WO2017147996A1 - 调整显示器尺寸的方法 - Google Patents

调整显示器尺寸的方法 Download PDF

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Publication number
WO2017147996A1
WO2017147996A1 PCT/CN2016/080808 CN2016080808W WO2017147996A1 WO 2017147996 A1 WO2017147996 A1 WO 2017147996A1 CN 2016080808 W CN2016080808 W CN 2016080808W WO 2017147996 A1 WO2017147996 A1 WO 2017147996A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
substrate
retention portion
cutting line
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/080808
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English (en)
French (fr)
Inventor
陈杰
单迪克
孙世英
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US15/106,674 priority Critical patent/US9958717B1/en
Publication of WO2017147996A1 publication Critical patent/WO2017147996A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1341—Filling or closing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes

Definitions

  • the present application relates to the field of display, and in particular, to a method of adjusting the size of a display.
  • Displays are often used to display text or images. As display technologies continue to evolve, displays are used in a variety of applications. In various specific application scenarios, different specific performance characteristics of the display may be required. Therefore, different specific application scenarios in various fields require different sizes of displays. If the display is separately designed for each size, the design cost and Production costs will be higher. From an economic point of view, manufacturers have come up with a common design when producing displays, so that all displays have essentially the same features and uniform size specifications, so that these sizes can be changed in small batch production of other sizes of displays without In addition, the design reduces the design cost.
  • the end can be cut off; in the inspection and testing stage of the display, in order to adapt to the size of the test instrument, the display needs to be cut to adjust the size.
  • the display generally includes a first substrate and a second substrate.
  • the first substrate and the second substrate are flush at the cutting portion, so that only the The flat cross-section of the first substrate and the second substrate is coated with an adhesive.
  • the coating is too small, the contact area between the adhesive and the cross section is too small or the cross-section is uneven, and the adhesive is likely to be broken.
  • a phenomenon such as a large deviation in coating position causes a poor sealing between the first substrate and the second substrate.
  • the technical problem to be solved by the present application is to provide a method for adjusting the size of a display, which can sufficiently penetrate the adhesive between the first substrate and the second substrate of the display to avoid coating the adhesive. At the time, there is a problem of poor sealing due to a large deviation in coating position and breakage of the adhesive.
  • the application provides a method for adjusting the size of a display, and the method for adjusting the size of the display includes the following steps:
  • the display comprising a first substrate, a second substrate, and an image generation medium between the first substrate and the second substrate;
  • the binder is cured.
  • An edge of the adhesive penetrating between the first retention portion and the second retention portion is at least 0.1 mm from an edge of the first retention portion at the first cutting line.
  • edge of the first retention portion at the first cutting line is inwardly contracted with respect to the edge of the second retention portion at the second cutting line by a distance of 1 mm to 10 mm. .
  • the "curing the adhesive” may include:
  • the adhesive is cured by irradiating the adhesive with ultraviolet light, wherein the adhesive is a photocurable adhesive.
  • the "curing the adhesive” may include:
  • the adhesive is heated to cure the adhesive, wherein the adhesive is a thermosetting adhesive.
  • the first substrate is a thin film transistor array substrate
  • the second substrate is a color filter assembly.
  • the first substrate is a color filter assembly
  • the second substrate is a thin film transistor array substrate.
  • the image forming medium is a liquid crystal.
  • the method for adjusting the size of the display is adopted because the orthographic projection of the first cutting line on the second substrate does not overlap with the second cutting line, and along the first cutting Wire cutting the first substrate and the image forming medium to cut off the image forming medium of the first removing portion and the first removing portion corresponding portion, and forming the first remaining portion and the remaining portion image generation Media cutting the second substrate along the second cutting line to cut off the second removing portion to form the second retaining portion, the edge of the first retaining portion being opposite at the first cutting line Extending the edge of the second retaining portion at the second cutting line inwardly, causing the second retaining portion to protrude a part to form a protruding portion;
  • the length of the second retention portion is greater than the length of the first retention portion, that is, the length of the second substrate after being cut is larger than the length of the first substrate, thereby Forming a protrusion on the second retention portion;
  • an adhesive may be applied on the surface of the protruding portion facing the first retaining portion, since the protruding portion and the second retaining portion are in the same plane, and therefore the orientation of the protruding portion is applied.
  • the adhesive on the surface of the first retaining portion easily penetrates between the first retaining portion and the second retaining portion, so that the adhesive can be sufficiently infiltrated into the first retaining portion and Between the second retaining portions, the first retaining portion and the second retaining portion are sufficiently sealed to avoid coating position The phenomenon of large deviation and breakage of the adhesive is avoided, thereby avoiding the problem of poor sealing due to large deviation of the coating position and breakage of the adhesive.
  • FIG. 1 is a schematic view showing a laminated structure of a display in step S1 in the embodiment of the present application;
  • FIG. 2 is a schematic view showing a cutting line disposed on a display in step S2 in the embodiment of the present application;
  • step S3 is a schematic structural diagram of a display in step S3 of the embodiment of the present application.
  • FIG. 4 is a schematic view showing an adhesive in a protruding portion in the embodiment of the present application.
  • FIG. 5 is a schematic structural view of a display after the adhesive is cured in the embodiment of the present application.
  • connection In the description of the present application, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise specifically defined and defined.
  • the ground connection, or the integral connection may be a mechanical connection; it may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the ground connection or the integral connection; may be a mechanical connection; it may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the present application provides a method of adjusting the size of a display such that the size of the adjusted display is suitable for the corresponding use.
  • the display of the present application may include all the displays in the display field.
  • the liquid crystal display is taken as an example in the embodiment of the present application.
  • the method for adjusting the size of the display may include the following steps S1, S2, S3, S4, and S5.
  • the display made by the target size in the embodiment of the present application is referred to as a target display, that is, the display formed after cutting is the target display.
  • FIG. 1 is a schematic diagram of a laminated structure of the display in step S1 in the embodiment of the present application.
  • Step S1 providing a display including a first substrate 100, a second substrate 200, and an image generation medium 300 between the first substrate 100 and the second substrate 200.
  • the display to be resized is prepared first, wherein opposite ends of the display are sealed by the first sealing portion 410 and the second sealing portion 420, respectively.
  • one end of the display further includes a circuit board (not shown) for electrically connecting and driving the display, such as a flexible circuit board.
  • the present application installs the display.
  • This end of the circuit board is called the circuit connection end, that is, the left end in FIG. 1, and the other end is called the non-circuit end, that is, the right end in FIG.
  • the first substrate 100 may be a color filter assembly.
  • the second substrate 200 may be a thin film transistor array substrate; It is understood that the first substrate 100 may also be a thin film transistor array substrate.
  • the second substrate 200 may be a color filter assembly; and the first substrate 100 and the second substrate 200 are located.
  • the image forming medium 300 may be a liquid crystal.
  • FIG. 2 is a schematic diagram of setting a cutting line on the display in step S2 in the embodiment of the present application.
  • Step S2 providing a first cutting line on the first substrate 100, a second cutting line on the second substrate 200, an orthographic projection of the first cutting line on the second substrate, and the The second cutting lines do not overlap.
  • a first cutting line is disposed at a position 110 on the first substrate 100 to determine a boundary between the first retention portion 120 and the first removal portion 130, and a position 210 on the second substrate 200 Providing a second cutting line to determine a boundary between the second retention portion 220 and the second removal portion 230 such that the first retention portion 120 and the second retention portion 220 are located at the same end of the display, and The orthographic projection of the first cutting line on the second substrate 200 does not overlap the second cutting line.
  • the first retention portion 120 is a portion of the first substrate 100 that remains as a component of the target display during the subsequent cutting process; the first removal portion 130 is the first substrate 100 in the subsequent The part to be removed during the cutting process, which is not part of the target display.
  • the second retention portion 220 is a portion of the second substrate 200 that remains as a component of the target display during subsequent cutting; the second removal portion 230 is the second substrate 200 that is subsequently cut. The part to be removed during the process, which is not part of the target display.
  • the first retention portion 120 and the second retention portion 220 are located at the circuit connection end.
  • the orthographic projection of the first cutting line on the second substrate 200 does not overlap with the second cutting line, that is, the remaining portion of the first substrate 100 and the remaining portion of the second substrate 200 Dimensions are different.
  • it is preferable that the size of the remaining portion of the second substrate 200 is larger than the size of the remaining portion of the first substrate 100.
  • FIG. 3 is a schematic structural diagram of the first step of removing the first removing portion 130 and the second removing portion 230 in the step 3 of the embodiment of the present application.
  • Step S3 cutting the first substrate 100 and the image forming medium 300 along the first cutting line to form a first retention portion 120 and a portion of the image generation medium 300 corresponding to the first retention portion. Cutting the second substrate 200 along the second cutting line to form a second retention portion 220 disposed in a stack with the first retention portion 120, the first retention portion 120 at the first cutting line The edge is inwardly contracted relative to the edge of the second retention portion 220 at the second cutting line to form a protrusion 240 at the edge of the second retention portion 220.
  • the first substrate 100 and the image forming medium 300 are cut along the first cutting line to cut off the image forming medium of the first removing portion 130 and the corresponding portion of the first removing portion 130. 300.
  • the first retention portion 120 and the retention portion image generation medium are formed, and the second substrate 200 is cut along the second cutting line to cut off the second removal portion 230 to form the second retention portion 220.
  • the edge of the first retention portion 120 at the first cutting line is inwardly contracted with respect to the edge of the second retention portion 220 at the first cutting line, so that the second retention portion 220 is opposite A portion of the first retention portion 120 protrudes to form a protrusion 240.
  • the first substrate 100 and the image forming medium 300 corresponding to the first substrate 100 are cut along the first cutting line at a position 110 of the first substrate 100, thereby removing the first removing portion.
  • the image forming medium 300 corresponding to the portion of the first removing portion 130 is removed, and the size of the first substrate 100 is reduced; and the first cutting line is cut at the position 210 of the second substrate 100.
  • the second substrate 200 is removed, so that the second removing portion 230 is removed, and the size of the second substrate 200 is reduced, that is, the second retaining portion 220 is protruded with respect to the first retaining portion 120 to form a portion.
  • the protruding portion 240; that is, the first retaining portion 120 and the second retaining portion 220 form a step.
  • the protruding portion 240 protrudes from the edge of the first retaining portion 120 at the edge of the first cutting line by a distance of 1 mm to 10 mm, that is, the first retaining portion 120 is
  • the distance at which the edge at the first cutting line is contracted inward relative to the edge of the second retention portion 220 at the second cutting line may be in the range of 1 mm to 10 mm.
  • the cutting process of the first substrate 100 and the second substrate 200 may be performed simultaneously, or the first substrate 100 may be cut first, then the second substrate 200 may be cut, or the second substrate may be cut first. 200, the first substrate 100 is cut again.
  • the projections 240 are used to carry the adhesive when the adhesive is subsequently applied.
  • FIG. 4 is an illustration of adding an adhesive to the protruding portion in the embodiment of the present application. intention.
  • Step S4 adding an adhesive 430 to the surface of the protruding portion 240 facing the first retaining portion 120, so that the adhesive 430 penetrates into the first retaining portion 120 and the second retaining portion 220 In between, the adhesive 430 seals the gap between the second retention portions 220 of the first retention portion 120 and prevents the image generation medium 300 from leaking out.
  • the adhesive 430 is added along an edge of the first retaining portion 120 at the first cutting line on a surface of the protruding portion 240 facing the first retaining portion 120, such that The adhesive 430 abuts the first retention portion 120.
  • the adhesive 430 may be infiltrated between the first retention portion 120 and the second retention portion 220 by adding pressure to the surface of the adhesive 430.
  • the adhesive 430 may also be sufficiently infiltrated between the first retention portion 120 and the second retention portion 220 by a siphon principle.
  • an edge of the adhesive 430 that penetrates between the first retention portion 120 and the second retention portion 220 is at least 0.1 from an edge of the first retention portion 120 at the first cutting line. Millimeter.
  • FIG. 5 is a schematic structural view of the display after the adhesive is cured in the embodiment of the present application.
  • Step S5 curing the adhesive 430.
  • the adhesive 430 is cured by ultraviolet light, wherein the adhesive 430 may be a photocurable adhesive.
  • the adhesive 430 can be heated to cure the adhesive 430, wherein the adhesive 430 can be a thermosetting adhesive.
  • the adjustment of the display size is substantially completed to form the size of the target display.
  • the related circuit may be connected to the circuit connection end.
  • the backlight module may be subsequently attached to the second retention portion 220.
  • the front projection of the first cutting line on the second substrate 200 is not overlapped with the second cutting line, and the first substrate 100 is cut along the first cutting line.
  • the image generating medium 300 is configured to cut off the image forming medium 300 corresponding to the first removing portion 130 and the first removing portion 130 to form the first retaining portion 120 and the retaining portion image generating medium. Cutting the second substrate 200 along the second cutting line to cut off the second removing portion 230 to form the second retaining portion 220, the first retaining portion 120 at the first cutting line
  • the edge of the second retaining portion 220 at the second cutting line is inwardly contracted, so that the second retaining portion 220 protrudes a part, forming a protrusion 240;
  • the length of the second retention portion 220 is greater than the length of the first retention portion 120, that is, the length of the second substrate 200 after being cut is longer than the length of the first substrate 100. Large, thereby forming a protrusion 240 on the second retention portion 220;
  • an adhesive 430 may be applied on the surface of the protruding portion 240 facing the first retaining portion 120. Since the protruding portion 240 and the second retaining portion 220 are in the same plane, The adhesive 430 on the surface of the protrusion 240 facing the first retention portion 120 easily penetrates between the first retention portion 120 and the second retention portion 220, so that the adhesion can be made The agent fully penetrates between the first retaining portion 120 and the second retaining portion 220 to sufficiently seal the first retaining portion 120 and the second retaining portion 220, thereby avoiding large deviation of the coating position. The phenomenon that the adhesive is broken, thereby avoiding the problem of poor sealing due to large deviation of the coating position and breakage of the adhesive.

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  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

一种调整显示器尺寸的方法，包括步骤：提供一显示器，显示器包括第一基板（100）、第二基板（200）以及位于第一基板（100）和第二基板（200）之间的图像生成介质（300）；在第一基板（100）上设置第一切割线，在第二基板（200）上设置第二切割线，且第一切割线在第二基板（200）上的正投影与第二切割线不重叠；沿第一切割线切割第一基板（100）及图像生成介质（300），形成第一保留部（120）及对应的部分图像生成介质（300），沿第二切割线切割第二基板（200），形成第二保留部（220），第二保留部（220）相对于第一保留部（120）突出一部分，形成突出部（240）；在突出部（240）的朝向第一保留部（120）的表面加粘合剂（430），使粘合剂（430）渗入第一保留部（120）和第二保留部（220）之间；固化所述粘合剂（430）。可避免因涂布位置偏差大、粘合剂断线而引起的密封不良问题。

Description

调整显示器尺寸的方法
本发明要求2016年3月2日递交的发明名称为“调整显示器尺寸的方法”的申请号201610119270.3的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本申请涉及显示领域，尤其涉及一种调整显示器尺寸的方法。
背景技术
显示器通常用来显示文本或者图像，随着显示技术的不断发展，显示器在各个领域均有应用。在各种具体的应用情境下，可能需要显示器的不同的特定的性能特征，因此，各个领域中不同的具体应用情境需要不同尺寸的显示器，若针对每一种尺寸都单独设计显示器，设计成本及生产成本都会较高。从经济角度来考虑，制造商在生产显示器时提出通用的设计方案，使所有显示器具有基本相同的特征和统一的尺寸规格，这样，可以在小批量生产其他规格的显示器时改变这些尺寸，而无需另外设计，降低设计成本。此外，在批量生产中若显示器的非电路密集端出现显示不良时，可以将该端切除；在显示器的检查测试阶段，为了适应测试仪器的尺寸，也需要切割显示器以调整尺寸。
在现有技术中，通常是先制作好一定尺寸的显示器，然后切割成所需尺寸的显示器，涂上粘合剂，并将粘合剂固化，然后连接相关电路，完成所需尺寸的显示器的制作。
显示器通常包括第一基板和第二基板，在现有的切割显示器的方式中，切割完成后，所述第一基板和所述第二基板在切割处的断面平齐，这样的话，只能从所述第一基板和所述第二基板的平齐的断面涂布粘合剂，涂布时，因粘合剂与断面的接触面积过小或者断面凹凸不平，容易出现粘合剂断线，涂布位置偏差大等现象，从而导致第一基板和第二基板之间密封不良。
发明内容
本申请所要解决的技术问题在于，提供一种调整显示器尺寸的方法，所述方法可以使粘合剂充分渗入所述显示器的第一基板和第二基板之间，避免涂布所述粘合剂时出现因涂布位置偏差大、粘合剂断线而引起的密封不良问题。
为了解决上述技术问题，本申请采用以下技术方案：
本申请提供一种调整显示器尺寸的方法，所述调整显示器尺寸的方法包括如下步骤：
提供一显示器，所述显示器包括第一基板、第二基板以及位于所述第一基板和所述第二基板之间的图像生成介质；
在所述第一基板上设置第一切割线，在所述第二基板上设置第二切割线，所述第一切割线在所述第二基板上的正投影与所述第二切割线不重叠；
沿所述第一切割线切割所述第一基板及所述图像生成介质，以形成第一保留部及与所述第一保留部对应的部分所述图像生成介质，沿所述第二切割线切割所述第二基板，以形成与所述第一保留部层叠设置的第二保留部，所述第一保留部在所述第一切割线处的边缘相对于所述第二保留部在所述第二切割线处的边缘向内收缩，以形成位于所述第二保留部边缘处的突出部；
在所述突出部的朝向所述第一保留部的表面加粘合剂，使所述粘合剂渗入所述第一保留部和所述第二保留部之间；
固化所述粘合剂。
其中，所述“使所述粘合剂渗入所述第一保留部和所述第二保留部之间”包括：
渗入所述第一保留部和所述第二保留部之间的所述粘合剂的边缘距离所述第一保留部在所述第一切割线处的边缘至少0.1毫米。
其中，所述第一保留部在所述第一切割线处的边缘相对于所述第二保留部在所述第二切割线处的边缘向内收缩的距离在1毫米至10毫米的范围内。
其中，所述“在所述突出部的朝向所述第一保留部的表面加粘合剂，使所述粘合剂渗入所述第一保留部和所述第二保留部之间”包括：
在所述突出部的朝向所述第一保留部的表面上沿着所述第一保留部的在所述第一切割线处的边缘加入所述粘合剂；
通过在所述粘合剂的表面增加压力，使所述粘合剂渗入所述第一保留部和 所述第二保留部之间。
其中，所述“固化所述粘合剂”可以包括：
采用紫外光照射所述粘合剂，使所述粘合剂固化，其中，所述粘合剂为光固化型粘合剂。
其中，所述“固化所述粘合剂”可以包括：
对所述粘合剂加热，使所述粘合剂固化，其中，所述粘合剂为热固化型粘合剂。
其中，所述第一基板是薄膜晶体管阵列基板，所述第二基板是彩色滤光片组件。
其中，所述第一基板为彩色滤光片组件，所述第二基板为薄膜晶体管阵列基板。
其中，所述图像生成介质为液晶。
与现有技术相比，本申请的技术方案至少具有以下有益效果：
本申请的技术方案中，所采用的调整显示器尺寸的方法由于设置所述第一切割线在所述第二基板上的正投影与所述第二切割线不重叠，且沿所述第一切割线切割所述第一基板及所述图像生成介质，以切除所述第一除去部及所述第一除去部对应部位的所述图像生成介质，形成所述第一保留部及保留部图像生成介质，沿所述第二切割线切割所述第二基板，以切除所述第二除去部，形成所述第二保留部，所述第一保留部在所述第一切割线处的边缘相对于所述第二保留部在所述第二切割线处的边缘向内收缩，使所述第二保留部突出一部分，形成突出部；
即：所述显示器被切割后，所述第二保留部的长度比所述第一保留部的长度大，亦即经切割后所述第二基板的长度比第一基板的长度大，从而在所述第二保留部上形成突出部；
如此，可以在所述突出部的朝向所述第一保留部的表面上加粘合剂，由于所述突出部与所述第二保留部位于同一平面，因此，加在所述突出部的朝向所述第一保留部的表面上的粘合剂很容易渗入所述第一保留部和所述第二保留部之间，如此，可使所述粘合剂充分渗入所述第一保留部和所述第二保留部之间，使所述第一保留部和所述第二保留部之间得到充分密封，从而避免涂布位 置偏差大、粘合剂断线的现象，进而避免因涂布位置偏差大、粘合剂断线而引起的密封不良问题。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请的实施例中步骤S1中显示器的叠层结构示意图；
图2是本申请的实施例中步骤S2中在显示器上设置切割线的示意图；
图3是本申请的实施例的步骤S3中显示器的结构示意图；
图4是本申请实施例中在突出部加粘合剂的示意图；及
图5是本申请实施例中粘合剂固化后显示器的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
此外，以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请中所提到的方向用语，例如，“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等，仅是参考附加图式的方向，因此，使用的方向用语是为了更好、更清楚地说明及理解本申请，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员 而言，可以具体情况理解上述术语在本申请中的具体含义。
此外，在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其它工序无法明确区别时，只要能实现该工序所预期的作用则也包括在本用语中。另外，本说明书中用“～”表示的数值范围是指将“～”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的单元用相同的标号表示。
本申请提供调整显示器尺寸的方法，从而使调整后的显示器的尺寸适用于对应的用途。本申请所述的显示器可以包括显示领域的所有显示器，为了便于理解和叙述，本申请的实施例中以液晶显示器为例进行解说。
本申请的实施例中，调整显示器尺寸的方法可以包括以下步骤S1、S2、S3、S4及S5。为了便于叙述，本申请的实施例中把按目标尺寸制作而完成的显示器称为目标显示器，即下文中经过切割之后所形成的显示器为目标显示器。
关于步骤1，请参阅图1，图1是本申请的实施例中步骤S1中显示器的叠层结构示意图。
步骤S1：提供一显示器，所述显示器包括第一基板100、第二基板200以及位于所述第一基板100和所述第二基板200之间的图像生成介质300。
具体地，先准备好要调整尺寸的显示器，其中，所述显示器的相对的两端分别由第一密封部410及第二密封部420进行密封。在实际生产中，所述显示器的一端还包括用于电性连接及驱动显示的电路板(图中未示出)，例如柔性电路板，为了便于叙述，本申请将所述显示器的安装有所述电路板的这一端称为电路连接端，即图1中的左端，相对的另一端称为非电路端，即图1中的右端。
在调整所述显示器的尺寸的过程中，为了不影响所述电路连接端的电性功能，优选从所述非电路端切割，以将所述显示器的尺寸修改为目标尺寸。
以薄膜晶体管液晶显示器(TFT-LCD)为例，所述第一基板100可以是彩色滤光片组件，此时，所述第二基板200则可以是薄膜晶体管阵列基板；可以 理解，所述第一基板100也可以是薄膜晶体管阵列基板，此时，所述第二基板200则可以是彩色滤光片组件；而位于所述第一基板100和所述第二基板200之间的图像生成介质300则可以是液晶。
关于步骤S2，请参阅图2，图2是本申请实施例中步骤S2中在显示器上设置切割线的示意图。
步骤S2：在所述第一基板100上设置第一切割线，在所述第二基板200上设置第二切割线，所述第一切割线在所述第二基板上的正投影与所述第二切割线不重叠。
具体地，在所述第一基板100上的位置110处设置第一切割线，以确定第一保留部120和第一除去部130之间的界线，在所述第二基板200上的位置210处设置第二切割线，以确定第二保留部220和第二除去部230之间的界线，使所述第一保留部120和所述第二保留部220位于所述显示器的同一端，且所述第一切割线在所述第二基板200上的正投影与所述第二切割线不重叠。
具体地，所述第一保留部120是所述第一基板100在后续切割过程中保留下来作为目标显示器的一个组成部分的部位；所述第一除去部130是所述第一基板100在后续切割过程中要去掉的部位，该部位不作为目标显示器的组成部分。同样，所述第二保留部220是所述第二基板200在后续切割过程中保留下来作为目标显示器的一个组成部分的部位；所述第二除去部230是所述第二基板200在后续切割过程中要去掉的部位，该部位不作为目标显示器的组成部分。
图2中，分别用虚线示出所述第一保留部120和第一除去部130之间的界线和所述第二保留部220和第二除去部230之间的界线。
优选地，所述第一保留部120和所述第二保留部220位于所述电路连接端。所述第一切割线在所述第二基板200上的正投影与所述第二切割线不重叠，亦即：所述第一基板100的保留部位和所述第二基板200的保留部位的尺寸不同，在一个实施方式中，优选所述第二基板200的保留部位的尺寸大于所述第一基板100的保留部位的尺寸。
关于步骤S3，请一并参阅图2和图3，图3是本申请的实施例的步骤3中显示器切除第一除去部130和第二除去部230后的结构示意图。
步骤S3：沿所述第一切割线切割所述第一基板100及所述图像生成介质300，以形成第一保留部120及与所述第一保留部对应的部分所述图像生成介质300，沿所述第二切割线切割所述第二基板200，以形成与所述第一保留部120层叠设置的第二保留部220，所述第一保留部120在所述第一切割线处的边缘相对于所述第二保留部220在所述第二切割线处的边缘向内收缩，以形成位于所述第二保留部220边缘处的突出部240。
具体地，沿所述第一切割线切割所述第一基板100及所述图像生成介质300，以切除所述第一除去部130及所述第一除去部130对应部位的所述图像生成介质300，形成所述第一保留部120及保留部图像生成介质，沿所述第二切割线切割所述第二基板200，以切除所述第二除去部230，形成所述第二保留部220，所述第一保留部120在所述第一切割线处的边缘相对于所述第二保留部220在所述第一切割线处的边缘向内收缩，使所述第二保留部220相对于所述第一保留部120突出一部分，形成突出部240。
具体地，在所述第一基板100的位置110处沿所述第一切割线切割所述第一基板100及所述第一基板100对应的图像生成介质300，从而将所述第一除去部130及所述第一除去部130对应部位的所述图像生成介质300去掉，缩小所述第一基板100的尺寸；在所述第二基板100的位置210处沿所述第一切割线切割所述第二基板200，从而将所述第二除去部230去掉，缩小所述第二基板200的尺寸，即：使所述第二保留部220相对于所述第一保留部120突出一部分，形成突出部240；亦即：所述第一保留部120与所述第二保留部220形成台阶。优选地，所述突出部240相对于所述第一保留部120在所述第一切割线处的边缘突出的距离可以在1毫米至10毫米的范围内，即所述第一保留部120在所述第一切割线处的边缘相对于所述第二保留部220在所述第二切割线处的边缘向内收缩的距离可以在1毫米至10毫米的范围内。对所述第一基板100和所述第二基板200的切割过程，可以同时进行，也可以先切割所述第一基板100，再切割所述第二基板200，或者先切割所述第二基板200，再切割所述第一基板100。
所述突出部240用于后续涂布粘合剂时承载粘合剂。
关于步骤S4，请参阅图4，图4是本申请实施例中在突出部加粘合剂的示 意图。
步骤S4：在所述突出部240的朝向所述第一保留部120的表面加粘合剂430，使所述粘合剂430渗入所述第一保留部120和所述第二保留部220之间，以使所述粘合剂430密封所述第一保留部120所述第二保留部220之间的间隙，并防止所述图像生成介质300漏出。
具体地，在所述突出部240的朝向所述第一保留部120的表面上沿着所述第一保留部120的在所述第一切割线处的边缘加入所述粘合剂430，使所述粘合剂430紧靠所述第一保留部120。
在一个实施方式中，可以通过在所述粘合剂430的表面增加压力，使所述粘合剂430渗入所述第一保留部120和所述第二保留部220之间。
在另一个实施方式中，还可以通过虹吸原理使所述粘合剂430充分渗入所述第一保留部120和所述第二保留部220之间。
优选地，渗入所述第一保留部120和所述第二保留部220之间的所述粘合剂430的边缘距离所述第一保留部120在所述第一切割线处的边缘至少0.1毫米。
关于步骤S5，请参阅图5，图5是本申请实施例中粘合剂固化后显示器的结构示意图。
步骤S5：固化所述粘合剂430。
在一个实施方式中，采用紫外光照射所述粘合剂430，使所述粘合剂430固化，其中，所述粘合剂430可以是光固化型粘合剂。
在另一个实施方式中，可以对所述粘合剂430进行加热，使所述粘合剂430固化，其中，所述粘合剂430可以是热固化型粘合剂。
如此，基本上完成了显示器尺寸的调节，形成目标显示器的尺寸。
完成所述步骤S5之后，可以将相关电路连接至所述电路连接端，对于液晶显示器，后续可以将背光模组贴合于所述第二保留部220。
本实施例中，由于设置所述第一切割线在所述第二基板200上的正投影与所述第二切割线不重叠，且沿所述第一切割线切割所述第一基板100及所述图像生成介质300，以切除所述第一除去部130及所述第一除去部130对应部位的所述图像生成介质300，形成所述第一保留部120及保留部图像生成介质， 沿所述第二切割线切割所述第二基板200，以切除所述第二除去部230，形成所述第二保留部220，所述第一保留部120在所述第一切割线处的边缘相对于所述第二保留部220在所述第二切割线处的边缘向内收缩，使所述第二保留部220突出一部分，形成突出部240；
即：所述显示器被切割后，所述第二保留部220的长度比所述第一保留部120的长度大，亦即经切割后所述第二基板200的长度比第一基板100的长度大，从而在所述第二保留部220上形成突出部240；
如此，可以在所述突出部240的朝向所述第一保留部120的表面上加粘合剂430，由于所述突出部240与所述第二保留部220位于同一平面，因此，加在所述突出部240的朝向所述第一保留部120的表面上的粘合剂430很容易渗入所述第一保留部120和所述第二保留部220之间，如此，可使所述粘合剂充分渗入所述第一保留部120和所述第二保留部220之间，使所述第一保留部120和所述第二保留部220之间得到充分密封，从而避免涂布位置偏差大、粘合剂断线的现象，进而避免因涂布位置偏差大、粘合剂断线而引起的密封不良问题。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述的实施方式，并不构成对该技术方案保护范围的限定。任何在上述实施方式的精神和原则之内所作的修改、等同替换和改进等，均应包含在该技术方案的保护范围之内。

Claims (20)

  1. 一种调整显示器尺寸的方法，其中，包括如下步骤：
    提供一显示器，所述显示器包括第一基板、第二基板以及位于所述第一基板和所述第二基板之间的图像生成介质；
    在所述第一基板上设置第一切割线，在所述第二基板上设置第二切割线，所述第一切割线在所述第二基板上的正投影与所述第二切割线不重叠；
    沿所述第一切割线切割所述第一基板及所述图像生成介质，以形成第一保留部及与所述第一保留部对应的部分所述图像生成介质，沿所述第二切割线切割所述第二基板，以形成与所述第一保留部层叠设置的第二保留部，所述第一保留部在所述第一切割线处的边缘相对于所述第二保留部在所述第二切割线处的边缘向内收缩，以形成位于所述第二保留部边缘处的突出部；
    在所述突出部的朝向所述第一保留部的表面加粘合剂，使所述粘合剂渗入所述第一保留部和所述第二保留部之间；
    固化所述粘合剂。
  2. 如权利要求1所述的方法，其中，所述“使所述粘合剂渗入所述第一保留部和所述第二保留部之间”包括：
    渗入所述第一保留部和所述第二保留部之间的所述粘合剂的边缘距离所述第一保留部在所述第一切割线处的边缘至少0.1毫米。
  3. 如权利要求1所述的方法，其中，所述第一保留部在所述第一切割线处的边缘相对于所述第二保留部在所述第二切割线处的边缘向内收缩的距离在1毫米至10毫米的范围内。
  4. 如权利要求1所述的方法，其中，所述“在所述突出部的朝向所述第一保留部的表面加粘合剂，使所述粘合剂渗入所述第一保留部和所述第二保留部之间”包括：
    在所述突出部的朝向所述第一保留部的表面上沿着所述第一保留部的在所述第一切割线处的边缘加入所述粘合剂；
    通过在所述粘合剂的表面增加压力，使所述粘合剂渗入所述第一保留部和所述第二保留部之间。
  5. 如权利要求2所述的方法，其中，所述“在所述突出部的朝向所述第一保留部的表面加粘合剂，使所述粘合剂渗入所述第一保留部和所述第二保留部之间”包括：
    在所述突出部的朝向所述第一保留部的表面上沿着所述第一保留部的在所述第一切割线处的边缘加入所述粘合剂；
    通过在所述粘合剂的表面增加压力，使所述粘合剂渗入所述第一保留部和所述第二保留部之间。
  6. 如权利要求3所述的方法，其中，所述“在所述突出部的朝向所述第一保留部的表面加粘合剂，使所述粘合剂渗入所述第一保留部和所述第二保留部之间”包括：
    在所述突出部的朝向所述第一保留部的表面上沿着所述第一保留部的在所述第一切割线处的边缘加入所述粘合剂；
    通过在所述粘合剂的表面增加压力，使所述粘合剂渗入所述第一保留部和所述第二保留部之间。
  7. 如权利要求1所述的方法，其中，所述“固化所述粘合剂”包括：
    采用紫外光照射所述粘合剂，使所述粘合剂固化，其中，所述粘合剂为光固化型粘合剂。
  8. 如权利要求2所述的方法，其中，所述“固化所述粘合剂”包括：
    采用紫外光照射所述粘合剂，使所述粘合剂固化，其中，所述粘合剂为光固化型粘合剂。
  9. 如权利要求3所述的方法，其中，所述“固化所述粘合剂”包括：
    采用紫外光照射所述粘合剂，使所述粘合剂固化，其中，所述粘合剂为光固化型粘合剂。
  10. 如权利要求1所述的方法，其中，所述“固化所述粘合剂”包括：
    对所述粘合剂加热，使所述粘合剂固化，其中，所述粘合剂为热固化型粘合剂。
  11. 如权利要求2所述的方法，其中，所述“固化所述粘合剂”包括：
    对所述粘合剂加热，使所述粘合剂固化，其中，所述粘合剂为热固化型粘合剂。
  12. 如权利要求3所述的方法，其中，所述“固化所述粘合剂”包括：
    对所述粘合剂加热，使所述粘合剂固化，其中，所述粘合剂为热固化型粘合剂。
  13. 如权利要求1所述的方法，其中，所述第一基板是薄膜晶体管阵列基板，所述第二基板是彩色滤光片组件。
  14. 如权利要求2所述的方法，其中，所述第一基板是薄膜晶体管阵列基板，所述第二基板是彩色滤光片组件。
  15. 如权利要求1所述的方法，其中，所述第一基板为彩色滤光片组件，所述第二基板为薄膜晶体管阵列基板。
  16. 如权利要求2所述的方法，其中，所述第一基板为彩色滤光片组件，所述第二基板为薄膜晶体管阵列基板。
  17. 如权利要求3所述的方法，其中，所述第一基板为彩色滤光片组件，所述第二基板为薄膜晶体管阵列基板。
  18. 如权利要求15所述的方法，其中，所述图像生成介质为液晶。
  19. 如权利要求16所述的方法，其中，所述图像生成介质为液晶。
  20. 如权利要求17所述的方法，其中，所述图像生成介质为液晶。
PCT/CN2016/080808 2016-03-02 2016-04-29 调整显示器尺寸的方法 Ceased WO2017147996A1 (zh)

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