JP6651023B2 - オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 - Google Patents
オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 Download PDFInfo
- Publication number
- JP6651023B2 JP6651023B2 JP2018538628A JP2018538628A JP6651023B2 JP 6651023 B2 JP6651023 B2 JP 6651023B2 JP 2018538628 A JP2018538628 A JP 2018538628A JP 2018538628 A JP2018538628 A JP 2018538628A JP 6651023 B2 JP6651023 B2 JP 6651023B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- semiconductor chip
- filter layer
- contact
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims description 188
- 230000005693 optoelectronics Effects 0.000 title claims description 55
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 230000005855 radiation Effects 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 230000005670 electromagnetic radiation Effects 0.000 claims description 10
- 239000003989 dielectric material Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 315
- 239000000463 material Substances 0.000 description 23
- 238000002161 passivation Methods 0.000 description 19
- 239000000758 substrate Substances 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- -1 nitride compound Chemical class 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910004607 CdSnO3 Inorganic materials 0.000 description 1
- 229910005264 GaInO3 Inorganic materials 0.000 description 1
- 229910017902 MgIn2O4 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910003107 Zn2SnO4 Inorganic materials 0.000 description 1
- 229910007694 ZnSnO3 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910000484 niobium oxide Inorganic materials 0.000 description 1
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K65/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element and at least one organic radiation-sensitive element, e.g. organic opto-couplers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Description
2,2’ 半導体ボディ
3 主面
4 側面
5 活性ゾーン
6,6’ コンタクト層
7 フィルタ層
7A,7B 部分層
8 導電層
8a 縁部
9,9a,9b 開口部
10,10’ パッシベーション層
11 第1のコンタクト要素
12 第1の半導体領域
13,13’ 第2のコンタクト要素
14 第2の半導体領域
15,15’ 接続層
16 キャリア、成長基板
17 メサ状領域
18 直方体領域
19 表面
a1,a2,a3 距離
b 直径
d1,d2,d3 厚さ
T 透過
A 吸収
H 主軸
S 電磁放射
V 周囲媒質
Claims (18)
- 主面(3)と、前記主面(3)を横断するように配置された少なくとも1つの側面(4)と、電磁放射(S)を発生する活性ゾーン(5)とを有する半導体ボディ(2)と、
導電性材料を含み、前記半導体ボディ(2)の前記主面(3)に配置されるコンタクト層(6)と、
誘電材料を含み、前記コンタクト層(6)に配置されるフィルタ層(7)と、
導電性材料を含み、前記フィルタ層(7)に配置される導電層(8)と、
を備え、
発生した前記電磁放射(S)の一部は、動作時に前記半導体ボディ(2)の前記主面(3)を通過し、
前記導電層(8)の厚さ(d2)は、前記コンタクト層(6)の厚さ(d1)より大きく、
前記コンタクト層(6)および前記導電層(8)は、透明導電性酸化物を含み、
前記フィルタ層(7)は、多層化されており、屈折率(n)が互いに異なる少なくとも2層の部分層(7A,7B)を有し、
前記フィルタ層(7)は、第1の角度範囲内の角度(α)で前記フィルタ層(7)に衝突する放射(S)が主に透過され、第2の角度範囲内の角度(α)で前記フィルタ層(7)に衝突する放射(S)が主に反射されるフィルタ特性を有する、
オプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)は、少なくとも1つの開口部(9)を有する、
請求項1に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記コンタクト層(6)および前記導電層(8)は、開口部(9)の領域において接触している、
請求項1または2に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)は、複数の開口部(9)を有し、
前記主面(3)の縁部に最も近い開口部(9a)と前記主面(3)の縁部との間の距離(a1)は、第1のコンタクト要素(11)に最も近い開口部(9b)と前記第1のコンタクト要素(11)との間の距離(a2)より小さい、
請求項2または3に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)は、前記コンタクト層(6)および前記導電層(8)に直接隣接する、
請求項1〜4のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)は、高屈折率の部分層(7B)および低屈折率の部分層(7A)が交互に積層された積層体を有し、
前記高屈折率の部分層(7B)の厚さは、前記低屈折率の部分層(7A)の厚さより小さい、
請求項1〜5のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)の前記誘電材料の屈折率は、前記フィルタ層(7)の周囲の媒質(V)の屈折率以上である、
請求項1〜6のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)は、前記側面(4)の少なくとも一部に配置される、
請求項1〜7のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記コンタクト層(6)および/または前記導電層(8)は、透明導電性酸化物からなる、
請求項1〜8のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)。 - 導電性材料を含み、前記導電層(8)に配置される第1のコンタクト要素(11)と、
導電性材料を含み、前記半導体ボディ(2)において第2の導電型を有する第2の半導体領域(14)に配置される第2のコンタクト要素(13)と、
を備え、
前記第1のコンタクト要素(11)は、前記半導体ボディ(2)において第1の導電型を有する第1の半導体領域(12)の電気接続を形成し、
前記第2のコンタクト要素(13)は、前記第2の半導体領域(14)の電気接続を形成する、
請求項1〜9のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記フィルタ層(7)の一部は、前記第2のコンタクト要素(13)と前記第2の半導体領域(14)との間に配置される、
請求項10に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記第2のコンタクト要素(13)と前記第2の半導体領域(14)との間に配置される導電性接続層(15)を備える、
請求項10または11に記載のオプトエレクトロニクス半導体チップ(1)。 - 前記導電性接続層(15)は、前記第2のコンタクト要素(13)と前記フィルタ層(7)との間に配置される、
請求項12に記載のオプトエレクトロニクス半導体チップ(1)。 - 主面(3)を有する半導体ボディ(2)を設けるステップと、
導電性材料から形成されるコンタクト層(6)を前記主面(3)に設けるステップと、
誘電材料から形成されるフィルタ層(7)を前記コンタクト層(6)に設けるステップと、
導電性材料から形成される導電層(8)を前記フィルタ層(7)に設けるステップと、
を含み、
前記導電層(8)の厚さ(d2)は、前記コンタクト層(6)の厚さ(d1)より大きく、
前記コンタクト層(6)および前記導電層(8)は、透明導電性酸化物を含み、
前記フィルタ層(7)は、多層化されており、屈折率(n)が互いに異なる少なくとも2層の部分層(7A,7B)を有し、
前記フィルタ層(7)は、第1の角度範囲内の角度(α)で前記フィルタ層(7)に衝突する放射(S)が主に透過され、第2の角度範囲内の角度(α)で前記フィルタ層(7)に衝突する放射(S)が主に反射されるフィルタ特性を有する、
オプトエレクトロニクス半導体チップ(1)の製造方法。 - 前記半導体ボディ(2)には、微細構造形成によって前記導電層(8)および接続層(15)が形成される層が設けられる、
請求項14に記載のオプトエレクトロニクス半導体チップ(1)の製造方法。 - 前記フィルタ層(7)は、不連続部を有さずに前記コンタクト層(6)に形成され、
続いて、少なくとも1つの開口部(9)が前記フィルタ層(7)に形成される、
請求項14または15に記載のオプトエレクトロニクス半導体チップ(1)の製造方法。 - 開口部(9)が形成される前記フィルタ層(7)の領域において、前記コンタクト層(6)を被覆するマスクが前記コンタクト層(6)に形成され、
前記フィルタ層(7)は、前記マスク、および、前記マスクによって被覆されていない前記コンタクト層(6)の領域に配置されるように成膜される、
請求項14または15に記載のオプトエレクトロニクス半導体チップ(1)の製造方法。 - 請求項1〜13のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)が製造される、
請求項14〜17のいずれか一項に記載のオプトエレクトロニクス半導体チップ(1)の製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016101612.8 | 2016-01-29 | ||
DE102016101612.8A DE102016101612A1 (de) | 2016-01-29 | 2016-01-29 | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips |
PCT/EP2017/051320 WO2017129519A1 (de) | 2016-01-29 | 2017-01-23 | Optoelektronischer halbleiterchip und verfahren zur herstellung eines optoelektronischen halbleiterchips |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019503589A JP2019503589A (ja) | 2019-02-07 |
JP6651023B2 true JP6651023B2 (ja) | 2020-02-19 |
Family
ID=57960403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018538628A Active JP6651023B2 (ja) | 2016-01-29 | 2017-01-23 | オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10475965B2 (ja) |
JP (1) | JP6651023B2 (ja) |
CN (1) | CN108604624B (ja) |
DE (2) | DE102016101612A1 (ja) |
WO (1) | WO2017129519A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016112587A1 (de) | 2016-07-08 | 2018-01-11 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip |
DE102019100799A1 (de) | 2019-01-14 | 2020-07-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches halbleiterbauelement mit einem schichtstapel mit anisotroper leitfähigkeit und verfahren zur herstellung des optoelektronischen halbleiterbauelements |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7573074B2 (en) * | 2006-05-19 | 2009-08-11 | Bridgelux, Inc. | LED electrode |
US7915629B2 (en) | 2008-12-08 | 2011-03-29 | Cree, Inc. | Composite high reflectivity layer |
KR20100050430A (ko) | 2008-11-04 | 2010-05-13 | 삼성엘이디 주식회사 | 미세 패턴을 갖는 발광장치 |
JP5237854B2 (ja) * | 2009-02-24 | 2013-07-17 | パナソニック株式会社 | 発光装置 |
DE102009054555A1 (de) | 2009-12-11 | 2011-06-16 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zum Herstellen eines optoelektronischen Halbleiterchips |
JP2012124306A (ja) * | 2010-12-08 | 2012-06-28 | Toyoda Gosei Co Ltd | 半導体発光素子 |
JP5582054B2 (ja) * | 2011-02-09 | 2014-09-03 | 豊田合成株式会社 | 半導体発光素子 |
KR101179606B1 (ko) | 2011-03-03 | 2012-09-05 | 주식회사 세미콘라이트 | 반도체 발광소자 |
CN103563104B (zh) * | 2011-05-25 | 2016-08-31 | 欧司朗光电半导体有限公司 | 光电子半导体芯片 |
KR20130140281A (ko) * | 2012-06-14 | 2013-12-24 | 엘지이노텍 주식회사 | 발광소자 |
JP2014127565A (ja) * | 2012-12-26 | 2014-07-07 | Toyoda Gosei Co Ltd | 半導体発光素子 |
DE102013113106A1 (de) | 2013-11-27 | 2015-06-11 | Osram Opto Semiconductors Gmbh | Strahlung emittierender Halbleiterchip |
KR102162437B1 (ko) * | 2014-05-15 | 2020-10-07 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광 소자 패키지 |
DE102014108373A1 (de) * | 2014-06-13 | 2015-12-17 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
DE102016100317A1 (de) * | 2016-01-11 | 2017-07-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
-
2016
- 2016-01-29 DE DE102016101612.8A patent/DE102016101612A1/de not_active Withdrawn
-
2017
- 2017-01-23 JP JP2018538628A patent/JP6651023B2/ja active Active
- 2017-01-23 CN CN201780008455.XA patent/CN108604624B/zh active Active
- 2017-01-23 DE DE112017000565.5T patent/DE112017000565B4/de active Active
- 2017-01-23 US US16/071,876 patent/US10475965B2/en active Active
- 2017-01-23 WO PCT/EP2017/051320 patent/WO2017129519A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20190027653A1 (en) | 2019-01-24 |
WO2017129519A1 (de) | 2017-08-03 |
JP2019503589A (ja) | 2019-02-07 |
DE112017000565A5 (de) | 2018-11-08 |
DE112017000565B4 (de) | 2024-03-14 |
DE102016101612A1 (de) | 2017-08-03 |
US10475965B2 (en) | 2019-11-12 |
CN108604624A (zh) | 2018-09-28 |
CN108604624B (zh) | 2020-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US12080827B2 (en) | Radiation-emitting semiconductor chip | |
US8729580B2 (en) | Light emitter with metal-oxide coating | |
KR102624112B1 (ko) | 플립칩형 발광 다이오드 칩 | |
KR102323686B1 (ko) | 발광 소자 및 그 제조 방법 | |
CN104465920A (zh) | 第iii族氮化物半导体发光器件 | |
US9705044B2 (en) | Semiconductor device and method for manufacturing same | |
US10236414B2 (en) | Semiconductor light emitting device and method of manufacturing the same | |
US9425363B2 (en) | Light emitting device | |
US10658548B2 (en) | Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip | |
US10381521B2 (en) | Optoelectronic component and method for producing an optoelectronic component | |
WO2013051326A1 (ja) | 窒化物半導体発光素子、及び窒化物半導体発光素子の製造方法 | |
JP5855344B2 (ja) | 分布ブラッグ反射器を有する発光ダイオードチップ及びその製造方法 | |
CN106159043B (zh) | 倒装led芯片及其形成方法 | |
JP6651023B2 (ja) | オプトエレクトロニクス半導体チップおよびオプトエレクトロニクス半導体チップの製造方法 | |
KR20200114133A (ko) | 발광 다이오드 칩 | |
US20210193875A1 (en) | Optoelectronic semiconductor chip, high-voltage semiconductor chip and method for producing an optoelectronic semiconductor chip | |
US9508900B2 (en) | Light-emitting device | |
US11916167B2 (en) | Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip | |
US20230032550A1 (en) | Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device | |
KR20120062660A (ko) | 수직 구조 발광 다이오드 | |
US20200227588A1 (en) | Radiation-emitting semiconductor chip | |
US20220293815A1 (en) | Method for producing a radiation emitting semiconductor chip and radiation emitting semiconductor chip | |
KR20120017695A (ko) | 광추출 효율이 향상된 발광 소자 | |
US20220231197A1 (en) | Flip-chip light emitting device and production method thereof | |
Zhou et al. | High-Efficiency Top-Emitting III-Nitride LEDs |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180723 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180723 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190521 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190522 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20190719 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20190724 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190808 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200107 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200121 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6651023 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |