JP6896038B2 - Display device - Google Patents

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JP6896038B2
JP6896038B2 JP2019182512A JP2019182512A JP6896038B2 JP 6896038 B2 JP6896038 B2 JP 6896038B2 JP 2019182512 A JP2019182512 A JP 2019182512A JP 2019182512 A JP2019182512 A JP 2019182512A JP 6896038 B2 JP6896038 B2 JP 6896038B2
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light emitting
emitting device
mounting surface
height
circuit board
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JP2020016900A (en
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聡 切通
聡 切通
敏明 花村
敏明 花村
将人 寺西
将人 寺西
淳一 奈良
淳一 奈良
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Mitsubishi Electric Corp
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Description

本発明は、表示装置に関する。 The present invention relates to a display device.

回路基板に複数の発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）がマトリクス状に実装された表示装置が知られている。
このような表示装置には、太陽光、体育館の照明光などの表示装置の外部から表示装置に入射した光が表示装置に反射されることによって生じるコントラストの低下を防ぐために、表示装置の外部から表示装置に入射する光を遮るルーバやマスク部材が設けられる（例えば、特許文献１を参照）。 A display device in which a plurality of light emitting diodes (LEDs: Light Emitting Diodes) are mounted in a matrix on a circuit board is known.
Such a display device is provided from the outside of the display device in order to prevent a decrease in contrast caused by reflection of light incident on the display device from the outside of the display device such as sunlight or illumination light of a gymnasium. A louver or a mask member that blocks light incident on the display device is provided (see, for example, Patent Document 1).

特開平１１−３０５６８９号公報Japanese Unexamined Patent Publication No. 11-305689

このような表示装置においては、表示の解像度を高めるために、実装面積が小さい表面実装型ＬＥＤが使用される。また、実装面積が小さい表面実装型ＬＥＤにおいては、出射光の光量を増やすために、ＬＥＤチップが実装される実装面とＬＥＤチップが実装される実装面に対向する光出射面との距離が短いこと、すなわち厚さが薄いことが望ましい。したがって、表示の解像度をさらに高めるためには、実装面積が小さく、厚さが薄い表面実装型ＬＥＤを使用しなければならない。
また、表示の解像度を高めると、表面実装型ＬＥＤの間の距離が短くなり、表面実装型ＬＥＤとルーバとの距離も短くなる。 In such a display device, a surface mount LED having a small mounting area is used in order to increase the display resolution. Further, in a surface mount type LED having a small mounting area, in order to increase the amount of emitted light, the distance between the mounting surface on which the LED chip is mounted and the light emitting surface facing the mounting surface on which the LED chip is mounted is short. That is, it is desirable that the thickness is thin. Therefore, in order to further increase the display resolution, it is necessary to use a surface mount type LED having a small mounting area and a thin thickness.
Further, when the display resolution is increased, the distance between the surface mount type LED becomes short, and the distance between the surface mount type LED and the louver also becomes short.

一方、表面実装型ＬＥＤの間に設けられるル−バは、強度を維持するために、高さを低くすることや幅を狭くすることが困難である。また、ル−バは射出成形によって製造されるので、製造面からもルーバの高さを低くすることや幅を狭くすることは困難である。 On the other hand, it is difficult to reduce the height or width of the louver provided between the surface mount type LEDs in order to maintain the strength. Further, since the louver is manufactured by injection molding, it is difficult to lower the height or width of the louver from the manufacturing surface.

したがって、表示の解像度をさらに高めるために、実装面積が小さく厚さが薄い表面実装型ＬＥＤの間の距離を短くすると、表面実装型ＬＥＤとルーバとの距離がさらに短くなり、ルーバが表面実装型ＬＥＤの出射光を遮ることになる。ルーバが表面実装型ＬＥＤの出射光を遮ると、表示装置の視野角、特に、このような表示装置において広い視野角が要求される左右方向の視野角が狭くなる。 Therefore, if the distance between the surface mount type LED having a small mounting area and a thin thickness is shortened in order to further increase the display resolution, the distance between the surface mount type LED and the louver is further shortened, and the louver is a surface mount type. The emitted light of the LED will be blocked. When the louver blocks the emitted light of the surface mount type LED, the viewing angle of the display device, particularly the viewing angle in the left-right direction in which a wide viewing angle is required in such a display device, becomes narrow.

本発明は、上記の事情に鑑みてなされたものであり、広い視野角を有する表示装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a display device having a wide viewing angle.

本発明の表示装置は、回路基板と、回路基板の実装面にマトリクス状に実装された発光装置と、回路基板の上に設けられ、隣接する発光装置の間で、マトリクス状に実装された発光装置の列の方向に延びる第１マスク部と、回路基板の上に設けられ、隣接する発光装置の間で、マトリクス状に実装された発光装置の行の方向に延びる第２マスク部と、を備える。発光装置は、光を発光するＬＥＤチップ、及び前記ＬＥＤチップを封止する封止部を有する。封止部は、実装面から上方へ離れる方向に凸面である上面と、凸面の縁部から実装面側に延伸し、実装面に垂直な側面とを有し、実装面から凸面の頂部までの高さは、実装面から第２マスク部の上端までの高さよりも低く、実装面から上面と側面との境界までの高さは、実装面から第１マスク部の上端までの高さ以上である。
本発明の他の表示装置は、回路基板と、回路基板の実装面にマトリクス状に実装された発光装置と、回路基板の上に設けられ、隣接する発光装置の間で、マトリクス状に実装された発光装置の列の方向に延びる第１マスク部と、回路基板の上に設けられ、隣接する発光装置の間で、マトリクス状に実装された発光装置の行の方向に延びる第２マスク部と、を備える。発光装置は、光を発光するＬＥＤチップ、及び前記ＬＥＤチップを封止する封止部を有する。封止部は、実装面から上方へ離れる方向に凸面である上面と、凸面の縁部から実装面側に延伸し、実装面に垂直な側面とを有し、実装面から凸面の頂部までの高さは、実装面から第２マスク部の上端までの高さよりも低く、凸面である上面から出射する発光装置の出射光のうち、出射角度が最大となる出射光の通る光路を、第１マスク部が遮らない。 The display device of the present invention emits light emitted in a matrix between a circuit board, a light emitting device mounted in a matrix on the mounting surface of the circuit board, and a light emitting device provided on the circuit board and adjacent to the light emitting device. A first mask portion extending in the direction of the row of the device and a second mask portion provided on the circuit board and extending in the direction of the row of the light emitting device mounted in a matrix between adjacent light emitting devices. Be prepared. The light emitting device has an LED chip that emits light and a sealing portion that seals the LED chip. The sealing portion has an upper surface that is convex in the direction away from the mounting surface and a side surface that extends from the edge of the convex surface to the mounting surface side and is perpendicular to the mounting surface, from the mounting surface to the top of the convex surface. The height is lower than the height from the mounting surface to the upper end of the second mask portion, and the height from the mounting surface to the boundary between the upper surface and the side surface is equal to or higher than the height from the mounting surface to the upper end of the first mask portion. is there.
The other display device of the present invention is provided on the circuit board, a light emitting device mounted in a matrix on the mounting surface of the circuit board, and a light emitting device provided on the circuit board and mounted in a matrix between adjacent light emitting devices. A first mask portion extending in the direction of the row of the light emitting device and a second mask portion provided on the circuit board and extending in the direction of the row of the light emitting device mounted in a matrix between adjacent light emitting devices. , Equipped with. The light emitting device has an LED chip that emits light and a sealing portion that seals the LED chip. The sealing portion has an upper surface that is convex in a direction away from the mounting surface and a side surface that extends from the edge of the convex surface to the mounting surface side and is perpendicular to the mounting surface, from the mounting surface to the top of the convex surface. The height is lower than the height from the mounting surface to the upper end of the second mask portion, and among the emitted light of the light emitting device emitted from the upper surface which is a convex surface, the optical path through which the emitted light having the maximum emission angle passes is first. The mask does not block.

本発明によれば、実装面から上面と側面との境界までの高さが、実装面から第１マスク部の上端までの高さ以上であるので、発光装置の出射光が第１マスク部によって遮られない。発光装置の出射光が第１マスク部によって遮られないので、視野角を広くできる。
また、凸面である上面から出射する発光装置の出射光のうち、出射角度が最大となる出射光の通る光路を、第１マスク部が遮らないので、視野角を広くできる。 According to the present invention, since the height from the mounting surface to the boundary between the upper surface and the side surface is equal to or greater than the height from the mounting surface to the upper end of the first mask portion, the emitted light of the light emitting device is emitted by the first mask portion. Not blocked. Since the emitted light of the light emitting device is not blocked by the first mask portion, the viewing angle can be widened.
Further, since the first mask portion does not block the optical path through which the emitted light having the maximum emission angle passes among the emitted light of the light emitting device emitted from the upper surface which is a convex surface, the viewing angle can be widened.

本発明の実施の形態１に係る表示装置の正面図である。It is a front view of the display device which concerns on Embodiment 1 of this invention. 図１に示す表示装置をＡ−Ａ線で矢視した断面図である。It is sectional drawing which looked at the display device shown in FIG. 1 by the arrow AA. 本発明の実施の形態１に係る発光装置の側面図である。It is a side view of the light emitting device which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る発光装置の正面図である。It is a front view of the light emitting device which concerns on Embodiment 1 of this invention. 図４に示す発光装置をＢ−Ｂ線で矢視した断面図である。FIG. 5 is a cross-sectional view taken along the line BB of the light emitting device shown in FIG. 本発明の実施の形態１に係る発光装置の出射光を示す模式図である。It is a schematic diagram which shows the emitted light of the light emitting device which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る第１マスク部を示す図である。It is a figure which shows the 1st mask part which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る第２マスク部を示す図である。It is a figure which shows the 2nd mask part which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る発光装置の高さと第２マスク部の高さとの関係を説明する模式図である。It is a schematic diagram explaining the relationship between the height of the light emitting device which concerns on Embodiment 1 of this invention, and the height of a 2nd mask part. 本発明の実施の形態１に係る発光装置の高さと第１マスク部の高さとの関係を説明する模式図である。It is a schematic diagram explaining the relationship between the height of the light emitting device which concerns on Embodiment 1 of this invention, and the height of the 1st mask part. 本発明の実施の形態１に係る素子基板の実装面の高さと第１マスク部の高さとの関係を説明する模式図である。It is a schematic diagram explaining the relationship between the height of the mounting surface of the element substrate which concerns on Embodiment 1 of this invention, and the height of the 1st mask part. 本発明の実施の形態２に係る表示装置の断面図である。It is sectional drawing of the display device which concerns on Embodiment 2 of this invention. 本発明の実施の形態２に係る発光装置の高さと第１マスク部の高さとの関係を説明する模式図である。It is a schematic diagram explaining the relationship between the height of the light emitting device which concerns on Embodiment 2 of this invention, and the height of the 1st mask part. 本発明の実施の形態３に係る表示装置の正面図である。It is a front view of the display device which concerns on Embodiment 3 of this invention. 図１４に示す表示装置をＣ−Ｃ線で矢視した断面図である。FIG. 6 is a cross-sectional view taken along the line CC of the display device shown in FIG. 本発明の実施の形態４に係る発光装置を示す図である。It is a figure which shows the light emitting device which concerns on Embodiment 4 of this invention. 本発明の実施の形態４に係る発光装置の封止部の上面の傾斜を説明する模式図である。It is a schematic diagram explaining the inclination of the upper surface of the sealing part of the light emitting device which concerns on Embodiment 4 of this invention. 本発明の実施の形態１に係る表示装置の変形例の正面図である。It is a front view of the modification of the display device which concerns on Embodiment 1 of this invention. 第１マスク部と第２マスク部を一体化したマスク板を示す図である。It is a figure which shows the mask plate which integrated the 1st mask part and the 2nd mask part. 本発明の実施の形態１に係る表示装置を組み合わせた表示装置の正面図である。It is a front view of the display device which combined the display device which concerns on Embodiment 1 of this invention.

以下、本発明の実施の形態に係る表示装置について、図面を参照して説明する。 Hereinafter, the display device according to the embodiment of the present invention will be described with reference to the drawings.

実施の形態１．
図１〜図１１を参照して、本発明の実施の形態１に係る表示装置１０について説明する。なお、理解を容易にするために、表示装置１０が野外で表示装置１０の正面（表示面）が地面に対して垂直に設置されたと仮定し、地面と表示装置１０の正面とに平行な方向をＸ軸方向、地面に対して垂直な方向、すなわち鉛直方向をＹ軸方向、Ｘ軸方向とＹ軸方向とに垂直な方向をＺ軸方向として説明する。他の実施の形態においても同様である。 Embodiment 1.
The display device 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 11. In order to facilitate understanding, it is assumed that the display device 10 is installed outdoors and the front surface (display surface) of the display device 10 is installed perpendicular to the ground, and the direction parallel to the ground and the front surface of the display device 10. Will be described as the X-axis direction, the direction perpendicular to the ground, that is, the vertical direction as the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction as the Z-axis direction. The same applies to other embodiments.

図１、２に示すように、表示装置１０は、回路基板２０と、回路基板２０の実装面２２にマトリクス状に実装された複数の発光装置３０と、Ｙ軸方向に延びる第１マスク部５０と、Ｘ軸方向に延びる第２マスク部６０とを備える。
表示装置１０は、競技場、ビルの壁面などに設置されている。また、表示装置１０は体育館などの屋内にも設置できる。 As shown in FIGS. 1 and 2, the display device 10 includes a circuit board 20, a plurality of light emitting devices 30 mounted in a matrix on the mounting surface 22 of the circuit board 20, and a first mask portion 50 extending in the Y-axis direction. And a second mask portion 60 extending in the X-axis direction.
The display device 10 is installed on a stadium, a wall surface of a building, or the like. Further, the display device 10 can be installed indoors such as a gymnasium.

回路基板２０は平板であり、絶縁性の樹脂材料などから構成される。回路基板２０は発光装置３０に電力を供給する図示しない配線を備える。また、回路基板２０には、回路基板２０の配線を介して発光装置３０を駆動する図示しない駆動ＩＣ（ＩＣ：Ｉｎｔｅｇｒａｔｅｄ Ｃｉｒｃｕｉｔ）が設けられる。 The circuit board 20 is a flat plate and is made of an insulating resin material or the like. The circuit board 20 includes wiring (not shown) that supplies electric power to the light emitting device 30. Further, the circuit board 20 is provided with a drive IC (IC: Integrated Circuit) (not shown) that drives the light emitting device 30 via the wiring of the circuit board 20.

発光装置３０は回路基板２０の実装面２２にマトリクス状に配置される。なお、表示装置１０の正面側に配置される面を上面３１、回路基板２０の実装面２２に垂直な面を側面３２、上面３１に対向する面を下面（図示せず）とする。 The light emitting device 30 is arranged in a matrix on the mounting surface 22 of the circuit board 20. The surface arranged on the front side of the display device 10 is the upper surface 31, the surface perpendicular to the mounting surface 22 of the circuit board 20 is the side surface 32, and the surface facing the upper surface 31 is the lower surface (not shown).

図３〜図５に示すように、発光装置３０は、それぞれが赤色光、緑色光、青色光を発光する３つのＬＥＤチップ３３ｒ、３３ｇ、３３ｂと、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂを実装する素子基板３４と、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂを素子基板３４上で封止する封止部３５とを備える。封止部３５は素子基板３４と共に発光装置３０の外形を構成する。
３つのＬＥＤチップ３３ｒ、３３ｇ、３３ｂの発光強度は、ＬＥＤチップの３３ｒ、３３ｇ、３３ｂのそれぞれに、回路基板２０の配線を介して回路基板２０の駆動ＩＣから供給される電力によって、独立に調整される。これにより、発光装置３０から、任意の色の光が任意の強度で出射される。その結果、複数の発光装置３０全体によって、表示装置１０にカラー画像などが表示される。 As shown in FIGS. 3 to 5, the light emitting device 30 is an element for mounting three LED chips 33r, 33g, 33b and LED chips 33r, 33g, 33b, each of which emits red light, green light, and blue light. A substrate 34 and a sealing portion 35 for sealing the LED chips 33r, 33g, and 33b on the element substrate 34 are provided. The sealing portion 35 and the element substrate 34 form the outer shape of the light emitting device 30.
The emission intensity of the three LED chips 33r, 33g, 33b is independently adjusted by the electric power supplied from the drive IC of the circuit board 20 to each of the LED chips 33r, 33g, 33b via the wiring of the circuit board 20. Will be done. As a result, light of an arbitrary color is emitted from the light emitting device 30 with an arbitrary intensity. As a result, a color image or the like is displayed on the display device 10 by the plurality of light emitting devices 30 as a whole.

素子基板３４は平板であり、絶縁性の樹脂材料などから構成される。素子基板３４は、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂを実装する実装面３６に、ＬＥＤチップ３３ｒに電力を供給する配線３７ｒ、３８ｒと、ＬＥＤチップ３３ｇに電力を供給する配線３７ｇ、３８ｇと、ＬＥＤチップ３３ｂに電力を供給する配線３７ｂ、３８ｂとを備える。配線３７ｒと配線３８ｒは、それぞれ、ＬＥＤチップ３３ｒに、ワイヤボンディングによって電気的に接続される。配線３７ｒ、３８ｒと同様に、配線３７ｇ、３８ｇはＬＥＤチップ３３ｇに、配線３７ｂ、３８ｂはＬＥＤチップ３３ｂに、ワイヤボンディングによって、電気的に接続される。
ＬＥＤチップ３３ｒ、３３ｇ、３３ｂは、ＬＥＤチップ３３ｇが素子基板３４の実装面３６の中心に配置され、互いに平行に、Ｘ軸方向にこの順で、等間隔に配列されている。 The element substrate 34 is a flat plate and is made of an insulating resin material or the like. The element substrate 34 has wirings 37r and 38r for supplying electric power to the LED chip 33r, wirings 37g and 38g for supplying electric power to the LED chip 33g, and an LED chip on the mounting surface 36 on which the LED chips 33r, 33g and 33b are mounted. Wiring 37b and 38b for supplying electric power to 33b are provided. The wiring 37r and the wiring 38r are electrically connected to the LED chip 33r by wire bonding, respectively. Similar to the wirings 37r and 38r, the wirings 37g and 38g are electrically connected to the LED chip 33g, and the wirings 37b and 38b are electrically connected to the LED chip 33b by wire bonding.
In the LED chips 33r, 33g, 33b, the LED chips 33g are arranged at the center of the mounting surface 36 of the element substrate 34, parallel to each other, and arranged at equal intervals in this order in the X-axis direction.

また、素子基板３４は、素子基板３４の側面４０から実装面３６に対向する面４１に延び、それぞれが配線３７ｒ、３８ｒ、３７ｇ、３８ｇ、３７ｂ、３８ｂと電気的に接続する６つの電極４２を備える。６つの電極４２は、それぞれ回路基板２０の配線と電気的に接続する。
したがって、ＬＥＤチップ３３ｒには、回路基板２０の配線と電極４２と配線３７ｒ、３８ｒとボンディングワイヤ（図示せず）を介して、回路基板２０の駆動ＩＣから電力が供給される。ＬＥＤチップ３３ｇ、３３ｂについても、ＬＥＤチップ３３ｒと同様に、回路基板２０の駆動ＩＣから電力が供給される。 Further, the element substrate 34 extends from the side surface 40 of the element substrate 34 to the surface 41 facing the mounting surface 36, and has six electrodes 42 that are electrically connected to the wirings 37r, 38r, 37g, 38g, 37b, and 38b, respectively. Be prepared. Each of the six electrodes 42 is electrically connected to the wiring of the circuit board 20.
Therefore, power is supplied to the LED chip 33r from the drive IC of the circuit board 20 via the wiring of the circuit board 20, the electrodes 42, the wirings 37r, 38r, and the bonding wire (not shown). Power is supplied from the drive IC of the circuit board 20 to the LED chips 33g and 33b as well as the LED chips 33r.

封止部３５は、エポキシ樹脂、ポリエステル樹脂、アクリル樹脂、シリコン樹脂などの透光性の樹脂から構成される。
封止部３５は直方体形状であり、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂを内包し、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂに密着して封止する。また、封止部３５は、素子基板３４の実装面３６と配線３７ｒ、３８ｒ、３７ｇ、３８ｇ、３７ｂ、３８ｂに密着する。 The sealing portion 35 is made of a translucent resin such as an epoxy resin, a polyester resin, an acrylic resin, and a silicon resin.
The sealing portion 35 has a rectangular parallelepiped shape, includes the LED chips 33r, 33g, and 33b, and seals the LED chips 33r, 33g, and 33b in close contact with each other. Further, the sealing portion 35 is in close contact with the mounting surface 36 of the element substrate 34 and the wirings 37r, 38r, 37g, 38g, 37b, 38b.

封止部３５は、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂが、配線３７ｒ、３８ｒ、３７ｇ、３８ｇ、３７ｂ、３８ｂに電気的に接続され、実装された素子基板３４の実装面３６に、モールド成形によって形成される。 The sealing portion 35 is formed by molding on the mounting surface 36 of the element substrate 34 in which the LED chips 33r, 33g, 33b are electrically connected to the wirings 37r, 38r, 37g, 38g, 37b, 38b and mounted. Will be done.

発光装置３０において、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂは封止部３５に内包され、封止部３５は透光性の樹脂で構成されているので、封止部３５の上面４３と側面４４と、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂとの間には、ボンディングワイヤ以外に光を遮る部材はない。したがって、図６に示すように、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂの発光光４５は、封止部３５の上面４３と側面４４から出射する。発光装置３０においては、Ｚ軸方向に出射する出射光の出射角度θを０°とすると、ＸＹ平面の全方位において、表示装置１０が画像などを表示するために必要な−９０°＜θ＜９０の出射光を得ることができる。
なお、封止部３５の上面４３は封止部３５の表示装置１０の正面側に配置される面であり、封止部３５の側面４４は回路基板２０の実装面２２に垂直な面である。また、図６においては、理解を容易にするために、ＬＥＤチップ３３ｇの発光光４５とＬＥＤチップ３３ｇの発光光４５による出射光のみを示している。 In the light emitting device 30, the LED chips 33r, 33g, and 33b are included in the sealing portion 35, and the sealing portion 35 is made of a translucent resin. There is no member that blocks light other than the bonding wire between the LED chips 33r, 33g, and 33b. Therefore, as shown in FIG. 6, the emitted light 45 of the LED chips 33r, 33g, and 33b is emitted from the upper surface 43 and the side surface 44 of the sealing portion 35. In the light emitting device 30, assuming that the emission angle θ of the emitted light emitted in the Z-axis direction is 0 °, −90 ° <θ <necessary for the display device 10 to display an image or the like in all directions of the XY plane. 90 emitted lights can be obtained.
The upper surface 43 of the sealing portion 35 is a surface arranged on the front side of the display device 10 of the sealing portion 35, and the side surface 44 of the sealing portion 35 is a surface perpendicular to the mounting surface 22 of the circuit board 20. .. Further, in FIG. 6, for easy understanding, only the emitted light 45 of the LED chip 33 g and the emitted light by the emitted light 45 of the LED chip 33 g are shown.

発光装置３０は、図１に示すように、回路基板２０の実装面２２に４行×５列のマトリクス状（Ｘ軸方向に５個、Ｙ軸方向に４個）に実装される。発光装置３０の電極４２は、回路基板２０の配線にハンダ等で直接接続され、電気的に接続される。 As shown in FIG. 1, the light emitting device 30 is mounted on the mounting surface 22 of the circuit board 20 in a matrix of 4 rows × 5 columns (5 in the X-axis direction and 4 in the Y-axis direction). The electrode 42 of the light emitting device 30 is directly connected to the wiring of the circuit board 20 by solder or the like, and is electrically connected.

図７に示すように、第１マスク部５０はＹ軸方向に延びる黒色の平板である。第１マスク部５０は、表示装置１０の外部から表示装置１０に入射する光を遮り、表示装置１０の表示のコントラストを向上させる。ここで、表示装置１０の外部から表示装置１０に入射する光を遮るとは、表示装置１０の外部から表示装置１０に入射する光の回路基板２０や発光装置３０への入射を防ぐことを意味する。例えば、第１マスク部５０は、表示装置１０の外部から表示装置１０に入射する光を吸収する。
第１マスク部５０は、例えば黒色の樹脂から射出成形によって作製される。図１、７に示すように、第１マスク部５０の長さ（Ｙ軸方向の長さ）Ｌ１は、後述する第２マスク部６０のうちの、隣接する第２マスク部６０の発光装置３０側の面と面との距離Ｌ２に等しい。また、第１マスク部５０の幅（Ｘ軸方向の長さ）は、Ｘ軸方向で隣接する発光装置３０と発光装置３０との隙間より狭く設定される。第１マスク部５０の厚さ（Ｚ軸方向の長さ）Ｄ１については後述する。
図１に示すように、第１マスク部５０は、隣接する第２マスク部６０の間において、Ｘ軸方向に配列され、隣接する発光装置３０の間と、発光装置３０のＸ軸方向に延びる列の両端の発光装置３０の外側に配置される。
第１マスク部５０は回路基板２０の実装面２２上に設けられる。第１マスク部５０は、例えば、回路基板２０の実装面２２に対向する面からネジ止めされることによって、回路基板２０の実装面２２に固定される。 As shown in FIG. 7, the first mask portion 50 is a black flat plate extending in the Y-axis direction. The first mask unit 50 blocks light incident on the display device 10 from the outside of the display device 10 to improve the display contrast of the display device 10. Here, blocking the light incident on the display device 10 from the outside of the display device 10 means preventing the light incident on the display device 10 from the outside of the display device 10 from entering the circuit board 20 and the light emitting device 30. To do. For example, the first mask unit 50 absorbs light incident on the display device 10 from the outside of the display device 10.
The first mask portion 50 is made of, for example, a black resin by injection molding. As shown in FIGS. 1 and 7, the length (length in the Y-axis direction) L1 of the first mask portion 50 is the light emitting device 30 of the adjacent second mask portion 60 of the second mask portions 60 described later. It is equal to the distance L2 between the side faces. Further, the width (length in the X-axis direction) of the first mask portion 50 is set to be narrower than the gap between the light emitting device 30 and the light emitting device 30 adjacent to each other in the X-axis direction. The thickness (length in the Z-axis direction) D1 of the first mask portion 50 will be described later.
As shown in FIG. 1, the first mask portions 50 are arranged in the X-axis direction between the adjacent second mask portions 60, and extend between the adjacent light emitting devices 30 and in the X-axis direction of the light emitting device 30. It is arranged outside the light emitting device 30 at both ends of the row.
The first mask portion 50 is provided on the mounting surface 22 of the circuit board 20. The first mask portion 50 is fixed to the mounting surface 22 of the circuit board 20, for example, by being screwed from the surface of the circuit board 20 facing the mounting surface 22.

図８に示すように、第２マスク部６０はＸ軸方向に延びる黒色の平板である。第２マスク部６０も、第１マスク部５０と同様に、表示装置１０の外部から表示装置１０に入射する光を遮り、表示装置１０の表示のコントラストを向上させる。第２マスク部６０は、例えば、表示装置１０の外部から表示装置１０に入射する光を吸収する。
第２マスク部６０の長さ（Ｘ軸方向の長さ）Ｌ３は、図１、８に示すように、回路基板２０のＸ軸方向の長さＬ４と等しい。また、第２マスク部６０の幅（Ｙ軸方向の長さ）は、Ｙ軸方向で隣接する発光装置３０と発光装置３０との隙間より狭く設定される。第２マスク部６０の厚さ（Ｚ軸方向の長さ）Ｄ２については後述する。
第２マスク部６０は、図１に示すように、Ｙ軸方向に配列され、隣接する発光装置３０の間と、発光装置３０のＹ軸方向に延びる列の両端の発光装置３０の外側に配置される。
第２マスク部６０は、回路基板２０の実装面２２上に設けられる。第２マスク部６０は、例えば、回路基板２０の実装面２２に対向する面からネジ止めされることによって、回路基板２０の実装面２２に固定される。 As shown in FIG. 8, the second mask portion 60 is a black flat plate extending in the X-axis direction. Similar to the first mask unit 50, the second mask unit 60 also blocks the light incident on the display device 10 from the outside of the display device 10 to improve the display contrast of the display device 10. The second mask unit 60 absorbs light incident on the display device 10 from the outside of the display device 10, for example.
As shown in FIGS. 1 and 8, the length (length in the X-axis direction) L3 of the second mask portion 60 is equal to the length L4 in the X-axis direction of the circuit board 20. Further, the width (length in the Y-axis direction) of the second mask portion 60 is set to be narrower than the gap between the light emitting device 30 and the light emitting device 30 adjacent to each other in the Y-axis direction. The thickness (length in the Z-axis direction) D2 of the second mask portion 60 will be described later.
As shown in FIG. 1, the second mask portion 60 is arranged in the Y-axis direction, and is arranged between the adjacent light emitting devices 30 and outside the light emitting devices 30 at both ends of the row extending in the Y-axis direction of the light emitting device 30. Will be done.
The second mask portion 60 is provided on the mounting surface 22 of the circuit board 20. The second mask portion 60 is fixed to the mounting surface 22 of the circuit board 20, for example, by being screwed from the surface of the circuit board 20 facing the mounting surface 22.

図７〜図１１を参照して、発光装置３０の高さＨ１と、第１マスク部５０の高さＨ２と第２マスク部６０の高さＨ３との関係を説明する。 The relationship between the height H1 of the light emitting device 30, the height H2 of the first mask portion 50, and the height H3 of the second mask portion 60 will be described with reference to FIGS. 7 to 11.

発光装置３０の高さＨ１は、回路基板２０の実装面２２のうちの発光装置３０が実装された面を含む基準面Ｓからの、発光装置３０の上端の高さを意味する。本実施の形態では、回路基板２０は平板であるので、回路基板２０の実装面２２は基準面Ｓに含まれ、発光装置３０の高さＨ１は回路基板２０の実装面２２からの発光装置３０の上端の高さと等しくなる。 The height H1 of the light emitting device 30 means the height of the upper end of the light emitting device 30 from the reference surface S including the surface on which the light emitting device 30 is mounted among the mounting surfaces 22 of the circuit board 20. In the present embodiment, since the circuit board 20 is a flat plate, the mounting surface 22 of the circuit board 20 is included in the reference surface S, and the height H1 of the light emitting device 30 is the light emitting device 30 from the mounting surface 22 of the circuit board 20. Is equal to the height of the top edge of.

第１マスク部５０の高さＨ２と第２マスク部６０の高さＨ３は、それぞれ、第１マスク部５０の上端の基準面Ｓからの高さ、第２マスク部６０の上端の基準面Ｓからの高さを意味する。本実施の形態では、発光装置３０の高さＨ１と同様に、第１マスク部５０の高さＨ２は、回路基板２０の実装面２２からの第１マスク部５０の上端の高さと等しくなる。第２マスク部６０の高さＨ３についても同様である。また、第１マスク部５０の高さＨ２と第２マスク部６０の高さＨ３は、それぞれ第１マスク部５０の厚さＤ１、第２マスク部６０の厚さＤ２と等しくなる。 The height H2 of the first mask portion 50 and the height H3 of the second mask portion 60 are the height from the reference surface S at the upper end of the first mask portion 50 and the reference surface S at the upper end of the second mask portion 60, respectively. Means the height from. In the present embodiment, similarly to the height H1 of the light emitting device 30, the height H2 of the first mask portion 50 is equal to the height of the upper end of the first mask portion 50 from the mounting surface 22 of the circuit board 20. The same applies to the height H3 of the second mask portion 60. Further, the height H2 of the first mask portion 50 and the height H3 of the second mask portion 60 are equal to the thickness D1 of the first mask portion 50 and the thickness D2 of the second mask portion 60, respectively.

本実施の形態においては、野外に設置された表示装置１０の外部から表示装置１０に入射する光のうち、最も光量が大きい、表示装置１０の表示面に対して斜め上方から表示装置１０に入射する光７０をより遮るために、図９に示すように、第２マスク部６０の高さＨ３を発光装置３０の高さＨ１より高くする（Ｈ３＞Ｈ１）。 In the present embodiment, among the light incident on the display device 10 from the outside of the display device 10 installed outdoors, the light incident on the display device 10 from diagonally above the display surface of the display device 10, which has the largest amount of light. As shown in FIG. 9, the height H3 of the second mask portion 60 is made higher than the height H1 of the light emitting device 30 (H3> H1) in order to further block the light 70.

一方、発光装置３０の高さＨ１は、図１０に示すように、第１マスク部５０の高さＨ２以上とする（Ｈ１≧Ｈ２）。例えば、素子基板３４の厚さ（Ｚ軸方向の長さ）Ｄ３と封止部３５の厚さ（Ｚ軸方向の長さ）Ｄ４の和を第１マスク部５０の厚さＤ１と等しくする。この場合、発光装置３０の高さＨ１は、第１マスク部５０の高さＨ２より、発光装置３０の電極４２の厚さ（Ｚ軸方向の長さ）Ｄ５高くなる。ここで、発光装置３０の電極４２の厚さＤ５は、発光装置３０の下面に設けられている部分の厚さ（Ｚ軸方向の長さ）を意味する。
また、発光装置３０の高さＨ１と第１マスク部５０の高さＨ２を等しくする場合には、素子基板３４の厚さＤ３と封止部３５の厚さＤ４と発光装置３０の電極４２の厚さＤ５との和を第１マスク部５０の厚さＤ１と等しくすればよい。
これらにより、発光装置３０の出射光を最も多く出射する発光装置３０の上面３１の基準面Ｓからの高さが、第１マスク部５０の発光装置３０に隣接する面の上端の基準面Ｓからの高さ以上となり、発光装置３０の上面３１からの出射光４６が第１マスク部５０によって遮られずに表示装置１０から出射する。発光装置３０の上面３１は、出射角度θが−９０°＜θ＜９０の出射光を出射するので、表示装置１０のＸ軸方向の視野角を広くできる。 On the other hand, as shown in FIG. 10, the height H1 of the light emitting device 30 is set to be equal to or higher than the height H2 of the first mask portion 50 (H1 ≧ H2). For example, the sum of the thickness (length in the Z-axis direction) D3 of the element substrate 34 and the thickness (length in the Z-axis direction) D4 of the sealing portion 35 is made equal to the thickness D1 of the first mask portion 50. In this case, the height H1 of the light emitting device 30 is higher than the height H2 of the first mask portion 50 by the thickness (length in the Z-axis direction) D5 of the electrode 42 of the light emitting device 30. Here, the thickness D5 of the electrode 42 of the light emitting device 30 means the thickness (length in the Z-axis direction) of the portion provided on the lower surface of the light emitting device 30.
Further, when the height H1 of the light emitting device 30 and the height H2 of the first mask portion 50 are made equal to each other, the thickness D3 of the element substrate 34, the thickness D4 of the sealing portion 35, and the electrode 42 of the light emitting device 30 The sum with the thickness D5 may be equal to the thickness D1 of the first mask portion 50.
As a result, the height of the upper surface 31 of the light emitting device 30 that emits the most emitted light of the light emitting device 30 from the reference surface S is from the reference surface S of the upper end of the surface adjacent to the light emitting device 30 of the first mask portion 50. The height of the light 46 is equal to or higher than the height of the above, and the light 46 emitted from the upper surface 31 of the light emitting device 30 is emitted from the display device 10 without being blocked by the first mask portion 50. Since the upper surface 31 of the light emitting device 30 emits emitted light having an emission angle θ of −90 ° <θ <90, the viewing angle of the display device 10 in the X-axis direction can be widened.

また、発光装置３０においては、封止部３５の側面４４からも出射光が得られるので、表示装置１０の表示を明るくするために、封止部３５の側面４４からの出射光４７も第１マスク部５０によって遮られないことが望ましい。すなわち、図１１に示すように、素子基板３４の実装面３６の基準面Ｓからの高さＨ４が第１マスク部５０の高さＨ２以上であることが望ましい（Ｈ４≧Ｈ２）。例えば、素子基板３４の厚さＤ３を、第１マスク部５０の厚さＤ１以上とすることによって、素子基板３４の実装面３６の基準面Ｓからの高さＨ４を第１マスク部５０の高さＨ２より高くできる。 Further, in the light emitting device 30, since the emitted light is also obtained from the side surface 44 of the sealing portion 35, the emitted light 47 from the side surface 44 of the sealing portion 35 is also the first in order to brighten the display of the display device 10. It is desirable that it is not blocked by the mask portion 50. That is, as shown in FIG. 11, it is desirable that the height H4 of the mounting surface 36 of the element substrate 34 from the reference surface S is equal to or higher than the height H2 of the first mask portion 50 (H4 ≧ H2). For example, by setting the thickness D3 of the element substrate 34 to be equal to or greater than the thickness D1 of the first mask portion 50, the height H4 of the mounting surface 36 of the element substrate 34 from the reference surface S is set to the height of the first mask portion 50. It can be higher than H2.

次に、上記の構成を備えた表示装置１０の作製方法について、説明する。
まず、以下のように、発光装置３０を作製する。
配線３７ｒ、３７ｇ、３７ｂ、３８ｒ、３８ｇ、３８ｂと電極４２を備えた素子基板３４を準備する。
ＬＥＤチップ３３ｒ、３３ｇ、３３ｂを、ワイヤボンディングによって配線３７ｒ、３７ｇ、３７ｂ、３８ｒ、３８ｇ、３８ｂと電気的に接続し、準備した素子基板３４に実装する。
モールド成形によって、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂが実装された素子基板３４の実装面３６上に封止部３５を形成する。これにより、封止部３５はＬＥＤチップ３３ｒ、３３ｇ、３３ｂを内包し、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂと素子基板３４の実装面３６とに密着する。以上によって、発光装置３０が作製できる。
次に、配線を備えた回路基板２０を準備する。
発光装置３０の電極４２を回路基板２０の配線にリフロー方式等によりハンダ付けすることによって、準備した回路基板２０の実装面２２に各発光装置３０を実装する。
最後に、ネジ止めによって、第１マスク部５０と第２マスク部６０を回路基板２０の実装面２２に固定する。以上によって、表示装置１０を作製できる。 Next, a method of manufacturing the display device 10 having the above configuration will be described.
First, the light emitting device 30 is manufactured as follows.
The element substrate 34 provided with the wirings 37r, 37g, 37b, 38r, 38g, 38b and the electrode 42 is prepared.
The LED chips 33r, 33g, 33b are electrically connected to the wirings 37r, 37g, 37b, 38r, 38g, 38b by wire bonding and mounted on the prepared element substrate 34.
By molding, the sealing portion 35 is formed on the mounting surface 36 of the element substrate 34 on which the LED chips 33r, 33g, and 33b are mounted. As a result, the sealing portion 35 includes the LED chips 33r, 33g, 33b and comes into close contact with the LED chips 33r, 33g, 33b and the mounting surface 36 of the element substrate 34. From the above, the light emitting device 30 can be manufactured.
Next, the circuit board 20 provided with the wiring is prepared.
Each light emitting device 30 is mounted on the mounting surface 22 of the prepared circuit board 20 by soldering the electrode 42 of the light emitting device 30 to the wiring of the circuit board 20 by a reflow method or the like.
Finally, the first mask portion 50 and the second mask portion 60 are fixed to the mounting surface 22 of the circuit board 20 by screwing. From the above, the display device 10 can be manufactured.

以上のように、発光装置３０の高さＨ１が第１マスク部５０の高さＨ２以上であるので、出射光を最も多く出射する発光装置３０の上面３１からの出射光４６が第１マスク部５０に遮らずに表示装置１０から出射し、表示装置１０のＸ軸方向の視野角、すなわち、表示装置１０の左右方向の視野角を広くできる。
また、素子基板３４の実装面３６の高さＨ４を第１マスク部５０の高さＨ２以上とすることによって、表示装置１０の出射光の光量が増加するので、表示装置１０の表示を明るくできる。 As described above, since the height H1 of the light emitting device 30 is equal to or higher than the height H2 of the first mask portion 50, the emitted light 46 from the upper surface 31 of the light emitting device 30 that emits the most emitted light is the first mask portion. It is possible to widen the viewing angle in the X-axis direction of the display device 10, that is, the viewing angle in the left-right direction of the display device 10 by emitting light from the display device 10 without blocking the display device 10.
Further, by setting the height H4 of the mounting surface 36 of the element substrate 34 to the height H2 or more of the first mask portion 50, the amount of emitted light of the display device 10 increases, so that the display of the display device 10 can be brightened. ..

実施の形態２．
実施の形態１においては、素子基板３４の厚さＤ３と封止部３５の厚さＤ４によって、発光装置３０の高さＨ１を第１マスク部５０の高さＨ２以上としたが、他の部材によって発光装置３０の高さＨ１を第１マスク部５０の高さＨ２以上としてもよい。 Embodiment 2.
In the first embodiment, the height H1 of the light emitting device 30 is set to the height H2 or more of the first mask portion 50 by the thickness D3 of the element substrate 34 and the thickness D4 of the sealing portion 35, but other members. The height H1 of the light emitting device 30 may be set to the height H2 or more of the first mask portion 50.

本実施の形態においては、図１２、１３に示すように、表示装置１１の回路基板２０は、実装面２２の発光装置３０が実装される部分に、ＸＹ平面に垂直な面での断面が台形状の凸部２５を備える。その他の構成は実施の形態１と同様である。 In the present embodiment, as shown in FIGS. 12 and 13, the circuit board 20 of the display device 11 has a cross section of the mounting surface 22 on the surface perpendicular to the XY plane on the portion where the light emitting device 30 is mounted. A convex portion 25 having a shape is provided. Other configurations are the same as those in the first embodiment.

本実施の形態においては、発光装置３０は凸部２５の上面２６に実装される。この場合、基準面Ｓは凸部２５の上面２６を含む面となる。
凸部２５の上面２６の実装面２２からの高さをＨ５とした場合、第１マスク部５０は実装面２２上に設けられるので、第１マスク部の基準面Ｓからの高さＨ２は、第１マスク部５０の厚さＤ１よりＨ５低くなる。
これにより、発光装置３０の厚さＤ６が第１マスク部５０の厚さＤ１よりも０以上Ｈ５以下薄い場合であっても、発光装置３０の基準面Ｓからの高さＨ１を第１マスク部５０の基準面Ｓからの高さＨ２以上にできる。 In the present embodiment, the light emitting device 30 is mounted on the upper surface 26 of the convex portion 25. In this case, the reference surface S is a surface including the upper surface 26 of the convex portion 25.
When the height of the upper surface 26 of the convex portion 25 from the mounting surface 22 is H5, the height H2 of the first mask portion from the reference surface S is set because the first mask portion 50 is provided on the mounting surface 22. The thickness of the first mask portion 50 is H5 lower than the thickness D1.
As a result, even when the thickness D6 of the light emitting device 30 is 0 or more and H5 or less thinner than the thickness D1 of the first mask portion 50, the height H1 from the reference surface S of the light emitting device 30 is set to the first mask portion. The height from the reference plane S of 50 can be H2 or more.

以上のように、回路基板２０が、実装面２２の発光装置３０が実装される部分に凸部２５を備えるので、発光装置３０の厚さＤ６が第１マスク部５０の厚さＤ１よりも薄い場合であっても、発光装置３０の高さＨ１を第１マスク部５０の高さＨ２以上にできる。したがって、表示装置１１においては、厚さがより薄い発光装置３０を使用できる。また、表示装置１０と同様に、表示装置１１の左右方向の視野角を広くできる。 As described above, since the circuit board 20 includes the convex portion 25 on the mounting surface 22 where the light emitting device 30 is mounted, the thickness D6 of the light emitting device 30 is thinner than the thickness D1 of the first mask portion 50. Even in this case, the height H1 of the light emitting device 30 can be set to the height H2 or more of the first mask portion 50. Therefore, in the display device 11, a light emitting device 30 having a thinner thickness can be used. Further, similarly to the display device 10, the viewing angle of the display device 11 in the left-right direction can be widened.

実施の形態３．
実施の形態１、２においては、回路基板２０の実装面２２に発光装置３０と第１マスク部５０と第２マスク部６０とが設けられているが、他の部材を設けることができる。 Embodiment 3.
In the first and second embodiments, the light emitting device 30, the first mask portion 50, and the second mask portion 60 are provided on the mounting surface 22 of the circuit board 20, but other members can be provided.

本実施の形態では、図１４、１５に示すように、回路基板２０の実装面２２と発光装置３０とに接し、回路基板２０の実装面２２と発光装置３０とを密封する保護部１００が、回路基板２０の実装面２２に設けられる。具体的には、保護部１００は、回路基板２０の実装面２２と、発光装置３０の上面３１と側面３２に沿って回路基板２０の実装面２２と発光装置３０とを覆い、回路基板２０の実装面２２と、発光装置３０の上面３１と側面３２に密着する。また、第１マスク部５０と第２マスク部６０は、保護部１００上に設けられる。
その他の構成は実施の形態１と同様である。 In the present embodiment, as shown in FIGS. 14 and 15, a protective unit 100 that is in contact with the mounting surface 22 of the circuit board 20 and the light emitting device 30 and seals the mounting surface 22 of the circuit board 20 and the light emitting device 30 is provided. It is provided on the mounting surface 22 of the circuit board 20. Specifically, the protection unit 100 covers the mounting surface 22 of the circuit board 20 and the mounting surface 22 of the circuit board 20 and the light emitting device 30 along the upper surface 31 and the side surface 32 of the light emitting device 30 to cover the circuit board 20. The mounting surface 22 is in close contact with the upper surface 31 and the side surface 32 of the light emitting device 30. Further, the first mask portion 50 and the second mask portion 60 are provided on the protection portion 100.
Other configurations are the same as those in the first embodiment.

本実施の形態において、保護部１００は、ポリエステル樹脂、ポリカーボネート樹脂、アクリル樹脂、シリコン樹脂などの透光性と防水性とを備える樹脂から構成されるフィルムである。 In the present embodiment, the protective portion 100 is a film made of a resin having translucency and waterproofness such as polyester resin, polycarbonate resin, acrylic resin, and silicon resin.

上記の構成を備えた表示装置１２の作製方法について、説明する。
まず、実施の形態１と同様に、発光装置３０を作製する。また、実施の形態１と同様に、配線を備えた回路基板２０を準備し、回路基板２０の実装面２２に各発光装置３０を実装する。
次に、一方の面に接着層を設けた保護部１００と発光装置３０が実装された回路基板２０とを真空容器内に設置し、真空容器内を脱気し減圧する。
減圧された真空容器内で、保護部１００の接着層が設けられた面を、発光装置３０の上面３１と側面３２に沿わせて、保護部１００を回路基板２０の実装面２２に貼り付ける。これにより、回路基板２０の実装面２２と実装された発光装置３０は、保護部１００によって密封される。
真空容器内を常圧に戻し、保護部１００が貼り付けられた回路基板２０を取り出す。最後に、保護部１００上に第１マスク部５０と第２マスク部６０を固定する。
保護部１００は、減圧された真空容器内で回路基板２０の実装面２２に貼り付けられるので、真空容器から回路基板２０を取り出すと、保護部は大気圧によって押圧され、それぞれ発光装置３０の上面３１と側面３２とに密着する。
以上によって、表示装置１２を作製できる。 A method of manufacturing the display device 12 having the above configuration will be described.
First, the light emitting device 30 is manufactured in the same manner as in the first embodiment. Further, as in the first embodiment, the circuit board 20 provided with the wiring is prepared, and each light emitting device 30 is mounted on the mounting surface 22 of the circuit board 20.
Next, the protective portion 100 having an adhesive layer on one surface and the circuit board 20 on which the light emitting device 30 is mounted are installed in a vacuum container, and the inside of the vacuum container is degassed to reduce the pressure.
In the vacuum container under reduced pressure, the surface provided with the adhesive layer of the protective portion 100 is attached to the mounting surface 22 of the circuit board 20 along the upper surface 31 and the side surface 32 of the light emitting device 30. As a result, the mounting surface 22 of the circuit board 20 and the light emitting device 30 mounted are sealed by the protection unit 100.
The inside of the vacuum vessel is returned to normal pressure, and the circuit board 20 to which the protection unit 100 is attached is taken out. Finally, the first mask portion 50 and the second mask portion 60 are fixed on the protection portion 100.
Since the protective unit 100 is attached to the mounting surface 22 of the circuit board 20 in the depressurized vacuum container, when the circuit board 20 is taken out from the vacuum container, the protective unit is pressed by the atmospheric pressure and the upper surface of the light emitting device 30 is formed. It is in close contact with the 31 and the side surface 32.
From the above, the display device 12 can be manufactured.

回路基板２０の実装面２２と発光装置３０とが、防水性を有するフィルムである保護部１００によって密封されるので、表示装置１２の防水性をより向上できる。また、実施の形態１に係る表示装置１０と同様に、表示装置１２の左右方向の視野角を広くできる。 Since the mounting surface 22 of the circuit board 20 and the light emitting device 30 are sealed by the protective portion 100 which is a waterproof film, the waterproofness of the display device 12 can be further improved. Further, similarly to the display device 10 according to the first embodiment, the viewing angle of the display device 12 in the left-right direction can be widened.

実施の形態４．
実施の形態３において、保護部１００はフィルムであるが、保護部１００はフィルムに限られない。 Embodiment 4.
In the third embodiment, the protective unit 100 is a film, but the protective unit 100 is not limited to the film.

本実施の形態において、保護部１００はポリエステル樹脂、ポリカーボネート樹脂、アクリル樹脂、シリコン樹脂などの透光性と防水性を備えるコート部材である。
保護部１００は、回路基板２０の実装面２２に塗布されて、回路基板２０の実装面２０と、発光装置３０の上面３１と側面３２に沿って回路基板２０の実装面２２と発光装置３０とを覆い、回路基板２０の実装面２２と、発光装置３０の上面３１と側面３２に密着する。具体的には、保護部１００は、ディスペンサによって発光装置３０が実装された回路基板２０の実装面２２に塗布された後、硬化される。
その他の構成は実施の形態３と同様である。 In the present embodiment, the protective portion 100 is a coating member having translucency and waterproofness such as polyester resin, polycarbonate resin, acrylic resin, and silicone resin.
The protection unit 100 is applied to the mounting surface 22 of the circuit board 20, and is applied to the mounting surface 20 of the circuit board 20, and the mounting surface 22 of the circuit board 20 and the light emitting device 30 along the upper surface 31 and the side surface 32 of the light emitting device 30. 22 is brought into close contact with the mounting surface 22 of the circuit board 20 and the upper surface 31 and the side surface 32 of the light emitting device 30. Specifically, the protection unit 100 is applied to the mounting surface 22 of the circuit board 20 on which the light emitting device 30 is mounted by a dispenser, and then cured.
Other configurations are the same as those in the third embodiment.

樹脂を塗布し硬化することによって保護部１００を作製できるので、より容易に表示装置１２の防水性を向上させることができる。また、実施の形態１に係る表示装置１０と同様に、表示装置１２の左右方向の視野角を広くできる。 Since the protective portion 100 can be produced by applying the resin and curing it, the waterproof property of the display device 12 can be improved more easily. Further, similarly to the display device 10 according to the first embodiment, the viewing angle of the display device 12 in the left-right direction can be widened.

実施の形態５．
実施の形態１〜実施の形態４においては、発光装置３０の封止部３５は直方体形状であるが、封止部３５の形状は直方体形状に限られない。 Embodiment 5.
In the first to fourth embodiments, the sealing portion 35 of the light emitting device 30 has a rectangular parallelepiped shape, but the shape of the sealing portion 35 is not limited to the rectangular parallelepiped shape.

本実施の形態においては、図１６、１７に示すように、封止部３５が外部の空間と接する境界面の１つである上面４３は、素子基板３４の実装面３６の中心点Ｕを通り素子基板３４に垂直な中心軸１１４から離れると共に、素子基板３４の実装面３６に近づく傾斜を有する。例えば、封止部３５の上面４３は凸面である。また、素子基板３４の実装面３６からの封止部３５の側面４４の高さ（Ｚ軸方向の長さ）Ｈ６は、素子基板３４の実装面３６からのＬＥＤチップ３３ｒ、３３ｇ、３３ｂの上端の高さ（Ｚ軸方向の長さ）Ｈ７よりも高い。その他の構成は、実施の形態１と同様である。 In the present embodiment, as shown in FIGS. 16 and 17, the upper surface 43, which is one of the boundary surfaces where the sealing portion 35 is in contact with the external space, passes through the center point U of the mounting surface 36 of the element substrate 34. It is separated from the central axis 114 perpendicular to the element substrate 34 and has an inclination approaching the mounting surface 36 of the element substrate 34. For example, the upper surface 43 of the sealing portion 35 is a convex surface. Further, the height (length in the Z-axis direction) H6 of the side surface 44 of the sealing portion 35 from the mounting surface 36 of the element substrate 34 is the upper end of the LED chips 33r, 33g, 33b from the mounting surface 36 of the element substrate 34. Height (length in the Z-axis direction) is higher than H7. Other configurations are the same as those in the first embodiment.

本実施の形態においては、素子基板３４の実装面３６の中心点Ｕから発光し、素子基板３４の実装面３６の中心軸１１４に対して角度φ（０°＜φ＜９０°）傾斜した発光角度φの発光光１１６を仮定し、素子基板３４の実装面３６に対する上面４３の傾斜角度αを発光角度φより小さくする（φ＞α）。
この場合、発光光１１６と上面４３の交点Ｖでの、発光光１１６の上面４３への上面４３に垂直な軸に対する入射角度βは、β＝φ−α＞０となる。さらに、封止部３５の屈折率は外部の空間を満たす空気よりも屈折率が大きいので、発光光１１６の発光装置３０からの出射光１２０の出射角度θは発光角度φよりも大きくなる。発光光１１６の発光角度φよりも、発光装置３０の出射光１２０の出射角度θが大きくなるので、発光装置３０の出射角度θが大きい出射光（例えば、θ＞６０°以上の出射光）の光量が増加する。 In the present embodiment, light is emitted from the center point U of the mounting surface 36 of the element substrate 34, and is inclined by an angle φ (0 ° <φ <90 °) with respect to the central axis 114 of the mounting surface 36 of the element substrate 34. Assuming the emission light 116 having an angle φ, the inclination angle α of the upper surface 43 with respect to the mounting surface 36 of the element substrate 34 is made smaller than the emission angle φ (φ> α).
In this case, the incident angle β with respect to the axis perpendicular to the upper surface 43 of the emitted light 116 with respect to the upper surface 43 at the intersection V of the emitted light 116 and the upper surface 43 is β = φ−α> 0. Further, since the refractive index of the sealing portion 35 is larger than that of the air filling the external space, the emission angle θ of the emission light 120 from the light emitting device 30 of the emission light 116 is larger than the emission angle φ. Since the emission angle θ of the emission light 120 of the light emitting device 30 is larger than the emission angle φ of the emission light 116, the emission light having a large emission angle θ of the light emitting device 30 (for example, emission light of θ> 60 ° or more) The amount of light increases.

発光装置３０の出射角度θが大きい出射光の光量が増加するので、表示装置１０の輝度の視野角依存性を小さくできる。また、実施の形態１に係る表示装置１０と同様に、表示装置１０の左右方向の視野角を広くできる。 Since the amount of emitted light having a large emission angle θ of the light emitting device 30 increases, the viewing angle dependence of the brightness of the display device 10 can be reduced. Further, similarly to the display device 10 according to the first embodiment, the viewing angle of the display device 10 in the left-right direction can be widened.

以上、本発明の複数の実施の形態を説明したが、本発明は、上記の実施の形態に限定されず、本発明の要旨を逸脱しない範囲で種々の変更が可能である。 Although a plurality of embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.

例えば、発光装置３０は、赤色光、緑色光、青色光を発光する３つのＬＥＤチップを備えるとは限られない。発光装置３０の出射光は単色光であってもよい。また、発光装置３０のマトリクス状の配列において、赤色光を出射する発光装置３０、緑色光を出射する発光装置３０、青色光を出射する発光装置３０を、列方向に繰り返し配置してもよい。 For example, the light emitting device 30 does not necessarily include three LED chips that emit red light, green light, and blue light. The emitted light of the light emitting device 30 may be monochromatic light. Further, in the matrix-like arrangement of the light emitting devices 30, the light emitting device 30 that emits red light, the light emitting device 30 that emits green light, and the light emitting device 30 that emits blue light may be repeatedly arranged in the row direction.

発光装置３０は、発光装置３０の素子基板３４の側面４０から実装面３６に対向する面４１に延びる電極４２を備えるものに限られず、電極４２の形状は任意である。例えば、回路基板２０の配線に接続され固定されるために、発光装置３０の下面にボール状の電極を配列したＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｒｒａｙ）タイプの電極を備えたものでもよい。 The light emitting device 30 is not limited to the one including the electrode 42 extending from the side surface 40 of the element substrate 34 of the light emitting device 30 to the surface 41 facing the mounting surface 36, and the shape of the electrode 42 is arbitrary. For example, a BGA (Ball Grid Array) type electrode in which ball-shaped electrodes are arranged on the lower surface of the light emitting device 30 may be provided so as to be connected to and fixed to the wiring of the circuit board 20.

発光装置３０の封止部３５の側面４４に、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂの発光光４５を反射あるいは散乱する側壁を設けてもよい。例えば、封止部３５の側面４４のうち、第２マスク部６０に対向する２つの側面４４に、発光光４５を反射あるいは散乱する側壁を設けてもよい。さらに、封止部３５の側面４４のそれぞれの一部に、発光光４５を反射あるいは散乱する側壁を設けてもよい。 A side wall 44 that reflects or scatters the emitted light 45 of the LED chips 33r, 33g, and 33b may be provided on the side surface 44 of the sealing portion 35 of the light emitting device 30. For example, of the side surfaces 44 of the sealing portion 35, side walls that reflect or scatter the emitted light 45 may be provided on the two side surfaces 44 facing the second mask portion 60. Further, a side wall that reflects or scatters the emitted light 45 may be provided on each part of the side surface 44 of the sealing portion 35.

発光装置３０の封止部３５は、ＬＥＤチップ３３ｒ、３３ｇ、３３ｂの発光光４５を拡散する拡散材を含んでもよい。封止部３５が拡散材を含むことにより、発光装置３０の出射光強度の角度分布をより均一にできる。 The sealing portion 35 of the light emitting device 30 may include a diffusing material that diffuses the emitted light 45 of the LED chips 33r, 33g, and 33b. By including the diffusing material in the sealing portion 35, the angular distribution of the emitted light intensity of the light emitting device 30 can be made more uniform.

発光装置３０のマトリクス状の配列は、各行（各列）のピッチが同一であるものに限られない。例えば、発光装置３０のマトリクス状の配列は１行（１列）毎に半ピッチずれた配列であってもよい。 The matrix-like arrangement of the light emitting device 30 is not limited to the one in which the pitch of each row (each column) is the same. For example, the matrix-like array of the light emitting device 30 may be an array that is half-pitch-shifted for each row (one column).

実施の形態１では、表示装置１０は、回路基板２０と回路基板２０の実装面２２にマトリクス状に実装された複数の発光装置３０とＹ軸方向に延びる第１マスク部５０とＸ軸方向に延びる第２マスク部６０とを備えるが、表示装置１０は回路基板２０と複数の発光装置３０と第１マスク部５０とを備えればよい。 In the first embodiment, the display device 10 includes a plurality of light emitting devices 30 mounted in a matrix on the circuit board 20 and the mounting surface 22 of the circuit board 20, the first mask portion 50 extending in the Y-axis direction, and the X-axis direction. The display device 10 may include a circuit board 20, a plurality of light emitting devices 30, and a first mask unit 50, although the display device 10 includes an extending second mask unit 60.

例えば、図７、１８に示すように、Ｙ軸方向に延びる第１マスク部５０の長さＬ１を回路基板２０のＹ軸方向の長さＬ５と等しくする。そして、実施の形態１と同様に、第１マスク部５０をＸ軸方向に配列し、隣接する発光装置３０の間と、発光装置３０のＸ軸方向に延びる列の両端の発光装置３０の外側に設ける。回路基板２０と発光装置３０の構成、発光装置３０の高さＨ１と第１マスク部５０の高さＨ２と関係は、実施の形態１と同様である。
この場合も、実施の形態１と同様に、発光装置３０の高さＨ１が第１マスク部５０の高さＨ２以上であるので、出射光を最も多く出射する発光装置３０の上面３１からの出射光４６が第１マスク部５０に遮られずに表示装置１０から出射する。したがって、表示装置１０のＸ軸方向の視野角、すなわち、表示装置１０の左右方向の視野角を広くできる。また、素子基板３４の実装面３６の高さＨ４を第１マスク部５０の高さＨ２以上とすることによって、表示装置１０の出射光の光量が増加するので、表示装置１０の表示を明るくできる。 For example, as shown in FIGS. 7 and 18, the length L1 of the first mask portion 50 extending in the Y-axis direction is made equal to the length L5 in the Y-axis direction of the circuit board 20. Then, as in the first embodiment, the first mask portions 50 are arranged in the X-axis direction, and are located between the adjacent light emitting devices 30 and outside the light emitting devices 30 at both ends of the row extending in the X-axis direction of the light emitting device 30. Provided in. The configuration of the circuit board 20 and the light emitting device 30, the height H1 of the light emitting device 30 and the height H2 of the first mask portion 50 are the same as those in the first embodiment.
Also in this case, as in the first embodiment, since the height H1 of the light emitting device 30 is equal to or higher than the height H2 of the first mask portion 50, the light emitting device 30 emits the most emitted light from the upper surface 31. The emitted light 46 is emitted from the display device 10 without being blocked by the first mask portion 50. Therefore, the viewing angle of the display device 10 in the X-axis direction, that is, the viewing angle of the display device 10 in the left-right direction can be widened. Further, by setting the height H4 of the mounting surface 36 of the element substrate 34 to the height H2 or more of the first mask portion 50, the amount of emitted light of the display device 10 increases, so that the display of the display device 10 can be brightened. ..

実施の形態１〜実施の形態４においては、第２マスク部６０の基準面Ｓからの高さＨ３は発光装置３０の基準面Ｓからの高さＨ１より高いが、第２マスク部６０の基準面Ｓからの高さＨ３は発光装置３０の基準面Ｓからの高さＨ１以下であってもよい。これにより、表示装置の上下方向の視野角を広くできる。
第１マスク部５０の基準面Ｓからの高さＨ２と第２マスク部６０の基準面Ｓからの高さＨ３を等しくしてもよい。また、第１マスク部５０の厚さＤ１と第２マスク部６０の厚さＤ２を等しくしてもよい。 In the first to fourth embodiments, the height H3 of the second mask unit 60 from the reference surface S is higher than the height H1 of the light emitting device 30 from the reference surface S, but the reference of the second mask unit 60. The height H3 from the surface S may be equal to or less than the height H1 from the reference surface S of the light emitting device 30. As a result, the viewing angle in the vertical direction of the display device can be widened.
The height H2 of the first mask portion 50 from the reference surface S and the height H3 of the second mask portion 60 from the reference surface S may be equal to each other. Further, the thickness D1 of the first mask portion 50 and the thickness D2 of the second mask portion 60 may be equal to each other.

また、第１マスク部５０と第２マスク部６０は一体に形成されてもよい。例えば、第１マスク部５０の厚さＤ１と第２マスク部６０の厚さＤ２を等しくし、一体に形成した場合には、図１９に示すように、発光装置３０が回路基板２０の実装面２２に実装された位置に矩形状の開口部１３０を有するマスク板１４０となる。
第２マスク部６０に庇部を設けてもよい。庇部は、例えばＸ軸方向に延びる黒色の平板である。庇部は、第２マスク部６０と一体に形成されてもよい。
さらに、第１マスク部５０と第２マスク部６０の表面には、シボ加工やつや消し塗装が施されることが好ましい。 Further, the first mask portion 50 and the second mask portion 60 may be integrally formed. For example, when the thickness D1 of the first mask portion 50 and the thickness D2 of the second mask portion 60 are made equal and integrally formed, as shown in FIG. 19, the light emitting device 30 is a mounting surface of the circuit board 20. The mask plate 140 has a rectangular opening 130 at the position mounted on the 22.
The eaves portion may be provided in the second mask portion 60. The eaves are, for example, a black flat plate extending in the X-axis direction. The eaves portion may be formed integrally with the second mask portion 60.
Further, it is preferable that the surfaces of the first mask portion 50 and the second mask portion 60 are textured or matte coated.

保護部１００は、発光装置３０の上面３１と接する部分に拡散材を含んでもよい。これにより、表示装置１２の輝度の視野角依存性を小さくできる。 The protective unit 100 may include a diffusing material in a portion in contact with the upper surface 31 of the light emitting device 30. As a result, the viewing angle dependence of the brightness of the display device 12 can be reduced.

さらに、複数の表示装置１０〜１２を組み合わせることによって、より大型の表示装置を構成することもできる。例えば、図２０に示されるように、４つの表示装置１０が組み合わされて、表示装置２００が構成される。なお、例えば、構成の異なる表示装置１０と１２とが組み合わされてもよい。 Further, a larger display device can be configured by combining a plurality of display devices 10 to 12. For example, as shown in FIG. 20, four display devices 10 are combined to form a display device 200. In addition, for example, display devices 10 and 12 having different configurations may be combined.

１０，１１，１２，１３，２００ 表示装置、２０ 回路基板、２２，３６ 実装面、２５ 凸部、３０ 発光装置、２６，３１，４３ 上面、３２，４０，４４ 側面、３３ｒ，３３ｇ，３３ｂ ＬＥＤチップ、３４ 素子基板、３５ 封止部、３７ｒ，３７ｇ，３７ｂ，３８ｒ，３８ｇ，３８ｂ 配線、４１ 実装面に対向する面、４２ 電極、４５，１１６ 発光光、４６ 発光装置の上面からの出射光、４７ 封止部の側面からの出射光、５０ 第１マスク部、６０ 第２マスク部、７０ 入射する光、１００ 保護部、１１４ 中心軸、１２０ 発光装置からの出射光、１４０ マスク板、θ 出射角度、φ 発光角度、Ｄ１，Ｄ２，Ｄ３，Ｄ４，Ｄ５，Ｄ６ 厚さ、Ｌ１，Ｌ２，Ｌ３，Ｌ４，Ｌ５ 長さ、Ｈ１，Ｈ２、Ｈ３，Ｈ４，Ｈ５，Ｈ６，Ｈ７ 高さ、Ｓ 基準面、Ｕ 中心点、Ｖ 交点 10,11,12,13,200 Display device, 20 circuit board, 22,36 mounting surface, 25 convex part, 30 light emitting device, 26,31,43 top surface, 32,40,44 side surface, 33r, 33g, 33b LED Chip, 34 element substrate, 35 sealing part, 37r, 37g, 37b, 38r, 38g, 38b wiring, 41 surface facing the mounting surface, 42 electrodes, 45,116 emitted light, 46 emitted light from the upper surface of the light emitting device , 47 Emitting light from the side surface of the sealing part, 50 1st mask part, 60 2nd mask part, 70 Incident light, 100 Protecting part, 114 Central axis, 120 Emitting light from the light emitting device, 140 Mask plate, θ Emission angle, φ emission angle, D1, D2, D3, D4, D5, D6 thickness, L1, L2, L3, L4, L5 length, H1, H2, H3, H4, H5, H6, H7 height, S Reference plane, U center point, V intersection

Claims (4)

回路基板と、
前記回路基板の実装面にマトリクス状に実装された発光装置と、
前記回路基板の上に設けられ、隣接する前記発光装置の間で、マトリクス状に実装された前記発光装置の列の方向に延びる第１マスク部と、
前記回路基板の上に設けられ、隣接する前記発光装置の間で、マトリクス状に実装された前記発光装置の行の方向に延びる第２マスク部と、
を備え、
前記発光装置は、光を発光するＬＥＤチップ、及び前記ＬＥＤチップを封止する封止部を有し、
前記封止部は、前記実装面から上方へ離れる方向に凸面である上面と、前記凸面の縁部から前記実装面側に延伸し、前記実装面に垂直な側面とを有し、
前記実装面から前記凸面の頂部までの高さは、前記実装面から前記第２マスク部の上端までの高さよりも低く、
前記実装面から前記上面と前記側面との境界までの高さは、前記実装面から前記第１マスク部の上端までの高さ以上である、
表示装置。 With the circuit board
A light emitting device mounted in a matrix on the mounting surface of the circuit board,
A first mask portion provided on the circuit board and extending in the direction of a row of the light emitting devices mounted in a matrix between the adjacent light emitting devices.
A second mask portion provided on the circuit board and extending in the direction of the row of the light emitting device mounted in a matrix between the adjacent light emitting devices,
With
The light emitting device has an LED chip that emits light and a sealing portion that seals the LED chip.
The sealing portion has an upper surface which is convex in a direction away upward from the mounting surface, and extends from the edge of the front Symbol convex on the mounting surface, and a perpendicular side surface on the mounting surface,
The height from the mounting surface to the top of the convex surface is lower than the height from the mounting surface to the upper end of the second mask portion.
The height from the mounting surface to the boundary between the upper surface and the side surface is equal to or greater than the height from the mounting surface to the upper end of the first mask portion.
Display device. 回路基板と、
前記回路基板の実装面にマトリクス状に実装された発光装置と、
前記回路基板の上に設けられ、隣接する前記発光装置の間で、マトリクス状に実装された前記発光装置の列の方向に延びる第１マスク部と、
前記回路基板の上に設けられ、隣接する前記発光装置の間で、マトリクス状に実装された前記発光装置の行の方向に延びる第２マスク部と、
を備え、
前記発光装置は、光を発光するＬＥＤチップ、及び前記ＬＥＤチップを封止する封止部を有し、
前記封止部は、前記実装面から上方へ離れる方向に凸面である上面と、前記凸面の縁部から前記実装面側に延伸し、前記実装面に垂直な側面とを有し、
前記実装面から前記凸面の頂部までの高さは、前記実装面から前記第２マスク部の上端までの高さよりも低く、
前記凸面である上面から出射する前記発光装置の出射光のうち、出射角度が最大となる出射光の通る光路を、前記第１マスク部が遮らない、
表示装置。 With the circuit board
A light emitting device mounted in a matrix on the mounting surface of the circuit board,
A first mask portion provided on the circuit board and extending in the direction of a row of the light emitting devices mounted in a matrix between the adjacent light emitting devices.
A second mask portion provided on the circuit board and extending in the direction of the row of the light emitting device mounted in a matrix between the adjacent light emitting devices,
With
The light emitting device has an LED chip that emits light and a sealing portion that seals the LED chip.
The sealing portion has an upper surface which is convex in a direction away upward from the mounting surface, and extends from the edge of the front Symbol convex on the mounting surface, and a perpendicular side surface on the mounting surface,
The height from the mounting surface to the top of the convex surface is lower than the height from the mounting surface to the upper end of the second mask portion.
Among the emitted light of the light emitting device emitted from the upper surface which is the convex surface, the first mask portion does not block the optical path through which the emitted light having the maximum emission angle passes.
Display device. 前記実装面から前記発光装置の前記側面の上端までの高さは、前記実装面から前記ＬＥＤチップまでの高さよりも高い、
請求項１又は２に記載の表示装置。 The height from the mounting surface to the upper end of the side surface of the light emitting device is higher than the height from the mounting surface to the LED chip.
The display device according to claim 1 or 2. 前記第２マスク部の表面には、外部から前記第２マスク部へ入射する光の反射を抑制する加工が施されている、
請求項１から３のいずれか１項に記載の表示装置。 The surface of the second mask portion is processed to suppress reflection of light incident on the second mask portion from the outside.
The display device according to any one of claims 1 to 3.
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