WO2017164565A1 - 점성 용액 도포 장치 및 점성 용액 도포 방법 - Google Patents

점성 용액 도포 장치 및 점성 용액 도포 방법 Download PDF

Info

Publication number
WO2017164565A1
WO2017164565A1 PCT/KR2017/002875 KR2017002875W WO2017164565A1 WO 2017164565 A1 WO2017164565 A1 WO 2017164565A1 KR 2017002875 W KR2017002875 W KR 2017002875W WO 2017164565 A1 WO2017164565 A1 WO 2017164565A1
Authority
WO
WIPO (PCT)
Prior art keywords
aerosol
nozzle
pneumatic
viscous solution
chamber
Prior art date
Application number
PCT/KR2017/002875
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
홍승민
김건희
Original Assignee
주식회사 프로텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 프로텍 filed Critical 주식회사 프로텍
Publication of WO2017164565A1 publication Critical patent/WO2017164565A1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
    • B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
    • B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1404—Arrangements for supplying particulate material
    • B05B7/144—Arrangements for supplying particulate material the means for supplying particulate material comprising moving mechanical means
    • B05B7/1445—Arrangements for supplying particulate material the means for supplying particulate material comprising moving mechanical means involving vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/14—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas designed for spraying particulate materials
    • B05B7/1481—Spray pistols or apparatus for discharging particulate material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

Definitions

  • the present invention relates to a viscous solution application device and a viscous solution application method, and more particularly, to a viscous solution application device and a viscous solution application method for applying the viscous solution to the correct area of the material, such as semiconductor parts at the correct dose.
  • Apparatuses for applying viscous solutions such as silicones and epoxies are widely used in many industries.
  • various processes of applying silver paste or solder paste to a substrate or a semiconductor chip as well as a synthetic resin solution are widely used in many industries.
  • a dispenser for applying a solution using a pump such as a screw pump, a linear pump, or a piezoelectric pump has been widely used.
  • a pump such as a screw pump, a linear pump, or a piezoelectric pump.
  • Such a conventional dispenser uses a method of discharging a solution in a stream form or continuously discharging the solution in a droplet form of a small size.
  • Such a conventional coating method or coating apparatus has a limitation in finely controlling the amount of the solution to be applied.
  • the minimum droplet size of a widely used piezoelectric pump is usually several hundred micrometers or more. Therefore, there is a problem that it is difficult to use a conventional coating device in the process of applying the solution with a line width of several micrometers to several tens of micrometers or the process of applying the coating capacity of the viscous solution very finely.
  • the spray injection method may be used.
  • the spray spraying method has an advantage that it is easy to finely adjust the coating capacity, it is difficult to apply the solution in a very narrow area or to apply the solution in the form of a very thin line due to the property of being sprayed while spreading over a wide area. There is a problem.
  • the present invention has been made to solve the problems described above, it is possible to precisely control the coating capacity of the viscous solution and viscous solution coating device and viscous solution coating that can finely adjust the line thickness or area of the coating area It is an object to provide a method.
  • the viscous solution application device of the present invention for solving the above object, the storage unit for storing the solution; An aerosol generating unit for converting the solution delivered from the reservoir into an aerosol in a fine particle state; A chamber configured to receive and store the aerosol generated by the aerosol generating unit; An aerosol nozzle which receives the aerosol from the chamber and injects the aerosol; A supply pipe connecting the chamber and an aerosol nozzle; A feed pump for applying pressure to the aerosol delivered from the chamber to the aerosol nozzle through the supply pipe; And a controller for controlling the operation of the aerosol-generating unit and the feed pump.
  • the viscous solution application method of the present invention (a) storing the solution in the storage; (b) converting the solution stored in the reservoir into an aerosol in a fine particle state using an aerosol generating unit; (c) delivering the aerosol generated in step (b) to a chamber; And (d) spraying the aerosol stored in the chamber through an aerosol nozzle.
  • the viscous solution application device and the viscous solution application method of the present invention provide an effect of providing a viscous solution application device and a viscous solution application method capable of precisely adjusting the application amount of the viscous solution and finely controlling the application area of the viscous solution. There is.
  • FIG. 1 is a schematic diagram of a viscous solution application device according to an embodiment of the present invention.
  • FIG. 2 is a schematic view of a viscous solution application device according to another embodiment of the present invention.
  • FIG. 1 is a schematic diagram of a viscous solution application device according to an embodiment of the present invention.
  • the viscous solution application device of the present embodiment includes a storage unit 10, an aerosol generating unit 21, a chamber 30, an aerosol nozzle 50, a supply pipe 33, a supply pump 31, and a controller. 70 is made.
  • the storage unit 10 stores the solution to be applied to the material (S).
  • the solution used in the present embodiment may be a silver paste for EMI coating applied to a semiconductor chip, or a solder paste for bonding a semiconductor chip to a substrate.
  • the aerosol generating unit 21 converts the solution delivered from the storage unit 10 into an aerosol in the form of fine particles.
  • an aerosol generating unit 21 is installed inside the storage unit 10.
  • This embodiment uses an aerosol generating unit 21 having an ultrasonic diaphragm.
  • the ultrasonic diaphragm vibrates the solution inside the storage unit 10 to atomize the solution, thereby generating aerosols in the form of particles having a size of about several micrometers or smaller.
  • the aerosol generated by the aerosol generating unit 21 is delivered to the chamber 30 connected to the reservoir 10.
  • the aerosol delivered from the reservoir 10 to the chamber 30 is stored in the chamber 30.
  • the reservoir 10 and the chamber 30 are connected to the delivery pipe 13.
  • the delivery pipe 13 is provided with a delivery valve 12 to open and close the delivery pipe 13 or to adjust the flow rate.
  • the reservoir 10 is provided with a delivery pump 11 to adjust the pressure of the reservoir 10 so that the aerosol is delivered to the chamber 30.
  • the operation of the aerosol generating unit 21, the delivery pump 11, and the delivery valve 12 is controlled by the control unit 70, respectively.
  • the supply pipe 33 is connected to the chamber 30, and the aerosol nozzle 50 is installed in the supply pipe 33. That is, the supply pipe 33 connects the chamber 30 and the aerosol nozzle 50.
  • the aerosol stored in the chamber 30 is delivered to the aerosol nozzle 50 through the supply pipe 33 and injected. By positioning the aerosol nozzle 50 relative to the semiconductor chip or package, it is possible to apply the solution to a desired position.
  • the chamber 30 is provided with a feed pump 31 to adjust the pressure of the chamber 30.
  • a supply valve 32 is provided in the supply pipe 33 to open and close the supply pipe 33.
  • the supply pipe 33 operates the supply pump 31 and the supply valve 32.
  • the controller 70 may adjust the amount of aerosol injected through the aerosol nozzle 50 by applying pressure to the chamber 30 by the supply pump 31 and adjusting the operation of the supply valve 32.
  • a circulation tube 40 is installed between the chamber 30 and the storage 10.
  • the aerosol stored in the chamber 30 may be delivered to the aerosol generating unit 21 through the circulation pipe 40.
  • the circulation valve 41 is installed in the circulation pipe 40.
  • the operation of the circulation valve 41 is controlled by the controller 70.
  • the aerosol stored in the chamber 30 is stored through the circulation pipe 40. 10) to be circulated.
  • the aerosol generated by the aerosol generating unit 21 and not injected into the aerosol nozzle 50 in the aerosol delivered to the chamber 30 is delivered to the storage unit 10 through the circulation pipe 40 for reuse.
  • the aerosol nozzle 50 is provided with a pneumatic nozzle 61.
  • the pneumatic nozzle 61 is formed in a direction inclined to the extending direction of the aerosol nozzle 50.
  • a pneumatic nozzle formed to cover the outer diameter of the aerosol nozzle 50 may be used.
  • the pneumatic pipe 63 is connected to the pneumatic nozzle 61.
  • a pneumatic pump 62 is connected to the pneumatic tube 63 to supply compressed air to the pneumatic nozzle 61.
  • the pneumatic 63 is provided with a pneumatic valve 64 that opens and closes the pneumatic tube 63.
  • the operation of the pneumatic pump 62 and the pneumatic valve 64 is controlled by the control unit 70.
  • the viscous solution application device of this embodiment includes two sets of pneumatic nozzles 61, pneumatic pipes 63, and pneumatic valves 64, one on each side of the aerosol nozzle 50, respectively.
  • Compressed air injected from the pneumatic nozzle 61 serves to guide or guide the aerosol is injected through the aerosol nozzle 50.
  • both pneumatic valves 64 are closed, the aerosol is injected in the vertical direction from the aerosol nozzle 50.
  • the aerosol is injected in the lateral inclination direction in the aerosol nozzle 50.
  • both pneumatic valves 64 are opened, the spray area of the aerosol is expanded by the aerosol nozzle 50.
  • the delivery pump 11, the supply pump 31, the delivery valve 12, the supply valve 32, and the circulation valve 41 are described above as an example, but only some of them in some cases It is also possible to comprise a configuration and additionally it is also possible to comprise a separate valve and pump. For example, even when there is no delivery pump 11, the aerosol can be naturally delivered to the chamber 30 by the pressure generated by the aerosol in the reservoir 10.
  • the aerosol generating unit 21 may be provided between the storage 10 and the chamber 30. That is, the aerosol-generating unit 21 receives the solution stored in the reservoir 10 to generate an aerosol, and the aerosol may be configured to be delivered to the chamber 30.
  • the viscous solution application device of the embodiment shown in FIG. 2 has the same configuration except for the configuration of the aerosol generating unit 22 and the embodiment described with reference to FIG. 1.
  • the rest of the configuration except for the aerosol-generating unit 22 will be described with reference to the same member numbers as in FIG. 1.
  • the viscous solution application device of this embodiment includes an aerosol generating unit 22 in the form of a spray.
  • the aerosol generating unit 22 includes a spray tube 223 and a spray nozzle 222.
  • the spray tube 223 is installed in the reservoir 10 to supply the solution stored in the reservoir 10.
  • the spray nozzle 222 is connected to the spray tube 223.
  • the spray nozzle 222 is connected to the spray pump 221 to supply air pressure.
  • the spray pump 221 is controlled by the control unit 70.
  • the aerosol solution thus produced is sprayed through the aerosol nozzle 50 via the chamber 30 as in the viscous solution application device described above with reference to FIG. 1. Some of the aerosols stored in the chamber 30 is circulated to the reservoir 10 through the circulation tube 40.
  • the solution to be sprayed in the form of an aerosol is stored in the storage unit 10 (step (a)).
  • the storage unit 10 may be stored according to the use of various solutions such as silver paste and solder paste.
  • the solution stored in the storage unit 10 is converted into an aerosol in a fine particle state by using the aerosol generating unit 21 (step (b)).
  • the aerosol is generated by applying vibration to the solution by using the ultrasonic diaphragm installed in the storage unit 10. It is possible to generate various aerosols by adjusting the frequency of the diaphragm according to the type of solution. Since the size of the particles of the aerosol can be made smaller than several ⁇ m depending on the method of producing the aerosol, it is possible to finely control the application capacity of the solution and to apply the solution in the form of extremely thin lines.
  • the aerosol generated by the aerosol generating unit 21 is delivered to the chamber 30 (step (c)).
  • the aerosol stored in the chamber 30 is injected through the aerosol nozzle 50 (step (d)).
  • Some of the aerosol stored in the chamber 30 is delivered to the aerosol-generating unit 21 of the storage unit 10 through the circulation tube 40 to circulate (step (e)).
  • the controller 70 operates the aerosol generating unit 21, the supply pump 31, the supply valve 32, and the circulation valve 41 to control the amount of aerosol and the circulation pipe 40 injected through the aerosol nozzle 50. It adjusts the amount of aerosol delivered to the storage 10 through. It is also possible to adjust the concentration of the aerosol to be injected through the aerosol nozzle 50 by allowing external air to enter the chamber 30 through the feed pump 31.
  • compressed air may be injected through the pneumatic nozzle 61 installed in the aerosol nozzle 50 to induce the injection of the aerosol or guide the direction (step (f)).
  • the aerosol can be adjusted to be sprayed only in the desired area without spreading, there is an advantage that it is easy to adjust the injection direction of the aerosol.
  • the injection direction of the aerosol injected from the aerosol nozzle 50 may be adjusted.
  • the spraying direction of the aerosol is inclined laterally, so that the aerosol can be effectively injected from the side surface of the material (S).
  • the aerosol nozzles are opened by opening and closing the respective pneumatic valves 64 in a state in which a plurality of sets of pneumatic nozzles 61, pneumatic pipes 63, and pneumatic valves 64 are installed in the aerosol nozzles 50. It is possible to variously adjust the direction or the injection area of the aerosol injected in 50).
  • step (b) described above is to mix the solution supplied through the spray tube 223 with the compressed air through the spray nozzle 222, such as the viscous solution application device described with reference to Figure 2 without using a diaphragm It is also possible to carry out using an aerosol-generating unit 22 for generating an aerosol.
  • the viscous solution application method of the present invention may not perform step (f) or may not perform step (e) of circulating the aerosol of the chamber 30 according to circumstances.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)
PCT/KR2017/002875 2016-03-24 2017-03-17 점성 용액 도포 장치 및 점성 용액 도포 방법 WO2017164565A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20160035123 2016-03-24
KR10-2016-0035123 2016-03-24

Publications (1)

Publication Number Publication Date
WO2017164565A1 true WO2017164565A1 (ko) 2017-09-28

Family

ID=59900463

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/002875 WO2017164565A1 (ko) 2016-03-24 2017-03-17 점성 용액 도포 장치 및 점성 용액 도포 방법

Country Status (3)

Country Link
KR (1) KR101930157B1 (zh)
TW (1) TWI629109B (zh)
WO (1) WO2017164565A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114643141A (zh) * 2020-12-21 2022-06-21 普罗科技有限公司 粘性溶液气溶胶喷射装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102620937B1 (ko) 2021-11-29 2024-01-05 주식회사 프로텍 하이브리드형 스프레이 펌프

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262108A (ja) * 2004-03-19 2005-09-29 Fuji Photo Film Co Ltd 成膜装置及び圧電材料の製造方法
JP2005305427A (ja) * 2004-03-26 2005-11-04 Fuji Photo Film Co Ltd ノズル装置、それを用いた成膜装置及び方法、無機エレクトロルミネッセンス素子、インクジェットヘッド、及び、超音波トランスデューサアレイ
JP2005305341A (ja) * 2004-04-22 2005-11-04 Fuji Photo Film Co Ltd 成膜装置
JP2006200013A (ja) * 2005-01-21 2006-08-03 Canon Inc 成膜方法及び成膜装置
KR20150024649A (ko) * 2013-08-27 2015-03-09 엔젯 주식회사 정전기력을 이용하는 분무 및 패터닝 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763308A (ja) * 1993-08-24 1995-03-07 Ckd Corp 噴霧ノズル
JP2001011653A (ja) * 1999-07-02 2001-01-16 Matsushita Electric Ind Co Ltd 薄膜形成方法及び薄膜形成装置
TW517604U (en) * 2002-03-14 2003-01-11 Asia Pacific Fuel Cell Tech Spraying apparatus for coating and applying materials on a substrate surface
SG111177A1 (en) * 2004-02-28 2005-05-30 Wira Kurnia Fine particle powder production
JP5526033B2 (ja) * 2007-11-14 2014-06-18 ザ ユニバーシティ オブ クィーンズランド 微粒子製造装置および微粒子製造方法
US9375746B2 (en) * 2008-06-05 2016-06-28 Durr Systems Gmbh Compact paint booth
JP6049067B2 (ja) * 2012-12-27 2016-12-21 株式会社日本マイクロニクス 配線形成装置、メンテナンス方法および配線形成方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005262108A (ja) * 2004-03-19 2005-09-29 Fuji Photo Film Co Ltd 成膜装置及び圧電材料の製造方法
JP2005305427A (ja) * 2004-03-26 2005-11-04 Fuji Photo Film Co Ltd ノズル装置、それを用いた成膜装置及び方法、無機エレクトロルミネッセンス素子、インクジェットヘッド、及び、超音波トランスデューサアレイ
JP2005305341A (ja) * 2004-04-22 2005-11-04 Fuji Photo Film Co Ltd 成膜装置
JP2006200013A (ja) * 2005-01-21 2006-08-03 Canon Inc 成膜方法及び成膜装置
KR20150024649A (ko) * 2013-08-27 2015-03-09 엔젯 주식회사 정전기력을 이용하는 분무 및 패터닝 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114643141A (zh) * 2020-12-21 2022-06-21 普罗科技有限公司 粘性溶液气溶胶喷射装置

Also Published As

Publication number Publication date
KR20170113190A (ko) 2017-10-12
KR101930157B1 (ko) 2018-12-17
TWI629109B (zh) 2018-07-11
TW201801797A (zh) 2018-01-16

Similar Documents

Publication Publication Date Title
KR101764987B1 (ko) 성막 장치
EP2805777B1 (en) Coating method and device
US6325853B1 (en) Apparatus for applying a liquid coating with an improved spray nozzle
TW201544186A (zh) 塗佈裝置及塗佈方法
US7997689B2 (en) Droplet ejection device for a highly viscous liquid
WO2017164565A1 (ko) 점성 용액 도포 장치 및 점성 용액 도포 방법
KR20060082839A (ko) 재료 분배 방법
KR20190109268A (ko) 공급량이 유체 생성물이 배출되는 개구의 속력에 의존하는 유체 생성물을 도포하기 위한 도포장치
KR102193365B1 (ko) 성막 장치
KR101899239B1 (ko) 반도체 패키지의 전자파 차폐막 형성 장치 및 반도체 패키지의 전자파 차폐막 형성 방법
KR20170113726A (ko) 점성 용액 스프레이 도포 장치
KR102579198B1 (ko) 음향 변환기를 갖는 분사 장치들 및 그 제어 방법들
KR20200028986A (ko) 에너지 출력 장치들을 갖는 분사 장치들 및 그 제어 방법들
CN105432155A (zh) 喷嘴装置
EP0819473B1 (en) Method and apparatus for applying a liquid coating in atomised or non-atomised form by use of a single nozzle
KR102384218B1 (ko) 디스펜싱 장치
JP2007098348A (ja) 液体塗布装置用マルチノズル及び液体塗布装置
US20070154647A1 (en) Spray valve
KR101479075B1 (ko) 스프레이 시스템
KR100617476B1 (ko) 초음파 스프레이를 이용한 전극 도포 시스템
CN110271173B (zh) 计量阀
US9145255B2 (en) Dispenser for dispensing a fluent material
WO2021182146A1 (ja) 面状液膜形成方法および面状液膜形成装置
US20170368628A1 (en) Spray apparatus and method of ejecting mist using spray apparatus
JP2841915B2 (ja) ペースト塗布装置

Legal Events

Date Code Title Description
NENP Non-entry into the national phase

Ref country code: DE

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17770536

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 17770536

Country of ref document: EP

Kind code of ref document: A1