WO2017129519A1 - Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips - Google Patents
Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips Download PDFInfo
- Publication number
- WO2017129519A1 WO2017129519A1 PCT/EP2017/051320 EP2017051320W WO2017129519A1 WO 2017129519 A1 WO2017129519 A1 WO 2017129519A1 EP 2017051320 W EP2017051320 W EP 2017051320W WO 2017129519 A1 WO2017129519 A1 WO 2017129519A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- filter layer
- semiconductor chip
- contact
- optoelectronic semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 187
- 230000005693 optoelectronics Effects 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000004020 conductor Substances 0.000 claims abstract description 55
- 230000005855 radiation Effects 0.000 claims abstract description 24
- 239000003989 dielectric material Substances 0.000 claims abstract description 8
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 345
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 14
- 239000002356 single layer Substances 0.000 claims description 4
- 238000002161 passivation Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- -1 for example Chemical class 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 150000002927 oxygen compounds Chemical class 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- LKJPSUCKSLORMF-UHFFFAOYSA-N Monolinuron Chemical group CON(C)C(=O)NC1=CC=C(Cl)C=C1 LKJPSUCKSLORMF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K65/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element and at least one organic radiation-sensitive element, e.g. organic opto-couplers
Definitions
- Limit angle of the total reflection determined which can be derived from the refractive index of the semiconductor body and the refractive index of the surrounding medium.
- Conductive oxides in short "TCO" are transparent, conductive materials, usually metal oxides, such as, for example, zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide (ITO)
- metal oxides such as, for example, zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or indium tin oxide (ITO)
- Main surface arranged.
- the conductive layer, the filter layer and the contact layer extend for the most part parallel to the main surface.
- the planar main surface facilitates the formation of the layers.
- the passivation layer 10 covers the main surface 3 and extends over the
- FIG. 4 shows a table in which different parameters are indicated for the different layers of the semiconductor chip 1 shown in FIG.
- the elements are given, in the second column the material M of the corresponding elements is given, in the third column the physical thickness d of the elements is given in nm.
- the filter layer 7 has a total of six partial layers 7A, 7B, the partial layers 7A being made of a low-refractive index
- Contact layer 6 a mask formed (not shown), which covers the contact layer 6 in the areas in which later the at least one opening 9 is to be formed.
- the filter layer 7 is deposited such that it is arranged on the mask and the uncovered areas of the contact layer 6.
- the filter and conductor layer 7, 8 can be generated by means of vapor deposition and / or sputtering.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/071,876 US10475965B2 (en) | 2016-01-29 | 2017-01-23 | Optoelectronic semiconductor chip and method for manufacturing an optoelectronic semiconductor chip |
JP2018538628A JP6651023B2 (ja) | 2016-01-29 | 2017-01-23 | オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 |
DE112017000565.5T DE112017000565B4 (de) | 2016-01-29 | 2017-01-23 | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
CN201780008455.XA CN108604624B (zh) | 2016-01-29 | 2017-01-23 | 光电子半导体芯片和用于制造光电子半导体芯片的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016101612.8A DE102016101612A1 (de) | 2016-01-29 | 2016-01-29 | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
DE102016101612.8 | 2016-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017129519A1 true WO2017129519A1 (de) | 2017-08-03 |
Family
ID=57960403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2017/051320 WO2017129519A1 (de) | 2016-01-29 | 2017-01-23 | Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips |
Country Status (5)
Country | Link |
---|---|
US (1) | US10475965B2 (de) |
JP (1) | JP6651023B2 (de) |
CN (1) | CN108604624B (de) |
DE (2) | DE102016101612A1 (de) |
WO (1) | WO2017129519A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016112587A1 (de) | 2016-07-08 | 2018-01-11 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip |
DE102019100799A1 (de) | 2019-01-14 | 2020-07-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauelement mit einem schichtstapel mit anisotroper leitfähigkeit und verfahren zur herstellung des optoelektronischen halbleiterbauelements |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070145380A1 (en) * | 2006-05-19 | 2007-06-28 | Shum Frank T | Low optical loss electrode structures for LEDs |
EP2403025A1 (de) * | 2009-02-24 | 2012-01-04 | Panasonic Electric Works Co., Ltd. | Lichtemittierende vorrichtung |
US20120199861A1 (en) * | 2011-02-09 | 2012-08-09 | Showa Denko K.K. | Semiconductor light emitting element |
KR20130140281A (ko) * | 2012-06-14 | 2013-12-24 | 엘지이노텍 주식회사 | 발광소자 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7915629B2 (en) * | 2008-12-08 | 2011-03-29 | Cree, Inc. | Composite high reflectivity layer |
KR20100050430A (ko) | 2008-11-04 | 2010-05-13 | 삼성엘이디 주식회사 | 미세 패턴을 갖는 발광장치 |
DE102009054555A1 (de) | 2009-12-11 | 2011-06-16 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zum Herstellen eines optoelektronischen Halbleiterchips |
JP2012124306A (ja) * | 2010-12-08 | 2012-06-28 | Toyoda Gosei Co Ltd | 半導体発光素子 |
KR101179606B1 (ko) | 2011-03-03 | 2012-09-05 | 주식회사 세미콘라이트 | 반도체 발광소자 |
JP5830166B2 (ja) * | 2011-05-25 | 2015-12-09 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス半導体チップ |
JP2014127565A (ja) | 2012-12-26 | 2014-07-07 | Toyoda Gosei Co Ltd | 半導体発光素子 |
DE102013113106A1 (de) | 2013-11-27 | 2015-06-11 | Osram Opto Semiconductors Gmbh | Strahlung emittierender Halbleiterchip |
KR102162437B1 (ko) * | 2014-05-15 | 2020-10-07 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광 소자 패키지 |
DE102014108373A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
DE102016100317A1 (de) * | 2016-01-11 | 2017-07-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
-
2016
- 2016-01-29 DE DE102016101612.8A patent/DE102016101612A1/de not_active Withdrawn
-
2017
- 2017-01-23 JP JP2018538628A patent/JP6651023B2/ja active Active
- 2017-01-23 CN CN201780008455.XA patent/CN108604624B/zh active Active
- 2017-01-23 WO PCT/EP2017/051320 patent/WO2017129519A1/de active Application Filing
- 2017-01-23 US US16/071,876 patent/US10475965B2/en active Active
- 2017-01-23 DE DE112017000565.5T patent/DE112017000565B4/de active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070145380A1 (en) * | 2006-05-19 | 2007-06-28 | Shum Frank T | Low optical loss electrode structures for LEDs |
EP2403025A1 (de) * | 2009-02-24 | 2012-01-04 | Panasonic Electric Works Co., Ltd. | Lichtemittierende vorrichtung |
US20120199861A1 (en) * | 2011-02-09 | 2012-08-09 | Showa Denko K.K. | Semiconductor light emitting element |
KR20130140281A (ko) * | 2012-06-14 | 2013-12-24 | 엘지이노텍 주식회사 | 발광소자 |
Also Published As
Publication number | Publication date |
---|---|
US10475965B2 (en) | 2019-11-12 |
DE112017000565A5 (de) | 2018-11-08 |
DE102016101612A1 (de) | 2017-08-03 |
US20190027653A1 (en) | 2019-01-24 |
CN108604624B (zh) | 2020-11-06 |
CN108604624A (zh) | 2018-09-28 |
JP2019503589A (ja) | 2019-02-07 |
JP6651023B2 (ja) | 2020-02-19 |
DE112017000565B4 (de) | 2024-03-14 |
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