WO2017131119A1 - Dispositif de rendu à faisceau de particules chargées, système de rendu à faisceau de particules chargées, et procédé de génération de données de rendu - Google Patents

Dispositif de rendu à faisceau de particules chargées, système de rendu à faisceau de particules chargées, et procédé de génération de données de rendu Download PDF

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Publication number
WO2017131119A1
WO2017131119A1 PCT/JP2017/002815 JP2017002815W WO2017131119A1 WO 2017131119 A1 WO2017131119 A1 WO 2017131119A1 JP 2017002815 W JP2017002815 W JP 2017002815W WO 2017131119 A1 WO2017131119 A1 WO 2017131119A1
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WIPO (PCT)
Prior art keywords
drawing data
unit
data
charged particle
particle beam
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PCT/JP2017/002815
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English (en)
Japanese (ja)
Inventor
剛哉 下村
洋平 大川
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大日本印刷株式会社
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Priority claimed from JP2017011653A external-priority patent/JP6788839B2/ja
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Publication of WO2017131119A1 publication Critical patent/WO2017131119A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Definitions

  • the present disclosure relates to a charged particle beam drawing apparatus, a charged particle beam drawing system, and a drawing data generation method that perform drawing with multi-beams.
  • a charged particle beam drawing apparatus In a semiconductor device manufacturing process, a charged particle beam drawing apparatus is used to draw a fine pattern on a photomask or wafer. Recently, in order to perform high-speed drawing, a charged particle beam drawing apparatus of a multi-beam system that draws a plurality of fine patterns by simultaneously irradiating a plurality of electron beams has attracted attention.
  • the charged particle beam drawing apparatus performs drawing based on drawing data (hereinafter referred to as original drawing data) generated by a layout design tool or the like.
  • the charged particle beam drawing device converts original drawing data in vector format known by names such as GDS and OASIS into raster format drawing data, temporarily stores it, and draws based on the saved raster format drawing data Is generally performed (see JP 2012-527765 A).
  • the charged particle beam drawing apparatus performs drawing by switching between irradiation / non-irradiation of the electron beam on a pixel basis on the basis of raster format drawing data.
  • the size of the fine pattern included in the original drawing data Since it does not necessarily match the interval, and the beam diameter of the electron beam does not match the pixel width, it is necessary to correct the raster drawing data before drawing.
  • the raster format drawing data has an enormous amount of data. If the raster format drawing data is corrected in pixel units and then stored and managed, a large-capacity recording device is required. It takes a lot of time to save.
  • the drawing data may be transferred to a design center or the like.
  • the drawing data in raster format has a huge amount of data
  • it takes a lot of time for the transfer and as a result, there is a problem that the drawing data after the correction processing cannot be quickly verified.
  • the present disclosure has been made to solve the above-described problem, and an object of the present disclosure is to provide a charged particle beam drawing apparatus, a charged particle beam drawing system, and a drawing data generation method that make it easy to manage drawing data after correction processing.
  • the purpose is to provide.
  • a beam generation unit that generates a charged particle beam;
  • An aperture unit having a plurality of openings, and passing the charged particle beam through these openings to generate a multi-beam including a plurality of micro beams;
  • a projection system for reducing and projecting the multi-beam onto a drawing object;
  • a blanking unit interposed between the aperture unit and the projection system to control whether the plurality of micro beams are directed to the projection system or to a direction different from the projection system;
  • a control unit that controls the beam generation unit, the projection system, and the blanking unit;
  • An acquisition unit that acquires first drawing data in a vector format for drawing on the drawing object;
  • a first image conversion unit for converting the first drawing data into second drawing data in a raster format;
  • An image correction unit that corrects the second drawing data on a pixel basis to generate third drawing data in a raster format;
  • a second image conversion unit for converting the third drawing data into fourth drawing data in vector format;
  • a first storage control unit that
  • the second image conversion unit A binarization unit that generates binary data obtained by binarizing the third drawing data; An outline extracting unit that extracts an outline of the binary data and generates the fourth drawing data.
  • an inspection unit After drawing on the drawing object, an inspection unit that performs an appearance inspection of the drawing pattern of the drawing object and determines whether there is a defect in appearance; When the inspection unit determines that there is a defect, a first storage control unit that reads the fourth drawing data around the defective part from the first drawing data storage unit; A comparison means for comparing the fourth drawing data read by the first storage control unit with the first drawing data; A correction defect determination unit that determines whether the first image conversion unit has a defect in the process of converting the first drawing data into the second drawing data based on a comparison result by the comparison unit. Also good.
  • the third rendering data includes a pixel value for each of a plurality of pixels,
  • the second image conversion unit A region dividing unit for performing region division to combine adjacent pixel ranges having the same pixel value in the third drawing data into one divided region;
  • a vector conversion unit that generates the fourth drawing data obtained by vectorizing the divided areas.
  • the third rendering data includes a pixel value for each of a plurality of pixels
  • the second image conversion unit Based on the third drawing data, an accumulated dose distribution acquisition unit that obtains an accumulated dose distribution by performing a drawing simulation considering forward scattering and backscattering of the charged particle beam; An accumulated dose amount converter for converting the accumulated dose amount distribution into vector data; A vertex number reduction unit that generates the fourth drawing data by reducing the number of vertices of the vector data converted by the accumulated dose amount conversion unit.
  • an inspection unit After drawing on the drawing object, an inspection unit that performs an appearance inspection of the drawing pattern of the drawing object and determines whether there is a defect in appearance; When the inspection unit determines that there is a defect, a first storage control unit that reads the fourth drawing data around the defective part from the first drawing data storage unit; A comparison means for comparing the fourth drawing data read by the first storage control unit with the first drawing data; A correction defect determination unit that determines whether or not there is a defect in the processing performed by the image correction unit that corrects the second drawing data and generates the third drawing data based on the comparison result by the comparison unit; You may prepare.
  • a third image conversion unit that converts the fourth drawing data stored in the first drawing data storage unit into fifth drawing data in a raster format;
  • the control unit may redraw the drawing pattern on the drawing target by controlling the beam generation unit, the projection system, and the blanking unit based on the fifth drawing data.
  • the image correction unit may generate the third drawing data by correcting pixel values of corner pixels of the drawing pattern included in the second drawing data.
  • the image correction unit may generate the third drawing data by correcting the pixel value of the pixel at the corner of the drawing pattern included in the second drawing data to a larger value.
  • the image correction unit may generate the third drawing data by correcting pixel values of a plurality of pixels where boundary lines of the drawing pattern included in the second drawing data are located.
  • a second storage control unit that performs control to save the first drawing data in the second drawing data storage unit may be provided.
  • a beam generation unit that generates a charged particle beam; An aperture unit having a plurality of openings, and passing the charged particle beam through these openings to generate a multi-beam including a plurality of micro beams; A projection system for reducing and projecting the multi-beam onto a drawing object; A blanking unit interposed between the aperture unit and the projection system to control whether the plurality of micro beams are directed to the projection system or to a direction different from the projection system; A control unit that controls the beam generation unit, the projection system, and the blanking unit; An acquisition unit that acquires first drawing data in a vector format for drawing on the drawing object; A first image conversion unit for converting the first drawing data into second drawing data in a raster format; An image correction unit that corrects the second drawing data on a pixel basis to generate third drawing data in a raster format; A second image conversion unit for converting the third drawing data into fourth drawing data in vector format; A first drawing data storage unit for storing the fourth drawing data; After drawing on
  • a beam generation unit that generates a charged particle beam; An aperture unit having a plurality of openings, and passing the charged particle beam through these openings to generate a multi-beam including a plurality of micro beams; A projection system for reducing and projecting the multi-beam onto a drawing object; A blanking unit interposed between the aperture unit and the projection system to control whether the plurality of micro beams are directed to the projection system or to a direction different from the projection system; A control unit that controls the beam generation unit, the projection system, and the blanking unit; An acquisition unit that acquires first drawing data in a vector format for drawing on the drawing object; A first image conversion unit for converting the first drawing data into second drawing data in a raster format; An image correction unit that performs correction processing on the second drawing data in units of pixels and generates third drawing data in a raster format; A second image conversion unit for converting the third drawing data into fourth drawing data in vector format; A first drawing data storage unit for storing the fourth drawing data; A
  • a method for generating drawing data used in a charged particle beam drawing apparatus that draws an object to be drawn using a multi-beam including a plurality of micro beams generated based on a charged particle beam
  • Obtaining first drawing data in vector format for drawing on the drawing object Converting the first drawing data into second drawing data in a raster format; Correcting the second drawing data in pixel units to generate third drawing data in a raster format; Converting the third drawing data into fourth drawing data in vector format;
  • a step of saving the fourth drawing data in a first drawing data storage unit is provided.
  • the step of converting into the fourth drawing data includes: Binarizing the third drawing data to generate binarized data;
  • the fourth drawing data may be generated by extracting an outline of the binary data.
  • the drawing object After drawing on the drawing object, perform an appearance inspection of the drawing pattern of the drawing object to determine whether there is a defect in appearance, When it is determined that there is the defect, the fourth drawing data around the defective part is read from the first drawing data storage unit, Comparing the read fourth drawing data with the first drawing data; Based on the comparison result, it may be determined whether or not there is a problem in the process of converting the first drawing data into the second drawing data.
  • the third rendering data includes a pixel value for each of a plurality of pixels
  • Converting to the fourth image comprises: Performing region division to combine adjacent pixel ranges having the same pixel value in the third drawing data into one divided region;
  • the fourth drawing data may be generated by vectorizing the divided areas obtained by the area division.
  • the third rendering data includes a pixel value for each of a plurality of pixels, Based on the third drawing data, performing a drawing simulation considering forward scattering and backscattering of the charged particle beam to obtain an accumulated dose distribution, Converting the accumulated dose distribution into vector data;
  • the fourth drawing data may be generated by reducing the number of vertices of the converted vector data.
  • the drawing object After drawing on the drawing object, perform an appearance inspection of the drawing pattern of the drawing object to determine whether there is a defect in appearance, When it is determined that there is the defect, the fourth drawing data around the defective part is read from the first drawing data storage unit, Comparing the read fourth drawing data with the first drawing data; Based on the comparison result, it may be determined whether or not there is a problem in the process of correcting the second drawing data and generating the third drawing data.
  • the figure which shows the process of FIG. 15 typically.
  • FIG. 20 is a diagram showing an accumulated dose distribution obtained by performing a drawing simulation using the third drawing data of FIG. 24A.
  • FIG. 27 is a diagram schematically illustrating the processing in FIG. 26.
  • the flowchart which shows an example of the redrawing process of a control system.
  • the block diagram which shows the internal structure of the control system which performs the process of FIG.
  • the flowchart which shows the 2nd example of the process sequence of a control system.
  • the block diagram of the control system by a 2nd example.
  • FIG. 1 is a diagram showing a schematic configuration of a charged particle beam drawing apparatus 1 according to an embodiment.
  • the charged particle beam drawing apparatus 1 in FIG. 1 is used for the purpose of forming a fine pattern on a drawing object such as an exposure mask or a silicon wafer.
  • an illumination system 2 is roughly divided into an illumination system 2, a multi-beam generation system 3, a projection system 4, and a control system 35.
  • the illumination system 2 includes an electron gun (beam generation unit) 7, an extraction system 8, a deflector 9 a, and an illumination lens 9.
  • the electron gun 7 emits an electron beam (electron beam).
  • the charged particles used for drawing by the charged particle beam drawing apparatus 1 according to the present embodiment are not necessarily limited to electron beams.
  • it may be a beam of various ions such as hydrogen ions or heavy ions, or a beam of charged atom clusters or charged molecules.
  • heavy ions refer to ions of elements heavier than carbon (C) (for example, oxygen, nitrogen, etc.).
  • heavy ions refer to neon (Ne), argon (Ar), krypton (Kr), xenon (Xe), and the like.
  • the example which uses an electron beam as a charged particle beam is mainly demonstrated.
  • the deflector 9a controls the traveling direction 1a of the electron beam emitted by the electron gun 7.
  • the illumination lens 9 aligns the traveling direction of the electron beam.
  • the electron beam that has passed through the illumination lens 9 becomes a wide and telecentric beam 1b.
  • the multi-beam generation system 3 generates a multi-beam 1c including a plurality of minute beams from the electron beam 1b that has passed through the illumination lens 9, as will be described in detail later.
  • the projection system 4 includes a first electromagnetic lens 6a, a first deflector 11, a second electromagnetic lens 6b, an aperture member 10, a third electromagnetic lens 6c, and a second deflector 12.
  • the multi-beam 1c incident on the projection system 4 sequentially passes through the first electromagnetic lens 6a, the first deflector 11, and the second electromagnetic lens 6b. Thereafter, only the multi-beams that have passed through the opening of the aperture member 10 sequentially pass through the third electromagnetic lens 6 c and the second deflector 12, and then the drawing target 13 placed on the stage 5 is irradiated to perform drawing. Done.
  • the projection system 4 uses the first to third electromagnetic lenses 6a to 6c to reduce and project the multi-beam on the drawing target 13.
  • the stage 5 is movable in the two-dimensional direction of the installation surface. Therefore, it is possible to perform drawing at an arbitrary place on the drawing target 13 by reducing and projecting the multi-beam onto the drawing target 13 by the projection system 4 while moving the stage 5.
  • the drawing target 13 is an exposure mask or a silicon wafer.
  • the projection system 4 performs optical processing for widely compensating chromatic aberration and geometric aberration in the first to third electromagnetic lenses 6a to 6c and the first to second deflectors 11 and 12.
  • the control system 35 controls the illumination system 2, the multi-beam generation system 3, and the projection system 4 as will be described in detail later. In addition to this, the control system 35 also performs an appearance inspection of the drawing pattern, control of correction processing described later, and the like.
  • FIG. 2 is a diagram showing an example of a specific configuration of the multi-beam generation system 3.
  • the multi-beam generation system 3 in FIG. 2 includes an aperture plate (aperture part) 16 and a blanking plate (blanking part) 17.
  • the aperture plate 16 has a protective layer 15 that protects the plate 16 from the colliding electron beam and a plurality of openings 16a that emit multi-beams.
  • the protective layer 15 is not an essential member and may be omitted.
  • the blanking plate 17 has a plurality of openings 17a formed in accordance with the openings 16a of the aperture plate 16.
  • FIG. 3 is a plan view of a plurality of openings 16 a and 17 a formed in the aperture plate 16 and the blanking plate 17 as viewed from above the aperture plate 16.
  • a plurality of openings 16 a are arranged at regular intervals in the two-dimensional direction of the surface direction of the aperture plate 16.
  • the electron beam passing through the corresponding openings 16 a and 17 a is deflected, and as shown by the arrow 21 in FIG. Do not pass through the aperture plate 10.
  • the ground electrode 18 and the corresponding deflection electrode 19 are not energized, the electron beam is not deflected and passes through the aperture plate 10 in FIG. 1 as indicated by an arrow 20 in FIG.
  • Energization is performed by applying a voltage sufficiently different from the default voltage in the non-conductive state between the ground electrode 18 and the deflection electrode 19.
  • the default voltage when no power is supplied is 0 V, and the ground electrode 18 and the deflection electrode 19 are at the same potential.
  • the voltage control of the ground electrode 18 and the deflection electrode 19 is performed by the control system 35.
  • the single-beam type charged particle beam drawing apparatus 1 only one electron beam is irradiated on the drawing target 13, so that the cross-sectional shape is processed into an arbitrary shape such as a rectangle and adjusted to an arbitrary intensity. It is possible to irradiate with. Accordingly, for example, a rectangular pattern can be drawn while scanning a rectangular irradiation spot on the exposure target surface. For this reason, a dimensional error does not occur and accurate patterning can be performed. However, since improvement in the drawing speed cannot be expected, there arises a problem that it takes a long drawing time.
  • the charged particle beam drawing apparatus 1 of the multi-beam system has an advantage that drawing can be performed at a very high speed using a large number of electron beams, but the sectional shape of each beam can be individually set. It is difficult to control the intensity of each beam or to control the intensity of each beam individually. More specifically, it is not possible to provide a mechanism for individually shaping each electron beam that has passed through the opening 16a of the fine aperture plate 16 or for adjusting the intensity individually.
  • the general charged particle beam drawing apparatus 1 of the general multi-beam system currently used can form a large number of circular irradiation spots having a diameter ⁇ on the surface to be exposed, but the irradiation spot is formed into an arbitrary shape.
  • the multi-beam type charged particle beam drawing apparatus 1 cannot individually control the intensity of a large number of electron beams.
  • each electron beam can be individually turned on / off by controlling the blanking plate 17. Therefore, for each irradiation reference point, a method of changing the exposure intensity by individually controlling ON / OFF of the irradiated electron beam and changing the exposure time is adopted.
  • Such control of the exposure time is actually performed in the form of control of the number of exposures. This is because, in practice, drawing is performed while two-dimensionally scanning the drawing target 13 with a large number of electron beams while moving the stage 5 two-dimensionally (left-right direction and depth direction in FIG. 1). It is.
  • an exposure time of about several nanoseconds is defined as a unit exposure time for one electron beam irradiation, and the stage 5 is moved by a pitch d in the X-axis direction each time one electron beam irradiation is completed. If the next electron beam irradiation is performed, the specific irradiation reference point Q is exposed for a unit exposure time by a different electron beam (adjacent electron beam) each time. At this time, if individual ON / OFF control is performed for each individual electron beam each time, it is possible to set a specific exposure intensity for each irradiation reference point although it is stepwise. As will be described later, the shape and pattern width of the drawing pattern can be finely adjusted by controlling the exposure intensity.
  • FIG. 4 is a block diagram showing an example of a specific internal configuration of the control system 35 of the present embodiment. 4 includes a control unit 41, an acquisition unit 42, a first image conversion unit 43, an image correction unit 44, a second image conversion unit 45, a first storage control unit 46, and a first storage control unit 46. A drawing data storage unit 47, a second storage control unit 48, and a second drawing data storage unit 49 are provided.
  • the acquisition unit 42, the first image conversion unit 43, the image correction unit 44, the second image conversion unit 45, the first storage control unit 46, and the second storage control unit 48 are included in the charged particle beam drawing apparatus 1.
  • the first drawing data storage unit 47 and the second drawing data storage unit 49 are provided in an apparatus (for example, an inspection apparatus) separate from the charged particle beam drawing apparatus 1.
  • an apparatus for example, an inspection apparatus
  • the charged particle beam drawing apparatus 1 and the inspection apparatus are collectively referred to as a charged particle beam drawing system.
  • the control unit 41 controls each unit in the charged particle beam drawing apparatus 1.
  • the control unit 41 can be configured by, for example, one or a plurality of computers, but a specific configuration for realizing the control unit 41 is not particularly limited.
  • the control unit 41 may include at least some functions of an acquisition unit 42, a first image conversion unit 43, an image correction unit 44, and a second image conversion unit 45, which will be described later.
  • the acquisition unit 42 acquires first drawing data in a vector format for drawing on the drawing target 13.
  • the vector format means that drawing data is managed by line segment information and line direction information.
  • the acquisition unit 42 acquires first drawing data generated by a layout design tool (not shown) via a network or a recording medium such as an optical disk.
  • the first drawing data is drawing data in a general-purpose vector format such as GDS or OASIS.
  • the first image conversion unit 43 converts the first drawing data acquired by the acquisition unit 42 into second drawing data in a raster format.
  • the raster format means that drawing data is managed by pixel data in units of pixels.
  • the image correction unit 44 corrects the second drawing data in units of pixels so that the second drawing data approaches the ideal drawing data, and generates third drawing data in a raster format.
  • the reason why the image correction unit 44 performs the correction process in the raster format is that the correction process is performed by extracting only a characteristic portion of the pattern image of the second drawing data.
  • the second image conversion unit 45 converts the third drawing data into fourth drawing data in vector format.
  • the reason why the second image conversion unit 45 converts the drawing data from the raster format to the vector format is that if the raster format remains in the raster format, the amount of data becomes enormous and not suitable for storage.
  • the first drawing data storage unit 47 stores the fourth drawing data in vector format that has been subjected to image conversion by the second image conversion unit 45.
  • the first storage control unit 46 performs control to save the fourth drawing data in the first drawing data storage 47.
  • the second drawing data storage unit 49 stores the first drawing data in the vector format before the correction process.
  • the second storage control unit 48 performs control to save the first drawing data in the second drawing data storage 49.
  • the second drawing data storage unit 49 is not an essential component and may be omitted.
  • An advantage of providing the second drawing data storage unit 49 is that when there is a defect in the appearance inspection of the pattern drawn on the drawing object 13, that is, when it is determined that there is an error, it can be used to investigate the cause of the defect.
  • the causes of errors in pattern appearance inspection include data conversion from the vector format to the raster format, a defect (error) in correction processing, and a defect (error) other than data conversion and correction processing.
  • the first drawing data before the correction process may be compared with the fourth drawing data after the correction process. Therefore, if the first drawing data before the correction process is stored in the second drawing data storage unit 49, it is possible to easily and quickly determine whether or not there is an error in the correction process.
  • FIG. 5 is a diagram illustrating a first example of correction processing performed by the image correction unit 44 of FIG.
  • the corner portion 40a of the drawing pattern 40 drawn on the drawing object 13 is rounded when actually drawn even if the ideal pattern in design has a sharp corner portion. It tends to become a tinged shape. This is because the beam shape of the electron beam is rounded, the beam diameter of the electron beam may be larger than the pixel width, and the electron beam has the highest brightness at the center of the beam aperture, This is because the luminance gradually decreases as the distance approaches.
  • the correction process for suppressing the roundness of the actual pattern shape is performed by increasing the exposure intensity of the pixel corresponding to the corner portion 40a of the drawing pattern 40.
  • FIG. 5 shows an enlarged view of only one corner 40a of the drawing pattern 40.
  • FIG. 5A shows the first drawing data at the corner 40a and the second drawing data at the corner 40a.
  • the first drawing data is drawing data in a vector format, and includes information on the line direction of the drawing pattern 40 and information on the length of the line segment.
  • the second drawing data includes pixel value information of each pixel constituting the drawing pattern 40.
  • a pixel is a unit region in the drawing pattern 40
  • a pixel value is an electron beam irradiation amount, that is, a dose amount per unit region in the drawing pattern 40.
  • the angle formed by the two sides of the corner portion 40a of the drawing pattern 40 is 90 degrees, and the boundary line of the drawing pattern 40 passes through the center of each pixel.
  • the second drawing data includes 15 pixel values of pixels in which the drawing pattern 40 exists in the entire area of the pixel, 7 pixel values of pixels in which the drawing pattern 40 exists in only half of the pixels, The pixel value of the pixel in which the corner portion 40a exists is 4 and the pixel value of the pixel in which the drawing pattern 40 does not exist in the pixel is 0.
  • FIG. 5B shows the third drawing data after the correction processing by the image correction unit 44.
  • the pixel value of the pixel in which the corner portion 40a of the drawing pattern 40 exists was set to 4, but the pixel value of this pixel is changed to 15 by performing the correction process.
  • the fourth drawing data obtained by vector conversion of the third drawing data becomes drawing data in which the corners 40a are enlarged in a rectangular shape.
  • the first drawing data storage unit 47 stores the fourth drawing data. Since the fourth drawing data is in the vector format, the amount of data to be saved can be greatly reduced as compared to saving the third drawing data in the raster format.
  • the image correction unit 44 detects the corner portion 40a of the drawing pattern 40 from the second drawing data in the raster format that is the drawing data of the drawing target 13, and corrects the pixel value of the corner portion 40a. To do.
  • the second image conversion unit 45 converts the corrected third drawing data into fourth drawing data in vector format, and stores it in the first drawing data storage unit 47.
  • the corrected drawing data can be managed with a small amount of data, so that the amount of data when the corrected fourth drawing data is transferred to the design center and verified can be reduced, and the fourth drawing data can be verified. It becomes easier to do.
  • correction processing performed by the image correction unit 44 is not limited to the corner 40a of the drawing pattern 40.
  • the correction process may be performed on the boundary line of the drawing pattern 40.
  • FIG. 6 to 9 are diagrams illustrating a second example of the correction process performed by the image correction unit 44 of FIG.
  • the boundary line of the drawing pattern 40 passes through the boundary position of the pixel.
  • FIG. 6 shows an example of third drawing data corresponding to a drawing pattern 40 having a pattern width that is a multiple of 5 (for example, 20 nm).
  • the pixel value of the pixel where the drawing pattern 40 exists is 15 and the pixel value of the pixel where the drawing pattern 40 does not exist is 0.
  • the boundary line of the drawing pattern 40 matches the boundary position of the pixel.
  • FIG. 7 shows an example in which the pixel value of the pixel located at the boundary line of the drawing pattern 40 is set to 15 in order to draw the drawing pattern 40 having a pattern width of 19 nm.
  • the pattern width when drawing is performed using the third drawing data as shown in FIG. 7 is 19.5 nm.
  • the pixel value of the pixel located on the boundary line of the drawing pattern 40 is set to a smaller value 13 as shown in FIG.
  • the pattern width at this time is 18.5 nm as shown in FIG. 8, for example, as shown in FIG. 9, the pixel values of the pixels located on the boundary line of the drawing pattern 40 are alternately changed along the boundary line. 13 and 14 are repeated.
  • the image correction unit 44 performs correction processing so as to obtain an optimum pattern width by repeating such correction.
  • the pixel values in the direction along the boundary line are 13 and 14, and the fourth drawing data in the vector format obtained by converting the third drawing data has a polygonal line shape. Even if the boundary line has a broken line shape, the unevenness difference is about 0.5 nm, and there is no problem in practical use.
  • the fourth drawing data includes each intersection coordinate of the broken line and the length and direction of the broken line, and the amount of data is larger than that of the drawing pattern 40 having the straight boundary line. However, the amount of data is much smaller than that of the third rendering data in the raster format.
  • the fourth drawing data obtained by vector conversion of the third drawing data is transmitted to the above-described design center or the like.
  • verification may be considered, the presence or absence of an error may be verified by the control system 35.
  • the error is detected by actually drawing on the drawing object 13 based on the third drawing data and performing an appearance inspection of the drawing pattern 40 using the fourth drawing data.
  • As a factor for detecting the error there are a case where there is a defect in the correction process of the image correction unit 44 and a case where there is a defect in processes other than the correction process. Therefore, when an error is detected, it is necessary to specify the cause of the error.
  • the block configuration when the control system 35 performs the error factor identification process is as shown in FIG. FIG. 10 is obtained by adding an inspection unit 50 and a correction defect determination unit 51 to FIG.
  • the inspection unit 50 performs an appearance inspection of the drawing pattern 40 drawn on the drawing object 13 and determines whether or not the cause of the defect is in the correction processing of the image correction unit 44.
  • the correction defect determination unit 51 determines whether or not the correction process of the image correction unit 44 has a defect. If there is a defect, the correction defect determination unit 51 instructs the image correction unit 44 to perform the correction process again. 10, the acquisition unit 42, the first image conversion unit 43, the image correction unit 44, the second image conversion unit 45, the first drawing data storage unit 47, the second drawing data storage unit 49, the inspection unit 50, and the correction defect.
  • the determination unit 51 constitutes a drawing data verification device.
  • FIG. 11 is a flowchart showing a first example of processing procedures of the control system 35 including image correction processing and error factor identification processing.
  • the acquisition unit 42 acquires first drawing data in a vector format for drawing on the drawing target 13 (step S1).
  • the acquired first drawing data is stored in the second drawing data storage unit 49 (step S2).
  • the process of step S2 is performed before and after the processes of steps S3 to S6 described later.
  • the first image conversion unit 43 converts the first drawing data into second drawing data in a raster format (step S3).
  • the image correction unit 44 corrects the second drawing data to generate raster-type third drawing data (step S4).
  • the second image conversion unit 45 converts the third drawing data into fourth drawing data in vector format (step S5). Details of the processing in step S5 will be described later.
  • the first storage control unit 46 performs control to save the fourth drawing data in the first drawing data storage unit 47 (step S6).
  • the first drawing data storage unit 47 is provided, for example, in a server (not shown) that performs information communication with the charged particle beam drawing apparatus 1.
  • control unit 41 performs drawing on the drawing target 13 based on the third drawing data to form a drawing pattern 40 (step S7).
  • the processes in steps S1 to S7 described above are performed by the charged particle beam drawing apparatus. Processing in steps S8 to S11 described later is performed by the inspection apparatus.
  • step S8 the formed drawing pattern 40 is imaged by an imaging device (not shown), the captured image is analyzed, and the appearance inspection of the drawing pattern 40 is performed.
  • the appearance inspection for example, a Die to Die inspection or a Die to Database inspection is performed.
  • the Die to Die inspection is an inspection for comparing cells of the same type on the drawing object 13 on which the drawing pattern 40 is formed.
  • a cell is a basic pattern constituting the drawing pattern 40.
  • One drawing pattern 40 is configured by combining a large number of cells.
  • a plurality of types of cells having different shapes may exist, but the drawing pattern 40 is configured by combining an arbitrary number of each type of cells.
  • an appearance inspection is performed by comparing a captured image of an inspection target cell with a captured image of another cell having the same shape.
  • the die-to-database inspection performs an appearance inspection by comparing the captured image of the drawing pattern 40 with the first drawing data.
  • the first drawing data used for comparison may be read from the second drawing data storage unit 49.
  • step S9 it is determined whether or not the drawing pattern 40 has a defect in appearance. If there is no appearance defect, the processing of FIG. 11 is terminated. If there is an appearance defect, the fourth drawing data stored in the first drawing data storage unit 47 and the second drawing data storage unit 49 are stored. It is determined whether or not there is a defect in the correction processing performed by the image correction unit 44 by comparing with the first drawing data that has been made (step S10). Details of the processing in step S10 will be described later. If it is determined that there is no defect in the correction process, it is recognized that there is a defect other than the correction process, and a predetermined error process is executed (step S11). If it is determined in step S10 that the correction process is defective, the process returns to step S4 and the correction process for the second drawing data is performed again.
  • step S5 Several methods are conceivable for performing the process of step S5. Hereinafter, typical first to third methods will be described in order.
  • FIG. 12 is a flowchart showing the processing procedure of the first method.
  • the third drawing data generated in step S4 in FIG. 11 is binarized (binarization unit, step S21).
  • FIG. 13A is a diagram illustrating an example of the third drawing data
  • FIG. 13B is a diagram illustrating an example in which the third drawing data in FIG. 13A is binarized.
  • the third drawing data in FIG. 13A is raster data in units of pixels having a minimum value of 0 and a maximum value of 15.
  • a threshold value is appropriately set, and binarization is performed by setting raster data equal to or higher than the threshold value to 1 and raster data less than the threshold value to 0.
  • FIG. 13B shows an example in which the threshold value is set to 5 and binarized.
  • a plurality of threshold values having different values may be provided, and binary data may be generated for each threshold value. Since the binary data has a much smaller data amount than the original third drawing data, even if a plurality of binary data are provided, there is no possibility that the data amount will increase extremely.
  • the outline of the drawing pattern is extracted to generate fourth drawing data that is vector data (outline extraction unit, step S22).
  • the generated fourth drawing data is stored in the first drawing data storage unit in step S6 of FIG.
  • FIG. 14 is a diagram showing an example of extracting a contour based on the binary data of FIG. 13B. A contour is extracted along the boundary between 1 and 0, and vector data including the contour information is generated.
  • FIG. 15 is a flowchart showing a detailed processing procedure when the process of step S9 of FIG. 11 is performed using the fourth drawing data generated by the first method of FIG. If it is determined in step S9 in FIG. 11 that there is a defect in the drawing pattern, the fourth drawing data near the portion determined to have the defect is read out from the first drawing data storage unit (step S31).
  • step S31 the fourth drawing data read in step S31 is compared with the first drawing data (step S32). As a result of the comparison, it is determined whether or not a data mismatch of a predetermined size or more has occurred (step S33). If a mismatch is detected in step S33, it is determined that some problem has occurred during the conversion from the first drawing data to the second drawing data (step S34), and the process proceeds to step S3 in FIG. If no mismatch is detected in step S33, error processing in step S11 of FIG. 11 is performed.
  • FIG. 16 is a diagram schematically showing the processing of FIG.
  • the solid line in FIG. 16 is the fourth drawing data
  • the broken line is the first drawing data
  • x is the location of the defect determined in step S9 in FIG.
  • the processing in FIG. 15 only needs to read out the fourth drawing data in the vicinity of the portion determined to be defective in step S9 in FIG. 11 and compare it with the corresponding first drawing data. Since it is not necessary to compare the fourth drawing data and the first drawing data of the entire pattern, the defective portion can be inspected at high speed.
  • each of the plurality of fourth drawing data is compared with the first drawing data, An inspection may be performed. Thereby, the inspection of the defective part can be performed with higher accuracy.
  • FIG. 17 is a flowchart showing a processing procedure when step S5 of FIG. 11 is performed by the second method.
  • the third drawing data generated in step S4 of FIG. 11 is divided into regions for each pixel value (region dividing unit, step S41).
  • each pixel value of the third drawing data represents the dose amount of the electron beam.
  • step S41 adjacent pixel ranges having the same dose amount are set as one divided region.
  • FIG. 18A is a diagram showing an example of the third drawing data
  • FIG. 18B is a diagram showing an example in which the third drawing data of FIG. 18A is divided into regions according to the dose amount.
  • FIG. 18B shows an example in which one divided region with a dose amount of “15”, three divided regions with a dose amount of “7”, and one divided region with a dose amount of “4” are provided.
  • FIG. 19 shows an example in which each divided area of FIG. 18B is converted into fourth drawing data composed of vector data obtained by polygonizing. For example, since the dose amount of the divided area d1 is “15”, the divided area d1 is converted into fourth drawing data including the value “15” and polygon information.
  • the generated fourth drawing data is stored in the first drawing data storage unit 47 in step S6 of FIG.
  • FIG. 20 is a flowchart showing a detailed processing procedure when the process of step S10 of FIG. 11 is performed using the fourth drawing data generated by the second method of FIG. If it is determined in step S9 in FIG. 11 that there is a defect in the drawing pattern, the fourth drawing data near the portion determined to have a defect is read from the first drawing data storage unit 47 (step S51).
  • step S51 the fourth drawing data read in step S51 is compared with the first drawing data (comparison unit, step S52). As a result of the comparison, it is determined whether or not the correction by the correction process in step S4 of FIG. 11 is excessive (step S53). If it is determined that the correction is excessive, it is concluded in step S4 in FIG. 11 that there is a problem in converting from the second drawing data to the third drawing data (correction defect determination unit, step S54). 11 error processing of step S11 is performed. If it is determined in step S53 that the correction is not excessive, the process proceeds to step S4 in FIG.
  • FIG. 21A and 21B are diagrams for schematically explaining the processing of FIG.
  • the solid line in FIG. 21 is the fourth drawing data
  • the broken line is the first drawing data
  • x is the location of the defect determined in step S9 in FIG. 21A is a corner of the drawing pattern.
  • the troubled part in FIG. 21B is the end of the drawing pattern. In either case, the problem can be solved by redoing the correction process in step S4 in FIG. 11 and adjusting the pixel value near x.
  • FIG. 22 is a diagram illustrating the fourth drawing data generated by the process of FIG. 20 based on the third drawing data generated by performing the process of step S4 of FIG. 11 again when the trouble of FIG. 21A is found.
  • the pixel values at the corners of the drawing pattern are changed. Thereby, it is determined to be normal in the appearance inspection in steps S8 and S9 in FIG.
  • the process of FIG. 20 only needs to read out the fourth drawing data near the portion determined to have a defect in step S9 of FIG. 11 and compare it with the corresponding first drawing data. Since it is not necessary to compare the drawing data and the first drawing data, it is possible to inspect the defective portion at high speed.
  • FIG. 23 is a flowchart showing a processing procedure when step S5 of FIG. 11 is performed by the third method.
  • a drawing simulation is performed in consideration of forward scattering and back scattering of the electron beam, and an accumulated dose amount distribution is acquired (accumulated dose amount distribution acquisition unit, Step S61).
  • Forward scattering refers to a scattering phenomenon in which an electron beam is irradiated not only on a target irradiation position but also around the target irradiation position.
  • Backscattering refers to a scattering phenomenon in which a part of an electron beam passes through a resist film and is reflected by an underlying substrate and is irradiated around a target irradiation position.
  • step S61 by performing a drawing simulation taking forward scattering and back scattering into consideration, the dose distribution of the electron beam irradiated around the target irradiation position is acquired as the accumulated dose distribution.
  • FIG. 24A is a diagram showing an example of third drawing data
  • FIG. 24B is a diagram showing an accumulated dose distribution obtained by performing a drawing simulation using the third drawing data of FIG. 24A.
  • the accumulated dose distribution has a characteristic that the dose decreases as the distance from the target irradiation position increases.
  • step S61 When the accumulated dose amount distribution is acquired in step S61 in FIG. 23, next, the accumulated dose amount distribution is limited by an arbitrary threshold value to generate a resist pattern image, and this resist pattern image is converted into vector data ( Accumulated dose conversion unit, step S62). Next, rectangular data obtained by reducing the number of vertices of the vector data converted in step S62 is stored as fourth drawing data in the first drawing data storage unit (vertex number reducing unit, step S63).
  • FIG. 25A and FIG. 25B are diagrams for explaining the processing in steps S62 and S63 in FIG.
  • the accumulated dose distribution shown in FIG. 24B for example, when only pixels having a dose with a threshold value of 5 or more are extracted, vector data as shown in FIG. 25A is obtained.
  • the outline of this vector data is a curve as shown in FIG. 25A, and has a large number of vertex data. Therefore, in step S63 in FIG. 23, vector data having a curved contour line as shown in FIG. 25A is converted into rectangular data having a straight contour line as shown in FIG. 25B. Thereby, the 4th drawing data which consists of vector data which reduced the number of vertices is obtained.
  • FIG. 26 is a flowchart showing a detailed processing procedure when the process of step S10 of FIG. 11 is performed using the fourth drawing data generated by the third method of FIG. If it is determined in step S9 in FIG. 11 that there is a defect in the drawing pattern, the fourth drawing data near the location where the defect is found is read from the first drawing data storage unit (step S71).
  • step S71 the fourth drawing data read in step S71 is compared with the first drawing data (comparison unit, step S72). As a result of the comparison, it is determined whether or not the correction by the correction process in step S4 of FIG. 11 is excessive (correction defect determination unit, step S73). If it is determined that the correction is excessive, it is concluded in step S4 in FIG. 11 that there is a problem in converting from the second drawing data to the third drawing data (step S74), and in step S11 in FIG. Perform error handling. If it is determined in step S73 that the correction is not excessive, the process proceeds to step S4 in FIG.
  • FIG. 27 is a diagram schematically illustrating the processing of FIG.
  • the solid line in FIG. 27 is the fourth drawing data
  • the broken line is the first drawing data
  • x is the location of the defect determined in step S9 in FIG.
  • the fourth drawing data is generated in consideration of forward scattering and back scattering of the electron beam, the accuracy of the fourth drawing data can be improved, and a defective portion of the drawing pattern can be inspected with high accuracy.
  • the third drawing data is deleted when the drawing pattern is drawn on the drawing object in step S7 in FIG.
  • the drawing object can be redrawn using the fourth drawing data stored in the first drawing data storage unit 47.
  • the redrawing is performed when a drawing object (for example, a photomask) drawn first becomes defective after drawing, or when a plurality of photomasks are requested by a customer.
  • a drawing object for example, a photomask
  • FIG. 28 is a flowchart showing an example of the redrawing process of the control system 35
  • FIG. 29 is a block diagram showing the internal configuration of the control system 35 that performs the process of FIG. FIG. 29 is obtained by adding a third image conversion unit 52 to the configuration of FIG.
  • the third image conversion unit 52 converts the fourth drawing data stored in the first drawing data storage unit 47 into fifth drawing data in a raster format.
  • the control unit 41 controls the multi-beam generation system 3, the aperture member 10, the projection system 4, the deflector 9a, and the like to redraw the drawing pattern on the drawing object.
  • step S81 the fourth drawing data stored in the first drawing data storage unit 47 is read and acquired (step S81).
  • step S82 the third image conversion unit 52 converts the fourth drawing data into fifth drawing data in a raster format (step S82).
  • step S83 the control unit 41 draws a drawing pattern on the drawing target (step S83).
  • FIG. 30 is a flowchart showing a second example of the processing procedure of the control system 35
  • FIG. 31 is a block diagram of the control system 35 according to the second example.
  • the control system 35 according to the second example includes a first regeneration unit 53 and a second regeneration unit 54 in addition to the configuration illustrated in FIG. 10.
  • the correction defect determination unit 51 determines that the correction processing of the image correction unit 44 is defective
  • the first regeneration unit 53 reproduces the fourth drawing data stored in the first drawing data storage unit 47.
  • the second regeneration unit 54 regenerates the third rendering data in the raster format based on the regenerated fourth rendering data.
  • step S100 If it is determined in step S100 that there is a problem with the correction process, the fourth drawing data stored in the first drawing data storage unit 47 is read and regenerated by the first regenerating unit 53 (step S102). .
  • the second regenerating unit 54 regenerates the third drawing data in the raster format (step S103).
  • the regenerated third drawing data is used for drawing the drawing pattern in step S97 and used for conversion to the fourth drawing data in step S95.
  • the regeneration process of the fourth drawing data and the third drawing data in steps S102 and S103 in FIG. 30 is performed as follows, for example.
  • the correction process is performed again to generate the third drawing data again.
  • the regenerated third drawing data is converted into vector data to generate the fourth drawing data again, and is stored in the first drawing data storage unit 47.
  • the first drawing data in the vector format to be drawn on the drawing target 13 is converted into the second drawing data in the raster format, and then the drawing pattern 40 is converted based on the second drawing data.
  • a place where correction is to be performed is specified, and correction processing is performed in units of pixels to generate third rendering data in a raster format. Since the third drawing data has a large amount of data, it is difficult to verify the third drawing data by transmitting it to a design center or the like. Therefore, in the present embodiment, the third drawing data is converted into the fourth drawing data in the vector format and stored in the first drawing data storage unit 47 in a state where the data amount is reduced. Therefore, it is possible to easily read and verify the fourth drawing data from the first drawing data storage unit 47 as necessary, and to easily and quickly determine whether or not the correction processing is appropriate.
  • 1 charged particle beam drawing apparatus 2 illumination system, 3 multi-beam generation system, 4 projection system, 5 Stage, 6a first electromagnetic lens, 6b second electromagnetic lens, 6c third electromagnetic lens, 7 Electron gun, 8 extraction system, 9 illumination lens, 9a blanking deflector, 10 aperture member, 11 first deflector, 12 second deflector, 13 object to be drawn, 16 aperture plate, 17 blanking plate, 18 ground electrode , 19 Deflection electrode, 40 Drawing pattern, 41 Control unit, 42 Acquisition unit, 43 First image conversion unit, 44 Image correction unit, 45 Second image conversion unit, 47 First drawing data storage unit, 49 Second drawing data storage Unit, 50 inspection unit, 51 correction defect determination unit, 52 third image conversion unit, 53 first regeneration unit, 54 second regeneration unit

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  • General Physics & Mathematics (AREA)
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Abstract

Le problème décrit par l'invention est de faciliter la gestion de données de rendu qui ont été soumises à un traitement de correction. La solution de l'invention porte sur un dispositif de rendu à faisceau de particules chargées (1) qui est pourvu des éléments suivants : une unité de génération de faisceau (7) qui génère un faisceau de particules chargées ; une unité d'ouverture (16) qui comprend une pluralité d'ouvertures et qui permet à un faisceau de particules chargées de passer à travers les ouvertures, ce qui permet de générer un faisceau multiple qui comprend une pluralité de micro-faisceaux ; un système de projection (4) qui projette, d'une manière réduite, le faisceau multiple sur un sujet de rendu ; une unité d'occultation (17) qui est intercalée entre l'unité d'ouverture et l'unité de projection et qui effectue une commande de manière à diriger la pluralité de micro-faisceaux vers le système de projection ou une direction différente de celle du système de projection ; une unité de commande (41) qui commande l'unité de génération de faisceau, le système de projection et l'unité d'occultation ; une unité d'acquisition (42) qui acquiert des premières données de rendu d'un format vectoriel pour effectuer un rendu du sujet de rendu ; une première unité de conversion d'image (43) qui convertit les premières données de rendu en deuxièmes données de rendu d'un format trame ; une unité de correction d'image (44) qui corrige les deuxièmes données de rendu par unités de pixel pour générer des troisièmes données de rendu d'un format trame ; une deuxième unité de conversion d'image (45) qui convertit les troisièmes données de rendu en quatrièmes données de rendu d'un format vectoriel ; et une première unité de commande de stockage (46) qui effectue une commande pour sauvegarder les quatrièmes données de rendu dans une première unité de stockage de données de rendu (47).
PCT/JP2017/002815 2016-01-28 2017-01-26 Dispositif de rendu à faisceau de particules chargées, système de rendu à faisceau de particules chargées, et procédé de génération de données de rendu WO2017131119A1 (fr)

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JP2017011653A JP6788839B2 (ja) 2016-01-28 2017-01-25 荷電粒子ビーム描画装置、荷電粒子ビーム描画システムおよび描画データ生成方法
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002528911A (ja) * 1998-10-26 2002-09-03 エテック システムズ インコーポレイテッド ラスタ走査ガウスビーム描画ストラテジ及びパターン発生の方法
JP2006251160A (ja) * 2005-03-09 2006-09-21 Fuji Photo Film Co Ltd 描画方法および装置
JP2008242885A (ja) * 2007-03-28 2008-10-09 Fujifilm Corp 描画データ検査方法および描画データ検査装置
JP2014049467A (ja) * 2012-08-29 2014-03-17 Canon Inc 描画装置、それを用いた物品の製造方法
US20150242563A1 (en) * 2014-02-21 2015-08-27 Mapper Lithography Ip B.V. Enhanced stitching by overlap dose and feature reduction
JP2015162504A (ja) * 2014-02-26 2015-09-07 大日本印刷株式会社 マルチビーム電子線描画装置を用いたパターニング方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002528911A (ja) * 1998-10-26 2002-09-03 エテック システムズ インコーポレイテッド ラスタ走査ガウスビーム描画ストラテジ及びパターン発生の方法
JP2006251160A (ja) * 2005-03-09 2006-09-21 Fuji Photo Film Co Ltd 描画方法および装置
JP2008242885A (ja) * 2007-03-28 2008-10-09 Fujifilm Corp 描画データ検査方法および描画データ検査装置
JP2014049467A (ja) * 2012-08-29 2014-03-17 Canon Inc 描画装置、それを用いた物品の製造方法
US20150242563A1 (en) * 2014-02-21 2015-08-27 Mapper Lithography Ip B.V. Enhanced stitching by overlap dose and feature reduction
JP2015162504A (ja) * 2014-02-26 2015-09-07 大日本印刷株式会社 マルチビーム電子線描画装置を用いたパターニング方法

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