greater than at least one of the absorptivity of visible light in the second region of the protection unit and the absorptivity of visible light in the third region of the protection unit. small,
    The display unit according to claim 1.
  3. 　前記第１領域の厚さは、前記第２領域の厚さと前記第３領域の厚さの少なくとも一方よりも薄い、
    　請求項２に記載の表示ユニット。     The thickness of the first region is thinner than at least one of the thickness of the second region and the thickness of the third region,
    The display unit according to claim 2.
  4. 　前記第１領域は、前記保護部の前記回路基板と対向する面に形成された凹部の底部である、
    　請求項３に記載の表示ユニット。     The first region is a bottom portion of a recess formed on a surface of the protection unit facing the circuit board.
    The display unit according to claim 3.
  5. 　前記第１領域は、前記保護部の前記回路基板と対向する面と反対側の面に形成された凹部の底部である、
    　請求項３に記載の表示ユニット。     The first region is a bottom portion of a recess formed on a surface of the protection portion opposite to the surface facing the circuit board.
    The display unit according to claim 3.
  6. 　前記保護部は、前記第１領域を囲む凸部を有する、
    　請求項５に記載の表示ユニット。     The protection part has a convex part surrounding the first region,
    The display unit according to claim 5.
  7. 　前記保護部は、可撓性を有するフィルムである、
    　請求項１から６のいずれか１項に記載の表示ユニット。     The protective part is a flexible film,
    The display unit according to claim 1.
  8. 　請求項１から７のいずれか１項に記載の表示ユニットが、複数組み合わされて構成された、
    　表示装置。     A plurality of display units according to any one of claims 1 to 7 are configured to be combined.
    Display device.
PCT/JP2017/003805 2016-03-31 2017-02-02 Display unit and display device WO2017169092A1 (en)

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