WO2013021987A1 - Light guiding module and electronic device equipped with same - Google Patents

Light guiding module and electronic device equipped with same Download PDF

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Publication number
WO2013021987A1
WO2013021987A1 PCT/JP2012/070050 JP2012070050W WO2013021987A1 WO 2013021987 A1 WO2013021987 A1 WO 2013021987A1 JP 2012070050 W JP2012070050 W JP 2012070050W WO 2013021987 A1 WO2013021987 A1 WO 2013021987A1
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WO
WIPO (PCT)
Prior art keywords
light
guide module
light guide
circuit board
led
Prior art date
Application number
PCT/JP2012/070050
Other languages
French (fr)
Japanese (ja)
Inventor
三上　伸弘
西村　望
Original Assignee
日本電気株式会社
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Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Publication of WO2013021987A1 publication Critical patent/WO2013021987A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133608—Direct backlight including particular frames or supporting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials

Definitions

  • the present invention relates to a light guide module using a light source and an electronic device including the same.
  • Patent Document 1 discloses a light guide structure that guides LED light to the surface of a housing.
  • a light-shielding sheet having a portion that transmits light is disposed between a plurality of LEDs arranged on a housing and a substrate at a position corresponding to each LED. Light is guided to the housing surface.
  • the casing is thin, the casing and the LED on which the casing is arranged collide with the LED due to a decrease in the strength of the casing.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a light guide module that can be easily reduced in thickness and size while maintaining strength, and an electronic apparatus including the same.
  • a light guide module includes: A circuit board on which wiring is formed; A plurality of light sources mounted at predetermined positions on the circuit board; A plurality of through holes formed at positions corresponding to the plurality of light sources, and a light non-transparent plate that overlaps the circuit board in a state where the light sources are inserted into the corresponding through holes; A translucent housing that houses the light source and the light-impermeable plate; A rib that surrounds the light source and is formed in a peripheral portion of each through-hole of the light-impermeable plate, and is inserted into each through-hole. It is characterized by that.
  • an electronic device provides: Comprising a light guide module according to a first aspect; It is characterized by that.
  • FIG. 1 a is a cross-sectional view of the light guide module 1.
  • FIG. 1b shows the AA cross section of FIG. 1a.
  • the light guide module 1 includes a circuit board 10, a plurality of LEDs 11, a metal plate 12, and a housing 20.
  • the circuit board 10 is made of an insulating resin material. Wiring is formed on the main surface of the circuit board 10. A plurality of LEDs 11 are mounted on the main surface of the circuit board 10 as light sources. The LED 11 is electrically connected to the wiring of the circuit board 10.
  • the LED 11 is a light source for displaying illumination such as characters and patterns on the surface of the housing 20.
  • the LED 11 has a rectangular parallelepiped shape.
  • the LED 11 is mounted on the circuit board 10 on the lower surface.
  • LED11 is equipped with the light emission surface 11a on the upper surface.
  • the plurality of LEDs 11 are arranged at predetermined positions on the circuit board 10. The LED 11 is turned on when a voltage is applied from the wiring of the circuit board 10.
  • the metal plate 12 is formed from a thin plate of light-opaque metal such as pressed stainless steel or titanium.
  • a plurality of through holes 12 a are formed in the metal plate 12 at positions corresponding to the plurality of LEDs 11.
  • the through hole 12a is formed in a rectangular shape.
  • the through hole 12a is slightly larger than the planar size of the LED 11 so that the corresponding LED 11 can be inserted.
  • the metal plate 12 is overlaid on the mounting surface of the LED 11 of the circuit board 10 with the LED 11 inserted into the through hole 12a.
  • the metal plate 12 and the circuit board 10 may be bonded by an adhesive or the like.
  • a metal rib 13 is formed integrally with the metal plate 12 at the peripheral portion of each through hole 12 a of the metal plate 12 so as to surround the LED 11.
  • the height L of the rib 13 is substantially equal to the height T of the LED 11 or higher than the height T of the LED 11. Therefore, in the state where the metal plate 12 and the circuit board 10 overlap, the upper end of the rib 13 is higher than the LED 11.
  • the housing (cover) 20 is made of a light-transmitting resin material such as acrylic, ABS, polycarbonate, epoxy, urethane, or silicon.
  • the housing 20 is integrally formed with the LED 11, the metal plate 12, and the circuit board 10 by insert molding.
  • the manufacturing method of the light guide module 1 is as follows.
  • the metal plate 12 having the through holes 12a and the ribs 13 is formed by pressing. As described above, the through hole 12a is formed at a position corresponding to the arrangement position of the LED 11.
  • the rib 13 is formed so that the upper end of the rib 13 is higher than the upper end of the LED 11 inserted into the through-hole 12 a in the completed state of the light guide module 1.
  • Several LED11 is mounted in the predetermined position of the circuit board 10 in which the circuit pattern was formed.
  • the metal plate 12 and the circuit board 10 are overlapped with the LED 11 corresponding to each through-hole 12a being inserted.
  • the metal plate 12 and the circuit board 10 may be bonded by an adhesive.
  • an upper mold 30 and a lower mold 31 are disposed so as to surround the circuit board 10, the metal plate 12, and the rib 13.
  • the lower mold 31 holds the surface opposite to the surface where the circuit board 10 is bonded to the metal plate 12.
  • casing 20 is formed by the injection molding which pours resin in the metal mold
  • the circuit board 10, the metal plate 12, the rib 13, and the housing 20 are integrally formed. By forming irregularities on the surface of the metal plate 12 that contacts the resin by sandblasting or the like, the adhesion between the metal plate 12 and the housing 20 is improved.
  • a treatment for improving the adhesion with the resin material may be performed. For example, by applying a silane coupling agent to the surface of the metal plate 12 and modifying the surface of the metal plate 12, the adhesion between the metal plate and the resin material can be enhanced.
  • a voltage is applied to the LED 11 from a battery (not shown) through the circuit of the circuit board 10.
  • the plurality of LEDs 11 are selectively lit.
  • Light emitted from the light emitting surface 11 a of the LED 11 is guided into the housing 20 by the rib 13 of the metal plate 12. Since the housing
  • FIG. Illumination such as characters and patterns is displayed on the surface of the housing 20 by the emitted light of the LED 11 that has reached the surface of the housing 20.
  • the periphery of the LED 11 is surrounded by the metal ribs 13. Since the metal rib 13 is non-light-transmitting, the light emitted from the LED 11 cannot pass through the rib 13. Therefore, the light emitted from the LED 11 travels to the surface of the housing 20 (upward in FIG. 1) using the rib 13 as a guide. Since the diffusion range of the emitted light of the LED 11 can be limited by the rib 13, the emitted light of the LED 11 and the emitted light of other adjacent LEDs 11 are not mixed on the surface of the housing 20. Therefore, the light guide module 1 can clearly display the illumination on the surface of the housing 20.
  • the metal plate 12 is inserted into the housing 20 in a state where the metal plate 12 overlaps the circuit board 10. Since the circuit board 10 and the housing 20 are reinforced by the metal plate 12, the impact resistance of the light guide module 1 is improved. In addition, since the light guide module 1 is formed by inserting the metal plate 12 or the LED 11 into the housing 20, the dead space is different from that in the case where the metal plate 12, the LED 11, and the housing 20 are stacked. It does not occur between the housing 20. Therefore, the light guide module 1 can be made thin and small.
  • Embodiment 2 As an electronic apparatus including the light guide module 1, a mobile phone 100 including the light guide module 1 will be described.
  • the configuration of the light guide module 1 is the same as that of the first embodiment. The difference is that the housing 20 is a part of the housing of the mobile phone 100.
  • the mobile phone 100 includes a display-side housing 101 having a display unit for displaying characters and images, an operation-side housing 102 on which operation keys are arranged, and a hinge 103. .
  • the hinge 103 connects the display-side housing 101 and the operation-side housing 102 so as to be rotatable.
  • the display side case 101 is configured by joining a front side case 104 and a rear side case 105 to each other.
  • the front case 104 appears on the front side with the cellular phone 100 folded.
  • the rear case 105 faces the operation side housing 102 in a state where the mobile phone 100 is folded.
  • the illumination unit 107 is an area that displays characters, patterns, and the like when the LED 11 is turned on. When the LED 11 is not lit, the user cannot visually recognize the internal LED 11 from the outside of the front case 104.
  • the illumination unit 107 has the same configuration as the light guide module 1 of the first embodiment.
  • the front side case 104 and the rear side case 105 are made of a resin material having translucency. Further, as shown in FIG. 5, grooves 104a and 105a are respectively formed on the joint surface between the front side case 104 and the rear side case 105 as shown in FIG. The front side case 104 and the rear side case 105 are joined in a watertight state in which a frame-like case packing 106 is fitted in the grooves 104a and 105a.
  • the LED 11, the circuit board 10, and the metal plate 12 are inserted into the front side case 104 of the display side case 101.
  • the LEDs 11 are mounted in a matrix on the circuit board 10 with the light emitting surface 11 a facing the main surface of the front case 104.
  • the metal plate 12 is provided so as to reinforce the front side case 104 from the main surface to the side surface of the front side case 104. Similar to the front side case 104, the metal plate 12 is inserted into the rear side case 105.
  • the manufacturing method of the front side case 104 is as follows.
  • the metal plate 12 having the through holes 12a and the ribs 13 is formed by pressing.
  • Several LED11 is mounted in the predetermined position of the circuit board 10 which has wiring.
  • the metal plate 12 and the circuit board 10 are overlapped with the LED 11 inserted into the through hole 12a.
  • the metal plate 12 and the circuit board 10 may be bonded by an adhesive.
  • an upper mold 300 and a lower mold 310 are arranged so as to surround the circuit board 10, the metal plate 12, and the rib 13.
  • a holding part 310 a is formed on the surface of the lower mold 310 facing the circuit board 10.
  • the holding part 310a holds the circuit board 10, whereby the circuit board 10, the metal plate 12, and the rib 13 are held in the mold.
  • the surface of the holding part 310a that contacts the circuit board 10 is formed to be equal to or larger than the through hole 12a of the metal plate 12.
  • the front side case 104 is formed by injection molding in which a resin is poured into the molds 300 and 310 with the circuit board 10, the metal plate 12, and the rib 13 inserted.
  • the circuit board 10, the metal plate 12, the rib 13, and the front side case 104 are integrally formed.
  • the circuit board 10 is buried in the front side case 104 by pouring resin into the portion where the holding portion 310a is disposed.
  • a voltage is applied to the LED 11 from a battery (not shown) through the circuit pattern of the circuit board 10.
  • the plurality of LEDs 11 are selectively lit.
  • Light emitted from the LED 11 is guided into the front case 104 by the rib 13 of the metal plate 12. Since the front case 104 has translucency, the light emitted from the LED 11 travels to the surface of the casing of the illumination unit 107. Illumination such as characters and patterns is displayed on the illumination unit 107 by the emitted light of the LED 11 reaching the surface of the casing of the illumination unit 107.
  • the periphery of the LED 11 is surrounded by the metal ribs 13. Since the metal rib 13 is non-light-transmitting, the light emitted from the LED 11 cannot pass through the rib 13. Therefore, the light emitted from the LED 11 travels to the illumination unit 107 using the rib 13 as a guide. Since the diffusion range of the emitted light from the LED 11 can be limited by the rib 13, the emitted light from the LED 11 and the emitted light from the other adjacent LEDs 11 are not mixed in the illumination unit 107. Therefore, the mobile phone 100 can clearly display the illumination on the illumination unit 107.
  • the metal plate 12 is inserted into the front case 104 in a state of being overlapped with the circuit board 10. Since the circuit board 10 and the front side case 104 are reinforced by the metal plate 12, the impact resistance of the mobile phone 100 is improved. Further, since the front case 104 is formed by inserting the metal plate 12 or the LED 11 into the front case 104, the dead space is less than the case where the metal plate 12, the LED 11, and the front case 104 are laminated. 12 and the front case 104 do not occur. Therefore, the mobile phone 100 can be made thin and small.
  • the light emitting surface 11a and the through hole 12a of the LED 11 may be circular or elliptical. Further, the rib 13 of the metal plate 12 may not protrude vertically from the metal plate 12 as long as the emitted light of the LED 11 is not mixed with the emitted light of other adjacent LEDs 11 (FIGS. 7a and 7b).
  • the rib 13 may be formed so that the tip 13a bends toward the LED 11 as shown in FIG. 8a.
  • a pattern of an arbitrary shape can be displayed on the illumination unit 107 by the light emitted from the LED 11 by forming an opening 13 b of an arbitrary shape by the tip 13 a of the rib 13.
  • the refractive index of the resin material constituting the casing is preferably larger than the refractive index of the light source on the light emitting surface.
  • the light emitted from the LED 11 is refracted on the surface where the light emitting surface 11 a of the LED 11 and the housing 20 are in contact.
  • the refracted outgoing light 17 of the LED 11 travels to the surface of the casing of the illumination unit 107 at a smaller angle with respect to the normal 16 on the casing surface than before being refracted (FIG. 9). Therefore, the diffusion range of the emitted light from the LED 11 is further limited.
  • the illumination unit 107 may be provided on the side surface of the front case 104 or the rear case 105.
  • the light guide module 1 can be formed at any location of the mobile phone 100.
  • the light source of the light guide module 1 may be a light source other than an LED as long as it emits light.
  • the plurality of LEDs 11 may be single color LEDs 11 or different color LEDs 11.
  • the plurality of LEDs 11 on the circuit board 10 may be arranged not only in a matrix but also in an arbitrary position.
  • a plate made of any material having light non-transparency and a certain strength can be used for shielding or guiding the light emitted from the LED 11.
  • a plate made of carbon fiber, a high-strength resin to which a light-shielding material is added, and the like are used for shielding or guiding light emitted from the LED 11.
  • the mobile phone 100 is an example of an electronic device.
  • the light guide module 1 can be provided in a personal computer, a digital camera, a game machine, and other electronic devices.
  • a light guide module characterized by that.
  • the rib protrudes vertically from the light-impermeable plate, and the rib is higher than the light source.
  • the light guide module according to Supplementary Note 1 or 2, characterized in that:
  • the light non-transmissive plate has irregularities on the surface
  • the light guide module according to any one of appendices 1 to 4, wherein the light guide module is characterized in that
  • the housing is formed of a resin material, and the refractive index of the resin material is larger than the refractive index of the light source on the light emitting surface.
  • the light guide module according to any one of appendices 1 to 5, characterized in that:
  • the casing is molded by inserting the light source, the light-impermeable plate, and the circuit board into a predetermined mold.
  • the light guide module according to any one of supplementary notes 1 to 6, wherein:

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Light Guides In General And Applications Therefor (AREA)
  • Telephone Set Structure (AREA)

Abstract

A light guiding module (1) is provided with a circuit board (10), a plurality of light-emitting diodes (11) mounted on the circuit board (10), a sheet-like metal plate (12) having a plurality of through holes (12a) formed at positions corresponding to the plurality of light-emitting diodes (11), and a light transmissive housing (20). The housing (20) is integrally formed with the light-emitting diodes (11) and the metal plate (12). The metal plate (12) is laminated on the circuit board (10) with the light-emitting diodes (11) being inserted into the through holes (12a). Further, ribs (13) surrounding the light-emitting diodes (11) are formed on the periphery of each through hole (12a) in the metal plate (12). The light emitted from the light-emitting diodes (11) is guided by the ribs (13) and is emitted outside the housing (20).

Description

導光モジュール及びこれを備える電子機器Light guiding module and electronic device including the same
　本発明は、光源を用いた導光モジュール及びこれを備える電子機器に関する。 The present invention relates to a light guide module using a light source and an electronic device including the same.
　近年、電子機器の多くは、筐体内に設けられた発光ダイオード（以下、ＬＥＤ）等の光を筐体の表面に導くイルミネーションを備える。例えば、特許文献１には、ＬＥＤの光を筐体表面へと導光する導光構造が開示されている。特許文献１の導光構造は、筐体と基板上に配列された複数のＬＥＤの間に、各ＬＥＤに対応する位置に光を透過する部分を備えた遮光シートを配置することによって、ＬＥＤの光を筐体表面へと導光する。 In recent years, many electronic devices are equipped with an illumination that guides light such as a light emitting diode (hereinafter referred to as LED) provided in the housing to the surface of the housing. For example, Patent Document 1 discloses a light guide structure that guides LED light to the surface of a housing. In the light guide structure of Patent Document 1, a light-shielding sheet having a portion that transmits light is disposed between a plurality of LEDs arranged on a housing and a substrate at a position corresponding to each LED. Light is guided to the housing surface.
特開２００６－１４５６８２号公報JP 2006-145682 A
　特許文献１に開示されている導光構造では、筐体とＬＥＤとの間に遮光シートが配置されるため、電子機器の小型化が難しい。 In the light guide structure disclosed in Patent Document 1, it is difficult to reduce the size of the electronic device because a light shielding sheet is disposed between the housing and the LED.
　また、筐体が薄い場合、筐体の強度の低下により、筐体とＬＥＤを配列した基板、ＬＥＤが衝突する。 If the casing is thin, the casing and the LED on which the casing is arranged collide with the LED due to a decrease in the strength of the casing.
　本発明は、上記実情に鑑みてなされたものであり、強度を維持しつつ、薄型化、小型化が容易な導光モジュール、及びこれを備える電子機器を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object thereof is to provide a light guide module that can be easily reduced in thickness and size while maintaining strength, and an electronic apparatus including the same.
　上記課題を解決するため、本発明の第１の観点に係る導光モジュールは、
　配線が形成された回路基板と、
　前記回路基板の所定の位置に実装された複数の光源と、
　前記複数の光源に対応する位置に形成された複数の貫通孔を有し、前記光源が対応する前記貫通孔に挿入された状態で前記回路基板と重なる光非透過性板と、
　前記光源と前記光非透過性板を収納した、透光性を有する筐体と、
　前記光非透過性板の各貫通孔の周縁部分に形成され、前記各貫通孔に挿入された前記光源を囲むリブと、を備える、
　ことを特徴とする。 In order to solve the above-described problem, a light guide module according to the first aspect of the present invention includes:
A circuit board on which wiring is formed;
A plurality of light sources mounted at predetermined positions on the circuit board;
A plurality of through holes formed at positions corresponding to the plurality of light sources, and a light non-transparent plate that overlaps the circuit board in a state where the light sources are inserted into the corresponding through holes;
A translucent housing that houses the light source and the light-impermeable plate;
A rib that surrounds the light source and is formed in a peripheral portion of each through-hole of the light-impermeable plate, and is inserted into each through-hole.
It is characterized by that.
　上記課題を解決するため、本発明の第２の観点に係る電子機器は、
　第１の観点に係る導光モジュールを備える、
　ことを特徴とする。 In order to solve the above problems, an electronic device according to a second aspect of the present invention provides:
Comprising a light guide module according to a first aspect;
It is characterized by that.
　本発明によれば、薄型化、小型化が容易な導光モジュール、及びこれを備える電子機器を提供できる。 According to the present invention, it is possible to provide a light guide module that can be easily reduced in thickness and size, and an electronic device including the same.
本発明の実施形態１に係る導光モジュールを示す断面図である。It is sectional drawing which shows the light guide module which concerns on Embodiment 1 of this invention. 図１ａにおけるＡＡ断面図である。It is AA sectional drawing in FIG. 本発明の実施形態１に係る導光モジュールを示す分解斜視図である。It is a disassembled perspective view which shows the light guide module which concerns on Embodiment 1 of this invention. 本発明の実施形態１に係る導光モジュールの成形方法を示す断面図である。It is sectional drawing which shows the shaping | molding method of the light guide module which concerns on Embodiment 1 of this invention. 本発明の実施形態２に係る導光モジュールを備える携帯電話を示す斜視図である。It is a perspective view which shows a mobile telephone provided with the light guide module which concerns on Embodiment 2 of this invention. 図４におけるＢＢ断面図である。It is BB sectional drawing in FIG. 本発明の実施形態２に係る導光モジュールを備える電子機器の成形方法を示す断面図である。It is sectional drawing which shows the shaping | molding method of an electronic device provided with the light guide module which concerns on Embodiment 2 of this invention. 本発明の導光モジュールの変形例を示す断面図である。It is sectional drawing which shows the modification of the light guide module of this invention. 図７ａにおけるＣＣ断面図である。It is CC sectional drawing in FIG. 7a. 本発明の導光モジュールの変形例を示す断面図である。It is sectional drawing which shows the modification of the light guide module of this invention. 図８ａにおけるＤＤ断面図である。It is DD sectional drawing in FIG. 8a. 本発明の導光モジュールにおける光源からの出射光を示す図である。It is a figure which shows the emitted light from the light source in the light guide module of this invention.
　以下、本発明の実施の形態に係る導光モジュール１について、図面を参照しながら説明する。 Hereinafter, a light guide module 1 according to an embodiment of the present invention will be described with reference to the drawings.
（実施形態１）
　図１ａは、導光モジュール１の断面図である。図１ｂは、図１ａのＡＡ断面を示す。導光モジュール１は、回路基板１０と、複数のＬＥＤ１１と、金属板１２と、筐体２０と、を備える。 (Embodiment 1)
FIG. 1 a is a cross-sectional view of the light guide module 1. FIG. 1b shows the AA cross section of FIG. 1a. The light guide module 1 includes a circuit board 10, a plurality of LEDs 11, a metal plate 12, and a housing 20.
　回路基板１０は絶縁性の樹脂材料から構成される。回路基板１０の主面には配線が形成される。また、回路基板１０の主面には、光源として複数のＬＥＤ１１が実装される。ＬＥＤ１１は回路基板１０の配線と電気的に接続される。 The circuit board 10 is made of an insulating resin material. Wiring is formed on the main surface of the circuit board 10. A plurality of LEDs 11 are mounted on the main surface of the circuit board 10 as light sources. The LED 11 is electrically connected to the wiring of the circuit board 10.
　ＬＥＤ１１は、筐体２０の表面に文字や模様等のイルミネーションを表示するための光源である。ＬＥＤ１１は直方体形状である。ＬＥＤ１１は下面で回路基板１０に実装される。また、ＬＥＤ１１は、上面に発光面１１ａを備える。複数のＬＥＤ１１は回路基板１０上の所定の位置に配列される。ＬＥＤ１１は回路基板１０の配線から電圧を印加されることによって点灯する。 The LED 11 is a light source for displaying illumination such as characters and patterns on the surface of the housing 20. The LED 11 has a rectangular parallelepiped shape. The LED 11 is mounted on the circuit board 10 on the lower surface. Moreover, LED11 is equipped with the light emission surface 11a on the upper surface. The plurality of LEDs 11 are arranged at predetermined positions on the circuit board 10. The LED 11 is turned on when a voltage is applied from the wiring of the circuit board 10.
　金属板１２は、プレス加工されたステンレス鋼、チタン等の光非透過性の金属の薄板から形成される。金属板１２には、複数のＬＥＤ１１に対応する位置に複数の貫通孔１２ａが形成される。貫通孔１２ａは矩形状に形成される。貫通孔１２ａは、対応するＬＥＤ１１を挿入できるように、ＬＥＤ１１の平面サイズより一回り大きい。金属板１２は、貫通孔１２ａにＬＥＤ１１が挿入された状態で、回路基板１０のＬＥＤ１１の実装面に重ねられる。金属板１２と回路基板１０は接着剤等によって接着されてもよい。 The metal plate 12 is formed from a thin plate of light-opaque metal such as pressed stainless steel or titanium. A plurality of through holes 12 a are formed in the metal plate 12 at positions corresponding to the plurality of LEDs 11. The through hole 12a is formed in a rectangular shape. The through hole 12a is slightly larger than the planar size of the LED 11 so that the corresponding LED 11 can be inserted. The metal plate 12 is overlaid on the mounting surface of the LED 11 of the circuit board 10 with the LED 11 inserted into the through hole 12a. The metal plate 12 and the circuit board 10 may be bonded by an adhesive or the like.
　また、金属板１２の各貫通孔１２ａの周縁部分には、金属のリブ１３がＬＥＤ１１を囲むように、金属板１２と一体に形成される。リブ１３の高さＬは、ＬＥＤ１１の高さＴと略同等、もしくはＬＥＤ１１の高さＴより高く形成される。したがって、金属板１２と回路基板１０が重なった状態では、リブ１３の上端はＬＥＤ１１より高い。 Further, a metal rib 13 is formed integrally with the metal plate 12 at the peripheral portion of each through hole 12 a of the metal plate 12 so as to surround the LED 11. The height L of the rib 13 is substantially equal to the height T of the LED 11 or higher than the height T of the LED 11. Therefore, in the state where the metal plate 12 and the circuit board 10 overlap, the upper end of the rib 13 is higher than the LED 11.
　筐体（カバー）２０は、アクリル、ＡＢＳ、ポリカーボネート、エポキシ、ウレタン、シリコン等の、透光性を有する樹脂材料から構成される。筐体２０は、インサート成形によってＬＥＤ１１、金属板１２、回路基板１０と、一体的に形成される。 The housing (cover) 20 is made of a light-transmitting resin material such as acrylic, ABS, polycarbonate, epoxy, urethane, or silicon. The housing 20 is integrally formed with the LED 11, the metal plate 12, and the circuit board 10 by insert molding.
　上記導光モジュール１の製造方法は以下のとおりである。 The manufacturing method of the light guide module 1 is as follows.
　プレス加工によって、貫通孔１２ａとリブ１３を備えた金属板１２が形成される。前述のように、貫通孔１２ａはＬＥＤ１１の配置位置に応じた位置に形成される。リブ１３は、その上端が導光モジュール１の完成状態で、貫通孔１２ａに挿入されたＬＥＤ１１の上端よりも高くなるように形成される。複数のＬＥＤ１１が、回路パターンが形成された回路基板１０の所定位置に実装される。金属板１２と回路基板１０は、各貫通孔１２ａに対応するＬＥＤ１１が挿入された状態で、重ねられる。金属板１２と回路基板１０は接着剤によって接着されてもよい。 The metal plate 12 having the through holes 12a and the ribs 13 is formed by pressing. As described above, the through hole 12a is formed at a position corresponding to the arrangement position of the LED 11. The rib 13 is formed so that the upper end of the rib 13 is higher than the upper end of the LED 11 inserted into the through-hole 12 a in the completed state of the light guide module 1. Several LED11 is mounted in the predetermined position of the circuit board 10 in which the circuit pattern was formed. The metal plate 12 and the circuit board 10 are overlapped with the LED 11 corresponding to each through-hole 12a being inserted. The metal plate 12 and the circuit board 10 may be bonded by an adhesive.
　図３に示すように、回路基板１０、金属板１２、リブ１３を囲むように上金型３０、下金型３１が配置される。下金型３１は回路基板１０の金属板１２との接合面とは反対の面を保持する。そして、筐体２０は、回路基板１０、金属板１２、リブ１３をインサートした状態で、金型３０、３１内に樹脂を流し込む出射成形により、形成される。以上の方法により、回路基板１０、金属板１２、リブ１３、筐体２０が一体的に形成される。金属板１２の樹脂と接触する面に、サンドブラスト等で凹凸を形成することにより、金属板１２と筐体２０との密着性が向上する。凹凸の形成の代わりに、樹脂材料との密着性を高める処置が施されてもよい。例えば、金属板１２の表面にシランカップリング剤を塗布し、金属板１２の表面を改質することにより、金属板と樹脂材料と密着性を高めることができる。 As shown in FIG. 3, an upper mold 30 and a lower mold 31 are disposed so as to surround the circuit board 10, the metal plate 12, and the rib 13. The lower mold 31 holds the surface opposite to the surface where the circuit board 10 is bonded to the metal plate 12. And the housing | casing 20 is formed by the injection molding which pours resin in the metal mold | die 30 and 31, in the state which inserted the circuit board 10, the metal plate 12, and the rib 13. FIG. By the above method, the circuit board 10, the metal plate 12, the rib 13, and the housing 20 are integrally formed. By forming irregularities on the surface of the metal plate 12 that contacts the resin by sandblasting or the like, the adhesion between the metal plate 12 and the housing 20 is improved. Instead of forming the irregularities, a treatment for improving the adhesion with the resin material may be performed. For example, by applying a silane coupling agent to the surface of the metal plate 12 and modifying the surface of the metal plate 12, the adhesion between the metal plate and the resin material can be enhanced.
　導光モジュール１では、図示しないバッテリから回路基板１０の回路を介して、電圧がＬＥＤ１１に印加される。これにより、複数のＬＥＤ１１が選択的に点灯する。ＬＥＤ１１の発光面１１ａからの出射光は、金属板１２のリブ１３によって筐体２０内に導光される。筐体２０は透光性を有するため、ＬＥＤ１１の出射光は筐体２０の表面（図１における上方向）へ進行する。筐体２０の表面に達したＬＥＤ１１の出射光によって、文字や模様等のイルミネーションが筐体２０の表面に表示される。 In the light guide module 1, a voltage is applied to the LED 11 from a battery (not shown) through the circuit of the circuit board 10. Thereby, the plurality of LEDs 11 are selectively lit. Light emitted from the light emitting surface 11 a of the LED 11 is guided into the housing 20 by the rib 13 of the metal plate 12. Since the housing | casing 20 has translucency, the emitted light of LED11 advances to the surface (upward direction in FIG. 1) of the housing | casing 20. FIG. Illumination such as characters and patterns is displayed on the surface of the housing 20 by the emitted light of the LED 11 that has reached the surface of the housing 20.
　上記実施形態によると、ＬＥＤ１１の周囲は金属のリブ１３によって囲まれる。金属のリブ１３は光非透過性であるので、ＬＥＤ１１の出射光はリブ１３を透過できない。したがって、ＬＥＤ１１の出射光は、リブ１３をガイドとして筐体２０の表面（図１における上方向）へ進行する。リブ１３によってＬＥＤ１１の出射光の拡散範囲を制限できるため、ＬＥＤ１１の出射光と、隣接する他のＬＥＤ１１の出射光とが、筐体２０の表面で混合しない。したがって、導光モジュール１は、イルミネーションを筐体２０の表面に鮮明に表示できる。 According to the above embodiment, the periphery of the LED 11 is surrounded by the metal ribs 13. Since the metal rib 13 is non-light-transmitting, the light emitted from the LED 11 cannot pass through the rib 13. Therefore, the light emitted from the LED 11 travels to the surface of the housing 20 (upward in FIG. 1) using the rib 13 as a guide. Since the diffusion range of the emitted light of the LED 11 can be limited by the rib 13, the emitted light of the LED 11 and the emitted light of other adjacent LEDs 11 are not mixed on the surface of the housing 20. Therefore, the light guide module 1 can clearly display the illumination on the surface of the housing 20.
　また上記実施形態によると、金属板１２が、回路基板１０に重なった状態で筐体２０にインサートされる。回路基板１０と筐体２０とが金属板１２によって補強されるので、導光モジュール１の耐衝撃性が向上する。また、導光モジュール１は、金属板１２やＬＥＤ１１を筐体２０内にインサートして成形されるので、金属板１２、ＬＥＤ１１、筐体２０を積層する場合と比べ、デッドスペースが金属板１２と筐体２０との間に生じない。したがって、導光モジュール１を薄く、小さくできる。 Further, according to the above embodiment, the metal plate 12 is inserted into the housing 20 in a state where the metal plate 12 overlaps the circuit board 10. Since the circuit board 10 and the housing 20 are reinforced by the metal plate 12, the impact resistance of the light guide module 1 is improved. In addition, since the light guide module 1 is formed by inserting the metal plate 12 or the LED 11 into the housing 20, the dead space is different from that in the case where the metal plate 12, the LED 11, and the housing 20 are stacked. It does not occur between the housing 20. Therefore, the light guide module 1 can be made thin and small.
（実施形態２）
　導光モジュール１を備えた電子機器として、導光モジュール１を備えた携帯電話１００について説明する。導光モジュール１の構成は実施形態１と同様である。筐体２０が携帯電話１００の筐体の一部である点が異なる。 (Embodiment 2)
As an electronic apparatus including the light guide module 1, a mobile phone 100 including the light guide module 1 will be described. The configuration of the light guide module 1 is the same as that of the first embodiment. The difference is that the housing 20 is a part of the housing of the mobile phone 100.
　携帯電話１００は、図４に示すように、文字や画像を表示する表示部を有する表示側筐体１０１と、操作キーが配列された操作側筐体１０２と、ヒンジ１０３と、から構成される。ヒンジ１０３は、表示側筐体１０１と操作側筐体１０２とを回動できるように連結する。 As shown in FIG. 4, the mobile phone 100 includes a display-side housing 101 having a display unit for displaying characters and images, an operation-side housing 102 on which operation keys are arranged, and a hinge 103. . The hinge 103 connects the display-side housing 101 and the operation-side housing 102 so as to be rotatable.
　表示側筐体１０１は、フロント側ケース１０４と、リア側ケース１０５とが、互いに接合されることにより構成される。フロント側ケース１０４は、携帯電話１００を折り畳んだ状態で表側に現れる。また、リア側ケース１０５は、携帯電話１００を折り畳んだ状態で操作側筐体１０２と対向する。フロント側ケース１０４の主面（図４における上面）には、図４に破線で示すように、照光部１０７が形成される。照光部１０７は、ＬＥＤ１１が点灯することによって文字や模様などを表示する領域である。ＬＥＤ１１が点灯していない状態では、使用者は、フロント側ケース１０４の外部から内部のＬＥＤ１１を視認できない。照光部１０７は、実施形態１の導光モジュール１と同様の構成を備える。 The display side case 101 is configured by joining a front side case 104 and a rear side case 105 to each other. The front case 104 appears on the front side with the cellular phone 100 folded. The rear case 105 faces the operation side housing 102 in a state where the mobile phone 100 is folded. On the main surface (the upper surface in FIG. 4) of the front side case 104, as shown by a broken line in FIG. The illumination unit 107 is an area that displays characters, patterns, and the like when the LED 11 is turned on. When the LED 11 is not lit, the user cannot visually recognize the internal LED 11 from the outside of the front case 104. The illumination unit 107 has the same configuration as the light guide module 1 of the first embodiment.
　フロント側ケース１０４とリア側ケース１０５は、透光性を有する樹脂材料から構成される。また、フロント側ケース１０４とリア側ケース１０５との接合面には、図５に示すように、全周にわたって溝１０４ａ、１０５ａがそれぞれ形成される。フロント側ケース１０４とリア側ケース１０５は、溝１０４ａ、１０５ａに枠状のケースパッキン１０６が嵌入された水密状態で接合される。 The front side case 104 and the rear side case 105 are made of a resin material having translucency. Further, as shown in FIG. 5, grooves 104a and 105a are respectively formed on the joint surface between the front side case 104 and the rear side case 105 as shown in FIG. The front side case 104 and the rear side case 105 are joined in a watertight state in which a frame-like case packing 106 is fitted in the grooves 104a and 105a.
　表示側筐体１０１のフロント側ケース１０４には、ＬＥＤ１１、回路基板１０、金属板１２がインサートされる。ＬＥＤ１１は、フロント側ケース１０４の主面方向に発光面１１ａを向けて、回路基板１０にマトリクス状に実装される。金属板１２は、フロント側ケース１０４の主面から側面にかけてフロント側ケース１０４を補強するように設けられる。フロント側ケース１０４と同様に、リア側ケース１０５にも金属板１２がインサートされる。 The LED 11, the circuit board 10, and the metal plate 12 are inserted into the front side case 104 of the display side case 101. The LEDs 11 are mounted in a matrix on the circuit board 10 with the light emitting surface 11 a facing the main surface of the front case 104. The metal plate 12 is provided so as to reinforce the front side case 104 from the main surface to the side surface of the front side case 104. Similar to the front side case 104, the metal plate 12 is inserted into the rear side case 105.
　フロント側ケース１０４の製造方法は以下のとおりである。 The manufacturing method of the front side case 104 is as follows.
　プレス加工によって、貫通孔１２ａとリブ１３を備えた金属板１２が形成される。複数のＬＥＤ１１が、配線を有する回路基板１０の所定位置に実装される。金属板１２と回路基板１０は、貫通孔１２ａにＬＥＤ１１が挿入された状態で重ねられる。金属板１２と回路基板１０は接着剤によって接着されてもよい。 The metal plate 12 having the through holes 12a and the ribs 13 is formed by pressing. Several LED11 is mounted in the predetermined position of the circuit board 10 which has wiring. The metal plate 12 and the circuit board 10 are overlapped with the LED 11 inserted into the through hole 12a. The metal plate 12 and the circuit board 10 may be bonded by an adhesive.
　図６に示すように、回路基板１０、金属板１２、リブ１３を囲むように上金型３００、下金型３１０が配置される。下金型３１０の回路基板１０と対向する面には保持部３１０ａが形成される。保持部３１０ａが回路基板１０を保持することによって、回路基板１０、金属板１２、リブ１３は金型内で保持される。保持部３１０ａの回路基板１０と接する面は、金属板１２の貫通孔１２ａと同等、または貫通孔１２ａより大きく形成される。 As shown in FIG. 6, an upper mold 300 and a lower mold 310 are arranged so as to surround the circuit board 10, the metal plate 12, and the rib 13. A holding part 310 a is formed on the surface of the lower mold 310 facing the circuit board 10. The holding part 310a holds the circuit board 10, whereby the circuit board 10, the metal plate 12, and the rib 13 are held in the mold. The surface of the holding part 310a that contacts the circuit board 10 is formed to be equal to or larger than the through hole 12a of the metal plate 12.
　フロント側ケース１０４は、回路基板１０、金属板１２、リブ１３をインサートした状態で、金型３００、３１０内に樹脂を流し込む射出成形により、形成される。以上の方法により、回路基板１０、金属板１２、リブ１３、フロント側ケース１０４が一体的に形成される。金型３００、３１０を外した後、保持部３１０ａが配置されていた部分に樹脂を流し込むことで、回路基板１０はフロント側ケース１０４内に埋没する。 The front side case 104 is formed by injection molding in which a resin is poured into the molds 300 and 310 with the circuit board 10, the metal plate 12, and the rib 13 inserted. By the above method, the circuit board 10, the metal plate 12, the rib 13, and the front side case 104 are integrally formed. After removing the molds 300 and 310, the circuit board 10 is buried in the front side case 104 by pouring resin into the portion where the holding portion 310a is disposed.
　携帯電話１００のフロント側ケース１０４では、図示しないバッテリから回路基板１０の回路パターンを介して、電圧がＬＥＤ１１に印加される。これにより、複数のＬＥＤ１１が選択的に点灯する。ＬＥＤ１１の出射光は、金属板１２のリブ１３によってフロント側ケース１０４内に導光される。フロント側ケース１０４は透光性を有するため、ＬＥＤ１１の出射光は照光部１０７の筐体表面へ進行する。照光部１０７の筐体表面に達したＬＥＤ１１の出射光によって、文字や模様等のイルミネーションが照光部１０７に表示される。 In the front case 104 of the mobile phone 100, a voltage is applied to the LED 11 from a battery (not shown) through the circuit pattern of the circuit board 10. Thereby, the plurality of LEDs 11 are selectively lit. Light emitted from the LED 11 is guided into the front case 104 by the rib 13 of the metal plate 12. Since the front case 104 has translucency, the light emitted from the LED 11 travels to the surface of the casing of the illumination unit 107. Illumination such as characters and patterns is displayed on the illumination unit 107 by the emitted light of the LED 11 reaching the surface of the casing of the illumination unit 107.
　上記実施形態によると、ＬＥＤ１１の周囲は金属のリブ１３によって囲まれる。金属のリブ１３は光非透過性であるので、ＬＥＤ１１の出射光はリブ１３を透過できない。したがって、ＬＥＤ１１の出射光は、リブ１３をガイドとして照光部１０７へ進行する。リブ１３によってＬＥＤ１１の出射光の拡散範囲を制限できるため、ＬＥＤ１１の出射光と、隣接する他のＬＥＤ１１の出射光とが、照光部１０７で混合しない。したがって、携帯電話１００は、イルミネーションを照光部１０７に鮮明に表示できる。 According to the above embodiment, the periphery of the LED 11 is surrounded by the metal ribs 13. Since the metal rib 13 is non-light-transmitting, the light emitted from the LED 11 cannot pass through the rib 13. Therefore, the light emitted from the LED 11 travels to the illumination unit 107 using the rib 13 as a guide. Since the diffusion range of the emitted light from the LED 11 can be limited by the rib 13, the emitted light from the LED 11 and the emitted light from the other adjacent LEDs 11 are not mixed in the illumination unit 107. Therefore, the mobile phone 100 can clearly display the illumination on the illumination unit 107.
　また上記実施形態によると、金属板１２が、回路基板１０に重なった状態でフロント側ケース１０４にインサートされる。回路基板１０とフロント側ケース１０４とが金属板１２によって補強されるので、携帯電話１００の耐衝撃性が向上する。また、フロント側ケース１０４は、金属板１２やＬＥＤ１１をフロント側ケース１０４内にインサートして成形されるので、金属板１２、ＬＥＤ１１、フロント側ケース１０４を積層する場合と比べ、デッドスペースが金属板１２とフロント側ケース１０４との間に生じない。したがって、携帯電話１００を薄く、小さくできる。 Further, according to the above embodiment, the metal plate 12 is inserted into the front case 104 in a state of being overlapped with the circuit board 10. Since the circuit board 10 and the front side case 104 are reinforced by the metal plate 12, the impact resistance of the mobile phone 100 is improved. Further, since the front case 104 is formed by inserting the metal plate 12 or the LED 11 into the front case 104, the dead space is less than the case where the metal plate 12, the LED 11, and the front case 104 are laminated. 12 and the front case 104 do not occur. Therefore, the mobile phone 100 can be made thin and small.
　以上、本発明の実施形態２について説明したが、本実施形態の具体的な態様はこれに限られない。 As mentioned above, although Embodiment 2 of this invention was demonstrated, the specific aspect of this embodiment is not restricted to this.
　ＬＥＤ１１の発光面１１ａと貫通孔１２ａは、円形や楕円形などであっても良い。また、金属板１２のリブ１３は、ＬＥＤ１１の出射光が隣接する他のＬＥＤ１１の出射光と混合しない範囲で、金属板１２から垂直に突出していなくとも構わない（図７ａ、図７ｂ）。 The light emitting surface 11a and the through hole 12a of the LED 11 may be circular or elliptical. Further, the rib 13 of the metal plate 12 may not protrude vertically from the metal plate 12 as long as the emitted light of the LED 11 is not mixed with the emitted light of other adjacent LEDs 11 (FIGS. 7a and 7b).
　リブ１３は、図８ａに示すように、先端部１３ａがＬＥＤ１１の側に曲折するよう形成されてもよい。例えば図８ｂに示すように、リブ１３の先端部１３ａによって任意の形状の開口１３ｂを形成することにより、ＬＥＤ１１の出射光で任意の形状の模様を照光部１０７に表示できる。 The rib 13 may be formed so that the tip 13a bends toward the LED 11 as shown in FIG. 8a. For example, as shown in FIG. 8 b, a pattern of an arbitrary shape can be displayed on the illumination unit 107 by the light emitted from the LED 11 by forming an opening 13 b of an arbitrary shape by the tip 13 a of the rib 13.
　筐体を構成する樹脂材料の屈折率は、光源の、発光面での屈折率よりも大きいことが好ましい。例えば、ＬＥＤ１１の出射光は、ＬＥＤ１１の発光面１１ａと筐体２０とが接触する面において、屈折する。屈折したＬＥＤ１１の出射光１７は、筐体表面の垂線１６に対して、屈折する前よりも小さな角度で、照光部１０７の筐体表面へ進行する（図９）。したがって、ＬＥＤ１１からの出射光の拡散範囲が、さらに制限される。 The refractive index of the resin material constituting the casing is preferably larger than the refractive index of the light source on the light emitting surface. For example, the light emitted from the LED 11 is refracted on the surface where the light emitting surface 11 a of the LED 11 and the housing 20 are in contact. The refracted outgoing light 17 of the LED 11 travels to the surface of the casing of the illumination unit 107 at a smaller angle with respect to the normal 16 on the casing surface than before being refracted (FIG. 9). Therefore, the diffusion range of the emitted light from the LED 11 is further limited.
　照光部１０７は、フロント側ケース１０４の側面やリア側ケース１０５に設けられていてもよい。導光モジュール１は携帯電話１００の任意の場所に形成できる。 The illumination unit 107 may be provided on the side surface of the front case 104 or the rear case 105. The light guide module 1 can be formed at any location of the mobile phone 100.
　導光モジュール１の光源は光を発するものであれば、ＬＥＤ以外の光源であってもよい。複数のＬＥＤ１１は、単色のＬＥＤ１１でも、それぞれ異なる色のＬＥＤ１１でもよい。回路基板１０での複数のＬＥＤ１１はマトリクス状だけでなく、任意の位置に配置されてよい。 The light source of the light guide module 1 may be a light source other than an LED as long as it emits light. The plurality of LEDs 11 may be single color LEDs 11 or different color LEDs 11. The plurality of LEDs 11 on the circuit board 10 may be arranged not only in a matrix but also in an arbitrary position.
　光非透過性の金属板１２の代わりに、ＬＥＤ１１の出射光の遮光あるいは導光のために、光非透過性を有し且つ一定の強度を有する任意の材質の板を使用できる。例えば、炭素繊維から構成された板、遮光性材料が添加された高強度樹脂等が、ＬＥＤ１１の出射光の遮光あるいは導光のために、使用される。 Instead of the light non-transparent metal plate 12, a plate made of any material having light non-transparency and a certain strength can be used for shielding or guiding the light emitted from the LED 11. For example, a plate made of carbon fiber, a high-strength resin to which a light-shielding material is added, and the like are used for shielding or guiding light emitted from the LED 11.
　携帯電話１００は電子機器の例である。導光モジュール１は、パーソナルコンピュータ、デジタルカメラ、ゲーム機、その他の電子機器に備えることができる。 The mobile phone 100 is an example of an electronic device. The light guide module 1 can be provided in a personal computer, a digital camera, a game machine, and other electronic devices.
　上記の実施形態の一部または全部は、以下の付記のようにも記載されうるが、以下には限られない。 Some or all of the above embodiments may be described as in the following supplementary notes, but are not limited to the following.
（付記１）
　配線が形成された回路基板と、
　前記回路基板の所定の位置に実装された複数の光源と、
　前記複数の光源に対応する位置に形成された複数の貫通孔を有し、前記光源が対応する前記貫通孔に挿入された状態で前記回路基板と重なる光非透過性板と、
　前記光源と前記光非透過性板を収納した、透光性を有する筐体と、
　前記光非透過性板の各貫通孔の周縁部分に形成され、前記各貫通孔に挿入された前記光源を囲むリブと、を備える、
　ことを特徴とする導光モジュール。 (Appendix 1)
A circuit board on which wiring is formed;
A plurality of light sources mounted at predetermined positions on the circuit board;
A plurality of through holes formed at positions corresponding to the plurality of light sources, and a light non-transparent plate that overlaps the circuit board in a state where the light sources are inserted into the corresponding through holes;
A translucent housing that houses the light source and the light-impermeable plate;
A rib that surrounds the light source and is formed in a peripheral portion of each through-hole of the light-impermeable plate, and is inserted into each through-hole.
A light guide module characterized by that.
（付記２）
　前記各リブは、前記光源からの出射光を導光する、
　ことを特徴とする付記１に記載の導光モジュール。 (Appendix 2)
The ribs guide light emitted from the light source,
The light guide module according to appendix 1, wherein:
（付記３）
　前記リブは前記光非透過性板から垂直に突出し、前記リブは前記光源より高い、
　ことを特徴とする付記１又は２に記載の導光モジュール。 (Appendix 3)
The rib protrudes vertically from the light-impermeable plate, and the rib is higher than the light source.
The light guide module according to Supplementary Note 1 or 2, characterized in that:
（付記４）
　前記各リブの先端部は、対応する各光源の側に曲折される、
　ことを特徴とする付記１乃至３のいずれか１に記載の導光モジュール。 (Appendix 4)
The tip of each rib is bent toward the corresponding light source,
The light guide module according to any one of supplementary notes 1 to 3, wherein:
（付記５）
　前記光非透過性板は、表面に凹凸を有する、
　ことを特徴とする付記１乃至４のいずれか１に記載の導光モジュール。 (Appendix 5)
The light non-transmissive plate has irregularities on the surface,
The light guide module according to any one of appendices 1 to 4, wherein the light guide module is characterized in that
（付記６）
　前記筐体は樹脂材料で形成され、前記樹脂材料の屈折率は、前記光源の、発光面での屈折率よりも大きい、
　ことを特徴とする付記１乃至５のいずれか１に記載の導光モジュール。 (Appendix 6)
The housing is formed of a resin material, and the refractive index of the resin material is larger than the refractive index of the light source on the light emitting surface.
The light guide module according to any one of appendices 1 to 5, characterized in that:
（付記７）
　前記筐体は、所定の金型に、前記光源と前記光非透過性板と前記回路基板とをインサートして成形される、
　ことを特徴とする付記１乃至６のいずれか１に記載の導光モジュール。 (Appendix 7)
The casing is molded by inserting the light source, the light-impermeable plate, and the circuit board into a predetermined mold.
The light guide module according to any one of supplementary notes 1 to 6, wherein:
（付記８）
　付記１乃至７のいずれか１に記載の導光モジュールを備える、
　ことを特徴とする電子機器。 (Appendix 8)
The light guide module according to any one of appendices 1 to 7 is provided,
An electronic device characterized by that.
　本発明は、本発明の広義の精神と範囲を逸脱することなく、様々な実施の形態及び変形が可能とされるものである。また、上述した実施の形態は、本発明を説明するためのものであり、本発明の範囲を限定するものではない。すなわち、本発明の範囲は、実施の形態ではなく、請求の範囲によって示される。そして、請求の範囲内及びそれと同等の発明の意義の範囲内で施される様々な変形が、本発明の範囲内とみなされる。 The present invention is capable of various embodiments and modifications without departing from the broad spirit and scope of the present invention. The above-described embodiments are for explaining the present invention and do not limit the scope of the present invention. In other words, the scope of the present invention is shown not by the embodiments but by the claims. Various modifications within the scope of the claims and within the scope of the equivalent invention are considered to be within the scope of the present invention.
　本発明は、２０１１年８月１０日に出願された日本国特許出願２０１１－１７４５９１号に基づく。本明細書中に日本国特許出願２０１１－１７４５９１号の明細書、特許請求の範囲、図面全体を参照として取り込むものとする。 The present invention is based on Japanese Patent Application No. 2011-174591 filed on August 10, 2011. The specification, claims, and entire drawings of Japanese Patent Application No. 2011-174591 are incorporated herein by reference.
　１　導光モジュール
　１０　回路基板
　１１　ＬＥＤ
　１１ａ　ＬＥＤの発光面
　１１ｂ　ＬＥＤ発光素子
　１２　金属板
　１２ａ　貫通孔
　１３　リブ
　１３ａ　先端部
　１６　筐体表面の垂線
　１７　ＬＥＤ発光面で屈折したＬＥＤの出射光
　２０　筐体
　３０、３００　上金型
　３１、３１０　下金型
　１００　携帯電話
　１０１　表示側筐体
　１０２　操作側筐体
　１０３　ヒンジ
　１０４　フロント側ケース
　１０４ａ　溝
　１０５　リア側ケース
　１０５ａ　溝
　１０６　ケースパッキン
　１０７　照光部
　３１０ａ　保持部 DESCRIPTION OF SYMBOLS 1 Light guide module 10 Circuit board 11 LED
11a LED light emitting surface 11b LED light emitting element 12 Metal plate 12a Through hole 13 Rib 13a Tip 16 Vertical line of housing surface 17 LED light refracted on LED light emitting surface 20 Housing 30, 300 Upper mold 31, 310 Bottom Mold 100 Mobile phone 101 Display side case 102 Operation side case 103 Hinge 104 Front side case 104a Groove 105 Rear side case 105a Groove 106 Case packing 107 Illuminating part 310a Holding part

Claims (8)

  1. 　配線が形成された回路基板と、
    　前記回路基板の所定の位置に実装された複数の光源と、
    　前記複数の光源に対応する位置に形成された複数の貫通孔を有し、前記光源が対応する前記貫通孔に挿入された状態で前記回路基板と重なる光非透過性板と、
    　前記光源と前記光非透過性板を収納した、透光性を有する筐体と、
    　前記光非透過性板の各貫通孔の周縁部分に形成され、前記各貫通孔に挿入された前記光源を囲むリブと、を備える、
    　ことを特徴とする導光モジュール。     A circuit board on which wiring is formed;
    A plurality of light sources mounted at predetermined positions on the circuit board;
    A plurality of through holes formed at positions corresponding to the plurality of light sources, and a light non-transparent plate that overlaps the circuit board in a state where the light sources are inserted into the corresponding through holes;
    A translucent housing that houses the light source and the light-impermeable plate;
    A rib that surrounds the light source and is formed in a peripheral portion of each through-hole of the light-impermeable plate, and is inserted into each through-hole.
    A light guide module characterized by that.
  2. 　前記各リブは、前記光源からの出射光を導光する、
    　ことを特徴とする請求項１に記載の導光モジュール。     The ribs guide light emitted from the light source,
    The light guide module according to claim 1.
  3. 　前記リブは前記光非透過性板から垂直に突出し、前記リブは前記光源より高い、
    　ことを特徴とする請求項１又は２に記載の導光モジュール。     The rib protrudes vertically from the light-impermeable plate, and the rib is higher than the light source.
    The light guide module according to claim 1, wherein the light guide module is a light guide module.
  4. 　前記各リブの先端部は、対応する各光源の側に曲折される、
    　ことを特徴とする請求項１乃至３のいずれか１項に記載の導光モジュール。     The tip of each rib is bent toward the corresponding light source,
    The light guide module according to claim 1, wherein the light guide module is provided.
  5. 　前記光非透過性板は、表面に凹凸を有する、
    　ことを特徴とする請求項１乃至４のいずれか１項に記載の導光モジュール。     The light non-transmissive plate has irregularities on the surface,
    The light guide module according to claim 1, wherein the light guide module is a light guide module.
  6. 　前記筐体は樹脂材料で形成され、前記樹脂材料の屈折率は、前記光源の、発光面での屈折率よりも大きい、
    　ことを特徴とする請求項１乃至５のいずれか１項に記載の導光モジュール。     The housing is formed of a resin material, and the refractive index of the resin material is larger than the refractive index of the light source on the light emitting surface.
    The light guide module according to claim 1, wherein the light guide module is a light guide module.
  7. 　前記筐体は、所定の金型に、前記光源と前記光非透過性板と前記回路基板とをインサートして成形される、
    　ことを特徴とする請求項１乃至６のいずれか１項に記載の導光モジュール。     The casing is molded by inserting the light source, the light-impermeable plate, and the circuit board into a predetermined mold.
    The light guide module according to claim 1, wherein the light guide module is a light guide module.
  8. 　請求項１乃至７のいずれか１項に記載の導光モジュールを備える、
    　ことを特徴とする電子機器。     The light guide module according to claim 1 is provided.
    An electronic device characterized by that.
PCT/JP2012/070050 2011-08-10 2012-08-07 Light guiding module and electronic device equipped with same WO2013021987A1 (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103292221A (en) * 2013-06-07 2013-09-11 南通亚浦照明电器制造有限公司 LED projection lamp
CN104951012A (en) * 2014-03-26 2015-09-30 鸿富锦精密电子(天津)有限公司 Machine case
WO2016125261A1 (en) * 2015-02-04 2016-08-11 株式会社水田製作所 Laminated molded body and laminated light-emitting body
CN106122871A (en) * 2016-08-19 2016-11-16 上海小糸车灯有限公司 A kind of photoconduction light-distribution LED protective cover structure and photoconduction luminous intensity distribution automobile lamp thereof
JP2016224319A (en) * 2015-06-02 2016-12-28 三菱電機株式会社 Display, display unit, and manufacturing method of display
WO2018078699A1 (en) * 2016-10-24 2018-05-03 堺ディスプレイプロダクト株式会社 Illumination apparatus and display apparatus
JP2018194866A (en) * 2018-09-03 2018-12-06 三菱電機株式会社 Display device
CN110764309A (en) * 2019-10-31 2020-02-07 深圳市德仓科技有限公司 Backlight module, display screen and terminal
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CN111752043A (en) * 2020-07-10 2020-10-09 武汉华星光电技术有限公司 Backlight module and display device
US11353742B2 (en) 2020-07-10 2022-06-07 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight module and display device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635580A (en) * 1986-06-25 1988-01-11 Mitsubishi Cable Ind Ltd Light emitting diode structure
JPH1020814A (en) * 1996-07-03 1998-01-23 Matsushita Electric Works Ltd Annunciator
JP2002268591A (en) * 2001-03-07 2002-09-20 Canon Inc Display device
JP2007206577A (en) * 2006-02-03 2007-08-16 Toshiba Corp Article with display structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS635580A (en) * 1986-06-25 1988-01-11 Mitsubishi Cable Ind Ltd Light emitting diode structure
JPH1020814A (en) * 1996-07-03 1998-01-23 Matsushita Electric Works Ltd Annunciator
JP2002268591A (en) * 2001-03-07 2002-09-20 Canon Inc Display device
JP2007206577A (en) * 2006-02-03 2007-08-16 Toshiba Corp Article with display structure

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* Cited by examiner, † Cited by third party
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CN103292221A (en) * 2013-06-07 2013-09-11 南通亚浦照明电器制造有限公司 LED projection lamp
CN104951012A (en) * 2014-03-26 2015-09-30 鸿富锦精密电子(天津)有限公司 Machine case
CN104951012B (en) * 2014-03-26 2018-03-20 鸿富锦精密电子(天津)有限公司 Cabinet
WO2016125261A1 (en) * 2015-02-04 2016-08-11 株式会社水田製作所 Laminated molded body and laminated light-emitting body
JPWO2016125261A1 (en) * 2015-02-04 2017-10-19 株式会社水田製作所 Laminated molded body and laminated light emitting body
JP2016224319A (en) * 2015-06-02 2016-12-28 三菱電機株式会社 Display, display unit, and manufacturing method of display
CN106122871A (en) * 2016-08-19 2016-11-16 上海小糸车灯有限公司 A kind of photoconduction light-distribution LED protective cover structure and photoconduction luminous intensity distribution automobile lamp thereof
US10634950B2 (en) 2016-10-24 2020-04-28 Sakai Display Products Corporation Illumination apparatus capable of inhibiting temperature rise in the casing and display apparatus including the illumination apparatus
CN110114714A (en) * 2016-10-24 2019-08-09 堺显示器制品株式会社 Lighting device and display device
WO2018078699A1 (en) * 2016-10-24 2018-05-03 堺ディスプレイプロダクト株式会社 Illumination apparatus and display apparatus
JP2018194866A (en) * 2018-09-03 2018-12-06 三菱電機株式会社 Display device
CN110764309A (en) * 2019-10-31 2020-02-07 深圳市德仓科技有限公司 Backlight module, display screen and terminal
CN110850633A (en) * 2019-10-31 2020-02-28 深圳市德仓科技有限公司 Backlight module, display screen and terminal
CN110764309B (en) * 2019-10-31 2022-07-15 深圳市德仓科技有限公司 Backlight module, display screen and terminal
CN111752043A (en) * 2020-07-10 2020-10-09 武汉华星光电技术有限公司 Backlight module and display device
US11353742B2 (en) 2020-07-10 2022-06-07 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight module and display device

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