JP2018194866A - Display device - Google Patents

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Publication number
JP2018194866A
JP2018194866A JP2018164447A JP2018164447A JP2018194866A JP 2018194866 A JP2018194866 A JP 2018194866A JP 2018164447 A JP2018164447 A JP 2018164447A JP 2018164447 A JP2018164447 A JP 2018164447A JP 2018194866 A JP2018194866 A JP 2018194866A
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circuit board
light emitting
film
mounting surface
display device
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Inventor
聡 切通
Satoshi Kiridoori
聡 切通
裕一郎 財部
Yuichiro Zaibe
裕一郎 財部
壮平 鮫島
Sohei Samejima
壮平 鮫島
石田 清
Kiyoshi Ishida
清 石田
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2018164447A priority Critical patent/JP2018194866A/en
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Abstract

To provide a display device having wide angle of view.SOLUTION: A display device includes: a circuit board; a plurality of light-emitting elements mounted in matrix on a mounting surface 22 of the circuit board; a plurality of mask members extended along a row in one direction of the light-emitting elements, arranged in a direction perpendicular to the row in one direction, and blocking external light; and a film-shaped waterproof member 50 covering the mounting surface 22 of the circuit board and the light-emitting elements. The mask members are arranged in a circuit board. The film-shaped waterproof member 50 is held between the mounting surface 22 of the circuit board and the mask members. The mask member has a projection 45 extended in a direction parallel to the circuit board, arranged at a tip in a direction apart from the circuit board.SELECTED DRAWING: Figure 17

Description

本発明は、表示装置に関する。   The present invention relates to a display device.

野外に設置される表示装置として、回路基板に複数の発光ダイオード(LED:Light Emitting Diode)がマトリクス状に実装された表示装置が知られている。
このような野外に設置される表示装置には、雨水などによる表示装置の配線の短絡を防ぐために、表示装置の正面(表示面)に防水カバーなどが設けられる。
As a display device installed outdoors, a display device in which a plurality of light emitting diodes (LEDs) are mounted in a matrix on a circuit board is known.
In such a display device installed outdoors, a waterproof cover or the like is provided on the front surface (display surface) of the display device in order to prevent a short circuit of the wiring of the display device due to rainwater or the like.

例えば、特許文献1に記載の表示装置においては、LED素子の前面に配置された透明カバーと、透明カバーを保持するカバー保持壁を備えた遮光ルーバによって、表示装置の正面が防水されている。   For example, in the display device described in Patent Literature 1, the front surface of the display device is waterproofed by a light shielding louver provided with a transparent cover disposed on the front surface of the LED element and a cover holding wall for holding the transparent cover.

特開2007−17833号公報JP 2007-17833 A

特許文献1に記載の表示装置においては、LED素子の前面に配置された透明カバーを遮光ルーバのカバー保持壁が保持する。このため、遮光ルーバのLED基板からの高さが高くなり、LED素子からの出射光を遮る。LED素子からの出射光が遮光ルーバに遮られることによって、表示装置の視野角は狭くなる。
また、特許文献1に記載の表示装置においては、LED素子の前面に板状の透明カバーが配置されるので、表示装置は厚くなる。
In the display device described in Patent Document 1, the cover holding wall of the light shielding louver holds the transparent cover disposed on the front surface of the LED element. For this reason, the height of the light shielding louver from the LED substrate is increased, and the emitted light from the LED element is blocked. When the light emitted from the LED element is blocked by the light blocking louver, the viewing angle of the display device is narrowed.
Moreover, in the display apparatus of patent document 1, since a plate-shaped transparent cover is arrange | positioned in the front surface of an LED element, a display apparatus becomes thick.

本発明は、上記の事情に鑑みてなされたものであり、広い視野角を有する表示装置を提供することを目的とする。また、本発明は、薄い表示装置を提供することを他の目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to provide a display device having a wide viewing angle. Another object of the present invention is to provide a thin display device.

本願発明の表示装置は、回路基板と、回路基板の実装面にマトリクス状に実装された複数の発光素子と、発光素子の一方向の列に沿って延び、一方向の列に垂直な方向に配列され、外光を遮る複数のマスク部材と、回路基板の実装面と複数の発光素子とを覆うフィルム状の防水部材とを備える。複数のマスク部材は回路基板に設けられ、フィルム状の防水部材は回路基板の実装面とマスク部材とに挟まれる。マスク部材は、回路基板から離れる方向の先端に、回路基板と平行な方向に延びる突出部を有する。
本願発明の他の表示装置は、回路基板と、回路基板の実装面にマトリクス状に実装された複数の発光素子と、発光素子が実装された位置に形成された複数の開口部を有し、外光を遮るマスク板と、発光素子の一方向の列に沿って延び、一方向の列に垂直な方向に配列され、マスク板に配置されて、外光を遮る複数のマスク部材と、回路基板の実装面と複数の発光素子とを覆うフィルム状の防水部材とを備える。マスク板は回路基板に設けられ、フィルム状の防水部材は回路基板の実装面とマスク板とに挟まれる。マスク部材は、回路基板から離れる方向の先端に、回路基板と平行な方向に延びる突出部を有する。
The display device according to the present invention includes a circuit board, a plurality of light emitting elements mounted in a matrix on the circuit board mounting surface, and extends along a line in one direction of the light emitting elements, and extends in a direction perpendicular to the line in one direction. A plurality of mask members arranged to block outside light, and a film-like waterproof member that covers the mounting surface of the circuit board and the plurality of light emitting elements are provided. The plurality of mask members are provided on the circuit board, and the film-like waterproof member is sandwiched between the mounting surface of the circuit board and the mask member. The mask member has a protrusion that extends in a direction parallel to the circuit board at the tip in a direction away from the circuit board.
Another display device of the present invention has a circuit board, a plurality of light emitting elements mounted in a matrix on the mounting surface of the circuit board, and a plurality of openings formed at positions where the light emitting elements are mounted, A mask plate that blocks outside light, a plurality of mask members that extend along a row in one direction of the light emitting elements, are arranged in a direction perpendicular to the row in one direction, and are arranged on the mask plate to block outside light, and a circuit A film-like waterproof member that covers the mounting surface of the substrate and the plurality of light-emitting elements is provided. The mask board is provided on the circuit board, and the film-like waterproof member is sandwiched between the mounting surface of the circuit board and the mask board. The mask member has a protrusion that extends in a direction parallel to the circuit board at the tip in a direction away from the circuit board.

本発明によれば、フィルム状の防水部材が回路基板の実装面と発光素子とを覆うので、マスク部材が防水部材を保持する必要がなく、マスク部材の回路基板の実装面からの高さを低くできる。マスク部材の回路基板の実装面からの高さを低くできるので、広い視野角を得ることができる。
また、回路基板の実装面と発光素子が、フィルム状の防水部材によって覆われるので、表示装置を薄くできる。
According to the present invention, since the film-like waterproof member covers the mounting surface of the circuit board and the light emitting element, the mask member does not need to hold the waterproof member, and the height of the mask member from the mounting surface of the circuit board is increased. Can be lowered. Since the height of the mask member from the mounting surface of the circuit board can be reduced, a wide viewing angle can be obtained.
In addition, since the mounting surface of the circuit board and the light emitting element are covered with a film-like waterproof member, the display device can be thinned.

本発明の実施の形態1に係る表示装置の正面図である。It is a front view of the display apparatus which concerns on Embodiment 1 of this invention. 図1に示す表示装置をA−A線で矢視した断面図である。It is sectional drawing which looked at the display apparatus shown in FIG. 1 by the AA line. 本発明の実施の形態1に係るマスク部材を示す図である。It is a figure which shows the mask member which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係るマスク部材の本体部の高さと発光素子からの出射光との関係を示す模式図である。It is a schematic diagram which shows the relationship between the height of the main-body part of the mask member which concerns on Embodiment 1 of this invention, and the emitted light from a light emitting element. 本発明の実施の形態2に係る表示装置の断面図である。It is sectional drawing of the display apparatus which concerns on Embodiment 2 of this invention. 本発明の実施の形態3に係る表示装置の正面図である。It is a front view of the display apparatus which concerns on Embodiment 3 of this invention. 図6に示す表示装置をB−B線で矢視した断面図である。It is sectional drawing which looked at the display apparatus shown in FIG. 6 by the BB line. 本発明の実施の形態4に係る表示装置の断面図である。It is sectional drawing of the display apparatus which concerns on Embodiment 4 of this invention. 本発明の実施の形態5に係る表示装置の正面図である。It is a front view of the display apparatus which concerns on Embodiment 5 of this invention. 図9に示す表示装置をC−C線で矢視した断面図である。It is sectional drawing which looked at the display apparatus shown in FIG. 9 by the CC line. 本発明の実施の形態6に係る表示装置の正面図である。It is a front view of the display apparatus which concerns on Embodiment 6 of this invention. 図11に示す表示装置をD−D線で矢視した断面図である。It is sectional drawing which looked at the display apparatus shown in FIG. 11 by the DD line. 本発明の実施の形態6に係るマスク板を示す図である。It is a figure which shows the mask board which concerns on Embodiment 6 of this invention. 本発明の実施の形態7に係る表示装置の正面図である。It is a front view of the display apparatus which concerns on Embodiment 7 of this invention. 図14に示す表示装置をE−E線で矢視した断面図である。It is sectional drawing which looked at the display apparatus shown in FIG. 14 at the EE line. 本発明の実施の形態8に係る表示装置の断面図である。It is sectional drawing of the display apparatus which concerns on Embodiment 8 of this invention. マスク部材が突出部を有する場合のマスク部材の本体部の高さと発光素子からの出射光との関係を示す模式図である。It is a schematic diagram which shows the relationship between the height of the main-body part of a mask member in case a mask member has a protrusion part, and the emitted light from a light emitting element. 本発明の実施の形態3に係る表示装置を組み合わせた表示装置の正面図である。It is a front view of the display apparatus which combined the display apparatus which concerns on Embodiment 3 of this invention.

以下、本発明の実施の形態に係る表示装置について、図面を参照して説明する。   Hereinafter, display devices according to embodiments of the present invention will be described with reference to the drawings.

実施の形態1.
図1〜図4を参照して、本発明の実施の形態1に係る表示装置10について説明する。なお、理解を容易にするために、表示装置10が野外で表示装置10の正面(表示面)が地面に対して垂直に設置されたと仮定し、地面と表示装置10の正面とに平行な方向をX軸方向(表示装置10の幅方向)、地面に対して垂直な方向をY軸方向(表示装置10の高さ方向)、X軸方向とY軸方向とに垂直な方向をZ軸方向(表示装置10の厚さ方向)として説明する。他の実施の形態においても同様である。
Embodiment 1 FIG.
With reference to FIGS. 1-4, the display apparatus 10 which concerns on Embodiment 1 of this invention is demonstrated. For easy understanding, it is assumed that the display device 10 is outdoors and the front surface (display surface) of the display device 10 is installed perpendicular to the ground, and the direction parallel to the ground and the front surface of the display device 10 is assumed. Is the X-axis direction (the width direction of the display device 10), the direction perpendicular to the ground is the Y-axis direction (the height direction of the display device 10), and the direction perpendicular to the X-axis direction and the Y-axis direction is the Z-axis direction. It will be described as (the thickness direction of the display device 10). The same applies to other embodiments.

図1、2に示すように、表示装置10は、回路基板20と、回路基板20の実装面22にマトリクス状に実装された複数の発光素子30と、外光を遮る複数のマスク部材40と、フィルム状の防水部材50とを備える。表示装置10は、競技場、ビルの壁面などに設置されている。   As shown in FIGS. 1 and 2, the display device 10 includes a circuit board 20, a plurality of light emitting elements 30 mounted in a matrix on the mounting surface 22 of the circuit board 20, and a plurality of mask members 40 that block outside light. The film-like waterproof member 50 is provided. The display device 10 is installed on a stadium, a wall surface of a building, and the like.

回路基板20は絶縁性の樹脂材料などから構成される。回路基板20は発光素子30に電力を供給する図示しない配線を備える。また、回路基板20には、回路基板20の配線を介して発光素子30を駆動する図示しない駆動IC(IC:Integrated Circuit)が設けられる。   The circuit board 20 is made of an insulating resin material or the like. The circuit board 20 includes wiring (not shown) for supplying power to the light emitting element 30. The circuit board 20 is provided with a driving IC (IC: Integrated Circuit) (not shown) that drives the light emitting element 30 via the wiring of the circuit board 20.

発光素子30は表面実装型発光ダイオードから構成され、回路基板20の実装面22にマトリクス状に配置される。発光素子30は、平らな上面31に光を出射する光出射面32を有する。なお、表示装置10の正面側に配置される面を上面と、回路基板20の実装面22に垂直な面を側面とする。
発光素子30は、内部にそれぞれが赤色光、緑色光、青色光を発光する3つの発光チップを備える(3in1タイプ)。3つの発光チップの発光強度は、発光チップのそれぞれに、回路基板20の配線を介して回路基板20の駆動ICから供給される電力によって、独立に調整される。これにより、発光素子30から、任意の色の光が任意の強度で出射される。その結果、複数の発光素子30全体によって、表示装置10にカラー画像などが表示される。
発光素子30は、発光チップのそれぞれに電力を供給するために、各発光チップに2個ずつ、6個の電極33を発光素子30の側面34に備える。
発光素子30は、回路基板20の実装面22に4行×5列のマトリクス状(X軸方向に5個、Y軸方向に4個)に実装される。発光素子30の電極33は回路基板20の配線にハンダ等で直接接続され、電気的に接続される。
The light emitting element 30 is composed of a surface mount type light emitting diode, and is arranged in a matrix on the mounting surface 22 of the circuit board 20. The light emitting element 30 has a light emitting surface 32 that emits light on a flat upper surface 31. Note that a surface disposed on the front side of the display device 10 is an upper surface, and a surface perpendicular to the mounting surface 22 of the circuit board 20 is a side surface.
The light emitting element 30 includes three light emitting chips each emitting red light, green light, and blue light (3 in 1 type). The light emission intensities of the three light emitting chips are independently adjusted by the power supplied from the driving IC of the circuit board 20 to the light emitting chips via the wiring of the circuit board 20. Thereby, light of an arbitrary color is emitted from the light emitting element 30 with an arbitrary intensity. As a result, a color image or the like is displayed on the display device 10 by the plurality of light emitting elements 30 as a whole.
The light emitting element 30 is provided with six electrodes 33 on the side surface 34 of the light emitting element 30, two for each light emitting chip, in order to supply power to each of the light emitting chips.
The light emitting elements 30 are mounted on the mounting surface 22 of the circuit board 20 in a matrix of 4 rows × 5 columns (5 in the X-axis direction and 4 in the Y-axis direction). The electrode 33 of the light emitting element 30 is directly connected to the wiring of the circuit board 20 by solder or the like and is electrically connected.

マスク部材40はX軸方向に延びる黒色の板であり、Y軸方向に配列される。マスク部材40は、外光(例えば、太陽光)を遮り、表示装置10が表示した画像などのコントラストを向上させる。ここで、外光を遮るとは、外光の発光素子30や回路基板20への入射を防ぐことを意味する。例えば、マスク部材40は外光を吸収する。
マスク部材40は、例えば黒色の樹脂から射出成形によって作製される。
図3に示すように、マスク部材40は本体部41と脚部42とから構成される。マスク部材40の長さL1(X軸方向の長さ)は、回路基板20のX軸方向の長さL2より長く、マスク部材40の脚部42同士の距離(脚部42と脚部42とのX軸方向の距離)が回路基板20のX軸方向の長さL2とほぼ同じである。マスク部材40の幅(Y軸方向の長さ)は任意であるが、表示装置10の表示の見やすさの観点から発光素子30の幅(Y軸方向の長さ)より狭いことが好ましい。マスク部材40の脚部42の高さH1は、回路基板20の厚さと後述するフィルム状の防水部材50の厚さとの和とほぼ同じである。
マスク部材40は、例えば、マスク部材40の本体部41がフィルム状の防水部材50に配置され、マスク部材40の脚部42が回路基板20を回路基板20のX軸方向の両端部で挟み、回路基板20の側面に接着されて回路基板20に固定される。
The mask member 40 is a black plate extending in the X-axis direction and is arranged in the Y-axis direction. The mask member 40 blocks outside light (for example, sunlight) and improves contrast of an image displayed by the display device 10. Here, blocking outside light means preventing outside light from entering the light emitting element 30 and the circuit board 20. For example, the mask member 40 absorbs external light.
The mask member 40 is produced from, for example, a black resin by injection molding.
As shown in FIG. 3, the mask member 40 includes a main body portion 41 and leg portions 42. The length L1 (the length in the X-axis direction) of the mask member 40 is longer than the length L2 in the X-axis direction of the circuit board 20, and the distance between the leg portions 42 of the mask member 40 (the leg portions 42 and 42). Of the circuit board 20 is substantially the same as the length L2 of the circuit board 20 in the X-axis direction. Although the width of the mask member 40 (the length in the Y-axis direction) is arbitrary, it is preferably smaller than the width of the light emitting element 30 (the length in the Y-axis direction) from the viewpoint of easy viewing of the display device 10. The height H1 of the leg portion 42 of the mask member 40 is substantially the same as the sum of the thickness of the circuit board 20 and the thickness of a film-like waterproof member 50 described later.
In the mask member 40, for example, the main body portion 41 of the mask member 40 is disposed on the film-like waterproof member 50, and the leg portions 42 of the mask member 40 sandwich the circuit board 20 at both ends in the X-axis direction of the circuit board 20, The circuit board 20 is bonded to the side surface and fixed to the circuit board 20.

フィルム状の防水部材50は、ポリエステル樹脂、ポリカーボネート樹脂、アクリル樹脂などの透明で、耐候性を備える樹脂から構成される。また、フィルム状の防水部材50は、柔軟で可撓性を備える。フィルム状の防水部材50の厚さD1は、例えば5μm〜500μmである。
フィルム状の防水部材50は、回路基板20の実装面22と回路基板20の実装面22に実装された発光素子30とを覆い、回路基板20の実装面22との間(回路基板20の実装面22と実装された発光素子30)を密封する。また、フィルム状の防水部材50は、回路基板20の実装面22とマスク部材40の本体部41とに挟まれている。
The film-like waterproof member 50 is made of a transparent resin such as a polyester resin, a polycarbonate resin, or an acrylic resin and having weather resistance. Moreover, the film-like waterproof member 50 is soft and flexible. The thickness D1 of the film-like waterproof member 50 is, for example, 5 μm to 500 μm.
The film-shaped waterproofing member 50 covers the mounting surface 22 of the circuit board 20 and the light emitting element 30 mounted on the mounting surface 22 of the circuit board 20, and between the mounting surface 22 of the circuit board 20 (mounting of the circuit board 20). The surface 22 and the mounted light emitting element 30) are sealed. Further, the film-like waterproof member 50 is sandwiched between the mounting surface 22 of the circuit board 20 and the main body 41 of the mask member 40.

フィルム状の防水部材50が、回路基板20の実装面22と実装された発光素子30を密封するので、表示装置10を防水することができる。さらに、フィルム状の防水部材50の厚さD1が薄く(例えば5μm〜500μm)、マスク部材40の本体部41が回路基板20の実装面22とフィルム状の防水部材50を挟む位置に固定される。このため、マスク部材40の本体部41の回路基板20の実装面22からの高さが低くなり、表示装置10の視野角を広くできる。マスク部材40の本体部41の回路基板20の実装面22からの高さについては、後述する。   Since the film-like waterproof member 50 seals the mounting surface 22 of the circuit board 20 and the mounted light emitting element 30, the display device 10 can be waterproofed. Furthermore, the thickness D1 of the film-like waterproof member 50 is thin (for example, 5 μm to 500 μm), and the main body 41 of the mask member 40 is fixed at a position between the mounting surface 22 of the circuit board 20 and the film-like waterproof member 50. . For this reason, the height from the mounting surface 22 of the circuit board 20 of the main body 41 of the mask member 40 is reduced, and the viewing angle of the display device 10 can be widened. The height of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 will be described later.

次に、上記の構成を備えた表示装置10の作製方法について、説明する。
まず、配線を備えた回路基板20を準備する。
発光素子30の電極33を回路基板20の配線にリフロー方式等によりハンダ付けすることによって、準備した回路基板20の実装面22に各発光素子30を実装する。
次に、実装面22の周辺部に実装された発光素子30を囲んで接着剤を塗布し、フィルム状の防水部材50を回路基板20の実装面22に貼り付ける。これにより、回路基板20の実装面22と実装された発光素子30は、フィルム状の防水部材50によって密封される。
最後に、フィルム状の防水部材50の上から各マスク部材40の本体部41を配置し、マスク部材40の脚部42を回路基板20に接着してマスク部材40を回路基板20に固定する。
以上によって、表示装置10を作製できる。
Next, a method for manufacturing the display device 10 having the above configuration will be described.
First, the circuit board 20 provided with wiring is prepared.
Each light emitting element 30 is mounted on the mounting surface 22 of the prepared circuit board 20 by soldering the electrode 33 of the light emitting element 30 to the wiring of the circuit board 20 by a reflow method or the like.
Next, an adhesive is applied to surround the light emitting element 30 mounted on the periphery of the mounting surface 22, and the film-like waterproof member 50 is attached to the mounting surface 22 of the circuit board 20. Thereby, the mounting surface 22 of the circuit board 20 and the mounted light emitting element 30 are sealed by the film-like waterproof member 50.
Finally, the main body portion 41 of each mask member 40 is disposed on the film-like waterproof member 50, and the leg portions 42 of the mask member 40 are bonded to the circuit board 20 to fix the mask member 40 to the circuit board 20.
As described above, the display device 10 can be manufactured.

図4を参照して、表示装置10におけるマスク部材40の本体部41の回路基板20の実装面22からの高さと発光素子30からの出射光との関係を説明する。なお、図4においては、理解を容易にするために、回路基板20の実装面22とマスク部材40の本体部41との間のフィルム状の防水部材50以外のフィルム状の防水部材50を省略している。   With reference to FIG. 4, the relationship between the height from the mounting surface 22 of the circuit board 20 of the main body portion 41 of the mask member 40 in the display device 10 and the emitted light from the light emitting element 30 will be described. In FIG. 4, for ease of understanding, the film-like waterproof member 50 other than the film-like waterproof member 50 between the mounting surface 22 of the circuit board 20 and the main body portion 41 of the mask member 40 is omitted. doing.

ここで、発光素子30における光出射面32のマスク部材40の本体部41に最も近い位置P1からマスク部材40の本体部41までの距離(X軸方向の距離)をL3、発光素子30の回路基板20の実装面22からの高さ(Z軸方向の長さ)をH2、マスク部材40の本体部41の高さ(Z軸方向の長さ)をH3とする。また、発光素子30の光出射面32(上面31)に垂直な線と発光素子30の出射光35とがなす角(出射角)をθとする。なお、D1は、フィルム状の防水部材50の厚さである。   Here, the distance (distance in the X-axis direction) from the position P1 closest to the main body 41 of the mask member 40 of the light emitting surface 32 of the light emitting element 30 to the main body 41 of the mask member 40 is L3, and the circuit of the light emitting element 30. The height (the length in the Z-axis direction) from the mounting surface 22 of the substrate 20 is H2, and the height (the length in the Z-axis direction) of the main body 41 of the mask member 40 is H3. In addition, an angle (outgoing angle) formed by a line perpendicular to the light emitting surface 32 (upper surface 31) of the light emitting element 30 and the outgoing light 35 of the light emitting element 30 is defined as θ. Note that D1 is the thickness of the film-like waterproof member 50.

野外などに設置される表示装置においては、表示装置と観察者の位置関係から、一般に表示装置には140°以上の視野角が要求される。したがって、発光素子30の出射光35のうち出射角θ=70°以上の出射光35が、表示装置10から出射されることが望ましい。すなわち、マスク部材40の本体部41の回路基板20の実装面22からの高さH4(マスク部材40の本体部41の高さH3とフィルム状の防水部材50の厚さD1の和)が、発光素子30の出射角θ=70°の出射光を遮る高さ以下であることが望ましい。距離L3と高さH4との関係を式で表すと、H4=H3+D1≦L3×tan(20°)+H2であることが望ましい。
一方、マスク部材40の本体部41の回路基板20の実装面22からの高さH4は、外光を遮るという本来の目的のために、発光素子30の回路基板20の実装面22からの高さH2よりも高いことが望ましい(H4=H3+D1>H2)。
これらから、マスク部材40の本体部41の回路基板20の実装面22からの高さH4は、H2<H4≦L3×tan(20°)+H2とすることが望ましい。
In a display device installed outdoors or the like, a viewing angle of 140 ° or more is generally required for the display device because of the positional relationship between the display device and an observer. Therefore, it is desirable that the outgoing light 35 having an outgoing angle θ = 70 ° or more out of the outgoing light 35 of the light emitting element 30 is emitted from the display device 10. That is, the height H4 of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 (the sum of the height H3 of the main body 41 of the mask member 40 and the thickness D1 of the film-like waterproof member 50) is It is desirable that the height of the light emitting element 30 be equal to or lower than the height at which the outgoing light with the outgoing angle θ = 70 ° is blocked. When the relationship between the distance L3 and the height H4 is expressed by an equation, it is desirable that H4 = H3 + D1 ≦ L3 × tan (20 °) + H2.
On the other hand, the height H4 of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 is a height from the mounting surface 22 of the circuit board 20 of the light emitting element 30 for the original purpose of blocking external light. It is desirable that the height is higher than H2 (H4 = H3 + D1> H2).
Accordingly, the height H4 of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 is preferably H2 <H4 ≦ L3 × tan (20 °) + H2.

以上のように、フィルム状の防水部材50は、回路基板20の実装面22と発光素子30とを覆い、密封するので、表示装置10を防水することができる。また、マスク部材40の本体部41の回路基板20の実装面22からの高さH4を低くすることができるので、表示装置10の視野角を広くできる。高さH4を、H2<H4≦L3×tan(20°)+H2とすることによって、140°以上の視野角を実現できる。
さらに、表示装置10の正面に板状の防水カバーなどを設ける必要がないので、表示装置10の厚さを薄くできる。
As described above, the film-like waterproof member 50 covers and seals the mounting surface 22 of the circuit board 20 and the light emitting element 30, so that the display device 10 can be waterproofed. In addition, since the height H4 of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 can be reduced, the viewing angle of the display device 10 can be widened. A viewing angle of 140 ° or more can be realized by setting the height H4 to H2 <H4 ≦ L3 × tan (20 °) + H2.
Furthermore, since it is not necessary to provide a plate-shaped waterproof cover or the like on the front surface of the display device 10, the thickness of the display device 10 can be reduced.

実施の形態2.
実施の形態1においては、発光素子30として、光出射面32(上面31)が平らで側面34に電極33を有する表面実装型発光ダイオードを使用したが、発光素子30の光出射面32の形状、発光素子30の電極33の配置はこれらに限られず、任意の構成の発光素子30を使用できる。
Embodiment 2. FIG.
In the first embodiment, as the light emitting element 30, a surface mount type light emitting diode having a flat light emitting surface 32 (upper surface 31) and having an electrode 33 on the side surface 34 is used, but the shape of the light emitting surface 32 of the light emitting element 30 is used. The arrangement of the electrodes 33 of the light emitting element 30 is not limited to these, and the light emitting element 30 having an arbitrary configuration can be used.

本実施の形態は、図5に示すように、発光素子30として砲弾型発光ダイオードを使用する点が、本発明の実施の形態1と異なる。その他の構成は実施の形態1と同様である。   As shown in FIG. 5, this embodiment is different from Embodiment 1 of the present invention in that a bullet-type light emitting diode is used as the light emitting element 30. Other configurations are the same as those of the first embodiment.

表示装置11における発光素子30の先端部分はドーム形状であるので、図5に示すように、フィルム状の防水部材50が容易に発光素子30の光出射面32の形状に沿い、フィルム状の防水部材50が発光素子30の光出射面32に密着する。   Since the tip portion of the light emitting element 30 in the display device 11 has a dome shape, the film-like waterproof member 50 easily follows the shape of the light emitting surface 32 of the light emitting element 30 as shown in FIG. The member 50 is in close contact with the light emitting surface 32 of the light emitting element 30.

フィルム状の防水部材50が発光素子30の光出射面32に密着することにより、フィルム状の防水部材50における発光素子30の出射光35の表面反射が減少し、表示装置11は明るい画像を表示できる。また、表示装置11は、実施の形態1に係る表示装置10と同様に、表示装置11を防水しつつ、表示装置11の視野角を広くでき、厚さを薄くできる。   When the film-like waterproof member 50 is in close contact with the light emitting surface 32 of the light-emitting element 30, the surface reflection of the emitted light 35 of the light-emitting element 30 on the film-like waterproof member 50 is reduced, and the display device 11 displays a bright image. it can. Moreover, the display apparatus 11 can widen the viewing angle of the display apparatus 11 and can reduce thickness while waterproofing the display apparatus 11 similarly to the display apparatus 10 which concerns on Embodiment 1. FIG.

実施の形態3.
実施の形態1、2においては、1つのフィルム状の防水部材50によって、回路基板20の実装面22と実装された発光素子30との全体を覆ったが、フィルム状の防水部材50が回路基板20の実装面22と実装された発光素子30とを覆う態様はこれに限られない。
Embodiment 3 FIG.
In the first and second embodiments, one film-like waterproof member 50 covers the entire mounting surface 22 of the circuit board 20 and the mounted light-emitting element 30, but the film-like waterproof member 50 is used as the circuit board. The aspect which covers 20 mounting surfaces 22 and the mounted light emitting element 30 is not restricted to this.

本実施の形態においては、図6、7に示すように、複数のフィルム状の防水部材50が、回路基板20の実装面22に実装された発光素子30を1行ずつ覆い、密封する。回路基板20と発光素子30の構成は、実施の形態1と同様である。   In the present embodiment, as shown in FIGS. 6 and 7, a plurality of film-like waterproof members 50 cover the light emitting elements 30 mounted on the mounting surface 22 of the circuit board 20 line by line and seal them. The configurations of the circuit board 20 and the light emitting element 30 are the same as those in the first embodiment.

具体的には、表示装置12は、4行×5列のマトリクス状に実装された発光素子30の行数と同じ数(4個)のフィルム状の防水部材50a〜50dを備える。また、フィルム状の防水部材50a〜50dは、それぞれ発光素子30の上面31と側面34とに沿って、1行ずつ発光素子30を覆い、発光素子30の上面31と側面34とに密着する。   Specifically, the display device 12 includes the same number (four) of film-like waterproof members 50a to 50d as the number of rows of the light emitting elements 30 mounted in a matrix of 4 rows × 5 columns. The film-like waterproof members 50 a to 50 d cover the light emitting elements 30 one by one along the upper surface 31 and the side surface 34 of the light emitting element 30, and are in close contact with the upper surface 31 and the side surface 34 of the light emitting element 30.

上記の構成を備えた表示装置12の作製方法について、説明する。
まず、実施の形態1と同様に、配線を備えた回路基板20を準備し、回路基板20の実装面22に各発光素子30を実装する。
回路基板20の実装面22の周辺部と発光素子30の各行の間とに、発光素子30を囲んで接着剤を塗布する。次に、接着剤が塗布された回路基板20とフィルム状の防水部材50a〜50dとを真空容器内に設置し、真空容器内を脱気し減圧する。
減圧された真空容器内でフィルム状の防水部材50a〜50dを、発光素子30の上面31と側面34に沿わせて、回路基板20の実装面22に貼り付ける。これにより、回路基板20の実装面22と実装された発光素子30は、フィルム状の防水部材50a〜50dによって密封される。
真空容器内を常圧に戻し、真空容器からフィルム状の防水部材50a〜50dが貼り付けられた回路基板20を取り出す。最後に、実施の形態1と同様に、フィルム状の防水部材50a〜50dが貼り付けられた回路基板20にマスク部材40を固定する。
フィルム状の防水部材50a〜50dは、減圧された真空容器内で回路基板20の実装面22に貼り付けられるので、真空容器から回路基板20を取り出すと、フィルム状の防水部材50a〜50dは大気圧によって押圧され、それぞれ発光素子30の上面31と側面34とに密着する。
以上によって、表示装置12を作製できる。
A method for manufacturing the display device 12 having the above structure will be described.
First, as in the first embodiment, a circuit board 20 having wiring is prepared, and each light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20.
An adhesive is applied around the light emitting elements 30 between the peripheral portion of the mounting surface 22 of the circuit board 20 and each row of the light emitting elements 30. Next, the circuit board 20 coated with the adhesive and the film-like waterproof members 50a to 50d are placed in a vacuum vessel, and the inside of the vacuum vessel is deaerated and decompressed.
The film-like waterproof members 50 a to 50 d are attached to the mounting surface 22 of the circuit board 20 along the upper surface 31 and the side surface 34 of the light emitting element 30 in the decompressed vacuum container. Thereby, the mounting surface 22 of the circuit board 20 and the mounted light emitting element 30 are sealed by the film-like waterproof members 50a to 50d.
The inside of the vacuum vessel is returned to normal pressure, and the circuit board 20 to which the film-like waterproof members 50a to 50d are attached is taken out from the vacuum vessel. Finally, as in the first embodiment, the mask member 40 is fixed to the circuit board 20 to which the film-like waterproof members 50a to 50d are attached.
Since the film-like waterproof members 50a to 50d are affixed to the mounting surface 22 of the circuit board 20 in a decompressed vacuum container, when the circuit board 20 is taken out from the vacuum container, the film-like waterproof members 50a to 50d are large. It is pressed by the atmospheric pressure and is in close contact with the upper surface 31 and the side surface 34 of the light emitting element 30.
As described above, the display device 12 can be manufactured.

フィルム状の防水部材50a〜50dが実装された発光素子30を1行ずつ覆うことにより、1つのフィルム状の防水部材50が覆う発光素子30の数が少なくなり、フィルム状の防水部材50の貼り付け(表示装置12の作製)が容易になる。また、表示装置12は、実施の形態2に係る表示装置11と同様に、明るい画像を表示できる。さらに、表示装置12を防水しつつ表示装置12の視野角を広くでき、表示装置12の厚さを薄くできる。   By covering the light emitting elements 30 on which the film-like waterproof members 50a to 50d are mounted one by one, the number of the light-emitting elements 30 covered by one film-like waterproof member 50 is reduced, and the film-like waterproof member 50 is attached. Attachment (production of the display device 12) is facilitated. Further, the display device 12 can display a bright image in the same manner as the display device 11 according to the second embodiment. Furthermore, the viewing angle of the display device 12 can be widened while waterproofing the display device 12, and the thickness of the display device 12 can be reduced.

実施の形態4.
実施の形態1〜3においては、マスク部材40の本体部41をフィルム状の防水部材50、50a〜50dに配置したが、マスク部材40の本体部41の配置はこれに限られず、マスク部材40が外光を遮り、マスク部材40の本体部41の回路基板20の実装面22からの高さが低くなる配置であればよい。
Embodiment 4 FIG.
In the first to third embodiments, the main body portion 41 of the mask member 40 is disposed on the film-like waterproof members 50 and 50a to 50d. However, the arrangement of the main body portion 41 of the mask member 40 is not limited thereto, and the mask member 40 is not limited thereto. May be any arrangement that blocks external light and reduces the height of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20.

本実施の形態においては、図8に示すように、マスク部材40の本体部41がフィルム状の防水部材50a〜50dの上方に配置される。回路基板20と発光素子30とフィルム状の防水部材50a〜50dの構成は、実施の形態3と同様である。   In this Embodiment, as shown in FIG. 8, the main-body part 41 of the mask member 40 is arrange | positioned above the film-like waterproof members 50a-50d. The configurations of the circuit board 20, the light emitting element 30, and the film-like waterproof members 50 a to 50 d are the same as those in the third embodiment.

表示装置13におけるマスク部材40の脚部42の高さH1は、回路基板20の厚さとフィルム状の防水部材50の厚さとの和よりも高く形成される。これにより、マスク部材40の本体部41はフィルム状の防水部材50a〜50dの上方に配置され、マスク部材40の本体部41とフィルム状の防水部材50a〜50dとの間に隙間が生じる。   The height H1 of the leg portion 42 of the mask member 40 in the display device 13 is formed higher than the sum of the thickness of the circuit board 20 and the thickness of the film-like waterproof member 50. Accordingly, the main body 41 of the mask member 40 is disposed above the film-like waterproof members 50a to 50d, and a gap is generated between the main body 41 of the mask member 40 and the film-like waterproof members 50a to 50d.

マスク部材40の本体部41とフィルム状の防水部材50a〜50dとの間に隙間が生じることにより、雨水等がマスク部材40の本体部41に貯まらず、防水性が向上する。
また、表示装置13は、実施の形態3に係る表示装置12と同様に、作製が容易であり、明るい画像を表示できる。さらに、表示装置13の視野角を広くでき、厚さを薄くできる。
Since a gap is generated between the main body portion 41 of the mask member 40 and the film-like waterproof members 50a to 50d, rainwater or the like does not accumulate in the main body portion 41 of the mask member 40, and the waterproofness is improved.
In addition, the display device 13 is easy to manufacture and can display a bright image, like the display device 12 according to the third embodiment. Further, the viewing angle of the display device 13 can be widened and the thickness can be reduced.

実施の形態5.
実施の形態1〜4においては、回路基板20の実装面22には発光素子30が配置(実装)されているが、回路基板20の実装面22には他の部材も配置できる。
本実施の形態においては、図9、10に示すように、マスク部材40が回路基板20の実装面22に配置され、フィルム状の防水部材50は、回路基板20の実装面22と実装された発光素子30とマスク部材40とを覆い、密封する。回路基板20と発光素子30の構成は、実施の形態1と同様である。
Embodiment 5. FIG.
In the first to fourth embodiments, the light emitting element 30 is disposed (mounted) on the mounting surface 22 of the circuit board 20, but other members can also be disposed on the mounting surface 22 of the circuit board 20.
In the present embodiment, as shown in FIGS. 9 and 10, the mask member 40 is disposed on the mounting surface 22 of the circuit board 20, and the film-like waterproof member 50 is mounted on the mounting surface 22 of the circuit board 20. The light emitting element 30 and the mask member 40 are covered and sealed. The configurations of the circuit board 20 and the light emitting element 30 are the same as those in the first embodiment.

表示装置14におけるマスク部材40は脚部42を備えていない。また、マスク部材40の長さL4は、発光素子30のX軸方向の列の長さL5より長く、回路基板20のX軸方向の長さL2よりも短い。
各マスク部材40はY軸方向に配列され、接着剤によって回路基板20の実装面22に固定される。
The mask member 40 in the display device 14 does not include the leg portion 42. The length L4 of the mask member 40 is longer than the length L5 of the light emitting elements 30 in the X-axis direction and shorter than the length L2 of the circuit board 20 in the X-axis direction.
The mask members 40 are arranged in the Y-axis direction and are fixed to the mounting surface 22 of the circuit board 20 with an adhesive.

フィルム状の防水部材50は、回路基板20の実装面22と実装された発光素子30と回路基板20の実装面22に固定されたマスク部材40との全体を覆い、密封する。また、フィルム状の防水部材50は、回路基板20の実装面22、発光素子30の上面31と側面34、マスク部材40の上面43と側面44に密着する。   The film-like waterproof member 50 covers and seals the entire mounting surface 22 of the circuit board 20, the light emitting element 30 mounted thereon, and the mask member 40 fixed to the mounting surface 22 of the circuit board 20. The film-shaped waterproof member 50 is in close contact with the mounting surface 22 of the circuit board 20, the upper surface 31 and the side surface 34 of the light emitting element 30, and the upper surface 43 and the side surface 44 of the mask member 40.

上記の構成を備えた表示装置14の作製方法について、説明する。
まず、実施の形態1と同様に、配線を備えた回路基板20を準備し、回路基板20の実装面22に各発光素子30を実装する。
次に、回路基板20の実装面22にマスク部材40を接着剤等によって固定する。
その後、回路基板20の実装面22の周辺部に、発光素子30を囲んで接着剤を塗布する。接着剤が塗布された回路基板20とフィルム状の防水部材50とを真空容器内に設置し、真空容器内を脱気し減圧する。
減圧された真空容器内でフィルム状の防水部材50を、発光素子30の上面31と側面34、マスク部材40の上面43と側面44とに沿わせて、回路基板20の実装面22に貼り付ける。これにより、回路基板20の実装面22と実装された発光素子30と固定されたマスク部材40は、フィルム状の防水部材50によって密封される。
真空容器内を常圧に戻し、真空容器からフィルム状の防水部材50が貼り付けられた回路基板20を取り出す。
フィルム状の防水部材50は、減圧された真空容器内で回路基板20の実装面22に貼り付けられるので、真空容器から回路基板20を取り出すと、フィルム状の防水部材50は大気圧によって押圧され、回路基板20の実装面22、発光素子30の上面31と側面34、マスク部材40の上面43と側面44に密着する。
A method for manufacturing the display device 14 having the above configuration will be described.
First, as in the first embodiment, a circuit board 20 having wiring is prepared, and each light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20.
Next, the mask member 40 is fixed to the mounting surface 22 of the circuit board 20 with an adhesive or the like.
Thereafter, an adhesive is applied to the periphery of the mounting surface 22 of the circuit board 20 so as to surround the light emitting element 30. The circuit board 20 to which the adhesive is applied and the film-like waterproof member 50 are placed in a vacuum container, and the inside of the vacuum container is deaerated and decompressed.
The film-shaped waterproof member 50 is attached to the mounting surface 22 of the circuit board 20 along the upper surface 31 and the side surface 34 of the light emitting element 30 and the upper surface 43 and the side surface 44 of the mask member 40 in the decompressed vacuum container. . As a result, the mounting surface 22 of the circuit board 20 and the mounted light emitting element 30 and the mask member 40 fixed thereto are sealed by the film-like waterproof member 50.
The inside of the vacuum vessel is returned to normal pressure, and the circuit board 20 with the film-like waterproof member 50 attached is taken out of the vacuum vessel.
Since the film-like waterproof member 50 is affixed to the mounting surface 22 of the circuit board 20 in a decompressed vacuum container, when the circuit board 20 is taken out from the vacuum container, the film-like waterproof member 50 is pressed by atmospheric pressure. In close contact with the mounting surface 22 of the circuit board 20, the upper surface 31 and the side surface 34 of the light emitting element 30, and the upper surface 43 and the side surface 44 of the mask member 40.

マスク部材40が回路基板20の実装面に配置されるので、マスク部材40(本体部41)の回路基板20の実装面22からの高さH4を容易に低くできる。したがって、表示装置10の視野角を容易に広くできる。
フィルム状の防水部材50が、回路基板20の実装面22と発光素子30に加えてマスク部材40を覆うので、表示装置14の防水性がより向上する。さらに、フィルム状の防水部材50が発光素子30の上面31(光出射面32)に密着するので、表示装置14は明るい画像を表示できる。また、表示装置14の厚さを薄くできる。
なお、本実施の形態においても、フィルム状の防水部材50として複数のフィルム状の防水部材50a〜50dを使用し、フィルム状の防水部材50a〜50dのそれぞれが、回路基板20の実装面22と実装された発光素子30と固定されたマスク部材40とを覆い密封することもできる。
Since the mask member 40 is disposed on the mounting surface of the circuit board 20, the height H4 of the mask member 40 (main body portion 41) from the mounting surface 22 of the circuit board 20 can be easily reduced. Therefore, the viewing angle of the display device 10 can be easily widened.
Since the film-like waterproof member 50 covers the mask member 40 in addition to the mounting surface 22 and the light emitting element 30 of the circuit board 20, the waterproofness of the display device 14 is further improved. Further, since the film-like waterproof member 50 is in close contact with the upper surface 31 (light emitting surface 32) of the light emitting element 30, the display device 14 can display a bright image. Further, the thickness of the display device 14 can be reduced.
Also in the present embodiment, a plurality of film-like waterproof members 50a to 50d are used as the film-like waterproof member 50, and each of the film-like waterproof members 50a to 50d is connected to the mounting surface 22 of the circuit board 20. The mounted light emitting element 30 and the fixed mask member 40 can be covered and sealed.

実施の形態6.
実施の形態1〜5において、表示装置10〜14は外光を遮るマスク部材40を備えているが、外光を遮る他の部材を備えてもよい。
表示装置15は、図11、12に示すように、外光を遮るマスク板46を備え、各マスク部材40はマスク板46に配置される。また、マスク板46はフィルム状の防水部材50a〜50dに配置される。回路基板20と発光素子30とフィルム状の防水部材50a〜50dの構成は、実施の形態3と同様である。
Embodiment 6 FIG.
In the first to fifth embodiments, the display devices 10 to 14 include the mask member 40 that blocks external light, but may include other members that block external light.
As shown in FIGS. 11 and 12, the display device 15 includes a mask plate 46 that blocks outside light, and each mask member 40 is disposed on the mask plate 46. The mask plate 46 is disposed on the film-like waterproof members 50a to 50d. The configurations of the circuit board 20, the light emitting element 30, and the film-like waterproof members 50 a to 50 d are the same as those in the third embodiment.

図13に示すように、マスク板46は本体部47と脚部48とから構成される。マスク板46のX軸方向の長さL6は、回路基板20のX軸方向の長さL2より長く、マスク板46の脚部48間の距離(脚部48と脚部48とのX軸方向の距離)が回路基板20のX軸方向の長さL2とほぼ同じである。マスク板46のY軸方向の長さL7は、回路基板20のY軸方向の長さL8より短い。マスク板46の脚部48の高さは、回路基板20の厚さとフィルム状の防水部材50a〜50dの厚さとの和とほぼ同じである。   As shown in FIG. 13, the mask plate 46 includes a main body portion 47 and leg portions 48. The length L6 of the mask plate 46 in the X-axis direction is longer than the length L2 of the circuit board 20 in the X-axis direction, and the distance between the leg portions 48 of the mask board 46 (the X-axis direction between the leg portions 48 and 48). Is substantially the same as the length L2 of the circuit board 20 in the X-axis direction. The length L7 of the mask plate 46 in the Y-axis direction is shorter than the length L8 of the circuit board 20 in the Y-axis direction. The height of the leg portion 48 of the mask plate 46 is substantially the same as the sum of the thickness of the circuit board 20 and the thickness of the film-like waterproof members 50a to 50d.

マスク板46の本体部47は、発光素子30が回路基板20の実装面22に実装された位置に開口部49を有する。開口部49は矩形状に形成される。また、開口部49は、対応する発光素子30を挿入するために、発光素子30の平面サイズよりも大きく形成される。
マスク板46は、例えば黒色の樹脂から射出成形によって作製される。
The main body 47 of the mask plate 46 has an opening 49 at a position where the light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20. The opening 49 is formed in a rectangular shape. Further, the opening 49 is formed larger than the planar size of the light emitting element 30 in order to insert the corresponding light emitting element 30.
The mask plate 46 is produced from a black resin by injection molding, for example.

マスク板46の本体部47は、各発光素子30が対応する開口部49に挿入された状態でフィルム状の防水部材50a〜50dに配置される。マスク板46の脚部48が回路基板20を回路基板20のX軸方向の両端部で挟み、回路基板20の側面に接着されて回路基板20に固定される。   The main body 47 of the mask plate 46 is disposed on the film-like waterproof members 50a to 50d in a state where each light emitting element 30 is inserted into the corresponding opening 49. Legs 48 of the mask plate 46 sandwich the circuit board 20 at both ends in the X-axis direction of the circuit board 20 and are bonded to the side surfaces of the circuit board 20 to be fixed to the circuit board 20.

表示装置15におけるマスク部材40は脚部42を備えていない。また、マスク部材の長さ(X軸方向の長さ)は、マスク板46のX軸方向の長さL6と同じである。各マスク部材40はマスク板46に配置される。各マスク部材40はY軸方向に配列され、接着剤によってマスク板46に固定される。   The mask member 40 in the display device 15 does not include the leg portion 42. Further, the length of the mask member (the length in the X-axis direction) is the same as the length L6 of the mask plate 46 in the X-axis direction. Each mask member 40 is disposed on a mask plate 46. The mask members 40 are arranged in the Y-axis direction and are fixed to the mask plate 46 with an adhesive.

フィルム状の防水部材50a〜50dは、実施の形態3と同様に、それぞれ発光素子30の上面31と側面34とに沿って、1行ずつ発光素子30を覆い、発光素子30の上面31と側面34とに密着する。また、フィルム状の防水部材50a〜50dは回路基板20の実装面22とマスク板46の本体部47とに挟まれている。   As in the third embodiment, the film-like waterproof members 50a to 50d cover the light emitting elements 30 one by one along the upper surface 31 and the side surface 34 of the light emitting element 30, respectively. 34. The film-like waterproof members 50 a to 50 d are sandwiched between the mounting surface 22 of the circuit board 20 and the main body 47 of the mask plate 46.

上記の構成を備えた表示装置15の作製方法について、説明する。
発光素子30の回路基板20の実装面22への実装と、フィルム状の防水部材50a〜50dの回路基板20の実装面22への貼り付けと、真空容器からの回路基板20の取り出しについては、実施の形態3と同様な作製方法により行う。これにより、回路基板20の実装面22と実装された発光素子30は、フィルム状の防水部材50a〜50dによって密封される。
次に、各発光素子30を対応するマスク板46の開口部49に挿入し、フィルム状の防水部材50a〜50dの上からマスク板46の本体部47を配置し、マスク板46の脚部48を回路基板20に接着してマスク板46を回路基板20に固定する。
最後に、各マスク部材40をマスク板46に配置し、マスク部材40をマスク板46に接着して固定する。
フィルム状の防水部材50a〜50dは、減圧された真空容器内で回路基板20の実装面22に貼り付けられるので、真空容器から回路基板20を取り出すと、フィルム状の防水部材50a〜50dは大気圧によって押圧される。これにより、フィルム状の防水部材50a〜50dは、それぞれ発光素子30の上面31と側面34とに密着する。
以上によって、表示装置15を作製できる。なお、予めマスク板46にマスク部材40を固定し、マスク板46を回路基板20に固定してもよい。
A method for manufacturing the display device 15 having the above configuration will be described.
Regarding the mounting of the light emitting element 30 on the mounting surface 22 of the circuit board 20, the attachment of the film-like waterproof members 50a to 50d to the mounting surface 22 of the circuit board 20, and the removal of the circuit board 20 from the vacuum container, The manufacturing method is similar to that in Embodiment Mode 3. Thereby, the mounting surface 22 of the circuit board 20 and the mounted light emitting element 30 are sealed by the film-like waterproof members 50a to 50d.
Next, each light emitting element 30 is inserted into the opening 49 of the corresponding mask plate 46, the main body portion 47 of the mask plate 46 is disposed on the film-like waterproof members 50a to 50d, and the leg portions 48 of the mask plate 46 are disposed. Is bonded to the circuit board 20 to fix the mask plate 46 to the circuit board 20.
Finally, each mask member 40 is disposed on the mask plate 46, and the mask member 40 is bonded and fixed to the mask plate 46.
Since the film-like waterproof members 50a to 50d are affixed to the mounting surface 22 of the circuit board 20 in a decompressed vacuum container, when the circuit board 20 is taken out from the vacuum container, the film-like waterproof members 50a to 50d are large. Pressed by atmospheric pressure. Thereby, the film-like waterproof members 50a to 50d are in close contact with the upper surface 31 and the side surface 34 of the light emitting element 30, respectively.
As described above, the display device 15 can be manufactured. Note that the mask member 40 may be fixed to the mask plate 46 in advance, and the mask plate 46 may be fixed to the circuit board 20.

発光素子30がフィルム状の防水部材50a〜50dに配置されたマスク板46の開口部49に挿入され、発光素子30の周囲がマスク板46に覆われるので、回路基板20の実装面22などからの外光の反射が減少し、表示装置15が表示する画像などのコントラストが向上する。また、表示装置15は、実施の形態3に係る表示装置12と同様に、明るい画像を表示できる。さらに、表示装置15を防水しつつ表示装置15の視野角を広くでき、表示装置15の厚さを薄くできる。   Since the light emitting element 30 is inserted into the opening 49 of the mask plate 46 disposed on the film-like waterproof members 50a to 50d and the periphery of the light emitting element 30 is covered by the mask plate 46, the mounting surface 22 of the circuit board 20 and the like can be used. The reflection of external light is reduced, and the contrast of the image displayed on the display device 15 is improved. In addition, the display device 15 can display a bright image similarly to the display device 12 according to the third embodiment. Furthermore, the viewing angle of the display device 15 can be widened while the display device 15 is waterproofed, and the thickness of the display device 15 can be reduced.

実施の形態7.
実施の形態6においては、マスク板46がフィルム状の防水部材50a〜50dに配置されているが、マスク板46の配置はこれに限られない。
Embodiment 7 FIG.
In Embodiment 6, although the mask board 46 is arrange | positioned at the film-shaped waterproofing members 50a-50d, arrangement | positioning of the mask board 46 is not restricted to this.

表示装置16においては、図14、15に示すように、マスク部材40が配置されたマスク板46が回路基板20の実装面22に配置される。また、フィルム状の防水部材50は、発光素子30と回路基板20の実装面22とマスク部材40とマスク板46とを覆い、密封する。回路基板20と発光素子30の構成は、実施の形態6と同様である。   In the display device 16, as shown in FIGS. 14 and 15, a mask plate 46 on which the mask member 40 is disposed is disposed on the mounting surface 22 of the circuit board 20. The film-like waterproof member 50 covers and seals the light emitting element 30, the mounting surface 22 of the circuit board 20, the mask member 40, and the mask plate 46. The configurations of the circuit board 20 and the light emitting element 30 are the same as those in the sixth embodiment.

表示装置16におけるマスク板46は、脚部48を備えていない。また、マスク板46のX軸方向の長さL9、Y軸方向の長さL10は、それぞれ回路基板20のX軸方向の長さL2、Y軸方向の長さL8よりも短い。
表示装置16におけるマスク板46は、実施の形態6と同様に、発光素子30が回路基板20の実装面22に実装された位置に開口部49を有する。開口部49は、発光素子30の平面サイズよりも大きく、矩形状に形成される。
The mask plate 46 in the display device 16 does not include the leg portion 48. Further, the length L9 in the X-axis direction and the length L10 in the Y-axis direction of the mask plate 46 are shorter than the length L2 in the X-axis direction and the length L8 in the Y-axis direction of the circuit board 20, respectively.
The mask plate 46 in the display device 16 has an opening 49 at a position where the light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20 as in the sixth embodiment. The opening 49 is larger than the planar size of the light emitting element 30 and is formed in a rectangular shape.

マスク板46は、各発光素子30が対応する開口部49に挿入された状態で回路基板20の実装面22に配置される。マスク板46は、接着剤によって回路基板20の実装面22に固定される。   The mask plate 46 is disposed on the mounting surface 22 of the circuit board 20 in a state where each light emitting element 30 is inserted into the corresponding opening 49. The mask plate 46 is fixed to the mounting surface 22 of the circuit board 20 with an adhesive.

表示装置16におけるマスク部材40は、実施の形態6と同様に脚部42を備えていない。また、マスク部材の長さ(X軸方向の長さ)は、マスク板46のX軸方向の長さL9と同じである。マスク部材40はマスク板46に配置される。各マスク部材40はY軸方向に配列され、接着剤によってマスク板46に固定される。   The mask member 40 in the display device 16 does not include the leg portion 42 as in the sixth embodiment. The length of the mask member (the length in the X-axis direction) is the same as the length L9 of the mask plate 46 in the X-axis direction. The mask member 40 is disposed on the mask plate 46. The mask members 40 are arranged in the Y-axis direction and are fixed to the mask plate 46 with an adhesive.

フィルム状の防水部材50は、回路基板20の実装面22と実装された発光素子30と回路基板20の実装面22に固定されたマスク板46とマスク板46に固定されたマスク部材40との全体を覆い、密封する。また、フィルム状の防水部材50は、発光素子30の上面31と側面34、マスク部材40の上面43と側面44、マスク板46の正面側の表面とに密着する。   The film-like waterproof member 50 includes a mounting surface 22 of the circuit board 20, a light emitting element 30 mounted thereon, a mask plate 46 fixed to the mounting surface 22 of the circuit board 20, and a mask member 40 fixed to the mask plate 46. Cover and seal the whole. The film-like waterproof member 50 is in close contact with the upper surface 31 and the side surface 34 of the light emitting element 30, the upper surface 43 and the side surface 44 of the mask member 40, and the front surface of the mask plate 46.

上記の構成を備えた表示装置16の作製方法について、説明する。
まず、実施の形態1と同様に、配線を備えた回路基板20を準備し、回路基板20の実装面22に各発光素子30を実装する。
次に、各発光素子30を対応するマスク板46の開口部49に挿入し、回路基板20の実装面22にマスク板46を配置して接着剤によって固定する。さらに、各マスク部材40をマスク板46に配置し、マスク部材40をマスク板46に接着して固定する。
その後、回路基板20の実装面22の周辺部に、マスク板46を囲んで接着剤を塗布する。接着剤が塗布された回路基板20とフィルム状の防水部材50とを真空容器内に設置し、真空容器内を脱気し減圧する。
減圧された真空容器内でフィルム状の防水部材50を、発光素子30の上面31と側面34、マスク部材40の上面43と側面44とに沿わせて、回路基板20の実装面22に貼り付ける。これにより、回路基板20の実装面22と実装された発光素子30と回路基板20の実装面22に固定されたマスク板46とマスク板46に固定されたマスク部材40とは、フィルム状の防水部材50によって密封される。
真空容器内を常圧に戻し、真空容器からフィルム状の防水部材50が貼り付けられた回路基板20を取り出す。
フィルム状の防水部材50は、減圧された真空容器内で回路基板20の実装面22に貼り付けられるので、真空容器から回路基板20を取り出すと、フィルム状の防水部材50は大気圧によって押圧される。これにより、フィルム状の防水部材50は、発光素子30の上面31と側面34、マスク部材40の上面43と側面44、マスク板46の正面側の表面とに密着する。
以上によって、表示装置16を作製できる。なお、予めマスク板46にマスク部材40を固定し、マスク板46を回路基板20に固定してもよい。
A method for manufacturing the display device 16 having the above structure will be described.
First, as in the first embodiment, a circuit board 20 having wiring is prepared, and each light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20.
Next, each light emitting element 30 is inserted into the opening 49 of the corresponding mask plate 46, and the mask plate 46 is disposed on the mounting surface 22 of the circuit board 20 and fixed with an adhesive. Further, each mask member 40 is disposed on the mask plate 46, and the mask member 40 is bonded and fixed to the mask plate 46.
Thereafter, an adhesive is applied to the periphery of the mounting surface 22 of the circuit board 20 so as to surround the mask plate 46. The circuit board 20 to which the adhesive is applied and the film-like waterproof member 50 are placed in a vacuum container, and the inside of the vacuum container is deaerated and decompressed.
The film-shaped waterproof member 50 is attached to the mounting surface 22 of the circuit board 20 along the upper surface 31 and the side surface 34 of the light emitting element 30 and the upper surface 43 and the side surface 44 of the mask member 40 in the decompressed vacuum container. . Thereby, the mounting surface 22 of the circuit board 20, the light emitting element 30 mounted thereon, the mask plate 46 fixed to the mounting surface 22 of the circuit board 20, and the mask member 40 fixed to the mask plate 46 are film-like waterproof. Sealed by member 50.
The inside of the vacuum vessel is returned to normal pressure, and the circuit board 20 with the film-like waterproof member 50 attached is taken out of the vacuum vessel.
Since the film-like waterproof member 50 is affixed to the mounting surface 22 of the circuit board 20 in a decompressed vacuum container, when the circuit board 20 is taken out from the vacuum container, the film-like waterproof member 50 is pressed by atmospheric pressure. The Thereby, the film-like waterproof member 50 is in close contact with the upper surface 31 and the side surface 34 of the light emitting element 30, the upper surface 43 and the side surface 44 of the mask member 40, and the front surface of the mask plate 46.
As described above, the display device 16 can be manufactured. Note that the mask member 40 may be fixed to the mask plate 46 in advance, and the mask plate 46 may be fixed to the circuit board 20.

発光素子30の周囲がマスク板46に覆われ、フィルム状の防水部材50がマスク部材40とマスク板46も覆うので、表示装置16が表示する画像などのコントラストが向上し、表示装置16の防水性も向上する。
また、表示装置16は、実施の形態3に係る表示装置12と同様に、明るい画像を表示できる。さらに、表示装置16の視野角を広くでき、表示装置16の厚さを薄くできる。
Since the periphery of the light emitting element 30 is covered with the mask plate 46 and the film-like waterproof member 50 also covers the mask member 40 and the mask plate 46, the contrast of the image displayed on the display device 16 is improved, and the display device 16 is waterproof. Also improves.
Further, the display device 16 can display a bright image in the same manner as the display device 12 according to the third embodiment. Furthermore, the viewing angle of the display device 16 can be widened, and the thickness of the display device 16 can be reduced.

実施の形態8.
実施の形態1〜7においては、回路基板20とフィルム状の防水部材50、50a〜50dによって回路基板20の実装面22、実装された発光素子30等を密閉したが、使用環境によっては、密閉することにより配線に短絡が生じる場合もある。本実施の形態においては、回路基板20が、発光素子30が回路基板20の実装面22に実装される部分に貫通孔24を有する点が、実施の形態1〜7と異なる。
Embodiment 8 FIG.
In the first to seventh embodiments, the circuit board 20 and the film-like waterproof members 50 and 50a to 50d are used to seal the mounting surface 22 of the circuit board 20, the mounted light emitting element 30, and the like. This may cause a short circuit in the wiring. In the present embodiment, the circuit board 20 is different from the first to seventh embodiments in that the light emitting element 30 has a through hole 24 in a portion where the light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20.

表示装置17の回路基板20は、図16に示すように各発光素子30が実装される領域の中央に、回路基板20の実装面22から回路基板20の実装面22に対向する面26に貫通する貫通孔24を有する。
その他の構成は、例としての実施の形態3と同様である。なお、表示装置17を作製する場合、真空容器からフィルム状の防水部材50a〜50dが貼り付けられた回路基板20を取り出すまで、回路基板20の貫通孔24を塞いでおく。
As shown in FIG. 16, the circuit board 20 of the display device 17 penetrates from the mounting surface 22 of the circuit board 20 to the surface 26 facing the mounting surface 22 of the circuit board 20 in the center of the region where the light emitting elements 30 are mounted. A through-hole 24 is formed.
Other configurations are the same as those of the third embodiment as an example. When the display device 17 is manufactured, the through hole 24 of the circuit board 20 is closed until the circuit board 20 to which the film-like waterproof members 50a to 50d are attached is taken out from the vacuum container.

フィルム状の防水部材50a〜50dを透過した水蒸気が、回路基板20の貫通孔24から表示装置17の正面の反対側に放出されるので、表示装置17を防水しつつ結露を防ぐことができる。表示装置17は、実施の形態3に係る表示装置12と同様に、容易に作製できる。また、表示装置17は明るい画像を表示できる。さらに、表示装置17の視野角を広くでき、厚さを薄くできる。   Since the water vapor that has passed through the film-like waterproof members 50a to 50d is released from the through hole 24 of the circuit board 20 to the opposite side of the front surface of the display device 17, dew condensation can be prevented while waterproofing the display device 17. The display device 17 can be easily manufactured in the same manner as the display device 12 according to the third embodiment. The display device 17 can display a bright image. Further, the viewing angle of the display device 17 can be widened and the thickness can be reduced.

なお、回路基板20の貫通孔24は、発光素子30が回路基板20の実装面22に実装される部分に設けられるとは、限られない。回路基板20の貫通孔24は、回路基板20の実装面22のフィルム状の防水部材50a〜50dによって覆われる領域内に設ければよい。   The through hole 24 of the circuit board 20 is not necessarily provided in a portion where the light emitting element 30 is mounted on the mounting surface 22 of the circuit board 20. The through hole 24 of the circuit board 20 may be provided in a region covered with the film-like waterproof members 50 a to 50 d on the mounting surface 22 of the circuit board 20.

以上、本発明の複数の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲で種々の変更が可能である。   As mentioned above, although several embodiment of this invention was described, this invention is not limited to said embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

例えば、発光素子30は、3in1タイプに限られない。発光素子30の出射光35は単色光であってもよい。また、発光素子30のマトリクス状の配列において、赤色光を出射する発光素子30、緑色光を出射する発光素子30、青色光を出射する発光素子30を、列方向に繰り返し配置してもよい。
発光素子30は、表面実装型発光ダイオード、砲弾型発光ダイオードに限られず、自発光型素子であり回路基板20に配列されるものであればよい。
For example, the light emitting element 30 is not limited to the 3 in 1 type. The outgoing light 35 of the light emitting element 30 may be monochromatic light. In the matrix arrangement of the light emitting elements 30, the light emitting elements 30 that emit red light, the light emitting elements 30 that emit green light, and the light emitting elements 30 that emit blue light may be repeatedly arranged in the column direction.
The light emitting element 30 is not limited to a surface mount type light emitting diode and a shell type light emitting diode, and may be a self light emitting type element that is arranged on the circuit board 20.

発光素子30は発光素子30の側面34に電極33を備えるものに限られず、電極33の形状は任意である。例えば、回路基板20の配線に接続され固定されるために、発光素子30の背面(上面31に対向する面)にボール状の電極を配列したBGA(Ball Grid Array)タイプの電極を備えたものでもよい。   The light emitting element 30 is not limited to the one provided with the electrode 33 on the side surface 34 of the light emitting element 30, and the shape of the electrode 33 is arbitrary. For example, in order to be connected and fixed to the wiring of the circuit board 20, a BGA (Ball Grid Array) type electrode in which ball-shaped electrodes are arranged on the back surface (surface facing the upper surface 31) of the light emitting element 30 is provided. But you can.

発光素子30のマトリクス状の配列は、各行(各列)のピッチが同一であるものに限られない。例えば、発光素子30のマトリクス状の配列は1行(1列)毎に半ピッチずれた配列であってもよい。   The matrix-like arrangement of the light emitting elements 30 is not limited to one in which the pitch of each row (each column) is the same. For example, the matrix-like arrangement of the light emitting elements 30 may be an arrangement shifted by a half pitch for each row (one column).

マスク部材40の表面には、シボ加工やつや消し塗装が施されることが好ましい。また、マスク部材40をフィルム状の防水部材50に配置する場合には(例えば、実施の形態1〜3)、マスク部材40の本体部41をフィルム状の防水部材50に接着剤等によって固定してもよい。   The surface of the mask member 40 is preferably subjected to texture processing or matte coating. When the mask member 40 is arranged on the film-like waterproof member 50 (for example, Embodiments 1 to 3), the main body 41 of the mask member 40 is fixed to the film-like waterproof member 50 with an adhesive or the like. May be.

また、マスク部材40の形状は任意であり、例えば、図17に示すように、雨水を防ぐためにZ軸方向の先端にY軸方向に延びる突出部45を備えてもよい。この場合、突出部45によって発光素子30の出射光35が遮られる。したがって、突出部45がY軸方向に突出する長さL11を考慮して、マスク部材40の本体部41の回路基板20の実装面22からの高さH4は、H2<H4≦(L3−L11)×tan(20°)+H2であることが望ましい。   Moreover, the shape of the mask member 40 is arbitrary. For example, as shown in FIG. 17, a protrusion 45 extending in the Y-axis direction may be provided at the tip in the Z-axis direction to prevent rainwater. In this case, the emitted light 35 of the light emitting element 30 is blocked by the protrusion 45. Therefore, in consideration of the length L11 at which the protrusion 45 protrudes in the Y-axis direction, the height H4 of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 is H2 <H4 ≦ (L3-L11 ) × tan (20 °) + H2.

マスク板46の表面には、シボ加工やつや消し塗装が施されることが好ましい。マスク板46は、例えば射出成形によって、マスク部材40と一体に形成されてもよい。マスク板46は、実施の形態4におけるマスク部材40と同様に、例えばマスク板46の脚部48を回路基板20の厚さとフィルム状の防水部材50、50a〜50dの厚さとの和よりも高くすることによって、フィルム状の防水部材50、50a〜50dの上方に配置されてもよい。
なお、マスク板46にマスク部材が配置された場合、マスク部材40の回路基板20の実装面22からの高さH4は、マスク板46の厚さも考慮される。
The surface of the mask plate 46 is preferably subjected to texture processing or matte coating. The mask plate 46 may be formed integrally with the mask member 40, for example, by injection molding. As with the mask member 40 in the fourth embodiment, the mask plate 46 has, for example, a leg portion 48 of the mask plate 46 higher than the sum of the thickness of the circuit board 20 and the thickness of the film-like waterproof members 50 and 50a to 50d. By doing, you may arrange | position above the film-shaped waterproofing members 50 and 50a-50d.
When a mask member is disposed on the mask plate 46, the height H4 of the mask member 40 from the mounting surface 22 of the circuit board 20 also takes into account the thickness of the mask plate 46.

フィルム状の防水部材50が実装された発光素子30全体を覆う例と、フィルム状の防水部材50a〜50dが発光素子30を一列ずつ覆う例を示したが、フィルム状の防水部材50は実装された発光素子30を発光素子30の複数列ずつ覆ってもよいし、実装された発光素子30を1つずつ覆ってもよい。また、フィルム状の防水部材50は、接着剤によって発光素子30に貼り付けられてもよい。これにより、フィルム状の防水部材50における発光素子30からの出射光35の表面反射が減少し、明るい画像が表示できる。   Although the example which covers the light emitting element 30 with which the film-like waterproof member 50 was mounted, and the example in which the film-like waterproof members 50a to 50d cover the light-emitting elements 30 one by one have been shown, the film-like waterproof member 50 is mounted. The light emitting elements 30 may be covered by a plurality of rows of the light emitting elements 30, or the mounted light emitting elements 30 may be covered one by one. The film-like waterproof member 50 may be attached to the light emitting element 30 with an adhesive. Thereby, surface reflection of the emitted light 35 from the light emitting element 30 in the film-like waterproof member 50 is reduced, and a bright image can be displayed.

また、マスク部材40の本体部41の回路基板20の実装面22からの高さH4は上述した式に限定されるものではなく、使用環境等によって変更できる。   Further, the height H4 of the main body 41 of the mask member 40 from the mounting surface 22 of the circuit board 20 is not limited to the above-described formula, and can be changed depending on the use environment or the like.

さらに、複数の表示装置10〜15を組み合わせることによって、より大型の表示装置を構成することもできる。例えば、図18に示されるように、4つの表示装置12が組み合わされて、表示装置60が構成される。なお、例えば、構成の異なる表示装置12と14とが組み合わされてもよい。   Furthermore, a larger display device can be configured by combining a plurality of display devices 10 to 15. For example, as shown in FIG. 18, the display device 60 is configured by combining four display devices 12. For example, display devices 12 and 14 having different configurations may be combined.

10,11,12,13,14,15,16,17,60 表示装置、20 回路基板、22 実装面、24 貫通孔 26 実装面に対向する面、30 発光素子、31,43 上面、32 光出射面、33 電極、34,44 側面、35 出射光、40 マスク部材、41,47 本体部、42,48 脚部、45 突出部、46 マスク板、49 開口部、50,50a,50b,50c,50d フィルム状の防水部材、L1,L2,L4,L5,L6,L7,L8,L9,L10,L11 長さ、L3 距離、H1,H2,H3,H4 高さ、D1 厚さ、P1 位置、θ 出射角   10, 11, 12, 13, 14, 15, 16, 17, 60 Display device, 20 Circuit board, 22 Mounting surface, 24 Through hole 26 Surface facing the mounting surface, 30 Light emitting element, 31, 43 Upper surface, 32 Light Emitting surface, 33 electrodes, 34, 44 side surface, 35 emitting light, 40 mask member, 41, 47 body portion, 42, 48 leg portion, 45 projecting portion, 46 mask plate, 49 opening portion, 50, 50a, 50b, 50c 50d Film-like waterproof member, L1, L2, L4, L5, L6, L7, L8, L9, L10, L11 length, L3 distance, H1, H2, H3, H4 height, D1 thickness, P1 position, θ Output angle

Claims (7)

回路基板と、
前記回路基板の実装面にマトリクス状に実装された複数の発光素子と、
前記発光素子の一方向の列に沿って延び、前記一方向の列に垂直な方向に配列され、外光を遮る複数のマスク部材と、
前記回路基板の実装面と前記複数の発光素子とを覆う、フィルム状の防水部材とを備え、
前記複数のマスク部材は前記回路基板に設けられ、
前記フィルム状の防水部材は、前記回路基板の実装面と前記マスク部材とに挟まれ、
前記マスク部材は、前記回路基板から離れる方向の先端に、前記回路基板と平行な方向に延びる突出部を有する、表示装置。
A circuit board;
A plurality of light emitting elements mounted in a matrix on the mounting surface of the circuit board;
A plurality of mask members extending along one direction row of the light emitting elements, arranged in a direction perpendicular to the one direction row, and blocking external light;
A film-like waterproof member that covers the mounting surface of the circuit board and the plurality of light emitting elements,
The plurality of mask members are provided on the circuit board,
The film-like waterproof member is sandwiched between the mounting surface of the circuit board and the mask member,
The said mask member is a display apparatus which has the protrusion part extended in the direction parallel to the said circuit board in the front-end | tip of the direction away from the said circuit board.
回路基板と、
前記回路基板の実装面にマトリクス状に実装された複数の発光素子と、
前記発光素子が実装された位置に形成された複数の開口部を有し、外光を遮るマスク板と、
前記発光素子の一方向の列に沿って延び、前記一方向の列に垂直な方向に配列され、前記マスク板に配置されて、外光を遮る複数のマスク部材と、
前記回路基板の実装面と前記複数の発光素子とを覆う、フィルム状の防水部材とを備え、
前記マスク板は前記回路基板に設けられ、
前記フィルム状の防水部材は、前記回路基板の実装面と前記マスク板とに挟まれ、
前記マスク部材は、前記回路基板から離れる方向の先端に、前記回路基板と平行な方向に延びる突出部を有する、表示装置。
A circuit board;
A plurality of light emitting elements mounted in a matrix on the mounting surface of the circuit board;
A mask plate having a plurality of openings formed at a position where the light emitting element is mounted, and shielding external light;
A plurality of mask members extending along a row in one direction of the light emitting elements, arranged in a direction perpendicular to the row in the one direction, and arranged on the mask plate to block outside light;
A film-like waterproof member that covers the mounting surface of the circuit board and the plurality of light emitting elements,
The mask plate is provided on the circuit board;
The film-like waterproof member is sandwiched between the mounting surface of the circuit board and the mask plate,
The said mask member is a display apparatus which has the protrusion part extended in the direction parallel to the said circuit board in the front-end | tip of the direction away from the said circuit board.
前記フィルム状の防水部材が前記回路基板の実装面との間を密封している、請求項1又は2に記載の表示装置。   The display device according to claim 1, wherein the film-shaped waterproof member seals a space between the mounting surface of the circuit board. 前記フィルム状の防水部材が前記発光素子の上面と側面とに沿って、密着して前記発光素子を覆う、請求項1から3のいずれか1項に記載の表示装置。   4. The display device according to claim 1, wherein the film-like waterproof member is in close contact with and covers the light emitting element along an upper surface and a side surface of the light emitting element. 前記回路基板の実装面にマトリクス状に実装された前記複数の発光素子は、1行毎に半ピッチずれて配列する、請求項1から4のいずれか1項に記載の表示装置。   5. The display device according to claim 1, wherein the plurality of light emitting elements mounted in a matrix on the mounting surface of the circuit board are arranged with a half-pitch shift for each row. 前記発光素子は内部に光を発する発光チップを有する表面実装型発光ダイオードである、請求項1から5のいずれか1項に記載の表示装置。   The display device according to claim 1, wherein the light emitting element is a surface mount type light emitting diode having a light emitting chip that emits light therein. 請求項1から6のいずれか1項に記載の表示装置が複数組み合わされて構成された、表示装置。   A display device comprising a combination of a plurality of display devices according to claim 1.
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