WO2017152496A1 - 一种曲面显示面板及其制造方法 - Google Patents
一种曲面显示面板及其制造方法 Download PDFInfo
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- WO2017152496A1 WO2017152496A1 PCT/CN2016/082599 CN2016082599W WO2017152496A1 WO 2017152496 A1 WO2017152496 A1 WO 2017152496A1 CN 2016082599 W CN2016082599 W CN 2016082599W WO 2017152496 A1 WO2017152496 A1 WO 2017152496A1
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- substrate
- color resist
- resist layer
- forming
- recessed region
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133354—Arrangements for aligning or assembling substrates
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/13356—Structural association of cells with optical devices, e.g. polarisers or reflectors characterised by the placement of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/62—Switchable arrangements whereby the element being usually not switchable
Definitions
- the present invention relates to the field of display panels, and in particular to a curved display panel and a method of fabricating the same.
- the thin curved display provides users with a deeper viewing experience due to better contrast, wider viewing angle and immersive experience.
- the panel since the panel has a certain degree of bending, a relative misalignment between the upper and lower substrates of the panel is caused, and the light shielding effect of the black matrix disposed on one substrate is affected, resulting in bending. Light leakage.
- FIG. 1 and FIG. 2 wherein FIG. 1 is a light-shielding condition of the black matrix 12 when the panel 11 is not bent, and FIG. 2 is a light-shielding condition of the black matrix 12 after the panel 11 is bent, as can be seen, FIG.
- the technical problem to be solved by the present invention is to provide a curved display panel and a manufacturing method thereof, which can improve the light leakage phenomenon of a curved surface product without sacrificing product penetration rate.
- a technical solution adopted by the present invention is to provide a method for manufacturing a curved display panel, including:
- the first substrate and the second substrate are bonded to each other such that the spacer is embedded in the recessed region.
- another technical solution adopted by the present invention is to provide a method for manufacturing a curved display panel, including:
- the first substrate and the second substrate are bonded to each other such that the spacer is embedded in the recessed region.
- the color resist layer covers the switch tube structure, and the predetermined position is a position where the color resist layer corresponds to the structure of the switch tube.
- the first substrate is an array substrate, and the switch tube is a thin film transistor.
- the method further comprises:
- the spacer is formed on the black matrix.
- the second substrate is a color film substrate.
- the recessed region is formed by partial exposure at a predetermined position of the color resist layer by a half exposure method.
- the size of the recessed area is 1 um - 100 um, and the depth of the recessed area is 1 / 10 - 3 / 4 of the thickness of the color resist layer.
- the step of forming a color resist layer on the first substrate and forming a recessed region at a predetermined position of the color resist layer includes:
- a recessed region is formed at a predetermined position on the color resist layer and the passivation layer such that the color resist layer at the recessed region is exposed through the passivation layer.
- the step of forming the recessed regions at predetermined positions on the color resist layer and the passivation layer includes:
- the color resist layer at a predetermined position is removed using oxygen or an inert gas to form a recessed region.
- the method further includes:
- a passivation layer is formed on the color resist layer such that the passivation layer entirely covers the color resist layer.
- a curved display panel including:
- the color resist layer is disposed on the first substrate, and forms a recessed region at a predetermined position;
- the spacer is disposed on the second substrate, and the spacer is embedded in the recessed area.
- the curved display panel further includes:
- the switch tube structure is disposed on the first substrate, wherein the color resist layer covers the switch tube structure, and the predetermined position is a position where the color resist layer corresponds to the switch tube structure;
- the black matrix is disposed on the second substrate, wherein the spacers are disposed on the black matrix.
- the curved display panel further includes:
- a passivation layer is provided on the color resist layer and is entirely covered.
- the curved display panel further includes:
- a passivation layer is disposed on the color resist layer, and the color resist layer at the recessed region is exposed through the passivation layer.
- the portion of the color resist layer on the recessed region is removed by using oxygen or an inert gas to form a recessed region.
- the recessed region is formed by partial exposure at a predetermined position of the color resist layer by a half exposure method.
- the invention has the beneficial effects that the present invention forms a color resist layer on the first substrate by forming a first substrate, and forms a recessed region at a predetermined position of the color resist layer while providing a first substrate.
- the second substrate forms a spacer on the second substrate, and the first substrate and the second substrate are bonded to each other such that the spacer is embedded in the recessed region.
- the spacer of the curved display panel is embedded in the recessed area, so that when the curved display panel is bent, the spacer will not be displaced, the light leakage phenomenon is reduced, and the yield of the display panel is reduced. loss.
- FIG. 1 is a schematic structural view of a prior art curved display panel
- FIG. 2 is a schematic structural view of a curved display panel of the prior art
- FIG. 3 is a flow chart showing a first embodiment of a method of manufacturing a curved display panel according to the present invention
- 4a-4c are cross-sectional views of a curved display panel in each step of the embodiment of the present invention.
- FIG. 5 is a flow chart of a second embodiment of a method for manufacturing a curved display panel according to the present invention.
- 6a-6e are cross-sectional views of a curved display panel in each step of the second embodiment of the present invention.
- FIG. 7 is a flow chart of a third embodiment of a method for manufacturing a curved display panel according to the present invention.
- FIGS. 8a-8d are cross-sectional views of a curved display panel in each step of the third embodiment of the present invention.
- Embodiment 9 is a schematic structural view of Embodiment 1 of a curved display panel according to the present invention.
- FIG. 10 is a schematic structural view of a second embodiment of a curved display panel according to the present invention.
- FIG. 3 is a flow chart of a first embodiment of a method for manufacturing a curved display panel according to the present invention
- FIGS. 4a to 4c are cross-sectional views of the display panel in each step of the embodiment, as shown in FIG. 3 and FIG.
- the manufacturing method specifically includes the following steps:
- FIG. 4a it is a schematic diagram of the first substrate prepared by step S101 and step S102.
- the recessed region 105 is formed by partial exposure at a predetermined position of the color resist layer 103 by a half exposure method. During the exposure process, the amount of accumulated light due to the color resist is different, and the thickness of the color resist remaining after development is also different.
- the size of 105 depends on the design requirements of the product. It can be selected from 1um to 100um.
- the depth of the recessed area 105 is also determined by the design requirements of the product. It can be selected from 1/10 to 3/4 of the thickness of the color resistance.
- the predetermined position referred to herein generally means a position capable of blocking light to prevent light leakage, and the number of predetermined positions, the number of formed recessed areas 105 is not limited, and matches the number of spacers 104 explained below. Based on.
- FIG. 4b it is a schematic diagram of the second substrate prepared by step S103 and step S104.
- a spacer 104 corresponding to the recessed region 105 on the first substrate 101 is formed on the second substrate 102.
- the spacer 104 may reserve a space between the first substrate 101 and the second substrate 102 to fill a liquid crystal or the like.
- the function of supporting the first substrate 101 and the second substrate 102 is such that the spacers 104 are generally uniformly dispersed on the second substrate 102 such that the thickness of the substance such as liquid crystal is uniform.
- the material and shape of the spacer 104 affect the reaction speed, contrast, viewing angle, etc. of the display panel, and an organic column spacer 104 is generally selected, as shown in Figure 4b.
- the spacer 104 is used to control the gap between the two substrates to maintain the thickness of the liquid crystal or the like. During use, if the spacer 104 moves, a void is generated, causing light leakage of the display panel.
- step S103 and step S104 are not performed after step S102, and the two substrates may be produced simultaneously or at different times, and the order is not limited.
- Step S105 the first substrate 101 and the second substrate 102 are bonded to each other such that the spacers 104 are embedded in the recessed regions 105.
- FIG. 4c a schematic diagram of the first substrate 101 and the second substrate 102 after the bonding of the groups is performed, and the spacers 104 on the second substrate 102 are exactly embedded in the recessed regions 105 of the first substrate 101.
- the spacer 104 cannot be displaced due to being fixed, thereby reducing the occurrence of light leakage.
- FIG. 5 is a flow chart of a second embodiment of a method for manufacturing a curved display panel according to the present invention.
- FIGS. 6a-6e are cross-sectional views of a curved display panel in each step of the second embodiment, wherein the first substrate 201 is an array substrate, and the second is The substrate 205 is a color film substrate.
- the manufacturing method of the curved display panel specifically includes the following steps:
- FIG. 6a it is a schematic diagram of the switch tube structure 202 prepared through steps S201 and S202.
- a switch transistor structure 202 is formed on the first substrate 201, that is, the array substrate 201.
- the switch transistor 202 can be a thin film transistor TFT.
- the TFT structure 202 is first formed on the array substrate 201. This process can be performed by any process in the prior art.
- the source electrode and the drain electrode may be formed on the active layer by forming a gate electrode on the array substrate 201 first, then forming a first insulating layer and an active layer on the gate electrode, and finally forming a drain electrode on the drain electrode.
- the second insulating layer thereby forming the entire TFT structure 202.
- S203 forming a color resist layer 203 on the first substrate 201, and forming a recessed region 208 at a predetermined position of the color resist layer 203, wherein the color resist layer 203 covers the switch tube structure 202, and the predetermined position is The color resist layer 203 corresponds to the position of the switch tube structure 202;
- FIG. 6b it is a schematic diagram of the color resist layer 203 prepared by the step S203.
- a color resist layer 203 is coated on the TFT structure 202, the color resist layer 203 covers the TFT structure 202, and then a recessed region 208 is formed on the position of the color resist layer 203 corresponding to the TFT structure 202 by using a half exposure method.
- the amount of accumulated light perceived by the color resist is different, and the thickness of the color resist remaining after development is different.
- the size of the recessed area 208 depends on the design requirements of the product, and may range from 1 um to 100 um.
- the depth of the recessed area 208 is also determined according to product design requirements, and may be selected from 1/10 to 3/4 of the thickness of the color resist.
- S204 Forming the passivation layer 204 on the color resist layer 203 such that the passivation layer 204 entirely covers the color resist layer 203.
- FIG. 6c it is a schematic diagram of the passivation layer 204 prepared by the step S204.
- the passivation layer 204 covers the entire color resist layer 203. Therefore, the passivation layer 204 formed also has a recessed region 208 at the position corresponding to the TFT structure 202, and an ITO transparent conductive layer is further formed on the passivation layer 204, thereby completing the array substrate. Production of 201.
- FIG. 6d it is a schematic diagram of the second substrate 205 prepared through steps S205 to S207.
- a black matrix 206 is formed on the second substrate 205, that is, the color filter substrate 205.
- the fabrication of the black matrix 206 can be completed by a process such as exposure, development, and film removal, and the black matrix 206 can be formed before the spacer 207 is formed on the black matrix 206.
- An ITO transparent conductive layer is formed thereon, and then a spacer 207 is formed on the ITO transparent conductive layer, thereby completing the fabrication of the color filter substrate 205.
- the position of the black matrix 206 should correspond to the position of the TFT structure 202, which is mainly determined by the action of the black matrix 206.
- the function of the black matrix 206 has the following three aspects: one is to block and absorb external incident light, and avoid It irradiates the a-Si layer of the channel region of the TFT device directly or through reflection and scattering, causing deterioration of the off-state characteristic of the TFT device; second, the black matrix 206 functions to block the TFT electrode lead and the ITO pixel electrode on the array substrate 201. There is a light leakage between the gaps to avoid the contrast of the image. The third is to avoid the contrast between the liquid crystal cell and the image loss caused by the transverse electric field.
- the spacer 207 is formed on the black matrix 206, and when the spacer 207 is displaced, the black matrix 206 and the TFT structure are displaced, and the shielding effect is affected, thereby causing light leakage.
- the fabricated array substrate 201 and the color filter substrate 205 are bonded to each other to form a flat display panel, and the flat display panel is bent to form a curved display panel, and the spacer 207 on the color filter substrate 205 is formed. Just embedded in the recessed region 208 formed on the array substrate, so that when the flat display panel is bent, the spacer 207 cannot be displaced due to being fixed, and the contact layer on the spacer 207 and the array substrate 201 is reduced, such as the PI film. Friction to reduce the occurrence of light leakage.
- the manufacturing process of the array substrate 201 and the color filter substrate 205 may be performed synchronously or asynchronously, and the order is not fixed.
- the first substrate 201 may be a color film substrate
- the second substrate 205 may be an array substrate.
- FIG. 7 is a flow chart of a third embodiment of a method for manufacturing a curved display panel according to the present invention
- FIGS. 8a to 8d are cross-sectional views of the curved display panel in each step of the third embodiment.
- the manufacturing method of the curved display panel specifically includes the following steps:
- FIG. 8a it is a schematic diagram of the first substrate 301 formed after the step S301 to the step S304.
- the process of forming the switch tube structure 302 is similar to the steps S201 and S202 of the second embodiment, and details are not described herein.
- a color resist layer 303 is coated on the switch tube structure 302, and a passivation layer 304 is deposited on the color resist layer 303.
- FIG. 8b it is a schematic diagram of the recessed region 308 formed after the step S304 is performed.
- the recessed region 308 is formed by the half exposure method, and the predetermined position is cleared by dry etching, that is, the passivation at the corresponding position of the switch tube structure 302.
- the layer 304 is further removed by the oxygen or inert gas to remove the color resistance of the recessed region 308, and the color resist in the recessed region 308 is exposed through the passivation layer 304.
- the ITO transparent conductive layer, the PI film surface, and the like are formed on the passivation layer 304.
- the color resist is processed by the ITO and PI processes.
- the high temperature action, the organic matter in the color group will be discharged from the recessed area 308, which is very helpful for improving the phenomenon of liquid crystal bubbles and afterimages.
- step S306 to step S308 is similar to the process of step S205 to step S207 of the second embodiment, and details are not described herein again.
- the spacers 307 on the second substrate 305 are just embedded in the recessed regions 308 of the first substrate 301, and the spacers 307 and the recessed regions 308 are disposed.
- the color resistance is directly contacted, and the materials of the two are generally organic materials, and the binding force between the organic matter and the organic material is relatively high.
- the curved display panel is bent, it is less prone to displacement than the second embodiment of the present invention, thereby greatly Reduce the occurrence of light leakage.
- the present invention describes in detail a method for fabricating a curved display panel by the above three embodiments.
- the spacer 307 on the second substrate 305 is just embedded.
- the first substrate 301 is colored in the recessed region 308 of the resist layer 303, so that when the curved display panel is bent, the spacer 307 is fixed and cannot be displaced, thereby reducing the occurrence of light leakage.
- the first embodiment of the curved display panel of the present invention includes:
- the switch tube structure 402 is disposed on the first substrate 401;
- the color resist layer 403, the color resist layer 403 is disposed on the first substrate 401 and covers the switch tube structure 402, the color resist layer 403 is provided with a recessed area 408 at a corresponding position of the switch tube structure 402;
- a passivation layer 404 is disposed on the color resist layer 403 and entirely covered;
- the spacer 407 is disposed on the black matrix 406, and the spacer 407 is embedded in the recessed region 408.
- the spacer 407 of the second substrate 405 is just embedded in the recessed region 408 of the first substrate 401, so that when the display panel is bent, the spacer 407 is fixed by the recessed region 408 and cannot be displaced. Reduce light leakage and reduce the yield loss of the display panel.
- the second embodiment of the curved display panel of the present invention includes:
- the switch tube structure 502 is disposed on the first substrate 501;
- the color resist layer 503, the color resist layer 503 is disposed on the first substrate 501 and covers the switch tube structure 502, the color resist layer 503 is provided with a recessed area 508 at a corresponding position of the switch tube structure 502;
- a passivation layer 504 is disposed on the color resist layer 503, and the color resist layer 503 at the recessed region 508 is exposed through the passivation layer 504;
- the spacer 507 is disposed on the black matrix 506, and the spacer 507 is embedded in the recessed region 508.
- the spacer 507 on the second substrate 505 is embedded in the recessed region 508 of the first substrate 501, and the bonding force between the organic material and the organic material is high.
- the spacer is Since the object 507 is fixed and cannot be displaced, the corresponding black matrix 506 can not be misaligned, and the surface of the spacer 507 contacting with it can also avoid the friction caused by the displacement, thereby greatly improving the light leakage phenomenon after the display panel is bent, and at the same time Since the color resisting recessed region 508 is not blocked by the passivation layer 504, the color resisting foreign matter is volatilized under the high temperature of the subsequent processes, such as ITO, PI, etc., thereby greatly reducing the contamination of the liquid crystal by the color resisting foreign matter after the group, and further improving the surface display.
- the yield of panel products reduces losses.
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Abstract
一种曲面显示面板的制造方法,包括:提供一第一基板(101,201,301,401,501);在第一基板(101,201,301,401,501)上形成色阻层(103,203,303,403,503),并在色阻层(103,203,303,403,503)的预定位置形成一凹陷区域(105,208,308,408,508);提供一第二基板(102,205,305,405,505);在第二基板(102,205,305,405,505)上形成隔垫物(104,207,307,407,507);将第一基板(101,201,301,401, 501)与第二基板(102,205,305,405,505)进行对组贴合,使得隔垫物(104,207,307,407,507)嵌入凹陷区域(105,208,308,408,508)内。一种曲面显示面板,通过上述方式,能够使得曲面显示面板的隔垫物(104,207,307,407,507)嵌入凹陷区域(105,208,308,408,508)内,从而在曲面显示面板弯曲时,隔垫物(104,207,307,407,507)不会随之发生位移,减少漏光现象的发生,降低显示面板的良率损失。
Description
【技术领域】
本发明涉及显示面板领域,特别是涉及一种曲面显示面板及其制造方法。
【背景技术】
薄曲面显示器由于具有更出色的对比度、更广泛的视角及沉浸式体验,为用户提供根据更具深度的观赏感受。在曲面显示器应用中,由于面板会有一定程度的弯曲,使得组成面板的上下两块基板之间会产生相对错位,导致设置在一块基板上的黑矩阵的光遮效果受到影响,造成弯曲后的漏光现象。具体请参阅图1和图2所示,其中,图1是面板11没有弯曲时,黑矩阵12的遮光情况,图2是面板11弯曲后,黑矩阵12的遮光情况,可以看出,图2中面板11弯曲后,面板11上的隔垫物13发生位移导致漏光现象。传统VA模式中的解决方法是将BM
遮光层加大,但是该方法将牺牲掉至少20%的穿透率,大大降低了产品的特性。
【发明内容】
本发明主要解决的技术问题是提供一种曲面显示面板及其制造方法,能够在不牺牲产品穿透率的前提下,改善曲面弯曲后产品的漏光现象。
为解决上述技术问题,本发明采用的一个技术方案是:提供一种曲面显示面板的制造方法,包括:
提供一第一基板;
在第一基板上形成开关管结构;
在第一基板上形成色阻层,色阻层覆盖开关管结构,并在色阻层对应开关管结构的位置上形成一凹陷区域;
提供一第二基板;
在第二基板上形成黑矩阵;
在黑矩阵上形成隔垫物;
将第一基板与第二基板进行对组贴合,使得隔垫物嵌入凹陷区域内。
为解决上述技术问题,本发明采用的另一个技术方案是:提供一种曲面显示面板的制造方法,包括:
提供一第一基板;
在第一基板上形成色阻层,并在色阻层的预定位置形成一凹陷区域;
提供一第二基板;
在第二基板上形成隔垫物;
将第一基板与第二基板进行对组贴合,使得隔垫物嵌入凹陷区域内。
其中,在第一基板上形成色阻层,并在色阻层的预定位置形成一凹陷区域的步骤之前,进一步包括:
在第一基板上形成开关管结构;
其中,色阻层覆盖开关管结构,预定位置为色阻层对应于开关管结构的位置。
其中,第一基板为阵列基板,开关管为薄膜晶体管。
其中,在第二基板上形成隔垫物的步骤之前,进一步包括:
在第二基板上形成黑矩阵;
其中,隔垫物形成于黑矩阵上。
其中,第二基板为彩膜基板。
其中,凹陷区域是利用半曝光方式在色阻层的预定位置进行部分曝光而形成的。
其中,凹陷区域的大小为1um-100um,凹陷区域的深度为色阻层的厚度的1/10-3/4。
其中,在第一基板上形成色阻层,并在色阻层的预定位置形成一凹陷区域的步骤包括:
在基板上形成色阻层;
在色阻层上形成钝化层;
在色阻层及钝化层上的预定位置形成凹陷区域,以使凹陷区域处的色阻层经钝化层外露。
其中,在色阻层及钝化层上的预定位置形成凹陷区域的步骤包括:
利用干蚀刻方式清除预定位置处的钝化层;
利用氧气或惰性气体将预定位置处的色阻层去除,形成凹陷区域。
其中,在第一基板上形成色阻层,并在色阻层的预定位置形成一凹陷区域的步骤之后,进一步包括:
在色阻层上形成钝化层,使得钝化层整体覆盖色阻层。
为解决上述技术问题,本发明采用的又一个技术方案是:提供一种曲面显示面板,包括:
第一基板;
色阻层,色阻层设在第一基板上,并在预定位置形成一凹陷区域;
第二基板;
隔垫物,隔垫物设在第二基板上,且隔垫物嵌入凹陷区域内。
其中,曲面显示面板还包括:
开关管结构,设置在第一基板上,其中色阻层覆盖开关管结构,预定位置为色阻层对应于开关管结构的位置;
黑矩阵,设置在第二基板上,其中隔垫物设置在黑矩阵上。
其中,曲面显示面板还包括:
钝化层,钝化层设在色阻层上并整体覆盖。
其中,曲面显示面板还包括:
钝化层,钝化层设在色阻层上,且凹陷区域处的色阻层经钝化层外露。
其中,钝化层在凹陷区域上的部分为利用干蚀刻方式清除;
色阻层在凹陷区域上的部分为利用氧气或惰性气体去除,从而形成凹陷区域。
其中,凹陷区域是利用半曝光方式在色阻层的预定位置上进行部分曝光而形成。
本发明的有益效果是:区别于现有技术的情况,本发明通过提供一第一基板,在第一基板上形成色阻层,并在色阻层的预定位置形成一凹陷区域,同时提供一第二基板,在第二基板上形成隔垫物,将第一基板与第二基板进行对组贴合,使得隔垫物嵌入凹陷区域内。本发明通过这种方式,使得曲面显示面板的隔垫物嵌入凹陷区域内,从而在曲面显示面板弯曲时,隔垫物不会随之发生位移,减少漏光现象的发生,降低显示面板的良率损失。
【附图说明】
图1是现有技术曲面显示面板的结构示意图;
图2是现有技术曲面显示面板弯曲后的结构示意图;
图3是本发明曲面显示面板的制造方法实施例一的流程图;
图4a-图4c是本发明实施例一各步骤中曲面显示面板的断面图;
图5是本发明曲面显示面板的制造方法实施例二的流程图;
图6a-图6e是本发明实施例二各步骤中曲面显示面板的断面图;
图7是本发明曲面显示面板的制造方法实施例三的流程图;
图8a-图8d是本发明实施例三各步骤中曲面显示面板的断面图;
图9是本发明曲面显示面板实施例一的结构示意图;
图10是本发明曲面显示面板实施例二的结构示意图。
【具体实施方式】
为使本领域的技术人员更好地了解本发明的技术方案,下面结合附图和具体实施方式对本发明所提供的一种曲面显示面板及其制造方法做进一步详细描述。
图3是本发明曲面显示面板的制造方法实施例一的流程图,图4a-图4c是本实施例一各步骤中显示面板的断面图,如图3和图4所示,该曲面显示面板的制造方法具体包括以下步骤:
S101:提供一第一基板101;
S102:在第一基板101上形成色阻层103,并在色阻层103的预定位置形成一凹陷区域105;
具体地,如图4a所示,为通过步骤S101和步骤S102制备出的第一基板的示意图。通过半曝光方式在色阻层103的预定位置进行部分曝光形成凹陷区域105,在曝光过程中,因色阻感受到的积光量不同,显影后留下的色阻厚度也不同,因此,凹陷区域105的大小视产品设计需求而定,可选1um-100um不等,凹陷区域105的深度同样视产品设计需求而定,可选为色阻厚度的1/10到3/4不等。
这里所说的预定位置通常是指能够遮挡光线防止漏光现象产生的位置,预定位置的个数,形成凹陷区域105的个数并不限定,以与下面阐述的隔垫物104的个数相匹配为依据。
S103:提供一第二基板102;
S104:在第二基板102上形成隔垫物104;
具体地,如图4b所示,为通过步骤S103和步骤S104制备出的第二基板的示意图。在第二基板102上形成对应于第一基板101上凹陷区域105的隔垫物104,隔垫物104可为第一基板101和第二基板102之间预留空间以填充液晶等物质,同时起到支撑第一基板101和第二基板102的作用,因此,隔垫物104通常是均匀分散在第二基板102上,以使得填充液晶等物质的厚度一致。隔垫物104的材料和形状对显示面板的反应速度、对比度、视角等都产生影响,通常选用的是有机柱状隔垫物104,如图4b中所示。
隔垫物104用来控制两块基板之间的间隙以保持液晶等物质的厚度,在使用过程中,如果隔垫物104移动会产生空洞,造成显示面板的漏光现象。
需要说明的是,步骤S103及步骤S104并不是在步骤S102之后进行,这两块基板的制作可以同时或不同时进行,顺序并不限定。
步骤S105:将第一基板101与第二基板102进行对组贴合,使得隔垫物104嵌入凹陷区域105内。
具体地,如图4c所示,是进行对组贴合后第一基板101和第二基板102的示意图,第二基板102上的隔垫物104正好嵌入第一基板101的凹陷区域105内,使得当曲面显示面板弯曲时,隔垫物104由于被固定而无法发生位移,减少漏光现象的发生。
图5是本发明曲面显示面板的制造方法实施例二的流程图,图6a-图6e为本实施例二各步骤中曲面显示面板的断面图,其中,第一基板201选用阵列基板,第二基板205选用彩膜基板。如图5和图6所示,该曲面显示面板的制造方法具体包括以下步骤:
S201:提供一第一基板201;
S202:在第一基板201上形成开关管结构202;
具体地,如图6a所示,为通过步骤S201和步骤S202制备出的开关管结构202的示意图。在第一基板201即阵列基板201上形成开关管结构202,开关管202可选为薄膜晶体管TFT,在阵列基板201上首先形成TFT结构202,这个过程可采用现有技术中的任一工艺得以实现,比如可通过首先在阵列基板201上形成栅电极,然后在栅电极上依次形成第一绝缘层和有源层,进而在有源层上形成源电极和漏电极,最后在漏电极上形成第二绝缘层,由此形成整个TFT结构202。
S203:在第一基板201上形成色阻层203,并在色阻层203的预定位置形成一凹陷区域208,其中,所述色阻层203覆盖所述开关管结构202,所述预定位置为所述色阻层203对应于所述开关管结构202的位置;
具体地,如图6b所示,为通过步骤S203制备出的色阻层203的示意图。形成TFT结构202后,在TFT结构202上涂布色阻层203,色阻层203覆盖TFT结构202,然后使用半曝光方式在色阻层203对应TFT结构202的位置上制作凹陷区域208,在曝光过程中,因色阻感受到的积光量不同,显影后留下的色阻厚度不同。凹陷区域208的大小视产品设计需求而定,可选1um—100um不等,凹陷区域208的深度同样视产品设计需求而定,可选为色阻厚度的1/10到3/4不等。
S204:在色阻层203上形成钝化层204,使得钝化层204整体覆盖色阻层203。
具体地,如图6c所示,为通过步骤S204制备出的钝化层204的示意图。钝化层204由于覆盖整个色阻层203,因此形成的钝化层204在对应TFT结构202的位置也会有一凹陷区域208,在钝化层204上进一步制作ITO透明导电层,从而完成阵列基板201的制作。
S205:提供一第二基板205;
S206:在第二基板205上形成黑矩阵206;
S207:在黑矩阵206上形成隔垫物207;
具体地,如图6d所示,为通过步骤S205-步骤S207制备出的第二基板205的示意图。
在第二基板205即彩膜基板205上制作黑矩阵206,黑矩阵206的制作可通过曝光、显影、脱膜等制程完成,在黑矩阵206上形成隔垫物207之前可先在黑矩阵206上形成ITO透明导电层,然后在ITO透明导电层上形成隔垫物207,从而完成彩膜基板205的制作。
其中,黑矩阵206的形成位置应该对应于TFT结构202的位置,这主要是由黑矩阵206的作用来决定,黑矩阵206的作用有以下三个方面:一是阻挡和吸收外界入射光线,避免其直接或通过反射与散射间照射到TFT器件沟道区的a-Si层上,引起TFT器件关态特性的劣化;二是黑矩阵206起到遮挡阵列基板201上TFT电极引线与ITO像素电极之间有存在间隙而产生的漏光,避免图像对比度的降低,三是避免于液晶盒在受横向电场作用时,在像素边缘会发生颠倒倾斜取向缺陷,而导致的对比度降低及残像现象。隔垫物207形成与黑矩阵206上,隔垫物207发生位移时会带动其上的黑矩阵206与TFT结构产生错位,遮挡效果受到影响,从而产生漏光现象。
S208:将第一基板201与第二基板205进行对组贴合,使得隔垫物207嵌入凹陷区域208内。
如图6e所示,将制作完成的阵列基板201和彩膜基板205进行对组贴合,形成平面显示面板,对平面显示面板进行弯曲形成曲面显示面板,彩膜基板205上的隔垫物207正好嵌入阵列基板上形成的凹陷区域208内,从而使得对平面显示面板进行弯曲时,隔垫物207由于被固定而无法发生位移,减少隔垫物207与阵列基板201上接触层面,如PI膜的摩擦,减少漏光现象的产生。
需要说明的是,阵列基板201与彩膜基板205制作过程可同步或不同步记进行,顺序并不固定。在其他实施例中,第一基板201可选为彩膜基板,第二基板205可选为阵列基板。
图7是本发明曲面显示面板的制造方法实施例三的流程图,图8a-图8d为本实施例三各步骤中曲面显示面板的断面图。如图7和图8所示,该曲面显示面板的制造方法具体包括以下步骤:
S301:提供一基板;
S302:在基板上形成开关管结构302;
S303:在基板上形成色阻层303;
S304:在色阻层303上形成钝化层304;
如图8a所示,是执行步骤S301至步骤S304之后形成的第一基板301的示意图,开关管结构302的形成过程与上述实施例二的步骤S201和步骤S202相类似,在此不再赘述。在开关管结构302上涂布色阻层303,在色阻层303上沉积钝化层304。
S305:在色阻层303及钝化层304上的预定位置形成凹陷区域308,以使凹陷区域308处的色阻层303经钝化层304外露。
如图8b所示,是执行步骤S304之后形成的凹陷区域308的示意图,利用半曝光方式进行凹陷区域308的制作,利用干蚀刻方式清除预定位置,也即开关管结构302对应位置上的钝化层304,再利用氧气或惰性气体将凹陷区域308的色阻去除,凹陷区域308内的色阻经钝化层304外露。
在钝化层304上进行ITO透明导电层、PI膜面的制作等,在这个过程中,由于色阻层303凹陷区域308的位置上没有钝化层304的覆盖,色阻经过ITO、PI制程的高温作用,色组内的有机物将从凹陷区域308内排出,对改善液晶气泡、残像等现象有很大帮助。
S306:提供一第二基板305;
S307:在第二基板305上形成黑矩阵306;
S308:在黑矩阵306上形成隔垫物307;
具体地,参阅图8c,步骤S306-步骤S308的制作过程与上述实施例二步骤S205至步骤S207的过程相类似,在此不再赘述。
S309:将第一基板301与第二基板305进行对组贴合,使得隔垫物307嵌入凹陷区域308内。
参阅图8d,第一基板301与第二基板305对组贴合后,第二基板305上的隔垫物307正好嵌入第一基板301的凹陷区域308内,隔垫物307与凹陷区域308内的色阻直接接触,两者的材料通常均为有机物,有机物与有机物的对顶结合力相对较高,在曲面显示面板弯曲时,相比本发明实施例二,更加不容易产生位移,从而大大减少漏光现象的产生。
本发明通过上述三个实施例详细描述了一种曲面显示面板的制作方法,通过将第一基板301与第二基板305进行对组贴合,使得第二基板305上的隔垫物307正好嵌入第一基板301上色阻层303的凹陷区域308内,从而使得曲面显示面板弯曲时,隔垫物307被固定无法发生位移,减少漏光现象的产生。
如图9所示,本发明曲面显示面板实施例一,包括:
第一基板401;
开关管结构402,设置在第一基板401上;
色阻层403,色阻层403设在第一基板401上并覆盖开关管结构402,色阻层403在开关管结构402对应位置上设有凹陷区域408;
钝化层404,钝化层404设在色阻层403上并整体覆盖;
第二基板405;
黑矩阵406,设置在第二基板405上;
隔垫物407,设置在黑矩阵406上,隔垫物407嵌入凹陷区域408内。
本实施例一的曲面显示面板,第二基板405的隔垫物407正好嵌入第一基板401的凹陷区域408内,从而使得显示面板弯曲时,隔垫物407被凹陷区域408固定无法产生位移,减少漏光现象,降低显示面板的良率损失。
如图10所示,本发明曲面显示面板实施例二,包括:
第一基板501;
开关管结构502,设置在第一基板501上;
色阻层503,色阻层503设在第一基板501上并覆盖开关管结构502,色阻层503在开关管结构502对应位置上设有凹陷区域508;
钝化层504,钝化层504设在色阻层503上,且凹陷区域508处的色阻层503经钝化层504外露;
第二基板505;
黑矩阵506,设置在第二基板505上;
隔垫物507,设置在黑矩阵506上,隔垫物507嵌入凹陷区域508内。
本实施例二的曲面显示面板,因第二基板505上的隔垫物507嵌入第一基板501的凹陷区域508内,有机物与有机物的对顶结合力较高,显示面板的弯曲时,隔垫物507由于被固定而无法发生位移,相应的黑矩阵506也无法产生错位,隔垫物507与其相接触的面也可避免因位移产生的摩擦,从而大大改善显示面板弯曲后的漏光现象,同时由于色阻凹陷区域508上没有钝化层504遮挡,色阻异物在后续制程,如ITO、PI等制程的高温作用下挥发,大大降低对组后色阻异物对液晶的污染,进一步提高曲面显示面板产品的良率,降低损失。
以上所述仅为本发明的实施方式,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。
Claims (17)
- 一种曲面显示面板的制造方法,其中,包括:提供一第一基板;在所述第一基板上形成开关管结构;在所述第一基板上形成色阻层,所述色阻层覆盖所述开关管结构,并在所述色阻层对应所述开关管结构的位置上形成一凹陷区域;提供一第二基板;在所述第二基板上形成黑矩阵;在所述黑矩阵上形成隔垫物;将所述第一基板与所述第二基板进行对组贴合,使得所述隔垫物嵌入所述凹陷区域内。
- 一种曲面显示面板的制造方法,其中,包括:提供一第一基板;在所述第一基板上形成色阻层,并在所述色阻层的预定位置形成一凹陷区域;提供一第二基板;在所述第二基板上形成隔垫物;将所述第一基板与所述第二基板进行对组贴合,使得所述隔垫物嵌入所述凹陷区域内。
- 根据权利要求2所述的方法,其中,所述在所述第一基板上形成色阻层,并在所述色阻层的预定位置形成一凹陷区域的步骤之前,进一步包括:在所述第一基板上形成开关管结构;其中,所述色阻层覆盖所述开关管结构,所述预定位置为所述色阻层对应于所述开关管结构的位置。
- 根据权利要求3所述的方法,其中,所述第一基板为阵列基板,所述开关管为薄膜晶体管。
- 根据权利要求2所述的方法,其中,所述在所述第二基板上形成隔垫物的步骤之前,进一步包括:在所述第二基板上形成黑矩阵;其中,所述隔垫物形成于所述黑矩阵上。
- 根据权利要求5所述的方法,其中,所述第二基板为彩膜基板。
- 根据权利要求2所述的方法,其中,所述凹陷区域是利用半曝光方式在所述色阻层的所述预定位置进行部分曝光而形成的。
- 根据权利要求7所述的方法,其中,所述凹陷区域的大小为1um-100um,所述凹陷区域的深度为所述色阻层的厚度的1/10-3/4。
- 根据权利要求2所述的方法,其中,所述在所述第一基板上形成色阻层,并在所述色阻层的预定位置形成一凹陷区域的步骤包括:在所述基板上形成所述色阻层;在所述色阻层上形成所述钝化层;在所述色阻层及所述钝化层上的所述预定位置形成所述凹陷区域,以使所述凹陷区域处的色阻层经所述钝化层外露。
- 根据权利要求9所述的方法,其中,所述在所述色阻层及所述钝化层上的所述预定位置形成所述凹陷区域的步骤包括:利用干蚀刻方式清除所述预定位置处的钝化层;利用氧气或惰性气体将所述预定位置处的色阻层去除,形成所述凹陷区域。
- 根据权利要求2所述的方法,其中,所述在所述第一基板上形成色阻层,并在所述色阻层的预定位置形成一凹陷区域的步骤之后,进一步包括:在所述色阻层上形成钝化层,使得所述钝化层整体覆盖所述色阻层。
- 一种曲面显示面板,其中,包括:第一基板;色阻层,所述色阻层设在所述第一基板上,并在所述预定位置形成一凹陷区域;第二基板;隔垫物,所述隔垫物设在所述第二基板上,且所述隔垫物嵌入所述凹陷区域内。
- 根据权利要求12所述的曲面显示面板,其中,所述曲面显示面板还包括:开关管结构,设置在所述第一基板上,其中所述色阻层覆盖所述开关管结构,所述预定位置为所述色阻层对应于所述开关管结构的位置;黑矩阵,设置在所述第二基板上,其中所述隔垫物设置在所述黑矩阵上。
- 根据权利要求13所述的曲面显示面板,其中,所述曲面显示面板还包括:钝化层,所述钝化层设在所述色阻层上并整体覆盖。
- 根据权利要求13所述的曲面显示面板,其中,所述曲面显示面板还包括:钝化层,所述钝化层设在所述色阻层上,且所述凹陷区域处的所述色阻层经所述钝化层外露。
- 根据权利要求15所述的曲面显示面板,其中,所述钝化层在所述凹陷区域上的部分为利用干蚀刻方式清除;所述色阻层在所述凹陷区域上的部分为利用氧气或惰性气体去除,从而形成所述凹陷区域。
- 根据权利要求12所述的曲面显示面板,其中,所述凹陷区域是利用半曝光方式在所述色阻层的所述预定位置上进行部分曝光而形成。
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| CN106094360A (zh) * | 2016-08-22 | 2016-11-09 | 深圳市华星光电技术有限公司 | 曲面液晶显示面板 |
| CN109143669B (zh) * | 2018-09-19 | 2023-11-03 | 京东方科技集团股份有限公司 | 曲面显示面板及其制作方法、显示装置 |
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| CN104483773A (zh) * | 2014-12-12 | 2015-04-01 | 深圳市华星光电技术有限公司 | 一种曲面液晶显示面板及其制作方法 |
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| US10018877B2 (en) * | 2014-03-06 | 2018-07-10 | Lg Display Co., Ltd. | Liquid crystal display device |
| JP6340268B2 (ja) * | 2014-07-02 | 2018-06-06 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
| CN104317111A (zh) * | 2014-10-14 | 2015-01-28 | 深圳市华星光电技术有限公司 | 液晶显示面板 |
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- 2016-05-19 WO PCT/CN2016/082599 patent/WO2017152496A1/zh not_active Ceased
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